Wireless Connectivity
Wireless Connectivity
RF ICs and proprietary protocols for the
Sub-1 GHz and 2.4 GHz frequency bands,
ANT™, Bluetooth®, Bluetooth low energy,
RFID/NFC, PurePath™ Wireless audio,
ZigBee® PRO, IEEE 802.15.4, ZigBee RF4CE,
6LoWPAN, Wi-Fi®, GPS
www.ti.com/wirelessconnectivity
1Q 2014
Wireless Connectivity Guide
Ô Table of Contents
With the industry’s broadest wireless connectivity portfolio, TI offers cost-effective, low-power solutions for short-range, longrange, mesh and IP networks, as well as personal area networks and more in the Internet of Things. TI SimpleLink™ solutions
leverage more than a decade of wireless expertise and are designed to enable easier and faster development of RF applications.
The SimpleLink portfolio supports technololgies: Wi-Fi®, Bluetooth®, Bluetooth low energy, ANT™, ZigBee® PRO, IEEE 802.15.4,
ZigBee RF4CE, NFC/RFID, 6LoWPAN and PurePath™ Wireless audio, GPS as well as a selection of RF ICs and proprietary
protocols for the Sub-1 GHz and 2.4 GHz frequency bands. TI provides an ecosystem of support such as development tools,
technical documentation, reference designs, application samples, customer support and services from the Texas Instruments
Design Network and university programs.
Wireless Connectivity and IoT Application Areas
Positioning
Introduction........................................................................................ 3
GPS
CC4000-TC6000GN ........................................................................ 29
Mesh & IP Networks
Proprietary RF
Wi-Fi®/ IEEE 802.11
Wi-Fi® Overview................................................................................. 4
CC3000.............................................................................................. 5
WiLink™ 8 Module Solutions ............................................................ 6
Sub-1 GHz
CC430 Integrated MSP430 and CC1101 System-on-Chip............. 30
CC1100E Transceiver....................................................................... 31
CC1101 Transceiver......................................................................... 32
CC1101-Q1 Automotive-Qualified Transceiver................................ 33
CC1110 System-on-Chip................................................................. 34
CC1111 System-on-Chip with Integrated USB Controller............... 35
CC1131-Q1 Automotive-Qualified Receiver ................................... 36
CC1150 Transmitter......................................................................... 37
CC1151-Q1 Automotive-Qualified Transmitter ............................... 38
CC1190 RF Front End...................................................................... 39
CC1120, CC1121, CC1125, CC1175, CC1200 Transceivers.......... 40
CC110L Value Line Transceiver........................................................ 42
ZigBee®/IEEE 802.15.4
ZigBee Overview................................................................................ 7
ZigBee Light Link............................................................................... 8
CC2538 System-on-Chip................................................................... 9
CC2520 Transceiver......................................................................... 10
CC2530 System-on-Chip................................................................. 11
CC2531 System-on-Chip with Integrated USB Controller............... 12
Z-Stack™ – ZigBee Protocol Stack................................................. 13
6LoWPAN
6LoWPAN Overview......................................................................... 14
CC1180............................................................................................ 15
2.4 GHz
CC2544 ........................................................................................... 43
CC2590, CC2591 RF Front End....................................................... 44
Personal Area Networks
RFID/NFC
Bluetooth® technology
Bluetooth® Overview........................................................................ 16
CC256x............................................................................................ 17
TMS37157 ....................................................................................... 45
TMS3705.......................................................................................... 46
TRF796x, Reader/Writer Transceiver ICs......................................... 47
TRF7970A Transceiver .................................................................... 48
Bluetooth® Low Energy
Bluetooth Low Energy Overview...................................................... 19
CC2540 System-on-Chip................................................................. 20
CC2541 System-on-Chip................................................................. 21
BLEStack – Bluetooth Low Energy Protocol Stack and Tools......... 22
Embedded Processors for Wireless Connectivity
Embedded Processors Overview..................................................... 49
MSP430™ Microcontrollers....................................................... 50–52
Sitara™ Processors.......................................................................... 53
ANT™
ANT™ Overview............................................................................... 23
CC2570/CC2571 Network Processor.............................................. 24
Resources
Development Tools..................................................................... 54–56
Development Tools Frequenty Asked Questions............................. 57
Software Overview..................................................................... 58–59
Texas Instruments Design Network (TIDN)....................................... 60
E2E™ Online Community................................................................. 61
TI Connectivity Wiki.......................................................................... 62
TI Worldwide Technical Support....................................................... 63
ZigBee® RF4CE
ZigBee® RF4CE Overview................................................................ 25
CC2533 System-on-Chip................................................................. 26
PurePath™ Wireless Audio
PurePath™ Wireless Audio Overview.............................................. 27
CC8520 System-on-Chip................................................................. 28
Wireless Connectivity Guide
2
Texas Instruments 1Q 2014
Wireless Connectivity and IoT Application Areas
Ô Introduction
The right wireless
connectivity solution
•
•
•
•
•
•
•
Whatever type of wireless technology
you need for your next Internet of
Things (IoT) designs, TI can help you
find the right one for your application.
With the industry’s broadest wireless
connectivity portfolio, TI supports more
than a dozen wireless technologies for:
• 802.15.4 standards-based mesh
and IP networks
• Personal area networks
• Proprietary RF sub-1 GHz
• Proprietary RF 2.4 GHz
• RFID/NFC
• GPS
Connecting to the Internet of Things
and more
Analysts estimate that the IoT is
quickly growing with the expectation
of 50 billion connected devices by
2020. TI is connecting the IoT now
with the industry’s broadest portfolio
of embedded wireless connectivity
technologies, microcontrollers,
processors and analog solutions.
Examples of how IoT-ready
connectivity is used:
Resources that make
development easy
Our solutions are paired with resources
that make development fast and easy
and reduce time-to-market.
Home automation and lighting
Metering/smart energy
Portable consumer
Portable enterprise
Consumer medical and health
Remote controls
Wireless audio
SimpleLink™ makes wireless
design easier
SimpleLink self-contained solutions
were designed to simplify wireless
development and certification by
minimizing the amount of RF expertise
you need to wirelessly enable a
wide range of applications. TI offers
SimpleLink solutions for multiple
wireless technologies including Wi-Fi®,
ZigBee®, 6LoWPAN, ANT™ and GPS
with an expanding portfolio to come.
Wireless solutions optimized for TI’s
embedded processing portfolio
Decrease your development time
with TI’s wireless technologies
pre-integration with TI Embedded
Processing solutions.
TI’s out-of-the-box development tools
will get you quickly started. Through TI
you’ll have access to a broad variety
of cost-effective development tools,
reference designs and supporting
application and design notes.
Get answers to your design questions
from the TI design experts through our
interactive online E2E™ community.
If you need help to speed up your
application development, TI has an
extensive network of third parties
to help accelerate your design. The
network consists of recommended
companies, RF consultants, and
independent design houses that
provide a series of hardware module
products and design services.
Our connectivity solutions are
designed for the industry’s broadest
embedded processing portfolio – from
high-performance processors to low
power MCUs.
• Alarm, security and
active/passive RFID/NFC
• Automotive
Getting started: Which wireless connectivity technology is right for your design
Finding the best connectivity fit for your application or system is a must and can be daunting. Below are two basic
considerations – Maximum throughput and Power source. For more information on how to get started, go to
www.ti.com/wirelessconnectivity and learn more.
Maximum Throughput
Wi-Fi
1
BLE/ANT
ZigBee
RF4CE
6LoWPAN
Sub-1 GHZ
NFC/RFID
2.4 GHz
BLE/ANT
Bluetooth
®
No
Battery
0.1
Wi-Fi
Coin
Cell
3
Smallest Power Source
Required
AAA
Li-Ion
Mbps
50
NFC/RFID
Technology
Wireless Connectivity Guide
BLE/ANT
ZigBee
Sub-1 GHZ
2.4 GHz
6LoWPAN
RF4CE
2.4 GHz
Proprietary
Technology
3
Texas Instruments 1Q 2014
Wi-Fi®/IEEE 802.11
Ô Wi-Fi® Overview
Wi-Fi IEEE 802.11 a/b/g/n
Wi-Fi continues to effectively penetrate
the wireless market with an installed
base of over 3.5B units with an annual
shipment rate exceeding a billion units.
Nine out of 10 Americans surveyed in
a consumer poll said they would rather
do without Starbucks for a year than
give up their Wi-Fi connection! It is
easy to see how the Internet of Things
(IoT) is expected to grow to 50 billion
connected devices by 2020.
Application areas
• Medical devices and remote patient
monitoring
• Consumer devices (tablets, e-books,
media players), web browsing,
Internet connectivity, and streaming
multimedia
• Industrial and home automation,
remote monitoring, controlling, datalogging and diagnostics
Wireless Connectivity Guide
• Smart machines
• Video conferencing
• Security and surveillance
How does Wi-Fi technology work?
Wi-Fi networks use radio technologies
based on the IEEE 802.11a, 802.11b,
802.11g and 802.11n to provide
secure, reliable, fast wireless
connectivity. Wi-Fi networks operate
in the unlicensed 2.4- and/or 5-GHz
radio bands at rates of 54 Mbps or
greater. They can provide real-world
performance similar to the basic
10BaseT wired Ethernet networks. For
more information on Wi-Fi technology,
visit www.wi-fi.org.
Why TI Wi-Fi?
Texas Instruments is the world’s
leading supplier of Wi-Fi products for
portable, battery-powered products
4
leveraging nearly a decade of
experience and eight generations of
products which are optimized for the
needs of personal technology and
handheld products for the IoT. TI is
also the market leader in combined
wireless products such as the precertified, preWiLink™ 8 module (singlechip Wi-Fi/Bluetooth®/Bluetooth low
energy device) which further solve
issues such as coexistence, antenna
sharing in size-constrained devices,
cost and power consumption.
TI enables simple Wi-Fi connectivity
with the self-contained SimpleLink™
CC3000, which allows very short
design cycles by eliminating the need
for extensive RF and Wi-Fi expertise.
Texas Instruments 1Q 2014
Wi-Fi®/IEEE 802.11
 CC3000
SimpleLink™ Wi-Fi® Module
CC3000MOD
Learn more at: www.ti.com/cc3000
The CC3000 is a self-contained wireless solution that simplifies the process of implementing Internet
connectivity. SimpleLink Wi-Fi
minimizes host microcontroller (MCU)
software requirements making it the
ideal Internet of Things (IoT) solution
for embedded applications using any
low-cost/low-power MCU.
The CC3000 is provided as a module
by TI to reduce development time,
lower manufacturing costs, save board
space, ease certification and minimize
RF expertise required. Additionally, it is
provided as a complete platform solution including software drivers, sample
applications, API guide, user documentation and a world-class support
community.
Key features and benefits
• Wirelessnetworkprocessor
IEEE 802.11 b/g
Embedded IPv4 TCP/IP stack
• Best-in-classradioperformance
Tx power: +18dBm, 11Mbps
Rx sensitivity: –88dBm, 11Mbps
• Singlepowersupply2.7Vto4.8V
• Pairwithlow-MIPS,low-costMCUs
with compact memory footprint
• FCC/IC/CE/TELECcertifiedreference
design with chip antenna
• Smallformfactormodule
16.3mm × 13.5mm × 2mm
• Temperaturerange–20°Cto+70°C
• SmartConfig™technologyenables
simple Wi-Fi configuration using a
smartphone, tablet or PC
• ProvenWi-Fiinteroperabilitybased
on TI’s seventh-generation Wi-Fi
solution
• Completeplatformsolutionincluding
user and porting guides, API guide,
sample applications and support
community
Applications
• Homeautomation
• Homesecurity
• Connectedappliances
• Smartenergy
• M2Mcommunication
Wireless Connectivity Guide
CC3000 Wi-Fi system diagram.
Development tools and software
• Forevaluationanddevelopment,CC3000EvaluationModule(EM)andCC3000
BoosterPack (BOOST) aid in the evaluation and development of SimpleLink Wi-Fi
solutions
• SimpleLinksoftwareandtoolsincludestheone-stepsetupSmartConfig™technology, tool (Patch Programmer) to update driver and firmware patches, single
SDK with drivers and sample applications (home automation, Internet time, email,
and more)
• Sampleapplicationsavailable–www.ti.com/tool/cc3000-platform
Individual/Bundled Kits
CC3000 Evaluation Module
(CC3000EM)
CC3000 BoosterPack
(CC3000BOOST)
See Board Tour Video
User Guide
Kit Contents
Order
• 1 TI CC3000 Evaluation Module
• Compatible Experimenter boards (sold
separately):
– MSP-EXP430F5529,
MSP-EXPF430FR5739,
DK-TM4C123G
$35.00 USD
• 1 TI CC3000 BoosterPack
• Compatible LaunchPads (sold separately)
– MSP-EXP430G2, MSP-EXP430F5529LP
EK-TM4C123GXL, DK-TM4C129X
SimpleLink CC3000 BoosterPack
and MSP430 LaunchPad Bundle
• Soft bundle
– 1 CC3000 BoosterPack
– 1 MSP-EXP430G2 LaunchPad
SimpleLink CC3000 BoosterPack
and Tiva™ C Series LaunchPad
• Soft bundle
– 1 CC3000 BoosterPack
– 1 EK-TM4C123GXL LaunchPad
SimpleLink CC3000 Evaluation
Module and MSP-EXP430FR5739
Experimenter Board Bundle
• Soft bundle
– 1 CC3000 EM board
– 1 MSP-EXP430FR5739 Experimenter
board
(MSP-EXP430G2-CC3000BOOST)
(EK-TM4C123GXL-CC3000BOOST)
(MSP-EXP430FR5739-CC3000EM)
5
Available at
TI eStore and
TI distributors
$35.00 USD
Available at
TI eStore and
TI distributors
$40.99 USD
Available
at TI eStore
only
$43.99 USD
Available
at TI eStore
only
$57.00 USD
Available
at TI eStore
only
Texas Instruments 1Q 2014
Wi-Fi®/IEEE 802.11
WiLink™ 8 module solutions
2.4-GHz Wi-Fi + Bluetooth®/Bluetooth Low Energy Pre-Integrated, Pre-Certified Modules
WL1801, WL1805, WL1831, WL1835
Learn more at: www.ti.com/wilink8
Overview
TI’s newest WiLink 8 module family
enables FCC/IC/ETSI-compliant and
fully integrated Wi-Fi and Bluetooth
technology solutions for the Internet of
Things with high throughput and extended range. WiLink 8 solutions provide
certified Wi-Fi and Bluetooth/Bluetooth
low energy co-existence in a poweroptimized design.
WiLink 8 is provided as certified modules
by TI to reduce development time, lower
manufacturing costs, save board space
and minimize RF expertise required.
Additionally, Linux™ and Android™
drivers for Wi-Fi and Bluetooth are preintegrated with software development
kits for TI’s AM335x and other Sitara™
microprocessors.
Key features and benefits
• High-performanceWi-Fi
802.11 b/g/n 2.4-GHz Radio/
Baseband/MAC
20- and 40-MHz channels
2×2 MIMO (2.4 GHz)
Up to 110 Mbps (UDP) of
throughput
MRC for extended range of 1.4×
(2.4 GHz)
Station and soft access point
– Wi-Fi direct multi-channel
multi-role
Personal and enterprise security
Linux™ and Android™ drivers
• Dual-modeBluetooth
Bluetooth and Bluetooth low energy
(BT 4.0 compliant)
Wi-Fi/Bluetooth single antenna
co-existence
• Built-inpowermanagement
• Advancedlow-powermodes
• Hostinterfaces
SDIO for Wi-Fi and UART for
Bluetooth
• Temperaturerange:–20°Cto+70°C
• Smallformfactor:
13.4 × 13.3 × 2 mm
Applications
• InternetofThings
• Multimedia
• Homeelectronics
Wireless Connectivity Guide
32-KHz
XTAL
VBAT
Antenna 1
Wi-Fi/BT
Host processor running
Linux™ or Android™
VIO
®
Bluetooth
stack and profiles
WPA supplicant
and Wi-Fi driver
32 KHz
WL18XXMOD
Enable
Antenna 2
Wi-Fi
(optional)
Wi-Fi
SDIO
UART driver
SDIO driver
BT
UART
WiLink 8 block diagram.
•
•
•
•
Homeappliancesandwhitegoods
Industrialandhomeautomation
Smartgatewayandmetering
Videocameraandsecurity
WiLink resources
• Learnmore:www.ti.com/wilink8
• E2E™ Forum:
www.ti.com/wiconforum
• WiLink8Wiki:
www.ti.com/wilink8wiki
TI Modules
Wi-Fi®
Product Number
802.11bgn
•
•
•
•
WL1801MOD
WL1805MOD
WL1831MOD
*WL1835MOD
MIMO
MRC
•
•
•
•
Bluetooth® v4.0
FCC/IC/ETSI
Certified
•
•
•
•
•
•
*WL1835MOD is available for sample through TI eStore and authorized distributors.
Development Tools and Software
Product Number
Description
Availability
WL1835MODCOM8
WL1835-based evaluation board compatible with the
Sitara™ AM335x EVM as well as several other TI EVMs and
reference designs
TI eStore and
authorized
distributors
WL1835MOD Cape
WiLink 8 module-based cape offered by CircuitCo for fast
development with BeagleBone Black and BeagleBone open
source computer
BoardZoo.com and
CircuitCo distributors
Other tools
• TIprovidesafullyintegratedandvalidatedWiLink8add-onsoftwareforSitaraAM335x
Linux ezSDK via www.ti.com/wilink8wiki
• TI’sSmartConfig™technologyisaone-stepWi-Fisetupprocessthatallowsmultiple
in-home devices to connect to Wi-Fi networks quickly – www.ti.com/tool/smartconfig
6
Texas Instruments 1Q 2014
ZigBee®/IEEE 802.15.4
Ô ZigBee Overview
ZigBee/IEEE 802.15.4
ZigBee is a standards-based
technology for remote monitoring,
control and sensor network
applications. The ZigBee standard was
created to address the need for a costeffective, standards-based wireless
networking solution that supports low
data-rates, low-power consumption,
security, and reliability.
ZigBee supports self-healing mesh
networking which is a decentralized
network topology very similar to the
Internet. It allows nodes to find new
routes throughout the network if one
route fails, making ZigBee a robust
wireless solution.
Application areas
A technology specifically targeted
for wireless sensor networks,
ZigBee 802.15.4 can be used in any
monitoring and control application that
requires a wireless link. The primary
target markets are:
• H
ome, building and industrial
automation
• S
mart wireless lighting control and
LED bulbs
• Home control/security
• Medical/patient monitoring
• Logistics and asset tracking
system-on-chip (SoC), CC2530 SoC
and the CC2520+MSP430™ two-chip
solution.
unit certified platforms which are
the benchmark for other developer
companies to test against. TI is the
lead technical editor for the next
generation IP based protocol stack.
TI’s ZigBee solutions include:
• T
he CC2538 ARM® Cortex-M3
SoC is the industry’s first 512-kB
Flash device with enough on-chip
memory to support onboard overthe-air download.
• C
ortex®-M3 based System-on-Chip
(SoC) is targeted for dual stack
SE and HA applications offering
hardware security acceleration for fast
commissioning.
• T
he ZigBee second-generation
CC2530 system-on-chip (SoC) is a
ZigBee golden unit that is targeted
for low-power applications and
small-form-factor designs.
• T
I provides complete and free
software solution on various
platforms (8051 and Cortex-M3
SoCs, ultra-low power MSP430™)
• T
I provides extensive development
tools, application support, reference designs
• T
I is the ZigBee market leader and
#1 in 802.15.4 and shipped the
first 802.15.4 chip on the market
(CC2420 )
• T
I brings ZigBee technology to
smartphones as mobile smart
energy display
• T
I had the first IEEE 802.15.4 radio
and has a continued solid roadmap
with focus on ZigBee
Three paths to ZigBee
TI offers three ZigBee-compliant
platforms, built on the CC2538
• B
y running the CC2530 as a ZigBee
Network Processor, it will run the
ZigBee stack and handle all the
network processing, offloading a
separate host processor that runs
the main application. The host
processor communicates with the
CC2530 over a serial interface.
This partitioning option allows
the designer to keep the ZigBee
application profile and any other
applications on the main processor.
• The second-generation CC2520
IEEE 802.15.4 transceiver can be
used with the MSP430 MCU and
Tiva™ suite of ARM Cortex-M3
technology. It is recommended for
designers who want additional Flash
and RAM.
• Sensor networks and active RFID
• Advanced metering/smart energy
• Commercial building automation
SoC
small footprint, high
integration, low cost
• Energy harvesting
Application
Complete ZigBee Solutions
Why TI ZigBee?
Texas Instruments is a founding
member of the ZigBee Board of
Directors. Unlike other hardware
suppliers that outsource their ZigBee
stack development, our software
engineering team delivers golden
CC2530 or CC2538
Protocol
stack
Any MCU (MSP430™, Tiva™)
Any MPU (Sitara™)
Dual-chip
ultra-low power or
high performance
MSP430
CC253x-based coprocessors
with UART/SPI/USB interface:
• Stack and application profile
Three paths to ZigBee
• Protocol stack
• MAC only
Radio
RF front end
(optional)
CC2520
CC2590 / CC2591
TI’s three paths to ZigBee.
Wireless Connectivity Guide
Co-processor
flexible, easy to use and
reduced time to market
7
CC2590 / CC2591
CC2590 / CC2591
www.ti.com/zigbee
Texas Instruments 1Q 2014
ZigBee®/IEEE 802.15.4
Ô ZigBee Light Link
Overview
The world of wireless lighting control
has seen a dramatic shift from custom
or proprietary lighting solution as
efficient and low cost solutions have
been introduced to the general market.
Consumers recognize the value of
convenience, security, and comfort
that wireless devices bring to the home
or office. The barrier to these systems
in the past has been that most product
manufacturers do not provide a system
that allows interoperability among
different lighting control vendors.
Designers can create an easy to use
lighting control solution using ZigBee
light link (ZLL) profile on the Texas
Instruments Z-Stack Pro platform.
ZLL is designed to run on the CC2530
product family. ZLL was created to
save time, money and installation
frustration by providing a simple easy
to install network of lights, switches,
occupancy sensors, daylight sensors
that can be controlled by a mobile
device such as an tablet and mobile
phone as illustrated in Figure 1.
TI ZigBee Light benefits
• Ease of set-up/installation
No tools required
No new wires to be installed, great
for retrofit projects
No special devices needed
• Scalable over time to easily add
your existing luminaries or new light
points to the system
• System components in a reliable
secure mesh network which allows
communication to be safely relayed
by multiple individual network nodes
• Flexibility of movement to allow you
to change the positioning of your
components wherever you want
• Control of lights from anywhere you
like
• Enhanced selection of lighting levels
(including on/off) and ambiances for
a single or group of lights stored and
recalled by the press of a button
What makes ZigBee Light Link
valuable?
Lighting control requires low cost
technology, long battery life capability,
reliable network performance and
system security. This is why the ZigBee
Light Link solution is based on ZigBee
technology.
• This system does not require a
coordinator node, or other special
devices
• All components in the network are
on a similar hierarchical level and
can easily be added to or removed
from the network without affecting
system functionality or integrity
Figure 2. ZigBee Light Link
Courtesy of ZigBee Alliance
How does TI ZigBee Light Link
work?
With Light Link, adding or removing
lamps is very easy and robust.
Contrary to other networking solutions,
it does not matter which lamp is
installed first, or whether other lamps
in the network are switched on or off.
With ZigBee Light Link, adding a new
lamp at a remote location is as easy as
adding a lamp nearby in range.
Figure 2 demonstrates the solution.
Only TI can provide you with one stop
shopping for your wireless lighting
projects. Smart phones, tablets and
PCs via bridging devices can control
lighting products based on TI. Wireless
control is possible via direct control
such as the key fob, remote control
and wireless wall switch or occupancy
sensor. ZigBee Light Link can also
be controlled remotely using a tablet
mobile app via a Wi-Fi to ZigBee
gateway. Added digital functionality
can add wake up features or time
phased multi room on/off lighting for
vacation mode security.
TI gets you into
the Smart Lighting
market NOW!
ti.com/ZigBee
Figure 1 – Low-power RF lighting control
Wireless Connectivity Guide
8
Texas Instruments 1Q 2014
ZigBee®/IEEE 802.15.4
Ô CC2538
2.4-GHz IEEE 802.15.4 ZigBee System-on-Chip Solution
CC2538
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/CC2538
Wireless Connectivity Guide
NVIC
128 KB/256 KB/512 KB
Flash
32 MHz
MPU
16 KB Retention SRAM
Debug
Interface
16 KB Standard SRAM
cJTAG/JTAG
4 KB ROM
ICEPick
Serial Interfaces
2 UARTs
2 SSI/SPI
Systick Timer
Timer/PWM/CCP
4× (32 bit or 2× 16 bit)
USB Full Speed
Device
Watchdog Timer
I2C
32 GPIO
32-ch DMA
AES-128/256
SHA-258
32-MHz XTAL
and 16-MHz RC Oscillator
ECC
RSA-2048
32-kHz XTAL
and 32-kHz RC Oscillator
Packet Handling
Processor
Command Strobe
Processor
32-bit Sleep Timer
LDO Regulator
Power-On Reset and
Brown-Out Detection
MAC Timer
Low-Power
Comparator
RF Chain
Modulator
Demod
Analog
12-bit ADC
RX
TX
with Temp. Sensor
Synth
Key features
• Future proof memory sizes
Up to 512 KB TSMC Flash to
enable on-chip OTA
Up to 32 KB RAM (16 KB with
retention) to comfortably implement
ZigBee IP routers
• Lower-power IEEE 802.15.4 radio
20 mA in Rx
24 mA in Tx @ 0 dBm
• Powerful MCU system
1.2 µA sleep current with RTC with
120 µs wake up for long battery life
Robust and proven power management system
• Capable security core ready for
ZigBee SE 2.0:
AES engine with 128, 192, 256-bit
key support
• CCM, GCM, CTR, CBC-MAC, ECB
modes of operation
• SHA-256 hash function
• Secure key storage memory
• High throughput
Public key accelerator
• ECC and RSA-2048
• Side channel attack protection against
timing and power attacks
ARM®
Cortex™-M3
System
The CC2538 comes in multiple
memory and feature options, among
them 256KB/512KB Flash memory,
16KB/32KB RAM memory and
multiple security features such as AES
engine with 128-, 192-, 256-bit key
support and Public Key Accelerator
ECC and RSA-2048.
SWO
Security
The CC2538 combines a fully integrated high-performance RF transceiver
with an industry-standard enhanced
Cortex®-M3 MCU, Flash, RAM and
other powerful supporting features
and peripherals.
JTAG
IEEE 802.15.4 Radio
The CC2538 is a cost-effective,
low-power, and full System-on-Chip
(SoC) solution specifically tailored to
IEEE 802.15.4 point-to-point, star, and
ZigBee PRO mesh network advanced
applications as well as ZigBee IP
Smart Energy 2.0 applications and
6LoWPAN products.
