Understanding Wireless Connectivity in the Industrial IoT www.ti.com/wirelessconnectivity Understanding Wireless Connectivity in the Industrial IoT Contents Page White Paper Wireless connectivity design considerations for the industrial IoT.........................................................3 Blog Posts The Internet of industrial Things.........................................................................................................12 Building the industrial Internet of Things............................................................................................13 Taking Power to a New Low with the SimpleLink™ ULP Wireless MCU Platform..............................15 Bluetooth® Smart in Industrial............................................................................................................18 The Shocking Impact of Poor RF Selectivity and Blocking.................................................................20 TI Design Reference Designs Humidity & Temp Sensor Node for Star Networks Enabling 10+ Year ...............................................22 Coin Cell Battery Life Ref Design Wireless Motor Monitor Reference Design.........................................................................................23 SimpleLink Multi-Standard CC2650 SensorTag Reference Design.....................................................25 ETSI Cat. 1 Receiver-Capable wM-Bus 169-MHz RF Subsystem for ................................................26 Smart Gas and Water Meters Implementing SimpleLink Wi-Fi® Connectivity in a Smart Electric Meter.............................................27 Smart Plug with Remote Disconnect and Wi-Fi Connectivity.............................................................28 Bluetooth Low Energy (Bluetooth Smart) to RS-485 Gateway...........................................................29 CC2540 Bluetooth Low Energy USB Dongle Reference Design........................................................30 Gas Sensor Platform with Bluetooth Low Energy..............................................................................31 Smart Home and Energy Gateway Reference Design........................................................................32 Product Overviews SimpleLink ultra-low power wireless MCU platform ..........................................................................35 SimpleLink Wi-Fi Family CC3100/CC3200 wireless MCU platform....................................................37 WiLink™ 8 Wi-Fi+ Bluetooth/BLE Modules.......................................................................................39 Dual-mode Bluetooth CC2564 smart RF transceiver.........................................................................41 Bluetooth Smart high-temperature CC2540T wireless MCU..............................................................43 White Paper Wireless connectivity design considerations for the industrial IoT Olivier Monnier marketing director, wireless connectivity solutions Eran Zigman business line manager, wireless connectivity solutions Amit Hammer business line manager, wireless connectivity solutions Texas Instruments 3 Introduction Wireless communications, dominant in consumer electronics for some time now, is quickly making its way into the industrial Internet of Things (IoT). Developers of industrial systems, once freed from the restrictions of cables, are discovering new ways to increase efficiencies and productivity, cut costs and better control processes and equipment. In fact, the only limit on industrial wireless applications appears to be the imagination of developers. Enabled by ultra-low power sensors and wireless communications devices, as well as highly integrated microcontrollers (MCUs), the IoT is quickly spreading throughout traditional industrial markets like factory and building automation, the energy infrastructure, smart lighting, as well as non-industrial markets such as automotive, retail, health care and others. In many cases, new wireless applications interoperate and enhance the established wired systems, providing value-added capabilities that ride the air waves instead of the wires. For instance, what had been a complex human/machine interface (HMI) can now run as a convenient app on a smartphone or tablet in the wireless industrial IoT. Moreover, tapping into powerful cloud-based analytics in real time adds another dimension to the sophistication of industrial applications. Of course, system designers should consider a number of factors with regards to wireless connectivity. These include choosing the particular wireless technology that best fits the requirements and use cases of the application, the power consumption and the compatibility of the technology with other devices such as sensors, MCUs, gateways, servers and others, the ease of integrating wireless technology into industrial equipment, cloud connectivity and security. Going wireless – it needs to be easy systems by integrating wireless connectivity with the processing capabilities of an MCU. This significantly reduces the need for the industrial system developer to be an expert in radio frequency (RF) design Integrating wireless connectivity into industrial techniques and gives developers a powerful MCU systems has become vastly easier in recent years for running an application or subsystem. Some of as new end-to-end building blocks – low-power these wireless MCUs include the entire wireless sensors, wireless connectivity devices, MCUs, protocol stack as well as security measures. Other gateways and servers – have been introduced. more integrated alternatives include as much as Industrial system developers now have access to possible in one device, such as cloud connectivity, a wide variety of wireless technology with diverse local wireless protocols, security protections capabilities and varying degrees of integration. For and other capabilities in an attempt to make the example, some technology suppliers have simplified inclusion of wireless connectivity a plug-in module the inclusion of wireless connectivity into industrial Wireless connectivity design considerations for the industrial IoT exercise. 4 July 2015 Motor drive and remote control Building automation Smart grid Figure 1: Examples of industrial applications where wireless connectivity may be implemented In addition to the devices and capabilities needed, The more comprehensive suppliers of wireless industrial system designers can now access the technology are able to ensure end-to-end inter extensive support ecosystems that some wireless operability among sensors, intermediary devices, technology suppliers provide. The more complete industrial protocols like RS-485, RS-232 and ecosystems feature an array of developer kits, the various real-time Ethernet networks, and the community support, reference designs, already cloud. Such suppliers have simplified designing-in integrated wireless protocol stacks, app developer wireless connectivity and at the same time ensure tools, integrated development environments interoperability with the cloud and a variety of IoT (IDE) for software programmers and many of the end nodes. software and hardware modules that are typically Industrial wireless: One size won’t fit all implemented in industrial settings. MCU RF Transceiver Sensor Gateway (Opt.) Discrete Fortunately, a variety of local area wireless connectivity standards with a wide range of • Application • RF stacks capabilities and unique characteristics is available. MCU + Wireless Network Processor Wireless Network Processor Sensor • Application This is especially beneficial to the developers of Gateway (Opt.) MCU industrial systems because industrial applications cover a broad spectrum of use cases and each • RF stacks + • RF transceiver one has its own set of challenges. Developers are able to select the wireless connectivity technology Wireless Microcontroller that best meets the requirements of the application. Gateway (Opt.) Wireless MCU Sensor For example, the developers of a smart metering system for a utility grid might decide that the longer signaling range of a Sub-1 GHz wireless protocol • RF stacks + • RF transceiver + • MCU + • Optional cloud agent is best suited to this application. Another design team working on a home automation system could Figure 2: Integration variations for cloud connectivity Wireless connectivity design considerations for the industrial IoT 5 July 2015 White Paper Factory automation Remote display / Wireless HMI Before the emergence of the industrial wireless IoT, an HMI for a new monitoring application would have required extensive development and integration of the new subsystem and display hardware. Now, with low-power wireless technologies like Bluetooth® Smart, batteryoperated sensors can transmit monitoring data to IoT user devices such as a smartphone or tablet PC. Technicians are familiar and comfortable with this sort of device so the learning curve is short. opt for Wi-Fi® because of its compatibility with communication (NFC) and Bluetooth® Smart or a controlling appliances remotely. Lighting networks proprietary 2.4-GHz protocol might suffice. ® The point is that each wireless technology consumption, mesh topology and extensive support has its own set of strengths. An industrial IoT ecosystem. 6LoWPAN could be the choice of application is best served when the strengths of developers of a factory automation system who see a particular wireless technology is matched with real benefit in implementing a network of nodes with the requirements of the application. For example, Internet Protocol (IP) addresses. For some systems, Bluetooth has been deployed in a host of user the very low power and limited range of near field devices, including smartphones and tablets. So an Range Network type might be better suited to ZigBee for its low power NFC RFID Bluetooth® Bluetooth low energy Proprietary 2.4 GHz ZigBee® Wi-Fi® 6LowPAN Proprietary Sub-1 GHz Identification Personal connection Customizable Mesh Existing infrastructure IP Mesh Customizable Industrial applications Key differences Proximity Personal area networks Data • Up to 848 Kbps • No battery to coin cell Data or voice • Up to 3 Mbps • Coin cell to AAA Data • Up to 1 Mbps • Coin cell Data • Up to 256 Kbps • Energy harvesting to AAA Voice or video • Up to 100 Mbps • AA battery Data • Up to 256 Kbps • Energy harvesting to AAA Data • Up to 1 Mbps • Coin cell • Device configuration / Firmware upgrade • Lighting • Wire replacement • Beaconing • Asset tracking • Factory automation • Building and factory automation • Beaconing • Smart energy • Building automation • Lighting networks • Industrial Internet • Assets tracking • Remote control of machinery • Sensors • Building automation • Smart energy • Building automation • Lighting networks • Low-power Industrial Internetgateways • Metering • Smart grid • Alarm and security • Environmental monitoring Figure 3: Selection table of wireless connectivity technologies for industrial Neighborhood area networks Local area networks Wireless connectivity design considerations for the industrial IoT 6 July 2015 devices. 