Temperature measurement and compensation in – hybrid circuits – data systems

Temperature measurement and compensation in – hybrid circuits – data systems
Temperature Measurement
B57621
SMD NTC Thermistors with Silver Palladium Termination, Size 1206
Applications
1,6±0,2
C 621
1,3 max.
■ Temperature measurement and
3,2±0,2
compensation in
– hybrid circuits
– data systems
– telecom systems
– automotive electronics
0,5±0,25
Features
■ Silver palladium termination (AgPd)
■ Cost-effective
■ Suitable for wave and reflow soldering
Termination
Options
TNT0398-F
Dimensions in mm/Approx. weight 18 mg
Alternative resistance ratings and resistance tolerance
< 5% available on request
Delivery mode
Blister tape, 180-mm reel, PU: 4000 or 2000 pcs, depending on chip thickness
Climatic category (IEC 60068-1)
Max. power at 25 °C (on PCB)
Resistance tolerance
Rated temperature
B value tolerance
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
P25
∆R N/R N
TN
∆B/B
δth1)
τc1)
Cth1)
B25/85
55/125/21
300
± 5 %, ± 10 %, ± 20 %
25
±3%
approx. 5
approx. 10
approx. 50
B 25/100
mW
°C
mW/K
s
mJ/K
Ordering code
No. of R/T
characteristic
B 25/50
K
K
K
2,2 k
1308
3010
3040
3060
B57621C0222+062
3,3 k
1309
3430
3500
3520
B57621C0332+062
4,7 k
1309
3430
3500
3520
B57621C0472+062
10 k
1010
3470
3510
3530
B57621C0103+062
15 k
1008
3480
3550
3560
B57621C0153+062
22 k
1008
3480
3550
3560
B57621C0223+062
33 k
2003
3930
3960
3980
B57621C0333+062
47 k
2001
3860
3890
3920
B57621C0473+062
68 k
2001
3860
3890
3920
B57621C0683+062
R 25
Ω
+: J for ∆RN/RN = ± 5 %
K for ∆RN/RN = ± 10 %
M for ∆RN/RN = ± 20 %
1) Depends on mounting situation
60
05/02
Temperature Measurement
B57621
SMD NTC Thermistors with Silver Palladium Termination, Size 1206
R 25
No. of R/T
characteristic
Ω
B 25/50
B 25/85
B 25/100
C 621
Ordering code
K
K
K
100 k
4901
3870
3930
3950
B57621C0104+062
150 k
2903
4120
4190
4200
B57621C0154+162
220 k
2903
4120
4190
4200
B57621C0224+062
330 k
1014
4090
4210
4250
B57621C0334+062
470 k
1014
4090
4210
4250
B57621C0474+062
+: J for ∆RN/RN = ± 5 %
K for ∆RN/RN = ± 10 %
M for ∆RN/RN = ± 20 %
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Standard
Test conditions
∆R25/R 25
(typical)
Storage in
dry heat
IEC
60068-2-2
JIS C 0021
Storage at upper
category temperature
T: (125 ± 2) °C
t: 1000 h
<3%
Storage in damp
heat, steady state
IEC
60068-2-3
JIS C 0022
Temperature of air: (40 ± 2) °C
Relative humidity of air:
(93 +2/–3) %
Duration: 21 days
<3%
Rapid temperature
cycling
IEC
60068-2-14
JIS C 0025
Lower test temperature: – 55 °C < 3 %
Upper test temperature: 125 °C
Number of cycles: 10
Endurance
Solderability
Pmax: 300 mW
T: (65 ± 2) °C
t: 1000 h
IEC
60068-2-58
JIS C 0054
95 % of
terminations
wetted
Solderability:
(215 ± 3) °C / (3 ± 0,3) s
(235 ± 5) °C / (2 ± 0,2) s
Reflow soldering profile
Wave soldering profile
61
No visible
damage
<5%
Resistance to soldering heat:
(260 ± 5) °C / (10 ± 1) s
Resistance drift
after soldering
Remarks
05/02
<5%
Herausgegeben von EPCOS AG
Unternehmenskommunikation, Postfach 80 17 09, 81617 München, DEUTSCHLAND
++49 89 636 09, FAX (0 89) 636-2 26 89
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Published by EPCOS AG
Corporate Communications, P.O. Box 80 17 09, 81617 Munich, GERMANY
++49 89 636 09, FAX (0 89) 636-2 26 89
(
 EPCOS AG 2002. Reproduction, publication and dissemination of this brochure and the information contained therein without
EPCOS’ prior express consent is prohibited.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics
Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers’ Association), unless otherwise agreed.
This brochure replaces the previous edition.
For questions on technology, prices and delivery please contact the Sales Offices of EPCOS AG or the international Representatives.
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also contact one of our Sales Offices.
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