Datasheet - LS Research

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Integrated Transceiver Modules for WLAN 802.11 b/g/n,

Bluetooth, and ANT

FEATURES



IEEE 802.11 b,g,n,d,e,i, compliant

Typical WLAN Transmit Power: o 18.3dBm, 11 Mbps, CCK (b) o 12.6 dBm, 54 Mbps, OFDM (g) o 9.5 dBm, 65 Mbps, OFDM (n)

Typical WLAN Sensitivity: o -89 dBm, 8% PER, 11 Mbps o -76 dBm, 10% PER, 54 Mbps o -73 dBm, 10% PER, 65 Mbps

Bluetooth 2.1+EDR, Power Class 1.5

Full support for ANT

Miniature footprint: 18 mm x 13 mm

Low height profile: 1.9 mm

U.FL connector for external antenna

Terminal for PCB/Chip antenna feeds

Integrated band-pass filter

Worldwide acceptance: FCC (USA), IC

(Canada), ETSI (Europe), Giteki (Japan)

Modular certification allows reuse of LSR

FCC ID and ETSI certification without repeating the expensive testing on your end product

Compact design based on Texas

Instruments WL1271 Transceiver

Seamless integration with TI OMAP™ application processors

SDIO Host data path interfaces

Bluetooth Advanced Audio Interfaces

Low power operation mode

RoHS compliant

DESCRIPTION

The TiWi-R2 module is a high performance 2.4 GHz

IEEE 802.11 b/g/n and Bluetooth 2.1+EDR radio in a cost effective, pre-certified footprint.

The module realizes the necessary PHY/MAC layers to support WLAN applications in conjunction with a host processor over a SDIO interface.

The module also provides a Bluetooth platform through the HCI transport layer. Both WLAN and

Bluetooth share the same antenna port.

Need to get to market quickly? Not an expert in

802.11 or Bluetooth? Need a custom antenna?

Would you like to own the design? Would you like a custom design? Not quite sure what you need?

Do you need help with your host board? LSR Design

Services will be happy to develop custom hardware or software, integrate the design, or license the design so you can manufacture yourself. Contact us at [email protected] or call us at 262-375-4400.

APPLICATIONS

Security

HVAC Control, Smart Energy

Sensor Networks

Medical

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

ORDERING INFORMATION

Order Number

450-0037

450-0037R

Description

TiWi-R2 Module with U.FL connector for external antenna

(Tray, SPQ = 100)

TiWi-R2 Module with U.FL connector for external antenna

(Tape and Reel, SPQ = 1000)

Table 1 Orderable TiWi-R2 Part Numbers

MODULE ACCESSORIES

Order Number Description

001-0001

2.4 GHz Dipole Antenna with Reverse Polarity

SMA Connector

080-0001

Table 2 Module Accessories

U.FL to Reverse Polarity SMA Bulkhead Cable

105mm

The information in this document is subject to change without notice.

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BLOCK DIAGRAM

TPS73028

VBAT

TPS62611

VIO

SLOW_CLK

HOST_SIGNALLING

HOST_INTERFACE

HOST_DEBUG

FAST_CLK

WLAN

WL_TX

WL_RX

FEM_CONTROL

PA_DETECTOR

PA_BIAS

PA

BT_TX_RX

BT

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

FEM

BPF

2.4

GHZ

RF

FM

WL1271

Figure 1 TiWi-R2 Module Block Diagram – Top-Level

MATCHING

MATCHING

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

TABLE OF CONTENTS

FEATURES ................................................................................................................................... 1

APPLICATIONS ............................................................................................................................ 1

DESCRIPTION .............................................................................................................................. 1

ORDERING INFORMATION .......................................................................................................... 2

MODULE ACCESSORIES ................................................................................................................ 2

BLOCK DIAGRAM ........................................................................................................................ 3

TIWI-R2 MODULE FOOTPRINT AND PIN DEFINITIONS .................................................................. 7

PIN DESCRIPTIONS ...................................................................................................................... 8

BT_FUNC2 and BT_FUNC5 Pins ............................................................................................................................ 10

BT_FUNC4 Pin ...................................................................................................................................................... 10

WL_UART_DBG Pin .............................................................................................................................................. 10

WL_RS232_RX and WL_RS232_TX Pins ................................................................................................................ 10

INI FILE RADIO PARAMETERS AND BLUETOOTH PATCH FILES ..................................................... 11

ELECTRICAL SPECIFICATIONS ..................................................................................................... 12

Absolute Maximum Ratings ................................................................................................................................. 12

Recommended Operating Conditions .................................................................................................................. 12

General Characteristics ........................................................................................................................................ 13

WLAN RF Characteristics ...................................................................................................................................... 15

Bluetooth RF Characteristics ................................................................................................................................ 17

WLAN POWER-UP SEQUENCE .................................................................................................... 18

WLAN POWER-DOWN SEQUENCE .............................................................................................. 20

BLUETOOTH POWER-UP SEQUENCE........................................................................................... 21

BLUETOOTH POWER-DOWN SEQUENCE .................................................................................... 22

ENABLE SCHEME ....................................................................................................................... 23

IRQ OPERATION ........................................................................................................................ 23

SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS ........................................................................ 24

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

BLUETOOTH HCI UART .............................................................................................................. 25

BLUETOOTH AUDIO CODEC INTERFACE...................................................................................... 27

Overview ............................................................................................................................................................. 27

PCM Hardware Interface ..................................................................................................................................... 27

Data Format ......................................................................................................................................................... 27

Frame-Idle Period ................................................................................................................................................ 28

Clock-Edge Operation .......................................................................................................................................... 29

Two Channel PCM Bus Example ........................................................................................................................... 29

Audio Encoding .................................................................................................................................................... 30

Improved Algorithm for Lost Packets ................................................................................................................... 30

BLUETOOTH PCM CLOCK MISMATCH HANDLING ....................................................................... 31

BLUETOOTH INTER-IC SOUND (I2S) ............................................................................................ 32

UDI SUPPORT ............................................................................................................................ 33

SDIO INTERFACE TIMING ........................................................................................................... 34

