2515KB

2515KB
ZENIGATA LED
July 30, 2014
SPECIFICATIONS
Pico ZENIGATA-LED
GM2AA50GV6*
*:1.2
Notice
Contents in this technical document be changed without any notice due to the product modification.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc.
Development DepartmentⅡ
Lighting Device Division
http://www.sharp-world.com/products/device/
Electronic Components And Devices Group
SHARP CORPORATION
sharp LD-E7-9-14-A
Model No. GM2AA50GV6*
Contents in this technical document be changed without any notice due to the product modification.
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●Handle this document carefully it contains material protected by international
copyright law. Any reproduction, full or in part, of this material is prohibited
without the express written permission of the company.
●When using the products covered herein,please observe the conditions written herein
and the precautions outlined in the following paragraphs. In no event shall the
company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions.
(1) Please do verify the validity of this part after assembling it in customerʼs products,when
customer wants to make catalogue and instruction manual based on the specification sheet of this part.
(2) The products covered herein are desigd and manufactured for the following application areas.
When using the products covered herein for the equipment listed in paragraph(3),even for the following
application areas, be sure to observe the precautions given in Paragraph(3).
Never use the products for the equipment listed in Paragraph(4).
・Office electronics
・Instrumentation and measuring equipment
・Machine tools
・Audiovisual equipment
・Home appliances
・Communication equipment other than for trunk lines
(3) These contemplating using the products covered herein for the following equipment which demands
high reliability, should first contact a sales representative of the company and then accept responsibility
for incorporating into the design fail-safe operation,redundansy, and other appropriate measures for
ensuring reliability and safety of the equipment and the overall system.
・Control and safety devices for airplanes, trains,automobiles, and other transportation equipment
・Mainframe computers
・Traffic control systems
・Gas leak detectors and automatic cutoff devices
・Rescue and security equipment
・Other safety devices and safety equipment, etc.
(4) Do not use the products covered herein for the followin equipment which demands extremely
high performance in terms of functionality, reliability, or accuracy.
・Aerospace equipment
・Communications equipment for trunk lines
・Control equipment for the nuclear power industry
・Medical equipment related to life support, etc.
(5) Please direct all queries and comments regarding the interpretation of the above four Paragraphs to
a sales representative of the company.
sharp LD-E7-9-14-A
Model No. GM2AA50GV6*
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GM2AA50GV6* Technical literature
1.Application
These technical literatures apply to light emitting diode Model No.GM2AA50GV6*
[ LED module (InGaN Blue LED chip + Phosphor) ]
Main application : Lighting
2. External dimensions and equivalent circuit
Refer to Page 2.
3. Ratings and characteristics
Refer to Page 3-6.
3-1.
3-2.
3-3.
3-4.
Absolute maximum ratings
Electro-optical characteristics
Derating curve
Characteristics diagram (TYP.)
4. Reliability
Refer to Page 7-8.
4-1. Test items and test conditions
4-2. Failure criteria
5. Quality level
Refer to Page 9.
5-1. Applied standard
5-2. Sampling inspection
5-3. Inspection items and defect criteria
6. Supplements
6-1.
6-2.
6-3.
6-4.
6-5.
Refer to Page 10-16.
Chromaticity rank table
Taping
Label
Packing
Indication printed on product
7. Precautions
Refer to Page 17-20.
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3.2
2.8
2. External dimensions and equivalent circuit
3.2
(0.6)
(min.0.3±0.1)
2.1
3.2
- Cathode
← Protection Circuit
(0.35)
(1.2)
(0.35)
3.2
(0.3)
(1.0)(0.5)(1.0)
(2.4)
(0.3)
+ Anode
・ Unspecified tolerance to be ±0.2
This tolerance does not include dimensions of resin and substrate burr remained on edge.
・ Values inside parentheses are reference values.
