Installation Instructions
16 Input/16 Output Digital Embedded I/O Boards
Catalog Numbers 1799-D16U16V, 1799-D16U16VL, 1799-D16U16B,
1799-D16U16BL
Topic
Page
Important User Information
2
Environment and Enclosure
3
About the Board
4
Install the Board
5
Set the Node Address
5
Mount the Board
7
Connect the Board
9
Configure the Parameters
16
Troubleshoot the I/O Boards
17
Technical Support
19
Specifications
20
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16 Input/16 Output Digital Embedded I/O Boards
Important User Information
Solid state equipment has operational characteristics differing from those of electromechanical equipment.
Safety Guidelines for the Application, Installation and Maintenance of Solid State Controls (Publication
SGI-1.1 available from your local Rockwell Automation sales office or online at
http://literature.rockwellautomation.com) describes some important differences between solid state
equipment and hard-wired electromechanical devices. Because of this difference, and also because of the
wide variety of uses for solid state equipment, all persons responsible for applying this equipment must
satisfy themselves that each intended application of this equipment is acceptable.
In no event will Rockwell Automation, Inc. be responsible or liable for indirect or consequential damages
resulting from the use or application of this equipment.
The examples and diagrams in this manual are included solely for illustrative purposes. Because of the
many variables and requirements associated with any particular installation, Rockwell Automation, Inc.
cannot assume responsibility or liability for actual use based on the examples and diagrams.
No patent liability is assumed by Rockwell Automation, Inc. with respect to use of information, circuits,
equipment, or software described in this manual.
Reproduction of the contents of this manual, in whole or in part, without written permission of Rockwell
Automation, Inc., is prohibited.
Throughout this manual, when necessary, we use notes to make you aware of safety considerations.
WARNING
IMPORTANT
ATTENTION
Identifies information about practices or circumstances that can cause an explosion
in a hazardous environment, which may lead to personal injury or death, property
damage, or economic loss.
Identifies information that is critical for successful application and understanding of
the product.
Identifies information about practices or circumstances that can lead to personal
injury or death, property damage, or economic loss. Attentions help you identify a
hazard, avoid a hazard and recognize the consequences.
SHOCK HAZARD
Labels may be on or inside the equipment (for example, drive or motor) to alert
people that dangerous voltage may be present.
BURN HAZARD
Labels may be on or inside the equipment (for example, drive or motor) to alert
people that surfaces may reach dangerous temperatures.
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16 Input/16 Output Digital Embedded I/O Boards
3
Environment and Enclosure
ATTENTION
This equipment is intended for use in overvoltage Category II applications (as defined in
IEC publication 60664-1), at altitudes up to 2000 meters (6562 feet) without derating.
This equipment is considered Group 1, Class A industrial equipment according to IEC/CISPR
Publication 11. Without appropriate precautions, there may be potential difficulties
ensuring electromagnetic compatibility in other environments due to conducted as well as
radiated disturbance.
This equipment is supplied as open-type equipment. It must be mounted within an
enclosure that is suitably designed for those specific environmental conditions that will be
present and appropriately designed to prevent personal injury resulting from accessibility
to live parts.The enclosure must have suitable flame-retardant properties to prevent or
minimize the spread of flame, complying with a flame spread rating of 5VA, V2, V1, V0 (or
equivalent) if non-metallic. The interior of the enclosure must be accessible only by the use
of a tool. Subsequent sections of this publication may contain additional information
regarding specific enclosure type ratings that are required to comply with certain product
safety certifications.
In addition to this publication, see:
• Industrial Automation Wiring and Grounding Guidelines, for additional installation
requirements, Allen-Bradley publication 1770-4.1.
• NEMA Standards publication 250 and IEC publication 60529, as applicable, for
explanations of the degrees of protection provided by different types of enclosure.
ATTENTION
Preventing Electrostatic Discharge
This equipment is sensitive to electrostatic discharge, which can cause internal damage
and affect normal operation. Follow these guidelines when you handle this equipment:
• Touch a grounded object to discharge potential static.