CC2538 system diagram.
Benefits
• Supports ZigBee PRO Mesh, ZigBee
IP Mesh, advanced ZigBee profiles,
ZigBee RF4CE, 6LoWPAN, and all
802.15.4-based solutions
• Excellent receiver sensitivity and
programmable output power
• Very low current consumption in RX,
TX, and multiple low-power modes
ensure long battery lifetime
• Best-in-class selectivity and
blocking performance, with lowest
packet error rate. Suited for battery
applications
9
Applications
• Meters and home area network –
Smart Energy 1.x/Smart Energy 2.x
• Automated meter reading
• Lighting networks
• Remote controls
• Home/building automation
• Consumer products
• Industrial control and monitoring
• Low-power wireless sensor networks
Texas Instruments 1Q 2014
ZigBee®/IEEE 802.15.4
Ô CC2520
RF Transceiver for IEEE 802.15.4/ZigBee
CC2520
Get samples, datasheets, evaluation modules and application notes at: www.ti.com/sc/device/CC2520
In addition, the CC2520 provides
extensive hardware support for
packet handling, data buffering,
burst transmissions, data encryption,
data authentication, clear channel
assessment, link quality indication
and packet timing information. These
features reduce the load on the host
controller.
1.8 V to 3.6 V Power Supply
C721
Digital Interface
The CC2520 is TI’s second
generation ZigBee/IEEE 802.15.4
RF transceiver for the 2.4-GHz
unlicensed ISM band. This chip
enables industrial-grade applications
by offering state-of-the-art noise
immunity, excellent link budget,
operation up to 125°C and
low-voltage operation.
1
2
3
4
5
6
7
SO
SI
CSn
GPIO 5
GPIO 4
GPIO 3
GPIO 2
R231
NC 21
AVDD 1 20
RF _N 19
CC2520
AGND
Exposed Die
Attached Pad
AVDD 2 16
NC 15
C173
C191
C171
C192
C174
L2
L3
C172
C1
XTAL
C121
Antenna
(50 Ω)
L1
C131
CC2520 application circuit.
General Characteristics
Parameter
Min
Typ
Max
Unit
2394
—
2507
MHz
—
250
—
kBaud
Operating conditions
Key features
• State-of-the-art noise immunity with
minimum 48-dB adjacent channel
rejection
• Excellent link budget (103 dB)
• Extended temp range
(–40°C to +125°C)
• Extensive IEEE 802.15.4 MAC
hardware support
• CC2420 interface compatibility mode
• AES-128 security module
Benefits
• Enables industrial applications in the
2.4-GHz ISM band
• Excellent coexistence with
Bluetooth® and Wi-Fi®
• Hardware support to offload MCU
Frequency range
Data rate
Operating voltage
1.8
—
3.6
V
Operating temperature
–40
—
125
ºC
Output power
–18
—
5
dBm
Receiver sensitivity
—
–98
—
dBm
Adjacent channel rejection, +5 MHz
—
49
—
dB
RX mode
Adjacent channel rejection, –5 MHz
—
49
—
dB
Adjacent channel rejection, +10 MHz
—
54
—
dB
Adjacent channel rejection, –10 MHz
—
54
—
dB
Current consumption
Current consumption, RX
—
22
—
mA
Current consumption, TX, +5 dBm
—
33
—
mA
Current consumption, TX, 0 dBm
—
25
—
mA
Current consumption, power down
—
<1
—
µA
Applications
• Industrial monitoring and control
• Home and building automation
• Low-power wireless sensor networks
• Set-top boxes and remote controls
Development tools and software
• CC2520DK Development Kit
• Z-Stack™ software
• TIMAC
• SimpliciTI™ software protocol
Wireless Connectivity Guide
10
Texas Instruments 1Q 2014
ZigBee®/IEEE 802.15.4
Ô CC2530
2.4-GHz IEEE 802.15.4/ZigBee/RF4CE System-on-Chip Solution
CC2530
Benefits
• Supports ZigBee PRO, ZigBee
RF4CE, 6LoWPAN, and all 802.15.4based solutions
• Excellent receiver sensitivity and
programmable output power
• Very low current consumption in RX,
TX, and multiple low-power modes
ensure long battery lifetime
• Best-in-class selectivity and
blocking performance, with lowest
packet error rate. Suited for battery
applications.
Applications
• Smart energy/automated meter
reading
• Remote controls
• Home/building automation
• Consumer products
• Industrial control and monitoring
• Low-power wireless sensor networks
Wireless Connectivity Guide
AVDD_GUARD
P2_4
P2_3
P2_2
P2_1
P2_0
P1_7
40 39 38 37 36 35 34 33 32 31
The CC2530 comes in four different
versions: CC2530-F32/64/128/256,
with 32/64/128/256-KB Flash memory
respectively, and combines a fully
integrated high-performance RF
transceiver with an industry-standard
enhanced 8051 MCU, 8-KB RAM and
other powerful supporting features
and peripherals.
GND
1
30 R_BIAS
GND
2
29 AVDD
GND
3
28 AVDD
GND
4
P1_5
5
P1_4
6
P1_3
7
24 AVDD
P1_2
8
23 XOSC32M_Q2
P1_1
9
22 XOSC32M_Q1
DVDD2
1
21 AVDD
27 AVDD
26 RF_N
CC2530
25 RF_P
0
P0_0
P0_1
P0_2
P0_3
RESET_N
CC2530 package.
P0_4
P0_5
P0_6
P1_0
11 12 13 14 15 16 17 18 19 20
P0_7
Key features
• Up to 256-KB Flash with 20K erase
cycles to support over-the-air
updates, large applications
• 8-KB RAM for more complex
applications and ZigBee profiles
• Programmable output power
up to +4.5 dBm
• Less than 1-µA current
consumption in power down
with sleep timer running
• Includes powerful address recognition and packet processing engine
P1_6
DCOUPL
The CC2530 is a cost-effective,
low-power, and true System-on-Chip
(SoC) solution specifically tailored to
IEEE 802.15.4 point-to-point and star
or ZigBee PRO mesh network
applications.
AVDD_DREG/DVDD1
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/CC2530
AGND
Esposed Die
Attached Pad
General Characteristics
Parameter
Min
Typ
Max
Unit
Operating conditions
Frequency range
2400
—
2483.6
MHz
Operating temperature range
–40
—
125
ºC
Operating supply voltage
2.0
—
3.6
V
Radio bit rate
—
250
—
kBaud
Receiver sensitivity
—
–97
—
dBm
Adjacent channel rejection
—
49/49
—
dB
Alternate channel rejection
—
57/57
—
dB
Blocking
—
57/57
—
dB
Nominal output power in TX mode
—
+4.5
—
dBm
MCU active and RX mode
—
25
—
mA
MCU active and TX mode, +4 dBm
—
34
—
mA
Power mode 1
—
105
—
µA
Power mode 2
—
1
—
µA
Power mode 3
—
0.4
—
µA
From power mode 2 or 3 to active
—
120
—
µs
From active to RX or TX
—
192
—
µs
Current consumption
Wake-up and timing
11
Texas Instruments 1Q 2014
ZigBee®/IEEE 802.15.4
Ô
CC2531
2.4-GHz USB-Enabled IEEE 802.15.4/ZigBee/RF4CE System-on-Chip Solution
CC2531
USB
• USB 2.0 certified full speed device
(12 Mbps)
• 5 highly flexible endpoints
• 1-KB dedicated FIFO
• No 48-MHz crystal required
• Certified CC2531 USB dongle
reference design
Benefits
• 2× Flash over closest competitor
• Supports ZigBee PRO, ZigBee
RF4CE, and more
• 400m+ LOS range with CC2530EM
dev boards
• 12dB better than closest competitor,
filters interference from a jammer
over 4× closer
• Lowest current consumption power
down mode for long battery life low
duty-cycle applications
• Widest temperature range for
superior robustness
• Efficient security takes up
little Flash or MCU cycles
• Reduced part list and lower BOM cost
Wireless Connectivity Guide
AVDD_GUARD
P2_4
P2_3
P2_2
P2_1
P2_0
P1_7
P1_6
40 39 38 37 36 35 34 33 32 31
DGND_USB
1
30 R_BIAS
USB_P
2
29 AVDD
USB_N
3
28 AVDD
DVDD_USB
4
P1_5
5
P1_4
6
P1_3
7
24 AVDD
P1_2
8
23 XOSC32M_Q2
P1_1
9
22 XOSC32M_Q1
27 AVDD
26 RF_N
CC2531
25 RF_P
DVDD2 10
21 AVDD
Benefits (continued)
• Ideal for gateway or bridge device
• Simple low-cost solution to 1000+
meter range
• Allows smaller PCB to help
miniaturize product
• Provides legacy IR support
with no added cost
P0_0
P0_1
AGND
Esposed Die
Attached Pad
RESET_N
CC2531 package.
P0_2
P0_3
P0_4
P0_5
P0_6
P0_7
11 12 13 14 15 16 17 18 19 20
P1_0
Key features
• Up to 256 KB Flash / 8-KB of RAM
• Excellent link budget (101.5 dB)
• 49dB adjacent channel rejection
(best in class)
• Four flexible power modes
• Extended temperature range:
–40 to +125°C
• AES-128 security module
• Fully compatible with the CC259x
range extenders
DCOUPL
The CC2531 is a USB-enabled SoC
solution for IEEE 802.15.4, ZigBee
PRO and RF4CE applications which
enables USB dongles or USB upgradable network nodes to be built with
low total bill-of-material costs. The
CC2531 combines the performance
of a leading RF transceiver with an
industry-standard enhanced 8051
MCU, in-system programmable Flash
memory, 8-KB RAM, and many other
powerful features. Combined with
the golden-unit-status (ZigBee PRO)
from TI, the CC2531 provides a robust
and complete ZigBee PRO dongle for
firmware upgradable network node.
AVDD_DREG/DVDD1
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/CC2531
Applications
• Home, building and
industrial automation
• Energy harvesting
• Home control/security
• Medical/patient monitoring
• Logistics and asset tracking
• Sensor networks and active RFID
• Advanced metering/smart energy
• Commercial building automation
General Characteristics
Parameter
Min
Typ
Max
Unit
Operating conditions
Frequency range
2400
—
2483.6
MHz
Operating temperature range
–40
—
125
ºC
Operating supply voltage
2.0
—
3.6
V
Radio bit rate
—
250
—
kBaud
Receiver sensitivity
—
–97
—
dBm
Adjacent channel rejection
—
49/49
—
dB
Alternate channel rejection
—
57/57
—
dB
Blocking
—
57/57
—
dB
Nominal output power in TX mode
—
+4.5
—
dBm
MCU active and RX mode
—
25
—
mA
MCU active and TX mode, +4 dBm
—
34
—
mA
Power mode 1
—
105
—
µA
Power mode 2
—
1
—
µA
Power mode 3
—
0.4
—
µA
From power mode 2 or 3 to active
—
120
—
µs
From active to RX or TX
—
192
—
µs
Current consumption
Wake-up and timing
12
Texas Instruments 1Q 2014
ZigBee®/IEEE 802.15.4
Ô Z-Stack™ – ZigBee® Protocol Stack
Z-Stack™ – TI’s industry-leading
ZigBee protocol stack
Z-Stack is TI’s protocol stack for a
growing portfolio of IEEE 802.15.4
products and platforms. Z-Stack is a
certified ZigBee-Compliant Platform
for the ZigBee 2012 specifications on
the C2538 System-on-Chip (SoC),
CC2530 SoC and MSP430+CC2520
transceiver. Z-Stack supports the
Smart Energy, Home Automation, Light
Link, Building Automation and Health
Care application profiles. The latest
ZigBee PRO stack is downloadable
from the TI web site without any royalty
charge.
Key features
• A fully compliant ZigBee PRO feature
set on the CC2530 and CC2538
family of SoCs and an extensive
family of MSP430™ microcontrollers
coupled with the CC2520 transceiver
SECURITY & ALARM
SECURITY
& ALARM
Sensors can use lighting network for
Sensors
canin addition
use lighting
visual alarms
to sound
network for visual alarms in
addition to sound
• A range of sample applications
including support for the ZigBee
Smart Energy, ZigBee Home
Automation and ZigBee Light Link
Profiles
• Over The Air download support
• Incorporated support for the
CC2591 (www.ti.com/cc2591) and
CC2590 (www.ti.com/cc2590), the
latest RF front ends which support
regional requirements for +20dBm
and +14dBm transmit power and
improved receive sensitivity
Benefits
• Golden Unit ZigBee PRO software
stack: deployed in millions of
systems worldwide today
• Over The Air (OTA) feature allows
future updates for your deployed
hardware
• A broad range of certified
sample applications reduce your
development costs
• Flexible architecture choices
MOTION DETECTOR
Used by alarm & lighting systems
Application areas
ZigBee 802.15.4 can be used in any
monitoring and control application that
requires a wireless link:
• Commercial and residential lighting
• Home, building and industrial
automation
• Energy harvesting
• Home control/security
• Medical/patient monitoring
• Logistics and asset tracking
• Sensor networks and active RFID
• Advanced metering/smart energy
• Commercial building automation
www.ti.com/z-stack
WINDOW CONTROL
Light sensor and remote controls
can be used to control the blinds
ACCESS CONTROL
Key fob can be used to
lock door, turn on alarm
and turn off lights
HEATING & AIR CONDITIONING
Wireless temperature sensors to
maintain ideal temperature while
lowering energy cost
ENVIRONMENTAL MONITORING
Wireless sensors for temperature,
humidity & pressure minimize water
usage & energy cost
LIGHTING CONTROL
Light schemes to dim or turn
on/off large number of lights
REMOTE CONTROL
REMOTE
CONTROL
DSL MODEM
Use gateway to Internet for monitor
& control of home network
AUTOMATIC NOTIFICATION
Use gateway to GSM or other standard to be
notified of alterations directly to a handset
Wireless Connectivity Guide
13
Texas Instruments 1Q 2014
6LoWPAN
Ô 6LoWPAN Overview
6LoWPAN
6LoWPAN is an open standard defined
by IETF (Internet Engineering Task
Force) in RFC 4944. It defines IPv6
over low power, low cost RF networks.
The 6LoWPAN technology natively
supports IPv6 addresses on all nodes
in a LoWPAN. 6LoWPAN uses mesh
technique to support large scalable
networks that require IP connectivity.
In case one route fails, the technology
allows nodes (routers) to find new
routes throughout the network, making
6LoWPAN a robust wireless solution.
Like in a ZigBee® environment
information is routed even if a node
is out of order. 6LoWPAN makes the
wireless embedded Internet possible!
6LoWPAN can be used with several
different PHY layers, both sub-1 GHz
and 2.4 GHz. It runs on top of IEEE
802.15.4 and enables end-to-end IPv6
addressing and IP context.
Application areas
• Outdoor lighting systems
• The focus markets and applications
are larger scale networks that require
connection to an IP backbone
network.
• The most relevant cases are, but not
limited to:
Smart metering
ome, building and industrial
H
automation
Industrial automation/monitoring/
process control
Logistics and asset tracking
Security large scale/commercial
Wireless Connectivity Guide
TI’s 6LoWPAN solutions
TI’s 6LoWPAN solutions are based on
hardware from TI and software from its
third party Sensinode Ltd. Sensinode
Ltd. is a leading supplier of 6LoWPAN
software components. TI’s 6LoWPAN
solutions include:
• Complete hardware and software
6LoWPAN platforms
• High-performance radio, based on
the CC1101 radio design or CC1110
and CC430 System-on-Chip (SoC)
solutions
• Application support
• Development kits and tools
TI offers two 6LoWPAN platforms, built
on the CC1180 and CC430 radios.
Both platforms are for sub-1-GHz
operation.
• The CC430 SoC is a device that is
targeted for low power applications
and small form factor designs. The
CC430 SoC runs both the 6LoWPAN
stack and the customer application
on networks up to 50 nodes
• The CC1180 can be used as
a wireless network processor.
Containing the 6LoWPAN stack,
the CC1180 communicates to the
system’s main processor through
the UART interface. This partitioning
option allows the designer to
keep the application on the main
processor
• The CC1101/MSP430 platform is
a two-chip solution for larger node
applications. The memory size of the
MSP430F5xx family provides more
partitioning for both the stack and
application profile.
14
Texas Instruments 1Q 2014
Sub-1-GHz 6LoWPAN Network Processor
Ô CC1180
Sub-1-GHz 6LoWPAN Network Processor
CC1180RSPR/CC1180RSPT
Get samples, datasheets, evaluation modules and application notes at: www.ti.com/sc/device/CC1180
The CC1180 is a cost effective, low
power, sub-1-GHz network processor that provides wireless 6LoWPAN
functionality for system designers that
want to connect their end products to
the Internet using standards based IPV6
technology. The CC1180 is a preloaded
version of the CC1110F32 SOC, where
the TI third party Sensinode’s 6LoWPAN
stack. Nanostack 2.0 Light runs on
the CC1180 Network processor. The
application controlling the network
processor runs on an external host
microcontroller. The CC1180 network
processor handles all the timing critical
and processing intensive 6LoWPAN
protocol tasks and leaves the application microcontroller free to handle.
Key features
• E
asy Integration of 6LoWPAN with
mesh support into any design
• Compact stack (around 20k)
­optimized for sensor applications
CC-6LoWPAN-DK-868 Development Kit.
• U
ART interface to almost any microcontroller running the application
Applications
Development tools and software
• Home and building automation
• CC-6LOWPAN-DK-868
• S
tandard IP socket programming:
Supports updating of the N
­ anoStack
2.0 Lite 6LOWPAN stack using
­Sensinode NanoBoot API
• Industrial monitoring and control
• R
F tester application: Eases FCC/ETSI
testing
Benefits
General Characteristics
• Integrated hardware design shortens
time to market by 25%
• Embedded stack with simple sample
applications reduce firmware
development by up to 50%
• Compact radio reference design
makes it ideal for small form factor
end devices and sensors
• Low current consumption optimized
for sleeping end nodes and battery
operated devices
Wireless Connectivity Guide
• Sensor networks
• Medical telehealth
Parameter
Min
Device type
SoC
—
—
—
Frequency ranges min
300
391
782
MHz
Frequency ranges max
348
464
928
MHz
Operating voltage
2.0
—
3.6
V
Operating temperature
–40
—
85
°C
Output power
–30
—
10
dBm
Receiver sensitivity
—
–98
–112
dBm
Standby current
—
0.3
—
µa
Wake up timer (PD->RX/TX)
—
330
—
µS
Modulation techniques
—
GFSK
—
—
15
Typ
Max
Unit
Texas Instruments 1Q 2014
Bluetooth® Technology
Ô Bluetooth® Overview
Bluetooth
Bluetooth wireless technology is one
of the most prominent short-range
communications technologies with
an installed base of more than three
billion units. Bluetooth is intended
to replace the cables connecting
portable and/or fixed devices while
maintaining high levels of security, low
power and low cost. A fundamental
strength of Bluetooth is the ability to
simultaneously handle data and voice
transmissions. Bluetooth is designed
to have very low power consumption
by allowing radios to be powered
down when inactive. The Bluetooth
specification defines a uniform
structure with global acceptance
to ensure interoperability of any
Bluetooth-enabled device.
Application areas
• Internet of Things (IoT)
• Sports and fitness
• Assisted living
• Industrial sensors
• Toys
• Entertainment devices
• Mobile accessories
• All Bluetooth wireless applications
Wireless Connectivity Guide
How does Bluetooth technology
work?
Bluetooth technology operates in the
unlicensed industrial, scientific and
medical (ISM) band at 2.4 to 2.485
GHz, which is available and unlicensed
in most countries. Bluetooth uses a
spread spectrum, frequency hopping,
full-duplex signal which was designed
to reduce interference between
wireless technologies sharing the
2.4-GHz spectrum. Bluetooth tech­
nology provides greater performance
even when other technologies are
being used along with Bluetooth
technology. Information above cited
from the Bluetooth SIG. For more
information on Bluetooth technology,
visit www.Bluetooth.com.
Why TI Bluetooth?
TI is one of the leading semiconductor
companies providing Bluetooth
wireless technology for portable,
battery-powered devices leveraging
nearly a decade of experience and
seven generations of products
which are optimized for the needs
of handheld products. TI is also the
market leader in combined wireless
products such as the WiLink™ 8
solution single-chip Wi-Fi®/Bluetooth/
Bluetooth low energy device), CC2560
(Bluetooth), CC2564 (Bluetooth/
16
Bluetooth low energy), which further
solve issues such as coexistence,
antenna sharing in size-constrained
devices, cost and power consumption.
Dual mode
Dual-mode Bluetooth low energy
technology is available as a part of
TI’s proven WiLink connectivity combo
solutions. These solutions support
Wi-Fi and dual-mode operations by
providing classic Bluetooth technology
capability along with Bluetooth low
energy technology. The WiLink 8
module solution includes on-chip
coexistence, which yields size, cost,
performance and power advantages
that ease customer development
cycles. WiLink brings connectivity
features to mainstream products such
as smart phones, mobile Internet
devices (MIDs), portable media players
(PMPs), gaming devices and personal
navigation devices (PNDs).
For longer range, higher throughput
and ability to connect to any mobile
phone or tablet on the market, TI also
has a Bluetooth dual-mode solution,
the CC2564. It is used for audio
and data applications and supports
Bluetooth and Bluetooth low energy,
assisted audio (SBC encode/decode)
or ANT™ running simultaneously.
Texas Instruments 1Q 2014
Bluetooth® Technology
Ô SimpleLink™ Bluetooth CC256x Devices
Dual-Mode Bluetooth 4.0 Controller Now with Integrated Audio Capabilities
CC2560, CC2564
Learn more at: www.ti.com/bluetooth
Overview
The TI SimpleLink CC256x device is a
complete Bluetooth BR/EDR/LE HCI
or Bluetooth + Bluetooth Low Energy
solution that reduces design effort and
enables fast time to market.
A royalty-free software Bluetooth stack
available from TI is pre-integrated with
TI’s MSP430™ and ARM® Cortex®-M4
MCUs. The stack is also available
for MFi solutions and on other MCUs
through Stonestreet One
(www.stonestreetone.com). Profiles
supported today include: serial port
profile (SPP), human interface device
(HID), A2DP (Advanced Audio Distribution Profile), AVRCP (Audio/Video
Remote Control Profile) and several
Bluetooth low energy profiles (profiles
can vary based on the supported MCU).
In addition to software, reference
designs are available with a low BOM
cost. For example, TI’s Audio Sink
solution uses the Bluetooth device
for audio processing, an MSP430,
audio DAC and USB charger. For more
information visit TI Designs.
Key features
• Single-chip Bluetooth solution
integrating Bluetooth Basic Rate
(BR)/Enhanced Data Rate (EDR)/
Low Energy (LE) features fully
compliant with the Bluetooth 4.0
specification up to the HCI layer
• BR/EDR features include:
•CC2560B/CC256B devices
provide an assisted mode for
HFP1.6 wideband speech (WBS)
profile or A2DP profile to reduce
host processing and power
26-MHz
Clock
32-KHz
Clock
MSP430™
or
Other MCU
UART
Filter
CC256x
SimpleLink CC256x block diagram
• Highly optimized for low-cost
designs:
• Physical interfaces:
•Package footprint: 76 pins,
0.6-mm pitch, 8.10-mm- ×
8.10-mm mrQFN
•Standard HCI over H5 UART (2 wire)
•Standard HCI over H4 UART (4 wire)
•Fully programmable digital
PCM-I2S codec interface
• Best-in-Class Bluetooth (RF) performance (TX power, RX sensitivity,
blocking)
Benefits
• Best-in-class link budget extends
application range
• Class 1.5 TX power up to +12 dBm
• Simplified hardware and software
development
•Provides longer range, including
2× range over other Bluetooth low
energy-only solutions
• Reduced development time and
costs
• Advanced power management for
extended battery life and ease of
design
• Enables simultaneous operations of
Bluetooth with Bluetooth low energy
SimpleLink™ CC256x Products
Technology supported
Device
CC2560B
CC2564B*
Description
BR/EDR
LE
Bluetooth 4.0 (with EDR)
•
•
•
•
Bluetooth 4.0 + BLE
Bluetooth 4.0 + ANT
Assisted modes
Ant™
HFP 1.6 (WBS)
A2DP
•
•
•
•
•
•
•
* The device does not support simultaneous operation of LE, ANT or assisted modes. Any of these modes can run simultaneous to Bluetooth
BR/EDR.
Continued on following page.
• LE supports up to 6 (CC2564) or 10
(CC2564B) simultaneous connections
• Flexibility for easy stack integration and validation into various
microcontrollers, such as MSP430™
and ARM® Cortex®-M4 MCUs
Wireless Connectivity Guide
17
Texas Instruments 1Q 2014
Bluetooth® Technology
 SimpleLink™ Bluetooth CC256x Devices (continued)
Dual-Mode Bluetooth 4.0 Controller Now with Integrated Audio Capabilities
CC2560, CC2564
Learn more at: www.ti.com/bluetooth
Applications
• Cablereplacement
•Smartwatches,activitytrackers
Development Tools and Software
Product Number
Description
Availability
®
CC256xQFNEM
CC256x Bluetooth / Dual-Mode Evaluation Module
TI eStore and
authorized distributors
Bluetooth and MSP430
Audio Sink Reference
Design
Enables Bluetooth audio (SBC encode/decode) with CC2560
and the ultra-low power MSP430F5229 and digital input
speaker amplifier (TAS2505) and USB charge management
device (BQ24055). Reference design is a cost-effective audio
implementation, with full design files provided for application
and end product development. Software supported includes
Stonestreet One Bluetopia Bluetooth stack (certified and
royalty free)
Download at TI
Designs
SimpleLink CC256x
modules from TI
TI certified modules based on the CC2564 devices
Coming soon
SimpleLink CC256x
BoosterPack
SimpleLink Bluetooth BoosterPack evaluation kit has flexibility
to work with ultra-low power microcontrollers such as the TI
MSP430™ and Tiva™ C Series LaunchPad evaluation kits
Coming soon
Bluetooth Audio Source
Reference Design
Enables Bluetooth audio (SBC encode/decode) with CC2560
and the ultra-low power MSP430F5229 and digital DAC
plus USB charge management device (BQ24055). Reference
design is a cost-effective audio implementation, with full
design files provided for application and end product development. Software supported includes Stonestreet One Bluetopia
Bluetooth stack (certified and royalty free).
Coming soon in TI
Designs and for
sale from TI and
distribution
• Mobiledeviceaccessories
• Industrialcontrol
• Audiostreamingsolutions
SimpleLink Bluetooth CC256x
resources
• L
earnmore:
www.ti.com/bluetooth
• E
2E™Forum:
www.ti.com/wiconforum
• C
C256xWiki:
www.ti.com/cc256xwiki
Audio microphone
Wireless Connectivity Guide
18
Boards orderable
through TI and eStore
coming soon
Texas Instruments 1Q 2014
Bluetooth® Low Energy Technology
 Bluetooth Low Energy Overview
Bluetooth® low energy technology
Bluetooth low energy technology
offers ultra-low power, state-ofthe-art communication capabilities
for consumer medical, mobile
accessories, sports and wellness
applications. Compared to classic
Bluetooth capabilities, Bluetooth low
energy is a connectionless protocol,
which significantly reduces the
amount of time the radio must be on.
