TVS Diode Arrays Low Capacitance ESD Protection - SP3004 Series (SPA Diodes)

TVS Diode Arrays Low Capacitance ESD Protection - SP3004 Series (SPA Diodes)
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3004 Series
SP3004 Series 0.85pF Diode Array
RoHS
Pb GREEN
Description
The SP3004 has ultra low capacitance rail-to rail diodes
with an additional zener diode fabricated in a proprietary
silicon avalanche technology to protect each I/O pin
providing a high level of protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level (Level 4) specified in the
IEC 61000-4-2 international standard without performance
degradation. Their very low loading capacitance also makes
them ideal for protecting high speed signal pins such as
HDMI, DVI, USB2.0, and IEEE 1394.
Pinout
Features
I/O 1
I/O 4
GND
VCC
I/O 2
I/O 3
• Low capacitance of
0.85pF (TYP) per I/O
• Low leakage of 1nA MAX with VR=3.3V
• ESD protection of ±12kV
contact discharge,
±15kV air discharge,
(IEC61000-4-2)
• Small SOT563 package
saves board space
• EFT protection,
IEC61000-4-4, 40A
(5/50ns)
• Lightning Protection,
IEC61000-4-5, 4A
(8/20µs)
Functional Block Diagram
I/O4
VCC
I/O2
Applications
• Computer Peripherals
• Network Hardware/Ports
• Mobile Phones
• Test Equipment
• PDA’s
• Medical Equipment
• Digital Cameras
GND
I/O1
Application Example
I/O3
+5V
D2+
Additional Information
D2+
Gnd
D2-
D26
5
4
SP300x-04
1
2
3
D1+
Datasheet
Resources
Samples
D1+
Gnd
D1HDMI
or DVI
Connector
D1HDMI
or DVI
Interface
IC
D0+
D0+
Gnd
D0-
D06
5
4
SP300x-04
1
2
3
Clk+
Clk+
Gnd
Clk-
ClkGnd
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
A single 4 channel SP300x-04
device can be used to protect
four of the data lines in a
HDMI/DVI interface. Two (2)
SP300x-04 devices provide
protection for the main data
lines. Low voltage ASIC
HDMI/DVI drivers can also be
protected with the SP300x-04,
the +VCC pins on the SP300x-04
can be substituted with a
suitable bypass capacitor or in
some backdrive applications the
+VCC of the SP300x-04 can be
floated or NC.
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3004 Series
Thermal Information
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
IPP
Peak Current (tp=8/20μs)
4
A
TOP
Operating Temperature
–40 to 125
°C
TSTOR
Storage Temperature
–55 to 150
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Parameter
Rating
Units
Storage Temperature Range
–55 to
150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Test Conditions
Reverse Standoff Voltage
VRWM
Reverse Leakage Current1
ILEAK
VC
Clamp Voltage1
ESD Withstand Voltage1
VESD
Dynamic Resistance
RDYN
Diode Capacitance1
CI/O-GND
Diode Capacitance
CI/O-I/O
1
Min
Typ
Max
Units
IR ≤ 1µA
6
V
VR=3.3V
1
nA
IPP=1A, tp=8/20µs, Fwd
10.0
12.0
V
IPP=2A, tp=8/20µs, Fwd
11.8
15.0
V
IEC61000-4-2 (Contact)
±12
kV
IEC61000-4-2 (Air)
±15
kV
(VC2 - VC1) / (IPP2 - IPP1)
1.8
Ω
Reverse Bias=0V
0.95
1.1
1.25
pF
Reverse Bias=1.65V
0.7
0.85
1
pF
Reverse Bias=0V
0.5
pF
Note: 1 Parameter is guaranteed by design and/or device characterization.
Insertion Loss (S21) I/O to GND
Capacitance vs. Bias Voltage
1.50
0
1.40
I/O Capacitance (pF)
Insertion Loss [dB]
1.30
-5
-10
-15
1.20
VCC = Float
1.10
1.00
VCC = 3.3V
0.90
0.80
VCC = 5V
0.70
0.60
0.50
-20
1.E+06
1.E+07
1.E+08
Frequency [Hz]
1.E+09
1.E+10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
I/O DC Bias (V)
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3004 Series
Capacitance vs. Frequency
Leakage Current vs Temperature
2E-12
1000
1.8E-12
5V Bias
I/O to GND Leakage (pA)
1.6E-12
Capacitance [F]
1.4E-12
1.2E-12
1E-12
8E-13
6E-13
4E-13
3.3V Bias
100
10
2E-13
0
1.E+06
1.E+07
1.E+08
1
1.E+09
0
25
45
65
Temperature ( ºC)
Frequency [Hz]
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Product Characteristics
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
tP
TP
Temperature
Reflow Condition
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
Time
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3004 Series
Package Dimensions — SOT563
A
D
6
5
2
4
E
3
Package
L
SOT 563
Pins
6
Millimeters
Solder Pad Layout
HE
Max
Min
Max
0.50
0.60
0.020
0.024
B
0.17
0.27
0.007
0.011
c
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
A
e
c
B
0.50 BSC
e
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
G* 4
SP3004-04X T G
G*4
G= Green
Product Series
Number of Channels
Number of Channels
G = SP3004 series
T= Tape & Reel
Series
0.020 BSC
L
Part Marking System
Part Numbering System
TVS Diode Arrays
(SPA® Diodes)
Inches
Min
Assembly Site
(varies)
Package
X = SOT563
-04 = 4 channel
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP3004-04XTG
SOT563
G*4
3000
Embossed Carrier Tape & Reel Specification — SOT563
Millimetres
Min
Pin 1 Location
User Feeding Direction
Inches
Max
Min
Max
0.073
E
1.65
1.85
0.065
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
0.45
0.55
0.017
0.021
P0
3.90
4.10
0.154
0.161
10P0
40.0± 0.20
1.574±0.008
W
7.70
8.10
0.303
P
3.90
4.10
0.153
0.318
0.161
A0
1.73
1.83
0.068
0.072
B0
1.73
1.83
0.068
0.072
K0
0.64
0.74
0.025
0.029
t
0.22 max
0.009 max
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
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