HP ProLiant ML310e User guide

HP ProLiant ML310e Gen8 Server
User Guide
Abstract
This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the
servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
Part Number: 682266-001a
April 2014
Edition: 1
© Copyright 2012, 2014 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or omissions contained herein.
Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.
Bluetooth® is a trademark owned by its proprietor and used by Hewlett-Packard Company under license.
Intel® Xeon®, Pentium®, Celeron®, and Intel® Core™ are trademarks of Intel Corporation in the U.S. and other countries.
Contents
Component identification ............................................................................................................... 7
Front panel components ................................................................................................................................ 7
Front panel LEDs and buttons ............................................................................................................... 8
Rear panel components ................................................................................................................................ 9
Rear panel LEDs and buttons ............................................................................................................. 10
System board components .......................................................................................................................... 11
DIMM slot locations .......................................................................................................................... 12
PCIe expansion slot definitions .......................................................................................................... 12
System maintenance switch ............................................................................................................... 12
NMI header .................................................................................................................................... 13
Drive numbering ........................................................................................................................................ 14
Hot-plug drive LED definitions ...................................................................................................................... 15
FBWC module LED definitions ..................................................................................................................... 16
Fan locations ............................................................................................................................................. 17
T-10/T-15 Torx screwdriver ......................................................................................................................... 17
Operations................................................................................................................................. 18
Power up the server .................................................................................................................................... 18
Power down the server ............................................................................................................................... 18
Unlock the tower bezel ............................................................................................................................... 19
Remove the tower bezel .............................................................................................................................. 19
Install the tower bezel ................................................................................................................................. 19
Remove the access panel ............................................................................................................................ 20
Install the access panel ............................................................................................................................... 21
Remove the air baffle .................................................................................................................................. 21
Install the air baffle ..................................................................................................................................... 22
Setup......................................................................................................................................... 24
Optional installation services ....................................................................................................................... 24
Rack planning resources ............................................................................................................................. 24
Optimum environment................................................................................................................................. 24
Space and airflow requirements ........................................................................................................ 25
Temperature requirements ................................................................................................................. 25
Power requirements .......................................................................................................................... 25
Electrical grounding requirements ...................................................................................................... 25
Server warnings and cautions...................................................................................................................... 26
Rack warnings ........................................................................................................................................... 26
Identifying the contents of the server shipping carton...................................................................................... 27
Installing hardware options ......................................................................................................................... 27
Installing the server into the rack .................................................................................................................. 27
Installing the operating system ..................................................................................................................... 28
Powering on and selecting boot options ....................................................................................................... 29
Registering the server.................................................................................................................................. 29
Hardware options installation....................................................................................................... 30
Introduction ............................................................................................................................................... 30
Drive options ............................................................................................................................................. 30
Contents
3
Drive installation guidelines ............................................................................................................... 30
Installing a non-hot-plug drive ............................................................................................................ 30
Installing a hot-plug drive .................................................................................................................. 32
Drive cage options ..................................................................................................................................... 33
Four-bay LFF hot-plug drive backplane option ...................................................................................... 33
Eight-bay SFF hot-plug drive cage option ............................................................................................ 37
Controller options ....................................................................................................................................... 39
Installing a storage controller ............................................................................................................. 39
Installing the FBWC module and capacitor pack ................................................................................. 40
Optical drive option ................................................................................................................................... 42
Memory options ......................................................................................................................................... 44
HP SmartMemory ............................................................................................................................. 45
DIMM identification .......................................................................................................................... 45
Single-rank and dual-rank DIMMs ...................................................................................................... 46
Memory subsystem architecture ......................................................................................................... 46
ECC memory ................................................................................................................................... 46
General DIMM slot population guidelines ........................................................................................... 47
Installing a DIMM............................................................................................................................. 47
Expansion board options ............................................................................................................................ 48
Dedicated iLO management port option ....................................................................................................... 52
Enabling the dedicated iLO management port ..................................................................................... 53
HP Trusted Platform Module option .............................................................................................................. 54
Installing the Trusted Platform Module board ....................................................................................... 54
Retaining the recovery key/password................................................................................................. 56
Enabling the Trusted Platform Module ................................................................................................. 56
RPS enablement option ............................................................................................................................... 57
Cabling ..................................................................................................................................... 61
Cabling overview ....................................................................................................................................... 61
Storage cabling ......................................................................................................................................... 61
Four-bay LFF drive cabling ................................................................................................................ 61
Eight-bay SFF drive cabling ............................................................................................................... 63
Media drive cabling ................................................................................................................................... 64
Power supply cabling ................................................................................................................................. 65
Nonredundant power supply cabling ................................................................................................. 65
Redundant power supply cabling ....................................................................................................... 65
Capacitor pack cabling .............................................................................................................................. 66
Software and configuration utilities ............................................................................................... 67
Server mode .............................................................................................................................................. 67
Server QuickSpecs ..................................................................................................................................... 67
HP iLO Management Engine ....................................................................................................................... 67
HP iLO ............................................................................................................................................ 67
Intelligent Provisioning ...................................................................................................................... 69
HP Insight Remote Support software ................................................................................................... 71
Scripting Toolkit ............................................................................................................................... 71
HP Service Pack for ProLiant ........................................................................................................................ 72
HP Smart Update Manager ............................................................................................................... 72
HP ROM-Based Setup Utility ........................................................................................................................ 72
Using RBSU ..................................................................................................................................... 73
Auto-configuration process ................................................................................................................ 73
Boot options .................................................................................................................................... 74
Re-entering the server serial number and product ID ............................................................................. 74
Utilities and features ................................................................................................................................... 74
Contents
4
Array Configuration Utility ................................................................................................................ 74
Option ROM Configuration for Arrays................................................................................................ 75
ROMPaq utility................................................................................................................................. 76
Automatic Server Recovery ................................................................................................................ 76
USB support .................................................................................................................................... 76
Redundant ROM support ................................................................................................................... 76
Keeping the system current .......................................................................................................................... 77
Drivers ............................................................................................................................................ 77
Software and firmware ..................................................................................................................... 77
Version control ................................................................................................................................. 77
HP operating systems and virtualization software support for ProLiant servers ......................................... 78
Change control and proactive notification .......................................................................................... 78
Troubleshooting .......................................................................................................................... 79
Troubleshooting resources ........................................................................................................................... 79
System battery replacement.......................................................................................................... 80
Regulatory compliance notices ..................................................................................................... 82
Regulatory compliance identification numbers ............................................................................................... 82
Federal Communications Commission notice ................................................................................................. 82
FCC rating label .............................................................................................................................. 82
FCC Notice, Class A Equipment ........................................................................................................ 82
FCC Notice, Class B Equipment ......................................................................................................... 82
Declaration of conformity for products marked with the FCC logo, United States only........................................ 83
Modifications ............................................................................................................................................. 83
Cables ...................................................................................................................................................... 83
Canadian notice (Avis Canadien) ................................................................................................................ 83
European Union regulatory notice ................................................................................................................ 84
Disposal of waste equipment by users in private households in the European Union .......................................... 84
Japanese notice ......................................................................................................................................... 85
BSMI notice ............................................................................................................................................... 85
Korean notice ............................................................................................................................................ 85
Chinese notice ........................................................................................................................................... 86
Vietnam compliance marking notice ............................................................................................................. 86
Ukraine notice ........................................................................................................................................... 86
Laser compliance ....................................................................................................................................... 86
Battery replacement notice .......................................................................................................................... 87
Taiwan battery recycling notice ................................................................................................................... 87
Power cord statement for Japan ................................................................................................................... 87
Acoustics statement for Germany (Geräuschemission) .................................................................................... 88
Electrostatic discharge ................................................................................................................. 89
Preventing electrostatic discharge ................................................................................................................ 89
Grounding methods to prevent electrostatic discharge .................................................................................... 89
Specifications ............................................................................................................................. 90
Environmental specifications ........................................................................................................................ 90
Server specifications ................................................................................................................................... 90
Power supply specifications ......................................................................................................................... 90
HP 350 W 4U Integrated Power Supply ............................................................................................. 91
HP 460 W CS Gold Hot-plug Power Supply (92% efficiency) ............................................................... 91
Hot-plug power supply calculations .................................................................................................... 91
Support and other resources ........................................................................................................ 92
Contents
5
Before you contact HP ................................................................................................................................ 92
HP contact information ................................................................................................................................ 92
Customer Self Repair .................................................................................................................................. 92
Acronyms and abbreviations ...................................................................................................... 100
Documentation feedback ........................................................................................................... 104
Index ....................................................................................................................................... 105
Contents
6
Component identification
Front panel components
Item
Description
1
Optical drive (optional)
2
Media drive bay
3
USB connectors
4
Power On/Standby button and system power LED
5
Drive bays (inside)
Component identification
7
Front panel LEDs and buttons
Item
Description
Status
1
UID LED button
Blue = Identification is activated
Flashing blue = System is being managed remotely
Off = Identification is deactivated
2
Health LED
Green = Normal (system on)
Flashing amber = System health is degraded
Flashing red = System health is critical
Off = Normal (system off)
3
NIC status LED
Green = Linked to network
Flashing green = Network activity
Off = No network link
4
Power On/Standby button
and system power LED
Green = Normal (system on)
Flashing green = Waiting for power
Amber = System in standby, but power is still applied
Off = Power cord is not attached or power supply failure
Component identification
8
Rear panel components
Item
Description
1
Non-hot-plug power supply
2
Slot 4 PCIe x16 (8, 4, 1)*
3
Slot 3 PCIe x8 (8, 4, 1)*
4
Slot 2 PCIe x8 (4, 1)*
5
Slot 1 PCIe x4 (1)*
6
Expansion slot cover retainer
7
Serial connector
8
Video connector
9
Dedicated iLO management port (optional)
10
NIC 1/shared iLO management connector
11
NIC connector 2
12
USB connectors
* For more information on the expansion slot specifications, see "PCIe expansion slot definitions (on page
12)."
Component identification
9
Rear panel LEDs and buttons
Item
Description
Status
1
NIC link LED
Green = Link exists
Off = No link exists
2
NIC status LED
Green = Activity exists
Flashing green = Activity exists
Off = No activity exists
3
UID LED button
Blue = Identification is activated
Flashing blue = System is being
managed remotely
Off = Identification is deactivated
4
Power supply LED (for hot-plug HP Green = Normal
CS power supplies only)*
Off = One or more of the following
conditions exists:
•
•
•
•
Power
Power
Power
Power
is unavailable
supply failed
supply is in standby mode
supply error
*Not shown
Component identification
10
System board components
Item
Description
1
RPS connector
2
Processor socket
3
System battery
4
24-pin power supply connector
5
Mini-SAS connector
6
SATA connectors
7
Internal USB cable connector
8
Internal USB connector
9
SD card slot
10
Front USB connector 2
11
Front USB connector 1
12
Front panel LED connector
13
Fan connector 2
14
Reserved
15
Ambient thermal sensor connector
16
NMI header
17
System maintenance switch
18
Slot 1 PCIe x4 (1)*
19
Slot 2 PCIe x8 (4, 1)*
20
Slot 3 PCIe x8 (8, 4, 1)*
21
Slot 4 PCIe x16 (8, 4, 1)*
22
Fan connector 1
23
TPM connector
24
4-pin power supply connector
25
Dedicated iLO module connector
26
DIMM slots
Component identification
11
* For more information on the expansion slot specifications, see "PCIe expansion slot definitions (on page
12)."
DIMM slot locations
DIMM slots are numbered sequentially (1 through 4) for the processor. The supported AMP modes use the
letter assignments for population guidelines.
PCIe expansion slot definitions
The transfer rate of the PCIe expansion slots 3 and 4 depends on the processor model installed. The slots can
either run in PCIe2 (5 GT/s) or PCIe3 (8 GT/s) rate.
•
Intel Xeon Processor E3-xxxx Series, Intel Core i3 Processor Series, Intel Pentium G2120, and Intel
Celeron G540
Slot number
Type
Length
Height
Connector link width
Negotiable link width
1
PCIe2
Half
Full
x4
x1
2
PCIe2
Full
Full
x8
x4
3
PCIe2
Full
Full
x8
x8
4
PCIe2
Full
Full
x16
x8
•
Intel Xeon Processor E3-xxxxV2 Series
Slot number
Type
Length
Height
Connector link width
Negotiable link width
1
PCIe2
Half
Full
x4
x1
2
PCIe2
Full
Full
x8
x4
3
PCIe3
Full
Full
x8
x8
4
PCIe3
Full
Full
x16
x8
System maintenance switch
Switch
Default
Function
1
Off
Off = No function
On = iLO security is disabled
Component identification
12
Switch
Default
Function
2
Off
Off = System configuration can be
changed
On = System configuration is locked
5
Off
Off = Power-on password is enabled
On = Power-on password is disabled
6
Off
Off = No function
On = ROM reads configuration as
invalid
3, 4, 7, 8, 9,
10, 11, 12
—
Reserved
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all
system configuration settings from both CMOS and NVRAM.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to
properly configure the server or data loss could occur.