6LoWPAN consumes very little power to Preventive maintenance was never so easy the point where it could be supported by small coin Preventive maintenance – heading off a problem cell batteries, energy harvesting or both. In addition, before it happens – is highly valued in many since 6LoWPAN nodes are assigned an IP address, industrial environments. Wireless connectivity they can be accessed directly from the cloud. If makes possible a new generation of preventive the wireless signal must travel a long distance and maintenance applications. In a power generation penetrate through objects like walls, a Sub-1 GHz plant, for example, wireless sensors could would have immediate compatibility with many user communicate with a technician’s smartphone when protocol could be most appropriate. vibration in a machine exceeds a certain limit. Then, preventive maintenance could return the machine Power consumption to its proper working order before a catastrophic problem occurs. The power consumption of an industrial wireless application must be examined at the macro level of the entire system and not just its individual elements. To start with, an industrial IoT network would certainly call for low-power sensors to monitor factory processes, building equipment, residential systems, the electrical power grid or whatever the setting. Today’s most advanced wireless sensors have brought new meaning to low power. When teamed with a low-power MCU with wireless a machine on the roof of a building, atop a tower connectivity, some sensor-based IoT end nodes or in a satellite. In these sorts of applications, the can operate for up to 10 years on a coin cell battery power management subsystem could lengthen the while others will operate on energy harvested from life of the batteries by keeping most of the system the light, vibration, thermal or RF energy in their in a low-power sleep mode except for the sensor surroundings. Sophisticated power management that is monitoring the inaccessible machine. When as well as precision analog capabilities like analog- the condition being monitored by the sensor, such to-digital (ADC) converters and comparators are as vibration or temperature, exceeds a certain also critical to low-power IoT networks. Power threshold, the rest of the system could be powered management routines that are able to automatically up so that it could communicate an alarm or take an place portions of the system into a power-saving action on its own. sleep mode can extend the operational life of a Sensors battery considerably and reduce the need for regular maintenance to change batteries. This could be critical in applications where an IoT node is Sensors deployed in a wireless industrial IoT will installed in a particularly inaccessible location, like Wireless connectivity design considerations for the industrial IoT monitor a complex and widely diverse environment 7 July 2015 White Paper industrial application supporting Bluetooth Smart IP investments as well as a loss of control over the system to rogue processes. In low-power, often remote wireless nodes, this security protection is usually best provided through hardware-based accelerators or co-processors executing security algorithms because this will consume less power and not diminish the throughput of the node. Conformance and certification to wireless standards, like Wi-Fi, Bluetooth Smart and others, also affect Figure 4: SimpleLink™ SensorTag quickly connects sensors to the cloud security since standards either incorporate built-in security measures or are compatible with security standards. Wi-Fi, for example, has a number of where slight changes in conditions can be critical. security standards associated with it, such as High-resolution measurements and the monitoring Wi-Fi Protected Access (WPA), SSL, TLS, X.509 of chemical composition, access control, vibrations, and others. Cryptographic and authentication asset tracking information, motion, pressure, temperature, UV radiation, gas and fluid flow and many other variables could be required. Building security Some easy-to-implement devices integrate Wireless connectivity can ensure the security of several of these capabilities, combining low- buildings in a convenient way. For example, locks, power wireless connectivity over Bluetooth motion sensors, cameras, exterior and interior Smart, ZigBee, 6LoWPAN, Sub-1 GHz, Wi-Fi or lighting, keypads and other security devices could a proprietary protocol, with an MCU that’s able to connect through ZigBee or Sub-1 GHz to a Wi-Fi- control a sensor and run an application. This also based gateway with access to the Internet. With includes several interfaces to I/O peripherals. By this sort of system, a business owner/operator who bundling many of the basic capabilities into an may not currently be at the property, could grant integrated platform, such devices reduce the power temporary access to a trusted employee through consumption of the node even further than that of a their smartphone and a cloud-based security discrete implementation. application. Security Security is an issue of concern in practically every aspect of the economy, including industrial wireless IoT networks. Security can be implemented in a number of ways, but the goal is always to prevent, detect and respond to malicious behavior when it occurs. On a physical level, IoT nodes should be as tamper resistant as possible. But with electronic systems, security must also be provided to protect Wireless connectivity design considerations for the industrial IoT 8 July 2015 wider industrial IoT and the cloud. Some industrial hardware security measures can be taken, such Wi-Fi solutions have been bundled with out-of-the- as secure boot loading mechanisms and logical box connectivity capabilities, including single or dual memory locks. wireless technologies, certified wireless protocols and security algorithms, sample code libraries and Connectivity to the cloud and wired networks development tools and kits. In addition to cloud connectivity, wireless industrial applications will likely interact with traditional wired equipment networks. For example, factory automation or building automation systems could At some point, most industrial wireless IoT networks very well feature both wired and local area wireless usually interface with the cloud and/or traditional networks in the same environment. In such cases, industrial wired networks. the ability to interface wireless connectivity devices Cloud connectivity has many advantages, but the with wired connectivity protocols like RS-485, first issue to address is where in the local IoT will this RS-232 and others will be quite beneficial. A connectivity be implemented. Most likely, the IoT will technician might then monitor processes on the connect to the cloud through one of its upper levels, factory floor through a wireless connection to such as a server or gateway. The gateway or server an HMI which is monitoring a wired equipment would aggregate cloud communications from other network running one of the industrial real-time nodes and transmit over the cloud. Some industrial Ethernet protocols like EtherCAT®, EtherNet/IP™, IoT implementations will access the cloud in order PROFINET® or POWERLINK. to connect with cloud-based strategic partners, like IBM, PTC or other third-party firms that offer Conclusions application-specific analytics, specialized processing and other services that are sometimes required. Texas Instruments has long had the industry’s Probably the most critical issue relative to cloud most extensive portfolio of enabling wireless connectivity will be how easy or difficult it will be technologies for industrial IoT networks. A pioneer to accomplish. Historically, developers of industrial in low-power innovation, TI’s technologies include systems have not needed experience in radio both integrated and discrete solutions, such as frequency (RF) engineering. In many cases, wireless ultra-low power MCUs and sensors, analog devices cloud connectivity will be provided by Wi-Fi in a like ADCs and comparators, as well as WiLink™ gateway or server, since Wi-Fi is already ubiquitous Wi-Fi and Bluetooth combo connectivity devices in many industrial settings and it features the and SimpleLink™ wireless MCUs which have been requisite bandwidth and capacity for effective cloud integrated with local area wireless connectivity for all connectivity. Some IoT end nodes might require of the popular standards in addition to being easily dual wireless connectivity; Bluetooth Smart, ZigBee customizable to proprietary protocols. Moreover, the or 6LoWPAN for local interaction with sensors and SimpleLink wireless MCUs include the most popular operators, and Wi-Fi connectivity for linking into the peripheral interfaces as well as on-chip memory and Wireless connectivity design considerations for the industrial IoT 9 July 2015 White Paper algorithms can also protect stored data. In addition, a sensor controller engine that quickly and easily and other resources that allow industrial system interfaces to a wide range of TI’s sensors. developers to not only customize and differentiate All solutions are capable of operating over the their products, but also deliver their new system to 40–85°C industrial temperature range. Highly the market quickly and efficiently. programmable, TI’s wireless solutions are supported For more information go to by an extensive ecosystem of tools, libraries of www.ti.com/wirelessconnectivity ready-to-use software modules, reference designs BG1 RF_ANT2 WRF2 ® ZigBee COEX I/F Aband BT: UART MAC/PHY WLAN : SDIO BT EN MAC/PHY 32 KHz 26M TCXO D WRFA BG2 RF_ANT1 2.4-GHz SPDT WRF1 WLAN EN 5-GHz DPDT BT D BTRF F VIO VBAT PM Note: Dashed lines indicate optional configurations and are not applied by default. Figure 5: WiLink 8 dual-band industrial module (WL1837MOD variant shown) Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard terms and conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no liability for applications assistance, customer’s applications or product designs, software performance, or infringement of patents. The publication of information regarding any other company’s products or services does not constitute TI’s approval, warranty or endorsement thereof. SimpleLink and WiLink are trademarks of Texas Instruments. All trademarks are the property of their respective owners. © 2015 Texas Instruments Incorporated 10 Return to ToC 11 Blog Posts Wireless connectivity blog posts Blog Posts The Internet of industrial Things The Internet of Things or IoT is not just for consumer applications. It has a strong potential in the industrial sector because of the services that will be provided as more sensors and equipment are connected to the cloud. It is important that IoT not be confused with machine-to-machine or M2M connectivity since they are not the same. M2M is traditionally based on proprietary technology that is a closed environment vs. IoT which offers an open environment and leverages standard Internet accessibility and services – just like the ones we humans use. This level of openness enables a gas sensor to tweet or text an operator when there is a problem, which is not straightforward with an M2M system. With cloud connectivity there is a lot of potential for IoTenabled applications within the industrial market. • Smart manufacturing: Manufacturers are adding wireless connectivity to their products or production line to improve the manufacturing process. With integrated wireless connectivity, manufacturers are better able to get information from the factory floor to their cloud systems to quickly uncover and address any issues long before the product leaves the factory. Manufacturers also want to use connectivity to gather information about equipment in the field. This information helps them find bugs, monitor equipment and also allows for software and firmware updates