TI Dual-mode Bluetooth Stack on STM32F4 MCUs User Guide

TI Dual-mode Bluetooth Stack on STM32F4 MCUs User Guide

Dual-Mode Bluetooth

®

on STM32F4 MCUs

Stack

User's Guide

Literature Number: SWRU428

September 2015

Contents

1

2

3

4

5

6

7

Features

..............................................................................................................................

4

Bluetooth Profiles

..................................................................................................................

5

Sample Application Overview

................................................................................................

6

CC256XSTBTBLESW Hardware and Software Requirements

.....................................................

7

Setting Up the Hardware

.......................................................................................................

8

Setting Up the Software

......................................................................................................

10

Building and Flashing the Bluetooth Code (STM3240G-EVAL)

7.1

..................................................

10

Flashing the Bluetooth Code

..........................................................................................

15

8 Applications

......................................................................................................................

18

9

Classic Bluetooth Sample Applications

.................................................................................

19

10

Classic Bluetooth + Bluetooth low energy Applications

.............................................................

20

11

Bluetooth low energy Applications

........................................................................................

20

Revision History

..........................................................................................................................

22

2

Table of Contents

Copyright © 2015, Texas Instruments Incorporated

SWRU428 – September 2015

Submit Documentation Feedback

www.ti.com

6

7

8

9

10

1

2

3

4

5

14

15

16

17

11

12

13

List of Figures

Overview of Demonstration

.................................................................................................

6

Hardware Combination

......................................................................................................

7

STM32 General Setup

......................................................................................................

8

STM3240G-EVAL, CC256X-STADAPT, and QFNEM Combination

..................................................

9

STM32F4DISCOVERY, CC256X-STADAPT, and QFNEM Combination

............................................

9

IAR Drop-down Menu

......................................................................................................

11

Download and Debug

......................................................................................................

11

Debugging Screen

.........................................................................................................

12

The GO Button

..............................................................................................................

12

Debug Dropdown Menu

...................................................................................................

13

Building Target

..............................................................................................................

13

Build Output

.................................................................................................................

14

Debug Mode

................................................................................................................

14

Release and Debug Mode

................................................................................................

15

Program and Verify

Start Download

........................................................................................................

16

.............................................................................................................

17

Verification...OK

............................................................................................................

17

Cortex, KEIL, µVision are registered trademarks of ARM Limited.

ARM is a registered trademark of Arm Limited.

Bluetooth is a registered trademark of Bluetooth SIG.

SWRU428 – September 2015

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

List of Figures

3

User's Guide

SWRU428 – September 2015

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

1

TI’s dual-mode Bluetooth

®

stack on STM32F4 MCUs (CC256XSTBTBLESW) software for Bluetooth +

Bluetooth low energy enables the STM32 ARM

®

Cortex

®

-M4 processor and includes single mode and dual mode, while implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID

69887 and QDID 69886) and provides simple command-line applications to help speed development and can be MFI capable.

For a complete evaluation solution, the CC256XSTBTBLESW works directly with the STM3240G-EVAL hardware development kit.

The stack for the STM32 MCU is certified and royalty-free

(CC256XSTBTBLESW).

The software works with all CC256x EM boards (CC256XQFNEM, CC2564MODNEM, and

CC2564MODAEM) to provide a complete Bluetooth BR/EDR/LE HCI solution, reducing design effort and enabling a faster time to market. The CC256x EM boards include TI's seventh-generation Bluetooth core and provide a product-proven, Bluetooth 4.1-compliant solution. The devices provide best-in-class RF performance with a transmit power and receive RX sensitivity that provide approximately two times the range of other BLE-only solutions. TI’s power-management hardware and software algorithms help save a significant amount of power in common Bluetooth BR/EDR/LE modes of operation.