• Wear an approved grounding wriststrap.
• Do not touch connectors or pins on component boards.
• Do not touch circuit components inside the equipment.
• Use a static-safe workstation, if available.
• Store the equipment in appropriate static-safe packaging when not in use.
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16 Input/16 Output Digital Embedded I/O Boards
About the Board
The board is a 32-point I/O board that communicates via a DeviceNet network.
This board has 16 inputs and 16 outputs. Inputs are 24V dc sourcing or sinking.
Outputs are self-protected 24V dc sourcing (1799-D16U16B, 1799-D16U16BL) or
sinking (1799-D16U16V, 1799-D16U16VL).
42557
Parts List
Your package contains:
• one 1799 I/O board.
• these installation instructions.
Optional Hardware
All mating connectors and mounting hardware must be ordered separately. This
table identifies the different connector and hardware options.
Option
Catalog Number
Third-party Supplier & Part Number
2 DIN rail brackets (4 screws)
1799-BRKD
N/A
Clear plastic cover (4 stand-offs, 4 screws)
1799-COV32
N/A
Mounting plate (4 screws)
1799-MP32
N/A
Five-position, open-style plug for DeviceNet
network (2 locking screws)
1799-DNETSCON
DeviceNet Buyer’s Guide at
http://www.odva.org
50-pin, D-sub I/O mating connector - solder
cup
1799-DSSCON
Amphenol Corp. - 777DF-D50P
ITT Cannon - DDM50PK127
50-pin, D-sub I/O mating connector - header
and crimp pins
1799-DSCCON
Tyco Electronics - 205212-1 (header)
Tyco Electronics - 66506-4 (pins)
EBY Co. - DR50-P02-0S
(header only)
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5
Install the Board
To install the board:
• set the node address.
• mount the board (brackets, mounting plate, plastic cover).
• connect the board (DeviceNet network, I/O).
• communicate with your board.
• configure the parameters.
More detailed information about each of these steps is in the following procedures.
Set the Node Address
Valid node addresses are 00...63.
Set the node address by using the rotary switches or a DeviceNet configuration tool
such as RSNetWorx for DeviceNet software. Setting the switches between 64 and 99
allows the software to have address control.
Each board is shipped with the node address set to 63 in the board’s memory. The
rotary switches are set for position 99 at shipment. The switches are located near
the center of the board. The two switches are:
• MSD (most significant digit).
• LSD (least significant digit).
To reset the node address, use a screwdriver to rotate the switches. Line up the
small arrow on the switch with the number setting you wish to use.
The rotary switches are read only when you apply power to the board. Settings
between 64 and 99 cause the board to use the last valid node address stored in the
board’s memory.
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16 Input/16 Output Digital Embedded I/O Boards
For example, the last setting in memory is 40. If a change is made to 68, and then
you apply power to the board, the address will default to 40.
LSD (S1)
The LSD (S2)
and MSD (S1)
switches are
shown in the
63 position.
MSD (S2)
42558
The board is equipped with AutoBaud detect. AutoBaud allows the board to detect
the communication rate on your DeviceNet network and automatically adjusts to
that rate.
The board is shipped with AutoBaud enabled.
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Mount the Board and Optional Cover
You can mount the board to a DIN rail by using DIN-rail brackets (catalog number
1799-BRKD) or to a mounting plate (catalog number 1799-MP32). For clear plastic
covers (catalog number 1799-COV32), reference the following instructions.
1. Place the four stand-offs onto the mounting screws and tighten.
2. Align the holes on the cover with the stand-offs.
3. Place the screws through the cover into the stand-offs and tighten.
DIN Rail
DIN Rail Bracket
or
or
Stand-off
15.62 mm
(0.62 in.)
Mounting Plate
93.73 mm
(3.69 in.)
42559
Plastic Cover
You can also mount the board in an enclosure with pre-tapped holes, which
accommodate M3 x 0.5mm screws.