over-the-air – something that was not possible before. • Building automation: Much like factory automation, building automation can connect to sensors to turn lights on and off depending on occupancy and allow dynamic control of HVAC systems, which allows for energy optimization. Predicative maintenance is also a benefit to ensure that service is done in a timely fashion, which reduces costs. • Smart cities: Connecting elements within a smart city to the IoT can provide enhancements to improve electricity and water usage with e-meters to improve conservation efforts. Connected smart street lights as well as cloud-connected surveillance and traffic-control monitors help provide a smoothrunning city. Last, sensors throughout the city detect gas and water-pipe leak keep citizens safe and ensure operation. • Other markets: There are additional opportunities to improve employee health and safety through the IoT outside of the workplace. Connected wearables and healthcare monitoring improves overall health and wellness. And IoT within automobiles provides infotainment but also lighter and more fuel efficient cars with wire replacement and predictive maintenance to save on costly repairs. Many of the examples above play out in the consumer market as well. However, the industrial IoT is different than consumer applications. Industrial requires different interfaces and protocols that are robust against noise, environmental changes, controlled latency and are highly secure because of the conditions and applications they are used in. Additionally, the industrial market moves much slower than the consumer market so its move to connected IoT enhancements will take some time. The benefits of predicative maintenance, monitoring and data analysis to improve output or working conditions, combined with the availability of the right hardware and software solutions, will provide a financial reason to migrate to IoT-connected systems in the future – its just a question of when. • Learn more about TI’s role in the IoT and its broad portfolio of IoT-ready solutions • Watch this video and see how TI is innovating for industrial automation • Read more blogs on TI’s IoT solutions 12 Blog Posts Building the industrial Internet of Things The Internet of Things or IoT is an enabling technology that is delivering new use cases and services across a wide variety of markets and applications. When people think of the IoT, they often think of home or personal applications, but in reality, IoT-connected products will play a role in smart manufacturing, smart cities, automotive, building automation and health care as well. The Industrial IoT has strong potential because of the services that will be provided as more sensors and equipment are connected to the cloud. It is important that IoT not be confused with machine-to-machine (M2M) connectivity since they are not the same. M2M is traditionally based on proprietary technology that is a closed environment vs. IoT which offers an open environment and leverages standard Internet accessibility and services – just like the ones we humans use. This level of openness enables a gas sensor to tweet or text an operator when there is a problem or for an industrial endequipment to leverage a generic public data base to see how it is performing compared to industry benchmarks, things which are not straightforward with proprietary M2M systems. At a high-level, IoT is about improving efficiency (e.g., energy, manufacturing, maintenance, etc.), and delivering increased safety and security, better experiences, new business services and more to a variety of industries including: • Smart manufacturing: Manufacturers are adding wireless connectivity to their products or production line to improve the manufacturing process. With integrated connectivity, manufacturers are better able to get information from the factory floor to their cloud systems to quickly uncover and address any issues long before the product leaves the factory. Manufacturers also want to use connectivity to gather information about equipment in the field. This information helps them find bugs, monitor equipment and also allows for software and firmware updates over-the-air – something that was not possible before. • Building automation: Much like factory automation, building automation can connect to sensors to turn lights on and off depending on occupancy and allow dynamic control of HVAC systems, which allows for energy optimization. Predicative maintenance is also a benefit to ensure that service is done in a timely fashion, which reduces costs. • Smart cities: Connecting elements within a smart city to the IoT can provide enhancements to improve electricity and water usage with e-meters to improve conservation efforts. Connected, smart street lights as well as cloud-connected surveillance and traffic-control monitors help provide a smoothrunning city. Last, sensors throughout the city detect gas and water-pipe leak keep citizens safe and ensure operation. • Automotive: Connected cars provide infotainment services to stream entertainment and provide navigation and other connected services. Replacing wires with wireless connectivity is leading to lighter and more fuel-efficient automobiles 13 with sensor-driven predictive maintenance to save on costly repairs. • Retail stores: A connected retail environment can better track inventory and dynamically change digital shelf labels. Combined with customer loyalty programs, IoT-connected beacons within a store can serve up coupons and offer sales based on customer preferences directly to their smartphones while they are shopping. • Healthcare: There are additional opportunities to improve employee health and safety through the IoT outside of the workplace. Connected wearables and health care monitoring improve overall health and wellness. Many of the examples above play out in the consumer market as well. However, the industrial IoT is different than consumer applications. Industrial requires different interfaces and communication protocols that are robust against noise, environmental changes, controlled latency and are highly secure because of the conditions and applications they are used in. Additionally, the industrial market moves much slower than the consumer market so its move to connected IoT will take some time. The benefits of predicative maintenance, monitoring and big data analysis to improve output or working conditions, combined with the availability of the right hardware and software solutions, will provide a financial reason to migrate to IoT-connected systems in the future – it’s just a question of how quickly it happens. • Learn more about TI’s role in the IoT and its broad portfolio of IoT-ready solutions • Watch this video and see how TI is innovating for industrial automation • Read more blogs on TI’s IoT solutions 14 The new SimpleLink™ CC26xx/CC13xx ultra-low power platform for Bluetooth® Smart, 6LoWPAN, ZigBee®, Sub-1 GHz and ZigBee RF4CE™ is built and designed with low power in mind. We’ve looked at all aspects important to making sure the energy footprint of our solution is as small as possible enabling longer battery lifetimes, smaller batteries or even energy harvesting for battery-less applications. Application Contrary to popular belief, that radio transceiver itself is rarely the main contributor to the overall power consumption of a wireless microcontroller (MCU). As various technologies progress, there is more and more need for computing power, even as relatively small sensors and the wireless protocol stacks come with more overhead as the standards evolve. In the SimpleLink CC26xx family, there are two very energy efficient MCUs available for the application. The scores in Table 1 allow for very low average power consumption during active use. Running the ARM Cortex-M3 at maximum speed (48 MHz), the CPU operation consumes less than 3 mA and outperforms any wireless MCU running at less efficient cores or at lower CPU clocks. The CC26xx CoreMark power efficiency (CoreMark / mA) is the best compared to any competitor with a comparable MCU, making it the most energy efficient microcontroller available today. Sensor controller The unique ultra-low power sensor controller is a 16-bit CPU coupled with peripherals like analog-to-digital converters (ADC), analog comparators, SPI/I2C and capacitive touch. It is designed to run autonomously when the rest of the system is in standby. The Sensor Controller allows interface with external analog or digital sensors in a very low power manner. ARM® Cortex®-M3 The ARM Cortex-M3 is the main system CPU inside the CC26xx device. One way of measuring the performance of MCUs is by using benchmark tools. One of the more popular benchmarks is CoreMark from the Embedded Microprocessor Benchmark Consortium (EEMBC). CoreMark is a simple, yet sophisticated, benchmark that is designed to test the efficiency of a processor core used in embedded devices. It is not system dependent, therefore it functions the same regardless of the platform (e.g., big/little endian, high-end or low-end processors, etc.). This benchmark also demonstrates the energy efficiency of the MCU core. Table 1: Various CoreMark scores for the CC26xx, measured on CC2650-7ID @ 3.0V and 48 MHz Figure 1: The ultra-low power sensor controller engine can run autonomously while the rest of the system is in standby. Waking up the entire system to perform minor tasks is very often not energy efficient as it introduces a lot of overhead. In many use cases there are tasks that need to run at certain intervals that are at a higher duty-cycle than the actual RF or main activity. One example could be a heart-rate monitor that needs to run the ADC 10 times per second to capture the heart rate accurately. Waking the entire system up to perform a wireless transmission 10 times per second will, in this case, be very energy inefficient. With the SimpleLink ultra-low power CC26xx platform, one can let the Sensor Controller perform 15 Blog Posts Taking power to a new low with the SimpleLink™ ULP wireless MCU platform the battery for the active use. The CC26xx uses an ultra-low leakage SRAM that can be fully retained (20 KB) and in addition have the real-time clock (RTC) running, and registers and CPU state retained while in standby consuming as little as 1 µA. In shutdown, the CC26xx can wake up on external I/O events while drawing as little as 150 nA. The shelf lives for CR2032s are increasing and some vendors now state up to 10 years of battery life. The average system current drawn from a 220 mAh CR2032 has to be below 2.5 µA to reach 10 years lifetime[2]. If the base current of a system is above this, one cannot reach the maximum potential of the battery, no matter how low active duty cycle one implements. Figure 2: The sensor controller can significantly reduce average power consumption. all the ADC measurements and wake up the ARM Cortex-M3 every 10th ADC sample for optional further processing and group RF transmission of this data. How average current affects battery lifetime In this example, the sensor controller can do 10 ADC reads per second at less than 3 µA average consumption. Performing the same task using the ARM Cortex-M3 will require 10× the power consumption. Battery life time is mostly about the average power consumption. This will be very use-case dependent, but there is a benchmark now available from EEMBC called ULPBench™ that standardizes on datasheet parameters and provides a methodology to reliably and equitably measure MCU energy