MAX8505

MAX8505
MAX8505EEE+
RELIABILITY REPORT
FOR
MAX8505EEE+
PLASTIC ENCAPSULATED DEVICES
January 29, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX8505EEE+
Conclusion
The MAX8505EEE+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX8505 step-down regulator operates from a 2.6V to 5.5V input and generates an adjustable output voltage from 0.8V to 0.85 x VIN at up to 3A.
With a 2.6V to 5.5V bias supply, the input voltage can be as low as 2.25V. The MAX8505 integrates power MOSFETs and operates at 1MHz/500kHz
switching frequency to provide a compact design. Current-mode pulse-width-modulated (PWM) control simplifies compensation with ceramic or
polymer output capacitors and provides excellent transient response. The MAX8505 features 1% accurate output over load, line, and temperature
variations. Adjustable soft-start is achieved with an external capacitor. During the soft-start period, the voltage-regulation loop is active. This limits the
voltage dip when the active devices, such as microprocessors or ASICs connected to the MAX8505's output, apply a sudden load current step upon
passing their undervoltage thresholds. The MAX8505 features current-limit, short-circuit, and thermal-overload protection and enables a rugged
design. Open-drain power-OK (POK) monitors the output voltage. Learn More About PowerMind(tm)
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MAX8505EEE+
II. Manufacturing Information
A. Description/Function:
3A, 1MHz, 1% Accurate, Internal Switch Step-Down Regulator with Power-OK
B. Process:
B8
C. Number of Device Transistors:
D. Fabrication Location:
Texas
E. Assembly Location:
Unisem Malaysia, ATP Philippines, UTL Thailand
F. Date of Initial Production:
October 25, 2003
III. Packaging Information
A. Package Type:
16-pin QSOP
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Gold (2 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-3501-0041
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
120°C/W
K. Single Layer Theta Jc:
37°C/W
L. Multi Layer Theta Ja:
105°C/W
M. Multi Layer Theta Jc:
37°C/W
IV. Die Information
A. Dimensions:
86 X 144 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
0.8 microns (as drawn)
F. Minimum Metal Spacing:
0.8 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX8505EEE+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
MTTF
=
1.83
192 x 4340 x 48 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.4 x 10
= 22.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the B8 Process results in a FIT Rate of 2.71 @ 25C and 17.30 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The PM60 die type has been found to have all pins able to withstand a HBM transient pulse of +/-200 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
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MAX8505EEE+
Table 1
Reliability Evaluation Test Results
MAX8505EEE+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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