IMPORTANT
ATTENTION
With the addition of the cover, the width of the board increases from 77.98 mm to 93.73
mm (3.07 in. to 3.69 in.) and the height increases from 19.05 mm to 35.05 mm (0.75 in. to
1.38 in.).
Turn off the system power before conducting maintenance or inspection on an open board,
or in an area where an open board is installed.
If powering down the system is not feasible, ensure that any open boards are covered
during maintenance or inspection to prevent any direct exposure of a directed light source
to open boards.
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16 Input/16 Output Digital Embedded I/O Boards
Board Dimensions
3.53 mm
(0.14 in.)
120.65 mm
(4.75 in.)
97.79 mm
(3.85 in.)
11.43 mm
(0.45 in.)
1.73 mm
(0.05 in.)
19.05 mm
(0.75 in.)
77.85 mm
(3.07 in.)
29.85 mm
(1.18 in.)
29.21 mm
(1.15 in.)
187.96 mm
(7.40 in.)
42560
Mounting Plate Dimensions (front view)
41.15 mm
(1.62 in.)
209.55 mm
(8.25 in.)
38.61 mm
(3.06 in.)
3.30 mm
(0.13 in.)
38.61 mm
(1.52 in.)
42562
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Connect the Board
Use these illustrations and tables to help you connect the DeviceNet connectors
and I/O connectors to the board.
DeviceNet Connector (P3)
Pin 1
(top)
I/O Connector (P1)
Pin 5
(bottom)
42561
This illustration shows the pin number assignments of the I/O connector (P1).
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16 Input/16 Output Digital Embedded I/O Boards
This table identifies the signal for each 1799-D16U16B and 1799-D16U16BL pin
number on the I/O connector.
P1 1799-D16U16B and 1799-D16U16BL I/O Connector
Pin
Signal
Pin
Signal
Pin
Signal
1
Output 15
18
Output 13
34
Output 12
2
Output 9
19
Output 8
35
Output 14
3
Output 11
20
Output 10
36
GRP 1 Return
4
+24V dc-GRP 1
21
Input 1
37
Input 0
5
+24V dc-GRP 1
22
Common In GRP 0
38
Input 2
6
Input 3
23
Input 6
39
Input 4
7
Input 5
24
Not Used
40
Input 7
8
GRP 0 Return
25
Input 11
41
Input 10
9
Output 4
26
Input 9
42
Input 8
10
+24V dc-GRP 0
27
Input 14
43
Common In GRP 1
11
Output 5
28
Input 12
44
Input 13
12
Output 7
29
Output 6
45
Input 15
13
Output 0
30
Not Used
46
Not Used
14
Output 1
31
Not Used
47
Not Used
15
+24V dc-GRP 0
32
Not Used
48
Not Used
16
Output 2
33
Not Used
17
Output 3
49
Not Used
50
Not Used
This table identifies the signal for each 1799-D16U16V and 1799-D16U16VL pin
number on the I/O connector.
P1 1799-D16U16V and 1799-D16U16VL I/O Connector
Pin
Signal
Pin
Signal
Pin
Signal
1
Output 15
18
Output 13
34
Output 12
2
Output 9
19
Output 8
35
Output 14
3
Output 11
20
Output 10
36
Common Return
4
+24V dc-GRP 1
21
Input 1
37
Input 0
5
+24V dc-GRP 1
22
Common In GRP 0
38
Input 2
6
Input 3
23
Input 6
39
Input 4
7
Input 5
24
Common Return
40
Input 7
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P1 1799-D16U16V and -D16U16VL I/O Connector
Pin
Signal
Pin
Signal
Pin
Signal
8
Common Return
25
Input 11
41
Input 10
9
Output 4
26
Input 9
42
Input 8
10
+24V dc-GRP 0
27
Input 14
43
Common In GRP 1
11
Output 5
28
Input 12
44
Input 13
12
Output 7
29
Output 6
45
Input 15
13
Output 0
30
Not Used
46
Not Used
14
Output 1
31
Not Used
47
Not Used
15
+24V dc-GRP 0
32
Not Used
48
Not Used
16
Output 2
33
Not Used
49
Not Used
17
Output 3
50
Not Used
The DeviceNet wire insulation colors are shown below.
P3 DeviceNet Connector
Pin
Insulation Colors
1
Black
2
Blue
3
Shield
4
White
5
Red
Auxiliary Power Specifications
ATTENTION
To comply with the CE Low Voltage Directive (LVD), this equipment and all connected I/O
must be powered from a source compliant with the following:
• Safety Extra Low Voltage (SELV) or Protected Extra Low Voltage (PELV).
To comply with UL restrictions, this equipment and all connected I/O must be powered
from a source compliant with the following:
• 10...30V dc Class 2 Power Supply or a 10...30V dc UL Listed or Recognized Power
Supply with isolated outputs limited to 200VA in each ungrounded output line. This
equipment and its power source must be mounted in a suitable enclosure with
proper spacings maintained.
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16 Input/16 Output Digital Embedded I/O Boards
Connect the Field Output Device to the I/O Connector (P1)
The 1799-D16U16B and 1799-D16U16BL boards have outputs that supply current to
your field output device (sourcing outputs).
The outputs on these boards are isolated in two groups of eight, with each group
requiring 24V dc power and 24V dc ground. Outputs 0...7 are powered from +24V
GRP 0 and return power via GRP 0 Return. Outputs 8...15 are powered from +24V
GRP 1 and return power via GRP 1 Return.
Use these wiring diagrams to connect both groups of outputs on these boards.
1799-D16U16B and 1799-D16U16BL Outputs (sourcing)
GRP 1
GRP 0
Pin 8
GRP 0
Return
Pins 10, 15 Pins 9, 11...14,
16, 17, 29
+24V
Output X
GRP 0
+
_
Pin 36
GRP 1
Return
Pins 1...3,
Pins 4, 5
18...20, 34, 35
+24V
Output X
GRP 1
+
Load
_
Load
42563
The 1799-D16U16V and 1799-D16U16VL boards have outputs that receive current
from your field output device (sinking outputs). The outputs on these boards are in
two groups of eight, with each group requiring 24V dc power and 24V dc ground.
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1799-D16U16V and 1799-D16U16VL Outputs (sinking)
GRP 0
Pin 8, Pins 9, 11...14,
24, 36 16, 17, 29
GRP
Output X
Return
GRP 1
Pins 10, 15
+24V
GRP
Pin 8,
24, 36
GRP
Return
Pins 1...3,
18...20, 34, 35
Output X
Load
Pins 4, 5
+24V
GRP
Load
+
+
_
_
42564
Connect the Field Input Device to the I/O Connector (P1)
The inputs on these boards are isolated in two groups of eight, with each group
providing a separate common signal. Inputs 0 to 7 share the Common In GRP 0
signal. Inputs 8 to 15 share the Common In GRP 1 signal.
The 1799-D16U16B, 1799-D16U16BL, 1799-D16U16V, and 1799-D16U16VL boards
have universal inputs that allow operation with either sourcing or sinking input
devices. The universal feature lets you configure the inputs as either sinking or
sourcing. Use these wiring diagrams to connect each group of inputs on the boards.
IMPORTANT
All field input devices in each group of eight must be of the same type, either sinking or
sourcing. The board will not operate if the types are mixed.
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16 Input/16 Output Digital Embedded I/O Boards
Inputs (sourcing)
GRP 1
GRP 0
Pins 6, 7, 21,
23, 37...40
Input X
Pins 25...28,
41, 42, 44, 45
Input X
Pin 22
Common In
GRP 0
+
+
_
_
Pin 43
Common In
GRP 1
42565
Inputs (sinking)
GRP 0
Pin 22
Common In
GRP 0
GRP 1
Pins 6, 7, 21,
23, 37...40
Input X
Pin 43
Common In
GRP 1
+
+
_
_
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Pins 25...28,
41, 42, 44, 45
Input X
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16 Input/16 Output Digital Embedded I/O Boards
15
Communicate With Your Board
This board exchanges I/O with the master on the DeviceNet network through a
cyclic, polled, or change-of-state connection.
The 1799-D16U16B and 1799-D16U16BL boards consume and produce I/O data as
follows.
I/O Connection Type
Consumes
Produces
Cyclic
2 bytes
3 bytes
Polled
2 bytes
3 bytes
Change-of-state
2 bytes
3 bytes
The 1799-D16U16V and 1799-D16U16VL boards consumes and produces I/O data
as follows.
I/O Connection Type
Consumes
Produces
Cyclic
2 bytes
2 bytes
Polled
2 bytes
2 bytes
Change-of-state
2 bytes
2 bytes
Cyclic — the board produces and consumes its I/O cyclically at the rate configured
by the master on the DeviceNet network.
Polled — the master initiates communication by sending its polled I/O message to
the board. The board consumes the message, updates any outputs, and produces a
response containing the input data.
Change-of-state — a production occurs when an input changes. A heartbeat
production occurs if no input condition change occurs within the expected packet
rate. This heartbeat production tells the master that the board is ready to
communicate. Consumption occurs when data changes and the master produces
new output data to the board.
Refer to this table for the word and bit definitions for the 1799-D16U16B and
1799-D16U16BL boards.
Byte
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Produced 0 I7
Bit 7
I6
I5
I4
I3
I2
I1
I0
Produced 1 I15
I14
I13
I12
I11
I10
I9
I8
OFLT 1
OFLT 0
Consumed 0 O7
O6
O5
O4
O3
O2
O1
O0
Consumed 1 O15
O14
O13
O12
O11
O10
O9
O8
Produced 2
Reserved
Where: I = Input, O = Output, OFLT 0 = Output Fault on one or more outputs in GRP 0,
OFLT 1 = Output Fault on one or more outputs in GRP 1
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16 Input/16 Output Digital Embedded I/O Boards
Refer to this table for the word and bit definitions for the 1799-D16U16V and
1799-D16U16VL boards.
Byte
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
I6
I5
I4
I3
I2
I1
I0
Produced 1 I15
I14
I13
I12
I11
I10
I9
I8
Consumed 0 O7
O6
O5
O4
O3
O2
O1
O0
Consumed 1 O15
O14
O13
O12
O11
O10
O9
O8
Produced 0 I7
Where: I = Input, O = Output
Configure the Parameters
The 1799 I/O boards have eight parameters that are configurable through a
DeviceNet configuration tool such as RSNetWorx for DeviceNet software. The
DeviceNet configuration tools require an electronic data sheet (EDS) for the 1799
I/O boards to configure the module’s parameters. Find the EDS files at
http://www.odva.org.
Use the descriptions in this table to help you configure the parameters.
Parameter
Description
Baud Rate
Controls the board’s communication rate.
Auto-Baud
Enables the board to match the network’s communication
rate. When enabled, Baud Rate parameter is ignored.
Input Off-to-On Filter Time
Controls the amount of time the input must be in the on
state before the board reports the input as on.
Input On-to-Off Filter Time
Controls the amount of time the input must be in the off
state before the board reports the input as off.
Output Idle State
Controls the state of each output when the DeviceNet
master is in an idle state.
Output Fault State
Controls the state of each output when the board loses
communication with the DeviceNet master.
Output Idle Value
Controls the value that outputs will have when the output
idle state is set to use idle value.
Output Fault Value
Controls the value that outputs will have when the output
fault state is set to use fault value.
The DeviceLogix capable boards, 1799-D16U16BL and 1799-D16U16VL, have
additional parameters, which are described in the DeviceLogix User Manual,
publication ACIG-UM001, and in the Embedded I/O for DeviceNet Technical Data,
publication 1799-TD001.
