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NXP BGU703X 1 GHz wideband low-noise amplifier Data Sheet
NXP BGU7031 is a wideband, internally biased, low-noise amplifier designed to excel in high linearity applications between 40 MHz to 1 GHz, suitable for cable and terrestrial STBs, tuner devices, recorders, and home signal distribution systems. With an internally set gain that remains flat between the specified frequency range, it provides a low noise figure of 4.5 dB and high linearity with an IP3 of 29 dBm. Packaged in a compact 6-pin SOT363, this LNA offers simplified handling and reduced space requirements.
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BGU7031
1 GHz wideband low-noise amplifier
Rev. 2 — 7 September 2010 Product data sheet
CAUTION
1.1 General description
The BGU7031 MMIC is a wideband amplifier with internal biasing. It is designed specifically for high linearity, low-noise applications over a frequency range of 40 MHz to
1 GHz. It is especially suited to Set-Top Box applications.
The LNA is housed in a 6-pin SOT363 plastic SMD package.
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling.
1.2 Features and benefits
Internally biased
Flat gain between 40 MHz and 1 GHz
Noise figure of 4.5 dB
High linearity with an IP3
O
of 29 dBm
75
Ω input and output impedance
ESD protection > 2 kV Human Body Model (HBM) on all pins
1.3 Applications
Terrestrial and cable Set-Top Boxes (STB)
Silicon and “Can” tuners
Personal and Digital Video Recorders (PVR and DVR)
Home networking and in-house signal distribution
NXP Semiconductors
BGU7031
1 GHz wideband low-noise amplifier
1.4 Quick reference data
Table 1.
Quick reference data
T amb
= 25
°
C; typical values at V
CC
= 5 V; Z
S
= Z
L
= 75
Ω
; R bias
= 43
Ω
; 40 MHz
≤
f
1
≤
1000 MHz.
Symbol Parameter Conditions Min Typ Max Unit
RF input AC coupled V
CC
I
CC(tot)
T amb
NF supply voltage total supply current ambient temperature noise figure
P
L(1dB) output power at 1 dB gain compression
IP3
O output third-order intercept point
1 GHz
4.75 5.0
5.25 V
-
43 mA
−10 +25 +70 °C
4.5
dB
13 dBm
29 dBm
[1] I
CC(tot)
is configurable with external resistor.
[2] The fundamental frequency (f
2
× f
2
− f
1
, where f
2
= f
1
1
) lies between 40 MHz and 1000 MHz. The intermodulation product (IM3) is
± 1 MHz. Input power P i
=
−10 dBm.
4
5
6
1
2
3
Table 2.
Pinning
Pin Description
RF_OUT
V
CC n.c.
n.c.
GND
RF_IN
Simplified outline Graphic symbol
6 5 4 3 2
6 1
1 2 3
5 4 sym141
Table 3.
Ordering information
Type number Package
BGU7031 -
Name Description plastic surface-mounted package; 6 leads
4. Marking
Table 4.
Marking codes
Type number
BGU7031
Marking code
SC%
Note: % character indicates the location of production.
Version
SOT363
BGU7031
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 September 2010
© NXP B.V. 2010. All rights reserved.
2 of 10
NXP Semiconductors
BGU7031
1 GHz wideband low-noise amplifier
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
V
CC
I
CC(tot)
P tot
P i
T stg
T j
T amb
V
ESD supply voltage total supply current total power dissipation T sp input power storage temperature junction temperature ambient temperature electrostatic discharge voltage
Conditions
RF input AC coupled configurable with external resistor
≤ 100 °C single tone
Human Body Model (HBM); according to JEDEC standard
22-A114E
[1] T sp
is the temperature at the solder point of the ground lead.
-
-
Min Max Unit
−0.6 5.25
V
60 mA
250 mW
10 dBm
-
−65 +150 °C
150
°C
−10 +70 °C
2 kV
Table 6.
Thermal characteristics
Symbol Parameter
R th(j-sp) thermal resistance from junction to solder point
Conditions Typ
240
Unit
K/W
7. Characteristics
Table 7.
Characteristics
T amb
= 25
°
C; typical values at V
CC
= 5 V; Z
S
= Z
L
= 75
Ω
; R bias
= 43
Ω
; 40 MHz
≤
f
1
≤
1000 MHz.
Symbol Parameter Conditions Min Typ Max Unit
V
CC
I
CC(tot)
|s
21
| 2
SL sl
FL
NF
RL in
RL out
P
L(1dB)
IP3
O supply voltage total supply current insertion power gain slope straight line flatness of frequency response noise figure input return loss output return loss output power at 1 dB gain compression output third-order intercept point
RF input AC coupled
1 GHz
-
-
-
-
-
-
-
-
-
4.75 5.0
5.25 V
43 -
10
−1
-
−0.2 -
4.5
-
18 -
12 -
14 -
29 mA dB dB dB dB dB dB dBm dBm
[1] The fundamental frequency (f
2
× f
2
− f
1
, where f
2
= f
1
1
) lies between 40 MHz and 1000 MHz. The intermodulation product (IM3) is
± 1 MHz. Input power P i
=
−10 dBm.