SDIO CLOCK TIMING .................................................................................................................. 35

SOLDERING RECOMMENDATIONS ............................................................................................. 36

Recommended Reflow Profile for Lead Free Solder ............................................................................................. 36

CLEANING ................................................................................................................................. 37

OPTICAL INSPECTION ................................................................................................................ 37

REWORK ................................................................................................................................... 37

SHIPPING, HANDLING, AND STORAGE ....................................................................................... 37

Shipping ............................................................................................................................................................... 37

Handling .............................................................................................................................................................. 37

Moisture Sensitivity Level (MSL) .......................................................................................................................... 37

Storage ................................................................................................................................................................ 37

Repeating Reflow Soldering ................................................................................................................................. 38

AGENCY CERTIFICATIONS .......................................................................................................... 39

AGENCY STATEMENTS ............................................................................................................... 39

Federal Communication Commission Interference Statement ............................................................................. 39

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Industry Canada Statements ................................................................................................................................ 40

OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS ............. 41

OEM LABELING REQUIREMENTS FOR END-PRODUCT ................................................................. 41

OEM END PRODUCT USER MANUAL STATEMENTS ..................................................................... 43

EUROPE .................................................................................................................................... 44

CE Notice ............................................................................................................................................................. 44

Declaration of Conformity (DOC) ......................................................................................................................... 44

MECHANICAL DATA ................................................................................................................... 45

TAPE AND REEL SPECIFICATION ................................................................................................. 47

DEVICE MARKINGS .................................................................................................................... 48

CONTACTING LSR ...................................................................................................................... 52

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

TIWI-R2 MODULE FOOTPRINT AND PIN DEFINITIONS

To apply the TiWi-R2 module, it is important to use the module pins in your application as they are designated in below and in the corresponding pin definition table found on pages 8 and 9. Not all the pins on the TiWi-R2 module may be used, as some are reserved for future functionality.

Figure 2 TiWi-R2 Pinout (Top View)

The information in this document is subject to change without notice.

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PIN DESCRIPTIONS

Module

Pin

14

15

16

17

18

9

10

11

12

13

7

8

5

6

3

4

1

2

22

23

24

25

19

20

21

26

27

28

29

30

Name

VBAT

BT_FUNC5

WL_UART_DBG

WLAN_IRQ

BT_EN

FM_EN

WL_RS232_RX

WL_RS232_TX

FM_I2S_FSYNC

WL_EN

VIO

GND

SDIO_D3

SDIO_D2

SDIO_D1

SDIO_D0

SDIO_CMD

SDIO_CLK

SLOW_CLK

FM_IRQ

FM_SDA

FM_SCL

FM_I2S_CLK

FM_I2S_DI

FM_I2S_DO

FM_AUD_RIN

FM_AUD_LIN

FMRFOUT

FMRFIN

GND

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

I/O

Type

DIO

DIO

DIO

DIO

DI

DO

DI

PI

GND

DIO

DI

DI

DI

DO

PI

DO

DIO

DO

DI

DO

DO

DO

DO

DI

DO

AI

AI

AO

AI

GND

Buffer

Type

Logic

Level

Description

- - Battery Voltage 3.6 VDC Nominal (3.0-4.8 VDC)

4 mA 1.8 VDC HOST_WU (*)

4 mA 1.8 VDC WL_UART_DBG

4 mA 1.8 VDC WLAN Interrupt Request

-

-

1.8 VDC Bluetooth Enable

1.8 VDC NOT SUPPORTED, CONNECT TO GND

- 1.8 VDC WLAN TEST UART RX (*)

4 mA 1.8 VDC WLAN TEST UART TX (*)

4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT

- 1.8 VDC WLAN Enable

-

-

-

-

POWER SUPPLY FOR 1.8 VDC DIGITAL DOMAIN

Ground

8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP

8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP

8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP

8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP

8 mA 1.8 VDC HOST PULL UP

- 1.8 VDC HOST PULL UP

-

-

-

-

-

- 1.8 VDC SLEEP CLOCK (32 kHz)

4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT

4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT

4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT

4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT

4 mA 1.8 VDC NOT SUPPORTED, CONNECT TO GND

4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT

-

-

-

-

-

NOT SUPPORTED, CONNECT TO GND

NOT SUPPORTED, CONNECT TO GND

NOT SUPPORTED, NO CONNECT

NOT SUPPORTED, CONNECT TO GND

Ground

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Module

Pin

Name

I/O

Type

Buffer

Type

Logic

Level

Description

39

40

41

42

43

44

45

46

35

36

37

38

31

32

33

34

50

51

52

47

48

49

FM_AUD_ROUT

FM_AUD_LOUT

AUD_FSYNC

HCI_RX

HCI_RTS

HCI_TX

AUD_CLK

AUD_OUT

HCI_CTS

AUD_IN

BT_FUNC2

BT_FUNC4

VDD_LDO_CLASS_1P5

GND

GND

GND

GND

ANT

GND

GND

GND

GND

AO

AO

DIO

DI

DO

DIO

DO

DO

DI

DI

DI

DO

NC

GND

GND

GND

GND

RF

GND

GND

GND

GND

-

-

4 mA 1.8 VDC Bluetooth HCI UART CTS (*)

4 mA 1.8 VDC PCM I/F (*)

4 mA 1.8 VDC Bluetooth Wakeup[DI] / DC2DC mode[DO](*)

4 mA 1.8 VDC BT_UARTD (DEBUG) (*)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

NOT SUPPORTED, NO CONNECT

NOT SUPPORTED, NO CONNECT

4 mA 1.8 VDC PCM I/F

8 mA 1.8 VDC Bluetooth HCI UART RX (*)

4 mA 1.8 VDC Bluetooth HCI UART RTS (*)

8 mA 1.8 VDC Bluetooth HCI UART TX

4 mA 1.8 VDC PCM I/F (*)

4 mA 1.8 VDC PCM I/F (*)

-

-

-

- VBAT VOLTAGE PRESENT, NO CONNECT

Ground

Ground

Ground

Ground

Antenna terminal for WLAN and Bluetooth (Note [1])

Ground

Ground

Ground

Ground

PI = Power Input PO = Power Output DI = Digital Input (1.8 VDC Logic Level) DO=Digital Output (1.8 VDC Logic Level)

AI = Analog Input

AO = Analog Output AIO = Analog Input/Output

Note[1]: Antenna terminal presents d.c. short circuit to ground.