NMI header
The NMI header enables administrators to perform a memory dump before performing a hard reset. Crash
dump analysis is an essential part of eliminating potential reliability issues, such as hangs or crashes in
operating systems, device drivers, and applications. Many crashes can freeze a system, requiring you to
perform a hard reset. Resetting the system erases any information that supports root cause analysis.
Systems running Microsoft® Windows® experience a blue-screen trap when the OS crashes. When this
happens, Microsoft® recommends that system administrators perform an NMI event by temporarily shorting
the NMI header with a jumper. The NMI event enables a hung system to become responsive again.
For additional information, see the HP website
(http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00797875/c00797875.pdf).
Component identification
13
Drive numbering
•
Four-bay LFF drive model
•
Eight-bay SFF drive model
Component identification
14
Hot-plug drive LED definitions
Item
LED
Status
Definition
1
Locate
Solid blue
The drive is being identified by a host application.
Flashing blue
The drive carrier firmware is being updated or requires an update.
Rotating green
Drive activity
Off
No drive activity
Solid white
Do not remove the drive. Removing the drive causes one or more of
the logical drives to fail.
Off
Removing the drive does not cause a logical drive to fail.
Solid green
The drive is a member of one or more logical drives.
Flashing green
The drive is rebuilding or performing a RAID migration, strip size
migration, capacity expansion, or logical drive extension, or is
erasing.
Flashing
amber/green
The drive is a member of one or more logical drives and predicts
the drive will fail.
Flashing amber
The drive is not configured and predicts the drive will fail.
Solid amber
The drive has failed.
Off
The drive is not configured by a RAID controller.
2
3
4
Activity ring
Do not remove
Drive status
Component identification
15
FBWC module LED definitions
The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the
reverse side of the cache module to facilitate status viewing.
1 - Amber
2 - Green
3 - Green
Interpretation
Off
Off
Off
The cache module is not powered.
Off
Flashing 0.5 Hz
Flashing 0.5 Hz
The cache microcontroller is executing from within its
boot loader and receiving new flash code from the host
controller.
Off
Flashing 1 Hz
Flashing 1 Hz
The cache module is powering up, and the capacitor
pack is charging.
Off
Off
Flashing 1 Hz
The cache module is idle, and the capacitor pack is
charging.
Off
Off
On
The cache module is idle, and the capacitor pack is
charged.
Off
On
On
The cache module is idle, the capacitor pack is charged,
and the cache contains data that has not yet been
written to the drives.
Off
Flashing 1 Hz
Off
A backup is in progress.
Off
On
Off
The current backup is complete with no errors.
Flashing 1 Hz
Flashing 1 Hz
Off
The current backup failed, and data has been lost.
Flashing 1 Hz
Flashing 1 Hz
On
A power error occurred during the previous or current
boot. Data may be corrupt.
Flashing 1 Hz
On
Off
An overtemperature condition exists.
Flashing 2 Hz
Flashing 2 Hz
Off
The capacitor pack is not attached.
Flashing 2 Hz
Flashing 2 Hz
On
The capacitor has been charging for 10 minutes, but
has not reached sufficient charge to perform a full
backup.
On
On
Off
The current backup is complete, but power fluctuations
occurred during the backup.
On
On
On
The cache module microcontroller has failed.
Component identification
16
Fan locations
Item
Description
1
Rear system fan (fan 1, for processor cooling)
2
Front system fan (fan 2, for expansion board cooling)
T-10/T-15 Torx screwdriver
The server includes a T-10/T-15 Torx screwdriver located on the side of the media drive cage. Use the
screwdriver to loosen screws during hardware configuration procedures.
Component identification
17
Operations
Power up the server
1.
Connect each power cord to the server.
2.
Connect each power cord to the power source.
3.
Press the Power On/Standby button.
The server exits standby mode and applies full power to the system. The system power LED changes
from amber to green.
Power down the server
Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical
server data and programs.
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some internal
circuitry remain active until AC power is removed.
IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the
system.
To power down the server, use one of the following methods:
•
Press and release the Power On/Standby button.
This method initiates a controlled shutdown of applications and the OS before the server enters standby
mode.
•
Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter
standby mode.
This method forces the server to enter standby mode without properly exiting applications and the OS.
If an application stops responding, you can use this method to force a shutdown.
•
Use a virtual power button selection through iLO.
This method initiates a controlled remote shutdown of applications and the OS before the server enters
standby mode.
Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.
Operations
18
Unlock the tower bezel
The tower bezel must be unlocked and opened to access the drive cage and media bays. It must be unlocked
to remove the access panel. The bezel must remain closed during normal server operations.
Remove the tower bezel
1.
Unlock and open the tower bezel ("Unlock the tower bezel" on page 19).
2.
Pull the bezel away from the front chassis.
Install the tower bezel
1.
Insert the tabs on the tower bezel to the slots on the front chassis.
Operations
19
2.
Close and lock the tower bezel.
Remove the access panel
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize
the amount of time the access panel is open.
1.
Power down the server (on page 18).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Unlock the tower bezel (on page 19).
4.
Place the server on its side.
5.
Remove the access panel:
a. Loosen the access panel thumbscrew.
b. Slide the access panel back.
Operations
20
c.
Lift the access panel away from the chassis.
Install the access panel
1.
Install the access panel:
a. Place the access panel on the chassis, and slide it toward the front of the server.
b. Tighten the thumbscrew.
2.
Lock the tower bezel.
Remove the air baffle
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize
the amount of time the access panel is open.
Operations
21
1.
Power down the server (on page 18).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Unlock the tower bezel (on page 19).
4.
Remove the access panel (on page 20).
5.
Remove the air baffle.
Install the air baffle
1.
Insert the tabs on the baffle into the slots on the rear chassis.
2.
Push the front end of the baffle inside the chassis.
3.
Install the access panel (on page 21).
Operations
22
4.
Lock the tower bezel.
5.
Power up the server (on page 18).
Operations
23
Setup
Optional installation services
Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and
running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate
both hardware and software support into a single package. A number of service level options are available
to meet your needs.
HP Care Pack Services offer upgraded service levels to expand your standard product warranty with
easy-to-buy, easy-to-use support packages that help you make the most of your server investments. Some of
the Care Pack services are:
•
•
•
•
Hardware support
o
6-Hour Call-to-Repair
o
4-Hour 24x7 Same Day
o
4-Hour Same Business Day
Software support
o
Microsoft® operating systems
o
Linux operating systems
o
HP ProLiant Essentials (HP SIM and RDP)
Integrated hardware and software support
o
Critical Service
o
Proactive 24
o
Support Plus
o
Support Plus 24
Startup and implementation services for both hardware and software
For more information on HP Care Pack Services, see the HP website
(http://www.hp.com/services/carepack).
Rack planning resources
The rack resource kit ships with all HP branded or Compaq branded 9000, 10000, and H9 series racks. For
more information on the content of each resource, see the rack resource kit documentation.
Optimum environment
When installing the server, select a location that meets the environmental standards described in this section.
Setup 24
Space and airflow requirements
Leave at least a 7.6-cm (3-inch) clearance space at the front and back of the server for proper ventilation.
Temperature requirements
To ensure continued, safe, and reliable equipment operation, install or position the system in a
well-ventilated, climate-controlled environment.
The maximum recommended TMRA for most server products is 35°C (95°F). The temperature in the room
where the server is located must not exceed 35°C (95°F).
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:
• Do not permit optional equipment to impede airflow around the server beyond the maximum
allowable limits.
• Do not exceed the manufacturer’s TMRA.
Power requirements
Installation of this equipment must comply with local and regional electrical regulations governing the
installation of information technology equipment by licensed electricians. This equipment is designed to
operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992
(code for Protection of Electronic Computer/Data Processing Equipment). For electrical power ratings on
options, see the product rating label or the user documentation supplied with that option.
CAUTION: Protect the server from power fluctuations and temporary interruptions with a
regulating uninterruptible power supply. This device protects the hardware from damage caused
by power surges and voltage spikes and keeps the system in operation during a power failure.
When installing more than one server, you might have to use additional power distribution devices to safely
provide power to all devices. Observe the following guidelines:
•
Balance the server power load between available AC supply branch circuits.
•
Do not allow the overall system AC current load to exceed 80% of the branch circuit AC current rating.
•
Do not use common power outlet strips for this equipment.
•
Provide a separate electrical circuit for the server.
Electrical grounding requirements
The server must be grounded properly for proper operation and safety. In the United States, you must install
the equipment in accordance with NFPA 70, 1999 Edition (National Electric Code), Article 250, as well as
any local and regional building codes. In Canada, you must install the equipment in accordance with
Canadian Standards Association, CSA C22.1, Canadian Electrical Code. In all other countries, you must
install the equipment in accordance with any regional or national electrical wiring codes, such as the
International Electrotechnical Commission (IEC) Code 364, parts 1 through 7. Furthermore, you must be sure
that all power distribution devices used in the installation, such as branch wiring and receptacles, are listed
or certified grounding-type devices.
Because of the high ground-leakage currents associated with multiple servers connected to the same power
source, HP recommends the use of a PDU that is either permanently wired to the building’s branch circuit or
Setup 25
includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs or those
complying with IEC 60309 are considered suitable for this purpose. Using common power outlet strips for
the server is not recommended.
Server warnings and cautions
WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the
equipment:
• Observe local occupational health and safety requirements and guidelines for manual
material handling.
• Get help to lift and stabilize the product during installation or removal, especially when the
product is not fastened to the rails. HP recommends that a minimum of two people are required
for all rack server installations. A third person may be required to help align the server if the
server is installed higher than chest level.
• Use caution when installing the server in or removing the server from the rack; it is unstable
when not fastened to the rails.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some internal
circuitry remain active until AC power is removed.
CAUTION: Protect the server from power fluctuations and temporary interruptions with a
regulating uninterruptible power supply. This device protects the hardware from damage caused
by power surges and voltage spikes and keeps the system in operation during a power failure.
CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can
lead to thermal damage.
Rack warnings
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
•
•
•
•
•
The leveling jacks are extended to the floor.
The full weight of the rack rests on the leveling jacks.
The stabilizing feet are attached to the rack if it is a single-rack installation.
The racks are coupled together in multiple-rack installations.
Only one component is extended at a time. A rack may become unstable if more than one
component is extended for any reason.
Setup 26
WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:
• At least two people are needed to safely unload the rack from the pallet. An empty 42U rack
can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might
become unstable when being moved on its casters.
• Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle
the rack from both sides.
WARNING: To reduce the risk of personal injury or damage to the equipment, adequately
stabilize the rack before extending a component outside the rack. Extend only one component at
a time. A rack may become unstable if more than one component is extended.
WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately
secured at the top and bottom to the building structure.
Identifying the contents of the server shipping carton
Unpack the server shipping carton and locate the materials and documentation necessary for installing the
server.
The contents of the server shipping carton include:
•
Server
•
Power cord
•
Printed setup documentation, Documentation CD, and software products
You need the following items for some procedures:
•
T-10/T-15 Torx screwdriver (on page 17)
•
Flathead screwdriver (for dedicated iLO module installation)
•
Hardware options
•
Operating system or application software
Installing hardware options
Install any hardware options before initializing the server. For options installation information, see the option
documentation. For server-specific information, see "Hardware options installation (on page 30)."
Installing the server into the rack
To install the server into a rack with square, round, or threaded holes, refer to the instructions that ship with
the rack hardware kit.
If you are installing the server into a telco rack, order the appropriate option kit at the RackSolutions website
(http://www.racksolutions.com/hp). Follow the server-specific instructions on the website to install the rack
brackets.
Use the following information when connecting peripheral cables and power cords to the server.
Setup 27
WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the
equipment:
• Observe local occupational health and safety requirements and guidelines for manual
material handling.
• Get help to lift and stabilize the product during installation or removal, especially when the
product is not fastened to the rails. HP recommends that a minimum of two people are required
for all rack server installations. A third person may be required to help align the server if the
server is installed higher than chest level.
