WEX025664BLPP3N00000

WEX025664BLPP3N00000
OLED SPECIFICATION
Model No:
WEX025664BLPP3N00000
SPECIFICATION
Version
Version:
sion: J
CUSTOMER :
MODULE NO. :
WEX025664BLPP3N00000
APPROVED BY:
( FOR CUSTOMER USE ONLY )
SALES BY
RELEASE DATE:
APPROVED BY
CHECKED BY
PREPARED BY
MODLE NO:
:
RECORDS OF REVISION
VERSION DATE
DOC. FIRST ISSUE
REVISED
SUMMARY
PAGE
NO.
0
2011/11/18
First issue
A
2012/01/11
B
2013/05/23
Correct Electrical Characteristics
& Mechanical Drawing
Correct Brightness
C
2013/06/20
Correct IDD
D
2013/07/22
Correct IDD and Brightness
E
2013/09/17
F
2014/01/10
G
2014/04/24
Correct Module dimension and
Electrical Characteristics and life
time.
Add information of Module Life
Time
Correct contour drawing.
H
2014/05/20
Correct Electrical Characteristics
I
2014/05/30
Correct Electrical Characteristics
J
2014/06/12
Add Low Temperature storage.
WEX025664BLPP3N00000
第 1 頁,共 24 頁
Contents
1.Module Classification Information
2.General Specification
3.Counter Drawing & Block Diagram
4.Interface Pin Function
5.Absolute Maximum Ratings
6.Electrical Characteristics
7.Optical Characteristics
8.OLED Lifetime
9.Reliability
10.Inspection specification
11.Precautions in use of OLED Modules
WEX025664BLPP3N00000
第 2 頁,共 24 頁
1.Module Classification Information
W E X 025664 B L P P 3 N 0 0 000
1
○
1
2
3
4
5
6
7
8
○
○
○
○
○
○
○
Brand:WINSTAR DISPLAY CORPORATION
⑨
⑩
⑪
⑫
⑬
2
E:OLED
3
Display Type:H→Character Type, G→Graphic Type , X→Tab Type ,O→Cog Type
4
5
Dot Matrix: 256 * 64
Serials code
A:Amber
6
Emitting Color
R:RED
B:Blue
C:Full color
G:Green
W:White
Y:Yellow Green
L:Yellow
7
Polarizer
P:With Polarizer; N: Without Polarizer
8
Display Mode
P:Passive Matrix ; A: Active Matrix
9
10
Driver Voltage
Touch Panel
3: 3.0 V; 5: 5.0V
N:Without touch panel; T: With touch panel
0:Standard type
1. Sunlight Readable type
11
Products type
2. Transparent OLED (TOLED)
3. Flexible OLED
4. OLED for Lighting
product grades:
0:Standard(A-level)
12
Product grades
2:B-level
3:C-level
4:high class(AA-level)
5:Customer offerings
13
Serial No.
Application serial number(00~ZZ)
WEX025664BLPP3N00000
第 3 頁,共 24 頁
2.General
2.General Specification
Item
Dimension
Unit
256 x 64 Dots
-
88.0 × 27.8 × 2.05 (mm)
mm
76.778×19.178 (mm)
mm
Pixel Size
0.278×0.278 (mm)
mm
Pixel Pitch
0.3×0.3 (mm)
mm
Dot Matrix
Module dimension
Active Area
Display Mode
Passive Matrix
Display Color
Yellow
Drive Duty
1/64 Duty
IC
SSD1322
WEX025664BLPP3N00000
第 4 頁,共 24 頁
3. Counter Drawing & Block Diagram
88 .0± 0.3 (Panel S ize)
8 8.0 ±0.3(C ap Size)
8 7.0 ±0.3(P olarizer)
10 .0
2 .05
0.7
1 .1
5.0
11.9
A ctive A rea 3 .1 2"
2 56 *64 P ixels
R E M O V E T A PE
T =0.15M ax
29.3
5 .61
20.9
3.0
78 .78 (V A )
7 6.7 78 (A A )
8.0
2.0
19.178(AA)
0.5±0.5
25.8(Cap Size)
24.8±0.3(Polarizer)
4 .61
2 -R 0 .5± 0.05
4 0.0 ±0.1
6 0.0±0 .2
0.278
14 .0
0 .3
0 .2 78
0.3
A
0.3 ±0 .05
0 .8 M A X
4.0
NC
V CC
V L SS
V SL
V CI
NC
V DD
V DD IO
R ES#
IR EF
C S#
FR
B S0
B S1
D C#
E
R /W#
D0
D3
D4
D2
D1
D7
D5
D6
V CC
V L SS
V CO MH
V SS
C on tact S ide
30
0 .3
P 0.5* 29 =1 4.5
A
15 .50
3.0
4.36
4.0
NC
8.7
1
A
1.5
2.6
S tiffener
SSD 13 22
9.2
11.01
P olarizer
19.7±0.3
27.8±0.3(Panel Size)
21.18(VA)
0.5 ±0.5
D O T SIZ E
S C A L E 3 0/1
T he non-specified tolerance of dim ension is
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
N C (G N D )
V SS
VCC
VCOM H
VLSS
D7
D6
D5
D4
D3
D2
D1
D0
E /R D #
R /W #
B S0
B S1
DC#
C S#
RES#
FR
IR E F
NC
V D D IO
VDD
VCI
V SL
VLSS
VCC
N C (G N D )
0.3m m .
FUNCTION BLOCK DIAGRAM
*For more information, please refer to Application Note provided by
Winstar
4. Interface Pin Function
Pin
Number
Symbol
Power Supply
26
VCI
I/O Function
P
25
VDD
P
24
VDDIO
P
2
VSS
P
3,29
VCC
P
5,28
VLSS
P
IREF
I
4
VCOMH
P
27
VSL
P
Driver
22
Power Supply for Operation
This is a voltage supply pin. It must be connected to
external source & always be equal to or higher than VDD
& VDDIO.
Power Supply for Core Logic Circuit
This is a voltage supply pin. It can be supplied externally (within
the range of 2.4~2.6V) or regulated internally from VCI. A
capacitor should be connected between this pin & VSS under
all circumstances.
Power Supply for I/O Pin
This pin is a power supply pin of I/O buffer. It should be
connected to VDD or external source. All I/O signal should have
VIH reference to VDDIO. When I/O signal pins (BS0~BS1,
D0~D7, control signals…) pull high, they should be connected
to VDDIO.
Ground of Logic Circuit
This is a ground pin. It also acts as a reference for the logic
pins. It must be connected to external ground.
Power Supply for OLED Panel
These are the most positive voltage supply pin of the chip. They
must be connected to external source.
Ground of Analog Circuit
These are the analog ground pins. They should be connected
to VSS externally.
Current Reference for Brightness Adjustment
This pin is segment current reference pin. A resistor should be
connected between this pin and VSS. Set the current lower
than 10uA.
Voltage Output High Level for COM Signal
This pin is the input pin for the voltage output high level for
COM signals. A tantalum capacitor should be connected
between this pin and VSS.
Voltage Output Low Level for SEG Signal
This is segment voltage reference pin.
When external VSL is not used, this pin should be left open.
When external VSL is used, this pin should connect with
resistor and diode to ground.
Testing Pads
21
FR
O
16
17
BS0
BS1
I
20
RES#
I
19
CS#
18
D/C#
14
E/RD#
15
R/W#
6~13
D7~D0
Frame Frequency Triggering Signal
This pin will send out a signal that could be used to identify the
driver status. Nothing should be connected to this pin. It should
be left open individually.
Communicating Protocol Select
These pins are MCU interface selection input. See the following
table:
Power Reset for Controller and Driver
This pin is reset signal input. When the pin is low, initialization
of the chip is executed.
Chip Select
I
This pin is the chip select input. The chip is enabled for MCU
communication only when CS# is pulled low.
Data/Command Control
I
This pin is Data/Command control pin. When the pin is pulled
high, the input at D7~D0 is treated as display data.
When the pin is pulled low, the input at D7~D0 will be
transferred to the command register. For detail relationship to
MCU interface signals, please refer to the
Timing Characteristics Diagrams.
Read/Write Enable or Read
I
This pin is MCU interface input. When interfacing to a
68XX-series microprocessor, this pin will be used as the
Enable (E) signal. Read/write operation is initiated when this
pin is pulled high and the CS# is pulled low.
When connecting to an 80XX-microprocessor, this pin receives
the Read (RD#) signal. Data read operation is initiated when
this pin is pulled low and CS# is pulled low.