Requiring only a fraction of the power
consumption of traditional Bluetooth
technology, Bluetooth low energy can
enable target applications to operate
on a coin cell for more than a year.
TI’s Bluetooth low energy solutions
– single mode and dual mode
TI provides Bluetooth low energy
single-mode solutions for sensor
applications and dual-mode solutions
for mobile handheld devices. With
both sides of the link, TI delivers a
fully tested and robust Bluetooth low
energy ecosystem. TI also offers Dual
mode Smart Ready solutions based
on CC2564. This dual mode solution
allows customers to create solutions
that talk with both classic Bluetooth
devices and Bluetooth low energy
devices. TI’s Bluetooth low energy
solutions include:
Application areas
• Mobileaccessories
• Consumerhealth/medical
• Healthandfitness
• Remotecontrols
• Wirelesssensorsystems
• TIprovidesbothsinglemodeand
dual-mode Bluetooth low energy
solutions
• Bothsidesofthelinktocreatea
fully tested Bluetooth low energy
ecosystem – from smart sensors to
smart phones
• LeadingRFperformanceupto
–97dBm
• Excellentcoexistencewithother
2.4-GHz devices
Bluetooth low
energy for personal
connectivity and
health and fitness
applications
Wireless Connectivity Guide
• CC2540Systemonachipintegrated
solution (host and controller) and
certified modules available
Single mode
TI’s Bluetooth low energy solution
for sensor applications includes
the CC254x 2.4-GHz system-onchip (SoC), TI protocol stack, profile
software and application support.
The CC254x is an ultra-low power,
true one-chip integrated solution with
controller, host and application on
one device. It is a Flash-based and
flexible device, with ultra-low power
consumption, leading RF performance
and excellent coexistence with other
2.4-GHz devices. Combined with the
Bluetooth low energy protocol stack,
the CC254x forms the market’s most
flexible and cost-effective single-mode
Bluetooth low energy solution.
For more information see page 20.
www.ti.com/bluetoothlowenergy
19
Texas Instruments 1Q 2014
Bluetooth® low energy Technology
Ô CC2540
Single-Mode Bluetooth® Low Energy System-on-Chip
CC2540
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/CC2540
See also: www.ti.com/product/tps62730
Benefits
• Versatile feature-rich device allows
lowest cost system when integrating
application and stack on single chip
• RF performance maximizes
communication range while simultaneously minimizing the effect of
interference sources
• Supports range of applications and
reduces BOM cost through all-inone SoC solution
• Ultra-low average-power consumption in low-duty cycle systems
Applications
• Mobile/laptop accessories
• Sports and fitness
• Consumer health and medical
• Proximity
Wireless Connectivity Guide
(1)
C331
The CC2540 is a cost-effective, lowpower, true System-on-Chip (SoC)
solution for single-mode Bluetooth low
energy applications, including
mobile accessories, sports and
fitness, consumer health, sensors
and actuators, remote controls, HID,
proximity, and more. The CC2540
combines a 1-Mbps GFSK RF
transceiver, offering superior range
over the competition with a peripheral rich 8051 MCU core. This highly
integrated and low cost SoC, coupled
with TI’s Bluetooth low energy stack,
offers a true one-chip integrated
solution.
Key features
• True one-chip single-mode
Bluetooth low energy solution
• Optimized RF performance including
Tx/Rx power and selectivity
• Extensive peripheral set including
USB, DMA, GPIO, USARTs, ADC,
timers
• Flexible low power modes to
maximize system lifetime when
battery powered
Optional 32-kHz Crystal
XTAL2
C401
2
USB_P
3
USB_N
4
DVDD_USB
5
P1_5
P1_4
7
P1_3
8
P1_2
9
P1_1
AVDD6 31
P2_1 35
P2_2 34
P2_0 36
P1_7 37
P1_6 38
R301
RBIAS 30
L251
AVDD4 29
AVDD1 28
C251
Antenna
(50 )
C252
AVDD2 27
L252
RF_N 26
CC2540
RF_P 25
DIE ATTACH PAD
C261
L253
L261
AVDD3 24
XOSC_Q2 23
C262
C253
XOSC_Q1 22
18 P0_1
19 P0_0
17 P0_2
16 P0_3
15 P0_4
14 P0_5
13 P0_6
11 P1_0
12 P0_7
10 DVDD2
20 RESET_N
6
P2_4/XOSC32K_Q1 32
DGND_USB
P2_3/XOSC32K_Q2 33
1
DVDD1 39
DCOUPL 40
C321
AVDD5
21
XTAL1
C221
C231
(1) 32-kHz crystal is mandatory when running the chip in low-power modes, except if the link layer is in the standby
(Vol. 6 Part
B Section 1.1 in [1]).
CC2540state
application
circuit.
NOTE: Different antenna alternatives will be provided as reference designs.
Development tools and software
• Single-mode Bluetooth low energycompliant software stack
• CC2540DK-MINI Development Kit
for quick product development
• Bluetooth low energy packet sniffer
• Application profiles, sample
applications, documentation
and more
General Characteristics
Parameter
Min
Frequency range
2402
Typ
Max
Unit
2480
MHz
kBaud
Data rate
—
1000
—
Operating voltage
2
—
3.6
V
Operating temperature
–40
—
85
ºC
Output power
–20
—
4
dBm
Receiver sensitivity
—
–93
—
dBm
Adjacent channel rejection, +1 MHz
—
5
—
dB
Adjacent channel rejection, –1 MHz
—
5
—
dB
Alternate channel rejection, +2 MHz
—
30
—
dB
Alternate channel rejection, –2 MHz
—
30
—
dB
Current consumption, RX
—
19.6
—
mA
Current consumption, TX, +4 dBm
—
31.6
—
mA
Current consumption, TX, 0 dBm
—
27
—
mA
Current consumption, power down
—
0.4
—
μA
RX mode
Current consumption
20
Texas Instruments 1Q 2014
Bluetooth® low energy Technology
Ô CC2541
Single-Mode Bluetooth® Low Energy System-on-Chip
CC2541
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/CC2541
Key features
• True one-chip single mode
Bluetooth low energy solution
• Optimized RF performance including
Tx/Rx power and selectivity
• Extensive peripheral set including
I2C, DMA, GPIO, USARTs, ADC,
timers
• Flexible low power modes to
maximize system lifetime when
battery powered
Benefits
• Versatile feature-rich device allows
lowest cost system when integrating
application and stack on single chip
RESET
32-MHz
Crystal OSC
32.768-kHz
Crystal OSC
P2_4
P2_3
P2_2
P2_1
P2_0
On-Chip Voltage
Regulator
Clock MUX and
Calibration
Power-On RESET
Brown Out
High Speed
RC-OSC
Debug
Interface
32-kHz
RC-OSC
Sleep Timer
XRAM
8051 CPU
Core
Memory
Arbitrator
IRAM
SRF
DMA
VDD (2 V8.6 V)
DCOUPL
Power Management Controller
PDATA
P1_7
P1_6
P1_5
P1_4
P1_3
P1_2
P1_1
P1_0
RAM
SRAM
FLASH
FLASH
UNIFIED
IRQ CTRL
FLASH CTRL
AES Encryption
and Decryption
DSADC
Audio/DC
I2C
SDA
SCL
FIFO CTRL
1-KB SRAM
Radio Registers
Link Layer Engine
SYNTH
RadioArbiter
Analog Comparator
SFR bus
Demodulator
Modulator
USART 0
USART 1
Recieve
Timer 1 (16-bit)
Timer 2 (BLE LLTIMER)
Frequency
Synthesizer
P0_7
P0_6
P0_5
P0_4
P0_3
P0_2
P0_1
P0_0
Watchdog Timer
SFR bus
RESET_N
XOSC_Q2
XOSC_Q1
I/O Controller
The CC2541 is a power-optimized
true system-on-chip (SoC) solution
for both low energy and proprietary
2.4-GHz applications. It enables robust
network nodes to be built with low
total bill-of-material costs. The CC2541
combines the excellent performance
of a leading RF transceiver with an
industry-standard enhanced 8051 MCU,
in-system programmable Flash memory,
8-KB RAM, and many other powerful
supporting features and peripherals.
The CC2541 is highly suited for systems
where ultra-low power consumption is
required. This is specified by various
operating modes. Short transition times
between operating modes further enable
low power consumption.
The CC2541 is pin-compatible with the
CC2540 in the 6-mm × 6-mm QFN-40
package, if the USB is not used on the
CC2540 and the I2C/extra I/O is not
used on the CC2541.
Transmit
Timer 3 (8-bit)
Timer 4 (8-bit)
RF_PRF_N
Digital
Analog
Mixed
Development tools and software
• Single-mode Bluetooth low energy
compliant software stack
• CC2541EMK Evaluation Module Kit
for quick product development
• CC2541DK-MINI Development Kit
for quick product development
• CC2540DK Development Kit for
advance prototyping
• Bluetooth low energy packet sniffer
• Application profiles, sample applications, documentation and more
Applications
• Mobile/laptop accessories
• Sports and fitness
• Consumer health and medical
• Proximity
General Characteristics
Parameter
Min
Frequency range
2402
Typ
Max
Unit
2480
MHz
Data rate
—
1000
—
kBaud
Operating voltage
2
—
3.6
V
Operating temperature
–40
—
85
ºC
• Supports range of applications and
reduces BOM cost through all-inone SoC solution
Output power
–20
—
0
dBm
—
–93
—
dBm
• Ultra low average-power consumption in low-duty cycle systems
Current consumption
Current consumption, RX
—
17.9
—
mA
Current consumption, TX, 0 dBm
—
18.2
—
mA
Current consumption, power down
—
0.4
—
μA
• RF performance maximizes
communication range while simultaneously minimizing the effect of
interference sources
Wireless Connectivity Guide
RX mode
Receiver sensitivity
21
Texas Instruments 1Q 2014
Bluetooth® low energy Technology
Ô BLEStack – Bluetooth Low Energy Protocol Stack and Tools
TI’s Bluetooth® low energy (BLE)
software development kit includes
all necessary software to get started
on the development of single-mode
Bluetooth low energy applications
using the CC2540/CC2541 system-onchip. It includes object code with the
Bluetooth low energy protocol stack,
a sample project and applications with
source code, and BTool, a Windows
PC application for testing Bluetooth
low energy applications. In addition
to the software, the kit contains
documentation, including a developer’s
guide and Bluetooth low energy API
guide.
Key features
• Bluetooth specification version 4.0
compliant, single mode low energy
host and controller sub-system.
Stack certified as controller and host
sub-systems.
• TI’s Bluetooth low energy solution
includes System-on-Chip (SoC), inhouse developed protocol stack,
profile software and application
support
• Both master and slave role support,
multi-role support
Application areas
• Mobile phone accessories
• Sample applications for profile and
proprietary products
• Sports/leisure/medical equipment
• Optimized specifically for CC2540/
CC2541
• Proximity applications – security or
other spatially aware applications
• Available to all CC2540/CC2541
customers as object code (libraries)
www.ti.com/blestack
• Gaming/HID/remote controls
• Royalty-free protocol stack
• Leverages TI’s long experience in
low-power radio protocol stacks for
ZigBee®, RF4CE and SimpliciTI™
Benefits
• Easy development and certification
of Bluetooth low energy end
products
• Low power consumption
• Small stack footprint
• Robust and flexible stack
implementation
• All aspects of Bluetooth low energy
development provided by TI
• Profile support planned based
on specific profile specifications
(attribute, PUID, proximity, remote
and more)
Customer can run their
own application on the
CC2540
Application
Basic Profile (Sensor, HID, etc)
Generic Attribute Profile (GATT)
SMP
TI provides the protocol
stack, which includes
some basic profiles
ATT
L2CAP
Link Layer (LL)
PHY Layer
SILICON
Wireless Connectivity Guide
Protocol Stack
22
Application
Texas Instruments 1Q 2014
ANT™
 ANT™ Overview
What is ANT?
ANT provides a simple, low-cost and
ultra-low power solution for short-range
wireless communication in point-to-point
and more complex network topologies.
Suitable for various applications, ANT
is today a proven and established
technology for collection, automatic
transfer and tracking of sensor data
within sports, wellness management and
home health monitoring applications.
Application areas
• Sports/Fitness
• Consumerhealth/medical
• Mobileaccessories
• Wirelesssensorsystems
TI’s ANT solutions– from smart
sensors to smart phones
TI’s ANT products feature full system
solutions for both sensor applications
and mobile handheld devices. With
both sides of the ANT link, TI delivers
fully tested and robust ANT ecosystem
solutions – from smart sensors to
smart phones. TI’s ANT solutions
are developed in cooperation with
Dynastream Innovations Inc, the
company behind ANT. TI’s ANT solutions
include:
CC257x ANT network processor +
MSP430™ MCU
TI’s ANT sensor device is a dual-chip
solution, combining market leading
RF technology and the MSP430, the
world’s lowest power microcontroller.
The CC257x network processors are
2.4-GHz devices tailored for ANT
sensor applications. The ICs are easy
to integrate, low cost, with ultra-low
power consumption and superior RF
performance, making them versatile
enough to support a wide range of
applications. In cooperation with
Dynastream Innovations Inc, TI delivers
a full turnkey ANT sensor solution,
including software and application
support.
For more information see 24.
CC2564 dual-mode ANT and Bluetooth
The CC2564 is the first dual-mode,
ANT and Bluetooth solution in the
market. This solution allows customers
to connect to mobile phones and
computers over Bluetooth from ANT+
enabled devices, and allows customers
with Bluetooth solutions to add ultra lowpower ANT+ connectivity.
• OnlyTIofferssingle-mode
(CC2570/71) and dual-mode solutions
(CC2567, WiLink)
• FullytestedTIANTecosystemsolution–
for both sensor and mobile handheld
devices
• Best-in-classRFperformance
• Excellentcoexistencewithother
2.4-GHz devices
The CC2567-PAN1327/17 is provided
as a module to help customers reduce
development time, lower manufacturing
costs, save board space, ease
certification, and minimize RF
expertise required.
For more information see 19.
ANT+ smartphone connectivity
The functionality of ANT enables mobile
handheld device manufacturers to
deliver ANT+ interoperable sports,
fitness and consumer health monitoring
products. TI’s WiLink™ family is the
first to deliver ANT+ communication
on a connectivity combo solution.
Leveraging TI’s connectivity leadership
in the Smartphone market, the ANT+
ecosystem is expanding its reach into
the mobile handheld device market.
WiLink is the industry’s first true singlechip mobile WLAN, GPS, Bluetooth®,
Bluetooth low energy, ANT and FM
transmit/receive solution. WiLink brings
connectivity features to mainstream
products such as smartphones, mobile
Internet devices (MIDs) and portable
media players (PMPs). Existing devices
based on both WiLink and BlueLink™
solutions can enable ANT with a simple
software upgrade, to connect to the
many available ANT+ sensors today.
For more information visit
www.ti.com/wilink
www.thisisant.com
www.ti.com/ant
Wireless Connectivity Guide
23
Texas Instruments 1Q 2014
ANT™
Ô CC2570/CC2571
ANT™ Network Processor
CC2570/CC2571
Wireless Connectivity Guide
AVDD6
XOSC32K_Q1
XOSC32K_Q2
EE_GND
GND
PORTSEL
GND
GND
40 39 38 37 36 35 34 33
32 31
GND
1
30 R_BIAS
GND
2
29 AVDD4
GND
3
28 AVDD1
GND
4
TxD/SOUT
5
RxD/SIN
6
BR2/SCLK
7
24 AVDD3
BR1/SFLOW
8
23 XOSC_Q2
BR3/FAST SPI
9
22 XOSC_Q1
27 AVDD2
CC257X
26 RF_N
25 RF_P
DVDD2 10
RESET
SUSPEND/SRDY
GND
EE_CLK
EE_MOSI
EE_MISO
GND
14 15 16 17 18 19 20
EE_CS
11 12 13
RTS/SEN
21 AVDD5
SLEEP/MRDY
Key features
• ANT compliant RF network
processors
• UART/SPI serial interface to
easy-to-use API command set
• Excellent RF performance (avg.
power and boosted output power)
• Accurate full-range RSSI function
suited for proximity
• ANT-FS support
Benefits
• Easy-to-integrate into ANT products
• Simple, accessible serial interface to
ANT-enable your product
• Optimized low power for long device
lifetime
• High resolution RSSI proximity
pairing
Applications
• Sports and fitness equipment
• Health and medical equipment
• Consumer health devices
• Consumer electronics
• Wireless sensor networks
Development tools and software
• ANTC7EK1 CC257x
Development Kit
• ANTware
• Integrated ANT-FS reference design
• ANT-FS PC host
• Embedded reference design
DCOUPL
The CC2570 and CC2571 are ANT RF
network processors that implement
the easy-to-use, power-efficient ANT
protocol. The CC2570 supports 1 ANT
channel, while the CC2571 supports
8 ANT channels. The CC2570/71 can
be connected to a host MCU (such
as an MSP430™) through a UART
or SPI serial interface and accessed
through a set of API calls. The majority
of the ANT protocol is built into the
CC2570/71, including the ANT-FS file
system functionality; only the application and profile layers need to reside
on the host MCU, thus keeping host
MCU memory requirements to a
minimum.
DVDD1
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/CC2570
CC2570 package.
General Characteristics
Parameter
Min
Typ
Max
Unit
Operating conditions
Frequency range
Data rate
2400
2507
MHz
—
—
kBaud
Operating voltage
2.0
—
3.6
V
Operating temperature
–40
—
85
ºC
Output power
–20
—
4
dBm
Receiver sensitivity
—
–85.8
—
dBm
Adjacent channel rejection, +2 MHz
—
23
—
dB
Adjacent channel rejection, –2 MHz
—
23
—
dB
Alternate channel rejection, +4 MHz
—
39
—
dB
Alternate channel rejection, –4 MHz
—
39
—
dB
Current consumption, RX
—
23.7
—
mA
Current consumption, TX, +4 dBm
—
34.3
—
mA
Current consumption, TX, 0 dBm
—
28.8
—
mA
Current consumption, power down
—
<1
—
μA
RX mode
Current consumption
24
Texas Instruments 1Q 2014
ZigBee® RF4CE
Ô ZigBee® RF4CE Overview
With the use of ZigBee® RF4CE radio
frequency (RF) technology, remote
control applications can operate
non-line-of-sight and provide more
advanced features based on
bidirectional communication.
ZigBee RF4CE advanced features for
remote control applications:
• Non line-of-sight control
• Longer range
• Richer communication
• Increased reliability
• Enhanced features and flexibility
• Interoperability
• Longer battery life
Application areas
• Remote controls
• Set-top boxes, TVs, Blu-Ray players
• 3D glasses
TI’s RF4CE solutions include:
• Mature and broad portfolio (thirdgeneration 802.15.4 SoC, RF4CE
golden platform)
• Market leading performance (bestin-class adjacent/alternate channel
rejection, lowest system power
consumption)
• System expertise (HW, SW, tools
experts, influential contributor to
RF4CE standard)
RemoTI™ is a complete hardware and
software solution for RF4CE remote
control applications. TI has a mature
and broad Portfolio (3rd generation
802.15.4 SoC and RF4CE golden
platform):
• Software: The industry-leading
RF4CE-compliant stack feature the
ZRC profile, a simple API, easy to
understand sample application code
and remote control reference design.
• Hardware: CC2533 System-onChip (SoC) optimized for IEEE
802.15.4-based remote-control
applications. The CC2533 enables
single-chip remote controls to
be built with lower power, higher
reliability and lower bill-of material
cost than alternative devices.
• Extensive worldwide support and
tools to ensure that development of
ZigBee RF4CE-based products is
simple, fast and can be completed at
minimal cost.
TI’s industry-leading ZigBee RF4CE
protocol stack
TI’s ZigBee RF4CE-compliant protocol
stack for remote control applications
is built on TI’s well proven IEEE
802.15.4 compliant TIMAC. It offers a
simple, easy-to-use, intuitive software
architectural framework and all of the
tools, documentation, and support
needed to build an RF4CE compliant
product.
The stack is compliant with the ZigBee
RF4CE specification and supports the
ZRC (ZigBee Remote Control) profile
and will support the upcoming ZID
(ZigBee Input Device) profile.
The latest RemoTI stack is
downloadable from the TI web site
without any royalty charge.
Key features
• CC2530, CC2531 (USB), and
CC2533 RF SoC and CC259x RF
front-end support
• Remote control and proprietary
profile support
• USB HID class support including
keyboard and consumer controls
pages
• Simple RemoTI API, or optional
direct RF4CE interface
• Complete sample application code
• UART, SPI, keypad, LED and other
driver support
• IR generation sample code for CC253x
• Easy-to-use development kits
www.ti.com/rf4ce
• WWW support
Wireless Connectivity Guide
25
Texas Instruments 1Q 2014
ZigBee® RF4CE
Ô CC2533
ZigBee® RF4CE System-on-Chip
CC2533
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/CC2533
Benefits
• Supports ZigBee RF4CE and
802.15.4-based solutions
• Excellent receiver sensitivity and
programmable output power
• Very-low current consumption in RX,
TX, and multiple low-power modes
ensure long battery lifetime
• Best-in-class selectivity and
blocking performance (50-dB ACR)
Applications
• Remote controls
• Set-top boxes, TVs, Blu-Ray players
• 3D glasses
• Smart Energy
Development tools and software
• REMOTI – RF4CE compliant
protocol stack
• CC2533DK-RF4CE-BA – CC2533
RF4CE Development Kit
• CC2533DK – CC2533
Development Kit
• CC2533EMK – CC2533 Evaluation
Module Kit
Wireless Connectivity Guide
Optional 32-kHz Crystal
C331
XTAL
C401
AVDD6 31
P2_4/XOSC32K_Q1 32
P2_2 34
P2_0 36
P2_1 35
P1_7 37
P1_6 38
DVDD1 39
2 SCL
3 SDA
P2_3/XOSC32K_Q2 33
1 NC
DCOUPL 40
C321
R301
RBIAS 30
AVDD4 29
AVDD1 28
4 NC
L252
C251
6 P1_4
CC2533
7 P1_3
DIE ATTACH PAD
RF_P 25
XOSC_Q1 22
19 P0_0
18 P0_1
17 P0_2
16 P0_3
15 P0_4
10 DVDD2
20 RESET_N
XOSC_Q2 23
14 P0_5
C261
L251
L261
AVDD3 24
9 P1_1
13 P0_6
C253
RF_N 26
8 P1_2
Antenna
(50 )
C252
AVDD2 27
5 P1_5
11 P1_0
Key features
• Up to 96-KB Flash with 20K erase
cycles to support over-the-air
updates, large applications
• Up to 6-KB RAM for complex
remote control applications
• Programmable output power up to
+7 dBm
• Less than 1-μA current consumption
in power down with sleep
timer running
• UART, I2C and SPI interfaces
• IR generation and modulation
engine
2-V to 3.6-V
Power Supply
12 P0_7
The CC2533 is a cost-effective, low
power, and true System-on-Chip
(SoC) solution specifically tailored to
IEEE 802.15.4/RF4CE applications.
The CC2533 comes in three different versions: CC2533-F32/64 with
32/64-KB Flash memory and 4 KB
of RAM and the CC2533-F96 with
96KB Flash and 6 KB of RAM. The
CC2533 combines a fully integrated
high-performance RF transceiver
with an industry-standard enhanced
8051 MCU and powerful supporting
features and peripherals.
C262
AVDD5 21
XTAL
Power-Supply Decoupling Capacitors Are Not Shown
Digital I/O Not Connected
C221
C231
S0383-02
CC2533 application circuit.
General Characteristics
Parameter
Min
Typ
Max
Unit
Frequency range
2394
—
2507
MHz
Operating temperature range
–40
—
125
ºC
Operating supply voltage
2.0
—
3.6
V
Radio bit rate
—
250
—
kBaud
Receiver sensitivity
—
–97
—
dBm
Adjacent channel rejection
—
49/49
—
dB
Alternate channel rejection
—
57/57
—
dB
Blocking
—
57/57
—
dB
Nominal output power in TX mode
—
+4.5
—
dBm
MCU active and RX mode
—
25
—
mA
MCU active and TX mode, +4 dBm
—
34
—
mA
Power mode 1
—
200
—
µA
Power mode 2
—
1
—
µA
Power mode 3
—
0.5
—
µA
From power mode 2 or 3 to active
—
120
—
µs
From active to RX or TX
—
192
—
µs
Operating conditions
Current consumption
Wake-up and timing
26
Texas Instruments 1Q 2014
PurePath™ Wireless Audio
Ô PurePath™ Wireless Audio Overview
PurePath™ Wireless Audio
By employing proprietary technology
called PurePath Wireless, the CC85xx
device family provides robust, highquality, short-range 2.4-GHz wireless
digital audio streaming in low-cost,
single-chip solutions.
Two or more devices form a PurePath
Wireless audio network. Great care has
been taken to ensure that this audio
network provides gap-less and robust
audio streaming in varied environments
and that it can coexist with existing
wireless technologies in the crowded
2.4-GHz ISM band.
Most applications can be implemented
without any software development
and only require the CC85xx to be
connected to an external audio source
or sink (such as an audio codec,
S/PDIF interface or class-D amplifier)
and a few push buttons, switches or
LED for human interaction. Advanced
applications can interface a host
processor or DSP directly to the
CC85xx and directly stream audio
and control most aspects of device
and audio network operation.
The PurePath Wireless Configurator,
a PC-based configuration tool, is used
to set up the desired functionality and
parameters of the target system and
then produces firmware images that
subsequently must be programmed
into the embedded Flash memory of
each CC85xx.
All devices in the CC85xx family
interface seamlessly with the CC2590
RF range extender device to allow for
even wider RF coverage and improved
robustness in difficult environments.