• Use caution when installing the server in or removing the server from the rack; it is unstable
when not fastened to the rails.
CAUTION: Always plan the rack installation so that the heaviest item is on the bottom of the rack.
Install the heaviest item first, and continue to populate the rack from the bottom to the top.
To install the server in an HP, Compaq-branded, Telco, or a third-party rack:
1.
Prepare the server for rack installation by installing the tower-to-rack conversion option kit (PN
418108-B21). For instructions, see the option kit documentation.
2.
Connect peripheral devices to the server. For information on identifying connectors, see "Rear panel
components (on page 9)."
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug
telephone or telecommunications connectors into RJ-45 connectors.
3.
Connect each power cord to the server.
4.
Connect each power cord to the power source.
WARNING: To reduce the risk of electric shock or damage to the equipment:
• Do not disable the power cord grounding plug. The grounding plug is an important safety
feature.
• Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all
times.
• Unplug the power cord from the power supply to disconnect power to the equipment.
• Do not route the power cord where it can be walked on or pinched by items placed against it.
Pay particular attention to the plug, electrical outlet, and the point where the cord extends from
the server.
Installing the operating system
This ProLiant server does not ship with provisioning media. Everything needed to manage and install the
system software and firmware is preloaded on the server.
To operate properly, the server must have a supported operating system. For the latest information on
operating system support, see the HP website (http://www.hp.com/go/supportos).
To install an operating system on the server, use one of the following methods:
•
Intelligent Provisioning—The iLO Management Engine is a new feature on ProLiant servers that contains
Intelligent Provisioning for embedded deployment, updating, and provisioning capabilities. Intelligent
Provisioning can configure the server and install an operating system, eliminating the need for
SmartStart CDs and Smart Update Firmware DVDs.
To install an operating system on the server with Intelligent Provisioning (local or remote):
Setup 28
a. Connect the Ethernet cable, and then power on the server.
b. During server POST, press the F10 key.
c.
Complete the initial Preferences and Registration portion of Intelligent Provisioning (on page 69).
d. At the 1 Start screen, click the Configure and Install button.
e. To finish the installation, follow the onscreen prompts. An Internet connection is required to update
the firmware and systems software.
•
Remote deployment installation—To remotely deploy an operating system, use Insight Control server
deployment for an automated solution.
For additional system software and firmware updates, download the HP Service Pack for ProLiant from the HP
website (http://www.hp.com/go/spp/download). Software and firmware must be updated before using
the server for the first time, unless any installed software or components require an older version. For more
information, see "Keeping the system current (on page 77)."
The Smart Update Firmware DVD ISO is also available at the download tab on the HP website
(http://www.hp.com/go/foundation).
For more information on using these installation methods, see the HP website (http://www.hp.com/go/ilo).
Powering on and selecting boot options
1.
Connect the Ethernet cable and press the Power On/Standby button.
2.
During the initial boot:
o
To modify the server configuration ROM default settings, press F9 when prompted from the start up
sequence to enter the RBSU. By default, RBSU runs in the English language.
o
If you do not need to modify the server configuration and are ready to install the system software,
press F10 to access Intelligent Provisioning.
NOTE: If an HP Smart Array controller has been added or is embedded in the system, the
controller defaults to a RAID configuration based on the size and number of drives installed. For
more information on modifying the controller default settings, see the documentation on the
Documentation CD.
For more information on automatic configuration, see the HP ROM-Based Setup Utility User Guide on the
Documentation CD or the iLO Management Engine Information Library
(http://www.hp.com/go/ilomgmtengine/docs).
Registering the server
To register the server, see the HP Registration website (http://register.hp.com).
Setup 29
Hardware options installation
Introduction
If more than one option is being installed, read the installation instructions for all the hardware options and
identify similar steps to streamline the installation process.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To prevent damage to electrical components, properly ground the server before
beginning any installation procedure. Improper grounding can cause electrostatic discharge.
Drive options
The server supports up to four non-hot-plug or hot-plug LFF drives and up to eight hot-plug SFF drives.
The embedded storage controller supports SATA drive installation only. For SAS drive installation, install the
storage controller card and Mini-SAS cable option kits. The storage controller card option supports both
SATA and SAS drives.
Drive installation guidelines
When adding drives to the server, observe the following general guidelines:
•
The system automatically sets all drive numbers.
•
Populate drive bays based, on the drive numbering sequence. Start from the drive bay with the lowest
device number ("Drive numbering" on page 14).
•
When drives are grouped together into the same drive array, they must be of the same capacity to
provide the greatest storage space efficiency.
Installing a non-hot-plug drive
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
To install the component:
1.
Power down the server (on page 18).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Unlock and open the tower bezel ("Unlock the tower bezel" on page 19).
Hardware options installation
30
4.
Remove the drive carrier.
5.
Remove the two metal brackets from the drive carrier.
6.
Install the drive in the carrier.
Hardware options installation
31
7.
Install the drive.
8.
Close and lock the tower bezel.
9.
Connect each power cord to the server.
10.
Connect each power cord to the power source.
11.
Power up the server (on page 18).
Installing a hot-plug drive
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
To install the component:
1.
Unlock and open the tower bezel ("Unlock the tower bezel" on page 19).
2.
Remove the drive blank.
Hardware options installation
32
3.
Prepare the drive.
4.
Install the drive.
5.
Determine the status of the drive from the drive LED definitions ("Hot-plug drive LED definitions" on page
15).
6.
Close and lock the tower bezel.
Drive cage options
Four-bay LFF hot-plug drive backplane option
To install the component:
1.
Power down the server (on page 18).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Remove the tower bezel (on page 19).
4.
Remove the access panel (on page 20).
5.
If the drives are to be connected to a storage controller card, remove the air baffle (on page 21).
Hardware options installation
33
6.
Remove all installed drives.
7.
Disconnect the drive cage cables:
a. Disconnect the Mini-SAS cable from the system board or from the storage controller option.
b. Disconnect the drive power cable from the 10-pin power supply connector.
8.
Remove the drive cage assembly.
9.
Loosen the bracket thumbscrew, and then remove the non-hot-plug bracket assembly from the drive
cage.
For image clarity, the non-hot-plug Mini-SAS and power cables attached to the bracket are not shown
in the following figure.
Hardware options installation
34
10.
Attach the hot-plug drive backplane to the drive cage, and then tighten the thumbscrew.
11.
Install the drive cage assembly.
12.
Connect the drive backplane cables:
a. Connect the power cable to the backplane.
b. Do one of the following:
— Connect the Mini-SAS cable to the system board (SATA drive support only).
Hardware options installation
35
For cable routing information, see "Hot-plug, SATA drive support (on page 62)."
— Connect one end of the Mini-SAS cable to the backplane and the other end to a storage
controller option (SATA and SAS drive support).
For cable routing information, see "Hot-plug, SATA and SAS drive support (on page 63)."
13.
Install the drives ("Drive options" on page 30).
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
14.
Install the air baffle (on page 22).
15.
Install the access panel (on page 21).
16.
Install the tower bezel (on page 19).
17.
Connect each power cord to the server.
18.
Connect each power cord to the power source.
Hardware options installation
36
19.
Power up the server (on page 18).
Eight-bay SFF hot-plug drive cage option
To install the component:
1.
Power down the server (on page 18).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Remove the tower bezel (on page 19).
4.
Remove the access panel (on page 20).
5.
Remove the air baffle (on page 21).
6.
Remove all installed drives.
7.
Disconnect the drive cage cables:
a. Disconnect the Mini-SAS cable from the system board.
b. Disconnect the drive power cable from the 10-pin power supply connector.
8.
Remove the LFF drive cage assembly.
Hardware options installation
37
9.
Install the SFF drive cage assembly.
10.
Connect the drive backplane cables:
a. Connect the power cable to the backplane.
b. Connect the Mini-SAS cables to the backplane and to a storage controller option.
For cable routing information, see "Eight-bay SFF drive cabling (on page 63)."
11.
Install the drives ("Drive options" on page 30).
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
12.
Install the air baffle (on page 22).
13.
Install the access panel (on page 21).
14.
Install the tower bezel (on page 19).
15.
Connect each power cord to the server.
Hardware options installation
38
16.
Connect each power cord to the power source.
17.
Power up the server (on page 18).
Controller options
The server ships with an embedded Smart Array B120i controller. For more information about the controller
and its features, see the HP Dynamic Smart Array RAID Controller User Guide on the HP website
(http://www.hp.com/support/DSA_RAID_UG_en).
To configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP
website (http://www.hp.com/support/CASAC_RG_en).
Upgrade options exist for the integrated array controller. For a list of supported options, see the QuickSpecs
on the HP website (http://www.hp.com/support).
The server supports FBWC. FBWC consists of a cache module and a capacitor pack. The DDR cache module
buffers and stores data being written by the controller. When the system is powered on, the capacitor pack
fully charges in approximately 5 minutes. If a system power failure occurs, a fully charged capacitor pack
provides power for up to 80 seconds. During that interval, the controller transfers the cached data from DDR
memory to flash memory, where the data remains indefinitely or until a controller retrieves the data.
The data protection and the time limit also apply if a power outage occurs. When power is restored to the
system, an initialization process writes the preserved data to the storage drives.
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMMs.
Do not use the controller with cache modules designed for other controller models, because the
controller can malfunction and you can lose data. Also, do not transfer this cache module to an
unsupported controller model, because you can lose data.
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove
the capacitor pack while an array capacity expansion, RAID level migration, or stripe size
migration is in progress.
CAUTION: After the server is powered down, wait for 30 seconds, and then check the amber LED
before unplugging the cable from the cache module. If the amber LED flashes after 30 seconds,
do not remove the cable from the cache module. The cache module is backing up data. Data will
be lost if the cable is detached when the amber LED is still flashing.
IMPORTANT: The capacitor pack might have a low charge when installed. If the pack does have
low charge a POST error message appears when the server is powered up, indicating that the
capacitor pack is temporarily disabled. No action is necessary. The internal circuitry
automatically recharges the capacitors and enables the capacitor pack. This process might take
up to 4 hours. During this time, the cache module functions properly but without the performance
advantage of the capacitor pack.
Installing a storage controller
IMPORTANT: For additional installation and configuration information, see the documentation
that ships with the option.
To install the component:
1.
Power down the server (on page 18).
Hardware options installation
39
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Unlock the tower bezel (on page 19).
4.
Remove the access panel (on page 20).
5.
Remove the air baffle (on page 21).
6.
If necessary, disconnect the Mini-SAS cable from the system board.
7.
Install the storage controller.
8.
Connect all necessary internal and external cabling to the option. For more information on these
cabling requirements, see the documentation that ships with the option. For internal cable routing
information in different drive configurations, see "Storage cabling (on page 61)."
9.
Install the air baffle (on page 22).
10.
Install the access panel (on page 21).
11.
Install the drives ("Drive options" on page 30).
CAUTION: To prevent improper cooling and thermal damage, do not operate the chassis unless
all bays are populated with a component or a blank.
12.
Lock the tower bezel.
13.
Connect each power cord to the server.
14.
Connect each power cord to the power source.
15.
Power up the server (on page 18).
For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant
Servers User Guide on the HP website (http://www.hp.com/support/SAC_UG_ProLiantServers_en). To
configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP
website (http://www.hp.com/support/CASAC_RG_en).
Upgrade options exist for the integrated array controller. For a list of supported options, see the QuickSpecs
on the HP website (http://www.hp.com/support).
Installing the FBWC module and capacitor pack
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be
powered down and the last to be powered back up. Taking this precaution ensures that the system
does not erroneously mark the external drives as failed when the server is powered up.
To install the component:
1.
Power down the server (on page 18).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Unlock the tower bezel (on page 19).
4.
Remove the access panel (on page 20).
5.
Remove the air baffle (on page 21).
Hardware options installation
40
6.
Install the cache module on the storage controller.
7.
Connect the capacitor pack cable to the cache module.
8.
Install the storage controller ("Installing a storage controller" on page 39).
Hardware options installation
41
9.
Install the capacitor pack.
10.
Install the air baffle (on page 22).
11.
Install the access panel (on page 21).
12.
Lock the tower bezel.
13.
Connect each power cord to the server.
14.
Connect each power cord to the power source.
15.
Power up the server (on page 18).
Optical drive option
To install the component:
1.
Power down the server (on page 18).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Remove the tower bezel (on page 19).
4.
Remove the access panel (on page 20).
Hardware options installation
42
5.
Remove the media bay blank.
6.
Remove the EMI shield.
Hardware options installation
43
7.
Install the optical drive into the media drive bay.
8.
Connect the drive cables:
a. Connect the power cable to the drive.
b. Connect one end of the SATA cable to the drive and the other end to the system board.
For cable routing information, see "Media drive cabling (on page 64)."
9.
Install the access panel (on page 21).
10.
Install the tower bezel (on page 19).
11.
Connect each power cord to the server.
12.
Connect each power cord to the power source.
13.
Power up the server (on page 18).
Memory options
Hardware options installation
44
IMPORTANT: This server does not support mixing LRDIMMs, RDIMMs, or UDIMMs. Attempting
to mix any combination of these DIMMs can cause the server to halt during BIOS initialization.
The server supports single- and dual-rank UDIMMs operating at a speed of up to 1600 MHz. Depending on
the processor model and the number of DIMMs installed, the memory clock speed might be reduced to 1333
or 1066 MHz. The server supports a maximum system memory of 32 GB, using 2-GB, 4-GB, and 8-GB
UDIMMs.
HP SmartMemory
HP SmartMemory, introduced for Gen8 servers, authenticates and unlocks certain features available only on
HP Qualified memory and verifies whether installed memory has passed HP qualification and test processes.
Qualified memory is performance-tuned for HP ProLiant and BladeSystem servers and provides future
enhanced support through HP Active Health and manageability software.
Certain performance features are unique with HP SmartMemory. The industry supports UDIMM at 2 DIMMs
per channel at 1066 MT/s. HP SmartMemory supports 2 DIMMs per channel at 1333 MT/s, or 25% greater
bandwidth.
DIMM identification
To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and
table.
Item
Description
Definition
1
Size
—
2
Rank
1R
2R
3R
4R
3
Data width
x4 = 4-bit
x8 = 8-bit
=
=
=
=
Single-rank
Dual-rank
Three-rank
Quad-rank
Hardware options installation
45
Item
Description
Definition
4
Voltage rating
L = Low voltage (1.35V)
U = Ultra low voltage (1.25V)
Blank or omitted = Standard
5
Memory speed
12800 = 1600-MT/s
10600 = 1333-MT/s
8500 = 1066-MT/s
6
DIMM type
R = RDIMM (registered)
E = UDIMM (unbuffered with ECC)
L = LRDIMM (load reduced)
For the latest supported memory information, see the QuickSpecs on the HP website
(http://h18000.www1.hp.com/products/quickspecs/ProductBulletin.html). At the website, choose the
geographic region, and then locate the product by name or product category.
Single-rank and dual-rank DIMMs
DIMM configuration requirements are based on these classifications:
•
Single-rank DIMM—One set of memory chips that is accessed while writing to or reading from the
memory.
•
Dual-rank DIMM—Two single-rank DIMMs on the same module, with only one rank accessible at a time.
The server memory control subsystem selects the proper rank within the DIMM when writing to or reading
from the DIMM.
Dual-rank DIMMs provide the greatest capacity with the existing memory technology. For example, if current
DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM would be 4 GB.
Memory subsystem architecture
The memory subsystem in this server is divided into channels. Each channel supports two DIMM slots.
Channel
Population order
Slot number
1
C
A
1
2
2
D
B
3
4
DIMM slots in this server are identified by number and by letter. Letters identify the population order. Slot
numbers are reported by ROM messages during boot and for error reporting. For the DIMM slot locations,
see "DIMM slot locations (on page 12)."
ECC memory
The server supports the standard ECC memory correction mode. Standard ECC can correct single-bit memory
errors and detect multibit memory errors. When multibit errors are detected, the error is signaled to the server
and causes the server to halt.
Hardware options installation
46
General DIMM slot population guidelines
•
The server has four memory slots.
•
The server supports two channels with two DIMM slots per channel.
o
Memory channel 1 consists of the two DIMMs that are closest to the processor.
o
Memory channel 2 consists of the two DIMMs that are farthest from the processor.
•
White DIMM slot indicates the first slot of a channel (2-A, 4-B).
•
Memory speed support depends on the type of processor installed. See the technical specification of the
installed processor for more information.
•
The server supports up to 1600 MT/s ECC UDIMMs.
•
The server supports up to 32 GB (4x8 GB) UDIMMs.
•
The server does not support:
•
o
RDIMMs
o
Non-ECC UDIMMs
When installing DIMMs:
o
Populate the DIMM slots in this sequence: 2-A, 4-B, 1-C, 3-D.
o
Use HP-qualified UDIMMs.
Installing a DIMM
1.
Power down the server (on page 18).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Unlock the tower bezel (on page 19).
4.
Remove the access panel (on page 20).
5.
Remove the air baffle (on page 21).
6.
Open the DIMM slot latches.
Hardware options installation
47
7.
Install the DIMM.
8.
Install the air baffle (on page 22).
9.
Install the access panel (on page 21).
10.
Lock the tower bezel.
11.
Connect each power cord to the server.
12.
Connect each power cord to the power source.
13.
Power up the server (on page 18).
After installing the DIMMs, to configure memory protection mode, use RBSU ("HP ROM-Based Setup Utility"
on page 72).
Expansion board options
The server has both full-height and low-profile expansion slots for controller option installation ("PCIe
expansion slot definitions" on page 12).
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all PCI slots have either an expansion slot cover or an expansion board installed.
To install the component:
1.
Power down the server (on page 18).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Unlock the tower bezel (on page 19).
4.
Remove the access panel (on page 20).
5.
Remove the air baffle (on page 21).
Hardware options installation
48
6.
Remove the expansion slot cover retainer.
7.
Identify the expansion slot compatible with the new option, and then remove the cover opposite that
slot.
Hardware options installation
49
8.
If installing a full-length expansion board, remove the board retainer.
9.
Install the expansion board.
Hardware options installation
50
10.
If installing a full-length expansion board, install the board retainer that was removed.
11.
Install the expansion slot cover retainer.
12.
Connect all necessary internal and external cables to the expansion board. For more information on
these cabling requirements, see the documentation that ships with the option.
13.
Install the air baffle (on page 22).
14.
Install the access panel (on page 21).
15.
Lock the tower bezel.
16.
Connect each power cord to the server.
17.
Connect each power cord to the power source.
18.
Power up the server (on page 18).
Hardware options installation
51
Dedicated iLO management port option
To install the component:
1.
Power down the server (on page 18).
2.
Unlock the tower bezel (on page 19).
3.
Remove the access panel (on page 20).
4.
Remove the air baffle (on page 21).
5.
Remove any existing expansion board that blocks the access to the rear system fan connector.
6.
Remove the rear system fan.
7.
Using a flat screwdriver, toggle the knockout to loosen it, and then pull it out of the chassis.
Hardware options installation
52
8.
Install the dedicated iLO management module.
9.
Install the rear system fan.
10.
Install any removed expansion board.
11.
Install the air baffle (on page 22).
12.
Install the access panel (on page 21).
13.
Lock the tower bezel.
14.
Connect each power cord to the server.
15.
Connect each power cord to the power source.
16.
Power up the server (on page 18).
Enabling the dedicated iLO management port
The onboard NIC 1/shared iLO connector is set as the default system iLO port.
To enable the installed dedicated iLO module:
1.
During the server startup sequence after module installation, to access iLO RBSU, press the F8 key.
2.
Select the Network menu.
3.
Click the Network Interface Adapter field.
4.
To change the setting to ON, press the spacebar.
5.
To save the new settings, press the F10 key.
6.
Select the File menu, and then to close iLO RBSU, click Exit.
7.
To confirm exiting iLO RBSU, click OK. The server automatically reboots.
IMPORTANT: If the iLO RBSU settings are reset to the default values, access to the machine will be
lost. Access the physical machine, and then set the Network Interface Adapter field to ON.
Hardware options installation
53
HP Trusted Platform Module option
Use these instructions to install and enable a TPM on a supported server. This procedure includes three
sections:
1.
Installing the Trusted Platform Module board (on page 54).
2.
Retaining the recovery key/password (on page 56).
3.
Enabling the Trusted Platform Module (on page 56).
Enabling the TPM requires accessing RBSU ("HP ROM-Based Setup Utility" on page 72). For more
information about RBSU, see the HP website (http://www.hp.com/go/ilomgmtengine/docs).
TPM installation requires the use of drive encryption technology, such as the Microsoft Windows BitLocker
Drive Encryption feature. For more information on BitLocker, see the Microsoft website
(http://www.microsoft.com).
CAUTION: Always observe the guidelines in this document. Failure to follow these guidelines
can cause hardware damage or halt data access.
When installing or replacing a TPM, observe the following guidelines:
•
Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system
board.
•
When installing or replacing hardware, HP service providers cannot enable the TPM or the encryption
technology. For security reasons, only the customer can enable these features.
•
When returning a system board for service replacement, do not remove the TPM from the system board.
When requested, HP Service provides a TPM with the spare system board.
•
Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security
rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the
system compromised and take appropriate measures to ensure the integrity of the system data.
•
When using BitLocker, always retain the recovery key/password. The recovery key/password is
required to enter Recovery Mode after BitLocker detects a possible compromise of system integrity.
•
HP is not liable for blocked data access caused by improper TPM use. For operating instructions, see the
encryption technology feature documentation provided by the operating system.
Installing the Trusted Platform Module board
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some internal
circuitry remain active until AC power is removed.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
To install the component:
1.
Power down the server (on page 18).
2.
Unlock the tower bezel (on page 19).
3.
Remove the access panel (on page 20).
Hardware options installation
54
4.
Remove the air baffle (on page 21).
5.
Remove any existing expansion board that blocks the access to the rear system fan connector.
6.
Remove the rear system fan.
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM,
administrators should consider the system compromised and take appropriate measures to ensure
the integrity of the system data.
7.
Install the TPM board. Press down on the connector to seat the board ("System board components" on
page 11).
Hardware options installation
55
8.
Install the TPM security rivet by pressing the rivet firmly into the system board.
9.
Install the rear system fan.
10.
Install any removed expansion board.
11.
Install the air baffle (on page 22).
12.
Install the access panel (on page 21).
13.
Lock the tower bezel.
14.
Connect each power cord to the server.
15.
Connect each power cord to the power source.
16.
Power up the server (on page 18).
Retaining the recovery key/password
The recovery key/password is generated during BitLocker™ setup, and can be saved and printed after
BitLocker™ is enabled. When using BitLocker™, always retain the recovery key/password. The recovery
key/password is required to enter Recovery Mode after BitLocker™ detects a possible compromise of system
integrity.
To help ensure maximum security, observe the following guidelines when retaining the recovery
key/password:
•
Always store the recovery key/password in multiple locations.
•
Always store copies of the recovery key/password away from the server.
•
Do not save the recovery key/password on the encrypted hard drive.
Enabling the Trusted Platform Module
1.
When prompted during the start-up sequence, access RBSU by pressing the F9 key.
2.
From the Main Menu, select Server Security.
3.
From the Server Security Menu, select Trusted Platform Module.
4.
From the Trusted Platform Module Menu, select TPM Functionality.
Hardware options installation
56
5.
Select Enable, and then press the Enter key to modify the TPM Functionality setting.
6.
Press the Esc key to exit the current menu, or press the F10 key to exit RBSU.
7.
Reboot the server.
8.
Enable the TPM in the OS. For OS-specific instructions, see the OS documentation.
CAUTION: When a TPM is installed and enabled on the server, data access is locked if you fail
to follow the proper procedures for updating the system or option firmware, replacing the system
board, replacing a hard drive, or modifying OS application TPM settings.
For more information on firmware updates and hardware procedures, see the HP Trusted Platform Module
Best Practices White Paper on the HP website (http://www.hp.com/support).
For more information on adjusting TPM usage in BitLocker™, see the Microsoft website
(http://technet.microsoft.com/en-us/library/cc732774.aspx).
RPS enablement option
Install the RPS enablement option to improve power efficiency and enable power redundancy. Power
redundancy requires the installation of two power supply modules. This module is a separately purchased
option and is not part of the RPS enablement kit. When the RPS enablement option is installed, the lower
media drive bay will not be available.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
To install the component:
1.
Power down the server (on page 18).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Unlock and open the tower bezel ("Unlock the tower bezel" on page 19).
4.
Remove the access panel (on page 20).
5.
Disconnect all drive power cables and the non-hot-plug power supply cables.
Hardware options installation
57
6.
Remove the power supply.
7.
Disconnect all cables from installed media drives.
8.
Remove all installed devices and any EMI shields from the media drive bays.
9.
Install the RPS cage.
Hardware options installation
58
10.
Insert the RPS backplane module cables into the media drive cage, and then slide in the module into the
lower media drive bay. Align the left edge of the module with the guide mark on the bay.
11.
Connect the eight-pin to four-pin adapter cable to the eight-pin power supply connector of the RPS
backplane module.
12.
Connect the RPS cables to the system board. For detailed cabling information, see "Redundant power
supply cabling (on page 65)."
Make sure that the extra cable is out of the way of the connected RPS backplane module cables.
13.
For improved power efficiency, install an HP CS power supply in the upper bay of the RPS cage.
CAUTION: The default and redundant power supplies in the server must have the same output
power capacity. Verify that all power supplies have the same part number and label color. The
system becomes unstable and might shut down when it detects mismatched power supplies.
14.
For improved power efficiency and redundancy, install two HP CS power supplies:
Hardware options installation
59
a. Remove the EMI shield.
b. Install the HP CS power supplies.
15.
Install any device originally installed in the upper media drive bay.
16.
Install the EMI shield in the lower media drive bay.
17.
Install the access panel (on page 21).
18.
If the lower media bay blank is not attached to the tower bezel, install it.
19.
Lock the tower bezel.
20.
Connect each power cord to the server.
21.
Connect each power cord to the power source.
22.
Power up the server (on page 18).
Hardware options installation
60
Cabling
Cabling overview
This section provides guidelines that help you make informed decisions about cabling the server and
hardware options to optimize performance.
For information on cabling peripheral components, refer to the white paper on high-density deployment at
the HP website (http://www.hp.com/products/servers/platforms).
CAUTION: When routing cables, always be sure that the cables are not in a position where they
can be pinched or crimped.
Storage cabling
Four-bay LFF drive cabling
Non-hot-plug, SATA drive support only
Item
Description
1
Power cable
2
Data cable
Cabling
61
Non-hot-plug, SATA and SAS drive support
Item
Description
1
Power cable
2
Data cable
Hot-plug, SATA drive support
Item
Description
1
Power cable
2
Mini-SAS cable
Cabling
62
Hot-plug, SATA and SAS drive support
Item
Description
1
Power cable
2
Mini-SAS cable
Eight-bay SFF drive cabling
This drive configuration supports hot-plug SATA and SAS drives.
Item
Description
1
Power cable
2
Mini-SAS cable
3
Mini-SAS cable
Cabling
63
Media drive cabling
•
Item
Media drives in a nonredundant power configuration
Description
1
Upper media drive power cable
2
Lower media drive SATA cable
3
Upper media drive SATA cable
4
Lower media drive power cable
•
Media drive in a redundant power configuration
Item
Description
1
Upper media drive SATA cable
2
Upper media drive power cable
Cabling
64
Power supply cabling
Nonredundant power supply cabling
Item
Description
1
24-pin power supply cable
2
4-pin power supply cable
Redundant power supply cabling
Item
Description
1
24-pin power supply cable
2
26-pin RPS cable
Cabling
65
Item
Description
3
4-pin power supply cable (with the 8-pin to 4-pin adapter
cable connected)
Capacitor pack cabling
Cabling
66
Software and configuration utilities
Server mode
The software and configuration utilities presented in this section operate in online mode, offline mode, or in
both modes.
Software or configuration utility
Server mode
HP iLO (on page 67)
Online and Offline
Active Health System (on page 68)
Online and Offline
Integrated Management Log (on page 69)
Online and Offline
Intelligent Provisioning (on page 69)
Offline
HP Insight Diagnostics (on page 70)
Online and Offline
HP Insight Remote Support software (on page 71)
Online
Erase Utility (on page 70)
Offline
Scripting Toolkit (on page 71)
Online
HP Service Pack for ProLiant (on page 72)
Online and Offline
HP Smart Update Manager (on page 72)
Online and Offline
HP ROM-Based Setup Utility (on page 72)
Offline
Array Configuration Utility (on page 74)
Online and Offline
Option ROM Configuration for Arrays (on page 75)
Offline
ROMPaq utility (on page 76)
Offline
Server QuickSpecs
For more information about product features, specifications, options, configurations, and compatibility, see
the QuickSpecs on the HP website (http://www.hp.com/go/productbulletin). At the website, choose the
geographic region, and then locate the product by name or product category.
HP iLO Management Engine
The HP iLO Management Engine is a set of embedded management features supporting the complete
lifecycle of the server, from initial deployment through ongoing management.
HP iLO
The iLO subsystem is a standard component of selected HP ProLiant servers that simplifies initial server setup,
server health monitoring, power and thermal optimization, and remote server administration. The iLO
subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface. This
design makes iLO independent of the host server and its operating system.
Software and configuration utilities
67
iLO enables and manages the Active Health System (on page 68) and also features Agentless Management.
All key internal subsystems are monitored by iLO. SNMP alerts are sent directly by iLO regardless of the host
operating system or even if no host operating system is installed.
HP Insight Remote Support software (on page 71) is also available in HP iLO with no operating system
software, drivers, or agents.
Using iLO, you can do the following:
•
Access a high-performance and secure Remote Console to the server from anywhere in the world.
•
Use the shared iLO Remote Console to collaborate with up to six server administrators.
•
Remotely mount high-performance Virtual Media devices to the server.
•
Securely and remotely control the power state of the managed server.
•
Have true Agentless Management with SNMP alerts from iLO regardless of the state of the host server.
•
Access Active Health System troubleshooting features through the iLO interface.
•
Subscribe to HP Insight Remote Support software without installing any drivers or agents.
For more information about iLO features (which may require an iLO Advanced Pack or iLO Advanced for
BladeSystem license), see the iLO documentation on the Documentation CD or on the HP website
(http://www.hp.com/go/ilo/docs).
Active Health System
HP Active Health System provides the following features:
•
Combined diagnostics tools/scanners
•
Always on, continuous monitoring for increased stability and shorter downtimes
•
Rich configuration history
•
Health and service alerts
•
Easy export and upload to Service and Support
The HP Active Health System monitors and records changes in the server hardware and system configuration.
The Active Health System assists in diagnosing problems and delivering rapid resolution when server failures
occur.
The Active Health System collects the following types of data:
•
Server model
•
Serial number
•
Processor model and speed
•
Storage capacity and speed
•
Memory capacity and speed
•
Firmware/BIOS
HP Active Health System does not collect information about Active Health System users' operations, finances,
customers, employees, partners, or data center, such as IP addresses, host names, user names, and
passwords. HP Active Health System does not parse or change operating system data from third-party error
event log activities, such as content created or passed through by the operating system.
Software and configuration utilities
68
The data that is collected is managed according to the HP Data Privacy policy. For more information see the
HP website (http://www.hp.com/go/privacy).
The Active Health System log, in conjunction with the system monitoring provided by Agentless Management
or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status,
and service alerts for various server components.
The Agentless Management Service is available in the SPP, which is a disk image (.iso) that you can
download from the HP website (http://www.hp.com/go/spp/download). The Active Health System log can
be downloaded manually from iLO or HP Intelligent Provisioning and sent to HP. For more information, see
the HP iLO User Guide or HP Intelligent Provisioning User Guide on the HP website
(http://www.hp.com/go/ilo/docs).
Integrated Management Log
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event
with 1-minute granularity.
You can view recorded events in the IML in several ways, including the following:
•
From within HP SIM
•
From within operating system-specific IML viewers
o
For Windows: IML Viewer
o
For Linux: IML Viewer Application
•
From within the iLO user interface
•
From within HP Insight Diagnostics (on page 70)
Intelligent Provisioning
Several packaging changes have taken place with HP ProLiant Gen8 servers: SmartStart CDs and the Smart
Update Firmware DVD will no longer ship with these new servers. Instead, the deployment capability is
embedded in the server as part of HP iLO Management Engine’s Intelligent Provisioning.
Intelligent Provisioning is an essential single-server deployment tool embedded in HP ProLiant Gen8 servers
that simplifies HP ProLiant server setup, providing a reliable and consistent way to deploy HP ProLiant server
configurations.
•
Intelligent Provisioning assists with the OS installation process by preparing the system for installing
"off-the-shelf" versions of leading operating system software and automatically integrating optimized
HP ProLiant server support software from SPP. SPP is the installation package for operating
system-specific bundles of HP ProLiant optimized drivers, utilities, management agents, and system
firmware.
•
Intelligent Provisioning provides maintenance-related tasks through Perform Maintenance features.
•
Intelligent Provisioning provides installation help for Microsoft Windows, Red Hat and SUSE Linux, and
VMware. For specific OS support, see the HP Intelligent Provisioning Release Notes.
For more information on Intelligent Provisioning software, see the HP website (http://www.hp.com/go/ilo).
For more information about Intelligent Provisioning drivers, firmware, and SPP, see the HP website
(http://www.hp.com/go/spp/download).
Software and configuration utilities
69
HP Insight Diagnostics
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions,
that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server
installations, troubleshoot problems, and perform repair validation.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS
is not running. To run this utility, boot the server using Intelligent Provisioning (on page 69).
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and
other related data needed for effective server management. Available in Microsoft Windows and Linux
versions, the utility helps to ensure proper system operation.
For more information or to download the utility, see the HP website (http://www.hp.com/servers/diags). HP
Insight Diagnostics Online Edition is also available in the SPP. For more information, see the HP website
(http://www.hp.com/go/spp/download).
HP Insight Diagnostics survey functionality
HP Insight Diagnostics (on page 70) provides survey functionality that gathers critical hardware and software
information on ProLiant servers.
This functionality supports operating systems that are supported by the server. For operating systems
supported by the server, see the HP website (http://www.hp.com/go/supportos).
If a significant change occurs between data-gathering intervals, the survey function marks the previous
information and overwrites the survey data files to reflect the latest changes in the configuration.
Survey functionality is installed with every Intelligent Provisioning-assisted HP Insight Diagnostics installation,
or it can be installed through the SPP ("HP Service Pack for ProLiant" on page 72).
Erase Utility
CAUTION: Perform a backup before running the System Erase Utility. The utility sets the system
to its original factory state, deletes the current hardware configuration information, including
array setup and disk partitioning, and erases all connected hard drives completely. Refer to the
instructions for using this utility.
The Erase utility enables you to erase system CMOS, NVRAM, and hard drives. Run the Erase Utility if you
must erase the system for the following reasons:
•
You want to install a new operating system on a server with an existing operating system.
•
You encounter an error when completing the steps of a factory-installed operating system installation.
To access the Erase Utility, click the Perform Maintenance icon from the Intelligent Provisioning home screen
and then select Erase.
Run the Erase utility to:
•
Reset all settings — erases all drives, NVRAM, and RBSU
•
Reset all disks — erases all drives
•
Reset RBSU — erases current RBSU settings
After selecting the appropriate option, click Erase System. Click Exit to reboot the server after the erase task
is completed. Click Cancel Erase to exit the utility without erasing.
Software and configuration utilities
70
HP Insight Remote Support software
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or
upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or
HP contractual support agreement. HP Insight Remote Support supplements your monitoring 24 x 7 to ensure
maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of
hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s
service level. Notifications may be sent to your authorized HP Channel Partner for on-site service, if
configured and available in your country. The software is available in two variants:
•
HP Insight Remote Support Standard: This software supports server and storage devices and is
optimized for environments with 1–50 servers. Ideal for customers who can benefit from proactive
notification but do not need proactive service delivery and integration with a management platform.
•
HP Insight Remote Support Advanced: For customers with mid-size to large environments with over 500
devices who require HP Proactive Services, or customers currently using HP Operations Manager or
SAP Solution Manager to manage their environment, HP recommends installing the latest HP Insight
Remote Support Advanced software. This software provides comprehensive remote monitoring and
proactive service support for nearly all HP servers, storage, network, and SAN environments, plus
selected non-HP servers that have a support obligation with HP. It is integrated with HP Systems Insight
Manager. A dedicated server is recommended to host both HP Systems Insight Manager and HP Insight
Remote Support Advanced.
Details for both versions are available on the HP website (http://www.hp.com/go/insightremotesupport).
To download the software, go to Software Depot (http://www.software.hp.com).
Select Insight Remote Support from the menu on the right.
The HP Insight Remote Support software release notes detail the specific prerequisites, supported hardware,
and associated operating systems. For more information:
•
See the HP Insight Remote Support Standard Release Notes on the HP website
(http://www.hp.com/go/insightremotestandard-docs).
•
See the HP Insight Remote Support Advanced Release Notes on the HP website
(http://www.hp.com/go/insightremoteadvanced-docs).
Scripting Toolkit
The Scripting Toolkit is a server deployment product that enables you to build an unattended automated
installation for high-volume server deployments. The Scripting Toolkit is designed to support ProLiant BL, ML,
DL, and SL servers. The toolkit includes a modular set of utilities and important documentation that describes
how to apply these tools to build an automated server deployment process.
The Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are
used to automate many of the manual steps in the server configuration process. This automated server
configuration process cuts time from each deployment, making it possible to scale rapid, high-volume server
deployments.
For more information, and to download the Scripting Toolkit, see the HP website
(http://www.hp.com/go/ProLiantSTK).
Software and configuration utilities
71
HP Service Pack for ProLiant
SPP is a release set that contains a comprehensive collection of firmware and system software components,
all tested together as a single solution stack for HP ProLiant servers, their options, BladeSystem enclosures,
and limited HP external storage.
SPP has several key features for updating HP ProLiant servers. Using HP SUM as the deployment tool, SPP can
be used in an online mode on a Windows or Linux hosted operating system, or in an offline mode where the
server is booted to the ISO so that the server can be updated automatically with no user interaction or
updated in interactive mode.
For more information or to download SPP, see the HP website (http://www.hp.com/go/spp).
HP Smart Update Manager
The HP SUM provides intelligent and flexible firmware and software deployment. This technology assists in
reducing the complexity of provisioning and updating HP ProLiant Servers, options, and Blades within the
data center. HP SUM is used to deploy firmware and software in SPP.
HP SUM enables system administrators to upgrade ROM images efficiently across a wide range of servers
and options. This tool has the following features:
•
Enables GUI and a command-line, scriptable interface
•
Provides scriptable, command-line deployment
•
Requires no agent for remote installations
•
Enables dependency checking, which ensures appropriate install order and dependency checking
between components
•
Deploys software and firmware on Windows and Linux operating systems
•
Performs local or remote (one-to-many) online deployment
•
Deploys firmware and software together
•
Supports offline and online deployment
•
Deploys necessary component updates only
•
Downloads the latest components from Web
•
Enables direct update of BMC firmware (HP iLO)
For more information about HP SUM and to access the HP Smart Update Manager User Guide, see the HP
website (http://www.hp.com/go/hpsum/documentation).
HP ROM-Based Setup Utility
RBSU is a configuration utility embedded in HP ProLiant servers that performs a wide range of configuration
activities that can include the following:
•
Configuring system devices and installed options
•
Enabling and disabling system features
•
Displaying system information
•
Selecting the primary boot controller
Software and configuration utilities
72
•
Configuring memory options
•
Language selection
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or
the HP website (http://www.hp.com/support/rbsu).
Using RBSU
To use RBSU, use the following keys:
•
To access RBSU, press the F9 key during power-up when prompted.
•
To navigate the menu system, use the arrow keys.
•
To make selections, press the Enter key.
•
To access Help for a highlighted configuration option, press the F1 key.
IMPORTANT: RBSU automatically saves settings when you press the Enter key. The utility does
not prompt you for confirmation of settings before you exit the utility. To change a selected setting,
you must select a different setting and press the Enter key.
Default configuration settings are applied to the server at one of the following times:
•
Upon the first system power-up
•
After defaults have been restored
Default configuration settings are sufficient for proper typical server operation, but configuration settings can
be modified using RBSU. The system will prompt you for access to RBSU with each power-up.
Auto-configuration process
The auto-configuration process automatically runs when you boot the server for the first time. During the
power-up sequence, the system ROM automatically configures the entire system without needing any
intervention. During this process, the ORCA utility, in most cases, automatically configures the array to a
default setting based on the number of drives connected to the server.
NOTE: If the boot drive is not empty or has been written to in the past, ORCA does not
automatically configure the array. You must run ORCA to configure the array settings.
NOTE: The server may not support all the following examples.
Drives installed
Drives used
RAID level
1
1
RAID 0
2
2
RAID 1
3, 4, 5, or 6
3, 4, 5, or 6
RAID 5
More than 6
0
None
To change any ORCA default settings and override the auto-configuration process, press the F8 key when
prompted.
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or
the HP website (http://www.hp.com/support/rbsu).
Software and configuration utilities
73
Boot options
Near the end of the boot process, the boot options screen is displayed. This screen is visible for several
seconds before the system attempts to boot from a supported boot device. During this time, you can do the
following:
•
Access RBSU by pressing the F9 key.
•
Access Intelligent Provisioning Maintenance Menu by pressing the F10 key.
•
Access the boot menu by pressing the F11 key.
•
Force a PXE Network boot by pressing the F12 key.
Re-entering the server serial number and product ID
After you replace the system board, you must re-enter the server serial number and the product ID.
1.
During the server startup sequence, press the F9 key to access RBSU.
2.
Select the Advanced Options menu.
3.
Select Service Options.
4.
Select Serial Number. The following warning appears:
Warning: The serial number should ONLY be modified by qualified service
personnel. This value should always match the serial number located on the
chassis.
5.
Press the Enter key to clear the warning.
6.
Enter the serial number and press the Enter key.
7.
Select Product ID. The following warning appears:
Warning: The Product ID should ONLY be modified by qualified service
personnel. This value should always match the Product ID located on the
chassis.
8.
Enter the product ID and press the Enter key.
9.
Press the Esc key to close the menu.
10.
Press the Esc key to exit RBSU.
11.
Press the F10 key to confirm exiting RBSU. The server automatically reboots.
Utilities and features
Array Configuration Utility
ACU is a utility with the following features:
•
Runs as a local application or remote service accessed through the HP System Management Homepage
•
Supports online array capacity expansion, logical drive extension, assignment of online spares, and
RAID or stripe size migration
•
Suggests the optimum configuration for an unconfigured system
•
For supported controllers, provides access to licensed features, including:
o
Moving and deleting individual logical volumes
Software and configuration utilities
74
o
Advanced Capacity Expansion (SATA to SAS and SAS to SATA)
o
Offline Split Mirror
o
RAID 6 and RAID 60
o
RAID 1 (ADM) and RAID 10 (ADM)
o
HP Drive Erase
o
Video-On-Demand Advanced Controller Settings
•
Provides different operating modes, enabling faster configuration or greater control over the
configuration options
•
Remains available any time that the server is on
•
Displays on-screen tips for individual steps of a configuration procedure
•
Provides context-sensitive searchable help content
•
Provides diagnostic and SmartSSD Wear Gauge functionality on the Diagnostics tab
ACU is now available as an embedded utility, starting with HP ProLiant Gen8 servers. To access ACU, use
one of the following methods:
•
If an optional controller is not installed, press F10 during boot.
•
If an optional controller is installed, when the system recognizes the controller during POST, press F5.
For optimum performance, the minimum display settings are 1024 × 768 resolution and 16-bit color. Servers
running Microsoft® operating systems require one of the following supported browsers:
•
Internet Explorer 6.0 or later
•
Mozilla Firefox 2.0 or later
For Linux servers, see the README.TXT file for additional browser and support information.
For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant
Servers User Guide on the HP website (http://www.hp.com/support/SAC_UG_ProLiantServers_en). To
configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP
website (http://www.hp.com/support/CASAC_RG_en).
Option ROM Configuration for Arrays
Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign
RAID levels, and establish online spare configurations.
The utility also provides support for the following functions:
•
Reconfiguring one or more logical drives
•
Viewing the current logical drive configuration
•
Deleting a logical drive configuration
•
Setting the controller to be the boot controller
•
Selecting the boot volume
If you do not use the utility, ORCA will default to the standard configuration.
For more information regarding the default configurations that ORCA uses, see the HP ROM-Based Setup
Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/rbsu).
Software and configuration utilities
75
For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant
Servers User Guide on the HP website (http://www.hp.com/support/SAC_UG_ProLiantServers_en). To
configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP
website (http://www.hp.com/support/CASAC_RG_en).
ROMPaq utility
The ROMPaq utility enables you to upgrade the system firmware (BIOS). To upgrade the firmware, insert a
ROMPaq USB Key into an available USB port and boot the system. In addition to ROMPaq, Online Flash
Components for Windows and Linux operating systems are available for updating the system firmware.
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available firmware
revisions.
For more information, go to the HP website (http://www.hp.com/go/hpsc) and click on Drivers, Software
& Firmware. Then, enter your product name in the Find an HP product field and click Go.
Automatic Server Recovery
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as
a blue screen, ABEND (does not apply to HP ProLiant DL980 Servers), or panic. A system fail-safe timer, the
ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the
operating system is functioning properly, the system periodically resets the timer. However, when the
operating system fails, the timer expires and restarts the server.
ASR increases server availability by restarting the server within a specified time after a system hang. At the
same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR
has restarted the system. You can disable ASR from the System Management Homepage or through RBSU.
USB support
HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by
the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB
devices through legacy USB support, which is enabled by default in the system ROM.
Legacy USB support provides USB functionality in environments where USB support is not available normally.
Specifically, HP provides legacy USB functionality for the following:
•
POST
•
RBSU
•
Diagnostics
•
DOS
•
Operating environments which do not provide native USB support
Redundant ROM support
The server enables you to upgrade or configure the ROM safely with redundant ROM support. The server has
a single ROM that acts as two separate ROM images. In the standard implementation, one side of the ROM
contains the current ROM program version, while the other side of the ROM contains a backup version.
Software and configuration utilities
76
NOTE: The server ships with the same version programmed on each side of the ROM.
Safety and security benefits
When you flash the system ROM, ROMPaq writes over the backup ROM and saves the current ROM as a
backup, enabling you to switch easily to the alternate ROM version if the new ROM becomes corrupted for
any reason. This feature protects the existing ROM version, even if you experience a power failure while
flashing the ROM.
Keeping the system current
Drivers
IMPORTANT: Always perform a backup before installing or updating device drivers.
The server includes new hardware that may not have driver support on all OS installation media.
If you are installing an Intelligent Provisioning-supported OS, use Intelligent Provisioning (on page 69) and its
Configure and Install feature to install the OS and latest supported drivers.
If you do not use Intelligent Provisioning to install an OS, drivers for some of the new hardware are required.
These drivers, as well as other option drivers, ROM images, and value-add software can be downloaded as
part of an SPP.
If you are installing drivers from SPP, be sure that you are using the latest SPP version that your server
supports. To verify that your server is using the latest supported version and for more information about SPP,
see the HP website (http://www.hp.com/go/spp/download).
To locate the drivers for a particular server, go to the HP website (http://www.hp.com/go/hpsc) and click
on Drivers, Software & Firmware. Then, enter your product name in the Find an HP product field and click
Go.
Software and firmware
Software and firmware should be updated before using the server for the first time, unless any installed
software or components require an older version. For system software and firmware updates, download the
SPP ("HP Service Pack for ProLiant" on page 72) from the HP website (http://www.hp.com/go/spp).
Version control
The VCRM and VCA are web-enabled Insight Management Agents tools that HP SIM uses to schedule
software update tasks to the entire enterprise.
•
VCRM manages the repository for SPP. Administrators can view the SPP contents or configure VCRM to
automatically update the repository with internet downloads of the latest software and firmware from
HP.
•
VCA compares installed software versions on the node with updates available in the VCRM managed
repository. Administrators configure VCA to point to a repository managed by VCRM.
Software and configuration utilities
77
For more information about version control tools, see the HP Systems Insight Manager User Guide, the HP
Version Control Agent User Guide, and the HP Version Control Repository User Guide on the HP website
(http://www.hp.com/go/hpsim).
HP operating systems and virtualization software support for
ProLiant servers
For information about specific versions of a supported operating system, see the HP website
(http://www.hp.com/go/ossupport).
Change control and proactive notification
HP offers Change Control and Proactive Notification to notify customers 30 to 60 days in advance of
upcoming hardware and software changes on HP commercial products.
For more information, refer to the HP website (http://www.hp.com/go/pcn).
Software and configuration utilities
78
Troubleshooting
Troubleshooting resources
The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving
common problems and comprehensive courses of action for fault isolation and identification, issue resolution,
and software maintenance on ProLiant servers and server blades. To view the guide, select a language:
•
English (http://www.hp.com/support/ProLiant_TSG_v1_en)
•
French (http://www.hp.com/support/ProLiant_TSG_v1_fr)
•
Spanish (http://www.hp.com/support/ProLiant_TSG_v1_sp)
•
German (http://www.hp.com/support/ProLiant_TSG_v1_gr)
•
Japanese (http://www.hp.com/support/ProLiant_TSG_v1_jp)
•
Simplified Chinese (http://www.hp.com/support/ProLiant_TSG_v1_sc)
The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages
and information to assist with interpreting and resolving error messages on ProLiant servers and server
blades. To view the guide, select a language:
•
English (http://www.hp.com/support/ProLiant_EMG_v1_en)
•
French (http://www.hp.com/support/ProLiant_EMG_v1_fr)
•
Spanish (http://www.hp.com/support/ProLiant_EMG_v1_sp)
•
German (http://www.hp.com/support/ProLiant_EMG_v1_gr)
•
Japanese (http://www.hp.com/support/ProLiant_EMG_v1_jp)
•
Simplified Chinese (http://www.hp.com/support/ProLiant_EMG_v1_sc)
Troubleshooting
79
System battery replacement
If the server no longer automatically displays the correct date and time, then replace the battery that provides
power to the real-time clock. Under normal use, battery life is 5 to 10 years.
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not
properly handled. To reduce the risk of personal injury:
•
•
•
•
Do not attempt to recharge the battery.
Do not expose the battery to temperatures higher than 60°C (140°F).
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
Replace only with the spare designated for this product.
To remove the component:
1.
Power down the server (on page 18).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Unlock the tower bezel (on page 19).
4.
Remove the access panel (on page 20).
5.
Locate the battery on the system board ("System board components" on page 11).
6.
Remove the battery.
IMPORTANT: Replacing the system board battery resets the system ROM to its default
configuration. After replacing the battery, reconfigure the system through RBSU.
To replace the component, reverse the removal procedure.
System battery replacement
80
For more information about battery replacement or proper disposal, contact an authorized reseller or an
authorized service provider.
System battery replacement
81
Regulatory compliance notices
Regulatory compliance identification numbers
For the purpose of regulatory compliance certifications and identification, this product has been assigned a
unique regulatory model number. The regulatory model number can be found on the product nameplate
label, along with all required approval markings and information. When requesting compliance information
for this product, always refer to this regulatory model number. The regulatory model number is not the
marketing name or model number of the product.
Federal Communications Commission notice
Part 15 of the Federal Communications Commission (FCC) Rules and Regulations has established Radio
Frequency (RF) emission limits to provide an interference-free radio frequency spectrum. Many electronic
devices, including computers, generate RF energy incidental to their intended function and are, therefore,
covered by these rules. These rules place computers and related peripheral devices into two classes, A and
B, depending upon their intended installation. Class A devices are those that may reasonably be expected
to be installed in a business or commercial environment. Class B devices are those that may reasonably be
expected to be installed in a residential environment (for example, personal computers). The FCC requires
devices in both classes to bear a label indicating the interference potential of the device as well as additional
operating instructions for the user.
FCC rating label
The FCC rating label on the device shows the classification (A or B) of the equipment. Class B devices have
an FCC logo or ID on the label. Class A devices do not have an FCC logo or ID on the label. After you
determine the class of the device, refer to the corresponding statement.
FCC Notice, Class A Equipment
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses,
and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. Operation of this equipment in a residential area
is likely to cause harmful interference, in which case the user will be required to correct the interference at
personal expense.
FCC Notice, Class B Equipment
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to
Regulatory compliance notices 82
radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the interference by
one or more of the following measures:
•
Reorient or relocate the receiving antenna.
•
Increase the separation between the equipment and receiver.
•
Connect the equipment into an outlet on a circuit that is different from that to which the receiver is
connected.
•
Consult the dealer or an experienced radio or television technician for help.
Declaration of conformity for products marked with
the FCC logo, United States only
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
this device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
For questions regarding this product, contact us by mail or telephone:
•
Hewlett-Packard Company
P. O. Box 692000, Mail Stop 530113
Houston, Texas 77269-2000
•
1-800-HP-INVENT (1-800-474-6836). (For continuous quality improvement, calls may be recorded or
monitored.)
For questions regarding this FCC declaration, contact us by mail or telephone:
•
Hewlett-Packard Company
P. O. Box 692000, Mail Stop 510101
Houston, Texas 77269-2000
•
1­281-514-3333
To identify this product, refer to the part, series, or model number found on the product.
Modifications
The FCC requires the user to be notified that any changes or modifications made to this device that are not
expressly approved by Hewlett-Packard Company may void the user’s authority to operate the equipment.
Cables
Connections to this device must be made with shielded cables with metallic RFI/EMI connector hoods in
order to maintain compliance with FCC Rules and Regulations.
Canadian notice (Avis Canadien)
Class A equipment
Regulatory compliance notices 83
This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment
Regulations.
Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur
du Canada.
Class B equipment
This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment
Regulations.
Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel brouilleur
du Canada.
European Union regulatory notice
Products bearing the CE marking comply with the following EU Directives:
•
Low Voltage Directive 2006/95/EC
•
EMC Directive 2004/108/EC
•
Ecodesign Directive 2009/125/EC, where applicable
CE compliance of this product is valid if powered with the correct CE-marked AC adapter provided by HP.
Compliance with these directives implies conformity to applicable harmonized European standards
(European Norms) that are listed in the EU Declaration of Conformity issued by HP for this product or product
family and available (in English only) either within the product documentation or at the following HP website
(http://www.hp.eu/certificates) (type the product number in the search field).
The compliance is indicated by one of the following conformity markings placed on the product:
For non-telecommunications products and for EU harmonized telecommunications products, such as
Bluetooth® within power class below 10mW.
For EU non-harmonized telecommunications products (If applicable, a 4-digit notified body number is
inserted between CE and !).
Please refer to the regulatory label provided on the product.
The point of contact for regulatory matters is Hewlett-Packard GmbH, Dept./MS: HQ-TRE, Herrenberger
Strasse 140, 71034 Boeblingen, GERMANY.
Disposal of waste equipment by users in private
households in the European Union
Regulatory compliance notices 84
This symbol on the product or on its packaging indicates that this product must not be disposed of
with your other household waste. Instead, it is your responsibility to dispose of your waste
equipment by handing it over to a designated collection point for the recycling of waste electrical
and electronic equipment. The separate collection and recycling of your waste equipment at the
time of disposal will help to conserve natural resources and ensure that it is recycled in a manner
that protects human health and the environment. For more information about where you can drop
off your waste equipment for recycling, please contact your local city office, your household
waste disposal service or the shop where you purchased the product.
Japanese notice
BSMI notice
Korean notice
Class A equipment
Regulatory compliance notices 85
Class B equipment
Chinese notice
Class A equipment
Vietnam compliance marking notice
This marking is for applicable products only.
Ukraine notice
Laser compliance
This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic
transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance
with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation.
Each laser product complies with 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser
Notice No. 50, dated June 24, 2007; and with IEC 60825-1:2007.
Regulatory compliance notices 86
WARNING: Use of controls or adjustments or performance of procedures other than those
specified herein or in the laser product's installation guide may result in hazardous radiation
exposure. To reduce the risk of exposure to hazardous radiation:
• Do not try to open the module enclosure. There are no user-serviceable components inside.
• Do not operate controls, make adjustments, or perform procedures to the laser device other
than those specified herein.
• Allow only HP Authorized Service technicians to repair the unit.
The Center for Devices and Radiological Health (CDRH) of the U.S. Food and Drug Administration
implemented regulations for laser products on August 2, 1976. These regulations apply to laser products
manufactured from August 1, 1976. Compliance is mandatory for products marketed in the United States.
Battery replacement notice
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not
properly handled. To reduce the risk of personal injury:
• Do not attempt to recharge the battery.
• Do not expose the battery to temperatures higher than 60°C (140°F).
• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
Batteries, battery packs, and accumulators should not be disposed of together with the general
household waste. To forward them to recycling or proper disposal, use the public collection system or
return them to HP, an authorized HP Partner, or their agents.
For more information about battery replacement or proper disposal, contact an authorized reseller or an
authorized service provider.
Taiwan battery recycling notice
The Taiwan EPA requires dry battery manufacturing or importing firms in accordance with Article 15 of the
Waste Disposal Act to indicate the recovery marks on the batteries used in sales, giveaway or promotion.
Contact a qualified Taiwanese recycler for proper battery disposal.
Power cord statement for Japan
Regulatory compliance notices 87
Acoustics statement for Germany (Geräuschemission)
Schalldruckpegel LpA < 70 dB(A)
Zuschauerpositionen (bystander positions), Normaler Betrieb (normal operation)
Nach ISO 7779:1999 (Typprüfung)
Regulatory compliance notices 88
Electrostatic discharge
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system
or handling parts. A discharge of static electricity from a finger or other conductor may damage system
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
To prevent electrostatic damage:
•
Avoid hand contact by transporting and storing products in static-safe containers.
•
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
•
Place parts on a grounded surface before removing them from their containers.
•
Avoid touching pins, leads, or circuitry.
•
Always be properly grounded when touching a static-sensitive component or assembly.
Grounding methods to prevent electrostatic discharge
Several methods are used for grounding. Use one or more of the following methods when handling or
installing electrostatic-sensitive parts:
•
Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist
straps are flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords. To
provide proper ground, wear the strap snug against the skin.
•
Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet when
standing on conductive floors or dissipating floor mats.
•
Use conductive field service tools.
•
Use a portable field service kit with a folding static-dissipating work mat.
If you do not have any of the suggested equipment for proper grounding, have an authorized reseller install
the part.
For more information on static electricity or assistance with product installation, contact an authorized
reseller.
Electrostatic discharge
89
Specifications
Environmental specifications
Specification
Value
Temperature range*
Operating
10°C to 35°C (50°F to 95°F)
Non-operating
-30°C to 60°C (-22°F to 140°F)
Relative humidity
(non-condensing)
Operating, maximum wet bulb 10% to 90%
temperature of 28°C (82.4°F)
Non-operating, maximum wet 5% to 95%
bulb temperature of 38.7°C
(101.7°F)
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048
m (10,000 ft) is applicable. No direct sunlight allowed.
Server specifications
Specification
Tower model
Rack model
Height
36.82 cm (14.50 in)
17.50 cm (6.89 in)
Depth
47.52 cm (18.71 in)
47.52 cm (18.71 in)
Width
17.50 cm (6.89 in)
36.82 cm (14.50 in)
Weight, minimum for SFF drive cage
11.00 kg (24.22 lb)
11.00 kg (24.22 lb)
Weight, maximum for SFF drive cage
17.00 kg (37.44 lb)
17.00 kg (37.44 lb)
Weight, minimum for LFF drive cage
11.90 kg (26.21 lb)
11.90 kg (26.21 lb)
Weight, maximum for LFF drive cage
19.00 kg (41.85 lb)
19.00 kg (41.85 lb)
Power supply specifications
Depending on installed options, the server is configured with one of the following power supplies:
•
HP 350 W 4U Integrated Power Supply
•
HP 460 W CS Gold Hot-plug Power Supply (92% efficiency)
CAUTION: Check the system and power supply input ratings before powering up the server.
Specifications
90
HP 350 W 4U Integrated Power Supply
Specification
Value
Input requirements
—
Rated input voltage
100 V AC to 240 V AC
Rated input frequency
47 Hz to 63 Hz
Rated input current
6A
Rated input power
440 W at 100 V AC input
440 W at 200 V AC input
Efficiency
No less than 82% at 100% load
No less than 85% at 50% load
No less than 82% at 20% load
Power supply output
—
Rated steady-state power
350 W at 100 V AC input
350 W at 200 V AC input
Maximum peak power
400 W at 100 V AC input
400 W at 200 V AC input
Rated output power
350 W
HP 460 W CS Gold Hot-plug Power Supply (92% efficiency)
Specification
Value
Input requirements
—
Rated input voltage
100 V AC to 240 V AC
Rated input frequency
50 Hz to 60 Hz
Rated input current
6 A to 3 A
Rated input power
526 W at 115 V AC input
523 W at 230 V AC input
Power supply output
—
Efficiency
Not less than 87.5% at 100% load
Not less than 89.5% at 50% load
Not less than 87.5% at 20% load
Rated steady-state power
460 W at 100 V to 120 V AC
input
460 W at 200 V to 240 V AC
input
Maximum peak power
460 W at 100 V to 120 V AC
input
460 W at 200 V to 240 V AC
input
Hot-plug power supply calculations
For hot-plug power supply specifications and calculators to determine electrical and heat loading for the
server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.com/configurator/).
Specifications
91
Support and other resources
Before you contact HP
Be sure to have the following information available before you call HP:
•
Active Health System log
Download and have available an Active Health System log for 3 days before the failure was detected.
For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP
website (http://www.hp.com/go/ilo/docs).
•
Onboard Administrator SHOW ALL report (for HP BladeSystem products only)
For more information on obtaining the Onboard Administrator SHOW ALL report, see the HP website
(http://h20000.www2.hp.com/bizsupport/TechSupport/Document.jsp?lang=en&cc=us&objectID=c
02843807).
•
Technical support registration number (if applicable)
•
Product serial number
•
Product model name and number
•
Product identification number
•
Applicable error messages
•
Add-on boards or hardware
•
Third-party hardware or software
•
Operating system type and revision level
HP contact information
For United States and worldwide contact information, see the Contact HP website
(http://www.hp.com/go/assistance).
In the United States:
•
To contact HP by phone, call 1-800-334-5144. For continuous quality improvement, calls may be
recorded or monitored.
•
If you have purchased a Care Pack (service upgrade), see the Support & Drivers website
(http://www8.hp.com/us/en/support-drivers.html). If the problem cannot be resolved at the website,
call 1-800-633-3600. For more information about Care Packs, see the HP website
(http://pro-aq-sama.houston.hp.com/services/cache/10950-0-0-225-121.html).
Customer Self Repair
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for
greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service
Support and other resources
92
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will
ship that part directly to you for replacement. There are two categories of CSR parts:
•
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts,
you will be charged for the travel and labor costs of this service.
•
Optional—Parts for which customer self repair is optional. These parts are also designed for customer
self repair. If, however, you require that HP replace them for you, there may or may not be additional
charges, depending on the type of warranty service designated for your product.
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the
Illustrated Parts Catalog.
Based on availability and where geography permits, CSR parts will be shipped for next business day
delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.
If assistance is required, you can call the HP Technical Support Center and a technician will help you over the
telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must
be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective
part back to HP within a defined period of time, normally five (5) business days. The defective part must be
returned with the associated documentation in the provided shipping material. Failure to return the defective
part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping
and part return costs and determine the courier/carrier to be used.
For more information about HP's Customer Self Repair program, contact your local service provider. For the
North American program, refer to the HP website (http://www.hp.com/go/selfrepair).
Réparation par le client (CSR)
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin
de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la
période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être
effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à
votre produit.
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué
par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation
géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même
ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le
Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise
s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai
indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les
coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de
retour, et détermine la société de courses ou le transporteur à utiliser.
Support and other resources
93
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP
(http://www.hp.com/go/selfrepair).
Riparazione da parte del cliente
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza
HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per
la sostituzione. Vi sono due categorie di parti CSR:
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere
spese addizionali a seconda del tipo di garanzia previsto per il prodotto.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono
identificate da un "No" nel Catalogo illustrato dei componenti.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento
di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del
centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente
deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve
spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il
componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione
fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.
Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il
corriere/vettore da utilizzare.
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).
Customer Self Repair
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere
Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der
Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses
Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen
Service berechnet.
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche
Kosten anfallen.
Support and other resources
94
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.
Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen
Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und
sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert
werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es
erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen
Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen
Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer
Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den
Kurier-/Frachtdienst.
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter
(http://www.hp.com/go/selfrepair).
Reparaciones del propio cliente
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self
Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar
sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios
de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente
CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se
clasifican en dos categorías:
•
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de
desplazamiento y de mano de obra de dicho servicio.
•
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si
precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de
servicio de garantía correspondiente al producto.
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que
el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado
realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el
catálogo ilustrado de componentes.
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su
destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el
mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de
asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales
para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán
devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá
hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes
defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas
Support and other resources
95
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de
componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en
contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite
la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Customer Self Repair
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij
de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat
onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee
categorieën CSR-onderdelen:
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen
voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen
voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het
product.
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met
de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij
reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en
kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).
Reparo feito pelo cliente
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo
pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.
Existem duas categorias de peças CSR:
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,
serão cobradas as despesas de transporte e mão-de-obra do serviço.
Support and other resources
96
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de
taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o
pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser
feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico
da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR
de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é
preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.
A peça com defeito deve ser enviada com a documentação correspondente no material de transporte
fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a
HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço
postal a ser utilizado.
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o
fornecedor de serviços local. Para o programa norte-americano, visite o site da HP
(http://www.hp.com/go/selfrepair).
Support and other resources
97
Support and other resources
98
Support and other resources
99
Acronyms and abbreviations
ABEND
abnormal end
ACU
Array Configuration Utility
AMP
Advanced Memory Protection
ASR
Automatic Server Recovery
BMC
baseboard management controller
BSMI
Bureau of Standards, Metrology and Inspection
CE
Conformité Européenne (European Conformity)
CSA
Canadian Standards Association
CSR
Customer Self Repair
DDR
double data rate
EMI
electromagnetic interference
FBWC
flash-backed write cache
Acronyms and abbreviations
100
FCC
Federal Communications Commission
HP CS
HP Common Slot (power supply)
HP SIM
HP Systems Insight Manager
HP SUM
HP Smart Update Manager
IEC
International Electrotechnical Commission
iLO
Integrated Lights-Out
IML
Integrated Management Log
ISO
International Organization for Standardization
LFF
large form factor
LRDIMM
load reduced dual in-line memory module
NMI
nonmaskable interrupt
NVRAM
nonvolatile memory
ORCA
Option ROM Configuration for Arrays
PCIe
Peripheral Component Interconnect Express
Acronyms and abbreviations
101
PDU
power distribution unit
POST
Power-On Self Test
PXE
preboot execution environment
RBSU
ROM-Based Setup Utility
RDIMM
registered dual in-line memory module
RDP
Rapid Deployment Pack
RF
radio frequency
RFI
radio frequency interference
RPS
redundant power supply
SAS
serial attached SCSI
SATA
serial ATA
SD
Secure Digital
SFF
small form factor
SPP
HP Service Pack for ProLiant
Acronyms and abbreviations
102
TMRA
recommended ambient operating temperature
TPM
Trusted Platform Module
UDIMM
unregistered dual in-line memory module
UID
unit identification
USB
universal serial bus
VCA
Version Control Agent
VCRM
Version Control Repository Manager
Acronyms and abbreviations
103
Documentation feedback
HP is committed to providing documentation that meets your needs. To help us improve the documentation,
send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com).
Include the document title and part number, version number, or the URL when submitting your feedback.
Documentation feedback 104
Index
A
D
access panel 20, 21
air baffle 21, 22
Array Configuration Utility (ACU) 74
ASR (Automatic Server Recovery) 76
authorized reseller 92
auto-configuration process 73
Automatic Server Recovery (ASR) 76
dedicated iLO management connector 52, 53
device numbers 14
diagnostic tools 67, 70, 76
diagnostics utility 70
DIMM identification 45
DIMM slot locations 12
DIMMs 46, 47
DIMMs, installing 47
DIMMs, single- and dual-rank 46
drive LEDs 15
drivers 77
drives 14, 15, 30, 32, 33, 37, 42
drives, installing 30, 32
B
battery 80, 87
battery, installing 80
bezel 19
bezel, removing 19
BIOS upgrade 67, 76
board components 11
boot options 29, 74
BSMI notice 85
buttons 7
buttons, front panel 7, 8
buttons, rear panel 10
C
cables 61, 83
cabling 61, 62, 63, 64, 65, 66
cache module 16, 40
cache module installation 40
Canadian notice 83
capacitor pack 40, 66
Care Pack 24
Change Control 78
Chinese notice 86
components 7
components, front panel 7
components, identification 7
components, system board 11
configuration of system 29, 67
connectors 7
contacting HP 92
controller 39
CSR (customer self repair) 92
customer self repair (CSR) 92
E
electrical grounding requirements 25
electrostatic discharge 89
enabling the Trusted Platform Module 56
environmental requirements 24, 25, 90
environmental specifications 90
Erase Utility 67, 70
error messages 79
European Union notice 84
expansion board options 48
expansion slot definitions 12
F
fan module location 17
FBWC cabling 61, 66
FBWC module 40
FBWC module LEDs 16
FBWC procedures 40
FCC rating label 82
features 7, 74
Federal Communications Commission (FCC)
notice 82, 83
firmware 77
front panel buttons 8
front panel components 7
front panel LEDs 8
Index 105
G
grounding methods 89
grounding requirements 25
guidelines 30
H
hardware options installation 30
health driver 76
help resources 92
Hot-plug SAS/SATA hard drive cabling 61
HP Insight Diagnostics 70
HP Insight Remote Support software 71
HP Smart Update Manager overview 67, 72
HP technical support 92
I
identification number 82
iLO (Integrated Lights-Out) 52, 53, 67, 68, 69
IML (Integrated Management Log) 67, 69
Insight Diagnostics 70, 77
Insight Remote Support Software 71
installation services 24, 27
installation, server options 27, 30
installing a DIMM 47
installing hardware 27, 30
installing the access panel 21
installing the server into the rack 27
installing the Trusted Platform Module board 54
Integrated Lights-Out (iLO) 67, 69
Integrated Management Log (IML) 69
Intelligent Provisioning 67, 69, 70
J
Japanese notice 85
K
Korean notices 85
L
laser devices 86
LED, system power 8
LEDs 15
LEDs, FBWC module 16
LEDs, front panel 8, 15
LEDs, NIC 8
LEDs, rear panel 10
LEDs, troubleshooting 79
LEDs, unit identification (UID) 8
LFF backplane 33
LFF drive cage 33
location 17
M
media drive bay 42
media drive bay cabling 64
memory 45, 46
memory options 44
memory subsystem architecture 46
modes 67
N
nonredundant power supply cabling 65
notices 82
notification actions 78
numbering, device bay 14
O
operating system installation 28, 78
operating systems 28, 78
optical drive 7, 42
optical drive cable 64
optimum environment 24
Option ROM Configuration for Arrays (ORCA) 67,
75
options installation 24, 27, 30, 33, 39, 42, 44, 52
ORCA (Option ROM Configuration for Arrays) 67,
75
P
PCI expansion slots 12
phone numbers 92
power cord 87
power distribution unit (PDU) 25
Power On button 29
power requirements 25, 91
power supply 57, 91
power supply cabling 65
power supply specifications 90, 91
powering down 18
powering up 18
preparation procedures 18
problem diagnosis 79
Product ID 74
Index 106
Q
QuickSpecs 67
R
rack installation 24, 27
rack resources 24
rack warnings 26
RBSU (ROM-Based Setup Utility) 67, 72, 73, 74
rear components 9
rear panel buttons 10
rear panel components 9
rear panel LEDs 10
recovering a lost password 56
redundant power supply cabling 65
redundant ROM 76
re-entering the server serial number 74
registering the server 29
regulatory compliance notices 82
removing the access panel 20
replacing the batteries 80
required information 92
retaining the recovery key/password 56
ROM redundancy 76
ROMPaq utility 67, 76
S
safety considerations 77, 89
SAS and SATA device numbers 14
scripted installation 71
scripting toolkit 67, 71
security 77
serial number 74
series number 82
server features and options 30
Server mode 67
server setup 24, 27, 77
server specifications 90
server warnings and cautions 26
server, front panel components 7
server, front panel LEDs 8
server, real panel LEDs 10
server, rear panel components 9
Service Packs 72
SFF drive cage 37
shipping carton contents 27
Smart Update Manager 67, 72
software 77, 78
space and airflow requirements 25
specifications 67, 90
specifications, environmental 90
specifications, power 90
specifications, server 90
static electricity 89
storage controller 39
support 92
supported operating systems 78
switch, system maintenance 12
system battery 80
system board components 11
system components 7
system configuration settings 12, 77
system maintenance switch 12
T
T-10/T-15 Torx screwdriver 17
Taiwan battery recycling notice 87
technical support 92
telco racks 27
telephone numbers 92
temperature requirements 25, 90
Torx screwdriver 17
tower bezel, installing 19
tower bezel, removing 19
TPM (Trusted Platform Module) 54, 56
troubleshooting 79
U
updating the system ROM 76
USB support 76
utilities 67, 74
utilities, deployment 67, 71, 72
V
ventilation 24
Version Control 77
video connector 11
Virtualization option 78
W
warnings 26
website, HP 92
Index 107