RF = RF Port

(*) indicates that pin is capable of bidirectional operation, but is used as the type shown.

GND = Ground

Table 3 TiWi-R2 Module Pin Descriptions

All digital I/O signals use 1.8V logic. If the host microcontroller does not support 1.8V logic, then level shifters MUST be used.

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

BT_FUNC2 and BT_FUNC5 Pins

When BT is awake and active, BT_WU (BT_FUNC2) is high (from host to module). This is an active high signal.

The host puts the BT section to sleep by de-asserting (logic low level) the BT_WU signal (input to the module).

The module then drives HOST_WU (BT_FUNC5) low to acknowledge to the host that it is has been put into sleep mode.

Using these pins is optional.

BT_FUNC4 Pin

The BT_FUNC4 (BT_UARTD) pin is a debug pin. It is a 1.8V logic UART TX line. This pin should never need to be used in normal operation. It may be useful to terminate this pin to a test point or header in case it is needed.

WL_UART_DBG Pin

The WL_UART_DBG pin is a debug pin. It is a 1.8V logic UART TX line. This pin should never need to be used in normal operation. It may be useful to terminate this pin to a test point or header in case it is needed.

WL_RS232_RX and WL_RS232_TX Pins

These pins are used for a WLAN test mode interface. Both pins are 1.8V logic level UART pins. These pins should be brought out to a header on the host PCB. The WLAN test interface can be used to place the module into constant packet transmit and constant packet receive modes. These modes can be useful for antenna and sensitivity testing.

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

INI FILE RADIO PARAMETERS AND BLUETOOTH PATCH FILES

There are ini files that contains WLAN radio parameters which are critical to both the RF performance and EMC compliance of the module in various antenna configurations.

The ini files available on the LSR wiki website are only intended to be used with the LSR WLAN Eval Tool. Note that the ini file will not work when using the TiWi-R2 module in normal operation which typically involves an operating system. To use the TiWi-R2 module in normal operation, refer to specifics contained in the TiWi

Family INI File Radio Parameter User Guide which is also available for download on the LSR wiki website, http://wiki.lsr.com/ .

The settings specified in the appropriate ini file must be used to operate the module in compliance with the modular certification for FCC or ETSI. There are two ini files for operating the module in compliance with FCC regulations that corresponds to different antenna configuration, and a different ini file for operating the module in compliance with the ETSI regulations.

The Bluetooth patch files are available on the LSR wiki website. The appropriate patch file must be selected to operate the module in compliance with the modular certification for FCC or ETSI.

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

ELECTRICAL SPECIFICATIONS

The majority of these characteristics are based on controlling and conditioning the tests using the TiWi-R2 control software application. Other control conditions may require these values to be re-characterized by the customer.

Absolute Maximum Ratings

Parameter

Power supply voltage (VBAT)

(4)(5)

Digital supply voltage (VIO)

Voltage on any GPIO

Voltage on any Analog Pins

(3)

RF input power, antenna port

Operating temperature

(6)

Storage temperature

Min

-0.5

-0.5

-0.5

-0.5

-40

-55

Max

+5.5

2.1

VIO + 0.5

2.1

+10

+85

+125

Unit

V

V

V

V dBm

ºC

ºC

1. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device and are not covered by the warranty. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

2. All parameters are measured as follows unless stated otherwise: VDD_IN=1.8V, VDDIO_1.8V=1.8V, VDD_LDO_CLASS1P5=3.6V

3. Analog pins: XTALP, XTALM, RFIOBT, DRPWRXBM, DRPWRXBP, DRPWTXB, and also FMRFINP, FMRFINM, FMRFINM, FMAUDLIN,

FMAUDRIN, FMAUDLOUT, FMAUDROUT

4. The following signals are from the VBAT group, PMS_VBAT and VDD_LDO_CLASS1P5 (if BT class 1.5 direct VBAT is used).

5. Maximum allowed depends on accumulated time at that voltage; 4.8V for 7 years lifetime, 5.5V for 6 hours cumulative.

6. The device can be reliably operated for 5,000 active-WLAN cumulative hours at T

A

of 85 o C.

Table 4 Absolute Maximum Ratings

Recommended Operating Conditions

Parameter Min Typ Max

V

BAT

VIO

V

IH

V

IL

3.0

1.62

0.65 x VIO

0

3.6

1.8

-

-

V

OH

@ 4, 8 mA

V

OL

@ 4, 8 mA

Ambient temperature range

VIO - 0.45

0

-40

-

-

25

Table 5 Recommended Operating Conditions

4.8

1.92

VIO

0.35 x VIO

VIO

0.45

85

Unit

V

V

V

V

V

V

ºC

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

General Characteristics

Parameter

WLAN RF frequency range

WLAN RF data rate

BT RF frequency Range

Min Typ

2412

1

802.11 b/g/n rates supported

2402

Table 6 General Characteristics

Max

2472

65

2480

Unit

MHz

Mbps

MHz

Power Consumption - WLAN

Parameter

CCK (802.11b)

TX Current

OFDM (802.11g)

TX Current

OFDM (802.11n)

TX Current

Test Conditions

2437 MHz, V

BAT

=3.6V, T amb

=+25°C

Po=18.3 dBm, 11 Mbps CCK

L=1200 bytes, t delay

(idle)=4 S

2437 MHz, V

BAT

=3.6V, T amb

=+25°C

Po=12.6 dBm, 54 Mbps OFDM

L=1200 bytes, t delay

(idle)=4 S

2437 MHz, V

BAT

=3.6V, T amb

=+25°C

Po=9.5 dBm, 65 Mbps OFDM

L=1200 bytes, t delay

(idle)=4 S

Min

-

-

-

Typ

270

171

152

Max

-

-

-

Unit

mA mA mA

CCK (802.11b)

RX Current

OFDM (802.11g)

RX Current

OFDM (802.11n)

RX Current

Dynamic Mode [1]

-

-

-

-

100

100

100

<1.2

-

-

-

- mA mA mA mA

[1] Total Current from V

BAT

for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon reception in

Listen Mode.