Built-in wireless audio protocol with
excellent robustness and coexistence
through multiple techniques:
Application areas
• Wireless headphones/headsets
• Wireless speaker systems
• Wireless signal cable replacement
• Wireless home theatre systems
• Adaptive frequency hopping
• Forward error correction
• Buffering and retransmission
• Error concealment
• Optional high-quality audio
compression
Wireless headphone/headset design
Wireless 25W Li-ion powered
speaker design
• Cost-optimized design with 100%
TI content
• Uses CC8520, TAS5727, BQ24610 (Li-Ion charger), LM2842Y (step-down DC/DC)
• 2× longer battery life than typical headphone (22hr on 465mah battery)
• Well suited for high-quality headphones/headsets
• Design files available from TI
Wireless Connectivity Guide
Digital audio support
• CD-quality uncompressed audio
(44.1/48 KHz, 16/24 bits)
• Digital I2S audio interface supports
1–2 audio channels (CC852x) or
3–4 audio channels (CC853x) at
sample rates of 32, 40.275, 44.1 and
48-kHz/16-bit word-widths
• Audio latency less than 20 ms
• Data side-channel allows data to be
sent alongside the audio between
external host controllers
27
• Targets ~20h playback (2 aHr @ CD quality)
• Well suited for PC/portable speakers
• iPhone RC application available (with Bluetooth low energy)
Texas Instruments 1Q 2014
PurePath™ Wireless Audio
Ô CC8520
PurePath™ Wireless 2.4-GHz RF System-on-Chip for Wireless Digital Audio Streaming
CC8520
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/CC8520
Key features
• Embedded audio network protocol
with state-of-the art error correction
and concealment techniques
• Uncompressed wireless 44.1/48 kHz
stereo audio
• Autonomous operation
• Free PurePath Wireless Configurator
PC tool
CC85xx
GIO4_MCLK
Audio clock
generator
GIO5_BCLK
Audio co-processor
GIO7_AD0
GIO8_AD1
Serial audio interface
GIO9_AD2
USBP
Full-speed USB function
USBM
CS_N
SCLK
MOSI
GIO0_MISO
GIO10_SCL
Applications
• Wireless headphones/headsets
• Wireless speaker systems
• Wireless signal cable replacement
• Wireless home theatre systems
GIO1
GIO3
Boot ROM (4 kB)
Radio co-processor
GIO13
XLNAEN
RAM (24 kB)
XPAEN
Battery voltage
monitor
VBAT
DCPL
Radio Timer
Voltage
supervisor
DAC
LPF
DAC
LPF
Freq Synth
PA
RF_P
Clock & reset
control
Freq synth
RF_N
ADC
AAF
ADC
AAF
LNA
Crystal oscillator
XO2
Modem
Radio analog/digital interface
Digital voltage
regulator
DVDD
CC8520 block diagram.
General Characteristics
CC8520
CC8521
CC8530
Number of wireless audio channels
2
2
4
4
Power consumption (RX) (mA)
25
25
25
25
Power consumption (TX) (mA)
29
29
29
29
Standby current (µA)
1
1
1
1
Data rate (max, Mbps)
5
5
5
5
2.4 GHz
2.4 GHz
2.4 GHz
2.4 GHz
Digital I2S
USB Full Speed
Digital I2S
USB Full Speed
Frequency range
Audio I/O
Wireless Connectivity Guide
Main CPU
Flash (32 kB)
GIO2
XO1
Development tools and software
• CC85XXDK Development Kit
• PurePath wireless configurator PC
tool: www.ti.com/ppwc
• CC85XXDK-HEADSET and PurePath
Wireless Commander www.ti.com/
tool/purepath-wl-cmd
SPI slave interface
I2C master interface
GIO11_SDA
GIO12
Benefits
• No dropouts during audio playback
• Well suited for hi-fi audio systems
• No microcontroller or external
memory needed
• Fast development time with no
software development needed
Audio PLL
GIO6_WCLK
Digital I/O Multiplexer
The CC8520 is used to build a lossless
wireless audio link. One CC8520 acts
as audio source and the other as
audio sink. I2S data is taken as input
on the audio source side, audio data
is transmitted without loss to the audio
sink which then outputs the I2S
audio data.
28
CC8531
Texas Instruments 1Q 2014
GPS
Ô CC4000-TC6000GN
SimpleLink™ GNS GPS Module
CC4000-TC6000GN
Get samples, evaluation modules and application notes at: www.ti.com/product/cc4000-tc6000gn
The following product brief applies to the
TC6000GN – a highly-integrated GPS
module offered by GNS using
Texas Instruments’ SimpleLink™
GPS CC4000. The GNS TC6000GN
module enables applications benefitting
from precise time, location, and/or
velocity data. This solution provides
industry standard NMEA protocol data
for accurate time, position, latitude,
longitude, satellite status, course
and speed. This solution provides
industry standard NMEA protocol data
for accurate time, position, latitude,
longitude, satellite status, course and
speed. Autonomous warm start and hot
start are enabled by on-board memory,
improving start-up performance. A single
GPIO is used to initiate a GPS fix (Pushto-fix), activating power management
for active and deep sleep modes.
Applications requiring high precision
timing benefit from an independent
programmable PPS generator. Further,
the GPS driver and firmware is fully
integrated into the module, greatly
minimizing loading on the host CPU, and
reducing system complexity. This allows
GPS functionality to simply integrate
with very small MCUs and MPUs. This
solution is provided as a module to
help customers reduce development
time, lower manufacturing costs, save
board space, and minimize RF and GPS
expertise required.
Key features
• GPS driver and firmware fully
­integrated into module
• Industry-standard NMEA 0183
interface protocol communication
• Protocol communication NMEA
provides
Time
Position
Speed
Satellite status
Course
• Performance:
Autonomous cold start TTFF
35 seconds in open sky signal
conditions
Autonomous hot start TTFF
~ 1 second in open sky signal
conditions
Tracking accuracy better than
3 meters
Wireless Connectivity Guide
Host Controller
GPS Subsystem
EEPROM
26MHz TCXO
RTC Clock
CC4000
MCU
or MPU
Level
Shifter
UART
VBAT
1.8V
DC2DC
CC4000-TC6000GN GPS system diagram.
• GPS tracking sensitivity of –162 dBm
• Push-to-fix: Single GPIO activates
power management for active and
deep-sleep modes
• Pulse-per-second (PPS) generator:
Independent output for high precision
timing applications with accuracy
<100ns (nominal)
Benefits
• Fully integrated GPS solution
• Standard NMEA protocol
­communication
• GPS tracking sensitivity –162dBm
• Very small package
• One single power supply
• Low power consumption
• Integrated LNA and TCXO
Applications
• Asset tracking
• Industrial M2M
• Portable navigation
• Fitness / health / medical
• Precision timing
Development tools and software
• CC4000GPSEM module and board
• Sample software for
MSP-EXP430FR5529 Development
Platform
www.ti.com/tool/cc4000gpsem
General Characteristics
Receiver Frequency
CC4000
Unit
1575.42
MHz
Operating voltage
1.7 to 1.95
V
I/O operating voltage
1.65 to 1.92
V
–40°C to + 85
°C
Sensitivity
–162
–147 (autonomous)
–155 (assisted)
dBm
Current consumption
80µA (sleep), 68mA
(acquisition)
Operating temperature
Interfaces
UART
Internet crystal frequency
Size
29
26
MHz
10.0 × 9.3 × 2.3
mm3
Texas Instruments 1Q 2014
Sub
1-GHz
Sub-1
GHz
➔ CC430
Ô
Integrated RF System-on-Chip Solution (MSP430™ microcontroller+ CC1101 radio)
CC430
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/CC430
See also: www.ti.com/CC430
CC430F61xx/
CC430F51xx
RF Microcontrollers
The CC430 family of ultra-low-power
microcontroller System-on-Chip
(SoC),
with integrated CC1101 RF
(SoC),withintegratedCC1101RF
transceiver core, consists of several
devices featuring different sets of
peripherals, targeted for a wide range
of applications. The architecture,
combined with up to seven low-power
modes, is optimized to achieve
extended battery life in portable
measurement applications. The device
features the powerful MSP430™
16-bit RISC CPU, 16-bit registers, and
constant generators that contribute to
maximum code efficiency. The CC430
family provides a tight integration
between the microcontroller core,
its peripherals, software, and the
RF transceiver, making these true
SoC solutions easy to use as well as
improving performance.
Key features
Features
• Integrates
MSP430 MCU and
IntegratesMSP430MCUand
CC1101 RF transceiver
• As
low as 1μA current consumption
Aslowas1μAcurrentconsumption
with state retention, 1.7 µA standby
current
with real time clock (RTC)
currentwithrealtimeclock(RTC)and
and
180µA/MHz
active
current
180µA/MHz
active
current
• AES-128
hardware module
AES128hardwaremodule
• Code
compatibility with existing
Codecompatibilitywithexisting
MSP430 and free RF software
available
• 10and 12-bit A/D converter options
10and12-bitA/Dconverteroptions
Benefits
• Save
space and components in
Savespaceandcomponentsin
design
• Extended
battery life in portable
Extendedbatterylifeinportable
applications
• Secure
RF transmissions
SecureRFtransmissions
• Shorter
design time with code re-use
Shorterdesigntimewithcodere-use
Applications
• Low
power RF sensors and energy
LowpowerRFsensorsandenergy
harvesting monitors
• Home
security and automation
Homesecurityandautomation
• Sports
and health monitoring
Sportsandhealthmonitoring
• Wireless
networks targeting IEEE
WirelessnetworkstargetingIEEE
802.15.4g standard
Wireless Connectivity Guide
Guide
Memory
Power and Clocking
Unified Clock System:
8/16/32kB Flash
FLL
REFO
LFXT1
2 / 4KB RAM
16-bit RISC
Orthogonal
MCU
20 MHz
Debug
PMM:
Real-Time JTAG
Embedded Emulation
Boot Strap Loader
Peripherals
VLO
DCO
XT2
POR
SVS
LDR
BOR
SVM
Timers
15-/16-bit Watch Dog Timer
16-bit Basic Timer
Integrated CC1101 RF Transceiver
AES128 Encryption/Decryption
Comparator B with 16-ch Analog MUX
3-ch Internal DMA
CRC16 Data Checking Module
16-bit Timer A5, with 5 CC Registers
16-bit Timer A3, with 3 CC Registers
Real-Time Counter
96-Segment LCD Drive (F61xx only)
Serial Interface
1 x USCI_A (UART/SPI/IrDA)
1 x USCI_B (I2C/SPI)
Converters
Connectivity
10/12-bit A/D Converter
44 I/O (F61xx); 30 I/O (F513x)
CC430 block diagram.
Development Tools
Software
tools and software
• eZ430-Chronoswirelesswatch
eZ430-Chronos wireless watch
development tool
• CC430F5137andCC430F6137
CC430F5137 and CC430F6137
wireless development tools
• CC430F6147wireless
CC430F6147 wireless development
developmenttool(withDC-DC
tool (with DC-DC converter & LCD)
converter&LCD)
• SupportedbyIntegrated
Supported by Integrated DevelopDevelopment
Environments
ment Environments
(IDEs) from TI
(IDEs)fromTIandthirdparties
and third parties including Code
including
Composer
ComposerCode
Studio™
IDE (CCStudio)
Studio(CCS)andIAREmbedded
and IAR Embedded Workbench for
Workbench
forIAR
MSP430
from
MSP430 from
Systems.
IAR Systems.
General Characteristics
CC430F51xx
CC430F51xx
CC430F61xx
CC430F61xx
RF frequency bands
300-348MHz,
387-464MHz,
779-928MHz
300–348MHz,
387–464MHz,
779–928MHz
300-348MHz,387–464MHz,
387-464MHz,779–928MHz
779-928MHz
300–348MHz,
ADC
Optional
10-bit
or 12-bit
Optional
10-bit
SAR,SAR,
or 12-bit
SAR SAR
10-bitSAR,
SAR,12-bit
12-bitSAR
SARoptional
optional
10-bit
RAM
2 - 4KB
2–4KB
2 - 4KB
2–4KB
Flash
8-32KB
8–32KB
8 -32
8–32
KBKB
Pin/package
48VQFN
48VQFN
64VQFN
64VQFN
GPIO
30 30
4444
Peripherals
CC1101
RF Transceiver,
32-bit
HW Multi,
CC1101RFRFTransceiver,
Transceiver,32-bit
32-bitHW
HWMulti,
Multi, A/
CC1101
CC1101
RF Transceiver,
32-bit
HW Multi,
A/Sync
Comm
AES-128
En/
Sync Serial Comm USCI, AES-128 En/Decrypt,
A/Sync
SerialSerial
Comm
USCI,USCI,
AES-128
En/Decrypt,
A/Sync
Decrypt,
DMA, RTC,
Universal Clock CRC16,
CRC16,DMA,
DMA,RTC,
RTC,Universal
Universalclock
Clock
CRC16,
DMA,CRC16,
RTC, Universal
clock
LCD segments
NA NA
9696
Interface
2
1 USCI
(UART/IrDA/SPI/I
C) 2C) 1 USCI
(UART/IrDA/SPI/I
2 2C) USCI
(UART/IrDA/SPI/I
1 1
USCI
(UART/IrDA/SPI/I
C)
Timers
1 16-bit
(3CCR) , 1
(5CCR) , 1
1 16-bit
(3CCR), 1
16-bit16-bit
(5CCR), Watchdog ,
1 RTC 1 Watchdog,
1 RTC 16-bit
(3CCR), 1
16-bit
(5CCR), 1
1 1
16-bit
(3CCR), 1
16-bit
(5CCR), 1 RTC 1 Watchdog ,
Watchdog, 1 RTC
Temp sensor
Yes Yes Yes Yes
Brown out reset
Yes Yes Yes Yes 32
30
Texas Instruments 4Q
1Q 2012
2014
Sub-1 GHz
Ô CC1100E
Integrated Multi-Channel RF Transceiver
CC1100E
Get samples, datasheets, evaluation modules and application notes at: www.ti.com/sc/device/CC1100E
Benefits
• Fast development time and low
­system cost
• Flexible optimization of range power
• Enables use of inexpensive
microcontroller
• Enables adaptive channel selection with increased robustness and
­coexistence of the wireless link
• Small size solution
Applications
• Automatic meter reading
• Active RFID
Wireless Connectivity Guide
16
RBIAS
GND
17
AVDD
15
2
SO (GD01) CC1100E AVDD
GD02 DIE ATTACH PAD: RF_N
DVDD
RF_P
DCOUPL
AVDD
14
5
6
CSn
XOSC_Q1
AVDD
XOSC_Q2
SCLK
4
C51
18
1
3
(Optional)
19
R171
SI
GND
DGUARD
20
GDO0
Key features
• Sub-1 GHz FSK/GFSK/MSK/
ASK/OOK RF Transceiver
• 1.2 to 500-kBaud data rate
• Low-power, low system cost
• Sleep current: –200 nA
• 90-µs PLL lock time: –240 µs from
sleep to RX/TX
• On-chip support for sync word
detection, address check, flexible
packet length and automatic CRC
checking
• Separate 64-Byte RX and TX data
FIFOs (enable burst mode data
transmission)
• Suitable for systems targeting
Japanese ARIB STD-T96 and
­Chinese short range device regulations at 470–510 MHz
1.8 V to 3.6 V Power Supply
Digital Interface
Integrated solution provides low cost
and high performance
The CC110E is a highly integrated,
multi-channel RF transceiver designed
for low-power wireless applications in
the 470-MHz and 950-MHz ISM bands.
7
8
9
Antenna
(50 Ω)
C131
L131
13
C125
C121 L122
12
11
L121
L123
C122 C123
C124
10
XTAL
(Optional)
C81
For quicker integration
use a Chip Balun from
our third party developer.
C101
CC1100E application circuit.
General Characteristics
Parameter
(433/868 MHz, 3.0 V, 25°C)
Min
Typ
Max
Unit
Condition
Operating conditions:
Frequency range
Operating temperature range
470
—
510
MHz
950
—
960
MHz
–40
—
+85
ºC
Operating supply voltage
1.8
—
3.6
V
Data rate (programmable)
1.2
—
500
kBaud
Output power (programmable)
–30
—
+12
dBm
Receiver sensitivity, 1.2 kBaud
—
–112
—
dBm
1% packet error rate
Power consumption
Current consumption RX
—
16
—
mA
Input well above sensitivity limit
Current consumption TX
—
—
15.0
30.0
—
—
mA
mA
0 dBm
12 dBm
Current consumption, power down
—
<1
—
µA
31
Texas Instruments 1Q 2014
Sub-1 GHz
Ô CC1101
Integrated Multi-Channel RF Transceiver
CC1101
Get samples, datasheets, evaluation modules and application notes at: www.ti.com/sc/device/CC1101
See also: www.ti.com/product/tps62730
Key features
• Sub-1 GHz FSK/GFSK/MSK/ASK/
OOK RF transceiver
• 1.2 to 500-kBaud data rate
• Low-power, low system cost
• Sleep current: 200 nA
• 90-µs PLL lock time: 240 µs from
sleep to RX/TX
• On-chip support for sync word
detection, address check, flexible
packet length and automatic CRC
checking
• Separate 64-Byte RX and TX data
FIFOs (enable burst mode data
transmission)
• Suitable for systems targeting
compliance with EN 300 200
­(Europe) and FCC CFR Part 15 (U.S.)
Benefits
• Fast development time and low
system cost
• Flexible optimization of range power
• Enables use of inexpensive
microcontroller
• Enables adaptive channel selection
with increased robustness and
coexistence of the wireless link
• Small size solution
Applications
• Wireless alarm and security systems
• Automatic meter reading
• Industrial monitoring and control
• Home and building automation
• Wireless networks targeting IEEE
802.15.4g standard
Wireless Connectivity Guide
1.8 V to 3.6 V Power Supply
2
3
(Optional)
4
5
C51
18
17
16
SCLK
SO (GD01) CC1101
GD02 DIE ATTACH PAD:
DVDD
DCOUPL
GDO0
CSn
XOSC_Q1
AVDD
XOSC_Q2
1
19
R171
SI
GND
DGUARD
RBIAS
GND
20
Digital Interface
Integrated solution provides low cost
and high performance
The CC1101 is a highly integrated, multichannel RF transceiver designed for
low-power wireless applications in the
315/433/868/915-MHz ISM bands. The
CC1101 is an upgrade of the CC1100
transceiver with improvements for
spurious response, close-in phase noise,
input saturation level, output power
ramping and extended frequency range.
6
7
8
9
AVDD
AVDD
RF_N
RF_P
AVDD
15
Antenna
(50 Ω)
C131
L131
14
13
C125
C121 L122
12
11
L121
L123
C122 C123
C124
10
XTAL
(Optional)
C81
For quicker integration
use a Chip Balun from
our third party developer.
C101
The CC1101 is pin and register compatible with the 2.4-GHz CC2500 transceiver. Please see 68.
Development tools and software
• CC1101DK-433 MHz
Development Kit
• CC1101DK-868/915 MHz
Development Kit
• CC1101EMK-433 MHz Evaluation
Module Kit
• CC1101EMK-868/915 MHz
Evaluation Module Kit
• SimpliciTI™ software protocol
• Wireless M-Bus
General Characteristics
Parameter
(433/868 MHz, 3.0 V, 25°C)
Min
Typ
Max
Unit
Condition
Operating conditions:
Frequency range
Operating temperature range
300
—
348
MHz
387
—
464
MHz
779
—
928
MHz
–40
—
+85
ºC
Operating supply voltage
1.8
—
3.6
V
Data rate (programmable)
1.2
—
500
kBaud
Output power (programmable)
–30
—
+12
dBm
Receiver sensitivity, 1.2 kBaud
—
–113
—
dBm
1.2 kBaud, 868 MHz, 1% packet error rate
Power consumption
Current consumption RX, 868 MHz
—
14.7
—
mA
Input well above sensitivity limit
Current consumption TX
—
—
15.0
30.0
—
—
mA
mA
0 dBm
12 dBm
Current consumption, power down
—
<1
—
µA
As part of the CC1101 family, the CC1101-Q1 (Transceiver), CC1131-Q1 (Receiver)
and CC1151-Q1 (Transmitter) are available as automotive-qualified versions
in accordance to AEC-Q100 Grade 1. All three parts come in a pin-to-pin and
software-compatible 5×5-mm QFN-32 package and offer an extended temperature
range from –40 to +125°C, tighter specification values and guaranteed sensitivity
values. See 36 for more information.
32
Texas Instruments 1Q 2014
Sub-1 GHz
Ô CC1101-Q1
Sub-1-GHz Automotive-Qualified RF Transceiver
CC1101-Q1
Get samples, datasheets, evaluation modules and application notes at: www.ti.com/sc/device/CC1101-q1
Benefits
• Fast development time and low
system cost
• Flexible optimization of range power
• Enables use of inexpensive
microcontroller
• Enables adaptive channel selection
with increased robustness and
coexistence of the wireless link
• Easy system scaling from unidirectional to bidirectional systems
through compatible device family
C31
28 GDO2
29 GND
NC 17
GND 19
AVDD_CHP 18
RBIAS 20
Antenna
(50 )
NC 16
AVDD_RF3 15
CC11x1-Q1
AVDD_RF2 11
GND 10
C122
L123
C125
C123
C124
C121
8 GND
7 XOSC_Q2
6 AVDD_IF
L122
L121
AVDD_RF1 9
4 CS
C51
L131
RF_P 12
31 DVDD2
32 DCOUPL1
C131
GND 14
RF_N 13
30 DVDD1
5 XOSC_Q1
C21
AVDD_GUARD 21
26 SO (GDO1)
27 NC/GND
GDO2
SI 23
25 SCLK
3 GDO0(ATEST)
SCLK
SO (GDO1)
AGND_GUARD 22
N C 24
SI
2 DCOUPL2
Key features
• Sub-1 GHz FSK/GFSK/MSK/ASK/
OOK RF transceiver
• 1.2 to 250-kBaud data rate
• Low-power, low system cost
• Sleep current: 700 nA
• 90-μs PLL lock time: 240 μs from
sleep to RX/TX
• On-chip support for sync word
detection, address check, flexible
packet length and automatic CRC
checking
• Separate 64-Byte RX and TX data
FIFOs (enable burst mode data
transmission)
• Suitable for systems targeting
compliance with EN 300 200
(Europe) and FCC CFR Part 15 (U.S.)
R171
VDD
1 GND
Integrated solution provides high
performance. The CC1101-Q1 is a highly
integrated, multichannel RF transceiver
designed for low-power wireless
applications in the 315/433/868/915MHz ISM bands. The CC1101-Q1 is
the automotive derivate of the CC1101
transceiver qualified in accordance to
AEC-Q100 with extended electrical
specification and extended temperature
range up to +125°C.
C41
GDO0
XTAL
CS
C81
C101
The CC1101-Q1 is register compatible with the CC1101 transceiver.
Development tools and software
• CC1101DK-433 MHz Development Kit
• CC1101DK-868/915 MHz Development Kit
• SimpliciTI™ software protocol
General Characteristics
Parameter (315, 433MHz, 3V, 25ºC)
Min
Typ
Max
Unit
310
—
348
MHz
387
—
464
MHz
Operating conditions:
Frequency range
779
—
928
MHz
Operating temperature
–40
—
125
ºC
Operating voltage
1.8
—
3.6
V
Data rate (programmable)
1.2
—
250
kBaud
Output power (programmable)
–30
—
+12
dBm
Receiver sensitivity, 1.2 kBaud
—
–114
—
dBm
Current consumption, RX
—
15.5
—
mA
Current consumption, TX, +10 dBm
—
29.5
—
mA
Current consumption, TX, 0 dBm
—
14.6
—
mA
Current consumption
Applications
• Remote keyless entry
• Passive entry and passive start
• TPMS receiver
• Garage door opener
• High-temperature sensors
Wireless Connectivity Guide
33
Texas Instruments 1Q 2014
Sub-1 GHz
Ô CC1110
RF System-on-Chip Solution
CC1110F8/F16/F32
Get samples, datasheets, evaluation modules and application notes at: www.ti.com/product/cc1110f32
See also: www.ti.com/product/tps62730
Key features
• High-performance, low-power 8051
MCU core, typically with 8× the performance of a standard 8051
• Utilizes the high-performance
CC1101 RF transceiver core
• 8/16/32-kB in-system
programmable Flash
• 1/2/4-kB SRAM (with data retention
in all power modes)
• 8- to 12-bit ADC, 21 general purpose
I/O pins, on-chip timers
• Very few external components
required
• Four flexible power modes for
reduced power consumption
• Very fast transition times from sleep
modes to active mode enables
ultra-low average power consumption
in low duty-cycle systems
• In deep-sleep modes the system can
wake up on external interrupts or
real-time counter events
• Low current consumption
• AES-128 encryption coprocessor
• Powerful DMA functionality
• Real-time clock with low-power
32.768-kHz crystal oscillator or internal 34-kHz RC Oscillator
Benefits
• Complete solution on one single chip
• Ideal for low-power, battery
operated systems
• Robust and secure link with very
good coexistence
Wireless Connectivity Guide
C301
36 35 34 33 32 31 30 29 28
P1_3
P1_4
P1_5
P1_6
P1_7
RESET_N
DCOUPL
AVDD_DREG
GUARD
1
2
3
4
5
6
7
8
9
P1_2
DVDD
P1_1
P1_0
P1_0
P0_1
P0_2
P0_3
P0_4
R271
R_BIAS
AVDD
AVDD
RF_N
RF_P
AVDD
27
26
25
24
23
22
XOSC_Q1
21
XOSC_Q2
20
AVDD
19
CC1110
DVDD
PO_5
PO_6
PO_7
P2_0
P2_1
P2_2
P2_4/XOSC32_Q1
P2_4/XOSC32_Q2
Radio, MCU and Flash
all-in-one chip
The CC1110Fx family consists of
three Systems-on-Chip designed for
low-power and low-voltage wireless
communication applications. With
a 315/433/868/915-MHz radio
transceiver, a single-cycle 8051 MCU,
8/16/32-kB Flash memory and
additional peripherals, these unique
all-in-one devices make it easier than
ever to finish your design faster while
offering numerous application
possibilities.
2.0 V to 3.6 V
Power Supply
C241
L241
L231 C231
X1
X2
L233
C232
C235
C233
C211
C201
AGND
Exposed Die
Attached Pad
Optional:
C171
L232
C234
10 11 12 13 14 15 16 17 18
For 2.4-GHz alternative, see
Antenna
(50 Ω)
For quicker integration use a
Chip Balun from our third party
developer.
C181
CC2510, 68.
