MSP-BSL Bootloader (BSL) Programmer for

User's Guide

SLAU573 – November 2015

MSP-BSL Bootloader (BSL) Programmer for MSP430 and

MSP432

3

4

1

2

5

1

2

1

2

3

4

5

6

7

8

The MSP-BSL (previous knows as the MSP430-BSL) is a low-cost programmer in the shape of a rocket.

Hence, it is nicknamed the "BSL Rocket". The MSP-BSL is designed for easy communication between a

PC and the BSL of an MSP430 or MSP432 device through USB. The MSP-BSL project is a collaboration between Olimex Ltd and Texas Instruments. The PCB design and firmware for the MSP-BSL are open source. As of this writing, the MSP-BSL supports UART, I

2

C, and SPI communication, but it can be extended for future requirements.

Contents

Introduction

...................................................................................................................

2

Functionality and Supported Protocols

....................................................................................

3

Firmware Update

.............................................................................................................

5

Hardware

......................................................................................................................

7

Firmware Revision History

..................................................................................................

9

List of Figures

MSP-BSL (Top View)

........................................................................................................

2

MSP-BSL (Bottom View)

....................................................................................................

2

BSL Entry Sequence With Shared and Dedicated JTAG Pins

........................................................

3

Firmware Upgrade Example With Selected Firmware and Connected MSP-BSL (USB BSL Invoked)

..........

6

Firmware Upgrade Example Showing Successful Firmware Update

.................................................

6

Schematic of the MSP-BSL

................................................................................................

7

Pinout of the BSL Connector (Target Side)

..............................................................................

8

Cuttable Power Supply Trace (PWR_E)

..................................................................................

8

List of Tables

Supported Baud Rates of the MSP-BSL

..................................................................................

3

Firmware Releases

..........................................................................................................

9

MSP430, MSP432 are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

SLAU573 – November 2015

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MSP-BSL Bootloader (BSL) Programmer for MSP430 and MSP432

Copyright © 2015, Texas Instruments Incorporated

1

Introduction

1 Introduction

www.ti.com

The bootloader (BSL) is an application built into MSP430™ and MSP432™ microcontrollers. The BSL enables the user to communicate with the device and to read and write its memory. This feature is primarily used for programming the device during prototyping phase, final production, and in service. Both the programmable memory (flash memory or FRAM) and the data memory (RAM) can be modified as required. Different BSLs offer different peripherals to communicate with (for example, UART, I

2

C, SPI, or

USB).

The MSP-BSL (previous knows as the MSP430-BSL) is a low-cost programmer in the shape of a rocket

(see

Figure 1

and

Figure 2

). Hence, it is nicknamed the "BSL Rocket". The MSP-BSL is designed for easy communication between a PC and the BSL of an MSP430 or MSP432 device through USB. The MSP-

BSL project is a collaboration between Olimex Ltd and Texas Instruments. The PCB design and firmware for the MSP-BSL are open source. As of this writing, the MSP-BSL supports UART, I

2

C, and SPI communication, but it can be extended for future requirements.

Figure 1. MSP-BSL (Top View) Figure 2. MSP-BSL (Bottom View)

1.1

Additional Online Information

More information on the BSL can be found in the following documents:

MSP430 Programming With the Bootloader (BSL) User's Guide ( SLAU319 )

MSP430FR4xx and MSP430FR2xx Bootstrap Loader (BSL) User's Guide ( SLAU610 )

MSP430FR58xx and MSP430FR59xx Bootloader (BSL) User's Guide ( SLAU550 )

MSP432P401R Bootstrap Loader (BSL) User's Guide ( SLAU622 )

Creating a Custom Flash-Based Bootstrap Loader (BSL) User's Guide ( SLAA450 )

The latest version of the firmware for the MSP-BSL is available from the BSL tool folder .

The source code can be obtained from Gitorious@TI . The project is open for contributions.

2





www.ti.com

2 Functionality and Supported Protocols

Functionality and Supported Protocols

The MSP-BSL is a USB communications device class (CDC) device. It enumerates on the host PC as a virtual COM port. The data that is sent to the MSP-BSL through this serial connection appears transparently at the output, and data that is received by the MSP-BSL is forwarded transparently to the

PC.

The serial communication to the MSP-BSL uses 8 data bits, no parity bit, and 1 stop bit (8N1). The baud rate selects the target communication protocol in use. Special functionality (for example applying a BSL entry sequence (see

Section 2.1

)) can also be triggered by baud rate changes.

Table 1

describes special-purpose baud rates used by the MSP-BSL. Each function in this table is described in detail in the following subsections.

Table 1. Supported Baud Rates of the MSP-BSL

(1)

Baud Rate

1200, 2400, 4800, 9600, 19200, 38400,

57600, 115200, 230400

921600

(1)

(1)

, 460800

(1)

, UART mode

4801

Description

Invokes the USB BSL of the MSP-BSL

9601

100000

100001

400000

400001

125000

125001

250000

250001

Triggers BSL entry sequence

I

2

C Standard Mode (Sm) (100 kbps)

I

2

C Standard Mode with BSL entry sequence

I

2

C Fast Mode (Fm) (400 kbps)

I

2

C Fast Mode with BSL entry sequence

SPI mode (125 kHz)

SPI mode (125 kHz) with BSL entry sequence

500000

500001

1000000

1000001

SPI mode (250 kHz)


SPI mode (500 kHz)


SPI mode (1 MHz)

SPI mode (1 MHz) with BSL entry sequence

Not supported by the MSP430 or MSP432 BSL.

2.1

BSL Entry Sequence

For most MSP430 devices, there are two ways to invoke the BSL: by the application software or by applying a hardware entry sequence.

The MSP-BSL can apply the entry sequence (see

Figure 3

) to the target. This entry sequence can be used for devices with shared or dedicated JTAG pins. The entry sequence can be triggered by setting the communication speed of the MSP-BSL to 9601 baud (for UART) or to the baud rate of any mode with a

BSL entry sequence; for example, 100001 baud for I

2

C mode with BSL entry sequence (see

Table 1 ).

Transition

Detection

RST/NMI

TEST

Bootloader starts here

TCK

Figure 3. BSL Entry Sequence With Shared and Dedicated JTAG Pins





3


NOTE:

For further information on the entry sequence, see the user's guides listed in

Section 1.1

.

www.ti.com

2.2

UART Communication

The MSP-BSL provides a mode to communicate with UART BSLs. In this mode, all data sent to the virtual

COM port is output at the TX pin (RX on the target connector, see

Section 4.2

). All data received on the

RX pin (TX on the target connector) is forwarded to the PC. The MSP-BSL acts as a transparent USB-to-

UART bridge.

The UART mode can be selected by setting the connection speed to any of the following standard UART baud rates:

1200

2400

4800

9600

19200

38400

57600

115200

230400 (not supported by the MSP430 or MSP432 BSL)



2.3

I

2

C Communication

Similar to the UART mode, the MSP-BSL supports the I

2

C protocol, starting with firmware version 2.1. All data sent to the virtual COM port is output on the SDA and SCL pins (see

Section 4.2

). Data received

from I

2

C is forwarded to the PC. The MSP-BSL acts as a transparent USB-to-I

2

C bridge, except that it returns an error code (055h) to the PC if the I

2

C communication fails. The MSP-BSL has a state machine that emulates this transparent behavior.

The MSP-BSL operates as an I

2

C master and uses 7-bit addressing mode. The slave address for the

MSP430 or MSP432 target is set to 048h.

The MSP-BSL supports I

2

C Standard Mode (Sm) with a maximum transfer rate of 100 kbps and I

2

C Fast

Mode (Fm) with a maximum transfer rate of 400 kbps. Both of these modes are selected by changing the baud rate of the serial connection from the PC to the MSP-BSL.

