User`s Guide - TI E2E Community
‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾
bq24610EVM-HV (HPA603)
>7 Cell Li-ion battery Charger
User’s Guide
-1-
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1 Introduction
1.1
EVM Features
• Evaluation Module For 8-cell Li-ion battery. To support other voltage battery, the output voltage
set point can be changed by changing the feedback voltage divider.
• High Efficiency Synchronous Buck Charger
• User-programmable Battery Voltage
• Test Points for Key Signals Available for Testing Purpose. Easy Probe Hook-up.
• Jumpers Available. Easy to Change Connections.
1.2
General Description
The bq24610 is highly integrated Li-ion or Li-polymer switch-mode battery charge controllers. It offers a
constant-frequency synchronous PWM controller with high accuracy charge current and voltage
regulation, termination, charge preconditioning, and charge status monitoring,
The bq24610 EVM charges the battery in three phases: preconditioning, constant current, and constant
voltage. Charge is terminated when the current reches a minimum user-selectable level. A programmable
charge timer provides a safety backup for charge termination. The bq24610 automatically restarts the
charge cycle if the battery voltage falls below an internal threshold, and enters a low-quiescent current
sleep mode when the input voltage falls below the battery voltage.
For details, see bq24610 (SLUS892) data sheets.
1.3
I/O Description
Table 1:
Jack
J1–Vin
J1–PGND
J2– BAT
J2– PGND
J2– TS
J2–TS1
JP1–CE
JP1–GND
Description
input positive terminal
Input ground terminal
Output positive terminal
Output ground
Temperature Qualification Voltage Input
Temperature Qualification Voltage Input 1
Charge enable pin
Ground
1.4
Controls and Key Parameters Setting
Table 2:
Jack
JP1
Description
Factory Setting
Charge enable setting
Installed : Disable charge
Non-installed: Allow charge
Jumper installed: disable charge
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1.5
Recommended Operating Conditions
Table 3:
Symbol
Supply
voltage, VIN
Battery
voltage, VBAT
Supply current,
IAC
Charge
current, Ichrg
Operating
junction
temperature
range, TJ
Description
Input voltage from
ac adapter input
Voltage applied at
VBAT terminal
Maximum input
current from ac
adapter input
Battery charge
current
Minimum
Typical
Maximum
Unit
33
48
60
V
0
33.6
50
V
4.5
A
4
A
125
°C
0
1
3
0
Notes
2 Test Summary
2.1 DEFINITIONS
This procedure details how to configure the HPA603 evaluation board. On the test procedure the
following naming conventions are followed. Refer to the HPA603 schematic for details.
VXXX :
LOADW:
V(TPyyy):
External voltage supply name (VADP, VBT, VSBT)
External load name (LOADR, LOADI)
Voltage at internal test point TPyyy. For example, V(TP12) means the voltage at
TP12.
V(Jxx):
Voltage at jack terminal Jxx.
V(TP(XXX)):
Voltage at test point “XXX”. For example, V(ACDET) means the voltage at the
test point which is marked as “ACDET”.
V(XXX, YYY): Voltage across point XXX and YYY.
I(JXX(YYY)): Current going out from the YYY terminal of jack XX.
Jxx(BBB):
Terminal or pin BBB of jack xx
Jxx ON :
Internal jumper Jxx terminals are shorted
Jxx OFF:
Internal jumper Jxx terminals are open
Jxx (-YY-) ON: Internal jumper Jxx adjacent terminals marked as “YY” are shorted
Measure:A,B Check specified parameters A, B. If measured values are not within specified
limits the unit under test has failed.
Observe A,B Observe if A, B occur. If they do not occur, the unit under test has failed.
Assembly drawings have location for jumpers, test points and individual components.
2.2 EQUIPMENT
2.2.1
POWER SUPPLIES
Power Supply #1 (PS#1): a power supply capable of supplying 60-V @ 5-A is required.
Power Supply #2 (PS#2): a power supply capable of supplying 5-V @ 1-A is required.
