Hardware Integration Guide - SSD50NBT.pdf

Hardware Integration Guide - SSD50NBT.pdf

A

Hardware Integration Guide

SSD50NBT

Version 1.0

SSD50NBT

Hardware Integration Guide

R

EVISION

H

ISTORY

Version Date Notes

1.0 27 Mar 2016 Initial Version

Approver

Andrew Chen

Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com

www.lairdtech.com/wireless

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SSD50NBT

Hardware Integration Guide

C

ONTENTS

Scope ..........................................................................................................................................................................4

Introduction ................................................................................................................................................................4

SSD50NBT Features Summary ....................................................................................................................................5

Specifications ..............................................................................................................................................................6

WLAN Functional Description.................................................................................................................................. 10

Bluetooth Functional Description ............................................................................................................................ 14

Block Diagram .......................................................................................................................................................... 15

Electrical Characteristics .......................................................................................................................................... 16

Absolute Maximum Ratings ................................................................................................................................ 16

Recommended Operating Conditions ................................................................................................................. 16

DC Electrical Characteristics ................................................................................................................................ 17

WLAN Radio Receiver Characteristics ................................................................................................................. 19

WLAN Transmitter Characteristics ...................................................................................................................... 20

Bluetooth Radio Characteristics .............................................................................................................................. 22

SDIO Timing Requirements...................................................................................................................................... 24

Pin Definitions ......................................................................................................................................................... 25

Integration Considerations .................................................................................................................................. 28

Boot Strap Options for Wi-Fi Interface .................................................................................................................... 28

Mechanical Specifications ....................................................................................................................................... 29

RF Layout Design Guidelines ................................................................................................................................... 30

Recommended Storage, Handling, Baking, and Reflow Profile............................................................................... 31

Required Storage Conditions ............................................................................................................................... 31

Baking Conditions ................................................................................................................................................ 32

Surface Mount Conditions ................................................................................................................................... 32

Regulatory ............................................................................................................................................................... 35

Certified Antennas ............................................................................................................................................... 35

FCC and IC Regulatory ............................................................................................................................................. 35

FCC ....................................................................................................................................................................... 36

Industry Canada ................................................................................................................................................... 37

European Union Regulatory .................................................................................................................................... 40

EU Declarations of Conformity ................................................................................................................................ 40

Ordering Information .............................................................................................................................................. 41

General Comments .............................................................................................................................................. 41

Labeling Requirements .................................................................................................................................... 42

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SSD50NBT

Hardware Integration Guide

Scope

This document describes key hardware aspects of the Laird SSD50NBT system in package (SIP) modules providing either SDIO or USB bus interface for WLAN connection and UART/PCM for Bluetooth

®

connection. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document is drawn from a number of sources and includes information found in the Qualcomm Atheros (QCA) QCA6004 and Cambridge Silicon Radio Ltd. (CSR) CSR8811 A08 data sheets issued in July 2011, along with other documents provided from QCA and CSR.

Note that the information in this document is subject to change. Please contact Laird to obtain the most recent version of this document.

I

NTRODUCTION

General Description

The SSD50NBT SIP module is an integrated, small form factor 2x2 MIMO 802.11 a/b/g/n WLAN plus Bluetooth 4.0 dual mode device that is optimized for lowpower mobile devices. The integration of all WLAN and Bluetooth functionality in a single package supports low cost and simple implementation along with flexibility for platform-specific customization.

This device is pre-calibrated and integrates the complete transmit/receive RF paths including baluns, mobile phone coexistence band pass filter, diplexer, switches, power amplifier, low noise amplifier, and reference crystal oscillator.

The SSD50NBT device supports Bluetooth 2.1 + EDR and Bluetooth 4.0 (Bluetooth

Low Energy or BLE). The device’s low power consumption radio architecture and proprietary power save technologies allow for extended battery life.

In addition, its dual 802.11 and Bluetooth radio includes full digital MAC and baseband engines that handle all

802.11 CCK/OFDM® 2.4/5GHz, and Bluetooth basic rate and EDR baseband and protocol processing.

Dual embedded low-power CPU cores minimize host loading and maximize flexibility to support customer specific use cases.

The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by Laird is under license.

Other trademarks and trade names are those of their respective owners.

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SSD50NBT

Hardware Integration Guide

SSD50NBT F

EATURES

S

UMMARY

The Laird SSD50NBT device features are described in Table 1 .

Table 1: SSD50NBT features

Feature Description

Radio Front End

Integrates the complete transmit/receive RF paths including baluns, coexistence band pass filter, diplexer, switches, power amplifier, low noise amplifier, and reference crystal oscillator.

Enhanced WLAN/BT

Coexistence

Algorithms

Enhanced important use cases including:

 PCM/I2S digital audio interface

 BT stereo audio (A2DP)

 BT data transfer profiles (such as OPP and FTP)

 BT2.1+EDR

 BT-LE

Flexible radio architecture ensures simple customization for future use cases.

Power Management

Uses power-saving techniques including:

 Gating clocks to idle or inactive blocks

 Fast start and settling circuits to reduce Tx power

 Active duty cycles

 CPU frequency scaling

Pre-Calibration

RF system tested and calibrated in production.

Internal Sleep Clock Integrated on-chip low power sleep clock to regulate internal timing.

Multiple Interface

Support

Advanced 802.11n

Reference

Frequency

 SDIO 2.0 (50 MHz, 4-bit and 1-bit) or USB for WLAN

 HS-UART for Bluetooth HCI (compatible with any upper layer Bluetooth stack)

 Half Guard Interval and Frame Aggregation for high throughput

 Space Time Block Coding (STBC) Rx for improved downlink robustness over range

 Low Density Parity Check (LDPC) for improved uplink and downlink robustness over range

 Incorporates a 26 MHz reference frequency source in package

 Sleep regulated and gated to enable the internal crystal to be powered down when the device is in sleep mode

 BT shares the clock from the Wi-Fi chip

 Wi-Fi cannot be turned off or in reset when running BT

Advanced WLAN

Host Offloading

(WLAN)

Includes the following advanced WLAN features:

 IEEE 802.11e QoS, Wi-Fi Alliance

WMM Power Save, and 802.11n power saving compliance

 AES, AES-CCMP, TKIP engines for faster data encryption

 Cisco CCXv4 ASD, WPS support

 Standard WEP/WPA/WPA2 for personal and enterprise environments

 Self-managed power state handling

 Self-contained beacon processing

 Shared authentication

 Ad-hoc power save

 Multiple PMK ID support

 Simulated UAPSD

 T-Spec support

 Production flow diagnostics

 3-wire scheme for Wi-Fi and BT support

 WWR, 802.11d, 802.11h support

 Wi-Fi Direct (Peer-to-Peer)

 RTT for indoor positioning

 Statistics and events for monitoring coexistence.

Integrates extensive hardware signal processing and an embedded on-chip CPU to offload complete

11n MAC/BB/PHY processing to minimize host processor loading and support application specific customization.

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SSD50NBT

Hardware Integration Guide

Feature

Advanced Bluetooth

Description

 High-speed UART port (up to 4 Mbps)

 HFP v1.6 wide-band speech supported on-chip

 On-chip encoding of SBC and aptX® codecs for A2DP music streaming

 PCM/I2S digital audio interface

 Support for IEEE 802.11 coexistence

 The flexible RAM/ROM based architecture enables custom or future profiles to be easily added.

S

PECIFICATIONS

Table 2: Specifications

Feature

Physical Interface

Wi-Fi Interface

Bluetooth Interface

Main Chip

Input Voltage Requirements

I/O Signaling Voltage

Average Current Consumption,

VDDIO = 3.3 volts

(At maximum transmit power setting)

Note: Reset refers to the radio are in reset, both Wifi and BT reset are asserted.

Note: MIMO measurements are generally higher than Single

Stream.

