Oxford Instruments OpAL System Manual

Oxford Instruments Opal is an Open Load Atomic Layer Deposition (ALD) system designed for research and development applications. It offers high-precision thin film control, a versatile chamber design, and a comprehensive manual for operation and maintenance. With its capabilities, you can explore a wide range of ALD processes for various materials and applications.
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OpAL
Open Load Atomic Layer Deposition System
System Manual
Works Order No.:
94-417919
Customer:
Universit&agrave; di Pisa
Typical OpAL system
WARNING
THIS SYSTEM INCORPORATES POTENTIALLY DANGEROUS COMPONENTS, WHICH CAN EXPOSE
PERSONNEL TO HAZARDS RESULTING IN DEATH OR SERIOUS INJURY.
BEFORE ATTEMPTING TO INSTALL, POWER UP OR OPERATE THIS SYSTEM, ENSURE YOU HAVE
READ AND UNDERSTOOD THE ENCLOSED SYSTEM MANUAL, ESPECIALLY SECTION 1 (HEALTH
AND SAFETY).
Issue 1: July 2010
OpAL
Open Load Atomic Layer Deposition System
System Manual
Works Order No.:
94-417919
Customer:
Universit&agrave; di Pisa
Volume 1: Operation and Maintenance Manual
This manual, Volume 1, is one of a series for the machine as follows:
Volume 1
Volume 2
Volume 3
Operation and Maintenance Manual
System Drawings
OEM Manuals
Notes:
1.
2.
Please regard this manual as part of the system.
Ensure that any amendment received is incorporated in the text.
Oxford Instruments Plasma Technology
Yatton, Bristol, BS49 4AP
Tel: +44 1934 837000
Fax: +44 1934 837001
Issue 1: July 2010
OpAL
Oxford Instruments Plasma Technology
System Manual
Contents
Title and inside front cover pages
Contents List.................................................................................................................(iii)
Preface..........................................................................................................................(iv)
Customer Support Facilities...........................................................................................(iv)
System Identification ......................................................................................................(v)
Quality Control Forms ...................................................................................................(vi)
Goods Return Form QCF 60
Certificate of Pre-Acceptance and Certificate of Acceptance QCF 61
System Readiness Form QCF 89
Declaration of Conformity QCF 185d
ASM Patent Rights
1. Health and Safety .................................................................................................. 1-1
2. Services (OpAL) ..................................................................................................... 2-1
3. Description ........................................................................................................... 3-1
4. Installation............................................................................................................ 4-1
5. Operating Instructions ......................................................................................... 5-1
6. Maintenance ......................................................................................................... 6-1
7. Troubleshooting ................................................................................................... 7-1
8. Process Guide and Glossary................................................................................... 8-1
9. Uninstallation and disposal ................................................................................... 9-1
Appendix A
Measurement of radio frequency and microwave emissions
Appendix B
Operation and maintenance of turbomolecular pumps
Appendix IDS
Installation Data Sheets (OpAL)
Appendix PSP
Precursor Source Pot
Appendix R
Rotameter data
Appendix S
Services Specifications for Plasmalab and Ionfab Systems
OIPT Automatch Unit Equipment Manual
Ozone Delivery System Equipment Manual
Printed: 14 July 2010 08:52
Contents
Page (iii)
Issue 1: July 2010
OpAL
Oxford Instruments Plasma Technology
System Manual
Preface
This manual is the OPERATION and MAINTENANCE MANUAL. It provides all the
information necessary for the operation and routine maintenance of the system. Certain
components within the system are supplied by other manufacturers. These components
have their separate manuals which are included, and should be referred to for detailed
operation, maintenance and repair information.
WARNING
SERVICE BY
QUALIFIED STAFF
ONLY
Refer to manual
Where this label is displayed (black text on a yellow
background), read the relevant manual before proceeding
to operate or maintain the labelled equipment.
Customer Support Facilities
Oxford Instruments Plasma Technology has global Customer Support Facilities to provide
a co-ordinated response to customer’s queries. All queries are recorded on our Support
Database and dealt with as quickly as possible. If we are not able to answer the query
immediately, we will contact you as soon as possible.
Before contacting a Customer Support Facility, please ensure that you have referred to the
appropriate section of your system manual, OEM manuals and electrical drawings.
Please direct all queries through your nearest support facility (see below) and have the
following details available.
System Type, e.g. OpAL etc.
Works Order No. – This can be found on the front cover of your system manual.
Contact Information – Your name, Company and how we can contact you.
Details of your query – nature of the problem, part numbers of spares required, etc.
You can contact us via any of the following:
China
Taiwan
Beijing
Tel: +86 106518 8160
Email: [email protected]
Shanghai
Tel: +8621 6360 8530
Email: [email protected]
Tel: +886 3 5788696
Email: [email protected]
UK
Germany
Customer Support Hotline: +44(0) 1934 837070
(0800 – 2000 UK local time)
Fax: +44(0) 1934 837071
Email: [email protected]
Tel: +49 6122 937 161
Email: [email protected]
USA
Japan
Tel: +81 3 5245 3591
Email: [email protected]
Singapore
Tel: +65 6337 6848
Email: [email protected]
Printed: 14 July 2010 08:52
Oxford Instruments Inc.
300 Baker Avenue, Suite 150
Concord, MA 01742
Phone: +1 978-369-9933
Toll Free: +1 800-447-4717
Fax: +1 978-369-8287
Email: [email protected]
Preface
Page (iv)
Issue 1: July 2010
OpAL
Oxford Instruments Plasma Technology
System Manual
System Identification
This system, Works Order No. 94-417919 for Customer: Universit&agrave; di Pisa, is identified
by a label attached to the rear of the power box. An image of this label is shown below:
NOTE: Refer to the label attached to the system power box for the measured maximum
rated input current value.
Quality Control forms
The following Quality Control Forms (QCF) are attached:
Goods Return Form QCF 60 – To be completed and attached to the outside of the
package of any returned parts.
Certificate of Pre-Acceptance and Certificate of Acceptance QCF 61 – To be completed
and returned if the customer is absent from acceptance.
System Readiness Form QCF 89 – To be completed and returned prior to the
commissioning visit.
Declaration of Conformity QCF 185d - CE Certificate.
Printed: 14 July 2010 08:52
Preface
Page (v)
Issue 1: July 2010
QCF 60 Issue 5 15/06/07
Environmental Agency Producer
Registration Number for WEEE:
WEE/AE0116XU
GOODS RETURN FORM
•
•
•
•
•
Returns No :
This form must be completed and a copy sent to Oxford Plasma Technology Service Department by fax or
mail before return of any goods to the factory. (Fax No : + 44 (0) 1934 837071)
If return to the factory is approved a Returns Authorisation Number will be issued. This should be written in the box
provided on this form and the completed form returned with the goods as part of the shipping documentation. It
must be possible to read this form without opening the packaging containing the goods, therefore the
form should not be enclosed within the packaging but affixed to the container.
Once the Returns Authorisation Number is issued goods should be returned within one month.
OIPT reserve the right to invoice the full value of parts if not returned.
All sections below must be completed. If any section does not apply, mark that section &quot;not
applicable&quot;. If the information requested is not known, mark that section &quot;not known&quot;.
Any goods returned to the factory without a copy of this form carrying a Returns Authorisation Number
will be considered hazardous and may be disposed of at the sender's expense. Mark the returns number
on all packages and supporting shipping documentation.
Equipment description.
Serial number or identifying marking
Original OIPT order No :
Date of order :
Reason for return of part/s.
Description of fault/s.
Chemical names of all materials which have come into
contact with the goods.
Precautions which must be taken when handling these
materials.
Nature of hazard(s) presented by contact with these
materials.
Action to be taken in the event of human contact or
spillage of these materials.
Details of any decontamination carried out prior to
shipping
Levels of residual substances left in or on the returned
goods.
.
Name and address of person to be contacted in case of
query.
Tel No :
Ext :
Fax No :
Declaration
Please strike through the section a) or b) which does not apply and sign the declaration.
a)
I hereby confirm that the equipment detailed above has not come into contact with any hazardous substance
and has been drained of any lubricant.
b)
I hereby confirm that the only hazardous materials to which the equipment detailed above has been exposed
are listed above and that the following precautions have been taken.
The equipment has been drained of any lubricant
All ports have been sealed and the equipment has been securely packed and labelled in accordance with
Oxford Instruments Plasma Technology recommendations (available on request)
The carrier has been informed of the nature of the consignment.
1.
2.
3.
Signed. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Date. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Name . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Position. . . . . . . . . . . . . . . . . . . . . . . . . .
QCF 61 Issue 8
Date: 15/06/07
Oxford Instruments Plasma Technology
North End, Yatton
Bristol, BS49 4AP
England.
Telephone : +44 (0) 1934 837000
Fax:
+44 (0) 1934 837001
E mail:
[email protected]
Environmental Agency Registration Number for WEEE: WEE/AE0116XU
Sheet 1/2
CERTIFICATE OF PRE-ACCEPTANCE
This form is to be completed in accordance with the guidelines stated in QCF 61a.
Customer
Project number:
Equipment serial number/s:
Brief description of the system:
The above equipment has been examined / tested in my presence, at Oxford Plasma Technology. The
following list defines items that need to be actioned prior to final acceptance being given.
Witnessed by: Oxford Instruments Plasma Technology representative
Signature:
Date:
/
/0
Accepted by:
Representative of the end user.
Signature:
OIPT circulation:
Service Manager
Design Manager
Date:
/
/0
QCF 61 Issue 8
Date: 15/06/07
Oxford Instruments Plasma Technology
North End, Yatton
Bristol, BS49 4AP
England.
Telephone : +44 (0) 1934 837000
Fax:
+44 (0) 1934 837001
E mail:
[email protected]
Environmental Agency Registration Number for WEEE: WEE/AE0116XU
Sheet 2/2
CERTIFICATE OF ACCEPTANCE
Brief description of the system:
Customer:
Project number:
Equipment serial number/s:
Pre-acceptance form completed at OIPT ? Yes / No
The equipment supplied has been examined and tested as an assembled system in my presence,
and has given satisfactory results where shown. (Tick as appropriate)
Operational
Process
I am satisfied with the results that this system has produced and I accept that the technical
specifications have been achieved.
Comments:-
Accepted by:
Representative of the end user.
Signature:
Date:
/
/0
Please ask our representative for a copy of our Customer feedback form, in order that you may record
your opinions of the service given by Oxford Plasma Technology Ltd.
Witnessed by: Oxford Instruments Plasma Technology representative
Signature:
OIPT circulation:
Service Manager
Design Manager
Date:
/
/0
QCF89 issue 8
09/11/07
``
Environmental Agency Producers Registration Number for WEEE: WEE/AE0116XU
SYSTEM READINESS FORM
This form is provided in order for us to record the level of work that you have conducted, to support the installation of your new Oxford Instruments system.
The system should be installed, within the parameters listed below and the form returned to your supporting Oxford Instruments office. Returning this form
signifies that you have completed the installation of the system, in accordance with the Services Specifications (Appendix S in this System Manual) the
Installation Data Document (Appendix IDS in this System Manual) and that the installation conforms with all of the requirements listed within these
documents.
Should this form be received, an engineer dispatched to start commissioning and any of the facilities requirements not be met, Oxford Instruments reserves
the right to terminate that commissioning visit and charge the customer for a return visit, once the facilities have been fully completed.
Company Name :
Company Contact Name:
System Serial
Number :
System Type:
Please tick appropriate box
1. Has the system been sited ? Attach site plan if available.
2. Has the system been installed in a clean room ?
3. Are there any special requirements for gaining access into the clean room
? ie. clearance, training, citizenship etc.. If so please list below.
4. Have pumps been sited and the cables between each pump and system
power box been connected?
5. Has the gas pod been sited, connected to the system and connected in to
the appropriate gas delivery and exhaust extraction systems, in accordance
with local safety regulations?
6. If the system has a heater chiller, has this been sited, connected to the
lower electrode cooling circuit and filled with Hexid A40?
7. Has AC power been connected to the system? Measure the voltages
between each phase and neutral.
8. Has compressed air been connected to the system? Inlet pressure must
be 6 Bar (90PSI). Note Pressure.
9. Has cooling water been connected to the system? Differential pressure
YES
Page 9 of 13
NO
Detail
Phase 1 to
Neutral
Phase 2 to
Neutral
Phase 3 to
Neutral
Compressed Air Inlet Pressure
Inlet Water
Outlet Water
QCF89 issue 8
09/11/07
``
Environmental Agency Producers Registration Number for WEEE: WEE/AE0116XU
between inlet and outlet must be 3 - 4 Bar (45 – 60PSI). Water supply
should be connected to each inlet/outlet on the system in parallel and not
series. Note Inlet and Outlet Pressure.
10. Has N2 vent been connected to the system? Inlet must be able to
maintain a pressure of 3 Bar (45psig). Note Pressure.
11. Has N2 purge been connected to the system? Inlet must be able to
maintain a pressure of 3 Bar (45psig). Note Pressure.
12. If the system is configured with cryogenic cooling, is an LN2 Dewar,
filled with LN2 available? Is the Dewar connected to the system via 3/8”
Swagelock connections and is the pipe work adequately insulated to prevent
a safety hazard?
13. Have all of the gas pod connections been made to the appropriate gas
supply or system connection. Have they been leak checked?
14. All process gasses should be available for the system
commissioning. Please verify that each gas, as it is laid out
Name
of Gas
Pressure
Pressure
Vent Nitrogen Inlet Pressure
Purge Nitrogen Inlet Pressure
Is the pipe work adequately
insulated to prevent a safety
hazard?
Inlet
Pressure
Page 10 of 13
Heated?
Leak
Rate
Name
of Gas
Inlet
Pressure
Heated?
Leak
Rate
QCF89 issue 8
09/11/07
Environmental Agency Producers Registration Number for WEEE: WEE/AE0116XU
``
in the gas pod is connected, available for process and that
the gas line has been leak checked.
Gas 1
Gas 7
Please record the leak rate for each gas line. If there is no
line fitted please enter N/A.
Gas 2
Gas 8
Gas 3
Gas 9
Gas 4
Gas 10
Gas 5
Gas 11
Gas 6
Gas 12
Process gas inlet pressure should be set at 3 Bar (45psig).
Minimum acceptable inlet pressure: 2 Bar (30psig).
Maximum acceptable inlet pressure: 5 Bar (75psig).
If the gas line is to be used for BCl3, SiCl4 or TEOS, has the
gas line been wrapped with trace heater wire and insulated?
Failure to do so could result in condensation of the gas,
within the line during processing.
Yes
No
15. Have the rotary pump exhaust lines been connected to an
exhaust extraction system that meets all local safety
standards?
16. If the system is fitted with a cryo pump, which is used
for toxic gasses, has an action plan been discussed and
implemented for connection of the pump outlet connector?
17. Has the rotary pump purge been connected to the pumps
and nitrogen supply?
18. Have the rotary pumps been filled with oil of the correct
type for the pump in use?
19. Is the gas pod extraction connected with a minimum flow
rate of 1m3/hour (6 line gas pod) or 3 m3/hour (12 line gas
pod). Does the extraction system meet all local safety
regulations?
20. Do you believe that that demonstration of process has
been included in the purchase of your tool?
Page 11 of 13
Detail
QCF89 issue 8
09/11/07
Environmental Agency Producers Registration Number for WEEE: WEE/AE0116XU
20.a. Please state, which processes require to be
demonstrated.
20.b. Are the required samples and measurement
equipment available for the process work to follow on
from hardware acceptance?
Name :
Signature:
Position Within Company:
Date:
/
/0
Preferred Date for Commissioning Commencement:
/
/0
Page 12 of 13
``
QCF89 issue 8
09/11/07
Environmental Agency Producers Registration Number for WEEE: WEE/AE0116XU
``
Please return the completed form to
your nearest Oxford Instruments
Support Office, detailed below:
USA &amp; Canada
Oxford Instruments America Inc
DE, NE, B, SE, FI,DK
Oxford Instruments GmbH
Eastern Territories
Oxford Instruments Pte. Ltd
Plasma Technology Support
Manager
300 Baker Avenue, Suite 150
Concord
MA 01742
Tel: +1 800 447 4717
Fax: +1 978 369 8287
Email: mailto:[email protected]
Plasma Technology
Raymond Wong
U.K. and all Other Territories
Oxford Instruments Plasma
Technology
Global Support Manager
Postfach 4509
65035 Wiesbaden
Germany
Tel: +49 6122 937161
Fax: +49 6122 937175
Email: [email protected]
371 Beach Road
#02-07 Keypoint
Singapore 199597
Tel: +65 6337 6848
Fax: +65 6337 6286
Email: [email protected]
North End
Yatton, Nr Bristol
BS49 4AP. U.K.
Tel: +44 1934 837070
Fax: +44 1934 837071
Email: [email protected]
Page 13 of 13
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l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;
System Manual
=
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=
This product exploits technology that is licensed from ASM and is protected by patents.
=
A label is attached to the system base unit indicating that the ASM licence covers the system:
Details of the specific patent numbers are listed in the following 13 pages.
ASM Patent Rights
Printed: 09 October 2007 11:14
Issue 1: July 2007
ASM Patents Licensed / Sub-Licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
Issue Date
281
Status
Assgnee
g.002
KR
Method for forming a metal film
KR 1998/35911
01-Sep-1998 2000/18353
06-Apr-2000 332364
30-Mar-2002 Issued
ASMG
g.004
EP
Method for forming a three component
nitride film containing metal and silicon
EP 1999/941865
10-Sep-1999
18-Oct-2000
19-Mar-2003 Published&amp;
Gr
ASMG
g.004
JP
Method for forming a three component
nitride film containing metal and silicon
JP 1999/570818
10-Sep-1999 2002/525432
g.004
US
Method for forming a three component
nitride film containing metal and silicon
US 09/554443
10-Sep-1999
g.004
WO
Method for forming a three component
nitride film containing metal and silicon
WO PCT/KR98/4
10-Sep-1999
0016377
g.009
EP
Method of Forming a Thin Film
EP 2000/915582
06-Apr-2000
1092233
g.009
JP
Method of Forming a Thin Film
JP 2000/612991
g.009
KR
Method of Forming a Thin Film
g.009
US
g.009
1044288
1044288
Published
ASMG
Issued
ASMG
23-Mar-2003
Published
ASMG
18-Apr-2001
Published
ASMG
06-Apr-2000 2003/521579
15-Jul-2003
Published
ASMG
KR 1999/11877
06-Apr-1999 2000/49298
05-Aug-2000 273473
15-Nov-2000 Issued
ASMG
Method of Forming a Thin Film
US 09/719103
06-Apr-2000
6645574
11-Nov-2003 Issued
ASMG
WO
Method of Forming a Thin Film
WO PCT/KR00/0
06-Apr-2000
0063957
26-Oct-2000
Published
ASMG
g.010
EP
Chemical Deposition Reactor and Method
of Forming a Thin Film using the Same
EP 2000/940951
19-Jun-2000
1125321
22-Aug-2001
Published
ASMG
g.010
JP
Chemical Deposition Reactor and Method
of Forming a Thin Film using the Same
JP 2000/505047
19-Jun-2000 2003/502501
21-Jan-2003
Published
ASMG
g.010
KR
Chemical Deposition Reactor and Method
of Forming a Thin Film using the Same
KR 1999/23078
19-Jun-2000 2001/1007431
26-Jan-2001
Published
ASMG
g.010
US
Chemical Deposition Reactor and Method
of Forming a Thin Film using the Same
US 09/763238
19-Jun-2000
g.010
WO
Chemical Deposition Reactor and Method
of Forming a Thin Film using the Same
WO PCT/KR00/0
19-Jun-2000
0079576
28-Dec-2000
Published
ASMG
g.015
EP
Thin Film Forming Method
EP 2001/937028
08-Jun-2000
1292970
19-Mar-2003
Published
ASMG
October 14, 2005
Restricted Distribution
Page 1 of 13
13-Aug-2002
6426117
6539891
30-Jul-2002
01-Apr-2003 Issued
ASMG
SM Patents Licensed / Sub-licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
g.015
JP
Thin Film Forming Method
JP 2001/000503
08-Jun-2001 2003/536272
02-Dec-2003 3687651
g.015
US
Thin Film Forming Method
US 2003/000297
15-Jul-2003 2004/0009307
g.015
WO
Thin Film Forming Method
WO PCT/KR01/0
08-Jun-2001
g.017
EP
Plasma Enhanced ALD equipment and
Method of forming a Conducting Thin Film
EP 2001/000957
06-Aug-2001
g.017
JP
Plasma Enhanced ALD equipment and
Method of forming a Conducting Thin Film
JP
g.017
KR
Plasma Enhanced ALD equipment and
Method of forming a Conducting Thin Film
g.017
US
Plasma Enhanced ALD equipment and
Method of forming a Conducting Thin Film
g.017
WO
g.018
Issue Date
Status
Assgnee
17-Jun-2005 Published
ASMG
15-Jan-2004
Published
ASMG
0199166
27-Dec-2001
Published
ASMG
1421606
26-May-2004
Published
ASMG
06-Aug-2001 2005/502784
27-Jan-2005
Published
ASMG
KR 2001/46802
02-Aug-2001
11-Feb-2003
Published
ASMG
US 10/486311
06-Aug-2001 2004/0231799
25-Nov-2004
Published
ASMG
Plasma Enhanced ALD equipment and
WO PCT/KR01/0
Method of forming a Conducting Thin Film
06-Aug-2001
20-Mar-2003
Published
ASMG
KR
Apparatus for Depositing
KR 2001/69598
08-Nov-2001 2003/0038168
16-May-2003
Published
ASMG
g.018
US
Apparatus for Depositing
US 10/495156
08-Nov-2002 2005/0034664
17-Feb-2005
Published
ASMG
g.018
WO
Apparatus for Depositing
WO PCT/KR02/0
08-Nov-2002
15-May-2003
Published
ASMG
g.019
AUS
Method for Forming Thin Film
US 10/495157
08-Nov-2002 2005/0037154
17-Feb-2005
Published
ASMG
g.019
EP
Method for Forming Thin Film
EP 2002/000788
08-Nov-2002
08-Sep-2004
Published
ASMG
g.019
JP
Method for Forming Thin Film
JP 2003/000543
08-Nov-2002 2005/509093
07-Apr-2005
Published
ASMG
g.019
KR
Method for Forming Thin Film
KR 2001/69597
08-Nov-2001
3038167
16-May-2003
Published
ASMG
g.019
WO
Method for Forming Thin Film
WO PCT/KR02/0
08-Nov-2002
03041142
15-May-2003
Published
ASMG
I.052
AUS
LPCVD with ALD preconditioning
US 09/611602
07-Jul-2000
I.052
DE
LPCVD with ALD preconditioning
DE
09-Jul-2001
I.052
EP
LPCVD with ALD preconditioning
EP 1952051.9
I.052
FR
LPCVD with ALD preconditioning
FR
October 14, 2005
Restricted Distribution
03023835
03041141
1454347
09-Apr-2003 6592942
15-Jul-2003
Issued
ASMI
1299572
09-Apr-2003 60104426
21-Jul-2004
Issued
ASMI
09-Jul-2001
1299572
09-Apr-2003 1299572
21-Jul-2004
Published&amp;
Gr
ASMI
09-Jul-2001
1299572
09-Apr-2003 1299572
21-Jul-2004
Issued
ASMI
Page 2 of 13
SM Patents Licensed / Sub-licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
Assgnee
21-Jul-2004
Issued
ASMI
GB
LPCVD with ALD preconditioning
GB
09-Jul-2001
I.052
JP
LPCVD with ALD preconditioning
JP 513963/02
09-Jul-2001 2004/504496
12-Feb-2004
Published
ASMI
I.052
PCT
LPCVD with ALD preconditioning
PCT
09-Jul-2001
09-Apr-2003
Published
ASMI
I.053
AUS
ALD in hot wall batch reactor
US 09/611536
07-Jul-2000
Issued
ASMI
I.053
JP
ALD in hot wall batch reactor
JP 2001/198085
26-Jun-2001 2002/060947
28-Feb-2002
Published
ASMI
I.100
00
Valve block for ALD
EP 03076812.1
11-Jun-2003
15-Dec-2004
Published
ASMI
I.100
00
Valve block for ALD
US 10/864260
09-Jun-2004 2004/0250853
16-Dec-2004
Published
ASMI
I.100
00
Valve block for ALD
JP 2004/171168
09-Jun-2004
24-Feb-2005
Published
ASMI
MC.004 AUS
Active thermal insulation
US 08/682704
25-Sep-1996
Issued
ASMI
MC.004 DE
Active thermal insulation
DE 19581484.3
25-Jul-1996
Published
ASMI
MC.004 FI
Active thermal insulation
FI 945610
28-Nov-1994
29-May-1996 97730
MC.004 JP
Active thermal insulation
JP 518299/1996
29-Jul-1996 1997/508889
09-Sep-1997
MC.004 KR
Active thermal insulation
KR 10/1996/0704
29-Jul-1996
12-Feb-1997 255429
MC.004 PCT
Active thermal insulation
WO /FI95/00657
28-Nov-1995
06-Jun-1996
MC.005 AUS
Pump between pulses
US 08/682705
25-Sep-1996
18-Jan-2000
6015590
18-Jan-2000
MC.005 C1US
Pump between pulses
US 09/482625
14-Jan-2000
03-Jun-2003
6572705
MC.005 C2US
Pump between pulses
US 09/855321
14-May-2001 2002/0041931
11-Apr-2002
Published
ASMI
MC.005 DE
Pump between pulses
DE 19581483.5
25-Jul-1996
02-Jan-1997
Published
ASMI
MC.005 FI
Pump between pulses
FI 945611
28-Nov-1994
11-Jun-1996
MC.005 JP
Pump between pulses
JP 518300/1996
29-Jul-1996
09-Sep-1997
MC.005 KR
Pump between pulses
KR 10/1996/0704
29-Jul-1996
12-Feb-1997 255430
MC.005 PCT
Pump between pulses
WO /FI95/00658
28-Nov-1995
MC.006 AUS
Flow restriction
US 08/682703
26-Jul-1996
October 14, 2005
Restricted Distribution
Page 3 of 13
1299572
09-Apr-2003 1299572
Status
I.052
2001/095205
1299572
Issue Date
6585823
1486707
2005/51205
05-Jan-1999
19581484
6572705
9617107
5855680
01-Jul-2003
05-Jan-1999
02-Jan-1997
10-Feb-1997 Issued
Published
100409
14-Feb-2000 Issued
ASMI
ASMI
Issued
ASMI
03-Jun-2003 Issued
ASMI
28-Nov-1997 Issued
Published
5711811
ASMI
Published
14-Feb-2000 Issued
06-Jun-1996
27-Jan-1998
ASMI
27-Jan-1998
ASMI
ASMI
ASMI
Published
ASMI
Issued
ASMI
SM Patents Licensed / Sub-licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
Issue Date
Status
Assgnee
Published
ASMI
MC.006 DE
Flow restriction
DE 19581482.7
25-Jul-1996
02-Jan-1997
MC.006 FI
Flow restriction
FI 945612
28-Nov-1994
29-May-1996 97731
10-Feb-1997 Issued
ASMI
MC.006 JP
Flow restriction
JP 1996/517343
26-Jul-1996
09-Sep-1997 3349156
13-Sep-2002 Issued
ASMI
MC.006 KR
Flow restriction
KR 10/1996/0704
29-Jul-1996
12-Feb-1997 255431
14-Feb-2000 Issued
ASMI
MC.006 PCT
Flow restriction
WO /FI95/00659
28-Nov-1995
9617969
13-Jun-1996
Published
ASMI
MC.008 EP
Functional surfaces
EP 97660037.9
02-Apr-1997
799641
08-Oct-1997
Published
ASMI
MC.008 FI
Functional surfaces
FI 961512
03-Apr-1996
04-Oct-1997
MC.008 JP
Functional surfaces
JP 84939/1997
03-Apr-1997 1998/53609
24-Feb-1998
MC.009 CP1US Flow distributor, US CIP
US 09/686613
04-Jan-2000
07-Oct-2003
MC.009 JP
Flow distributor
JP 506497/1999
28-Dec-1999
12-Mar-2002
Published
ASMI
MC.009 KR
Flow distributor
KR 10/2000/7000
04-Jan-2000
15-Mar-2001
Published
ASMI
MC.009 PCT
Flow distributor
WO /FI98/00571
03-Jul-1998
9901595
14-Jan-1999
Published
ASMI
MC.010 AUS
Coating inner surfaces of equipment
US 09/581020
07-Jun-2000
6416577
09-Jul-2002
6416577
09-Jul-2002
Issued
ASMI
MC.010 FI
Coating inner surfaces of equipment
FI 974472
09-Dec-1997
10-Jun-1999
104383
14-Jan-2000
Issued
ASMI
MC.010 PCT
Coating inner surfaces of equipment
WO /FI98/00955
09-Dec-1998
17-Jun-1999
Published
ASMI
MC.011 FI
Ba and Sr source materials
FI 981959
11-Sep-1998
12-Mar-2000 108375
Issued
ASMI
MC.011 JP
Ba and Sr source materials
JP 2000/570387
12-Mar-2001
13-Aug-2002
Published
ASMI
MC.011 KR
Ba and Sr source materials
KR 10/2001/7003
12-Mar-2001
22-Aug-2001
Published
ASMI
MC.011 PCT
Ba and Sr source materials
WO /FI99/00741
13-Sep-1999
23-Mar-2000
Published
ASMI
MC.012 AUS
Single wafer ALCVD™ reactor
US 09/568077
10-May-2000
MC.012 C1US
Single wafer ALCVD™ reactor
US 09/769562
MC.012 C2US
Single wafer ALCVD™ reactor
MC.012 EP
Single wafer ALCVD™ reactor
October 14, 2005
6630030
31-Aug-2001 Issued
Published
6630030
07-Oct-2003 Issued
15-Jan-2002
ASMI
ASMI
ASMI
13-May-2003 6562140
13-May-2003 Issued
ASMI
25-Jan-2001 2001/0009140
26-Jul-2001
17-Jun-2003
Issued
ASMI
US 10/383291
06-Mar-2003 2003/0150385
14-Aug-2003
Published
ASMI
EP 00660085.2
10-May-2000
15-Nov-2000
Published
ASMI
Restricted Distribution
Page 4 of 13
6562140
107533
1052309
6579374
SM Patents Licensed / Sub-licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
Status
Assgnee
11-Nov-2000
Published
ASMI
23-Jan-2001
Published
ASMI
MC.012 FI
Single wafer ALCVD™ reactor
FI 991078
10-May-1999
MC.012 JP
Single wafer ALCVD™ reactor
JP 2000/137175
10-May-2000 2001/20075
MC.012 KR
Single wafer ALCVD™ reactor
KR 10/2000/0024 10-May-2000 2001/20831
15-Mar-2001 415475
06-Jan-2004
Issued
ASMI
MC.012 TW
Single wafer ALCVD™ reactor
TW 89107029
14-Apr-2000
527433
11-Apr-2003 175825
08-Aug-2003 Issued
ASMI
MC.013 AUS
High surface area trap
US 09/619820
20-Jul-2000
6506352
14-Jan-2003
14-Jan-2003
Issued
ASMI
MC.013 C1US
High surface area trap
US 10/205296
24-Jul-2002 2002/0187084
12-Dec-2002
Published
ASMI
MC.013 FI
High surface area trap
FI 991628
20-Jul-1999
991628
21-Jan-2001
MC.013 JP
High surface area trap
JP 2000/220782
21-Jul-2000
2001/62244
13-Mar-2001
MC.013 TW
High surface area trap
TW 89114140
14-Jul-2000
555585
01-Oct-2003
188294
09-Feb-2004 Issued
ASMI
MC.015 AUS
Metal compounds as oxygen sources
US 09/687355
13-Oct-2000
6632279
14-Oct-2003
6632279
14-Oct-2003 Issued
ASMI
MC.015 C1US
Metal compounds as oxygen sources
US 10/618429
10-Jul-2003 2004/0007171
15-Jan-2004
Published
ASMI
MC.015 FI
Metal compounds as oxygen sources
FI 992223
14-Oct-1999
14-Apr-2001
Published
ASMI
MC.015 JP
Metal compounds as oxygen sources
JP 2000/315409
16-Oct-2000 2001/172767
26-Jun-2001
Published
ASMI
MC.015 KR
Metal compounds as oxygen sources
KR 10/2000/0060
14-Oct-2000 2001/40090
15-May-2001
Published
ASMI
MC.016 AUS
Yttrium stabilized ZrO2
US 09/835737
16-Apr-2001 2002/0042165
11-Apr-2002 6548424
15-Apr-2003 Issued
ASMI
MC.016 C1US
Yttrium stabilized ZrO2
US 10/410718
08-Apr-2003 2003/0215996
20-Nov-2003 6777353
17-Aug-2004 Issued
ASMI
MC.016 JP
Yttrium stabilized ZrO2
JP 2001/117318
16-Apr-2001 2001/355070
25-Dec-2001
MC.016 TW
Yttrium stabilized ZrO2
TW 90108955
13-Apr-2001
21-Dec-2003 193372
MC.017 AUS
Ozone for silicon/metal oxides
US 10/148525
27-Aug-2002 2003/0188682
09-Oct-2003
Published
ASMI
MC.017 C1US
Ozone for silicon/metal oxides
US 10/678766
02-Oct-2003 2004/0065253
08-Apr-2004
Published
ASMI
MC.017 EP
Ozone for silicon/metal oxides
EP 00987492.6
04-Apr-2000
16-Oct-2002
Published
ASMI
MC.017 JP
Ozone for silicon/metal oxides
JP 2001/542604
04-Dec-2000 2003/515674
07-May-2003
Published
ASMI
MC.017 KR
Ozone for silicon/metal oxides
KR 10/2002/7006 30-May-2002 2002/63196
01-Aug-2002
Published
ASMI
October 14, 2005
Restricted Distribution
Page 5 of 13
991078
Issue Date
992223
567584
1248865
6506352
110311
31-Dec-2002 Issued
Published
Published
20-Apr-2004 Issued
ASMI
ASMI
ASMI
ASMI
SM Patents Licensed / Sub-licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
Assgnee
Published
ASMI
Ozone for silicon/metal oxides
WO /FI00/01072
04-Dec-2000
MC.020 AUS
Batch ALCVD™ reactor with load lock
US 09/749329
27-Dec-2000 2001/0013312
16-Aug-2001 6447607
10-Sep-2002 Issued
ASMI
MC.020 D1US
Batch ALCVD™ reactor with load lock
US 10/205297
24-Jul-2002 2002/0185060
12-Dec-2002 6689210
10-Feb-2004 Issued
ASMI
MC.020 TW
Batch ALCVD™ reactor with load lock
TW 89127892
26-Dec-2000
11-Aug-2003 184030
18-Dec-2003 Issued
ASMI
MC.021 AUS
Batch type holder with angle variation.
US 09/749339
27-Dec-2000 2001/0014371
16-Aug-2001 6551406
22-Apr-2003 Issued
ASMI
MC.021 C1US
Batch type holder with angle variation.
US 10/365926
13-Feb-2003 2003/0140854
31-Jul-2003
6835416
28-Dec-2004 Issued
ASMI
MC.021 JP-U
Batch type holder with angle variation.
JP-U 2000/9189
27-Dec-2000 2001/3079231
10-Aug-2001 3079231
23-May-2001 Issued
ASMI
MC.021 KR-U
Batch type holder with angle variation.
KR-U 20/2000/0036
28-Dec-2000 2001/0224419
15-May-2001 224419
07-Mar-2001 Issued
ASMI
MC.021 TW
Batch type holder with angle variation.
TW 89127893
26-Dec-2000
524876
21-Mar-2003 174871
25-Jul-2003
Issued
ASMI
MC.023 AUS
In situ reduction of source materials
US 10/110598
11-Apr-2002
6767582
27-Jul-2004
27-Jul-2004
Issued
ASMI
MC.023 EP
In situ reduction of source materials
EP 00969585.9
14-Mar-2002
14-Aug-2002
Published
ASMI
MC.023 FI
In situ reduction of source materials
FI 992233
15-Oct-1999
15-Apr-2001
Published
ASMI
MC.023 JP
In situ reduction of source materials
JP 2001/529475
15-Apr-2002 2003/511560
25-Mar-2003
published
ASMI
MC.023 KR
In situ reduction of source materials
KR 10/2002/7004
15-Apr-2002
30-May-2002
Published
ASMI
MC.023 PCT
In situ reduction of source materials
WO /FI00/00884
12-Oct-2000
19-Apr-2001
Published
ASMI
MC.023 TW
In situ reduction of source materials
TW 89121351
12-Oct-2000 008261 sep 200
01-Sep-2002 162686
27-Dec-2002 Issued
ASMI
MC.024 AUS
Tungsten nitride
US 10/110730
13-Oct-2000
6863727
08-Mar-2005 Issued
ASMI
MC.024 DE
Tungsten nitride
DE 09695966
15-Mar-2002
1242647
25-Sep-2002 60004566
18-Aug-2003 Issued
ASMI
MC.024 EP
Tungsten nitride
EP 00969596.6
15-Mar-2002
1242647
25-Sep-2002 1159313
13-Aug-2003 Published&amp;
Gr
ASMI
MC.024 FI
Tungsten nitride
FI 19992234
15-Oct-1999
MC.024 FR
Tungsten nitride
FR 09695966
15-Mar-2002
1242647
25-Sep-2002 1242647
13-Aug-2003 Issued
ASMI
MC.024 GB
Tungsten nitride
GB 09695966
15-Mar-2002
1242647
25-Sep-2002 1242647
18-Aug-2003 Issued
ASMI
MC.024 JP
Tungsten nitride
JP 2001/529476
15-Apr-2002 2003/511561
Restricted Distribution
Page 6 of 13
546400
07-Jun-2001
Status
MC.017 PCT
October 14, 2005
0140541
Issue Date
6767582
15-Apr-2001
25-Mar-2003
Published
published
ASMI
ASMI
SM Patents Licensed / Sub-licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
Issue Date
Status
Assgnee
MC.024 KR
Tungsten nitride
KR 10/2002/7004
15-Apr-2002
30-May-2002
Published
ASMI
MC.024 PCT
Tungsten nitride
WO /FI00/00895
13-Oct-2000
19-Apr-2001
Published
ASMI
MC.024 TW
Tungsten nitride
TW 89121352
12-Oct-2000
541351
11-Jul-2003
Published
ASMI
MC.025 AUS
Selective coating
US 09/644636
23-Aug-2000
6391785
21-May-2002 6391785
21-May-2002 Issued
ASMI
MC.025 C1
Selective coating (IMEC)
US 10/123492
15-Apr-2002 2002/0155722
24-Oct-2002
6664192
16-Dec-2003 Issued
ASMI
MC.025 C2US
Selective coating (IMEC)
US 10/731656
08-Dec-2003 2004/0121616
24-Jun-2004
6852635
08-Feb-2005 Issued
ASMI
MC.025 EP
Selective coating (IMEC)
EP 000955875
24-Aug-2000
22-May-2002
Published
ASMI
MC.025 JP
Selective coating (IMEC)
JP 2001/519484
24-Aug-2000 2003/508897
04-Mar-2003
Published
ASMI
MC.025 PCT
Selective coating (IMEC)
WO /US00/23252
24-Aug-2000
01/15220
01-Mar-2001
Published
ASMI
MC.025 TW
Selective coating (IMEC)
TW 89117141
24-Aug-2000
478045
01-Mar-2002 151092
MC.027 EP
Nitride nanolaminates on sensitive surfaces
EP 00973583.8
16-Oct-2000
1221178
10-Jul-2002
Published
ASMI
MC.027 JP
Nitride nanolaminates on sensitive surfaces
JP 2001/531142
15-Apr-2002 2003/524888
19-Aug-2003
Published
ASMI
MC.027 PCT
Nitride nanolaminates on sensitive surfaces
WO /US00/28654
16-Oct-2000
01/29893
26-Apr-2001
Published
ASMI
MC.027 TW
Nitride nanolaminates on sensitive surfaces
TW 89121517
13-Oct-2000
550306
01-Sep-2003 185093
07-Jan-2004
Issued
ASMI
MC.027 US
Nitride nanolaminates on sensitive surfaces
US 10/049125
20-Aug-2002
6902763
07-Jun-2005
Issued
ASMI
MC.028 AUS
Metals with boron compound
US 09/687205
13-Oct-2000
05-Nov-2002 6475276
05-Nov-2002 Issued
ASMI
MC.028 C1US
Metals with boron compound (ALD)
US 10/210715
30-Jul-2002 2002/0187256
12-Dec-2002 6821889
23-Nov-2004 Issued
ASMI
MC.028 FI
Metals with boron compound (ALD)
FI 19992235
15-Oct-1999
15-Apr-2001
MC.029 AUS
TMA and O3
US 10/003749
23-Oct-2001 2002/0106451
08-Aug-2002 6743475
01-Jun-2004 Issued
ASMI
MC.029 C1
TMA and O3
US 10/829894
21-Apr-2004 2004/0197476
07-Oct-2004
26-Apr-2005 Issued
ASMI
MC.029 JP
TMA and O3
JP 2001/324382
23-Oct-2001 2002/161353
04-Jun-2002
MC.029 TW
TMA and O3
TW 89122263
23-Oct-2000
21-Aug-2003 185773
14-Jan-2004
MC.030 AUS
Solid source for Pulsar™
US 09/854706
14-May-2001 2001/0042523
22-Nov-2001 6699524
October 14, 2005
Restricted Distribution
Page 7 of 13
1206799
6475276
548239
30-May-2003 Issued
Published
6884465
ASMI
ASMI
Published
ASMI
Issued
ASMI
02-Mar-2004 Issued
ASMI
SM Patents Licensed / Sub-licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
Issue Date
Status
Assgnee
MC.030 C1US
Solid source for Pulsar™
US 10/695269
28-Oct-2003 2004/0086642
06-May-2004
Published
ASMI
MC.030 JP
Solid source for Pulsar™
JP 2001/145256
15-May-2001 2001/323374
22-Nov-2001
Published
ASMI
MC.030 TW
Solid source for Pulsar™
TW 89111644
14-Jun-2000
21-Mar-2003 174786
24-Jul-2003
Issued
ASMI
MC.031 AUS
CVD of metalloid thin films
US 09/764692
18-Jan-2001 2001/0009695
26-Jul-2001
6599572
29-Jul-2003
Issued
ASMI
MC.031 C1US
CVD of metalloid thin films
US 10/394309
20-Mar-2003 2003/0186495
02-Oct-2003
6794287
21-Sep-2004 Issued
ASMI
MC.033 AUS
Liquid source system for ALD applications
US 10/615332
08-Jul-2003 2004/0079286
29-Apr-2004
Published
ASMI
MC.033 VJP
Liquid source system for ALD applications
JP 2003/274331
14-Jul-2003
2004/36004
05-Feb-2004
Published
ASMI
MC.033 VTW
Liquid source system for ALD applications
TW 92118177
03-Jul-2002
2004/02774
16-Feb-2004
Published
ASMI
MC.035 AUS
Active CVD-zone for ALD
US 09/836674
16-Apr-2001
15-Aug-2002
Published
ASMI
MC.035 JP
Active CVD-zone for ALD
JP 2001/117413
16-Apr-2001
18-Dec-2001
Published
ASMI
MC.035 TW
Active CVD-zone for ALD
TW 89107028
14-Apr-2000
MC.036 AUS
ALCVD™ reactor equipped with filter and
hot drain
US 09/835931
MC.036 FI
ALCVD™ reactor equipped with filter and
hot drain
MC.036 JP
524875
01-Aug-2002 160775
27-Nov-2002 Issued
ASMI
16-Apr-2001 2001/0054377
27-Dec-2001 6783590
31-Aug-2004 Issued
ASMI
FI 20000900
14-Apr-2000
15-Oct-2001
Published
ASMI
ALCVD™ reactor equipped with filter and
hot drain
JP 2001/117468
16-Apr-2001
09-Jan-2002
Published
ASMI
MC.036 KR
ALCVD™ reactor equipped with filter and
hot drain
KR 10/2001/0020
14-Apr-2001
08-Nov-2001
Published
ASMI
MC.036 TW
ALCVD™ reactor equipped with filter and
hot drain
TW 89107027
14-Apr-2000
576873
21-Feb-2004 197419
17-Jun-2004 Published
ASMI
MC.037 AUS
CuO reduction / plasma radicals
US 09/291807
14-Apr-1999
6342277
29-Jan-2002
29-Jan-2002
Issued
ASMI
MC.037 C1US
CuO reduction / plasma radicals
US 09/974162
09-Oct-2001 2002/0031618
14-Mar-2002 6616986
09-Sep-2003 Issued
ASMI
MC.037 C2
CuO reduction / plasma radicals
US 10/683727
10-Oct-2003 2004/0076751
22-Apr-2004
MC.037 D1US
CuO reduction / plasma radicals
US 09/866156
24-May-2001 2001/0028924
11-Oct-2001
MC.037 D2
CuO reduction / plasma radicals
US 10/692243
22-Oct-2003 2004/0083949
06-May-2004
October 14, 2005
Restricted Distribution
Page 8 of 13
496907
6342277
Published
6652924
25-Nov-2003 Issued
Published
ASMI
ASMI
ASMI
SM Patents Licensed / Sub-licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
1183406
Issue Date
Status
Assgnee
06-Mar-2002
Published
ASMI
MC.037 EP
CuO reduction / plasma radicals
EP 00922268.8
14-Apr-2000
MC.037 JP
CuO reduction / plasma radicals
JP 2000/610879
12-Oct-2001 2002541332
03-Dec-2002
Published
ASMI
MC.037 PCT
CuO reduction / plasma radicals
WO /US00/10267
14-Apr-2000
19-Oct-2000
Published
ASMI
MC.038 AUS
Licenced Sherman patent
US 08/699002
16-Aug-1996
MC.039 EP
Conductance ratio
EP 19581099
18-Nov-2002
MC.039 JP
Conductance ratio
JP 2002/513966
MC.039 KR
Conductance ratio
MC.039 PCT
0061833
29-Jun-1999
29-Jun-1999 Issued
ASMI
02-Jul-2003
Published
ASMI
20-Jul-2001 2004/504497
12-Feb-2004
Published
ASMI
KR 10/2003/7000
20-Jul-2001
2003/24787
26-Mar-2003
Published
ASMI
Conductance ratio
WO /FI01/00680
20-Jul-2001
0208488
31-Jan-2002
Published
ASMI
MC.039 TW
Conductance ratio
TW 90117837
20-Jul-2001
576874
21-Feb-2004 197452
17-Jun-2004 Issued
ASMI
MC.039 US
Conductance ratio
US 10/333521
20-Jul-2001 2003/0224107
04-Dec-2003 6881263
19-Apr-2005 Issued
ASMI
MC.043 AUS
Sullivan ALE-reactor (radicals and purging)
US 09/392371
08-Sep-1999
28-Jan-2003
6511539
28-Jan-2003
Issued
ASMA
MC.043 C1US
Sullivan ALE-reactor (radicals and purging)
US 10/317275
10-Dec-2002 2003/0089308
15-May-2003 6764546
20-Jul-2004
Issued
ASMA
MC.043 D1US
Sullivan ALE-reactor (radicals and purging)
US 10/317266
10-Dec-2002 2003/0101927
05-Jun-2003
Published
ASMA
MC.043 EP
Sullivan ALE-reactor (radicals and purging)
EP 00963326.4
08-Sep-2002
26-Jun-2002
Published
ASMA
MC.043 JP
Sullivan ALE-reactor (radicals and purging)
JP 2001/521471
07-Mar-2002 2003/508932
04-Mar-2003
Published
ASMA
MC.043 PCT
Sullivan ALE-reactor (radicals and purging) WO /US00/24586
08-Sep-2000
0117692
15-Mar-2001
Published
ASMA
MC.043 TW
Sullivan ALE-reactor (radicals and purging) TW 89118222
06-Sep-2000
527224
11-Apr-2003 175152
29-Jul-2003
Issued
ASMA
MC.044 AUS
Graded barriers
US 09/800757
06-Mar-2001 2001/0041250
15-Nov-2001 6534395
18-Mar-2003 Issued
ASMI
MC.044 C1US
Graded barriers
US 10/253859
23-Sep-2002 2003/0032281
13-Feb-2003 6933225
23-Aug-2005 Issued
ASMI
MC.044 D1US
Graded barriers
US 10/329658
23-Dec-2002 2003/0129826
10-Jul-2003
09-Mar-2004 Issued
ASMI
MC.044 EP
Graded barriers
EP 01918295.5
02-Mar-2001
18-Dec-2002
Published
ASMI
MC.044 JP
Graded barriers
JP 2001/565432
02-Mar-2001 2003/526218
02-Sep-2003
Published
ASMI
MC.044 PCT
Graded barriers
WO /US01/06746
02-Mar-2001
13-Sep-2001
Published
ASMI
October 14, 2005
Restricted Distribution
Page 9 of 13
1322797
5916365
6511539
1216106
1266054
0166832
6703708
SM Patents Licensed / Sub-licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
Status
Assgnee
157886
14-Sep-2002 Issued
ASMI
27-Apr-2004 6727169
27-Apr-2004 Issued
ASMI
11-Jun-2002
Issue Date
MC.044 TW
Graded barriers
TW 90105107
06-Mar-2001
MC.045 AUS
Dual damascene
US 09/644416
23-Aug-2000
MC.045 D1US
Dual damascene
US 10/737315
15-Dec-2003 2004/0130029
08-Jul-2004
Published
ASMI
MC.045 EP
Dual damascene
EP 00957751.1
26-Feb-2002
1221177
10-Jul-2002
Published
ASMI
MC.045 PCT
Dual damascene
WO /US00/23213
24-Aug-2000
0129891
26-Apr-2001
Published
ASMI
MC.045 TW
Dual damascene
TW 89117142
24-Aug-2000
01-Mar-2002 151592
27-Jun-2002
Issued
ASMI
MC.046 AUS
Low k
US 09/843518
26-Apr-2001 2001/0054769
27-Dec-2001 6482733
19-Nov-2002 Issued
ASMI
MC.046 C1US
Low k
US 10/303355
21-Nov-2002 2003/0134508
17-Jul-2003
6699783
02-Mar-2004 Issued
ASMI
MC.046 CP1US Low k
US 10/303293
22-Nov-2002 2003/0143839
31-Jul-2003
6759325
06-Jul-2004
Issued
ASMI
MC.046 D1US
Low k
US 10/237526
06-Sep-2002 2003/0054631
20-Mar-2003 6686271
03-Feb-2004 Issued
ASMI
MC.046 JP
Low k
JP 2001/144436
15-May-2001
2002/9078
11-Jan-2002
Published
ASMI
MC.046 WO
Low k
PCT PCT/US/03/4
22-Nov-2003
04049432
10-Jun-2004
Published
ASMI
MC.047 AUS
Shallow trench
US 09/887199
21-Jun-2001 2003/0015764
MC.048 AUS
Capacitor dielectrics
US 09/452844
03-Dec-1999
MC.048 D1US
Capacitor dielectrics
US 09/791072
MC.048 JP
Capacitor dielectrics
MC.048 TW
6727169
6861334
01-Mar-2005 Issued
ASMI
6780704
24-Aug-2004 Issued
ASMI
22-Feb-2001 2001/0024387
27-Sep-2001 6831315
14-Dec-2004 Issued
ASMI
JP 2000/368569
04-Dec-2000
24-Jul-2001
Capacitor dielectrics
TW 89125655
01-Dec-2000
11-May-2002 155059
27-Aug-2002 Issued
ASMI
MC.049 AUS
Oxidation moderation
US 09/791167
22-Feb-2001 2001/0031562
18-Oct-2001
6492283
10-Dec-2002 Issued
ASMI
MC.049 C1US
Oxidation moderation
US 10/281418
25-Oct-2002 2003/0060057
27-Mar-2003 6794314
21-Sep-2004 Issued
ASMI
MC.050 AUS
Metal oxide reduction
US 10/276663
15-Nov-2002 2004/0038529
26-Feb-2004 6921712
26-Jul-2005
Issued
ASMI
MC.050 EP
Metal oxide reduction
EP 01934057.9
20-Sep-2002
12-Feb-2003
Published
ASMI
MC.050 JP
Metal oxide reduction
JP 2001/584473
15-Nov-2002 2003/533880
11-Nov-2003
Published
ASMI
MC.050 KR
Metal oxide reduction
KR 10/2002/7015
13-Nov-2002
23-Jan-2003
Published
ASMI
October 14, 2005
Restricted Distribution
Page 10 of 13
1282911
2003/7612
23-Jan-2003
Published
ASMI
SM Patents Licensed / Sub-licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
Issue Date
Status
Assgnee
Published
ASMI
MC.050 PCT
Metal oxide reduction
WO /FI01/00473
15-May-2001
188972
22-Nov-2001
MC.050 TW
Metal oxide reduction
TW 90111584
15-May-2001
508658
01-Nov-2002 166237
18-Mar-2003 Issued
ASMI
MC.051 AUS
Metals via or through oxide intermediate
US 09/858820
15-May-2001 2002/0004293
10-Jan-2002
6482740
19-Nov-2002 Issued
ASMI
MC.051 C1US
Metals via or through oxide intermediate
US 10/300169
19-Nov-2002 2003/0096468
22-May-2003 6887795
03-May-2005 Issued
ASMI
MC.051 CP1US Liquid phase reduction of metal oxides
US 10/394430
20-Mar-2003 2004/0005753
08-Jan-2004
MC.052 AUS
Nitrogen source material
US 10/100500
15-Mar-2002 2002/0182320
05-Dec-2002 6706115
16-Mar-2004 Issued
ASMI
MC.052 FI
Nitrogen source material
FI 20010539
16-Mar-2001
109770
15-Oct-2002 Issued
ASMI
MC.056 AUS
Aluminum oxide sandwich
US 09/945463
31-Aug-2001 2002/0115252
22-Aug-2002 6660660
09-Dec-2003 Issued
ASMI
MC.056 D1
Aluminum oxide sandwich
US 10/653737
02-Sep-2003 2004/0043557
04-Mar-2004
Published
ASMI
MC.056 JP
Aluminum oxide sandwich
JP 2002/535166
11-Sep-2001 2004/535166
15-Apr-2004
Published
ASMI
MC.056 PCT
Aluminum oxide sandwich
WO /US01/42167
11-Sep-2001
0231875
18-Apr-2002
Published
ASMI
MC.056 TW
Aluminum oxide sandwich
TW 90124227
02-Oct-2001
516168
01-Jan-2003
MC.057 AUS
Low temperature gate stack
US 10/227475
MC.057 PCT
Low temperature gate stack
MC.057 TW
Published
ASMI
169832
07-May-2003 Issued
ASMI
22-Aug-2002 2003/0049942
13-Mar-2003 6806145
19-Oct-2004 Issued
ASMI
WO /US02/27230
26-Aug-2002
03041124
15-May-2003
Low temperature gate stack
TW 91119485
28-Aug-2002
559916
01-Nov-2003 189726
02-Mar-2004 Issued
ASMI
MC.058 AUS
Transition metal carbides
US 09/687204
13-Oct-2000
6482262
19-Nov-2002 6482262
19-Nov-2002 Issued
ASMI
MC.058 C1US
Transition metal carbides
US 10/246131
17-Sep-2002 2003/0031807
13-Feb-2003 6800552
05-Oct-2004 Issued
ASMI
MC.058 JP
Transition metal carbides
JP 2001/532259
11-Apr-2002 2003/512527
02-Apr-2003
Published
ASMI
MC.058 PCT
Transition metal carbides
WO /US00/28537
16-Oct-2000
0129280
26-Apr-2001
Published
ASMI
MC.058 TW
Transition metal carbides
TW 89121518
13-Oct-2000
527429
11-Apr-2003 175854
MC.059 AUS
Magnetic RAM
US 09/997396
28-Nov-2001 2002/0076837
20-Jun-2002
Published
ASMI
MC.059 EP
Magnetic RAM
EP 19952456
26-Nov-2001
1340269
03-Sep-2003
Published
ASMI
MC.059 PCT
Magnetic RAM
WO /US01/44350
26-Nov-2001
0245167
06-Jun-2002
Published
ASMI
October 14, 2005
Restricted Distribution
Page 11 of 13
Published
08-Aug-2003 Issued
ASMI
ASMI
SM Patents Licensed / Sub-licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
527700
Issue Date
Status
Assgnee
11-Apr-2003 175767
07-Aug-2003 Issued
ASMI
06-Jul-2004
Issued
ASMI
MC.059 TW
Magnetic RAM
TW 90129481
29-Nov-2001
MC.060 AUS
Magnetic heads
US 10/136095
30-Apr-2002 2002/0196591
26-Dec-2002 6759081
MC.060 DV1
Magnetic heads
US 10/781574
17-Feb-2004 2004/0161636
19-Aug-2004
Published
ASMI
MC.060 JP
Magnetic heads
JP 2002/135407
10-May-2002 2003/59016
28-Feb-2003
Published
ASMI
MC.064 AUS
Limited film growth on walls
US 09/801542
07-Mar-2001 2002/0157611
31-Oct-2002
MC.064 JP
Limited film growth on walls
JP 2002/60518
06-Mar-2002 2002/353154
06-Dec-2002
Published
ASMI
MC.065 AUS
Active pulse shape monitoring
US 10/066169
30-Jan-2002 2003/0143747
31-Jul-2003
Published
ASMI
MC.066 AUS
Divider plate
US 10/222005
14-Aug-2002 2003/0075273
24-Apr-2003 6820570
MC.066 PCT
Divider plate
WO /US02/26192
15-Aug-2002
27-Feb-2003
MC.072 AUS
Rare earth oxides
US 10/067634
04-Feb-2002 2003/0072882
17-Apr-2003 6858546
MC.072 JP
Rare earth oxides
JP 2001/236874
03-Aug-2001 2003/55093
26-Feb-2003
MC.073 AUS
Ruthenium thin films
US 10/066315
29-Jan-2002 2003/0165615
04-Sep-2003 6824816
MC.073 JP
Ruthenium thin films
JP 2003/19678
29-Jan-2003 2003/226970
15-Aug-2003
Published
ASMI
MC.073 KR
Ruthenium thin films
KR 10/2003/0004
24-Jan-2003 2003/0065343
06-Aug-2003
Published
ASMI
MC.073 TW
Ruthenium thin films
TW 91101473
29-Jan-2002
01-Oct-2003
MC.075 AUS
Removable container closure
US 10/187142
MC.075 EP
Removable container closure
MC.075 PCT
03016587
06-Sep-2005 Issued
23-Nov-2004 Issued
Published
22-Feb-2005 Issued
Published
30-Nov-2004 Issued
ASMI
ASMI
ASMI
ASMI
ASMI
ASMI
188712
12-Feb-2004 Issued
ASMI
28-Jun-2002 2003/0075925
24-Apr-2003 6889864
10-May-2005 Issued
ASMI
EP 2744752.3
28-Jun-2002
1404890
07-Apr-2004
Published
ASMI
Removable container closure
PCT PCT/US02/20
28-Jun-2002
03/004723
16-Jan-2003
Published
ASMI
MC.075 TW
Removable container closure
TW 91114123
27-Jun-2002
539822
01-Jul-2003
181018
28-Oct-2003 Issued
ASMI
MC.076 AUS
CuO reduction prior to SiC.
US 09/975466
09-Oct-2001 2002/0098685
25-Jul-2002
6878628
12-Apr-2005 Issued
ASMI
MC.077 AUS
Low temperature WNC.
US 10/242368
12-Sep-2002 2003/0082296
01-May-2003
Published
ASMI
MC.077 EP
Low temperature WNC.
EP 2798955.7
10-Sep-2002
1425435
09-Jun-2004
Published
ASMI
MC.077 PCT
Low temperature WNC.
WO /US02/29032
10-Sep-2002
03025243
27-Mar-2003
Published
ASMI
October 14, 2005
Restricted Distribution
Page 12 of 13
556314
6939579
SM Patents Licensed / Sub-licensed to Oxford Instruments
Case Extension Title
ApplicationNo
FilingDate
PublicationNo Publication Date PatentNo
Status
Assgnee
01-Nov-2003 189730
02-Mar-2004 Issued
ASMI
30-Aug-2005 Issued
ASMI
MC.077 TW
Low temperature WNC.
TW 91120831
12-Sep-2002
MC.078 AUS
Stuffed diffusion barrier
US 10/007304
05-Dec-2001 2002/0187631
12-Dec-2002 6936535
MC.078 JP
Stuffed diffusion barrier
JP 2002/566544
05-Dec-2001 2004/525510
19-Aug-2004
MC.078 KR
Stuffed diffusion barrier
KR 10/2000/0074
06-Dec-2000 2003/0386034
02-Jun-2003
MC.078 PCT
Stuffed diffusion barrier
WO /US01/47592
05-Dec-2001
29-Aug-2002
Published
ASMI
MC.087 AUS
Enhanced thermal conduction
US 10/463309
16-Jun-2003 2003/0232138
18-Dec-2003
Published
ASMI
MC.087 VJP
Enhanced thermal conduction
JP 2003/171797
17-Jun-2003 2004/134741
30-Apr-2004
Published
ASMI
MC.087 VTW
Enhanced thermal conduction
TW 92116365
17-Jun-2003
01-Apr-2004
Published
ASMI
MC.094 AUS
Source vapour pressure monitor
US 10/285348
30-Oct-2002 2004/0083787
06-May-2004 6779378
MC.094 JP
Source vapour pressure monitor
JP 2003/370625
30-Oct-2003 2004/149925
27-May-2004
Published
ASMI
MC.098 AUS
Molecular bridges
US 10/696244
28-Oct-2003 2004/0092096
13-May-2004
Published
ASMI
MC.098 PCT
Molecular bridges
WO 2003/033214
21-Oct-2003 2004/040642
13-May-2004
Published
ASMI
MC.108 AUS
Adjusting electronegativities and work
function
US 10/430703
05-May-2003 2004/016261
03-Jun-2004
Published
ASMI
MC.108 JP
Adjusting electronegativities and work
function
JP 2003/404434
03-Dec-2003 2004/186693
02-Jul-2004
Published
ASMI
MC.109 AUS
Barrier layers for metal gates and electrodes
US 10/430811
05-May-2003 2004/0104439
03-Jun-2004
MC.110 AUS
Enhanced CMOS process flow
US 10/601037
19-Jun-2003 2004/0106249
03-Jun-2004
MC.145 AUS
HfSiON with one reactor
US 10/652851
29-Aug-2003
October 14, 2005
Restricted Distribution
Page 13 of 13
559890
Issue Date
02067319
2004/04912
Published
0386034
6858524
02-Jun-2003 Issued
24-Aug-2004 Issued
22-Feb-2005 Issued
Published
6818517
16-Nov-2004 Issued
ASMI
ASMI
ASMI
ASMI
ASMI
ASMI
SM Patents Licensed / Sub-licensed to Oxford Instruments
Health and Safety
1.
Oxford Instruments Plasma Technology
Plasmalab and Ionfab
Health and Safety
A l’attention des clients de langue fran&ccedil;aise
Le document hygi&egrave;ne et securit&eacute; est disponible en fran&ccedil;ais. Vous devez
vous assurer que cette version est pr&eacute;sente dans ce manual. Si elle est
manquante, contactez votre representant Oxford Instruments Plasma
Technology.
F&uuml;r deutschsprachige Kunden
besteht dieses Kapitel “Health and Safety” unter dem Titel “Sicherheit und
Unfallverh&uuml;tung” auch in deutscher Fassung, die in diesem Handbuch
enthalten sein sollte. Falls diese fehlt, fordern Sie bitte ein Exemplar bei
Oxford Instruments Plasma Technology an.
Contents
1. Health and Safety ..........................................................................................................................................1-1
1.1 Introduction ..............................................................................................................................................1-2
1.1.1 Warnings and Cautions .................................................................................................................1-2
1.2 Service mode ...........................................................................................................................................1-3
1.3 Hazard Categories...................................................................................................................................1-3
1.4 Specific Hazards......................................................................................................................................1-5
1.4.1 Electrical ........................................................................................................................................1-5
1.4.2 Electromagnetic Radiation ............................................................................................................1-6
1.4.3 Light ...............................................................................................................................................1-7
1.4.4 High Temperature..........................................................................................................................1-8
1.4.5 Low Temperature ..........................................................................................................................1-8
1.4.6 Gases ............................................................................................................................................1-9
1.4.7 Precursor materials .....................................................................................................................1-11
1.4.8 Materials ......................................................................................................................................1-12
1.4.9 Process Chemicals......................................................................................................................1-15
1.4.10 Vacuum........................................................................................................................................1-15
1.4.11 Compressed air ...........................................................................................................................1-16
1.4.12 Mechanical ..................................................................................................................................1-16
1.4.13 General ........................................................................................................................................1-17
1.5 Warning and advisory labels .................................................................................................................1-18
Printed:06 April 2010, 09:32
Health and Safety
Page 1-1 of 24
Issue 18: April 2010
Plasmalab and Ionfab
1.1
Oxford Instruments Plasma Technology
Health and Safety
Introduction
This section must be read and understood before the system is approached or operated and
before any maintenance work is carried out.
It is a requirement that procedures and practices taught in Oxford Instruments Plasma Technology
training courses are followed. If any user of the tool has not been directly trained by Oxford
Instruments Plasma Technology, please ensure that they understand the safety issues associated
with the tool, and that they consult relevant personnel for guidance when operating the tool.
If the equipment is used in a manner not specified by Oxford Instruments Plasma Technology, the
protection provided by the equipment may be impaired.
It is the user's responsibility to ensure the system is operated in a safe manner. Consideration
should be made for all aspects of the system's lifecycle, including, handling, installation, normal
operation, maintenance, dismantling, decontamination and disposal. It is the user's responsibility to
complete suitable risk assessments, to determine the magnitude of hazards, particularly when
using hazardous process gases and chemicals. The use of gas, chemical and fire detection
equipment, and gas pod monitoring equipment should be considered.
Please read this section carefully, and note that certain aspects of the system can produce more
than one hazard (e.g. process gases can be a fire hazard and a toxic hazard).
Some safety features are fitted to guard against more than one hazard. In particular, note that
some view ports must guard against UV light emission (sub-section 1.4.3, page 1-7), RF energy
emission (sub-section 1.4.2, page 1-6) and must be fitted with implosion guards.
Note that this document is standardised and may contain warnings, which are not relevant to your
particular system.
1.1.1
Warnings and Cautions
Throughout this manual, WARNINGS are inserted in the text to draw the reader’s attention to
hazards. Failure to comply with a WARNING could result in death or serious injury. A typical
warning is shown below:
HAZARD IDENTIFICATION
CONSEQUENCES OF IGNORING
THE HAZARD
WARNING
HAZARDOUS VOLTAGE - CONTACT CAN CAUSE DEATH, SEVERE INJURY OR BURNS
Any work requiring the removal of covers or panels must only be performed by authorised
personnel who are aware of the hazards involved.
Before removing any covers or panels, power down the system then carry out the lock out /
tag out procedure detailed in Section 6.
PICTORIAL SHOWING THE
HAZARD CATEGORY GRAPHICALLY
HOW TO AVOID
THE HAZARD
Throughout this manual CAUTIONS are inserted in the text to draw the reader’s attention to
situations and procedures, which could cause damage to the equipment.
Issue 18: April 2010
Health and Safety
Page 1-2 of 24
Printed:06 April 2010, 09:32
Health and Safety
Oxford Instruments Plasma Technology
Plasmalab and Ionfab
A typical CAUTION is shown below:
CAUTION
Upper electrodes can become contaminated from finger marks etc.
When working on the upper electrodes, ensure that powder-free cleanroom gloves are
worn.
1.2
Service mode
Service mode allows parts of the system to be operated without some of the interlocks that are
present in other operating modes. For example in service mode the loadlock end-effector can be
moved with the chamber lid open. Take additional care when operating the equipment in service
mode to avoid personal injury or damage to the equipment.
1.3
Hazard Categories
Hazards and associated warnings relevant to Health and Safety which appear in the text of this
manual and in this section will fall into the following categories:
a)
Electrical
(sub-section 1.4.1,
page 1-5)
The system carries voltages high enough to cause death or serious
injury. Even when the electrical power supply is isolated, electrical
energy at dangerous levels is stored by capacitors.
b)
Electromagnetic
Radiation
(sub-section 1.4.2,
page 1-6)
Parts of the system produce electromagnetic radiation from audio
frequencies to 2.45 GHz. This radiation can have a field strength strong
enough to cause death or injury if not properly shielded.
c)
Light
(sub-section 1.4.3,
page 1-7)
Ultra Violet (UV) or Laser light may be emitted in some systems. These
can cause permanent damage to the eyes or blindness if not protected
by the relevant shields or filters.
d)
High Temperature
(sub-section1.4.4,
page 1-8)
Some components run at a temperature high enough to cause severe
burns.
e)
Low Temperature
(sub-section 1.4.5,
page 1-8)
Components and gases at very low temperatures can cause severe
'burns' if allowed to contact the skin.
f)
Gases
(sub-section 1.4.6,
page 1-9)
Some process gases and cleaning fluid vapour may be toxic, corrosive,
carcinogenic or flammable. They may also cause asphyxiation through
oxygen deprivation. Gases under pressure can, if applied to the body,
enter it and cause death or serious injury.
g)
Precursors
(sub-section 1.4.7,
page1-11)
Some precursors may be toxic, corrosive, carcinogenic or flammable.
h)
Materials
(sub-section 1.4.8,
page1-12)
Some materials used in the system can become toxic during use. If this
happens, then great care must be taken during maintenance to prevent
death or serious injury.
Some processes may generate nanoparticles; particles whose sizes
range from 1 to 100 nm. The effect of these particles on the health and
safety of personnel and the environment is currently unknown. Follow
local and national safety procedures to alleviate any risk.
If a new process is considered and new materials may result, please
consult Oxford Instruments Plasma Technology for further health and
safety information.
Printed:06 April 2010, 09:32
Health and Safety
Page 1-3 of 24
Issue 18: April 2010
Plasmalab and Ionfab
Oxford Instruments Plasma Technology
Health and Safety
i)
Process Chemicals
(sub-section 1.4.9,
page 1-15)
Some etching and deposition compounds are toxic during use, and can
leave toxic residues in the system.
Some non-plasma cleaning processes, for example wet cleaning, may
involve the use of toxic or harmful chemicals. Ensure that local and
national health and safety procedures are followed when using such
chemicals.
j)
Vacuum
(sub-section 0, page
1-15)
Chambers or other components under partial vacuum represent stored
energy, which can cause injury if released carelessly.
k)
Compressed Air
(sub-section 1.4.11,
page 1-16)
Compressed air can enter the body through the skin and cause serious
injury. Pneumatically operated system components can be actuated
suddenly, even when the system is not operating, causing serious injury.
l)
Mechanical
(sub-section 0, page
1-16)
Injury can be caused by heavy components, sprung components,
deposition layers under stress, embrittled wire and machinery in motion.
Some mechanical cleaning processes may generate dust or very small
particles, which may be toxic or harmful. Ensure that local and national
health and safety procedures are followed when performing mechanical
cleaning procedures.
m)
General
(sub-section 1.4.13,
page 1-17)
Various procedures must be studied and followed. These include
procedures specific to the system in question and also local and national
Health and Safety standards.
Issue 18: April 2010
Health and Safety
Page 1-4 of 24
Printed:06 April 2010, 09:32
Health and Safety
Oxford Instruments Plasma Technology
1.4
Specific Hazards
1.4.1
Electrical
Plasmalab and Ionfab
WARNING
HAZARDOUS VOLTAGE - CONTACT CAN CAUSE DEATH, SEVERE INJURY OR BURNS
Any work requiring the removal of covers or panels must only be performed by authorised
personnel who are aware of the hazards involved.
Before removing any covers or panels, power down the system then carry out the lock out /
tag out procedure detailed in Section 6.
1.4.1.1
Parts of the system carry high voltages, which are capable of causing injury or death.
Take great care when carrying out maintenance tasks.
1.4.1.2
Do not operate the system if any of the doors, panels or covers are removed. Parts of
the system may still be 'live' even when shut down by a switch, blown fuse or control
function. Note that the system POWER OFF button does not isolate the main distribution
panel.
1.4.1.3
Ensure that all system units are connected to electrical earth (ground). For details of the
required electrical installation, refer to the ‘Services Specifications for Plasmalab and
Ionfab systems’ document which is included at the rear of this manual’s binder.
1.4.1.4
During troubleshooting and calibration, the power supplies may need to be connected
with live components exposed. This work must only be carried out by skilled
personnel who are aware of the hazards involved.
1.4.1.5
Ensure that all safety interlocks are tested before the system is used for the first time
and at scheduled intervals thereafter. These tests must be carried out by suitably
qualified personnel.
1.4.1.6
Inspect the system regularly for damaged components, e.g. cables, connectors or
switches. Any components found damaged must be replaced before continuing to
operate the system. Refer to the instructions in the maintenance section of this manual
for details of any particular tests of the cables that may be required.
1.4.1.7
If any water leaks are detected, immediately switch the system off at the main incoming
circuit breaker.
1.4.1.8
No servicing is to be carried out unless all personnel involved fully understand the
danger of stored electrical energy. Refer to the lock out / tag out procedure detailed in
Section 6.
Printed:06 April 2010, 09:32
Health and Safety
Page 1-5 of 24
Issue 18: April 2010
Plasmalab and Ionfab
1.4.2
Oxford Instruments Plasma Technology
Health and Safety
Electromagnetic Radiation
WARNING
HAZARDOUS RF AND MICROWAVE EMISSIONS - EXPOSURE CAN CAUSE SEVERE INJURY
OR BURNS
Before operating the System On button, ensure that all RF and / or microwave shielding,
flanges, retaining screws and connectors have been correctly fitted.
1.4.2.1
Parts of the system produce electromagnetic radiation from audio frequencies to
2.45 GHz. At all frequencies within this range there is a field strength level at which
radiation can cause injury. Oxford Instruments Plasma Technology specifies limits for
the Electric and Magnetic field strengths within the environment of the system.
The system must be tested to ensure that radiation is within these limits, using suitably
calibrated equipment. The tests must be carried out after maintenance involving RF
shielding components, and routinely every three months. Refer to the instructions in the
maintenance section of this manual.
1.4.2.2
Ensure that all waveguide components, flanges and cables are correctly fitted, secure
and undamaged.
View ports on Plasmalab systems and on certain Ionfab systems are fitted with a metal
grid for shielding RF radiation. Replace this item only with the correct part, and ensure
that the ports are correctly reassembled.
If a metal grid is not fitted and there is any doubt about whether one should be fitted, you
must check with Oxford Instruments Plasma Technology before proceeding. If the view
port has been disassembled then tests must be carried out as described in sub-section
1.3.2.1 above.
1.4.2.3
Operating the equipment with any panels removed increases the risk of RF burns.
Maintenance procedures, which require this, must only be performed by skilled persons
who have access to a suitable field strength meter.
1.4.2.4
Removing panels or modifying the equipment may increase the radio interference
emitted by the equipment above permitted levels. This may cause nearby equipment to