Features

• Supports dual-mode Bluetooth 4.0 – Bluetooth certified and royalty free

• Offers a fully-qualified Bluetooth Stack (QDID 69887 and QDID 69886)

• Offers thread-safe operation

• Supports both threaded (RTOS) and non-threaded (No OS) environments (sample applications use

FreeRTOS)

• Offers a fully-documented API interface

• Works with any STM32F4 MCU

• Offers sample applications for the STM3240G-EVAL MCU Development Kit supported by CC256XEM-

STADAPT

• Offers the capability to disable or enable protocols and profiles

• Supports KEIL

® and IAR IDEs

4

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

SWRU428 – September 2015

Submit Documentation Feedback

www.ti.com

2

Bluetooth Profiles

Classic Profiles:

• Advanced Audio Distribution Profile (A2DP): A3DP implementation

• Audio/Video Remote Control Profile (AVRCP)

• Generic Access Profile (GAP)

• Generic Audio and Video Distribution Profile (GAVDP)

• Headset Profile (HSP)

• Hands-Free Profile (HFP)

• Human Interface Device Profile (HID)

• Message Access Profile (MAP)

• Phonebook Access Profile (PBAP)

• Serial Port Profile (SPP)

Low Energy Profiles:

• Alert Notification Service (ANS)

• Alert Notification Profile (ANP)

• Battery Service (BAS)

• Device Information Service (DIS)

• Find Me Profile (FMP)

• Generic Access Profile Service (GAPS)

• Generic Attribute Profile (GATT)

• Health Thermometer Service (HTS)

• Health Thermometer Profile (HTP)

• Heart Rate Service (HRS)

• Heart Rate Profile (HRP)

• Human Interface Device Service (HIDS)

• HID over GATT Profile (HOGP)

• Immediate Alert Service (IAS)

• Link Loss Service (LLS)

• Phone Alert State Service (PASS)

• Phone Alert State Profile (PASP)

• Proximity Profile (PXP)

• TX Power Service (TPS)

Bluetooth Profiles

SWRU428 – September 2015

Submit Documentation Feedback

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

5

Sample Application Overview

3 Sample Application Overview

www.ti.com

This demonstration lets you to evaluate TI's CC256x Bluetooth device with the STM3240G-EVAL platform.

The CC256x+ STM3240G-EVAL Bluetooth applications offer a rich out-of-box experience. These applications let you use a console to send Bluetooth commands, set up a Bluetooth device to accept connections, connect to a remote Bluetooth device, and communicate through Bluetooth. This demonstration includes one sample application for each profile with simple command-line sample applications to speed development. See

Figure 1

for an overview of the demonstration.

Figure 1. Overview of Demonstration

6

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

SWRU428 – September 2015

Submit Documentation Feedback

www.ti.com

4

CC256XSTBTBLESW Hardware and Software Requirements

CC256XSTBTBLESW Hardware and Software Requirements

A complete evaluation requires the following hardware and software tools from the following list:

Hardware

• One dual-mode Bluetooth CC2564 evaluation board

– CC256XQFNEM or CC2564MODNEM or CC2564MODAEM

• One CC256xEM Bluetooth adapter kit

– CC256XEM-STADAPT

• One STM32 experimenter board

– A STM3240G-EVAL board or STM32F4DISCOVERY board

Software

• Dual-mode Bluetooth stack

– On STM32F4 MCUs: CC256XSTBTBLESW

• IDE versions

– IAR 7.2 or 7.3 for ARM or KEIL µVision

®

4.70.0.0

or STSW-LINK004 (optional)

Figure 2

shows the hardware combination.

Figure 2. Hardware Combination

SWRU428 – September 2015

Submit Documentation Feedback

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

7

Setting Up the Hardware

5 Setting Up the Hardware

www.ti.com

Using TI’s dual-mode Bluetooth CC256x solution (CC256XQFNEM or CC2564MODNEM), the STM32

MCU evaluation board (STM3240G-EVAL or STM32F4DISCOVERY), with the support of the CC256xEM

Bluetooth adapter kit (CC256XEM-STADAPT), developers canevaluate both classic and Bluetooth low energy capabilities with the TI Dual-Mode Bluetooth stack on STM32F4 MCUs.

