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TDC1000-GASEVM User’s Guide
User's Guide
Literature Number: SNIU026A
March 2015 – Revised December 2015
Contents
1
2
3
4
5
6
General Overview
.................................................................................................................
TDC1000-GASEVM vs. TDC1000-TDC72000EVM
......................................................................
EVM Package Contents
.........................................................................................................
Software
.............................................................................................................................
Setup
..................................................................................................................................
Software Installation
.............................................................................................................
6.1
Graphical User Interface (GUI)
.........................................................................................
7
8
TDC1000-BSTEVM Setup and Operation
7.1
.................................................................................
Connections
...............................................................................................................
Launching the Software
......................................................................................................
9 Clock Selection
..................................................................................................................
9.1
Steps to Select the CPU Clock
......................................................................................
10 Possible Excitation Pulses
.................................................................................................
11 Troubleshooting
.................................................................................................................
11.1
Boost converter
.........................................................................................................
11.2
Jumper
...................................................................................................................
11.3
Firmware Upgrade
......................................................................................................
12 TDC1000-GASEVM Board Layout
.........................................................................................
13 TDC1000-GASEVM Schematic
..............................................................................................
14 TDC1000-BSTEVM Board Layout
..........................................................................................
15 BSTEVM Schematic
............................................................................................................
Revision History
..........................................................................................................................
2
Table of Contents
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7
24
25
26
27
21
22
23
16
17
18
19
20
11
12
13
14
15
8
9
10
4
5
6
1
2
3
List of Figures
TDC1000-GASEVM
.........................................................................................................
TDC1000-BSTEVM Board
..................................................................................................
TDC1000-7200EVM Installation Directory
................................................................................
TDC1000-BSTEVM Plugged into TDC1000-TDC7200EVM
...........................................................
SETUP Tab in TDC1000-TDC7200EVM
................................................................................
Top to Bottom: START Pulse, Voltage on VDD Pin of UCC Driver, Voltage Across Connector J1, EN1
Signal on Oscilloscope
....................................................................................................
Top to Bottom: TDC1000's START Pulse (Dark Blue), TDC1000's Tx Signal (Light Blue), and the
Boosted 30 V of TD1000's Tx Signal (Green)
..........................................................................
Place Jumper on JP6 to Use the CPU Clock
...........................................................................
Select CPU-CLK
............................................................................................................
Clock Options
...............................................................................................................
Excitation Pulses Chart
....................................................................................................
Jumper
.......................................................................................................................
Connection Error Pop-up Window
.......................................................................................
USB Firmware Upgrade Window
.........................................................................................
Top Overlay
.................................................................................................................
Top Solder Mask
...........................................................................................................
Top Layer
....................................................................................................................
Mid Layer 1
..................................................................................................................
Mid Layer 2
..................................................................................................................
Bottom Layer
................................................................................................................
Bottom Solder Mask
.......................................................................................................
Board Dimensions
..........................................................................................................
TDC1000-GASEVM Schematic 1
........................................................................................
TDC1000-GASEVM Schematic 2
........................................................................................
TDC1000-GASEVM Schematic 3
........................................................................................
BSTEVM Layout
............................................................................................................
TDC1000-BSTEVM
........................................................................................................
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List of Figures
3
1 www.ti.com
List of Tables
Jumper
.......................................................................................................................
4
List of Tables
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User's Guide
SNIU026A – March 2015 – Revised December 2015
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s
Guide
1
2
3
4
General Overview
This user's guide details the use of the TDC10000-GASEVM, which is comprised of two boards. The first board is the main TDC1000-GASEVM, which includes an on-board TDC1000 (ultrasonic analog-frontend), TDC7200 (time-to-digital converter), and MSP430 microcontroller. The purpose of this board is to excite the transducers, receive the returned echo, generate the STOP pulses, and digitize the time-of-flight to the MSP430 for further processing. This main board connects with a separate TDC1000-BSTEVM board (referred to as HV board for the remainder of this document). The purpose of the HV board is to boost the transmit pulses from 3.7V-to-30V to get a better received echo for applications where a higher range is necessary or when the ultrasonic medium is a gas or is exposed to vibration.