operate unexpectedly.
1.4.2.5
If portable transmitting equipment, e.g. radio, cellular phone, etc., is used within two
metres of the equipment, the equipment could operate unexpectedly. Removing panels
or modifying the equipment may increase this risk.
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Health and Safety
Page 1-6 of 24
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Health and Safety
1.4.3
Oxford Instruments Plasma Technology
Plasmalab and Ionfab
Light
WARNING
LASER RADIATION - EXPOSURE CAN CAUSE SEVERE EYE DAMAGE OR BURNS
Before operating the system, ensure that all covers are fitted correctly.
Ensure that for laser equipment, the manufacturer’s instructions have been read and fully
understood.
1.4.3.1
Laser equipment when handled incorrectly or in a damaged condition can seriously
damage eyesight. Read and follow the manufacturer's instructions carefully. Ensure that
all covers supplied by Oxford Instruments Plasma Technology or by the manufacturer
are correctly fitted before the equipment is powered up.
WARNING
ULTRA VIOLET RADIATION - EXPOSURE CAN CAUSE SEVERE EYE DAMAGE OR BURNS
Ensure that all view ports are assembled correctly, and that any replacement filters are of
the correct specification.
1.4.3.2
View ports on Plasmalab systems are fitted with a clear plastic UV filter (Perspex -VEclear-003). Replace this item only with the correct part, and ensure that the ports are
correctly reassembled.
If a plastic filter is not fitted, or if there is any doubt about the type of filter that is fitted,
you must check with Oxford Instruments Plasma Technology before proceeding.
1.4.3.3
The customer should be aware of the fact that view ports are available in glass or
quartz. Most view ports on Oxford Instruments Plasma Technology systems are glass,
but quartz is used in certain applications. Quartz view ports allow much more UV light to
pass through than glass does, and so present a greater hazard. They will require very
careful shielding or filtering in ALL situations on Plasmalab and Ionfab systems.
Be careful if the service history of the system is not fully known. It is possible that a glass
view port has been changed for a quartz one.
1.4.3.4
UV light can also escape from other parts of the system, e.g. from ICP plasma sources,
and downstream plasma discharge tubes. Discharge tubes of this type are often made
of quartz, and so very careful shielding or filtering is needed.
1.4.3.5
UV light can produce ozone from ambient air. Detectable quantities are produced by ICP
sources fitted with a quartz tube. Local extraction must be used in this case.
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Page 1-7 of 24
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Plasmalab and Ionfab
1.4.4
Oxford Instruments Plasma Technology
Health and Safety
High Temperature
WARNING
HOT SURFACES - CLOSE CONTACT CAN CAUSE SERIOUS INJURY AND BURNS
Allow sufficient time for heated components (e.g. heated lower electrodes) to cool to room
temperature before carrying out maintenance.
1.4.4.1
During operation of the system some components can become dangerously hot. Always
allow time for these to cool to a safe temperature before handling them.
Components that become hot include electrically heated chambers, chamber liners,
lower electrodes, specimen holders and halogen lamps. Items illuminated by halogen
lamps can also reach very high temperatures.
Note that items such as neutralizers, ion sources, and ICP sources operate at high
temperatures.
1.4.5
Low Temperature
WARNING
COLD OBJECTS - CONTACT CAN CAUSE SERIOUS INJURY TO THE SKIN AND CAN CAUSE
THE SKIN TO ADHERE TO THE COLD OBJECT
Allow sufficient time for cold components (e.g. cryogenically cooled lower electrodes) to
return to room temperature before carrying out maintenance.
If cold objects must be handled, ensure that suitable protective clothing is worn.
1.4.5.1
Beware of the extreme cold produced in refrigerated or cryogenically cooled systems.
Contact with the skin by components at these temperatures can produce 'burns'. Allow
the cooling system to reach a safe temperature before attempting any maintenance
tasks.
Components that become cold include cryogenically cooled lower electrodes, cryogenic
pumps and components that use liquid nitrogen.
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Health and Safety
1.4.6
Oxford Instruments Plasma Technology
Plasmalab and Ionfab
Gases
Gases are used in the system for venting and purging (N2), for aiding heat transfer (e.g. helium)
and for establishing the process environment (i.e. process gases).
Process gases used in the system are specified dependent on the process for which the system is
designed.
The hazards presented by gases fall into one or more of the following categories:
a)
b)
c)
d)
e)
Asphyxiant - replaces Oxygen causing respiration difficulties and eventually death.
Flammable - can ignite in the presence of heat or arcing.
Pyrophoric – can ignite spontaneously on contact with air.
Toxic
Corrosive
The following WARNINGS may be applicable to the gases used in your system; it is your
responsibility to be aware of the hazards and take the necessary precautions. Contact your gas
supplier for full details.
WARNING
FLAMMABLE GASES - FLAMMABLE MATERIAL CAN IGNITE IN THE PRESENCE OF HEAT
OR ARCING, CAUSING SEVERE INJURY.
After a processing run, the process chamber must be subjected to at least one vent cycle
before any maintenance work is carried out.
Ensure that the gas lines have been purged before removing or loosening components.
Wear personal protective equipment as necessary.
WARNING
TOXIC GASES - CONTACT CAN CAUSE DEATH OR SERIOUS INJURY
After a processing run, the process chamber must be subjected to at least two vent cycles
before any maintenance work is carried out.
Ensure that the gas lines have been purged before removing or loosening components.
Wear personal protective equipment as necessary.
WARNING
CORROSIVE GASES - CONTACT CAN CAUSE SERIOUS INJURY
After a processing run, the process chamber must be subjected to at least two vent cycles
before any maintenance work is carried out.
Ensure that the gas lines have been purged before removing or loosening components.
Wear personal protective equipment as necessary.
WARNING
PLASMALAB and IONFAB SYSTEMS DO NOT PROVIDE ANY EXCESS PRESSURE
REGULATION / PROTECTION FOR PROCESS GASES.
It is the customer’s responsibility to ensure that suitable regulation / protection, in
accordance with all applicable standards, is installed and correctly maintained external to
the system.
1.4.6.1
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The effluents of all Plasmalab and Ionfab systems should be considered toxic.
Health and Safety
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Oxford Instruments Plasma Technology
Health and Safety
1.4.6.2
Ensure that effluents are extracted into a safe disposal system. The bore of the
extraction pipework must be of a greater internal bore than the pump outlet. Exhaust
lines carrying hazardous gases must not be used for any other purpose.
1.4.6.3
Rotary and turbomolecular pumps MUST always be nitrogen ballasted, if this feature is
provided on the system. For Plasmalab deposition systems, the oil box of the rotary
pump should also be purged. If a flow switch and alarm are needed on any of these
lines to ensure safe operation, they must be installed and regularly maintained.
1.4.6.4
If toxic, flammable or corrosive gases are to be used, the entire system must be installed
in accordance with best practice for the semiconductor production industry.
If no local guidelines are available, the regulations contained in U.S. documents UBC
9.911 (1985) and UFC 51 are recommended reading. Guidance is also contained in
‘The Safe Storage, Handling and Use of Liquid Gases in the Micro-Electronics Industry’
BCGA/ECIF COP CP18, ISBN 0260 - 4809, available from BCGA or ECIF.
1.4.6.5
If toxic, flammable or corrosive gases are to be used, the entire system must be situated
in a purged or extracted environment with suitable gas detectors.
1.4.6.6
Gas pods supplied by OIPT incorporate a 100mm diameter extraction collar. If toxic,
flammable or corrosive gases are used, extraction facilities must be connected to this
collar. Purge gas extracted from the gas pod should be monitored by a suitable gas
detector to give advance warning of any leakage.
1.4.6.7
Ensure that the purge gas extraction system can withstand corrosion or combustion if
necessary.
1.4.6.8
Make regular checks on the vacuum integrity of the gas lines to reduce the risk of
sudden leaks.
1.4.6.9
Ensure that the system is completely purged BEFORE maintenance is started and
suitably leak tested AFTER maintenance is completed.
1.4.6.10
As far as practicable, shut down gas lines when not in use.
1.4.6.11
Pumps must always be operated in accordance with the manufacturers' manuals and
with Oxford Instruments Plasma Technology engineers' training courses.
Pumps, when fitted with a nitrogen purging facility, must always be purged during a
processing run and for a suitable period after a processing run has finished.
1.4.6.12
Where gas detectors are fitted, their responses should be verified every two weeks
(refer to the manufacturer's manuals).
1.4.6.13
Compressed gases can penetrate the skin and enter the blood stream. Avoid direct
contact with compressed gases.
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Health and Safety
1.4.7
Oxford Instruments Plasma Technology
Plasmalab and Ionfab
Precursor materials
Precursors used in the system are specified dependent on the process for which the system is
designed.
The hazards presented by precursors fall into one or more of the following categories:
a)
b)
c)
d)
e)
Asphyxiant - replaces oxygen causing respiration difficulties and eventually death.
Flammable - can ignite in the presence of heat or arcing.
Pyrophoric – can ignite spontaneously on contact with air.
Toxic
Corrosive
The following WARNINGS may be applicable to the precursors used in your system; it is your
responsibility to be aware of the hazards and take the necessary precautions. Contact your
precursor supplier for full details.
WARNING
FLAMMABLE PRECURSORS - FLAMMABLE MATERIAL CAN IGNITE IN THE PRESENCE OF
HEAT OR ARCING, CAUSING SEVERE INJURY.
After a processing run, the process chamber must be subjected to at least one vent cycle
before any maintenance work is carried out.
Ensure that the precursor lines have been purged before removing or loosening
components.
Wear personal protective equipment as necessary.
WARNING
TOXIC PRECURSORS - CONTACT CAN CAUSE DEATH OR SERIOUS INJURY
After a processing run, the process chamber must be subjected to at least two vent cycles
before any maintenance work is carried out.
Ensure that the precursor lines have been purged before removing or loosening
components.
Wear personal protective equipment as necessary.
WARNING
CORROSIVE PRECURSORS - CONTACT CAN CAUSE SERIOUS INJURY
After a processing run, the process chamber must be subjected to at least two vent cycles
before any maintenance work is carried out.
Ensure that the precursor lines have been purged before removing or loosening
components.
Wear personal protective equipment as necessary.
1.4.7.1
Perform a risk assessment and wear suitable personal protective equipment when
working on pre-cursor systems.
1.4.7.2
The effluents of all OpAL and FlexAL systems should be considered toxic.
1.4.7.3
Ensure that effluents are extracted into a safe disposal system. The bore of the
extraction pipework must be of a greater internal bore than the pump outlet. Exhaust
lines carrying hazardous gases must not be used for any other purpose.
1.4.7.4
Rotary and turbomolecular pumps MUST always be nitrogen ballasted, if this feature is
provided on the system. If a flow switch and alarm are needed on any of these lines to
ensure safe operation, they must be installed and regularly maintained.
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Plasmalab and Ionfab
1.4.7.5
Oxford Instruments Plasma Technology
Health and Safety
If toxic, flammable or corrosive precursors are to be used, the entire system must be
installed in accordance with best practice for the semiconductor production industry.
If no local guidelines are available, the regulations contained in U.S. documents UBC
9.911 (1985) and UFC 51 are recommended reading. Guidance is also contained in
‘The Safe Storage, Handling and Use of Liquid Gases in the Micro-Electronics Industry’
BCGA/ECIF COP CP18, ISBN 0260 - 4809, available from BCGA or ECIF.
1.4.7.6
If toxic, flammable or corrosive precursors are to be used, the entire system must be
situated in a purged or extracted environment with suitable gas detectors.
1.4.7.7
Precursor cabinets supplied by OIPT incorporate a 100mm diameter extraction collar. If
toxic, flammable or corrosive gases are used, extraction facilities must be connected to
this collar. Purge gas extracted from the precursor cabinet should be monitored by a
suitable gas detector to give advance warning of any leakage.
1.4.7.8
Ensure that the purge gas extraction system can withstand corrosion or combustion if
necessary.
1.4.7.9
Make regular checks on the vacuum integrity of the precursor lines to reduce the risk of
sudden leaks.
1.4.7.10
Ensure that the system is completely purged BEFORE maintenance is started and
suitably leak tested AFTER maintenance is completed.
1.4.7.11
As far as practicable, shut down precursor lines when not in use.
1.4.7.12
Pumps must always be operated in accordance with the manufacturers' manuals and
with Oxford Instruments Plasma Technology engineers' training courses.
Pumps, when fitted with a nitrogen purging facility, must always be purged during a
processing run and for a suitable period after a processing run has finished.
1.4.8
1.4.7.13
Where gas detectors are fitted, their responses should be verified every two weeks
(refer to the manufacturer’s manuals).
1.4.7.14
Do not fit incompatible precursors on the same manifold. Consider the precursors that
are already fitted, or that have been fitted previously, before installing a new precursor.
1.4.7.15
Do not overheat precursors as dangerously high pressures may be produced. Never
heat precursor pots containing water.
1.4.7.16
Never use glass precursor pots.
Materials
1.4.8.1
Materials used in the construction of the system are in a safe state when installed.
However, fluorine-containing materials may be used as O-rings (e.g. Viton™ materials),
as electrical insulation or as electrical isolation block (e.g. Teflon ™ or other tfe or ptfe
material) or as lubricating grease or fluid (e.g. Fomblin™, Krytox™ or the NCI™ range
from Leybold) If any of these materials are over-heated, hazardous materials are
created that can result in the loss of a limb or death.
1.4.8.2
Very great care must be taken to ensure that Perfluoro-elastomer (Viton™) O-rings are
not exposed to high temperatures. If overheated, decomposition takes place, producing
a highly acidic residue containing hydrofluoric acid (HF).
If there is any evidence that a Viton™ O-ring could have been subjected to temperatures
in excess of 300&deg;C the following actions must be carried out:
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Health and Safety
1.4.8.3
Oxford Instruments Plasma Technology
Plasmalab and Ionfab
(a)
Consult a competent authority regarding the following items (b) to (e).
(b)
Wearing suitable protective clothing, remove the O-ring and dispose of
it in accordance with local Health and Safety regulations.
(c)
Wearing suitable protective clothing, thoroughly clean the
contaminated area, disposing of any residue in accordance with local
Health and Safety regulations.
(d)
Fit a new O-ring.
(e)
Investigate the cause of the overheating and review operating
procedures and control systems to prevent a recurrence.
Teflon™ and other tfe materials. Very great care must be taken to ensure that Teflon™
and other tfe or ptfe materials are not exposed to high temperatures. If overheated,
decomposition takes place, producing volatile fluorine containing components.
If there is any evidence that any Teflon™ or other tfe or ptfe material could have been
subjected to temperatures in excess of 300&deg;C the following actions must be carried out:
(a)
Consult a competent authority regarding the following items (b) to (e).
(b)
Wearing suitable protective clothing, remove the decomposed material
and dispose of it in accordance with local Health and Safety
regulations.
(c)
Wearing suitable protective clothing, thoroughly clean the
contaminated area, disposing of any residue in accordance with local
Health and Safety regulations.
(d)
Fit a new component.
(e)
Investigate the cause of the overheating and review operating
procedures and control systems to prevent a recurrence.
Note that swarf and other pieces of material for disposal must be disposed of with great
care and must be kept well away from fire, from cigarettes and other smoking materials.
1.4.8.4
PFPE lubricating fluids. Very great care must be taken to ensure that PFPE fluids (e.g.
Fomblin™, Krytox™ NCI™ etc) are not exposed to high temperatures. If overheated,
decomposition takes place, producing volatile fluorine containing components.
If there is any evidence that any PFPE lubricating fluids could have been subjected to
temperatures in excess of 300&deg;C the following actions must be carried out:
Printed:06 April 2010, 09:32
(a)
Consult a competent authority regarding the following items (b) to (e).
(b)
Wearing suitable protective clothing, remove the decomposed material
and dispose of it in accordance with local Health and Safety
regulations.
(c)
Wearing suitable protective clothing, thoroughly clean the
contaminated area, disposing of any residue in accordance with local
Health and Safety regulations.
(d)
Replace with fresh grease or fluid.
(e)
Investigate the cause of the overheating and review operating
procedures and control systems to prevent a recurrence.
Health and Safety
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Oxford Instruments Plasma Technology
Health and Safety
Note that all PFPE material, including spillages of fresh fluid must be disposed of with
great care and must be kept well away from fire, from cigarettes and other smoking
materials.
1.4.8.5
Maintenance work inside the vacuum chamber, particularly cleaning operations, can
generate dust. This dust may be toxic, corrosive or carcinogenic, depending on the
process that is being run. Wear appropriate personal protective equipment to avoid dust
contacting the skin, eyes and other parts of the body. Take appropriate precautions to
contain any dust that may be generated to prevent it spreading.
1.4.8.6
Some processes may generate nanoparticles; particles whose sizes range from 1 to
100 nm. The effect of these particles on the health and safety of personnel and the
environment is currently unknown. Follow local and national safety procedures to
alleviate any risk.
If a new process is considered and unfamiliar materials may result, please consult
Oxford Instruments Plasma Technology for further health and safety information.
1.4.8.7
Gases exhausted from rotary vacuum pumps may contain oil vapour which is
carcinogenic. Always fit a suitable oil mist filter to the exhaust ports of such pumps.
1.4.8.8
Recirculating chillers using silicone oil as a heat transfer fluid and operating at
temperatures above ambient temperature may produce vapour around the chiller bath.
Appropriate extraction should be considered to prevent inhalation of the vapour by
personnel.
1.4.8.9
Do not use silicone oil (such as Thermal H5S) as the heat transfer medium in
heater/chiller units that connect to electrically heated tables. Over-heating silicone oil
can produce hazardous by-products. A glycol based heat transfer medium (such as
Thermal G) should be used in heater/chiller units connected to electrically heated tables.
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Health and Safety
1.4.9
Oxford Instruments Plasma Technology
Plasmalab and Ionfab
Process Chemicals
WARNING
SOME MATERIALS USED IN AND RESULTING FROM DEPOSITION AND ETCHING
PROCESS CAN BE DANGEROUSLY TOXIC; CONTACT CAN CAUSE SERIOUS INJURY
NANOPARTICLES HAVE AN UNKNOW EFFECT ON HEALTH AND SAFETY. TAKE GREAT
CARE IF NANOPARTICLES MAY BE PRESENT.
Before working on the process chamber or its associated components, consult a
competent authority to ascertain the nature of any coatings.
Wear appropriate protective clothing, e.g. hand and eye protection, as necessary.
WARNING
COMPOUNDS USED FOR CLEANING MAY BE FLAMMABLE – FLAMMABLE MATERIAL CAN
IGNITE IN THE PRESENCE OF HEAT OR ARCING, CAUSING SEVERE INJURY.
Follow local and national health and safety regulations when using flammable cleaning
compounds. Wear personal protective equipment as necessary.
1.4.10
1.4.9.1
Some compounds used in and resulting from deposition and etching processes can be
dangerously toxic. These compounds can be deposited as coatings on the inside of the
chamber, pipework etc. Therefore, suitable hand and eye protection must be used.
1.4.9.2
Cleaning fluids, and the gases given off from them, may be toxic or flammable. Only use
them in a well ventilated area and avoid ingestion. Follow local and national health and
safety regulations.
1.4.9.3
Always use suitable eye and skin protection when handling vacuum pumps and mineral
or synthetic oil. Apart from the hazards described in sub-section 1.3.7, used oils and
pumps may be contaminated with dangerous chemicals.
1.4.9.4
Study all relevant Material Safety Data Sheets (MSDS), or their equivalents, before
carrying out any maintenance work.
1.4.9.5
Nanoparticles (particles with a size range between 1 and 100 nm) may be deposited as
coatings on vacuum components. These particles may be toxic or have an unknown
effect on the health and safety of personnel and the environment. Assume all such
materials are hazardous and wear appropriate personal protective equipment. If a new
process generates an unfamiliar material, consult Oxford Instruments Plasma
Technology for further health and safety information.
Vacuum
1.4.10.1
Do not enter large vacuum chambers.
1.4.10.2
Process chambers and load locks under vacuum represent stored energy. If released
accidentally, this can cause injury. These spaces must be vented to atmospheric
pressure before the system is powered down in preparation for maintenance.
1.4.10.3
Handle vacuum capacitors carefully; if knocked or dropped they can implode causing
serious injury.
1.4.10.4
All view ports that are greater than 100mm diameter must be fitted with a clear plastic
implosion eye-guard on the outside. Replace this item only with the correct part, and
ensure that the ports are correctly reassembled.
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Oxford Instruments Plasma Technology
Health and Safety
If a plastic implosion eye-guard is not fitted, or if there is any doubt about the type of
eye-guard that is fitted, you must check with Oxford Instruments Plasma Technology
before proceeding.
1.4.10.5
1.4.11
Take care when opening vented vacuum vessels in case of excess pressure inside.
Compressed air
1.4.11.1
1.4.11.2
Retained air pressures can be at dangerous levels. Never put your hand or any other
obstruction in the path of a slit or gate valve blade unless it has been made safe.
Release the pressure as follows:
a)
Power down the system by opening the main circuit breaker.
b)
Disconnect the pneumatic supply pipes from the system.
Operate and padlock the lock-out valves (if fitted) on the gate valves. This will release all
air pressure from both sides of the valve actuators. If lock-out valves are not fitted,
disconnect the supply pipe at the point where it connects to the valve.
WARNING
AUTOMATICALLY CONTROLLED COMPONENTS CAN MOVE WITHOUT WARNING CAUSING
SERIOUS INJURY
Maintenance on automatically controlled equipment must only be carried out by fully trained
personnel who are aware of the risks involved.
WARNING
PLASMALAB and IONFAB SYSTEMS DO NOT PROVIDE ANY EXCESS PRESSURE
REGULATION / PROTECTION FOR COMPRESSED AIR SUPPLIES.
It is the customer’s responsibility to ensure that suitable regulation / protection, in
accordance with all applicable standards, is installed and correctly maintained external to
the system.
1.4.12
1.4.11.3
Before undertaking any work on the system, you must ensure that all compressed air is
released. If lock-out valves are fitted, they must be operated and locked. See the section
on powering down the system for more details.
1.4.11.4
Compressed air can penetrate the skin and enter the blood stream. Avoid direct contact
with compressed air.
Mechanical
WARNING
LIFTING HEAVY OBJECTS INCORRECTLY CAN CAUSE SEVERE INJURY
When handling heavy system components such as the system unit or vacuum pumps, ensure
that the appropriate lifting equipment, operated by fully trained personnel, is used.
When heavy rack-mounted components are handled, ensure that the weight is safely
distributed between sufficient personnel.
1.4.12.1
Injury can be caused by attempting to lift heavy components. Always ensure that
suitable lifting equipment and assistance, if required, are available when removing or
refitting heavy components, e.g. chamber lids, chamber doors or electrodes.
1.4.12.2
Be aware of the weight of racked units, e.g. power supplies. Do not attempt to remove
heavy units from their racks unaided.
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Health and Safety
1.4.12.3
Oxford Instruments Plasma Technology
Plasmalab and Ionfab
Take care when moving heavy components. Ensure that they remain stable to avoid any
risk of toppling. Use any support frames or stabilizers provided when moving, installing
or decommissioning equipment.
WARNING
PINCH POINT - LIMBS, FINGERS ETC CAN BECOME TRAPPED RESULTING IN SEVERE
INJURY.
Ensure that all personnel are kept clear of pinch points, e.g. chamber doors, hoist
mechanisms, variable height electrodes etc, while these components are moving.
1.4.12.4
Close chamber doors carefully; ensure that personnel vacate the vicinity of the door and
its operating mechanism before it is closed to avoid trapped fingers etc.
1.4.12.5
Handle sprung components under compression or tension carefully, Take suitable
precautions, including eye protection, before maintaining small sprung items.
1.4.12.6
Beware of machinery in motion such as robotic arms, substrate lifting mechanisms and
shutters. Remember that machinery can start suddenly. Ensure that all safety guards
are correctly fitted before use.
1.4.12.7
Beware of deposition layers under stress. Wear eye protection before cleaning surfaces
which are coated with layers of material, as particles can be ejected with considerable
force.
1.4.12.8
Handle embrittled wire, e.g. filaments, carefully. They can break and become embedded
in the skin.
1.4.12.9
Some process chambers and loadlocks are fitted with a safety mechanism to lock the
chamber in the open position. This mechanism may be integral to the gas spring design
or it may be a separate locking pin arrangement. Ensure that the locking mechanism is
engaged whenever the chamber is opened for any length of time, or if maintenance is
being performed inside the chamber.
1.4.12.10 Wall mounted equipment, such as gas pods and LN2 auto changeover boxes, should be
supported by bolts and frames that are rated to withstand four times the weight of the
item being supported.
1.4.13
General
1.4.13.1
Ensure that local and national Health and Safety standards are studied and followed. It
is the customer’s responsibility to carry out their own risk assessment and to develop a
safe system of work.
1.4.13.2
Ensure that all personnel who operate this equipment are trained to use the equipment,
and are alerted to the range of hazards present.
1.4.13.3
When working with the equipment, ensure that there are always at least two persons
present.
1.4.13.4
If a tool is used to access or alter any part of the equipment, this is classed as a
maintenance action. Persons performing maintenance tasks must be skilled and trained
to know and avoid the hazards present. Before carrying out any maintenance work, read
the relevant manuals supplied by manufacturers of proprietary components.
1.4.13.5
Ensure that the main electrical supply, compressed air, all other gases and the water
supply are disconnected before starting maintenance work (Also see sub-section 1.3.9).
1.4.13.6
Consult Oxford Instruments Plasma Technology before making any alterations to the
system or changing the process gases.
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Oxford Instruments Plasma Technology
Health and Safety
1.4.13.7
Ensure that all personnel who may be expected to have access to the system during an
emergency, such as firemen, paramedics etc. are familiar with the location of the main
circuit breakers and valves.
1.4.13.8
Whenever any component is returned to Oxford Instruments Plasma Technology or to
any of their agents, it must be accompanied by copies of the Goods Return Form (QCF
60).
1.4.13.9
Never smoke or eat in the 'clean room' or where gases are stored. In addition to the fire
risks and particulate contamination presented by smoking, some chemicals when burnt
generate carcinogenic or toxic compounds.
1.4.13.10 OIPT systems have been designed to be operated with all panels and covers in place.
These panels form part of a barrier to protect the operator from exposure to hazards
within the system. Note that some hazards are either present continuously, but some
hazards only appear in a fault condition. The panels should also be in place to ensure
that the system meets electromagnetic compatibility requirements. OIPT do not
recommend operating the system unless all panels and covers are fixed in place.
1.5
Warning and advisory labels
During manufacture, warning and advisory labels are attached to the system to indicate potential
hazards and components, which should not be operated or maintained without first reading the
relevant manual. Typical labels and their meanings are as follows:
Label
OIPT Part Number
94-G-SUN-ART-055
94-G-SUN-ART-056
Meaning
Danger of physical injury
from RF radiation or from
touching components
within the labelled
equipment.
Location
RF shielding.
RF generator
cover.
RF coaxial cable.
94-G-SUN-ART-054
Danger of trapping limbs,
fingers etc. in the labelled
equipment.
Upper chamber.
Upper loadlock.
Danger of physical injury
from toppling.
Precursor cabinet.
Warns of physical injury
from toppling system, if
frame not fitted.
NGP-B front
frame below
loadlock.
Warns of physical injury
from lifting heavy panel.
Crystal Flex
exterior panels.
NGP-B loadlock
lower panel.
Warns of physical injury
from lifting heavy
loadlock.
NGP-B Loadlock.
94-G-SUN-ART-053
94-G-G-SUN-ART084
94-G-SUN-ART-061
94-G-G-SUN-ART085
Issue 18: April 2010
Health and Safety
Page 1-18 of 24
Printed:06 April 2010, 09:32
Health and Safety
Label
Oxford Instruments Plasma Technology
OIPT Part Number
94-G-SUN-ART-073
Plasmalab and Ionfab
Meaning
Danger of physical injury
(particularly for persons
with pacemakers fitted)
from the strong magnetic
field generated by the
labelled equipment.
Caution, hot surface.
94-G-SUN-ART-051
94-G-G-SUN-ART088
94-G-SUN-ART-059
94-G-SUN-ART-060
94-G-SUN-ART-058
94-G-SUN-ART-080
Printed:06 April 2010, 09:32
Chamber walls.
Loadlock walls.
Precursor cabinet.
Caution, very hot surface.
Crystal Flex
furnace entrance.
Cold surface. Danger of
physical injury, from the
labelled equipment.
Liquid nitrogen
inlet.
Liquid nitrogen
outlet.
94-G-SUN-ART-075
94-G-SUN-ART-079
Location
Magnetic spacer
outer cover.
Warns of potential
explosion hazard if
instructions are not
followed
Read the relevant manual
before proceeding to
operate or maintain the
labelled equipment.
Danger of physical injury
from RF and UV radiation
from the labelled
components.
Danger of physical injury
from laser beam
generated by the labelled
components.
Health and Safety
Page 1-19 of 24
System services
panel
Turbo pump
controller outer
cover.
Recirculation
chiller controller.
Vacuum gauge
outer cover. Three
phase filter outer
cover.
Vacuum valve
outer cover. MFC
outer cover.
RF / DC generator
outer cover.
Foreline pump
outer cover.
Power box
external and
internal panels.
Chamber
viewport.
Upper chamber.
Cassette box.
Wafer handler
chamber.
Issue 18: April 2010
Plasmalab and Ionfab
Label
Oxford Instruments Plasma Technology
OIPT Part Number
WARNING
System vent gas: Nitrogen
Health and Safety
Meaning
Warns of gas type and
maximum pressure,
connected to the system.
Location
Gas pod.
Warns of gas type and
maximum pressure,
connected to the system.
Gas pod.
Warns of gas type and
maximum pressure,
connected to the system.
Gas pod.
Warns of fluid type and
maximum pressure,
connected to the system
Gas pod.
Max inlet pressure : 5 Bar
WARNING
Gas type: Air (c ompressed)
Max inlet pressure : 9 Bar
WARNING
System proc ess gas :
Max inlet pressure : 5 Bar
WARNING
Fluid type: Water (c ooling)
Max inlet pressure : 4.2 Bar
Caution, refer to
accompanying
documents. ISO 3864,
No. B.3.1
On (Supply) IEC 417,
No.5007
Off (Supply) IEC 417,
No.5008
Earth (ground) IEC 417,
No.5017
94-G-G-SUN-ART091
Identifies the location of
electrical safety ground.
Power box.
Earth studs
around the
system.
Three phase alternating
Current IEC 617-2 No.
020206
Three phase alternating
Current with Neutral wire.
Issue 18: April 2010
Health and Safety
Page 1-20 of 24
Printed:06 April 2010, 09:32
Health and Safety
Label
Oxford Instruments Plasma Technology
OIPT Part Number
94-G-SUN-ART-052
94-G-SUN-ART-057
Warns of hazardous
voltage up to 208 V
underneath the cover.
94-G-SUN-ART-067
Warns of hazardous
voltage up to 240 V
underneath the cover.
94-G-SUN-ART-068
Warns of hazardous
voltage up to 380 V
underneath the cover.
94-G-SUN-ART-062
Warns of hazardous
voltage up to 415 V
underneath the cover.
94-G-SUN-ART-072
Warns of a hazardous
DC voltage underneath
the cover.
94-G-SUN-ART-078
Printed:06 April 2010, 09:32
Meaning
Warns of a hazardous
voltage underneath the
cover.
94-G-SUN-ART-063
94-G-SUN-ART-074
Plasmalab and Ionfab
Warns that asphyxiant
gas may be present.
Warns of a possible
explosion risk if any
container of water is fitted
to the cabinet.
Health and Safety
Page 1-21 of 24
Location
Turbo pump
controller outer
cover.
Recirculation
chiller controller.
Three phase filter
outer cover.
Vacuum valve
outer cover. RF /
DC generator
outer cover.
Foreline pump
outer cover.
Power box outer
cover and inside
box.
700&deg;C table DC
power supply
back cover.
System internal
panel.
Heater power
cable.
DC magnetron
distribution outer
cover.
DC magnetron
shield cover.
Crystal Flex
glove box end
panel.
Precursor cabinet
inside door.
Issue 18: April 2010
Plasmalab and Ionfab
Label
Oxford Instruments Plasma Technology
OIPT Part Number
Health and Safety
Meaning
Warns of the risks of
mixing incompatible precursors.
Location
Precursor cabinet
inside and
outside cabinet
Warns of the risks of
exposure to hazardous
fluids.
Precursor cabinet
exterior panel.
Gas pod outer
door.
Warns of possible
exposure to hazardous
gases.
Close coupled
gas pod outer
cover
G4-G-SUN-ART-071
Warns of the risks
associated with a high
leakage current.
Power box mains
cable.
94-G-SUN-ART-064
Warns of the risks
associated with fluid
under pressure.
Gas pod.
System services
panel.
Warns to stay within fluid
usable temperature
range.
Recirculating
chiller control
panel
Warns of possible
equipment damage that
could be caused by
unplugging the motor
without turning off the
electrical power supply.
Warns that there is
electrical equipment
mounted on the reverse
of the panel that the label
is affixed to.
PlasmaLab 133
load lock drive
motor enclosure.
94-G-SUN-ART-077
94-G-SUN-ART-065
94-G-G-SUN-ART086
94-G-G-SUN-ART088
94-G-SUN-ART-082
94-G-SUN-ART-066
Issue 18: April 2010
Health and Safety
Page 1-22 of 24
System exterior
panel.
Printed:06 April 2010, 09:32
Health and Safety
Label
Oxford Instruments Plasma Technology
OIPT Part Number
Location
Foreline pump.
94-G-SUN-ART-076
Meaning
Warns that the pump has
been drained of oil and
that the pump should not
be operated.
94-G-SUN-ART-070
Warns that a filter gasket
must be fitted in the
indicated location.
Gas pod interior
panel.
94-G-SUN-ART-083
94-G-G-SUN-ART090
Printed:06 April 2010, 09:32
Plasmalab and Ionfab
General warning label
where a specific warning
label won’t fit.
Any hazard.
Identifies recommended
location for fork lifting.
System frame.
Health and Safety
Page 1-23 of 24
Issue 18: April 2010
Plasmalab and Ionfab
Oxford Instruments Plasma Technology
Health and Safety
NOTES:
Issue 18: April 2010
Health and Safety
Page 1-24 of 24
Printed:06 April 2010, 09:32
System Manual
O
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
p&Eacute;&ecirc;&icirc;&aacute;&Aring;&Eacute;&euml;=E^iaF=
2 Services (ALD) ............................................................................................................ 2-1
2.1 Introduction....................................................................................................... 2-2
2.2 Services .............................................................................................................. 2-3
2.3 Distribution and use of Nitrogen vent............................................................ 2-3
2.3.1 Check valve .................................................................................................................2-3
Fig 2-1: G-SP71B29663 OpAL Services flow diagram....................................................................2-4
Fig 2-2: Hoist pneumatic circuit ....................................................................................................2-4
Printed: 5-Oct-07, 9:30
Services
Page 2-1 of 4
Issue 1: August 07
l&eacute;^i
OKN
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
System Manual
f&aring;&iacute;&ecirc;&ccedil;&Ccedil;&igrave;&Aring;&iacute;&aacute;&ccedil;&aring;=
The services requirements for l&eacute;^i are given in two appendices to this manual:
Appendix S
Services Specifications for l&eacute;^i Systems. This document gives generic
information and mandatory requirements for all services.
Appendix IDS
l&eacute;^i Installation Data Sheets. This document gives the information
necessary to prepare the environment for the l&eacute;^i. Services information
includes electrical power consumption and cooling water flow rates.
References are made to the relevant mandatory services requirements,
listed in ‘Services Specifications for l&eacute;^i Systems’ (see Appendix S).
A Services flow diagram of the l&eacute;^i=system is given in drawing G-SP71B29663. This drawing
is located in Volume 2 of this manual. An Illustration of this drawing is also given at the rear
of this section, but be aware that this may not be up-to-date.
Issue 1: August 07
Services
Page 2-2 of 4
Printed: 5-Oct-07, 9:30
System Manual
OKO
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
p&Eacute;&ecirc;&icirc;&aacute;&Aring;&Eacute;&euml;=
For details of the services required, services panel, etc, refer to Appendix IDS.
OKP
a&aacute;&euml;&iacute;&ecirc;&aacute;&Auml;&igrave;&iacute;&aacute;&ccedil;&aring;=~&aring;&Ccedil;=&igrave;&euml;&Eacute;=&ccedil;&Ntilde;=k&aacute;&iacute;&ecirc;&ccedil;&Ouml;&Eacute;&aring;=&icirc;&Eacute;&aring;&iacute;==
Nitrogen (N2)is supplied to the system via the services panel to allow the process chamber and
foreline to be filled during system venting. The N2 distribution circuit is shown in the services
flow diagram; see the following paragraph.
Services flow diagrams of the l&eacute;^i=system is given in drawing G-SP71B29663. This drawing is
located in Volume 2 of this manual. Illustrations of this drawing is also given at the rear of
this Section.
Nitrogen enters the system at the services panel through a &frac14;” Swagelok bulkhead connector.
It is then fed to a regulator and pressure gauge (located behind a panel to prevent
unauthorized adjustment) via a stainless steel pipe. The outlet pressure of the regulator can
be manually adjusted. To set up the outlet pressure of the regulator, refer to ‘Operator
Adjustments’ in Section 5.
The outlet from the regulator is connected to:
OKPKN
a)
A check valve (over-pressure relief valve).
b)
The process chamber vent line.
`&Uuml;&Eacute;&Aring;&acirc;=&icirc;~&auml;&icirc;&Eacute;=
The check valve is installed to limit the maximum pressure that the regulator can supply. The
valve is normally closed and will open at pressures above 5 psi. The outlet of the check valve is
fed to the air out connector on the services panel to allow any excess nitrogen to be piped
out of the cleanroom if required.
WARNING
IN A NORMALLY VENTED ROOM, THERE IS A LOW RISK OF
ASPHYXIA DUE TO VENT GAS DISPLACING AIR.
USERS SHOULD MAKE THEIR OWN RISK ASSESSMENT.
DO NOT REMOVE THE CHECK VALVE OR CAP THE AIR OUT
CONNECTOR; THIS WOULD COMPROMISE A SYSTEM SAFETY
FEATURE.
Process chamber vent line
The process chamber vent line supplies nitrogen to the process chamber during the venting
sequence via a restrictor and chamber vent valve. The chamber vent valve is pneumatically
controlled by the system software.
Printed: 5-Oct-07, 9:30
Services
Page 2-3 of 4
Issue 1: August 07
l&eacute;^i
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
System Manual
Fig 2-1: G-SP71B29663 OpAL Services flow diagram
Fig 2-2: Hoist pneumatic circuit
Issue 1: August 07
Services
Page 2-4 of 4
Printed: 5-Oct-07, 9:30
System Manual
3
Oxford Instruments Plasma Technology
OpAL
Description
3
Description ...................................................................................................... 3-1
3.1
Introduction .............................................................................................. 3-3
3.2
System component locations...................................................................... 3-4
3.2.1 Console/base unit mechanical assembly ..................................................3-4
3.2.2 System views ...........................................................................................3-5
3.3
Hoist assembly ........................................................................................ 3-10
3.4
Control system ........................................................................................ 3-13
3.4.1 PC 2000 Hardware and software with licence .........................................3-13
3.4.2 System controller...................................................................................3-13
3.4.3 Control PLC (ALD valves)........................................................................3-15
3.4.4 Heating .................................................................................................3-16
3.4.4.1 Heater PLC ....................................................................................3-18
3.5
Controls and indicators............................................................................ 3-19
3.5.1 Base unit ...............................................................................................3-19
3.5.2 Precursor cabinet control panel..............................................................3-20
3.6
Emergency off and Interlock facilities....................................................... 3-20
3.6.1 Emergency off switch.............................................................................3-20
3.6.2 PLC interlock chain ................................................................................3-21
3.6.2.1 General description .......................................................................3-21
3.6.2.2 Gas pod interlocks ........................................................................3-23
3.6.2.3 Incompatible gases .......................................................................3-23
3.6.2.4 System Link Configuration Table ...................................................3-24
3.6.2.5 System LED Monitoring Table ........................................................3-24
3.7
Process chamber...................................................................................... 3-25
3.7.1 Upper chamber configuration for plasma ALD........................................3-26
3.7.2 Upper chamber configuration for thermal ALD .......................................3-28
3.7.3 Lower chamber configuration for plasma and thermal ALD ....................3-29
3.8
Lower Electrode ....................................................................................... 3-30
3.9
Vacuum system ....................................................................................... 3-31
3.10 System power supply ............................................................................... 3-32
3.11 94-100-6-46 ICP 65 source .................................................................... 3-33
3.12 Gas handling ........................................................................................... 3-35
3.12.1 Standard non-toxic gas line.................................................................3-35
3.12.2 Standard toxic gas line ........................................................................3-36
3.12.3 Internal gas pod ..................................................................................3-38
3.12.4 8-line gas pod.....................................................................................3-39
3.13 Precursor................................................................................................. 3-41
3.13.1 Water delivery......................................................................................3-43
3.13.2 Precursor Cabinet ................................................................................3-43
3.13.3 Precursor manufacturers......................................................................3-44
3.13.4 Bubbler connections ............................................................................3-45
3.13.5 Precursor consumption ........................................................................3-45
3.14 Glove box ................................................................................................ 3-46
3.15 Residual gas analyser............................................................................... 3-46
Fig 3-1: System frame..................................................................................................3-4
Fig 3-2: System front view ...........................................................................................3-5
Fig 3-3: System front view – front panel removed.........................................................3-6
Fig 3-4: Rear view of system ........................................................................................3-6
Fig 3-5: Console rear view (part) ..................................................................................3-7
Fig 3-6: Console left-hand side view............................................................................3-7
Fig 3-7: Console top front view....................................................................................3-8
Fig 3-8: Nitrogen vent line ...........................................................................................3-8
Fig 3-9: Console right-hand view.................................................................................3-9
Fig 3-10: Console right- hand view (door open)...........................................................3-9
Printed: 07 August 2009 07:42
Description
Page 3-1 of 46
Issue 1: August 07
OpAL
Oxford Instruments Plasma Technology
System Manual
Fig 3-11: Console left hand view showing hoist control valves ................................... 3-10
Fig 3-12: Typical hoist assembly ............................................................................... 3-11
Fig 3-13: Hoist pneumatic circuit .............................................................................. 3-12
Fig 3-14: Typical control system................................................................................ 3-14
Fig 3-15: Control plc ................................................................................................. 3-15
Fig 3-16: Temperature zones .................................................................................... 3-16
Fig 3-17: Heater Presets page.................................................................................... 3-17
Fig 3-18: Heater plc .................................................................................................. 3-18
Fig 3-19: Controls and indicators .............................................................................. 3-19
Fig 3-20: Precursor cabinet control panel .................................................................. 3-20
Fig 3-21: Gas pod interlock chain.............................................................................. 3-23
Fig 3-22: Typical ALD configuration .......................................................................... 3-25
Fig 3-23: Upper chamber configuration for plasma ALD ........................................... 3-27
Fig 3-24: Upper chamber configuration for thermal ALD........................................... 3-28
Fig 3-25: Lower chamber configuration for both thermal and plasma ALD ................ 3-29
Fig 3-26: Lower electrode.......................................................................................... 3-30
Fig 3-27: Vacuum system .......................................................................................... 3-31
Fig 3-28: Typical power distribution unit (cover removed) ......................................... 3-32
Fig 3-29: ICP 65 source ............................................................................................. 3-34
Fig 3-30: 94-81-9-11 Standard non-toxic gas line................................................... 3-36
Fig 3-31: 94-81-9-21 Standard toxic gas line .......................................................... 3-37
Fig 3-32: Typical 8-line gas pod................................................................................ 3-40
Fig 3-33: Precursor delivery layout in OpAL ............................................................... 3-42
Fig 3-34: Precursor arrangement inside cabinet......................................................... 3-43
Fig 3-35: Requirements for connecting bubblers ....................................................... 3-45
Fig 3-36: Glove box................................................................................................... 3-46
Table 3-1: Temperature zones .................................................................................. 3-16
Table 3-2: RF enable interlock chain details............................................................... 3-22
Table 3-3: Incompatible gases................................................................................... 3-23
Table 3-4: System link configuration ......................................................................... 3-24
Table 3-5: System LED monitoring............................................................................. 3-24
Table 3-6: Precursor manufacturers .......................................................................... 3-44
Table 3-7: Recommended precursor quantities.......................................................... 3-45
Issue 1: August 07
Description
Page 3-2 of 46
Printed: 07 August 2009 07:42
System Manual
3.1
Oxford Instruments Plasma Technology
OpAL
Introduction
The OpAL system is an Atomic Layer Deposition (ALD) system, which can be configured to
carry out thermal (ALD) and plasma enhanced (PEALD).
A large range of options is available to precisely tailor the system to the customer's
requirements.
The OpAL system is supplied in a two-console configuration sharing various system
components.
A stainless steel cabinet with removable access panels encloses the mechanical and
electronic components of the system and provides a support for the processing chamber.
Pumps such as the rotary vane pump are mounted separately from the main console
cabinet. Precursors are housed inside an extractable enclosure bolted to the main
console.
The upper chamber and integral inductively coupled plasma components are raised and
rotated clear of the chamber base and substrate table by a pneumatic hoist mechanism.
This provides access to the table for loading and removal of substrates. The hoist is, for
safety considerations, operated by pressing two buttons simultaneously.
The lower aluminium chamber is sited on PEEK standoffs from the frame. The CM gauge
and N2 vent are fitted to the pumping elbow which is fitted to the lower chamber. Process
gases including ALD precursors are supplied to the substrate via channels in the two
halves of the chamber.
The substrate table is made of aluminium for temperatures up to 400&ordm;C.
Printed: 07 August 2009 07:42
Description
Page 3-3 of 46
Issue 1: August 07
OpAL
3.2
Oxford Instruments Plasma Technology
System Manual
System component locations
This sub-section contains illustrations of the OpAL console showing the locations of major system
components.
3.2.1
Console/base unit mechanical assembly
The system console/base unit is shown in Fig 3-1 (based on drawing G-MA71A30090).
The unit comprises two major frames:
Main frame – houses all system components, e.g. services panel, power box, control
panel, etc.
Precursor unit frame – houses all precursor components, e.g. control panel, valves,
pipework, etc.
Services
panel
Main frame
Precursor
unit frame
Fig 3-1: System frame
Issue 1: August 07
Description
Page 3-4 of 46
Printed: 07 August 2009 07:42
System Manual
3.2.2
Oxford Instruments Plasma Technology
OpAL
System views
The following illustrations show various views of the system.
Heat shield
Process Chamber
Control panel
Precursor Cabinet
EMO
Precursor bypass
valves control
Fig 3-2: System front view
Printed: 07 August 2009 07:42
Description
Page 3-5 of 46
Issue 1: August 07
OpAL
System Manual
Oxford Instruments Plasma Technology
Hoist
PLC valve
control module
PLC temperature
control module
Relays
Fig 3-3: System front view – front panel removed
Pumping port
Panel for mounting
internal CAN (not shown)
Extraction port
Services panel
(Gas, water ,nitrogen,
compressed air,
connectors)
Arcnet serial
communications
connector for PC
Power box
Fig 3-4: Rear view of system
Issue 1: August 07
Description
Page 3-6 of 46
Printed: 07 August 2009 07:42
System Manual
Oxford Instruments Plasma Technology
Lower electrode
support flange
OpAL
Water delivery
ALD valves
heater jacket
VAC stat
Hoist
Gate Valve
Pumping
pipework
ALD valve
Water flow switch
Purge and
Bubbler MFC
Internal CAN module
N2 ven t valve
Fig 3-5: Console rear view (part)
Gate valve
Pumping port
Water vapour delivery
ALD valves
heated
Extraction
port
Water pot
Purge and bubbler
MFC's
Hoist
PLC Interface PLC
Power box
Fig 3-6: Console left-hand side view
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Description
Page 3-7 of 46
Issue 1: August 07
OpAL
System Manual
Oxford Instruments Plasma Technology
Dual valve
heater jacket
On/Off
button
Hoist
N2 vent
supply
Water
pot
Fig 3-7: Console top front view
Fig 3-8: Nitrogen vent line
Issue 1: August 07
Description
Page 3-8 of 46
Printed: 07 August 2009 07:42
System Manual
Oxford Instruments Plasma Technology
OpAL
ALD valves
mounted behind panel
Precursor cabinet
door
Fig 3-9: Console right-hand view
ALD valves
Precursor 2
Precursor 4
Precursor 3
Fig 3-10: Console right- hand view (door open)
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Description
Page 3-9 of 46
Issue 1: August 07
OpAL
Oxford Instruments Plasma Technology
System Manual
Hoist
control valves
Interface PCB
Fig 3-11: Console left hand view showing hoist control valves
3.3
Hoist assembly
The hoist assembly, shown in Fig 3-12, raises and rotates the upper chamber to provide
access to the lower chamber and table for wafer handling. The hoist’s pneumatic circuit is
shown in Fig 3-13.
Issue 1: August 07
Description
Page 3-10 of 46
Printed: 07 August 2009 07:42
System Manual
Oxford Instruments Plasma Technology
OpAL
Hoist tube
Hoist block
Cam tube
assembly
Pneumatic
cylinder
Thrust
bearing
Rod end
Fig 3-12: Typical hoist assembly
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Description
Page 3-11 of 46
Issue 1: August 07
OpAL
Oxford Instruments Plasma Technology
System Manual
Fig 3-13: Hoist pneumatic circuit
Issue 1: August 07
Description
Page 3-12 of 46
Printed: 07 August 2009 07:42
System Manual
3.4
Oxford Instruments Plasma Technology
OpAL
Control system
The system is controlled by a dedicated Personal Computer (PC) linked to a
Programmable Logic Controller (PLC), housed in the system console.
The PC, located adjacent to the system console, runs the OIPT PC 2000 software, which
provides a user interface in the Microsoft Windows environment.
3.4.1
PC 2000 Hardware and software with licence
Hardware
The system is controlled and monitored by a Pentium™ PC comprising base unit,
keyboard, mouse, 3.5&quot; floppy disk drive, CD-ROM drive and colour monitor. The PC runs
a Windows operating system and communicates with the OpAL via an Arcnet
communications link.
PC 2000 software and single-user licence
The PC 2000 control software runs as a Windows-based application allowing multiple
levels of system control: SYSTEMS MANAGER, SYSTEMS ENGINEER, PROCESS DEVELOPER,
MAINTENANCE ENGINEER, PROCESS EDITOR and OPERATOR, all of which are accessed by
password entry.
The system status is displayed on graphic mimic diagrams with all operational parameters
and status displays accessible through pop-up windows selected using the mouse. All the
major process parameters are accessible from the recipe and process step set-up pages,
including definition of gases on each line and calculation of mass flow settings in sccm's.
The software includes data logging to disk of run-time process parameters for off-line
verification and analysis of process conditions.
Processing recipes can be formulated and stored in the computer and the system can be
run in fully automatic mode using the recipes. Alternatively, the system can be run in the
manual mode with each phase of the process controlled and initiated separately. All the
parameters can be monitored in real time using the PC 2000 software. Processing recipes
can be formulated and stored in the computer and the system can be run in fully
automatic mode using the recipes. Alternatively, the system can be run in the manual
mode with each phase of the process controlled and initiated separately. All the
parameters can be monitored in real time using the PC 2000 software.
3.4.2
System controller
The system is controlled from a remote IBM compatible PC computer terminal using
Oxford Instruments Plasma Technology's 'PC 2000' software via a Programmable Logic
Controller (PLC) housed in the base unit. See Fig 3-14.
Communications between the PC and PLC are via an Arcnet serial link and between the
PLC interface PCB and the Controller Area Network (CAN) modules are via a CAN bus.
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Description
Page 3-13 of 46
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System Manual
Oxford Instruments Plasma Technology
PERSONAL
COMPUTER
RUNNING
'PC 2000‘
SOFTWARE
IINTERFACE PCB DISCRETE
CONTROL &amp; STATUS SIGNALS
GAS POD
Gas flows
CAN PCB (Gas lines 1-4)
END POINT
Gas valve control
SERIAL DIGITAL
COMMUNICATIONS
CAN PCB (Gas lines 5-8)
(If fitted)
CM PRESSURE GAUGE
WATER FLOW SWITCH INTERLOCKS
Gas flows
HEATER CONTROLLER
Gas valve control
PENNING/PIRANI PRESSURE GAUGE
LF GENERATOR
Gas flows
CAN PCB (Gas lines 9-12)
Gas valve control
(If fitted)
TURBO CONTROLLER
RF GENERATOR
CHAMBER VENT VALVE
PLC
TURBO PURGE VALVE
INTERFACE
PCB
ROUGHING VALVE
TURBO BACKING VALVE
CM GAUGE ISOLATION VALVE
GATE VALVE
CHAMBER LID INTERLOCK
VACSTAT (CHAMBER)
CHAMBER THERMOCOUPLE
GENERATOR INTERLOCK
Discrete
analogue/digital
signal control
circuits
CAN bus control
circuits
EMO BUTTON IN
PUMPS
AUDIBLE WARNING (BUZZER) IF FITTED
CAN PCB (VAT variable)
Adaptive Pressure Controller
control
CAN PCB (A)
Signal tower lights control
(Red/Orange/Green) if fitted
= CAN bus
= Discrete Analogue/Digital
signals
Fig 3-14: Typical control system
The system may be run from the PC terminal in manual mode, that is using direct 'real
time' control over the process, or in automatic mode where the system performs the
entire process according to previously entered recipes. The extensive Oxford Instruments
Plasma Technology process library supports all OpAL configurations. A full description of
the 'PC 2000' control instructions is provided in Section 5.
For details of the control wiring, see the relevant drawings in Volume 2 of this manual.
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3.4.3
Oxford Instruments Plasma Technology
OpAL
Control PLC (ALD valves)
The control PLC, shown in Fig 3-15 provides control of the ALD valves. The PLC
incorporates a fast microprocessor.
B&amp;R Analogue output
card (two channels)
PLC Base
unit
B&amp;R Analogue input
card (four channels)
Pc2003 Digital I/O
IDC
Compact
flash card
CAN
Interface
PLC
Connector
CPU
Analogue
PCB
Fig 3-15: Control plc
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Description
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Issue 1: August 07
OpAL
3.4.4
System Manual
Oxford Instruments Plasma Technology
Heating
The management of condensation and decomposition in OpAL is achieved by dedicated
temperature control of individual components. Up to 16 temperature zones are available
as shown in Fig 3-16 and Table 3-1. Temperature is controlled using PID.
ICP
Gate Valve
Zone 1
Services panel
Zone 2
Gate
Valve
Zone 4
External pumping
Zone 3
4 x 0.5 m lengths
Precursor 4
Zones 12,13,14
Precursor 3
Zones 9, 10,11
Precursor 1
Reserved for water
Precursor 2
Zone 5
Zones 6, 7, 8
Fig 3-16: Temperature zones
Zone
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Name
Upper Chamber
Lower Chamber
Internal pumping
External pumping
P1 –Water Z3 (dual valve)
P2Z1 (source pot)
P2Z2(intermediate)
P2Z3(dual valve)
P3Z1(source pot)
P3Z2(intermediate)
P3Z3(dual valve)
P4Z1(source pot)
P4Z2(intermediate)
P4Z3(dual valve)
ICP Gate Valve
Spare
Temp Range (deg C)
20 - 180
20 - 180
20 - 120
20 -120
20 - 200
20 - 200
20 - 200
20 - 200
20 - 200
20 - 200
20 - 200
20 - 200
20 - 200
20 - 200
20 - 120
20 - 200
Power (Watts)
2000
2000
75
4 x75
84
87
74
84
87
74
84
87
74
84
162
Snap switch
200 &plusmn; 10
200 &plusmn; 10
160 &plusmn; 10
160 &plusmn; 10
220 &plusmn; 10
220 &plusmn; 10
220 &plusmn; 10
220 &plusmn; 10
220 &plusmn; 10
220 &plusmn; 10
220 &plusmn; 10
220 &plusmn; 10
220 &plusmn; 10
220 &plusmn; 10
160 &plusmn; 10
220 &plusmn; 10
Table 3-1: Temperature zones
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Oxford Instruments Plasma Technology
OpAL
The heater zones are controlled from the PC 2000 software; a typical heater presets page
is shown in Fig 3-17.
Fig 3-17: Heater Presets page
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OpAL
3.4.4.1
System Manual
Oxford Instruments Plasma Technology
Heater PLC
The heater PLC, shown in Fig 3-18, controls all heaters except the grounded electrode.
The PLC incorporates a dedicated PID, which can control up to 16 temperature zones.
PC 2003
Base Unit
2003 Analog input
module
B&amp;R 3-slot
backplane 2003
PC 2003 DIG I/O
card
CANBUS
connector
Fig 3-18: Heater plc
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Description
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Oxford Instruments Plasma Technology
3.5
Controls and indicators
3.5.1
Base unit
OpAL
The controls and indicators are mounted on the front of the unit as shown in Fig 3-19.
Fig 3-19: Controls and indicators
The controls and indicators comprise:
Chamber Hoist buttons and
up/down selection switch:
These controls raise and lower the chamber top to
allow access to the chamber interior. To raise or
lower the chamber top, the up/down selection switch
is set to the required position, then both chamber
hoist buttons are pressed.
Emergency Off (EMO) button:
When pressed, the system is shut down. See subsection 3.6.1 for details.
Power On indicator:
Indicates that 3-phase electrical power is connected
to the machine.
System On indicator:
Indicates that the system is powered up.
System On button:
Switches the system power on.
System Off button:
Switches the system power off.
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OpAL
3.5.2
Oxford Instruments Plasma Technology
System Manual
Precursor cabinet control panel
The control panel, shown in Fig 3-20, controls the bypass valves and N2 purge gas
during the installation and removal of precursor pots. Each switch is lockable, requiring a
key to operate it.
Fig 3-20: Precursor cabinet control panel
3.6
Emergency off and Interlock facilities
Emergency off (EMO) and interlock facilities are provided to shut down the machine in an
emergency and to prevent processing until the system is fully prepared. The functions of
these facilities are described in the following sub-sections. Note that the circuit
implementation of these facilities is fully described in Section 7 as an aid to
troubleshooting.
3.6.1
Emergency off switch
An emergency off switch, with normally-closed contacts, is mounted on top of the
console. The switch is activated by pressing a 40 mm diameter red 'Emergency Off'
button.
When the switch is activated, its contacts open removing the 24V dc EMO supply to the
main input contactor, thus shutting down the entire machine.
An external EMO facility is provided at SK7 located on the power distribution unit. This
allows normally-closed contacts of external equipment (e.g. remote EMO switches,
exhaust scrubbers etc.) to be connected in series with the machine’s EMO switch. If this
facility is not used, pins D &amp; A in SK7 must be shorted out by a link.
To reset the machine after EMO activation, refer to the procedure given in Section 5.
IMPORTANT
Where the rotary vane pump is powered from a mains supply separate from the OpAL
system, a separate 'Emergency Off' facility must be provided by the customer.
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Oxford Instruments Plasma Technology
3.6.2
PLC interlock chain
3.6.2.1
General description
OpAL
The interlocks form a continuous 24Vdc chain, which must be complete before the
process gases and RF power supplies are enabled. An output to disable external devices
unless the lid/ hoist is closed is also provided; this is typically used to disable a lidmounted endpoint detector laser.
The interlock chain is monitored by the software, but acts independently. It is also
supplemented by machine protection sensors, which operate only via the software.
No ALD gases or processes will be run if the heaters are not in tolerance.
To enable RF power:






The 600 mbar vacuum switch (‘Vacstat’) must be at low pressure
The process chamber lid must be shut (or its hoist down)
The primary process pump must be running
The primary process pressure gauge (normally a capacitance manometer) must be
on scale
Customer-supplied external alarm devices must be in their safe state
The inert gas purge to the primary process pump must be flowing.
To enable process gases:



RF power must be enabled
The gas box lid must be shut
Specific gases can be set in the gas box hardware to be mutually exclusive, so that
they cannot be turned on together.
To enable delivery of ALD gases:








The 600 mbar vacuum switch (‘Vacstat’) must be at low pressure
Pressure in chamber at base pressure
The process chamber lid must be shut (or its hoist down)
The precursor cabinet door is shut
The primary process pump must be running
The primary process pressure gauge (normally a capacitance manometer) must be
on scale
Customer-supplied external alarm devices must be in their safe state
The inert gas purge to the primary process pump must be flowing.
Machine protections fitted where appropriate:


A nitrogen flow meter, to detect purge gas flow to pump bearings.
Water flow switch/es.
RF enable interlock chain details are given in Table 3-2; Refer to drawing SE00A26865
(PC2003 interface schematic).
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OpAL
System Manual
Oxford Instruments Plasma Technology
DEVICE
Vacuum Switch
PCB
input
BLK17
PCB1
LED
11
NONE
Pressure below 600 mBar
a)
BLK18
12
NONE
Lid closed or hoist down. Enables
end point laser via JP51
BLK19
13
JP44
6
15
Interlock disabled if an
independent/dry pump fitted
Capacitance
Manometer (e.g.
Baratron™)
JP16
5
NONE
Analogue input below 11.5V.
Switches comparator U5.
External Voltage Free
contact or 24V DC
input to PCB
JP52
14
External Voltage Free
contact
JP53
15
Can be
bypassed
using
LK19
20
Customer-supplied device. Volt
free contact JP52 pins 1 and 4.
OR
24V DC input JP52 pin 4.
Customer-supplied device
INTERLOCK
Vacuum
Switch
Hoist /Lid
or
Air cylinder
switch/microswitc
h
b)
Guardmaster
Switch N/O Switch
Current monitor in
Power Box
Primary
pump
running
Process
pressure
gauge on
scale
Spare
interlock 1
Spare
interlock 2
Link out
Or
Comments
Or
Load lock
valve
Process
pump purge
Inter-chamber valve
must be shut
Gas Flow Switch at
Primary Pump
Used on 100 and 133 systems
JP55
16
LK21A
Fit LK21B if fitted
Table 3-2: RF enable interlock chain details
If above satisfied, then 24V is at BLK20, 21 &amp; 22 pin 1. This enables the K4 contactor to
supply power to the RF Generator.
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3.6.2.2
Oxford Instruments Plasma Technology
OpAL
Gas pod interlocks
Refer to drawing: 94-SE81B26657 (PC2003 gas pod loom).
To enable process gases, the RF interlock chain must be complete. The gas pod interlock
is shown in Fig 3-21.
SYSTEM CONSOLE
PCB 94-PC00S26866
BLK
20
24VDC
1
GAS BOX
REAR SERVICES
PANEL
SKT25W
PIN4
PL25W
PIN4
SERVICES
PANEL
SKT25W PL24W
PIN4
PIN4
PCB 94-PC81S26655
JP6
PIN1
JP6
PIN2
LID
SWITCH
JP6
PIN3
Via JP3 to CAN unit
controlling gases 1 - 4.
See NOTE.
NOTE: The function of the signal is to supply
24Vdc power to the digital outputs of
the CAN unit. The interlock continues
through idendical boards (where fitted)
which drive gases 5 - 8 and 9 - 12.
Fig 3-21: Gas pod interlock chain
3.6.2.3
1st Gas
2nd Gas
3rd Gas
4th Gas
Incompatible gases
2nd PCB Gas 3rd PCB Gas
1st PCB Gas
1
5
9
2
6
10
3
7
11
4
8
12
Gases are designated as one of three types:
Type A
LK3A + 4
LK5A + 6
LK7A + 8
LK9A + 10
Type B
LK3B
LK5B
LK7B
LK9B
Type X
LK3A
LK5A
LK7A
LK9A
Gas type A: Typically oxidising gases (e.g. oxygen)
Gas type B: Typically fuel gases (e.g. hydrogen)
Gas type X: Gases normally miscible with most other gas types.
If ANY gas Type A is enabled, then ALL gas Type B lines are disabled.
Table 3-3: Incompatible gases
The gas pod has a facility to prevent incompatible gases from being enabled
simultaneously, using soldered links.
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OpAL
3.6.2.4
System Manual
Oxford Instruments Plasma Technology
System Link Configuration Table
NAME
LK1
LK2
LK3
LK4
LK5
LK6 A/B
LK7 A/B
LK8
LK9
LK10
LK11
LK12
LK13
LK14 A/B
LK15
LK16
LK17
LK18
LK19
LK20
LK21 A/B
FUNCTION
ANALOGUE 0V TO CHASSIS
DIGITAL 0V TO ANALOGUE 0V
NON – CONTROLLER CRYO ENABLE
HEATER SNAP SWITCH BYPASS
FIT IF NO OEM CONTROLLER
LK6A = NON PM140 ENDPOINT
LK6B = PM140 ENDPOINT
LK7A = NON PM140 ENDPOINT
LK7B = PM140 ENDPOINT
+24V DC TO RL2 COM1
+24V DC TO RL2 COM2
+24V DC TO RL6 COM1
+24V DC TO RL6 COM2
+24V DC TO RL7 COM1
+24V DC TO RL7 COM2
LK14A = NON DRY PUMP FITTED
LK14B = DRY PUMP FITTED
PUMP CURRENT BYPASS
+24V DC TO RL8 COM2
NON – CONTROLLER HEATER ALARM
NON – CONTROLLER HEATER ENABLE
SPARE INT/LOCK 1 BYPASS
NOT FITTED 100/133
SPARE INT/LOCK 2 BYPASS
LK21A = PURGE SWITCH NOT FITTED
LK21B = PURGE SWITCH FITTED
NOTES
SEE LK7 A/B
SEE LK 6 A/B
Table 3-4: System link configuration
3.6.2.5
System LED Monitoring Table
NAME
LED1
LED2
LED3
LED4
LED5
LED6
LED7
LED8
LED9
LED10
LED11
LED12
LED13
LED14
LED15
LED16
LED17
COLOUR
GREEN
RED
YELLOW
GREEN
RED
RED
RED
RED
RED
RED
RED
RED
RED
RED
RED
RED
RED
MONITORING
+24V DC
+15V DC
-15V DC
+5V DC
CM COMP OK
PUMP CURRENT SWITCH
N2 PRESSURE SWITCH
WATER ONE
WATER TWO
WATER THREE
VAC STAT
RL10 (HOIST CONTROL)
HOIST
SPARE INTERLOCK 1
SPARE INTERLOCK 2
PUMP PURGE SWITCH
RL15 (MASTER/SLAVE) ACTIVE SLAVE
Table 3-5: System LED monitoring
Note that when the interlock chain is complete, all LEDs are illuminated.
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System Manual
3.7
Oxford Instruments Plasma Technology
OpAL
Process chamber
The chamber arrangement is shown in Figs 3-18 to Fig 3-21. The processing chamber is
fitted with liners to minimize deposition on the chamber walls. The liners can be removed
for maintenance.
Fig 3-22: Typical ALD configuration
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OpAL
3.7.1
Oxford Instruments Plasma Technology
System Manual
Upper chamber configuration for plasma ALD
The upper chamber configuration for ALD is shown in Fig 3-23 (based on drawing GMA71A30690).
This configuration comprises the following major components:
Automatic Matching Unit (AMU) – matches the impedance from the RF generator to the
ICP 65 ion source to ensure maximum power transfer.
ICP 65 ion source. – produces a plasma for the process chamber.
Fast gate valve – when required, isolates the ICP 65 ion source from the process chamber.
The valve is heated by a heater jacket.
Process chamber top – forms the upper half of the process chamber and when lowered
onto the lower chamber provides a vacuum-tight process chamber. Sealing is provided by
integral O rings. Apertures are provided for the following:
Plasma head – ICP 65.
Two blanked view ports – each can be used as a view port or to mount an end point
detection device.
Process gas line inlet.
Purge gas line inlet.
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Oxford Instruments Plasma Technology
OpAL
Automatic Matching
Unit (AMU)
Top electrode
(ICP 65)
Heater jacket
for fast gate
valve
Centering
ring
O ring
Fast gate
valve
O ring
Adapter
flange
Process gas
line
O ring
Plasma head
liner
Blank view port
components
Clamping
components
Purge gas
line
Process
chamber
top
Blank view
port
Fig 3-23: Upper chamber configuration for plasma ALD
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OpAL
3.7.2
System Manual
Oxford Instruments Plasma Technology
Upper chamber configuration for thermal ALD
The upper chamber configuration for thermal ALD is shown in Fig 3-24 (based on
drawing G-MA71A29920).
This configuration comprises the following major components:
Chamber top cover incorporating a process gas inlet.
Process chamber top – forms the upper half of the process chamber and when lowered
onto the lower chamber provides a vacuum-tight process chamber. Sealing is provided by
integral O rings. Apertures are provided for the following:
Two blanked view ports – each can be used as a view port or to mount an end point
detection device.
Process gas line inlet.
Process gas valve
(if fitted)
Clamping
components
Gas port assembly
O ring
Centering ring
Chamber top cover
(thermal)
Clamping
components
O ring
Process
chamber top
Liner disk
Blank view port
components
Fig 3-24: Upper chamber configuration for thermal ALD
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3.7.3
Oxford Instruments Plasma Technology
OpAL
Lower chamber configuration for plasma and thermal ALD
The lower chamber configuration for plasma and thermal ALD is shown in Fig 3-25
(based on drawing MA71A29232).
Lower chamber
liner
Heater
cartridge
Lower process
chamber
Thermo
Switch
O ring
Mounting
flange
Water in
for flange
cooling
Water out
for flange
Heater cooling
legs
Thermocouple
leg
O ring
Adapter flange
(pumping line)
Fig 3-25: Lower chamber configuration for both thermal and plasma ALD
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OpAL
3.8
System Manual
Oxford Instruments Plasma Technology
Lower Electrode
The lower electrode is shown in Fig 3-26. The electrode is grounded inside the chamber.
A flange with allowance for the electrode heater legs and thermocouple leg is fitted to the
underside of the chamber. The flange may be water cooled to provide protection to the
‘O’ ring seals. Cooling is achieved by water flowing in channels within the flange.
Lower Electrode
(400&deg; C)
Mounting
bracket
(3-off)
Heater
legs
Thermocouple
Fig 3-26: Lower electrode
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Description
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3.9
Oxford Instruments Plasma Technology
OpAL
Vacuum system
A typical vacuum schematic for the process chamber, using a 63m3/hr rotary with 2
metres of NW40 flexible stainless steel tubing, is shown in Fig 3-27. The gate valves and
isolation valves associated with the pumping systems are pneumatically operated.
The process chamber pressure is monitored by a 1-Torr capacitance manometer gauge.
Pressure control is achieved by flowing inert gas using a mass flow controller controlled
by PC 2000 via the Programmable Logic Controller (PLC).
Fig 3-27: Vacuum system
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OpAL
3.10
Oxford Instruments Plasma Technology
System Manual
System power supply
The Power Distribution Unit, shown in Fig 3-28, is located at the rear of the unit. It
houses circuit breakers and transformers (&plusmn;15 volt DC and 24 volt DC supplies). The
main power supply cable gland and sockets for rotary pumps and auxiliary EMO
connection are mounted on the unit. Fuses for the 24 volt and &plusmn;15 volt supplies are also
accessible externally.
For circuit details, refer to the Power Distribution Unit circuit diagram in Volume 2 of this
manual.
Fig 3-28: Typical power distribution unit (cover removed)
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3.11
Oxford Instruments Plasma Technology
OpAL
94-100-6-46 ICP 65 source
The ICP 65 source is shown in Fig 3-29. RF power from the RF generator is fed via the
automatch unit to the RF coil to create a plasma within the insulating tube (under
vacuum). Process gas is supplied to the top of the insulating tube and to the gas ring
located within the process chamber. The screening box cover incorporates a NW40
pumping port to enable ozone removal. The cover is interlocked to prevent the
application of electrical / RF power whilst the cover is not in place.
WARNING
DO NOT POWER UP THE SYSTEM WITHOUT FIRST CONNECTING THE
NW40 PUMPING PORT TO AN EXTRACTION SYSTEM CAPABLE OF
PUMPING AT FIVE CUBIC METRES/HOUR.
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OpAL
Oxford Instruments Plasma Technology
System Manual
Fig 3-29: ICP 65 source
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Description
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3.12
Oxford Instruments Plasma Technology
OpAL
Gas handling
WARNING
CONTACT WITH TOXIC GASES CAN CAUSE DEATH OR SERIOUS
INJURY.
USERS SHOULD PERFORM THEIR OWN RISK ASSESSMENT OF
HAZARDOUS GASES TO BE USED ON THE SYSTEM.
BEFORE VENTING THE PROCESS CHAMBER, ALWAYS ENSURE THAT
THE SYSTEM IS ADEQUATELY PURGED AND PUMPED. SEE SUBSECTION 5.8.6.
The process gas handling system is supplied as one of two options:
a)
An internal gas “pod” which requires 2 bubbler and purge gases fitted inside
the main console and an additional 2 process gases which are fitted inside the
precursor cabinet.
b)
An 8-line gas pod. See sub-section 3.12.4, page 3-39.
Depending on the machine specification and process gases used, the gas lines fitted can
be non-toxic and/or toxic. See sub-section 3.12.1 (non-toxic) and 3.12.2 (toxic).
3.12.1
Standard non-toxic gas line
The standard non-toxic gas line is shown in Fig 3-30. All gas fittings are VCR and all
stainless steel pipework connections are welded. The ‘gas in’ tube passes into the side of
the case, protected by a grommet. A ferrite core, fitted to the ‘gas in’ tube, reduces the
susceptibility of the gas pod electronics to signals from nearby transmitting devices, e.g.
mobile phones, modems, etc.
Gas from the customer’s cylinder/regulator/filter flows into the ‘gas in’ tube to the filter.
The gas flows through the 2-&micro;m filter to the mass flow controller (MFC). The MFC
controls the flow of gas as commanded by the system controller. The gas then flows
through the pneumatically controlled outlet shut-off valve and into the gas out manifold
where it is mixed with the other process gases before flowing into the process chamber.
WARNING
IF THE SHUT-OFF VALVE IS CLOSED, IT REMAINS SHUT FOR
DIFFERENTIAL PRESSURES UP TO 5 BAR. A FAILURE UPSTREAM,
WHICH PRODUCES LINE PRESSURES ABOVE THIS, WILL NOT BE
CONTAINED. IF THIS PRODUCES A HAZARD, THE CUSTOMER IS
WARNED TO FIT ADDITIONAL PROTECTION UPSTREAM.
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System Manual
Oxford Instruments Plasma Technology
GAS OUT
MANIFOLD
OUTLET SHUT-OFF
VALVE
(PNEUMATICALLY
CONTROLLED)
MASS
FLOW
CONTROLLER
2 &micro;m FILTER
GAS LINE EXTENSION
FERRITE CORE
GROMMET
GAS IN TUBE
(STAINLESS STEEL)
Fig 3-30: 94-81-9-11 Standard non-toxic gas line
3.12.2
Standard toxic gas line
The standard toxic gas line is shown in Fig 3-31. All gas fittings are VCR and all stainless
steel pipework connections are welded. The gas in tube passes into the side of the gas
pod case, protected by a grommet.
Gas from the customer’s cylinder/regulator/filter flows into the ‘gas in’ tube to the filter.
WARNING
THE CLOSED INLET VALVE REMAINS SHUT FOR DIFFERENTIAL
PRESSURE UP TO 210 BAR. A FAILURE UPSTREAM WHICH PRODUCES
LINE PRESSURES ABOVE THIS WILL NOT BE CONTAINED. IF THIS
PRODUCES A HAZARD, THE CUSTOMER IS WARNED TO FIT
ADDITIONAL PROTECTION UPSTREAM.
With the Inlet Valve and Outlet Valve open and the Bypass Valve closed, the gas flows
through the 2 &micro;m filter to the mass flow controller (MFC). The MFC controls the flow of
gas as commanded by the system controller. The gas then flows through the outlet valve
and into the gas out manifold where it is mixed with the other process gases before
flowing into the process chamber.
With the Bypass Valve open, the gas flows through the bypass line directly to the gas out
manifold. This facility is provided to enable the toxic gas line to be evacuated by pumping
down the process chamber. This is necessary to prevent air entering the gas line and
contaminating it during a gas cylinder changeover, and to service the gas line in the event
of an MFC or filter blockage.
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Oxford Instruments Plasma Technology
OpAL
Fig 3-31: 94-81-9-21 Standard toxic gas line
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OpAL
3.12.3
System Manual
Oxford Instruments Plasma Technology
Internal gas pod
The purpose of the internal gas pod is to provide two gases dedicated for inert gas
purging and inert gas bubbling of precursors. The controls are provided from a CAN unit
sited inside the main console. A further two gases which are process gases may be
housed inside the precursor cabinet. In the unlikely event that a leak occurs in the
precursor cabinet, an extraction collar at the rear of the case enables any leaked gas to be
safely removed by a laboratory extraction system. Selection of gases and flow rates are
determined by the system controller.
The outputs from the two gas lines dedicated for purge and bubbling are fed separately
into the chamber. The two process gases housed inside the precursor cabinet are
connected to the process chamber gas line.
Pneumatically operated shut-off valves in each gas line are driven by associated SMC
valves mounted on the associated gas pod CAN PCB. Each SMC valve is powered by
compressed air and controlled by signals from the system controller.
All gas pod functions are controlled by interlocks, refer to sub-section 3.6.2.2 for details.
A gas pod cover interlock microswitch disables all gas pod functions unless the cover is
correctly fitted.
A CAN (Controller Area Network) PCB is fitted, controlling the gas lines.
The Gas Pod CAN PCB receives signals from the system controller, to control the SMC
valves, and the Mass Flow Controllers (MFC) fitted in the gas lines. For a circuit diagram of
the Gas Pod CAN PCB, refer to the electrical drawings in Volume 2 of this manual.
.
WARNING
THE CONNECTION FROM THE GAS POD MANIFOLD TO THE PROCESS
CHAMBER SHOULD NOT INCLUDE ANY SHUT OFF VALVE, UNLESS
THIS HAS BEEN CLEARED WITH OXFORD INSTRUMENTS PLASMA
TECHNOLOGY. A BLOCKAGE HERE COULD CAUSE PROCESS GASES TO
MIX AND CROSS CONTAMINATE IN THE HIGH PRESSURE GAS
DELIVERY PIPEWORK.
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3.12.4
Oxford Instruments Plasma Technology
OpAL
8-line gas pod
The purpose of the gas pod is to feed a mixture of process gases, at specified flow rates,
to the process chamber. Selection of gases and flow rates are determined by the system
controller. A ‘clean gas’ line can be incorporated to feed an etch gas mixture into the
process chamber to remove process residues.
The gas pod, shown in Fig 3-32, comprises a steel case with a folded removable cover. In
the unlikely event that a leak occurs, an extraction collar at the top of the case enables
any leaked gas to be safely removed by a laboratory extraction system. The back panel of
the case is fitted with fixing holes for wall or frame mounting.
The case incorporates stations for up to eight gas lines. The outputs from the gas lines
are fed into a common manifold, which is connected to the process chamber gas line. The
gas output manifold can be split to provide two out puts; one to the process chamber and
the other to another device, e.g. gas ring.
Pneumatically operated shut-off valves in each gas line are driven by associated SMC
valves mounted on the associated gas pod CAN PCB. Each SMC valve is powered by
compressed air and controlled by signals from the system controller.
All gas pod functions are controlled by interlocks, refer to sub-section 3.6.2.2 for details.
A gas pod cover interlock microswitch disables all gas pod functions unless the cover is
correctly fitted.
Two CAN (Controller Area Network) PCBs are fitted, each controlling four gas lines (1 – 4
and 5 – 8).
Each Gas Pod CAN PCB receives signals from the system controller, to control the SMC
valves, and the Mass Flow Controllers (MFC) fitted in the associated gas lines. For a circuit
diagram of the Gas Pod CAN PCB, refer to the electrical drawings in Volume 2 of this
manual.
A ‘clean gas’ line can be fitted in place of gas line 1.
The ‘clean gas’ line flow rate can be set either manually by a variable valve or by an MFC.
Note that the ‘clean gas’ is usually supplied from a cylinder containing the required gas
mixture. An alternative method is to mix separate gases in optional additional gas lines.
WARNING
THE CONNECTION FROM THE GAS POD MANIFOLD TO THE PROCESS
CHAMBER SHOULD NOT INCLUDE ANY SHUT OFF VALVE, UNLESS
THIS HAS BEEN CLEARED WITH OXFORD INSTRUMENTS PLASMA
TECHNOLOGY. A BLOCKAGE HERE COULD CAUSE PROCESS GASES TO
MIX AND CROSS CONTAMINATE IN THE HIGH PRESSURE GAS
DELIVERY PIPEWORK.
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Issue 1: August 07
OpAL
System Manual
Oxford Instruments Plasma Technology
100MM EXTRACTION
COLLAR
GAS POD COVER
(CUT AWAY TO SHOW
INTERNAL DETAILS)
PROCESS GAS
OUT TO CHAMBER (1)
GAS LINE 8
(IN)
GAS LINE 7
(IN)
GAS LINE 6
(IN)
GAS LINE 5
(IN)
GAS LINE 4
(IN)
GAS LINE 3
(IN)
GAS LINE 2
(IN)
GAS LINE 1
(IN)
PROCESS GAS
OUT TO CHAMBER (2)
GAS POD
CAN PCB
(GAS LINES
1-4)
CONTROL
CABLE FROM
PLC / PCB
GAS POD
CAN PCB
(GAS LINES
5-8)
GAS POD COVER
INTERLOCK MICROSWITCH
COMPRESSED
AIR IN OUT
Fig 3-32: Typical 8-line gas pod
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3.13
Oxford Instruments Plasma Technology
OpAL
Precursor
NOTE:
Different precursors can be used to deposit the same film. Where possible,
OIPT will endeavour to use novel precursors or find alternatives which are
safer to handle, use and manage in our systems.
Unless benefits are significant, OIPT is not recommending solid precursors.
A careful selection and evaluation of precursors is performed prior to the
order intake process
A precursor is a term for a source chemical which may be in a solid, liquid or gas state.
The precursors may be generally categorized as;
Gases: N2, O2, O3 (in-situ), NH3, WF6, H2, …
High Vapour Pressure (HVP): e.g. 5 –40 Torr at room temperature liquids (e.g. TMA, SiCl4,
TiCl4, H2O) and solids (e.g. W(CO)6)
Low Vapour Pressure (LVP): e.g. &lt; 0.5Torr @ RT (eg. Some metal organic Zr, Ta and Hf
precursors) and solids (e.g. TaCl5, HfCl4, ZrCl4). (Some solids may be dissolved in a
solvent and handled as liquids)
There is an additional category which is for precursors with vapour pressures between 0.5
Torr and 5 Torr. In this case, the source pot is heated to at least 20-50 deg C above
ambient to increase the vapour pressure so that there is sufficient vapour to saturate the
wafer. The delivery method will very much depend on the precursor type, both vapour
draw and bubbling may be used
The precursors are transported in vapour from source container to the chamber. In
principle, two delivery methods, bubbling and vapour draw are used to deliver precursors.
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Oxford Instruments Plasma Technology
Fig 3-33: Precursor delivery layout in OpAL
Vapour draw is used for delivering high vapour pressure chemicals, category B. This
method is used when processing at pressures &lt; vapour pressure of the source chemical
at room temperature. Bubbling is used to deliver low vapour pressure chemicals, category
C. Gases are delivered directly into the chamber.
Delivery method
Vapour draw
Vapour draw / Bubbling
Bubbling
Precursor Category
B
Intermediate between B and
C
C
Heating of source pot
No
Yes
Yes
Precursors are supplied in bubblers which are pre-fitted with two manual valves – one on
the inlet and one on the outlet side. It is imperative that during precursor selection,
correct precursor, amount (max. 100 g), bubbler types and temperature rating of the
manual valves are specified. Precursors may be purchased from Air Products, Akzo Nobel,
Epichem, Sigma Aldrich, Rohm and Haas, Strem Chemicals, etc.
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3.13.1
Oxford Instruments Plasma Technology
OpAL
Water delivery
A water pot is located inside the top console. A pipe connects the pot outlet to the
process chamber. A pair of ALD fast valves provides delivery and purging of the line.
3.13.2
Precursor Cabinet
A maximum of three ALD precursors can be fitted inside the precursor cabinet. Fig 3-34
shows the arrangement of precursors inside the cabinet. The precursor source pots are
heated using dedicated heater jackets. Two MFCs can be located inside the precursor
cabinet.
Fig 3-34: Precursor arrangement inside cabinet
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3.13.3
Oxford Instruments Plasma Technology
System Manual
Precursor manufacturers
Bubblers can be ordered from any of the major precursor manufacturers shown in the
following table.
Manufacturer
Epichem
Air Products (inc Schumacher and Akzo Nobel)
Sigma Aldrich (SAFC)
Air Liquide
Strem Chemicals
Web address
www.epichem.com
www.airproducts.com
www.sigmaaldrich.co
m
www.airliquide.com
www.strem.com
Table 3-6: Precursor manufacturers
Please note the above is not an exhaustive list as Oxford Instruments always recommends
you shop around to get the best deal on both price and delivery time, which varies
depending on the precursor you are ordering.
NOTE:
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Heater jackets are specific to the bubbler type fitted and have to be specified at
the time of order.
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3.13.4
Oxford Instruments Plasma Technology
OpAL
Bubbler connections
Bubblers with fill up to 200g can be ordered. The precursor cabinet has been designed to
take precursor source pots of maximum height 165mm and 51mm diameter as shown in
Fig 3-35. Please state when ordering the bubbler that it is for an Oxford Instruments
machine and the manufacturer should be aware of OIPT’s bubbler specifications. Please
see Fig 3-35 for details of these connections.
Alternative connection arrangements may be accommodated but must be specified well in
advance.
Fig 3-35: Requirements for connecting bubblers
NOTE:
3.13.5
For low vapour pressure compounds that will be heated above 80&deg;C, please
remember to specify high temperature compatible manual valves when
ordering a bubbler.
Precursor consumption
See Table 3-7 for recommended ordering quantities for precursors.
Quantity of precursor
50g
100g
200g
Recommended use
Researching a new material or developing a new
process and running a few samples for
measurements
Running 2-3 months of medium duty sample
work
Running 4-6 months of fairly intensive
processing
Table 3-7: Recommended precursor quantities
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3.14
System Manual
Oxford Instruments Plasma Technology
Glove box
The N2 purged glove box, shown in Fig 3-36, is located on the chamber to provide a
nitrogen environment for use against moisture and oxygen-sensitive gases.
The glove box incorporates:



a manual substrate loader
a nitrogen flow meter to regulate the flow of gas into the chamber
an extraction port.
Fig 3-36: Glove box
3.15
Residual gas analyser
An MKS Vision 1000-C residual gas analyser (RGA) can be fitted on the process chamber
to monitor the levels of various gas species during process runs. This equipment can also
be used to monitor plasma cleaning operations.
Refer to the manufacturer’s manual in Section 3 of this manual for a complete description
of this equipment.
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Description
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System Manual
4
Oxford Instruments Plasma Technology
OpAL
Installation and commissioning
4.. Installation and commissioning............................................................................. 4-1
4.1 Introduction................................................................................................. 4-2
4.2 Installing the system .................................................................................... 4-2
4.2.1 Unpacking ...............................................................................................4-2
4.2.2 Positioning the system components.........................................................4-3
4.2.3 Connecting the services...........................................................................4-4
4.3 Commissioning the system .......................................................................... 4-6
4.4 System adjustments ..................................................................................... 4-7
4.4.1 Process pump purge................................................................................4-7
Fig 4-1: 3-phase supply cable connections at the power box .......................................4-5
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OpAL
4.1
Oxford Instruments Plasma Technology
System Manual
Introduction
The installation and cabling of this system is the responsibility of the customer (unless
this has been specifically altered in the sales contract). On completion of the system
installation, Oxford Instruments Plasma Technology (OIPT) will commission the system.
4.2
Installing the system
The following instructions are a general guide for installing a typical OpAL system,
supplied with a remote gas pod and rotary vane pump. Customers should be aware of any
special requirements for their specific system, e.g. internal gas lines, rotary pump
purging, hazardous processes, endpoint detectors etc..
For details of the services required, refer to the Installation Data Sheets and the Services
Specifications documents included in this manual as Appendices.
IMPORTANT: BEFORE INSTALLING THE SYSTEM, ENSURE THAT ALL PERSONNEL WHO WILL BE
INVOLVED HAVE READ AND UNDERSTOOD SECTION 1 ‘HEALTH AND SAFETY’ OF THIS
MANUAL.
4.2.1
Unpacking
Unpack system components and check for damage and missing items against the packing
list. If any items are damaged or missing, report immediately to the carrier and OIPT.
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4.2.2
Oxford Instruments Plasma Technology
OpAL
Positioning the system components
WARNING
LIFTING HEAVY OBJECTS INCORRECTLY CAN CAUSE SEVERE INJURY
When handling heavy system components such as the system unit or vacuum pumps,
ensure that the appropriate lifting equipment, operated by fully trained personnel, is used.
When heavy rack-mounted components are handled, ensure that the weight is safely
distributed between sufficient personnel.
WARNING
TOPPLING (TIPOVER) HAZARD - IF THE CONSOLE IS NOT KEPT VERTICAL, IT CAN TOPPLE
CAUSING SEVERE INJURY.
When transporting or manoeuvring the console, ensure that it remains vertical at all times.
1)
Transport the system console(s) to the clean room.
2)
Position the system console(s) in the required location. Consider access for
maintenance and access to the services isolation points when positioning the system.
OIPT recommends that at least 600mm service access space is allowed between any
obstacle (e.g. walls, partitions, etc.) and serviceable items, e.g. the power distribution
unit.
3)
Level the system console(s) using the adjustable feet, then lock the feet.
4)
Transport the system PC to the clean room and position it in the required location.
5)
Transport the gas pod to the grey area and mount it in the required position.
IMPORTANT OIPT gas pods typically weigh &gt;40kg. If you intend fixing your gas pod
to a wall, ensure the wall and gas pod fixings are sturdy enough to
bear at least four times the weight of the gas pod. Periodically, e.g.
annually, check the gas pod and its fixings are secure.
6)
Transport the rotary vane pump to the grey area and mount it in the required
position in accordance with the pump manufacturer’s instructions. Refer to the
manufacturer’s literature in Volume 3 of this manual.
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Oxford Instruments Plasma Technology
7)
4.2.3
Connecting the services
IMPORTANT
NOTES
(A)
(B)
(C)
BEFORE CONNECTING ANY OF THE SERVICES, ENSURE THAT THEY ARE
TURNED OFF. E.G. COMPRESSED AIR AND GAS SUPPLY VALVES SET TO THEIR
OFF POSITIONS AND ELECTRICAL SUPPLIES SWITCHED OFF AND LOCKED
OUT.
DO NOT RESTRICT ACCESS TO THE EMERGENCY OFF SWITCH
(EMO CONTROL) BY LOCATING CABLES AND OTHER OBSTACLES
IN FRONT OF THE SYSTEM.
DO NOT LOCATE CABLES WHERE PERSONNEL ARE LIABLE TO WALK. OIPT
RECOMMENDS THAT CABLES ARE LOCATED IN CABLE TRUNKING /
TRENCHES.
1)
Connect the extraction collars on the system console(s) and the gas pod to the
appropriate extraction systems.
2)
Connect the rotary vane pump exhaust line.
3)
Connect the Nitrogen purge lines to the system console(s) and the rotary vane pump.
4)
Connect the compressed air supply to the system console(s) and to the gas pod.
5)
Connect the gas supplies to the gas pod (all gas supply valves closed).
6)
Connect the gas outlet line, control cable and earth cable (see Fig 4-1) from the gas
pod to the system console.
7)
Connect the cooling circuits to the system console.
8)
At the system PC, connect the monitor, keyboard and mouse, then connect the
control cable(s) from the PC to the system console.
9)
Connect the electrical supply from the safety isolation box to the system console. If it
is necessary to connect the 3-phase electrical supply cable to the power box, refer to
sub-section 4.2.3.1.
10) Connect the electrical supply to the PC.
11) Ensure that all covers and panels are fitted and attach notices to the system
indicating that the system is not ready for service.
Installation is now complete and the system is ready for commissioning by Oxford
Instruments Plasma Technology. Note that customers who have arranged to
commission the system themselves can ignore the remainder of this Section.
12) Complete and sign the ‘System Readiness’ form QCF 89 (shipped with the system),
then fax it to OIPT who will arrange for the system to be commissioned.
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4.2.3.1
Oxford Instruments Plasma Technology
OpAL
Connecting the 3-phase supply cable to the power box
If it is necessary to connect the 3-phase supply cable to the power box, use the following
steps.
1) Ensure that the supply cable is not connected to the safety isolation box.
2) Remove the power box cover.
3) Inside the power box, remove the clear plastic safety cover from the power box
(secured to the right-hand side of the power box by four screws).
4) Connect the 3-phase supply cable wires as shown in Fig 4-1.
5) Re-fit the clear plastic safety cover and then the power box cover.
L1
L2
L3
Neutral
3-phase connections
Protective
Earth (at
side of
panel)
Connection
Terminal for
Earth cable to
Gas Pod
Clear plastic
safety cover
Fig 4-1: 3-phase supply cable connections at the power box
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4.3
System Manual
Oxford Instruments Plasma Technology
Commissioning the system
Commissioning of the system will be carried out by OIPT in accordance with their
standard procedures and any additional requirements stated in the sales contract.
Generally, this will include the following items:
1)
Checking that the installation has been carried out satisfactorily.
2)
Powering up the system.
3)
Checking the operation of the system, including the Emergency Off facility and all
interlocks.
4)
Ensuring that the system can perform the processes specified in the sales contract.
5)
Providing training on the system.
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Installation and Commissioning
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4.4
Oxford Instruments Plasma Technology
OpAL
System adjustments
This sub-section gives details of adjustments which may be necessary depending on
system configuration. In addition to these adjustments, refer to the Operator Adjustments
sub-section in Section 5 (Operating Instructions) of this manual.
4.4.1
Process pump purge
An inert gas, normally nitrogen, is added to the process chamber primary mechanical
pump for a variety of reasons:
a)
When pumping condensable vapours, it is flowed via the gas ballast port. This
helps to prevent condensation during compression, and reduces the amount of
liquids such as water vapour or SiCl4 in the pump fluid.
b)
When pumping reactive gases, it is bubbled through the pump fluid, to help
drive out acidic compounds.
c)
When pumping flammable or explosive gases, it is added to dilute the gas below
the threshold for explosion.
d)
In dry pumps, the purge gas flow is important for managing heat and limiting
particle build up.
WARNING
DILUTION IS NOT USED TO MAKE THE EXHUAST SAFE TO BREATH: IT MUST STILL BE
DUCTED AWAY AND TREATED APPROPRIATELY.
If your OpAL system is supplied with a dry pump, e.g. Alcatel ADP122P or ADS602P, that
includes its own purge gas monitor, with an output suitable for inclusion in a hardware
interlock chain, it is permissible to use this instead of the OIPT purge kit.
If your OpAL system is supplied with an oil filled rotary pump, e.g. Alcatel A2063C2, the
purge kit supplied is configured for the process gases specified. Note that information
about the Rotameters used is given in Appendix R.
For purge requirements not covered by the standard OIPT purge kits or dry pump purge
gas monitor an additional purge supplement is included at the end of this section.
Inert pumping
Tools that are pumping only atmospheric gases need no purge, other than any minimum
purge the specific pump requires.
Etch tools – halogen gases
Tools that use gases containing halogens (fluorine, chlorine, and bromine – including
compounds which contain these elements, e.g. CHF3), are supplied with purge into the
pump, via a rotameter of full scale at least 4 standard litres per minute (slpm).
Etch tools – flammable gases
Certain processes use the flammable gases hydrogen (H2) and methane (CH4), often in
combination with chlorine (Cl2) to etch compound semiconductors. The primary pump for
these is purged with sufficient gas to bring the exhaust to one third of the lower
flammability limit.
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Oxford Instruments Plasma Technology
System Manual
A rotameter is used to set and read the flow. A flow switch monitors the purge. The
process gases are turned off by means of a hardware interlock if the flow switch reports
low flow below 7.5slpm.
Deposition processes – pyrophoric gases
Tools that use silane to deposit thin films containing silicon shall be purged with
sufficient gas to bring the exhaust to one third of the lower explosion limit.
A rotameter is used to set and read the flow. A flow switch monitors the purge. For low
rate processes (&lt;25sccm SiH4) the process gases are turned off by means of a hardware
interlock if the flow switch reports low flow below 5.2slpm. For high rate processes
(&lt;50sccm Si H4) the process gases are turned off by means of a hardware interlock if the
flow switch reports low flow below 10.5slpm.
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Installation and Commissioning
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System Manual=
R
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5
Operating instructions .......................................................................................... 5-1
5.1 Introduction ...................................................................................................... 5-3
5.1.1 Controls and indicators............................................................................................5-3
5.1.2 PC 2000 Software Overview ....................................................................................5-4
5.2 System power-up.............................................................................................. 5-5
5.3 Shutting the system down in an emergency ................................................. 5-6
5.4 System shut down and restart ........................................................................ 5-6
5.4.1 Emergency shut down .............................................................................................5-6
5.4.2 Routine shut down...................................................................................................5-6
5.4.3 Mains Power failure .................................................................................................5-6
5.4.4 Software abort .........................................................................................................5-6
5.4.5 System shut-down procedure..................................................................................5-7
5.4.6 System restart following an emergency stop, power failure, or software abort 5-8
5.4.7 System response to loss of services .........................................................................5-8
5.5 Opening and closing the process chamber................................................... 5-10
5.6 Operator control ............................................................................................. 5-11
5.6.1 Turning screen savers and power saver options off ............................................5-11
5.6.2 Logging on .............................................................................................................5-12
5.6.2.1
Editing users details ...............................................................................5-12
5.6.3 System alerts...........................................................................................................5-15
5.6.4 Visual and audible warnings (if fitted).................................................................5-16
5.6.5 Using PC 2000 software .........................................................................................5-17
5.6.6 Pumping the system down ....................................................................................5-18
5.6.7 Venting the system ................................................................................................5-19
5.6.8 Manual process run................................................................................................5-19
5.6.9 Automatic process run...........................................................................................5-20
5.6.10 Single button automatic process run..................................................................5-21
5.6.11 Production mode..................................................................................................5-22
5.7 Creating and editing recipes ......................................................................... 5-23
5.7.1 Working with recipe steps.....................................................................................5-24
5.7.2 Working with recipes.............................................................................................5-25
5.8 Process Datalog............................................................................................... 5-27
5.8.1 Select Log page ......................................................................................................5-27
5.8.1.1
Saving a log file as text for use in Microsoft Excel™...........................5-28
5.8.2 Run log page ..........................................................................................................5-31
5.8.3 Leak detection and MFC calibration log page.....................................................5-32
5.9 Operator adjustments .................................................................................... 5-33
5.9.1 Adjusting the N2 outlet pressure to the system ...................................................5-33
5.9.2 Manually controlled valve with outlet pressure gauge ......................................5-33
5.9.3 Rotary/dry pump N2 purge flow rate adjustment................................................5-34
5.10 PC 2000 Software Reference .......................................................................... 5-35
5.10.1 Pump Control Page ..............................................................................................5-35
5.10.2 Service mode page ...............................................................................................5-38
5.10.2.1
Exiting from service mode .....................................................................5-39
5.10.3 ALD Heater Presets page .....................................................................................5-40
5.10.3.1
Autotune zone heaters..........................................................................5-40
5.10.4 System Log page ..................................................................................................5-42
5.10.5 Recipe page ..........................................................................................................5-43
5.10.6 Production mode page ........................................................................................5-45
5.10.7 Chamber 1 Process Control page ........................................................................5-46
5.10.8 Leak Detection page............................................................................................5-51
5.10.9 Mass flow calibration page .................................................................................5-53
5.10.10 Tolerances page .................................................................................................5-54
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System Manual
5.10.10.1 Buttons ................................................................................................... 5-55
5.10.10.2 System setup timers panel .................................................................... 5-55
5.10.10.3 Process setup timers panel.................................................................... 5-55
5.10.10.4 RF Generator 1 tolerance panel ........................................................... 5-55
5.10.10.5 RF generator capacitor presets panel .................................................. 5-56
5.10.10.6 Gas tolerance panel............................................................................... 5-56
5.10.10.7 ICP generator tolerance panel ............................................................. 5-56
5.10.10.8 Chamber venting times panel .............................................................. 5-58
5.10.10.9 Heater tolerance panel ......................................................................... 5-58
5.10.10.10 APC Tolerance panel ............................................................................. 5-58
5.11 Log files........................................................................................................... 5-59
Fig 5-1: Controls and indicators ............................................................................................... 5-3
Fig 5-2: Typical system alert ................................................................................................... 5-15
Fig 5-3: PC 2000 screen header .............................................................................................. 5-17
Fig 5-4: Typical recipe page.................................................................................................... 5-23
Fig 5-5: Step Commands pop-up menu ................................................................................. 5-25
Fig 5-6: Typical select Log page ............................................................................................. 5-27
Fig 5-7: Typical run log page.................................................................................................. 5-31
Fig 5-8: Typical leak detection and MFC calibration log page ............................................ 5-32
Fig 5-9: N2 Pressure regulator/gauge..................................................................................... 5-33
Fig 5-10: Typical Pump Control page..................................................................................... 5-35
Fig 5-11: Pump control page vacuum mimic......................................................................... 5-36
Fig 5-12: Pump control page operator interface.................................................................. 5-37
Fig 5-13: Service mode page .................................................................................................. 5-38
Fig 5-14: Heater Presets page ................................................................................................ 5-40
Fig 5-15: System Log page...................................................................................................... 5-42
Fig 5-16: Recipe page.............................................................................................................. 5-43
Fig 5-17: Typical production mode page............................................................................... 5-45
Fig 5-18: Chamber 1 process control page ............................................................................ 5-46
Fig 5-19: Leak Detection page ............................................................................................... 5-51
Fig 5-20: Mass flow calibration page..................................................................................... 5-53
Fig 5-21: Process tolerances page .......................................................................................... 5-54
Generic (OpAL Plasma) Issue 1: Oct. 07
Operating Instructions
Page 5-2 of 60
Printed: 06 November 2007 09:42
System Manual=
RKN
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
l&eacute;^i
f&aring;&iacute;&ecirc;&ccedil;&Ccedil;&igrave;&Aring;&iacute;&aacute;&ccedil;&aring;=
This section contains instructions for the operation of the l&eacute;^i=system. The instructions are
supplemented by descriptions of the system’s controls and indicators, and control software.
The operating facilities comprise the following:
RKNKN
a)
Controls and
Indicators
Provide the functions necessary to power the system up,
shut the system down in an emergency, open and close the
process chamber, and shut the system down.
b)
PC 2000 Software
Provides the operator interface to automatically control
and monitor the system hardware.
`&ccedil;&aring;&iacute;&ecirc;&ccedil;&auml;&euml;=~&aring;&Ccedil;=&aacute;&aring;&Ccedil;&aacute;&Aring;~&iacute;&ccedil;&ecirc;&euml;=
The controls and indicators are mounted on the front of the console as shown in Fig 5-1.
Fig 5-1: Controls and indicators
The controls and indicators comprise:
Chamber Hoist buttons and
up/down selection switch:
These controls raise and lower the chamber top to allow
access to the chamber interior. See sub-section 5.5, page
5-10, for details.
Emergency Off (EMO) button:
When pressed, the system is shut down. See sub-section
5.3, page 5-6 for details.
Power On indicator:
Indicates that 3-phase electrical power is connected to the
machine.
System On indicator:
Indicates that the system is powered up.
Printed: 06 November 2007 09:42
Operating Instructions
Page 5-3 of 60
Generic (OpAL Plasma) Issue 1: Oct. 07
l&eacute;^i=
RKNKO
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
System On button:
Switches the system power on.
System Off button:
Switches the system power off.
m`=OMMM=p&ccedil;&Ntilde;&iacute;&iuml;~&ecirc;&Eacute;=l&icirc;&Eacute;&ecirc;&icirc;&aacute;&Eacute;&iuml;=
The PC 2000 software provides the user interface for automatically controlling and
monitoring the system hardware. The software is a Microsoft Windows™ application, running
on a PC (i.e. the system controller).
The software provides the following facilities:
a)
Multi-level password protected logging on.
b)
Vacuum system control for pumping and venting the system.
c)
Service mode for individual control of system components
d)
Display of system interlock status.
e)
Display of system data, e.g. RF generator cumulative on time.
f)
System log.
g)
Recipe creation and editing.
h)
Manual process run.
i)
Automatic process run using recipes.
j)
System vacuum leak checks.
k)
Mass flow controller calibration.
l)
Data logging.
The facilities are presented to the operator as function-related screens selected via menus.
These screens and menus are introduced as the relevant operation procedures are described
in the following sub-sections. A reference guide of all screens is given in sub-section 5.10,
page 5-35.
Generic (OpAL Plasma) Issue 1: Oct. 07
Operating Instructions
Page 5-4 of 60
Printed: 06 November 2007 09:42
System Manual=
RKO
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
l&eacute;^i
p&oacute;&euml;&iacute;&Eacute;&atilde;=&eacute;&ccedil;&iuml;&Eacute;&ecirc;J&igrave;&eacute;=
This sub-section describes the initial power-up (switch on) of the system. It assumes that the
system is switched OFF at the wall-mounted safety isolation box.
WARNING
BEFORE POWERING THE SYSTEM UP, CHECK THAT:
A)
THE ‘ON-SITE’ MAINTENANCE LOG SHOWS THAT THE SYSTEM IS IN A FIT STATE FOR
CUSTOMER OPERATION.
B)
ALL DOORS ARE CLOSED AND ALL COVERS ARE IN PLACE.
C)
THERE IS NO VISIBLE DAMAGE TO THE SYSTEM.
To power up the system, proceed as follows:
1)
Ensure that all manually operated cooling water taps are turned ON.
2)
Ensure that the compressed air supply is ON.
CAUTION
If the gas lines may contain air, do not open any gas taps. Continue with the start up
procedure, then use the system to evacuate the lines one at a time. When it is certain that the
air has been removed and there are no leaks, open the gas taps.
3)
If you are certain that the gas lines do not contain air, turn all the manually
operated gas taps (on gas cylinders etc.) to ON.
4)
Ensure that all covers and panels are fitted and secured.
5)
Open the console door, then set all Remote/Local switches on the panel-mounted
units (RF Generator, etc) to REMOTE.
6)
Switch ON all the panel-mounted units.
7)
Ensure that the serial communications cable from the remote PC system controller is
plugged into the ‘D’ socket located at the rear of the console.
8)
Check that the Emergency Stop button is OUT.
9)
Set the wall-mounted safety isolation box switch to ON (I).
10)
Ensure that the Power On LED (located on the system console) is illuminated.
11)
Operate System ON button (coloured green), located on the console front panel
behind the console door.
12)
Ensure that the System On LED (located on the system console) is illuminated.
13)
Switch the remote PC system controller ON.
Printed: 06 November 2007 09:42
Operating Instructions
Page 5-5 of 60
Generic (OpAL Plasma) Issue 1: Oct. 07
l&eacute;^i=
RKP
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
p&Uuml;&igrave;&iacute;&iacute;&aacute;&aring;&Ouml;=&iacute;&Uuml;&Eacute;=&euml;&oacute;&euml;&iacute;&Eacute;&atilde;=&Ccedil;&ccedil;&iuml;&aring;=&aacute;&aring;=~&aring;=&Eacute;&atilde;&Eacute;&ecirc;&Ouml;&Eacute;&aring;&Aring;&oacute;=
If you need to shut the system down in an emergency, e.g. danger to personnel, fire etc.,
press the red Emergency Stop button, located on the control panel at the front of the
console. This action will switch off all electrical power with the following exceptions:
a)
Mains input cable.
b)
Main contact breaker and associated contactor in the power box.
c)
24V dc Power Supply in the power box.
d)
Power box cooling fan.
When any faults have been cleared and the system is safe to operate, restart the system using
the procedure given in sub-section 5.4.6.
RKQ
p&oacute;&euml;&iacute;&Eacute;&atilde;=&euml;&Uuml;&igrave;&iacute;=&Ccedil;&ccedil;&iuml;&aring;=~&aring;&Ccedil;=&ecirc;&Eacute;&euml;&iacute;~&ecirc;&iacute;=
The situations, which necessitate system shut down, are given in sub-sections 5.4.1 to 5.4.4.
RKQKN
b&atilde;&Eacute;&ecirc;&Ouml;&Eacute;&aring;&Aring;&oacute;=&euml;&Uuml;&igrave;&iacute;=&Ccedil;&ccedil;&iuml;&aring;=
In an emergency, e.g. risk of physical injury, fire, etc., shut the system down by pressing the
Emergency Off (EMO) button. This will disable all power outputs from the power box
(except for low voltage supplies). When any faults have been cleared and the system is safe to
operate, restart the system using the procedure given in sub-section 5.4.6.
RKQKO
o&ccedil;&igrave;&iacute;&aacute;&aring;&Eacute;=&euml;&Uuml;&igrave;&iacute;=&Ccedil;&ccedil;&iuml;&aring;=
When all processing operations are completed and the system is to be shut down for
maintenance and repair, use the Shut down procedure given in sub-section 5.4.5, page 5-7.
On completion of maintenance and/or repair, restart the system using the System power up
procedure, given in sub-section 5.2, page 5-5.
RKQKP
j~&aacute;&aring;&euml;=m&ccedil;&iuml;&Eacute;&ecirc;=&Ntilde;~&aacute;&auml;&igrave;&ecirc;&Eacute;=
A mains power failure will halt all system functions. When power is restored, restart the
system using the procedure given in sub-section 5.4.6.
RKQKQ
p&ccedil;&Ntilde;&iacute;&iuml;~&ecirc;&Eacute;=~&Auml;&ccedil;&ecirc;&iacute;=
To halt processing, click on the STOP ALL AUTO PROCESSES button which is displayed at the
top of the page on all screens. Clicking on this button will halt the current process. Also, an
Automatic Process Shutdown dialogue is displayed asking you if you wish to shut down the
total system. Clicking on Yes will:
Generic (OpAL Plasma) Issue 1: Oct. 07
Operating Instructions
Page 5-6 of 60
Printed: 06 November 2007 09:42
System Manual=
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
a)
Switch the RF power generator(s) OFF.
b)
Switch the pumps OFF.
c)
Close the APC and normally-closed vacuum valves.
d)
Switch the process gases OFF.
l&eacute;^i
After clicking on Yes, the system should be restarted using the procedure given in sub-section
5.4.6.
Clicking on the No button in the Automatic Process Shutdown dialogue will limit the abort to
the actions already done, i.e. stop all automatic recipes. Further processing operations
(automatic or manual) can then be carried out.
RKQKR
p&oacute;&euml;&iacute;&Eacute;&atilde;=&euml;&Uuml;&igrave;&iacute;J&Ccedil;&ccedil;&iuml;&aring;=&eacute;&ecirc;&ccedil;&Aring;&Eacute;&Ccedil;&igrave;&ecirc;&Eacute;=
This procedure assumes that the process run is finished and that the system is to be shut down
for maintenance or repair.
1)
Ensure that the system has been vented, and all pumps are switched off.
2)
Exit from the PC 2000 software by clicking on the System button, then on the Exit
option.
3)
Exit from Windows.
4)
Turn the PC controller OFF.
5)
At the Main Console, press the OFF button (coloured red).
6)
Switch off and lock off the wall-mounted safety isolation box.
7)
Turn off the compressed air supply.
8)
Ensure that all heated components have cooled to ambient temperature, then turn
off the cooling water.
Printed: 06 November 2007 09:42
Operating Instructions
Page 5-7 of 60
Generic (OpAL Plasma) Issue 1: Oct. 07
l&eacute;^i=
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
WARNING
BEFORE PROCEEDING, CHECK THAT THE POWER ON INDICATOR ON THE CONSOLE IS
EXTINGUISHED. IF IT IS ILLUMINATED, PARTS OF THE SYSTEM ARE STILL ELECTRICALLY
ENERGISED AND THE SYSTEM IS THEREFORE UNSAFE FOR MAINTENANCE.
9)
Turn all manual gas taps on the Main Console, gas pod and compressed gas cylinders
OFF.
WARNING
BEFORE REMOVING ANY OF THE SYSTEM PANELS OR COVERS, WAIT AT LEAST FIVE MINUTES
AFTER HAVING SWITCHED OFF THE WALL-MOUNTED SAFETY ISOLATION BOX. THIS WILL ENSURE
THAT ELECTRICAL CHARGES WILL HAVE DECAYED TO A SAFE LEVEL.
RKQKS
p&oacute;&euml;&iacute;&Eacute;&atilde;=&ecirc;&Eacute;&euml;&iacute;~&ecirc;&iacute;=&Ntilde;&ccedil;&auml;&auml;&ccedil;&iuml;&aacute;&aring;&Ouml;=~&aring;=&Eacute;&atilde;&Eacute;&ecirc;&Ouml;&Eacute;&aring;&Aring;&oacute;=&euml;&iacute;&ccedil;&eacute;I=&eacute;&ccedil;&iuml;&Eacute;&ecirc;=&Ntilde;~&aacute;&auml;&igrave;&ecirc;&Eacute;I=&ccedil;&ecirc;=
&euml;&ccedil;&Ntilde;&iacute;&iuml;~&ecirc;&Eacute;=~&Auml;&ccedil;&ecirc;&iacute;=
A power failure, or emergency stop will halt all system functions. A software abort, (by
clicking on the STOP ALL AUTO PROCESSES button, then clicking on Yes in the Automatic
Process Shutdown dialogue), also halts the machine quickly.
When power is restored, and it is safe to turn on or restart the system, use the following
procedure:
1)
Turn off the machine at the System Off switch (coloured red, located on the
console front panel behind the console door).
2)
Ensure that the System Power LED is not illuminated.
3)
Turn on the machine at the System On switch.
4)
Ensure that the System Power LED is illuminated.
NOTE:
RKQKT
System and data log files may have been corrupted. Refer to sub-section 5.11
(page 5-59) for details.
p&oacute;&euml;&iacute;&Eacute;&atilde;=&ecirc;&Eacute;&euml;&eacute;&ccedil;&aring;&euml;&Eacute;=&iacute;&ccedil;=&auml;&ccedil;&euml;&euml;=&ccedil;&Ntilde;=&euml;&Eacute;&ecirc;&icirc;&aacute;&Aring;&Eacute;&euml;=
This sub-section briefly describes the system’s response to the loss of services.
b&auml;&Eacute;&Aring;&iacute;&ecirc;&aacute;&Aring;~&auml;=
Process and pumps stop. Air operated gas and vacuum valves shut.
Loss of one of three phases: rotary vacuum pump stops. If the phase powering the process
controller remains live then the process aborts, all valves shut but the system controller
retains information on the current state of the machine. If the process controller phase is lost,
then current information is lost.
`&ccedil;&atilde;&eacute;&ecirc;&Eacute;&euml;&euml;&Eacute;&Ccedil;=~&aacute;&ecirc;=
All air operated gas inlet and vacuum valves shut. (Exceptions: air-operated valves with
electrical solenoids unaffected; normally open gas interlock valves open). Gas flows stop and
the chamber is not pumped. Process power(s) are turned off as soon as a flow or pressure
exceeds a tolerance band - normally within 5 seconds.
Generic (OpAL Plasma) Issue 1: Oct. 07
Operating Instructions
Page 5-8 of 60
Printed: 06 November 2007 09:42
System Manual=
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
l&eacute;^i
`&ccedil;&ccedil;&auml;&aacute;&aring;&Ouml;=&iuml;~&iacute;&Eacute;&ecirc;=
Most dry pumps have their own internal over-temperature switches. Loss of flow for these
pumps will eventually cause a temperature trip causing a process abort (process chamber
pump) and the relevant pump to be switched off. Devices such as turbo pumps have their
own internal protection against overheating and are not protected by external flow switches.
m&ecirc;&ccedil;&Aring;&Eacute;&euml;&euml;=&Ouml;~&euml;&Eacute;&euml;=
Loss of process gas is detected when a mass flow controller goes out of tolerance during
process. The active process devices (normally plasma power) are paused, and gas flows remain
active. The process will resume automatically if gas is restored.
s~&Aring;&igrave;&igrave;&atilde;=&eacute;&igrave;&atilde;&eacute;&euml;=
An auxiliary circuit on the pump contactor detects pump failure due to overload or short
circuit, and the process gases are immediately halted.
If a rotary vane or dry vacuum pump stops pumping for other reasons during a process, e.g. if
it fails or its power is disconnected, and the vacuum interlock switch’s contacts remain closed,
process gas will continue to flow into the process chamber. Gas flow will stop when the
chamber pressure exceeds the vacuum switch trip level of 600 mbar absolute. The front-end
software will show the interlock status as ‘fault’.
WARNING
DISCONNECTING THE POWER TO AUXILIARY EQUIPMENT, ESPECIALLY VACUUM PUMPS, WHILE
RUNNING A PROCESS CAN CAUSE A HAZARD IN THE PROCESS CHAMBER.
ENSURE THAT THE SYSTEM IS SHUT DOWN USING THE PROCEDURE GIVEN IN SUB-SECTION 5.4.5
BEFORE DISCONNECTING ANY POWER CABLES FROM THE POWER BOX, OR SWITCHING OFF ANY
ELECTRICAL SUPPLIES TO AUXILIARY EQUIPMENT.
WARNING
IF THE EQUIPMENT HALTS DURING PROCESS BECAUSE THE VACUUM SWITCH HAS OPENED, THERE
MAY BE A SERIOUS GAS HAZARD IN THE CHAMBER AND PUMPING LINES.
ASSESS THE RISKS BEFORE TRYING TO PUMP OR VENT THE CHAMBER.
PERSONAL PROTECTIVE EQUIPMENT MAY BE NECESSARY.
Printed: 06 November 2007 09:42
Operating Instructions
Page 5-9 of 60
Generic (OpAL Plasma) Issue 1: Oct. 07
l&eacute;^i=
RKR
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
System Manual
l&eacute;&Eacute;&aring;&aacute;&aring;&Ouml;=~&aring;&Ccedil;=&Aring;&auml;&ccedil;&euml;&aacute;&aring;&Ouml;=&iacute;&Uuml;&Eacute;=&eacute;&ecirc;&ccedil;&Aring;&Eacute;&euml;&euml;=&Aring;&Uuml;~&atilde;&Auml;&Eacute;&ecirc;=
The process chamber can be opened to allow access to its interior for handling wafers.
Opening is achieved by a pneumatically-operated hoist which raises the chamber lid and
rotates it 90 degrees. The hoist is controlled by an up/down selection switch and two hoist
buttons mounted on the control panel.
The hoist buttons are located one at each end of the control panel, so that operation of the
hoist requires the use of two hands. This design is a safety feature to reduce the risk of
trapping the users fingers etc. in the pinch point formed between the two process chamber
halves, and to prevent inadvertent chamber hoist operation.
NOTES: When compressed air is first applied to the system, the initial chamber lift movement
will be rapid unless the Hoist buttons are operated intermittently.
It is permissible to stop hoist travel part way and to resume the travel or to reverse its
direction.
WARNING
PINCH POINT - WHEN THE CHAMBER LID IS OPENED OR CLOSED, LIMBS,
FINGERS ETC CAN BECOME TRAPPED BETWEEN THE LID AND THE MAIN UNIT
RESULTING IN SEVERE INJURY.
Ensure that all personnel are kept clear of the chamber lid when it is
opened or closed.
Opening or closing the chamber lid requires both hoist buttons
(located at either end of the control panel) to be pressed. This
feature is intended to prevent accidental operation of the
hoist. When operating the hoist buttons, use one hand to press
each button. Do not attempt to bypass this safety feature.
Opening the process chamber
To open the process chamber when it has fully vented, use the following procedure:
1)
At the control panel, set the up/down selection switch to its Chamber Up position.
2)
Press both hoist buttons simultaneously. The chamber lid will raise and rotate.
3)
When the chamber lid is fully raised and rotated, release both hoist buttons.
Closing the process chamber
To close the process chamber, use the following procedure:
1)
At the control panel, set the up/down selection switch to its Chamber Down
position.
2)
Press both hoist buttons simultaneously. The chamber lid will lower and rotate.
3)
When the chamber lid is fully lowered and rotated, release both hoist buttons.
Generic (OpAL Plasma) Issue 1: Oct. 07
Operating Instructions
Page 5-10 of 60
Printed: 06 November 2007 09:42
System Manual=
RKS
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
l&eacute;^i
l&eacute;&Eacute;&ecirc;~&iacute;&ccedil;&ecirc;=&Aring;&ccedil;&aring;&iacute;&ecirc;&ccedil;&auml;=
This sub-section gives the procedures for operating the system.
Using the software requires the operator to be familiar with the Microsoft Windows™
environment. For details, refer to the Windows on-line help and tutorials.
RKSKN
q&igrave;&ecirc;&aring;&aacute;&aring;&Ouml;=&euml;&Aring;&ecirc;&Eacute;&Eacute;&aring;=&euml;~&icirc;&Eacute;&ecirc;&euml;=~&aring;&Ccedil;=&eacute;&ccedil;&iuml;&Eacute;&ecirc;=&euml;~&icirc;&Eacute;&ecirc;=&ccedil;&eacute;&iacute;&aacute;&ccedil;&aring;&euml;=&ccedil;&Ntilde;&Ntilde;=
CAUTION
When running the PC 2000 software, using a Screen Saver or allowing the PC to
enter any of the Power Saver modes can cause the PC to lose communications
with the PLC.
Before starting the PC 2000 software, ensure that Screen Savers and all Power
Saver options are turned off. A procedure to do this is given in the following
text.
Use the following procedure to turn the screen savers and power saver options off. Note that
this procedure is applicable to Microsoft Windows XP™; for other versions of Windows, refer
to the on-line help.
1)
Right-click anywhere in a clear area on the Windows desktop and then, on the
displayed menu, select the Properties option. The Display Properties dialogue box
is displayed.
2)
Select the Screen Saver tab.
3)
In the Screen Saver drop-down list, select the (None) option.
4)
Click on the OK button.
5)
On the taskbar, select the Start button, then the Settings option, then select
Control Panel. The control panel is displayed.
6)
Select Power Options. The Power Options Properties dialogue is displayed.
7)
Ensure that all power scheme options are set to ‘Never’. If necessary, use the dropdown lists to select the ‘Never’ option.
8)
Click on the OK button.
9)
Close the Control Panel.
Printed: 06 November 2007 09:42
Operating Instructions
Page 5-11 of 60
Generic (OpAL Plasma) Issue 1: Oct. 07
l&eacute;^i=
RKSKO
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
System Manual
i&ccedil;&Ouml;&Ouml;&aacute;&aring;&Ouml;=&ccedil;&aring;=
To log on to the PC 2000 software, proceed as follows:
RKSKOKN
1)
On the PC Desktop, select the PC 2000 icon
. The PC 2000 splash screen is loaded,
and then the Access Control dialogue is displayed:
2)
Enter your name and password in the appropriate data fields (note that data entry
in the Password field is case sensitive), and then select the Verify button. If you
make a mistake in entering your name and password, select the Verify button and
then re-enter the data. After verification of the entered data, your log-on status is
displayed in the Current User and Access level fields.
3)
Select the OK button. The PC 2000 software continues to load, then the Pump
Control page is displayed.
b&Ccedil;&aacute;&iacute;&aacute;&aring;&Ouml;=&igrave;&euml;&Eacute;&ecirc;&euml;=&Ccedil;&Eacute;&iacute;~&aacute;&auml;&euml;=
Users details, i.e. names, passwords and facility access options can be edited by a person
logged on as a Manager. To do this, use the following steps:
1)
Log on as a Manager (see sub-section 5.6.2).
2)
Select the System Menu, and then the Password option. The Access Control
dialogue box is displayed.
Generic (OpAL Plasma) Issue 1: Oct. 07
Operating Instructions
Page 5-12 of 60
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l&eacute;^i
3)
Select the Edit Users button. The Edit User List is displayed.
4)
To add a new user, click on the Name and Password cells then enter the required
details (remember that text entered into the Password cell is case sensitive). Clicking
on the Access Level cell will display a scrollable drop-down list with the following
options:
Option
Quit
View_Only
User
Production
Maintenance
Manager
Printed: 06 November 2007 09:42
Result
Exit from the drop-down list.
All Facilities automatically disabled.
A set of Facilities can be selected, see Step 5.
Production mode; see sub-section 5.6.11, page 5-22.
A special set of Facilities is automatically enabled. Note that this access level
has its own recipes and steps for maintenance and does not allow access to
process recipes and steps, or allow the system log to be viewed.
All Facilities automatically enabled.
Operating Instructions
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5)
System Manual
Select one of the access levels for the new user.
Similarly, existing Names, Passwords and Access Levels can be edited. In addition,
existing entries can be removed from the list by selecting a name and then selecting
the Delete button.
6)
The Facilities enabled for ‘User’ (selected in Step 4) can be edited by selecting the
Facilities button while the cursor is in the name field for that user. This will display
the Edit User Facilities dialogue box.
7)
Click on the appropriate checkboxes to enable the facilities available to the selected
name (9 indicates enabled). Click on the OK button to accept the entered data and
exit.
Note that the enabled facilities are dependent on the name and not on the access
level, e.g. two people logged on as users can have different sets of facilities enabled.
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System alerts are displayed when PC 2000 detects an event that requires the attention of the
user. Each alert is automatically categorised depending on the nature of the event and the
response required by the user. The category of the event can range from a warning indicating
that a service parameter is out of tolerance to a process abort indicating that a process
setpoint has been out of tolerance for so long that the process cannot be completed. A
typical system alert is shown in Fig 5-2.
System
Alert
banner
System Alert
dialogue
Fig 5-2: Typical system alert
The alert is displayed as a banner in the menu bar at the top of the screen with an associated
dialogue in the main screen area. Note that more than one alert can be active at the same
time, each requiring action by the user in turn.
There are three categories of alert indicated by the colour and text displayed in the banner
and dialogue:
Blue
Warning e.g. water flow low.
Yellow
Hazard – not currently used.
Red
Process abort, e.g. high reflected RF power.
A user logged on at any access level can close the alert dialogue, but only a user logged on as
a system manager can clear the alert banner from the menu bar. The dialogue options are:
Accept button:
System Managers only. Clear the alert and log it.
Next button:
View the next alert.
Cancel button:
System Managers only. Clear the alert, do not log it.
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Continue button: Close the alert dialogue box – the alert banner remains displayed
on the menu bar.
Note that option buttons that are not available (i.e. Accept and Cancel due to user ‘logged
on’ status and Next when there is only one active alert) are greyed out.
The alert message usually contains an adequate description of the detected event. If it is a
service fault (water flow, purge gas etc.) then verify that the service is available to the
machine as soon as possible. Depending on the nature of the service, the system may allow
the machine to continue to operate, so that the current process can be completed. Do not
start a new process before checking the service.
The red alerts are often due to a process setpoint being out of tolerance for too long. In these
cases, the process is halted by the system. If it is authorised to resume processing with a
parameter deviation then:
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1)
Check the most recent process log to find the process time remaining.
2)
Construct a new process with a modified process time and check the ‘Ignore
tolerance’ option. Note that this removes all tolerance checking. The machine should
be monitored by an operator for further deviations when operated in this condition.
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Visual and audible system warnings are provided by a light beacon tower attached to the rear
of the system console.
The basic functionality of the light beacon tower is defined in Table 5.1.
Light tower colour
System Status
Amber
Standby at base pressure – ‘Ready for Process’.
Continuous Green
Process in progress
Flashing Green
Process complete – will continue to flash until the process chamber
is vented and opened, then all tower lamps are extinguished.
Red with buzzer on
Alarm – fault must be rectified. Note when an alarm is accepted, the
alarm will keep recurring until the fault is cleared or rectified.
Table 5.1: Light beacon tower functionality
If the process complete (end of batch) status occurs:
Note the buzzer can be turned ON/OFF by selecting the audible warning button
status bar (you will be prompted for confirmation).
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The PC 2000 software facilities are access from the screen header which is displayed on all
screens (pages). The screen header is shown in Fig 5-3.
LOG-ON
STATUS
PAGE
TITLE
SYSTEM LOG
FILE SPACE
SYSTEM ALERT
BANNER
STOP ALL AUTO
PROCESSES BUTTON
Fig 5-3: PC 2000 screen header
The use of the screens will be described in the relevant procedures. Remember that a full
description of each screen’s features is given in the PC 2000 Reference Guide. See sub-section
5.10, page 5-35.
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System Manual
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To pump the system down, use the following procedure:
1)
Ensure that the Pump Control page is displayed (if necessary, select the System
Menu, then the Pumping option).
2)
Ensure that the status indicators are coloured green:
3)
Ensure that the process chamber lid is in its ‘down’ position. If you intend to carry
out a manual or automatic process run, you will need to open the process chamber
lid, place a wafer on the wafer holder in the process chamber, then close the process
chamber lid. See sub-section 5.5, page 5-10 for the process chamber opening/closing
procedure.
4)
Select the SET BASE PRESSURE button, then enter the required process chamber
base pressure if different from the default. Click OK.
5)
Select the Evacuate button for the process chamber. You will be prompted to enter
a wafer identity; either enter the identity and click OK, or click Cancel (to pump
down without a wafer in the process chamber). The relevant valves will operate and
the process chamber will be pumped down.
NOTE: Turning off the rotary vane pump will cause all process and pumping actions
using that pump to stop.
WARNING
PARTS OF THE EQUIPMENT MAY BE TOO HOT TO TOUCH. E.G THE PROCESS CHAMBER OPERATES
AT 180 &ordm;C AND THE LOWER ELECTRODE (TABLE) OPERATES AT 400 &ordm;C.
DO NOT TOUCH THESE COMPONENTS IF THEY ARE HEATED.
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WARNING
CONTACT WITH TOXIC GASES CAN CAUSE DEATH OR SERIOUS INJURY.
BEFORE VENTING THE PROCESS CHAMBER, ALWAYS ENSURE THAT THE SYSTEM IS ADEQUATELY
PURGED AND PUMPED.
To ensure the process chamber is safe to open and residuals are pumped away as required, an
automatic pump/purge cycle is incorporated into the system. This cycle can be pre-set to be
performed from a minimum of five to a maximum of 100 cycles
Do not vent a system which has used toxic gases unless the system has been adequately
pumped first.
For example:
Gases having Threshold Limit Values (TLVs) of 1ppm or below, e.g.
Chlorine, require at least 20 minutes pumping before venting.
After venting, there may still be residual gases in the process chamber. Consider wearing
suitable personal protection, e.g. a respirator.
To vent the system, use the following steps:
1)
Ensure that the Pump Control page is displayed (if necessary, select the System
Menu, then the Pumping option).
2)
Select the STOP button, then the VENT button for the process chamber. Note that
the vent sequence is controlled by a timer to allow time for the turbo pumps to be
purged.
When the ‘Vent Time Left’ timer has decremented to zero, the process chamber has been
vented.
Do not attempt to open the process chamber lid until the vacuum switch has changed status,
i.e. to its high-pressure status (In this condition, on the Pump Control page the vacuum status
field will display ‘FAULT’).
The vent valve is left on for a period after the chamber opens, to ensure that venting is fully
completed, even if lid opening is actuated early.
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1)
Pump the system down as detailed in sub-section 5.6.6, page 5-18.
2)
Check that the system has pumped down to base pressure. (The process chamber
message panel should display ‘Base Pressure reached’).
3)
Select the Process Menu, then the Chamber 1 option. The Process Control page is
displayed.
4)
Enter the parameters required for the manual process run, e.g. Step Time, RF
generator power, table temperature, chamber pressure, and gas demands etc.
5)
Click the START button. (Note that if this button is not active, the chamber has not
reached base pressure.) The process will commence.
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NOTES:
a)
You can pause the process at any time by selecting the PAUSE button. This will
cause the Step Time and the plasma power to stop with the current step time
indicated. Re-starting the process will cause the process to continue from the time it
was paused. If, during the pause period, you change any of the process parameters,
e.g. gas demand, pressure etc., you must press the START button for the changes
made to come into effect, this will cause the step timer to continue from the time it
was paused.
b)
You can stop the process at any time; the message ‘Process Complete’ will be
displayed, if required, you can then run the same or another process.
When the ‘Process Complete’ message is displayed, the system can be vented (see sub-section
5.6.7 page 5-19), or another manual process run carried out.
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An automatic process run as described in this sub-section can be carried out by a user logged
on as a Manager. See sub-section 5.6.10, page 5-21 for details of a single button automatic
process run which can be carried out by any user.
1)
Pump the system down as detailed in sub-section 5.6.6, page 5-18.
2)
Check that the system has pumped down to base pressure. (The process chamber
message panel should display ‘Base Pressure reached’).
3)
Select the Process Menu, then the Recipe option. The recipe page is displayed.
4)
Select the Chamber button.
5)
Select the Load button then select the required recipe from the displayed list. Click
OK.
6)
To run the loaded recipe, select the Run button. The recipe will be automatically run
and the Chamber 1 page will be displayed to allow you to monitor its progress.
NOTES:
a)
You can pause the process at any time by selecting the PAUSE button. This will
cause the Step Time and the plasma power to stop with the current step time
indicated. Re-starting the process will cause the process to continue from the time it
was paused. If, during the pause period, you change any of the process parameters,
e.g. gas demand, pressure etc., you must press the START button for the changes
made to come into effect, this will cause the step timer to continue from the time it
was paused.
b)
You can stop the process at any time; the message ‘Process Complete’ will be
displayed, if required, you can then run the same or another process.
When the ‘Process Complete’ message is displayed, the system can be vented (see sub-section
5.6.7 page 5-19), or another process run carried out.
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A single button automatic process run allows a complete process to be run automatically. The
run starts by pumping the system down, carrying out the process and then venting the
system. The automatic process run can be carried out by a user logged on at any access level,
e.g. Manager, User etc..
Before starting an automatic process run, the rotary vane/roots/dry pumps must be started. It
is suggested that once the system is powered up, the Manager logs on, starts the pumps and
then re-logs on for the User or Production Operator to carry out the automatic process run(s).
When the pumps have started and the User or Production Operator is logged on, carry out
the automatic process run using the following steps.
1)
Place the wafer to be processed on the table.
2)
Close the process chamber lid.
3)
In PC 2000, select the System menu and then the Recipe option. The Recipe page is
displayed.
4)
Load the required recipe.
5)
Select the Run button. The following sequence will be automatically carried out:
6)
i)
The process chamber will start to evacuate.
ii)
When the process chamber reaches base pressure, the process will
commence.
iii)
When all of the process steps have completed, the process chamber will be
vented.
When the vent sequence is completed, open the process chamber and remove the
wafer.
To process another wafer, repeat the above steps from Step 1). If running the same recipe,
Step 4 can be skipped otherwise load another recipe.
NOTES:
a)
You can pause the process at any time by selecting the PAUSE button. This will
cause the Step Time and the plasma power to stop with the current step time
indicated. Re-starting the process will cause the process to continue from the time it
was paused. If, during the pause period, you change any of the process parameters,
e.g. gas demand, pressure etc., you must press the START button for the changes
made to come into effect, this will cause the step timer to continue from the time it
was paused.
b)
You can stop the process at any time; the message ‘Process Complete’ will be
displayed, if required, you can then run the same or another process.
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The production mode facility is provided to make operation of the system as simple as
possible. In this mode, the user is provided with a ‘special’ Recipe page which allows the user
to load and run a recipe and then vent the system.
To carry out production mode processing, use the following steps:
1)
Log on as a Manager.
2)
Start the external rotary vane pump/dry pump.
3)
Select the system menu, then select the Passwords option.
4)
Log on using the appropriate user name and password for the production mode. The
Production mode page is displayed. See sub-section 5.10.6, page 5-45.
5)
Open the process chamber and place the wafer to be processed on the table.
6)
Select the Load button, then select the required recipe from the displayed list and
select OK.
7)
Enter a batch identity.
8)
Select the Run button. Note that this button only becomes active when a recipe has
been loaded and a batch identity has been entered, and the associated indicators
are coloured green. The system will automatically pump down and the recipe will
run.
9)
When the ‘Process Complete’ message is displayed, select the Vent button to vent
the system. Note that a Vent Time Remaining counter indicates venting progress.
10)
Open the process chamber and remove the processed wafer.
11)
You can now carry out a further process by repeating steps 5) to 10). If running the
same recipe Step 5 can be skipped, otherwise load another recipe.
12)
On completion of production mode processing, log on as a Manager.
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Fig 5-4: Typical recipe page
The Recipe page is used to assemble and store in memory all the set points and instructions
which make up a Recipe for an Automatic Mode run. These recipes consist of a sequence of
process Steps. ‘Drag and Drop’ facilities are provided to copy library steps into a recipe.
NOTE: For a description of the facilities on this page, refer to sub-section 5.10.5, page 5-43.
The Recipe option (accessed from the PROCESS menu) displays the recipe page for the
process chamber. This page allows you to create / edit recipes and the recipe steps that they
contain.
NOTE:
Before creating / editing recipes, make sure that you understand the operation of
key components of the system to ensure that recipes proceed as expected.
A recipe is created by adding steps from the Step Library to the Recipe Step Name fields. The
recipe is then allocated a Data Log Interval and saved.
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Recipe steps are stored in the Step Library list. The list can contain any number of steps,
depending on available hard disk space. When the displayed list is full, it becomes scrollable
to allow you to view all of the list contents.
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To create a new recipe step, use the following procedure:
1)
In the Step Library panel, select the NEW button. The Step Edit page is displayed.
2)
Enter the step parameters as required, then click on OK. The step is automatically
saved.
To create a recipe step, based on an existing recipe step, use the following procedure:
1)
Select a recipe step from the Step Library list, i.e. click on it to highlight it.
2)
Select the COPY button. Enter a new step name.
3)
Edit the step parameters as required, then click on OK. The new recipe is
automatically saved.
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To edit an existing recipe, use the following procedure:
1)
Select a recipe step from the Step Library list, i.e. click on it to highlight it.
2)
In the Step Library panel, click on the Edit button.
3)
Edit the step’s process parameters as required, then click on OK. The step is
automatically saved.
NOTE:
Changing an existing recipe step will not alter saved recipes which use the
old version of that step.
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To delete a recipe step, use the following procedure;
1)
Select the recipe step from the Step Library list, i.e. click on it to highlight it.
2)
Select the DELETE button; the selected recipe step is deleted.
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Recipes are ‘built’ using existing recipe steps, and edited as required.
Within a recipe, steps can be manipulated using the Step Commands pop-up menu
(accessed by clicking on the Recipe Steps field).
Fig 5-5: Step Commands pop-up menu
The Step Commands pop-up menu provides the following options:
Edit Step
Enables the selected (highlighted) step to be edited.
Repeat Step
Repeats all subsequent steps until a Loop Step is reached. This group of
steps can be repeated any number of times. (When you select this option,
you are prompted to enter the number of times the group of steps is to be
repeated.)
Loop Step
Terminates a Repeat Step group.
Insert Step
Creates a 'gap' above the selected step to allow another step to be dragged
into the list.
Delete Step
Deletes the selected step from the list.
Cancel
Closes the Step Commands pop-up menu.
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To build a recipe, use the following procedure:
1)
In the Recipe panel, select the NEW button.
2)
Click on a recipe step in the Step Library list, hold the left mouse button down then
drag the mouse pointer to the Step Name field next to the asterisk (*) then release
the mouse button. The step name is displayed in the Step Name field.
3)
Repeat 2) as required to add further steps to the recipe. Note that once you have
filled the Step Name field, the recipe step list becomes scrollable, enabling you to
add a maximum total of 1000 steps.
4)
To remove a step from the list, click on it to highlight it then select the Delete step
button from the Step Commands pop-up menu. Any further steps will move up the
list by one place.
5)
To add a step before an existing step, click on the existing step then select the Insert
step button from Step Commands pop-up menu. The selected step and all those
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following it will move down the list by one place. You can then drag another step
from the Step Library list into the now vacant field.
6)
When all steps have been added, enter a time into the Data Log Interval field,
then enter a name for the recipe in the Recipe Name field. Finally, select the SAVE
button.
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To edit a recipe, use the following procedure:
1)
Select the LOAD button, then select the recipe to be edited.
2)
In the Step Commands pop-up menu, click on the Edit Step button, then edit the
process parameters as required. Note that editing a recipe step will not affect the
associated step, i.e. a step having the same filename, in the Library of Available
Steps.
3)
To remove a step from the list, click on it to highlight it then select the DELETE STEP
button from the Step Commands pop-up menu. Any further steps will move up the
list by one place.
To add a step before an existing step, click on the existing step then select the INSERT STEP
button. The selected step and all those following it will move down the list by one place. You
can then drag another step from the Step Library list into the now vacant field.
Generic (OpAL Plasma) Issue 1: Oct. 07
Operating Instructions
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RKU
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l&eacute;^i
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All processes are automatically data-logged. The interval between logging events is set in the
Recipe screen.
The Process Datalog facility allows you to view process data runs and associated comments.
The facility comprises three pages:
a)
SELECT LOG page – allows you to select the process data to view.
b)
RUN LOG page – lists the selected process data, for all runs except Leak detection
runs and MFC calibration runs, with respect to time.
c)
Leak detection and MFC calibration log page – displays the Leak detection runs and
MFC calibration runs in text and graphical formats.
These pages are described in the following text.
RKUKN
p&Eacute;&auml;&Eacute;&Aring;&iacute;=i&ccedil;&Ouml;=&eacute;~&Ouml;&Eacute;=
The Select Log page is displayed by selecting the Process button, then the Log View option.
Fig 5-6: Typical select Log page
The page comprises a list of logged events, which can be filtered by type, batch name and
time. When the required events have been selected, they can be viewed on a Log View page.
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Operating Instructions
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System Manual
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The facilities provided on the page are as follows:
RKUKNKN
List of logged
events
Displays a list of logged events in a date/time sequence. Each event is
identified by an icon, date, time, title, duration, name and comments (if
present). An event is selected (highlighted) by clicking on it.
Delete
button
Deletes the selected event
Undo button
Undo the last action
Save As Text
button
Save the selected event as a text file for use in spreadsheets etc. For details
of saving a log file as text for use in Microsoft Excel™, see sub-section
5.8.1.1.
View Run
button
Opens either the Run Log page (see sub-section 5.8.2, page 5-31) or, if
) or MFC calibration run ( ) is selected, the
either a Leak detection run (
Leak Detect and MFC calibration log page (see sub-section 5.8.3, page 5-32)
with the selected log data displayed.
Filter by
Type list
A list of event types with associated checkboxes. Use this panel to select the
events to display in the Event list. A checkbox showing an ‘x’ indicates that
the associated event type will not be displayed. A checkbox showing a ‘9’
indicates that the associated event type will be displayed.
Filter by
Batch Name
field
Enter a batch name to list only logged events associated with that batch.
Filter by
time fields
and buttons
Use these controls to select events occurring in a time range to be
displayed.
Hide items
before
selection
button
Displays all events after and including the highlighted event.
Hide items
after
selection
button
Displays all events before and including the highlighted event.
Show all
items button
Displays all previously hidden events.
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NOTE:
OIPT now supplies customers with comprehensive software to view/analyse PC 2000
log files. The software, LogViewer, is provided on the system PC. For full details of
LogViewer, refer to its Manual by following the shortcut on the desktop of your
system PC.
Any logged process run can be saved at text and then opened in Excel for viewing, analysing,
etc. To do this, use the following steps:
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Operating Instructions
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l&eacute;^i
1)
On the Select Log page, select the required process run (any multiple steps will be
automatically highlighted).
2)
Select the Save As Text button. The Save As dialogue is displayed.
3)
Navigate to the target location for the log text file, enter a filename and in the ‘Save
as type:’ field select ‘Log Text Files (*.Txt)’ from the drop-down list. If saving to a
floppy disk, label it and insert into the drive now.
4)
Select the Save button. The text file is saved in your chosen location.
5)
Start Excel and then in the File menu, select the Open option. The ‘Open’ dialogue is
displayed.
6)
Navigate to the location of the saved text file and in the ‘Files of type:’ field, select
‘All Files (*.*)’ from the drop-down list. Select the required text file and then select
the Open button. The ‘Text Import Wizard – Step 1 of 3’ dialogue is displayed:
7)
In the ‘Original data type’ panel, select the ‘Delimited’ option and then select the
Next &gt; button. The ‘Text Import Wizard – Step 2 of 3’ dialogue is displayed:
8)
In the ‘Delimiters’ panel, select the ‘Comma’ checkbox. Select the Next &gt; button. The
‘Text Import Wizard – Step 3 of 3’ dialogue is displayed:
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System Manual
9)
In the ‘Column data format’ panel, ensure that the ‘General’ option is selected and
then select the Finish button. The process run log data is now displayed in the Excel
worksheet.
10)
Adjust the column widths so that all text is visible and then save the spreadsheet.
Generic (OpAL Plasma) Issue 1: Oct. 07
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The Run Log page is accessed from the Select Run page by clicking on the View Run button
) or MFC calibration run ( )
with any process run other than a leak detection run (
selected.
Fig 5-7: Typical run log page
The page displays the Parameters, Demands and Readbacks for the selected log data.
The facilities provided on the page are as follows:
Select Run button
Displays the Select Log page.
Log information panel
Displays details about the selected log data.
Parameter list
Lists the logged parameter names
Demand list
Displays the demanded parameter value
Readbacks list
Displays the logged parameter values with respect to time at the
log intervals specified for the process run. The list can be scrolled
horizontally either by single readbacks or by page. The list can also
be scrolled vertically to display further steps (for multi-step
recipes).
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Operating Instructions
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RKUKP
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System Manual
The leak detection and MFC calibration log page is accessed from the Select Run page by
) or MFC calibration run ( ) and then clicking on
selecting either a leak detection run (
the View Run button.
Log panel
Leak detection run
MFC Calibration run
MFC calibration trace
(Blue)
Pressure axis scale controls
Leak detection trace
(Red)
Time axis scale controls
Graph panel
Fig 5-8: Typical leak detection and MFC calibration log page
This page is used to view details of up to six leak check runs and/or MFC calibration runs. Note
that Fig 5-8 shows details of a leak test (red trace) and an MFC calibration run (blue trace).
The facilities available on this page are:
Select Run
button
Clear buttons
Displays the Select Run page.
Log panel
Displays details of each run in text format.
Graph panel
Displays a plot of each run (pressure versus time). Each run is represented
by a coloured trace as indicated by the palette displayed adjacent to the
run data in the Log panel. The graph can be scaled in each axis by the
controls located at the bottom-left corner of the graph.
Select to remove the associated data from the log panel and graph
panel. Note that to re-display the cleared data, you must return to the
Select Run page and re-select it.
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RKV
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RKVKN
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NOTE:
l&eacute;^i
Refer to Section 2 for a description of the Nitrogen distribution circuit.
Depending when the system was build, the N2 pressure to the system is controlled by a
manually controlled valve with an outlet pressure gauge (see Fig 5-9).
The N2 outlet pressure to the system should not usually require adjustment from its factory
setting. However, if adjustment is necessary, proceed as follows.
WARNING
THIS PROCEDURE INVOLVES WORKING ON THE SYSTEM WITH COVERS REMOVED AND WITH THE
ELECTRICAL POWER ON. THEREFORE IT MUST ONLY BE CARRIED OUT BY TRAINED AND
COMPETENT PERSONNEL WHO ARE AWARE OF THE RISKS INVOLVED.
RKVKO
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1)
Remove system panels as necessary to gain access to the regulator.
Outlet pressure
control knob
Outlet connector
Outlet pressure
gauge
Fig 5-9: N2 Pressure regulator/gauge
2)
Adjust the regulator outlet pressure control knob to set the outlet pressure to the
maximum which will not open the check valve; normally 0.5 to 0.7 bar gauge as
indicated on the regulator gauge.
NOTE:
Setting the outlet pressure too low will extend system venting times
excessively, and may compromise the purge gas flow to the turbo pump if
fitted. Setting the outlet pressure too high will open the check valve and
waste gas, but will not reduce venting times.
3)
Refit all system covers.
4)
Carry out a simple process to check that the vent sequence operates correctly.
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Operating Instructions
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RKVKP
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System Manual
o&ccedil;&iacute;~&ecirc;&oacute;L&Ccedil;&ecirc;&oacute;=&eacute;&igrave;&atilde;&eacute;=kO=&eacute;&igrave;&ecirc;&Ouml;&Eacute;=&Ntilde;&auml;&ccedil;&iuml;=&ecirc;~&iacute;&Eacute;=~&Ccedil;&agrave;&igrave;&euml;&iacute;&atilde;&Eacute;&aring;&iacute;=
CAUTION
If the rotary/dry pump’s N2 purge flow rate is inadequate, damage to the pump could occur.
Ensure that the flow rate is set to the value recommended by the pump manufacturer.
The rotary/dry pump’s N2 purge flow rate is set at the factory before system shipment and
should not need adjustment. However, the pump purge rate will need to be confirmed on
installation and at any time the purge gas supply pressure changes significantly. If adjustment
is necessary, refer to Appendix R in this manual.
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RKNM
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m`=OMMM=p&ccedil;&Ntilde;&iacute;&iuml;~&ecirc;&Eacute;=o&Eacute;&Ntilde;&Eacute;&ecirc;&Eacute;&aring;&Aring;&Eacute;=
This sub-section gives functional descriptions of the PC 2000 screens.
RKNMKN
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The Pump Control page is automatically displayed when PC 2000 is first accessed; the page
can also be accessed by selecting the System button, then the Pumping option. The Pump
Control page is shown in Fig 5-10.
Fig 5-10: Typical Pump Control page
The Pump Control page provides control and monitoring of the vacuum system. The page has
the following features:
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System Manual
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The vacuum system mimic is shown in Fig 5-11.
PROCESS
CHAMBER
CHAMBER
VENT VALVE
GATE
VALVE
CM GAUGE
ISOLATING VALVE
ROTARY VANE/DRY
PUMP
Fig 5-11: Pump control page vacuum mimic
Valves are coloured Red when closed and Green when open. Running pumps are indicated by
animation.
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Operating Instructions
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l&eacute;^i
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The Pump Control page Buttons, controls, indicators and message panels to allow you to
control the vacuum system are shown in Fig 5-12.
Click to set
Process Chamber
Base Pressure
Process chamber
message field
Purge cycle
panel
Process
chamber
status panel
Fig 5-12: Pump control page operator interface
The operator interface facilities are labelled in Fig 5-12.
The following facilities are provided:
a)
System status indicators:
PSU:
Green when the -15V, +15V and +24V dc supplies are
healthy. Red when a supply is faulty.
N2 Vent Gas:
(If fitted)
Green when the N2 vent gas supply is healthy. Red when
the supply if faulty.
Gas Pod Interlock:
Green when the Gas Pod cover is fitted correctly. Red
when the cover is off.
Water Flow
GENERATOR:
Green when cooling satisfactory. Red when flowswitch is
tripped (i.e. cooling flow rate out of tolerance).
Water Flow HEATER:
Green when cooling satisfactory. Red when flowswitch is
tripped (i.e. cooling flow rate out of tolerance).
Pump Purge Switch:
(If fitted)
Green when the pump purge is switched on. Red when it
is switched off.
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b)
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Control and status panels for the process chamber. The Control and status panel has
associated EVACUATE, STOP and VENT buttons.
i)
EVACUATE button: Select to pump-down the associated chamber.
ii)
STOP button: Select to stop either pumping down or venting the
process chamber.
iii)
VENT buttons: Select to vent the associated chamber.
c)
Mimics of all valves showing open/closed status (coloured green when open, red
when closed).
d)
Rotary pump control. Clicking on the EVACUATE button will switch the pump on (a
running rotary pump is indicated by animation).
e)
A SET BASE PRESSURE button. Select to set the Process Chamber Base Pressure.
f)
Context related message panel for the process chamber.
g)
Purge cycle panel. Enter the required number of process chamber pump/purge cycles
required (a maximum of 100 cycles can be performed at a single time). The number
of purge cycles remaining is displayed. Note that the pump/purge times are set on
the tolerances page.
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The Service Mode page is displayed by selecting the System button, then the Service option.
Fig 5-13: Service mode page
This page is used during maintenance to manually control system components.
Manual control of the following features is available by clicking on them (confirmation is
requested before any action is carried out):
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l&eacute;^i
Note that moving the mouse pointer over a feature will cause a box to be displayed around
the feature indicating that it can be manually controlled.
a)
Vent valve.
b)
Gate valve.
c)
CM gauge isolating valve.
d)
Fast Valves (click on a valve mimic to open the valve; its mimic will become green).
e)
Rotary vane/dry pump.
The Table Heater button is used to autotune the table heater.
The ADD WAFER button is used to inform the system that a wafer is present. This facility
would be used if the machine were powered-up with a wafer in the process chamber. The
legend on this button changes to KILL WAFER when a wafer is present, enabling the selected
wafer to be removed from system memory.
RKNMKOKN
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To exit from service mode, select the system menu and then the Exit Service option. The
following dialogue box is displayed:
Ensure that there are no personnel close to the system, and then select the OK button.
After exiting from service mode, the system configuration will depend on which service mode
facilities were used as follows:
If no service mode facilities were used, e.g. no valves were open or closed; the system
configuration will be the same as it was before entering service mode.
If the service facilities were used, the system configuration will depend on which of the
facilities were used as follows.
To prevent damage to the system, if the process chamber had any of its features altered in
service mode, e.g. valves opened/closed, pumps turned on/off etc., it will have its pumping
stopped.
To return the process chamber to the pumping or vent state, click on the associated Stop
button, and then on the Evacuate button or the Vent button as required. The chamber will
then pump down or vent.
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Operating Instructions
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RKNMKP
System Manual
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^ia=e&Eacute;~&iacute;&Eacute;&ecirc;=m&ecirc;&Eacute;&euml;&Eacute;&iacute;&euml;=&eacute;~&Ouml;&Eacute;=
The Heater Presets page, accessed from the Utilities menu, is used to view, set and save the
ALD heater presets.
Fig 5-14: Heater Presets page
CAUTION
If the heaters are not in tolerance, the process will not start.
RKNMKPKN
^&igrave;&iacute;&ccedil;&iacute;&igrave;&aring;&Eacute;=&ograve;&ccedil;&aring;&Eacute;=&Uuml;&Eacute;~&iacute;&Eacute;&ecirc;&euml;=
All zones can be autotuned at the same time or each zone can be autotuned individually.
^&igrave;&iacute;&ccedil;&iacute;&igrave;&aring;&Eacute;=~&auml;&auml;=&ograve;&ccedil;&aring;&Eacute;&euml;=
1)
Ensure the Main Heater and Thermocouples are connected.
2)
Select the Enable button for each zone to be autotuned.
3)
For each zone to be autotuned, enter the required setpoint. Note that the entered
setpoint must be 50 degrees higher than the actual temperature.
4)
Select the Set Pump Heaters button to send the setpoints to the PLC.
5)
Select the Set Autotune button.
6)
When the temperature has reached the selected setpoint wait for 30 minutes.
7)
Autotune is now complete.
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8)
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
l&eacute;^i
Change new setpoint for heating. Enter new value and then select the Set Pump
Heaters button.
^&igrave;&iacute;&ccedil;&iacute;&igrave;&aring;&Eacute;=&aacute;&aring;&Ccedil;&aacute;&icirc;&aacute;&Ccedil;&igrave;~&auml;=w&ccedil;&aring;&Eacute;&euml;=
Example: If there are 20 zones of which 19 zones are OK, only one zone is required to
