Daewoo CML-523BM Service manual

Service Manual
XGA COLOR MONITOR
Model : L500B1
DAEWOO ELECTRONICS CO., LTD.
http : //svc.dwe.co.kr
November, 2000
CONTENTS
SAFETY PRECAUTIONS
1
GENERAL SAFETY INFORMATION
2
SERVICING PRECAUTIONS
3
TECHNICAL INFORMATION
6
GENERAL INFORMATION
7
PIN CONNECTOR
8
CAUTIONS FOR ADJUSTMENT AND REPAIR
8
OPERATION & ADJUSTMENT
9
ALIGNMENT PROCEDURE
14
TROUBLESHOOTING HINTS
15
BLOCK DIAGRAM
22
PCB LAYOUT
23
SCHEMATIC DIAGRAM
27
EXPLODED VIEW & MECHANICAL PARTS LIST
28
INFORMATION OF PART DESCRIPTION
29
ELECTRICAL PARTS LIST
30
SAFETY PRECAUTIONS
CAUTION: No modifications of any circuits should be attempted. Service work should be performed
only after you are thoroughly familiar with all of the following safety checks and servicing
guidelines.
◆ Safety Check
Care should be taken while servicing this analog color display because of the high voltages used in the
deflection circuits. These voltages are exposed in such areas as the associated flyback and yoke circuits.
◆ Fire & Shock Hazard
• Insert an isolation transformer between the analog color display and AC power line before servicing the
chassis.
• When servicing, pay close attention to the original lead dress especially in the high voltage circuit area;
if a short circuit is found, replace all parts which have been overheated as a result of the short circuit.
• All the protective devices must be reinstalled per original design.
• Soldering must be inspected for possible cold solder points, frayed leads, damaged insulation, solder
splashes or sharp solder points. Be certain to remove all foreign materials.
◆ Implosion Protection
Picture tube in this monitor employs intergral implosion protection system, but care should be taken to
avoid damage and scratching during installation.
Only use same type replacement picture tubes.
IMPORTANT SAFETY NOTICE: There are special components used in this analog color display,
which are important for safety. These parts are shaded on the
schematic diagram and on the replacement parts list. It is essential
that these critical parts should be replaced with manufacturer’s
specified parts to prevent X-Ray, shock, fire or other hazards. Do
not modify the original design without getting written permission
from DAEWOO ELECTRONICS CO. or this will void the original
parts and labor warranty.
◆ X-Ray
WARNING: The only potential source of X-Ray is the picture tube. However when the high voltage
circuitry is operating properly, there is no possibility of an X-Ray problem. The basic
precaution which must be exercised is to keep the high voltage at the following factory
recommended level.
NOTE: It is important to use an accurate, periodically, calibrated high voltage meter.
• To measure the high voltage, use a high-impedance high-voltage meter.
Connect(-) to chassis and (+) to the CRT anode button.
• Turn the Contrast & Brightness Control fully counterclockwise.
• Measure the high voltage. The high voltage meter should indicate the following factory
recommended levels.
• If the upper meter indication exceeds the maximum level, immediate service is required to
prevent the possibility of premature component failure.
• To prevent X-Ray possibility, it is essential to use the specified picture tube.
• The normal high voltage is 25.5KV or below and must not exceed 29KV at zero beam current
at rated voltage.
1
GENERAL SAFETY INFORMATION
◆ Terms in the manual
CAUTION
Statements identify conditions or practices that could result in damage to the equipment or
other property.
WARNING Statements identify conditions or practices that could result in personal injury or loss of
life.
◆ Terms as marked on equipment
CAUTION
Statements indicate a personal injury hazard not immediately accessible as one reads the
marking or a hazard which is properly included on the equipment itself.
WARNING Statements are clearly concerning indicated personal injury hazards.
◆ Symbols in the manual
The symbols indicate where applicable cautionary or other information is to be found.
◆ Symbols as marked on equipment
Protective GROUND terminal
◆ High Voltage Warning
And Critical Component Warning Label
The following warning label is on the CRT PWB shield case inside the unit.
Warning: This product includes critical mechanical and electrical parts which are essential for x ray
protection. For continued safety, replace critical components that are indicated in the service
manual with exact replacement parts given in the parts list.
Operating high voltage with this product is 29Kv at minimum brightness. Refer to service
manual for measurement procedures and proper service adjustments.
2
SERVICING PRECAUTIONS
CAUTION: Before servicing instruments covered by this service manual, its supplements, and
addendum, please read and follow the SAFETY PRECAUTIONS of this manual.
NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any
of the safety precautions on page 1 of this manual, always follow the safety precautions.
Remember: Safety First.
◆ General Servicing Precautions
1. Always unplug the AC power cord from the AC power source before:
a. Removing or reinstalling any component, circuit board, module, or any other instrument assembly.
b. Disconnecting or reconnecting any electrical plug or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic capacitor in the instrument.
CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors
may result in a explosion.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM. etc.) equipped with a suitable high voltage probe. Do not test high
voltage by “drawing an arc”.