efficiency. ULPBench uses a common set of workloads that are portable across 8-, 16- and 32-bit microcontrollers, enables the use of MCU low-power modes while focusing on real-world applications utilizing integrated hardware functions. In the end it analyzes the effects of active and low-power conditions[3]. Table 2: Energy efficiency of the sensor controller while running at the main clock. The sensor controller can run directly off a pre-scaled 24-MHz clock, making it capable of collecting data and performing simple processing of the data. Radio Traditionally the peak drain caused by high transmit and receive currents of wireless solutions puts constraints on the batteries that could be used or significantly reduced the battery lifetime. With the very low peak currents of the CC26xx at around 6 mA (0 dBm output), this no longer poses any limitations on the traditional CR2032 batteries and can even allow for smaller batteries to be used. From an average power consumption perspective, the radio is no longer the main contributor and is of less concern and there is no longer a need to back down on the output power to reduce the peak consumption. Sleep and shutdown Figure 3: CC26xx ULPBench scores vs. competition. In any battery-operated application, the RF (receive/transmit) duty cycle and its parameters decide the battery lifetime. Between transmissions, it is important to keep the standby currents as low as possible so that there is enough juice in Another common way of looking at average current is to look at a specific use-case for a given technology. For Bluetooth 16 Smart, one way is to point out the average while keeping a connection between two devices at a given interval. Further details on how to calculate average currents and battery lifetime for a Bluetooth Smart application can be found in [4]. Table 3: Average scores for the CC26xx, measured on CC2650-7ID @ 3.0 V Reference Cortex-M0+ Processor [2] arketing Malarkey and Some Truths About Ultra-Low M Power Design, Jack Ganssle 2014 [3] EEMBC ULPBench [4] Measuring Bluetooth® Smart Power Consumption Blog Posts All of what has been discussed comes into play when looking at the power profile of a wireless event. Figure 4 shows a connection event for Bluetooth Smart with wake-up, preprocessing of the software stack, radio events (both receive and transmit) and a post-processing / going back to sleep period. [1] Figure 4: Power profile of a Bluetooth Smart connection event 17 ® Blog Posts Bluetooth Smart in industrial Have you ever heard of Bluetooth® Smart? It’s the latest addition to the Bluetooth specification and it uses Bluetooth low-energy technology to enable the Internet of Things (IoT) for products that operate on small coin cells for years. How is that possible you may ask? Bluetooth low energy was designed to be low power, only waking up from time to time to transmit small amounts of data with rather high latency in a range that covers up to a couple of meters. Perfect for sensors! That’s how it began in 2010. It took a year or two until the first products showed up on the market in the form of heart-rate belts and smart watches. Then a smartphone came into the picture, Apple® iPhone® 4S. It was the first phone on the market to support Bluetooth low energy and the market took off. The fact that everyone carrying a smartphone, could connect to all kinds of products in a low-power manner was something new. Suddenly, everyone wanted their product to be connected to a smartphone. As a natural progression came the talk about Internet of Things and cloud connectivity so your smartphone can connect to any-thing and so allowing any-thing to connect to the Internet (read cloud). With this dramatic change, firmware updates could be pushed to products out in the field, smartphones could control helicopter toys and wireless add-ons can replace wires in weird places. There are already deployed solutions for use cases including both wired and wireless technologies that can be replaced by Bluetooth Smart. As Bluetooth Smart is evolving and adapting to these new use cases, one might be afraid that there might be a “war” between standards coming. I like to think about it more of an evolution, where the survival of the fittest applies. The future will behold which technology is suitable for what. We are at this point closing in on 2015 and all of a sudden, manufacturers are now using Bluetooth Smart (which is becoming the more common name for Bluetooth low energy) for longer-range communication, high-throughput transfers and tough ISM applications as well. This is not at all what Bluetooth low energy was designed for. However, Bluetooth low energy is now advancing into high-quality industrial applications; replacing whatever has been used for ages, or at least a very long time. However, we can already elaborate on some applications that might be impacted. Take lighting as an example, where ZigBee is dominating the market with smart bulbs connected in a network to a Wi-Fi® gateway. Bluetooth Smart can do star topologies as of now, with a central or smartphone controlling multiple light bulbs. However, ZigBee operates in a mesh network topology which means that information can be routed through nodes and range can be extended beyond the gateway limitation. Bluetooth Mesh is something that could address this in the future as well, if it’s designed in an energyefficient way (i.e., not using flooding, etc.) and the security It’s time for a revolution, time for Bluetooth Smart to show its worth in new places. Bluetooth Smart is emerging into unexplored new market segments from hardcore industrial applications and fancy home appliances to trendy beaconsystems [sic]. 18 is robust including the complete solution for that matter. But what about the already-deployed ZigBee solutions, will those be redundant? Well, not necessarily. What if one node in the ZigBee network adds Bluetooth Smart? Or the gateway includes a Bluetooth Smart interface? Why is Bluetooth Smart a good fit for industrial applications? Read the six-part blog series on ECN Magazine that covers the industrial applications mentioned above and allow me to enlighten you. Reference There are other use cases; i.e., Machine to Machine (M2M), cable replacements, asset tracking and automation control that can benefit from Bluetooth Smart in the industrial setting. There are already multiple connectivity technologies with a foothold in the industrial space including Ethernet, ZigBee, Wi-Fi, Sub-1 GHz, etc. and Bluetooth Smart can easily complement these technologies. What is needed is a focus on streamlining a set of technologies to define a wireless super-set similar to the useful Swiss army knife. 19 [1] Why Bluetooth Smart is perfect for M2M [2] Connecting machinery to the IoT [3] How to use Bluetooth Smart in industrial lighting [4] How you can replace wires with Bluetooth Smart [5] Why Beacon is the next big thing in wireless [6] The key to using Bluetooth Smart in asset tracking Blog Posts The shocking impact of poor RF selectivity and blocking At TI we have more than 15 years of experience with lowpower RF solutions. Over time, working hands-on with customers, we have learned what it takes to design RF ICs that work well in industrial environments. The wireless communication needs to be robust and just plain work. To learn more about our 169-MHz, 315-MHz, 433-MHz, 470-MHz, 868-MHz, 915-MHz and 920-MHz solutions, check out our Sub-1 GHz page. Recently we wanted to test our newest long-range RF solution against a well-known competitor in the market. Both solutions have really great RF transmission range when tested in a quiet open space, such as in the countryside environment found in this video from our 25-km range test video in South Africa. However, many industrial RF solutions are not deployed in the countryside but rather in urban areas, which is why we shot our latest range test video in downtown Oslo, Norway. what happens to the RF link when we introduce an interferer, i.e., an e-meter, into the equation. We were really surprised by the results. The wideband solution basically ceased to function if the interferer was within ~200 meter range. This basically means that an e-meter in a neighboring building can block your wide-band RF link completely. So why is the wideband solution prevented from receiving data while the narrowband solution is just fine? There are two main benefits with a narrowband solution. First, there are more RF channels available which enable more systems to coexist peacefully. Secondly, wideband solutions have wider RF receive filters which pick up more RF noise and interference than a narrowband solution. Hence, narrowband is the best choice for robust RF solutions in urban and industrial areas. For an in-depth discussion on this topic, please check out our Long-range RF communication: Why narrowband is the de facto standard whitepaper. In the video we set up 2 RF links (one with TI’s CC1120 long-range, narrowband, high-performance RF transceiver and one with a long-range wideband competitor) to compare 20 Return to ToC TI Designs Wireless connectivity TI Design reference designs 21 Humidity & Temp Sensor Node for Star Networks Enabling 10+ Year Coin Cell Battery Life Ref Design Description TI Designs This TI Design uses Texas Instruments nano-power system timer, SimpleLink™ ultra-low power wireless microcontroller (MCU) platform, and humidity-sensing technologies to demonstrate an ultra-low power method to duty-cycle sensor end nodes. These technologies lead to an extremely long battery life: over 10 years with a standard CR2032 lithium ion coin cell battery. The TI Design includes techniques for system design, detailed test results and information to get the design up and running quickly. Features • Use of nano-power system timer to duty-cycle the system results in 10+ year battery life from CR2032 coin cell • Configurable system wakeup interval • Extremely low off-state current (183 nA for 59.97 seconds) • Ultra-low on-state current due to low active processor and radio transmit currents (4.04 mA for 30 ms) • ±3% Relative humidity accuracy • ±0.2°C Temperature accuracy Part number Name Product family Design kits and Evaluation modules CC2650 SimpleLink™ multi-standard 2.4-GHz ultra-low power wireless MCU Wireless MCUs View Design Kits & Evaluation Modules CC2640 SimpleLink ultra-low power wireless MCU for Bluetooth Smart Wireless connectivity View Design Kits & Evaluation Modules CC2630 SimpleLink ultra-low power wireless MCU for 2.4-GHz IEEE 802.15.4-based RF protocols Wireless connectivity View Design Kits & Evaluation Modules HDC1000 Low power, high accuracy digital humidity sensor with integrated temperature sensor Sensor products View Design Kits & Evaluation Modules TPD1E10B06 Single-channel ESD in 0402 package with 10pF capacitance and 6V breakdown ESD protection diodes View Design Kits & Evaluation Modules TPL5110 Ultra-low-power timer with MOS driver and MOSFET power ON Clock and timing View Design Kits & Evaluation Modules To download the full TI Design Reference Design visit: http://www.ti.com/tool/TIDA-00374 © 2015 Texas Instruments Incorporated Printed in U.S.A. 22 Wireless Motor Monitor Reference Design This TI Design is inspired by the need to monitor the health of motors and machines to accurately predict and schedule maintenance (or replacement) while minimizing cost and down time during industrial production. Millions of industrial motors are monitored today with handheld or wired Piezo accelerometer sensing devices. The