autotune. Alternatively, you may wish to add an extra zone. In these cases, you do
not need to autotune all zones.
To autotune an individual zone, you must first disable all other zones by clicking on their
Enable/Disable buttons so that the ‘Disable’ legend is displayed with a red indicator. After
disabling these zones, click on the WarmStart_PLC button.
To autotune or retune an individual zone:
1)
Select the Enable button for the zone to be autotuned or retuned and disable all
other zones.
2)
Enter the required setpoint.
3)
Select the Set Pump Heaters button.
4)
Select the Set Autotune button.
5)
When the temperature has reached the selected setpoint wait for 30 minutes.
6)
Autotune is now complete.
7)
To autotune a further zone, repeat Steps 1) to 6).
8)
For all zones disabled in Step 1) click on their Enable/Disable buttons so that the
‘Enable’ legend is displayed with a green indicator.
9)
Select the Enable button.
10)
Select the WarmStart_PLC button. The ‘Comms OK’ indicator (Green) will change to
‘Comms error’ (Red) for a few seconds and then return to ‘Comms OK’ (Green).
NOTES:
If any zone’s main or thermocouple is disconnected/reconnected the PLC must have a
warm start before the zone can be heated again.
After any setpoint change, the Set Pump Heaters button must be selected.
When disabling or enabling an individual zone, select the disable/enable button and
then select the WarmStart_PLC button
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Operating Instructions
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p&oacute;&euml;&iacute;&Eacute;&atilde;=i&ccedil;&Ouml;=&eacute;~&Ouml;&Eacute;=
The System Log page is displayed by selecting the System button, then the System Log
option.
Fig 5-15: System Log page
The system log page allows logged system events to be viewed. A filter facility allows the
viewed events to be displayed by event type and time of occurrence.
The page provides the following features:
Event list:
A scrollable list of events in date/time order. Each event is categorised
by an icon, and an event description is given. Use the scrollbar and
associated buttons to move the list up or down by a single event, a
page of events or to the end of the list.
Delete button
Removes the selected event(s) from the Event list.
Undo button
Only active after a Delete action. Restores the last deleted event.
Filter by Event
Type panel:
A list of event types with associated checkboxes. Use this panel to select
the events to display in the Event list. A checkbox showing an ‘x’
indicates that the associated event type will not be displayed. A
checkbox showing a ‘9’ indicates that the associated event type will be
displayed.
Filter by time
controls:
Use these controls to select events occurring in a time range to be
displayed.
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Operating Instructions
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Hide events
before selection
button
Displays all events after and including the highlighted event.
Hide events
after selection
button
Displays all events before and including the highlighted event.
Show all events
button:
Displays all previously hidden events.
l&eacute;^i
o&Eacute;&Aring;&aacute;&eacute;&Eacute;=&eacute;~&Ouml;&Eacute;=
The Recipe page is displayed by selecting the Process button, then the Recipe option.
Fig 5-16: Recipe page
The recipe page is used to create, edit and run recipes. See sub-section 5.7, page 5-23.
The facilities on this page are:
Chamber button
Select to carry out an automatic process run using a recipe. The
button’s indicator is coloured yellow when selected.
No wafer button
Select to carry out an automatic process run without a wafer in the
process chamber. The button’s indicator is coloured yellow when
selected.
Recipe Panel
Recipe Name
field
The name of the currently loaded recipe.
Data Log
Displays the data log interval, i.e. the time interval between the
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Interval field
logging of system parameters.
Created field
The date and time of recipe creation.
Recipe length
field
The length of time taken to run the recipe.
Recipe step list
A scrollable sequential list of steps contained in the recipe.
New button
Select to create a new recipe.
Load button
Select to load an existing recipe.
Save button
Select to save the current recipe.
Run button
Select to run the current recipe. Be aware that selecting this button
will cause system components, e.g. valves, heaters, etc., to
operate!
Step Library Panel
Edit button
Select to edit the selected (highlighted) recipe step.
New button
Select to create a new recipe step.
Copy button
Delete button
Select to copy the selected recipe (you are prompted for a new step
name).
Select to delete the selected (highlighted) recipe.
Step Library list
Displays the recipe steps available in a scrollable list.
Generic (OpAL Plasma) Issue 1: Oct. 07
Operating Instructions
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RKNMKS
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The production mode page (a typical production mode page is shown in Fig 5-17) is
automatically displayed when a user logs on in production mode. To use the production
mode facility, refer to sub-section 5.6.11 (page 5-22).
Fig 5-17: Typical production mode page
The facilities available on this page are:
Recipe Name field
The name of the currently loaded recipe. The indicator at the right of
this field is coloured red until a recipe is loaded when it changes to
green.
Batch Id field
Enter the batch identity of the currently loaded wafer. The indicator
at the right of this field is coloured red until a batch identity is
entered when it changes to green.
Created field
The date and time of recipe creation.
Recipe Length
field
The length of time taken to run the recipe.
Load button
Select to load an existing recipe.
Run button
Select to run the current recipe. Be aware that selecting this
button will cause system components, e.g. valves, heaters,
etc., to operate! Note that this button only becomes active when a
recipe has been loaded and a batch identity has been entered.
Vent button
Select to vent the automatic load lock.
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System Manual
Vent Time Left
counter
Indicates the time remaining (in seconds) until the automatic load
lock has completely vented. The counter is displayed when the Vent
button is selected and remains displayed until the Run button is
selected.
Recipe step list
A scrollable sequential list of steps contained in the recipe.
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The Chamber 1 page is displayed by selecting the Process button, then the Chamber 1
option.
Fig 5-18: Chamber 1 process control page
This page is used to set the process parameters either for a manual run, or for a process step
to be used in an automatic run recipe.
The facilities available on this page are:
Process chamber
message field
Displays context related messages about the process chamber.
Log Comment
field
Used to enter comments about the current process run which can be
viewed on the log viewer page.
Wafer status
field
Displays context related messages about the wafer currently in the
process chamber.
Log Comment
button
Allows comments about the current process to be entered in the Log
Comment message field. While entering a comment, the button title
changes to OK to allow the comment to be accepted.
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Leak Detection
button
Select to carry out a process chamber leak rate test and to calibrate the
MFCs. See sub-section 5.10.8, page 5-51.
Start button
Select to start a manual process run using the parameters set on this
page. Be aware that selecting this button will cause system
components, e.g. valves, heaters etc., to operate!
Stop button
Select to stop the current process step.
Pause button
Select to pause the current process.
Jump button
Select to jump to the next process step.
Recipe message
field
Displays information about the current recipe, step, loaded wafer
identity, etc..
Step Time fields
Enter the required step time in hours:minutes:seconds. While a process is
running, the adjacent field displays the time remaining to the end of the
step.
Log Interval
fields
Enter the interval required between data logging events.
Process status
field
Indicates the process status; either Ready, Auto or Manual
Pump to
Pressure
checkbox
Select to create a pumping step. The system will pump down until the
demanded pressure is reached. The step will remain active until this
condition is met. The RF Generator is automatically switched off during
the step. All setpoints are automatically set to zero, except for base
pressure.
Pressure fields
Enter the required Process Chamber pressure for the step. The measured
pressure is displayed in the adjacent field.
Ignore
Tolerances
checkbox
Select to disable tolerance checking during the current step.
Printed: 06 November 2007 09:42
NOTE: RF power turns on immediately without waiting for flows and
pressure to be established.
Operating Instructions
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Hold button
System Manual
Used in multi-step recipes to keep the plasma on between steps.
NOTES:
The Hold button is only displayed on the Process Control page when a
recipe is loaded. The Hold facility can be selected when creating/editing a
process step using the Process Editor page.
When running the recipe, at the end of the process time for a process step
without the Hold button selected, all process setpoints (chamber pressure,
helium backing pressure, table temperature, RF power, ICP power, gas
flow, etc) are set to zero (off) before starting the next process step. This
means that the plasma would be extinguished between two plasma
process steps if the Hold button were not selected.
When running the recipe, at the end of the process time for a process step
with the Hold button selected, all process setpoints (chamber pressure,
helium backing pressure, table temperature, RF power, ICP power, gas
flow, etc) are set to the values of the next process step to run. This means
that the plasma remains on between two plasma process steps if the Hold
button is selected.
Chamber
Pressure
readback
Displays the current process chamber pressure.
TABLE
HEATER
panel
Enter the required table temperature. The current table temperature is
displayed.
Note that a message ‘AUTO-TUNE RUNNING’ indicates the table
temperature is under the control of the calibrated Proportional-IntegralDerivative (PID) controller. Other messages can be displayed, refer to subsection 6.9.
For details of the heater temperature controller set-up, refer to subsection 6.9.
RF
GENERATOR
panel
Enter the required forward power. The RF on/off status, forward power
and reflected power are displayed.
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RF
AUTOMATCH
panel
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CAPACITOR 1 field
Enter the required position for variable AMU Capacitor 1. The position can
be set between 0%, minimum capacitance, and 100%, maximum
capacitance. The capacitor position read back is displayed.
CAPACITOR 2 field
Enter the required position for variable AMU Capacitor 2. The position can
be set between 0%, minimum capacitance, and 100%, maximum
capacitance. The capacitor position read back is displayed.
AUTO button
Select to enable the AMU to tune automatically when the RF generator is
switched on. When the RF generator is switched off, the capacitors return
to the park position.
MANUAL button
Select to enable the AMU to move the capacitors to the values defined in
the CAPACITOR 1 and CAPACITOR 2 fields; the capacitors will remain in
these positions.
HOLD button
Select to enable the AMU to tune automatically when the RF generator is
switched on. When the RF generator is switched off the capacitors remain
at the last position.
ICP Gate
Valve panel
Enter a ‘1’ to open the valve or ‘0’ to close it. An indicator displays current
status.
The ICP gate valve should be open when running process gases and when
running a plasma step, it should be closed during a precursor process step
to stop coating of the ICP tube with precursor.
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Process gas
pod mimic
Displays a mimic of the gas lines installed in the gas pod.
Enter the required gas flow in sccm for each gas line. Click on the Gas
Name in an MFC mimic to edit the associated Gas Factors; the following
dialogue is displayed.
It is recommended to keep the Gas Factor as 1, and to put the full scale
of the MFC for the gas used in the Mass Flow field.
For example, if Argon is used with a 100 sccm N2 MFC. Put gas factor 1 and
Mass Flow 141 sccm.
Gas Isolation panel – Enter a ‘1’ to open the valve, or ‘0’ to close it.
The Dose valves (D) are interlocked against each other.
Gas lines 7 and 8 – Enter a ‘1’ to open the associated valve or ‘0’ to close
it.
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Operating Instructions
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RKNMKU
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Fig 5-19: Leak Detection page
The leak detection page, accessed from the Chamber 1 process page by selecting the Leak
Detection button, allows you to perform automatic or manual leak detection runs.
The Leak Detection page can be used to check the rate-of-pressure rise in a sealed process
chamber. The chamber is first pumped for a fixed time. The chamber then seals and the
pressure rise rate is calculated. A graph of the chamber pressure against time is plotted. The
test stops either when the test time elapses. The chamber is returned to pumping at the end
of the test.
The rate-of-pressure rise will depend on:
a)
The leak rate from atmosphere. Leaks are not improved by more pumping.
b)
The outgassing rate from all surfaces.
c)
The ‘virtual leak’ rate from parts of the system furthest from the vacuum pump,
especially gas feed pipes.
Outgassing and virtual leaks are reduced by more pumping. Outgassing is increased if the
temperature of the whole system is raised.
The facilities available on this page are:
Page function title
field
Displays the current function of the page, i.e. Leak Detection
Process chamber
message field
Displays context related messages about the process chamber.
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Log Comment
message field
Used to enter comments about the current process run which can be
viewed on the log viewer page.
Wafer status field
Displays context related messages about the currently loaded wafer.
Log Comment
button
Allows comments about the current process to be entered in the Log
Comment message field. While entering a comment, the button title
changes to OK to allow the comment to be accepted.
Return to
Process button
Select to return to the Chamber 1 process page.
Start button
Select to commence a leak detection test.
Stop button
Select to halt a leak detection test and return to pumping.
Step Time fields
Enter the required step time (in hours:minutes:seconds) for the
duration of the pressure-rise test. While a process is running, the
adjacent field displays the time remaining to the end of the step.
Log Interval
fields
Enter the sampling rate for the datalogging log file (in
hours:minutes:seconds). If set to zero, no data log will be made.
Recipe message
field
Displays information about the current recipe, step, loaded wafer
identity etc.
PUMP TO TIME
fields
Click on the checkbox to select (9 Indicates selected) and then enter
the duration of the initial pumpdown (in hours:minutes:seconds). The
readback field displays the time remaining to the end of the test.
Pressure fields
Mass Flow
Calibration
button
The pressures read by the chamber Penning and CM gauges are
displayed.
Select to calibrate the MFCs. Calibration is carried out by clicking on
each MFC mimic, then entering the Gas Name, Gas Factor and Mass
Flow. See sub-section 5.10.9, page 5-53.
Gas pod mimic
Displays a mimic of the gas lines.
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Fig 5-20: Mass flow calibration page
CAUTION
Some gas mixtures may produce particles in the chamber or gas
lines.
Check only ONE gas at a time.
This page is similar to the Leak Detection page (see sub-section 5.10.8, page 5-51) with the
addition of setpoint boxes for the Mass Flow Controllers. When the initial pumping and MFC
stabilisation period ends, the chamber seals and fills slowly. The rate-of-pressure rise is
calculated and displayed.
NOTE: Chamber pressure depends on quantity of gas added and on the chamber
temperature. If a high-power plasma has been run recently, the chamber will
be hotter and the rate-of-pressure rise will be greater for the same gas flow.
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System Manual
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The Tolerances page, accessed from the Utilities menu, is used to view, set, load defaults and
save Process Tolerances.
WARNING
CHANGING VALUES ON THIS PAGE WILL AFFECT SYSTEM PERFORMANCE AND
POSSIBLY INTRODUCE HAZARDS TO PERSONNEL.
THEREFORE, THIS PAGE MUST ONLY BE EDITED BY FULLY TRAINED PERSONNEL WHO
ARE AWARE OF THE RISKS INVOLVED.
Fig 5-21: Process tolerances page
NOTE:
In all of the Max Scale data fields, the displayed value is proportional to a
voltage, i.e. 4095 represents 10V, 2048 represents 5V, etc.
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The page provides the following features and facilities:
RKNMKNMKN _&igrave;&iacute;&iacute;&ccedil;&aring;&euml;=
Set Tols button
Click to send the current process tolerances to the PLC.
Load Defaults button
Click to load the default tolerance values.
Save Defaults button
Click to save the default tolerance values.
RKNMKNMKO p&oacute;&euml;&iacute;&Eacute;&atilde;=&euml;&Eacute;&iacute;&igrave;&eacute;=&iacute;&aacute;&atilde;&Eacute;&ecirc;&euml;=&eacute;~&aring;&Eacute;&auml;=
Over pressure
timeout alarm fields
The length of time (hours, minutes and seconds) before an
overpressure timeout alarm is triggered via a System Alert.
N2 pressure alarm
warning fields
The length of time (hours, minutes and seconds) before an N2
pressure warning is triggered via a System Alert.
N2 pressure failed
timeout fields
The length of time (hours, minutes and seconds) before an N2
pressure failed timeout is triggered via a System Alert.
RKNMKNMKP m&ecirc;&ccedil;&Aring;&Eacute;&euml;&euml;=&euml;&Eacute;&iacute;&igrave;&eacute;=&iacute;&aacute;&atilde;&Eacute;&ecirc;&euml;=&eacute;~&aring;&Eacute;&auml;=
Pump purge gas on
before flowing
process gas fields
The length of time (hours, minutes and seconds) after starting to
pump the purge gas before flowing process gas.
Pump purge gas on
after recipe finished
fields
The length of time (hours, minutes and seconds) after a recipe has
finished before flowing pump purge gas.
RKNMKNMKQ oc=d&Eacute;&aring;&Eacute;&ecirc;~&iacute;&ccedil;&ecirc;=N=&iacute;&ccedil;&auml;&Eacute;&ecirc;~&aring;&Aring;&Eacute;=&eacute;~&aring;&Eacute;&auml;=
Fwd fields
Tol% - The percentage difference between the setpoint and
readback before an alarm condition is triggered.
Max Scale – The maximum scale value (Watts).
Alarm Times – The length of time (hours, minutes and seconds)
after an alarm condition is triggered before a Forward Power outof-tolerance System Alert is raised.
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Ref fields
Tol% - The percentage difference between the setpoint and
readback before an alarm condition is triggered.
Max Scale – The maximum scale value (Watts).
Alarm Times – The length of time (hours, minutes and seconds)
after an alarm condition is triggered before a Reflected Power outof-tolerance System Alert is raised.
DcBias fields
Tol% - The percentage difference between the setpoint and
readback before an alarm condition is triggered.
Max Scale – The maximum scale value (Volts).
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Cap 1 fields
Position – The default position of the capacitor 1 shaft (% of full
stroke).
Max Scale – The maximum scale value (reference to voltage). Do
not change.
Cap 2 fields
Position – The default position of the capacitor 2 shaft (% of full
stroke).
Max Scale – The maximum scale value (reference to voltage). Do
not change.
RKNMKNMKS d~&euml;=&iacute;&ccedil;&auml;&Eacute;&ecirc;~&aring;&Aring;&Eacute;=&eacute;~&aring;&Eacute;&auml;=
01 to 12 fields
Tol% - percentage of full scale where a difference of more than this
value is considered and alarm condition.
Max Scale – The maximum scale value (sccm). Do not change.
RKNMKNMKT f`m=&Ouml;&Eacute;&aring;&Eacute;&ecirc;~&iacute;&ccedil;&ecirc;=&iacute;&ccedil;&auml;&Eacute;&ecirc;~&aring;&Aring;&Eacute;=&eacute;~&aring;&Eacute;&auml;=
Fwd fields
Tol% - percentage of full scale where a difference of more than this
value is considered and alarm condition.
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Max Scale – The maximum scale value (reference to voltage). Do
not change.
Alarm Times – The length of time (hours, minutes and seconds)
after an alarm condition is found causing a process shutdown.
Ref fields
Tol% - The percentage difference between the setpoint and
readback before an alarm condition is triggered.
Max Scale – The maximum scale value (reference to voltage). Do
not change.
Alarm Times – The length of time (hours, minutes and seconds)
after an alarm condition is found causing a process shutdown.
Printed: 06 November 2007 09:42
Operating Instructions
Page 5-57 of 60
Generic (OpAL Plasma) Issue 1: Oct. 07
l&eacute;^i=
System Manual
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Purge cycle fields
The maximum length of time (hours, minutes and seconds) the
process chamber is purged before venting is continued.
Vent to atmosphere
fields
The maximum length of time (hours, minutes and seconds) the
process chamber is vented before a timeout condition is reached.
RKNMKNMKV e&Eacute;~&iacute;&Eacute;&ecirc;=&iacute;&ccedil;&auml;&Eacute;&ecirc;~&aring;&Aring;&Eacute;=&eacute;~&aring;&Eacute;&auml;=
Tol% – The percentage difference between the cryo temperature setpoint and readback
before an alarm condition is triggered.
Max Scale – The maximum scale value (deg C).
RKNMKNMKNM ^m`=q&ccedil;&auml;&Eacute;&ecirc;~&aring;&Aring;&Eacute;=&eacute;~&aring;&Eacute;&auml;=
Pressure fields
Tol% – The percentage difference between the process chamber
pressure setpoint and readback before an alarm condition is
triggered.
Max Scale – The maximum scale value (Torr).
Stabilise Time fields
The maximum length of time (hours, minutes and seconds) before
the process chamber pressure has stabilised.
Generic (OpAL Plasma) Issue 1: Oct. 07
Operating Instructions
Page 5-58 of 60
Printed: 06 November 2007 09:42
System Manual=
RKNN
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l&eacute;^i
i&ccedil;&Ouml;=&Ntilde;&aacute;&auml;&Eacute;&euml;=
While PC 2000 is running, two log files are maintained, one for the system log and the other
for the data log. These files are stored on your hard disk in the folder C:\Optsyslg. Details of
the log files are as follows.
System log file – The filename for this file is of the form s0Caabb where aa represents the
month, e.g. 06 (for June) and bb represents the day of the month, e.g. 11 (for the eleventh
day).
Data log file – The filename for this file is of the form p1caabb where aa represents the
month, e.g. 06 (for June) and bb represents the day of the month, e.g. 11 (for the eleventh
day).
When PC 2000 is shut down correctly (select the System menu, then the Exit option), both log
files are automatically saved and closed. If PC 2000 is then started again, the files are
automatically opened and their data is available via the System Log page and the Select Log
Data page.
If PC 2000 is not shut down correctly, e.g. the PC is switched off or the PC ‘hangs’ etc., one or
both of the log files can become corrupted. If this happens, the next time PC 2000 is started
the corrupt log file(s) will be detected and reported on-screen by an error dialogue. To
correct this problem, use the following procedure:
1) Close PC 2000.
2) Use Windows Explorer to navigate to C:\Optsyslg.
3) Delete the reported log file.
4) Re-start PC 2000.
Printed: 06 November 2007 09:42
Operating Instructions
Page 5-59 of 60
Generic (OpAL Plasma) Issue 1: Oct. 07
l&eacute;^i=
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
System Manual
NOTES:
Generic (OpAL Plasma) Issue 1: Oct. 07
Operating Instructions
Page 5-60 of 60
Printed: 06 November 2007 09:42
System Manual
Oxford Instruments Plasma Technology
OpAL
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
6
Maintenance
6 Maintenance ......................................................................................................... 6-1
6.1 Periodic maintenance schedule..................................................................... 6-2
6.2 General........................................................................................................ 6-3
6.2.1 Weekly.....................................................................................................6-3
6.2.2 Monthly ...................................................................................................6-3
6.2.3 Changing the gas bottles.........................................................................6-5
6.3 Process chamber.......................................................................................... 6-6
6.3.1 Monthly ...................................................................................................6-6
6.3.2 Annually ..................................................................................................6-6
6.4 Substrate table (lower electrode) .................................................................. 6-7
6.4.1 Monthly ...................................................................................................6-7
6.5 Vacuum gauges ........................................................................................... 6-7
6.5.1 Capacitance manometer ..........................................................................6-7
6.6 Gas handling system .................................................................................... 6-8
6.6.1 Wall-mounted gas pod ............................................................................6-8
6.6.2 Mass flow controllers (MFC) .....................................................................6-8
6.6.3 Filters......................................................................................................6-9
6.6.4 Precursor cabinet and delivery system .....................................................6-9
6.7 Pumping system ........................................................................................ 6-11
6.7.1 Exhaust filter with oil feedback and chemical filter.................................6-11
6.7.2 Rotary vane pumps................................................................................6-11
6.8 Pump lubricants......................................................................................... 6-13
6.8.1 General .................................................................................................6-13
6.8.2 Hydrocarbon lubricants (mineral oils) ....................................................6-14
6.9 Temperature controller auto-tune set-up................................................... 6-14
Fig 6-1: Schematic of precursor cabinet .....................................................................6-10
Fig 6-2: Table heater panel ........................................................................................6-14
Fig 6-3: Service mode page showing the HEATER CALIBRATION button ......................6-15
Table 6-1: Periodic maintenance schedule ...................................................................6-2
Note that this section includes references to optional equipment which may not be fitted
to your particular system.
WARNINGS
BEFORE STARTING ANY MAINTENANCE WORK, SWITCH OFF AND LOCK OFF
THE MAIN INCOMING CIRCUIT BREAKER.
ENSURE THAT ONLY FULLY AND APPROPRIATELY QUALIFIED PERSONNEL ARE
ALLOWED TO WORK ON THE SYSTEM.
READ THE HEALTH AND SAFETY SECTION AT THE BEGINNING OF THIS
MANUAL.
WARNING
SAFETY OF THE OPERATOR RELIES UPON THE INTEGRITY OF THE INTERLOCK
CHAIN. IT IS IMPORTANT THAT THE FUNCTIONALITY OF THE INTERLOCK
CHAIN IS REGULARLY TESTED.
Printed: 14-Jul-10, 8:14
Maintenance
Page 6-1 of 16
Issue 4: July 10
OpAL
Oxford Instruments Plasma Technology
System Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
6.1
Periodic maintenance schedule
Periodic maintenance requerments are listed in Table 6-1. However, this list is not
exhaustive and must be read in conjunction with the remainder of this Section.
Item
1
2
3
Description
Vacuum switch
Interlock chain
Chamber seals
Action
Check the interlock.
Check the function of all interlocks.
Wipe using lint cloth and IPA
4
CM gauge zero
drift
Chamber liners
Reset 0
Frequency
Weekly.
Monthly
Monthly – change seals
annually.
Quarterly
Remove upper and lower liners and bead
blast. If available, ultra sonic clean.
Exchange for new ones.
Every 5-microns
deposition on wafer
Annually
Leak check.
Clean.
Check level
Monthly
Annually
TMA – weekly
Other chemistries –
monthly
Renew
Anually or sooner
depending on process.
TMA – weekly
Other chemistries –
monthly
5
6
7
8
9
10
Chamber gas
springs
Precursor line
ALD valves
Pump oil
Oil cartridge filter
Check
Renew
11
12
ICP 65 ceramic
tube
Showerhead
Remove and bead blast, wipe with IPA
Remove and bead blast
13
14
Electrode
ICP gate valve
Remove and bead blast
Remove actuator and clean
Anually or sooner
depending on process.
Annually
Every 5-microns
deposition on wafer
Annually
Annually
Table 6-1: Periodic maintenance schedule
Issue 4: July 10
Maintenance
Page 6-2 of 16
Printed: 14-Jul-10, 8:14
System Manual
Oxford Instruments Plasma Technology
OpAL
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
6.2
General
WARNING
ISOPROPYL ALCOHOL IS HIGHLY INFLAMMABLE (FLAMMABLE). DO NOT USE
IT NEAR A NAKED FLAME OR ENERGISED ELECTRICAL EQUIPMENT.
6.2.1
Weekly
1)
Examine the exterior of the machine for damage or signs of overheating and for failed
indicator lamps.
2)
Examine the service connections of the machine for signs of fluid leaks or loose electrical
connectors.
3)
Check the functionality of the vacuum switch interlock switch, as described in the following
steps:
4)
6.2.2
a)
Select the Pumping page on the PC2000 application.
b)
Vent the process chamber.
c)
Check that the Process Interlock field on the Pumping page displays the
message “Fault”.
d)
Evacuate the process chamber.
e)
Check that the message in the Process Interlock field on the Pumping
page changes to “OK”.
f)
If this test fails, stop using the system and contact your local OIPT office
for advice.
g)
Examine the exterior of the machine for damage or signs of overheating
and for failed indicator lamps.
Note, in the machine’s log book, the time taken for the machine to pump down from
atmosphere to a standard pressure. An increase in this time may indicate a leak, a decrease
in pumping efficiency, a change in a vacuum gauge or in a vacuum valve.
Monthly
1)
Printed: 14-Jul-10, 8:14
Check the functionality of the interlock chain, as described in the following
steps:
a)
Access the interlock chain terminals as described in section 3.4.
b)
Connect a digital voltmeter, set to a suitable DC voltage range, to the
interlock chain terminals.
c)
Toggle each interlock in turn to check operation of the associated contacts.
d)
If any interlock fails, shut down the system and do not operate it. Contact
OIPT technical support for instructions.
Maintenance
Page 6-3 of 16
Issue 4: July 10
OpAL
Oxford Instruments Plasma Technology
System Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
2)
The O-rings should be checked monthly but replaced as and when necessary.
Replacement O-rings should be constructed of FR10/80 and pre-baked to 180&deg;C to
minimise the risk of gas escaping from the chamber. The chamber lid O-ring should not
need to be removed unless it leaks. Clean the O-ring in situ using a lint-free cloth wetted
with Isopropyl Alcohol.
To change the lid O-ring (use gloves):
6.2.2.1
i)
Remove the O-ring, being careful not to damage the retaining groove.
ii)
Use a lint-free cloth and IPA to clean the O-ring sealing face on the
chamber.
iii)
The new O-ring, cleaned with IPA, should be inserted with no twists.
Stretch the O-ring evenly as it is inserted to avoid local regions of
stretching.
3)
Monitor the vacuum integrity of the system by pumping thoroughly, isolating the
process chamber and noting the rate of pressure rise. An abnormally high value
may indicate a leak or heavy contamination of the process chamber. See subsection 6.2.2.1 for leak check procedures.
4)
Monitor the rotary pump condition by timing how long it takes to pump from
atmosphere to 0.1 Torr. An increase in time may indicate deteriorating pump
performance.
5)
Monitor the condition of the oil filter by ensuring that the oil is still flowing.
Ensure that the oil filter is not clogged by ensuring that the pressure gauge
reading is &lt; 2 bar
6)
Check the zero setting of the capacitance manometer. A rotary pump should give
a base pressure below 10 mTorr, so a true zero pressure cannot be set in this
case. Either the gauge should be set to the same arbitrary reference level (e.g.
10 mTorr), or it should be set to zero on another vacuum system with a known
base pressure, and carefully re-installed in the OpAL system.
7)
Monitor the performance of each mass flow controller, by noting the system
pressure with 10%, 50% and 100% flow set points and the throttle fully open. A
change may indicate a deterioration in MFC performance, or a change in
pumping speed.
Vacuum leak rate check
To perform a process chamber leak-rate check, use the following procedure:
1)
Pump the system down using a manual process.
2)
Press the Abort button. The gate valve will close and the sealed chamber
pressure can be monitored on-screen.
3)
To perform a process chamber and gas line leak-rate check, use the following
procedure:
Issue 4: July 10
Maintenance
Page 6-4 of 16
Printed: 14-Jul-10, 8:14
System Manual
Oxford Instruments Plasma Technology
OpAL
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
6.2.3
4)
Close the gas bottle outlet valve associated with the gas line to be checked.
5)
Pump down the system and flow 100% all gases until flow readbacks are zero.
This will require pumping for a few hours.
6)
Manually close the gate valve by removing its 24V dc connector plug.
7)
Monitor the leak rate on-screen.
Changing the gas bottles
The operator should be aware that certain process parameters may change as the process
gas bottles pressure drops. For example, inert gas bottles which are normally filled to
about 3000 psi, should be changed when the pressure drops below 400 psi. The inlet
pressure should be 25 - 35 psia. Before disconnecting the empty bottle it is advisable to
thoroughly evacuate the gas line (by closing the gas bottle tap and pumping the line via
the MFC). The line should then be filled with dry N2 if available.
Once the new bottle has been connected, monitor the vacuum integrity of the gas line
before opening the bottle by setting a high flow on the MFC, pumping the line thoroughly
(via the MFC), isolating the process chamber and noting the rate of pressure rise. An
abnormally high value (&gt;2mTorr/minute) may indicate a leak in the gas line or the
regulator to bottle connection.
During normal operation the bottle pressure and line pressure on the cylinder regulator
should be regularly checked for loss of pressure during periods when the gas bottle tap is
turned off (during shut-down periods, overnight or over a weekend). This will indicate a
leak from the gas line or the regulator.
Printed: 14-Jul-10, 8:14
Maintenance
Page 6-5 of 16
Issue 4: July 10
OpAL
System Manual
Oxford Instruments Plasma Technology
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
6.3
Process chamber
WARNING
BEFORE ATTEMPTING ANY MAINTENANCE WORK ON THE PROCESS
CHAMBER, IT MUST BE SUBJECTED TO AT LEAST TWO VENT CYCLES
SUBSEQUENT TO A PROCESSING RUN.
HEATED TABLES MUST BE ALLOWED TO COOL TO ROOM TEMPERATURE
BEFORE CLEANING THE CHAMBER WITH SOLVENTS.
CRYOGENICALLY COOLED TABLES MUST BE BROUGHT TO ROOM
TEMPERATURE BEFORE MAINTENANCE WORK.
6.3.1
Monthly
1)
Visually examine the interior of the chamber for contamination. Any necessary
cleaning should be carried out using a lint-free cloth moistened with Isopropyl
Alcohol (IPA). Tougher deposits can be removed using an abrasive pad first.
WARNING
ISOPROPYL ALCOHOL IS HIGHLY INFLAMMABLE (FLAMMABLE). DO NOT USE
IT NEAR A NAKED FLAME OR ENERGISED ELECTRICAL EQUIPMENT.
6.3.2
2)
Examine the exterior of the chamber and its fittings for damage.
3)
Examine the lid and seals for any damage or deterioration.
4)
Examine the heating/cooling water flow system (outside and inside the machine
covers) for signs of leakage.
5)
Purge the process chamber for thirty minutes with dry nitrogen if IPA has been
used for cleaning.
6)
Inspect the chamber gas springs for signs of wear and damage. Check that the
gas springs operate correctly.
Annually
1)
Issue 4: July 10
Exchange the chamber and loadlock gas springs for new ones.
Maintenance
Page 6-6 of 16
Printed: 14-Jul-10, 8:14
System Manual
Oxford Instruments Plasma Technology
OpAL
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
6.4
Substrate table (lower electrode)
WARNING
BEFORE ATTEMPTING ANY MAINTENANCE WORK ON THE MACHINE, THE
PROCESS CHAMBER MUST BE SUBJECTED TO AT LEAST TWO VENT CYCLES
SUBSEQUENT TO A PROCESSING RUN.
6.4.1
Monthly
1)
Visually examine the substrate table for contamination. Any necessary cleaning
should be carried out using a lint-free cloth soaked in Isopropyl Alcohol (IPA).
WARNING
ISOPROPYL ALCOHOL IS HIGHLY INFLAMMABLE (FLAMMABLE). DO NOT USE
IT NEAR A NAKED FLAME OR ENERGISED ELECTRICAL EQUIPMENT.
2)
6.5
Examine the table and its integral heating and/or cooling systems for signs of
damage.
Vacuum gauges
WARNING
ISOPROPYL ALCOHOL IS HIGHLY INFLAMMABLE (FLAMMABLE). DO NOT USE
IT NEAR A NAKED FLAME OR ENERGISED ELECTRICAL EQUIPMENT.
6.5.1
6.5.1.1
Capacitance manometer
Six-monthly (or as necessary)
1)
Remove the capacitance manometer from the process chamber.
WARNING
ISOPROPYL ALCOHOL IS HIGHLY INFLAMMABLE (FLAMMABLE). DO NOT USE
IT NEAR A NAKED FLAME OR ENERGISED ELECTRICAL EQUIPMENT.
2)
Carefully pour a measure of Isopropyl Alcohol (IPA) at room temperature into the
pressure-measurement cavity. Do not allow IPA to come into contact with
electronic components.
3)
Agitate the solvent carefully and then pour it out.
Printed: 14-Jul-10, 8:14
Maintenance
Page 6-7 of 16
Issue 4: July 10
OpAL
Oxford Instruments Plasma Technology
System Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
CAUTION
Because the diaphragm in the gauge is thin tensioned metal, it can be
destroyed
by sudden changes in temperature or by clumsy handling.
4)
Re-install the gauge, allowing sufficient time for outgassing of the cavity and
diaphragm prior to operation.
NOTE: See manufacturer's literature for calibration adjustments.
6.6
Gas handling system
WARNING
BEFORE ATTEMPTING ANY MAINTENANCE WORK ON THE GAS HANDLING
SYSTEM, ELECTRICALLY ISOLATE THE SYSTEM BY SWITCHING OFF AND
LOCKING OFF THE WALL-MOUNTED SAFETY ISOLATION BOX. PROCESS
GASES USED MAY BE TOXIC OR FLAMMABLE. ADOPT THE CORRECT
PROCEDURES WITH REGARD TO PURGING BEFORE REMOVING OR LOOSENING
COMPONENTS CARRYING THESE GASES. WEAR PROTECTIVE CLOTHING.
6.6.1
6.6.1.1
Wall-mounted gas pod
Annually
Ensure the gas pod and its fixings are secure.
IMPORTANT:
OIPT gas pods typically weigh &gt;40kg. Ensure the wall and gas pod
fixings are sturdy enough to bear at least four times the weight of the gas pod.
6.6.2
Mass flow controllers (MFC)
6.6.2.1
Annually (or as necessary)
If an MFC needs cleaning, repair or recalibration:
1)
Make sure MFC has been thoroughly purged before removal.
2)
Discuss with the vendor the return of the MFC for service work. Inform the
vendor if hazardous gases have been used.
Issue 4: July 10
Maintenance
Page 6-8 of 16
Printed: 14-Jul-10, 8:14
System Manual
Oxford Instruments Plasma Technology
OpAL
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
6.6.3 Filters
6.6.3.1
Annually (or as necessary)
The process gas filter elements will need replacing at a frequency that depends on both
the nature and purity of the process gases, and of other materials that come into contact
with them. The filters could need changing more or less often than annually.
6.6.4
6.6.4.1
1)
Make sure line has been thoroughly purged before removal.
2)
Unscrew union nut and remove assembly.
3)
Tap filter element lightly on side with a fibre mallet to loosen and remove
element.
4)
Fit new element.
5)
Re-assemble.
Precursor cabinet and delivery system
Monthly
Leak check the precursor delivery line, as described in Appendix PSP.
6.6.4.2
Annually
The ALD valves must be cleaned once a year.
1)
Shut down the system for service.
2)
Turn off the manual valves on all precursor pots. The manual valves are
identified in section 3 of this manual.
3)
Pump out and purge the delivery line to remove all residual precursor material.
This is described in Appendix PSP.
4)
Perform a risk assessment for the relevant precursor materials and wear
appropriate personal protective equipment.
5)
Remove the fast ALD valve from the outlet line on each bubbler. These valves are
identified as D1, D2, D3 and D4 in Fig 6-1.
Printed: 14-Jul-10, 8:14
Maintenance
Page 6-9 of 16
Issue 4: July 10
OpAL
Oxford Instruments Plasma Technology
System Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
Fig 6-1: Schematic of precursor cabinet
6)
Place the valves in an ultrasonic bath filled with isopropyl alcohol so that the
valve ports are immersed but the valve actuators are not.
7)
Attach a supply of clean, regulated compressed air to each valve actuator to
open each valve.
8)
Ultrasonically clean the valves for one hour.
9)
Remove the valves from the bath and use a pipe cleaner ( or similar) to remove
any remaning precursor from the valve body.
10)
Bake the valves at 100&deg;C for thirty minutes to remove all traces of isopropyl
alcohol.
11)
Refit the ALD valves to the system.
12)
Start the system up.
13)
Leak test the precursor lines and prepare them for use, as described in
Appendix PSP.
Issue 4: July 10
Maintenance
Page 6-10 of 16
Printed: 14-Jul-10, 8:14
System Manual
Oxford Instruments Plasma Technology
OpAL
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
6.7
Pumping system
WARNING
BEFORE ATTEMPTING ANY MAINTENANCE WORK ON THE PUMPING SYSTEM,
THE PROCESS CHAMBER MUST BE SUBJECTED TO AT LEAST TWO MANUALLY
CONTROLLED VENT CYCLES SUBSEQUENT TO ANY RUN WHERE CORROSIVE,
TOXIC OR INFLAMMABLE (FLAMMABLE) PROCESS GASES HAVE BEEN USED.
THE SYSTEM MUST THEN BE ELECTRICALLY ISOLATED (SWITCHED OFF ).
CAUTION
When changing or topping-up the lubricating oil in a pump, always use oil
of the same brand and type. If a change of brand or type is contemplated,
refer to Oxford Instruments Plasma Technology for advice.
6.7.1
6.7.1.1
Exhaust filter with oil feedback and chemical filter
Weekly
Inspect the filter differential pressure indicator (if fitted) and change the filter cartridge if
necessary. If perfluoropolyether (PFPE) oil is used in the pump, change the filters when
the oil becomes cloudy.
WARNING
HAZARDOUS SUBSTANCES MAY ESCAPE FROM THE FILTER AND OIL. TAKE
SUITABLE PRECAUTIONS SUCH AS WEARING GLOVES, GOGGLES OR GAS
MASK.
6.7.1.2
During an oil change
Always change the filters when the oil is changed. Note that the oil trapped in the filter
cartridge housing must also be drained and re-filled.
6.7.2
6.7.2.1
Rotary vane pumps
Weekly
Inspect the oil level. If the level is low, switch off the system and replenish.
6.7.2.2
Bi-weekly (or at 400 hours operating time)
Inspect the quality of the oil visually, chemically and with regard to its viscosity (see
manufacturer's literature) to establish its rate of deterioration for a given process. Once
this has been established, the oil should be changed regularly at that frequency, but
never less frequently than every 2000 hours. Always change the oil filters when the oil is
changed.
Printed: 14-Jul-10, 8:14
Maintenance
Page 6-11 of 16
Issue 4: July 10
OpAL
Oxford Instruments Plasma Technology
System Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
Note that PFPE oil should never need changing if used as specified.
CAUTION
Changing from a PFPE oil to a mineral oil or vice versa should only be
attempted after reference to the manufacturers. If the oils are allowed to
come into contact with each other, they emulsify, with fatal results for the
pump.
6.7.2.3
Annually
Remove and clean the wire mesh filters (if fitted) on the intake ports, using a
perfluorinated liquid such as Freon when PFPE oil is in use, or Isopropyl alcohol (IPA)
when mineral oils (hydrocarbons) are in use.
CAUTION
When replacing filters, do NOT change filter type (filling material) without
reference to Oxford Instruments Plasma Technology.
Issue 4: July 10
Maintenance
Page 6-12 of 16
Printed: 14-Jul-10, 8:14
System Manual
Oxford Instruments Plasma Technology
OpAL
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
6.8
Pump lubricants
CAUTION
When changing or topping-up the lubricating oil in a pump, always use oil
of the same brand and type. If a change of brand or type is contemplated,
refer to Oxford Instruments Plasma Technology for advice.
6.8.1
General
The lubricating oils used for pumps where the oil comes into contact with the pumped
gases, i.e. oil-sealed pumps such as rotary vane types, should be chosen to meet the
specific characteristics necessary for the process involved.
The vapour pressure must be low at the temperatures reached at the rubbing surfaces.
Viscosity should not vary significantly over the temperature range involved, and the water
absorption rate and content must be low.
Lubricating oils generally fall into one of two categories: mineral (hydrocarbon) based oil
or synthetic oil such as perfluorinated polyether. The synthetic oils are normally used
where they come into contact with strong oxidants such as nitrogen dioxide, oxygen, or
one of the halogens.
6.8.1.1
Perfluorised polyethers
Perfluorised polyether (PFPE) lubricants have the following properties:
a)
They are stable up to 350&deg;C, i.e. they do not decompose below this temperature.
b)
They are chemically inert. They will, however react with Lewis acids (BCI3, AICI3
etc.) at temperatures over 100&deg;C.
c)
They do not polymerise under the impact of high-energy radiation.
d)
Since they tend not to keep contaminants suspended, always consider whether
suitable oil filters are needed for the application.
e)
They do not 'age' and therefore, if used correctly, need not be replaced during the
lifetime of the pump.
f)
Any contaminants in the lubricant may be removed by fitting clean filters and
letting the pump run for several hours with inert gas ballast, the intake port
having been closed.
g)
They do not protect metal surfaces against corrosion. Pumps should therefore
always be flushed with inert gas. Pumps using PFPE should be allowed to run
continuously, unless the process is non-corrosive and the pump is vented to dry
Nitrogen.
h)
PFPE is incompatible with hydrocarbon oils, i.e. mineral oils, conventional greases
and cleaning agents.
If a pump uses PFPE lubricant only Freon 113 or Frigen 113 may be used as a
cleaning agent, and only PFPE grease may be employed.
Printed: 14-Jul-10, 8:14
Maintenance
Page 6-13 of 16
Issue 4: July 10
OpAL
Oxford Instruments Plasma Technology
System Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
6.8.2
I)
If it should become necessary to change from PFPE to mineral oil lubrication or
vice versa, the pump must be completely disassembled, freed of lubricant and
fitted with new gaskets and vanes.
j)
At temperatures over 350C, hazardous gaseous decomposition products are
formed. Therefore do not smoke in rooms where PFPE is used, and make sure
that no tobacco comes into contact with PFPE.
k)
When handling PFPE, protective clothing must be used.
l)
Do not mix PFPE with used oil. Dispose of them separately.
m)
PFPE is normally odourless and colourless. Cloudiness or odour is a sign of
contamination.
Hydrocarbon lubricants (mineral oils)
Where mineral oils are used, the rate of oil deterioration for a particular pump and
process should be established at an early stage, and oil changes based upon this
information.
6.9
Temperature controller auto-tune set-up
The table heater is controlled by a Proportional-Integral-Derivative (PID) loop via the PLC.
To set the table heater temperature, an auto-tune set-up software sequence is carried
out.
The temperature controller auto-tune set-up is carried out by OIPT prior to system
shipment. However, if required, it can be carried out by the customer using the following
procedure.
NOTE:
The temperature controller auto-tune set-up procedure will take
approximately between one hour and one hour twelve minutes to complete.
1)
On the Process Control page’s TABLE HEATER panel (see Fig 6-2), enter the
heater setpoint into the white data field. Note the value entered must be 80 to
100 degrees higher than the actual temperature for the PID to auto-tune.
Fig 6-2: Table heater panel
2)
Select the START button and then the STOP button to download the setpoint to
the PLC.
3)
From the System Menu, select the Service option to display the Service Mode
page.
Issue 4: July 10
Maintenance
Page 6-14 of 16
Printed: 14-Jul-10, 8:14
System Manual
Oxford Instruments Plasma Technology
OpAL
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
Fig 6-3: Service mode page showing the HEATER CALIBRATION button
NOTE: Once the auto-tune sequence has been started, it cannot be stopped except by
switching the system off.
4)
Select the HEATER CALIBRATION button. You will be prompted for confirmation;
select the Yes button. The message ‘CALIBRATION STARTED’ is displayed.
5)
Exit from Service Mode and then select the System Menu’s Chamber 1 option.
The Process Control page is displayed.
In the TABLE HEATER panel, the message ‘AUTO-TUNE RUNNING’ is displayed. The actual
temperature value will increase towards the set-point value. On completion of auto-tune
the message ‘HEATER READY’ is displayed (this will take approximately one hour to one
hour and twelve minutes).
NOTES:
If the water flow switch or thermo snapswitch (if fitted) fail while auto-tune is
running, the message ‘HEATER FAIL’ will be displayed. If this happens, investigate and fix
the fault and then re-start this procedure from Step 1).
If the water flow switch or thermo snapswitch (if fitted) fail temporarily during heating
(i.e. when HEATER READY is displayed), the message ‘PLEASE TUNE ME’ will be displayed.
When the flow switch/snapswitch recover, the HEATER READY message is displayed again,
the heater is again ready for use – do not re-tune the heater.
Printed: 14-Jul-10, 8:14
Maintenance
Page 6-15 of 16
Issue 4: July 10
OpAL
Oxford Instruments Plasma Technology
System Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
NOTES:
Issue 4: July 10
Maintenance
Page 6-16 of 16
Printed: 14-Jul-10, 8:14
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
T
q&ecirc;&ccedil;&igrave;&Auml;&auml;&Eacute;&euml;&Uuml;&ccedil;&ccedil;&iacute;&aacute;&aring;&Ouml;=
7 Troubleshooting ........................................................................................................................... 7-1
7.1 Customer Support Facilities ................................................................................................. 7-2
7.2 General ................................................................................................................................... 7-3
7.3 Troubleshooting chart........................................................................................................... 7-3
7.4 Emergency Off chain ............................................................................................................. 7-8
7.5 Interlocks................................................................................................................................ 7-9
7.5.1 General description ........................................................................................................................7-9
7.5.2 Gas box interlocks.........................................................................................................................7-11
7.5.3 System Link Configuration Table.................................................................................................7-12
7.5.4 System LED Monitoring Table......................................................................................................7-12
Fig 7-1: Emergency off chain ..............................................................................................................................7-8
Fig 7-2: Gas box interlock chain .......................................................................................................................7-11
Printed: 25-Oct-07, 11:47
Troubleshooting
Page 7-1 of 12
Issue 1: August 07
l&eacute;^i
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
System Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
TKN
`&igrave;&euml;&iacute;&ccedil;&atilde;&Eacute;&ecirc;=p&igrave;&eacute;&eacute;&ccedil;&ecirc;&iacute;=c~&Aring;&aacute;&auml;&aacute;&iacute;&aacute;&Eacute;&euml;=
Oxford Instruments Plasma Technology has global Customer Support Facilities to provide a coordinated response to customer’s queries. All queries are recorded on our Support Database
and dealt with as quickly as possible. If we are not able to answer the query immediately, we
will contact you as soon as possible.
Before contacting a Customer Support Facility, please ensure that you have referred to the
appropriate section of your system manual, OEM manuals and electrical drawings.
Please direct all queries through your nearest support facility (see below) and have the
following details available.
System Type, e.g. l&eacute;^i=etc.
Works Order No. – This can be found on the front cover of your system manual.
Contact Information – Your name, Company and how we can contact you.
Details of your query – nature of the problem, part numbers of spares required, etc.
You can contact us via any of the following:
China
Beijing
Tel: +86 106518 8160
Email: [email protected]
Shanghai
Tel: +8621 6360 8530
Email: [email protected]
Taiwan
Tel: +886 3 5788696
Email: [email protected]
UK
Customer Support Hotline: +44(0) 1934 837070
(0800 – 2000 UK local time)
Fax: +44(0) 1934 837071
Email: [email protected]
Germany
Tel: +49 6122 937 161
Email: [email protected]
Japan
Tel: +81 3 5245 3591
Email: [email protected]
Singapore
Tel: +65 6337 6848
Email: [email protected]
Issue 1: August 07
USA
Concord, MA
Tel: +1 978 9933 ext. 444
Toll Free: +1 800 447 4717 ext. 444
Fax: +1 978 369 8287
Email: [email protected]
Troubleshooting
Page 7-2 of 12
Printed: 25-Oct-07, 11:47
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
TKO
d&Eacute;&aring;&Eacute;&ecirc;~&auml;=
WARNING
1) BEFORE REMOVING THE EXTERNAL COVERS OF THE SYSTEM, ISOLATE
THE SYSTEM ELECTRICALLY BY SWITCHING OFF THE INCOMING MAINS
SAFETY ISOLATOR (MOUNTED ADJACENT TO THE MACHINE) .
2) READ THE HEALTH AND SAFETY SECTION AT THE FRONT OF THIS
MANUAL.
What may appear to be faults are sometimes simply the failure on the part of the operator to
follow the correct procedures. Before spending time, therefore, searching for a failed
component, ensure that the pre-power-up check has been carried out (see Section 5) and that
all plugs and connectors are secure.
TKP
q&ecirc;&ccedil;&igrave;&Auml;&auml;&Eacute;&euml;&Uuml;&ccedil;&ccedil;&iacute;&aacute;&aring;&Ouml;=&Aring;&Uuml;~&ecirc;&iacute;=
Note that the selection of faults given for each symptom may not be exhaustive.
Symptom
No Power to
system
Possible Faults and Checks
1) Incoming mains safety isolator (mounted adjacent to the machine)
switched off.
Also, in PC 2000 on
the Pump Control
page, the PSU
Monitor indicator
is coloured red.
2) SYSTEM CONTROL ON button not operated. (Located on front panel).
3) EMERGENCY OFF button not released – twist clockwise to release. (Located
on the control panel).
4) External Emergency Off circuit is open circuit. Check that Socket 7 has a
shorting plug fitted. (Located at rear of machine).
WARNING
THE CIRCUIT BREAKERS CB1 AND CB2 ARE LOCATED
WITHIN THE POWER DISTRIBUTION UNIT. DO NOT
REMOVE THE COVER OF THIS UNIT UNLESS YOU ARE
FULLY TRAINED AND AWARE OF THE RISKS
INVOLVED.
5) Circuit breaker CB1 de-energised.
6) Circuit breaker CB2 de-energised. This CB supplies the &plusmn;15V dc and 24V dc
power supply unit. Check FUSES 1, 2 and 3 and the &plusmn;15V dc and 24V dc
power supply unit’s outputs.
Printed: 25-Oct-07, 11:47
Troubleshooting
Page 7-3 of 12
Issue 1: August 07
l&eacute;^i
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
Symptom
Pumps not
operating
Possible Faults and Checks
1) Pump not turned on: use the Pump control page and click on the relevant
EVACUATE button to start it.
2) Pump cable not connected. Plug 10 (pump 1) and Plug 9 (pump 2) located
at the rear of the machine.
WARNING
THE CIRCUIT BREAKERS CB12 AND CB 13, AND
CONTACTORS K2 AND K3 ARE LOCATED WITHIN THE
POWER DISTRIBUTION UNIT. DO NOT REMOVE THE
COVER OF THIS UNIT UNLESS YOU ARE FULLY
TRAINED AND AWARE OF THE RISKS INVOLVED.
3) Circuit breaker CB12 (pump 1) and CB13 (pump 2) de-energised.
4) Contactor K2 (pump 1) and K3 (pump 2) de-energised. Refer to the 80 Plus
Power Distribution circuit diagram.
Excessive time to
achieve base
pressure of
&lt;10 mTorr.
1) Rotary pumps not operating. (See preceding sub-section).
2) Capacitance Manometer (CM) gauge not operating correctly. Refer to the
CM gauge manual.
3) Excessive water vapour in the process chamber. Continue pumping with gas
ballast open on the rotary pump (where possible) or with a flow of inert
gas.
Issue 1: August 07
Troubleshooting
Page 7-4 of 12
Printed: 25-Oct-07, 11:47
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
Unable to strike a
Plasma
1) Chamber pressure out of correct operating range. Set correct pressure.
2) Other process variables incorrect. RF will not be turned on until electrode
temperature, gas flows and process pressure are close to demand values.
3) Gas isolation valves not operating. Check for correct compressed air supply.
4) RF generator not operating. Check that generator’s mains switch is set to
ON, and that the AC ON indicator is lit. Check CB4 is made.
NOTE:
RF generator will only switch on when the chamber is below
600 mbar (vacuum switch closed).
Is RF generator MAX POWER indicator on or the reflected power high? If so,
refer to the RF generator and automatch unit manuals..
5) Automatch unit problems: read the following text:
Automatch set to 'manual' with capacitors in the wrong positions (retune
manually or set to 'auto').
Automatch not powered (connect automatch cables)
Automatch capacitor(s) stopped at maximum or minimum (some versions
of automatch require manual retuning if a capacitor reaches an end stop retune manually away from the end and set to 'auto')
A good match and a plasma can be obtained by manual tuning, but not by
automatching:
a) The capacitor electrical end stop positions do not coincide with the
mechanical maximum and minimum points of a variable capacitor
(usually means the capacitor has slipped mechanically on the drive
shaft; re-align the electrical and mechanical end positions and
retighten the shaft connections)
b) Refer to instructions for setting up the automatch - it is normally
necessary to manually tune to a good match, then adjust the auto
mode to recognise this as a good match point. In some systems reteaching is required for process conditions which are very different
from each other.
Arcing between the vanes of an air-vane variable capacitor. (Turn off the RF
immediately - the capacitor can be permanently damaged. Investigate for
vanes which are out of alignment. Repair may be possible, but arcing
usually requires the capacitor to be replaced.)
6) Is RF generator OVERHEAT indicator on? If so, refer to the RF generator
manual. Water-cooled versions: turn on the water, check for blocked pipe
or high back pressure. Air-cooled versions: check for obstructions to air
flow and high ambient temperature.
Printed: 25-Oct-07, 11:47
Troubleshooting
Page 7-5 of 12
Issue 1: August 07
l&eacute;^i
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
Unable to strike a
Plasma (continued)
7) Is the RF ON indicator on when requesting RF power? If not:
a)
b)
c)
d)
8)
Check the rf power demand is not zero
Check the rf remote cable is properly connected
Check the vacuum interlock is made
Contact an Oxford Instruments Plasma Technology engineer.
Check that the reflected RF power is less than 10% of the forward
power. If not, carry out the following checks:
a) Check the cable between the RF generator and the automatch unit.
b) Check the connection between the automatch and electrode.
c)
RF electrode resistance to chassis should be &gt; 1Mohm, if
significantly less, look for a short circuit.
d) If manual control of the automatch is available, attempt a manual
match. If, in a manual match the reflected power can be reduced to
less than 10% of forward power, the problem is in the automatch
unit – refer to the automatch manual.
In PC 2000, on the
Pump Control
page, the Water
Off indicator is
coloured red.
Issue 1: August 07
9)
Check that the plasma really is absent: low power and high pressure
plasmas in O2 or SF6 emit very little visible light; DC bias values will be
low for these plasmas, and low or zero for PECVD, PE- mode and RIE
mode when an insulating cover plate is used.
10)
Check the condition of the process chamber. Heavy contamination of
either electrode can lead to difficulty in striking a plasma
11)
Try starting the plasma with the automatch capacitors at different
staring values. The approach to match can sometimes take the electrode
through a maximum voltage point which assists starting.
12)
If the reflected power is low but the pressure is too low to strike the
plasma, do NOT raise the power for more than one minute in an attempt
to strike. The power is being dissipated in the matching unit, which will
get hot.
13)
Do NOT use a Tesla coil or similar sparking device: voltages from these
devices exceed the ESD test limits of the equipment, causing permanent
damage.
1) Check that the cooling water supplies are connected and turned on.
Troubleshooting
Page 7-6 of 12
Printed: 25-Oct-07, 11:47
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
In PC 2000, on the
Pump Control
page, the Gas Pod
Interlock indicator
is coloured red.
Printed: 25-Oct-07, 11:47
1) Check that the gas pod cover is in place and fitted correctly.
2) In the gas pod, check the interlock microswitch and associated wiring.
3) Check that the process chamber pressure is below 600 mbar.
Troubleshooting
Page 7-7 of 12
Issue 1: August 07
l&eacute;^i
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
TKQ
b&atilde;&Eacute;&ecirc;&Ouml;&Eacute;&aring;&Aring;&oacute;=l&Ntilde;&Ntilde;=&Aring;&Uuml;~&aacute;&aring;=
If the system does not power up when it is known that electrical power is supplied to the
machine, there could be a break in the emergency off chain. Details are given in the electrical
schematics, but a summary of the route is given here to assist diagnostics.
WARNING
INVESTIGATIONS SHOULD ONLY BE CARRIED OUT BY QUALIFIED
SERVICE PERSONNEL WHO APPRECIATE THE ELECTRICAL HAZARDS
INSIDE THE MACHINE.
The +24V dc emergency off (EMO) chain begins at the +24V dc power supply in the power
box. The route is shown in Fig 7-1:
80 Plus SYSTEM
POWER BOX
SE81A19439
+24V &amp;
+/- 15V
PSU
24V
Pin 9
F3
Sk7
D
A
Sk15
K
link
EMERGENCY
OFF SWITCH
CONTROL PANEL
SYSTEM ON
SWITCH
J
TERMINAL
BLOCK
H
K1 COIL
G
Sk14
6
SYSTEM
OFF SWITCH
RL1
COIL
2
PUMPS
Sk15
L
24V
14 13
TO THE 24V DISTRIBUTION
TERMINAL BLOCK (MOUNTED
ON THE EXTERIOR OF THE
POWER BOX AT THE REAR
LEFT-HAND SIDE).
NOTE THAT THIS
VOLTAGE IS
REQUIRED TO
SUPPLY THE
INTERLOCK CHAIN
Fig 7-1: Emergency off chain
Switching the mains safety isolator on applies power to the 24V PSU. 24V is applied via the
EMO link (or external N/C contacts) and the Emergency Off switch to the System On switch.
Pressing the System On switch momentarily, energises contactor K1 coil and RL1 coil. RL1
contacts changeover to latch K1 coil on and to apply 24V to the pump control circuit.
24V is applied via K1 contacts 13 and 14 to the 24V distribution terminal block (located on the
power box exterior at the rear left-hand side). The 24V supply is then routed to the interlock
circuit.
Issue 1: August 07
Troubleshooting
Page 7-8 of 12
Printed: 25-Oct-07, 11:47
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
TKR
f&aring;&iacute;&Eacute;&ecirc;&auml;&ccedil;&Aring;&acirc;&euml;=
TKRKN
d&Eacute;&aring;&Eacute;&ecirc;~&auml;=&Ccedil;&Eacute;&euml;&Aring;&ecirc;&aacute;&eacute;&iacute;&aacute;&ccedil;&aring;=
The interlocks form a continuous 24Vdc chain, which must be complete before the process
gases and RF power supplies are enabled. An output to disable external devices unless the lid/
hoist is closed is also provided; this is typically used to disable a lid-mounted endpoint
detector laser.
ALD process gases will only flow if all heaters are within tolerance. If any one heater is not in
tolerance, the process will not start.
If the precursor cabinet door is opened, compressed air to the ALD valves is turned off and
process gases are turned off.
Supply to the ALD valves is only available when the system is at base pressure.
The interlock chain is monitored by the software, but acts independently. It is also
supplemented by machine protection sensors, which operate only via the software.
To enable RF power:
•
•
•
•
•
•
•
The 600 mbar vacuum switch (‘Vacstat’) must be at low pressure
The process chamber lid must be shut (or its hoist down)
The primary process pump must be running
The primary process pressure gauge (normally a capacitance manometer) must be on
scale
The load lock inter-chamber valve (where fitted) must be closed
Customer-supplied external alarm devices must be in their safe state
The inert gas purge to the primary process pump must be flowing.
To enable process gases:
•
•
•
RF power must be enabled
The gas box lid must be shut
Specific gases can be set in the gas box hardware to be mutually exclusive, so that they
cannot be turned on together.
Machine protections fitted where appropriate:
•
A nitrogen pressure switch, to detect adequate purge pressure to turbomolecular
pump bearings.
OR:
•
A nitrogen flow meter, to detect purge gas flow to pump bearings.
•
Water flow switch(es).
Printed: 25-Oct-07, 11:47
Troubleshooting
Page 7-9 of 12
Issue 1: August 07
l&eacute;^i
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
RF enable interlock chain details are given in the following table: Refer to drawing
SE00A26865 (PC2003 interface schematic).
INTERLOCK
Vacuum
Switch
Hoist /Lid
DEVICE
Vacuum Switch
PCB
input
BLK17
PCB1
LED
11
Link out
Comments
NONE
Pressure below 600 mBar
a)
Air cylinder
switch/microswitch
BLK18
12
NONE
Lid closed or hoist down. Enables
end point laser via JP51
Guardmaster
Switch N/O Switch
Current monitor in
Power Box
BLK19
13
JP44
6
15
Interlock disabled if an
independent/dry pump fitted
Capacitance
Manometer (e.g.
Baratron™)
JP16
5
NONE
Analogue input below 11.5V.
Switches comparator U5.
External Voltage Free
contact or 24V DC input
to PCB
JP52
14
External Voltage Free
contact
JP53
15
Can be
bypassed
using
LK19
20
Customer-supplied device. Volt
free contact JP52 pins 1 and 4.
OR
24V DC input JP52 pin 4.
Customer-supplied device
or
b)
Primary
pump
running
Process
pressure
gauge on
scale
Spare
interlock 1
Spare
interlock 2
Or
Or
Load lock
valve
Process
pump purge
Inter-chamber valve
must be shut
Gas Flow Switch at
Primary Pump
Used on 100 and 133 systems
JP55
16
LK21A
Fit LK21B if fitted
If the above is satisfied, then 24V is at BLK20, 21 &amp; 22 pin 1. This enables the K4 contactor to
supply power to the RF Generator.
Issue 1: August 07
Troubleshooting
Page 7-10 of 12
Printed: 25-Oct-07, 11:47
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
TKRKO
d~&euml;=&Auml;&ccedil;&ntilde;=&aacute;&aring;&iacute;&Eacute;&ecirc;&auml;&ccedil;&Aring;&acirc;&euml;=
Refer to drawing: SE81B26657 (PC2003 gas pod loom).
To enable process gases, the RF interlock chain must be complete. The gas box interlock is
shown in Fig 7-2.
SYSTEM CONSOLE
PCB 94-PC00S26866
BLK
20
24VDC
1
GAS BOX
REAR SERVICES
PANEL
SKT25W
PIN4
SERVICES
PANEL
PL25W
PIN4
SKT25W PL24W
PIN4
PIN4
PCB 94-PC81S26655
JP6
PIN1
LID
SWITCH
JP6
PIN2
JP6
PIN3
Via JP3 to CAN unit
controlling gases 1 - 4.
See NOTE.
NOTE: The function of the signal is to supply
24Vdc power to the digital outputs of
the CAN unit. The interlock continues
through idendical boards (where fitted)
which drive gases 5 - 8 and 9 - 12.
Fig 7-2: Gas box interlock chain
TKRKOKN f&aring;&Aring;&ccedil;&atilde;&eacute;~&iacute;&aacute;&Auml;&auml;&Eacute;=&Ouml;~&euml;&Eacute;&euml;=
1st PCB Gas
2nd PCB Gas
1
5
1 Gas
2
6
2nd Gas
3
7
3rd Gas
4
8
4th Gas
Gases are designated as one of three types:
st
3rd PCB Gas
9
10
11
12
Type A
LK3A + 4
LK5A + 6
LK7A + 8
LK9A + 10
Type B
LK3B
LK5B
LK7B
LK9B
Type X
LK3A
LK5A
LK7A
LK9A
Gas type A: Typically oxidising gases (e.g. oxygen)
Gas type B: Typically fuel gases (e.g. hydrogen)
Gas type X: Gases normally miscible with most other gas types.
If ANY gas Type A is enabled, then ALL gas Type B lines are disabled.
The gas box has a facility to prevent incompatible gases from being enabled simultaneously,
using soldered links.
Printed: 25-Oct-07, 11:47
Troubleshooting
Page 7-11 of 12
Issue 1: August 07
l&eacute;^i
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System Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
TKRKP
p&oacute;&euml;&iacute;&Eacute;&atilde;=i&aacute;&aring;&acirc;=`&ccedil;&aring;&Ntilde;&aacute;&Ouml;&igrave;&ecirc;~&iacute;&aacute;&ccedil;&aring;=q~&Auml;&auml;&Eacute;=
NAME
LK1
LK2
LK3
LK4
LK5
LK6 A/B
LK7 A/B
LK8
LK9
LK10
LK11
LK12
LK13
LK14 A/B
LK15
LK16
LK17
LK18
LK19
LK20
LK21 A/B
TKRKQ
FUNCTION
ANALOGUE 0V TO CHASSIS
DIGITAL 0V TO ANALOGUE 0V
NON – CONTROLLER CRYO ENABLE
HEATER SNAP SWITCH BYPASS
FIT IF NO OEM CONTROLLER
LK6A = NON PM140 ENDPOINT
LK6B = PM140 ENDPOINT
LK7A = NON PM140 ENDPOINT
LK7B = PM140 ENDPOINT
+24V DC TO RL2 COM1
+24V DC TO RL2 COM2
+24V DC TO RL6 COM1
+24V DC TO RL6 COM2
+24V DC TO RL7 COM1
+24V DC TO RL7 COM2
LK14A = NON DRY PUMP FITTED
LK14B = DRY PUMP FITTED
PUMP CURRENT BYPASS
+24V DC TO RL8 COM2
NON – CONTROLLER HEATER ALARM
NON – CONTROLLER HEATER ENABLE
SPARE INT/LOCK 1 BYPASS
NOT FITTED 100/133
SPARE INT/LOCK 2 BYPASS
LK21A = PURGE SWITCH NOT FITTED
LK21B = PURGE SWITCH FITTED
NOTES
SEE LK7 A/B
SEE LK 6 A/B
p&oacute;&euml;&iacute;&Eacute;&atilde;=iba=j&ccedil;&aring;&aacute;&iacute;&ccedil;&ecirc;&aacute;&aring;&Ouml;=q~&Auml;&auml;&Eacute;=
NAME
LED1
LED2
LED3
LED4
LED5
LED6
LED7
LED8
LED9
LED10
LED11
LED12
LED13
LED14
LED15
LED16
LED17
COLOUR
GREEN
RED
YELLOW
GREEN
RED
RED
RED
RED
RED
RED
RED
RED
RED
RED
RED
RED
RED
MONITORING
+24V DC
+15V DC
-15V DC
+5V DC
CM COMP OK
PUMP CURRENT SWITCH
N2 PRESSURE SWITCH
WATER ONE
WATER TWO
WATER THREE
VAC STAT
RL10 (HOIST CONTROL)
HOIST
SPARE INTERLOCK 1
SPARE INTERLOCK 2
PUMP PURGE SWITCH
RL15 (MASTER/SLAVE) ACTIVE SLAVE
Note that when the interlock chain is complete, all LEDs are illuminated.
Issue 1: August 07
Troubleshooting
Page 7-12 of 12
Printed: 25-Oct-07, 11:47
System Manual=
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l&eacute;^i
m&ecirc;&ccedil;&Aring;&Eacute;&euml;&euml;=&Ouml;&igrave;&aacute;&Ccedil;&Eacute;=C=&Ouml;&auml;&ccedil;&euml;&euml;~&ecirc;&oacute;=
Printed: 05 October 2007 10:33
Process Guide and Glossary
Page 8-1 of 2
Issue 1: September 07
l&eacute;^i=
UKN
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
System Manual
^&Auml;&ccedil;&igrave;&iacute;=&iacute;&Uuml;&aacute;&euml;=p&Eacute;&Aring;&iacute;&aacute;&ccedil;&aring;=
This Section contains the OIPT ‘Process Guide’ document. Note that this document includes a
Glossary of Terms.
Issue 1: September 07
Process Guide and Glossary
Page 8-2 of 2
Printed: 05 October 2007 10:33
System Manual=
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
l&eacute;^i
l&eacute;^i=m&ecirc;&ccedil;&Aring;&Eacute;&euml;&euml;=d&igrave;&aacute;&Ccedil;&Eacute;=
Process Information (Information contained in this document is confidential)
Page 1 of 14
Issue 1: August 07
Printed: 08 October 2007 11:00
l&eacute;^i=
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System Manual
Contents
1 Introduction......................................................................................................................................3
1.1 About this guide........................................................................................................................................3
1.2 Health and safety ......................................................................................................................................3
1.3 Terminology ...............................................................................................................................................3
2 The clean room .................................................................................................................................4
3 Processes...........................................................................................................................................5
3.1 General .......................................................................................................................................................5
3.2 ALD processes.............................................................................................................................................6
3.2.1 ALD operating parameter ranges...................................................................................................6
3.2.2 ICP operating parameter ranges ....................................................................................................7
3.2.3 Precursors with low vapour pressure .............................................................................................7
3.2.4 Gas calibration factors.....................................................................................................................7
3.2.5 Exhaust emissions ............................................................................................................................7
3.2.6 Premature flaking of chamber wall liners / showerhead material ..............................................8
3.3 Process troubleshooting............................................................................................................................9
3.3.1 Partial process failure ......................................................................................................................9
3.3.1.1 Example problems ........................................................................................................................9
3.3.1.2 Typical causes................................................................................................................................9
3.3.2 Total plasma failure.........................................................................................................................9
3.3.2.1 Example problems ........................................................................................................................9
3.3.2.2 Typical causes................................................................................................................................9
4 Glossary of terms ...........................................................................................................................11
5 OIPT locations worldwide..............................................................................................................14
Process Information (Information contained in this document is confidential)
Issue 1: August 07
Page 2 of 14
Printed: 08 October 2007 11:00
System Manual=
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l&eacute;^i
N f&aring;&iacute;&ecirc;&ccedil;&Ccedil;&igrave;&Aring;&iacute;&aacute;&ccedil;&aring;=
NKN
^&Auml;&ccedil;&igrave;&iacute;=&iacute;&Uuml;&aacute;&euml;=&Ouml;&igrave;&aacute;&Ccedil;&Eacute;=
This guide gives information about plasma processes based on Oxford Instruments Plasma Technology’s
(OIPT) long experience in the semiconductor industry.
The scope of the guide is to provide a general introduction to process strategies and common process
problems, and has not been prepared for a particular version of hardware. The information is presented
to help users obtain optimum results from their specific process applications using Plasmalab systems.
To ensure that the information is as comprehensive and up-to-date as possible, it has been collated from
the following sources within OIPT:
In-house Applications Laboratory1 (Process Lab reports, manager’s notes, customer feedback etc.).
Service Department (customer feedback, on-site experience etc.)
Technology Department (external information sources, design reviews, customer liaison, etc.)
NKO
e&Eacute;~&auml;&iacute;&Uuml;=~&aring;&Ccedil;=&euml;~&Ntilde;&Eacute;&iacute;&oacute;=
For health and safety information, see Section 1 (Health and Safety) of your Plasmalab system manual.
The customer is always responsible for:
(A)
Delivery of process gases to the tool.
(B)
Removal of exhaust gases from the tool.
(C)
Maintaining a safe system of work in using and maintaining the tool.
NKP
q&Eacute;&ecirc;&atilde;&aacute;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
Material presented within this guide is aimed at users who have knowledge of plasma processes and the
terms used. However, if you come across an unfamiliar term, please refer to Section 4 (Glossary of Terms).
The Application Laboratory is a purpose-built clean room facility housing examples of all of our
Plasmalab systems for research and development purposes. Each of these systems is installed in
accordance with our standard installation data documents supplied to customers for each system type.
1
Process Information (Information contained in this document is confidential)
Page 3 of 14
Issue 1: August 07
Printed: 08 October 2007 11:00
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System Manual
O q&Uuml;&Eacute;=&Aring;&auml;&Eacute;~&aring;=&ecirc;&ccedil;&ccedil;&atilde;=
It is recommended that the OIPT process tool(s) are installed in a ‘clean room’ that meets the following
requirements:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
HEPA filtered air conditioning system, ideally laminar flow.
Clean room walls/ceiling/flooring constructed from low particulate materials.
Work areas shall remain free from waste materials.
Covered waste containers shall be provided and emptied regularly.
Gangways shall remain clear at all times.
Access to H&amp;S / COSHH data sheets shall be maintained at all times.
Access to fire protection equipment shall be maintained at all times..
Appropriate warning labels shall be provided where required.
Samples shall be covered where practicable, particularly at the end of a working shift.
No eating /drinking or smoking shall be permitted in the clean room/laboratory.
Restricted access shall be maintained and a list of authorised persons shall be displayed outside
the processing areas. All other persons entering the area shall be escorted at all times.
Items entering the processing area shall be inspected for cleanliness prior to entry.
Non-essential items shall be precluded from the processing areas.
Non-essential equipment or documentation shall not be stored on the floor area.
Prior to entering the processing rooms, protective clothing shall be worn and shall constitute at
least over-shoes, coat and hat. These shall be made available within the laboratory access room
and will be replaced at a controlled frequency. A bench shall be provided to aid dressing with
protective clothing. The bench area immediately adjacent to the entry door to the laboratory shall
contain a tack mat to further prevent contamination ingress. Over shoes must not come into
contact with the area that has been used for day shoes.
Cleaning of the processing areas shall be performed with suitably filtered vacuum equipment.
A cleaning programme shall be established and evidence of compliance maintained for audit
purposes.
All samples in current use or in temporary storage within the area shall be identified.
Non-conforming samples shall be identified and physically segregated from acceptable work.
Gloves shall be worn when handling unprotected samples.
Unused tooling / equipment shall be stored in a manner to prevent damage and deterioration.
It shall remain the responsibility of the users to ensure that tooling / equipment remains suitable
for its intended purpose.
For Health &amp; Safety guidelines, refer to Section 1 (Health &amp; Safety) of your Plasmalab system manual.
For services required, refer to OIPT Services Specifications and the relevant Installation Data document for
your Plasmalab system.
Process Information (Information contained in this document is confidential)
Issue 1: August 07
Page 4 of 14
Printed: 08 October 2007 11:00
System Manual=
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l&eacute;^i
P m&ecirc;&ccedil;&Aring;&Eacute;&euml;&euml;&Eacute;&euml;=
PKN d&Eacute;&aring;&Eacute;&ecirc;~&auml;=
Recommendations for the OpAL system
Day-to-day operation
•
It is strongly recommended that the tools are left switched on and pumping continuously (i.e. do
not switch off system or pumps). This ensures the maximum lifetime for system and pumps and
optimum process repeatability.
•
Datalogging of each run is strongly recommended to allow the system to maintain full records of
all process runs. Items to monitor regularly via datalogs are as follows:

Gas flow during process - if this is different from original/earlier data it indicates MFC and/or
pumping problems.

RF reflected power during process - indicates matching or striking problems.

RF Automatch capacitor positions (if available) – for checking reliability of RF matching.
Weekly checks
•
Leak-up rate – gate valve closed, measure rate of pressure rise: should be &lt;1mTorr/minute.
•
Partial pressure checks - measure pressure versus flow for all MFCs individually: see relevant
calibration graph. This will identify problems with MFCs or pumping.
•
Fill rates (if possible), i.e. measure rate of pressure rise with APC closed (can be performed using
leak check software, if present), for each gas at a range of flow rates, and in particular at the
flow rates of the processes in use. This may not be possible for very high flow rates and is not
recommended for flammable or pyrophoric gases. This will identify problems with MFCs or gate
valve seals.
•
Pumpdown times from vent to base pressure e.g. 10mTorr. For example, this would be typically
18 to 20 seconds for a rotary system. This will identify problems with pumping performance.
Process Information (Information contained in this document is confidential)
Page 5 of 14
Issue 1: August 07
Printed: 08 October 2007 11:00
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PKO
^ia=&eacute;&ecirc;&ccedil;&Aring;&Eacute;&euml;&euml;&Eacute;&euml;=
PKOKN
^ia=&ccedil;&eacute;&Eacute;&ecirc;~&iacute;&aacute;&aring;&Ouml;=&eacute;~&ecirc;~&atilde;&Eacute;&iacute;&Eacute;&ecirc;=&ecirc;~&aring;&Ouml;&Eacute;&euml;=
System Manual
The typical process operating ranges are:
Total gas flows = 50 to 500 sccm. The maximum flow depends on type of pumps fitted to the system i.e.
their maximum flow capacity, their pumping performance, and the required operating pressure. If you
need to use a low pressure, you may have to limit the flow rate to achieve this.
Pressure = 100 to 1000mTorr. The pressure is set by gas flow and depends on the process. The system
base pressure is measured simply by using the CM gauge, hence base pressures are typically a few mTorr.
The exact value is mainly determined by the offset of the CM gauge zero (this is usually set slightly
positive by a few mTorr to ensure a sensible reading, since a negative offset will always read zero).
RF power = typically 100W to 250W. A plasma may not strike easily for low power levels for certain
gases. You will need to check this and adjust the process accordingly, since operating the system without
a plasma could cause damage.
Temperature is limited by the operating range of the electrode, up to 400 &deg;C and jacket heaters ranging
from 30 &deg;C to 200 &deg;C.
NOTES:
(A)
The time taken to reach the base pressure will depend on whether the chamber has recently been
vented to atmosphere, the cleanliness of the chamber walls and if the chamber has been baked.
(B)
Operating with a high reflected power (&gt;5% of forward power) is not advised, as this will cause
damage to the matching unit or RF generator. To reduce the high reflected power, adjust the
process parameters or re-tune the matching unit.
Process Information (Information contained in this document is confidential)
Issue 1: August 07
Page 6 of 14
Printed: 08 October 2007 11:00
System Manual=
PKOKO
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
l&eacute;^i
f`m=&ccedil;&eacute;&Eacute;&ecirc;~&iacute;&aacute;&aring;&Ouml;=&eacute;~&ecirc;~&atilde;&Eacute;&iacute;&Eacute;&ecirc;=&ecirc;~&aring;&Ouml;&Eacute;&euml;=
For an ICP 65 the process operating ranges are:
Total gas flows = 10 to 1000sccm. The maximum flow depends on type of pump, i.e. its maximum flow
capacity, and the required operating pressure. If you need to use a low pressure, you may have to limit
the flow rate to achieve this.
Pressure = 10 to 1000mTorr. The system base pressure is measured simply by using the CM gauge, hence
base pressures are typically a few mTorr. The exact value is mainly determined by the offset of the CM
gauge zero (this is usually set slightly positive by a few mTorr to ensure a sensible reading, since a
negative offset will always read zero).
ICP power = approximately 50W to 250W. The minimum power level will be dependent on how easily
the plasma strikes for certain gases. You will need to check this and adjust process accordingly, since
operating system without a plasma either on the substrate electrode or in the ICP tube could cause
damage.
The maximum ICP power limit is set by the power rating of the RF generator.
Temperature is limited by the operating range of the electrode.
NOTES:
(A)
The time taken to reach the base pressure will depend on whether the chamber has recently been
vented to atmosphere and the cleanliness of the chamber walls. If the process chamber /
electrodes are anodised, the time will increase as the anodised surfaces will take longer to outgas
compared with bare metal surfaces.
(B)
Operating with chlorine based processes can cause damage to the electrode unless it is protected
with a dummy wafer.
(C)
Operating with a high-reflected power (&gt;5% of forward power) is not advised, as this will cause
damage to the matching unit or RF generator. To reduce the high-reflected power, adjust the
process parameters or re-tune the matching unit.
PKOKP
m&ecirc;&Eacute;&Aring;&igrave;&ecirc;&euml;&ccedil;&ecirc;&euml;=&iuml;&aacute;&iacute;&Uuml;=&auml;&ccedil;&iuml;=&icirc;~&eacute;&ccedil;&igrave;&ecirc;=&eacute;&ecirc;&Eacute;&euml;&euml;&igrave;&ecirc;&Eacute;=
Gases with a low vapour pressure (e.g. TEMAH) present unique problems for the gas supply system, e.g.
temperature dependence of gas pressure, condensation in the gas lines, and low line pressure. It is
recommended that delivery lines are always heated above the condensation temperature and the lines
are always &gt; 20 C higher than the source pot temperature.
PKOKQ
=d~&euml;=&Aring;~&auml;&aacute;&Auml;&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;~&Aring;&iacute;&ccedil;&ecirc;&euml;=
See the MKS OEM manual for details of gas correction factors. However, it is worth pointing out that for
certain gases (e.g. H2 or He) it is recommended that the MFC is calibrated for that particular gas, since
they have very different gas properties compared to other gases, and hence the errors on calibrations
factors is large.
PKOKR
b&ntilde;&Uuml;~&igrave;&euml;&iacute;=&Eacute;&atilde;&aacute;&euml;&euml;&aacute;&ccedil;&aring;&euml;=
The by-products emitted by an ALD process will be mostly made up of the inert gases, methyl, ethyl and
ammonia like by-products. The exact amounts will depend on process type and conditions. These can be
any combination of etch gas material and etched material.
Process Information (Information contained in this document is confidential)
Page 7 of 14
Issue 1: August 07
Printed: 08 October 2007 11:00
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System Manual
As many of these by-products are toxic, it is a minimum requirement that these gases are exhausted in an
enclosed extraction system to the roof of the building - following health and safety regulations. In
addition to this, depending on local regulations, it may be necessary to have some form of gas scrubbing
before releasing these materials to the atmosphere.
Even if we were not running gases through the system, we would recommend that the system exhaust is
extracted correctly, since the pump exhaust will contain small droplets of pump oil which are in
themselves harmful to lung function.
Another important consideration is the gas absorbed in the pump oil. Since the exhaust gases contain HF
there will be a build up of HF in the pump oil. Therefore, it is important to use the correct protective
equipment when servicing the pump or changing pump oil, i.e. suitable gloves, protective clothing,
filtered facemask or breathing apparatus.
It is also worth remembering that when using O2 processes the pump oil should be Fomblin oil and NOT
mineral oil to avoid risk of fire or explosive reaction between O2 and mineral oil.
PKOKS
m&ecirc;&Eacute;&atilde;~&iacute;&igrave;&ecirc;&Eacute;=&Ntilde;&auml;~&acirc;&aacute;&aring;&Ouml;=&ccedil;&Ntilde;=&Aring;&Uuml;~&atilde;&Auml;&Eacute;&ecirc;=&iuml;~&auml;&auml;=&auml;&aacute;&aring;&Eacute;&ecirc;&euml;=L=&euml;&Uuml;&ccedil;&iuml;&Eacute;&ecirc;&Uuml;&Eacute;~&Ccedil;=&atilde;~&iacute;&Eacute;&ecirc;&aacute;~&auml;=
Premature flaking of chamber wall liners / showerhead material can occur for a number of reasons:
1)
Temperature cycling of showerhead / chamber walls can cause flaking, therefore it is important
that chamber walls are set to a stable temperature, e.g. 60C. It is also important that electrode
temperature is maintained at a constant value as this will also affect showerhead temperature.
2)
The system should NEVER be switched off overnight to save power. The system should be left
pumping with electrode maintained at deposition temperature and the chamber walls and
delivery lines maintained at temperature at all times to avoid flaking.
3)
Incomplete cleaning during a previous clean cycle can lead to premature flaking.
4)
Wiping of chamber and or showerhead with water or IPA can leave residues which subsequently
causes early flake-off of films deposited.
5)
Wiping of chamber walls / showerhead with clean room wipes while they are hot can also leave
behind residues which cause premature flaking.
6)
Repeated venting of chamber will cause flaking. This one of the main reasons it is recommended
to clean every 5-10 microns of film.
7)
Mixed deposition of oxide, nitride, and oxynitride films can cause increased stresses in deposited
films and hence premature flaking.
8)
Changes to standard recipes can also cause increased stress and hence premature flaking.
As part of the regular maintenance of the system the showerhead must be bead blasted. This is the only
Oxford Instruments Plasma Technology approved way of cleaning a showerhead. The use of solvents and
ultra-sonic baths is strongly discouraged. Scrubbing with Scotchbrite is also not recommended. OIPT will
not be able to support you if you use these alternative cleaning methods and still experience problems
the problems described in the above table with showerhead particles.
Recommended bead blasting specification:
Bead blast using alumina powder (aluminium oxide beads) of 180 grit size or less - maybe 120. Do not use
any solvents. Clean the showerhead after bead blasting using compressed air only. Hold the showerhead
up to the light to check that none of the holes are blocked by any grit from the bead blasting. Clean out
holes with paper clip or similar if blocked.
Process Information (Information contained in this document is confidential)
Issue 1: August 07
Page 8 of 14
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PKP
m&ecirc;&ccedil;&Aring;&Eacute;&euml;&euml;=&iacute;&ecirc;&ccedil;&igrave;&Auml;&auml;&Eacute;&euml;&Uuml;&ccedil;&ccedil;&iacute;&aacute;&aring;&Ouml;=
PKPKN
m~&ecirc;&iacute;&aacute;~&auml;=&eacute;&ecirc;&ccedil;&Aring;&Eacute;&euml;&euml;=&Ntilde;~&aacute;&auml;&igrave;&ecirc;&Eacute;=
PKPKNKN
b&ntilde;~&atilde;&eacute;&auml;&Eacute;=&eacute;&ecirc;&ccedil;&Auml;&auml;&Eacute;&atilde;&euml;=
•
•
Deposition rate has dropped
Non-uniform deposition
PKPKNKO
l&eacute;^i
q&oacute;&eacute;&aacute;&Aring;~&auml;=&Aring;~&igrave;&euml;&Eacute;&euml;=
•
Precursor source pot is empty
•
Blockage in the delivery line. Follow H&amp;S procedure
•
Showerhead plate is clogged
•
Chamber leak – Check leak-up rate
•
Faulty MFC – check partial pressures
•
Check MFCs / Pumps
•
RF generator/matching – adjust matching unit set-up, check generator range switch, watch HF
matching time in mixed frequency pulsed process
•
Incorrect gases used
•
Temperature – cooling or heater failure
•
Chamber is dirty – needs more frequent cleaning
•
Incorrect process regime (knife-edge process)
•
Wrong process for given hardware - no pumpdown time, no preheat step, no pre-clean step
PKPKO
q&ccedil;&iacute;~&auml;=&eacute;&auml;~&euml;&atilde;~=&Ntilde;~&aacute;&auml;&igrave;&ecirc;&Eacute;=
PKPKOKN
b&ntilde;~&atilde;&eacute;&auml;&Eacute;=&eacute;&ecirc;&ccedil;&Auml;&auml;&Eacute;&atilde;&euml;=
•
•
•
Plasma does not ignite/light up
Plasma is unstable/pulsing
Plasma is flickering
PKPKOKO
q&oacute;&eacute;&aacute;&Aring;~&auml;=&Aring;~&igrave;&euml;&Eacute;&euml;=
Check that readbacks are within tolerance – MFCs, pressure control, RF matching, temperature.
Check that base pressure has been reached (this can always be changed if you are in a hurry!)
Read error / warning / information messages
Check that plasma is striking
Try selecting ‘ignore tolerance’ checkbox
Sudden pressure rise – check for dissociation, - try Ar instead, strike at reduced ICP power
Process Information (Information contained in this document is confidential)
Page 9 of 14
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Printed: 08 October 2007 11:00
l&eacute;^i=
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System Manual
Sudden pressure rise at plasma strike – check for cross talk between RF power and CM gauge
Sudden temperature rise at plasma strike – check for cross talk between RF power and temperature gauge
Sudden gas flow change at plasma strike – check for RF cross talk
Process Information (Information contained in this document is confidential)
Issue 1: August 07
Page 10 of 14
Printed: 08 October 2007 11:00
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l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
l&eacute;^i
Q d&auml;&ccedil;&euml;&euml;~&ecirc;&oacute;=&ccedil;&Ntilde;=&iacute;&Eacute;&ecirc;&atilde;&euml;=
AMU
Abbreviation for Automatch Unit. This is a self-controlling variable capacitor,
which is connected between an electrode (to which it is normally close-coupled)
and the discharge power supply. Its purpose is to shift the voltage and current
waveforms to maximise the power transfer. It also transforms the load
impedance to 50Ω.
Rotary pump
A pump downstream of the chamber (See also Rotary pump)
Baratron
See CM gauge. Baratron is a trade name.
Base pressure
The lowest pressure attainable by a high vacuum pump. Alternatively, the
pressure, which should be attained before starting a process.
Clean gas
This refers, in fact, to 'cleaning gas'. It is a gas which, when converted to a
plasma, removes contamination from the walls of the chamber and from the
electrodes.
CM gauge (Baratron)
Capacitance manometer gauge in which gas pressure deflects a membrane and
thus a measured capacitance. Measures absolute pressure down to
approximately 10-5 Torr. Not affected by corrosive gases. Does not need a
correction factor for different types of gas.
Electrode
One of two metal plates within the process chamber, which form part of the
electrical discharge system. The lower electrode is sometimes referred to as the
'table'. They are fabricated from aluminium alloy or stainless steel, and may
either be heated by integral electrical resistance elements, or cooled by chilled
water pipes.
Gas ballast
Inert gas introduced into a port on a rotary pump to improve its ability to pump
condensable vapours.
Gas factor
Ion gauges, Pirani gauges, Penning gauges and mass flow controllers need to be
adjusted when run on different gases, to prevent them from being inaccurate.
This 'gas factor' depends on the gas and also the type of instrument.
Gate valve
A high vacuum valve with a stainless steel shutter having linear motion. It may
be used for high vacuum isolation and also for pressure control.
ICP
An abbreviation for Induction Coupled Plasma.
Interlock
A safety device (either software or electrically implemented) that allows a piece
of apparatus to function only when predetermined conditions are fulfilled.
Ion gauge
(Bayard-Alpert gauge)
This gauge uses a glowing cathode to emit electrons. Any positive ions created
by collisions with gas molecules are collected on a thin central ion collection
wire. The ion current varies with the gas density. Used for checking very low
base pressures down to 10-10 Torr. It needs to be calibrated to the gases being
measured (see Gas factor). The filament lifetime will be limited in reactive gases.
Process Information (Information contained in this document is confidential)
Page 11 of 14
Issue 1: August 07
Printed: 08 October 2007 11:00
l&eacute;^i=
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System Manual
Leak up rate
The rate of increase of pressure, due to leakage and outgassing, in a sealed
chamber, which has been pumped down to base pressure.
MFC
Short for mass flow controller. This is a closed loop device, which controls the
flow rate of piped gases under the control of an analogue signal. It also outputs
a measured flow rate analogue signal. It needs to be calibrated to the gases
being controlled (see Gas factor).
Micron
Unit of pressure; 10-3 Torr. Equivalent to the pressure required to support a
column of mercury one micron (length) high.
Micron
Unit of length; 10-6 metres.
Millibar
Unit of pressure; 1/1000 of one atmosphere or bar.
Nupro valve
Nupro is a manufacturer of commonly used pneumatically operated gas line
valves.
Outgassing
The vaporisation of contaminants from the surfaces of the components exposed
to the vacuum.
PFPE
An abbreviation for perfluorised polyether lubricating fluid. This synthetic
lubricant is used in a highly oxidising environment where mineral (hydrocarbon)
oils would deteriorate too rapidly.
Plasma
A region of electrons, positive ions and neutral gas particles created between
electrodes within which the various etching or deposition processes take place.
Plasma system
This generates a plasma above a substrate in a vacuum chamber and uses the
action of the plasma to etch from, or deposit material onto, a substrate.
Platen
The plate, which supports the substrate to be processed.
RF
An abbreviation for Radio Frequency, often 13.56 MHz.
Roughing pump
A secondary pump, which reduces the chamber pressure from atmospheric to a
point at which the high vacuum (or main) pump takes over for a further
reduction of pressure. (See also rotary pump)
Sample
See Substrate
Shower head
A form of top electrode having perforations through which the process gas is
introduced into the chamber.
SMC valve
SMC is the manufacturer of commonly used solenoid operated pneumatic
valves. The valves are normally closed, and on receipt of an electrical signal, the
pneumatic valve opens. In some cases, the opposite action is used, for example
to vent a turbo pump if system power is lost.
Specimen
See substrate.
Substrate / wafer /
specimen / sample
The item to be processed in the vacuum chamber.
TEMAH
Abbreviation for Tetrakis Ethyl Methyl Amino Hafnium. TEMAH is a ALD
processes.
Process Information (Information contained in this document is confidential)
Issue 1: August 07
Page 12 of 14
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l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
Torr
Unit of pressure; 1/760 of one atmosphere or bar.
Wafer
See Substrate.
Vent
Introduce high purity nitrogen into a chamber or pump to raise it to
atmospheric pressure.
l&eacute;^i
Process Information (Information contained in this document is confidential)
Page 13 of 14
Issue 1: August 07
Printed: 08 October 2007 11:00
l&eacute;^i=
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;=
System Manual
R lfmq=&auml;&ccedil;&Aring;~&iacute;&aacute;&ccedil;&aring;&euml;=&iuml;&ccedil;&ecirc;&auml;&Ccedil;&iuml;&aacute;&Ccedil;&Eacute;
UK
Oxford Instruments Plasma Technology
North End, Yatton,
Bristol, BS49 4AP
Tel: +44(0)1934 837000
Fax: +44(0)1934 837001
Email: [email protected]
Web: www.oxfordinstruments.com/plmchp5.htm
USA
Oxford Instruments Inc.
130A Baker Avenue Extension
Concord, MA 01742
Tel: +1 978 369 9933
Toll Free +1 800-447-4717
Fax: +1 978 369 8287
Email: [email protected]
Germany
Oxford Instruments GmbH
Otto-von-Guericke Ring 10,
D-65205 Wiesbaden
Tel: +49(0)6122 937161
Fax: +49(0)6122 937175
Email: [email protected]
Japan
Oxford Instruments K.K.
2-11-6 Tomioka
Koto-ku, Tokyo 135-0047
Tel: +81-3-5245-3261
Fax: +81-3-5245-4466
Email: [email protected]
Web: www.oxford-instruments.jp
People’s Republic of China (Beijing)
Oxford Instruments China
Room 714, Office Tower 3,
Henderson Center,
No. 18 Jianguomennei Ave,
Dongcheng District,
Beijing 100005
Tel: +86 106518 8160/1/2
Fax: +86 106518 8155
Email: [email protected]
Web: www.oxford-instruments.com.cn
People’s Republic of China
(Shanghai)
Oxford Instruments China
Room 14-F, No.1 Plaza
800 Nanjing East Road
Shanghai 200001
Tel: +86 216360 8530
Fax: +86 216360 8535
Email: [email protected]
Web: www.oxford-instruments.com.cn
Singapore
Oxford Instruments Pte. Ltd
371 Beach Road,
#02-07 Keypoint
Singapore 199597
Tel: +65 6337 6848
Fax: +65 6337 6286
Email: [email protected]
Taiwan
Oxford Instruments Overseas
Marketing Ltd.
th
1F, No 23 Jing-Shang 19 Street,
Hsinchu, Taiwan
Tel: +65 6337 6848
Fax: +65 6337 6286
Email: [email protected]
Process Information (Information contained in this document is confidential)
Issue 1: August 07
Page 14 of 14
Printed: 08 October 2007 11:00
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
V
r&aring;&aacute;&aring;&euml;&iacute;~&auml;&auml;~&iacute;&aacute;&ccedil;&aring;=~&aring;&Ccedil;=a&aacute;&euml;&eacute;&ccedil;&euml;~&auml;=
9 Uninstallation and Disposal ........................................................................................................ 9-1
9.1 About this section .................................................................................................................................9-2
9.2 Uninstalling the system ........................................................................................................................9-2
9.2.1 General considerations for shutting the system down ................................................................9-2
9.2.2 Shutting the system down .............................................................................................................9-2
9.2.3 Disconnecting the services .............................................................................................................9-3
9.2.4 Decontamination ............................................................................................................................9-4
9.2.5 Dismantling the system components ............................................................................................9-4
9.3 Disposal..................................................................................................................................................9-5
Printed: 7-Oct-07, 12:11
Uninstallation and Disposal
Page 9-1 of 6
Issue 1: February 00
l&eacute;^i
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
System Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
VKN
^&Auml;&ccedil;&igrave;&iacute;=&iacute;&Uuml;&aacute;&euml;=&euml;&Eacute;&Aring;&iacute;&aacute;&ccedil;&aring;=
This section gives guidance for the uninstallation of an l&eacute;^i=system prior to moving it to
another location or disposing of it. Guidance is also given for the disposal of a system.
The guidance given is by necessity of a general nature; detail will vary depending on system
type, customer’s site, etc.
IMPORTANT: BEFORE UNINSTALLING THE SYSTEM, ENSURE THAT ALL PERSONNEL WHO WILL BE
INVOLVED HAVE READ AND UNDERSTOOD SECTION 1 ‘HEALTH AND SAFETY’ OF
THE SYSTEM MANUAL.
VKO
r&aring;&aacute;&aring;&euml;&iacute;~&auml;&auml;&aacute;&aring;&Ouml;=&iacute;&Uuml;&Eacute;=&euml;&oacute;&euml;&iacute;&Eacute;&atilde;=
To uninstall the system, carry out the following sub-sections in sequence.
VKOKN
d&Eacute;&aring;&Eacute;&ecirc;~&auml;=&Aring;&ccedil;&aring;&euml;&aacute;&Ccedil;&Eacute;&ecirc;~&iacute;&aacute;&ccedil;&aring;&euml;=&Ntilde;&ccedil;&ecirc;=&euml;&Uuml;&igrave;&iacute;&iacute;&aacute;&aring;&Ouml;=&iacute;&Uuml;&Eacute;=&euml;&oacute;&euml;&iacute;&Eacute;&atilde;=&Ccedil;&ccedil;&iuml;&aring;=
The main use of this document will be when a customer requires to move a system to another
location. This will involve uninstalling the system, moving the system components and then
reinstalling the system. An important consideration is the length of time between shutting
the system down and powering the system up. The longer the system is shut down, the
greater the need to remove as much residue gas as possible.
It is very important that the customer follows the pump manufacturer’s instructions for
purging pumps prior to shut down. For periods of more than a few days shutdown, 24 hours
of N2 purging is often recommended.
If the system is to be reinstalled, the vacuum system should be left fully vented with dry
nitrogen, with the pump and gas supply service points capped.
VKOKO
p&Uuml;&igrave;&iacute;&iacute;&aacute;&aring;&Ouml;=&iacute;&Uuml;&Eacute;=&euml;&oacute;&euml;&iacute;&Eacute;&atilde;=&Ccedil;&ccedil;&iuml;&aring;=
1) Chamber1 or source2 plasma cleaning should be conducted to remove residues. Use the
normal cleaning process according to the most recent use of the tool.
2) Process gas supply lines must be pumped down using the system at least as far as the last
isolation valve upstream from the gas pod. Consider whether the gases should be
pumped out back to the cylinder, or whether the gas installation has alternative means of
exhausting hazardous gases. For shut down periods of longer than two days, purge the
gas lines with N2.
3) Precursor gas delivery lines must be pumped and purged to the source pot connection.
Refer to Appendix PSP (Precursor Source Pot installation and Decommissioning).
4) Pump the system according to the following criteria:
Pump the system for one hour with a small N2 or Argon flow, and then pump for a
further hour with no gas flow.
1
2
For OpAL system, refer to Section 6 (Maintenance) of the System Manual.
Run a SF6 / O2 plasma for &gt; 1 hour at ~250W
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Uninstallation and Disposal
Page 9-2 of 6
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l&eacute;^i
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
5) The process chamber should be vented with dry nitrogen and the process gas inlet
blanked.
6) Ensure that the system has been shut down in accordance with the procedure given in
Section 5 (Operating Instructions).
7) Depending on system type, ensure that the front panel compressed air lockout valves are
set to their OFF positions and padlocked. (e.g.gate valves, RGA, etc. if fitted)
VKOKP
a&aacute;&euml;&Aring;&ccedil;&aring;&aring;&Eacute;&Aring;&iacute;&aacute;&aring;&Ouml;=&iacute;&Uuml;&Eacute;=&euml;&Eacute;&ecirc;&icirc;&aacute;&Aring;&Eacute;&euml;==
IMPORTANT:
BEFORE DISCONNECTING ANY OF THE SERVICES, ENSURE THAT THEY ARE TURNED
OFF. E.G. COMPRESSED AIR AND GAS SUPPLY VALVES SET TO THEIR OFF
POSITIONS AND ELECTRICAL SUPPLIES SWITCHED OFF AND LOCKED OUT.
1)
Ensure that all covers and panels are fitted and attach notices to the system indicating
that the system is not ready for service.
2)
Disconnect the electrical supply from the PC.
3)
Disconnect the electrical supply from the safety isolation box to the system console.
4)
At the system PC, disconnect the monitor, keyboard and mouse, then disconnect the
control cable(s) from the PC to the system console.
5)
Disconnect the safety earth (ground) between the system and the gas pod, if the gas pod
is not bonded to the system.
6)
Disconnect the cooling circuits from the system console. Coolant may be removed, if so
wished by using low pressure (&lt; 1 bar gauge) compressed air. Do not seal the cooling
circuits tightly.
7)
Disconnect the gas outlet line(s) and control cable from the gas pod to the system
services panel.
8)
Disconnect the precursor source pots and cap the inlet and outlet ports
9)
Disconnect the gas supplies to the internal and external gas pod (all gas supply valves
closed).
10) Disconnect the compressed air supply from the system services panel(s) and from the gas
pod.
11) Disconnect the Nitrogen purge lines to the system services panel(s) and the rotary vane
pump(s).
12) Disconnect the rotary pump(s) from the system and cap the pump ports and the system
vacuum ports.
13) Disconnect the rotary vane pump exhaust line.
14) Disconnect the extraction collars on the process chamber(s) (e.g. ICP process chambers)
and the gas pod from the extraction systems.
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Uninstallation and Disposal
Page 9-3 of 6
Issue 1: February 00
l&eacute;^i
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System Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
VKOKQ
a&Eacute;&Aring;&ccedil;&aring;&iacute;~&atilde;&aacute;&aring;~&iacute;&aacute;&ccedil;&aring;=
Remove any hazardous residues/deposits from the process chamber, precursor delivery lines,
pumps and pump lines, gas lines and mass flow controllers in accordance with local safety
regulations. Refer to equipment manufacturer’s manuals as necessary.
Note that if the system is to be moved and re-installed, it may be acceptable to purge the gas
lines / mass flow controllers and ALD valves with dry nitrogen and seal all connections.
VKOKR
a&aacute;&euml;&atilde;~&aring;&iacute;&auml;&aacute;&aring;&Ouml;=&iacute;&Uuml;&Eacute;=&euml;&oacute;&euml;&iacute;&Eacute;&atilde;=&Aring;&ccedil;&atilde;&eacute;&ccedil;&aring;&Eacute;&aring;&iacute;&euml;=
WARNING
LIFTING HEAVY OBJECTS INCORRECTLY CAN CAUSE SEVERE INJURY
When handling heavy system components such as the system unit or vacuum pumps,
ensure that the appropriate lifting equipment, operated by fully trained personnel, is
used.
When heavy rack-mounted components are handled, ensure that the weight is safely
distributed between sufficient personnel.
WARNING
TOPPLING (TIPOVER) HAZARD – SOME SYSTEM COMPONENTS, E.G. ROBOTIC HANDLERS
AND AUTOMATIC LOAD LOCKS / TRANSFER CHAMBERS (ESPECIALLY IF FITTED WITH
CASSETTE LOAD LOCKS) CAN TOPPLE CAUSING SEVERE INJURY.
When transporting or manoeuvring the system frames, robotic handlers etc., ensure
that they remain vertical at all times and use the appropriate lifting / handling
equipment.
Ensure that any support frames, supplied with the system, are correctly fitted
whenever the system is transported / manoeuvred or dismantled for service /
maintenance.
It is entirely the user’s responsibility to ensure that all components are supported
safely before and during any transporting, manoeuvring or maintenance operations.
Support frames provided by Oxford Instruments Plasma Technology are not
necessarily adequate for any such operations. The absence of a support frame must
not be taken as an indication that no further precautions need to be made before
such operations are undertaken.
1)
In the grey area, remove the rotary vane pump from its mounting and prepare it for
transport in accordance with the pump manufacturer’s instructions. Refer to the
manufacturer’s literature in Volume 3 of this manual.
2)
Remove the gas pod from its mounting and prepare it for transport.
3)
Prepare the system PC for transport.
4)
Prepare the system frames for transport by disconnecting processing modules from the
transfer chamber (if applicable) and fitting the castor assemblies.
Issue 1: February 00
Uninstallation and Disposal
Page 9-4 of 6
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l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
VKP
a&aacute;&euml;&eacute;&ccedil;&euml;~&auml;=
This sub-section gives guidance for disposing of the system at the end of its life. The disposal
must be carried out in accordance with local safety regulations.
To dispose the system, use the following procedure:
1)
Carry out the uninstallation procedure given in sub-section 9.2, page 9-2
2)
Locate, remove and dispose of any hazardous materials in accordance with local safety
regulations, e.g. batteries, o-rings, oil etc. Refer to manufacturer’s manuals.
3)
Dispose of the remainder of the system in accordance with local safety regulations.
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Page 9-5 of 6
Issue 1: February 00
l&eacute;^i
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
System Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
NOTES:
Issue 1: February 00
Uninstallation and Disposal
Page 9-6 of 6
Printed: 7-Oct-07, 12:11
System Manual
Appendix A
Oxford Instruments Plasma Technology
Plasmalab and Ionfab
Measurement of radio frequency and microwave
emissions
1.
Scope of testing ................................................................................................................. 2
2.
Method of testing............................................................................................................... 2
3.
Acceptable exposure standards .......................................................................................... 3
4.
System design .................................................................................................................... 3
Printed: 5-Jun-09, 9:58
Measurement of RF &amp; Microwave Emissions
Page 1 of 4
Issue 2: December 01
Plasmalab and Ionfab
System Manual
Oxford Instruments Plasma Technology
WARNING
THIS APPENDIX COVERS ALL OF THE CURRENT REQUIREMENTS
FOR THE MEASUREMENT OF RADIO FREQUENCY AND MICROWAVE
EMISSIONS FOR THE OXFORD INSTRUMENTS PLASMA
TECHNOLOGY'S RANGE OF PRODUCTS. ENSURE THAT THE ENTIRE
APPENDIX IS READ AND UNDERSTOOD BY ALL INVOLVED
PERSONNEL AND THAT THE TESTS RELEVANT TO THE INSTALLED
SYSTEM ARE CARRIED OUT AT THE SPECIFIED PERIODICITY.
1. Scope of testing
Systems which contain RF generators, both Ion Beam and Plasma systems will be tested for the
emission of energy prior to shipment. They will also be tested routinely every three months during
use, or as required by safety standards at the customer's site, if this is more frequent.
Systems must also be tested after maintenance, if the maintenance has involved RF shielding
components such as covers and viewports, or components in the process chamber such as
feedthroughs and vacuum gauges.
Systems with RF generators in the frequency range of 0.1 MHz to 27.12 MHz must be tested for
emissions by measuring separately both the electric (E) and magnetic (H) field strengths. Either field
can be a safety hazard, hence the need to test both.
Systems with microwave frequency generators at 2.45 GHz will only be tested for power, usually by
measuring the electric (E) field.
2. Method of testing
Suitable test meters are the Narda 1 8511 for 1.7MHz to 2.1MHz, the Narda 8512 for 13.56 MHz and
27.12 MHz, and the Holaday 2 1501 for 2.45 GHz. Equivalent meters from other vendors are
acceptable. The test meter MUST have a current calibration certificate. Note that if an alternative
13.56 MHz meter is used, it should be able to detect the presence of 27.12 MHz as well as 13.56
MHz.
Testing must be performed on the system in its normal operating configuration, with the usual
covers and components in place. The system must be operating at maximum reasonable power, and
must be tested both in the presence and the absence of plasma.
The field strength must be measured 50 mm (2 inches) away from the system, at all points that can
be reached by hand with the probe (If parts of the system are inaccessible from the ground, a
stepladder must be used). The probes of the above meters are designed so that the correct distance
is obtained if the head of the probe is touching the system.
Particular attention must be given to viewports, doors and flanges, the automatch unit, and the whole
length of waveguides and RF power cables. If viewports are fitted with shutters, then tests must be
made with the shutter both open and shut. All cables leaving gauges and other feedthroughs in the
process chamber and the pumping system are suspect, and must be checked along their entire
length. The pumping system and any separate system racks and power box must also be checked.
It is strongly recommended that the operation of all safety interlocks should be tested at the same
time, whenever an RF or Microwave leakage test is performed.
1The Narda Microwave Corporation, Plainview, New York 11803.
2Holaday Industries Inc, 14825 Martin Drive, Eden Prairie, MN 55344.
Issue 2: December 01
Measurement of RF &amp; Microwave Emissions
Page 2 of 4
Printed: 5-Jun-09, 9:58
System Manual
Oxford Instruments Plasma Technology
Plasmalab and Ionfab
3. Acceptable exposure standards
Readings must be equal to or less than the levels shown in Table 1 at all points. Exceptions will only
be permitted in certain special circumstances. These exceptions will be clearly documented in the
system instructions. In all other situations, these standards must be strictly met.
Frequency
Electric Field (E)
V/m
mW/cm2
614
614
1842/f
900/f2
f/300
Magnetic field (H)
A/m
mW/cm2
16.3/f
16.3/f
16.3/f
10000/f2
f/300
0.1 to 1 MHz
1.7 to 2.1 MHz
13.56 MHz and 27.12 MHz
2.45 GHz
Note – f is the frequency in MHz
Reference: ANSI/IEEE C95.1 maximum permissible exposure for controlled
environments.
Table 1 - Maximum permitted field strengths
4. System design
RF and Microwave components such as RF ion sources may be purchased from Oxford Instruments
Plasma Technology and fitted to the customer's system. Such an installation requires a system
designed to prevent leakage of RF and Microwave emissions, and requires careful testing by the
installer before use.
It is not possible to give a full list of necessary safety precautions, and advice should be sought from
a competent authority. However, some of the points to be considered are as follows:
(a)
The system and all of its assemblies should be very well grounded (earthed), using low
impedance straps, and ensuring impedances between power supplies and the chamber of 
0.1 Ohms at 25 A.
(b)
Viewports should be shielded with fine conducting mesh to prevent the transmission of RF
and Microwave energy, and should be filtered to prevent the transmission of UV light.
(c)
Doors and flanges should provide metal-to-metal contact. In case of doubt, and in the case
of access doors, the use of copper beryllium finger strips or wire mesh over elastomer core
(e.g. Zemrex products from Warth International 3 should be considered. Small flanges in the
vacuum system should be joined with metal clamps, not plastic.
(d)
All types of electrical feedthrough and vacuum gauges, together with cables leaving them,
may need shielding.
(e)
Interlocks will need to be wired into the system to ensure safe operation. These will include
interlocks with the system access door, the customer's water supply to the RF product, and
the system vacuum. The product purchased from Oxford Instruments Plasma Technology will
also have interlock switches. These interlocks must all force the disconnection of power from
the RF, Microwave and HV power supplies if they are opened. See the product manual for
more details.
3Warth International Ltd, Charlswood Road, East Grinstead, Sussex, England, RH19 2HH.
Printed: 5-Jun-09, 9:58
Measurement of RF &amp; Microwave Emissions
Page 3 of 4
Issue 2: December 01
Plasmalab and Ionfab
Oxford Instruments Plasma Technology
System Manual
NOTES:
Issue 2: December 01
Measurement of RF &amp; Microwave Emissions
Page 4 of 4
Printed: 5-Jun-09, 9:58
System Manual
Appendix B
Appendix B
Oxford Instruments Plasma Technology
Plasmalab and Ionfab
Operation and maintenance of turbomolecular pumps
Operation and maintenance of turbomolecular pumps .............................................. 1
1
Maintenance for all Turbo Pumps ....................................................................................... 2
2
Maintenance for Alcatal ATP/ACT Turbo pumps .................................................................. 3
2.1 Re-greasing of turbo pumps fitted to process chambers....................................................... 3
2.2 2000 to 8000 hours (3 to 12 months): pump relubrication ................................................... 3
Printed: 10-Jun-09, 6:52
Operation and Maintenance of Turbo Pumps
Page 1 of 4
Issue 3: June 02
Plasmalab and Ionfab
Oxford Instruments Plasma Technology
System Manual
1 Maintenance for all Turbo Pumps
Please note that premature failure of Turbomolecular Pumps can be caused by failing to
observe the following recommendations:
a)
Always follow the maintenance and operating instructions contained in the
manufacturers' manuals, copies of which are provided within the system
manuals. Note that with some types of pump the lubricant should be replaced
when the total running time reaches 500 hours.
b)
When corrosive process gases are being used always purge the turbo pump
with dry nitrogen during a processing run. If the process chamber is to be
vented adequate time must first be allowed for the process gases to be
pumped away.
c)
If corrosive process gases are used in a system with no gate valve between
the turbo pump and the process chamber and the system is to be left for
more than one hour with the turbo pump not running, proceed as follows:
d)
Issue 3: June 02
1)
Turn off all the manual gas taps on the process gas lines. Also turn off
the gas taps on the process gas cylinders.
2)
Close the chamber door.
3)
Pump the process chamber and turbo pump down to approximately 1 x
10 -4 millibars.
4)
Vent the process chamber and turbo pump to atmospheric pressure with
dry nitrogen. Do not allow the chamber door to open.
5)
Repeat Steps 3 and 4 three times.
6)
Seal the process chamber and turbo pump.
If corrosive process gases are used in a system with a gate valve between the
turbo pump and the process chamber and the system is to be left for more
than one hour with the turbo pump not running, proceed as follows:
1)
With the exception of the Argon and Nitrogen lines, turn off all the
manual gas taps on the process gas lines and also turn off the gas taps
on the process gas cylinders.
2)
Close the chamber door.
3)
Run a 'process' sequence (without any samples loaded) using only Argon
or Nitrogen as process gases for at least 10 minutes.
4)
Vent the process chamber and vent the turbo pump to atmospheric
pressure with dry nitrogen. Do not allow the chamber door to open.
5)
Pump the process chamber and the turbo pump down to 1 x 10-4
millibars and then vent them with dry nitrogen.
6)
Repeat Step 5 three times.
7)
Seal the process chamber and the turbo pump.
Operation and Maintenance of Turbo Pumps
Page 2 of 4
Printed: 10-Jun-09, 6:52
System Manual
Oxford Instruments Plasma Technology
Plasmalab and Ionfab
2 Maintenance for Alcatal ATP/ACT Turbo pumps
2.1
Re-greasing of turbo pumps fitted to process chambers
The following instruction applies to conventionally greased bearing turbo pumps, e.g. the Alcatel ATP
series. It does not apply to Maglev turbo pumps.
To prevent damage to turbo pumps fitted to process chambers, OIPT strongly recommends that
bearing re-greasing is carried out periodically after every 2500 hours of pump running time.
Details of re-greasing are given in the following sub-section.
2.2
2000 to 8000 hours (3 to 12 months): pump relubrication
CAUTION
Failure to perform regular pump maintenance will result in pump warranty being
suspended.
Refer to the manufacturer’s manual in Volume 3 of this manual.
Alcatel ATP series turbo pumps are conventional greased bearing pumps. Periodically, these bearings
need to be re-greased.
The re-greasing interval depends on a number of factors; Refer to the graph in the Maintenance
section of the manufacturer’s manual to establish the re-greasing interval for the pump in your
system. Remember that turbo pumps fitted to process chambers must be re-greased at 2500 hour
intervals. The re-greasing interval for turbo pumps fitted to load locks and transfer chambers is not
so critical, therefore the manufacturer’s recommendations can be used.
The ATP turbo pumps are supplied with series ACT intelligent controllers which are menu-driven.
The ‘SET-UP’ menu allows the re-greasing interval to be set so that a visual warning with an optional
audible alarm is displayed at the relevant time. Note that this visual warning does not require any
action immediately; it only indicates that the bearing should be re-greased at the next available
opportunity. If required, the visual warning and audible alarm can be disabled via the ‘SET-UP’ menu.
When the pumps are supplied, the ACT controller is pre-set with a 5,000 hour re-grease interval. If
the pumps are running continuously, the visual re-grease warning will be automatically triggered
after approximately seven months.
The customer is advised to use the ‘SET-UP’ menu to set the re-greasing interval for the pump fitted
to his system. Refer to the pump manufacturer’s manual. Note that this change takes approximately
five minutes.
When the re-greasing time is reached, lubrication is carried out using a pre-loaded syringe to apply a
metered quantity of a specific grease to one point on the bearing. Refer to the pump manufacturer’s
manual. The Alcatel part numbers of the syringes are:
Pump Type
ATP80
150C/400HPC/900HP
C
Pre-loaded Syringe Part Number
056993
101924
Note that the grease syringe has a limited shelf life so shouldn’t be ordered from the Alcatel service
centre until it is needed. Alcatel exercises strict stock control on this item to ensure that the grease is
always in good condition.
Printed: 10-Jun-09, 6:52
Operation and Maintenance of Turbo Pumps
Page 3 of 4
Issue 3: June 02
Plasmalab and Ionfab
Oxford Instruments Plasma Technology
System Manual
Once the grease has been applied to the bearing, it needs to be evenly distributed around the
bearing. This is done automatically by using the ACT controller’s ‘RUNNING IN’ menu. Note that the
grease distribution takes approximately 2.5 hours.
Issue 3: June 02
Operation and Maintenance of Turbo Pumps
Page 4 of 4
Printed: 10-Jun-09, 6:52
OpAL
Open Load Atomic Layer Thermal Deposition System
Installation Data
Typical OpAL thermal system
Issue 3: October
OpAL
Installation Data
Oxford Instruments Plasma Technology
Change Record Sheet
Issue No.
01
02
03
Details of change
First Issue
Whole Document reviewed and updated
Fig 3 updated. Fig 4 and Fig 5 added (showing process chamber open)
Issue 3: October 08
Installation Data
Page 2 of 22
Date
Aug. 07
Aug. 08
Oct. 08
Printed: 7-Aug-09, 8:03
Installation Data
Oxford Instruments Plasma Technology
OpAL
Contents
Change record sheet
1.
Introduction ........................................................................................................... 4
2.
Installation information .......................................................................................... 5
2.1 Dimensions...................................................................................................... 5
2.2 Weights ........................................................................................................... 5
2.3 Heat load ......................................................................................................... 5
2.4 Sound level ...................................................................................................... 5
3.
Installation diagrams .............................................................................................. 6
4.
Services connections ............................................................................................ 13
5.
Gas handling ........................................................................................................ 15
6.
Services................................................................................................................ 16
6.1 Electrical Supply requirement ......................................................................... 16
6.2 Water Cooling requirements ........................................................................... 16
6.2.1 Lower Electrode ......................................................................................... 16
6.3 Compressed Dry Air (CDA) requirement.......................................................... 16
6.4 Nitrogen requirement..................................................................................... 17
6.5 Process gas requirement ................................................................................ 17
6.6 Extraction requirement .................................................................................. 17
7.
Pump set information ........................................................................................... 18
7.1 Rotary pump purging ..................................................................................... 18
8.
Interlocks ............................................................................................................. 19
8.1 General description........................................................................................ 19
8.2 Gas box interlocks ......................................................................................... 21
8.2.1 Incompatible gases.................................................................................... 21
8.3 System LED Monitoring Table ......................................................................... 22
9.
Precursor Information........................................................................................... 22
10. OIPT locations worldwide...................................................................................... 22
Fig 1: OpAL services ........................................................................................................ 6
Fig 2: Front view ............................................................................................................. 7
Fig 3: Plan view ............................................................................................................... 8
Fig 4: Plan view with process chamber open .................................................................... 8
Fig 5: 3-D view with process chamber open .................................................................... 9
Fig 6: Console - rear view with dimensions ................................................................... 10
Fig 7: Console - rear view ............................................................................................. 11
Fig 8: Console – precursor cabinet rear view.................................................................. 12
Fig 9: Services connector locations ................................................................................ 13
Fig 10: Electrical connections ........................................................................................ 14
Fig 11: 8-Line gas pod .................................................................................................. 15
Fig 12: Gas box interlock chain ..................................................................................... 21
Table 1: Services connector identification ...................................................................... 13
Printed: 7-Aug-09, 8:03
Installation Data
Page 3 of 22
Issue 3: October 08
OpAL
1.
Oxford Instruments Plasma Technology
Installation Data
Introduction
This installation specification document gives information about the OpAL (ALD) systems to
enable customers to prepare the required environment for the system.
Note that all dimensions shown in these data sheets are typical; precise dimensions
depend on the actual equipment fit. All dimensions are given in millimetres unless
otherwise stated.
Oxford Instruments Plasma Technology conducts a programme of continual product
development, and reserves the right to change the design and/or specification of
equipment without notice. The details contained in this document were correct at the
time of printing but should be confirmed immediately prior to delivery.
Issue 3: October 08
Installation Data
Page 4 of 22
Printed: 7-Aug-09, 8:03
Installation Data
Oxford Instruments Plasma Technology
2.
Installation information
2.1
Dimensions
OpAL
Dimensions of the system are given in Fig 1, Fig 2, Fig 3, Fig 4 and Fig 6. Gas handling
component dimensions are given in Fig 11. Pump dimensions are given in Section 7.
2.2
Weights
Typical weights of system components:
Console:
250 kg
8-line Gas pod:
50 kg
12-line Gas pod: 70 kg
Pump:
2.3
See Section 7 (Pump set information).
Heat load
The typical heat load for the clean room installation is:
Operating: 5 kW (includes chamber, electrode, precursors)
Passive:
3 kW
Note that these specifications do not include externally sited components, e.g. pumps,
transformers, etc..
2.4
Sound level
Typical sound levels (measured 500mm above the dry pump): 75dB
Printed: 7-Aug-09, 8:03
Installation Data
Page 5 of 22
Issue 3: October 08
OpAL
3.
Oxford Instruments Plasma Technology
Installation Data
Installation diagrams
Fig 1: OpAL services
Issue 3: October 08
Installation Data
Page 6 of 22
Printed: 7-Aug-09, 8:03
Installation Data
Oxford Instruments Plasma Technology
OpAL
Fig 2: Front view
Printed: 7-Aug-09, 8:03
Installation Data
Page 7 of 22
Issue 3: October 08
OpAL
Oxford Instruments Plasma Technology
Installation Data
Fig 3: Plan view
Fig 4: Plan view with process chamber open
Issue 3: October 08
Installation Data
Page 8 of 22
Printed: 7-Aug-09, 8:03
Installation Data
Oxford Instruments Plasma Technology
OpAL
Fig 5: 3-D view with process chamber open
Printed: 7-Aug-09, 8:03
Installation Data
Page 9 of 22
Issue 3: October 08
OpAL
Oxford Instruments Plasma Technology
Installation Data
For details, refer to Fig 6
For details of electrical
connections, refer to Fig 8
Fig 6: Console - rear view with dimensions
Issue 3: October 08
Installation Data
Page 10 of 22
Printed: 7-Aug-09, 8:03
Installation Data
Oxford Instruments Plasma Technology
OpAL
Fig 7
Foreline
Heater
connections
Fig 7: Console - rear view
Printed: 7-Aug-09, 8:03
Installation Data
Page 11 of 22
Issue 3: October 08
OpAL
Oxford Instruments Plasma Technology
Installation Data
(These are for internal gas lines
located inside the cabinet)
Fig 8: Console – precursor cabinet rear view
Issue 3: October 08
Installation Data
Page 12 of 22
Printed: 7-Aug-09, 8:03
Installation Data
4.
Oxford Instruments Plasma Technology
OpAL
Services connections
Fig 9: Services connector locations
NOTE:
When installing the services, read the Mandatory requirements in the Services
Specification document.
Connector
ALD Machine with External Gas Pod
Service
Fitting
NOTE
1
2
Spare
Inert Purge gas IN
&frac14;” VCR
3
4
Spare
Argon Bubbler gas IN
Either Argon or Nitrogen purge
for gas line located inside of
system cabinet. See section 6
For gas supply pressure and
flow requirements.
&frac14;” VCR
5
6
7
8
N2 vent gas IN
Spare
Spare
Process gas IN
Argon for bubbling gas line
located inside of system
cabinet. See sub-section 6.5 for
gas supply pressure and flow
requirements
9
10
Electrode Cooling IN
Electrode cooling
OUT
Compressed air OUT
Spare
Spare
Compressed air IN
Drip tray Outlet
11
12
13
14
15
&frac14;” Swagelok
&frac14;” VCR
3/8” Swagelok
Only used to link external gas
pod to system. For internal gas
lines refer to Fig 8, page 12.
3/8” Swagelok
6mm Push-fit
6mm Push-fit
&frac14;” OD pipe
Table 1: Services connector identification
Printed: 7-Aug-09, 8:03
Installation Data
Page 13 of 22
Issue 3: October 08
OpAL
Installation Data
Oxford Instruments Plasma Technology
POWER DISTRIBUTION
UNIT
(REMOVABLE COVER)
SYSTEM POWER
CABLE GLAND
(CABLE LENGTH
= 4 METRES)
CABLE GLAND FOR
SUPPLY TO SLAVE
UNIT
SKT 7
SOCKET 10A
(Spare)
SOCKET 9
1
COOLING
FAN
SOCKET 10
1
1
SKT 8
EARTH TERMINAL
SOCKET 16
2 AMP 2 AMP 3.15 AMP
FS1
FS2
FS3
+15V
-15V +24V
LOW VOLTAGE FUSES
HEATER/CHILLER OR
SILANE FURNACE
AUXILIARY
EMERGENCY OFF
(EMO) SWITCH
CONNECTION
4-WAY BICC
PIN A
EMO 1
PIN B
0V
PIN C
+24VDC
PIN D
EMO 2
(NOTE: EMO 1 &amp; 2
MUST BE LINKED)
PUMP PURGE
(PINS 1 &amp; 2)
VAC STAT FOR
LEYBOLD ROOTS
(IF FITTED)
(PINS C &amp; D)
SUPPLY TO ROTARY PUMP 2 SUPPLY TO ROTARY PUMP 1
CURRENT RATING = 10 AMPS CURRENT RATING = 12 AMPS
(208V) OR 5 AMPS (415V)
(208V) OR 6 AMPS (415V)
PHASE 2
PHASE 1
PHASE 2
4
PHASE 3
PHASE 3 3 2 1
SPARE
5
6
PHASE 1
2
1
3
4
SPARE
NEUTRAL
(NOTE: PUMP OUTLETS HAVE OVERLOAD RELAY IN ADDITION
TO CIRCUIT BREAKERS)
Fig 10: Electrical connections
Issue 3: October 08
Installation Data
Page 14 of 22
Printed: 7-Aug-09, 8:03
Installation Data
5.
Oxford Instruments Plasma Technology
OpAL
Gas handling
IMPORTANT: OIPT gas pods typically weigh &gt; 50 kg. If you intend fixing your gas pod
to a wall, ensure the wall and gas pod fixings are sturdy enough to bear at
least four times the weight of the gas pod. Periodically, e.g. annually,
check the gas pod and its fixings are secure.
100 mm DIAMETER
EXTRACTION COLLAR
220
100
45
41
SECONDARY GAS OUTLET
LINE TO SYSTEM (ONLY
USED IF A SPLIT MANIFOLD
IS FITTED)
&frac14;&quot;
GAS 8
160
988.7
918.4
GAS 7
848.1
GAS 6
777.8
GAS 5
707.5
GAS 4
GAS INLET LINES
(&frac14;&quot;STAINLESS
STEEL TUBE
FOR WELDING TO
THE CUSTOMER'S
SUPPLY)
637.2
GAS 3
1030
566.9
GAS 2
496.6
GAS 1
FIXING HOLE
(6.5 mm DIA.)
LOCATED 20 mm
FROM EDGES
OF BACKPLATE
(ONE AT EACH
CORNER)
426.3
356
HEATER
CONTROLLERS
(IF FITTED)
EARTH
STUD
25-WAY ‘D’ CONNECTOR
FOR PLC/PCB
CONTROL SIGNALS
PRIMARY GAS
OUTLET LINE TO
SYSTEM
650
COMPRESSED
AIR IN (LEFT-HAND
CONNECTOR) &amp; OUT
(4mm push fit)
GAS POD COVER
INTERLOCK MICROSWITCH
0
Fig 11: 8-Line gas pod
(Gases 7 and 8 are on split manifolds, an additional 6 gases may be fitted including a
clean gas)
Printed: 7-Aug-09, 8:03
Installation Data
Page 15 of 22
Issue 3: October 08
OpAL
6.
Oxford Instruments Plasma Technology
Installation Data
Services
The required services are listed in the following sub-sections. For full details of services
specifications including connection diagrams, electrical connection schematic etc., read in
conjunction with the Oxford Instruments Plasma Technology ‘Services Specifications for
Plasmalab and Ionfab Systems’ document.
6.1
Electrical Supply requirement
Function
System electrical
supply (208V
system)
Connection
Cable (4 metres
long)
System electrical
supply (415V
system)
Cable (4 metres
long)
6.2
Water Cooling requirements
6.2.1
Lower Electrode
Function
Liquid cooled seals
for lower electrode
6.3
Connection
3/8” stainless steel
Swagelok
Parameter
Voltage
Current
Frequency
Phases
Voltage
Current
Frequency
Phases
Parameter
Flow
Temperature
Specification
208Vac &plusmn;10%
32 A
50 / 60 Hz
3 phase, N + E
380Vac –10% to
415Vac +6%
25 A
50 / 60 Hz
3 phase, N + E
Specification
Min. 2 lpm (0.53
gpm (US))
As required by
process
Compressed Dry Air (CDA) requirement
Function
System CDA
Connection
6mm push-fit
Parameter
Flow
Gaspod CDA
6mm push-fit
Pressure
Flow
Pressure
Issue 3: October 08
Installation Data
Page 16 of 22
Specification
5 lpm (0.2 cfm)
(combined with gas
pod)
6.0 – 7.0 Bar
5 lpm (0.2 cfm)
(combined with
system)
4.0 – 6.0 Bar
Printed: 7-Aug-09, 8:03
Installation Data
6.4
Oxford Instruments Plasma Technology
Nitrogen requirement
Function
System N2
Connection
&frac14;” stainless steel
Swagelok
Parameter
Flow
Pressure
Rotary pump purge
&frac14;” stainless steel
Swagelok typically
Flow
Pressure
Glove box purge
6.5
&frac14;” stainless steel
Swagelok (fed from
System N2)
Flow (set at
rotameter)
Pressure
Specification
10 lpm (0.4 cfm)
3.0 Bar (45 psi)
minimum
Refer to subsection 6.1 Rotary
pump purging
Refer to subsection 6.1 Rotary
pump purging
1 lpm (0.04 cfm)
3.0 Bar (45 psi)
minimum
Process gas requirement
Function
Process gas in
(includes purge
and bubbler gases)
6.6
OpAL
Connection
&frac14;” stainless steel
welded pipe at
gaspod
&frac14;” stainless steel
VCR at system
Parameter
Pressure
Specification
2.0 – 3.0 Bar (30 –
45 psi)
Parameter
Flow
Specification
8-line gas pod – 3
m3/hour (1.8 cfm)
Extraction requirement
Function
Gaspod
Connection
100mm (4”) tube
Rotary pump
exhaust
Refer to Section 6
Pump set
information
Printed: 7-Aug-09, 8:03
Installation Data
Page 17 of 22
Issue 3: October 08
OpAL
7.
Installation Data
Oxford Instruments Plasma Technology
Pump set information
CAUTION
Where the rotary vane pump is powered from a mains supply separate from the OpAL
system, a separate 'emergency off' facility must be provided by the customer.
Minimum N2
Power
consumption
purge rate
kW
Alcatel 2063C2
819
264
397
DN 40
98
2.2 (50Hz)
2 litres/minute
2.6 (60Hz)
* All fittings and pipework connected to the rotary pump exhaust must be made from industry standard stainless
steel. Refer to the OIPT Services Specifications document, sub-section 8.1.
** This figure applies only to the rotary vane pump; the roots blower does not require N2 purging.
For ALD precursors such as TMA, mineral oil A155 is to be used with the pump
Available
pump options
7.1
Length
mm
Width
mm
Height
mm
Machine
connection
*Pump
outlet
connection
DN 40
Weight
kg
Rotary pump purging
The requirements for rotary pump purging depend on the process used. Customers
should consult the pump manufacturer for their recommendations.
For Adixen 2063 rotary pumps, the recommended minimum N2 purge rate is
2 litres/minute at a pressure of 2bar to 5bar. For highly corrosive or pyrophoric gases,
4 litres/minute is recommended.
Issue 3: October 08
Installation Data
Page 18 of 22
Printed: 7-Aug-09, 8:03
Installation Data
Oxford Instruments Plasma Technology
8.
Interlocks
8.1
General description
OpAL
The interlocks form a continuous 24Vdc chain, which must be complete before the
process gases are enabled. An output to disable external devices unless the lid/ hoist is
closed is also provided; this is typically used to disable a lid-mounted endpoint detector
laser.
ALD process gases will only flow if all heaters are within tolerance. If any one heater is not
in tolerance, the process will not start.
If the precursor cabinet door is opened, compressed air to the ALD valves is turned off
and process gases are turned off.
Supply to the ALD valves is only available when the system is at base pressure.
The interlock chain is monitored by the software, but acts independently. It is also
supplemented by machine protection sensors, which operate only via the software.
To enable the interlocks:






The 600 mbar vacuum switch (‘Vacstat’) must be at low pressure
The process chamber lid must be shut (or its hoist down)
The primary process pump must be running
The primary process pressure gauge (normally a capacitance manometer) must be
on scale
Customer-supplied external alarm devices must be in their safe state
The inert gas purge to the primary process pump must be flowing.
To enable process gases including ALD precursors:


The gas box lid must be shut
Specific gases can be set in the gas box hardware to be mutually exclusive, so that
they cannot be turned on together.
Machine protections fitted where appropriate:

A nitrogen pressure switch, to detect adequate purge pressure to turbomolecular
pump bearings.
OR:

A nitrogen flow meter, to detect purge gas flow to pump bearings.