・ Tc: Measurement point of case temperature
Unit
mm
Finish
Material
Substrate : Ceramics
Terminal:Au plating
Lens : Silicone resin
2
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3. Ratings and characteristics
3-1. Absolute maximum ratings
Parameter
Symbol
Applied temperature
[℃]
Rating
Operating temperature
(Note 1)
Tc
-
-30 to +100
℃
Storage temperature
(Note 2)
Tstg
-
-40 to +100
℃
Power dissipation (Note 3)
P
-30 ≦ Topr ≦ 85
1600
mW
-
85 < Topr ≦ 100
42.7
mW/℃
IF
-30 ≦ Topr ≦ 85
250
mA
-
85 < Topr ≦ 100
6.7
mA/℃
I FM
-30 ≦ Topr ≦ 85
400
mA
-
85 < Topr ≦ 100
10.0
mA/℃
VR
Tc=25
5
V
Tsol
-
350
℃
Derating factor
Forward current (Note 4)
Derating factor
Peak pulsed forward current
Derating factor
Derating factor
Soldering temperature
(Note 5)
Unit
(Note 1) The range of operating temperature is prescribed by case temperature,
Case temperature (Refer to Page 2, External dimensions and equivalent circuit)
(Note 2)Do not exceed specified temperature range under any packing condition.
(Except when baking and soldering)
(Note 3) The operating current value follows the derating curve. (Refer to Page 5)
(Note 4) Duty ratio = 1/10, Pulse width = 100 μs.
(Note 5) Each terminal must be soldered with the soldering iron (under 60W) within 3 seconds
(only once). Solder tip temperature: under 350℃
As for the reflow soldering profile, please refer to Page 19.
3
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3-2. Electro-optical characteristics
Parameter
Symbol
Forward voltage
Luminous flux
(Note 1)
Chromaticity coordinates
(Note 2)
Color rendering index
(Note 3)
(Tc=25℃)
MIN.
TYP.
MAX.
Unit
VF
5.60
(5.95)
6.40
V
Φv
100
(125)
140
lm
0.3301
(0.3447)
0.3627
y
0.3296
(0.3553)
0.3840
Ra
65
(70)
-
x
Conditions
I F =150mA
(Note 1) Monitored by 8 inch integrating sphere of Sharp Standard. (After 20 ms drive) (Tolerance: ±10%)
(Note 2) Measured by 8 inch integrating sphere of Sharp Standard. (After 20ms drive) (Tolerance: ±0.01)
(Note 3) Measured by 8 inch integrating sphere of Sharp Standard. (After 20ms drive) (Tolerance: ±5)
(Note 4) Values inside parentheses are indicated only for reference, and are not guaranteed.
4
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3-3. Derating Curve
Peak Pulsed Forward Current Derating Curve
Forward Current I F (mA)
Peak Pulsed Forward Current I FM (mA)
Forward Current Derating Curve
Case Temperature Tc (℃)
Case Temperature Tc (℃)
Peak Pulsed Forward Current I FM (mA)
Peak Pulsed Forward Current vs. Duty Ratio
Duty Ratio
5
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3-4.Characteristics Diagram (TYP.)
Forward Current vs. Forward Voltage
Forward Current I
F
(mA)
Relative Luminous Flux (%)
Relative Luminous flux vs. Forward Current
Forward Voltage V F (V)
Forward Current I F (mA)
Forward Voltage VF (mA)
Relative Luminous Flux (%)
Relative Luminous flux vs. Case Temperature
Case Temperature Tc (℃)
Case Temperature Tc (℃)
6
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4.Reliability
4-1. Test items and test conditions
(Confidence level:90%)
Samples
Defective
n
C
-40℃(30min)to +100℃(30min),100cycles
22
0
10
Temperature humidity storage
Tstg = +60℃,RH = 90%,Time = 1 000h
22
0
10
3
High temperature storage
Tstg = +100℃,Time = 1 000h
22
0
10
4
Low temperature storage
Tstg = -40℃,Time = 1 000h
22
0
10
5
Steady state operating life
at room temperature
Tc =25℃,I F = 250 mA,Time = 1 000h
22
0
10
6
Steady state operating life
at high temperature
22
0
10
7
Steady state operating life
at high temperature and
elevated humidity
22
0
10
11
0
20
No.