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Troubleshoot the I/O Boards
This board has the following status indicators.
• Board
• Network
• Logic
• I/O
Logic Status
Indicator
Board Status
Indicator
Network Status
Indicator
I/0 Status
Indicators
42567
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16 Input/16 Output Digital Embedded I/O Boards
Board Status Indicator (labeled MOD)
Indication
Status
None
No power
Green
Blinking
Solid
Needs commissioning
Device operational
Red
Blinking
Solid
Minor fault
Critical fault
Network Status Indicator (labeled NET)
Indication
Status
None
Not online
Green
Blinking
Solid
Online/no connections
Online/connected
Red
Blinking
Solid
Connection timed out
Failed communication: a duplicate
node address exists or module is at
the wrong communication rate
DeviceLogix Status Indicator (labeled DS1)
Indication
Status
None
Logic disabled
Green
Solid
Blinking
Logic enabled
Local forces applied and local logic enabled
I/O Status Indicators (labeled Inputs and Outputs)
Indication
Status
None
Input or output point off
Yellow
Input or output point on
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Technical Support
For additional troubleshooting information on the 1799 Embedded I/O Boards,
access Rockwell Automation’s technical support services at 440.646.5800 or at
http://www.ab.com.
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16 Input/16 Output Digital Embedded I/O Boards
Specifications
16 Input/16 Output Boards - 1799-D16U16B, 1799-D16U16BL, 1799-D16U16V,
1799-D16U16VL
Attribute
Value
Input Specifications
Inputs per block
16 sinking or sourcing, Type 1 + compatible
Off-state voltage
5V dc max
Off-state current
1.5 mA max
On-state voltage
10...30V dc
On-state current
2...6 mA
Output Specifications
Outputs per block
16 sinking or sourcing, 0.5A, short circuit protected, pilot duty
Output auxiliary voltage
10...30V
On-state voltage drop
250 mV max
On-state current
0.5 A max
Off-state leakage
65 μA max
Board current (all outputs on)
8.0 A max
Surge current - for 10ms, repeatable
Every 2 s (individual outputs)
1.0 A
General
Attribute
Value
DeviceNet voltage range
11...25V dc
DeviceNet current
125 mA max
DeviceNet power circuit type
Class 2
Auxiliary power voltage range
10...30V dc UL Listed or recognized power supply
Auxiliary power current outputs on
8 A max
Auxiliary power current outputs off
30 mA
Auxiliary supply power/current
ratings
Isolated outputs limited to 200VA in each ungrounded output line
Status indicators
Board - red/green
Network - red/green
DeviceLogix - green
Input Point - yellow
Output Point - yellow
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General
Attribute
Value
Dimensions (H x W x D), approx.
19.05 x 77.85 x 189.33 mm (0.75 x 3.07 x 7.45 in.)
Weight, approx.
0.10 kg (0.22 lb)
Enclosure type rating
None (open-style)
Pilot duty rating
NEMA DC-14
Isolation voltage
1799-D16U16B and 1799-D16U16BL modules:
50V (continuous), Basic Insulation Type
Type tested at 750V dc for 60 seconds, I/O to Network, I/O Group to
Group, and I/O (AUX) power to Network
No isolation between individual channels
1799-D16U16V and 1799-D16U16VL modules:
50V (continuous), Basic Insulation Type
Type tested at 2300V dc for 60 seconds, I/O to Network, I/O Group to
Group, and I/O (AUX) power to Network
No isolation between individual channels
Power dissipation
5 W max @ IO 30.0V dc DeviceNet 25V dc (whole board)
Thermal dissipation
17 BTU/hr max @ IO 30.0V dc DeviceNet 25V dc (whole board)
I/O and auxiliary power wire size
0.52...2.1 mm2 (24…20 AWG) solid or stranded copper wire rated at
80 °C (176 °F) or greater, 1.2 mm (3/64 in.) insulation max.