Applications
• Alarm and security
• Automatic meter reader/
smart metering
• Consumer electronics
• Wireless networks targeting
IEEE 802.15.4g standard
Development tools and software
• CC1110/CC1111DK
Development Kit
• CC1110EMK-433 MHz Evaluation
Module Kit
• CC1110EMK-868/915 MHz
Evaluation Module Kit
• SimpliciTI™ software protocol
• Wireless M-Bus
• CC1110DK-MINI
General Characteristics
Parameter
(433/868 MHz, 3.0 V, 25°C)
Min
Typ
Max
Unit
Condition
Operating conditions
Frequency range
300
—
348
MHz
391
—
464
MHz
782
—
928
MHz
Operating temperature range
–40
—
+85
ºC
Operating supply voltage
2.0
—
3.6
V
Data rate (programmable)
1.2
—
500
kBaud
Output power (programmable)
–30
—
10
dBm
Receiver sensitivity
—
–111
—
dBm
1.2 kBaud, 868 MHz, 1% packet error rate
MCU active and RX mode
—
17
—
mA
System clock at 203 kHz
MCU active and TX mode, 0 dBm
—
20/21
—
mA
MCU running at full speed (26 MHz), radio in TX
mode, 0-dBm output power
Power mode 2
—
0.5
—
µA
32 kHz RC-oscillator (or 32.768-kHz crystal
oscillator) and sleep timer running
Power mode 3
—
0.3
—
µA
No clocks running, power On Reset (POR) active, can
wake up on external interrupt
From power mode 2 or 3 to active
—
100
—
µs
Digital regulator and high-speed oscillators off,
start-up of regulator and high-speed RC Oscillator
From active to RX or TX
—
90
—
µs
Time from enabling 26-MHz crystal oscillator and the
radio part until RX or TX starts
Current consumption
Wake-up and timing
34
Texas Instruments 1Q 2014
Sub-1 GHz
Ô CC1111
RF System-on-Chip with Integrated Full-Speed USB Controller
CC1111F8/F16/F32
Get samples, datasheets, evaluation modules and application notes at: www.ti.com/sc/device/CC1111F8
Key features
• Full-speed USB 2.0 with 1-kB USB
FIFO, 12-Mbps transfer rate,
five bidirectional endpoints with
support for bulk, interrupt and
isochronous transfers
• Sub-1 GHz RF transceiver identical
to the CC1101:
Highly configurable with support
for 1.2- to 500-kBaud data rate
and FSK, MSK, GFSK and OOK/
ASK modulation
• Very low current consumption:
0.3 µA in lowest power mode
• 8/16/32-kB in-system programmable Flash
• 1/2/4-kB SRAM (with data retention
in all power modes)
• Excellent receiver sensitivity and
robustness
• 128-bit AES supported in hardware
coprocessor
• 8-channel, 8- to 14-bit ADC with up
to eight inputs
• Industry standard I2S interface for
digital audio data, full-duplex, mono
and stereo support, configurable
sample rate and sample size
• Direct memory access which
reduces MCU load
R263
C301
Optional:
RBAS
CC1111
XOSC_02
AVDD
R262
AVD0
AVDO
RF_N
RF_P
AVDD
XOSC32_01
D+
D–
2.12 DVDD
10 DP
11 DM
30 DCOUPL
28 27
GUARD
R264
29
AVDO_DREG
4.P1_0
R271
XOSC32_02
The CC1111 is a System-on-Chip
(SoC) with USB controller for lowpower wireless applications in the
315/433/868/915-MHz frequency
bands. The CC1111 combines the
excellent performance of the industryleading CC1101 RF transceiver with
an enhanced MCU, full-speed USB
2.0, 32-kByte Flash memory, 4-kBytes
RAM, 128-bit AES hardware encryption
and many other powerful features.
3.0 V to 3.6 V Power Supply
18
17
20 19 21
C181 C171
C203
26
25
24
23
22
L131
C131
L132
Antenna
(50 Ω)
L123
L124
C125
C121
L121
XOSC_01
Radio, MCU, Flash and
USB all-in-one chip
C122
L122
C123
C124
X3
X2
C214
CC1111 application circuit.
Benefits
• Complete solution on one single
chip
• Ideal for low-power battery operated
systems
• Robust and secure link with very
good coexistence
• Powerful and flexible development
tools and reference designs available
General Characteristics
Applications
• Alarm and security applications
• Automatic meter reading
• Industrial monitoring and control
• Home and building automation
Development tools and software
• CC1110/CC1111DK
Development Kit
• CC1111EMK-868/915
Evaluation Module Kit
• SimpliciTI™ software protocol
Parameter
(433/868 MHz, 3.0 V, 25°C)
Min
Typ
Max
Unit
300
—
348
MHz
391
—
464
MHz
782
—
928
MHz
0
—
85
°C
Operating supply voltage
3.0
—
3.6
V
Data rate (programmable)
1.2
—
500
kBaud
Output power (programmable)
–30
—
10
dBm
Receiver sensitivity
—
–110
—
dBm
Condition
Operating conditions
Frequency range
Operating temperature range
1.2 kBaud, 1% packet error rate
Current consumption
MCU active and RX mode
—
19
—
mA
MCU active and TX mode, 0 dBm
—
20/21
—
mA
Power mode 2
—
0.5
—
µA
Power mode 3
—
0.3
—
µA
From power mode 2 or 3 to active
—
100
—
µs
Digital regulator and high-speed oscillators off,
start-up of regulator and high-speed RC oscillator
From active to RX or TX
—
90
—
µs
Time from enabling 26-MHz crystal oscillator and
the radio part until RX or TX starts
Wake-up and timing
Wireless Connectivity Guide
35
Texas Instruments 1Q 2014
Sub-1 GHz
Ô CC1131-Q1
Sub-1-GHz Automotive-Qualified RF Receiver
CC1131-Q1
Get samples, datasheets, evaluation modules and application notes at: www.ti.com/sc/device/CC1131-q1
Benefits
• Fast development time and low
system cost
• Flexible optimization of range power
• Enables use of inexpensive
microcontroller
• Enables adaptive channel selection
with increased robustness and
coexistence of the wireless link
• Easy system scaling from unidirectional to bidirectional systems
through compatible device family
C31
28 GDO2
29 GND
NC 17
GND 19
AVDD_CHP 18
RBIAS 20
Antenna
(50 )
NC 16
AVDD_RF3 15
CC11x1-Q1
AVDD_RF2 11
GND 10
C122
L123
C125
C123
C124
C121
8 GND
7 XOSC_Q2
6 AVDD_IF
L122
L121
AVDD_RF1 9
4 CS
C51
L131
RF_P 12
31 DVDD2
32 DCOUPL1
C131
GND 14
RF_N 13
30 DVDD1
5 XOSC_Q1
C21
AVDD_GUARD 21
26 SO (GDO1)
27 NC/GND
GDO2
SI 23
25 SCLK
3 GDO0(ATEST)
SCLK
SO (GDO1)
AGND_GUARD 22
N C 24
SI
2 DCOUPL2
Key features
• Sub-1 GHz FSK/GFSK/MSK/ASK/
OOK RF receiver
• 1.2- to 250-kBaud data rate
• Low-power, low system cost
• Sleep current: 700 nA
• 90-μs PLL lock time: 240 μs from
sleep to RX
• On-chip support for sync word
detection, address check, flexible
packet length and automatic CRC
checking
• 64-Byte RX data FIFOs (enable burst
mode data reception)
• Suitable for systems targeting compliance with EN 300 200 (Europe)
and FCC CFR Part 15 (U.S.)
R171
VDD
1 GND
Integrated solution provides high
performance. The CC1131-Q1 is a
highly integrated, multichannel RF
receiver designed for low-power wireless
applications in the 315/433/868/915-MHz
ISM bands. The CC1131-Q1 is the
receiver only derivate of the CC1101-Q1
transceiver qualified in accordance to
AEC-Q100 with extended electrical
specification and extended temperature
range up to +125°C.
C41
GDO0
XTAL
CS
C81
C101
The CC1131-Q1 is register compatible with the CC1101-Q1 transceiver.
Development tools and software
• CC1101DK-433 MHz Development Kit
• CC1101DK-868/915 MHz Development Kit
• SimpliciTI™ software protocol
General Characteristics
Parameter (315, 433MHz, 3V, 25ºC)
Min
Typ
Max
Unit
310
—
348
MHz
387
—
464
MHz
779
—
928
MHz
Operating temperature
–40
—
125
ºC
Operating voltage
1.8
—
3.6
V
Data rate (programmable)
1.2
—
250
kBaud
Receiver sensitivity, 1.2kBaud
—
–114
—
dBm
—
15.5
—
mA
Operating conditions:
Frequency range
Current consumption
Current consumption, RX
Applications
• Remote keyless entry
• Passive entry and passive start
• TPMS receiver
• Garage door opener
• High-temperature sensors
Wireless Connectivity Guide
36
Texas Instruments 1Q 2014
Sub-1 GHz
Ô CC1150
Multi-Channel RF Transmitter
CC1150
Get samples, datasheets, evaluation modules and application notes at: www.ti.com/sc/device/CC1150
Integrated solution provides
low cost and high performance
Benefits
• Fast development time and low
system cost
• Flexible optimization of range
versus power
• Enables use of inexpensive
microcontroller
• Small solution size
AVDD
RBIAS
SI
SCLK
1 SCLK
SO
2 SO (GD01)
(GDO1)
DGUARD
16 15 14 13
CC1150
AVDD 12
RF_N 11
GDO0
GDO0 (Optional)
XOSC_Q2
C41
AVDD
3 DVDD DIE ATTACH PAD: RF_P 10
CSn 9
4 DCOUPL
XOSC_Q1
Key features
• Best-in-class price/performance
ratio
• Many powerful digital features:
Full packet handling including
preamble generation, sync word
insertion, flexible packet length
and automatic CRC generation
• Reference design with two-layer
PCB with all components mounted
on the same side
• Programmable high data rate from
1.2 to 500 kBaud
• Programmable output power up to
+12 dBm
• Low-transmit current consumption
• Fast startup time (0.3 µs)
• Packaging: very small footprint
4×4 mm, 20-pin QLP package
R141
SI
Digital Interface
The CC1150 is a highly integrated,
multi-channel RF transmitter designed
for low-power wireless applications in
the 315/433/868/915-MHz ISM band.
1.8 V to 3.6 V Power Supply
5
6
7
8
CSn
Antenna
(50 Ω)
C111
L111
C101
L101
L102
L103
C102
C105
C103
C104
XTAL
C51
C71
CC1150 application circuit.
General Characteristics
Parameter
(433/868 MHz, 3.0 V, 25°C)
Min
Typ
Max
Unit
300
—
348
MHz
Operating conditions
Frequency range
400
—
464
MHz
800
—
928
MHz
Output power (programmable)
–30
—
+10
dBm
Operating temperature range
–40
—
+85
°C
Operating supply voltage
1.8
—
3.6
V
Data rate (programmable)
1.2
—
500
kBaud
Power consumption
Current consumption TX, (+10 dBm) 433 MHz
—
26.4
—
mA
Current consumption TX, (0 dBm) 433 MHz
—
14.9
—
mA
Current consumption, power down
—
<1
—
µA
Applications
• Home and building automation
• Automatic meter reading
• Wireless alarm and security systems
• Industrial monitoring and control
• Wireless sensor networks
• Consumer electronics
Development tools and software
• CC1101DK-868/915 MHz Evaluation
Module Kit
• CC1101DK-433 MHz
Development Kit
Wireless Connectivity Guide
37
Texas Instruments 1Q 2014
Sub-1 GHz
Ô CC1151-Q1
Sub-1-GHz Automotive-Qualified RF Transmitter
CC1151-Q1
Get samples, datasheets, evaluation modules and application notes at: www.ti.com/sc/device/CC1151-q1
Benefits
• Fast development time and low system cost
• Flexible optimization of range power
• Enables use of inexpensive
microcontroller
• Enables adaptive channel selection
with increased robustness and coexistence of the wireless link
• Easy system scaling from unidirectional to bidirectional systems thru
compatible device family
C31
28 GDO2
29 GND
NC 17
GND 19
AVDD_CHP 18
RBIAS 20
Antenna
(50 )
NC 16
AVDD_RF3 15
CC11x1-Q1
AVDD_RF2 11
GND 10
C122
L123
C125
C123
C124
C121
8 GND
7 XOSC_Q2
6 AVDD_IF
L122
L121
AVDD_RF1 9
4 CS
C51
L131
RF_P 12
31 DVDD2
32 DCOUPL1
C131
GND 14
RF_N 13
30 DVDD1
5 XOSC_Q1
C21
AVDD_GUARD 21
26 SO (GDO1)
27 NC/GND
GDO2
SI 23
25 SCLK
3 GDO0(ATEST)
SCLK
SO (GDO1)
AGND_GUARD 22
N C 24
SI
2 DCOUPL2
Key features
• Sub-1 GHz FSK/GFSK/MSK/ASK/
OOK RF transmitter
• 1.2- to 250-kBaud data rate
• Low-power, low system cost
• Sleep current: 700 nA
• 90-μs PLL lock time: 240 μs from
sleep to TX
• On-chip support for sync word
insertion, address insertion, flexible
packet length and automatic CRC
insertion
• 64-Byte TX data FIFOs (enable burst
mode data transmission)
• Suitable for systems targeting
compliance with EN 300 200
­(Europe) and FCC CFR Part 15 (U.S.)
R171
VDD
1 GND
Integrated solution provides high
performance. The CC1151-Q1 is a highly
integrated, multichannel RF transmitter
designed for low-power wireless
applications in the 315/433/868/915MHz ISM bands. The CC1151-Q1 is
the transmitter only derivate of the
CC1101-Q1 transceiver qualified in
accordance to AEC-Q100 with extended
electrical specification and extended
temperature range up to +125°C.
C41
GDO0
XTAL
CS
C81
C101
The CC1151-Q1 is register compatible with the CC1101-Q1 transceiver.
Development tools and software
• CC1101DK-433 MHz Development Kit
• CC1101DK-868/915 MHz Development Kit
• SimpliciTI™ software protocol
General Characteristics
Parameter (315, 433MHz, 3V, 25ºC)
Min
Typ
Max
Unit
Operating conditions:
Frequency range
310
—
348
MHz
387
—
464
MHz
779
—
928
MHz
Operating temperature
–40
—
125
ºC
Operating voltage
1.8
—
3.6
V
Data rate (programmable)
1.2
—
250
kBaud
Output power (programmable)
–30
—
+12
dBm
Current consumption
Current consumption, TX, +10 dBm
—
29.5
—
mA
Current consumption, TX, 0 dBm
—
14.6
—
mA
Applications
• Remote keyless entry
• Passive entry and passive start
• Garage door opener
• High-temperature sensors
Wireless Connectivity Guide
38
Texas Instruments 1Q 2014
Sub-1 GHz
Ô CC1190
Sub-1-GHz Front End (850–950 MHz)
CC1190
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/CC1190
The CC1190 is range extender for
the sub-1-GHz low-power RF
transceivers and System-on-Chip
(SoC) devices from Texas Instruments. The CC1190 integrates a power
amplifier (PA), a low noise amplifier
(LNA), switches, and RF matching
for the design of high-performance
wireless systems. The CC1190
increases the link budget by providing
a power amplifier for increased output
power, and an LNA with low noise
figure for improved sensitivity.
The CC1190 provides an efficient
and easy-to-use range extender in a
compact 4×4mm package.
Key features
• Seamless interface to sub-1-GHz
low-power RF devices from TI
• Up to 27 dBm (0.5 W) output power
• 2.9 dB LNA noise figure including
switch and external antenna match
• Few external components: the
integrated PA, LNA, switches,
matching network and inductors
improve system performance over
typical discrete front end solutions
• High transmit power efficiency
PAE=50% at 26 dBm output power
Benefits
• An integrated front end reduces
development time by up to 70%
• Using the CC1190 with even a small
6dB increase in link budget doubles
the range, making the CC1190 a
great choice for remote monitoring
• A compact reference design reduces
the board space for a front end by
up to 50%
Applications
• Wireless sensor networks
• Wireless metering infrastructure
• Wireless security systems
• Wireless long range remote
monitoring
Development tools and software
• CC1101CC1190EMK915 Evaluation
Module Kit
Wireless Connectivity Guide
VDD_LNA
VDD_PA1
PA_OUT
VDD_PA2
PA
PA_IN
PREAMP
EN
EN
TR_SW
LNA
LNA_OUT
EN
LNA_IN
PA_EN
LOGIC
LNA_EN
BIAS
HGM
BIAS
CC1190 block diagram.
General Characteristics
Parameter
Min
Typ
Max
Unit
Supply range
2.0
—
3.7
V
Frequency range
850
—
950
MHz
Ambient temperature range
–40
—
85
°C
Power down current
—
50
200
nA
mA
RX mode
Receive current, high gain mode
—
3
—
Receive current, low gain mode
—
26
—
µA
Gain, high gain mode
—
11.6
—
dB
Gain, low gain mode
—
–6
—
dB
Input, 1-dB compression, high gain
mode
—
–12.3
—
dB
Noise figure, high gain mode
—
2.9
—
dB
Transmit current, 26.5dBm output
power
—
302
—
mA
Output power
—
26.5
—
dBm
TX mode
Power added efficiency, PAE
—
48
—
%
Output 1-dB compression
—
24
—
dBm
39
Texas Instruments 1Q 2014
Sub-1 GHz
Ô CC1120, CC1121, CC1125, CC1175 and CC1200
High-Performance RF Transceiver for Narrowband Systems
CC1120, CC1121, CC1125, CC1175, CC1200
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/cc1120
See also: www.ti.com/product/tps62730
Complete RF and MCU development
is done with the RF Performance Line
development kit. Out-of-the box, RF
range and performance can be tested
using the free SmartRF™ Studio and
RF Packet Sniffer PC software. Code
development can be done on the
MSP430F5438A used in the development kit, which also includes peripherals like a dot matrix LCD display and
various sensors.
Key features
• Industry leading RF blocking and
selectivity:
5dB adjacent channel rejection at
6
12.5kHz offset
90dB blocking
• High output power (up to +16dBm)
and excellent sensitivity (Up to
145db link budget)
• WaveMatch; Advanced DSP sync
detector with high sensitivity and
strong noise and fast setting
Ultra low
power 32kHz
auto-calibrated
RC oscillator
Power
on reset
4k byte
ROM
MARC
Main Radio
Control Unit
Ultra low power
16 bit MCU
SPI Serial
configuration
and data
interface
CS_N (chip select)
SI (serial input)
Interrupt
and IO
handler
System bus
RF and DSP frontend
PA
14dBm
high
effciency
PA
Configuration
and status
registers
High
linearity
LNA
I
Q
Fully integrated
Fractional-N
Frequecy Synthesizer
ifamp
LNA_N
256 byte
FIFO RAM
buffer
Packet
handler and
FIFO control
(optional GPIO0-3)
(optional auto
detected external
XOSC/TCXO)
Output power ramping and OOK/ASK modulation
ifamp
LNA_P
SO (serial output)
SCLK (serial clock)
Battery
sensor/
temp sensor
90dB
dynamic
range ADC
90dB
dynamic
range ADC
Data
interface
with signal
chain access
Cordic
eWOR
Enhanced ultra
low power
Wake On Radio
timer
Modulator
The RF Performance Line devices are
distinguished by supporting different
RF channel bandwidths, data rates
and RF regulations. See tables for RF
regulations supported and feature set.
CC112x
(optional
32kHz
clock
input)
Channel
filter
The RF Performance Line is a family
of industry’s highest performance RF
parts, including RF transceivers and
a transmitter. The parts operate in the
169/315/433/868/950MHz frequency
bands. RF Performance Line offers
a new level of RF selectivity and
blocking. With 65dB adjacent channel
rejection and 90dB blocking, robust
applications can be built even without
an external SAW filter.
XOSC_Q1
XOSC
Highly flexible
FSK/OOK
demodulator
XOSC_Q2
(optional bit clock)
(optional low
jitter serial data
output for legacy
protocols)
AGC
Automatic Gain Control, 60dB VGA range
RSSI measurements and carrier sense detection
(optional
GPIO for
antenna
diversity)
CC112x block diagram.
Benefits
Applications
• First pass installation success.
The RF chip market is growing
30%YoY, and robust RF is the key
to communicate reliably in presence
of interference => lower field install
cost.
• Smart metering
• Alarm and security systems
• Industrial automation
• The first fully integrated ETSI
Category 1 radio on the market.
Significant cost reduction compared
to today’s discrete solutions.
Development tools and software
• RF Performance Line
Development Kit
• SmartRF Studio
• Long range, 10s of kilometers
out-of-the-box with the development
kit.
• More reliable links, no false sync
detects in noise.
• <3mA RX sniff mode current
consumption. Extended battery life.
• Advanced RX sniff mode with
low power without sacrificing
­performance
Wireless Connectivity Guide
40
Texas Instruments 1Q 2014
Sub-1 GHz
Ô CC1120, CC1121, CC1125, CC1175 and CC1200 (continued)
Parameter
CC1175 (only TX)
CC1121
CC1120
CC1125
CC1200 (Q1 2013)
RCR 30
Yes
No
Yes
Yes
Yes
ARIB T96, ARIB T108
Yes
Yes
Yes
Yes
Yes
ETSI EN 300-220 Cat 1
Yes
No
Only 169MHz & 433MHz
Yes
No
ETSI EN 300-220 Cat 2
Yes
Yes
Yes
Yes
Yes
FCC Part 15
Yes
Yes
Yes
Yes
Yes
FCC Part 24
Yes
No
Yes
Yes
Yes
(Mask D, E, G, J)
Yes
No
Yes
Yes
Yes
FCC Part 101
Yes
No
Yes
Yes
Yes
ETSI EN 54-25
Yes
Yes
Yes
Yes
Yes
ETSI 300-113 TN
Yes
No
No
TX only
No
FCC Part 90
General Characteristics
CC1120
CC1121
CC1175
CC1125
CC1200
Transceiver
Transceiver
Transmitter
Transceiver
Transceiver
7.8
41.7
N/A
3.5
12.5
Frequency (Min)
164MHz, 410MHz, 820MHz
164MHz, 410MHz, 820MHz
164MHz, 410MHz, 820MHz
164MHz, 410MHz, 820MHz
410MHz, 820MHz
Frequency (Max)
Device Type
Minimum RX Filter Bandwidth (kHz)
192MHz, 480MHz, 960MHz
192MHz, 480MHz, 960MHz
192MHz, 480MHz, 960MHz
192MHz, 480MHz, 960MHz
480MHz, 960MHz
Data Rate (Max) (kbps)
200
200
200
200
1000
Phase noise @170MHz,
10kHz (dBc/Hz)
–111
–111
–115
–115
–110
Operating Voltage (Min) (V)
2.0
2.0
2.0
2.0
2.0
Operating Voltage (Max) (V)
3.8
3.8
3.8
3.8
3.8
RX Current (Lowest) (mA)
17
17
n/a
17
17
Standby Current (µA)
0.3
0.3
0.3
0.3
0.3
Modulation Techniques
2-FSK, 2-GFSK, 4-FSK,
4-GFSK, MSK, OOK
2-FSK, 2-GFSK, 4-FSK,
4-GFSK, MSK, OOK
2-FSK, 2-GFSK, 4-FSK,
4-GFSK, MSK, OOK
2-FSK, 2-GFSK, 4-FSK,
4-GFSK, MSK, OOK
2-FSK, 2-GFSK, 4-FSK,
4-GFSK, MSK, OOK,
extended support for
802.15.4g PHY FSK
Sensitivity (Best) (dBm)
-123
-117
n/a
-127
-122
Adjacent Channel Selectivity (dB)
64
61
n/a
65
55
RF Blocking (+/- 10MHz) (dB)
90
86
n/a
104
90
TX Power (Max) (dBm)
16
16
16
16
16
AES-128 Accelerator
NO
NO
NO
NO
YES
Wireless Connectivity Guide
41
Texas Instruments 1Q 2014
Sub-1 GHz
Ô CC110L
Value Line Transceiver
CC110L, CC113L, CC115L
Get samples, datasheets, evaluation modules and application notes at: www.ti.com/sc/device/cc110L
Key features
• CC1101 RF performance
• Flexible RF modulation formats
2-FSK, 4-FSK, GFSK and OOK, data
rates from 0.6 to 600kbps
• All Value Line devices are pin, register
and code compatible
• $1 price tag on transmitter + receiver
bundle
Benefits
• Proven RF performance where
millions of these devices are being
used every day
• Backwards compatible with existing
sub-1-GHz systems
• Easy to switch between 1-way and
2-way solutions
• Complete 1-way RF link for $1 in high
volumes (100k+)
Wireless Connectivity Guide
ADC
RF_T
0
RF_N
FREQ
SYNTH
90
PA
RC OSC
BIAS
RBIAS
TX FIFO
Digital Interface MCU
LNA
RX FIFO
ADC
PACKET HANDLER
Demodulator
Radio Control
Modulator
The RF Value Line is a family of low
cost RF parts, including a transceiver,
a receiver and a transmitter. The
parts are pin, register and code
compatible, and they can be used to
migrate between 1-way and 2-way
RF solutions using the same PCB for
both options. The parts operate in
the 315/433/868/915MHz bands. The
RF Value Line is based on TI’s very
popular CC1101 RF transceiver, and
the devices have inherited the key
benefits of this platform. This includes
very flexible modulation formats and
data rates to be compatible with
almost any existing RF solution,
advanced digital features and a vast
pool of design resources with more
than 50 application notes have been
published on the platform.
To make RF development easier and
more accessible an RF BoosterPack for the MSP430 LaunchPad is
also available. The new 430BOOSTCC110L RF BoosterPack includes
ETSI-compliant and FCC-certified
modules to help speed development
time, reduce certification costs and
eliminate barriers associated with the
RF hardware design process.
SCLK
SO (GDO1)
SI
CSn
GDO0
GDO2
XOSC
XOSC_Q1
XOSC_Q2
CC110L block diagram.
Development tools and software
• RF Value Line Development Kit
• SmartRF Studio PC software
• CC110L RF BoosterPack for
MSP430 LaunchPad
Applications
• Cost-sensitive 1-way and 2-way
sub-1-GHz RF applications
• Remote controls
• Toys
• Home and building automation
• Alarm and security systems
General Characteristics
Device Type
CC110L
CC113L
CC115L
Frequency (Max)
300MHz, 387MHz,
779MHz
300MHz, 387MHz,
779MHz
300MHz, 387MHz,
779MHz
Data Rate (Max) (kbps)
348MHz,
464MHz,928MHz
348MHz,
464MHz,928MHz
348MHz,
464MHz,928MHz
Operating Voltage (Min) (V)
600
600
600
Operating Voltage (Max) (V)
1.8
1.8
1.8
RX Current (Lowest) (mA)
3.6
3.6
3.6
Standby Current (µA)
14
14
NA
Wake-up Time (PD-->RX/TX) (µS)
0.2
0.2
0.2
Modulation Techniques
240
240
240
Sensitivity (Best) (dBm)
2-FSK, 4-FSK,
GFSK, OOK
2-FSK, 4-FSK,
GFSK, OOK
2-FSK, 4-FSK,
GFSK, OOK
TX Power (Max) (dBm)
–116
–116
NA
Transmit current, 26.5dBm output
power
12
NA
12
Output power
—
26.5
—
Power added efficiency, PAE
—
48
—
Output 1-dB compression
—
24
—
42
Texas Instruments 1Q 2014
2.4 GHz
Ô CC2544
➔
2.4-GHz
RFValue
ValueLine
LineSoC
SoCwith
with32kB
32kBflash,
Flash,3131GPIO,
GPIO,I2C,
I2C,SPI
SPIand
andUART
UART
2.4GHz RF
CC2543, CC2544 and CC2545
Get samples, evaluation modules and application notes at: www.ti.com/product/CC2543
•
Upbudget:
to 256-Byte packet length
Link
•
Quick
RX/TX turnaround time
• +4dBmoutputpower
• -98dBmsensitivity@250kbpx
Link
budget:
• +4dBm
-90dBmsensitivity@2Mbps
•
output power
•
–98dBm
sensitivity @ 250kbps
Power
consumption:
•
sensitivity @ 2Mbps
• –90dBm
<1uAsleepcurrent
• Quicktransitionbetweenpowermodes
Power
consumption:
•
<1µA
sleep
current
Low cost
design:
•
Quick
transition
between power modes
• IntegratedMCU,RF,memoryandUSB
• Ultralow-costcrystal,fewexternal
Low-cost
design:
components,
small
antennaes
• Integrated
MCU,
RF,PCB
memory
and USB
• Ultra low-cost crystal, few external
components, small PCB antennaes
Wireless Connectivity Guide
Guide
RESET
32-MHz
Crystal OSC
Watchdog Timer
On-Chip Voltage
Regulator
Clock MUX and
Calibration
Power-On RESET
Brown Out
High
Speed
RC-OSC
Debug
Interface
SFR bus
RESET_N
XOSC_Q2
XOSC_Q1
32-kHz
RC-OSC
VDD (2 V-3.6 V)
DCOUPL
5V to 3.3 V
Voltage Regulator
VBUS (4 V-5.45 V)
Sleep Timer
Power Management Controller
PDATA
XRAM
8051 CPU
Core
IRAM
Memory
Arbitrator
SRF
DMA
SRAM
FLASH
FLASH
IRQ CTRL
FLASH CTRL
AES Encryption
and Decryption
FIFO CTRL
Link Layer Engine
USB
SFR bus
Demodulator
USART 0
Timer 1 (16-bit)
USB_N
USB_P
1-KB SRAM
Radio Registers
Recieve
Timer 2 (BLE LLTIMER)
SYNTH
Pseudo-Random
Number
Generator
Frequency
Synthesizer
P0_3
P0_2
P0_1
P0_0
RAM
UNIFIED
RadioArbiter
P1_3
P1_2
P1_1
P1_0
I/O Controller
CC2543/44/45
CC2543/44/45 is
is aa family
family of
of 2.4GHz
2.4GHz
RF
Value Line System-on-Chip (SoC)
RFValueLineSystem-on-Chip(SoC)
with MCU,
MCU, 32KB
32kB flash
with
Flashand
and1/2kB
1/2KBRAM
on a single
die. They
feature
2Mbps
RAM
on a single
die. They
feature
data
rate,
102dB
link
budget
<1uA
2-Mbps data rate, 102dB link and
budget
sleep
current
with
sleeptimer
running.
and
<1µA
sleep
current
with sleep
The family members are distinguished
timer running. The family members are
by different number of general I/O pins,
distinguished
by different
number of
and CC2544 has
a USB interface.
general I/O pins, and CC2544 has a
USB
interface.