annual cost of monitoring these motors is approximately $300 per motor. Recent advancements in ultra-low-power processing technologies, radios and piezo sensor miniaturization have enabled the development and deployment of low-cost, small motor monitors with wireless capabilities. These wireless motor monitors are powered by coin cells that have a battery life of more than 10 years. These systems provide the same broadband sensitivity as existing handheld systems, collect vibrational data and perform spectral analyses on that data. This integrated intelligence lets you deploy and monitor these systems in difficult-to-reach locations. The money these capabilities save can pay for the systems within a few months. The wireless motor-monitoring TI Design uses two different, yet electrically equivalent, form factors for development and testing. These form factors include: • The modular form factor • The compact form factor The standard sensor board supports a PCB Piezotronic vibration sensor. The 30-pin expansion connector on the small form factor board enables the base-board to be operated with the MCU, the CC2650 radio, or both. The system software assumes you are using both devices. This TI Design focuses on the compact form factor system. Features • 100-µA MSP MCU analyze/write • 6-mA Bluetooth® Low Energy radio • 40-nA system sleep • 10-KHz/16-bit vibration sensor • iPad®/Android™ visualization • This circuit design is tested and includes firmware, GUI, demo, and Getting Started Guide In the modular form factor, TI LaunchPad™ Development Kits and EM connectors allow you to incorporate multiple radios and processors with energy-management and sensor subsystems. The compact form factor uses the MSP430FR5969 ultra-low-power microcontroller unit (MCU) with a CC2650 BLE radio, but can be connected to multiple sensor boards. (continued) 23 TI Designs Description TI devices Order samples, get tools and find more information on the TI products in this reference design. Part number Name Product family Design kits and Evaluation modules ADS8320 16-bit, high-speed, 2.7-V to 5-V micro power sampling analog-to-digital converter Analog-to-digital converter View Design Kits & Evaluation Modules BQ25570 Ultra-low-power harvester power management IC with boost charger and nanopower buck converter Battery management products View Design Kits & Evaluation Modules CC2650 SimpleLink™ multi-standard 2.4-GHz ultra-low power wireless MCU Wireless MCUs View Design Kits & Evaluation Modules LMP7716 Dual-precision, 17-MHz, low-noise, CMOS input amplifier Operational amplifier (Op Amp) View Design Kits & Evaluation Modules MSP430FR5969 16-MHz ultra-low-power microcontroller featuring 64 KB FRAM, 2 KB SRAM, 40 I/O Ultra-low power MCU View Design Kits & Evaluation Modules TPL5100 Nano power programmable timer with power gating functionality Clock and timing View Design Kits & Evaluation Modules TPS22969 1-Ohm SPDT analog switch 5-V/3.3-V single-channel 2:1 multiplexer/ demultiplexer Signal switches View Design Kits & Evaluation Modules TPS7A7002 Very-low input, very-low dropout 3-A regulator with enable Linear regulator (LDO) View Design Kits & Evaluation Modules To download the full TI Design Reference Design visit: http://www.ti.com/tool/tidm-wlmotormonitor © 2015 Texas Instruments Incorporated Printed in U.S.A. 24 SimpleLink™ Multi-Standard CC2650 SensorTag Reference Design The new SimpleLink Multi-Standard SensorTag IoT kit invites you to realize your cloud-connected product idea. Including 10 low-power MEMS sensors in a tiny package, the kit is expandable with DevPacks to make it easy to add your own sensors or actuators. Connect to the cloud with Bluetooth® Smart and get your sensor data online in three minutes. The SensorTag is ready to use out of the box with an iOS™ and Android™ app, with no programming experience required to get started. The new SensorTag is based on the CC2650 wireless MCU, offering 75% lower power consumption than previous Bluetooth Smart products. This allows the SensorTag to be battery powered and offer years of battery lifetime from a single coin-cell battery. The Bluetooth Smart SensorTag includes iBeacon technology. This allows your phone to launch applications and customize content based on SensorTag data and physical location. Additionally, the SensorTag can be enabled with ZigBee® and 6LoWPAN technology. Features • Support for 10 low-power sensors, including ambient light, digital microphone, magnetic sensor, humidity, pressure, accelerometer, gyroscope, magnetometer, object temperature and ambient temperature • Ultra-low power, with years of battery life from a single coincell battery and enabling battery-less applications through the high-performance ARM® Cortex®-M3 CC2650 wireless MCU. • Cloud connectivity lets you access and control your SensorTag from anywhere • Multi-standard support enables ZigBee or 6LoWPAN through a simple firmware upgrade • DevPacks allow you to expand the SensorTag to fit your designs Visit www.ti.com/sensortag for more information. TI devices Order samples, get tools and find more information on the TI products in this reference design. Part number Name Product family Design kits and Evaluation modules CC2620 SimpleLink ultra-low power wireless MCU for RF4CE Wireless connectivity View Design Kits & Evaluation Modules CC2630 SimpleLink ultra-low power wireless MCU for 2.4-GHz IEEE 802.15.4-based RF protocols Wireless connectivity View Design Kits & Evaluation Modules CC2640 SimpleLink ultra-low power wireless MCU for Bluetooth Smart Wireless connectivity View Design Kits & Evaluation Modules CC2650 SimpleLink multi-standard 2.4-GHz ultra-low power wireless MCU Wireless MCUs View Design Kits & Evaluation Modules HDC1000 Low power, high-accuracy digital humidity sensor with integrated temperature sensor Sensor products View Design Kits & Evaluation Modules OPT3001 Digital ambient light sensor (ALS) with high-precision human eye response Optical sensing View Design Kits & Evaluation Modules TMP007 Infrared thermopile contactless temperature sensor with integrated math engine in WCSP package Temperature sensors View Design Kits & Evaluation Modules TS5A3159A 1-Ohm SPDT analog switch 5-V/3.3-V single-channel 2:1 multiplexer/demultiplexer Signal switches To download the full TI Design Reference Design visit: http://www.ti.com/tool/TIDC-CC2650STK-SENSORTAG 25 TI Designs Description ETSI Cat. 1 Receiver-Capable wM-Bus 169-MHz RF Subsystem for Smart Gas and Water Meters Description Features • ETSI Cat. 1 receiver capable RF subsystem • Market-leading blocking, selectivity and RX sensitivity subsystem for wM-Bus at 169 MHz • Fully compliant with the wM-Bus requirements for Italy and France (with an external PA device) at 169 MHz • Highly efficient, RF friendly DC/DC converter • No costly SAW filter and TCXO required TI devices Order samples, get tools and find more information on the TI products in this reference design. Part number Name Product family Design kits and Evaluation modules CC1120 High-performance RF transceiver for narrowband systems Wireless connectivity View Design Kits & Evaluation Modules TPS62730 Step-down converter with bypass mode for ultra-low-power wireless applications Converter (integrated switch) View Design Kits & Evaluation Modules To download the full TI Design Reference Design visit: http://www.ti.com/tool/TIDC-WMBUS-169MHZ © 2015 Texas Instruments Incorporated Printed in U.S.A. 26 TI Designs This reference design is a very-low power, ETSI Cat. 1 receiver capable RF subsystem for wM-Bus-enabled smart gas and water meters at 169 MHz. It provides market-leading blocking, selectivity and RX sensitivity numbers for all wM-Bus N-modes as per EN13757-4:2013 and their respective variants, which were defined in Italy and France. This cost-optimized design, without SAW filter and without TCXO, uses the RF friendly DC/DC to reduce the average power consumption while keeping the highest RF performance. ™ Implementing SimpleLink ® Wi-Fi Connectivity in a Smart Electric Meter Description This design implements a three-phase energy meter with Wi-Fi connectivity. The e-meter SoC is used to perform all metrology functions and control the SimpleLink™ Wi-Fi transceiver. The smart meter data can then be displayed on any Wi-Fi connected device via a standard web browser. Features TI Designs • Three-phase e-meter implementation that calculates metrology parameters such as RMS current, RMS voltage, active and reactive power and energies, power factor and frequency • Wi-Fi connectivity over IEEE 802.11 b/g/n networks from any smart phone, tablet or computer through a standard web browser • 160-segment LCD display for Wi-Fi status and metrology parameter display • Expandable to support other Internet applications • PC-based GUI for calibration TI devices Order samples, get tools and find more information on the TI products in this reference design. Part number Name Product family CC3100 CC3100 SimpleLink™ Wi-Fi and Internet-of-Things solution for MCU applications SimpleLink solutions CC3100MOD SimpleLink Wi-Fi CC3100 Internet-on-a-chip wireless network processor module Wireless connectivity MSP430F67791 MSP430F67791 mixed-signal microcontroller Low power + performance To download the full TI Design Reference Design visit: http://www.ti.com/tool/TIDC-3PHMTR-WIFIXR © 2015 Texas Instruments Incorporated Printed in U.S.A. 27 Smart Plug with Remote ® Disconnect and Wi-Fi Connectivity Description This design implements single-outlet energy measurement with remote connect/disconnect capability and Wi-Fi® connectivity. Designers can quickly create networked load control devices for industrial building and home automation applications. • SimpleLink™ Wi-Fi connectivity over IEEE-802.11 b/g/n networks from any smart phone, tablet or computer through a standard web browser • Single-phase energy measurement that calculates RMS current, RMS voltage, active and reactive power and energies, power factor and frequency • Solid-state relay provides remote connect/disconnect capability • Compact physical design with minimal BOM components • Low-power components plus efficient power supply provide low system power consumption • The system design is tested and includes firmware for energy measurement, Wi-Fi connectivity and relay control along with Android™-based demo application and user’s guide TI devices Order samples, get tools and find more information on the TI products in this reference design. Part number Name Product family Design kits and Evaluation modules ® CC3200 CC3200 SimpleLink™ Wi-Fi and Internet-of-Things solution, a single-chip wireless MCU Wireless MCUs View Design Kits & Evaluation Modules CC3200MOD SimpleLink Wi-Fi CC3200 Internet-on-a-chip wireless MCU module Wireless connectivity View Design Kits & Evaluation Modules MSP430I2040 16-bit mixed-signal microcontroller Ultra-low power View Design Kits & Evaluation Modules UCC28910 700-V flyback switcher with constant-voltage constant-current and primary-side control AC/DC and isolated DC/DC power supply View Design Kits & Evaluation Modules UCC28911 700-V flyback switcher with constant-boltage constant-current and primary-side regulation AC/DC and isolated DC/DC power supply View Design Kits & Evaluation Modules To download the full TI Design Reference Design visit: http://www.ti.com/tool/TIDC-SMARTPLUG-WIFI © 2015 Texas Instruments Incorporated Printed in U.S.A. 28 TI Designs Features Bluetooth® Low Energy (Bluetooth Smart) to RS-485 Gateway Description Modbus is an application protocol