When serial mode is selected, this pin must be connected to
VSS.
Read/Write Select or Write
I
This pin is MCU interface input. When interfacing to a
68XX-series microprocessor, this pin will be used as
Read/Write (R/W#) selection input. Pull this pin to “High” for
read mode and pull it to “Low” for write mode.
When 80XX interface mode is selected, this pin will be the
Write (WR#) input. Data write operation is initiated when this
pin is pulled low and the CS# is pulled low.
When serial mode is selected, this pin must be connected to
VSS.
I/O Host Data Input/Output Bus
These pins are 8-bit bi-directional data bus to be connected to
the microprocessor’s data bus. When serial mode is selected,
D1 will be the serial data input SDIN and D0 will be the serial
clock input SCLK.
Unused pins must be connected to VSS except for D2 in serial
mode.
Reserve
23
1,30
N.C.
-
N.C.
(GND)
-
Reserved Pin
The N.C. pin between function pins are reserved for compatible
and flexible design.
Reserved Pin (Supporting Pin)
The supporting pins can reduce the influences from stresses
on the function pins. These pins must be connected to external
ground.
5.Absolute
5.Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Unit
Notes
Supply Voltage for
VCI
-0.3
4
V
1, 2
Operation
Supply Voltage for Logic
VDD
-0.5
2.75
V
1, 2
Supply Voltage for I/O Pins
VDDIO
-0.5
VCI
V
1, 2
Supply Voltage for Display
VCC
-0.5
20
V
1, 2
Operating Temperature
TOP
-40
80
°C
Storage Temperature
TSTG
-40
80
°C
Note 1: All the above voltages are on the basis of “VSS = 0V”.
Note 2: When this module is used beyond the above absolute maximum ratings, permanent
breakage of the module may occur. Also, for normal operations, it is desirable to use this
module under the conditions according to Section 6 ‘’Electrical Characteristics’’. If this module
is used beyond these conditions, malfunctioning of the module can occur and the reliability of
the module may deteriorate
6.Electrical
6.Electrical Characteristics
Item
Symbol
Condition
Min
Typ
Max
Unit
Supply Voltage for
Operation
VCI
Note
2.8
3.0
3.3
V
Supply Voltage for Display
VCC
-
14
14.5
15
V
High Level Input
VIH
-
0.8×VDDIO
-
VDDIO
V
Low Level Input
VIL
-
0
-
0.2×VDDIO
V
High Level Output
VOH
-
0.9×VDDIO
-
VDDIO
V
Low Level Output
VOL
-
0
-
0.1×VDDIO
V
VCC =14.5V
23
25
32
mA
50% Check Board operating Current
Note: Supply Voltage for Logic = VDD core power supply can be regulated from VCI.
7.Optical
7.Optical Characteristics
Item
View Angle
Contrast Ratio
Symbol
Condition
Min
Typ
Max Unit
(V)θ
160
deg
(H)φ
160
deg
-
Dark
T rise
-
10
µs
T fall
-
10
µs
cd/m2
Response Time
2000:1
-
CR
Display with 50% check Board Brightness
100
120
CIEx(Yellow)
(CIE1931)
0.45
0.47
0.49
CIEy(Yellow)
(CIE1931)
0.48
0.50
0.52
8.OLED
8.OLED Lifetime
ITEM
Conditions
Operating
Life Time
Ta=25℃
/ Initial 50% check board
brightness Typical Value
Min
Typ
80,000 Hrs
100,000 Hrs
Remark
Note
Notes:
1. Life time is defined the amount of time when the luminance has decayed to <50% of the
initial value.
2. This analysis method uses life data obtained under accelerated conditions to extrapolate
an estimated probability density function (pdf) for the product under normal use conditions.
3. Screen saving mode will extend OLED lifetime.
9.Reliability
9.Reliability
Content of Reliability Test
Environmental Test
Test Item
High
Temperature
storage
Low
Temperature
storage
High
Temperature
Operation
Low
Temperature
Operation
High
Temperature/
Humidity
Storage
Temperature
Cycle
Content of Test
Test Condition
Applicable
Standard
Endurance test applying the high
storage temperature for a long time.
80℃
240hrs
——
Endurance test applying the low storage -40℃
temperature for a long time.
240hrs
——
Endurance test applying the electric
stress (Voltage & Current) and the
thermal stress to the element for a long
time.
Endurance test applying the electric
stress under low temperature for a long
time.
80℃
240hrs
——
-40℃
240hrs
——
Endurance test applying the high
60℃,90%RH
temperature and high humidity storage
240hrs
for a long time.
Endurance test applying the low and
high temperature cycle.
-40℃
25℃
80℃
30min
5min
1 cycle
-40℃/80℃
100 cycles
——
——
30min
Mechanical Test
10~22Hz→1.5mmp-p
22~500Hz→1.5G
——
Total 0.5hr
50G Half sin
wave 11 ms
——
3 times of each
direction
Vibration test
Endurance test applying the vibration
during transportation and using.
Shock test
Constructional and mechanical
endurance test applying the shock
during transportation.
Atmospheric
pressure test
Endurance test applying the
atmospheric pressure during
transportation by air.
115mbar
40hrs
Endurance test applying the electric
stress to the terminal.
VS=800V,RS=1.5kΩ
CS=100pF
——
1 time
——
Others
Static
electricity test
*** Supply voltage for OLED system =Operating voltage at 25℃
Test and measurement conditions
1. All measurements shall not be started until the specimens attain to temperature stability.
After the completion of the described reliability test, the samples were left at room
temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH.
2. All-pixels-on is used as operation test pattern.
3. The degradation of Polarizer are ignored for High Temperature storage, High Temperature/
Humidity Storage, Temperature Cycle
Evaluation criteria
1. The function test is OK.
2. No observable defects.
3. Luminance: > 50% of initial value.
4. Current consumption: within ± 50% of initial value.
APPENDIX:
RESIDUE IMAGE
Because the pixels are lighted in different time, the luminance of active pixels
may reduce or differ from inactive pixels. Therefore, the residue image will occur.
To avoid the residue image, every pixel needs to be lighted up uniformly.
10.Inspection
10.Inspection specification
NO
01
02
03
04
Item
Electrical
Testing
Black or
white
spots on
OLED
(display
only)
OLED
black
spots,
white
spots,
contamina
tion
(non-displ
ay)
Polarizer
bubbles
Criterion
1.1 Missing vertical, horizontal segment, segment contrast
defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 OLED viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
2.1 White and black spots on display ≦0.25mm, no more than
three white or black spots present.
2.2 Densely spaced: No more than two spots or lines within
3mm.
3.1 Round type : As
following drawing
Φ=( x + y ) / 2
SIZE
Acceptable Q
TY
Accept no
dense
2
Φ≦0.10
0.10<
Φ≦0.20
0.20<
Φ≦0.25
0.25<Φ
3.2 Line type : (As following drawing)
Length Width
--W≦0.02
L≦3.0
0.02<W≦0.03
L≦2.5
0.03<W≦0.05
--0.05<W
If bubbles are visible,
judge using black spot
specifications, not easy
to find, must check in
specify direction.
Size Φ
Φ≦0.20
0.20<Φ≦0.50
0.50<Φ≦1.00
1.00<Φ
Total Q TY
AQL
0.65
2.5
2.5
1
0
Acceptable Q TY
Accept no dense
2.5
2
As round type
Acceptable Q TY
Accept no dense
3
2
0
3
2.5
NO
05
Item
Scratches
Criterion
Follow NO.3 OLED black spots, white spots, contamination
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: OLED side length
L: Electrode pad length:
AQL
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
06
Chipped
glass
z: Chip thickness
Z≦1/2t
y: Chip width
x: Chip length
Not over viewing
x≦1/8a
area
Not exceed 1/3k
1/2t<z≦2t
x≦1/8a
☉If there are 2 or more chips, x is total length of each chip.
6.1.2 Corner crack:
z: Chip thickness
Z≦1/2t
y: Chip width
x: Chip length
Not over viewing
x≦1/8a
area
Not exceed 1/3k
1/2t<z≦2t
x≦1/8a
☉If there are 2 or more chips, x is the total length of each chip.
2.5
NO Item
Criterion
Symbols :
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: OLED side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
y: Chip width
x: Chip length
y≦0.5mm
x≦1/8a
6.2.2 Non-conductive portion:
06
AQL
z: Chip thickness
0 < z≦t
Glass
crack
2.5
y: Chip width
x: Chip length
z: Chip
thickness
y≦ L
x≦1/8a
0 < z≦t
☉If the chipped area touches the ITO terminal, over 2/3 of the ITO
must remain and be inspected according to electrode terminal
specifications.
☉If the product will be heat sealed by the customer, the alignment
mark not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width
y≦1/3L
x: length
x≦a
NO
07
08
09
10
11
Item
Cracked
glass
Backlight
elements
Criterion
AQL
The OLED with extensive crack is not acceptable.
2.5
8.1 Illumination source flickers when lit.
8.2 Spots or scratched that appear when lit must be judged.
Using OLED spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong.
0.65
2.5
Bezel
9.1 Bezel may not have rust, be deformed or have
fingerprints, stains or other contamination.
9.2 Bezel must comply with job specifications.
PCB、COB
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.
10.2 COB seal surface may not have pinholes through to the
IC.
10.3 The height of the COB should not exceed the height
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the
seal area on the PCB. And there should be no more than
three places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, OLED pad, zebra pad
or screw hold pad, make sure it is smoothed down.
Soldering
11.1 No un-melted solder paste may be present on the PCB.
11.2 No cold solder joints, missing solder connections,
oxidation or icicle.
11.3 No residue or solder balls on PCB.
11.4 No short circuits in components on PCB.
0.65
2.5
0.65
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
2.5
2.5
0.65
NO
12
Item
Criterion
AQL
2.5
General
appearance
12.1 No oxidation, contamination, curves or, bends on
interface Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP.
12.3 No contamination, solder residue or solder balls on
product.
12.4 The IC on the TCP may not be damaged, circuits.
12.5 The uppermost edge of the protective strip on the
interface pin must be present or look as if it cause the
interface pin to sever.
12.6 The residual rosin or tin oil of soldering (component or
chip component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened.
12.8 Pin type must match type in specification sheet.
12.9 OLED pin loose or missing pins.
12.10 Product packaging must the same as specified on
packaging specification sheet.
12.11 Product dimension and structure must conform to
product specification sheet.
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
Check Item
Classification
No Display
Major
Missing Line
Major
Pixel Short
Major
Darker Short
Major
Wrong Display
Major
Un-uniform
B/A x 100% < 70%
A/C x 100% < 70%
Major
Criteria
11.Precautions
11.Precautions in use of OLED Modules
Modules
(1)Avoid applying excessive shocks to module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the
components of OLED display module.
(3)Don’t disassemble the OLED display module.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist OLED display module.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
(8)It's pretty common to use "Screen Saver" to extend the lifetime and Don't use fix information
for long time in real application.
(9)Don't use fixed information in OLED panel for long time, that will extend "screen burn" effect
time..
(10)Winstar has the right to change the passive components, including R2and R3 adjust
resistors. (Resistors, capacitors and other passive components will have different
appearance and color caused by the different supplier.)
(11)Winstar have the right to change the PCB Rev. (In order to satisfy the supplying stability,
management optimization and the best product performance...etc, under the premise of not
affecting the electrical characteristics and external dimensions, Winstar have the right to
modify the version.)
11.1. Handling Precautions
(1) Since the display panel is being made of glass, do not apply mechanical impacts such us
dropping from a high position.
(2) If the display panel is broken by some accident and the internal organic substance leaks out,
be careful not to inhale nor lick the organic substance.
(3) If pressure is applied to the display surface or its neighborhood of the OLED display module,
the cell structure may be damaged and be careful not to apply pressure to these sections.
(4) The polarizer covering the surface of the OLED display module is soft and easily scratched.
Please be careful when handling the OLED display module.
(5) When the surface of the polarizer of the OLED display module has soil, clean the surface. It
takes advantage of by using following adhesion tape.
* Scotch Mending Tape No. 810 or an equivalent
Never try to breathe upon the soiled surface nor wipe the surface using cloth containing
solvent
such as ethyl alcohol, since the surface of the polarizer will become cloudy.
Also, pay attention that the following liquid and solvent may spoil the polarizer:
* Water
* Ketone
* Aromatic Solvents
(6) Hold OLED display module very carefully when placing OLED display module into the
System housing. Do not apply excessive stress or pressure to OLED display module. And, do
not over bend the film with electrode pattern layouts.