Test items
1
Temperature cycle
2
8
Test conditions
Tc = +100℃,I F= 150 mA,Time = 1 000h
Tc = +60℃,RH=90%,I F= 250 mA,Time = 500h
2
Shock
Acceleration: 15 000 m/s2, Pulse width: 0.5 ms,
Tc = +25 ℃
Direction: X, Y and Z, 3 trials in each direction
7
LTPD
(%)
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9
Vibration
10 Resistance to soldering heat
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Acceleration: 200 m/s2
Frequency: 100 to 2 000 Hz (round-trip) 4 min
Tc = +25 ℃
Direction: X, Y and Z
4 trials in each direction
11
0
20
2 trials, under the reflow condition
mentioned in Page 23.
11
0
20
11
0
20
11
0
20
M705/ESR-250
Solder/ Flux: M705/ ESR 250
(SENJU METAL INDUSTRY CO., LTD)
11
Solderability
(Solder dip)
Pretreatment
①High temp. storage : 150℃, 1h
②PCT(105℃, 100%RH, 1.22×105Pa, 4h)
Applied only to terminal part
Soldering Temperature:Tsol=240℃±2℃, 3s,
Dipping depth:0.2~0.25mm
(After pretreatment, leave 2h or more at room
temperature and humidity. Dipping
flux in 3~5s and soldering)
M705-221BM5-42-11
Solder: M705-221BM5-42-11
(SENJU METAL INDUSTRY CO., LTD)
12
Solder joint strength
under the reflow condition mentioned
in Page 23
Temperature cycle
-40℃~+100℃(30min.), 100cycles
8
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5.Quality level
5-1. Applied standard(ISO 2859-1)
5-2. Sampling inspection(A single normal sampling plan, level S-4)
5-3. Inspection items and defect criteria
No.
Inspection items
1
No radiation
2
Radiation color
3
Taping
4
Electro-optical
characteristics
5
External dimensions
6
Appearance
Defect criteria
Classification
AQL
Major defect
0.1
Minor defect
0.4
No light emitting
Different from the specified color
Not conforming to the inserted direction shown
in the specification
Not satisfied with specified values for VF, IR,
φ and chromaticity coordinates mentioned in Page 4
Not satisfied with specified dimensions in Page 2
Foreign substances and scratches of light
emitting face which are obstructed light
emitting condition.
(Except removable foreign substance)
Resin or substrate burr which is over 0.3mm
Resin crack and terminal crack, which are over φ0.3 mm
9
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6.Supplements
6-1. Chromaticity diagram of each model
Rank
GM2BB50GT4E
Point1
x
0.3551
(Tc=25℃)
Point2
y
x
0.3760
0.3376
Point3
y
0.3616
Point4
x
y
x
y
0.3366
0.3369
0.3515
0.3487
(I F =50mA Tolerance:±0.01)
(Note 1) Model name of Rank "fa": GM2AA50GV61
Model name of Rank "fa", "fb", "fc": GM2AA50GV62
The basic order(delivery)ratio of GM2AA50GV61 : GM2AA50GV62 is 2:1.
It discusses, when changing a order ratio.
(Note 2)Chromaticity rank "fa" is ellipse step-5 of MacAdam.
Parameter of the ellipse of MacAdam.
-Ellipse center chromaticity coordinate x,y = (0.344 7, 0.355 3)
[ANSI C78.377-2008 conformity]
-g11=560 000 and 2g12=-500 000 and g22=280 000
[ANSI C78.376-2001 conformity].
(Note 3)Chromaticity rank "fb", "fc" are the area except the quadrangle surrounded by
four chromaticity coordinates to "fa"rank (ellipse).
fc
fa
fb
10
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6-2.Taping
6.2.1 Shape and dimensions of tape (Ref.)
P0
t1
W0
W1
B
F
E
P2
Feeding direction
t3
P1
t2
A
Cathode Mark
Symbol Dimension [mm]
Parameter
Pocket
(embossed)
Sprocket hole
Length
A
3.6
Width
B
3.6
Pitch
P1
8.0
Diameter
D0
1.5
Pitch
P0
4.0
Accumulated error ±0.5 mm/ 10 pitch
E
1.75
Dimension from the edge of the tape
to the center of the sprocket hole
P2
2.0
F
5.5
Width
W1
9.3
Thickness
t3
0.1
Width
W0
12.0
Thickness
t1
0.25
t2
2.7
Sprocket hole position
Pocket position
Cover tape
Carrier tape
Remarks
Overall thickness of the taping
11
Measured at inside bottom
square corner
Dimension at the extension of the
center lines of the pocket to the
center line of the sprocket hole
Including the thickness of cover and
carrier tape
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A
B
C
0.2
0.4
0.6
W
Parameter
Hub
0.8
t
Label
Flange
0.6
0.4
0.2
0.8
E
U
6-2-2.Shape and dimensions of reel (Ref.)