for serial data transmission that often uses RS-485 for serial data transfer. This reference design implements a gateway between Modbus and the Bluetooth® Smart CC2540 wireless MCU. It serves as a replacement for wires in an RS-485 network, and it allows another Bluetooth Smart-compatible device like a computer or smartphone to easily connect to an existing RS-485 network. • Implements wireless connection to industrial electronic devices with the CC2540T Bluetooth Smart Gateway solution graded up to 125°C • Simple and “ready-to-go” design shortens time to market • Android™ app (ModbusController) provided to enable control and communication with Modbus peripheral software • This design is tested and includes firmware, GUI, demo and user guide TI devices Order samples, get tools and find more information on the TI products in this reference design. Part number Name Product family ® CC2540T SimpleLink high-temperature Bluetooth Smart wireless MCU Wireless connectivity SN65HVD485E Half-duplex RS-485 transceiver Interface TPS769 10-V, 100-mA, low Iq, low-dropout linear regulator Linear regulator (LDO) To download the full TI Design Reference Design visit: http://www.ti.com/tool/TIDC-BLUETOOTH-SMART-TO-RS-485-GATEWAY © 2015 Texas Instruments Incorporated Printed in U.S.A. 29 TI Designs Features CC2540 Bluetooth® Low Energy USB Dongle Reference Design Description The CC2540 USB Dongle is a complete example of how to use the USB-enabled Bluetooth® Low Energy (BLE) Wireless MCU. The reference design can be used to enable Bluetooth Smart and Internet of Things applications on any system that contains a USB host. Features TI Designs • Simple BLE-to-USB connection – Adds BLE to an existing product with USB • Debug header, LEDs and buttons included – Enables faster development • It can also be used as a packet sniffer for analyzing the BLE protocol and for software and system-level debugging (use the free tool SmartRF Packet Sniffer) TI devices Order samples, get tools and find more information on the TI products in this reference design. Part number Name Product family ® CC2540 SimpleLink Bluetooth Smart wireless MCU with USB Wireless connectivity TPS769 10-V, 100-mA, low Iq, low-dropout linear regulator Linear regulator (LDO) To download the full TI Design Reference Design visit: http://www.ti.com/tool/TIDC-CC2540-BLE-USB © 2015 Texas Instruments Incorporated Printed in U.S.A. 30 Gas Sensor Platform with Bluetooth® Low Energy Description This reference design is a low-power wireless gas sensor solution that supports a wide array of electrochemical gas sensors. With the versatility of a configurable interface for either Bluetooth® Low Energy, ZigBee® RF4CE, 6LoWPAN or ANT this flexible and certified sensor solution is ideal for various building safety, industrial process control, mining and health care applications. Features TI Designs • Monitors wide range of gases • Carbon monoxide, oxygen, ammonia, fluorine, chlorine dioxide … and more • Supports 2- and 3-lead electrochemical gas sensors • Complies with FCC and IC regulatory standards • Coin-cell battery operation • Easily monitor gas concentrations via TI’s gas sensor iOS mobile app TI devices Order samples, get tools and find more information on the TI products in this reference design. Part number Name Product family ® CC2541 SimpleLink™ Bluetooth Smart and proprietary wireless MCU Wireless connectivity LM4120 Precision micropower low dropout voltage reference Voltage reference LMP91000 Configurable AFE potentiostat for low-power chemical-sensing applications Sensor products TPS61220 Low input voltage, 0.7-V boost converter with 5.5-μA quiescent current Converter (integrated switch) To download the full TI Design Reference Design visit: http://www.ti.com/tool/TIDA-00056 © 2015 Texas Instruments Incorporated Printed in U.S.A. 31 Smart Home and Energy Gateway Reference Design The Smart Home and Energy Gateway Reference Design provides example implementation for measurement, management and communication of energy systems for smart homes and buildings. This example design is a bridge between different communication interfaces, such as Wi-Fi®, Ethernet, ZigBee® or Bluetooth®, that are commonly found in residential and commercial buildings. Since objects in the house and buildings are becoming more and more connected, the gateway design needs to be flexible to accommodate different RF standards, since no single RF standard is dominating the market. This example gateway addresses this problem by supporting existing legacy RF standards (Wi-Fi, Bluetooth) and newer RF standards (ZigBee, BLE). • Showcase seamless profile integration for smart energy, lighting and building automation • Showcase bridge between HAN (Home Area Network) and LAN (Local Area Network)/WAN (Wide Area Network) • Enables development of real-world smart home and energy gateway applications, with the use of example schematics, bill of materials, design files and links to free software package downloads Features • Showcase co-existence of ZigBee, Wi-Fi, Bluetooth and NFC (Near Field Communication) allows for simultaneous operation of the different communication profiles (continued) 32 TI Designs Description TI devices Order samples, get tools and find more information on the TI products in this reference design. Part number Name Product family ® ® Design kits and Evaluation modules AM3352 Sitara™ processor ARM Cortex -A8 core View Design Kits & Evaluation Modules CC2530 Second-generation System-on-Chip solution for 2.4-GHz IEEE 802.15.4 / RF4CE / ZigBee SimpleLink™ solutions View Design Kits & Evaluation Modules WL1835MOD WiLink™ 8 single-band combo 2×2 MIMO Wi-Fi, Bluetooth and Bluetooth Low Energy module Wireless Connectivity View Design Kits & Evaluation Modules DP83848J PHYTER mini LS commercial temperature single-port 10/100 Mb/s Ethernet transceiver Ethernet View Design Kits & Evaluation Modules SN74AVC4T774 4-bit dual-supply bus transceiver with configurable voltage translation and 3-state outputs Voltage level translation SN74LVC04 Hex inverter Buffer/Driver/Transceiver SN74LVC07A Hex buffer/driver with open-drain outputs Buffer/Driver/Transceiver TLV702 300-mA, low IQ, low-dropout regulator for portables Linear regulator (LDO) TLVH431 Low-voltage adjustable precision shunt regulator Voltage reference TPD4S012 4-channel USB ESD solution with power clamp ESD protection diodes View Design Kits & Evaluation Modules TPS2051B Single, current-limited, power-distribution switch USB power and charging port controllers View Design Kits & Evaluation Modules TPS51200 3-A sink/source DDR termination regulator w/ VTTREF buffered reference for DDR2, DDR3, DDR3L and DDR4 Power management View Design Kits & Evaluation Modules TPS650250 Power management IC (PMIC) for Li-ion powered systems Power management View Design Kits & Evaluation Modules View Design Kits & Evaluation Modules To download the full TI Design Reference Design visit: http://www.ti.com/tool/TIEP-SMART-ENERGY-GATEWAY © 2015 Texas Instruments Incorporated Printed in U.S.A. Return to ToC Product Overviews Wireless connectivity product overviews 34 SimpleLink™ Ultra-Low Power Wireless Microcontroller Platform Overview The SimpleLink™ ultra-low power wireless microcontroller (MCU) platform is the broadest, lowest power and easiest to use wireless connectivity offering in the industry for Internet of Things (IoT) connected devices. With the capability to leverage multiple standards, customers have flexibility in design and TI makes it easy by providing tools and software, reference designs, community support and more. What standard fits your design? Key benefits • The lowest power: • Go battery-less with energy harvesting • Use a coin cell battery for multi-year, always-on operation • Integrated ultra-low power sensor controller • Industry’s only multi-standard platform: • Code- and pin-compatibility across Bluetooth Smart, 6LoWPAN, ZigBee, Sub-1 GHz and RF4CE • Easiest to design with: •ARM® Cortex®-M3 based MCU •TI-RTOS • Simplest RF and antenna design • Built-in robust security • Ready-to-use protocol stacks • Tools and reference designs • Bluetooth Smart: Control ultralow power wireless solutions with a smartphone or tablet • 6LoWPAN: Complete solution to the cloud in a wide-area mesh network using open IP standards • Sub-1 GHz: Provides long range and reliable communication at ultra-low power • ZigBee: Standardized stacks, protocols and application profiles for robust, low-power mesh networks • RF4CE: Two-way communication standard designed for ultra-low power input devices such as remote controls Available products • SimpleLink 2.4-GHz multi-standard C2650 wireless MCU: The CC2650 supports multiple 2.4 GHz standards allowing customers to leverage code compatibility across 2.4 GHz standards by downloading the corresponding protocol stack. 35 • SimpleLink Bluetooth Smart CC2640 wireless MCU: The CC2640 is the lowest power Flash-based Bluetooth 4.1 solution with multi-year operation on smaller coin cells. • SimpleLink 6LoWPAN/ZigBee CC2630 wireless MCU: The CC2630 supports large networks connecting 1,000s of nodes in homes, buildings and cities. Take advantage of easy IP and cloud connectivity through 6LowPAN operation where each device has an IPv6 address. • TI is also launching the SimpleLink Sub-1 GHz CC1310 wireless MCU and the SimpleLink ZigBee RF4CE CC2620 wireless MCU in 2015. Getting started To simplify development, TI provides a broad range of tools and software that offer flexibility between technologies. All kits for 2.4-GHz operation are based on the multi-standard CC2650 wireless MCU. The CC2650DK includes two SmartRF06 evaluation boards, two CC2650 evaluation modules and can be customized with the appropriate software stacks for Bluetooth Smart, 6LoWPAN or ZigBee operation. The CC2650STK SimpleLink SensorTag is a rapid prototyping and development tool designed to shorten the design time for CC26xx development from months to hours. Product Overviews The industry’s only multi-standard family with code- and pin-compatibility across: • Bluetooth® low energy (Bluetooth Smart) •6LoWPAN • Sub-1 GHz •ZigBee® •RF4CE™ and •Proprietary modes Application areas Block diagram The SimpleLink ultra-low power wireless MCU platform is designed for use in multiple applications including: SimpleLink™ ULP wireless MCU platform Health and Fitness RF core 2.4 GHz Sub-1GHz cJTAG Main CPU ROM ADC ® ADC Up to 128 KB Flash ARM ® Cortex -M3 Digital PLL Home and Building Automation DSP modem 8 KB cache Radio controller 20 KB SRAM General peripherals / modules Industrial IC 2 4× 32-bit timers UART 2× SSI (SPI, µW, TI) I2S Watchdog timer 10 / 15 / 31 GPIOs TRNG AES Temp. / batt. monitor 32 ch. µDMA RTC 4 KB SRAM ROM Sensor controller Sensor controller engine 12-bit ADC, 200 ks/s 2× Analog comparators 2 SPI / I C digital sensor IF Constant current source Time-to-digital converter 2 KB SRAM DC / DC converter Hardware CC2650DK $299 CC2650EMK $99 CC2650STK $29 Complete 2.4-GHz hardware, software and RF development platform for Bluetooth Smart, ZigBee and 6LoWPAN Two optimized plug-in boards to easily test RF performance with more nodes in a CC2650DK network Low-power development kit for IoT applications Start sensor development in the cloud in three minutes. Expandable with debugger and DevPacks to customized your IoT application. Powered by the CC2650 wireless MCU and 10 low-power sensors The EMK comes in 4×4-mm, 5×5-mm and 7×7-mm options Software SmartRF Studio 7 Sensor Controller Studio PC application that helps designers of radio