To set up the hardware, perform the following steps:

1. Fit the jumpers onto the adaptor board. (Ensure the jumpers are set to the correct position. For more information on the jumper positions and connections to the specific STM32 boards, see the CC256xEM

Bluetooth Adapter Kit User's Guide [ SWRU417 ] and the CC256xEM Bluetooth Adapter Kit Quick Start

Guide [ SWRU416 ].)

2. Fit the adaptor board on top of the STM32 board. (See

Figure 4

for an example using the STM3240G-

EVAL board. See

Figure 5

for an example using the STM32F4DISCOVERY board.)

3. Install the CC256X module board on the adaptor board.

Figure 3

shows the setup for the STM32 board.

Figure 3. STM32 General Setup

8

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

SWRU428 – September 2015

Submit Documentation Feedback

www.ti.com

Setting Up the Hardware

Figure 4

shows an example of the STM3240G-EVAL, the CC256X-STADAPT, and QFNEM boards combined.

Figure 4. STM3240G-EVAL, CC256X-STADAPT, and QFNEM Combination

Figure 5

shows an example of the STM32F4DISCOVERY, the CC256X-STADAPT, and QFNEM boards combined.

Figure 5. STM32F4DISCOVERY, CC256X-STADAPT, and QFNEM Combination

SWRU428 – September 2015

Submit Documentation Feedback

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

9

Setting Up the Software

6 Setting Up the Software

Do the following to set up the software for the demonstration:

1. Navigate to Bluetooth SDK .

NOTE:

When you try to download the SDK, you will be prompted for a TI login. If you do not have a

TI login, you must create one.

2. Create a TI login (if necessary).

3. Complete and submit the export approval form.

NOTE:

Wait for TI to approve the request. After approving the request, TI provides you with a link to download the software.

4. Click Download to download the software.

NOTE:

TI intends the Bluetooth SDK for use only with the STM3240G-EVAL board. Software modifications are required for the SDK to work with the STM32F4DISCOVERY board.

5. Run CC256XSTMNoOSBTBLESW-v4.0.2.1-Setup.exe after the download completes.

6. Accept the TI Bluetooth Stack Clickwrap License Agreement.

www.ti.com

7

NOTE:

After accepting the license agreement, the SDK installs to C:\TI\Connectivity\CC256X

BT\CC256xSTM32BluetopiaSDK\v4.0.2.1\.

7. Access the SDK through

Start/Programs/TexasInstruments/CC256XBT/CC256xSTM32BluetopiaSDKv4.0.2.1.

Building and Flashing the Bluetooth Code (STM3240G-EVAL)

Sample applications for FreeRTOS and NoOS are available for IAR and KEIL.

Perform the following instructions to set up applications on each IDE version.

IAR

1. Navigate to C:\TI\Connectivity\CC256XBT\CC256xSTM32BluetopiaSDK\v4.0.2.1 to open the workspace.

2. Select one of the following samples:

• For NoOS, navigate to \NoOS\STM3240G-EVAL\Samples\ for a list of samples.

• For FreeRTOS, navigate to \FreeRTOS\STM3240G-EVAL\Samples\ for a list of samples.

3. Select the demonstration to load onto the device. (This example uses SPPDemo.)

4. Navigate to NoOS.

5. Navigate to EWARM.

6. Select SPPDemo.eww.

NOTE:

The IAR IDE opens.

10

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

SWRU428 – September 2015

Submit Documentation Feedback

www.ti.com

Building and Flashing the Bluetooth Code (STM3240G-EVAL)

7.

Select Debug. (See

Figure 6

.) or Release Configuration from the drop-down menu. (For this example, select Debug.)

Figure 6. IAR Drop-down Menu

8. Select Download and Debug from the Project drop-down menu or click the Play icon. (See

Figure 7

.)

Figure 7. Download and Debug

NOTE:

The IDE debugs and loads the software onto the device. This may take 5 to 10 minutes.

SWRU428 – September 2015

Submit Documentation Feedback

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

11

Building and Flashing the Bluetooth Code (STM3240G-EVAL)

9.