Symbol
Dimension [mm]
Diameter
A
180
Thickness
t
1.1
Clearance between the flanges
W
13
External diameter
B
60
Spindle hole diameter
C
13
Width
E
2.0
Depth
U
4.5
Key slit
Indication of Model No. etc.
Remarks
Dimension measured close to the core
Label attached on flange (Model No., quantity, Lot No. etc.)
Materials: Polystyrene
12
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6-2-3.Taping technical specification
Feeding direction
Empty
LEDs inside
Leader(Empty)
MIN. 160mm
MIN. 400mm
Cover tape separation
F
Cover Tape
0.1N ~ 1.0N(Θ=10°以下)
0 ~ 10°
Forward
Tape speed:5mm/s
Carrier Tape
(1)Tape strength against bending: The radius of curvature should be more than 30 mm.
If i bent at less than 30 mm, the cover may peel off.
(2) Joint of the tape: No joint of cover tape or carrier tape in one reel
(3) Quantity: 1 000 pcs. per reel (standard)
(4) Product mass: Approx. 30mg (One piece of LED/ Reference value)
(5) Others:
①There are no continuous empty pockets except leader and trailer part.
②The quantity of the products lacking should be less than 0.1% of total product quantity.
③Products should not be attached to the cover tape when it peeled off.
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6-3.Label (on reel)
EIAJC-3 compliant bar code (format e) label is attached on each reel.
<Example>
SHARP CORPORATION
PART No.
GM2AA50GV6*
QUANTITY
1 000
← Model No.
← Product quantity
← EIAJ C-3 Bar codes
LOT No. XX12J19/ RANK ○△△-□
〈EIAJ C-3〉 MADE IN XXXX
← LOT number and rank
← Production country
<LOT Number>
XX
12
C
19
①
②
③
④
① Production plant code (to be indicated alphabetically)
② Year of production (the last two figures of the year)
③ Month of production
(to be indicated alphabetically with January corresponding to A)
④ Date of production (01 to 31)
<Rank>
RANK○△△-□: ○ Luminous flux rank
△△ Chromaticity rank
□ Forward voltage rank
14
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6-4.Packing
6-4-1.Moisture proof packing
In order to avoid the absorption of humidity while transport and storage,
the devices are packed in moisture proof aluminum bags.
Aluminum bag
Label
SHIPMENT TABLE
GM2AA50GV6*
PART No.
QUANTITY. 1000
RANK
LOT No.
XXXXXXXXXXX
SHARP
CORPORATION
M ADE IN XXXX
Silica gel
○△△-□
R.C.
(※1)
SHARP LABEL
Reel
Label(EIAJ C-3 compliant)
(Note 1) This mark indicates that this product is RoHS compliant product designed and
manufactured in accordance with Sharp's Green Device Guidelines.
6-4-2.Recommended storage conditions
Temperature: 5℃to 30 ℃ Relative humidity: 85% or less
6-4-3.Precautions after opening aluminum bags
①Please be sure to give them the soldering within 7 days under the following
conditions. Temperature: 5 ℃to 30 ℃ Relative humidity: 60% or less
②Storage in a dry box is recommended in case that the products are not used for
a long time after opened. Or repack the reels with a desiccative by the sealer
and store them under the same conditions mentioned in 5.3.2.
③Please perform the baking treatment under the recommended conditions in the
following cases;
・ The blue indicator of silica gel changes its color or fades.
・ 7days passed after opened under the specified storage conditions.
・ Products were stored out of storage condition.
(Recommended baking conditions)
・ Products with taping
Temperature: 60 ℃to 65 ℃, Time: 36 to 48 hours
・ Single piece of the products (on PCB or metallic tray)
Temperature: 100 ℃to 120 ℃, Time: 2 to 3 hours.
Avoid piling up the reels or applying stress to them during baking so as to protect from
deformation. Please be sure to cool them to room temperature after baking.
