TVS Diode Arrays SP1007 Series 3.5pF 8kV Bidirectional Discrete TVS

TVS Diode Arrays SP1007 Series 3.5pF 8kV Bidirectional Discrete TVS
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1007 Series
SP1007 Series 3.5pF 8kV Bidirectional Discrete TVS
RoHS
Pb GREEN
Description
The SP1007 includes back-to-back Zener diodes fabricated
in a proprietary silicon avalanche technology to provide
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes at the
maximum level specified in the IEC61000-4-2 international
standard (Level 4, ±8kV contact discharge) without
performance degradation. The back-to-back configuration
provides symmetrical ESD protection for data lines when
AC signals are present.
Pinout
Features
0201 Flipchip
1
2
• ESD, IEC61000-4-2, ±8kV
contact, ±15kV air
• Low capacitance of 5pF
(TYP @ VR=5V)
• EFT, IEC61000-4-4, 40A
(5/50ns)
• Low leakage current of
0.1μA at 5V
• Lightning, IEC61000-4-5,
2A (tP=8/20μs)
• Space efficient 0201 and
0402 footprint
SOD882
Applications
1
2
• Mobile Phones
• MP3/PMP
• Smart Phones
• Camcorders
• Portable Navigation
Devices
• Portable Medical
• Tablets
• Digital Cameras
• Point of Sale Terminals
Functional Block Diagram
Application Example
2
1
I/O Controller
Keypads
P1
Additional Information
P2
Outside
World
Datasheet
Resources
P3
IC
P4
SP1007 (x4)
Samples
GND
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1007 Series
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
2.0
A
Operating Temperature
–40 to 125
°C
Storage Temperature
–55 to 150
°C
IPP
Peak Current (tp=8/20μs)
TOP
TSTOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Storage Temperature Range
Rating
Units
–55 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 20-40s)
260
°C
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Reverse Standoff Voltage
VRWM
Test Conditions
Min
Typ
Max
Units
6.0
V
Breakdown Voltage
VBR
IR=1mA
8.5
9.5
V
Leakage Current
ILEAK
VR=5V with 1 pin at GND
0.1
0.5
μA
IPP=1A, tp=8/20µs, Fwd
11.2
V
IPP=2A, tp=8/20µs, Fwd
13.1
V
(VC2 - VC1) / (IPP2 - IPP1)
1.9
Ω
Clamp Voltage1
VC
Dynamic Resistance
RDYN
ESD Withstand Voltage1
VESD
Diode Capacitance
1
IEC61000-4-2 (Contact Discharge)
±8
kV
IEC61000-4-2 (Air Discharge)
±15
kV
CD
Note:
Parameter is guaranteed by design and/or device characterization.
1
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
Reverse Bias=0V
5
6
pF
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1007 Series
Capacitance vs. Reverse Bias
Pulse Waveform
7.0
110%
100%
6.0
90%
SP1007-01ETG
80%
Percent of IPP
Capacitance (pF)
5.0
4.0
SP1007-01WTG
3.0
2.0
70%
60%
50%
40%
30%
20%
1.0
10%
0%
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
5.0
10.0
Insertion Loss (S21) I/O to GND
-5
Attenuation (dB)
-10
-15
-20
-25
-30
-35
-40
25.0
30.0
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
-45
100
20.0
Product Characteristics of SOD-882 Package
0
10
15.0
Time (μs)
Bias Voltage (V)
1000
Frequency (MHz)
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
260
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
Peak Temperature (TP)
+0/-5
tP
TP
Temperature
Reflow Condition
tS
time to peak temperature
Time
°C
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1007 Series
Part Numbering System
Ordering Information
SP 1007 – 01 x T G
TVS Diode Arrays
(SPA® Diodes)
G= Green
T= Tape & Reel
Part Number
Package
Marking
Min. Order Qty.
SP1007-01WTG
0201 Flipchip
••
10,000
SP1007-01ETG
SOD882
•b
10,000
Series
Package
W: 0201 Flipchip
E: SOD882
Number of
Channels
Part Marking System
b
SP1007-01ETG
SP1007-01WTG
Package Dimensions — 0201 Flip Chip
A
0201 Flipchip
Symbol
B
F
D
E
D
Inches
Min
Typ
Max
Min
Typ
Max
A
0.595
0.620
0.645
0.0234
0.0244
0.0254
B
0.295
0.320
0.345
0.0116
0.0126
0.0136
C
0.245
0.275
0.305
0.0096
0.0108
0.0120
C
G
Millimeters
D
0.145
0.150
0.155
0.0057
0.0059
0.0061
E
0.245
0.250
0.255
0.0096
0.0098
0.0100
F
0.245
0.250
0.255
0.0096
0.0098
0.0100
G
0.005
0.010
0.015
0.0002
0.0004
0.0006
Package Dimensions — SOD882
Symbol
0.325
0.325
0.650
0.650
0.975
Recommended Soldering Pad Layout
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
Package
SOD882
JEDEC
MO-236
Millimeters
Inches
Min
Typ
Max
Min
Typ
Max
A
0.90
1.00
1.10
0.035
0.039
0.043
B
0.50
0.60
0.70
0.020
0.024
0.028
C
0.40
0.50
0.60
0.016
0.020
0.024
0.45
D
0.018
E
0.20
0.25
0.35
0.008
0.010
0.012
F
0.45
0.50
0.55
0.018
0.020
0.022
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1007 Series
Embossed Carrier Tape & Reel Specification — 0201 Flipchip
P1
P2
D
P0
0.30
E
0.28
F
W
0.75
0.19
D1
T
*Sizes in mm
A0
K0 B0
Recommended Solder Pad Footprint
Symbol
Millimeters
A0
0.41±0.03
B0
0.70±0.03
D
ø 1.50 + 0.10
D1
ø 0.20 ± 0.05
E
1.75±0.10
F
3.50±0.05
K0
0.38±0.03
P0
2.00±0.05
P1
2.00±0.05
P2
4.00±0.10
W
8.00 + 0.30 -0.10
T
0.23±0.02
Embossed Carrier Tape & Reel Specification — SOD882
D evice Orientation in Tape
Symbol
Millimeters
A0
0.70±0.045
B0
1.10±0.045
K0
0.65±0.045
F
3.50±0.05
P1
2.00±0.10
W
8.00 + 0.30 -0.10
Pin 1 Location
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/26/15
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