DeviceNet wire size
0.25...2.5 mm2 (22...14 AWG) solid or stranded copper wire rated at
80 °C (176 °F) or greater
Refer to DeviceNet Media Design Installation Guide, publication
DNET-UM072.
Wiring category(1)
(1)
2 - on signal ports
2 - on power ports
2 - on communication ports
Use this Conductor Category information for planning conductor routing. Refer to Industrial Automation Wiring and
Grounding Guidelines, publication 1770-4.1.
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16 Input/16 Output Digital Embedded I/O Boards
Environmental
Attribute
Value
Temperature, operating
IEC 60068-2-1 (Test Ad, Operating Cold),
IIEC 60068-2-2 (Test Bd, Operating Dry Heat),
IEC 60068-2-14 (Test Nb, Operating Thermal Shock):
-10...80 o C (14...176o F)
Temperature, storage
IEC 60068-2-1 (Test Ab, Unpackaged Nonoperating Cold),
IEC 60068-2-2 (Test Bb, Unpackaged Nonoperating Dry Heat),
IEC 60068-2-14 (Test Na, Unpackaged Nonoperating Thermal Shock):
-40...85 oC (-40...185 o F)
Relative humidity
IEC 60068-2-30 (Test Db, Unpackaged Damp Heat):
5...95% noncondensing
Vibration
IEC 60068-2-6 (Test Fc, Operating):
5 g @ 10...500 Hz
Shock, operating
IEC 60068-2-27 (Test Ea, Unpackaged Shock):
30 g
Shock, nonoperating
IEC 60068-2-27 (Test Ea, Unpackaged Shock):
50 g
Emissions
CISPR 11:
Group 1, Class A
ESD immunity
IEC 61000-4-2:
6 kV indirect contact discharges
Radiated RF immunity
IEC 61000-4-3:
10V/m with 1 kHz sine-wave 80% AM from 80…2000 MHz
10V/m with 200 Hz 50% Pulse 100% AM at 900 MHz
10V/m with 200 Hz 50% Pulse 100% AM at 1890 MHz
1V/m with 1 kHz sine-wave 80% AM from 2000…2700 MHz
Publication 1799-IN004F-EN-P - September 2008
16 Input/16 Output Digital Embedded I/O Boards
23
Environmental
Attribute
Value
EFT/B immunity
IEC 61000-4-4:
±2 kV at 5 kHz on power ports
±2 kV at 5 kHz on signal ports
±2 kV at 5 kHz on communication ports
Surge transient immunity
IEC 61000-4-5:
±500V line-line (DM) and ±1 kV line-earth (CM) on dc power ports
±1 kV line-line (DM) and ±2 kV line-earth (CM) on signal ports
±2 kV line-earth (CM) on communication ports
Conducted RF immunity
IEC 61000-4-6:
10V rms with 1 kHz sine-wave 80%AM from 150 kHz...80 MHz
Certifications
Certification (when
Value
product is marked)(1)
c-UR-us
UL Recognized Component Industrial Control Equipment, certified for US and
Canada. See UL File E65584.
CE
European Union 2004/108/EC EMC Directive, compliant with:
EN 61326-1; Meas./Control/Lab., Industrial Requirements
EN 61000-6-2; Industrial Immunity
EN 61000-6-4; Industrial Emissions
EN 61131-2; Programmable Controllers (Clause 8, Zone A & B)
C-Tick
Australian Radiocommunications Act, compliant with:
AS/NZS CISPR 11; Industrial Emissions
ODVA
ODVA conformance tested to DeviceNet specifications
(1)
See the Product Certification link at http://www.ab.com for Declaration of Conformity, Certificates, and other certification
details.
Publication 1799-IN004F-EN-P - September 2008
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Trademarks not belonging to Rockwell Automation are property of their respective companies.
Publication 1799-IN004F-EN-P - September 2008
Supersedes Publication 1799-IN004E-EN-P - May 2007
PN-31833
Copyright © 2008 Rockwell Automation, Inc. All rights reserved. Printed in the U.S.A.
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