Click the red X in the IDE to stop debugging. (See

Figure 8 .)

www.ti.com

Figure 8. Debugging Screen

10. Disconnect the STM3240G-EVAL.

11. Reconnect the STM3240G-EVAL.

12. Press Reset on the STM3240G-EVAL device.

13. Press the GO button in the IAR.

12

Figure 9. The GO Button

KEIL

1. Navigate to C:\TI\Connectivity\CC256XBT\CC256xSTM32BluetopiaSDK\v4.0.2.1 to open the workspace.

2. Select one of the following samples:

• For NoOS, navigate to \NoOS\STM3240G-EVAL\Samples\ for a list of samples.

• For FreeRTOS, navigate to \FreeRTOS\STM3240G-EVAL\Samples\ for a list of samples.

3. Select the demonstration to load onto the device. (This example uses SPPDemo.)

4. Navigate to NoOS.

NOTE:

For RTOS, navigate to FreeRTOS.

5. Navigate to RVMDK in the list.

6. Click SPPDemo.uvproj.

NOTE:

Keil µVision4 opens.

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

SWRU428 – September 2015

Submit Documentation Feedback

www.ti.com

Building and Flashing the Bluetooth Code (STM3240G-EVAL)

7.

Select Debug or Release Configuration from the drop-down menu. (For this example, select Debug

[See

Figure 10 ].)

Figure 10. Debug Dropdown Menu

8. Right-click SPPDemo_Debug in the project sidebar.

9. Select Build target to build the code. (See

Figure 11 .)

NOTE:

Figure 12

shows the output when built correctly.

Figure 11. Building Target

NOTE:

After a few minutes, the build process finishes and builds an .axf file. Each time you change the configuration, you must build a new .axf file.

SWRU428 – September 2015

Submit Documentation Feedback

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

13

Building and Flashing the Bluetooth Code (STM3240G-EVAL)

www.ti.com

Figure 12. Build Output

10. Choose Debug mode or Release and Debug modes.

• For Debug mode only:

(a) Select Start/Stop Debug Session to start loading the profile on the STM32 device and to work in Debug mode. (See

Figure 13

.)

Figure 13. Debug Mode

NOTE:

The loading process completes in a few minutes.

(b) Stop the debugging session from the Debug drop-down menu.

NOTE:

The profile loads on the STM3240G-EVAL board.

(c) Unplug the device.

(d) Plug the device in again to start working with it.

14

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

SWRU428 – September 2015

Submit Documentation Feedback

www.ti.com

Building and Flashing the Bluetooth Code (STM3240G-EVAL)

• For Release and Debug modes:

(a) Click LOAD to start loading the profile on the STM32 device. (See

Figure 14 .)

NOTE:

It should complete in a few minutes.

The profile loads on the STM3240G-EVAL board.

(b) Unplug the device.

(c) Plug the device in again to start working with it.

Figure 14. Release and Debug Mode

7.1

Flashing the Bluetooth Code

STSW-LINK004

You can use the STSW-LINK004 utility to flash the software when you have created the binary file through

IAR or KEIL.

To flash the software, do the following:

1. Open the file from the File drop-down menu.

2. Select the demonstration to load on the device. (This example uses SPPDemo.)

• For NoOS, navigate to

C:\TI\Connectivity\CC256XBT\CC256xSTM32BluetopiaSDK\v4.0.2.1\NoOS\STM3240G-

EVAL\Samples\SPPDemo\NoOS\EWARM\Debug\Exe.

• For FreeRTOS, navigate to

C:\TI\Connectivity\CC256XBT\CC256xSTM32BluetopiaSDK\v4.0.2.1\FreeRTOS\STM3240G-

EVAL\Samples\SPPDemo\FreeRTOS\EWARM\Debug\Exe.

3. Select a bin file. (This example uses SPPDemo.bin.)

SWRU428 – September 2015

Submit Documentation Feedback

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

15

Building and Flashing the Bluetooth Code (STM3240G-EVAL)

4.

Click Program & Verify... from the Target drop-down menu. (See

Figure 15 .)

www.ti.com

Figure 15. Program and Verify

NOTE:

The information for your device shows.