Additionally a BSL entry sequence can be generated prior to the I

2

C communication:

100000 baud: I

2

C Standard Mode (Sm)

100001 baud: I

2

C Standard Mode (Sm) with the BSL entry sequence

400000 baud: I

2

C Fast Mode (Fm)

400001 baud: I

2

C Standard Mode (Sm) with the BSL entry sequence

NOTE:

I

2

C communication requires pullup resistors on the SDA and SCL lines. The pullup resistors can be soldered on the MSP-BSL PCB (see

Section 4.4

), or they can be included in the target application design; for example, by adding jumpers to the I

2

C pullups on the MSP430 or MSP432 target socket board.

4





www.ti.com


2.4

SPI Communication

Similar to the UART mode, the MSP-BSL supports the SPI protocol starting from firmware version 3.0. All data send to the virtual COM port is output through the SOMI, SIMO, CLK, and STE pins (see

Section 4.2

). A state machine on the MSP-BSL makes the communication appear as transparent UART to the outside.

The MSP-BSL operates as 4-pin SPI master. Data is changed on first clock edge and captured on the following edge (CKPH = 0). Clock is high when inactive (CKPL = 1). Slave transmit enable (STE) is active low. 8-bit serial data character format (MSB first transmit/receive) is used.

SPI communication is clocked at 125 kHz, 250 kHz, 500 kHz, or 1 MHz, depending on the selected mode.

These mode are selected by the baud rate of the serial connection from PC to MSP-BSL. Additionally a

BSL entry sequence can be generated prior to the SPI communication:

125000 baud: SPI mode at 125 kHz

125001 baud: SPI mode at 125 kHz with the BSL entry sequence





1000000 baud: SPI mode at 1 MHz

1000001 baud: SPI mode at 1 MHz with the BSL entry sequence

3 Firmware Update

To update the firmware of the MSP-BSL, the USB BSL of the MSP430F5510 on the MSP-BSL can be used. To update the firmware:

1. Download the latest firmware for the MSP-BSL from the BSL tool folder .

2. Download and install the MSP430 USB Firmware Upgrade Example. It is part of the MSP430 USB

Developers Package .

3. Start the MSP430 USB Firmware Upgrade Example. It shows 'No device connected' at this time.

4. Before starting the update, the USB BSL of the MSP-BSL must be invoked.

(a) Disconnect the MSP-BSL from the USB cable.

(b) Hold the USB BSL button down while connecting the USB cable.

(c) Alternatively, switch to baud rate 4801 to invoke the BSL on the MSP-BSL.

The BSL is now invoked, and the Firmware Upgrade Example shows 'Found 1 device' (see

Figure 4

).





5

Firmware Update

www.ti.com

Figure 4. Firmware Upgrade Example With Selected Firmware and Connected MSP-BSL (USB BSL

Invoked)

5. Now the firmware can be updated.

(a) Click ‘Select Firmware’ and ‘Browse’ to select the TI-TXT firmware image for the MSPBSL.

(b) Click ‘Upgrade Firmware’.

The image is loaded, and the MSP-BSL restarts automatically. The new firmware is now ready to use

(see

Figure 5 ).

Figure 5. Firmware Upgrade Example Showing Successful Firmware Update

6





www.ti.com

4 Hardware

Hardware

The hardware of the MSP-BSL is open source. The design files are available on the Olimex website .

The MSP-BSL programmer is based on MSP430F5510. All I/Os that are not used by the standard BSL target connector (see

Section 4.2

) are made available as pads on the bottom of the PCB. Furthermore, there are two status LEDs (green and yellow) and two push-buttons, a reset button and a button to invoke the USB BSL of the MSP430F5510.

The MSP-BSL features also an on-board 3.3 V voltage regulator that can supply up to 150 mA to the target (see

Section 4.3

).

4.1

Schematic

Figure 6

shows the schematic of the MSP-BSL.