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Description

64-pin LGA package

1-bit or 4-bit Secure Digital I/O or USB 2.0

Host Controller Interface (HCI) using High Speed UART

Wi-Fi: Qualcomm Atheros QCA6004

BT: Cambridge Silicon Radio Ltd. (CSR) CSR8811 A08

3.3 VDC (3.20V min to 3.46V max)

3.3 VDC ± 5% or 1.8 VDC ± 5%

Single Stream

802.11a (with BT in standby)

@ 18 dBm 6 Mbps

Transmit: 600 mA

Receive: 260 mA

Reset: 0.13 mA

802.11b (with BT in standby)

@ 18 dBm 1 Mbps

Transmit: 460 mA

Receive: 250 mA

Reset: 0.13 mA

802.11g (with BT in standby)

@ 18 dBm 6 Mbps

Transmit: 450 mA

Receive: 250 mA

Reset: 0.13 mA

802.11n (2.4 GHz) (with BT in standby)

@ 14 dBm MCS7

Transmit: 340 mA

Receive: 250mA

Reset: 0.13 mA

802.11n (5 GHz) (with BT in standby)

@ 14 dBm MCS7

Transmit: 490 mA

Receive: 260 mA

Reset: 0.13 mA

Bluetooth (with Wi-Fi in standby)

Transmit: 85 mA

Receive: 70 mA

Reset: 0.13 mA

MIMO

802.11a (with BT in standby)

@ 18 dBm 6 Mbps

Transmit: 900 mA

Receive: 140 mA

Reset: 0.13 mA

802.11b (with BT in standby)

@ 18 dBm 1 Mbps

Transmit: 680 mA

Receive: 140 mA

Reset: 0.13 mA

802.11g (with BT in standby)

@ 18 dBm 6 Mbps

Transmit: 710 mA

Receive: 140 mA

Reset: 0.13 mA

802.11n (2.4 GHz) (with BT in standby)

@ 14 dBm MCS7

Transmit: 460 mA

Receive: 140 mA

Reset: 0.13 mA

802.11n (5 GHz) (with BT in standby)

@ 14 dBm MCS7

Transmit: 720 mA

Receive: 140 mA

Reset: 0.13 mA

Bluetooth (with Wi-Fi in standby)

Transmit: 85 mA

Receive: 70 mA

Reset: 0.13 mA

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SSD50NBT

Hardware Integration Guide

Feature

Operating Temperature

Operating Humidity

Description

-30° to 85°C (-22° to 185°F)

10 to 90% (non-condensing)

Storage Temperature

Storage Humidity

-40° to 85°C (-40° to 185°F)

10 to 90% (non-condensing)

Maximum Electrostatic Discharge Conductive 4KV; Air coupled 8KV

Size

16 mm (length) x 16 mm (width) x 2.5 mm (thickness)

Weight

1.20 g

Mounting

Please see the mounting and handling guide.

Wi-Fi Media

Direct Sequence-Spread Spectrum (DSSS)

Complementary Code Keying (CCK)

Orthogonal Frequency Divisional Multiplexing (OFDM)

Bluetooth Media

Frequency Hopping Spread Spectrum (FHSS)

Wi-Fi Media Access Protocol

Carrier sense multiple access with collision avoidance (CSMA/CA)

Network Architecture Types

Infrastructure and ad-hoc

Wi-Fi Standards

IEEE 802.11a, 802.11b, 802.11d, 802.11e, 802.11g, 802.11h, 802.11i, 802.11n,

802.11r

Bluetooth Standards

Bluetooth version 2.1 with Enhanced Data Rate

Bluetooth 4.0 (Bluetooth Low Energy or BLE)

Wi-Fi Data Rates Supported

11a (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps

802.11b (DSSS, CCK) 1, 2, 5.5, 11 Mbps

802.11g (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps

802.11n (OFDM, MCS 0-15)

Full Guard Interval: 6.5,13.0, 19.5, 26.0,39.0,52.0,58.5,65.0, 13.0,26.0,39.0, 52.0,

78.0,104.0,117.0 Mbps

Short Guard Interval: 1.2,14.4,21.7,29.9,43.3,57.8,65.0,72.2, 14.4,28.9,43.3,57.8,

86.7,115.6,130.0,144.4 Mbps

Modulation

BPSK @ 1, 6,9, 6.5, 7.2,13 and 14.4 Mbps

QPSK @ 2, 12, 18, 13, 14.4,19.5, 21.7, 26, 28.9, 39,43.3 Mbps

CCK @ 5.5 and 11 Mbps

16-QAM @ 24, 36,26, 29.9,39,43.3,52,57.8,78,86.7 Mbps

64-QAM @ 48,54,52, 57.8, 58.5, 65,72.2,104.0,115.6,117.0,130.0,144.4 Mbps

802.11n Spatial Streams

2 (2x2 MIMO)

Bluetooth Data Rates Supported

1, 2, 3 Mbps

Bluetooth Modulation

[email protected] 1 Mbps

Pi/[email protected] 2 Mbps

[email protected] 3 Mbps

Regulatory Domain Support

FCC (Americas, Parts of Asia, and Middle East)

ETSI (Europe, Middle East, Africa, and Parts of Asia)

IC (Industry Canada )

MIC (Japan) (formerly TELEC) – Option

KC (Korea) (formerly KCC) – Option

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SSD50NBT

Hardware Integration Guide

Feature

2.4 GHz Frequency Bands

2.4 GHz Operating Channels

(Wi-Fi)

5 GHz Frequency Bands

5 GHz Operating Channels

(Wi-Fi)

Transmit Power

Note: Transmit power on each channel varies according to individual country regulations. All values for lowest data rate is nominal, +/-2 dBm.

Others are +/-2.5 dBm.

Note:

HT40 – 40 Mhz-wide channels

HT20 – 20 MHz-wide channels

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Description

ETSI: 2.4 GHz to 2.483 GHz

FCC: 2.4 GHz to 2.473 GHz

MIC: 2.4 GHz to 2.495 GHz

KC: 2.4 GHz to 2.483 GHz

ETSI: 13 (3 non-overlapping)

FCC: 11 (3 non-overlapping)

MIC: 14 (4 non-overlapping)

KC: 13 (3 non-overlapping)

ETSI

5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)

5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140)

FCC

5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)

5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140

5.725 GHz to 5.825 GHz(Ch 149/153/157/161/165)

MIC (Japan)

5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)

5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140)

KC

5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)

5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124)

5.725 GHz to 5.825 GHz (Ch 149/153/157/161)

ETSI: 19 non-overlapping

FCC: 24 non-overlapping

MIC: (Japan): 19 non-overlapping

KC: 19 non-overlapping

802.11a

6 Mbps

54 Mbps

802.11b

1 Mbps

11 Mbps

802.11g

6 Mbps

54 Mbps

802.11n (2.4 GHz)

6.5 Mbps (MCS0)

65 Mbps (MCS7)

18 dBm (63 mW)

15 dBm (32 mW)

18 dBm (63 mW)

18 dBm (63 mW)

18 dBm (63 mW)

15 dBm (32 mW)

18 dBm (63 mW)

14 dBm (25 mW)

802.11n (5 GHz)

6.5 Mbps (MCS0;HT20)

65 Mbps (MCS7;HT20)

(MCS0;HT40)

(MCS7; HT40)

Bluetooth

1 Mbps

2 Mbps

3 Mbps

18 dBm (63 mW)

14 dBm (25 mW)

15 dBm (32 mW)

12 dBm (16 mW)

6 dBm (4 mW)

6 dBm (4 mW)

3 dBm (2 mW)

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SSD50NBT

Hardware Integration Guide

Feature

Typical Receiver Sensitivity

Note: All values nominal, +/-3 dBm.

Description

802.11a:

6 Mbps

54 Mbps

802.11b:

1 Mbps

-93 dBm

-75 dBm (PER <= 10%)

11 Mbps

802.11g:

6 Mbps

54 Mbps

802.11n (2.4 GHz)

MCS0 Mbps

-95 dBm

-88 dBm (PER <= 10%)

-92 dBm

-75 dBm (PER <= 10%)

-92 dBm

MCS7 Mbps -72 dBm

802.11n (5 GHz)

MCS0 Mbps

MCS7 Mbps

Bluetooth:

1 Mbps

-93 dBm

-72 dBm

-84 dBm

3 Mbps -76 dBm

(1DH1)

(3DH5)

BLE -87 dBm

Operating Systems Supported

Security

Windows Mobile 5.0, 6.0, 6.1, 6.5

Windows Embedded Compact (CE) 5.0, 6.0, 7.0, 2013

Windows 7, 8, 8.1

Linux 2.6.x, 3.x.x, 4.0.x kernel

Android 4.1.2 (Jellybean) and forward

Standards

Wireless Equivalent Privacy (WEP)

Wi-Fi Protected Access (WPA)

IEEE 802.11i (WPA2)

Encryption

Wireless Equivalent Privacy (WEP, RC4 Algorithm)

Temporal Key Integrity Protocol (TKIP, RC4 Algorithm)

Advanced Encryption Standard (AES, Rijndael Algorithm)

Encryption Key Provisioning

Static (40-bit and 128-bit lengths)

Pre-Shared (PSK)

Dynamic

802.1X Extensible Authentication Protocol Types

EAP-FAST

EAP-TLS

EAP-TTLS

PEAP-GTC

PEAP-MSCHAPv2

PEAP-TLS

LEAP

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SSD50NBT

Hardware Integration Guide

Feature

Compliance

Certifications

Warranty

Description

ETSI Regulatory Domain

EN 300 328 (Wi-Fi®)

EN 300 328 v1.8.1

(BT 2.1)

EN 301 489-1

EN 301 489-17

EN 301 893

EN 60950-1

EU 2002/95/EC (RoHS)

FCC Regulatory Domain

FCC 15.247 DTS – 802.11b/g (Wi-Fi) – 2.4 GHz

FCC 15.407 UNII – 802.11a (Wi-Fi) – 5 GHz

FCC 15.247 DSS – BT 2.1

Industry Canada

RSS-247 – 802.11a/b/g/n (Wi-Fi) – 2.4 GHz, 5.8 GHz, 5.2 GHz, and 5.4 GHz

RSS-247 – BT 2.1

Wi-Fi Alliance

802.11a, 802.11b, 802.11g , 802.11n

WPA Enterprise

WPA2 Enterprise

Cisco Compatible Extensions (Version 4)

Bluetooth

®

SIG Qualification

Five Year Limited Lifetime

All specifications are subject to change without notice

WLAN F

UNCTIONAL

D

ESCRIPTION

Overview

The SSD50NBT WLAN block is based on the Qualcomm-Atheros AR6004 802.11a/b/g/n chipset. It is optimized for low power embedded applications and is configured to operate in dual-band, two-stream (2x2 MIMO) mode.