5. Ensure the values in Device Information changed to your device information.

16

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

SWRU428 – September 2015

Submit Documentation Feedback

www.ti.com

6.

Press Start. (See

Figure 16 .)

Building and Flashing the Bluetooth Code (STM3240G-EVAL)

Figure 16. Start Download

NOTE:

The command window displays Verification...OK. (See

Figure 17 .)

Figure 17. Verification...OK

SWRU428 – September 2015

Submit Documentation Feedback

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

17

Applications

8 Applications

www.ti.com

The dual-mode Bluetooth stack on STM32F4 MCUs includes a sample application directory for NoOS and

FreeRTOS with source code that demonstrates TI’s dual-mode Bluetooth stack. These simple, commandline sample applications display a list of available commands.

Table 1

lists the available profiles for

Bluetooth SDK.

Profile

A3DP Demo_SNK

A3DP Demo_SRC

ANP demo

AUD demo

FMP demo

HFP demo

HFPAG demo

HID demo

HOGP demo

HRP demo

HSP demo

HTP demo iBEACON demo

MAP demo

PASP demo

PBAP demo

PXP demo

SPP demo

SPPLE demo

Table 1. Table of Available Profiles for Bluetooth SDK

Server

Client

Server

Client

Server

Client

Server

Client

Monitor

Reporter

Device A

Device B

Server

Client

Role

Sink

Controller

Source

Target

Server

Client

Source

Sink

Target

Locator

Audio gateway

Hands-free unit

Audio gateway

Hands-free unit

Host

Device

Host

Device

Collector

Sensor

Audio gateway

Headset

Collector

Thermometer

FreeRTOS

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

NoOS

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

IAR

KEIL

EM Platform

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

STM3240G-EVAL

18

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

SWRU428 – September 2015

Submit Documentation Feedback

www.ti.com

9

Classic Bluetooth Sample Applications

Classic Bluetooth Sample Applications

AUD Demo

• Lets you use the advanced audio distribution profile (A2DP) to stream high-quality audio over

Bluetooth.

• Supports the sink role only.

• Visit the AUD demonstration application wiki for instructions for this demonstration.

A3DP Sink Demo

• Lets you use the assisted advanced audio distribution profile (A3DP) to send stereo audio over

Bluetooth.

• Visit the A3DP demonstration sink wiki for instructions for this demonstration for the sink role.

A3DP Source Demo

• Lets you use the assisted advanced audio distribution profile (A3DP) to send stereo audio over

Bluetooth.

• Visit the A3DP demonstration source wiki for a instructions for this demonstration for the source role.

HFP Demo

• Lets you use hands-free profile (HFP) to provide remote control and voice connections over Bluetooth to a mobile device.

• Supports the hands-free role.

• Visit the HFP demonstration wiki for instructions for this demonstration.

HFPAG Demo

• Lets you use the hands-free profile on an embedded device.

• Connects a headset or speaker phone with a mobile device to provide remote control and voice connections.

• Supports the hands-free and audio-gateway roles.

• Provides two applications that demonstrate the audio-gateway and hands-free roles of the profile, respectively.

• Offers audio routing to the STM3240G-EVAL board DAC for the hands-free application and audiogateway role application.

• Visit the HFPAG demonstration application wiki for instrucitons for this demonstration.

HID Demo

• Offers a demonstration of the human-interface device (HID) profile that enables a host to connect and control a HID device.

• Visit the HID demonstration wiki for instructions for this demonstration.

HSP Demo

• Lets you demonstrate the headset profile (HSP) on an embedded device.

• Connects a headset or speaker phone with a mobile device.

• Connects an audio gateway with a headset device to provide basic control and voice connections.

• Visit the HSP demonstration wiki for instructions for this demonstration.

MAP Demo

• Lets you exchange message objects over Bluetooth.

• Visit the MAP demonstration application wiki for instructions for this demonstration.

PBAP Demo

• Lets you exchange phone book objects over Bluetooth.

• Visit the PBAP demonstration application wiki .

