TVS Diode Arrays SP3031 Series 0.8pF 10kV Unidirectional Discrete TVS

TVS Diode Arrays SP3031 Series 0.8pF 10kV Unidirectional Discrete TVS
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3031 Series
SP3031 Series 0.8pF 10kV Unidirectional Discrete TVS
RoHS
Pb GREEN
Description
The SP3031 includes low capacitance rail to rail diodes
with an additional Zener diode to provide protection for
electronic equipment that may experience destructive
electrostatic discharges (ESD). These robust diodes can
safely absorb repetitive ESD strikes above the maximum
level specified in the IEC61000-4-2 international standard
without performance degradation. The low loading
capacitance makes it ideal for protecting high speed
data lines.
Pinout
Features
1
• ESD protection of ±10kV
contact discharge,
±15kV air discharge,
(IEC61000-4-2)
• Low capacitance of 0.8pF
@ VR=0V
• EFT, IEC61000-4-4, 40A
(5/50ns)
• 0402 small footprint
available
• L
ow leakage current of
1μA at 5V
• L
ightning protection,
IEC61000-4-5, 5A
(tp=8/20µs)
2
Applications
Functional Block Diagram
1
• USB 2.0, Ethernet
• Smart Phones
• MHL/MIPI/MDDI
• External Storage
• HDMI, Display Port,
eSATA
• Ultrabooks, Notebooks
• Tablets, eReaders
• Set Top Boxes, Game
Consoles
USB2.0 Application Example
2
USB2.0 Port
USB Controller
VBUS
D+
Additional Information
DSP1003
IC
Datasheet
Resources
Samples
SP3031 (x2)
*Package is shown as transparent
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
Signal GND
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3031 Series
Symbol
IPP
Parameter
Parameter
Value
Units
Peak Current (tp=8/20μs)
5.0
A
Storage Temperature Range
°C
Maximum Junction Temperature
°C
Maximum Lead Temperature
(Soldering 20-40s)
TOP
Operating Temperature
TSTOR
Storage Temperature
–40 to 125
–55 to 150
Rating
Units
–55 to 150
°C
150
°C
260
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress only rating and operation of the device at these or any other
conditions above those indicated in the operational sections of this specification is not implied.
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Reverse Standoff Voltage
Test Conditions
Min
6.0
Typ
Max
VRWM
5.0
Reverse Breakdown Voltage
VBR
1R=1mA
Reverse Leakage Current
ILEAK
VR=5V with 1pin at GND
Clamp Voltage1
VC
Dynamic Resistance
Diode Capacitance1
1
µA
6.9
V
IPP=2A, tp=8/20µs, Fwd
7.5
V
(VC2-VC1)/(IPP2-IPP1)
VESD
V
V
IPP=1A, tp=8/20µs, Fwd
RDYN
ESD Withstand Voltage1
Units
0.6
IEC61000-4-2 (Contact)
±10
IEC61000-4-2 (Air)
±15
CI/O-I/O
Ω
kV
kV
Reverse Bias=0V
0.8
pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Capacitance vs. Reverse Voltage
0
1.2
-5
1.0
Capacitance (pF)
Attenuation (dB)
Insertion Loss (S21) I/O to GND
-10
-15
-20
-25
0.8
0.6
0.4
0.2
-30
0.0
-35
10
100
Frequency (MHz)
0.0
1000
1.0
2.0
3.0
DC Bias (V)
Pulse Waveform
Transmission Line Pulsing(TLP) Plot
110%
100%
TLP Current (A)
90%
Percent of IPP
80%
70%
60%
50%
40%
30%
20%
10%
0%
0.0
5.0
10.0
15.0
Time (μs)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
20.0
25.0
30.0
TLP Voltage (V)
4.0
5.0
SP3031
Thermal Information
Absolute Maximum Ratings
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3031 Series
Product Characteristics
Ordering Information
Lead Plating
Pre-Plated Frame or Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Part Number
Package
Marking
Min. Order Qty.
SP3031-01ETG
SOD882
•f
12000
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Part Numbering System
tP
TP
Temperature
Reflow Condition
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
SOD882
G= Green
f
T= Tape & Reel
Series
Number of
Channels
Time
Part Marking System
SP 3031 – 01 E T G
TVS Diode Arrays
(SPA® Diodes)
Critical Zone
TL to TP
Ramp-up
Pin 1 Indicator
Product ID
Package
E: SOD882
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3031 Series
Package Dimensions — SOD882
Symbol
0.325
0.325
0.650
Package
SOD882
JEDEC
MO-236
Millimeters
Inches
Min
Typ
Max
Min
Typ
Max
A
0.90
1.00
1.10
0.035
0.039
0.043
B
0.50
0.60
0.70
0.020
0.024
0.028
C
0.40
0.50
0.60
0.016
0.020
0.024
0.45
D
0.018
0.650
E
0.20
0.25
0.35
0.008
0.010
0.012
0.975
F
0.45
0.50
0.55
0.018
0.020
0.022
Recommanded Soldering
Pad Layout
Embossed Carrier Tape & Reel Specification — SOD882
D evice Orientation in Tape
Pin 1 Location
Notes :
1. All dimensions are in millimeters
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
Symbol
Millimeters
A0
0.70±0.045
B0
1.10±0.045
K0
0.65±0.045
F
3.50±0.05
P1
2.00±0.10
W
8.00 + 0.30 -0.10
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