The CC2543-CC2544
Development
Kit
provides
a complete
hardware
The CC2543-CC2544
Development
performance test platform and generic
Kit provides a complete hardware
software development environment for
performance
test platform
and generic
2.4GHz RF proprietary
applications.
software
development
environment
The kit includes two CC2543-basedfor
2.4-GHz
RF proprietary
RF evaluation
modules, applications.
one CC2544The
kit USB
includes
two general
CC2543-based
based
dongle,
purpose
RF
evaluation modules, one CC2544developmentboards(SmartRF05EB)
for software
and hardware
based
USB dongle,
generalprototyping,
purpose
cables, antennas
and(SmartRF05EB)
documentation
development
boards
to get
you upand
andhardware
running with
the
for
software
prototyping,
CC2543,
CC2544,
and
CC2545
quickly
cables, antennas and documentation
and easily.
to get you up and running with the
CC2543,
and CC2545
quickly
CompleteCC2544,
RF and MCU
development
and
easily.
is done with the CC2543-CC2544
Development
Kit. Out-of-the
box,
Complete
RF and
MCU development
RF
range
and
performance
can
be
is done with the CC2543-CC2544
tested
using
the
free
SmartRF
Studio.
Development Kit. Out-of-the box,
Code development can be done on
RF range and performance can be
embedded 8051 core used in the
tested
using the
SmartRF
Studio.
development
kit,free
which
also includes
Code
development
can
be
done
peripherals like a dot matrix LCDon
embedded
core
usedinterfaces.
in the
display and8051
various
other
development kit, which also includes
peripherals like a dot matrix LCD
Key Features
display and various other interfaces.
Data throughput:
• 2Mbpsradio
Key
features
• Upto256bytepacketlength
Data
throughput:
• 2-Mbps
QuickRX/TXturnaroundtime
•
radio
Modulator
Transmit
Timer 3 (8-bit)
Timer 4 (8-bit)
RF_P
RF_N
CC2544
CC2544block
blockdiagram.
diagram.
Digital
Analog
Mixed
Benefits
• High
effective data rate, up to
Higheffectivedatarate,upto
1.6Mbps sustainable throughput
• Less
time on-air and lower power
Lesstimeon-airandlowerpower
consumption
• Up
to 100dB link budget
Upto100dBlinkbudget
• Long
range with small antennas
Longrangewithsmallantennas
• Several
years of battery life on AA cells
SeveralyearsofbatterylifeonAAcells
possible depending on application
• Perfect
fit for wireless 2.4-GHz
Perfectfitforwireless2.4GHz
consumer applications
• Good
fit for PC keyboard and mouse
GoodfitforPCkeyboardandmouse
Applications
Applications
•
mouse and keyboard
•Wireless
Wirelessmouse&keyboard
•
remote controls, toys
•Low-cost
Low-costremotecontrols,toys
•
consumer applications
•Low-cost
Low-costconsumerapplications
Development
Developmenttools
Toolsand
andsoftware
Software
•
CC2543-CC2544 Development Kit
•CC2543-CC2544DevelopmentKit
•
Evaluation Module Kit
•CC2545
CC2545EvaluationModuleKit
•
SmartRF Studio
•SmartRFStudio
•
IAR Embedded Workbench
•IAREmbeddedWorkbench
General Characteristics
CC2543
CC2544
CC2545
Frequency (Min)
2379MHz
2380MHz
2379MHz
Frequency (Max)
Device type
Type
2496MHz
System-on-Chip
2495MHz
System-on-Chip
32
1
32
2
2496MHz
System-on-Chip
32
Data rate
Rate(Max)
(Max)(kbps)
(kbps)
Operating voltage
Voltage (Min) (V)
2000
2.0
2000
2.0
Operating voltage
Voltage (Max) (V)
RX current
Current (Lowest)
(Lowest) (mA)
(mA)
3.6
21.2
Standby current
Current
0.9µA
0.9uA
3.6
22.5
1mA (USB
suspend)
GFSK, MSK
Flash size (KB)
RAM size (KB)
Modulation techniques
Techniques
Sensitivity (Best) (dBm)
TX Power (Max) (dBm)
GFSK, MSK
–98
-98
4
I2C,UART,
UART,SPI,
SPI,16
I2C,
16gpio
GPIO
Features
43
45
–95
-95
4
USB, UART, SPI,
88 GPIO
gpio
1
2000
2.0
3.6
20.8
0.9µA
0.9uA
GFSK, MSK
–98
-98
4
I2C,UART,
UART,SPI,
SPI,31
I2C,
31gpio
GPIO
Texas Instruments 1Q
4Q 2014
2012
2.4 GHz
CC2590, CC2591
2.4 GHz RF Front End
CC2590, CC2591
Get samples, datasheets, evaluation modules and application notes at: www.ti.com/sc/device/CC2590
and www.ti.com/sc/device/CC2591
CC2590 and CC2591 are 2.4-GHz
range extenders specially designed
for all existing and future 2.4-GHz RF
transceivers and System-on-Chip (SoC)
solutions from TI. CC2590/CC2591
increase the link budget by providing
a power amplifier for improved output
power and an LNA with low noise
figure for improved receiver sensitivity.
They contain PA, LNA, switches,
RF-matching, and balun for simple
design of high-performance wireless
applications.
Key features
CC2590
•Upto+14-dBmoutputpower
•22-mAtransmitcurrentat3Vat
+12-dBm output power
•4.6-dBLNAnoisefigureincluding
RX/TXswitchandantennamatch
CC2591
•Upto+22-dBmoutputpower
•Upto+28-dBincreasedlinkbudget
•112-mAtransmitcurrentat3Vat
+20-dBm output power
•4.8-dBLNAnoisefigureincluding
RX/TXswitch
CC2590/CC2591
•SeamlessinterfacetoTI's2.4-GHz
802.15.4 low-power RF devices
•6-dBtypimprovedsensitivityon
CC24xx, CC2500, CC2510
and CC2511
•Veryfewexternalcomponents:
integrated PA, LNA, switches,
inductors, balun and matching
network
•Lowreceivecurrent:
3.4 mA in HIGH gain mode,
1.7 mA in LOW gain mode
•100nAinpowerdown
•DigitalcontrolofLNAgainbyHGMpin
•Packaging:RoHS-compliant,4×4mm
QFN-16
Development tools
• CC2530-CC2591EMKEvaluation
Module Kit
• CC2520-CC2591EMKEvaluation
Module Kit
Wireless Connectivity Guide
CC2590/CC2591
PA
ANT BALUN
RF_P
LNA
RF_N
2.4-GHz
Low-Power
Radio
LOGIC
PAEN
EN
GAIN CTR
CC2590/CC2591 block diagram.
CC2590 General Characteristics
Parameter
Supply range
Frequency range
Ambient temperature range
Power down current
Min
2.0
2400
–40
—
Typ
—
—
—
0.1
Max
3.6
2483.5
85
0.3
Unit
V
MHz
°C
µA
—
—
—
—
—
—
3.4
1.8
11.4
0
–21
4.6
4
2
—
—
—
—
mA
mA
dB
dB
dB
dB
—
—
—
—
22
12
23
10.4
—
—
—
—
mA
dBm
%
dBm
Min
2.0
2400
–40
—
Typ
—
—
—
0.1
Max
3.6
2483.5
85
0.3
Unit
V
MHz
°C
µA
—
—
—
—
—
—
3.4
1.7
11
1
4.8
–17
4
2
—
—
—
—
mA
mA
dB
dB
dB
dB
—
—
—
—
100
20
33
19
—
—
—
—
mA
dBm
%
dBm
RX mode
Receive current, high gain mode
Receive current, low gain mode
Gain, high gain mode
Gain, low gain mode
Input, 1-dB compression, high gain mode
Noise figure, high gain mode
TX mode
Transmit current, 12-dBm output power
Output power
Power added efficiency, PAE
Output 1-dB compression
CC2591 General Characteristics
Parameter
Supply range
Frequency range
Ambient temperature range
Power down current
RX mode
Receive current, high gain mode
Receive current, low gain mode
Gain, high gain mode
Gain, low gain mode
Noise figure, high gain mode
Input, 1-dB compression, high gain mode
TX mode
Transmit current, 20-dBm output power
Output power
Power added efficiency, PAE
Output 1-dB compression
44
Texas Instruments 1Q 2014
RFID
Ô TMS37157
PaLFI – Passive Low-Frequency Interface Device
TMS37157
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/TMS37157
The PaLFI – Passive Low-Frequency
Interface TMS37157 enables shortrange two way communication
without the need of a battery by
harvesting the RF energy transmitted
from the base-station. It combines
a Low-Frequency RFID Transponder
with EEPROM memory and an SPI
Interface to connect to a microcontroller. The EEPROM memory is
accessible via the LF and SPI
interface without battery support. It
is ideal for data-logging applications
(configuration or updating a device
without the need of a battery), for
medical applications (non-battery
operated bio-sensors) and as a
method for recharging batteries while
enabling two way communications.
The TMS37157 can also be used in
combination with active low power
devices to wake up the active device
in a defined read zone and thus
conserve the battery life. Dependent
on system parameters such as
antenna sizes and base station power,
the device wirelessly powers an
MSP430 MCU at ranges up to
1.5 meter.
Key features
• Low frequency half duplex (HDX)
interface
Special selective addressing
mode allows anti collision
Up to 8 kbit/s LF uplink data rate
• 3-wire SPI interface
• 1008 bit EEPROM:
968-bit free available EEPROM
user memory
32-bit unique serial number
8-bit selective address
Pages are irreversible lockable
and protectable
• Power management for connected
microcontroller
Wireless Connectivity Guide
Digital or Analog
Sensor
MSP430
TMS3705
LF Base Station
134, 2 kHz
PaLFI
TMS37157
LF Transponder
with EEPROM
Energy
LP data
Base station
Sensor system
TMS37157 block diagram.
Benefits
• Batteryless operation of a
microcontroller supplied by RF field
• EEPROM memory expansion for
microcontroller
• Dedicated LF wake-up
• HDX transponder communication
• Battery check and battery charge
function
Applications
• Wireless batteryless interface
Medical
Metering
• LF wake-up for container tracking
• Configuration memory (end of
production line)
Development tools and software
• ez430-TMS37157 evaluation kit
PaLFI – Passive Low-Frequency Interface
Part number
TMS37157
Communication interfaces
SPI, RFID, direct microcontroller access via RFID
Operating frequency
134.2kHz
Wired communication interface
3-wire SPI
Operating voltage
2V to 3.6VDC
Current consumption
Active mode max 150μA
Power-down mode 60nA
Battery charge current
Max 2mA
Memory
32-bit unique serial number
968-bit EEPROM user memory
8-bit selective address
Operating temperature
–40˚C to +85˚C
Storage temperature
–40˚C to +125˚C
Package
16-pin VQFN (4mm × 4mm)
Packing/delivery
Tape-on reel, 3,000 per reel
45
Texas Instruments 1Q 2014
RFID
Ô TMS3705
134.2-kHz Transceiver IC
TMS3705
Get samples, evaluation modules and application notes at: www.ti.com/sc/device/TMS3705
The TMS3705 is a highly integrated transceiver IC to support all
HDX transponders and TI LF dual
interface devices. This base station
IC drives the antenna of a transponder system to send data modulated
on the antenna signal, and to detect
and demodulate the response from
the transponder. It allows efficient
development and enables minimizing the external component count for
RFID reader systems.
Key features
• Transceiver IC for 134.2 kHz
Transponder and PaLFI – Passive
Low Frequency Interface Device
• HDX transmission principle
• Digital FM/FSK demodulator
• Asynchronous or synchronous data
interface to µC
• Automatic transponder frequency
measurement and adaptation
• Integrated diagnosis functions
• Full bridge antenna driver
• Built-in band-pass filter and limiter
• Short-circuit protection
• Power-on reset
• PLL for internal clock generation
• Sleep-mode current consumption:
typ. 15 µA
• Designed for automotive
requirements
• 16-pin SOIC (D) package
Benefits
• 2-wire interface
• Low external component count
• Remote antenna principle
(up to 10m)
Wireless Connectivity Guide
Supply
V-Reg
5Volt
R1
R2
Data
µC
TMS3705
LF Base Station IC
134.2kHz
Loop
Antenna
ANT2
C1
ANT1
TXCT
Air Coil or Ferrite
inductance
200 to 700µH
TMS3705 block diagram.
Applications
• 134.2kHz Reader (HDX) for:
Automotive immobilizer
Animal ID
Access control
Industrial automation
Container tracking
Asset management
Development tools and software
• Included in ez430-TMS37157
Evaluation Kit
For more information on transponders
and inlays please visit
www.ti.com/lf-transponders
Part number
TMS3705
Operating frequency
134.2 kHz
Communication interface
SCI Asyn/Sync
Supply voltage
4.5 V to 5.5 VDC
Current consumption
RX 8 mA
TX 220 mA peak
Sleep Mode 15 µA
Transmitter modulation
100% ASK
Demodulation format
FM/FSK
FSK data rate
8kbps
Transmission principle
HDX
Operating temperature
–40˚C to +85˚C
Storage temperature
–55˚C to +150˚C
Package
16-pin SOIC-D
Packing/delivery
Tape-on Reel, 2500 per reel
46
Texas Instruments 1Q 2014
NFC/RFID
Ô TRF796x
13.56-MHz Reader/Writer Transceiver ICs
TRF7960, TRF7960A, TRF7961, TRF7962A, TRF7963A, TRF7964A
Get samples, evaluation modules and application notes at: www.ti.com/nfc
The TRF796x is a pin compatible,
high performance 13.56-MHz HF
RFID Reader IC family comprising an
integrated analog front end (AFE) and a
built in data-framing system for
ISO/IEC 15693, ISO/IEC 18000-3,
ISO/IEC 14443A and B. This includes
data rates up to 848kbits for ISO/IEC
14443 with all framing and synchronization tasks on board. This architecture enables the customer to build
a complete reader using only a low
end microcontroller. Other standards
and even custom protocols can be
implemented by using the various
Direct Modes of the device. The
Direct Modes allow the user to get
access to the Sub-Carrier Data or to
the unframed, however already ISO
Formatted Data stream. A parallel
or serial interface (SPI) can be used
for the communication between the
Microcontroller and the TRF796x. The
transmitter has selectable outputpower levels of 100mW (+20dBm) or
200mW (+23dBm) equivalent into a
50 Ohm load when using a 5V supply.
The receiver system enables AM and
PM demodulation using a dual-input
architecture to minimize communication holes. The reader is configured by
selecting the desired protocol in the
control registers. Direct access to all
control registers allows fine tuning of
various reader parameters as needed.
Key features
• ISO 14443A/B, ISO 15693, FeliCa,
Mifare
• Supply voltage range: 2.7 – 5.5 V
• Parallel data communication or serial
4-pin SPI interface
• Integrated data framing, CRC and/or
parity checking
• Multiple sub-carrier receiving and
decoding compatibility
• Data rates supported up to 848 kHz
• Integrated voltage regulators for
MCU supply (20 mA)
• Clock output for MCU
• Selectable receive gain with AGC
• Antenna driver using OOK or ASK
modulation
• Programmable output power,
100 mW and 200 mW
• 7 user selectable power modes
Wireless Connectivity Guide
TX_OUT
Matching
RX_IN1
VDD_I/O
VDD
Serial or
Parallel
TRF796x
RX_IN2
VSS
VIN
Supply: 2.7 V - 5.5 V
Crystal
13.56 MHz
TRF7960 block diagram.
uC / MSP430
Benefits
• Easy to use with high flexibility
• Completely integrated protocol
handling
• Auto-configured default modes for
each supported ISO protocol
• Separate internal high-PSRR power
supplies for analog, digital, and PA
sections provide noise isolation for
superior read range and reliability
• Dual receiver inputs with AM and PM
demodulation to minimize
communication holes
• Receiver AM and PM RSSI
• High integration reduces total BOM
and board area
• Ultra-low-power modes
• Power down < 1 µA
• Standby 120 µA
Applications
• 13.56-MHz RFID reader
• Access control
• POS contactless payment
• Prepaid eMetering
• Medical equipment
• Product identification/authorization (consumables)
Development tools and software
• TRF7960AEVM – Evaluation Kit
• TRF7960ATB target board for
MSP-EXP430F5438A board, ARM®
Cortex®-M3 based DK-LM3S9BD96
board, or any other TI embedded
microcontroller platform with the EM
socket headers populated.
For more information on transponders
and inlays please visit
www.ti.com/hf-transponders
General Characteristics
TRF7960
TRF7960A
TRF7964A
Part Number
Operating frequency
TRF7961
TRF7962A
TRF7963A
13.56 MHz
ISO/IEC 15693,
ISO/IEC 18000-3
ISO/IEC 14443A
ISO/IEC 14443B
Supported protocols
Operating voltage
Current consumption
Transmitter power
Transmitter modulation
Communication interface
Operating temperature
Storage temperature
Package
Packing/delivery
47
ISO/IEC 15693,
ISO/IEC 18000-3
2.7 to 5.5 VDC
Transmit: 200 mW at 120 mA, typ.
100 mW at 70 mA, typ.
Active (RX only): 10 mA, typ.
Stand-by: 120 μA
Power down: <1 μA
Adjustable power, 100 mW or
200 mW at 5 VDC
ASK, adjustable 8% to 30% OOK
Parallel 8-bit or 4-wire SPI
–40˚C to +110˚C
–55˚C to +150˚C
32-pin QFN, (5 mm × 5 mm)
Tape-on Reel, 250 or 3000 per reel
ISO/IEC 14443A
ISO/IEC 14443B
Texas Instruments 1Q 2014
NFC/RFID
Ô TRF7970A
13.56-MHz NFC (Near Field Communication)/RFID Transceiver IC
TRF7970A
Get samples, evaluation modules and application notes at: www.ti.com/nfc
The TRF7970A is the newest addition to
the TRF796x HF Transceiver IC Family.
TRF7970A supports Near Field
Communication (NFC) Standards
NFCIP-1 (ISO/IEC 18092) and NFCIP-2
(ISO/IEC 21481) which defines the selection of any of the four possible communication modes (NFC peer-to-peer, card
emulation, proximity reader/writer – ISO
14443A/B, Mifare or FeliCa and Vicinity
reader/writer – ISO 15693). Integrated
encode, decode and data framing
capability for data rates up to 848bps,
wide supply voltage range ­support
(2.7V – 5.5V), large FIFO buffer for RF
communication, relevant NFC software
stack libraries and an innovative RF field
detector allow for easy development efforts and robust, cost effective designs.
Finally, eight selectable power modes
and ultra-low power operation enable the
longest battery life in the industry. The
devices also offer unparalleled flexibility
via the various direct communication
modes on the device to allow implementations of custom protocols as well as
other 13.56-MHz standards. The receiver
system enables AM and PM demodulation using a dual-input architecture to
maximize communication robustness.
Key features
• NFCIP-1, NFCIP-2
• Peer-to-peer, card emulation, reader/
writer functionality
• ISO 14443A, ISO 14443B, FeliCa,
ISO 15693
• Supply voltage range: 2.7 – 5.5V
• Operating temperature: –40°C to
+110°C
• Parallel or SPI interface
• Integrated data framing, CRC and/or
parity checking
• Integrated voltage regulators for MCU
supply (20 mA)
• Clock output for MCU
• Selectable receive gain with AGC
• Antenna driver using OOK or ASK
modulation
• Programmable output power, 100 mW
and 200 mW
• RF field detector with programmable
wake-up levels
• Eight user-selectable power modes
100 mW and 200 mW
• 7 user-selectable power modes
Wireless Connectivity Guide
Matching
TX_OUT
RX_IN1
RX_IN2
VDD_X VDD_I/0
TRF7970A
VSS
VDD_I/0
Serial or
Parallel
VIN
Crystal
13.56MHz
27.12MHz
uC/MSP430
Optional
ISO7816
or SWP
Secure
Element
XIN
Supply: 2.7 V - 5.5 V
TRF7970A block diagram.
Benefits
• Easy to use with high flexibility
• Completely integrated protocol
­handling
• Auto-configured default modes for
each supported ISO protocol
• Separate internal high-PSRR power
supplies for analog, digital, and PA
sections provide noise isolation for
superior read range and reliability
• Dual receiver inputs with AM and PM
demodulation to minimize
communication holes
• Receiver AM and PM RSSI
• High integration reduces total BOM
and board area
• Ultra-low-power modes
• Power down < 1 µA
• Standby 120 µA
General Characteristics
Part Number
Operating frequency
Operating Modes
Operating voltage
Current consumption
Transmitter power
Transmitter modulation
Communication interface
Operating temperature
Storage temperature
Package
Packing/delivery
Applications
Infrastructure devices which
communicate to the NFC enabled smart
phones and PDAs:
• Public transport/event ticketing
• Access control/digital door-lock
• POS contactless payment
• Medical equipment
• Product identification/authentication
• Sharing of electronic business cards
• Secure pairing
Bluetooth, wireless networks
• Short range wireless communication
Firmware updates
Development tools and software
• TRF7970AEVM evaluation kit
• TRF7970ATB target board for
MSP-EXP430F5529 board or any other
TI embedded microcontroller platform
with the EM socket headers populated
TRF7970A
13.56 MHz
Reader/Writer
ISO/IEC 15693, ISO/IEC 18000-3
ISO/IEC 14443A
ISO/IEC 14443B
Peer-to-peer
ISO 18092 / NFCIP-1
Card Emulation
ISO 14443A & B
2.7 V to 5.5 VDC
Transmit: 200 mW at 120 mA, typ.
100 mW at 70 mA, typ.
Power down: <1 μA
Adjustable power, 100 mW or
200 mW at 5 VDC
ASK, adjustable 8% to 30% OOK
Parallel 8-bit or 4-wire SPI
–40°C to +110°C
–55°C to +150°C
32-pin QFN, (5 mm × 5 mm)
Tape-on Reel, 250 or 3000 per reel
48
Texas Instruments 1Q 2014
Embedded Processors for Wireless Connectivity
 Embedded Processors
TI Embedded Processors – A perfect companion to our radios in wireless systems
Microcontrollers are an integral part of all wireless connectivity systems, especially in low-power wireless solutions.
From being the main applications and/or protocol processor to performing power management functions to coordinating
communications, microcontrollers play a key role both in battery operated end nodes as well as host devices such as
coordinators and routers. TI’s broad industry leading portfolio of embedded processors, from the ultra-low power MSP430™
microcontrollers to our high-performance Sitara™ portfolio and DSP products, ensures you have the choice of the right device
for any wireless connectivity application.
TI recognizes the importance of embedded software in wireless connectivity solutions. Our embedded processors are
supported by a wide variety of software stacks, including protocol and network solutions.
Finally we offer a comprehensive suite of development tools and online resources to make your wireless connectivity design
robust, easy and fast.
Embedded Processing Portfolio
TI Embedded Processors
Code Composer Studio™ IDE
ARM®-Based Processors
Microcontroller (MCU)
16-Bit Ultra-Low
Power MCUs
32-Bit
Real-Time MCUs
32-Bit
ARM MCUs
MSP430™
C2000™
Tiva™ C Series
ARM Cortex™-M4
ARM Cortex-R4F
• Up to 25 MHz
• Up to 512 KB
Flash
• Up to 64 KB FRAM
• Analog I/O, ADC
• LCD, USB, RF
• 40 MHz to
300 MHz
• Flash, RAM
16 KB to 512 KB
• PWM, ADC, CAN,
SPI, I2C
Measurement,
Sensing, General
purpose
$0.25 – $9.00
Digital Signal Processor (DSP)
32-Bit ARM
Safety MCUs
32-Bit ARM
Processors
Singlecore
DSPs
Multicore
Processors
Hercules™
Sitara™
C5000™ C6000™
and ARM Cortex-A15
• Up to 80 MHz
• Flash
32 KB to 256 KB
• USB OTG, CAN,
ADC, PWM, SPI
• Up to 220 MHz
• Flash
256 KB to 3 MB
• USB, ENET,
FlexRay™,Timer/
PWM, ADC, CAN,
LIN, SPI, I2C, EMIF
• Up to 1 GHz
• Up to 32 KB I/D
Cache, 256 KB L2,
LPDDR, DDR2/3
support
• GEMAC, CAN
SATA+PHY,
USB+PHY,
PRU-ICSS
• Up to 800-MHz
DSPs, SDRAM,
DDR2, µPP, I2C, I2S,
UHPI, McASP/
McBSP, LCDC,
Integrated
connectivity
options:
USB 2.0, EMAC
• GEMAC, PCIe+PHY,
SATA+PHY, CAN,
USB+PHY, PR-ICSS
• Up to 10-GHz
Multicore,
Fixed/Floating+
accessories
• Up to 4 MB SL2,
32 KB L1, 1 MB L2
• RapidIO®, PCIe,
McBSP, 10/100
MAC, µPP, UART,
HyperLink,
DDR2/3
Motor control,
Digital power,
Lighting,
Renewable energy
Connectivity, Security,
Motion control, HMI,
Industrial automation
Safety, Transportation,
Industrial and Medical
Consumer, Industrial,
Connected home, POS,
Smart grid, Medical
Patient monitoring,
Biometric security,
Smart e-meter,
Industrial drives
Telecom, Medical,
Mission critical,
Base stations
$1.50 – $20.00
$2.15 – $5.25
$5.00 – $30.00
$5.00 – $25.00
$2.00 – $25.00
$30.00 – $225.00
Wireless Connectivity Guide
49
C6000™ DSP
Texas Instruments 1Q 2014
Embedded Processors for Wireless Connectivity
Ô MSP430™ Microcontrollers
The MSP430 family of ultra-lowpower microcontrollers
MSP430 microcontrollers (MCUs)
from Texas Instruments (TI) are 16-bit,
RISC-based, mixed-signal processors
designed for ultra-low power. Our
MCUs offer the lowest power
consumption and the perfect mix of
integrated peripherals for thousands
of applications – including yours. We
also provide all of the hardware and
software tools you need to get started
today! Not only that, TI has a plethora
of complementary components to
meet your needs. Learn more today at
ti.com/msp430. Visit
www.ti.com/msp430 for a complete
product portfolio and more information.