Its functionality includes:

 Improved throughput on the link due to frame aggregation, RIFS (reduced inter-frame spacing), and half guard intervals.

 Support for STBC (Space Time Block Codes) and LDPC (Low Density Parity Check) codes.

 Improved 11n performance due to features such as 11n frame aggregation (A-MPDU and A-MSDU) and low-overhead host-assisted buffering (RX A-MSDU and RX A-MPDU). These techniques can improve performance and efficiency of applications involving large bulk data transfers such as file transfers or highresolution video streaming.

Other functionality are listed in the following table ( Table 3 ).

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SSD50NBT

Hardware Integration Guide

Table 3: WLAN functions

Feature Description

Reset Control

WLAN_PWD_L and BT_PWD_L pins must be asserted low to reset Wi-Fi and Bluetooth. After these signals are de-asserted, the radio waits for host communication. Until then, all modules except the host interface are held in reset.

Once the host has initiated communication, the radio turns on its crystal and then the PLL. After all clocks are stable and running, the block resets are automatically de-asserted.

Note: Because it derives its clock from WLAN, the Bluetooth function should be powered down/reset whenever WLAN is reset.

After a COLD_RESET event, the SSD50NBT enters the HOST_OFF state and awaits communication from the host. From that point, the typical COLD_RESET sequence is shown below:

Reset Sequence

 When the host is ready to use the radio, it initiates communication via the SDIO.

 The radio enters the WAKEUP state and then the ON state. Embedded software configures the radio functions and interfaces. When the radio is ready to receive commands from the host, it sets an internal function ready bit.

 The host reads the ready bit and sends function commands to the radio.

 The embedded CPU may continue to be held in reset under some circumstances until its reset is cleared by an external pin or when the host clears a register.

Power Transition

Integrated power management and control functions and low power operation for maximum battery life across all operational states by:

 Gating clocks for logic when not needed

 Shutting down unneeded high speed clock sources

 Reducing voltage levels to specific blocks in some states

See

Figure 1

.

Figure 1: Power state transition

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SSD50NBT

Hardware Integration Guide

Feature

Hardware Power

States

Sleep State

Management

Description

The SSD50NBT hardware has five top-level hardware power states managed by the RTC block.

State

OFF

HOST_OFF

SLEEP

WAKEUP

ON

Description

 CHIP_PWD_L pin assertion immediately brings the chip to the OFF state.

 Sleep clock is disabled.

 No state is preserved.

 WLAN is turned off. The Bluetooth clock is off but should also be powered down through BT_PWD_L.

 Only the host interface is powered on. The rest of the chip is power gated

(off).

 The host instructs the SSD50NBT to transition to WAKEUP by writing a register in the host interface domain.

 The embedded CPU and WLAN do not retain state (separate entry).

 For USB, this state can be bypassed by asserting FORCE_HOST_ON_L during

CHIP_PWD_L de-assertion.

 Only the sleep clock is operating.

 The crystal or oscillator is disabled.

 Any wakeup events force a transition from this state to the WAKEUP state.

 All internal states are maintained.

 The system transitions from sleep states to ON.

 The high frequency clock is gated off as the crystal or oscillator is brought up and the PLL is enabled.

 WAKEUP duration is programmable.

 The high speed clock is operational and sent to each block enabled by the clock control register.

 Lower level clock gating is implemented at the block level, including the CPU, which can be gated off using the WAITI instruction while the System is on.

 No CPU, host, and WLAN activities transition to sleep states. WLAN must be initialized prior to Bluetooth initialization and use.

Sleep state minimizes power consumption while saving system states. In sleep state, all high speed clocks are gated off and the external reference clock source is powered off.

The system remains in sleep state until a WAKEUP event causes the system to enter WAKEUP state, waits for the reference clock source to stabilize, and then un-gates all enabled clock trees. The embedded CPU wakes up only when an interrupt arrives, which may have also generated the system

WAKEUP event.

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SSD50NBT

Hardware Integration Guide

Feature

System Clocking

(RTC Block)

Description

The SSD50NBT has an RTC block which controls the clocks and power going to other internal modules.

Its inputs consist of sleep requests from these modules and its outputs consists of clock enable and power signals which are used to gate the clocks going to these modules. The RTC block also manages resets going to other modules with the device. The SSD50NBT’s clocking is grouped into two types: high-speed and low-speed.

High Speed Clocking

The reference 26 MHz clock source inside the SSD50NBT drives the PLL and RF synthesizer of Wi-Fi and

Bluetooth. To minimize power consumption, the reference clock source is powered off in SLEEP,

HOST_OFF, and OFF states.

Low Speed Clocking

On Wi-Fi operation, the SSD50NBT does not need an external sleep clock source. Instead, an internal ring oscillator is used to generate a low frequency sleep clock. It is also used to run the state machines and counters related to low power states. The SSD50NBT has an internal calibration module which produces a 32.768 KHz output with minimal variation. For this, it uses the reference clock source as the golden clock. As a result, the calibration module adjusts for process and temperature variations in the ring oscillator when the system is in ON state.

The Bluetooth section shares the clock from the Wi-Fi chip. It is not able to get into deep sleep mode without 32KHz present at pin-24. Without get into deep sleep mode, it consumes 3.3 mA at VDD_BT supply. In order to have the Bluetooth device get into deep sleep mode, a 32.768 KHz slow clock is a must on pin-24. When 32.768 KHz is present on pin-24, the Bluetooth chip can go into deep sleep mode with 0.08 mA current consume on VDD_BT supply.

Interface Clock

The host interface clock represents another clock domain for the SSD50NBT. This clock comes from the

SDIO and is independent from the other internal clocks. It drives the host interface logic as well as certain registers which can be accessed by the host in HOST_OFF and SLEEP states.

MAC/BB/RF Block

The SSD50NBT Wireless MAC consists of five major blocks:

 Host interface unit (HIU) for bridging to the AHB for bulk data accesses and APB for register accesses

 Ten queue control units (QCU) for transferring Tx data

 Ten DCF control units (DCU) for managing channel access

 Protocol control unit (PCU) for interfacing to baseband

 DMA receive unit (DRU) for transferring RxX data

Baseband Block

Clock Sharing

The SSD50NBT baseband module (BB) is the physical layer controller for the 802.11b/g/n air interface.

It is responsible for modulating data packets in the transmit direction and detecting and demodulating data packets in the receive direction. It has a direct control interface to the radio to enable hardware to dynamically adjust analog gains and modes.

Clock sharing is implemented on the SSD50NBT. The Bluetooth chip (CSR8811) receives a reference clock from the Wi-Fi chip (QCA6004). When Wi-Fi is in power off/reset state, Bluetooth is also off.

32.768KHz slow clock is needed for BT to get into deep sleep mode.

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SSD50NBT

Hardware Integration Guide

B

LUETOOTH

F

UNCTIONAL

D

ESCRIPTION

The SSD50NBT Bluetooth (BT) block is based on CSR8811A08 and described in the following table ( Table 4 ).

Table 4: Bluetooth functions

Feature Description

HCI-UART Interface

PCM or I2S Interface

CPU and Memory

The UART Interface is a standard high-speed UART interface. It operates up to 4 Mbps, supporting Bluetooth HCI UART interface.

 Continuous PCM encoded audio data transmission and reception over Bluetooth.

 Processor overhead reduction through hardware support for continual transmission and reception of PCM data.

 A bidirectional digital audio interface that routes directly into the baseband layer of the firmware. It does not pass through the HCI protocol layer.

 Hardware on CSR8811 for sending data to and from a SCO connection.

 Up to three SCO connections on the PCM interface at any one time.

 PCM interface master, generating PCM_SYNC and PCM_CLK.

 PCM interface slave, accepting externally generated PCM_SYNC and PCM_CLK.

 Various clock formats including:

– *Long Frame Sync

– *Short Frame Sync

 GCI timing environments

 13-bit or 16-bit linear, 8-bit μ-law or A-law companded sample formats.

 Receives and transmits on any selection of three of the first four slots following

PCM_SYNC.

 The PCM configuration options are enabled by setting SKEY_PCM_CONFIG32.

The CSR8811 uses a 16-bit RISC MCU for low power consumption and efficient use of memory.

The MCU, interrupt controller, and event timer run the Bluetooth software stack and control the

Bluetooth radio and host interfaces.

56 KB of on-chip RAM is provided to support the RISC MCU and is shared between the ring buffers used to hold voice/data for each active connection and the general-purpose memory required by the Bluetooth stack.

5 Mb of Internal ROM memory is available on the CSR8811. This memory is provided for system firmware, storing CSR8811 settings and program code.

Build-in Standard WLAN

Coexistence

The SSD50NBT supports internally the standard WLAN coexistence interface through the

WLAN_ACTIVE, BT_PRIORITY, and BT_ACTIVE pins.

Reference Clock

The BT block is configured for 26 MHz reference clock frequency. The clock source is provided to

BT internally from the WLAN block on demand from BT_CLK_REQ.

Note:

The WLAN block must be initialized prior before BT clock sharing is enabled.

BT Low Energy

Reset

The SSD50NBT supports Low Energy specification which allows for connection to devices with single mode LE function (such as a watch, sensor, and HID). The implementation is optimized for coexistence with WLAN.

The pin BT_PWD_L resets and powers down the BT block.

Holding the BT_PWD_L pin at GND turns off the entire BT block; all state information is lost. To ensure a full reset, the reset signal should be asserted for a period greater than

5 milliseconds.

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SSD50NBT

Hardware Integration Guide

Feature

Radio

BT wake up Host

SDIO_IOVDD

Description

The Bluetooth radio shares the single antenna port with the WLAN through an internal 3-way RF switch. The SSD50NBT implements WLAN/BT coexistence internally.

VDDIO is to set the I/O voltage internally with either 1.8 V or 3.3 V to ensure same voltage level for the internal Wi-Fi and BT coexistence signal. Refer to the reference design specifications for details.

PIO-3 is reserved for BT to wake host from deep sleep mode.

WLAN host IO (SDIO) power supply input 1.8V or 3.3V.

B

LOCK

D

IAGRAM

Note: Refer to the Specifications table for the Wi-Fi transmitter frequencies.

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SSD50NBT

Hardware Integration Guide

E

LECTRICAL

C

HARACTERISTICS

Absolute Maximum Ratings

Table 5 summarizes the absolute maximum ratings and Table 6 lists the recommended operating conditions for

the

SSD50NBT

. Absolute maximum ratings are those values beyond which damage to the device can occur.

Functional operation under these conditions, or at any other condition beyond those indicated in the operational sections of this document, is not recommended.

Note: Maximum rating for signals follows the supply domain of the signals.

Table 5: Absolute maximum ratings

Symbol (Domain)

SDIO_IOVDD

VDDIO (Wi-Fi and BT)

VDD33;VDD33_FEM

BT_VDD

VDD12_USB, DVDD12,

AVDD12

Storage

ANT1; ANT2

ESD

Parameter

WLAN host SDIO interface I/O supply

Max Rating

-0.3 to 4.0

WLAN and BT I/O configuration power supply -0.3 to 4.0

External 3.3V power supply -0.3 to 4.0

BT Power core supply

WLAN 1.2V power supply

3.6

-0.3 to 1.32

Storage Temperature

Maximum RF input (reference to 50-Ω input)

Electrostatic discharge tolerance

Recommended Operating Conditions

Table 6: Recommended Operating Conditions

Symbol (Domain) Parameter

SDIO_IOVDD WLAN host interface I/O supply

VDDIO (Wi-Fi and BT)

VDD33

BT_VDD

VDD12_USB, DVDD12,

AVDD12

T-ambient

WLAN and BT GPIO I/O power supply

External 3.3V power supply

BT core supply

WLAN 1.2V power supply

Ambient temperature

-40 to +85

+10

2000

Unit

V

V

V

V

V

°C dBm

V

Min Typ Max Unit

1.71/3.2 1.8/3.3 1.89/3.46 V

1.71/3.2 1.8/3.3 1.89/3.46 V

3.2

3.2

1.20

-30

3.30

3.30

1.26

25

3.46

3.46

1.32

85

V

V

V

°C

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DC Electrical Characteristics

Table 7 and Table 8 list the general DC electrical characteristics over recommended operating conditions (unless

otherwise specified).

Table 7: General DC electrical characteristics (For 3.3V I/O operation)

Symbol Parameter Conditions

VIH High Level Input Voltage

VIL

IIL

VOH

VOL

Low Level Input Voltage

Without Pullup or Pulldown

Input

Leakage

Current

With Pull-up

With Pull-down

High Level Output Voltage

Low Level Output Voltage

0V < VIN < VDD

0V < VOUT< VDD

0 V < VIN < VDD

0V < VOUT < VDD

0V < VIN < VDD

0V < VOUT < VDD

IOH = -4mA

IOH = -12mA

IOH = 4mA

IOH = 12mA

Table 8: General DC electrical characteristics (For 1.8V I/O operation)

Symbol Parameter Conditions

VIH High Level Input Voltage

VIL

IIL

Low Level Input Voltage

Input

Leakage

Current

Without Pull-up or Pull-down

With Pull-up

0V < VIN < VDD

0V < VOUT < VDD

0V < VIN < VDD

0V < VOUT < VDD

VOH

With Pull-down 0V < VIN < VDD

0V < VOUT < VDD

High Level Output Voltage IOH = -4mA

IOH = -12mA

VOL Low Level Output Voltage IOH = 4mA

IOH = 12mA

Min

0.7 x VDD

0

16

-14

0.9 x VDD

0.9 x VDD

Min

0.7 x VDD

0

3.5

-6.2

0.9 x VDD

0.9 x VDD

Typ Max Unit

V

0.3 x VDD V

-3

48 nA

µA

-47 µA

V

V

0.1 x VDD V

0.1 x VDD V

Typ Max Unit

V

0.3 x VDD V

-3 nA

13

-23

µA

µA

0.1 x VDD V

0.1 x VDD V

V

V

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SSD50NBT

Hardware Integration Guide

Figure 2: Power On/Off timing

Figure 3: Wi-Fi and BT reset timing

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Table 9: Timing Diagram Definitions

Timing Description

Ta Time between 3.3V (VDD33/BT_VDD/VDD_FEM/VDD_USB) and

VDDIO/SDIO_IOVDD supplies

Tb Time between VDDIO/SDIO_IOVDD supplies valid and WLAN_PWD_L negation.

Note: There are 10K ohm internal Pull-up on SD_D0, SD_D1 and SD_D3.

Tc Time between VDDIO/SDIO_IOVDD supplies valid and

BT_PWD_L negation

Td Time between WLAN_PWD_L assertion and VDDIO/SDIO_IOVDD invalid or time between BT_PWD_L negation and VDDIO/SDIO_IOVDD invalid.

Te Time between VDDIO/SDIO_IOVDD invalid and 3.3V

(VDD33/BT_VDD/VDD_FEM/VDD_USB) invalid.

Tf Time of WLAN_PWD_L assertion during reset or power down period. Both

3.3V (VDD33/BT_VDD/VDD_FEM/VDD_USB) and VDDIO/SDIO_IOVDD should keep ON.

Tg Time of BT_PWD_L assertion during reset or power down period. Both 3.3V

(VDD33/BT_VDD/VDD_FEM/VDD_USB) and VDDIO/SDIO_IOVDD should keep

ON.

Min

0

5

5

0

Unit

µsec

µsec msec

µsec

No requirement

5

5

µsec msec

Important: The SSD50NBT requires SDIO interface lines SD_CMD, SD_D1, and SD_D2 to be high prior to negation of WLAN_PWD_L. Designs should drive these lines high or, if necessary, add external pull-ups to insure proper SDIO configuration on WLAN boot-up. Failure to pull these lines high results in non-functional SDIO interface. These are boot-mode strapping options interpreted by the WLAN CPU on power-on. There is 10K ohm pull high resistor already implemented on SD_D0,

SD_D1, and SD_D3. No external pull-up is required for those three lines.

We suggest that Tb and Tf timing is greater than 5µsec but no longer than 100 msec.

WLAN Radio Receiver Characteristics

Table 10

and Table 11 summarize the WLAN SSD50NBT receiver characteristics.

Table 10: WLAN receiver characteristics for 2.4 GHz signal chain operation

Symbol Parameter Conditions

Frx Receive input frequency range

Srf Sensitivity

CCK, 1 Mbps

CCK, 11 Mbps

OFDM, 6 Mbps

OFDM, 54 Mbps

HT20, MCS0

See Note

3

HT20, MCS7

Radj Adjacent channel rejection

OFDM, 6 Mbps

OFDM, 54 Mbps

See Note

4

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Min

2.412

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Typ

32

16

-95

-88

-92

-75

-92

-72

Max

2.484

Unit

GHz dBm dB

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Symbol Parameter

HT20, MCS0

HT20, MCS7

Conditions

3

Performance data are measured under signal chain operation.

4

Performance data are measured under signal chain operation.

Min Typ

31

14

Max Unit

Table 11: WLAN Receiver Characteristics for 5 GHz Dual Chain Operation

Symbol Parameter Conditions

Frx Receive input frequency range

Srf Sensitivity

OFDM, 6 Mbps

OFDM, 54 Mbps

HT20, MCS0

HT20, MCS7

HT40, MCS0

HT40, MCS7

See Note

5

Radj Adjacent channel rejection

OFDM, 6 Mbps

OFDM, 54 Mbps

HT20, MCS0

See Note

6

HT20, MCS7

5

Performance data are measured under dual chain operation.

6

Performance data are measured under dual chain operation.

WLAN Transmitter Characteristics

Table 12: WLAN transmitter characteristics for 2.4 GHz per chain operation

Symbol Parameter Conditions

Ftx

Transmit output frequency range

Pout

ATx

Output power

11b mask compliant

11g mask compliant

11g EVM compliant

11n HT20 mask compliant

11n HT20 EVM compliant

11n HT20 EVM compliant

Transmit power accuracy at 18 dBm

See Note

7

1Mbps

6Mbps

54Mbps

MCS0

MCS7

MCS15

-

Min

5.15

-

Typ

Min

2.412

22

9

20

19

-93

-75

-93

-72

-87

-67

Max

5.825

Unit

GHz dBm dB

Typ

18

18

15

18

14

14

+ 2.0

Max Unit

2.484 GHz dBm dB

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SSD50NBT

Hardware Integration Guide

Freq.

2412MHz

2442MHz

2472MHz

Mode/Rate (Mbps)

1 Mbps

54 Mbps

HT20 MCS7

1 Mbps

54 Mbps

HT20 MCS7

1 Mbps

54 Mbps

HT20 MCS7

Output Power Per

Chain (dBm)

18dBm

15dBm

14dBm

18dBm

15dBm

14dBm

18dBm

15dBm

14dBm

Typical Current

Consumption Single

Chain (mA)

8

420

350

340

420

350

340

420

350

340

Max. Current

Consumption Single

Chain (mA)

8

560

450

420

560

450

420

560

450

420

Table 13: WLAN transmitter characteristics for 5 GHz per chain operation

Symbol Parameter Conditions

Ftx

Pout

Transmit output frequency range

Output power

11a mask compliant

11a EVM compliant

See Note

6Mbps

54Mbps

3

ATx

11n HT20 mask compliant

11n HT20 EVM compliant

11n HT20 EVM compliant

11n HT40 mask compliant

11n HT40 EVM compliant

11n HT40 EVM compliant

Transmit power accuracy at 18 dBm -

MCS0

MCS7

MCS15

MCS0

MCS7

MCS15

Freq.

Mode/Rate

[Mbps]

Output Power Per

Chain [dBm]

5180MHz

5500MHz

5825MHz

54 Mbps

HT20 MCS7

HT40 MCS7

54 Mbps

HT20 MCS7

HT40 MCS7

54 Mbps

HT20 MCS7

HT40 MCS7

15 dBm

14 dBm

12 dBm

15 dBm

14 dBm

12 dBm

15 dBm

14 dBm

12 dBm

7

Performance data are measured under

single

chain operation.

Typical Current

Consumption Single

Chain (mA)

8

490

450

470

490

450

470

490

450

470

-

Min

5.15

Typ Max Unit

18

15

5.925 GHz

18

14

14

15

12

12

+ 2.0 dBm dB

Max. Current

Consumption Single

Chain (mA)

8

590

560

540

590

560

540

590

560

540

Note: Final TX power values on each channels are limited by the regulatory certification test limit.

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SSD50NBT

Hardware Integration Guide

Note: 2.4 GHz does not support HT40 operation, only 5 GHz support HT40 operation.

B

LUETOOTH

R

ADIO

C

HARACTERISTICS

Table 14 through Table 15 describe the basic rate transmitter performance, enhanced data transmitter

performance, basic rate receiver performance, enhanced rate receiver performance, and current consumption conditions at 25°C.

Table 14: Basic rate transmitter performance temperature at 25°C (3.3V)

Test Parameter Min Typ

Maximum RF Output Power

Frequency Range

20 dB Bandwidth

2

2.4

6

925

Adjacent Channel TX Power F = F0 +

2 MHz

Adjacent Channel TX Power F = F0

+3 MHz

Δf1avg Maximum Modulation

Δf2max Minimum Modulation

–36

–42

Δf2avg/Δf1avg

Initial Carrier Frequency

Drift Rate

Drift (DH1 packet)

Drift (DH5 packet)

140

165

135

0.9

5

5

6

7

Max

2.4835

175

BT Spec.

–6 to +10

2.4 ≤ f ≤ 2.4835

≤ 1000

≤ –20

Unit

dBm

GHz

KHz dBm

≤ –40

140 < Δf1avg < 175

≥ 115

≥ 0.80

≤±75

≤ 20

≤25

≤ 40 dBm

KHz

KHz

KHz

KHz/50 µs

KHz

KHz

Table 15: Enhanced data rate transmitter performance 25°C (3.3V)

Test Parameter Min

Relative Transmit Power –1

Max Carrier Frequency

Stability |wo|

π/4 DQPSK

8 DPSK

Max Carrier Frequency

Stability |wi|

π/4 DQPSK —

Max Carrier Frequency

Stability |w0+wi|

8 DPSK

π/4 DQPSK

8 DPSK

π/4 DQPSK

RMS DEVM

8 DPSK

π/4 DQPSK

Peak DEVM

8 DPSK —

1

2

1.5

6

Typ

3

1

1

1

6

16

15

Max

6

BT Spec.

–4 to +1

≤ ±10

≤ ±75

≤ ±75

≤ 20

≤13

≤ 35

≤ 25

Unit

dBm

KHz

KHz

KHz

%

%

%

%

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SSD50NBT

Hardware Integration Guide

Test Parameter

π/4 DQPSK

99% DEVM

8 DPSK

EDR Differential Phase Encoding

F≥ ± 3MHz

Adjacent Channel Power F = ± 2MHz

F = ±1MHz

Table 16: Basic rate receiver performance at 3.3V

Test Parameter

Sensitivity

Maximum Input

BER ≤ 0.1%

BER ≤ 0.1%

Co-Channel

Carrier-to-Interferer Ratio

(C/I)

Adjacent Channel

(± 1 MHz)

Second Adjacent

Channel (± 2 MHz)

Third Adjacent

Channel (± 3 MHz)

Maximum Level of Intermodulation Interferers

Table 17: Enhanced data rate receiver performance 3.3V

Test Parameter

Min

Min

Min

–20

–39

Sensitivity (BER ≤0.01%)

Maximum Input (BER

≤0.1%)

Co-Channel C/I (BER

≤0.1%)

Adjacent Channel C/I

(BER≤ 0.1%)

Second Adjacent Channel

C/I (BER ≤ 0.1%)

Third Adjacent Channel C/I

(BER ≤ 0.1%)

8 DPSK

π/4 DQPSK

8 DPSK

π/4 DQPSK

8 DPSK

π/4 DQPSK

8 DPSK

π/4 DQPSK

8 DPSK

π/4 DQPSK

8 DPSK

–20

–20

Typ

12

12

99

–60

–28

–32

Typ

–84

-10

-4/-2

-35/-28

-42

-30

Typ Max

–76 -71

10

18

13

20

-9/-6 0

-3/0 5

-42/-28

–30

-28/-22

–25

-45

–40

-39

–33

Max

-78

11

0

–30

–40

-

Max

Bluetooth

Specification

≤ –70

≥ –20

≥ –20

≤ ±13

≤ ±20

≤ 0

≤5

≤ –30

≤ –25

≤ –40

≤ –33

BT Spec.

≤ 30

≤ 20

≥ 99

< –40

≤ –20

≤ –26

BT Spec.

≤ –70

≥ –20

11

0

–30

–40

≥ –39

Unit

dBm dBm dBm dB dB dB dB dB dB dB dB

Unit

dBm dBm dB dB dB dBm

Unit

%

%

% dBm dBm dB

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SSD50NBT

Hardware Integration Guide

SDIO T

IMING

R

EQUIREMENTS

The following figure ( Figure 4 ) and table (

Table 18

) display SDIO default mode timing.

Figure 4: SDIO default mode timing

Note: Timing is based on CL ≤ 40 pF load on CMD and Data.

Table 18: SDIO timing requirements

Symbol

fPP

Parameter

Frequency – Data Transfer mode tWL Clock low time tWH tTLH tTHL tISU tIH

Clock high time

Clock rise time

Min.

0

7

7

-

Clock low time -

Inputs: CMD, DAT (referenced to CLK)

Input setup time

Input hold time

6

2 tODLY

Outputs: CMD, DAT (referenced to CLK)

Output delay time – Data Transfer mode 0

Typ.

-

-

-

-

-

-

-

-

Max.

50

-

-

10

10

-

-

14 ns ns ns

Unit

MHz ns ns ns ns

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SSD50NBT

Hardware Integration Guide

P

IN

D

EFINITIONS

Pin # Name

1

2

3

4

5

6

7

11

12

13

14

15

16

17

18

19

20

GND

VDD33_FEM

VDD33_FEM

8 GND

9 GND

10 GND

GND

ANT_0

(Wi-Fi and BT)

21 GND

22

GND

GND

WIFI_RFKILL

(GPIO-10)

XPABIAS51

ANT_1 (Wi-Fi)

GND

XPABIAS20

BT_PCM_SYNC

BT_PCM_BCLK

BT_PCM_IN

BT_PCM_OUT

XPABIAS50

BT_PWD_L

Type

-

-

I, PU

O

-

Power -

-

-

-

A_IO

-

O

I/O,

PD

I/O,

PD

I, PD

O, PD

O

-

A_IO

-

I, PD

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Voltage

Reference

-

-

SDIO_IOVDD

VDDIO

-

Power -

-

-

-

-

-

VDDIO

VDDIO

VDDIO

VDDIO

VDDIO

VDDIO

-

-

-

VDDIO

Description

Ground

Ground

Reserved for RF disable (RF Kill) feature.

Active Low.

Note: The current does not support it.

# See Boot strap configuration.

Control signal for external 5GHz power amplifier Chain 1.

Ground

3.3V Power for FEM

3.3V Power for FEM

Ground

Ground

Ground

WLAN antenna port

(Chain 1)

Ground

Control signal for external 2GHz power amplifier Chain 0.

PCM interface synchronization control, input for slave, output for master, weak internal pull-down. High on reset, low after reset.

PCM interface bit clock, input for slave, output for master, weak internal pulldown. High on reset, low after reset.

PCM synchronous input, weak internal pull-down.

PCM synchronous output, weak internal pull-down.

Control signal for external 5GHz power amplifier Chain 1.

Ground

WLAN/BT antenna port

(Chain 0)

Ground

BT chip power-down control. Driving this pin active low to power down or to reset the BT chip. Has internal strong pulldown.

Note: Should be low for at least 5 ms for chip reset.

25

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If Not

Used

GND

GND

N/C

N/C

GND

3.3V

3.3V

GND

GND

GND

50 Ωload

GND

N/C

N/C

N/C

N/C

N/C

N/C

GND

50 Ωload

GND

10K PU

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SSD50NBT

Hardware Integration Guide

Pin # Name

23

24

29

30

31

32

33

34

35

36 GND

37 SDIO_DATA_0

38

39

40

41

NC

CLK_32K

25 BT_VDD

26 GND

27 BT_UART_RXD

28 BT_UART_TXD

BT_UART_CTS

BT_UART_RTS

Type

-

I

I, PU

O, PU

I, PU

O, PU

BT_WAKEUP_HOST O

GND

VDDIO

GND

SDIO_CLK

SDIO_DATA_1

SDIO_DATA_2

SDIO_DATA_3

SD_CMD

-

Power

-

I

-

I/O

I/O

I/O

I/O

I/O

Voltage

Reference

-

VDDIO

Power -

- -

VDDIO

VDDIO

VDDIO

VDDIO

VDDIO

-

-

Description

External 32.768KHz input for BT chip.

It is must for BT chip to get deep sleep mode.

BT core power supply input 3.3V

Ground

Bluetooth UART Serial Input

Bluetooth UART Serial Output

Clear-to-send signal for the Bluetooth

UART interface, active low.

Request-to-send signal for the Bluetooth

UART interface, active low.

When BT wakes up from its deep sleep state, it sends an H pulse signal out to

Host. Normally, it is Low state.

Note: The current software does not support it.

Ground

1.8 or 3.3V I/O power configuration.

This is the reference voltage for all I/O signalling pins; it accepts 1.8V or 3.3V from the host.

-

VDDIO

Ground

SDIO Clock

- Ground

SDIO_IOVDD SDIO Data 0, internal 10K pulled-up.

SDIO_IOVDD SDIO Data 1, internal 10K pulled-up.

SDIO_IOVDD

SDIO Data 2.

# See Boot strap configuration.

SDIO_IOVDD SDIO Data 3, internal 10K pulled-up.

SDIO_IOVDD

SDIO Command signal,

# See Boot strap configuration.

42

43

44

SDIO_IOVDD

AVDD_12

DVDD_12

Power

Power

Power

-

-

-

If Not

Used

N/C

Must be used

3.3V

GND

N/C

N/C

N/C

N/C

N/C

N/C

WLAN Host bust SDIO I/O power configuration either 1.8V or 3.3V

1.8V or

3.3V

WLAN internal analogy 1.2V input fed from switching regulator or external 1.2V

DC supply

WLAN internal analogy 1.2V input fed from switching regulator or external 1.2V

DC supply

1.2V

1.2V

GND

1.8V or

3.3V

GND

N/C

GND

N/C

N/C

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SSD50NBT

Hardware Integration Guide

Pin # Name

45

46

47

48

49

51

52

53

58

59

60

61

VDD12_USB

VDD33_USB

VDD12_PMU

USB_D+

USB_D-

50 GND

WLAN_PWD_L

WLAN_TDO

AR6004_GPIO38

54 LTE_COEX3

55 LTE_ACTIVE

62 WCN_PRIORITY

63 GND

Type

Power

Power

Power output

I/O

I/O

-

I, PD

-

I/O

-

-

56 LTE_FRAME_SYNC -

57 VDD33

VDD33

GND

WAKE_ON_WLAN

Power

Power

-

O, PD

DEBUG_UART_TXD O

-

-

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Voltage

Reference

-

-

-

-

-

-

SDIO_IOVDD

SDIO_IOVDD

VDDIO

VDDIO

VDDIO -

VDDIO -

-

-

-

SDIO_IOVDD

SDIO_IOVDD

-

-

Description

If Not

Used

USB interface 1.2V input fed from switching regulator or external 1.2V DC supply.

Note: When Wi-Fi run at USB interface, external 1.2V (400mA max) is required.

USB interface 3.3V input.

Connect to 3.3V

On-Chip 1.2V switching regulator output.

A 10uF 6.3V LOW ESR cap is must to connect to this pin as close as possible.

High speed serial interface, positive input for USB2.0.

High speed serial interface, negative input for USB2.0.

Strobe line for HSIC mode

Ground

WLAN Power down, active low, external

10K pull up is required.

(0= power down, 1=WLAN awake)

Negation samples boot strap pin for SDIO interface mode

Pull High for SDIO

Pull Low for USB

# See Boot strap configuration.

Reserved for LTE coexistence;

Reserved for WiFi LED indicator, Active

High. (Not support Now)

Reserved for LTE coexistence

Reserved for LTE coexistence

Reserved for LTE coexistence

3.3V Power

3.3V Power

Ground

Reserved for Wake-ON-Wireless

(WOW) LAN, WLAN output signal to wake up host, active Low and need external

10K pull up.

Note: The current software does not support it.

WLAN debugging UART TXD (GPIO_11)

# See Boot strap configuration.

Reserved for LTE coexistence

Ground

1.2V

3.3V

10uF

N/C

N/C

GND

10K, PU

N/C

N/C

N/C

N/C

3.3V

3.3V

GND

10K,PU

N/C

N/C

GND

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SSD50NBT

Hardware Integration Guide

Pin # Name

64 XPABIAS21

Type

O

Voltage

Reference

VDDIO

65-

80

GND - -

Description

Control signal for external 2GHz power amplifier Chain 1.

Thermal Ground Pad

(Important for RF performance and thermal dissipation; please flow the reference design)

If Not

Used

N/C

GND

Integration Considerations

The following Wi-Fi information should be taken into consideration when integrating the SSD50NBT:

 When WLAN is communicating via the SDIO bus, the internal switch regulator (1.2V out) can be used to power the SSD50NBT itself. Pin-47 (VDD12_PMU) of the SSD50NBT is the internal PMU output pin that generates 1.2V to provide to AVDD12 (pin-43), DVDD12 (pin-44), and AVDD12_USB (pin-45).

 When WLAN is communicating via the USB bus, an external 1.2 V (maximum rating 400 mA) is needed for to AVDD12 (pin-43), DVDD12 (pin-44), and AVDD12_USB (pin-45). This is due to insufficient power from internal PMU.

 No matter if WLAN is running at SDIO or USB bus, a 10uF, 6.3V low ESR capacitor is always needed directly on pin-47 (VDD12_PMU) as close as possible to the pin.

B

OOT

S

TRAP

O

PTIONS FOR

W

I

-F

I

I

NTERFACE

SSD50NBT provides either SDIO or USB interface for WLAN connection. It is configured per the following table

( Table 19 ).

Table 19: Wi-Fi interface configuration table

Pin No. Pin Name

41

39

SD_CMD

SDIO_DATA_2

38

3

61

52

SDIO_DATA_1

GPIO_10

DEBUG_UART_TXD

WLAN_TDO

SDIO 2.0 USB 2.0

Note

H

H

H

L

N/C

H

L

L

H

L

H

L

-

-

10KΩ Pull High to Avoid Booting into test mode.

Note: It is implemented inside the SSD50NBT. No external pull “H” is needed.

10K Ω Pull “L” to Avoid leakage.

No connection at SDIO bus.

10K Ω Pull “H” to Avoid leakage. Only SDIO

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SSD50NBT

Hardware Integration Guide

Figure 5: Setting when using USB interface Figure 6: Setting when using SDIO interface

M

ECHANICAL

S

PECIFICATIONS

Module dimensions of SSD50NBT are 15 x 15 x 2.5 mm. Detail drawings are shown in Figure 7 .

Figure 7: Module dimension of SSD50NBT

Note: The Wi-Fi MAC address is located on the product label. The BT MAC address is always numerically subsequent to the Wi-Fi MAC address. Therefore, the BT MAC address is the Wi-Fi MAC address plus one.

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SSD50NBT

Hardware Integration Guide

Figure 8: Pad dimensions and pin numbers

T

OP

V

IEW

Recommend minimal via size and placement for grounding and thermal dissipation. Please double the ground via number when using laser via on HID process. More ground via and the use of 1-oz copper is recommended in our design to get better thermal dissipation.

Note: When soldering, the stencil thickness should be ≥ 0.1 mm.

RF L

AYOUT

D

ESIGN

G

UIDELINES

The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into your device.

 Do not run antenna cables directly above or directly below the radio.

 Do not place any parts or run any high speed digital lines below the radio.

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SSD50NBT

Hardware Integration Guide

 If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the devices as far apart from each other as possible. Also, make sure there is at least 25 dB isolation between the Bluetooth antenna and the Wi-Fi antenna.

 Ensure that there is the maximum allowable spacing separating the antenna connectors on the Laird radio from the antenna. In addition, do not place antennas directly above or directly below the radio.

 Laird recommends the use of a double-shielded cable for the connection between the radio and the antenna elements.

 Be sure to put the capacitor on the power pin as close as possible to reduce the radiation issue.

 Use proper electro-static-discharge (ESD) procedures when installing the Laird radio module.

 In order to get maximum throughput when operate at MIMO 2x2, two antennas with at least 25 dB isolation is recommended.

 To avoid negatively impacting Tx power and receiver sensitivity, do not cover the antennas with metallic objects or components.

R

ECOMMENDED

S

TORAGE

, H

ANDLING

, B

AKING

,

AND

R

EFLOW

P

ROFILE

Required Storage Conditions

Prior to Opening the Dry Packing

The following are required storage conditions prior to opening the dry packing:

 Normal temperature: 5~40℃

 Normal humidity: 80% (Relative humidity) or less

 Storage period: One year or less

Note: Humidity means Relative Humidity.

After Opening the Dry Packing

The following are required storage conditions after opening the dry packing (to prevent moisture absorption):

 Storage conditions for one-time soldering:

– Temperature: 5~25℃

– Humidity: 60% or less

– Period: 48 hours or less after opening

 Storage conditions for two-time soldering

Storage conditions following opening and prior to performing the 1 st

reflow:

– Temperature: 5~25℃

– Humidity: 60% or less

– Period: 48 hours or less after opening

Storage conditions following completion of the 1 st

reflow and prior to performing the 2 nd

reflow

– Temperature: 5~25℃

– Humidity: 60% or less

– Period: 48 hours or less after completion of the 1 st

reflow

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SSD50NBT

Hardware Integration Guide

Temporary Storage Requirements after Opening

The following are temporary storage requirements after opening:

 Only re-store the devices once prior to soldering.

 Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using heat-sealing.

The following indicate the required storage period, temperature, and humidity for this temporary storage:

Storage temperature and humidity

Temperature: 5-40°C

Humidity: 80% or less

Temperature: 5-25°C

***

Humidity: 60% or less

Temperature: 5-40°C

Humidity: 80% or less

***

*** - External atmosphere temperature and humidity of the dry packing

Temperature: 5-25°C

Humidity: 60% or less

Storage period

– X1+X2 – Refer to

After Opening the Dry Packing storage requirements.

– Y – Two weeks or less.

Baking Conditions

Baking conditions and processes for the SSD50NBT follow the J-STD-033 standard which includes the following:

 The calculated shelf life in a sealed bag is 12 months at <40℃ and <90% relative humidity.

 Once the packaging is opened, the SiP must be mounted (according to MSL3/Moisture Sensitivity Level 3) within 168 hours at <30℃ and <60% relative humidity.

 If the SiP is not mounted within 168 hours or if, when the packaging is opened, the humidity indicator card displays >10% humidity, then the product must be baked for 48 hours at 125℃ (±5℃).

Surface Mount Conditions

The following soldering conditions are recommended to ensure device quality.

Soldering

Note: When soldering, the stencil thickness should be ≥ 0.1 mm.

Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen environment)

 Measuring point – IC package surface

 Temperature profile:

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SSD50NBT

Hardware Integration Guide

Figure 9: Temperature profile

Cautions When Removing the SIP from the Platform for RMA

 Bake the platform before remove the SIP from the platform. Reference baking conditions.

 Remove the SIP by using a hot air gun. This process should be carried out by a skilled technician.

Suggestion conditions:

 One-side component platform:

– Set the hot plate at 280°C.

– Put the platform on the hot plate for 8~10 seconds.

– Remove the SIP from platform.

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SSD50NBT

Hardware Integration Guide

Two-side components platform:

– Use two hot air guns

– On the bottom side, use a pre-heated nozzle (temperature setting of 200~250°C) at a suitable distance from the platform PCB.

– On the top side, apply a remove nozzle (temperature setting of 330°C). Heat the SIP until it can be removed from platform PCB.

Platform

PCB

Remove Nozzle

SIP

Remove the residue solder under the bottom side of SIP.

Pre-heat

Nozzle

(Not accepted for RMA) (Accepted for RMA analysis)

SIP with residue solder on the bottom SIP without residue solder on the bottom

Remove and clean the residue flux if needed.

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SSD50NBT

Hardware Integration Guide

Precautions for Use

 Opening/handing/removing must be done on an anti-ESD treated workbench.

All workers must also have undergone anti-ESD treatment.

 The devices should be mounted within one year of the date of delivery.

R

EGULATORY

Certified Antennas

Model

Laird MAF94051

Laird/NanoBlade-IP04

Laird/MAF95310 Mini Nano Blade

Flex

Laird/NanoBlue-IP04

Ethertronics/WLAN_1000146

Type

Dipole

PCB

Dipole

PCB

Dipole

PCB

Dipole

Isolated

Magnetic

Dipole

Connector

RP-SMA

IPEX MHF

IPEX MHF

IPEX MHF

IPEX MHF

2400~2483.5MHz

5150~5250MHz 5250~5350MHz

5470~5725MHz 5725~5850MHz

2.1 dBi (2.4-2.5 GHz), 2.4 dBi (4.9 GHz)

2.6 dBi (5.25 GHz), 3.4 dBi (5.875 GHz)

2 dBi (2.4-2.5 GHz),

3.9 dBi (5.15-5.35 GHz), 4 dBi (5.6 GHz)

2.79 dBi (2.4 GHz), 3.38 dBi (5 GHz)

2 dBi (2.4 GHz only)

2.5 dBi (2.390-2.490 GHz),

3.5 dBi (4.900-5.100, 5.150-5.350,

5.70-5.900 GHz)

FCC

AND

IC R

EGULATORY

Model

SSD50NBT

US/FCC

SQG-SSD50NBT

CANADA/IC

3147A-SSD50NBT

The SSD50NBT has been designed to pass certification with the antenna listed below. The required antenna impedance is 50 ohms.

Peak gain ( dBi )

Model Type Connector

2400~2483.5

MHz

5150~5250

MHz

5250~5350

MHz

5470~5725

MHz

5725~5850

MHz

Laird

MAF94051

Laird

NanoBlade-IP04

Laird

MAF95310 Mini

NanoBlade Flex

Laird

NanoBlue-IP04

Dipole RP-SMA

PCB Dipole IPEX MHF

2.1 dBi

2 dBi

PCB Dipole IPEX MHF 2.79 dBi

PCB Dipole IPEX MHF 2dBi

2.4 dBi 2.6 dBi

3.9 dBi

3.38 dBi

_

3.4 dBi

4 dBi

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SSD50NBT

Hardware Integration Guide

Model Type

Peak gain ( dBi )

Connector

2400~2483.5

MHz

5150~5250

MHz

5250~5350

MHz

5470~5725

MHz

5725~5850

MHz

Ethertronics

WLAN_1000146

Isolated

Magnetic

Dipole

IPEX MHF 2.5dBi

FCC

Federal Communication Commission Interference Statement

3.5 dBi

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part

15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

 Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and receiver.

 Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

 Consult the dealer or an experienced radio/TV technician for help.

FCC Caution:

Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Important Note:

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body.

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Country Code selection feature to be disabled for products marketed to the US/Canada.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20 cm is maintained between the antenna and users, and

The transmitter module may not be co-located with any other transmitter or antenna,

For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G band by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to

Regulatory Domain change.

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SSD50NBT

Hardware Integration Guide

As long as the three conditions above are met, further transmitter testing will not be required. However, the

OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Important Note:

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID: SQG-SSD50NBT.

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

Industry Canada

Industry Canada Statement

This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions:

 This device may not cause interference; and

 This device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes:

 l’appareil ne doit pas produire de brouillage;

 l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.

This radio transmitter (IC: 3147A-SSD50NBT) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Le présent émetteur radio (IC: 3147A-MSD50NBT) a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

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SSD50NBT

Hardware Integration Guide

Antenna Information

Model Type

Peak gain ( dBi )

Connector

2400~2483.5

MHz

5150~5250

MHz

5250~5350

MHz

5470~5725

MHz

5725~5850

MHz

Laird

MAF94051

Laird

NanoBlade-IP04

Laird

MAF95310 Mini

NanoBlade Flex

Laird

NanoBlue-IP04

Ethertronics

WLAN_1000146

Dipole RP-SMA

PCB Dipole IPEX MHF

2.1 dBi

2 dBi

PCB Dipole IPEX MHF 2.79 dBi

PCB Dipole IPEX MHF

Isolated

Magnetic

Dipole

IPEX MHF

2dBi

2.5dBi

2.4 dBi 2.6 dBi

3.9 dBi

3.38 dBi

_

3.5 dBi

3.4 dBi

4 dBi

Caution:

(i) The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

(ii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-

5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with EIRP limit;

(iii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-

5850 MHz shall be such that the equipment still complies with the EIRP limits specified for point-to-point and non-point-to-point operation as appropriate; and

Operations in the 5.25-5.35GHz band are restricted to indoor usage only.

Avertissement:

(i) les dispositifs fonctionnant dans la bande de 5150 à 5250MHz sont réservés uniquement pour une utilisation

à l'intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes de satellites mobiles utilisant les mêmes canaux;

(ii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis pour les dispositifs utilisant les bandes de 5250 à 5350MHz et de 5470 à 5725 MHz doit être conforme à la limite de la p.i.r.e;

(iii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis (pour les dispositifs utilisant la bande de 5725 à 5850 MHz) doit être conforme à la limite de la p.i.r.e. spécifiée pour l'exploitation point à point et l'exploitation non point à point, selon le cas;

Les opérations dans la bande de 5.25-5.35GHz

sont limités à un usage intérieur seulement.

Radiation Exposure Statement

This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body.

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SSD50NBT

Hardware Integration Guide

Déclaration d'exposition aux radiations

Cet équipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrôlé.

Cet équipement doit être installé et utilisé à distance minimum de 20cm entre le radiateur et votre corps.

This device is intended only for OEM integrators under the following condition:

 The transmitter module may not be co-located with any other transmitter or antenna.

As long as the condition above is met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:

 Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.

Important Note:

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.

Note Importante:

Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.

End Product Labeling

The final end product must be labeled in a visible area with the following: Contains IC: 3147A-SSD50NBT.

Plaque signalétique du produit final

Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: Contient des IC: 3147A-

SSD50NBT.

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

Manuel d'information à l'utilisateur final

L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.

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Europe: +44-1628-858-940

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SSD50NBT

Hardware Integration Guide

Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel.

E

UROPEAN

U

NION

R

EGULATORY

The SSD50NBT has been tested for compliance with relevant standards for the EU market. SSD50NBT module was tested with antennas listed below.

Model

Laird MAF94051

Laird/NanoBlade-IP04

Type

Dipole

Connector

RP-SMA

IPEX MHF

2400~2483.5MHz

5150~5250MHz 5250~5350MHz

5470~5725MHz 5725~5850MHz

2.1 dBi (2.4-2.5 GHz), 2.4 dBi (4.9 GHz)

2.6 dBi (5.25 GHz), 3.4 dBi (5.875 GHz)

2 dBi (2.4-2.5 GHz),

3.9 dBi (5.15-5.35 GHz), 4 dBi (5.6 GHz)

Laird/MAF95310 Mini Nano Blade

Flex

Laird/NanoBlue-IP04

Ethertronics/WLAN_1000146

PCB

Dipole

PCB

Dipole

PCB

Dipole

Isolated

Magnetic

Dipole

IPEX MHF

IPEX MHF

IPEX MHF

2.79 dBi (2.4 GHz), 3.38 dBi (5 GHz)

2 dBi (2.4 GHz only)

2.5 dBi (2.390-2.490 GHz),

3.5 dBi (4.900-5.100, 5.150-5.350,

5.70-5.900 GHz)

The OEM should consult with a qualified test house before entering their device into an EU member country to make sure all regulatory requirements have been met for their complete device.

Reference the Declaration of Conformities listed below for a full list of the standards that the modules were tested to. Test reports are available upon request.

EU D

ECLARATIONS OF

C

ONFORMITY

SSD50NBT

Manufacturer:

Product:

EU Directive:

Conformity Assessment:

Laird

SSD50NBT

RTTE 1995/5/EC

Annex IV

Reference standards used for presumption of conformity:

Article Number Requirement

3.1a

Health and Safety

3.1b

Protection requirements with respect to electromagnetic compatibility

Reference standard(s)

EN60950-1:2006+A11:2009+A1:2010+A12:2011

EN 301 489-1 V1.9.2 (2011-09)

EN 301 489-17 V2.2.1 (2012-09)

Emissions:

EN55022:2006/A1:2007 (Class B)

Immunity:

EN61000-4-2:2009

EN61000-4-3:2006/A1:2008/A2:2010

Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com

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Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

SSD50NBT

Hardware Integration Guide

Article Number Requirement

3.2

Means of the efficient use of the radio frequency spectrum

Reference standard(s)

EN 300 328 V1.8.1 (2012-06)

EN 301 893 v1.8.1

O

RDERING

I

NFORMATION

Part Number

SSD50NBT

General Comments

Description

2X2 802.11 a/b/g/n with BT4.0 dual mode module.

This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If in doubt, ask.

Česky

[Czech]

Dansk

[Danish]

Deutsch

[German]

Eesti

[Estonian]

English

Español

[Spanish]

Ελληνική

[Greek]

Français

[French]

Italiano

[Italian]

Latviski

[Latvian]

Lietuvių

[Lithuanian]

Nederlands

[Dutch]

Malti

[Maltese]

[Jméno výrobce] tímto prohlašuje, že tento [typ zařízení] je ve shodě se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.

Undertegnede [fabrikantens navn] erklærer herved, at følgende udstyr [udstyrets

typebetegnelse] overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF.

Hiermit erklärt [Name des Herstellers], dass sich das Gerät [Gerätetyp] in Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der

Richtlinie 1999/5/EG befindet.

Käesolevaga kinnitab [tootja nimi = name of manufacturer] seadme [seadme tüüp = type of

equipment] vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele sätetele.

Hereby, [name of manufacturer], declares that this [type of equipment] is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC.

Por medio de la presente [nombre del fabricante] declara que el [clase de equipo] cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva

1999/5/CE.

ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ [name of manufacturer] ΔΗΛΩΝΕΙ ΟΤΙ [type of equipment]

ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ

ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ 1999/5/ΕΚ.

Par la présente [nom du fabricant] déclare que l'appareil [type d'appareil] est conforme aux exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE.

Con la presente [nome del costruttore] dichiara che questo [tipo di apparecchio] è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE.

Aršo[name of manufacturer /izgatavotājanosaukums] deklarē, ka[type of equipment / iekārtas

tips]atbilstDirektīvas 1999/5/EK būtiskajāmprasībām un citiemar to saistītajiemnoteikumiem.

Šiuo [manufacturer name] deklaruoja, kad šis [equipment type] atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.

Hierbij verklaart [naam van de fabrikant] dat het toestel [type van toestel] in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG.

Hawnhekk, [isem tal-manifattur], jiddikjara li dan [il-mudel tal-prodott] jikkonforma malħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC.

Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com

www.lairdtech.com/wireless

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Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

SSD50NBT

Hardware Integration Guide

Magyar

[Hungarian]

Polski

[Polish]

Português

[Portuguese]

Slovensko

[Slovenian]

Slovensky

[Slovak]

Suomi

[Finnish]

Svenska

[Swedish]

Alulírott, [gyártó neve] nyilatkozom, hogy a [... típus]megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.

Niniejszym [nazwa producenta] oświadcza, że [nazwa wyrobu] jest zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC.

[Nome do fabricante] declara que este [tipo de equipamento] está conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE.

[Ime proizvajalca] izjavlja, da je ta [tip opreme] v skladu z bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES.

[Menovýrobcu]týmtovyhlasuje, že[typzariadenia]spĺňazákladnépožiadavky a všetkypríslušnéustanoveniaSmernice 1999/5/ES.

[Valmistaja = manufacturer] vakuuttaa täten että [type of equipment = laitteen tyyppimerkintä] tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen mukainen.

Härmed intygar [företag] att denna [utrustningstyp] står I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG.

Labeling Requirements

The final end product must be labeled in a visible area with the following notice:

Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com

www.lairdtech.com/wireless

42

© Copyright 2015 Laird. All Rights Reserved

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

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