3. Discharge the picture tube anode only by: (a) first connecting one end of an insulated clip lead to the
degaussing or line grounding system shield at the point where the picture tube socket ground lead is
connected, and then (b) touching the other end of the insulated clip lead to the picture tube anode
button, using an insulating handle to avoid personal contact with high voltage.
4. Do not any spray chemicals on or near this instrument, or any of its assemblies.
5. Unless otherwise specified in this service manual, only clean electrical contacts by applying the
following mixture to the contacts with a pipe cleaner, cotton-tipped stick, or comparable nonabrasive
applicator: 10% (by volume) Aceton and 90% (by volume) isopropyl alchohol (90%-99% strength).
CAUTION: This is a flammable mixture. Unless specified in this service manual, lubrication of
contacts is not required.
6. Do not damage any plug/socket B+ voltage interlocks with which instruments covered by this service
manual might be equipped.
7. Do not apply AC power to this instrument and/or any other of its electrical assemblies unless all the
solid-state device heat sinks are correctly installed.
8. Always connect the test instrument ground lead to the appropriate instrument chassis ground before
connecting the test instrument positive lead. Always remove the test instrument ground lead last.
9. Only use the test fixtures specified in this service manual with this instrument.
CAUTION: Do not connect the test fixture ground strap to any heatsink in this instrument.
3
◆ Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity.
Such components are commonly called Electrostatically Sensitive (ES) Devices.
The typical examples of ES devices are integrated circuits, some field-effect transistors, and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence
of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly,
wipe off any electrostatic charge on your body by touching any known earth ground. Alternatively,
obtain and wear a commercially available discharging wrist strap device which should be removed for
potential shock reasons prior to applying power to the unit under testing conditions.
2. After removing the electrical assembly equipped with ES devices, place the assembly on a conductive
surface such as aluminum foil to prevent electrostatic charge buildup or exposure to the assembly.
3. Only use a grounded-tip soldering iron to solder or unsolder ES devices.
4. Only use an anti-static type solder removal device. Some solder removal devices not classified as “antistatic” can generate enough electrical charges to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate enough electrical charges to damage ES
devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are
ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together
by conductive foam, aluminum foil, or comparable conductive material).
7. Immediately before removing the protective material from the leads of replacement ES devices, touch
the protective material to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure that no power is applied to the chassis or circuit, and observe all other safety
precautions.
8. Minimize bodily movements when handling unpackaged replacement ES devices. (Otherwise harmful
motion such as the brushing together clothes fabric or the lifting your foot from a carpeted floor can
generate enough static electricity to damage ES devices).
◆ General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron with appropriate tip size and shape that will maintain
tip temperature between a 550°F-660°F (288°C-316°C) range.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean.
4. Throughly clean the surface to be soldered. Use a small wire-bristle (0.5 inch or 1.25cm) brush with a
metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following soldering technique:
a. Allow the soldering iron tip to reach normal temperature (550°F to 660°F or 288°C to 316°C)
b. Hold the soldering iron tip and solder strand against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil,
and hold it there until the solder flows onto and around both the component lead and the foil.
d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle
brush.
4
FIGURE 1. USE SOLDERING IRON TO PRY LEADS
◆ IC Removal/Replacement
Some utilized chassis circuit boards have slotted (oblong) holes through which the IC leads are inserted
and then bent flat against the circuit foil. When holes are slotted, the following technique should be used
to remove and replace the IC. When working with boards using the familiar round hole, use the standard
technique as outlined in paragraphs 5 on the page under the title of general soldering guidelines.
◆ Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the
soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with
desoldering braid before removing the IC.
◆ Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (lt is not necessary to reapply acrylic coating
to the area).
◆ “Small-Signal” Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend the ends of each of three leads remaining on the circuit board into a “U” shape.
3. Bend the replacement transistor leads into a “U” shape.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board
and crimp the “U” with long nose pliers to ensure metal-to-metal contact, then solder each connection.
◆ Power IC, Transistor or Devices Removal/Replacement
1. Heat and remove all solders from the device leads.
2. Remove the heatsink mounting screw (if applicable).
3. Carefully remove the device from the circuit board.
4. Insert new device in circuit board.
5. Solder each device lead and then clip off excess lead.
6. Replace heatsink.
5
◆ Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicularly to the circuit board.
3. Observing diode polarity, wrap each lead out of the new diode around the corresponding lead on the
circuit board.
4. Securely crimp each connection and solder it.
5. Inspect the solder joints of the two “original” leads on the circuit board copper side. If they are not
shiny, reheat them and apply additional solder if necessary.
TECHNICAL INFORMATION
Panel Size
15.1-inch (38cm) diagonol
Pixel Pitch
0.3 x 0.3 mm
Synchronization
Horizontal
30 - 62 KHz
Vertical
50 - 85 Hz
Plug and Play
DDC1/2B/CI
Power Saving
EPA, VESA DPMS, Nutek Compliant
Power Source
100-240 Vac, 50/60Hz (Free Voltage)
DC12V, 3A
Power Consumption
21W(without adapter)/26W(with adapter)
Dimension-W x H x D(net/gross)
390 x 401.5 x 73.5mm /502 x 502 x 242mm
Weight(net/gross )
4.5/6.4 Kg
9.9/14.1lbs
Tilt/Swivel Range
Tilt
5° forward, 30° backward
Swivel
± 90° leftward, rightward
Operating Temperature
10 ~ 40°C /50 ~ 104°F
6
GENERAL INFORMATION
This TFT LCD monitor automatically scans all horizontal frequencies from 30KHz to 62KHz, and all
vertical frequencies from 50Hz to 85Hz. This TFT LCD monitor supports IBM PC, PC/XT, PC/AT, personal
System/2 (PS/2), Apple Macintosh, and compatible users crisp text and vivid color graphics display when
using the following graphics adapters : (VGA, Super VGA, VESA and XGA and Apple Macintosh Video
Card). And so, this TFT LCD monitor has a maximum horizontal resolution of 1024 dots and a maximum
vertical resolution of 768 lines for superior clarity of display.
By accepting analog signal inputs which level is zero to 0.7 Volts. This TFT LCD monitor can display and
262, 144 colors depending on the graphics adapter and software being used. (available used to 8 bit panel is
16.7M colors)
◆ Abbreviations
ADJ
AFC
CRT
Def
D.Y
HVG
H.SYNC
OSC
P.S.U
PWA
R.G.B
V.Sync
Adjustment
Automatic Frequency Control
Cathode Ray Tube
Deflection
Deflection Yoke
High Voltage Generator
Horizontal Synchronization
Oscillator
Power Supply Unit
Printed Circuit Board Wiring Assembly
Red, Green, Blue
Vertical Synchronization
7
PIN CONNECTOR
Pin
Signal
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Red
Green
Blue
GND
GND
GND - Red
GND - Green
GND - Blue
+5Vdc
GND - H.Sync
GND - V.Sync
Bi-directional Data (SDA)
Horizontal Sync
Vertical Sync (VCLK)
Data Clock (SCL)
1
6
10
15
Arrangement of 15-pin D-sub connector
CAUTIONS FOR ADJUSTMENT AND REPAIR
• Degaussing is always required when adjusting purity or convergence.
• The white balance adjustment has been done by a color analyzer in factroy. The adjustment procedure,
described in the service manual is made by a visual check.
• Allow 20 minutes warm-up time for the display before checking or adjusting only electrical
specification or function.
• Reform the leadwire after any repair work.
◆ Caution For Servicing
• In case of servicing or replacing CRT, high voltage sometimes remains in the anode of the CRT.
Completely discharge high voltage before servicing or replacing CRT to prevent a shock to the
serviceman.
8
OPERATION & ADJUSTMENT
Control Panel
AUTO
AUTO
EXIT
MENU
BRIGHTNESS
BRIGHTNESS
EXIT
MENU
BRIGHTNESS
•
The AUTO button launches the AUTO TRACKING function directly.
•
•
The EXIT button turns the OSD (On-Screen Display) window off.
•
•
The MENU button turns the OSD window on.
•
•
The button moves cursor to the left or high window in the OSD window.
•
•
The button moves cursor to the right or low window in the OSD window.
This button moves from sub menu to top menu in the OSD window.
This button moves from top menu to sub menu in the OSD window.
This button decreases the value of any selected function.
This button increases the value of any selected function.
Hot Key
AUTO
BRIGHTNESS
AUTO TRACKING
9
Key Process
MENU
MENU
MENU
EXIT
EXIT
EXIT
OSD OFF
10
Adjustment Procedure
Yes
Is the mode
1024x768?
No
Adjust the FIT
SCREEN.
No
Is the H.Size
proper?
Adjust the CLOCK
control.
Yes
Perform the AUTO
Is the
noise displayed on
the screen?
POSITION.
No
Yes
Perform the AUTO
TRACKING.
Is the
noise displayed on
the screen yet?
No
Yes
Adjust the CLOCK
FINE until the screen is
cleared.
Yes
Is the
noise displayed on
the screen yet?
No
End
11
OSD Functions
ICON
CONTROL
FUNCTIONS
LANGUAGE
Select language for OSD (5 languages).
CLOCK
Adjust the width (horizontal size) of the screen image.
CLOCK FINE
Sharpen the focus by aligning the illuminated pixels and adjust until the
screen image looks focused, crisp and sharp. Adjusting the CLOCK
FINE after the CLOCK adjustment will produce a clear screen.
COLOR TEMP
Choose different preset color temperatures or set your own customized
color parameters.
R
RED CONTROL
Adjust the red color.
G
GREEN CONTROL
Adjust the green color.
B
BLUE CONTROL
Adjust the blue color.
H. CENTER &
Adjust the position of the display horizontally(left or right) and vertically
(up or down).
V. CENTER
FIT SCREEN
Make characters of displayed text easier to read (only for resolutions
lower than 1024x768).
SMART SCALING
Adjust the display image quality (if the screen proceed to scaling up).
AUTO TRACKING
Adjust the horizontal & vertical picture image quality and size.
OSD
TIME OUT
Adjust the display OSD Menu.
STATUS
Display horizontal & vertical frequency and polarity.
RECALL
Reset the screen to the Factory Preset Display Settings.
AUTO POSITION
Choose automatically the proper horizontal position and vertical
position & size of the screen image.
CONTRAST
Adjust the contrast of image, the difference between light and dark
areas on the screen.
12
Self Diagnosis
When the monitor doesn’t display, if you press any key, Self Diagnosis screen is displayed. Self Diagnosis
function checks if the status of the monitor is No Signal or Out of range.
No Signal screen is displayed when the D-Sub signal connector is not connected or
the status of the monitor is on DPMS mode.
Out of Range screen is displayed when the applied frequency is under or over
normal range.
Normal range
(Non-interlaced mode only)
H : 30 - 62 KHz (1024 dot Max)
V : 50 - 85 Hz (768 dot Max)
13
ALIGNMENT PROCEDURE
Standard Check point
1. Power source : 100 - 240Vac, 50/60Hz.
2. Aging : Take at least 20 minutes warm-up time.
3. Signal
Video input : Analog 0.7Vpp 75Ω terminal positive polarity
Synchronizing : acceptable negative or positive at TTL level
Resolution
Horizontal : 1024 max.
Vertical : 768 max.
Frequency
Horizontal : 30KHz - 62KHz
Vertical : 50Hz - 85Hz (available only non interlace mode)
Adjustment
1. Smart scaling set to 69%.
2. Contrast set to 100%
3. Brightness set to 50%
4. Switching to factory alignment mode
Press power key with Auto key at the power off status.
5. Video level adjustment
Receive stair pattern of 16 step (doesn’t care any mode).
Readjust coarse R, G, B in TDA8752 menu before saturaton point.
6. Set up the tracking
See the user’s manual at page 8th.
7. Switching to user’s mode
If turn-off and turn-on then switched to user’s mode.
* All of adjusted data stores by fade out of OSD.
14
TROUBLESHOOTING HINTS
1. Abnormal mode detect
Abnormal mode
detect
Yes
Is a input
H-sync of ADC
correct?
No
Trouble in the H-sync
input circuit.
No
Trouble
in ADC.
Yes
Is waveform
of pin 84 of ADC
correct?
Yes
Trouble
in Scalier.
15
2. Trouble in Power on
Is Power LED
on or off?
Off
Refer to No video
or No raster.
No
Trouble
in the adapter.
No
Trouble in U3 & Q1
and its ambient circuit.
No
Trouble in SQ1 and
its ambient circuit.
On
Check the output
voltage
of adapter.
Yes
Is the pulse
of pin 7
of -com.
Yes
Is 5VS line
normal?
Yes
Check on U1(scalier)
16
3. No Raster
Check the
output of Q6 or
pin 3 of CN2.
< 2.5
Trouble in Q6 or
pin 3 of -com.
> 2.5
Is 12V
plugged in pin 1
of CN2?
No
Check 12V
line of CN3.
Yes
Is the output of
inverter correct?
No
Yes
Replace a LCD panal.
17
Replace the inverter.
4. One color is missing
One color is missing
Yes
No
Is the OSD color
normal?
Check the output
signal of Scalier.
Yes
Is the input
signal normal?
No
Check the video signal
cable or R,G,B
con-ass’y.
Yes
Are the
R,G,B Digital values
(every eight bits) correct
on ADC output
stage?
Yes
Trouble in the soldering
of R,G,B data lines
from output of ADC
to pin 41 wafer.
18
No
Check the ambient
circuit of ADC.
5. No Video
Has display image
only white?
No
Next page.
Yes
Is pin 41
cable of CN6
well connected?
No
Connection trouble.
Yes
Is pin 1
of Q16 3.3V?
No
Yes
Check the output of scalier
(pin 70, 99, 100, 101)
and soldering of CN6.
19
Check Q16, its ambient
circuit and pin 26 of -com.
5-1. No Video
Black
Yes
Is OSD normal?
No
(3) No raster
or Check SDRAM.
No
Set the contrast
up to Max.
Yes
Is the contrast
at its maximum?
Yes
Is the output of
ADC correct?
No
Is the input of
ADC correct?
Yes
Yes
Next Page.
No
Check the video
input signal.
Replace the main board
(or replace ADC).
Yes
Is the output
of Scalier correct?
Is the input of
Scalier correct?
No
No
Yes
Yes
Replace the main board
(or replace ADC).
Check the LCD panel
or pin 41 wafer and
con-ass’y.
20
6. Broke graph
Is clock
of SDRAM pin 35
correct?
No
Check Scalier
pin 135.
Yes
Is 3.3V plugged in
VCC pin of SDRAM?
No
Yes
After checking the
soldering between SDRAM
and Scalier, if O.K., replace
the SDRAM.
21
Check 3.3V line.
H/V
sync
Main Borad
RGB signal
Mx88LC284FC
PRE-AMP
Data line/Address
line/contorl line
SDRAM (16Mbit*2)
15pin DSUB -Connector
panel
TDA8752
MIU
RED (8)
ADC
Buffer
74ACT14
Green(8)
Odd/
Even
MUX
Red(6)
Green(6)
Blue(6)
Hs,Vs,DE,LCLK
Panel S,G Driver
Back light
Dithering
Scaling
Blue(8)
Offset/Corse
630VAC/ 62khz
22
clk
OSD Mux
Dot clk
Hs,Vs
Controller
PLL
DC-AC Inverter
CPU I/F
-Clock timing&
phase
-Current &resistance
address/data line
I2C
Micom
DDC I2C
Dimming
12V/ On-Off
12V
I2C
EEPROM
24C08
Hsync,Vsync
Control Board
AC IN(100 ~ 230V)
12V(3A)Adapter
DC-DC converter&
on-off control
3.3V/5V/12V
BLOCK DIAGRAM
L500B1 BLOCK DIAGRAM
From PC
PCB LAYOUT
Main PCB Component Side
23
Main PCB Solder Side
24
Control PCB Component Side
Control PCB Solder Side
25
D-sub PCB Component Side
D-sub PCB Solder Side
26
SCHEMATIC DIAGRAM
27
EXPLODED VIEW & MECHANICAL PARTS LIST
28
INFORMATION OF PART DESCRIPTION
Important Safety Notice
Components identified with the International Symbol have special characteristics important for safety.
When replacing any components, use only manufacturer’s specified parts.
Abbreviation of Description
RESISTOR Description
Tolerance
F
± 1%
J
± 5%
K
± 10%
M
± 20%
G
± 2%
Example:
Fig &
Index
Part No
Description
Resistors
RD-4Z820J
Carbon : 82J
HRFS472JBA Chip 4.7K OHM J
R101
R30
CAPACITOR Description
C
D
F
J
K
P
Z
Tolerance
± 0.25pF
± 0.5%
± 1pF
± 5%
± 10%
± 100% ~ 0%
± 80% ~ –
Example:
Fig &
Index
C28
C63
C44
Part No
Description
Capacitors
HCFK104ZBA
Chip Cera 50V Z
HCBK393KBA
Chip Cera 50V K
HCQK102JBA
Chip Cera 50V J
29
ELECTRICAL PARTS LIST
The components identified by mark
have special characteristics important for safety and x-ray radiation.
These should be replaced only with the types specified in the parts list.
LOC
PART-CODE
PART-NAME
PART-DESC
LOC
PART-CODE
PART-NAME
PART-DESC
00030 9970800035
CABLE SIGNAL AS
15P+15P/DDC=1.5M(GY275A)
C28
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
00040 W1112B831-
CORD POWER
CML-100 1.8M BK(AME)
C29
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
01000 9979800550
PCB CONTROL
T=1.6*246*122
C3
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
9979720013
ADAPTER POWER
LSE9802B1240(DC12V/3.3A)
C31
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C1
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C32
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C10
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C33
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C100
HCQK221JBA
C CHIP CERA
50V CH 220PF J 1608
C34
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C101
HCQK221JBA
C CHIP CERA
50V CH 220PF J 1608
C35
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C102
HCQK221JBA
C CHIP CERA
50V CH 220PF J 1608
C36
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C103
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C37
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C104
HCFD105ZBA
C CHIP CERA
Y5V 10V 1MF Z 1608
C38
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C106
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C39
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C108
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C4
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C11
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C40
HCQK220JBA
C CHIP CERA
50V CH 22PF J 1608
C110
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C41
HCQK220JBA
C CHIP CERA
50V CH 22PF J 1608
C111
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C42
HCQK470JBA
C CHIP CERA
50V CH 47PF J 1608
C113
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C43
HCQK330JBA
C CHIP CERA
50V CH 33PF J 1608
C114
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C44
HCQK102JBA
C CHIP CERA
50V CH 1000PF J 1608
C115
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C45
HCFF474ZBA
C CHIP CERA
Y5V 16V 0.47MF Z 1608
C116
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C46
HCQK120JBA
C CHIP CERA
50V CH 12PF J 1608
C117
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C47
HCQK102JBA
C CHIP CERA
50V CH 1000PF J 1608
C118
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C48
HCFF474ZBA
C CHIP CERA
Y5V 16V 0.47MF Z 1608
C119
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C49
HCQK120JBA
C CHIP CERA
50V CH 12PF J 1608
C12
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C5
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C120
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C50
HCQK102JBA
C CHIP CERA
50V CH 1000PF J 1608
C121
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C51
HCFF474ZBA
C CHIP CERA
Y5V 16V 0.47MF Z 1608
C123
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C52
HCQK120JBA
C CHIP CERA
50V CH 12PF J 1608
C124
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
C54
HCFF474ZBA
C CHIP CERA
Y5V 16V 0.47MF Z 1608
C125
HCENH101MD C CHIP ELECTRO
MV 25V 100MF D8.0XH6.3
C55
HCQK102JBA
C CHIP CERA
50V CH 1000PF J 1608
C126
HCEKK109MC C CHIP ELECTRO
MV 50V 1MF D4.0XH5.2
C56
HCQK150JBA
C CHIP CERA
50V CH 15PF J 1608
C13
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C57
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C14
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C58
HCQK102JBA
C CHIP CERA
50V CH 1000PF J 1608
C15
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C59
HCQK151JBA
C CHIP CERA
50V CH 150PF J 1608
C16
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C6
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C17
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C60
HCBK393KBA
C CHIP CERA
50V X7R 0.039MF K 1608
C18
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C61
HCQK102JBA
C CHIP CERA
50V CH 1000PF J 1608
C19
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C62
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C2
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C63
HCBK103KBA
C CHIP CERA
50V X7R 0.01MF K 1608
C20
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C64
HCBK103KBA
C CHIP CERA
50V X7R 0.01MF K 1608
C21
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C65
HCBK103KBA
C CHIP CERA
50V X7R 0.01MF K 1608
C22
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C66
HCBK223KBA
C CHIP CERA
50V X7R 0.022MF K 1608
C23
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C67
HCBK103KBA
C CHIP CERA
50V X7R 0.01MF K 1608
C24
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C68
HCBK223KBA
C CHIP CERA
50V X7R 0.022MF K 1608
C25
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C69
HCBK103KBA
C CHIP CERA
50V X7R 0.01MF K 1608
C26
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C7
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C27
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
C70
HCBK223KBA
C CHIP CERA
50V X7R 0.022MF K 1608
! AD1
30
LOC
PART-CODE
PART-NAME
PART-DESC
LOC
PART-CODE
PART-NAME
PART-DESC
C71
HCBK103KBA
C CHIP CERA
50V X7R 0.01MF K 1608
L1
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
C72
HCBK223KBA
C CHIP CERA
50V X7R 0.022MF K 1608
L10
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
C73
HCBK103KBA
C CHIP CERA
50V X7R 0.01MF K 1608
L11
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
C74
HCBK223KBA
C CHIP CERA
50V X7R 0.022MF K 1608
L12
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
C75
HCBK103KBA
C CHIP CERA
50V X7R 0.01MF K 1608
L2
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
C76
HCBK223KBA
C CHIP CERA
50V X7R 0.022MF K 1608
L3
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
C77
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
L4
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
C78
HCQK102JBA
C CHIP CERA
50V CH 1000PF J 1608
L5
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
C79
HCQK102JBA
C CHIP CERA
50V CH 1000PF J 1608
L6
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
C8
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
L7
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
C80
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
L8
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
C81
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
L9
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
C82
HCQK102JBA
C CHIP CERA
50V CH 1000PF J 1608
LCD
DLM151X2C2
LCD
LM151X2-C2TH
C83
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
LED1 DSD50GYW--
LED
SD50GYW(GREEN/AMBER)
C84
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
OUTA 9970741001
CONN AS
DF-9-41S*2+1571#32=220
C85
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
PCB1
9979800549
PCB MAIN
T=1.6*180*140
C86
HCQK102JBA
C CHIP CERA
50V CH 1000PF J 1608
Q1
TZTC3198Y-
TR
KTC3198Y-(1815Y) (AUTO)
C87
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
Q10
DKDS226RTK
DIODE CHIP
KDS226(RTK)
C88
HCQK102JBA
C CHIP CERA
50V CH 1000PF J 1608
Q11
DKDS226RTK
DIODE CHIP
KDS226(RTK)
C89
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
Q12
DKDS226RTK
DIODE CHIP
KDS226(RTK)
C9
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
Q13
DKDS226RTK
DIODE CHIP
KDS226(RTK)
C90
HCQK220JBA
C CHIP CERA
50V CH 22PF J 1608
Q14
DKDS226RTK
DIODE CHIP
KDS226(RTK)
C91
HCQK220JBA
C CHIP CERA
50V CH 22PF J 1608
Q15
DKDS226RTK
DIODE CHIP
KDS226(RTK)
C92
HCQK121JBA
C CHIP CERA
50V CH 120PF J 1608
Q16
TNDS9958--
FET CHIP
NDS9958
C93
HCQK121JBA
C CHIP CERA
50V CH 120PF J 1608
Q2
TKTC3875SY
TR CHIP
KTC3875SY(RTK)
C94
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
Q3
TKTC3875SY
TR CHIP
KTC3875SY(RTK)
C95
HCQK221JBA
C CHIP CERA
50V CH 220PF J 1608
Q4
TKTC3875SY
TR CHIP
KTC3875SY(RTK)
C96
HCQK120JBA
C CHIP CERA
50V CH 12PF J 1608
Q5
TKTC3875SY
TR CHIP
KTC3875SY(RTK)
C97
HCQK120JBA
C CHIP CERA
50V CH 12PF J 1608
Q6
TKTC3875SY
TR CHIP
KTC3875SY(RTK)
C98
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
Q7
TKTC3875SY
TR CHIP
KTC3875SY(RTK)
C99
HCQK221JBA
C CHIP CERA
50V CH 220PF J 1608
Q9
DKDS226RTK
DIODE CHIP
KDS226(RTK)
CN10
9979220022
CONN WAFER
SMAW250-07 (ANGLE)
R1
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
CN11
9979200209
D-SUB 15P ANGLE
15P DDC BLUE W/IN SCREW
R10
HRFS513JBA
R CHIP
1/16 51K OHM J 1608
CN12
9979100010
JACK DC
POWER JACK 6.5PIE 14.5*9
R12
HRFS512JBA
R CHIP
1/16 5.1K OHM J 1608
CN1A 9970740044
CONN AS
SMH250-04+YBNH200-05=270
R14
HRFS220JBA
R CHIP
1/16W 22 OHM J 1608
CN2A 9970750035
CONN AS
5264-05+YBNH200+1007=110
R15
HRFS220JBA
R CHIP
1/16W 22 OHM J 1608
CN3A 9970730072
CONN AS
SMH250+YBNH200+1354=250
R16
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
CN4A 9970760045
CONN AS
SMH250+YBNH200+2464=120
R17
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
CN5A 9970770030
CONN AS
SMH250+YBNH200+1354=180
R18
HRFS750JBA
R CHIP
1/16W 75 OHM J 1608
CN6
9979220080
CONN WAFER
DF9B-41P-1V(22)
R19
HRFS750JBA
R CHIP
1/16W 75 OHM J 1608
CN7
9979220019
CONN WAFER
SMAW250-04 (ANGLE)
R2
HRFS101JBA
R CHIP
1/16 100 OHM J 1608
CN8
9979220018
CONN WAFER
SMAW250-03 (ANGLE)
R20
HRFS750JBA
R CHIP
1/16W 75 OHM J 1608
CN9
9979220021
CONN WAFER
SMAW250-06 (ANGLE)
R21
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
D2
DRLS4148--
DIODE CHIP
RLS4148
R22
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
D3
DRLS4148--
DIODE CHIP
RLS4148
R23
HRFS101JBA
R CHIP
1/16 100 OHM J 1608
D4
DRLS4148--
DIODE CHIP
RLS4148
R24
HRFS102JBA
R CHIP
1/16 1K OHM J 1608
D5
DRLS4148--
DIODE CHIP
RLS4148
R25
HRFS102JBA
R CHIP
1/16 1K OHM J 1608
EF1
5PF1BH471M
FILTER LC
CFI-06-B-1H-471M
R26
HRFS153JBA
R CHIP
1/16 15K OHM J 1608
LCD INVERTER
BAI-1502
R27
HRFS102JBA
R CHIP
1/16 1K OHM J 1608
! INV1 DBA11502--
31
LOC
PART-CODE
PART-NAME
PART-DESC
LOC
PART-CODE
PART-NAME
PART-DESC
R28
HRFS105JBA
R CHIP
1/16 1M OHM J 1608
R9
HRFS101JBA
R CHIP
1/16 100 OHM J 1608
R29
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
RP1
HFFH4H300E
COIL CHIP BEAD
HB-4H3216-300JT
R3
HRFS000JBA
R CHIP
1/16 0 OHM J 1608
RP10
HFFH4M121E
COIL CHIP BEAD
HB-4M3216-121JT
R30
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
RP11
HFFH4M121E
COIL CHIP BEAD
HB-4M3216-121JT
R31
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
RP2
HFFH4H300E
COIL CHIP BEAD
HB-4H3216-300JT
R32
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
RP3
HFFH4H300E
COIL CHIP BEAD
HB-4H3216-300JT
R33
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
RP4
HFFH4H300E
COIL CHIP BEAD
HB-4H3216-300JT
R34
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
RP5
HFFH4H300E
COIL CHIP BEAD
HB-4H3216-300JT
R35
HRFS101JBA
R CHIP
1/16 100 OHM J 1608
RP6
HFFH4M121E
COIL CHIP BEAD
HB-4M3216-121JT
R36
HRFS221JBA
R CHIP
1/16 220 OHM J 1608
RP7
HFFH4M121E
COIL CHIP BEAD
HB-4M3216-121JT
R37
HRFS101JBA
R CHIP
1/16 100 OHM J 1608
RP8
HFFH4M121E
COIL CHIP BEAD
HB-4M3216-121JT
R38
HRFS221JBA
R CHIP
1/16 220 OHM J 1608
RP9
HFFH4M121E
COIL CHIP BEAD
HB-4M3216-121JT
R39
HRFS223JBA
R CHIP
1/16 22K OHM J 1608
SC1
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
R40
HRFS101JBA
R CHIP
1/16 100 OHM J 1608
SC10
HCEMF470MD C CHIP ELECTRO
MV 16V 47MF D6.3XH5.2
R41
HRFS101JBA
R CHIP
1/16 100 OHM J 1608
SC11
HCEMH220MD C CHIP ELECTRO
MV 25V 22MF D6.3XH5.2
R42
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SC12