Table 7 WLAN Power Consumption

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

Power Consumption - Bluetooth

Parameter

GFSK TX Current

EDR TX Current

GFSK RX Current

EDR RX Current

Deep Sleep Current

Test Conditions Min

Constant Transmit, DH5, PRBS9

Constant Transmit, 2DH5,3DH5, PRBS9

Constant Receive, DH1

Constant Receive, 2DH5, 3DH5

-

-

-

-

Deep Sleep Mode -

Table 8 Bluetooth Power Consumption

DC Characteristics – General Purpose I/O

Parameter

VIO Current

Logic input low, V

IL

Logic input high, V

IH

Logic output low, V

OL

(Full Drive)

Logic output low, V

OL

(Reduced Drive)

Logic output high, V

OH

(Full Drive)

Logic output high, V

OH

(Reduced Drive)

Test Conditions Min Typ

Iout = 8 mA

Iout = 4 mA

Iout = 1 mA

Iout = 0.09 mA

Iout = -8 mA

Iout = -4 mA

0

0.65 x VIO

0

0

0

0

VIO - 0.45

VIO - 0.45

Iout = -1 mA

Iout = -0.3 mA

VIO - 0.112

VIO - 0.033

Table 9 DC Characteristics General Purpose I/O

-

-

-

-

-

-

-

-

-

-

-

Typ

45

43

35

41

70

DATASHEET

Max

16

0.35 x VIO

VIO

0.45

0.45

0.112

0.01

VIO

VIO

VIO

VIO

Max

-

-

-

-

-

Unit

mA mA mA mA

µA

Unit

V

V

V

V

V

V

V mA

V

V

V

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

WLAN RF Characteristics

WLAN Transmitter Characteristics

(TA=25°C, VBAT=3.6 V)

Parameter

11 Mbps CCK (802.11b)

TX Output Power

9 Mbps OFDM (802.11g) TX

Output Power

54 Mbps OFDM (802.11g) TX

Output Power

6.5 Mbps OFDM (802.11n) TX

Output Power

65 Mbps OFDM (802.11n) TX

Output Power

Test Conditions Min

11 Mbps CCK , 802.11(b) Mask Compliance,

35% EVM

RMS power over TX packet

9 Mbps OFDM , 802.11(g) Mask

Compliance, -8 dB EVM

RMS power over TX packet

-

-

54 Mbps OFDM, 802.11(g) Mask

Compliance, -25 dB EVM

RMS power over TX packet

6.5 Mbps OFDM, 802.11(n) Mask

Compliance, -5 dB EVM

RMS power over TX packet

-

-

65 Mbps OFDM, 802.11(n) Mask

Compliance, -28 dB EVM

RMS power over TX packet

Table 10 WLAN Transmitter RF Characteristics

-

Typ

18.3

17.6

12.6

17.7

9.5

DATASHEET

Max Unit

-

-

-

-

- dBm dBm dBm dBm dBm

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

WLAN Receiver Characteristics

(TA=25°C, VBAT=3.6 V) [1]

Parameter Test Conditions Min Typ Max Unit

1 Mbps CCK (802.11b)

RX Sensitivity

11 Mbps CCK (802.11b)

RX Sensitivity

9 Mbps OFDM (802.11g)

RX Sensitivity

54 Mbps OFDM (802.11g) RX

Sensitivity

6.5 Mbps OFDM (802.11n) RX

Sensitivity

65 Mbps OFDM (802.11n) RX

Sensitivity

11 Mbps CCK (802.11b)

RX Overload Level

6 Mbps OFDM (802.11g)

RX Overload Level

8% PER

8% PER

10% PER

10% PER

10% PER

10% PER

8% PER

10% PER

-

-

-

-

-

-

-

-

-97

-89

-90

-76

-91

-73

-

-

-

-

-

-

-

--

-10

-20 dBm dBm dBm dBm dBm dBm dBm dBm

54 Mbps OFDM (802.11g)

RX Overload Level

65 Mbps OFDM (802.11n)

RX Overload Level

10% PER

10% PER

-

-

-

-

-20

-20

[1] Up to 2 dB degradation at Channel 13 for 11g/n modes and up to 2 dB degradation at Channel 14 for 11b/g/n modes. dBm dBm

Table 11 WLAN Receiver RF Characteristics

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

Bluetooth RF Characteristics

Bluetooth Transmitter GFSK and EDR Characteristics, Class 1.5

(TA=25°C, VBAT=3.6 V)

Parameter

GFSK RF Output Power

EDR RF Output Power

Power Control Step Size

EDR Relative Power

Bluetooth Receiver Characteristics

(TA=25°C, VBAT=3.6 V)

Test

Conditions

Min Typ Max

-

-

2

-2

9.5

7

4

-

-

8

1

Table 12 Bluetooth Transmitter RF Characteristics

Parameter

GFSK Sensitivity

EDR 2 Mbps Sensitivity

EDR 3 Mbps Sensitivity

GFSK Maximum Input Level

EDR 2 Maximum Input Level

EDR 3 Maximum Input Level

Test

Conditions

Min Typ Max

BER=0.1%

BER=0.01%

BER=0.01%

BER=0.1%

BER=0.1%

-

-

-

-

-

-92

-91

-82

-5

-10

BER=0.1% - -10 -

Table 13 Bluetooth Receiver RF Characteristics

-

-

-

-

-

DATASHEET

Bluetooth Spec

-

2-8

-4/+1

Bluetooth Spec

-70

-70

-70

-20

-

-

Unit

dBm dBm dB dB

Unit

dBm dBm dBm dBm dBm

-

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

WLAN POWER-UP SEQUENCE

The following sequence describes device power-up from shutdown. Only the WLAN Core is enabled; the

Bluetooth and FM cores are disabled.