TDC1000-GASEVM vs. TDC1000-TDC72000EVM
The TDC1000-GASEVM is compatible with the Firmware and GUI of the TDC1000-TDC72000EVM since all the components are the same. However, the TDC1000-GASEVM has the following component changes to facilitate rapid evaluation for water/gas flow applications.
1. The TDC1000-GASEVM has been designed for Gas Flow applications. The passive components that determine the first order filter of the Rx signal path have been tuned for frequencies between 58 kHz to
300 KHz.
2. The resistors connecting the TX2/RX1 and TX1/RX2 channel have been removed to enable the
TDC1000-GASEVM to be used with the TDC1000-BSTEVM. When resistors have been removed, the transmitting pulses increase from 3.7 V to 30 V.
EVM Package Contents
The TDC1000-GASEVM evaluation kit contains the following:
• On board TDC1000 (ultrasonic analog-front-end) and TDC7200 (time-to-digital converter)
• On board MPS430 microcontroller
• USB Mini-B to USB-A plug cable
The TDC1000-BSTEVM kit contains the following:
• On board LM2733XMF boost converter
• On board UCC27531 Gate drivers
• Connectors to plug into the TDC1000-GASEVM or TDC1000-TDC7200EVM
Software
The firmware and GUI is the same as the TDC1000-TDC7200 EVM. For detail information about the GUI and troubleshooting the software, see the TDC100-TDC7200EVM User's Guide SNIU021 .
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5
Setup
5
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Setup
1. Download TDC1000-TDC7200 Software (same software for TDC1000_GASEVM)
2. Install the GUI. For detailed information, see
.
3. Connect TDC1000-BSTEVM to TDC1000-GASEVM
4. Connect a gas pipe transducers to the TDC1000-BSTEVM
5. Connect the EVM board to the computer with a USB cable (J2).
6. Launch the GUI. See
7. On the GUI's “SETUP” tab, select the "TDC1000-HV Boost Power Enable", “TDC1000-HV Driver EN1” and/or “TDC1000-HV Driver EN2” depending on which TX port your transducer is connected to.
8. On the “GRAPH” tab, press the “START GRAPH” button.
9. Select an "EN period (us)" in that matches your excitation duration in μs. For instance if you are using a 200Khz transducer with 10 excitation pulses the duration = (# pulses/Xmit freq)*1e6+30us or 80 us.
10. Run the GUI as explained in SNIA020
Figure 1. TDC1000-GASEVM
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Setup
Figure 2. TDC1000-BSTEVM Board
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7
Software Installation
6 Software Installation
6.1
Graphical User Interface (GUI)
Installing the TDC1000-GASEVM GUI software:
1. Download the GUI http://www.ti.com/product/TDC1000/toolssoftware
2. Unzip the downloaded file into a known directory and run it
3. Follow the pop-up screen instructions. Click “Next” to install the software.
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Figure 3. TDC1000-7200EVM Installation Directory
4. When the installation is done, click “Finish”.
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7 TDC1000-BSTEVM Setup and Operation
TDC1000-BSTEVM Setup and Operation
7.1
Connections
1. Connect the USB cable (J2) from the TDC1000-GASEVM to the PC.
2. Plug the TDC1000-BSTEVM (HV board) into the TDC1000-GASEVM (see
).
3. Attach the transducer wires to the connectors J1 and J2 on the HV board.
On the TDC1000-GASEVM, make sure the following jumpers are in place.