By making RF design easy,
performance-rich and power-efficient,
the MSP430 helps advance RF
networking applications from RFID
to Bluetooth®/Bluetooth low energy
as well as proprietary protocols.
These applications include, but are
not limited to, industrial/building
automation, asset tracking, industrial
monitoring and tamper detection,
alarm and security systems, sports/
body monitoring, wireless keyboard/
mouse products, wireless gaming
accessories and automatic metering
infrastructure (AMI). The ultra-low
power consumption of the MSP430
also enables energy harvesting
applications with wireless systems.
www.ti.com/embeddedrf
MSP430 – your ultra-low-power wireless connectivity microcontroller
Ultra-Low Power
Integration
Battery life > 20 years
Advanced peripherals
• <100 μA/MHz
• 0.1μA RAM retention
• <1μA RTC mode
• High-performance analog
• Optimized serial communications
• Operate in low-power modes
More performance without
sacrificing battery life
Minimize physical footprint and bill
of materials
• 7 low-power modes
• Instant wakeup
• Autonomous peripherals
• USB
• LCD drivers
• Sigma-Delta ADCs
Ease of Use
Grow with MSP
Development
Scale your applications
• S
tart with MSP430 LaunchPad
Evaluation Kit
• Comprehensive software portfolio
• Application-specific ecosystem
• 400+ devices
• Up to 512 KB Flash and 64 KB RAM
• 25+ package options
Support
• Data collection
• Wireless connectivity
• Power solutions
• C
ode examples
• Direct support available at
ti.com/e2e-msp430
• Developer community at 43oh.com
Unlimited possibilities with TI
MSP430 embedded software:
The MSP430 microcontroller supports several wireless connectivity protocol and networking software stacks with more
options coming soon.
Stack
MSP430 device
Availability
SimpliciTI
MSP430F2xx, MPR430F5xx, MSP430F4xx, CC430Fxx, MSP430FR57xx
For more information, visit ti.com/embeddedrf
TIMAC 802.15.4
MSP430F461x*, MSP430FR57xx
For more information, visit ti.com/embeddedrf
ZigBee Coordinator
MSP430F227x*, MSP430F461x*, MSP430F54xxA*
For more information, visit ti.com/embeddedrf
ZigBee End Device
MSP430F227x*, MSP430F461x*, MSP430F54xxA*, MSP430FR57xx
For more information, visit ti.com/embeddedrf
Bluetooth v2.1 + EDR, SPP
MSP430BT5190*, MSP430F5529
For more information, visit ti.com/embeddedrf
6LoWPAN
CC430Fxxx*, MSP430F5438A
For more information, visit ti.com/embeddedrf
Dash7
CC430Fxxx*
For more information, visit ti.com/embeddedrf
*Can be ported to other MSP430 MCU devices (depending on memory requirements)
Wireless Connectivity Guide
50
Texas Instruments 1Q 2014
Embedded Processors for Wireless Connectivity
MSP430™ Microcontrollers
Hardware
Now, let’s talk hardware! MSP430 MCUs are supported by a broad collection of hardware development tools for beginners as
well as experienced engineers. Our tools range from low-cost development kits like the MSP430 LaunchPad Evaluation Kit to
highly-integrated, application-specific platforms and target boards for integrating MSP430 into your designs.
MSP430 LaunchPad and BoosterPack ecosystem
LaunchPad Evaluation Kits provide
customers everything needed to
get started.
Try it out with Energia for the
simplified user experience! Learn
more about this easy-to-use IDE at
www.energia.nu/
BoosterPacks are plug-in
modules for the LaunchPad, which
enable customers to stack additional
functionality such as wireless,
capacitive touch and more.
Explore the ecosystem at
www.ti.com/launchpad
430BOOST-SENSE1
MSP-EXP430G2
Full-featured development kits
eZ430-CHRONOS
CC430-based RF wireless
development kit
in a sports watch form factor in
433, 868 and 915 MHz frequencies
MSP-EXP430FG4618
MSP-EXP430F5529
Featuring MSP430FG4618
and MSP430F2013 on-board
segmented display, buzzer,
RS-232, capacitive touch,
microphone, RF headers, JTAG
Featuring MSP430F5529
complete USB development
platform, on-board dot matrix
display, JTAG, RF headers, onboard emulation, accelerometer,
microSD, capacitive touch
MSP-EXPCC430RF
Featuring CC430F6137 and
CC430F5137 on-board
emulation, segmented LCD, light
sensor, includes F6137-based
motherboard and
F5137-based satellite board
Hardware support tools
Production programmer
One tool to rule them all.
The MSP430 Flash Emulation Tool (MSP-FET430UIF)
supports all MSP430 devices when paired with the
appropriate target board.
The MSP-GANG can program up to eight identical MSP430
Flash or FRAM devices at the same time and allows the user
to fully customize the process.
MSP-FET430UIF
Bundle available
MSP-FET430U64
MSP-TS430PM64
We’re here for you!
• Referencedesignsavailableformanyapplications
• DirectsupportthroughourE2E™Forumatwww.ti.com/e2e-msp430
Learn more at www.ti.com/msp430tools
Wireless Connectivity Guide
51
Texas Instruments 1Q 2014
Embedded Processors for Wireless Connectivity
Ô MSP430™ Microcontrollers
Wireless connectivity hardware tools from MSP430:
The MSP430 eZ430 development tools are the best way to get familiar with the MSP430 MCU and include all the software and
hardware needed to develop a complete project and are available for as little as $20. Most eZ430 tools include a programming
interface that provides full debugging and programming capabilities for the detachable MSP430 target boards. For more
information visit www.ti.com/ez430.
Part
Number
Key Feature
Price ($ U.S.)
CC3000-FRAM-EMK
eZ430-Chronos
eZ430-RF2500
eZ430-RF2500-SEH
eZ430-TMS37157
eZ430-RF256x
Full turn-key TI Wi-Fi
evaluation and
demonstration tool for the
MSP430 FRAM MCUs and
TI’s SimpleLink™ Wi-Fi
Sub-1-GHz wireless watch
with integrated sensors
2.4-GHz wireless
connectivity development
board
Solar Energy Harvester
with 2.4 GHz
connectivity
Passive low frequency
RFID connectivity
Bluetooth®
connectivity
$199
$49
$49
$149
$199
$99
*Can be ported to other MSP430 MCU devices (depending on memory requirements)
Experimenter Board kits:
These innovative kits feature select MSP430 devices and include additional hardware components to take advantage of the
high level of analog integration available for easy system evaluation and prototyping. These kits are ideal for learning the
MSP430 architecture, testing the capabilities of available peripherals and include integrated headers for plugging in low-power
RF modules (CCxxxxEMK).
Part
Number
Key features
Supports
Price ($ U.S.)
MSP-EXP430F5438
Dot matrix grayscale
display, microphone,
audio output, RF
expansion connector,
USB connectivity,
accelerometer, joystick
EM430F6137RF900
MSP-EXP430F5529
MSP-EXP430FR5739
EM430F6147RF900
MSP-SA430-SUB1GHZ
EM430F6137RF900
5-pad capacitive
touch strip,
microSD card slot
with 1GB card,
USB connectivity,
supports
Integrated MSP430FR5739
3-axis accelerometer
NTC thermister
8 display LEDs
Footprint for additional throughhole LDR sensor
2 user-input switches
Sub-1-GHz CC430
complete wireless
development tool
kit. Includes DC-DC
converter option for
lower power operation
Low-cost sub-GHz
spectrum analyzer
Supported frequency ranges:
300–348 MHz, 389–464
MHz, 779–928 MHz
Open source QT-based
Graphical user interface
Most wireless
daughter cards
(CCxxxx RF).
CC1101EMK,
CC2500EMK,
CC2430EMK,
CC2530EMK,
CC4000GPSEM,
CC3000
Connection to most wireless
daughter cards (CCxxxx RF),
User experience, Preloaded
with out-of-box demo code,
4 modes to test FRAM
CC430 SoCs
CC110x transceivers,
CC430 SoS, CC111x SoC
$149
$49
$149
$249
Any CCxxxxEMK
module, PAN1323EMK,
CC2567PAN1327ANTBT,
CC3000
$149
$149
*Can be ported to other MSP430 MCU devices (depending on memory requirements)
Wireless Connectivity Guide
52
Texas Instruments 1Q 2014
Embedded Processors for Wireless Connectivity
 Sitara™ Processors
TI’s Sitara processors based on the
ARM9™ and ARM® Cortex®-A8 cores, in
conjunction with TI’s Wi-Fi®/Bluetooth®
connectivity options provide the right
combination of performance, power
and peripherals to meet any wireless
application need. Drive down system
cost, simplify design and expand
connectivity of your current design all
while maintaining software compatibility
across TI’s ARM9 and ARM Cortex-A8
processor portfolio.
Key features
• Multipleoperatingfrequenciesfor
optimizing power vs. performance
Applications
• Portabledataterminals
• 3Dgraphicsacceleration,multiple
packaging options and temperature
ranges
• Point-of-sale
• TIconnectivitysolutions(Wi-Fi/
Bluetooth) support
• High-bandwidthconnectivity
peripherals such as Gigabit Ethernet,
DDR2/DDR3 interfaces, CAN, SATA
2.0 and USB 2.0
Performance
Portfolio
• 300-MHz ARM9 to 1-GHz
Cortex-A8
• Graphics acceleration up to 27M
polygons per second
• High-speed DDR2 and DDR3
memory performance
• L
everage TI’s extensive portfolio
• Connectedaudio
• Connecteddisplays
• Consumergoods
• Industrialautomation
• Portablenavigation
• Medical
• Gamingequipment
of embedded ARM devices to
maximize your product’s
changing needs
• Reuse of both software and
hardware design across portfolio
• Fully pin-for-pin and softwarecompatible options across
portfolio
Performance
Ease of Use
• Wi-Fi/Bluetooth
• Gigabit Ethernet
• SATA, CAN 2.0 and high-speed
USB interface
• Multiple serial ports
• Touch-screen LCD controllers
• Industrial peripheral support
• Free and easy access Linux™
and Android™
• Application-specific and
advanced development kits
• Third-party RTOS ecosystem
Development tools
These full-featured development boards come complete with hardware, software and documentation and a wireless
connectivity module to accelerate hardware/software development. Available from TI and distributors. Additional low-cost
community-based boards can be obtained from numerous partners and distributors. www.ti.com/sitara
Part Number
BeagleBone Black – BEAGLEBK
AM335x Starter Kit – TMDSSK3358
AM335x EVM – TMDXEVM3358
Description
Low-cost, open-source community platform with
plug-in board expansion
Low-cost with optimized BOM and DDR3 and LCD
Evaluate functionality of AM3352/3354/3356/3358
applications processor with WL1271 based Wi-Fi,
7" LCD touch screen, ENET PHY, USB connector,
video connectors
Price ($ U.S.)
$45
$199
$995
Wireless Connectivity Guide
53
Texas Instruments 1Q 2014
Resources
 Development Tools
TI provides development tools that enable both software and hardware designers to quickly get up and running with wireless
connectivity products. The general-purpose low-power RF development tools consist of three elements – the Evaluation
Module, Evaluation Board and PC Tools:
Evaluation Module (EM)
A small plug-in board with the
complete reference design for the radio
device, ensuring maximum
performance.
Evaluation Board (EB)
Contains sockets for the EM.
Platform for testing the
performance of the radio and
for development of protoype
software.
PC Tools
Connect the EB to the PC and
use available tools to test,
configure and debug software
running on the chip.
There are several types of hardware
development tools.
USB Dongles
Bluetooth low energy
Development Kits
TI has made it easy for a fast and
convenient development with
Bluetooth Low Energy by the use of
the CC2540DK-MINI. It contains a
USB dongle and a key fob for rapid
prototyping. Complete Evaluation
Module Kits for CC2540 and CC2541
are also available.
Development Kit (DK)
The DK contains all the hardware that
is necessary to start development of
an RF system. In most configurations,
a development kit consists of two
Evaluation Boards, two small RF
modules, antennas and cables.
Mini Development Kit (DK-MINI)
Mini Development Kits are low-cost
development kits that contain the
basic hardware for prototyping and
for developing simple demonstration
applications. The kits can also be used
for basic evaluation of the device.
Evaluation Module Kit (EMK)
The EMK contains two RF modules
(EM) and antennas. The EMK can be
ordered separately and can be used
as add-ons to existing kits, compatible
motherboards or other boards with
matching connectors.
Wireless Connectivity Guide
Small form-factor dongles with the
USB enabled System-on-Chip (SoC)
and PCB antenna.
ZigBee® and ZigBee RF4CE
Development Kits
The ZigBee Development Kit (ZDK)
has all the features of a development
kit, but contains additional nodes
for experimenting with the mesh
capabilities of ZigBee. The kit is
preprogrammed with a ZigBee demo
application, giving you ZigBee directly
out of the box.
A specific ZigBee Network Processor
(ZNP) kit demonstrates the concept
with a CC2530 running the Z-Stack
and a small MSP430 running the
application code.
To get quickly up and running with
ZigBee RF4CE, there’s a dedicated kit
containing a fully functional remote
controller, a receiver board with a
multitude of connection options and a
USB dongle for PC connectivity.
54
Bluetooth low energy SensorTag
Development Kit
The award-winning SensorTag
development kit, based on the CC2541
SoC, shortens the design time for
Bluetooth application development from
months to hours with no hardware or
software expertise required. The overthe-air download feature provides the
ability to update firmware from a central
device like a smartphone, tablet or PC.
The SensorTag has limitless possibilities
in applications including health and
fitness, educational tools, toys, remote
controls and mobile phone accessories.
Find out more at ti.com/tool/
cc2541dk-sensor.
Texas Instruments 1Q 2014
Resources
Ô Development Tools
Device
Device Type
Development Kits
CC1101
Transceiver
sub-1 GHz
Value line transceiver,
Receiver and transmitter
CC1101DK433
CC1101DK868-915
CC11xLDK868-915
Automotive qualified transceiver
Automotive qualified receiver
Automotive qualified transmitter sub-1 GHz
High-performance RF transceiver for
narrowband systems
CC1101DK-433 MHz
CC1101DK-868/915 MHz
CC110L
CC113L
CC115L
CC1101-Q1
CC1131-Q1
CC1151-Q1
CC1120
CC1121
CC1175
CC1110
CC1111
High-performance low-power RF transceiver
High-performance RF transmitter for
narrowband systems
8051-based System on Chip
sub-1 GHz
Evaluation Module Kits
(Add-on boards)
CC1101EMK433
CC1101EMK868-915
CC11xLEMK-433
CC1120DK
CC1120EMK169
CC1120EMK420-470
CC1120EMK868-915
CC1120EMK955
CC1121EMK868-915
CC1175EMK868-915
CC1110DK-MINI-868
CC1110-CC1111DK
CC1110EMK433
CC1110EMK868-915
CC1111EMK868-915 (USB dongle)
CC430
Integrated MSP430 and CC1101
System on Chip
CC1190
PA and LNA front end
sub-1 GHz
Transceiver
2.4 GHz
8051-based System on Chip
2.4 GHz
Wi-Fi® module
CC2510DK-MINI
CC2510-CC2511DK
CC3000EM
CC2510EMK
CC2511EMK (USB dongle)
CC3000EM
CC3000BOOST
CC4000GPSEM
CC2520DK
CC2530DK
Only for CC2530
CC2533DK
CC2533DK-RF4CE-BA
CC2540DK-MINI
CC2540DK
CC4000-TC6000GN
CC2520EMK
CC2530EMK
CC2531EMK (USB Dongle)
CC2533EMK
CC2540
CC2541
GPS module
Transceiver – IEEE 802.15.4, ZigBee® PRO
8051-based System on Chip
IEEE 802.15.4, ZigBee PRO
8051-based System on Chip
IEEE 802.15.4, ZigBee RF4CE
8051-based System on Chip
Bluetooth® low energy
CC2543/2544/2545
CC2560
8051-based System-on-Chip
Bluetooth v2.1 + EDR module
CC2543-CC2544DK
EZ430-RF256x
CC2540EMK
CC2540EMK-USB (USB dongle),
CC2541EMK
CC2545EMK
CC256xQFNEM
CC2564
CC256x BTBLE-Kit
CC256xQFNEM
CC257x
CC2590
CC2591
CC2595
CC85xx
Bluetooth v2.1 + EDR, Bluetooth v4.0
and ANT™ dual-mode
ANT network processor
PA and LNA front end
2.4 GHz
PA front end 2.4 GHz
PurePath™ wireless audio
TMS37157
TMS3705
TRF796x
TRF7970A
Passive low-frequency interface device
134.2kHz transceiver IC
13.56 MHz transceiver IC
13.56 MHz NFC transceiver IC
CC2500
CC2510
CC2511
CC3000
CC4000
C2520
C2530
CC2531
CC2533
EZ430-Chronos Wireless Watch
EM430F6137RF900
EM430F6147RF900
MSP-SA430-SUB1GHZ
CC2500-CC2550DK
CC1101CC1190EMK868
CC1101CC1190EMK915
CC2500EMK
MSP430FG4618 Exp Board
MSP430F5438 Exp Board
MSP-EXP430F5529
MSP-EXP430F5438
MSP-EXP430FG4618
DK-TM4C123G
EK-TM4C123GXL LaunchPad
MSP-EXP430G2 LaunchPad
MSP-EXP430F5529
MSP430F5438 Exp Board
DK-TM4C123G
See www.ti.com/bluetooth
DK-TM4C123G
See www.ti.com/bluetooth
ANTC7EK1 (CC257x)
CC2520-CC2591EMK
CC2530-CC2591EMK
CC2595EMK
CC85xxDK
CC85xxDK-HEADSET
ez430-TMS37157
TRF7960EVM
TRF7970AEVM
TRF7960ATB
TRF7970ATB
WiLink™ 8 modules Wi-Fi module
Wireless Connectivity Guide
Other Compatible Mother
Boards
MSP430FG4618 Exp Board
MSP430F5438 Exp Board
WL1835MODCOM8
WL1835MOD Cape
55
MSP-EXP430F5438,
MSP-EXP430F5529
Sitara™ AM335x EVM
BeagleBone open source
computer
Texas Instruments 1Q 2014
Resources
Ô Development Tools
Other Development Kits
Tool Name
Short Description
SOC-BB
General purpose battery board for LPRF EM modules. The board has EM connector sockets, break-out pins, battery holders for
two AA batteries, a LED and a button.
CC-ANTENNA-DK
The Antenna Evaluation Kit can be used as a reference for various antenna designs and for testing the performance that can
be achieved.
This kit contains an A4-sized PCB panel with 16 different boards; 13 antenna designs and 3 boards for calibration purposes. The
frequency range of the antennas is from 136 MHz to 2480 MHz.
CC-DEBUGGER
Low-cost debugger probe and programming tool for CCxxxx 8051-based System-on-Chip (SoC) and for programming of devices
in the CC85xx family. Can be used together with SmartRF Studio, SmartRF Flash Programmer, PurePath Wireless Configurator
and IAR Embedded Workbench for 8051.
eZ430-RF2560
Low-cost demonstration and evaluation tool with CC2560 and MSP430BT5190
AM37x / DM37x
WL1271-TiWi (WLAN/Bluetooth) connectivity card pre-integrated with AM/DM37x processor evaluation module
AM18x / OMAP-L138
WL1271-TiWi (WLAN/Bluetooth) connectivity card pre-integrated with AM18x/OMAP-L138 processor evaluation module
AM335x
WL1271-TypeTN (WLAN/Bluetooth) connectivity card pre-integrated with AM335x processor evaluation module
TMDXWL1271COM6M
WL1271-TypeTN (WLAN/Bluetooth) connectivity card available as aftermarket DM814x processor evaluation module
430BOOST - CC110L
CC110L BoosterPack for MSP430 LaunchPad
CC1180 - 6LoWPAN - DK868
Complete CC-6LOWPAN-DK-868 system development kit including IPv6 to 6LoWPAN gateway
Related PC Tools
Tool Name
Short Description
SmartRF™ Studio
Application for controlling the RF ICs from the PC and to find appropriate register settings for the radio.
SmartRF Packet Sniffer
Simple packet sniffer application. Communicates with an evaluation board with a radio that captures packets on the specified
channel. The sniffer GUI parses and displays the packets.
SmartRF Flash Programmer
Use this application to program hex files on the system on chips or to update the firmware on the evaluation boards.
PurePath™ Wireless Configurator
Use this graphical PC tool for configuring and programming of CC85xx devices
PurePath Wireless Commander
Run tests for evaluating performances of CC85xx devices
CC3000 Radio Tool Package
Tool for operating, testing and calibrating the CC3000 designs during development
Bluetooth Hardware Evaluation Tool
Tool used to configure the BT chip’s properties through the Service Pack (SP) and also allows to test RF performance
TI University Program offers universities the
industry’s broadest wireless connectivity
portfolio, supporting more than a dozen
different wireless technologies.
Add TI to your curriculum, contact:
www.ti.com/univcontacts
www.ti.com/university
Wireless Connectivity Guide
56
Texas Instruments 1Q 2014
Resources
Ô Development Tools
Frequently Asked Questions
What can I do with a DK?
In most configurations, a development
kit consists of two Evaluation Boards,
two small RF modules, antennas and
cables. When the RF modules are
connected to the Evaluation Board, it
is possible to control the radio from
the PC using SmartRF™ Studio. Most
of the development kits also come
preprogrammed with a Packet Error Rate
test application, which makes it easy
to perform practical range testing with
the radios. In addition, the development
kits are flexible platforms and it is easy
to connect your own peripherals and
controllers to break-out pins on the
boards. The development kit would also
serve as a known good platform during
test and verification of your own system.
For development kits with systemon-chips (SoC), the evaluation boards
make it possible to debug and program
the chip with no additional hardware.
The kit also gives access to useful user
interfaces for testing of the various
peripherals and capabilities of the SoC.
The hardware in the kit can also be used
as a packet sniffer.
What is the purpose of the EMK?
The Evaluation Module (EM) is exactly
the same piece of hardware that is being
used in characterization of the radio,
and you will get datasheet performance
from these boards. The EMK can be
ordered separately and can be used
as add-ons to existing kits, compatible
motherboards or other boards with
matching connectors. The modules are
equipped with two 2×10 sockets from
Samtec (SFM-110-02-SM-D-A-K-TR)
matched with headers from Samtec
(TFM-110-02-SM-D-A-K-TR).
Wireless Connectivity Guide
Why do I need the
Evaluation Board?
The Evaluation Board (EB) is a flexible
test and development platform. It makes
it easy to perform basic functional RF
tests. For example:
• Connect the EB to your hardware to
test your own RF design (running tests
from SmartRF Studio)
• Use SmartRF Studio + EB + EM to
send packets that are received by your
own system
• Use your own system to send packets
and receive the packets using
SmartRF Studio + EB + EM
Are the MSP430 Experimenter’s
Boards compatible with
SmartRF Studio?
No
How do I adopt Wi-Fi®/
Bluetooth®?
Thus, you can easily verify the behavior
of either your own software or your own
hardware, eliminating multiple error
sources and reducing the time it takes to
debug and test an RF system.
TI has created platforms which are
pre-integrated, fully validated and
documented solutions to remove the
obstacles of wireless design. Platforms
provide complete system integration
of all components including Wi-Fi and
Bluetooth hardware, firmware, low-level
drivers, stacks, profiles, and sample
source applications. Platforms have
also been optimized for reduced system
level power consumption and higher
throughput. A full suite of detailed user
guides, developer guides, datasheets,
and extensive FAQs are included.
What are MSP430™
Experimenter’s Boards?
Where can I go to learn more
about Wi-Fi and Bluetooth tools?
The MSP430 Experimenter’s Boards
are versatile development boards
for MSP430 with a lot of external
peripherals, making it easy to experiment
and make prototypes to explore
the many features of the MSP430
peripherals. These boards are also
equipped with connectors for the RF
Evaluation Modules. Note that due to the
pin out of the connectors, only a subset
of the Evaluation Modules can be used
with the boards. You will find schematics,
software examples and application notes
for the experimenter’s boards on the
MSP430 development tools web pages.
57
www.ti.com/connectivitywiki
Why modules?
Customers greatly benefit from validated
RF modules which help reduce
development time, lower manufacturing
costs, improve PCB yield, decrease
board space, ease certification, and
minimize RF expertise required.
What is the difference between
the DK-EM2-2500S and the
DK-EM2-2520Z?
The DK-EM2-2500S is a kit tailored to
work with the SimpliciTI™ software. It
communicates using the CC2500EM but
also comes with compatible software for
the CC1101 as well as the CC2420. The
DK-EM2-2500Z is a kit tailored to work
with the ZigBee software. It uses the
CC2520 to communicate with two reprogrammable CC2530 battery boards.
Texas Instruments 1Q 2014
Resources
Ô Software
In addition to the comprehensive
hardware portfolio, TI provides a wide
range of supporting tools and software
stacks:
SimpliciTI™ Network Protocol
www.ti.com/simpliciti
SimpliciTI is a simple low-power RF
network protocol aimed at small (<256
nodes) RF networks. Such networks
typically contain battery operated
devices, which require long battery
life, low data rate and low duty cycle.
They usually have a limited number
of nodes talking directly to each
other or through an access point or
a range extender. Access points and
range extenders are not required, but
provide extra functionality such as
storing and forwarding messages.
With SimpliciTI the MCU resource
requirements are minimal which results
in a low system cost.
SimpliciTI was designed for easy
implementation and out-of-the-box
deployment on several TI RF platforms
such as the MSP430™ family of
low-power MCUs and the CC11xx/
CC25xx transceivers and SoCs.