SWRU428 – September 2015

Submit Documentation Feedback

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

19

Classic Bluetooth + Bluetooth low energy Applications

SPP Demo

• Shows how to use the serial port profile (SPP) module.

• Shows how to handle the different callback events.

• Lets you interface with a remote SPP client or server.)

• Visit the SPP demonstration application wiki for instructions for this demonstration.

www.ti.com

10

Classic Bluetooth + Bluetooth low energy Applications

SPP + SPPLE Demo

• Shows how to use Low Energy (LE) and the GATT profile.

• Emulates using SPP over LE using the GATT profile.

• Acts as a LE Master and LE Slave.

• Shows how to use the SPP module.

• Shows how to handle the different SPP callback events.

• Acts as either a SPP server or SPP client

• Uses the same command for SPP as the SPP demonstration.

• Visit the SPP + SPPLE demonstration wiki for instructions for this demonstration.

11

Bluetooth low energy Applications

ANP Demo

• Shows how to use low energy (LE) and the GATT profile.

• Implements the alert notification profile (ANP) using the GATT profile.

• Acts as an LE master and LE slave.

• Visit the ANP demonstration wiki for instructions for this demonstration.

iBEACON Demo

• Provides location-based information and services for iOS devices.

• Has server and client roles.

• Allows the user to use a console to use Bluetooth Low Energy (BLE) to advertise specific data that can be read by the client..

HRP Demo

• Shows how to use low energy (LE) and the GATT profile.

• Implements the heart rate profile (HRP) using the GATT profile.

• Acts as an LE Master and LE Slave.

• Visit the HRP demonstration wiki for instructions for this demonstration.

HTP Demo

• Shows how to use low energy (LE) and the GATT profile.

• Implements the health thermometer profile (HTP) using the GATT profile.

• Acts as an LE master and LE slave.

• Visit the HTP demonstration wiki for instructions for this demonstration.

PASP Demo

• Shows how to use low energy (LE) and the GATT profile.

• Implements the phone alert status profile (PASP) using the GATT profile.

• Acts as an LE master and LE slave.

• Visit the PASP demonstration wiki for instructions for this demonstration.

20

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

SWRU428 – September 2015

Submit Documentation Feedback

www.ti.com

HOGP Demo

• Shows how to use low energy (LE) and the GATT profile.

• Implements the human interface device (HID) using the GATT profile.

• Visit the HOGP demonstration wiki for instructions for this demonstration.

PXP Demo

• Shows how to use low energy (LE) and the GATT profile.

• Implements the proximity profile (PXP) using the GATT profile.

• Visit the PXP demonstration wiki for instructions for this demonstration.

FMP Demo

• Shows how to use low energy (LE) and the GATT profile.

• Implements the find me profile (FMP) using the GATT profile.

• Acts as an LE master and slave.

• Visit the FMP demonstration wiki for instructions for this demonstration.

Bluetooth low energy Applications

SWRU428 – September 2015

Submit Documentation Feedback

Dual-Mode Bluetooth

®

Stack on STM32F4 MCUs

Copyright © 2015, Texas Instruments Incorporated

21

Revision History

Revision History

www.ti.com

22

Revision History

Copyright © 2015, Texas Instruments Incorporated

SWRU428 – September 2015

Submit Documentation Feedback

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Audio

Amplifiers

Data Converters

DLP® Products

DSP

Clocks and Timers

Interface

Logic

Power Mgmt

Microcontrollers

RFID

OMAP Applications Processors

Wireless Connectivity www.ti.com/audio amplifier.ti.com

dataconverter.ti.com

www.dlp.com

dsp.ti.com

www.ti.com/clocks interface.ti.com

logic.ti.com

power.ti.com

microcontroller.ti.com

Applications

Automotive and Transportation

Communications and Telecom

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

Medical

Security

Space, Avionics and Defense

Video and Imaging www.ti-rfid.com

www.ti.com/omap

TI E2E Community

www.ti.com/wirelessconnectivity www.ti.com/automotive www.ti.com/communications www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security www.ti.com/space-avionics-defense www.ti.com/video e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2015, Texas Instruments Incorporated

Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement