DG300A

DG300A
DG300AAA
RELIABILITY REPORT
FOR
DG300AAA
(DG300-DG303, DG300A-DG303A)
PLASTIC ENCAPSULATED DEVICES
January 19, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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DG300AAA
Conclusion
The DG300AAA successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
Maxim's DG300-DG303 and DG300A-DG303A CMOS dual and quad analog switches combine low power operation with fast switching times and
superior DC and AC switch characteristics. On-resistance is less than 50 and is essentially constant over the analog signal range. Device
specifications are ideal for battery-powered circuitry. These switches are available in a variety of formats as outlined in the Pin Configurations section
in the full data sheet. The switch control logic inputs are fully TTL and CMOS compatible. Also featured are "break-before-make" switching and low
charge injection. Maxim's DG300-DG303 and DG300A-DG303A families are electrically compatible and pin compatible with the original
manufacturer's devices. All devices operate with power supplies ranging from ±5V to ±18V. Single-supply operation is implemented by connecting Vto GND.
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DG300AAA
II. Manufacturing Information
A. Description/Function:
TTL Compatible CMOS Analog Switches
B. Process:
M6H
C. Number of Device Transistors:
D. Fabrication Location:
Oregon
E. Assembly Location:
PACSEM
F. Date of Initial Production:
Pre 1997
III. Packaging Information
A. Package Type:
10-pin GOLD CAN
B. Lead Frame:
N/A
C. Lead Finish:
Preplated Gold over Nickel
D. Die Attach:
30x30 Au/Si Epoxy
E. Bondwire:
Aluminum (1.25 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-0301-0350
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
IV. Die Information
A. Dimensions:
97 X 101 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
F. Minimum Metal Spacing:
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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DG300AAA
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
MTTF
=
1.83
192 x 4340 x 2134 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 1.7 x 10
= 1.7 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program.
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The AG37 die type has been found to have all pins able to withstand a HBM transient pulse of +/-400 V per JEDEC
JESD22-A114-D. Latch-Up testing has shown that this device withstands a current of +/-100 mA.
Maxim Integrated Products. All rights reserved.
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DG300AAA
Table 1
Reliability Evaluation Test Results
DG300AAA
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
2134
2
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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