1. JP1: TDC7200 - connect pin 1 to pin 2 (via a jumper)
2. JP2: CPU - connect pin 1 to pin 2 (via a jumper)
3. JP3: TDC1000 - connect pin 1 to pin 2
4. JP4: VIO - connect pin 1 to pin 2
5. JP5: Trigger - connect pin 2 to pin 3
6. JP6: CLOCK - connect pin 5 to pin 6
Figure 4. TDC1000-BSTEVM Plugged into TDC1000-TDC7200EVM
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9
Launching the Software
8 Launching the Software
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1. The TDC1000_TDC7200EVM GUI software can be run by clicking on Start >> All Programs >>
Texas Instruments >> TDC1000_7200.
2. See TDC100-TDC7200EVM_Users_Manual ( SNIA020 ) on how to use the GUI
3. When using the HV board: Go to the “SETUP” tab on the TDC1000-7200EVM GUI and select
"TDC1000-HV Boost Power Enable" to enable the 30V boost supply. The supply will remain on constantly (Always ON) unless a different time period is selected via the pulldown box. The capacity to reduce the Boost power supply active time is to enable very low power applications testing so the
BOOST supply is only active during the measurement cycle time. Next make sure to select either
“TDC1000-HV Driver EN1” or “TDC1000-HV Driver EN2” -- or both of them by checking the respective box.
(a) Select an "EN period (us)" in µs. This is the time the EN will stay HIGH after the START pulse of the EVM. EN will go high about 30 µs before START to ensure that the driver ICs on the HV interface board are powered up in time for the first Tx pulses. Example: If you choose an EN period of 40 µs (default = 30 µs), you will see a EN pulse with the length of 70 µs, because it consists of the constant 30 µs before the START signal plus whatever you choose for EN period.
(b) A longer EN period can be used to dampen the oscillation of the ultrasonic transducers. After the last Tx pulse, the output of the driver IC will be pulled to ground via the 110Ω resistor that is on the board until the voltage on the VDD pin drops below about 3 V.
4. You can set the “EN period” for EN1 and EN2 separately, but whichever is higher will be applied to
BOTH enables if EN1 and EN2 are checked.
5. If you choose to use one channel with 5V pulses and the other with 30V, you can bypass the HV driver of Channel 2. Make sure to uncheck the box "TDC1000-HV Driver EN2" in the GUI and to also place the jumper JP1 on the HV board to "LV" for low voltage.
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Launching the Software
Figure 5. SETUP Tab in TDC1000-TDC7200EVM
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Launching the Software
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Figure 6. Top to Bottom:
START Pulse,
Voltage on VDD Pin of UCC Driver,
Voltage Across Connector J1,
EN1 Signal on Oscilloscope
6. Observe the following signals: TDC1000's START (dark blue) on the TDC1000-GASEVM, VDD of driver IC U2(light blue) on the HV board, transmit pulses on transducer connector J1 (green) and EN1
(pink) signals on the oscilloscope as shown in
. This shows that the VDD of the driver is turned on in time and long enough for this number of pulses. If the last pulses are reduced in amplitude, increase EN period in the “SETUP” tab of the GUI.
7. EN signal should go high about 30µs before START goes high.
8. Observe Tx pulses and voltage at the output of the high voltage drivers as shown in
transducer voltage at connectors J1/2 should be in phase. Tx should have an amplitude of 3.7Vpk-pk and transducer voltage 30Vpk-pk.
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Launching the Software
Figure 7. Top to Bottom:
TDC1000's START Pulse (Dark Blue),
TDC1000's Tx Signal (Light Blue), and the Boosted 30 V of TD1000's Tx Signal (Green)
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Clock Selection
9 Clock Selection
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In order to excite the transducer with its resonant frequency and to achieve the maximum energy transfer and therefore generate a big echo, the EVM allows you to apply the external clock, use the onboard oscillator, or to use the CPU clock.
For gas flow applications, we recommend using the CPU clock. The steps to select the CPU clock can be seen in the following subsections.
9.1
Steps to Select the CPU Clock
1. On the TDC1000-GASEVM, place the JP6 Jumper on the CPU position
Figure 8. Place Jumper on JP6 to Use the CPU Clock
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2.