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2.2.2
LOAD #1
A 60V (or above), 5A (or above) electronic load that can operate at constant current
mode
2.2.3
METERS
Four Fluke 75 multimeters, (equivalent or better)
The current meters must be capable of measuring 5A+ current.
2.2.4
Oscilloscope
Tektronix TDS3054 scope or equivalent, 10X voltage probe.
2.3 EQUIPMENT SETUP
A) Set the power supply #1 for 0V ± 100mVDC, with the current limit set to > 5 A and then turn off
supply.
B) Connect the output of power supply #1 in series with a current meter (multi-meter) to J1 (VIN,
GND).
C) Connect a voltage meter across J1 (VIN, GND).
D)
E)
F)
G)
H)
I)
J)
Set the power supply #2 for 0V ± 100mVDC, 0.2 ± 0.1A current limit and then turn off supply.
Connect the output of the power supply #2 across J2 (TS, GND).
Connect Load #1 in series with a current meter to J2 (BAT, GND). Turn off Load #1.
Connect a voltage meter across J2 (BAT, GND).
Connect an oscilloscope’s probe across J2 (BAT, GND).
If JP1 is not installed, install the jumper.
After the steps above, the test setup for HPA603 is shown in Figure 1.
Iin
Power
supply #1
J1
Vin
I
J2
VCC bias supply
Power
supply #2
TS1
V
TS
U1
GND
GND
BAT
APPLICATION CIRCUIT
LOW bat protector
Sleep mode comparator
Test Points
V
Load
#1
Ibat
I
Oscilloscope
I
JP1
CHGDIS
Figure 1: Original test setup for HPA603 (bq24610EVM-HV)
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2.4 PROCEDURE
2.4.1
2.4.1.1
Vcc Bias Supply Power Up
Turn on PS#1. Set the power supply #1 to 48V ± 1VDC
Measure V(TP(VREF)) = 3.3V ± 0.1V
Measure V(TP(REGN)) = 0V ± 0.5V
Measure V(TP(Vcc)) = 8.5V ± 0.5V
2.4.2
CHARGE VOLTAGE REGULATION
2.4.2.1
Turn on PS#2. Set the power supply #1 to 1.8V ± 100mVDC
2.4.2.2
Take JP1 off (Enable the charging).
Oscilloscope Measure Peak V(J2(BAT)) = 33.6V ± 1V
Measure V(TP(REGN)) = 6V ± 500mV
2.4.3
2.4.3.1
CHARGE CURRENT REGULATION
Set the output voltage to 15V. Turn on Load#1.
Measure Ibat = 500mA ± 200mA
2.4.3.2
Set the output voltage to 28V.Turn on Load#1.
Measure Ibat = 4.15A ± 300mA
2.4.4
CHARGE CUT-OFF BY THERMISTOR
.
2.4.4.1
Slowly increase the output voltage of PS2 until Ibat = 0 10Ma
Measure → V(J4(TS)) = 2.44V ± 200mV
Measure Ibat = 0mA ± 100mA
2.4.4.2
Slowly decrease the output voltage of PS2 to 1.8V ± 100mV
Measure Ibat = 4150mA ± 300mA
3 PCB Layout Guideline
The switching node rise and fall times should be minimized for minimum switching loss. Proper layout
of the components to minimize high frequency current path loop is important to prevent electrical and
magnetic field radiation and high frequency resonant problems. Here is a PCB layout priority list for
proper layout. Layout PCB according to this specific order is essential.
1). Place input ceramic capacitor as close as possible to switching MOSFET’s supply and ground
connections and use shortest copper trace connection.
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2). The gate drive IC, UCC27201, should be placed close to the switching MOSFET’s gate terminals
and keep the gate drive signal traces short for a clean MOSFET drive. The IC can be placed on the
other side of the PCB of switching MOSFETs.
3). Place inductor input terminal to switching MOSFET’s output terminal as close as possible.
Minimize the copper area of this trace to lower electrical and magnetic field radiation but make the
trace wide enough to carry the charging current. Do not use multiple layers in parallel for this
connection. Minimize parasitic capacitance from this area to any other trace or plane.
4). The charging current sensing resistor should be placed right next to the inductor output. Route the
sense lead nets close to each other (minimize loop area) and do not route the sense leads through a
high-current path.
5). Place output capacitor next to the sensing resistor output and ground.
6). Output capacitor ground connections need to be tied to the same copper that connects to the input
capacitor ground before connecting to system ground.
8). Route analog ground separately from power ground. Connect analog ground and connect power
ground separately. Connect analog ground and power ground together using power pad as the single
ground connection point. Or using a 0Ω resistor to tie analog ground to power ground (power pad
should tie to analog ground in this case if possible).
9). Decoupling capacitors should be placed next to the IC pins and make trace connection as short as
possible.
10). It is critical that the exposed power pad on the backside of the IC package be soldered to the
PCB ground. Ensure that there are sufficient thermal vias directly under the IC, connecting to the
ground plane on the other layers.
4 Bill of Materials, Board Layout and Schematics
4.1
Bill of Materials
COUNT
RefDes
Value
Description
Size
Part Number
MFR
0.22uF
Capacitor, Ceramic, 100V, X7R, 20%
1206
STD
STD
1
C1
3
C10, C16, C28
0.1uF
Capacitor, Ceramic, 16V, X7R, 10%,
0603
STD
STD
4
C11, C17, C20, C24
0.1uF
Capacitor, Ceramic, 50V, X7R, 10%
0603
STD
STD
2
C12, C36
4.7uF
Capacitor, Ceramic, 16V, X7R, 20%
1206
STD
STD
2
C14, C19
22pF
Capacitor, Ceramic, 50V, X7R, 10%
0603
STD
STD
1
C2
33uF
Capacitor, Radial, Aluminum, 100V, 20%
0.492 inch
UPW2A330MPD
Nichicon
0
C21, C22
Open
Capacitor, Ceramic, 50V, X7R, 10%
0603
STD
STD
1
C25
3.3nF
Capacitor, Ceramic, 50V, X7R, 10%
0603
TDK
1
C26
10uF
Capacitor, Radial, Aluminum, 100V, 20%
0.492 inch
Std
RFS100V100MH4#5
Elna America
2
C27, C29
100pF
Capacitor, Ceramic, 16V, X7R, 5%,
0603
STD
STD
2
C3, C37
2.2uF
Capacitor, Ceramic, 100V, X7R, 10%
1812
STD
STD
1
C30
1.0uF
Capacitor, Ceramic, 16V, X7R, 10%
0603
STD
STD
1
C31
15pF
Capacitor, Ceramic, 50V, X5R, 10%
0402
Std
Std
1
C32
2.2uF
Capacitor, Ceramic, 100V, X7R, 10%
1210
Std
Std
1
C33
0.1uF
Capacitor, Ceramic, 6.3V, X5R, 20%
0402
Std
Std
1
C34
3300pF
Capacitor, Ceramic, 6.3V, X5R, 20%
0402
Std
Std
1
C35
0.1uF
Capacitor, Ceramic, 10V, X5R, 20%
0402
Std
Std
-6-
‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾
0
C38
Open
Capacitor, Ceramic, 100V, X7R, 20%
0805
STD
1
C4
0.22uF
Capacitor, Ceramic, 100V, X7R, 10%
1206
STD
STD
2
C5, C6
2.2uF
Capacitor, Ceramic, 50V, X5R, 20%
1812
STD
STD
3
C7, C13, C18
0.1uF
Capacitor, Ceramic, 16V, X7R, 10%
0603
STD
STD
1
C8
0.1uF
Capacitor, Ceramic, 100V, X7R, 10%
1206
STD
STD
3
C9, C15, C23
1.0uF
Capacitor, Ceramic, 16V, X7R, 20%
0805
STD
STD
1
D1
BZX84B15-V
Diode, Zener, 15-V, 300-mW
SOT-23
BZX84B15-V
Diodes
1
D2
MMSD701T1G
Schottky Barrier Diodes, 70-V, 200-mA, 225mW,
SOD-123
MMSD701T1G
On Semi
0
D3, D4
Open
Diode, Signal, 300-mA, 75-V, 350-mW
SOD-123
1N4148W-7-F
Diodes
1
D5, D8
1N4148W-7-F
Diode, Signal, 300-mA, 75-V, 350-mW
SOD-123
1N4148W-7-F
Diodes
0
D6
Open
Diode, Schottky Barrier Rectifier, 2A, 100V
SMB
B2100-13
Diodes
1
D7
DDZ5V6BS
Diode, Zener, 5.6V, 900mA, 200mW
SOD-323
DDZ5V6BS
Diodes
1
D9
BAT54
Diode, Schottky, 200-mA, 30-V
SOT-23
BAT54
Vishay
1
J1
ED1609-ND
Terminal Block, 2 pin, 15A, 5.1mm
0.40 x 0.35 inch
ED1609
OST
1
J2
ED2227
Terminal Block, 4 pin, 15A, 5.1mm
0.80 x 0.35 inch
ED2227
OST
1
JP1
PEC02SAAN
Header, Male 2-pin, 100mil spacing,
0.100 inch x 2
PEC02SAAN
Sullins
1
L1
22uH
Inductor, Low Profile High Current, 6A, 20%
1
L2
100uH
Inductor, SMT, 2.48A, 89milliohm
0.51 x 0.52 inch
0.402 x 0.394
inch
MSS1038-104ML
2
Q1, Q2
SI7852DP
MOSFET, NChan, 80V, 10.9A, 22 millohm
PWRPAK S0-8
Si7852DP
0
Q3, Q5
Open
MOSFET, NChan, 80V, 10.9A, 22 millohm
PWRPAK S0-8
Si7852DP
Coilcraft
VishaySiliconix
VishaySiliconix
1
Q4
SI7469DP
MOSFET, PChan, 80V, 28A, 29millohm
PWRPAK S0-8
SI7469DP
Vishay
0
Q6
SI7469DP
MOSFET, PChan, 80V, 28A, 29millohm
PWRPAK S0-8
SI7469DP
Vishay
1
R1
200k
Resistor, Metal Film, 1/4 watt, 5%
1206
Std
Std
1
R10
100k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
R11, R12
15.0k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
4
R13, R14, R25, R26
0
Resistor, Chip, 1/16W, 5%
0603
Std
Std
1
R22
2.00k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
3
R17, R19, R36
10.0k
Resistor, Chip, 1/16W, 1%
0402
Std
Std
1
R18
0.02
Resistor, Chip, 1/2W, 1%
2010
WSL2010R0100FEA
Dale
1
R2
51.1
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R20
100k
Resistor, Chip, 1/10W, 1%
0805
Std
Std
1
R21
4.02k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R23
464k
Resistor, Chip, 1/10W, 1%
0805
Std
Std
1
R24
30.9k
Resistor, Chip, 1/10W, 1%
0805
Std
Std
2
R28, R29
1.00M
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R3
40.2
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
R30, R33
866k
Resistor, Chip, 1/10W, 1%
0805
Std
Std
2
R16, R31
10.0k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R35
750k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R37
100k
Resistor, Chip, 1/16W, 1%
0402
Std
Std
1
R38
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R39
5.49k
Resistor, Chip, 1/16W, 1%
0402
Std
Std
1
R4
9.31k
Resistor, Chip, 1/16W, 1%
0402
Std
Std
1
R40
154k
Resistor, Chip, 1/16W, 1%
0402
Std
Std
1
R41
88.7K
Resistor, Chip, 1/16W, 1%
0402
Std
Std
1
R42
113k
Resistor, Chip, 1/16W, 1%
0402
Std
Std
0
R43, R44
Open
Resistor, Chip, 1/2W, 1%
2010
STD
STD
-7-
STD
7443551221
Wurth
‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾
1
R45
3.3
Resistor, Chip, 1/10W, 1%
0805
Std
Std
2
R46, R47
200
Resistor, Chip, 1/2W, 1%
2010
Std
Std
1
R5
432k
Resistor, Chip, 1/16W, 1%
0402
Std
Std
2
R6, R27
1.00k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R7
10
Resistor, Chip, 1/16W, 1%
0603
Std
Std
3
R15, R32, R34
23.2k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R8