These stresses will influence the display performance. Also, secure sufficient rigidity for the
outer cases.
(7) Do not apply stress to the LSI chips and the surrounding molded sections.
(8) Do not disassemble nor modify the OLED display module.
(9) Do not apply input signals while the logic power is off.
(10) Pay sufficient attention to the working environments when handing OLED display
modules to prevent occurrence of element breakage accidents by static electricity.
* Be sure to make human body grounding when handling OLED display modules.
* Be sure to ground tools to use or assembly such as soldering irons.
* To suppress generation of static electricity, avoid carrying out assembly work under dry
environments.
* Protective film is being applied to the surface of the display panel of the OLED display
module. Be careful since static electricity may be generated when exfoliating the protective
film.
(11) Protection film is being applied to the surface of the display panel and removes the
protection film before assembling it. At this time, if the OLED display module has been stored
for a long period of time, residue adhesive material of the protection film may remain on the
surface of the display panel after removed of the film. In such case, remove the residue
material by the method introduced in the above Section 5.
(12) If electric current is applied when the OLED display module is being dewed or when it is
placed under high humidity environments, the electrodes may be corroded and be careful to
avoid the above.
11.2. Storage Precautions
(1) When storing OLED display modules, put them in static electricity preventive bags
avoiding exposure to direct sun light nor to lights of fluorescent lamps. and, also, avoiding
high temperature and high humidity environment or low temperature (less than 0°C)
environments.
(We recommend you to store these modules in the packaged state when they were shipped
from Winstar Technology Inc.
At that time, be careful not to let water drops adhere to the packages or bags nor let dewing
occur with them.
(2) If electric current is applied when water drops are adhering to the surface of the OLED
display module, when the OLED display module is being dewed or when it is placed under
high humidity environments, the electrodes may be corroded and be careful about the above.
11.3. Designing Precautions
(1) The absolute maximum ratings are the ratings which cannot be exceeded for OLED
display module, and if these values are exceeded, panel damage may be happen.
(2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH
specifications and, at the same time, to make the signal line cable as short as possible.
(3) We recommend you to install excess current preventive unit (fuses, etc.) to the power
circuit (VDD). (Recommend value: 0.5A)
(4) Pay sufficient attention to avoid occurrence of mutual noise interference with the
neighboring devices.
(5) As for EMI, take necessary measures on the equipment side basically.
(6) When fastening the OLED display module, fasten the external plastic housing section.
(7) If power supply to the OLED display module is forcibly shut down by such errors as taking
out the main battery while the OLED display panel is in operation, we cannot guarantee the
quality of this OLED display module.
* Connection (contact) to any other potential than the above may lead to rupture of
the IC.11.4.
Precautions when disposing of the OLED display modules
1) Request the qualified companies to handle industrial wastes when disposing of the OLED
display modules. Or, when burning them, be sure to observe the environmental and hygienic
laws and regulations.
11.5. Other Precautions
(1) When an OLED display module is operated for a long of time with fixed pattern may remain
as an after image or slight contrast deviation may occur.
Nonetheless, if the operation is interrupted and left unused for a while, normal state can be
restored. Also, there will be no problem in the reliability of the module.
(2) To protect OLED display modules from performance drops by static electricity rapture, etc.,
do not touch the following sections whenever possible while handling the OLED display
modules.
* Pins and electrodes
* Pattern layouts such as the TCP & FPC
(3) With this OLED display module, the OLED driver is being exposed. Generally speaking,
semiconductor elements change their characteristics when light is radiated according to the
principle of the solar battery. Consequently, if this OLED driver is exposed to light,
malfunctioning may occur.
* Design the product and installation method so that the OLED driver may be shielded from light
in actual usage.
* Design the product and installation method so that the OLED driver may be shielded from light
during the inspection processes.
(4) Although this OLED display module stores the operation state data by the commands and the
indication data, when excessive external noise, etc. enters into the module, the internal status
may be changed. It therefore is necessary to take appropriate measures to suppress noise
generation or to protect from influences of noise on the system design.
(5) We recommend you to construct its software to make periodical refreshment of the operation
statuses (re-setting of the commands and re-transference of the display data) to cope with
catastrophic noise.
(6)Resistors, capacitors and other passive components will have different appearance and color
caused by the different supplier.
(7)Our company will has the right to upgrade and modify the product function.
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