systems easily evaluate the RF-IC at an early stage in the design process Development environment to implement sensor controller task algorithms and rapid development SmartRF Flash Programmer 2 PC application for programming CC26xx devices CCS Uniflash Flash programmer with Windows® and Linux™ support For more information on the SimpleLink ultra-low power wireless MCU platform, please visit www.ti.com/simplelinkulp The platform bar and SimpleLink are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. © 2015 Texas Instruments Incorporated Printed in U.S.A. 36 SimpleLink Wi-Fi Family ™ ® CC3100 / CC3200 Internet-on-a-chip™ Solutions Save time and resources developing with CC3100 and CC3200 Wi-Fi® CERTIFIED™ chips and modules TI makes connectivity even easier with the next-generation SimpleLink Wi-Fi solutions. The product family features Internet-on-a-chip™, Wi-Fi CERTIFIED™ solutions solving industry challenges for broad embedded applications. With SimpleLink CC3100 and CC3200 pin-topin-compatible solutions you can: • Program applications on the industry’s first Internet-on-a-chip solution with userdedicated MCU • Power Wi-Fi battery-operated designs for more than a year on two AA batteries • Start quickly, no Wi-Fi experience needed CC3100 Wireless Network Processor The CC3100 device is a Wi-Fi, self-contained network processor with on-chip web server and embedded TCP/IP stack that connects VCC Serial Flash 32-KHz XTAL 32 KHz MCU Enable I2S audio, SDMMC, ADC, SPI, UART, I2C, PWM, I/Os, built-in power management and RTC enabling connection to the cloud. CC3200 certified modules, coming soon, provide easier Wi-Fi integration by lowering manufacturing costs, reducing development time and simplifying procurement and certification. The modules have complete antenna reference designs for streamlined integration. CC3200 Wireless MCU Both CC3100 and CC3200 solutions are supported by a software development kit (SDK) including software drivers, sample applications, API guide, user documentation and a world-class support E2E™ community. On the integrated Cortex-M4, all sample applications in the SDK are supported with Code Composer Studio™ Integrated Development Environment and no RTOS. A few of the applications support IAR, GCC, Free RTOS, TI-RTOS. Example applications: The SimpleLink Wi-Fi CC3200 solution capitalizes on the CC3100 benefits and integrates an 80-MHz ARM® Cortex®-M4 MCU and peripherals enabling application development with a Wi-Fi CERTIFIED device or module. Developers can fully access the MCU portion with more than 200kB of application code fully independent from the Wi-Fi processing. The peripheral set includes parallel camera, 40-MHz XTAL CC3100 Network Processor ROM JTAG Fast Parallel SYSTEM SPI or UART UART SPI Timers UART GPIOs IC Oscillators SD/MMC 2 POWER MANAGEMENT 2 I S/PCM DC2DC BAT Monitor ADC Hibernate RTC PWM ® Wi-Fi Network Processor 37 ANALOG easily to any low-cost and low-power microcontroller (MCU) such as the MSP430F5529 or MSP430FR5969, due to a simple UART or SPI driver and host memory footprint as low as 7kB of code to reside on the MCU. Hardware design flexibility includes a 64-pin 9×9 mm QFN package or upcoming certified CC3100 module. Flexible connection methods (provisioning) RAM ARM® Cortex®-M4 80 MHz PERIPHERAL INTERFACES IRQ include Access Point Mode, WPS, SmartConfig™ Technology and others. On the security side, an embedded hardware cryptography engine allows establishing TLS secure Link in 200 ms. Interfacing to any MCU, designed with lowpower radio and advanced low-power modes, the SimpleLink Wi-Fi family makes sensor-to-thecloud connectivity possible. Moreover, the solution contains several Internet protocols in ROM including mDNS, DNS, SSL/TLS and HTTP server. Software and Support • Internet-on-a-chip sample applications • Email from SimpleLink Wi-Fi solution • Information Center – get time and weather from Internet • http server – host a web page on SimpleLink Wi-Fi solution • XMPP – Instant Message chat client • Serial interface • Wi-Fi sample apps • Easy Wi-Fi configuration • Station, AP modes • TCP/UDP • Security – Enterprise/Personal, TLS/SSL • MCU peripheral samples apps Product Overviews Overview Getting started: SimpleLink™ CC3100 and CC3200 hardware development kits Kit name Description When to buy this? SimpleLink Wi-Fi C3200 Internet-on-a-chip wireless microcontroller (MCU) CC3200-LAUNCHXL $29.99 USD • CC3200 Launchpad • Single-chip Internet of Things solution with integrated MCU Want to use Wi-Fi® wireless MCU – single-chip Interneton-a-chip™ SimpleLink Wi-Fi CC3100 Internet-on-a-chip wireless network processor CC3100BOOST-CC31XXEMUBOOSTEXP430F5529LP • CC3100 BoosterPack + Advanced emulation board + MSP430F5529 Launchpad Want to evaluate all CC3100 sample apps, using TI’s ultralow-power MSP430™ MCU family • CC3100 BoosterPack + flashing and advanced debug capability • Compatible LaunchPads (sold separately) Want to use CC3100 with any other MCU. Need one EMUBOOST board for flashing, using radio tool, using SimpleLink Studio (MCU development on PC) or advanced debug • CC3100 BoosterPack If buying additional CC3100BOOST boards – assuming you already have CC31XXEMUBOOST for flashing, radio tool and possible advanced debug • CC3100 BoosterPack + MSP430FR5969 LaunchPad Want to evaluate CC3100 with TI's low power FRAM device MSP430FR5969 $49.99 USD CC3100BOOST-CC31XXEMUBOOST $36.99 USD CC3100BOOST $19.99 USD CC3100BOOST-MSP-EXP430FR5969 $34.00 USD Growing cloud of ecosystem partners The TI IoT cloud ecosystem helps manufacturers using TI technology to easily and rapidly connect more to the IoT. Open to cloud service providers with a differentiated service offering and value-added services running on one of TI’s IoT solutions, the TI cloud ecosystem provides options to meet individual manufacturer needs. www.ti.com/simplelinkwificloud TI Design Library: Wi-Fi and IoT development with SimpleLink Wi-Fi reference designs Jump start system design and speed time to market with our comprehensive Wi-Fi reference designs. Each design includes schematic or block diagram, BOM and design files. Created by experts with deep system and product knowledge, the designs span across TI’s portfolio of analog, embedded processor and connectivity products. • SimpleLink Wi-Fi Antenna Selection enables evaluation and development of end applications requiring antenna diversity • Smart Plug with Remote Disconnect and Wi-Fi Connectivity quickly creates networked load control devices for industrial building and home automation applications • Wi-Fi Audio Streaming Application enables the capture, streaming and playback of audio from a digital microphone or a stereo/mono audio jack to another Wi-Fi-enabled device • SimpleLink Wi-Fi Connectivity in a Smart Electric Meter implements a three-phase energy meter with Wi-Fi connectivity Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard terms and conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no liability for applications assistance, customer’s applications or product designs, software performance, or infringement of patents. The publication of information regarding any other company’s products or services does not constitute TI’s approval, warranty or endorsement thereof. The platform bar, Code Composer Studio, E2E, Internet-on-a-chip, MSP430, SimpleLink and SmartConfig are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. © 2014 Texas Instruments Incorporated Printed in U.S.A. SWRB034B 38 WiLink 8 Wi-Fi + Bluetooth /BLE Modules ™ ® ® Certified high-performance combo modules from TI for fast and easy time-to-market •High-performance Wi-Fi •802.11 a/b/g/n 2.4- and 5-GHz Radio/Baseband/MAC • 20- and 40-MHz channels •2×2 MIMO •Up to 100 Mbps (UDP) of throughput •MRC for 1.4× extended range •Station and access point •Wi-Fi direct, multi-channel multi-role •Personal and enterprise security •Linux™, Android™ and RTOS drivers •Dual-mode Bluetooth •Bluetooth and BLE (BT 4.0 compliant) •On-chip SBC encode and decode •Royalty-free certified TI Bluetooth Stack™ based on Bluetopia® •Wi-Fi/Bluetooth single antenna co-existence • Built-in power management •Direct connection to battery (integrated DC2DC) • Advanced low-power modes • Host interfaces •SDIO for Wi-Fi and UART for BT • Temperature ranges: • 20°C to +70°C •–40°C to +85°C •Small form factor: 13.4 × 13.3 × 2 mm Overview The TI WiLink 8 module family enables manufacturers to easily add fully integrated 2.4- and 5-GHz versions of Wi-Fi and dual-mode Bluetooth 4.0 solutions to embedded applications. The new highly integrated module family offers high throughput and extended industrial temperature range with robust Wi-Fi and Bluetooth coexistence. WiLink 8 modules are perfect for power-optimized designs for home and building automation, smart energy, gateways, wireless audio, enterprise, wearables and many more industrial and Internet of Things (IoT) applications. The WiLink 8 modules and software are compatible and pre-integrated with many processors including TI’s Sitara™ processors. As a module, less hardware and RF design is needed, making development easier and faster. Wi-Fi and Bluetooth software stacks and sample applications are provided, and the modules are FCC/IC/ETSI/ Telec certified. WiLink 8 solutions also provide sample applications, API guide, user documentation and a world-class support community. The modules are pin-to-pin compatible enabling new use cases and better user experiences including: •Extended temperature range of –40°C to 85°C for industrial applications WiLink 8 block diagram 32-KHz XTAL VBAT Antenna 1 Wi-Fi/BT Host processor running ™ ™ Linux , Android or RTOS VIO ® WPA supplicant ® and Wi-Fi driver Bluetooth stack and profiles 32 KHz Enable Wi-Fi SDIO UART driver SDIO driver 39 BT UART WL18XXMOD Antenna 2 Wi-Fi (optional) Product Overviews Key Features and Benefits •5-GHz module for high-performance solutions in a less noisy frequency band (maximal ratio combining) and MIMO (multiple-input and multiple-output) technology •Wi-Fi, Bluetooth and ZigBee® coexistence for Smart energy and home gateways •Low-power applications with low idle connect current consumption •1.4× the range and up to 100 Mbps throughput with WiLink 8 MRC •Audio streaming with both Wi-Fi and dual-mode Bluetooth/Bluetooth low energy Applications • Internet of Things • Industrial and home automation • Home electronics • Home appliances and white goods •Gateways • Wireless audio • Video camera and security •Wearables WiLink™ 8 Wi-Fi®+ Bluetooth®/BLE Modules TI Modules Product Number WL1801MOD WL1805MOD WL1807MOD WL1831MOD WL1835MOD WL1837MOD 2.4 GHz • • • • • • Wi-Fi® 5 GHz • • MIMO Bluetooth v4.0 Bluetooth low energy • • • • Other tools Industrial temperature • • • • • Development Tools Product Number Description Availability WL1835MODCOM8 The 2.4-GHz WL1835-based evaluation board is compatible with the Sitara™ AM335x and AM437x EVMs as well as several other TI EVMs and reference designs TI eStore and authorized distributors WL1835MOD Cape WiLink 8 module-based cape offered by CircuitCo for fast development with BeagleBone Black and BeagleBone open source computer BoardZoo.com and CircuitCo distributors WL1837MODCOM8 The 5-GHz WL1837-based evaluation board is compatible with Sitara AM335x and AM437xEVMs as well as several other TI EVMs and reference designs TI eStore and authorized distributors •TI provides a fully integrated and validated WiLink 8 add-on software for Sitara AM335x Linux™ ezSDK – www.ti.com/wilink8 •TI’s unique SmartConfig™ technology is a one-step Wi-Fi setup process that allows multiple in-home devices to connect to Wi-Fi networks quickly and efficiently – www.ti.com/tool/smartconfig WiLink resources • Learn more: www.ti.com/wilink8 • E2E Forum: www.ti.com/wiconforum • WiLink 8 Wiki: www.ti.com/wilink8wiki Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard terms and conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no liability for applications assistance, customer’s applications or product designs, software performance, or infringement of patents. The publication of information regarding any other company’s products or services does not constitute TI’s approval, warranty or endorsement thereof. The platform bar, Sitara, SmartConfig and WiLink are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. © 2014 Texas Instruments Incorporated Printed in U.S.A. 40 TI Bluetooth CC256x Solutions ® Dual-mode Bluetooth 4.1 controller available in certified modules with integrated audio capabilities Overview •Single-chip Bluetooth solution integrating Bluetooth Basic Rate (BR)/Enhanced Data Rate (EDR)/ Low Energy (LE) features fully compliant with the Bluetooth 4.1 specification up to the HCI layer • BR/EDR features include: • CC2560 provides an assisted mode for HFP1.6 wideband speech (WBS) profile or A2DP profile to reduce host processing and power •LE supports up to 10 CC2564 simultaneous connections •Flexibility for easy stack integration and validation into various microcontrollers, such as MSP430 and ARM Cortex-M4 MCUs • Highly optimized for low-cost designs: • Package footprint: 76 pins, 0.6-mm pitch, 8.10-mm × 8.10-mm mrQFN •Best-in-class Bluetooth (RF) performance (TX power, RX sensitivity, blocking) • Class 1.5 TX power up to +12 dBm • Provides longer range, including 2× range over ther Bluetooth low energy-only solutions •Advanced power management for extended battery life and ease of design • Physical interfaces: • Standard HCI over H4 UART (4 wire) • Standard HCI over H5 UART (2 wire) • Fully programmable digital PCM-I2S codec interface A royalty-free software Bluetooth stack available from TI is pre-integrated with TI’s MSP430™ and ARM® Cortex®-M4 MCUs. The stack is also available for MFi solutions and on other MCUs. Examples of profiles supported today include: serial port profile (SPP), human interface device (HID), A2DP (Advanced Audio Distribution Profile), AVRCP (Audio/Video Remote Control Profile) and several BLE profiles (profiles can vary based on the supported MCU). In addition to software, reference designs are available with a low BOM cost. For example, TI’s Audio Sink solution uses the Bluetooth® device for audio processing, an MSP430™, audio DAC and USB charger. TI’s Audio Source solution is also available. For more information, visit TI Designs. 26-MHz Clock 32-KHz MSP430™ or Other MCU Clock UART CC256x Filter Benefits CC256x block diagram • Best-in-class link budget extends application range • Simplified hardware and software development • Reduced development time and costs •Enables simultaneous operations of Bluetooth with Bluetooth low energy www.ti.com/bluetooth 41 Product Overviews Key Features TI single- and dual-mode CC256x solutions are complete Bluetooth® BR/EDR/LE HCI or Bluetooth + Bluetooth Low Energy solutions that reduce design effort and enable fast time to market. CC256x Products Technology supported Devices/ Modules Description BR/EDR CC2560 Bluetooth® 4.1 (with EDR) • • • CC2564* Bluetooth 4.1 + BLE Bluetooth 4.1 + ANT LE Assisted modes Ant™ HFP 1.6 (WBS) A2DP • • • • • • • • * The device does not support simultaneous operation of LE, ANT or assisted modes. Any of these modes can run simultaneous to Bluetooth BR/EDR. Applications Bluetooth® CC256x Resources • Cable replacement •Smart watches, activity trackers •Mobile device accessories • Industrial control •Audio streaming solutions • Point of sale • Learn more at: www.ti.com/bluetooth • E2E™ Forum: www.ti.com/wiconforum • CC256x Wiki: www.ti.com/cc2564wiki Development Tools and Software Product Number Description Availability CC256x modules from TI TI-certified modules based on the CC2564 devices Available through TI and TI authorized distributors CC2564MODEM CC2564 Module Evaluation board Intended for evaluation purposes of the CC2564 module. Works with processor platforms such as TI’s ultra-low-power MSP430 and the performance TM4C ARM® Cortex®-MF microcontrollers. TI Store and authorized distributors Bluetooth and MSP430™ Audio Sink Reference Design Enables Bluetooth audio (SBC encode/decode) with CC2560 and the ultra-low power MSP430F5229 and digital input speaker amplifier (TAS2505) and USB charge management device (BQ24055). Reference design is a cost-effective audio implementation, with full design files provided for application and end product development. Software supported includes TI Bluetooth stack (certified and royalty free) based on Bluetopia. Download at TI Designs Boards are orderable through TI Store Bluetooth and MSP430 Audio Source Reference Design Enables Bluetooth audio (SBC encode/decode) with CC2560 and the ultra-low power Download at TI Designs MSP430F5229 and digital DAC plus USB charge management device (BQ24055). Reference design is a cost-effective audio implementation, with full design files provided for applicaBoards are orderable through tion and end product development. Software supported includes TI Bluetooth stack (certified TI Store and royalty free) based on Bluetopia. CC256x BoosterPack Bluetooth BoosterPack evaluation kit has flexibility to work with ultra-low power microcontrollers such as the TI MSP430 and TM4C Series LaunchPad evaluation kits Coming soon: Boards will be orderable through TI Store CC256xQFNEM CC256x Bluetooth® / dual-mode QFN device evaluation module TI Store and authorized distributors The platform bar, E2E and MSP430 are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. © 2015 Texas Instruments Incorporated 42 Product Folder Sample & Buy Technical Documents Tools & Software Support & Community CC2540T SWRS172 – JULY 2014 SimpleLink™ CC2540T 2.4-GHz Bluetooth® Low Energy Wireless MCU 1 Device Overview 1 Features • True Single-Chip BLE Solution: CC2540T Can Run Both Application and BLE Protocol Stack, Includes Peripherals to Interface with Wide Range of Sensors, and so forth. • Operating Temperature up to 125°C • 6-mm × 6-mm Package • RF – Bluetooth Low Energy Technology Compatible – Excellent Link Budget (up to 97 dB), Enabling Long-Range Applications Without External Front End – Accurate Digital Received Signal-Strength Indicator (RSSI) – Suitable for Systems Targeting Compliance with Worldwide Radio Frequency Regulations: ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan) • Layout – Few External Components – Reference Design Provided – 6-mm × 6-mm QFN40 Package • Low Power – Active Mode RX Down to 19.6 mA – Active Mode TX (–6 dBm): 24 mA – Power Mode 1 (3-μs Wake-Up): 235 μA – Power Mode 2 (Sleep Timer On): 0.9 μA – Power Mode 3 (External Interrupts): 0.4 μA – Wide Supply Voltage Range (2 V–3.6 V) – Full RAM and Register Retention in All Power Modes • TPS62730 Compatible Low Power in Active Mode – RX Down to 15.8 mA (3-V Supply) – TX (–6 dBm): 18.6 mA (3-V Supply) • Microcontroller – High-Performance and Low-Power 8051 Microcontroller Core – 256-KB In-System-Programmable Flash – 8-KB SRAM • Peripherals – 12-Bit ADC with Eight Channels and Configurable Resolution – Integrated Ultralow-Power Comparator – General-Purpose Timers (One 16-Bit, Two 8-Bit) – 21 General-Purpose I/O (GPIO) Pins (19×4 mA, 2×20 mA) – 32-kHz Sleep Timer with Capture – Two Powerful USARTs with Support for Several Serial Protocols – Full-Speed USB Interface – IR Generation Circuitry – Powerful Five-Channel DMA – AES Security Coprocessor – Battery Monitor and Temperature Sensor – Each CC2540T Contains a Unique 48-Bit IEEE Address • Bluetooth v4.0 Compliant Protocol Stack for Single-Mode BLE Solution – Complete Power-Optimized Stack, Including Controller and Host • GAP – Central, Peripheral, Observer, or Broadcaster (Including Combination Roles) • ATT / GATT – Client and Server • SMP – AES-128 Encryption and Decryption • L2CAP – Sample Applications and Profiles • Generic Applications for GAP Central and Peripheral Roles • Proximity, Accelerometer, Simple Keys, and Battery GATT Services – Multiple Configuration Options • Single-Chip Configuration, Allowing Application to Run on CC2540T • Network Processor Interface for Applications Running on an External Microcontroller – BTool – Windows PC Application for Evaluation, Development, and Test • Development Tools – CC2540T Mini Development Kit – SmartRF™ Software – Supported by IAR Embedded Workbench™ Software for 8051 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. 43 Product Overviews 1.1 CC2540T www.ti.com SWRS172 – JULY 2014 1.2 • • • • • Applications 2.4-GHz Bluetooth Low Energy Systems Lighting Motor Monitoring Proximity Sensing Cable Replacement 1.3 • • • • • Power Tools Maintenance Wireless HMI and Remote Display USB Dongles Smart Phone Connectivity Description The CC2540T is a cost-effective, low-power, true wireless MCU for Bluetooth low energy applications. It enables robust BLE master or slave nodes to be built with very low total bill-of-material costs, and can operate up to 125°C. The CC2540T combines an excellent RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful supporting features and peripherals. The CC2540T is suitable for systems where very low power consumption is required. Very low-power sleep modes are available. Short transition times between operating modes further enable low power consumption. Combined with the Bluetooth low energy protocol stack from Texas Instruments, the CC2540TF256 forms the market’s most flexible and cost-effective single-mode Bluetooth low energy solution. Table 1-1. Device Information (1) PART NUMBER PACKAGE BODY SIZE CC2540TF256RHAR RHA (40) 6.00 mm × 6.00 mm CC2540TF256RHAT RHA (40) 6.00 mm × 6.00 mm (1) 2 For more information, see Section 8, Mechanical Packaging and Orderable Information. Device Overview Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2540T 44 CC2540T www.ti.com 1.4 SWRS172 – JULY 2014 Functional Block Diagram Figure 1-1 shows the functional block diagram of the device. XOSC_Q2 32-MHz CRYSTAL OSC XOSC_Q1 P2_4 32.768-kHz CRYSTAL OSC P2_3 P2_2 HIGHSPEED RC-OSC DEBUG INTERFACE P2_1 DCOUPL POWER-ON RESET BROWN OUT CLOCK MUX and CALIBRATION SFR Bus RESET VDD (2 V–3.6 V) ON-CHIP VOLTAGE REGULATOR WATCHDOG TIMER RESET_N SLEEP TIMER 32-kHz RC-OSC POWER MANAGEMENT CONTROLLER P2_0 PDATA P1_7 P1_6 XRAM 8051 CPU CORE P1_5 IRAM P1_4 MEMORY ARBITRATOR SFR FLASH FLASH P1_3 P1_2 DMA P1_1 UNIFIED P1_0 IRQ CTRL FLASH CTRL P0_7 P0_6 ANALOG COMPARATOR P0_5 FIFOCTRL 1 KB SRAM Radio Arbiter P0_4 OP-AMP P0_2 AES ENCRYPTION AND DECRYPTION ADC AUDIO/DC RADIO REGISTERS Link Layer Engine SFR Bus DEMODULATOR MODULATOR Product Overviews P0_0 I/O CONTROLLER P0_1 SYNTH P0_3 USB_N USB_P USB RECEIVE USART 1 FREQUENCY SYNTHESIZER USART 0 TRANSMIT TIMER 1 (16-Bit) TIMER 2 (BLE LL TIMER) RF_P RF_N TIMER 3 (8-Bit) DIGITAL ANALOG TIMER 4 (8-Bit) MIXED B0301-05 Figure 1-1. Functional Block Diagram SWRY016 Device Overview Copyright © 2014, Texas Instruments Incorporated 3 Submit Documentation Feedback Product Folder Links: CC2540T 45 Return to ToC IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. 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With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. 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