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
R43
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SC13
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
R44
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SC14
HCBK103KBA
C CHIP CERA
50V X7R 0.01MF K 1608
R45
HRFS102JBA
R CHIP
1/16 1K OHM J 1608
SC15
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
R46
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SC16
HCEMF470MD C CHIP ELECTRO
R47
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SC17
HCBK103KBA
C CHIP CERA
50V X7R 0.01MF K 1608
R48
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SC18
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
R49
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SC19
HCEPF221ME
C CHIP ELECTRO
MV 16V 220MF D8.0XH1.0
R5
HRFS105JBA
R CHIP
1/16 1M OHM J 1608
SC2
HCBK103KBA
C CHIP CERA
50V X7R 0.01MF K 1608
R50
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SC20
HCENH101MD C CHIP ELECTRO
MV 25V 100MF D8.0XH6.3
R51
HRFS101JBA
R CHIP
1/16 100 OHM J 1608
SC21
HCENH101MD C CHIP ELECTRO
MV 25V 100MF D8.0XH6.3
R52
HRFS101JBA
R CHIP
1/16 100 OHM J 1608
SC3
HCEKF100MC
C CHIP ELECTRO
MV 16V 10MF D4.0XH5.2
R53
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SC4
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
R54
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SC5
HCBK103KBA
C CHIP CERA
50V X7R 0.01MF K 1608
R55
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SC6
HCFK104ZBA
C CHIP CERA
50V Y5V 0.1MF Z 1608
R56
HRFS222JBA
R CHIP
1/16 2.2K OHM J 1608
SC7
HCEMH220MD C CHIP ELECTRO
MV 25V 22MF D6.3XH5.2
R57
HRFS222JBA
R CHIP
1/16 2.2K OHM J 1608
SC8
HCEMH220MD C CHIP ELECTRO
MV 25V 22MF D6.3XH5.2
R58
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SC9
HCEEH470MD C CHIP ELECTRO
MV 25V 47MF D6.3XH5.7
R59
HRFS101JBA
R CHIP
1/16 100 OHM J 1608
SD1
DSK14-----
DIODE SCHOTTKY
SK14
R6
HRFS102JBA
R CHIP
1/16 1K OHM J 1608
SL1
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
R60
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SL2
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
R61
HRFS101JBA
R CHIP
1/16 100 OHM J 1608
SL3
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
R62
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SL4
HFFTB2601B
COIL CHIP BEAD
TB321611Z260
R63
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SL5
HLC330M00E
L CHIP COIL
33UH M (BA330)
R64
HRFS473JBA
R CHIP
1/16 47K OHM J 1608
SQ1
1K1A78L05F
IC REGULATOR CHIP KIA78L05F(RTF)
R65
HRFS102JBA
R CHIP
1/16 1K OHM J 1608
SQ2
1K1A7805P1
IC REGULATOR
KIA7805API
R66
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SQ3
1K1A7805P1
IC REGULATOR
KIA7805API
R7
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SQ4
TNDS9435A-
FET CHIP
NDS9435A
R8
HRFS472JBA
R CHIP
1/16 4.7K OHM J 1608
SQ5
T2N3904SRT
TR CHIP
2N3904S(RTK)
R80
RD-AZ302J-
R CARBON FILM
1/6 3K OHM J
SR1
HRFS104JBA
R CHIP
1/16 100K OHM J 1608
R81
RD-AZ682J-
R CARBON FILM
1/6 6.8K OHM J
SR2
HRFS104JBA
R CHIP
1/16 100K OHM J 1608
R82
RD-AZ153J-
R CARBON FILM
1/6 15K OHM J
SR3
HRFS113JBA
R CHIP
1/16 11K OHM J 1608
R83
RD-AZ303J-
R CARBON FILM
1/6 30K OHM J
SR4
RS01Z330J-
R M-OXIDE FILM
1W 33 OHM J (TAPPING)
R84
RD-AZ623J-
R CARBON FILM
1/6 62K OHM J
SR5
RS02Z180J-
R M-OXIDE FILM
2W 18 OHM J (TAPPING)
32
MV 16V 47MF D6.3XH5.2
LOC
PART-CODE
PART-NAME
PART-DESC
LOC
PART-CODE
PART-NAME
PART-DESC
SU1
1LM2596S33
IC SD REGULATOR
LM2596S3.3
U3A
9979300501
SOCKET IC
SDIF-42T(1.778)
SW1
5S50101Z10
SW TACT
KPT-1115AM
U4
1EM636165T
IC SDRAM
EM636165TS-8
SW2
5S50101Z10
SW TACT
KPT-1115AM
U5
1EM636165T
IC SDRAM
EM636165TS-8
SW3
5S50101Z10
SW TACT
KPT-1115AM
U6
124C08----
IC EEPROM
24C08
SW4
5S50101Z10
SW TACT
KPT-1115AM
U7
1KA7542---
IC VOTAGE DETECTOR KA7542
SW5
5S50101Z10
SW TACT
KPT-1115AM
U8
1TC74ACT14
IC
SW6
5S50101Z10
SW TACT
KPT-1115AM
U9
1LM385M25-
ICVOLTAGEREFERENCE LM385M25
TC74ACT14FN
U1
1MX88L284F
IC LCD CONTROLLER MX88L284
Y1
5XJ14R318F
CRYSTAL QUARTZ
HC-49/S 14.31818MHZ 50PPM
U2
1TDA8752BH
IC ADC
TDA8752BH
Y2
5XJ12R000E
CRYSTAL QUARTZ
HC-49/S 12.00000MHZ 30PPM
U3
1MTV212M--
IC MICOM
MTV212MS64U
33
DAEWOO ELECTRONICS CO., LTD
686, AHYEON-DONG MAPO-GU
SEOUL, KOREA
C.P.O. BOX 8003 SEOUL, KOREA
TELEX : DWELEC K28177-8
CABLE : "DAEWOOELEC"
E-mail : G7F00E@web.dwe.co.kr
TEL : 82-32-510-7620
FAX : 82-32-510-7630