HSMS-280x Data Sheet Surface Mount RF Schottky Barrier Diodes Description/Applications

HSMS-280x Data Sheet Surface Mount RF Schottky Barrier Diodes Description/Applications

HSMS-280x

Surface Mount RF Schottky Barrier Diodes

Data Sheet

Description/Applications

These Schottky diodes are specifically designed for both analog and digital applications. This series offers a wide range of specifications and package configurations to give the designer wide flexibility. The HSMS‑280x series of diodes is optimized for high voltage applications.

Note that Avago’s manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match.

Features

Surface Mount Packages

High Breakdown Voltage

Low FIT (Failure in Time) Rate*

Six‑sigma Quality Level

Single, Dual and Quad Versions

Tape and Reel Options Available

• Lead‑free Option Available

* For more information see the Surface Mount Schottky Reli‑ ability Data Sheet.

Package Lead Code Identification, SOT-323

(Top View)

SINGLE

SERIES

Package Lead Code Identification, SOT-363

(Top View)

HIGH ISOLATION

UNCONNECTED PAIR

6 5 4

UNCONNECTED

TRIO

6 5 4

B

COMMON

ANODE

C

COMMON

CATHODE

1 2

K

3

COMMON

CATHODE QUAD

6 5 4

1 2

L

3

COMMON

ANODE QUAD

6 5 4

E

F

1

6

2

M

3

BRIDGE

QUAD

5 4

1

6

2

N

3

RING

QUAD

5 4

Package Lead Code Identification, SOT-23/SOT-143

(Top View)

SINGLE

3

SERIES

3

COMMON

ANODE

3

COMMON

CATHODE

3

1

#3

2 1

#4

2 1

#0

2

UNCONNECTED

PAIR

3 4

1

#2

2

BRIDGE

QUAD

3 4

1

#5

2 1

#8

2

1 2

P

3 1 2

R

3

Pin Connections and Package Marking, SOT-363

1

Notes:

1. Package marking provides orientation and identification.

2. See “Electrical Specifications” for appropriate package marking.

2

6

5

3 4

ESD WARNING:

Handling Precautions Should Be Taken To Avoid Static Discharge.

Absolute Maximum Ratings

[1]

T

C

= 25°C

Symbol

I f

P

IV

T j

T stg

θ jc

Parameter

Forward Current (1 µs Pulse)

Peak Inverse Voltage

Junction Temperature

Storage Temperature

Thermal Resistance

[2]

Unit

Amp

V

°C

°C

°C/W

SOT-23/SOT-143

1

Same as V

BR

150

‑65 to 150

500

SOT-323/SOT-363

1

Same as V

BR

150

‑65 to 150

150

Notes:

1. Operation in excess of any one of these conditions may result in permanent damage to the device.

2. T

C

= +25°C, where T

C

is defined to be the temperature at the package pins where contact is made to the circuit board.

Electrical Specifications T

A

= 25°C, Single Diode

[3]

Part

Number

HSMS [4]

2800

2802

2803

2804

2805

2808

280B

280C

280E

280F

280K

280L

280M

280N

280P

280R O

Test Conditions

AL

H

N

AP

Package

Marking

Code

A0

A2

A3

A4

A5

A8

A0

A2

A3

A4

AK

5

8

3

4

Lead

Code Configuration

0

2

Single

Series

Common Anode

Common Cathode

Unconnected Pair

Bridge Quad [4]

E

F

B Single

C Series

Common Anode

Common Cathode

K

High Isolation

Unconnected Pair

L Unconnected Trio

M Common Cathode Quad

N Common Anode Quad

P Bridge Quad

R Ring Quad

Minimum

Breakdown

Voltage

V

BR

(V)

70

Maximum

Forward

Voltage

V

F

(mV)

410

I

R

= 10 mA I

F

= 1 mA

Maximum

Forward

Voltage

V

F

(V) @ I

F

(mA)

Maximum

Reverse

Leakage

I

R

(nA) @ V

R

(V)

1.0 @ 15 200 @ 50

Maximum

Capacitance

C

T

(pF)

2.0

V

F

= 0 V f = 1 MHz

Notes:

1. DV

F

for diodes in pairs and quads in 15 mV maximum at 1 mA.

2. DC

TO

for diodes in pairs and quads is 0.2 pF maximum.

3. Effective Carrier Lifetime (t) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.

4. See section titled “Quad Capacitance.”

5. R

D

= R

S

+ 5.2Ω at 25°C and I f

= 5 mA.

Typical

Dynamic

Resistance

R

D

(Ω) [5]

35

I

F

= 5 mA

2

Quad Capacitance

Capacitance of Schottky diode quads is measured using an HP4271 LCR meter. This instrument effectively isolates individual diode branches from the others, allowing accurate capacitance measurement of each branch or each diode. The conditions are: 20 mV R.M.S. voltage at 1

MHz. Avago defines this measurement as “CM”, and it is equivalent to the capacitance of the diode by itself. The equivalent diagonal and adjacent capacitances can then be calculated by the formulas given below.

In a quad, the diagonal capacitance is the capacitance between points A and B as shown in the figure below.

The diagonal capacitance is calculated using the follow‑ ing formula

C

DIAGONAL

= _______ + _______

4

C

1

+ C

2

C

3

+ C

4

A

C

1

C

3

C

C

2

C

4

B

The equivalent adjacent capacitance is the capacitance between points A and C in the figure below. This capaci‑ tance is calculated using the following formula

C

ADJACENT

= C

1

C

2

C

3

C

4

This information does not apply to cross‑over quad diodes.

Linear Equivalent Circuit, Diode Chip

R

S

R j

C j

R

S

= series resistance (see Table of SPICE parameters)

C j

= junction capacitance (see Table of SPICE parameters)

R j

=

8.33 X 10

-5

nT

I where b

+ I s

I b

I s

T

= externally applied bias current in amps

= saturation current (see table of SPICE parameters)

= temperature,

°K n = ideality factor (see table of SPICE parameters)

Note:

To effectively model the packaged HSMS-280x product, please refer to Application Note AN1124.

SPICE Parameters

Parameter Units HSMS-280x

V 75 B

V

C

J0

E

G

I

BV

I

S

N

R

S

P

B

P

T

M

V

A

A pF eV

1.08

30

0.65

2

1.6

0.69

E‑5

3.00E‑08

0.5

3

Typical Performance, T

C

= 25°C (unless otherwise noted), Single Diode

100 100,000

10,000

10

1000

1

0.1

0.2

0.3

T

A

T

A

T

T

A

A

= +125

°C

= +75

°C

= +25

°C

= –25

°C

0.01

0 0.1

0.4

0.5 0.6

0.7

0.8

0.9

V

F

– FORWARD VOLTAGE (V)

Figure 1. Forward Current vs.

Forward Voltage at Temperatures.

100

10

1

0 10 20

T

A

T

A

T

A

= +125

°C

= +75

°C

= +25

°C

30 40

V

R

– REVERSE VOLTAGE (V)

Figure 2. Reverse Current vs.

Reverse Voltage at Temperatures.

50

30

10

I

F

(Left Scale)

2

1.5

1

0.5

0

0 10 20 30 40

V

R

– REVERSE VOLTAGE (V)

Figure 4. Total Capacitance vs.

Reverse Voltage.

50

1

V

F

(Right Scale)

30

10

1

0.3

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0.3

V

F

- FORWARD VOLTAGE (V)

Figure 5. Typical V f

Match, Pairs and

Quads.

1000

100

10

1

0.1

1 10 100

I

F

– FORWARD CURRENT (mA)

Figure 3. Dynamic Resistance vs.

Forward Current.

4

Applications Information Introduction—

Product Selection

Avago’s family of Schottky products provides unique solu‑ tions to many design problems.

The first step in choosing the right product is to select the diode type. All of the products in the HSMS‑280x family use the same diode chip, and the same is true of the HSMS‑

281x and HSMS‑282x families. Each family has a different set of characteristics which can be compared most easily by consulting the SPICE parameters in Table 1.

A review of these data shows that the HSMS‑280x family has the highest breakdown voltage, but at the expense of a high value of series resistance (R s

). In applications which do not require high voltage the HSMS‑282x family, with a lower value of series resistance, will offer higher current carrying capacity and better performance. The HSMS‑281x family is a hybrid Schottky (as is the HSMS‑280x), offering lower 1/f or flicker noise than the HSMS‑282x family.

In general, the HSMS‑282x family should be the designer’s first choice, with the ‑280x family reserved for high volt‑ age applications and the HSMS‑281x family for low flicker noise applications.

0.039

0.026

0.026

0.079

0.022

Dimensions in inches

Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323 Products.

Assembly Instructions

SOT-363 PCB Footprint

A recommended PCB pad layout for the miniature SOT‑363

(SC‑70, 6 lead) package is shown in Figure 7 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the perfor‑ mance.

Assembly Instructions

SOT-323 PCB Footprint

A recommended PCB pad layout for the miniature SOT‑323

(SC‑70) package is shown in Figure 6 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance.

0.039

0.079

0.018

Dimensions in inches

Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Products.

Table 1. Typical SPICE Parameters

Parameter Units HSMS-280x HSMS-281x HSMS-282x

I

S

N

B

V

C

J0

E

G

I

BV

R

S

P

B

(V

J

)

P

T

(XTI)

M

V pF eV

A

A

Ω

V

75

1.6

0.69

1 E‑5

3 E‑8

1.08

30

0.65

2

0.5

25

1.1

0.69

1 E‑5

4.8 E‑9

1.08

10

0.65

2

0.5

15

0.7

0.69

1 E‑4

2.2 E‑8

1.08

6

0.65

2

0.5

5

SMT Assembly

Reliable assembly of surface mount components is a com‑ plex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the

SOT package, will reach solder reflow temperatures faster than those with a greater mass.

Avago’s SOT diodes have been qualified to the time‑ temperature profile shown in Figure 8. This profile is representative of an IR reflow type of surface mount as‑ sembly process.

After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones.

The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder.

The rates of change of temperature for the ramp‑up and cool‑down zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (T

MAX

) should not exceed 235°C.

These parameters are typical for a surface mount assem‑ bly process for Avago diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder.

250

200

150

100

50

0

0

Preheat

Zone

60

Figure 8. Surface Mount Assembly Profile.

Reflow

Zone

120 180

TIME (seconds)

Cool Down

Zone

240

T

MAX

300

Part Number Ordering Information

Part Number

HSMS‑280x‑TR2*

HSMS‑280x‑TR1*

HSMS‑280x‑BLK*

No. of

Devices

10000

3000

100 x = 0, 2, 3, 4, 5, 8, B, C, E, F, K, L, M, N, P, R

Container

13” Reel

7” Reel antistatic bag

For lead‑free option, the part number will have the character "G" at the end, eg. HSMS‑280x‑TR2G for a

10,000 lead‑free reel.

6

Package Dimensions

Outline 23 (SOT-23) e2 e1

E

A1 e

XXX

D

B

Notes:

XXX-package marking

Drawings are not to scale

E1

A

L

C

SYMBOL

A

A1

D

E1 e e1

B

C e2

E

L

DIMENSIONS (mm)

MIN.

0.79

0.000

0.37

0.086

2.73

1.15

0.89

1.78

0.45

2.10

0.45

MAX.

1.20

0.100

0.54

0.152

3.13

1.50

1.02

2.04

0.60

2.70

0.69

Outline 143 (SOT-143) e2 e1

B1

E

XXX

E1

A1 e

D

Notes:

XXX-package marking

Drawings are not to scale

B

A

L

C

SYMBOL

A

A1

B

B1

C

D

E1 e e1 e2

E

L

DIMENSIONS (mm)

MIN.

0.79

0.013

0.36

0.76

0.086

2.80

1.20

0.89

1.78

0.45

2.10

0.45

MAX.

1.097

0.10

0.54

0.92

0.152

3.06

1.40

1.02

2.04

0.60

2.65

0.69

Outline SOT-323 (SC-70 3 Lead) e1

E e

XXX

B

D

A1

Notes:

XXX-package marking

Drawings are not to scale

E1

A

L

C

SYMBOL

A

A1

B

E1 e

C

D e1

E

L

DIMENSIONS (mm)

MIN.

0.80

0.00

0.15

MAX.

1.00

0.10

0.40

0.10

1.80

0.20

2.25

1.10

1.40

0.65 typical

1.30 typical

1.80

2.40

0.425 typical

Outline SOT-363 (SC-70 6 Lead)

HE

A1 e

D

E

A2

A

SYMBOL

E

D

HE

A

A2

A1

Q1 e b c

L

DIMENSIONS (mm)

MIN.

1.15

1.80

1.80

0.80

0.80

0.00

1.00

0.10

0.10

0.40

0.650 BCS

0.15

0.10

0.10

0.30

0.20

0.30

MAX.

1.35

2.25

2.40

1.10

Q1 c b L

7

Device Orientation

REEL

USER

FEED

DIRECTION

COVER TAPE

For Outline SOT-143

TOP VIEW

4 mm

CARRIER

TAPE

END VIEW

8 mm

ABC ABC ABC

Note: "AB" represents package marking code.

"C" represents date code.

ABC

For Outlines SOT-23, -323

TOP VIEW

4 mm

END VIEW

8 mm

ABC ABC ABC ABC

Note: "AB" represents package marking code.

"C" represents date code.

For Outline SOT-363

TOP VIEW

4 mm

END VIEW

8 mm

ABC ABC ABC ABC

Note: "AB" represents package marking code.

"C" represents date code.

8

Tape Dimensions and Product Orientation

For Outline SOT-23

P

D

P

2

P

0

E t1

D

1

9

°

MAX

A

0

CAVITY

PERFORATION

CARRIER TAPE

DISTANCE

BETWEEN

CENTERLINE

DESCRIPTION

LENGTH

WIDTH

DEPTH

PITCH

BOTTOM HOLE DIAMETER

DIAMETER

PITCH

POSITION

WIDTH

THICKNESS

CAVITY TO PERFORATION

(WIDTH DIRECTION)

CAVITY TO PERFORATION

(LENGTH DIRECTION)

Ko 8

°

MAX 13.5

°

MAX

B

0

SYMBOL

A

0

B

0

K

0

P

D

1

D

P

E

0

W t1

F

P

2

SIZE (mm)

3.15

2.77

1.22

4.00

±

±

±

±

0.10

0.10

0.10

0.10

1.00 + 0.05

1.50 + 0.10

4.00

1.75

±

±

0.10

0.10

8.00 + 0.30 - 0.10

0.229

±

0.013

3.50

±

0.05

SIZE (INCHES)

0.124

0.109

0.048

0.157

0.039

±

0.004

±

0.004

±

0.004

±

0.004

±

0.002

0.059 + 0.004

0.157

0.069

±

±

0.004

0.004

0.315 + 0.012 - 0.004

0.009

±

0.0005

0.138

±

0.002

2.00

±

0.05

0.079

±

0.002

For Outline SOT-143

P

D

P

0

P

2

E

F

W

D

1 t

1

9

°

MAX

A

0

CAVITY

PERFORATION

CARRIER TAPE

DISTANCE

DESCRIPTION

LENGTH

WIDTH

DEPTH

PITCH

BOTTOM HOLE DIAMETER

DIAMETER

PITCH

POSITION

WIDTH

THICKNESS

CAVITY TO PERFORATION

(WIDTH DIRECTION)

CAVITY TO PERFORATION

(LENGTH DIRECTION)

K

0

9

°

MAX

B

0

SYMBOL

D

P0

E

A0

B0

K0

P

D1

W t1

F

P2

SIZE (mm)

3.19

2.80

1.31

4.00

±

±

±

±

0.10

0.10

0.10

0.10

1.00 + 0.25

1.50 + 0.10

4.00

1.75

±

±

0.10

0.10

8.00 + 0.30 - 0.10

0.254

±

0.013

3.50

±

0.05

SIZE (INCHES)

0.126

0.110

0.052

0.157

±

±

±

±

0.004

0.004

0.004

0.004

0.039 + 0.010

0.059 + 0.004

0.157

0.069

±

±

0.004

0.004

0.315+ 0.012 - 0.004

0.0100

±

0.0005

0.138

±

0.002

2.00

±

0.05

0.079

±

0.002

F

W

9

Tape Dimensions and Product Orientation

For Outlines SOT-323, -363

P

P

0

D

P

2

E

F

W

C t

1

(CARRIER TAPE THICKNESS)

An

A

0

CAVITY

PERFORATION

CARRIER TAPE

COVER TAPE

DISTANCE

ANGLE

DESCRIPTION

LENGTH

WIDTH

DEPTH

PITCH

BOTTOM HOLE DIAMETER

DIAMETER

PITCH

POSITION

WIDTH

THICKNESS

WIDTH

TAPE THICKNESS

CAVITY TO PERFORATION

(WIDTH DIRECTION)

CAVITY TO PERFORATION

(LENGTH DIRECTION)

FOR SOT-323 (SC70-3 LEAD)

FOR SOT-363 (SC70-6 LEAD)

C

T t

F t

W

1

SYMBOL

A

0

B

0

K

0

P

D

1

D

P

E

0

P

2

An

SIZE (mm)

2.40

2.40

1.20

4.00

±

±

±

±

0.10

0.10

0.10

0.10

1.00 + 0.25

1.55

4.00

1.75

±

±

0.05

0.10

±

0.10

8.00

0.254

±

0.30

±

0.02

5.4

±

0.062

0.10

±

0.001

3.50

±

0.05

2.00

±

0.05

8

°

C MAX

10

°

C MAX

SIZE (INCHES)

0.094

0.094

0.047

0.157

±

±

±

±

0.004

0.004

0.004

0.004

0.039 + 0.010

0.061

0.157

0.069

±

±

0.002

0.004

±

0.004

0.315

0.0100

±

0.012

±

0.0008

0.205

0.0025

±

0.004

±

0.00004

0.138

±

0.002

0.079

±

0.002

K

0

D

1

B

0

An

T t

(COVER TAPE THICKNESS)

For product information and a complete list of distributors, please go to our web site:

www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.

Data subject to change. Copyright © 2006 Avago Technologies, Limited. All rights reserved. Obsoletes 5989-4020EN

AV02-0533EN - June 21, 2007

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