Figure 3 TiWi-R2 Power-up Sequence Requirements

1. No signals are allowed on the IO pins if no IO power is supplied, because the IOs are not 'fail safe’. Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can tolerate external voltages with no VDDS and DC2DC".

2. VBAT, VIO, and SLOWCLK must be available before WL_EN.

3. T wakeup

= T1 + T2

The duration of T1 is defined as the time from WL_EN=high until F

REF

is valid for the SoC. T1=~55ms

The duration of T2 depends on:

– Operating system

– Host enumeration for the SDIO/WSPI

– PLL configuration

– Firmware download

– Releasing the core from reset

The information in this document is subject to change without notice.

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– Firmware initialization

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

The information in this document is subject to change without notice.

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WLAN POWER-DOWN SEQUENCE

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Notes:

1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)

2. DC_REQ and CLK_REQ are internal signals shown for reference only

Figure 4 TiWi-R2 Module Power-down Sequence Requirements

1. DC_REQ will go low only if WLAN is the only core working. Otherwise if another core is working (e.g BT) it will stay high.

2. CLK_REQ will go low only if WLAN is the only core working. Otherwise if another core is working and using the

F

REF

(e.g BT) it will stay high.

3. If WLAN is the only core that is operating, WL_EN must remain de-asserted for at least 64 sec before it is reasserted.

The information in this document is subject to change without notice.

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DATASHEET

BLUETOOTH POWER-UP SEQUENCE

The following sequence describes device power up from shutdown. Only the Bluetooth core is enabled; the WLAN core is disabled.

Notes:

1. (A) After this sequence is completed, the device is in the low VIO-leakage state while in shutdown

2. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)

3. DC_REQ, CLK_REQ, and F

REF are internal signals shown for reference only

Figure 5 Bluetooth Power-up Sequence

Power up requirements:

1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'. Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can tolerate external voltages with no VDDS and DC2DC.

2. VDDS and SLOWCLK must be stable before releasing BT_EN.

3. Fast clock must be stable maximum 55 ms after BT_EN goes HIGH.

The information in this document is subject to change without notice.

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BLUETOOTH POWER-DOWN SEQUENCE

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Notes:

1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)

2. DC_REQ and CLK_REQ are internal signals shown for reference only

Figure 6 Bluetooth Power-down Sequence

The TiWi-R2 module indicates completion of Bluetooth power up sequence by asserting HCI_RTS low. This occurs up to 100 ms after BT_EN goes high.

The information in this document is subject to change without notice.

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DATASHEET

ENABLE SCHEME

The module has 3 enable pins, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2 modes of active operation now supported: WLAN and Bluetooth. It is recommended that the FM_EN pin be grounded to disable the FM section. It is also recommended that the FM section be disabled by Bluetooth HCI commands.

1. Each core is operated independently by asserting each signal EN to Logic '1’. In this mode it is possible to control each core asynchronously and independently.

2. Bluetooth mode operation. WLAN will be operated through WL_EN asynchronously and independently of Bluetooth.

IRQ OPERATION

1. The default state of the WLAN_IRQ prior to firmware initialization is 0.

2. During firmware initialization, the WLAN_IRQ is configured by the SDIO module; a WLAN_IRQ changes its state to

1.

3. A WLAN firmware interrupt is handled as follows: a. The WLAN firmware creates an Interrupt-to-Host, indicated by a 1-to-0 transition on the

WLAN_IRQ line (host must be configured as active-low or falling-edge detect). b. After the host is available, depending on the interrupt priority and other host tasks, it masks the firmware interrupt. The WLAN_IRQ line returns to 1 (0-to-1 transition on the WLAN_IRQ line). c. The host reads the internal register status to determine the interrupt sources - the register is cleared after the read. d. The host processes in sequence all the interrupts read from this register e. The host unmasks the firmware interrupts.

4.

The host is ready to receive another interrupt from the WLAN device.

The information in this document is subject to change without notice.

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DATASHEET

SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS

The slow clock is always supplied from an external source. It is input on the SLOW_CLK pin, and can be a digital signal in the

range of VIO only. For slow clock frequency and accuracy refer to

Table 14

. The external slow clock must be stable before

the system exits from shut down mode.

Parameter

[1]

Condition Symbol Min Typ Max Unit

Input slow clock frequency

Input slow clock accuracy

Input transition time T r

/T f

– 10% to 90%

Frequency input duty cycle

Input voltage limits

Input impedance

Input capacitance

Rise and fall time

Phase noise

WLAN, BT

T r

/T f

30

Square wave,

DC coupled

1 kHz

VIH

VIL

0.65 x VIO

0

1

Table 14 Slow Clock Source Requirements

32768

50

+/-250

100

70

VIO

0.35 x VIO

5

100

-125

Hz ppm ns

%

V peak

MΩ pF ns dBc/Hz

[1] Slow clock is a fail safe input

The information in this document is subject to change without notice.

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BLUETOOTH HCI UART

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Figure 7 Bluetooth UART Timing

Table 15 Bluetooth UART Timing

The information in this document is subject to change without notice.

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DATASHEET

Figure 8 Bluetooth UART Data Frame

Table 16 Bluetooth UART Data Frame

The information in this document is subject to change without notice.

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DATASHEET

BLUETOOTH AUDIO CODEC INTERFACE

Overview

The CODEC interface is a fully dedicated programmable serial port that provides the logic to interface to several kinds of

PCM or I

2

S codecs. The interface supports:

Two voice channels

Master / slave modes

Coding schemes: μ-Law, A-Law, Linear, Transparent

Long & short frames

Different data sizes, order and positions

UDI profile

High rate PCM interface for EDR

Enlarged interface options to support a wider variety of Codecs

PCM bus sharing

PCM Hardware Interface

The PCM interface is one implementation of the codec interface. It contains the following four lines:

Clock--configurable direction (input or output)

Frame Sync--configurable direction (input or output)

Data In--Input

Data Out--Output/Hi-Z

The WL1271 device can be either the master of the interface where it generates the clock and the framesync signals, or slave where it receives these two signals. The PCM interface is fully configured by means of a VS command.