100
Resistor, Chip, 1/16W, 1%
0402
Std
Std
0
R9
OPEN
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
SH1, SH2
0
TP1, TP18, TP19
STD
Test Point, 0.020 Hole
1
TP10
STAT2
Test Point, White, Thru Hole Color Keyed
1
TP11
REGN
Test Point, White, Thru Hole Color Keyed
1
TP12
VREF
Test Point, White, Thru Hole Color Keyed
1
TP3, TP13
GND
Test Point, Black, Thru Hole Color Keyed
1
TP14
VCC
Test Point, White, Thru Hole Color Keyed
1
TP15
CHGEN
Test Point, White, Thru Hole Color Keyed
Short jumper
STD
STD
5002
Keystone
5002
Keystone
5002
Keystone
1
TP9
STAT1
Test Point, White, Thru Hole Color Keyed
0.100 x 0.100
inch
0.100 x 0.100
inch
0.100 x 0.100
inch
0.100 x 0.100
inch
0.100 x 0.100
inch
0.100 x 0.100
inch
0.100 x 0.100
inch
0.100 x 0.100
inch
0.100 x 0.100
inch
0.100 x 0.100
inch
0.100 x 0.100
inch
0.100 x 0.100
inch
0.100 x 0.100
inch
5002
Keystone
1
U1
bq24610RGE
IC,
QFN-24
bq24610RGE
TI
1
U2
INA169
IC, 2.7V to 60V High-Side Current Shunt Monitor
SOT23-5
INA169
TI
1
U3
UCC27201QDD
IC, High Freq. Half Bridge Driver, 120V 3A Peak
EPSO-8
UCC27201QDD
TI
1
U4
LM2903PW
IC, Dual Differential Comparators, 2-36 Vin
TSSOP-8 (PW)
LM2903PW
TI
1
U5
LM358AD
IC, Dual Operational Amplifiers
SO-8
LM358AD
TI
1
U6
TPS54060DGQ
IC, DC-DC Converter, 60V, 0.5A
MSOP-10
TPS54060DGQ
TI
1
--
HPA603
PCB, 4 In x 4 In x 0.62 In
HPA603
Any
1
TP17
BTST
Test Point, White, Thru Hole Color Keyed
3
TP2, TP4,TP5
5002
Test Point, White, Thru Hole Color Keyed
1
TP16
TS
Test Point, White, Thru Hole Color Keyed
1
TP6
TTC
Test Point, White, Thru Hole Color Keyed
1
TP7
ISET2
Test Point, White, Thru Hole Color Keyed
1
TP8
ISET1
Test Point, White, Thru Hole Color Keyed
-8-
5001
Keystone
5002
Keystone
5002
Keystone
5002
Keystone
5002
Keystone
5002
Keystone
5002
Keystone
5002
Keystone
5002
Keystone
‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾
4.2
Board Layout
Figure 2. Top Layer
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‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾
Figure 3. 2nd Layer
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‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾
Figure 4 3rd Layer
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‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾
Figure 5. Bottom Layer
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‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾
Figure 6. Top Assembly
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‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾
Figure 7. Bottom Assembly
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‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾‾
4.3
Schematics
Figure 8. Schematic
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IMPORTANT NOTICE
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Copyright 2007, Texas Instruments Incorporated
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EVM IMPORTANT NOTICE
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Copyright 2007, Texas Instruments Incorporated
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