Water flow switch(es).
Printed: 7-Aug-09, 8:03
Installation Data
Page 19 of 22
Issue 3: October 08
OpAL
Installation Data
Oxford Instruments Plasma Technology
The interlock chain details are given in the following table: Refer to drawing SE00A26865
(PC2003 interface schematic).
INTERLOCK
Vacuum
Switch
Hoist /Lid
DEVICE
Vacuum Switch
PCB
input
BLK17
PCB1
LED
11
NONE
Pressure below 600 mBar
a)
BLK18
12
NONE
Lid closed or hoist down. Enables
end point laser via JP51
BLK19
13
JP44
6
15
Interlock disabled if an
independent/dry pump fitted
Capacitance
Manometer (e.g.
Baratron™)
JP16
5
NONE
Analogue input below 11.5V.
Switches comparator U5.
External Voltage Free
contact or 24V DC
input to PCB
JP52
14
External Voltage Free
contact
JP53
15
Can be
bypassed
using
LK19
20
Customer-supplied device. Volt
free contact JP52 pins 1 and 4.
OR
24V DC input JP52 pin 4.
Customer-supplied device
or
Air cylinder
switch/microswitc
h
b)
Guardmaster
Switch N/O Switch
Current monitor in
Power Box
Primary
pump
running
Process
pressure
gauge on
scale
Spare
interlock 1
Spare
interlock 2
Link out
Or
Comments
Or
Load lock
valve
Process
pump purge
Inter-chamber valve
must be shut
Gas Flow Switch at
Primary Pump
Used on 100 and 133 systems
JP55
16
LK21A
Fit LK21B if fitted
If the above is satisfied, then 24V is at BLK20, 21 &amp; 22 pin 1. This enables the Gas Pod.
Issue 3: October 08
Installation Data
Page 20 of 22
Printed: 7-Aug-09, 8:03
Installation Data
8.2
Oxford Instruments Plasma Technology
OpAL
Gas box interlocks
Refer to drawing: SE81B26657 (PC2003 gas pod loom).
To enable process gases, the interlock chain must be complete. The gas box interlock is
shown in Fig 12.
SYSTEM CONSOLE
PCB 94-PC00S26866
BLK
20
24VDC
1
GAS BOX
REAR SERVICES
PANEL
SKT25W
PIN4
PL25W
PIN4
SERVICES
PANEL
SKT25W PL24W
PIN4
PIN4
PCB 94-PC81S26655
JP6
PIN1
JP6
PIN2
LID
SWITCH
JP6
PIN3
Via JP3 to CAN unit
controlling gases 1 - 4.
See NOTE.
NOTE: The function of the signal is to supply
24Vdc power to the digital outputs of
the CAN unit. The interlock continues
through idendical boards (where fitted)
which drive gases 5 - 8 and 9 - 12.
Fig 12: Gas box interlock chain
8.2.1
Incompatible gases
2nd PCB Gas 3rd PCB Gas
1st PCB Gas
1
5
9
2nd Gas
2
6
10
3rd Gas
3
7
11
4th Gas
4
8
12
Gases are designated as one of three types:
1st Gas
Type A
LK3A + 4
LK5A + 6
LK7A + 8
LK9A + 10
Type B
LK3B
LK5B
LK7B
LK9B
Type X
LK3A
LK5A
LK7A
LK9A
Gas type A: Typically oxidising gases (e.g. oxygen)
Gas type B: Typically fuel gases (e.g. hydrogen)
Gas type X: Gases normally miscible with most other gas types.
If ANY gas Type A is enabled, then ALL gas Type B lines are disabled.
The gas box has a facility to prevent incompatible gases from being enabled
simultaneously, using soldered links.
Printed: 7-Aug-09, 8:03
Installation Data
Page 21 of 22
Issue 3: October 08
OpAL
8.3
Installation Data
Oxford Instruments Plasma Technology
System LED Monitoring Table
NAME
LED1
LED2
LED3
LED4
LED5
LED6
LED7
LED8
LED9
LED10
LED11
LED12
LED13
LED14
LED15
LED16
LED17
COLOUR
GREEN
RED
YELLOW
GREEN
RED
RED
RED
RED
RED
RED
RED
RED
RED
RED
RED
RED
RED
MONITORING
+24V DC
+15V DC
-15V DC
+5V DC
CM COMP OK
PUMP CURRENT SWITCH
N2 PRESSURE SWITCH
WATER ONE
WATER TWO
WATER THREE
VAC STAT
RL10 (HOIST CONTROL)
HOIST
SPARE INTERLOCK 1
SPARE INTERLOCK 2
PUMP PURGE SWITCH
RL15 (MASTER/SLAVE) ACTIVE SLAVE
Note that when the interlock chain is complete, all LEDs are illuminated.
9.
Precursor Information
Refer to precursor ordering guide.
10.
OIPT locations worldwide
UK
Oxford Instruments Plasma Technology
North End, Yatton,
Bristol, BS49 4AP
Tel: +44(0)1934 837000
Fax: +44(0)1934 837001
Email: [email protected]
Web: www.oxfordinstruments.com/plmchp5.htm
USA
Oxford Instruments Inc.
300 Baker Avenue, Suite 150
Concord, MA 01742
Phone: +1 978-369-9933
Toll Free: +1 800-447-4717
Fax: +1 978-369-8287
Email: [email protected]
Japan
Oxford Instruments K.K.
2-11-6 Tomioka
Koto-ku, Tokyo 135-0047
Tel: +81-3-5245-3261
Fax: +81-3-5245-4466
Email: [email protected]
Web: www.oxford-instruments.jp
People’s Republic of China (Beijing)
Oxford Instruments China
Room 714, Office Tower 3,
Henderson Center,
No. 18 Jianguomennei Ave,
Dongcheng District,
Beijing 100005
Tel: +86 106518 8160/1/2
Fax: +86 106518 8155
Email: [email protected]
Web: www.oxford-instruments.com.cn
Germany
Oxford Instruments GmbH
Otto-von-Guericke Ring 10,
D-65205 Wiesbaden
Tel: +49(0)6122 937161
Fax: +49(0)6122 937175
Email: [email protected]
Issue 3: October 08
People’s Republic of China
(Shanghai)
Oxford Instruments China
Room 14-F, No.1 Plaza
800 Nanjing East Road
Shanghai 200001
Tel: +86 216360 8530
Fax: +86 216360 8535
Email: [email protected]
Web: www.oxford-instruments.com.cn
Singapore
Oxford Instruments Pte. Ltd
371 Beach Road,
#02-07 Keypoint
Singapore 199597
Tel: +65 6337 6848
Fax: +65 6337 6286
Email: [email protected]
Taiwan
Oxford Instruments Overseas Marketing
Ltd.
th
1F, No 23 Jing-Shang 19 Street,
Hsinchu, Taiwan
Tel: +65 6337 6848
Fax: +65 6337 6286
Email: [email protected]
Installation Data
Page 22 of 22
Printed: 7-Aug-09, 8:03
System Manual
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l&eacute;^i
^&eacute;&eacute;&Eacute;&aring;&Ccedil;&aacute;&ntilde;=mpm= m&ecirc;&Eacute;&Aring;&igrave;&ecirc;&euml;&ccedil;&ecirc;=p&ccedil;&igrave;&ecirc;&Aring;&Eacute;=m&ccedil;&iacute;=&aacute;&aring;&euml;&iacute;~&auml;&auml;~&iacute;&aacute;&ccedil;&aring;I=
&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=~&aring;&Ccedil;=&Ccedil;&Eacute;&Aring;&ccedil;&atilde;&atilde;&aacute;&euml;&euml;&aacute;&ccedil;&aring;&aacute;&aring;&Ouml;=
1.
About this appendix................................................................................................... 2
2.
Bubbling ...................................................................................................................... 2
2.1 Pot preparation for bubbling............................................................................................2
2.1.1 Step-by-step procedure ..............................................................................................4
2.1.1.1 Step 1 (Pot preparation for bubbling) ..............................................................4
2.1.1.2 Step 2 (Pot preparation for bubbling) ..............................................................5
2.1.1.3 Step 3 (Pot preparation for bubbling) ..............................................................6
2.1.1.4 Step 4 (Pot preparation for bubbling) ..............................................................7
2.1.1.5 Step 5 (Pot preparation for bubbling) ..............................................................7
2.1.1.6 Step 6 (Pot preparation for bubbling) ..............................................................8
2.1.1.7 Step 7 (Pot preparation for bubbling) ..............................................................9
3.
Vapour draw ............................................................................................................. 11
3.1 Pot preparation for vapour draw....................................................................................12
3.1.1 Step-by-step procedure ............................................................................................13
3.1.1.1 Step 1 (Pot preparation for vapour draw) ......................................................13
3.1.1.2 Step 2 (Pot preparation for vapour draw) ......................................................14
3.1.1.3 Step 3 (Pot preparation for vapour draw) ......................................................15
3.1.1.4 Step 4 (Pot preparation for vapour draw) ......................................................16
3.1.1.5 Step 5 (Pot preparation for vapour draw) ......................................................16
3.1.1.6 Step 6 (Pot preparation for vapour draw) ......................................................17
3.1.1.7 Step 7 (Pot preparation for vapour draw) ......................................................18
Fig 2-1: Basic bubbling layout......................................................................................................2
Fig 2-2: Step 1 (Pot preparation for bubbling)...........................................................................4
Fig 2-3: Step 2 (Pot preparation for bubbling)...........................................................................5
Fig 2-4: Step 3 (Pot preparation for bubbling)...........................................................................6
Fig 2-5: Step 4 (Pot preparation for bubbling)...........................................................................7
Fig 2-6: Step 6 (Pot preparation for bubbling)...........................................................................8
Fig 2-7: Step 7 Bubbling - delivery of precursor .........................................................................9
Fig 2-8: Step 7 Bubbling - purging of precursor .......................................................................10
Fig 3-1: Basic vapour draw layout .............................................................................................11
Fig 3-2: Step 1 (Pot preparation for vapour draw)...................................................................13
Fig 3-3: Step 2 (Pot preparation for vapour draw)...................................................................14
Fig 3-4: Step 3 (Pot preparation for vapour draw)...................................................................15
Fig 3-5: Step 4 (Pot preparation for vapour draw)...................................................................16
Fig 3-6: Step 6 (Pot preparation for vapour draw)...................................................................17
Fig 3-7: Vapour draw – precursor delivery................................................................................18
Fig 3-8: Vapour draw – precursor purge ...................................................................................19
Printed: 7-Oct-07, 12:13
Precursor Source Pot
Page 1 of 20
Issue 1: September 07
l&eacute;^i
NK
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
^&Auml;&ccedil;&igrave;&iacute;=&iacute;&Uuml;&aacute;&euml;=~&eacute;&eacute;&Eacute;&aring;&Ccedil;&aacute;&ntilde;=
This Appendix gives information about the precursor pot fitted to the l&eacute;^i system.
OK
_&igrave;&Auml;&Auml;&auml;&aacute;&aring;&Ouml;=
The basic bubbling layout is shown in Fig 2-1.
To chamber
Purge
VCR
Extraction port
1 m3/h
Dose
Ar purge
500 sccm
VCR
Switching
Bypass
Single
ALD valve
jacket heated
to 200 &deg;C
Ar bubbler
500 sccm
E
Drip tray
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 2-1: Basic bubbling layout
OKN
m&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&Auml;&igrave;&Auml;&Auml;&auml;&aacute;&aring;&Ouml;=
1) Before connecting a source pot, ensure that the lines have been pumped.
2) Connect the pot in accordance with local health and safety measures and MSDS
3) Connect the inlet and outlet – DO NOT TURN THEM ON YET
4) Pump out atmosphere which is trapped during connection of inlet and outlet valves of the
source pot:
i)
The inlet is pumped out via the Exhaust ALD valve, E, this valve needs to be turned
on with Switching valve S1 (S1 is paired with D1 and control is provided by D1)
ii)
S1 and D1 will come on at the same time and this will clear the trapped
atmosphere
iii)
Close S1 and D1, flow Ar from bubbler mfc to clear any residual air in the bubbling
line
Issue 1: September 07
Precursor Source Pot
Page 2 of 20
Printed: 7-Oct-07, 12:13
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
iv)
Open D1 and flow Argon from the purge MFC to clear any residual air in the
delivery line
v)
Pump out inlet and outlet lines – MANUAL INLET AND OUTLET VALVES ARE STILL
SHUT
5) Degassing
Precursors are filled under inert gas at around 2 bar. This space has to be evacuated.
i)
Turn on D1 for 1 minute
ii)
Gradually, open the outlet valve, note pressure rise does not trip the CM gauge.
iii)
Shut manual valve
iv)
Repeat steps ii) and iii) above until there is no pressure rise
v)
Turn off D1
vi)
Pot is now degassed
6) Open the inlet manual valve
7) Start processing in bubbling mode.
Printed: 7-Oct-07, 12:13
Precursor Source Pot
Page 3 of 20
Issue 1: September 07
l&eacute;^i
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
OKNKN
p&iacute;&Eacute;&eacute;J&Auml;&oacute;J&euml;&iacute;&Eacute;&eacute;=&eacute;&ecirc;&ccedil;&Aring;&Eacute;&Ccedil;&igrave;&ecirc;&Eacute;=
OKNKNKN
p&iacute;&Eacute;&eacute;=N=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&Auml;&igrave;&Auml;&Auml;&auml;&aacute;&aring;&Ouml;F=
1) Ensure that lines are fitted with VCR blanks ; see Fig 2-2.
2) Perform leak check of inlet and outlet.
To chamber
Purge
Ar purge
500 sccm
Extraction port
1 m3/h
Dose
Bypass
Single
ALD valve
jacket heated
to 200 &deg;C
Switching
Ar bubbler
500 sccm
E
Drip tray
Heated TEMAH pot pre
fitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 2-2: Step 1 (Pot preparation for bubbling)
Issue 1: September 07
Precursor Source Pot
Page 4 of 20
Printed: 7-Oct-07, 12:13
System Manual
OKNKNKO
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
p&iacute;&Eacute;&eacute;=O=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&Auml;&igrave;&Auml;&Auml;&auml;&aacute;&aring;&Ouml;F=
1) Remove VCR blanks; see Fig 2-3.
2) Connect outlet and inlet to the source pot.
3) Do not turn on the manual valves yet!
To chamber
Purge
Extraction port
1 m3/h
Dose
Ar purge
500 sccm
Bypass
Single
ALD valve
jacket heated
to 200 &deg;C
Switching
Ar bubbler
500 sccm
Drip tray
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 2-3: Step 2 (Pot preparation for bubbling)
Printed: 7-Oct-07, 12:13
Precursor Source Pot
Page 5 of 20
Issue 1: September 07
l&eacute;^i
OKNKNKP
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
p&iacute;&Eacute;&eacute;=P=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&Auml;&igrave;&Auml;&Auml;&auml;&aacute;&aring;&Ouml;F=
1) Pump out bubbler line.; see Fig 2-4.
2) Turn on D1 (S1 is paired with D1) and E so that atmosphere trapped during installation is
pumped out from the inlet and outlet via E and D valves respectively.
3) Do not turn on the manual valves yet!
To chamber
Purge
Ar purge
500 sccm
Extraction port
1 m3/h
Dose
Bypass
Single
ALD valve
jacket heated
to 200 &deg;C
Switching
Ar bubbler
500 sccm
Drip tray
E
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 2-4: Step 3 (Pot preparation for bubbling)
Issue 1: September 07
Precursor Source Pot
Page 6 of 20
Printed: 7-Oct-07, 12:13
System Manual
OKNKNKQ
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
p&iacute;&Eacute;&eacute;=Q=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&Auml;&igrave;&Auml;&Auml;&auml;&aacute;&aring;&Ouml;F=
1) Purge bubbler lines.; see Fig 2-5.
2) Turn on argon purge and argon bubbler MFCs and pump out any residuals in the lines..
3) Do not turn on the manual valves yet!
To chamber
Purge
Extraction port
1 m3/h
Dose
Ar purge
500 sccm
Bypass
Single
ALD valve
jacket heated
to 200 &deg;C
Switching
Ar bubbler
500 sccm
Drip tray
E
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 2-5: Step 4 (Pot preparation for bubbling)
OKNKNKR
p&iacute;&Eacute;&eacute;=R=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&Auml;&igrave;&Auml;&Auml;&auml;&aacute;&aring;&Ouml;F=
1) Repeat Steps 3 and 4.
2) Carry out a leak check.
3) Do not turn on the manual valves yet!
Printed: 7-Oct-07, 12:13
Precursor Source Pot
Page 7 of 20
Issue 1: September 07
l&eacute;^i
OKNKNKS
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
p&iacute;&Eacute;&eacute;=S=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&Auml;&igrave;&Auml;&Auml;&auml;&aacute;&aring;&Ouml;F=
1) Degas source pot; see Fig 2-6.
2) Turn on D valve for one minute and slowly open the outlet valve to evacuate the inert
gas in the pot overhead space.
3) Note the pressure rise in the chamber.
4) Repeat Steps 2) and 3) above until pressure in the chamber is constant.
5) Do not turn on the manual valves yet!
To chamber
Purge
Extraction port
1 m3/h
Dose
Ar purge
500 sccm
Bypass
Single
ALD valve
jacket heated
to 200 &deg;C
Switching
Ar bubbler
500 sccm
Drip tray
E
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 2-6: Step 6 (Pot preparation for bubbling)
Issue 1: September 07
Precursor Source Pot
Page 8 of 20
Printed: 7-Oct-07, 12:13
System Manual
OKNKNKT
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
p&iacute;&Eacute;&eacute;=T=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&Auml;&igrave;&Auml;&Auml;&auml;&aacute;&aring;&Ouml;F=
Precursor pulse
1) Ensure Switching and Dose valves are turned on; see Fig 2-7.
Fill
To chamber
Purge
Ar purge
500 sccm
Extraction port
1 m3/h
Dose
Bypass
Single
ALD valve
jacket heated
to 200 &deg;C
Switching
Ar bubbler
500 sccm
Drip tray
E
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 2-7: Step 7 Bubbling - delivery of precursor
Printed: 7-Oct-07, 12:13
Precursor Source Pot
Page 9 of 20
Issue 1: September 07
l&eacute;^i
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
Precursor purge
1) Ensure Purge valve is turned on; see Fig 2-8
Fill
To chamber
Purge
Extraction port
1 m3/h
Dose
Ar purge
500 sccm
Bypass
Single
ALD valve
jacket heated
to 200 &deg;C
Switching
Ar bubbler
500 sccm
Drip tray
E
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 2-8: Step 7 Bubbling - purging of precursor
Issue 1: September 07
Precursor Source Pot
Page 10 of 20
Printed: 7-Oct-07, 12:13
System Manual
PK
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
s~&eacute;&ccedil;&igrave;&ecirc;=&Ccedil;&ecirc;~&iuml;=
The basic vapour draw layout is shown in Fig 3-1.
To chamber
VCR
Ar purge
500 sccm
Purge
Dose
Bypass
VCR
Single
ALD valve
jacket heated
to 200 &deg;C
Extraction port
1 m3/h
Unheated TMA or H2O pot
pre-fitted with manual
valves. Only the outlet is
connected
Drip tray
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 3-1: Basic vapour draw layout
Printed: 7-Oct-07, 12:13
Precursor Source Pot
Page 11 of 20
Issue 1: September 07
l&eacute;^i
PKN
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
m&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&icirc;~&eacute;&ccedil;&igrave;&ecirc;=&Ccedil;&ecirc;~&iuml;=
1) Before connecting a source pot, ensure that the lines have been pumped.
2) Connect the pot in accordance with local health and safety measures and MSDS
3) Connect the inlet and outlet – DO NOT TURN THEM ON YET
4) Pump out atmosphere which is trapped during connection of inlet and outlet valves of the
source pot: (THE INLET VALVE OF THE SOURCE POT IS NOT CONNECTED.)
i)
The outlet is pumped out via the dose ALD valve D.
ii)
Close D1, flow Argon from the purge MFC to clear any residual air in the delivery
line
iii)
Repeat pump purge as required.
iv)
OUTLET VALVE IS STILL SHUT
5) Degassing
Precursors are filled under inert gas at around 2 bar. This space has to be evacuated.
i)
Turn on D1 for 1 minute
ii)
Gradually, open the outlet valve, note pressure rise does not trip the CM gauge.
iii)
Shut manual valve
iv)
Repeat steps ii) and iii) above until there is no pressure rise
v)
Turn off D1
vi)
Pot is now degassed
6) Start processing in vapour draw mode.
Issue 1: September 07
Precursor Source Pot
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System Manual
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PKNKN
p&iacute;&Eacute;&eacute;J&Auml;&oacute;J&euml;&iacute;&Eacute;&eacute;=&eacute;&ecirc;&ccedil;&Aring;&Eacute;&Ccedil;&igrave;&ecirc;&Eacute;=
PKNKNKN
p&iacute;&Eacute;&eacute;=N=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&icirc;~&eacute;&ccedil;&igrave;&ecirc;=&Ccedil;&ecirc;~&iuml;F=
l&eacute;^i
1) Ensure that lines are fitted with VCR blanks.; see Fig 3-2.
2) Carry out leak check of inlet and outlet.
To chamber
Purge
Extraction port
1 m3/h
Dose
Ar purge
500 sccm
Bypass
E
Single
ALD valve
jacket heated
to 200 &deg;C
Drip tray
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 3-2: Step 1 (Pot preparation for vapour draw)
Printed: 7-Oct-07, 12:13
Precursor Source Pot
Page 13 of 20
Issue 1: September 07
l&eacute;^i
PKNKNKO
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
p&iacute;&Eacute;&eacute;=O=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&icirc;~&eacute;&ccedil;&igrave;&ecirc;=&Ccedil;&ecirc;~&iuml;F=
1) Remove VCR blanks.; see Fig 3-3.
2) Connect outlet only to the source pot.
3) Do not turn on the outlet manual valve yet!
To chamber
Purge
Ar purge
500 sccm
Extraction port
1 m3/h
Dose
Bypass
Drip tray
Single
ALD valve
jacket heated
to 200 &deg;C
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 3-3: Step 2 (Pot preparation for vapour draw)
Issue 1: September 07
Precursor Source Pot
Page 14 of 20
Printed: 7-Oct-07, 12:13
System Manual
PKNKNKP
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
p&iacute;&Eacute;&eacute;=P=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&icirc;~&eacute;&ccedil;&igrave;&ecirc;=&Ccedil;&ecirc;~&iuml;F=
1) Pump out bubbler line; see Fig 3-3.
2) Turn on D1 (S1 is paired with D1), so that atmosphere trapped during installation is
pumped out from the outlet.
3) Do not turn on the outlet manual valve yet!
To chamber
Purge
Extraction port
1 m3/h
Dose
Ar purge
500 sccm
Bypass
Drip tray
Single
ALD valve
jacket heated
to 200 &deg;C
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 3-4: Step 3 (Pot preparation for vapour draw)
Printed: 7-Oct-07, 12:13
Precursor Source Pot
Page 15 of 20
Issue 1: September 07
l&eacute;^i
PKNKNKQ
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
p&iacute;&Eacute;&eacute;=Q=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&icirc;~&eacute;&ccedil;&igrave;&ecirc;=&Ccedil;&ecirc;~&iuml;F=
1) Purge line by flowing argon using the argon purge MFC; see Fig 3-5.
2) Open the manual bypass valve.
4) Do not turn on the outlet manual valve yet!
To chamber
Purge
Extraction port
1 m3/h
Dose
Ar purge
500 sccm
Bypass
Drip tray
Single
ALD valve
jacket heated
to 200 &deg;C
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 3-5: Step 4 (Pot preparation for vapour draw)
PKNKNKR
p&iacute;&Eacute;&eacute;=R=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&icirc;~&eacute;&ccedil;&igrave;&ecirc;=&Ccedil;&ecirc;~&iuml;F=
1) Repeat Step 3 and Step 4.
2) Carry out a leak check.
5) Do not turn on the outlet manual valve yet!
Issue 1: September 07
Precursor Source Pot
Page 16 of 20
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System Manual
PKNKNKS
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
p&iacute;&Eacute;&eacute;=S=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&icirc;~&eacute;&ccedil;&igrave;&ecirc;=&Ccedil;&ecirc;~&iuml;F=
1) Degas source pot; see Fig 3-6.
2) Turn on D valve for one minute and slowly open the outlet valve to evacuate the inert
gas in the pot overhead space.
3) Note the pressure rise in the chamber.
4) Repeat until pressure in the chamber is constant.
To chamber
Purge
Ar purge
500 sccm
Extraction port
1 m3/h
Dose
Bypass
Drip tray
Single
ALD valve
jacket heated
to 200 &deg;C
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 3-6: Step 6 (Pot preparation for vapour draw)
Printed: 7-Oct-07, 12:13
Precursor Source Pot
Page 17 of 20
Issue 1: September 07
l&eacute;^i
PKNKNKT
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
p&iacute;&Eacute;&eacute;=T=Em&ccedil;&iacute;=&eacute;&ecirc;&Eacute;&eacute;~&ecirc;~&iacute;&aacute;&ccedil;&aring;=&Ntilde;&ccedil;&ecirc;=&icirc;~&eacute;&ccedil;&igrave;&ecirc;=&Ccedil;&ecirc;~&iuml;F=
Precursor pulse
Fill
To chamber
Purge
Ar purge
500 sccm
Extraction port
1 m3/h
Dose
Bypass
Drip tray
Single
ALD valve
jacket heated
to 200 &deg;C
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 3-7: Vapour draw – precursor delivery
Issue 1: September 07
Precursor Source Pot
Page 18 of 20
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l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
l&eacute;^i
Precursor purge
Fill
To chamber
Purge
Ar purge
500 sccm
Extraction port
1 m3/h
Dose
Bypass
Drip tray
Single
ALD valve
jacket heated
to 200 &deg;C
Heated TEMAH pot prefitted with manual valves.
N2 purge
Precursor cabinet
Manual valve
Air driven nupro valve –manual control
Fast high temperature ALD valve
Fig 3-8: Vapour draw – precursor purge
Printed: 7-Oct-07, 12:13
Precursor Source Pot
Page 19 of 20
Issue 1: September 07
l&eacute;^i
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
System Manual
NOTES:
Issue 1: September 07
Precursor Source Pot
Page 20 of 20
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System Manual
Appendix R
Oxford Instruments Plasma Technology
All OIPT Systems
Rotameter data
1 Rotameters ................................................................................................................................ 2
1.1 Rotameter types..................................................................................................................... 2
1.2 Setting the required purge flow rate....................................................................................... 3
1.3 Flow versus scale reading graphs ........................................................................................... 4
2 Appendix R Rotameter data – Issue Change Record Sheet ........................................................... 5
Fig 1: Typical rotameter .................................................................................................................... 2
Printed: 5-Jun-09, 9:58
Rotameter Data
Page R 1 of 6
Issue 2: October 04
All OIPT Systems
Oxford Instruments Plasma Technology
System Manual
1 Rotameters
A rotameter is a manually controlled variable valve/indicating tube, used by OIPT to manually set the
flow rate 1 for various gas supplies. For example, purge flow rates for turbomolecular 2 , rotary vane
and dry pumps, glove boxes and etch gas supplies for process chamber cleaning.
Ball float
Tube type number
is marked on this
side of the tube
Graduated
scale
Flow control
knob
Fig 1: Typical rotameter
1.1
Rotameter types
The models of rotameter used for setting purge gas flows on OIPT equipment is fitted with a
common scale, reading from 0 to 6 as flow is varied from zero to full scale. The full-scale flow
depends on:





The tube type (marked on the tube itself)
The ball material
The gas type
Temperature
Pressure
The full-scale flows given in the following table are for 20&deg; C, 1 atmosphere pressure, air or nitrogen
gas.
OIPT part
G/GAS/ROT/05
0
G/GAS/ROT/25L
G/GAS/ROT/40L
G/GAS/ROT/80
0
G/GAS/ROT/90
0
1
Tube number
A125-3
Ball material
Glass
Normal use
Turbo pump purge
Full scale flow
53 sccm
A250-4
A250-6
A125-7
Carboloy
Stainless steel
Stainless steel
Rotary pump purge, PECVD
Pump exhaust purge
CF4/O2 ‘clean gas’ metering
27.5 slpm
43.4 slpm
850 sccm
A250-1
Stainless steel
Rotary pump purge, etch,
PECVD
4.4 slpm
Flow rates are quoted in either standard cubic centimetres per minute (sccm) or standard litres per minute (slpm).
2 In most OIPT systems, turbomolecular pump purge flows are set automatically and monitored by the system software via a
flow meter: these systems do not incorporate a rotameter for the turbo pump purge.
Issue 2: October 04
Rotameter Data
Page R 2 of 6
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System Manual
Oxford Instruments Plasma Technology
All OIPT Systems
The flow-setting knob can be on the upstream or downstream side of the tube.
-
If it is upstream (below the tube), the pressure in the tube is close to the exit pressure,
which should be close to 1 bar absolute for pump or exhaust pipe purging.
-
If the knob is downstream (above the tube) the pressure in the tube is close to the supply
pressure of the gas. This method is normally used if the exit pressure is below
atmospheric pressure, which is often the case in turbomolecular pump purging.
If in doubt, control downstream is always safe, because the ball float will operate normally and the
purge flow will be slightly higher than given in the table.
1.2
Setting the required purge flow rate
CAUTION
The rotameter scale is graduated with values of 0 to 6. These
graduations do not represent flow rates in sccm or slpm.
To set the required flow rate, use the following procedure.
Note that the following procedure is for setting N2 purge flow rates for pumps; a similar procedure
can be used for other applications, e.g. etch cleaning, glove box purging, etc.
To set the required flow rate, use the following procedure:
1) Refer to the pump manufacturer’s literature or to the relevant OIPT Installation Data document
to obtain the required N2 flow rate.
2) Check the Tube number (marked on the Rotameter tube) and then refer to the relevant
rotameter’s graph on page 4 and note the required scale reading.
3) Ensure that the N2 supply meets the Mandatory Requirements for Nitrogen Supplies as stated
in the OIPT Services Specifications document sub-section 5.1.
4) Adjust the rotameter flow-setting knob so that the centre of the ball float is aligned with the
required scale reading. (Rotate knob anti-clockwise to increase flow, clockwise to reduce
flow.)
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Rotameter Data
Page R 3 of 6
Issue 2: October 04
All OIPT Systems
1.3
System Manual
Oxford Instruments Plasma Technology
Flow versus scale reading graphs
G/GAS/ROT/050 (Tube No: A125-3)
G/GAS/ROT/25L (Tube No: A250-4)
A125-3
60
25
50
40
20
Flow
(sccm) 30
Flow
(slpm) 15
20
10
10
5
0
0
0
1
2
3
4
Scale Reading
5
0
6
G/GAS/ROT/40L (Tube No: A250-6)
1
2
3
4
Scale Reading
5
6
G/GAS/ROT/900 (Tube No: A250-1)
A250-6
50
A250-1
5
4
40
Flow
(slpm)
A250-4
30
30
Flow
(slpm)
3
20
2
10
1
0
0
0
1
2
3
4
Scale Reading
5
0
6
1
2
3
4
Scale Reading
5
6
G/GAS/ROT/800 (Tube No: A125-7)
A125-7
900
800
700
600
Flow
(sccm)
500
400
300
200
100
0
0
Issue 2: October 04
1
2
3
4
Scale Reading
Rotameter Data
Page R 4 of 6
5
6
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System Manual
Oxford Instruments Plasma Technology
All OIPT Systems
2 Appendix R Rotameter data – Issue Change Record Sheet
Issue change record
Issue No.
2
Details of change
Issue Change Record Sheet added.
Date
19 Oct 04
Rotameter Data
Page R 5 of 6
Issue 2: October 04
Printed: 5-Jun-09, 9:58
All OIPT Systems
Oxford Instruments Plasma Technology
System Manual
NOTES:
Issue 2: October 04
Rotameter Data
Page R 6 of 6
Printed: 5-Jun-09, 9:58
Services Specifications
Appendix S
Issue 21: January 10
Qualitative Specifications for all of Oxford Instruments
Plasma Technology’s Plasma and Ion Beam Systems
Page 1 of 22
OIPT Systems
Oxford Instruments Plasma Technology
System Manual
Change record sheet
Issue No.
16
17
Details of change
Change record table added
For British Standards compliance:
Date
20 April 05
24 May 06
New sub-section 9.1 ‘Statement of intended use’ added.
18
19
20
21
Requirement for an Earth Continuity Test added to subsection 3.1.1.
Fig 2.2 (Recommended basic total loss installation)
updated.
Sub-section 9.2 (Mandatory specifications for the system
environment) – Maximum Storage temperature changed to
40&deg;C.
Update heater/chiller types with Julabo information and
remove references to “Hexid”
Issue 21: January 10
Services Specifications
Page 2 of 22
05 April 07
23 March 09
6 January 2010
Printed: 6-Jan-10, 8:53
System Manual
Oxford Instruments Plasma Technology
OIPT Systems
CONTENTS
Change record sheet ..................................................................................................... 2
1.
Introduction ........................................................................................................... 4
2.
Cooling / Warming water ........................................................................................ 5
2.1 Recirculation water ............................................................................................ 6
2.1.1 Mandatory Specifications for recirculated water systems.............................. 7
2.2 Total Loss Cooling ............................................................................................. 8
2.2.1 Mandatory Specifications for total loss cooling systems............................... 9
3.
Electrical supply ................................................................................................... 10
3.1 System earthing and bonding........................................................................... 10
3.1.1 Earth connection ....................................................................................... 10
3.1.2 Neutral supply bonding ............................................................................. 11
3.1.3 Residual Current Circuit Breakers .............................................................. 11
3.2 Mandatory Specifications for electrical installations.......................................... 11
4.
Compressed air .................................................................................................... 11
4.1 Mandatory Specifications for compressed air supplies ...................................... 13
5.
Nitrogen............................................................................................................... 14
5.1 Mandatory specifications for Nitrogen supplies ................................................ 14
6.
Process gases ....................................................................................................... 15
6.1 Mandatory specifications for process gas supplies ........................................... 15
6.1.1 Systems using Helium wafer cooling.......................................................... 15
6.1.2 Systems using Helium purge ..................................................................... 16
6.1.3 Installation of low vapour pressure gases (e.g. SiCl4, BCl3, C4F8)................. 16
7.
Liquid Nitrogen .................................................................................................... 17
7.1 Mandatory Requirements for Liquid Nitrogen systems...................................... 17
8.
Extraction............................................................................................................. 18
8.1 Mandatory requirements for Rotary Pump extraction........................................ 18
8.2 Mandatory requirements for Gas Pod extraction............................................... 18
8.3 Mandatory requirements for Cryogenic pump extraction .................................. 19
9.
Environment ......................................................................................................... 20
9.1 Statement of intended use ............................................................................... 20
9.2 Mandatory Specifications for the system environment ...................................... 20
10. OIPT locations worldwide...................................................................................... 22
Fig 2.1: Recommended basic recirculation installation ................................................ 7
Fig 2.2: Recommended basic total loss installation ..................................................... 8
Fig 3.1: Recommended electrical installation............................................................. 10
Fig 4.1: Recommended compressed air supply installation........................................ 12
Fig 5.1: Recommended nitrogen supply installation .................................................. 14
Fig 6.1: Recommended process gas supply installation ............................................. 15
Printed: 6-Jan-10, 8:53
Services Specifications
Page 3 of 22
Issue 21: January 10
OIPT Systems
1.
Oxford Instruments Plasma Technology
System Manual
Introduction
This document gives the specifications of the services required for the Plasmalab and Ionfab
systems. For details of cooling flow rates and electrical supply ratings, see the relevant
system installation data sheets.
Customers must ensure that the services as specified are available at the time of delivery
to reduce system commissioning time and potential problems.
Unless other arrangements have been made in writing with Oxford Instruments Plasma
Technology (OIPT), it is a requirement that services meet the following specifications. If
they do not meet these specifications then the system warranty and process guarantees
may be made invalid.
If you suspect that you may fail to meet ANY of these specifications, please contact
Oxford Instruments Plasma Technology (OIPT) immediately so that we can discuss the
problem with you.
Oxford Instruments Plasma Technology (OIPT) conducts a programme of continual
product development, and reserves the right to change the design and/or specification of
equipment without notice. The details contained in this document were correct at the
time of printing but should be confirmed immediately prior to delivery.
WARNING
BEFORE INSTALLING THE SERVICES REQUIRED FOR OIPT SYSTEMS, ENSURE THAT ALL
RELEVANT ASPECTS OF HEALTH AND SAFETY ARE FULLY UNDERSTOOD.
HEALTH AND SAFETY GUIDANCE AND INSTRUCTIONS ARE GIVEN IN SECTION 1 OF ALL
OUR SYSTEM USER MANUALS. THIS DOCUMENT IS AVAILABLE IN ENGLISH, FRENCH,
GERMAN AND JAPANESE.
Issue 21: January 10
Services Specifications
Page 4 of 22
Printed: 6-Jan-10, 8:53
System Manual
2.
Oxford Instruments Plasma Technology
OIPT Systems
Cooling / Warming water
There are two acceptable methods of applying cooling / warming water to an OIPT
system:
Recirculation:
Water is pumped through the system by a dedicated *heater / chiller or
heat exchanger. After passing through the system, the temperature of
the water is adjusted before recirculating through the system.
*Many customers have a water recirculation facility shared by several
systems. This shared facility seldom provides water of suitable quality,
and so cannot usually be used for cooling any part of the OIPT system
without the use of a heat exchanger dedicated to the OIPT system.
Total Loss
Cooling:
Municipal (drinking quality) water is applied to the system from a mains
supply, passed through the system to cool it, then fed to a drain for
disposal.
Water failing to meet the recirculation or total loss cooling specifications must not be put
into the system without close consultation with OIPT.
In some circumstances, it may be appropriate to use a combination of recirculation
cooling and total loss cooling in one system.
It is recommended that the customer uses a dedicated heater/chiller either for the whole
system, or at least for the critical components. Note that chillers, which cool only, can
give problems with condensation on chamber components in some environments. This is
a particularly important consideration for production systems of the batch-load type. In
severe cases, they can produce sufficient condensation to damage components such as
RF power supplies, ferrofluidic seals and automatch units. Any damage so caused cannot
be covered by the system warranty.
Note that if a heater-chiller is used to provide warm water (above 30o C) for heated parts
of the system, then items such as the turbo pump will need an independent water supply.
Items such as turbomolecular pumps can be cooled with total loss cooling if they are of
stainless steel construction and if the water is suitable. If the water is not suitable, then a
heat exchanger may be necessary.
Total loss cooling cannot be used on any components that have aluminium in direct
contact with the coolant. See sub-section 2.1.
Printed: 6-Jan-10, 8:53
Services Specifications
Page 5 of 22
Issue 21: January 10
OIPT Systems
2.1
Oxford Instruments Plasma Technology
System Manual
Recirculation water
WARNING
CHILLERS HAVE COMPONENTS, WHICH BECOME COLD ENOUGH TO CAUSE SERIOUS
INJURY. READ THE MANUFACTURER’S MANUALS BEFORE INSTALLING, OPERATING OR
MAINTAINING CHILLERS, AND ENSURE THAT ADEQUATE PROTECTIVE CLOTHING IS
WORN.
Recirculation water is used in systems where the user does not wish to consume water at
a high rate, or where it is wished to supply water to the system at a constant temperature.
Some systems contain aluminium in direct contact with coolant. These are the Ionfab 500
Plus, the Ionfab 300 Plus, and Plasmalab systems fitted with tables or turbomolecular pumps
with plain aluminium cooling channels. Certain aluminium chambers are also included.
However, the Ionfab 300 Plus does not contain aluminium in contact with water, unless it is
in the turbomolecular pump.
In these aluminium-containing systems, it is MANDATORY that the approved coolant is
used at all times. If the approved coolant and installation are not used, the system
warranty will not cover any damage caused by the coolant either directly or indirectly to
the system or to anything else.
It is the customer's responsibility to comply with the above requirement. If the customer
has any doubt as to whether their system falls into this category, they must contact OIPT
for further advice.
In systems that do not contain aluminium components, severe corrosion can still
sometimes occur: water will collect corrosive chemicals, and will be lacking in the oxygen
that protects stainless steel. We strongly recommend that the approved coolant is used. If
an alternative product or water is used, then it is entirely the customer’s responsibility to
check for any signs of corrosion or contaminated water. If the customer’s coolant has not
been approved in writing by OIPT, then the system warranty will not cover any damaged
caused by the coolant either directly or indirectly to the system or to anything else 1 .
The approved installation and coolant are shown in sub-section 2.1.1 and in Fig 2.1. Note
that the total water flow meter and the isolation valves are recommended for cooling
monitoring and ease of maintenance.
1 Customers should note, for example, that certain types of inhibitor will damage the pumps of heater/chiller units, and that
the use of municipal (drinking water) or deionized water can introduce harmful chemicals into the system. If plain water is
used, distilled water is by far the safest option.
Issue 21: January 10
Services Specifications
Page 6 of 22
Printed: 6-Jan-10, 8:53
System Manual
Oxford Instruments Plasma Technology
OIPT Systems
DEDICATED
HEAT EXCHANGER
OR
CHILLER
(FITTED WITH AN
EXTERNAL BYPASS
HAVING A CAPACITY OF
100% FLOW)
ISOLATION
VALVES
PLASMALAB
OR
IONFAB
SYSTEM
TOTAL WATER FLOW
METER OF APPROPRIATE
RANGE
10-MICRON METAL MESH FILTER
MAXIMUM PRESSURE DROP AT
RATED FLOW RATE 0.15 BAR (2.2 PSI)
Fig 2.1: Recommended basic recirculation installation
2.1.1
Mandatory Specifications for recirculated water systems
CAUTION
If clear (i.e. transparent) tubing is exposed to sunlight, algal growth can develop,
which can restrict coolant flow.
It is MANDATORY that clear tubing is not used in any part of the cooling system. OIPT
recommends the use of either black or dark green tubing.
CAUTION
It is the customer's responsibility not to exceed a pressure of 4.2 bar, or other limit
that has been set for the system. Exceeding this safe pressure may cause irreparable
damage to system components.
The water must be kept warm enough to prevent condensation on chamber surfaces and
outside system components. This applies to those parts of the system inside the clean
room and those parts in a service area. Condensation can damage components such as
RF power supplies, ferrofluidic seals and automatch units. Any damage so caused cannot
be covered by the system warranty.
Pressure:
Temperature range:
Minimum flows:
Cooling capacity:
Coolant:
Filtration:
Printed: 6-Jan-10, 8:53
Adjustable 0.7 to 4.2 bar (10 to 60 psi). Chiller / heat exchanger to
be fitted with a bypass having a capacity of 100% of rated flow.
See system installation data sheets.
See system installation data sheets.
See system installation data sheets.
Use either Thermal G (94-G-WTR-SUN-909) or Thermal H5 (84-GWTR-SUN-903) depending on the application. See sub-section 2.1
for the warranty impact of not using these products.
10 micron metal mesh water filter. Maximum pressure drop 0.15
bar (2.2 psi) at rated flow. For example, filter element Balston SMC100-12-10.
Services Specifications
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2.2
System Manual
Oxford Instruments Plasma Technology
Total Loss Cooling
Municipal (drinking) water may be used in total loss cooling of the system in situations
where clean water is freely available, but only if the water meets the specification in subsection 2.2.1. In case of any doubt, obtain the water specification from the water utility
company, and consult with OIPT. It is not practical to use total loss cooling where the
water temperature is critical.
FILTER
10 MICRON FULL FLOW
ISOLATION
VALVES
PLASMALAB
OR
IONFAB
SYSTEM
TOTAL WATER FLOW
METER OF APPROPRIATE
RANGE
DRAIN
Fig 2.2: Recommended basic total loss installation
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System Manual
2.2.1
Oxford Instruments Plasma Technology
OIPT Systems
Mandatory Specifications for total loss cooling systems
CAUTION
If clear (i.e. transparent) tubing is exposed to sunlight, algal growth can develop,
which can restrict coolant flow.
It is MANDATORY that clear tubing is not used in any part of the cooling system. OIPT
recommends the use of either black or dark green tubing.
CAUTION
It is the customer's responsibility not to exceed a pressure of 5 bar, or other limit that
has been set for the system. Exceeding this safe pressure may cause irreparable
damage to system components.
If total loss cooling with municipal water (drinking quality water) is used in the system or
in the pumps, the water quality must meet the following specifications. Note that
increased maintenance will be required if this water is used directly in the system as well
as in the pumps.
The water must be kept warm enough to prevent condensation on chamber surfaces and
outside system components. This applies to those parts of the system inside the clean
room and those parts in a service area. Condensation can damage components such as
RF power supplies, ferrofluidic seals and automatch units. Any damage so caused cannot
be covered by the system warranty.
•
•
•
•
•
Pressure:
Temperature:
pH:
Oxygen:
CO2 and NH3:
• Chloride:
• Calcium
Carbonate:
• Filtration:
Printed: 6-Jan-10, 8:53
4 to 5 bar. Backpressure from the drain must be less than 1 bar.
10&ordm;C to 25&ordm;C
7 to 8
Greater than 4mg/litre
Less than 10mg/litre
Less than 100mg/litre
Less than 75mg/litre
To 0.9 micron full flow, for example filter element Balston 20050-50 or 200-95-50.
Services Specifications
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OIPT Systems
3.
Oxford Instruments Plasma Technology
System Manual
Electrical supply
Classification: For European Community customers who need this information: The
systems are classified as Class A, Group 2 as defined in EN 55011 Clause
4.
SAFETY
ISOLATION
BOX
Combined Circuit Breaker
to protect transformer
to system phase conductors
3-phase supply
or transformer
secondary
winding
Phase 1
conductor
Phase 2
conductor
3-Phase
supply
to
system
Phase 3
conductor
Neutral
conductor
NEUTRAL CONDUCTOR
BONDED TO EARTH
(GROUND)
Hand
Operated
PLASMALAB
OR
IONFAB
SYSTEM
INDEPENDENT
EARTH (GROUND)
Fig 3.1: Recommended electrical installation
NOTES:
a)
The combined Circuit Breaker MUST break all phases if any one phase
exceeds the set current limit.
b)
The trip rating of the Circuit Breaker depends on the system type and
the supply voltage to the system.
c)
The current-carrying capacity of the cables between the Circuit Breakers
and the system must be greater than the trip rating of the Circuit
Breaker.
For example, if a 32A Circuit Breaker is fitted then a cable having
conductors of a minimum rating of 40A (32A x 125%) is required. The
conductors will have a minimum Cross Sectional Area (CSA) of 6.0 mm2.
3.1
System earthing and bonding
3.1.1
Earth connection
To meet international standards for RF interference, our systems are fitted with filtration
on the mains supply inputs. As a result, there is significant leakage to earth (ground)
from the mains supply.
WARNING
IT IS ESSENTIAL THAT AN EARTH CONNECTION IS MADE BEFORE CONNECTING THE
SUPPLY.
An Earth Continuity Test is required for all PERMANENTLY CONNECTED EQUIPMENT, using
a ‘CLARE’ tester or similar equipment.
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System Manual
Oxford Instruments Plasma Technology
OIPT Systems
International standard IEC950, section 5.2, requires that a label is attached at the point
where the system is connected to the factory electricity supply: either to the safety
isolation box, or to the transformer, or to the electrical supply outlet socket. This label
must contain the following text:
“WARNING.
High leakage current.
Earth connection essential before connecting supply.&quot;
3.1.2
Neutral supply bonding
WARNING
THE NEUTRAL CONDUCTOR MUST BE BONDED TO THE EARTH (GROUND) CONDUCTOR.
IF THIS IS NOT DONE ALREADY IN THE FACTORY SUPPLY, THEN IT MUST BE DONE AT
THE SAFETY ISOLATION BOX AS SHOWN IN Fig 3.1. IF AN ISOLATING TRANSFORMER IS
FITTED, THEN THE NEUTRAL CONDUCTOR OF THE TRANSFORMER SECONDARY MUST
BE BONDED TO THE EARTH (GROUND) CONDUCTOR.
3.1.3
Residual Current Circuit Breakers
Customers sometimes wish to fit a Residual Current Circuit Breaker (RCCB), also known as
an Earth Leakage Circuit Breaker (ELCB, or ELB) to the electrical supply to the system. This
is not recommended for this type of equipment, and a 30mA breaker is likely to trip
often, due to the leakage caused by the filters on the power lines. This leakage is in
accordance with International standard IEC950 section 5.2.
3.2
4.
a)
If you must fit an ELB, we strongly recommend a minimum current of 100mA.
b)
Even a 100mA circuit breaker may trip, and we accept no responsibility if this
turns out to be the case.
Mandatory Specifications for electrical installations
• Connection:
In accordance with local regulations via a safety isolation box,
lockable in the OFF position, mounted adjacent to the machine.
• Configuration:
3-phase, star (&quot;Y&quot;) with a grounded neutral supply connected to
the centre point. An independent earth (ground) is required.
• Maximum
Current:
The Maximum Current required by the system is given in the
relevant system installation data sheets.
• Voltage &amp;
Frequency:
380V -10% to 415V +6% or 208V +/-10% phase-to-phase.
Frequency to be 50Hz or 60Hz. Note that voltage and frequency
cannot be changed from the values specified at the time of
ordering.
• Safety Earthing:
The system safety earthing must be in accordance with local
Electrical Regulations. See Fig 3.1.
Compressed air
A dry and clean compressed air supply at a minimum pressure of 6 bar (90 psig) must be
fed to a customer-supplied air filter/mist separator/pressure regulator unit mounted
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System Manual
Oxford Instruments Plasma Technology
adjacent to the machine. A suitable unit is supplied by SMC (part No. AC 2030); other
units to the same specification can be used. Maximum safe pressure in the customer's
feed to the regulator is determined by the regulator used (9.9 bar (148.5 psig) for the
SMC unit).
The supply to the system must be monitored by a pressure gauge having a range of 0 to
10 bar (0 to 150 psi). The pressure regulator must be fitted with a stop to prevent a
pressure greater than 6 bar from being supplied to the system. The pressure to be used
will be set during commissioning of the system.
The following air filter/mist separator/pressure regulator unit components are
recommended:
Air filter:
SMC AF2000-02D with filter element 1129116A.
Mist separator:
SMC AFD2000-02D with filter element 63092. This filter
element must be changed annually. Note that as this item is
not supplied by OIPT, its maintenance is not included in the
system manuals.
Regulator with gauge:
SMC AR2001-02G.
Spacers:
2 off SMC Y20L.
SMC COMPONENTS
OR EQUIVALENT
DRY AND CLEAN
AIR SUPPLY
FILTER
MINIMUM PRESSURE
6 BAR (90 PSIG)
MIST
SEPARATOR
PRESSURE
GAUGE
0 TO 10 BAR
(0 TO 150 PSIG)
COMPRESSED
AIR SUPPLY TO
PLASMALAB OR
IONFAB SYSTEM
(SEE SPECIFICATION)
ADJUSTABLE
PRESSURE
REGULATOR
6 MM
PUSH-FIT
CONNECTOR
Fig 4.1: Recommended compressed air supply installation
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System Manual
4.1
Oxford Instruments Plasma Technology
OIPT Systems
Mandatory Specifications for compressed air supplies
• Inlet pressure to filter/mist
separator/regulator unit:
6 bar (90 psig) minimum.
OUTLET TO SYSTEM:
• Oil content:
Less than 10 ppm
• Maximum Moisture Content:
-3&ordm;C (25&ordm;F)
• Filtration:
Maximum particle size of 0.3 microns
• Regulator outlet pressure:
Adjustable from 3 bar to 6 bar (45 psig to 90
psig). 6 bar must be the maximum provided.
• Maximum flow rate:
135 litres/minute (5 scfm).
• Pressure monitoring:
0 to 10 bar (0 to 150 psi) pressure gauge.
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5.
Oxford Instruments Plasma Technology
System Manual
Nitrogen
Nitrogen is required to vent and purge process chambers, load locks and pumps.
1/4&quot;
SWAGELOK
CONNECTOR
2 MICRON
FILTER
TO PLASMALAB
OR IONFAB
SYSTEM
REGULATOR
0 TO 1 SLM
FLOW CONTROL
ROTAMETER
(IF REQUIRED)
TO PUMP
PURGE
CONNECTOR
Fig 5.1: Recommended nitrogen supply installation
Semiconductor grade fittings and pressure regulators, together with electropolished
stainless steel tube must be used to ensure that gas quality is not degraded. Purges to
turbo pumps are supplied by OIPT as part of the system. The customer will usually need
to fit a purge to the rotary pump. See below.
5.1
Mandatory specifications for Nitrogen supplies
• Pipework fittings and
pressure regulators:
• Gas handling tubing:
• Purity:
Semiconductor grade
• Filtration:
• Regulation:
• Minimum pressure at input to
system:
• Rotary pump purging
Electropolished stainless steel
At least 99.99% or higher to satisfy process
requirements.
2 micron filter mounted adjacent to the system.
0.5 to 5 bar (7.5 to 75 psig)
3 bar (45 psig). Certain pumps, for example
Edwards Drystar pumps, may need up to 5 bar
(75psig) to ensure satisfactory purging. Check
with the vendor's instructions.
It is the customer’s responsibility to ensure that a rotary pump purge connection is
fitted and used correctly. This is needed to ensure the protection of the pumping
system from the customer’s process, and may also be required by local safety
regulations. Because customers’ requirements vary, components are not supplied
automatically by OIPT. Kits of parts are available if required. Contact OIPT for further
information.
It may be safe to omit this feature on certain systems, such as Ionfab machines
running inert gas processes. However, unless the customer has written agreement on
this point from OIPT, any damage caused by the omission cannot be covered by the
system warranty.
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6.
Oxford Instruments Plasma Technology
OIPT Systems
Process gases
REGULATOR 0.5 BAR TO 5 BAR
(7 TO 75 PSIG) LOCATED
ADJACENT TO THE SYSTEM
NOTES: ALL TUBING TO BE
ELECTROPOLISHED
STAINLESS STEEL
SUPPLY TO
GAS POD
OR INTERNAL
GAS LINE
MINIMUM PRESSURE
3 BAR (45 PSIG)
ALL FITTINGS,
REGULATOR AND
FILTER TO BE
SEMICONDUCTOR
GRADE
Fig 6.1: Recommended process gas supply installation
Semiconductor grade fittings and pressure regulators, together with electropolished
stainless steel tube must be used to ensure that gas quality is not degraded.
6.1
Mandatory specifications for process gas supplies
• Pipework fittings and pressure regulators:
• Gas handling tubing:
• Purity:
• Filtration:
• Regulation:
• Minimum pressure at input to system:
6.1.1
Semiconductor grade
Electropolished stainless steel
At least 99.99% or higher to satisfy
process requirements.
A 2-micron filter is fitted to each gas
line supplied as part of the system.
For other grades of filter, please
consult OIPT.
0.5 to 5 bar (7.5 to 75 psig)
2 bar (30 psig)
Systems using Helium wafer cooling
The specifications for the Helium gas supply are as for those of the process gases given
in sub-sections 6 and 6.1 with the exception that the maximum pressure at the inlet to
the pressure controller must not exceed 3.5 bar (43 psig). The design of the Helium
pressure controller is such that it can be destroyed by higher pressures.
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6.1.2
Oxford Instruments Plasma Technology
System Manual
Systems using Helium purge
The specifications for the Helium gas supply are as for those of the process gases given
in sub-sections 6 and 6.1 with the exception that the maximum pressure at the inlet to
the pressure controller must not exceed 3.5 bar (43 psig). The design of the Helium
pressure controller is such that it can be destroyed by higher pressures.
6.1.3
Installation of low vapour pressure gases (e.g. SiCl4, BCl3, C4F8)
The low vapour pressure can lead to condensation in the gas supply lines, particularly at
cold points or when the gas passes into a cooler region. This condensation can result in a
build up of liquid in the gas pipe, usually at the low points or u-bends in the gas line,
often leading to instability of gas flow, especially if liquid condenses or flows into the
MFC.
The low vapour pressure can also result in very low gas pressure if the gas cylinder is very
cold, e.g. if it is kept outdoors in the winter.
Therefore, it is important to adhere to the following guidelines:
(A)
It is necessary to keep the gas cylinder indoors (in an extracted gas cabinet) to
avoid loss of line pressure when the outside temperature is cold.
However, do NOT heat the gas cylinder with a heated jacket as this can cause
condensation problems when the gas passes into the cooler gas lines. Room
temperature is warm enough to provide sufficient vapour pressure.
(B)
It is important to maintain a positive temperature gradient from the cylinder to
the MFC, or at least keep them at the same temperature. The simplest method is
to position the gas cabinet close to the gas pod, minimising the chances of
temperature differences, reducing the length of the gas pipe, and hence
minimising the chances of condensation. If this is not possible, then it is
necessary to heat the gas lines by the use of heater tape.
The MFC will also need to be heated. OIPT offers a heated MFC kit for these
gases. Alternatively, heater tape can be wrapped around the MFC. However, in
this case, it may also be necessary to detach the MFC from the backing plate to
avoid heat loss through the plate, and to cover the MFC in insulation material to
avoid cooling from air flow within the gas pod (from the gas pod exhaust).
It will then be necessary to set the MFC temperature hotter than the gas line
temperature, which in turn is hotter than the gas cylinder temperature. A typical
set-up might be MFC 40 &deg;C or above, gas line 30-40 &deg;C, and gas cylinder at room
temperature.
(C)
If condensation problems are suspected, it will be necessary to pump out the gas
lines completely, and optimise the heater tape arrangement and temperature
setpoints before refilling the gas line.
(D)
For SiCl4 it is important to use a dedicated SiCl4 MFC as this is designed
specifically for low-pressure condensable SiCl4 operation.
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7.
Oxford Instruments Plasma Technology
OIPT Systems
Liquid Nitrogen
WARNING
IF LIQUID NITROGEN FACILITIES ARE NOT INSTALLED, OPERATED AND MAINTAINED
CORRECTLY, DANGEROUS SITUATIONS CAN RESULT. THESE INTRODUCE RISKS OF:
7.1
A)
HAZARDOUS PRESSURE BUILD-UP CAUSED BY THE BOIL-OFF OF LIQUID
NITROGEN, WHICH CAN RESULT IN AN EXPLOSION.
B)
PERSONAL INJURY FROM TOUCHING PIPEWORK OR OTHER SYSTEM
COMPONENTS CARRYING LIQUID NITROGEN. THIS RISK CAN REMAIN EVEN
AFTER VENTING THE CHAMBER.
C)
ASPHYXIATION CAUSED BY THE BOILED-OFF LIQUID NITROGEN REPLACING
OXYGEN IN THE SYSTEM ENVIRONMENT.
Mandatory Requirements for Liquid Nitrogen systems
• Ensure that the Liquid Nitrogen installation is carried out in accordance with local
safety regulations. This includes the following:
(a)
No part of the Liquid Nitrogen circuit can become blocked with ice or
other contaminants.
(b)
Adequate precautions, e.g. pressure relief valves, are fitted to prevent
hazardous pressure build-up from boil-off of the Liquid Nitrogen.
(c)
All system components carrying Liquid Nitrogen are adequately
insulated, and covered to prevent personnel touching exposed
components.
• Ensure that the installation is inspected by a Specialist to confirm that it is safe to
use. Inspections must be carried out before the system is commissioned and at
regular intervals throughout its life.
• Pipework from the Dewar to the system must be adequately insulated and
connected to the system via a 3/8” Swagelok connector.
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8.
Oxford Instruments Plasma Technology
System Manual
Extraction
The following mandatory requirements describe the extraction systems recommended
by OIPT. While these recommendations may be regarded as “good practice”, they are not
a complete definition of the safety standards required when handling toxic, corrosive or
otherwise hazardous gases. It is the customer’s responsibility to ensure that the
installation meets all relevant local safety regulations and OIPT accepts no responsibility
in this respect.
For detailed information about the safety aspects of gas handling and pumping systems,
the customer should consult the relevant manufacturer/supplier of the gases and pumps
to be used.
8.1
Mandatory requirements for Rotary Pump extraction
The installation must provide a rotary pump exhaust extraction system which matches
the rotary pump exhaust and which conforms to local safety standards.
In particular, all fittings and pipework connected to the rotary pump exhaust must be
made from industry standard stainless steel in accordance with local safety regulations.
Specialised equipment such as scrubbers and furnaces may be needed to dispose of
hazardous gases. The routing of the pump exhaust line must be arranged so that
condensates cannot flow back into the pump.
Note that there is a risk of damage from cross-contamination if rotary pumps share one
exhaust system. This applies whether the pumps are on the same system or on different
systems. Damage caused by any cross-contamination is not covered by the system
warranty.
Care must be taken to route mutually incompatible exhaust gases through separate
exhaust ducts. In particular, oxygen enriched exhaust gases should not be mixed with
exhausts from mineral oil pumps, otherwise, an explosion may occur.
8.2
Mandatory requirements for Gas Pod extraction
The gas pod must be connected to the customer's gas extraction system via a 100 mm
diameter pipe collar to provide cabinet extraction with a minimum flow rate of 1
m3/hour (6-line gas pod) or 3 m3/hour (12-line gas pod), i.e. an extraction vacuum of
approximately 500 Pa relative to local atmospheric pressure is required. It is the
customer’s responsibility to ensure that the gas extraction system, including any
necessary gas sensors, meets local safety regulations.
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Page 18 of 22
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System Manual
8.3
Oxford Instruments Plasma Technology
OIPT Systems
Mandatory requirements for Cryogenic pump extraction
WARNING
ANY CRYOGENIC PUMP, WHICH PUMPS HAZARDOUS GASES MUST HAVE, A VENT PIPE
FITTED TO ITS RELIEF VALVE TO PREVENT THE RELEASE OF GAS INTO THE CLEAN
ROOM.
THE PUMPS COLLECT THE PROCESS GASES AND THE GASEOUS RESIDUES DURING
OPERATION. THESE GASES ARE RELEASED THROUGH THE RELIEF VALVE DURING PUMP
REGENERATION OR IF ELECTRICAL POWER IS LOST.
If a cryogenic pump is used to pump toxic, corrosive, or flammable gases, a written
action plan is required. This must be prepared in consultation with OIPT and other
competent bodies. Specialised equipment such as scrubbers and furnaces may be
needed to dispose of hazardous gases.
If the pumped gases contain more than 20% oxygen, a vent pipe must be fitted to the
system’s cryo pump outlet connector. The vent pipe must be routed to a safe place
outside of the clean room and conform to local safety standards.
If a cryogenic pump is used to pump gases containing more than 20% oxygen, the
associated roughing pump(s) must be lubricated with a PFPE fluid, e.g. Fomblin or
Krytox.
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OIPT Systems
Oxford Instruments Plasma Technology
9.
Environment
9.1
Statement of intended use
System Manual
This equipment is intended to be used by skilled and trained personnel for processing
materials within a controlled access environment.
9.2
Mandatory Specifications for the system environment
Rated for use in a Pollution Degree 1 Installation Category environment (laboratory or
clean industrial environment).
•
•
•
•
•
•
Operating temperature:
Storage temperature:
Maximum humidity:
Minimum humidity:
Electrostatic build-up:
Ambient light level:
5&deg;C to 25&deg;C.
0&deg;C to 40&deg;C.
90% See NOTE 1.
10% See NOTE 2.
Low static environment. See NOTE 2.
300 lux minimum.
NOTE 1: High humidity will have a progressively significant effect on system
performance. At humidity greater than 50%, the rate of chamber pumpdown after venting the chamber will be affected significantly, and at
humidity greater than 65%, the rate of chamber pump-down may not meet
system specifications.
NOTE 2: Low humidity will introduce a risk of electrostatic build-up, with subsequent
discharge to the system producing a malfunction or damage. The systems
are tested to EN60801-2, severity level 3. We recommend the use of an
environment, which protects against electrostatic build-up, and extra
precautions will be necessary at low humidity.
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Oxford Instruments Plasma Technology
OIPT Systems
NOTES:
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OIPT Systems
10.
Oxford Instruments Plasma Technology
System Manual
OIPT locations worldwide
UK
Oxford Instruments Plasma Technology
North End, Yatton,
Bristol, BS49 4AP
Tel: +44(0)1934 837000
Fax: +44(0)1934 837001
Email: [email protected]
Web: www.oxfordinstruments.com/plmchp5.htm
USA
Oxford Instruments Inc.
300 Baker Avenue, Suite 150
Concord, MA 01742
Phone: +1 978-369-9933
Toll Free: +1 800-447-4717
Fax: +1 978-369-8287
Email: [email protected]
Germany
Oxford Instruments GmbH
Otto-von-Guericke Ring 10,
D-65205 Wiesbaden
Tel: +49(0)6122 937161
Fax: +49(0)6122 937175
Email: [email protected]
Issue 21: January 10
Japan
Oxford Instruments K.K.
2-11-6 Tomioka
Koto-ku, Tokyo 135-0047
Tel: +81-3-5245-3261
Fax: +81-3-5245-4466
Email: [email protected]
Web: www.oxford-instruments.jp
People’s Republic of China (Beijing)
Oxford Instruments China
Room 714, Office Tower 3,
Henderson Center,
No. 18 Jianguomennei Ave,
Dongcheng District,
Beijing 100005
Tel: +86 106518 8160/1/2
Fax: +86 106518 8155
Email: [email protected]
Web: www.oxford-instruments.com.cn
People’s Republic of China
(Shanghai)
Oxford Instruments China
Room 14-F, No.1 Plaza
800 Nanjing East Road
Shanghai 200001
Tel: +86 216360 8530
Fax: +86 216360 8535
Email: [email protected]
Web: www.oxford-instruments.com.cn
Singapore
Oxford Instruments Pte. Ltd
371 Beach Road,
#02-07 Keypoint
Singapore 199597
Tel: +65 6337 6848
Fax: +65 6337 6286
Email: [email protected]
Taiwan
Oxford Instruments Overseas Marketing
Ltd.
th
1F, No 23 Jing-Shang 19 Street,
Hsinchu, Taiwan
Tel: +65 6337 6848
Fax: +65 6337 6286
Email: [email protected]
Services Specifications
Page 22 of 22
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RF Automatic Matching Unit
Issue 6: September 2005
Page 1 of 20
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System Manual
Contents
1.
Health and Safety........................................................................................................3
2.
Description...................................................................................................................3
2.1 Introduction ........................................................................................................................3
2.2 Major components .............................................................................................................4
2.3 Automatch control .............................................................................................................5
2.3.1 RF generator panel .....................................................................................................5
2.3.2 RF automatch panel....................................................................................................5
2.4 Matching component layouts............................................................................................6
2.5 Sense and control PCB........................................................................................................7
3.
Test and setting up......................................................................................................8
3.1 Disabling the RF generators ..............................................................................................8
3.2 Overview .............................................................................................................................8
3.3 Procedure ............................................................................................................................9
4.
Operator adjustment ................................................................................................13
4.1 DC bias / Peak-to-peak switch setting .............................................................................13
5.
Troubleshooting ........................................................................................................14
5.1 Fault diagnosis chart ........................................................................................................14
5.1.1 Amplifier gain adjustment .......................................................................................15
5.1.2 Drive motor shaft to capacitor spindle alignment .................................................16
5.2 Link Settings......................................................................................................................17
5.3 Changing the RF components .........................................................................................18
5.4 Adjustment of capacitor park positions..........................................................................19
6.
OIPT locations worldwide .........................................................................................20
Fig 1: The Oxford Instruments Plasma Technology automatch unit .........................................3
Fig 2: Typical RF generator and RF automatch panels ...............................................................5
Fig 3: Matching component layouts............................................................................................6
Fig 4: Sense and control PCB layout ............................................................................................7
Fig 5: Capacitor shafts rotation direction .................................................................................10
Fig 6: Component locations .......................................................................................................11
Fig 7: LK102 and LK2 settings ....................................................................................................15
Issue 6: September 05
OIPT Automatch Unit
Page 2 of 20
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System Manual
NK
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
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e&Eacute;~&auml;&iacute;&Uuml;=~&aring;&Ccedil;=p~&Ntilde;&Eacute;&iacute;&oacute;=
For Health and Safety aspects of operating and maintaining the Oxford Instruments Plasma
Technology Automatch Unit, refer to Section 1 - Health and Safety of your m&auml;~&euml;&atilde;~&auml;~&Auml; or
f&ccedil;&aring;&Ntilde;~&Auml; system manual.
OK
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OKN
f&aring;&iacute;&ecirc;&ccedil;&Ccedil;&igrave;&Aring;&iacute;&aacute;&ccedil;&aring;=
The purpose of the Oxford Instruments Plasma Technology Automatch Unit (AMU) is to match
the impedance of m&auml;~&euml;&atilde;~&auml;~&Auml; process chambers and f&ccedil;&aring;&Ntilde;~&Auml; RF ion sources to RF generators
with an output impedance of 50 ohms, operating at 13.56 MHz.
DC bias / Peakto-peak switch
Fig 1: The Oxford Instruments Plasma Technology automatch unit
Different versions of internal components exist, but all AMUs in this series share common
electronic controls and setting up instructions. The main versions are:
Low power:
The two matching capacitors are air-cooled vane types.
High power: The two matching capacitors are water-cooled vacuum types.
The low power version is used for single wafer electrodes matching up to 500W. (The air vane
AMU is rated for 300W operation in all OIPT tools, and for use up to 500W in specific builds.)
The high power version is used in most other applications, including batch electrode
matching, 3kW ICP source, and 3cm and 15cm RF ion sources.
Note that OIPT also manufactures a 5kW AMU for use with the ICP 380 source and the 35cm
RF ion source. This AMU has an associated dedicated manual.
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OIPT Automatch Unit
Page 3 of 20
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l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
System Manual
j~&agrave;&ccedil;&ecirc;=&Aring;&ccedil;&atilde;&eacute;&ccedil;&aring;&Eacute;&aring;&iacute;&euml;=
The AMU comprises:
a)
an input section with a type N coaxial connector, and a coupler giving ‘out of match’
error signals when the reflected power is greater than 1% of the forward power.
b)
an RF section containing two motor-driven variable capacitors, together with a coil
where necessary.
c)
a DC bias / Peak to peak, set by local switch, signal path. (Only fitted to AMUs used
for matching to a powered wafer table.)
d)
an electronic control board, which uses the error signals to drive the variable
capacitors towards match.
Issue 6: September 05
OIPT Automatch Unit
Page 4 of 20
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System Manual
OKP
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
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^&igrave;&iacute;&ccedil;&atilde;~&iacute;&Aring;&Uuml;=&Aring;&ccedil;&aring;&iacute;&ecirc;&ccedil;&auml;=
The Automatch Unit is controlled by the PC 2000 software via the PLC.
Manual and automatic control is provided on the PC 2000 process page. Typical RF
GENERATOR and RF AUTOMATCH panels are shown in Fig 2 and brief descriptions of the
control facilities are given in the following sub-sections.
Fig 2: Typical RF generator and RF automatch panels
OKPKN
OKPKO
oc=&Ouml;&Eacute;&aring;&Eacute;&ecirc;~&iacute;&ccedil;&ecirc;=&eacute;~&aring;&Eacute;&auml;=
RF POWER
indicator
Displays the ON/OFF status of the RF Generator (coloured purple for ON
and grey for OFF).
Forward Power
field
Readback fields
Enter the required forward power in Watts.
Display the current forward power, reflected power and DC Bias values.
oc=~&igrave;&iacute;&ccedil;&atilde;~&iacute;&Aring;&Uuml;=&eacute;~&aring;&Eacute;&auml;=
CAPACITOR 1
fields
Enter the required position for variable AMU Capacitor 1. The position
can be set between 0%, minimum capacitance, and 100%, maximum
capacitance. The capacitor position read back is displayed.
CAPACITOR 2
fields
Enter the required position for variable AMU Capacitor 2. The position
can be set between 0%, minimum capacitance, and 100%, maximum
capacitance. The capacitor position read back is displayed.
AUTO button
Select to enable the AMU to tune automatically when the RF generator
is switched on. When the RF generator is switched off, the capacitors
return to the park position. When selected, the button’s indicator is
coloured yellow.
MANUAL button
Select to enable the AMU to move the capacitors to the values defined in
the CAPACITOR 1 and CAPACITOR 2 fields; the capacitors will remain in
these positions. When selected, the button’s indicator is coloured yellow.
HOLD button
Select to enable the AMU to tune automatically when the RF generator
is switched on. When the RF generator is switched off, the capacitors
remain at the last position. When selected, the button’s indicator is
coloured yellow.
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Page 5 of 20
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OKQ
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
j~&iacute;&Aring;&Uuml;&aacute;&aring;&Ouml;=&Aring;&ccedil;&atilde;&eacute;&ccedil;&aring;&Eacute;&aring;&iacute;=&auml;~&oacute;&ccedil;&igrave;&iacute;&euml;=
The layout of the matching components depends on the device to be matched to the RF
Generator to ensure maximum power transfer. Typical layouts of the components are shown
in Fig 3.
Note that in the typical layout, padding capacitors can be added in parallel with C1 and C2 to
modify their capacitance ranges. Refer to sub-section 5.3 (page 18) for details.
C2 PADDING
CAPACITORS
C2
RF IN
C1 PADDING
CAPACITORS
COIL
RF OUT
C1
DC BIAS
COIL
TO DC BIAS
CIRCUIT
TYPICAL MATCHING COMPONENTS (LAYOUT 1)
C1
RF IN
RF OUT
C2
ALTERNATIVE MATCHING COMPONENT LAYOUT (LAYOUT 2)
NOTE: In some systems the circuit labels C1 and C2 are reversed.
Fig 3: Matching component layouts
Issue 6: September 05
OIPT Automatch Unit
Page 6 of 20
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System Manual
OKR
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
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p&Eacute;&aring;&euml;&Eacute;=~&aring;&Ccedil;=&Aring;&ccedil;&aring;&iacute;&ecirc;&ccedil;&auml;=m`_=
Refer to drawing 94-SE00A17801 for a circuit diagram of the AMU. The layout of the Sense
and Control PCB is shown in Fig 4 .
Fig 4: Sense and control PCB layout
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Page 7 of 20
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PK
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
System Manual
q&Eacute;&euml;&iacute;=~&aring;&Ccedil;=&euml;&Eacute;&iacute;&iacute;&aacute;&aring;&Ouml;=&igrave;&eacute;=
WARNING
HAZARDOUS RF VOLTAGE - CONTACT CAN CAUSE DEATH, SEVERE INJURY
OR BURNS.
ANY WORK REQUIRING THE REMOVAL OF COVERS OR PANELS MUST
ONLY BE PERFORMED BY AUTHORISED PERSONNEL WHO ARE AWARE OF
THE HAZARDS INVOLVED.
NOTE:
PKN
Detailed test instructions are contained in Oxford Instruments Plasma Technology
Work Instruction No. 39. The following is a summary for the benefit of skilled
service engineers. It should not be necessary for operators to perform these
setting up operations.
a&aacute;&euml;~&Auml;&auml;&aacute;&aring;&Ouml;=&iacute;&Uuml;&Eacute;=oc=&Ouml;&Eacute;&aring;&Eacute;&ecirc;~&iacute;&ccedil;&ecirc;&euml;=
Before removing an RF shielding panel, disable the RF generators by opening the interlock
chain. This can be done most easily by partially venting the process chamber using the 'Service
mode' vacuum control page to isolate the chamber and open the vent valve for 10-30
seconds, until the interlock indicator changes state.
PKO
l&icirc;&Eacute;&ecirc;&icirc;&aacute;&Eacute;&iuml;=
Connect AMU to system
Steps 1-8:
RF POWER
SUPPLY OFF
Set mechanical movement range
Steps 1 to 5
Step 6
Confirm end-stop points
Step 7
Set gain levels
Step 8
Find manual match
Steps 9 to 12
Set park positions
Step 13
Set RV1 and RV2
Step 14
Confirm auto-match for low power
operation
Step 15
Confirm auto-match for high power
operation
Issue 6: September 05
OIPT Automatch Unit
Page 8 of 20
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System Manual
PKP
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
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m&ecirc;&ccedil;&Aring;&Eacute;&Ccedil;&igrave;&ecirc;&Eacute;=
WARNING
HAZARDOUS RF VOLTAGE - CONTACT CAN CAUSE DEATH, SEVERE INJURY
OR BURNS.
ENSURE THAT THE RF SUPPLY IS SWITCHED OFF WHILE CARRYING OUT
STEPS 1 TO 8.
1)
Connect the AMU to the system. Make a good earth bond between the vacuum
chamber and the AMU chassis.
2)
Connect the output strap to the plasma electrode with at least a 25 mm wide copper
strap, with at least 10 mm clearance between the live strap and any earthed part.
3)
Confirm the polarity and voltage of the dc power source before connecting to the
Sense and Control PCB:
JP7 pin 1
JP7 pin 2
+24 Vdc
0V
4)
Ensure the ventilation fans are all pulling air out of the automatch case and check
the system cooling is turned on. For sense board cooling, check one fan is pulling air
out and one is pulling air in to the sense board section.
5)
Confirm the operation of each motor using the manual button (see sub-section
2.3.2). An increase in capacitor position should make the vanes overlap more. In the
case of a vacuum capacitor, an increase in position should turn the capacitor shaft
anti-clockwise, when looking at it from the motor end (see Fig 5). Check with a
capacitance meter in case of doubt.
If the motors do not turn in the correct direction check the plug in connector on the
board, refer to OIPT Work Instruction No. 39.
6a)
Calibrate the motors and their respective positions as follows:
For gear driven capacitors: Loosen screws retaining the motors to the AMU box,
but don’t remove completely and ensure the gears don’t mesh.
For direct drive capacitors: Unscrew the motor plate attached to the side of the
AMU box and pull the coupling apart.
Then,
For Air Vane Capacitor AMU:
Keeping gears separated, overlap the vanes fully. Then, making sure that the gears
don’t mesh, drive both motors to maximum (999), using the AMU control panel.
For Vacuum Capacitor AMU (AMU board REV05 and earlier):
Set the capacitor positions and drive motors to their required position according to
the system type as shown in the following table:
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Page 9 of 20
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System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
System
Type
Set C1
to
Then
move
in
Drive
C1
Motor
to
Set C2
to
Then
Move
in
Drive
C2
Motor
to
RIE/DP
Maximum
1 turn
Maximum
(999)
Maximum
1 turn
Maximum
(999)
ICP180
Maximum
1 turn
Maximum
(999)
Minimum
1 turn
Minimum
(000)
Ion Beam
Minimum
1 turn
Minimum
(000)
Minimum
1 turn
Minimum
(000)
ICP 380
Maximum
1 turn
Maximum
(999)
Maximum
7 Turns
Maximum
(999)
To find the minimum position, turn the capacitor
shaft in the direction of the arrow, shown in Fig
5.
Padding
capacitor
mounting
position
To find the maximum position, turn the
capacitor shaft opposite to the direction of the
arrow in Fig 5.
At the minimum position, the shaft becomes
stiff; at the maximum position, the shaft
becomes loose. Do not try to turn the shaft
past these points. If when turning the
capacitor to the maximum position, the shaft
becomes loose, turn the shaft back in until it just
begins to bite, this is the maximum position.
Fig 5: Capacitor shafts rotation direction
For Vacuum Capacitor AMU (AMU board with capacitor range mod.):
(Applies to all system types) Rotate the vacuum capacitor shaft clockwise as you
look at it from the motor end (see Fig 5) until the shaft just becomes stiff, and then
turn in half a turn. Making sure the motors don’t mesh, drive both motors to
minimum (000).
6b)
For gear driven capacitors: Re-mesh the gears and tighten motor retaining
screws, ensuring that the motor and capacitor positions don’t move.
For direct drive capacitors: Loosen the coupling clamp screw on the capacitor
side, turn the coupling on the capacitor side until it lines up wit that on the motor
side ensuring neither the capacitor nor the motor change position at any time. Clip
the coupling together and tighten the clamp screw. Then re-attach the motor plate.
7)
Confirm the ‘end of range’ stop functions using the manual drive switches located
on the AMU panel:
Drive C1 positive to the stop position; LED 101 lights; stop point in the range 950-999
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OIPT Automatch Unit
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^&auml;&auml;=lfmq=p&oacute;&euml;&iacute;&Eacute;&atilde;&euml;
Drive C1 negative to the stop position; LED 102 lights; stop point in the range 000 050
Drive C2 positive to the stop position; LED 1 lights; stop point in the range 950-999
Drive C2 negative to the stop position; LED 2 lights; stop point in the range 000 - 050
If these aren’t working as stated, refer to section 5 or OIPT Work Instruction No. 39
8)
Set LK2 and LK 102 to
position ‘b’, and then
turn RV1 and RV101 fully
clockwise until they
begin to click (see Fig 6
or Fig 4).
LK2 RV1
JP3
LK102
RV101
Fig 6: Component locations
9)
Fit all covers to the AMU ensuring that they are securely fitted, and then connect the
RF generator to the matching unit. Evacuate the process chamber and turn on a low
power process.
For a Plasmalab system, a suitable process would be:
RF Generator output:
50 W
Pressure:
50 mTorr (RIE), 1 Torr (PECVD), 0.1 Torr (PE)
Gas:
20-100 sccm air, nitrogen or argon.
For an ion beam system, a suitable process would be:
RF generator output:
150 W (3 cm to 5 cm diameter)
300 W (15 cm to 20 cm diameter)
Gas:
10 sccm Argon
It may be necessary to use a gas burst to start the plasma, and it may be
necessary to start the neutralizer, if fitted.
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10)
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
Manually match to the lowest possible reflected power using the AUTOMATCH
panel (see sub-section 2.3.2), and make sure a plasma is running. Adjust the error
signal zero potentiometers RV1 and RV2 (located on the same side of the AMU as
the RF in connector; see Fig 1), while monitoring the two error signals on JP3 pins 1
and 3 (See Fig 6). These should be less than 20 mV when a match exists. Amplified
error signals are accessible at TP 10 and TP 110; these should be made as low as
possible when the RF is well matched.
For Vacuum Capacitor AMU (AMU board REV05 and earlier):
If it is not possible to find a match position due to the match position being beyond
the range of the capacitors, stop the process and remove the AMU cover again. If C1
is attempting to drive above the maximum position, add 180 pF padding capacitor
(Part Number 94-ECC1218), or turn 2 turns anti-clockwise towards maximum. If C1 is
attempting to drive past the minimum position, remove a padding capacitor if
already fitted, otherwise turn 2 turns clockwise towards minimum. If C2 attempts to
drive above the maximum position turn 2 turns anti-clockwise, if C2 attempts to
drive below the minimum position, turn 2 turns clockwise. Whilst doing this, be
careful not to turn the capacitors beyond their physical end stops.
For Vacuum Capacitor AMU (AMU board with capacitor range mod.):
If C1 attempts to drive above maximum position, add 180 pF padding capacitor. If C1
is attempting to drive past the minimum position, remove a padding capacitor if
already fitted. If C2 attempts to drive past maximum or minimum position, check
that the correct inductor is fitted and that the capacitors are correctly fitted to the
system. If these are correct, the match position is out of the range of C2.
For Air Vane Capacitor AMU:
If C1 or C2 attempts to drive above maximum position, add 180 pF padding
capacitor. If C1 or C2 is attempting to drive past the minimum position, remove a
padding capacitor if already fitted. It is not necessary to reset the positions of the Air
Vane Capacitors.
11)
Increase the RF power in a few steps to maximum and check for RF leakage, arcing
or local overheating.
12)
Rematch manually, when at maximum RF power, manually to less than 1% reflected
power if possible; less than 3% is the maximum reflected power acceptable. Refine
the zero settings of the error signals.
13)
Make a note of the capacitor position values when a good match is achieved. Stop
the process and adjust the park positions to a value below that of the match position
(within around 050 units on the position display), making sure that C2 is closer to its
match position than C1.
Re-start the process with the AUTOMATCH panel’s Auto button selected (see subsection 2.3.2) to make sure the match is successful. If there is a large reflected power,
repeat Step 10. If there is a small amount of reflected power, which can’t be reduced
manually, RV1 and RV2 on the side of the AMU can be used to make finer
adjustments when in auto mode.
14)
If the capacitors oscillate when in auto, reduce the gain of the control circuit by
slowly turning RV1 and RV101 anti-clockwise (if C2 oscillates adjust RV1, if C1
oscillates adjust RV101) until oscillations stop. If the potentiometer’s RV1 or RV101
begin to click before the oscillations have ceased, turn them fully clockwise until
Issue 6: September 05
OIPT Automatch Unit
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^&auml;&auml;=lfmq=p&oacute;&euml;&iacute;&Eacute;&atilde;&euml;
they begin to click again and change LK2 (corresponding to RV1) or LK102
(corresponding to RV101) to position ‘a’ and begin turning the potentiometers anticlockwise again until the oscillations stop.
15)
QK
Confirm the automatching behaviour, increasing the RF power to maximum in small
steps, repeating Steps 10 to 13 if necessary.
l&eacute;&Eacute;&ecirc;~&iacute;&ccedil;&ecirc;=~&Ccedil;&agrave;&igrave;&euml;&iacute;&atilde;&Eacute;&aring;&iacute;=
WARNING
THE FOLLOWING ADJUSTMENT INVOLVES WORKING ON THE SYSTEM WITH
PANELS/COVERS REMOVED. IT SHOULD ONLY BE CARRIED OUT BY TRAINED
PERSONNEL WHO ARE AWARE OF THE HAZARDS INVOLVED.
QKN
a`=&Auml;&aacute;~&euml;=L=m&Eacute;~&acirc;J&iacute;&ccedil;J&eacute;&Eacute;~&acirc;=&euml;&iuml;&aacute;&iacute;&Aring;&Uuml;=&euml;&Eacute;&iacute;&iacute;&aacute;&aring;&Ouml;=
The DC bias / Peak-to-peak switch is located on the outer case of the AMU, adjacent to RV1
(null adjustment potentiometer). See Fig 1, page 3.
This switch selects one of two sensing output signals from the AMU:
DC bias:
This switch setting is the default position. The output is a SCALED dc
voltage proportional to the RF-induced self-bias on the electrode,
sometimes called the 'DC bias'. This is a negative offset voltage on the
electrode with respect to ground, which is inverted and conventionally
referred to as a positive value, typically 100 - 600 Vdc. Normal scaling can
read up to 1000 Vdc. This signal is read by the front-end software with
correct scaling on OIPT tools.
Peak-to-peak:
The output is an UNSCALED dc voltage related to the peak-to-peak value
of the RF signal at the output of the automatch. This can be useful when
the scaled dc bias is inaccessible, for example if the electrode has no dc
contact to the plasma because a quartz carrier plate masks the whole
electrode. The value displayed on the PC screen will be an arbitrary value,
not a true peak-to-peak value, but can still be a useful monitor.
Note that the software has no knowledge of the switch setting, and is scaled only for the dc
bias setting.
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Issue 6: September 05
^&auml;&auml;=lfmq=p&oacute;&euml;&iacute;&Eacute;&atilde;&euml;
RK
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System Manual
q&ecirc;&ccedil;&igrave;&Auml;&auml;&Eacute;&euml;&Uuml;&ccedil;&ccedil;&iacute;&aacute;&aring;&Ouml;=
WARNING
HAZARDOUS RF VOLTAGE - CONTACT CAN CAUSE DEATH, SEVERE INJURY
OR BURNS.
ANY WORK REQUIRING THE REMOVAL OF COVERS OR PANELS MUST
ONLY BE PERFORMED BY AUTHORISED PERSONNEL WHO ARE AWARE OF
THE HAZARDS INVOLVED.
RKN
c~&igrave;&auml;&iacute;=&Ccedil;&aacute;~&Ouml;&aring;&ccedil;&euml;&aacute;&euml;=&Aring;&Uuml;~&ecirc;&iacute;=
Use the following chart to locate and identify faults. Note that the chart lists typical fault
symptoms and is not exhaustive.
SYMPTOM
(A) Drive motors do
not respond to
automatic or
manual control
POSSIBLE CAUSES
Fuse FS2 blown
ACTION
Investigate and repair fault, which caused the
fuse to blow. Then renew the fuse.
Fuse FS1 or FS101 tripped.
Investigate and repair the fault, which caused
the fuse to trip. (The fuses will automatically
reset once the fault is repaired.)
Note that these components are semiconductor
fuses which respond to an increase in current
above their rating (approximately 200 mA) by
increasing their internal resistance significantly.
The voltage drop across each of these
components under non-fault conditions is
approximately 0.5V
When tripped by high current, the voltage drop
is almost the full supply voltage i.e. 24V.
(B) C1 or C2 drive to
min or max
1. C1 or C2 starting too far
from final match position
2. Match position is out of
accessible range
(C) C1 or C2 drive to
min or max and do
not return
manually
Capacitor has travelled past
an electrical limit
(D) Plasma does not
strike even though
the reflected power
is low
Gas pressure is too low or
too high
Issue 6: September 05
After power is removed, the devices require 20
seconds to cool down and reset.
Adjust park potentiometers (Refer to subsection 5.4 (page 19).
1. Change process conditions
2. Change component fit in AMU (skilled
personnel only). Refer to sub-section 5.3 (page
18).
1. All vane capacitors only: Continue manual
travel in the same direction (to max if capacitor
is at max). The capacitor will turn fully until it
passes the opposite limit.
2. Readjust limit settings
Caution: do not run for &gt; 2 minutes in this
condition. Change gas pressure to 20 - 200
mTorr range (RIE), or 0.5 - 1.5 Torr range
(PECVD)
OIPT Automatch Unit
Page 14 of 20
Printed: 16-Nov-07, 9:26
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
SYMPTOM
(E) C1 or C2 oscillate
close to match
POSSIBLE CAUSES
1. Amplifier gain too high
ACTION
See sub-section 5.1.1 (page 15).
2. C1 or C2 spindle thread
dirty.
(F) Drive motor shafts
rotate but capacitor
spindles do not.
Coupling between the motor
shafts and capacitor spindles
has become disengaged or
loose.
Park potentiometers have
broken
Remove capacitor, clean and re-lubricate
capacitor’s spindle thread and bearing. Realign; see sub-section 5.1.2 (page 16).
See sub-section 5.1.2 (page 16).
(G) End stops don’t
work, motor drives
through.
(H) Error signal pots
don’t adjust the
error signal or both
adjust one signal
only.
Links placed incorrectly
^&auml;&auml;=lfmq=p&oacute;&euml;&iacute;&Eacute;&atilde;&euml;
Check park potentiometers behind AMU
control panel and replace if necessary.
Check links LK6, 7, 10 &amp; 107 to ensure they are
in the correct position. If link is open end type,
ensure that metal insert is still present.
Hints and Tips
RKNKN
•
Do not remove anything from the Motor Control board without removing the
power (JP2) first.
•
When in ‘Auto’ mode RV1 and RV2 found on the side of the AMU casing can be used
to make fine adjustments to the match position.
^&atilde;&eacute;&auml;&aacute;&Ntilde;&aacute;&Eacute;&ecirc;=&Ouml;~&aacute;&aring;=~&Ccedil;&agrave;&igrave;&euml;&iacute;&atilde;&Eacute;&aring;&iacute;=
Refer to Symptom (E) in the Fault diagnosis chart (see sub-section 5.1, page 14).
When adjusting the amplifier gain, initially adjust the associated variable resistor (RV101 for
C1 or RV1 for C2; see for locations). These variable resistors provide a ‘fine’ adjustment. If
required, a coarse adjustment is available by using links LK102 and LK2 as shown in Fig 7.
Link shown in
position A
Pin on
PCB
A
B
C
Position A = Lowest amplifier gain
Position B = Medium amplifier gain
Position C = Highest amplifier gain
Fig 7: LK102 and LK2 settings
Printed: 16-Nov-07, 9:26
OIPT Automatch Unit
Page 15 of 20
Issue 6: September 05
^&auml;&auml;=lfmq=p&oacute;&euml;&iacute;&Eacute;&atilde;&euml;
RKNKO
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
a&ecirc;&aacute;&icirc;&Eacute;=&atilde;&ccedil;&iacute;&ccedil;&ecirc;=&euml;&Uuml;~&Ntilde;&iacute;=&iacute;&ccedil;=&Aring;~&eacute;~&Aring;&aacute;&iacute;&ccedil;&ecirc;=&euml;&eacute;&aacute;&aring;&Ccedil;&auml;&Eacute;=~&auml;&aacute;&Ouml;&aring;&atilde;&Eacute;&aring;&iacute;=
Refer to Symptom (F) in the Fault diagnosis chart (sub-section 5.1, page 14).
If the coupling between the motor shafts and capacitor spindles, has become disengaged or
loose, use the following procedure to align the shafts/spindles to their correct relative
positions.
1)
Tighten the shaft and spindle grub screws.
2)
Loosen the two bolts securing the motor/gear assembly to the AMU casing.
3)
Carefully slide the motor/gear assembly away from the fan housing to disengage the
gear wheels from the capacitor.
4)
Align the gear wheels to the capacitor depending on the AMU version as follows:
a) Air spaced capacitor
AMUs
(i)
Set the relevant capacitor to MANUAL mode.
(ii)
Set the relevant capacitor to MAX, so that the motor drives
the read-back potentiometer to its upper limit, without
driving the capacitor itself.
(iii) Fully mesh the capacitor vanes.
b) Vacuum capacitor
AMUs for RIE/PECVD
applications
c) Vacuum capacitor
AMUs for the ICP 180
application
d) Vacuum capacitor
AMUs for RF ion
source applications
(i)
Set the relevant capacitor to MANUAL mode.
(ii)
Set the relevant capacitor to MAX, so that the motor
drives the read-back potentiometer to its upper limit,
without driving the capacitor itself.
(iii)
Set the relevant capacitor to maximum by rotating its
shaft anti-clockwise until the shaft becomes loose and
starts to unscrew from the capacitor body, then rotate
the shaft one turn clockwise.
For C1, use the procedure in b) above.
For C2, use the following steps:
(i)
Set C2 to MANUAL mode.
(ii)
Set the C2 to MIN so that the motor drives the readback potentiometer to its lower limit, without driving
the capacitor itself.
(iii)
Set C2 to minimum by rotating its shaft clockwise until
the physical end stop is reached, and then rotate the
shaft one turn anti-clockwise.
For C1 and C2 alignment in this AMU, use the procedure for C2
in c) above.
5)
On completion of capacitor alignment in Step 4), re-engage the motor/gear assembly
to the capacitor and tighten the securing bolts.
6)
Check capacitor travel.
Issue 6: September 05
OIPT Automatch Unit
Page 16 of 20
Printed: 16-Nov-07, 9:26
System Manual
RKO
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
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i&aacute;&aring;&acirc;=p&Eacute;&iacute;&iacute;&aacute;&aring;&Ouml;&euml;=
Incorrect link settings can cause the AMU to malfunction. The factory default settings are
given in the following table:
Link
LK1
Air
spaced
Capacitor
A
Low Power
Vacuum
Capacitor
A
High Power
Vacuum
Capacitor
A
LK2
B
A
B
LK3
A
A
A
LK4
B
A
A
Incremental Gain Signal. LK4 in position
‘A’ enables extra gain when in position
control. This is used when driving a
vacuum capacitor.
LK5
A
A
A
Panel/PLC Controller. Position B for AMU
controlled by PLC
LK6
A
A
B
Changes the biasing on the input
amplifier for C2 motor
LK7
B
B
A
Changes the biasing on the input
amplifier for C2 motor
LK101
A
A
A
Setting ‘A’ enables park position.
Setting ‘B’ disables park.
LK102
B
A
B
LK104
B
A
A
Coarse gain setting for C1 (‘A’ – low, ‘B’ –
medium, ‘C’ - high)
Incremental Gain Signal. LK104 in position
‘A’ enables extra gain when in position
control. This is used when driving a
vacuum capacitor.
LK105
A
A
A
Panel/PLC Controller. Position ‘B’ for AMU
controlled by PLC
LK106
A
A
B
Changes the biasing on the input
amplifier for C1 motor
LK107
A
A
B
Changes the biasing on the input
amplifier for C1 motor
Printed: 16-Nov-07, 9:26
Notes
Setting A enables park position.
Setting B disables park.
Coarse gain setting for C2 (‘A’ – low, ‘B’ –
medium, ‘c’ - high)
Setting ‘B’ simulates RF on signal (for
testing only).
OIPT Automatch Unit
Page 17 of 20
Issue 6: September 05
^&auml;&auml;=lfmq=p&oacute;&euml;&iacute;&Eacute;&atilde;&euml;
RKP
System Manual
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
`&Uuml;~&aring;&Ouml;&aacute;&aring;&Ouml;=&iacute;&Uuml;&Eacute;=oc=&Aring;&ccedil;&atilde;&eacute;&ccedil;&aring;&Eacute;&aring;&iacute;&euml;=
This may be necessary to match a process beyond the normal operating range.
WARNING
HAZARDOUS RF VOLTAGE - CONTACT CAN CAUSE DEATH, SEVERE INJURY
OR BURNS
Any work requiring the removal of covers or panels must only be
performed by authorised personnel who are aware of the hazards
involved.
Turn off the RF generator completely before removing the smaller L-section cover. This
reveals the ends of the two variable capacitors and mounting positions for extra fixed
capacitors.
CAUTION
Components fitted must be suitable for RF power service. Low power circuit
devices will overheat quickly.
Suitable components are given in the following table:
OIPT Part Number
94-ECC1209
94-ECC1218
Capacitance
90pf
180pF
Rating
1kV
2kV
Change components according to the following table:
C1 going maximum
Add fixed capacitance in parallel with C1
See following NOTE.
C1 going minimum
Remove fixed capacitance in parallel with C1
Minimum is zero
C2 going maximum
1. Add fixed capacitance in parallel with C2
2. Increase coil inductance
See following NOTE.
C2 going minimum
1. Remove fixed capacitance in parallel
with C2
Minimum is zero fixed capacitance
2. Decrease coil inductance
NOTE: Variable capacitors C1 and C2 have a maximum capacitance of 1000pF and 500pF respectively.
For each of these variable capacitors there are three positions for fitting parallel ‘padding’
capacitors. Therefore, a maximum of 3 x 180pF padding capacitors could be fitted but usually
there is no need to fit more than one padding capacitor (i.e. 180pF).
Issue 6: September 05
OIPT Automatch Unit
Page 18 of 20
Printed: 16-Nov-07, 9:26
System Manual
RKQ
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
^&auml;&auml;=lfmq=p&oacute;&euml;&iacute;&Eacute;&atilde;&euml;
^&Ccedil;&agrave;&igrave;&euml;&iacute;&atilde;&Eacute;&aring;&iacute;=&ccedil;&Ntilde;=&Aring;~&eacute;~&Aring;&aacute;&iacute;&ccedil;&ecirc;=&eacute;~&ecirc;&acirc;=&eacute;&ccedil;&euml;&aacute;&iacute;&aacute;&ccedil;&aring;&euml;=
The capacitors drive automatically to the park positions if:
the AMU is set to Auto
the RF is off
the circuit board links enable parking
The park positions can be adjusted when all of these conditions are satisfied, by altering the
corresponding potentiometer with a small flat-bladed screwdriver. The capacitor will move
when the potentiometer is adjusted, and the park position is displayed as the capacitor
position.
Printed: 16-Nov-07, 9:26
OIPT Automatch Unit
Page 19 of 20
Issue 6: September 05
^&auml;&auml;=lfmq=p&oacute;&euml;&iacute;&Eacute;&atilde;&euml;
SK
l&ntilde;&Ntilde;&ccedil;&ecirc;&Ccedil;=f&aring;&euml;&iacute;&ecirc;&igrave;&atilde;&Eacute;&aring;&iacute;&euml;=m&auml;~&euml;&atilde;~=q&Eacute;&Aring;&Uuml;&aring;&ccedil;&auml;&ccedil;&Ouml;&oacute;==
System Manual
lfmq=&auml;&ccedil;&Aring;~&iacute;&aacute;&ccedil;&aring;&euml;=&iuml;&ccedil;&ecirc;&auml;&Ccedil;&iuml;&aacute;&Ccedil;&Eacute;
UK
Oxford Instruments Plasma Technology
North End, Yatton,
Bristol, BS49 4AP
Tel: +44(0)1934 837000
Fax: +44(0)1934 837001
Email: [email protected]
Web: www.oxfordinstruments.com/plmchp5.htm
USA
Oxford Instruments Inc.
300 Baker Avenue, Suite 150
Concord, MA 01742
Phone: +1 978-369-9933
Toll Free: +1 800-447-4717
Fax: +1 978-369-8287
Email: [email protected]
Germany
Oxford Instruments GmbH
Otto-von-Guericke Ring 10,
D-65205 Wiesbaden
Tel: +49(0)6122 937161
Fax: +49(0)6122 937175
Email: [email protected]
Issue 6: September 05
Japan
Oxford Instruments K.K.
2-11-6 Tomioka
Koto-ku, Tokyo 135-0047
Tel: +81-3-5245-3261
Fax: +81-3-5245-4466
Email: [email protected]
Web: www.oxford-instruments.jp
People’s Republic of China (Beijing)
Oxford Instruments China
Room 714, Office Tower 3,
Henderson Center,
No. 18 Jianguomennei Ave,
Dongcheng District,
Beijing 100005
Tel: +86 106518 8160/1/2
Fax: +86 106518 8155
Email: [email protected]
Web: www.oxford-instruments.com.cn
People’s Republic of China
(Shanghai)
Oxford Instruments China
Room 14-F, No.1 Plaza
800 Nanjing East Road
Shanghai 200001
Tel: +86 216360 8530
Fax: +86 216360 8535
Email: [email protected]
Web: www.oxford-instruments.com.cn
Singapore
Oxford Instruments Pte. Ltd
371 Beach Road,
#02-07 Keypoint
Singapore 199597
Tel: +65 6337 6848
Fax: +65 6337 6286
Email: [email protected]
Taiwan
Oxford Instruments Overseas
Marketing Ltd.
th
1F, No 23 Jing-Shang 19 Street,
Hsinchu, Taiwan
Tel: +65 6337 6848
Fax: +65 6337 6286
Email: [email protected]
OIPT Automatch Unit
Page 20 of 20
Printed: 16-Nov-07, 9:26
ALD Ozone Delivery System
Ozone Delivery System for FlexAL and OpAL Systems
Equipment Manual
Issue 1: July 2010
ALD Ozone Delivery SystemOxford Instruments Plasma Technology
Equipment Manual
Contents
Section 1 Health and Safety ....................................................................................... 1-1
Section 2 Services...................................................................................................... 2-1
Section 3 Description................................................................................................. 3-1
Section 4 Installation ................................................................................................. 4-1
Section 5 Operating Instructions ................................................................................ 5-1
Section 6 Maintenance and Troubleshooting .............................................................. 6-1
Record of Changes
Issue No.
1
First issue.
Details of change
OEM Manuals
The following OEM manuals are applicable to the ozone delivery system:

Atlas 25 ozone generator

C-30ZX ozone monitor
Issue 01: July 10
Ozone Delivery system for FlexAL and OpAL Systems
Page 2 of 2
Printed: 14-Jul-10, 7:01
Date
July 10
ALD Ozone Delivery System
1
Oxford Instruments Plasma Technology
Equipment Manual
Health and Safety
1 Health and Safety ................................................................................................................... 1-1
1.1 Health and safety for the ozone delivery system..................................................................1-2
1.2 Hazard information for ozone .............................................................................................1-2
1.2.1 Charecteristics of ozone...............................................................................................1-2
1.2.2 Potential health effects of ozone ..................................................................................1-2
1.3 Additional hazard information for the ozone delivery system ..............................................1-3
1.3.1 Weight .........................................................................................................................1-3
1.3.2 High voltage.................................................................................................................1-3
1.4 Safety features ....................................................................................................................1-3
Printed: 14-Jul-10, 7:20
Health and Safety
Page 1-1 of 4
Issue 01: July 10
ALD Ozone Delivery System
1.1
Oxford Instruments Plasma Technology
Equipment Manual
Health and safety for the ozone delivery system
This chapter contains specific health and safety information for operating and maintaining
the ALD Ozone Delivery System. This chapter must be read in conjunction with Section 1 Health and Safety of the manual provided with the FlexAL or OpAL atomic layer deposition
(ALD) tool that the ozone generator is attached to.
1.2
Hazard information for ozone
1.2.1
Characteristics of ozone
Ozone is a colourless gas at room temperatures. It has a characteristic sharp, irritating odour.
Ozone is a powerful oxidizing agent. Oxidation reactions involving ozone evolve more heat
than similar reactions involving oxygen. Reactions involving ozone can usually be initiated at
lower temperatures than similar reactions involving oxygen.
Ozone reacts with non-saturated organic compounds to produce ozonides, which are
unstable and may decompose with explosive violence.
Ozone is an unstable gas which, at normal temperatures, decomposes to diatomic oxygen. At
elevated temperatures and in the presence of certain catalysts such as hydrogen, iron, copper
and chromium, this decomposition may be explosive.
All personnel who will install, maintain or operate the ozone delivery system must fully
understand the hazards associated with ozone before beginning work. All such personnel
must read and understand the appropriate Material Safety Data Sheet (MSDS).
1.2.2
Potential health effects of ozone
When inhaled, ozone irritates the nose, throat, and chest and also causes dryness of the
mouth. Ozone may cause difficulty in breathing, headache, and fatigue. The characteristic
sharp, irritating odour is readily detectable at low concentrations (0.01 to 0.05 ppm).
Ozone irritates the eyes causing pain, lacrimation, and general inflammation.
Before operating the ozone generator, consult the appropriate MSDS to understand what
first-aid measures may be required.
Printed: 14-Jul-10, 7:20
Health and Safety
Page 1-2 of 4
Issue 01: July 10
ALD Ozone Delivery System
Oxford Instruments Plasma Technology
1.3
Additional hazard information for the ozone delivery system
1.3.1
Weight
Equipment Manual
The cabinet is a heavy object and has a centre of gravity above its mid-point. Take care when
lifting and installing the cabinet.
1.3.2
High voltage
High voltages are present inside the ozone generator box. There are no user serviceable parts
inside the ozone generator box.
The electrical supply to the ozone generator box must be isolated before the box is opened.
Opening the box will void the warranty.
1.4
Safety features
Refer to section 3 of this manual for a description of the safety features on the ozone delivery
system.
Printed: 14-Jul-10, 7:20
Health and Safety
Page 1-3 of 4
Issue 01: July 10
ALD Ozone Delivery System
Oxford Instruments Plasma Technology
Equipment Manual
Health and Safety
Page 1-4 of 4
Issue 01: July 10
NOTES:
Printed: 14-Jul-10, 7:20
ALD Ozone Delivery System
2
Oxford Instruments Plasma Technology
Equipment Manual
Services
2 Services ................................................................................................................................. 2-1
2.1 Services requirements .........................................................................................................2-2
2.2 Quantitative requirements...................................................................................................2-2
2.2.1 Facilities inlet connections ...........................................................................................2-2
2.2.2 Outlet connections .......................................................................................................2-2
2.2.3 Connections between the ozone delivery system and the ALD system...........................2-2
Printed: 14-Jul-10, 7:06
SERVICES
Page 2-1 of 2
Issue 01: July 10
ALD Ozone Delivery System
2.1
Oxford Instruments Plasma Technology
Equipment Manual
Services requirements
The ALD Ozone Delivery System is only intended for use in conjunction with a FlexAL or OpAL
system. This document gives generic information and mandatory requirements for all services.
2.2
Quantitative requirements
2.2.1
Facilities inlet connections
2.2.2
2.2.3
a)
Compressed air with a pressure &gt;5 bar
b)
Oxygen with a pressure between 2 bar and 3 bar
Outlet connections
a)
Compressed air exhaust
b)
Ozone supply to the ALD chamber
c)
Ozone out to the exhaust (atmospheric pressure side of pump)
Connections between the ozone delivery system and the ALD system
a)
AC electrical power
b)
24 VDC control signals
c)
Compressed air to drive the remote isolation valve (OpAL systems only)
Printed: 14-Jul-10, 7:06
SERVICES
Page 2-2 of 2
Issue 01: July 10
ALD Ozone Delivery System
3
Oxford Instruments Plasma Technology
Equipment Manual
Description
3 Description ............................................................................................................................ 3-1
3.1 General description.............................................................................................................3-2
3.1.1 System features............................................................................................................3-2
3.1.2 Use of delivery system..................................................................................................3-2
3.2 Main parts of the ozone delivery system .............................................................................3-2
3.3 Safety features ....................................................................................................................3-3
3.3.1 Safety interlocks...........................................................................................................3-3
3.3.2 Ozone monitoring ........................................................................................................3-3
3.4 Functional description of the ozone delivery system............................................................3-4
3.5 Pneumatic control circuit for the ozone delivery system ......................................................3-5
3.6 Electrical schematic.............................................................................................................3-6
Figure 3-1: Ozone generator cabinet .............................................................................................3-2
Figure 3-2: Functional diagram of the ozone delivery system .........................................................3-4
Figure 3-3: Pneumatic control circuit .............................................................................................3-5
Printed: 14-Jul-10, 7:09
DESCRIPTION
Page 3-1 of 6
Issue 01: July 10
ALD Ozone Delivery System
3.1
Oxford Instruments Plasma Technology
Equipment Manual
General description
The unit is a complete ozone delivery system housed inside a steel enclosure. The enclosure is
continuously monitored to ensure the concentration of ozone is within safe levels.
3.1.1
3.1.2
System features

An ozone generator, which outputs ~10% w/w ozone concentration.

An ozone destruction unit

Forward pressure regulation

An oxygen flow regulator

Ozone flow-restriction to regulate ozone delivery to the ALD chamber.

A Swagelok rapid ALD dose valve
Use of delivery system
This ozone delivery system is intended to provide the oxidant for ALD processes. The system is
designed to deliver short pulses of ozone (~ few seconds) to the ALD chamber.
3.2
Main parts of the ozone delivery system
The ozone generator is housed in a stainless steel cabinet with a sealing door containing a
glass viewing window to enable set-up (see Figure 3-1).
Figure 3-1: Ozone generator cabinet
Printed: 14-Jul-10, 7:09
DESCRIPTION
Page 3-2 of 6
Issue 01: July 10
ALD Ozone Delivery System
Oxford Instruments Plasma Technology
Equipment Manual
The main features of the ozone generator cabinet are:
Ozone generator
an Absolute Ozone&reg; Atlas 25 ozone generator
Ozone destruction unit
uses a catalyst to convert ozone to oxygen before sending it to the exhaust
system.
Pressure regulator and display
adjusts the pressure of oxygen fed into the ozone generator. The pressure in
the generator must be greater than the pressure in the exhaust.
Check valve
prevents backflow from the exhaust into the generator, if the exhaust pressure
becomes greater than the generator pressure.
Isolation valves
closed when the unit is idle or an interlock is tripped. These valves provide
protection in the event of a leak or failure.
Needle valve
regulates the flow into the ALD chamber.
ALD dose valve
switches the flow going to the ALD chamber.
Rotameter
regulates the flow of oxygen through the ozone generator. This flow
determines the percentage of ozone in oxygen that flows into the process
chamber.
Ozone monitor
model C-30ZX monitor interrupts the interlock chain if it detects an ozone leak
in the cabinet.
3.3
Safety features
3.3.1
Safety interlocks
Opening the cabinet door causes the following actions:
3.3.2

Electrical power to the ozone generator is interrupted. This stops ozone production.

The compressed air supply to the cabinet is disabled. This closes the isolation and
ALD dose valves.
Ozone monitoring
An ozone detector is located inside of the cabinet. The ozone detector is located towards the
bottom of the box, since ozone is denser than air. The detector has an LED display to show
the measured ozone concentration. Table 3-1 explains the LED display.
Table 3-1: Ozone detector LEDs
Ozone Concentration
0 to 0.05 ppm
0.05 to 0.1 ppm
Greater than 0.1 ppm
Printed: 14-Jul-10, 7:09
DESCRIPTION
Page 3-3 of 6
LED Colour
Green
Yellow
Red
Issue 01: July 10
ALD Ozone Delivery System
Oxford Instruments Plasma Technology
Equipment Manual
If the ozone detector measures unsafe concentrations of ozone, it performs the following
actions:

Electrical power to the ozone generator is interrupted. This stops ozone production.

The compressed air supply to the cabinet is disabled. This closes the isolation and
ALD dose valves.

An alarm is displayed on the PC2000 pages on the FlexAL or OpAL system controller.
This stops the recipe that is running on the controller.
NOTE: Electrical power to the ozone generator remains off, even if ozone concentrations
return to safe levels.
3.4
Functional description of the ozone delivery system
Figure 3-2 shows a functional diagram of the ozone delivery system.
Figure 3-2: Functional diagram of the ozone delivery system
When the ozone delivery system is not in use, the three pneumatic valves are closed. This
minimises the risk of oxygen leaking from the system.
When the oxygen input valve opens, oxygen enters the ozone generator. Some of the ozone
produced by the ozone generator passes through the isolation valve into the ozone
destruction system. This converts ozone into oxygen, which then passes into the facility
exhaust. When the ALD rapid dose valve is open, ozone also passes through a needle valve
into the ALD process chamber.
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DESCRIPTION
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3.5
Oxford Instruments Plasma Technology
Equipment Manual
Pneumatic control circuit for the ozone delivery system
Figure 3-3 shows the pneumatic control circuit.
Figure 3-3: Pneumatic control circuit
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DESCRIPTION
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Equipment Manual
Electrical schematic
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DESCRIPTION
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ALD Ozone Delivery System
4
Oxford Instruments Plasma Technology
Equipment Manual
Installation and commissioning
4 Installation and commissioning .............................................................................................. 4-1
4.1 Installation..........................................................................................................................4-2
4.2 Commissioning...................................................................................................................4-3
4.2.1 Initial power-up ...........................................................................................................4-3
4.2.2 Initial set-up procedure ...............................................................................................4-3
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ALD Ozone Delivery System
4.1
Oxford Instruments Plasma Technology
Equipment Manual
Installation
If the Ozone Delivery System is supplied with a FlexAL system, the cabinet is mounted on the
FlexAL system frame (see Figure 4-1).
Figure 4-1: Mounting the cabinet on a FlexAL system
If the Ozone Delivery System is supplied with an OpAL system, the cabinet is mounted on a wall
(see Figure 4-2).
Figure 4-2: Mounting the cabinet on a wall
Refer to section 2 of this manual for a description of the required services.
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ALD Ozone Delivery System
Oxford Instruments Plasma Technology
4.2
Commissioning
4.2.1
Initial power-up
Equipment Manual
When electrical power is first connected to the cabinet, the ozone monitor unit displays a
high alarm reading for between 30 and 60 minutes. This is normal behaviour. Do not attempt
to use the ozone delivery system until the high alarm has disappeared.
If electrical power to the system is interrupted for less than 5 minutes, the ozone monitor will
only require around 5 minutes to warm up. If electrical power is interrupted for more than
five minutes, the high alarm reading may persist for between 30 and 60 minutes.
4.2.2
Initial set-up procedure
Perform the following steps to adjust the pressure regulator:
1)
Open the cabinet door.
2)
Switch the “Power” knob on the control panel of the ozone generator to the
“Off” position.
3)
Rotate the control knob on the pressure regulator fully clockwise.
4)
Close the cabinet door, to enable the interlock switch
5)
Turn on the ozone generator from the process page on the main system PC2000
application. This opens the ozone isolation valves. The ozone generator will not
activate as it is switched off.
6)
Open the cabinet door.
7)
Turn the control knob on the pressure regulator one quarter-turn counterclockwise
8)
Close the cabinet door and note the pressure displayed on the regulator display.
9)
Repeat steps 6) to 8) until the regulator displays a value 0.5 bar above atmospheric
pressure.
Perform the following steps to adjust the rotameter:
1)
Note the flow rate on the rotameter inside the cabinet.
2)
Open the cabinet door.
3)
If the flow rate is greater than 0.1 slpm, rotate the control knob on the rotameter
a small amount clockwise.
4)
If the flow rate is less than 0.1 slpm, rotate the control knob on the rotameter a
small amount counter-clockwise.
5)
Close the cabinet door and wait several seconds until the flow rate through the
rotameter is stable.
6)
Repeat steps 2) to 5) until the flow rate through the rotameter is 0.1 slpm.
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Equipment Manual
Perform the following steps to adjust the needle valve:
1)
Open the cabinet door.
2)
Rotate the control knob on the needle valve fully clockwise to close it.
3)
Close the cabinet door.
4)
Access the PC2000 application on the main system controller.
5)
Evacuate the ALD chamber and leave the system pumping.
6)
Open the ALD dose valve from the PC2000 application.
7)
Note the chamber pressure indicated on the PC2000 Pumping page.
8)
Open the cabinet door.
9)
Rotate the control knob on the needle valve slightly counter-clockwise.
10)
Close the cabinet door and wait until the indicated chamber pressure is stable.
11)
Repeat steps 8) to 10) until the chamber pressure is 30 mTorr (for a FlexAL system)
or 75 mTorr (for an OpAL system).
Perform the following steps to prepare the ozone delivery system for use:
1)
Access the PC2000 application on the main controller.
2)
Stop the ozone generator and close the ALD valve.
3)
Open the cabinet door and switch the “Power” knob on the control panel of the
ozone generator to the “On” position.
4)
Close the cabinet door.
5)
The ozone generator is now ready for use.
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Operating Instructions
5 Operating Instructions............................................................................................................ 5-1
5.1 Introduction........................................................................................................................5-2
5.2 Representation on the PC2000 pages..................................................................................5-2
5.3 Using the ozone delivery system in a recipe ........................................................................5-2
5.4 Faults .................................................................................................................................5-3
5.4.1 Fault displayed on the PC2000 page.............................................................................5-3
Figure 5-1: Ozone panel ................................................................................................................5-2
Figure 5-2: Ozone generator is turned on ......................................................................................5-2
Figure 5-3: Fast ALD valve is open .................................................................................................5-3
Figure 5-4: A fault in the ozone delivery system ............................................................................5-3
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5.1
Oxford Instruments Plasma Technology
Equipment Manual
Introduction
The ozone delivery system is controlled from the PC2000 application on the main system
controller.
5.2
Representation on the PC2000 pages
Figure 5-1 shows the panel used to control the delivery system.
Figure 5-1: Ozone panel
The panel contains the following controls and indicators:
O2 valve
Switches the oxygen supply to the ozone generator.
Ex valve
Switches ozone to the exhaust system.
CH valve
This fast ALD valve switches ozone to the ALD process chamber.
Status panel
Displays status messages.
Ozone generator ON/OFF field
Enter a 1 to turn the generator on. Enter a 0 to turn the generator off.
5.3
Using the ozone delivery system in a recipe
The ozone generator must be turned on from the PC2000 controller at least five minutes
before delivering ozone in a process step. This time period allows the ozone output of the
generator to optimise (see Figure 5-2).
If running a recipe, turn the ozone generator on during the first recipe step.
Figure 5-2: Ozone generator is turned on
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Oxford Instruments Plasma Technology
Equipment Manual
Turn the fast ALD valve (CH) on to admit ozone to the process chamber (see Figure 5-3). For
most processes, use a one second pulse of ozone.
Figure 5-3: Fast ALD valve is open
5.4
Faults
5.4.1
Fault displayed on the PC2000 page
Figure 5-4 shows the ozone panel if a fault has occurred.
Figure 5-4: A fault in the ozone delivery system
A red alert message is generated if the ozone generator is turned on but the generator does
not return an “OK” message within 30 seconds. The red alert stops the process that is
running. The alert message is “The ozone generator output has failed, please check the
generator, power connections and the ozone monitor”.
HAZARDOUS GAS
IF THE OZONE MONITOR DISPLAYS ELEVATED OZONE
CONCENTRATIONS, DO NOT OPEN THE CABINET. WAIT UNTIL A SAFE
LEVEL IS INDICATED ON THE OZONE MONITOR BEFORE OPENING THE
CABINET. IT CAN TAKE SEVERAL HOURS FOR THE OZONE
CONCENTRATION TO DECAY TO SAFE LAVELS.
If the ozone monitor displays an elevated ozone concentration, DO NOT attempt to open the
cabinet. Wait until the monitor indicates a safe ozone concentration before opening the
cabinet. Depending on the levels of ozone within the cabinet, this may take several hours.
If the ozone concentration has not decayed to a safe level after several hours, it is possible
that the ozone monitor has failed.
Perform the following steps to recover the situation:
1)
Check that the ozone generator is powered off.
2)
Put on appropriate personal protective equipment.
3)
Ensure that the area around the cabinet is well ventilated. If necessary, install
temporary extraction for the area.
4)
Open the cabinet door and fault-find the ozone monitor.
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Equipment Manual
OPERATING INSTRUCTIONS
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NOTES:
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ALD Ozone Delivery System
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Equipment Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
6
Maintenance and troubleshooting
6 Maintenance and troubleshooting........................................................................................... 6-1
6.1 Maintenance .......................................................................................................................6-2
6.2 Troubleshooting .................................................................................................................6-2
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MAINTENANCE
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Oxford Instruments Plasma Technology
Equipment Manual
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
6.1
Maintenance
Perform the following checks every month.
6.2
1)
Open the cabinet door.
2)
Observe the colour of the granules in the ozone destruction unit. If the crystals
have changed colour, contact Oxford Instruments Plasma Technology for advice.
The crystals change colour when they are contaminated with moisture.
3)
Check that all VCR and Swagelok connections with the cabinet are tight.
Troubleshooting
SYMPTOM
POSSIBLE CAUSE
Ozone generator cannot be
turned on from the PC2000
page.
Ozone generator is
turned off at the front
panel.
The cabinet door is
open.
Ozone monitor frontpanel switch is off.
Ozone monitor is
displaying a high
reading.
Exhaust pressure is too
high.
Ozone monitor is
warming up.
Check the ozone
generator is turned on.
Ozone level inside the
cabinet is high.
Wait for the ozone level
to decay to a safe level.
Then leak-check the
ozone system.
Wait for 60 minutes. If
the ozone reading has
not fallen, fault-find the
ozone monitor.
Correct the fault.
Ozone generator displays a
“FAULT” message on the
PC2000 page.
System has recently been
powered off and the ozone
monitor is displaying a high
reading.
System has been powered
on for more than 60 minutes
and the ozone monitor is
displaying a high reading.
Ozone monitor is
faulty.
Rotameter is showing zero
flow.
Rotameter flow is incorrect
but not zero.
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Exhaust pressure is too
high.
Needle valve is open
too far.
Rotameter is
incorrectly adjusted.
MAINTENANCE
Page 6-2 of 2
SOLUTION
Close the cabinet door.
Switch the ozone
monitor on.
Fault-find the ozone
monitor (see below).
Correct the fault.
Wait 60 minutes and try
again.
Adjust the needle valve.
Adjust the rotameter.
Issue 01: July 10
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Key Features

Open load configuration
Versatile chamber
Precise film control
Comprehensive manual
Global customer support
Frequently Answers and Questions

What are the potential hazards associated with the OpAL system?

The OpAL system incorporates potentially dangerous components. Before attempting to install, power up, or operate the system, ensure you have read and understood the enclosed System Manual, especially Section 1 (Health and Safety).
What are the main components of the OpAL system?

The OpAL system consists of various components including the ALD reactor, gas pod, pump system, and control system. Refer to the System Manual for detailed descriptions and specifications.
How do I access customer support for the OpAL system?

Oxford Instruments Plasma Technology offers global Customer Support Facilities. Contact your nearest support facility with details such as System Type, Works Order No., and your contact information. Refer to the Preface section of your System Manual for contact details.