Select CPU_CLK on the SETUP tap of the GUI. A message will pop up. Click "OK".
Clock Selection
Figure 9. Select CPU-CLK
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Clock Selection
3.
Check the CPU-CLK EN box and Select desired frequency from the drop down menu.
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Figure 10. Clock Options
4. In the GUI and on the TDC1000 tab, select a clock divider from the TX_FREQ_DIV register. Note the transducer's resonant frequency = (external clock) / (TX_FREQ_DIV). For example, if the transducer's resonant frequency is 500kHz, and a CPU clock of 2MHz is chosen, then the TX_FREQ_DIV needs to be 4.
shows possible excitation pulses using the CPU clock or on-board oscillator of 8MHz.
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10 Possible Excitation Pulses
Possible Excitation Pulses
TX-Frequency
Division 2 4 8 16 32 64 128 256
On Board
Oscilator 8,000,000
1,000,000
1,043,500
1,090,900
1,142,900
1,200,000
1,263,200
1,333,300
1,411,800
1,500,000
1,600,000
1,714,300
1,846,200
2,000,000
4,000,000
500,000
521,750
545,450
571,450
600,000
631,600
666,650
705,900
750,000
800,000
857,150
923,100
1,000,000
2,000,000
250,000
260,875
272,725
285,725
300,000
315,800
333,325
352,950
375,000
400,000
428,575
461,550
500,000
1,000,000
125,000
130,438
136,363
142,863
150,000
157,900
166,663
176,475
187,500
200,000
214,288
230,775
250,000
500,000
62,500
65,219
68,181
71,431
75,000
78,950
83,331
88,238
93,750
100,000
107,144
115,388
125,000
250,000
31,250
32,609
34,091
35,716
37,500
39,475
41,666
44,119
46,875
50,000
53,572
57,694
62,500
125,000
15,625
16,305
17,045
17,858
18,750
19,738
20,833
22,059
23,438
25,000
26,786
28,847
31,250
62,500
7,813
8,152
8,523
8,929
9,375
9,869
10,416
11,030
11,719
12,500
13,393
14,423
15,625
31,250
3,906
4,076
4,261
4,464
4,688
4,934
5,208
5,515
5,859
6,250
6,696
7,212
7,813
Figure 11. Excitation Pulses Chart
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Troubleshooting
11 Troubleshooting
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11.1 Boost converter
The DC/DC converter on the HV board is a LM2733X 1.6 MHz boost converter with integrated switch.
Test point TP2 should show a voltage of 30 V. If this is not the case, check if TP3 shows the required input voltage of 5 V.
11.2 Jumper
JUMPERS
JP1
Table 1. Jumper
DESCRIPTION
Tx2 voltage selector: bypass HV driver when placed in “LV” position
For default operation (use high voltage for both channels), place jumper on the following:
1. JP1.P2 and JP1.P3 – HV
Figure 12. Jumper
When placing the jumper in LV position (on pins 1 and 2), “TDC1000-HV Driver EN2” should be unchecked in the GUI. Otherwise the UCC27531 will pull its output to ground.
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Troubleshooting
11.3 Firmware Upgrade
Note: This section is only necessary if the firmware needs to be changed. The TDC1000-TDC7200EVM comes pre-loaded with firmware already. The HV board needs firmware TDC1000_7200_FW-v1.16-1MHz or newer.
To change the firmware, complete the following steps:
1. Connect the TDC1000-TDC7200EVM to a PC.
2. Open the TDC1000-7200EVM GUI then go to the “DEBUG” tab. Press “OK” if a connection error window pops up. Click on the Update Firmware button.
Figure 13. Connection Error Pop-up Window
3. The MSP430 USB Firmware Upgrade windows will pop up. Click “Next” to proceed on the first prompt.
Read and accept the license agreement and click “Next” to continue.