R1

2k

R2

1.5k

LED1

0603(GREEN)

LED2

0603(YELLOW)

USB_DEVICE

+5V

C12 10nF

C15 100nF

C16 22uF/6.3V

USB

VBUS

D-

D+

ID

GND

D-

D+

GND

MINI-USB

+5V

R6

R7

27R

27R

R4

LED1

LED2

LEDS

USB_BSL

T1107A-6_3.8_2.5

R3

100R

1.5k

3.3V

3.3V

C5

100nF

C7

1uF

C6

100nF

C8

1uF

C9

22uF/6.3V

3.3VA

C10

100nF

AGND

11

28

U1

DVCC1

DVCC2

12

27

DVSS1

DVSS2

13

43

VCORE

V18

7

AVCC1

10

44

AVSS1

AVSS2

42

41

39

40

38

37

VUSB

VBUS

PUR

PU1/DM

PU_0/DP

VSSU

R5

1M/1%

C13 C14

10pF 10pF

RST

TEST

J3

J2

J1

J0

#RST

BSL-TCK

BSL-TEST

BSL-RST

48

47

26

25

24

23

#RST/NMI/SBWTDIO

TEST/SBWTCK

PJ_3/TCK

PJ_2/TMS

PJ_1/TDI/TCLK

PJ_0/TDO

MSP430F5510IPT

C4

RESET

3.3V

R8

33k

#RST

R9

330R

RESET

T 1107A-6_3.8_2.5

P1_7/TA1_0

P1_6/TA1CLK/CBOUT

P1_5/TA0_4

P1_4/TA0_3

P1_3/TA0_2

P1_2/TA0_1

P1_1/TA0_0

P1_0/TA0CLK/ACLK

P2_0/TA1_1

P4_7/PM_NONE

P4_6/PM_NONE

P4_5/PM_UCA1RXD/PM_UCA1SOMI

P4_4/PM_UCA1TXD/PM_UCA1SIMO

P4_3/PM_UCB1CLK/PM_UCA1STE

P4_2/PM_UCB1SOMI/PM_UCB1SCL

P4_1/PM_UCB1SIMO/PM_UCB1SDA

P4_0/PM_UCB1STE/PM_UCA1CLK

P5_5/XOUT

P5_4/XIN

P5_3/XT2OUT

P5_2/XT2IN

P5_1/A9/VEREF-

P5_0/A8/VEREF+

P6_3/CB3/A3

P6_2/CB2/A2

P6_1/CB1/A1

P6_0/CB0/A0

21

20

19

18

17

16

15

14

22

36

35

34

33

32

31

30

29

6

5

9

8

46

45

4

3

2

1

LED2

LED1

BSL-TX

BSL-RX

P4.3/USTE

P4.0/UCLK

5.1

5.0

6.3

6.2

6.1

6.0

2.0

4.7

4.6

4.5

4.4

4.3

4.2

4.1

4.0

1.7

1.6

1.5

1.4

1.3

1.2

1.1

1.0

Q1

C17

G N D

C18

NA(10pF)

NA(10pF)

NA(QCT32768(2x6)/6pF)

Q2

C19

C20

39pF

39pF

Q4.000MHz/20pF/SMD

3.3V

+5V

5V

POWER_SUPPLY

3.3V

VR1

1

VIN

VOUT

5

3

CE

VSS

2

AP1231-3.3V(SOT23-5)

C1

3.3V_E

1 2

CLOSE

C2 C3

100nF

AGND_E

1 2

CLOSE

GND

3.3V

AGND

AGND

TVCC_SENSE

Figure 6. Schematic of the MSP-BSL

BSL-TCK

BSL-RST

P4.3/USTE

RM1G2

RM1G3

RM2G1

RM2G4

PWR_E

Close

6

8

10

2

4

BSL

Target

TC K

( In )

/R ST

( In )

VC C

( PW R )

TV C C

S ense

(Out)

NC

BL Tx

( O u t)

BL R x

( In )

1

3

G N D

( PW R )

5

TEST

( In )

7

NC

9

RM2G2

RM1G4

RM1G1

RM2G3

R10

NA

R11

NA

BSL-TX

BSL-RX

BSL-TEST

P4.0/UCLK

IDC10S/PCB(Female)

MS430-BSL_rev_B

OLIMEX LTD, BULGARIA, 2013

HTTPS://WWW.OLIMEX.COM





7

Hardware

www.ti.com

4.2

BSL Connector and Available Pins

Figure 7

shows the BSL Connector as seen from the target side.