For slave mode, clock input frequencies of up to 16MHz are supported. At clock rates above 12MHz, the maximum data burst size is 32 bits.

For master mode, the WL1271 can generate any clock frequency between 64kHz and 4.096MHz.

Data Format

The data format is fully configurable:

The data length can be from 8 to 320 bits, in 1-bit increments, when working with two channels, or up to 640 bits when using 1 channel. The data length can be set independently for each channel.

The data position within a frame is also configurable with 1-clock (bit) resolution, and can be set independently

(relative to the edge of the Frame Sync signal) for each channel.

The Data_In and Data_Out bit order can be configured independently. For example; Data_In can start with MSB while Data_Out starts with LSB. Each channel is separately configurable. The inverse bit order (i.e. LSB first) is supported only for sample sizes up to 24 bits.

The data in and data out size do not necessarily have to be the same length.

The Data_Out line is configured as a ‘high-Z’ output between data words. Data_Out can also be set for permanent high-Z, irrespective of data out. This allows the WL1271 to be a bus slave in a multi-slave PCM environment. At power up, Data_Out is configured as high-Z.

The information in this document is subject to change without notice.

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DATASHEET

Frame-Idle Period

The CODEC interface has the capability for frame-idle periods, where the PCM clock can “take a break” and become ‘0’ at the end of the PCM frame, after all data has been transferred.

The WL1271 supports frame-idle periods both as master and slave of the PCM bus.

When WL1271 is the master of the interface, the frame-idle period is configurable. There are 2 configurable parameters:

Clk_Idle_Start - Indicates the number of PCM clock cycles from the beginning of the frame till the beginning of the idle period. After Clk_Idle_Start clock cycles, the clock becomes ‘0’.

Clk_Idle_End – Indicates the time from the beginning of the frame till the end of the idle period. This time is given in multiples of PCM clock periods.

The delta between Clk_Idle_Start and Clk_Idle_End is the clock idle period. e.g. For PCM clock rate = 1MHz, frame sync period = 10kHz, Clk_Idle_Start = 60, Clk_Idle_End = 90.

Between each two-frame sync there are 70 clock cycles (instead of 100). The clock idle period starts 60 clock cycles after the beginning of the frame and lasts 90-60=30 clock cycles. This means that the idle period ends 100-90=10 clock cycles before the end of the frame. The data transmission must end prior to the beginning of the idle period.

Figure 9 Frame Idle Period

The information in this document is subject to change without notice.

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DATASHEET

Clock-Edge Operation

The CODEC interface of the WL1271 can work on the rising or the falling edge of the clock. It also has the ability to sample the frame sync and the data at inversed polarity.

The following diagram shows the operation of a falling-edge-clock type of codec. The codec is the master of the PCM bus.

The frame-sync signal is updated (by the codec) on the falling clock edge and therefore is sampled (by the WL1271) on the next rising clock. The data from the codec is sampled (by the WL1271) on the clock falling edge.

Figure 10 Negative Clock Edge PCM Operation

Two Channel PCM Bus Example

In the following figure, a 2-channel PCM bus is shown where the two channels have different word sizes and arbitrary positions in the bus’ frame. (FT stands for Frame Timer)

Figure 11 2 Channels PCM Bus Timing

The information in this document is subject to change without notice.

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DATASHEET

Audio Encoding

The WL1271 CODEC interface can use one of four audio coding patterns:

A-Law (8-bit)

μ-Law (8-bit)

Linear (8 or 16-bit)

Transparent

Improved Algorithm for Lost Packets

The WL1271 features an improved algorithm for improving voice quality when received voice data packets go missing.

There are two options:

Repeat the last sample – possible only for sample sizes up to 24 bits. For sample sizes >24 bits, the last byte is repeated.

Repeat a configurable sample of 8-24 bits (depends on the real sample size), in order to simulate silence (or anything else) in the PCM bus. The configured sample is written in a specific register for each channel.

The choice between those two options is configurable separately for each channel.

The information in this document is subject to change without notice.

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DATASHEET

BLUETOOTH PCM CLOCK MISMATCH HANDLING

In BT RX, the WL1271 receives RF voice packets and writes these to the CODEC I/F. If the WL1271 receives data faster than the CODEC I/F output allows, an overflow occurs. In this case, the WL1271 BT function has 2 possible behavior modes:

‘allow overflow’ and ‘don’t allow overflow’.

If overflow is allowed, the WL1271 BT function continues receiving data and overwrites any data not yet sent to the CODEC.

If overflow is not allowed, RF voice packets received when buffer is full, are discarded

The information in this document is subject to change without notice.

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DATASHEET

BLUETOOTH INTER-IC SOUND (I2S)

The WL1271 can be configured as an Inter-IC Sound (I2S) serial interface to an I2S CODEC device. In this mode, the WL1271 audio CODEC interface is configured as a bi-directional, full duplex interface, with two time slots per frame: Time slot 0 is used for the left channel audio data and time slot 1 for the right channel audio data. Each time slot is configurable up to 40 serial clock cycles in length and the frame is configurable up to 80 serial clock cycles in length.

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

UDI SUPPORT

The UDI profile defines the protocols and procedures that are used by devices implementing UDI for the 3G mobile phone systems, such as devices with Bluetooth connections to a 3G Handset, communicating via video phone over a 3G network.

Up to 2 channels of UDI data can be supported. The data is transferred via the CODEC interface using transparent mode, and is sent out using eSCO EV4 Bluetooth packets (EV5 is also selectable).

The information in this document is subject to change without notice.

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SDIO INTERFACE TIMING

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Table 17 SDIO Interface Read (see Figure 12)

Figure 12 SDIO Single Block Read

Table 18 SDIO Interface Write (see Figure 13)

Figure 13 SDIO Single Block Write

The information in this document is subject to change without notice.

330-0045-R5.5 Copyright © 2010-2016 LSR Page 34 of 52

SDIO CLOCK TIMING

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Table 19 SDIO Clock Timing

Figure 14 SDIO Clock Timing

The information in this document is subject to change without notice.