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Troubleshooting
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Figure 14. USB Firmware Upgrade Window
1. Disconnect and reconnect the LaunchPad to PC while holding the BSL button down.
2. Select the Select Firmware button and browse to the firmware file.
3. Click on the Upgrade Firmware button to program the EVM. Close the application when done and restart the TDC1000_7200EVM GUI.
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12 TDC1000-GASEVM Board Layout
TDC1000-GASEVM Board Layout
Figure 15. Top Overlay
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TDC1000-GASEVM Board Layout
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Figure 16. Top Solder Mask
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TDC1000-GASEVM Board Layout
Figure 17. Top Layer
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TDC1000-GASEVM Board Layout
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Figure 18. Mid Layer 1
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TDC1000-GASEVM Board Layout
Figure 19. Mid Layer 2
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TDC1000-GASEVM Board Layout
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Figure 20. Bottom Layer
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TDC1000-GASEVM Board Layout
Figure 21. Bottom Solder Mask
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TDC1000-GASEVM Board Layout
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Figure 22. Board Dimensions
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TDC1000-GASEVM Schematic
13 TDC1000-GASEVM Schematic
R30
200
R32
200
TX2
TX1
R35
10.0Meg
R36
10.0Meg
Directly connected STOP and START traces from
TDC71000 to TDC7200 must be completely symmetrical and as short as possible to avoid introducing timing delay
GND
C28
VCOM
TP9
DNP
0.01µF
START
STOP
GND
R38
1.00k
RTD2
RTD1
Pin 1 and pin 14 of the connector must be marked on the PC board
All the labels appearing on pin 2, 4, 6, 8, 10,
12 and 14 must be marked on the PC board
TX2/RX1or TX2
GND
J5
13
11
9
7
5
3
1
6
4
2
14
12
10
8
SSW-107-02-G-D-RA
TX2/RX1or RX1
TX1/RX2 or TX1
TX1/RX2 or RX2
AVDD
RTD1
RTD2
J6
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
2
4
6
8
10
PPPC052LJBN-RC
Pin 1 and pin 10 of the connector must be marked on the PC board
5
7
9
1
3
GPIO4
GPIO3
GPIO2
GPIO1
3
4
1
2
U11
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
EP
TPD8E003DQDR
9
7
8
5
6
GPIO7
GPIO6
TDC1000_CHSEL
USB_5V
GND
TDC1000_CHSEL
GPIO7
GPIO6
GPIO5
R52
GND
R41
GND
Place the ground TP close to VDD jumper
JP
TP11 AVDD
Place filter caps to VDD pins
C46
10µF
C37
0.01µF
C38
0.1µF
GND JP3
1
2
GND GND
VDD_TDC1000
FB2
GND
60 ohm
SH-JP3 VDD
V3p3
C40
0.01µF
C41
0.1µF
JP4
1
2 VIO
GND
FB3
GND
60 ohm
SH-JP4 VIO
SPI_MISO
C/R42& 42 must be close to TDC1000