The latest update to SimpliciTI has
extended the stack to include autoacknowledgement, encryption, and
dynamic network commissioning/
decommissioning features. These
additions increase the overall
capabilities of SimpliciTI and broaden
the scope of applications to which
SimpliciTI can be applied. With the
flexibility of SimpliciTI to ride on top of
many forms of modulation, SimpliciTI
is uniquely qualified to work as a
basis for extending many existing
proprietary formats.
TIMAC – IEEE 802.15.4 medium
access control software stack
www.ti.com/timac
Z-Stack™ – ZigBee
protocol stack
www.ti.com/z-stack
TIMAC is ideal when you need a
wireless point-to-point or
point-to-multipoint solution based
on a standard (e.g., multiple sensors
reporting directly to a master).
Z-Stack is compliant with the ZigBee
2007 (ZigBee and ZigBee PRO)
specification. It is the perfect way
to bring the power of mesh network
connectivity to any application.
Z-Stack supports multiple platforms
including the CC2530 System-onChip (SoC), CC2531 SoC, CC2520 +
MSP430 platform. They are all certified
as ZigBee-compliant platforms.
TIMAC is:
• A standardized wireless protocol
for battery powered and/or mains
­powered nodes
• Support for acknowledgement and
retransmission
• Suitable for applications with low
data-rate requirements (about
100 kBps effective data rate)
• Support for IEEE 802.15.4-2003
• Support for IEEE 802.15.4-2006
• Multiple platforms
• Easy application development
• Easy porting
TIMAC is distributed as object code
free of charge. There are no royalties
for using TIMAC.
RemoTI™ – ZigBee® RF4CE/IEEE
BLEstack – Bluetooth® low
energy protocol stack
www.ti.com/remoti
www.ti.com/blestack
RemoTI is the industry leading RF4CEcompliant software architecture. Built
on TI’s well-proven IEEE 802.15.4
compliant TIMAC, RemoTI offers a
simple, easy-to-use, intuitive software
architectural framework and all of the
tools, documentation, and support
needed to build an RF4CE compliant
product. RemoTI allows you to
reduce development time and cost,
and enables a quick time to market.
RemoTI supports the CC2530, CC2531
and CC2533 platforms.
TI’s Bluetooth low energy (BLE)
solution includes all necessary
software to get started on the
development of single-mode Bluetooth
low energy applications using the
CC2540 system-on-chip. It includes
object code with the Bluetooth low
energy protocol stack, a sample
project and applications with source
code, and BTool, a Windows PC
application for testing Bluetooth
low energy applications. In addition
to the software, the kit contains
documentation, including a developer’s
guide and Bluetooth low energy API
guide.
SimpliciTI also supports the narrow
band versions of TI’s radios in the
2.4-GHz and sub-1-GHz bands.
Wireless Connectivity Guide
Z-Stack is:
• Robust and reliable (it was one
of the first ZigBee stacks to be
certified)
• Flexible (it offers APIs at different
levels and enable several
architectures, including network
processor)
• Interoperable (it supports ZigBee
Smart Energy and ZigBee Home
Automation public profiles)
58
Texas Instruments 1Q 2014
Resources
Ô Software
Protocol Stack
Name
Description
Web link
SimpliciTI™ Network Protocol
SimpliciTI is a simple low-power RF network protocol aimed at small RF networks
www.ti.com/simpliciti
TIMAC
IEEE 802.15.4 medium access control software stack
www.ti.com/timac
®
Z-Stack™ Software
ZigBee protocol stack
www.ti.com/z-stack
RemoTI™ Software
ZigBee RF4CE protocol stack
www.ti.com/remoti
®
BLEstack
Bluetooth low energy protocol stack
®
www.ti.com/blestack
®
Bluetooth Stack
Stonestreet One Bluetopia Bluetooth Stack
www.ti.com/stonestreetone
AM37x Linux SDK
Linux Open-Source Wi-Fi® & BlueZ Bluetooth® Stack, Drivers & Demos
processors.wiki.ti.com/index.php/
AM37x_release_download_page
DM37x Linux SDK
Linux Open-Source Wi-Fi & BlueZ Bluetooth® Stack, Drivers & Demos
TBD
AM18x Linux SDK
Linux Open-Source Wi-Fi & BlueZ Bluetooth® Stack, Drivers & Demos
processors.wiki.ti.com/index.php/
AM18x_release_download_page
OMAP-L138 Linux SDK
Linux Open-Source Wi-Fi Stack, Drivers & Demos
processors.wiki.ti.com/index.php/
OMAPL138_DVSDK_download_page
AM335x Linux SDK
Linux Open-Source Wi-Fi & BlueZ Bluetooth® Stack, Drivers & Demos
processors.wiki.ti.com/index.php/
AM335x_release_download_page
AM37x Android ADK
Wi-Fi & Bluetooth® support integrated with Android™ Framework
processors.wiki.ti.com/index.php/
AM37x_release_download_page
AM335x Android ADK
Wi-Fi & Bluetooth® support integrated with Android Framework
processors.wiki.ti.com/index.php/
AM335x_release_download_page
Name
Description
Web link
SmartRF™ Studio
Applications for controlling the RF ICs from the PC and to find appropriate register settings for the radio
www.ti.com/smartrfstudio
SmartRF Packet Sniffer
Sample packet sniffer application. Communicates with an evaluation board with a radio that captures
packets on the specified channel. The sniffer GUI parses and displays the packets.
www.ti.com/packetsniffer
SmartRF Flash Programmer
Use this applications to program hex files on the System-on-Chip (SoC) or to update the firmware on the
Evaluation Boards
See tool folder of your preferred SoC
part
Example Libraries
The example libraries include the most basic functionality needed to establish a link between two devices
See tool folder of your preferred SoC
part
USB Libraries
USB interface libraries for devices with built-in USB interface (CC2511, CC1111, CC2531)
See tool folder of your preferred SoC
part
MSP430 Code Library for
Low-Power RF
The code library provides functions to facilitate the interfacing of an MSP430 MCU to CC1100/2500 RF IC
www.ti.com/ccmsplib
PurePath™ Wireless Configurator
Use this graphical PC tool for programming of CC85xx devices
www.ti.com/ppwc
PurePath Wireless Commander
Run tests for evaluating performances of CC85xx devices
See tool folder of your preferred SoC
part
SimpleLink™ CC4000 GPS Drivers
Firmware and demosoftware for out-of-the-box experience demo
www.ti.com/tool/cc4000gpsem
SimpleLink CC3000 Wi-Fi Sample
Applications
Sample Applications drivers using TI’s SimpleLink CC3000 Wi-Fi solution.
www.ti.com/tool/cc3000-platform
Software Tools/Resources
Low-power RF application notes
and design notes
Low-power RF can provide you with
more than 100 application notes and
design notes. Find them on the Wireless
Connectivity products web pages in the
related literature. You will then get device
Wireless Connectivity Guide
specific documentation. To access any of
the application notes and design notes,
type the URL:
www.ti.com/wirelessconnectivity and
then go to the documents tab and use the
search engine to find the right information
you need.
59
Texas Instruments 1Q 2014
Resources
Ô Texas Instruments Design Network (TIDN)
The TI Design Network for low-power
RF developers, Wi-Fi® and Bluetooth®
dual-mode is a worldwide community
of respected, experienced, and wellestablished companies including
those servicing the low-power RF
market in the sub-1-GHz and 2.4-GHz
ISM frequency bands and the 2.4-GHz
wireless technologies market for Wi-Fi
and Bluetooth.
This network consists of recom­
mended companies, RF consultants
and independent design houses that
provide scalable projects from antenna
circuit-board layout to turnkey system design and FCC or ETSI
compliance testing.
• Online search tool to determine
suitable RF development partners
Benefits include:
• A faster design-to-production
schedule and experience with the TI
Low-power RF product portfolio
• RF circuit, low-power RF and
ZigBee® design services
• Low-power RF and ZigBee module
solutions
• Development tools for testing and
troubleshooting RF systems
• RF certification services and RF
circuit manufacturing
To find a suitable partner for your
design and test project go to:
www.ti.com/lprfnetwork for ZigBee,
sub-1 GHz, Bluetooth low energy and
other proprietary wireless technologies
www.ti.com/tidn for Wi-Fi and
Bluetooth 4.0 technologies
Are you interested in becoming a
TI development partner?
Send an e-mail to m.grazier@ti.com
for more information.
Featured third-party developers
Europe
Amber Europe:
Amber Wireless GmbH is a German electronics company
specializing in the design, manufacturing and marketing
of compact short range radio modules and modems for
rapid implementation of cable-free data links and have
become one of the leading suppliers for ISM/SRD radio
modules and radio modems in Europe.
Wireless connectivity ICs:
CC430, CC1101, CC2520, CC2530
Contact details:
Contact: Wolfgang Esch
E-mail:wolfgang.esch@amber-wireless.de
Phone:0049-2203-6991950
URL:http://www.amber-wireless.de/
Radiocrafts:
Radiocrafts designs, manufactures and markets standard
RF modules for operation in the license-free ISM bands at
315 / 433 / 429 / 868 / 915 MHz and 2.4 GHz.
Low-Power RF ICs:
CC2420, CC1020, CC2430, CC2431, CC2400, CC1000,
CC2530
Contact details:
Contact: Peder Martin Evjen
E-mail:radiocrafts@radiocrafts.com
Phone: (+47) 4000 5195
URL:http://www.radiocrafts.com
Sensinode 6LowPAN:
Sensinode is the pioneer IP-based wireless sensor
network solution provider and offers seamless Internet
integration to embedded device and chip manufacturers
through all industries on a worldwide level.
Wireless connectivity ICs:
CC2430, CC1100, CC1110
Contact details:
Phone: +358 10 387 8680
URL:www.sensinode.com
United States
LS Research:
L.S. Research provides complete design services for
product development including embedded firmware,
RF design, antenna design, analog/digital design, PCB
layout, and prototyping. L.S. Compliance provides FCC,
CE, and ETSI testing services.
Wireless connectivity ICs
CC2530, CC2500, CC2550, CC2510, CC1100, CC1110,
CC2511, CC256x, CC1020, CC2520/MSP430, WL1271TiWi, CC3000-TiWi
Wireless Connectivity Guide
Contact details:
Contact: Bill Steinike
E-mail:bsteinike@lsr.com
Phone: 262-375-4400 ext.103
URL:http://www.lsr.com/
Anaren:
Anaren (Nasdaq: ANEN) is a US-based global innovator
of microwave/RF technology for the space, defense,
wireless infrastructure, and consumer electronics sectors.
As part of TI’s Low-power RF network, the company
offer its Anaren Integrated Radio (AIR) module family –
compact, pre-certified, SMT radio modules eOEMs can
quickly and cost-effectively implement without deep RF
expertise and operate at 433MHz, 868MHz, 900MHz, and
2.5GHz. (AIR-equipped test boards available for use with
TI EZ430 and DK tools.)
Wireless connectivity ICs:
CC1101, CC2500, CC8520 PurePath™ uncompressed
wireless audio w/ CC2591 range extender; test boards
Contact details:
Contact: Mark Bowyer
E-mail: mbowyer@anaren.com or
AIR@anaren.com
Phone: Toll free in US: 800.411.6596 or
44-2392-232392 (in Europe)
URL: www.anaren.com
Awarepoint:
Awarepoint is providing its Real-Time Awareness
Solutions® to healthcare clients that include prestigious
teaching institutions, premiere independents, military
facilities and members of major integrated delivery
networks.
Wireless connectivity ICs:
CC2430, CC2431
Contact details:
Toll-Free:
1-888-860-FIND (888-860-3463)
Phone:
(858) 345-5000
URL:www.awarepoint.com
Panasonic:
Panasonic Electronic Components provides powerful,
highly flexible, cost effective RF modules for a wide
variety of wireless Personal Area Network applications,
while also specializing in contract manufacturing and
design services.
Pacific Design Engineering:
PDE provides complete product design services
including; Wi-Fi applications development, Android and
iOS development, RF design, antenna design, embedded
firmware, microcontroller design, analog/digital design,
mechanical and industrial design, PCB layout, and
prototyping.
Wireless connectivity ICs:
SimpleLink Wi-Fi CC3000, CC2400, CC2500,
CC2520/MSP430, CC2530, CC2540,
CC2541, CC2591, CC8520 PurePath
CC1100, CC1110, CC1111, CC1190, CC430
Contact details:
Contact: Derek Pyner
E-mail: pyner@pde.com
Phone: (604) 421 1311 ext 20
Toll Free: (800) 561 3322
URL: http://www.pde.com
Global Navigation systems GNS – GmbH:
GNS-GmbH is a German electronics company. GNS
production complies with ISO 9001. GNS provides
complete design services, software IP, RF design, PCB
layout , prototyping, testing and manufacturing of GPS
only and GPS combo modules. GNS also provides
Software IP for GPS, BT, BLE, and FM / TMC based on
different OS like Android, Linux, Windows, WIN CE
Wireless connectivity ICs:
CC4000, NL5500, NL5500L, MSP430
Contact details:
Contact: Werner Koch
E-mail: w.koch@gns-gmbh.com
Phone: 0049-2405-4148-16
URL: http://www.gns-gmbh.com
Murata:
Murata is a global leader in the manufacture of electronic
components including wireless connectivity modules.
Wireless modules are world class in terms of size,
production capacity, and quality.
Wireless connectivity ICs
WL127x, WL128x, WL18xx, CC2560, CC3000
Contact details:
E-mail: modules@murata.com
URL: www.murata-ws.com
Wireless connectivity ICs
CC2560-PAN1325/15, CC2564-PAN1326/16
CC2567-PAN1327/17
Contact details:
URL: http://www.panasonic.com/ti
60
Texas Instruments 1Q 2014
Resources
TI E2E™ Online Community
TI’s Online Community has been created to provide you with technical support forums,
videos and blogs, and the chance to openly and freely interact with fellow engineers.
With the Online Community you can:
Exchange ideas, share knowledge and ask questions
View our latest videos covering basic knowledge to deep technical content
Interact with fellow engineers from all over the world
Join the E2E Online Community
Wireless Connectivity Guide
61
Texas Instruments 1Q 2014
Resources
 TI Connectivity Wiki
http://processors.wiki.ti.com/index.php/Wireless_Connectivity_Platforms
TI’s Wireless Connectivity Wiki provides the latest and most comprehensive technical information needed to begin developing a
wireless application.
With the Wireless Wiki you can:
Discover User guides, sample applications, software
Learn about the diverse catalog of available platforms
Clarify your understanding with support links for all wireless technologies
Wireless Connectivity Guide
62
Texas Instruments 1Q 2014
TI Worldwide Technical Support
Internet
Asia
TI Semiconductor Product Information Center Home Page
support.ti.com
TI E2E™ Community Home Page
e2e.ti.com
Product Information Centers
Americas
Brazil
Mexico
Phone
+1(512) 434-1560
Phone0800-891-2616
Phone0800-670-7544
Fax
+1(972) 927-6377
Internet/E-mailsupport.ti.com/sc/pic/americas.htm
Europe, Middle East, and Africa
Phone
European Free Call
00800-ASK-TEXAS
(00800 275 83927)
International
+49 (0) 8161 80 2121
Russian Support
+7 (4) 95 98 10 701
Note: The European Free Call (Toll Free) number is not active in all c­ ountries.
If you have technical difficulty calling the free call number, please use the
­international number above.
Fax
+(49) (0) 8161 80 2045
Internetwww.ti.com/asktexas
Direct E-mail
asktexas@ti.com
Japan
PhoneDomestic 0120-92-3326
Fax
International+81-3-3344-5317
Domestic0120-81-0036
Internet/E-mail
Internationalsupport.ti.com/sc/pic/japan.htm
Domesticwww.tij.co.jp/pic
© 2014 Texas Instruments Incorporated
Printed in U.S.A. by (Printer, City, State)
Phone
International
+91-80-41381665
Domestic
Toll-Free Number
Note: Toll-free numbers do not support
mobile and IP phones.
Australia
1-800-999-084
China
800-820-8682
Hong Kong
800-96-5941
India
1-800-425-7888
Indonesia
001-803-8861-1006
Korea
080-551-2804
Malaysia
1-800-80-3973
New Zealand
0800-446-934
Philippines
1-800-765-7404
Singapore
800-886-1028
Taiwan
0800-006800
Thailand
001-800-886-0010
Fax+8621-23073686
E-mailtiasia@ti.com or ti-china@ti.com
Internetsupport.ti.com/sc/pic/asia.htm
Important Notice: The products and services of Texas Instruments
Incorporated and its subsidiaries described herein are sold subject to TI’s
standard terms and conditions of sale. Customers are advised to obtain
the most current and complete information about TI products and services
before placing orders. TI assumes no liability for applications assistance,
customer’s applications or product designs, software performance, or
infringement of patents. The publication of information regarding any
other company’s products or services does not constitute TI’s approval,
warranty or endorsement thereof.
B090712
The platform bar, BlueLink, C2000, C5000, C6000, Code Composer Studio,
E2E, FlexRay, Hercules, MSP430, PurePath, RemoTI, Sitara, SimpleLink,
SimpliciTI, SmartRF, Tiva, WiLink and Z-Stack are trademarks of Texas
Instruments.
All other trademarks are the property of their respective owners.
SLAB056C
SILICA | The Engineers of Distribution.
SILICA Offices
AUSTRIA
Avnet EMG Elektronische Bauelemente GmbH
Schönbrunner Str. 297 - 307 • A-1120 Wien
Phone: +43 1 86642-300 • Fax: +43 1 86642-350
wien@silica.com
ITALY
Avnet EMG Italy S.r.l.
Via Manzoni 44, I-20095 Cusano Milanino MI
Phone: +39 02 660 921 • Fax: +39 02 66092 333
milano@silica.com
Avnet Iberia S.A.
Plaza Zabalgane, 12 • Bajo Izqda.
E-48960 Galdàcano (Vizcaya)
Phone: +34 944 57 27 77 • Fax: +34 944 56 88 55
bilbao@silica.com
BELGIUM
Avnet Europe Comm. VA
Axxes Business Park • Gebouw B 3de Verdieping
Guldensporenpark 17 • B-9820 Merelbeke
Phone: +32 2 709 90 00 • Fax: +32 2 709 98 10
gent@silica.com
Avnet EMG Italy S.r.l.
Viale dell‘ Industria, 23 • I-35129 Padova (PD)
Phone: +39 049 8073689 • Fax: +39 049 773464
padova@silica.com
SWEDEN
Avnet Nortec AB
Lövströms Alle’ 5 • S-172 66 Sundbyberg
Phone: +46 8 587 461 00 • Fax: +46 8 587 461 01
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CZECH REPUBLIC (SLOVAKIA)
Avnet
Amazon Court • Karolinska 661/4 • CZ-18600 Prague
Phone: +420 2 34091031 • Fax: +420 2 34091030
praha@silica.com
DENMARK
Avnet Nortec A/S
Ellekær 9 • DK-2730 Herlev
Phone: +45 43 22 80 10 • Fax: +45 43 22 80 11
herlev@silica.com
FINLAND (ESTONIA)
Avnet Nortec Oy
Pihatörmä 1B • FIN-02240 Espoo
Phone: +358 20 749 9200 • Fax: +358 20 749 9280
helsinki@silica.com
FRANCE (TUNISIA)
Avnet EMG France SA
Immeuble Carnot Plaza • 14 Avenue Carnot
F-91349 Massy Cedex
Phone: +33 1 64 47 29 29 • Fax: +33 1 64 47 00 84
paris@silica.com
Avnet EMG France SA
Parc Club du Moulin à Vent • Bât 10
33, rue du Dr. G. Lévy • F-69693 Vénissieux Cedex
Phone: +33 4 78 77 13 60 • Fax: +33 4 78 77 13 99
lyon@silica.com
Avnet EMG France SA
Les Peupliers II • 35, avenue des Peupliers
F-35510 Cesson Sévigné
Phone: +33 2 99 83 84 85 • Fax: +33 2 99 83 80 83
rennes@silica.com
Avnet EMG France SA
Parc de la Plaine 35 • avenue Marcel Dassault –
BP 5867 • F-31506 Toulouse Cedex 5
Phone: +33 5 62 47 47 60 • Fax: +33 5 62 47 47 61
toulouse@silica.com
GERMANY
Avnet EMG GmbH
Gruber Str. 60 C • D-85586 Poing
Phone: +49 8121 777 02 • Fax +49 8121 777 531
muenchen@silica.com
Avnet EMG GmbH
Rudower Chaussee 12 d • D-12489 Berlin
Phone: +49 30 214882-0 • Fax: +49 30 214882-33
berlin@silica.com
Avnet EMG GmbH
Berliner Platz 9 • D-44623 Herne
Phone: +49 2323 96466-0 • Fax: +49 2323 96466-60
herne@silica.com
Avnet EMG GmbH
Wolfenbütteler Str. 22 • D-38102 Braunschweig
Phone: +49 531 22073-0 • Fax: +49 531 2207335
braunschweig@silica.com
Avnet EMG GmbH
Gutenbergstraße 15 • D-70771 Leinfelden-Echterdingen
Phone: +49 711 78260-01 • Fax: +49 711 78260-200
stuttgart@silica.com
Avnet EMG GmbH
Borsigstr. 32 • 65205 Wiesbaden
Phone: +49 6122 5871 0 • Fax: +49 6122 5871 333
wiesbaden@silica.com
HUNGARY
Avnet
Budafoki út 91-93 • IP WEST / Building B
H-1117 Budapest
Phone: +36 1 43 67215 • Fax: +36 1 43 67213
budapest@silica.com
Avnet EMG Italy S.r.l.
Via Panciatichi, 40 • I-50127 Firenze (FI)
Phone: +39 055 4360392 • Fax: +39 055 431035
firenze@silica.com
Avnet EMG Italy S.r.l.
Via Scaglia Est, 144 • I-41100 Modena (MO)
Phone: +39 059 351300 • Fax: +39 059 344993
modena@silica.com
Avnet EMG Italy S.r.l.
Via Zoe Fontana, 220 • I-00131 Roma Tecnocittà
Phone: +39 06 4131151 • Fax: +39 06 4131161
roma@silica.com
Avnet EMG Italy S.r.l.
Corso Susa, 242 • I-10098 Rivoli (TO)
Phone: +39 011 204437 • Fax: +39 011 2428699
torino@silica.com
NETHERLANDS
Avnet B.V.
Takkebijsters 2 • NL-4817 BL Breda
Phone: +31 (0)76 57 22 700 • Fax: +31 (0)76 57 22 707
breda@silica.com
NORWAY
Avnet Nortec AS
Solbråveien 45, 2. Floor
N-1383 Asker
Phone: +47 6677 3600 • Fax: +47 6677 3677
asker@silica.com
POLAND (LATVIA/LITHUANIA)
Avnet EM Sp. z.o.o
Ul. Staromiejska 7 • Room 406 • PL-40-013 Katowice
Phone: +48 32 209 55 45 • Fax: +48 22 25 65 766
katowice@silica.com
Avnet EM Sp. z.o.o.
Street Marynarska 11 • PL-02-674 Warszawa
(Building Antares, 5th Floor)
Phone: +48 22 25 65 760 • Fax: +48 22 25 65 766
warszawa@silica.com
PORTUGAL
Avnet Iberia S.A.
Tower Plaza • Rot. Eng. Edgar Cardoso, 23
Piso 14 • Sala E
P-4400-676 Vila Nova de Gaia
Phone: + 35 1 223 779 502 • Fax: + 35 1 223 779 503
porto@silica.com
RUSSIA (BELARUS, UKRAINE)
Avnet
Korovinskoye Chaussee 10 • Building 2
Office 25 • RUS-127486 Moscow
Phone: +7 495 9371268 • Fax: +7 495 9372166
moscow@silica.com
Avnet
Polustrovsky Prospect, 43, of.422
RUS-195197 Saint Petersburg
Phone: +7 (812) 635 81 11 • Fax: +7 (812) 635 81 12
stpetersburg@silica.com
SLOVENIA (BOSNIA AND HERZEGOVINA, BULGARIA, CROATIA,
MACEDONIA, MONTENEGRO, ROMANIA, SERBIA)
Avnet
Dunajska c. 159 • SLO-1000 Ljubljana
Phone: +386 (0)1 560 9750 • Fax: +386 (0)1 560 9878
ljubljana@silica.com
SPAIN
Avnet Iberia S.A.
C/Chile,10 • plta. 2ª, ofic 229 • Edificio Madrid 92
E-28290 Las Matas (Madrid)
Phone: +34 91 372 71 00 • Fax: +34 91 636 97 88
madrid@silica.com
Avnet Iberia S.A.
C/Mallorca, 1 al 23 • 2ª plta.1A • E-08014 Barcelona
Phone: +34 93 327 85 30 • Fax: +34 93 425 05 44
barcelona@silica.com
SWITZERLAND
Avnet EMG AG
„Ausfahrt 46“ • Rössliweg 29b • 4852 Rothrist
Phone: +41 62 919 55 55 • Fax: +41 62 919 55 00
rothrist@silica.com
TURKEY (GREECE, EGYPT)
Avnet
Canan Residence, Ofis A1
Hendem Cad. No: 54
Serifali-Umraniye
TR-34775 Istanbul
Phone: +90 216 528 83 40 • Fax: +90 216 528 83 44
istanbul@silica.com
UNITED KINGDOM (IRELAND)
Avnet EMG Ltd.
Avnet House • Rutherford Close
Meadway Stevenage, Herts • SG1 2EF
Phone: +44 (0)1438 788310 • Fax: +44 (0)1438 788262
stevenage@silica.com
Avnet EMG Ltd.
Oceanic Building • Waters Meeting Road
Bolton • BL1 8SW
Phone: +44 (0)1204 547170 • Fax: +44 (0)1204 547171
bolton@avnet.eu
Avnet EMG Ltd.
First Floor • The Gatehouse
Gatehouse Road • Aylesbury Bucks • HP19 8DB
Phone: +44 (0)1296 678920 • Fax: +44 (0)1296 678939
aylesbury@avnet.eu
Avnet EMG Ltd.
Unit 5B • Waltham Park • White Waltham
Berkshire • SL6 3TN
Phone: +44 (0)1628 512912 • Fax: +44 (0)1628 512999
maidenhead@avnet.eu
ISRAEL
Avnet Components Israel Ltd.
P.O.Box 48 TEL-MOND, 4065001
Phone: +972 (0)9 7780280 • Fax: +972 (0)3 760 1115
avnet.israel@avnet.com
SOUTH AFRICA
Avnet Kopp
Block 3 • Pinewood Office Park • 33 Riley Road
Woodmead 2191 • Sandton • Johannesburg
Phone: +27 (0)11 319 8600 • Fax: +27 (0)11 319 8650
sales@avnet.co.za
Avnet Kopp
Ground Floor, HP House • Belmont Office Park • Belmont Road
Rondebosch 7700 • Cape Town
Phone: +27 (0)21 689 4141 • Fax: +27 (0)21 686 4709
sales@avnet.co.za
Avnet Kopp
Suite 6, Upminster • Essex Gardens • Nelson Road •
Westville 3630 • Durban
Phone: +27 (0)31 266 8104 • Fax: +27 (0)31 266 1891
sales@avnet.co.za
03/2014
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