330-0045-R5.5 Copyright © 2010-2016 LSR Page 35 of 52

SOLDERING RECOMMENDATIONS

Recommended Reflow Profile for Lead Free Solder

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic

Assemblies, section 8.2.4 Castellated Terminations.”

Figure 15 Reflow Profile

The information in this document is subject to change without notice.

330-0045-R5.5 Copyright © 2010-2016 LSR Page 36 of 52

CLEANING

In general, cleaning populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process.

Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.

Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.

Ultrasonic cleaning could damage the module permanently.

OPTICAL INSPECTION

After soldering the Module to the host board, consider optical inspection to check the following:

Proper alignment and centering of the module over the pads.

Proper solder joints on all pads.

Excessive solder or contacts to neighboring pads or vias.

REWORK

The module can be unsoldered from the host board if the Moisture Sensitivity Level (MSL) requirements are met as described in this datasheet.

Never attempt rework on the module itself, e.g., replacing individual components. Such actions will terminate warranty coverage.

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

SHIPPING, HANDLING, AND STORAGE

Shipping

TiWi-R2 modules are delivered in trays of 100 or reels of 1,000.

Handling

The TiWi-R2 modules contain a highly sensitive electronic circuitry. Handling without proper ESD protection may damage the module permanently.

Moisture Sensitivity Level (MSL)

Per J-STD-020, devices rated as MSL 4 and not stored in a sealed bag with desiccant pack should be baked prior to use.

Devices are packaged in a Moisture Barrier Bag with a desiccant pack and Humidity Indicator Card (HIC).

Devices that will be subjected to reflow should reference the HIC and J-STD-033 to determine if baking is required.

If baking is required, refer to J-STD-033 for bake procedure.

Storage

Per J-STD-033, the shelf life of devices in a Moisture

Barrier Bag is 12 months at <40ºC and <90% room humidity (RH).

Do not store in salty air or in an environment with a high concentration of corrosive gas, such as Cl2,

H2S, NH3, SO2, or NOX.

Do not store in direct sunlight.

The product should not be subject to excessive mechanical shock.

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

Repeating Reflow Soldering

Only a single reflow soldering process is recommended for host boards.

DATASHEET

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

AGENCY CERTIFICATIONS

FCC ID: TFB-TIWI1-01, 15.247

IC ID: 5969A-TIWI101, RSS 210

CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489

Giteki: 209-J00157

SAR: This wireless mobile and/or portable device has been shown to be compliant for localized specific absorption rate (SAR) for uncontrolled environment/general exposure limits specified in ANSI/IEEE Std. C95.1-

1999 and had been tested in accordance with the measurement procedures specified in IEEE 1528-2003, OET

Bulletin 65 Supp. C, RSS-102 and Safety Code 6.

AGENCY STATEMENTS

Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part

15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Industry Canada Statements

Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.

This device has been designed to operate with the antenna(s) listed below, and having a maximum gain of 4.3 dBi (LSR Dipole), -0.6dBi (Ethertronics Prestta), and 3.0dBi (Taoglas Flexible Dipole). Antennas not included in this list or having a gain greater than 4.3 dBi, -0.6dBi, and 3.0dBi are strictly prohibited for use with this device.

The required antenna impedance is 50 ohms.

List of all Antennas Acceptable for use with the Transmitter

1) LSR 001-0001 center-fed dipole antenna and LSR 080-0001 U.FL to Reverse Polarity SMA connector cable.

2) Ethertronics Prestta 1000423 and Johnson Emerson U.FL to U.FL coaxial cable 415-0088-150.

3) Taoglas FXP831.07.0100C flexible dipole antenna with integrated cable and U.FL connector.

L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil.

Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une communication réussie.

Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de 4,3 dBi

(LSR dipôle),-0.6dBi (Ethertronics Prestta), et 3.0dBi (Taoglas Flexibles Dipôle). Antennes pas inclus dans cette liste ou ayant un gain supérieur à 4,3 dBi, 0.6dBi, et 3.0dBi sont strictement interdits pour une utilisation avec cet appareil. L'impédance d'antenne requise est de 50 ohms.

Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur

1) LSR 001-0001 alimenté par le centre antenne dipôle et LSR 080-0001 U.FL d'inversion de polarité du câble connecteur SMA.

2) Ethertronics Prestta 1000423 et Johnson Emerson U.FL d'un câble coaxial U.FL 415-0088-150.

3) Taoglas FXP831.07.0100C antenne dipôle flexible avec câble intégré et un connecteur U.FL.

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS

The TiWi-R2 Module has been certified for integration into products only by OEM integrators under the following conditions:

This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures.

As long as the two conditions above are met, further transmitter testing will not be required.

However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or colocation with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product

(including the transmitter) and obtaining a separate FCC and Industry Canada authorization.

Le module de TiWi-R2 a été certifié pour l'intégration dans des produits uniquement par des intégrateurs OEM dans les conditions suivantes:

Ce dispositif est accordé pour une utilisation dans des configurations mobiles seul dans lequel les antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au moins 20cm de toute personne et ne pas être colocalisés avec les autres émetteurs, sauf en conformité avec la

FCC et de l'Industrie Canada, multi-émetteur procédures produit.

Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil numérique, les exigences de périphériques PC, etc.)

NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations

Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de certification ne peut pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.

OEM LABELING REQUIREMENTS FOR END-PRODUCT

The TiWi-R2 module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification numbers are not visible when the module is installed inside another device, as such the end device into which

The information in this document is subject to change without notice.

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DATASHEET

the module is installed must display a label referring to the enclosed module. The final end product must be labeled in a visible area with the following:

Contains Transmitter Module FCC ID: TFB-TIWI1-01”

Contains Transmitter Module IC: 5969A-TIWI101” or

Contains FCC ID: TFB-TIWI1-01”

Contains IC: 5969A-TIWI101”

The OEM of the TiWi-R2 Module must only use the approved antenna(s) listed above, which have been certified with this module.