RX pins. Place minimal parasitic capacitances onto RX1&RX2
SPI_MOSI
SPI_SCLK
TDC1000_SPI_CSB
RX1
R42
0
R45 33
RX2
R43
0
CLK
V3p3
FB4
60 ohm
C44
0.01µF
GND
C45
0.1µF
OSC_ENABLE
EXT_OSC
142-0701-201
J8
1
4
1
Y2
VDD OUT
3
STANDBY GND
2
SG-210STF13.000000MHZS
13 MHz
OSC_OUT
GND
R48
33
CPU_CLK_OUT
R50
51.1
R49
0
ExtClock
SH-JP6
6
4
2
5
3
1
JP6
OSC_SOURCE_SEL
Buffered STOP and START traces from the buffers to the MCU must be completely symmetrical to avoid introducing timing delay
R31
5.36k
VCOM
DNP
R34
1.00k
GND
C36
GND
510pF
C32
510pF
5600pF
Interstage Passive Filters:
Configured for 1MHz
U10
C27
TDC1000PW
TDC1000_ENABLE
TP17
STOP
V3p3
C25
0.01µF
C26
0.1µF
GND
START
V3p3
C33
0.01µF
C34
0.1µF
V3p3
V3p3
V3p3
V3p3
6
1
U7
VDD
CLKIN
Y0
Y1
2
NC
NC
1G GND
CDCLVC1102PW
6
1
U8
VDD
CLKIN
Y0
Y1
NC
NC
2
1G GND
CDCLVC1102PW
3
8
5
7
4
8
5
7
4
GND
3
GND
GND
TP6
TDC1000_MCU_STOP
R29
33
J3
STOP_OUT
142-0701-201
DNP
TP5
1
GND
Buffered STOP and START traces from the buffers to the connectors must be completely symmetrical to avoid introducing timing delay
TDC1000_MCU_START
R33
GND
TP7
33
START_OUT
142-0701-201
J4
DNP
1
TP8
GND
C29
0.1µF
GND
C35
VCOM
R40
10.0k
V5p0
4
3
5
10pF
R37
1.00k
V5p0
V+
V-
U9
LMH6601MG
1
R39
50
TP10
GND
V5p0
TP18
VCOM_OUT
GND
C30
0.1µF
GND
V3p3
R53
10.0k
TP12
DNP
TP13
DNP
TDC1000_ERRB
TDC1000_CHSEL
TP14
DNP
TDC1000_RESET
TRIGGER_IN
MSP430_TRIGGER TDC7200_TRIGGER
JP5
TRIGGER_SOURCE_SEL
SH-JP5
C39
10pF
R44
1.00k
V5p0
TP15
GND
TP16
C31
1µF
COMPIN
R47
10.0k
V5p0
4
3
5
V+
V-
U12
LMH6601MG
1
50
142-0701-201
J7
DNP
1
GND
GND
C47
10pF
COMPIN_OUT
CPU_CMP_OUT
CLK
Component value = DNP means do not populate
GND GND
Figure 23. TDC1000-GASEVM Schematic 1
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TDC1000-GASEVM Schematic
MSP_TDC_INT
Place caps close to the pin
Place the TP close to the
TDC7200 Power JP
TP1
C1
0.01µF
C2
0.1µF
GND
FB1
60 ohm
SH-JP1
JP1
V3p3
V3p3
R2
10.0k
TP2
DNP
SPI_SCLK
SPI_MOSI
SPI_MISO
DNP
TP19
DNP
TP20
DNP
TP21
R1
33
TDC7200_SPI_CSB
MSP_TDC7200_EN
DNP
TP3
GND
6
U1
FLAG
12
SCLK
10
DIN
9
DOUT
11
CS
8
INT
1
ENABLE
TDC7200PW
GND
VDD
VREG
CLOCK
STOP
START
TRIGG
GND
5
4
14
13
3
2
7
R3
33
GND
STOP
START
TDC7200_TRIGGER
Component value = DNP means do not populate
Figure 24. TDC1000-GASEVM Schematic 2
R4
DNP
CLK
GND
C3
1µF
Place cap close to the pin
CPU_CLK www.ti.com
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TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
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TDC1000-GASEVM Schematic
VBUS
DM
DP
STOP is connected to TA0.0, as this has quickest responding ISR. In this way STOP pulses can be closer together.
START is connected to TA0.1, which is slower.
This produces a delay to timestamp, but this can be compensated.
TRIGGER is on TA0.2, used to reset counter so there are no rollover issues.