BGU7031
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 September 2010
© NXP B.V. 2010. All rights reserved.
3 of 10
NXP Semiconductors
BGU7031
1 GHz wideband low-noise amplifier
Other applications are possible. Please contact your local sales representative for more information. Application notes are available on the NXP website.
8.1 Application circuit
V
CC
RF_IN
X1
C4 C3 n.c.
3
C1
6
2
4
5 n.c.
Components are listed in
Fig 1.
BGU7031 application circuit
R1 = Rbias
1
L1
C2 X2
RF_OUT
001aam382
All control and supply lines must be decoupled properly. The decoupling capacitors must be placed as close to the device as possible.
8.2 Application circuit board layout
RF_IN
X1
C1
C4
L1
R1
C3
C2
X2
RF_OUT
001aam385
BGU7031
Product data sheet
PCB material = FR4.
PCB thickness = 1.6 mm.
PCB size = 30 mm
× 30 mm.
ε r
= 4.5; thickness of copper layer = 35
μm.
Components are listed in
Fig 2.
BGU7031 application circuit board layout
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 September 2010
© NXP B.V. 2010. All rights reserved.
4 of 10
NXP Semiconductors
BGU7031
1 GHz wideband low-noise amplifier
Table 8.
List of components
See
Component Description
C1, C2 capacitor
C3
C4
L1
R1
X1, X2
Value
10 nF
Remarks capacitor capacitor
10 nF
10
μF chip ferrite bead 1.5 k
Ω
Murata BLM18HE152SN1DF resistor 43
Ω
R bias connector 75
Ω
F-connector, edge mount PCB reflow type, Bomar 861V509ERG
Function
DC blocking decoupling decoupling
RF choke bias setting input/output
[1] L1 and R1 must have a power rating of 0.1 W or higher.
BGU7031
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 September 2010
© NXP B.V. 2010. All rights reserved.
5 of 10
NXP Semiconductors
Plastic surface-mounted package; 6 leads
D B
BGU7031
1 GHz wideband low-noise amplifier
E A X
SOT363 y HE v M A
6 5 4
Q pin 1 index
1 2 e1 e bp
3 w M B
A
A1 c detail X
Lp
0 1 scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT A
A1 max bp c D mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
E
1.35
1.15
e
1.3
e
1
0.65
HE
2.2
2.0
Lp
0.45
0.15
Q
0.25
0.15
v
0.2
w
0.2
y
0.1
OUTLINE
VERSION
SOT363
IEC
REFERENCES
JEDEC JEITA
SC-88
Fig 3.
Package outline SOT363
BGU7031
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 September 2010
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
© NXP B.V. 2010. All rights reserved.
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NXP Semiconductors
BGU7031
1 GHz wideband low-noise amplifier
10. Abbreviations
Table 9.
Abbreviations
Acronym
AC
Description
Alternating Current
DC
LNA
MMIC
PCB
RF
SMD
Direct Current
Low-Noise Amplifier
Monolithic Microwave Integrated Circuit
Printed-Circuit Board
Radio Frequency
Surface-Mounted Device
11. Revision history
Table 10.
Revision history
Document ID
BGU7031 v.2
Modifications:
BGU7031 v.1
Release date Data sheet status Change notice Supersedes
20100907 Product data sheet BGU7031 v.1
•
The status of this data sheet has been changed to Product data sheet.
•
: The minimum value for V
CC
has been added.
20100812 Preliminary data sheet -
BGU7031
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 September 2010
© NXP B.V. 2010. All rights reserved.
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NXP Semiconductors
BGU7031
1 GHz wideband low-noise amplifier
12. Legal information
Document status
[1][2]
Objective [short] data sheet
Product status
[3]
Development
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com
.
12.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or
BGU7031
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 September 2010 malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
© NXP B.V. 2010. All rights reserved.
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NXP Semiconductors
BGU7031
1 GHz wideband low-noise amplifier
Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
13. Contact information
product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGU7031
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 September 2010
© NXP B.V. 2010. All rights reserved.
9 of 10
NXP Semiconductors
14. Contents
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 4
Application circuit . . . . . . . . . . . . . . . . . . . . . . . 4
Application circuit board layout . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
BGU7031
1 GHz wideband low-noise amplifier
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 7 September 2010
Document identifier: BGU7031
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