• UART communication is handled through pin 1 (TX) and pin 3 (RX).

• I

2

C communication is handled through pin 1 (SDA) and pin 9 (SCL).

• SPI communication is handled through pin 1 (SOMI), pin 3 (SIMO), pin 9 (CLK), and pin 10 (STE).

• The entry sequence can be generated using pin 4 (RST) and pin 7 (TEST) for devices with shared

JTAG pins, or using pin 2 (TCK) and pin 4 (RST) for devices with dedicated JTAG pins.

• Power is supplied through pin 6 (VCC), and electrical ground is supplied through pin 5 (GND).

The connector uses 0.1-inch spacing and is a 10-pin male header on the target board.

2

TCK

4

RST

6

Vcc

8

TVcc Sense

10

STE

5

7

9

1

3

TX/SDA/SOMI

RX/SIMO

GND

TEST

SCL/CLK

Figure 7. Pinout of the BSL Connector (Target Side)

4.3

Target Power Supply

The MSP-BSL has a built-in 3.3-V power supply for the target board. It can supply up to 150 mA of current. The power is supplied on pin 6 of the BSL connector but can be cut (by opening PWR_E, see

Figure 8

) if not needed.

Figure 8. Cuttable Power Supply Trace (PWR_E)

NOTE:

Cutting the power supply at PWR_E also prevents the onboard pullup resistors (R10, R11) from being pulled high.

8





www.ti.com

Hardware

4.4

Pullups for I

2

C Operation

I

2

C communication requires pullups on the SDA and SCL lines. These pullup resistors can be included in the target application design or onboard the MSP-BSL. Newer MSP430/MSP432 target socket boards have I

2

C pullup resistors already included.

5 Firmware Revision History

Version

3.0

2.1

1.0

Table 2. Firmware Releases

Added SPI support

Updated USB stack

Added I

2

C support

Initial version

Changes





9

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3.1.1

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SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

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Japan to follow the instructions below with respect to EVMs:

1.

Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for

Enforcement of Radio Law of Japan,

2.

Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to

EVMs, or

3.

Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けて

いないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの

措置を取っていただく必要がありますのでご注意ください。

1.

電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。

2.

実験局の免許を取得後ご使用いただく。

3.

技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ

ンスツルメンツ株式会社

東京都新宿区西新宿６丁目２４番１号

西新宿三井ビル

3.3.3

Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ

い。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

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4

EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT

LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:

4.3.1

User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.

During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm.

4.3.2

EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.

User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements.

5.

Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free.

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6.

Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE

DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER

WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED

WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY

THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND

CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY

OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD

PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY

INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF

THE EVM.

7.

USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS

LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,

EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY

HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION

SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY

OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8.

Limitations on Damages and Liability:

8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE

TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS

BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED

TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS

OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,

LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL

BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION

ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM

PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER

THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE

OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND

CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9.

Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.

Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2015, Texas Instruments Incorporated spacer

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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Wireless Connectivity www.ti.com/audio amplifier.ti.com

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MSP-BSL Bootloader (BSL) Programmer for

User's Guide

MSP-BSL Bootloader (BSL) Programmer for MSP430 and

MSP432

1 Introduction

1.1

Additional Online Information

2 Functionality and Supported Protocols

2.1

BSL Entry Sequence

2.2

UART Communication

2.3

I

C Communication

2.4

SPI Communication

3 Firmware Update

4 Hardware

4.1

Schematic

USB_DEVICE

LEDS

RESET

POWER_SUPPLY

4.2

BSL Connector and Available Pins

4.3

Target Power Supply

4.4

Pullups for I

C Operation

5 Firmware Revision History

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