Place holes on the SPI lines for probing
AFE SPI uses MCU
USCI_B0 SPI
TDC1000_MCU_STOP
TDC1000_MCU_START
MSP430_TRIGGER
GPIO7
MSP_TDC_INT
SPI_MOSI
SPI_MISO
SPI_SCLK
R6
R7
33
33
OSC_ENABLE
CPU_MOSI
CPU_SCLK
GPIO6
CPU_CLK
34
35
36
37
38
22
23
24
25
18
19
20
21
U2
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
GND
2
4
Y1
G
G
1
3
ABMM-24.000MHZ-B2-T
24.000MHz
C6
30pF
R13 0
9
10
57
58
12
13
P5.0/A8/VREF+/VEREF+
P5.1/A9/VREF-/VEREF-
P5.2/XT2IN
P5.3/XT2OUT
P5.4/XIN
P5.5/XOUT
GND
C7
GND
30pF
GND
V3p3
V18 VCORE VUSB
C8
0.22µF
C10
0.47µF
C11
0.22µF
JP2
1
2
GND
SH-JP2
C12
0.1µF
DP
DM
PUR
V18
VCORE
VBUS
VUSB
C14
0.1µF
50
52
PU.0/DP
PU.1/DM
51
PUR
55
17
V18
VCORE
53
54
VBUS
VUSB
11
15
40
AVCC1
DVCC1
DVCC2
MSP430F5528IRGC
C13
0.1µF
USB Physical Interface
GND
33
33
R21
R22
1
2
3
4
5
GND
C19
0.1µF
1
2
6
U5
IO1
IO2
IO3
IO4
VCC GND
TPD4E004DRYR
3
4
5
GND
R28
1.2M
R24
1.5k
GND
PUR
1
SW1
BSL
2
GND
GND
VUSB
C20
220pF
GND
J2
GND
651-305-142-821
R26
33k
GND
VBUS
C22
22µF
V5p0
Board Power
D4
Green
L1
GND
744043220
D5
1SMB5922BT3G
7.5V
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
P4.0/PM_UCB1STE/PM_UCA1CLK
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.6/PM_NONE
P4.7/PM_NONE
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
RST/NMI/SBWTDIO
TEST/SBWTCK
QFN PAD
VSSU
AVSS1
AVSS2
DVSS1
DVSS2
65
49
14
56
16
39
60
61
62
63
64
59
45
46
47
48
41
42
43
44
7
8
5
6
3
4
1
2
30
31
32
33
26
27
28
29
R51 33.0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
CPU_CMP
PEAK_DET
R9
261
R12
261
EN_EX_VDD
EX_VDD_FAULTB
JTAG_TDO
JTAG_TDI
JTAG_TMS
JTAG_TCK
JTAG_RST
JTAG_TEST
V3p3
R14
33k
C9
D2
Green
MSP_TDC7200_EN
TDC1000_ENABLE
TDC1000_CHSEL
TDC1000_RESET
TDC1000_ERRB
CPU_CLK_OUT
TDC7200_SPI_CSB
TDC1000_SPI_CSB
D3 Orange
2200pF
LINK
MEAS
GND
V3p3
GND
GND
AVDD
R19
1.0k
C18
10µF
3
4
1
U3
ON/OFF
ADJ VOUT
5
VIN GND
LP2980IM5X-ADJ
2
C15
6.8pF
R17
51.1k
Radj
R18
102k
GND
C16
2.2µF
GND
C23
1µF
1
3
U6
LP2985AIM5-3.3/NOPB
IN OUT
ON/OFF
GND
CBYP
5
4
C24
0.01µF
GND
C21
2.2µF
GND
V3p3
PEAK_DET
CPU_CMP
DNP
C4
GND
R5
D1
DNP
1N4148W-7-F
Place Cap as close as possible to the MCU pin
DNP
C5
GND
GND
JTAG Programming Interface
J1
14 13
JTAG_TEST
R15
0
12
10
8
6
4
2
DNP
7
5
3
1
11
9
R16
TSW-107-07-G-D
JTAG_RST
JTAG_TCK
JTAG_TMS
JTAG_TDI
JTAG_TDO
0
GND
R8
DNP
CPU_CMP_OUT
Choose proper resistor values to comply with the MSP430 ADC input requirements
TP4
V5p0
R23
100k
1
U4
IN
4
FAULT
OUT
ILIM
3
EN GND
TPS2553DBV-1
6
5
2
GND
R20
240k
C17
1µF
USB_5V
GND
GND
V3p3
R27
0
R25
1.0Meg
EX_VDD_FAULTB
EN_EX_VDD
GND
GND
GND GND GND GND
Component value = DNP means do not populate
Figure 25. TDC1000-GASEVM Schematic 3
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TDC1000-BSTEVM Board Layout
14 TDC1000-BSTEVM Board Layout
www.ti.com
Figure 26. BSTEVM Layout
32
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15 BSTEVM Schematic
AVDD
TP3
AVDD
TP1
GND
L2
GND
5V
L1
EN_Boost
R4 100
C3
4.7µF
10 uH
R3