Le module de TiWi-R2 est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la FCC et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil, comme par exemple le terminal dans lequel le module est installé doit afficher une etiquette faisant référence au module ci-joint. Le produit final doit être étiqueté dans un endroit visible par le suivant:

“Contient Module émetteur FCC ID: TFB-TIWI1-01"

“Contient Module émetteur IC: 5969A-TIWI101"

ou

“Contient FCC ID: TFB-TIWI1-01"

“Contient IC: 5969A-TIWI101"

L’OEM du module TiWi-R2 ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce module.

The information in this document is subject to change without notice.

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DATASHEET

OEM END PRODUCT USER MANUAL STATEMENTS

The OEM integrator should not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product.

The user manual for the end product must include the following information in a prominent location:

This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures.

Other user manual statements may apply.

L'intégrateur OEM ne devrait pas fournir des informations à l'utilisateur final en ce qui concerne la façon d'installer ou de retirer ce module RF ou modifier les paramètres RF connexes dans le manuel utilisateur du produit final.

Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans unendroit bien en vue:

Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en conformité avec FCC et Industrie Canada, multi-émetteur procédures produit.

Autres déclarations manuel de l'utilisateur peuvent s'appliquer.

The information in this document is subject to change without notice.

330-0045-R5.5 Copyright © 2010-2016 LSR Page 43 of 52

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

EUROPE

CE Notice

This device has been tested and certified for use in the European Union. See the Declaration of Conformity

(DOC) for specifics.

If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU standards. A Declaration of Conformity must be issued and kept on file as described in the Radio and

Telecommunications Terminal Equipment (R&TTE) Directive.

The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive.

Declaration of Conformity (DOC)

This DOC can be downloaded from the LSR Wiki.

The information in this document is subject to change without notice.

330-0045-R5.5 Copyright © 2010-2016 LSR Page 44 of 52

MECHANICAL DATA

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Figure 16 Module Mechanical Dimensions (Maximum Module Height = 1.9 mm)

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

DATASHEET

Figure 17 TiWi-R2 Recommended PCB Footprint (Top View)

The information in this document is subject to change without notice.

330-0045-R5.5 Copyright © 2010-2016 LSR Page 46 of 52

TAPE AND REEL SPECIFICATION

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

(Module Must Be in this Orientation when Feeding Tape)

Figure 18 TiWi-R2 Tape and Reel Specification

The information in this document is subject to change without notice.

330-0045-R5.5 Copyright © 2010-2016 LSR Page 47 of 52

DEVICE MARKINGS

Rev 0 Devices

WL1271: WL1271A1YFVR PG2.1

Front End: TQM679002A

LS Research

TiWi01-R2

2D Bar

Code

00-XXXXXX

Where 00 = revision

XXXXXX = incremental serial number

2D Barcode Format is Data Matrix Standard

Rev 1 Devices

WL1271: WL1271BYFVR PG3.1

Front End: TQM679002A

Changed the WL1271 IC to WL1271BYFVR PG3.1.

LS Research

TiWi01-R2

2D Bar

Code

01-XXXXXX

Where 01 = revision

XXXXXX = incremental serial number

2D Barcode Format is Data Matrix Standard

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

The information in this document is subject to change without notice.

330-0045-R5.5 Copyright © 2010-2016 LSR Page 48 of 52

Rev 2 Devices

WL1271: WL1271BYFVR PG3.1

Front End: TQM679002A

Changed PCB supplier.

LS Research

TiWi-R2

2D Bar

Code

2-XXXXXX

Where 2 = revision

XXXXXX = incremental serial number

2D Barcode Format is Data Matrix Standard

Rev 3 Devices

WL1271: WL1271BYFVR PG3.1

Front End: TQM679002A

Incorporated PCB DFM improvements.

LS Research

TiWi-R2

2D Bar

Code

3-XXXXXX

Where 3 = revision

XXXXXX = incremental serial number

2D Barcode Format is Data Matrix Standard

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

Rev 4 Devices

WL1271: WL1271BYFVR PG3.1

Front End: TQM679002A

LSR logo changed from red to black.

Improvements to prevent solder from wicking to bottom pad on module pin 48.

Switched the locations of the serial number and model name on the label.

LS RESEARCH

4-XXXXXX

2D Bar

Code

Model: TiWi-R2

Where 4 = Revision

XXXXXX = incremental serial number

2D Barcode Format is Data Matrix Standard

Rev 5 Devices

WL1271: WL1271BYFVR PG3.1

Front End: TQM679002A

Improvements in the manufacturing process of the PCB.

LS RESEARCH

5-XXXXXX

2D Bar

Code

Model: TiWi-R2

Where 5 = Revision

XXXXXX = incremental serial number

2D Barcode Format is Data Matrix Standard

DATASHEET

The information in this document is subject to change without notice.

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TiWi-R2 TRANSCEIVER MODULE

Rev 6 Devices

WL1271: WL1271BYFVR PG3.1

Front End: TQM679002A

Updated the label to include FCC, IC, and Giteki EMC marking information.

Updated the label to include a Date Code.

DATASHEET

Where RX = Revision X

SSYYWWD = Date Code (YY=Year, WW=Week)

XXXXX = Incremental Serial Number

2D Barcode Format is Data Matrix Standard

The information in this document is subject to change without notice.

330-0045-R5.5 Copyright © 2010-2016 LSR Page 51 of 52

TiWi-R2 TRANSCEIVER MODULE

DATASHEET

CONTACTING LSR

Headquarters

Website

Sales Contact

LSR

W66 N220 Commerce Court

Cedarburg, WI 53012-2636

USA

Tel: (262) 375-4400

Fax: (262) 375-4248 www.lsr.com

[email protected]

The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”) products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR’S TERMS AND CONDITIONS OF SALE LOCATED ON

LSR’S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY

WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF

MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR

ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT

LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE

USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. LSR does not make any commitment to update the information contained herein. Unless specifically provided otherwise, LSR products are not suitable for, and shall not be used in, automotive applications. LSR’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.

The information in this document is subject to change without notice.

330-0045-R5.5 Copyright © 2010-2016 LSR Page 52 of 52

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