51.1k
5
4
U1
VIN SW
FB
1
3
SHDN
GND
LM2733XMF
LMR64010 is pin compatable
2
SD103AWS-TP
D1
R1
316k
R2
C1
68pF
13.3k
30V
TP2
30V
GND
C2
4.7µF
GND
GND
TP5
GND
C12
0.1µF
GND
13
11
9
7
5
3
1
J3
GND
Vdd2_EN
GPIO4
GPIO3
GPIO2
2
4
6
8
EN_Boost
10
J4
5
7
1
3
9
8
6
4
2
14
12
10
Tx2
Rx1
Tx1
Rx2
AVDD
RTD1
RTD2
Vdd1_EN
GPIO6
TDC1000_CHSEL
USB_5V
GND
GND
Channel 1 TX1 / RX2
Vdd1
U2
3
VDD OUTH
EN uses internal pull-up
C5
0.1µF
1
EN
GND
Tx1
R9
10k
2
IN
UCC27531DBVR
OUTL
GND
6
5
4
GND
R11
110
R12
110
C7
2000pF
1
R13
300
2
D2
BAS40-04-7-F
GND
1.00k
R24
DNP
OUT1
J1
1
2
Transducer_1
Rx2
AVDD
GND
GND
R5
10k
30V
C6
1µF
GND
R8
10k
1
R6
51.1k
C4
100pF
Q1
2N7002-7-F
R10
DNP
0
Q2
BSS84-7-F
R7
Vdd1
GND GND
Figure 27. TDC1000-BSTEVM
BSTEVM Schematic
Channel 2 TX2 / RX1
EN uses internal pull-up
U3
Vdd2
GND
3
C9
0.1µF
1
VDD
EN
OUTH
OUTL
Tx2_IN
R20
10k
2
IN
UCC27531DBVR
GND
6
GND
R21
110
R18
C10
300
2000pF
1
5
R22
110
GND
D3
BAS40-04-7-F
4
Tx2
Tx2_IN
1
2
3
JP1
1.00k
R23
DNP
1
2
OUT2
J2
Transducer_2
GND TSW-103-07-G-S
HV bypass
GND
Rx1
AVDD
2
SH-JP1
30V
C11
1µF
Vdd2
GND
R16
10k
1
R15
51.1k
C8
100pF
Q3
2N7002-7-F
R19
DNP
0
Q4
BSS84-7-F
R17
R14
10k
GND GND
SNIU026A – March 2015 – Revised December 2015
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TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
33
Revision History
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Revision History
Changes from Original (March 2015) to A Revision
.......................................................................................................
Page
• Changed SETUP Tab
.....................................................................................................................
• Changed SETUP Tab
• Changed Schematic
...................................................................................................................
.....................................................................................................................
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
34
Revision History
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Copyright © 2015, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1
EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2
EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system.
2 Limited Warranty and Related Remedies/Disclaimers:
2.1
These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2
TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM.
2.3
If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period.
3
Regulatory Notices:
3.1
United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2.
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3.
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2.
実験局の免許を取得後ご使用いただく。
3.
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated spacer
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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