15
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6-5.Information on environmental impact substances
6-5-1.RoHS compliant product
This product complies with the RoHS Directive (2011/65/EU) and manufactured
in accordance with Sharp's Green Device Guidelines.
6-5-2. Information relating to China RoHS
Product Information Notification based on Chinese law, Management Methods for
Controlling Pollution by Electronic Information Products.
Names and Contents of the Toxic and Hazardous Substances or Elements in the Products.
Toxic and Hazardous Substances or Elements.
Lead
Mercury
Cadmium
Hexavalent
Chromium
Polybrominated
Biphenyls
Polybrominated Diphenyl
Ethers
(Pb)
(Hg)
(Cd)
(Cr(VI))
(PBB)
(PBDE)
○
○
○
○
○
○
○:indicates that the content of the toxic and hazardous substance in all the homogeneous
materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006.
×:indicates that the content of the toxic and hazardous substance in at least one
homogeneous material of the part exceeds the concentration limit requirement
as described in SJ/T 11363-2006 standard.
6-5-3.Ozone Depleting Substances
・ This product does not contain the following Ozone Depleting Substances.
・ This product does not have a production line whose process requires the
following Ozone Depleting Substances.
・ Restricted substances: CFCs, Halones, CCl4, and 1, 1, 1-Trichloroethane
(Methyl chloroform)
16
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7 Precautions
7-1.General handling
① The voltage must be applied to LED only as a forward direction. Moreover, please design
circuit diagram considering no voltage gap between Anode and Cathode during off state.
If the reverse voltage is applied to LED for a long term, the electro-migration is generated
and there is a possibility of the short-circuit of the circuit.
② This product is sensitive for electrostatic voltageand surge voltage.Static electricity or surge
voltage can deteriorate product and its reliability. Please make sure that all devices and
equipments must be grounded.
We recommend to built in zener diode or TVS(Transient Voltage Suppression) as
protectioncircuit against static electricity.
③ This product is composed of blue LED chip and special phosphor.
Color tone is possibleto vary in some degree, depending on the operating conditions such
as ambient temperature or current amount. Also it is subject to variation due to the
afterglow of the phosphor in pulse drive.
So please verify the performancebefore use.
④ Do not look directly at LEDs with unshielded eyes, or damage to your eyes may result.
⑤ Materials with high thermal conductivity are used in this product in order to allow generated
heat to escape effectively out of the product.Avoid locating other heat sources
(ex. resistance, etc.) near the products on circuit board to protect the devices from the
heatdamage. Please make sure that case temperature is always under 100 ℃
during operation, including the self-heating.
⑥ Since dust on the surface of the radiation part is hard to remove and may decrease the
luminous intensity, please handle the products in a clean, non-dusty condition.
⑦ The lensof this product is formed with silicone resin. In the case of handling this device,
please do not push the lens portion by the sharp tools. The crackandpeeloffof the lens,
and the wire deformation are generated and it causes not lighting.
・ Especially do not apply the load from horizontal direction to the side of the lens of this product.
・ Please do not apply the static loadof 2.5N or more (1.4mmφor less)fromthe diagonal 45
degrees of this productslens portion to the direction of an optical axis.
⑧ This product is the small size andthe lens portion is formed by silicone resin, there isa
possibilityto have damage by the external stress.
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・ In the case of the handling withthe tweezers
In the case of the handling with the tweezers, please pick up the products with the sides of the
ceramic substrate and do not touch the lens portion .
・ In the case of the mount of the product
Please use this productafter confirming the mounting condition,
1.4mm 1.66mm
because there is a possibility to have damage by the external stress
when the load is applied by the collet of the mounter.
Please see the recommended collet of this product as right picture.
3.0mm
3.6mm
⑨ Please make sure not to apply any external stress to resin after mounted as well.When the
substrate bends after mounted, the product might be applied by an external stress, and
thecrack will be generated in the soldering part.
Please arrange the product in the direction not stressed for thewarp of the substrate after
mounted.
⑩ Please do not pile the substrate after this product is mounted.This product will be damaged
by the substrate, and it causes the crack ofthe lens and not lighting bythe inner-wire
deformation or wiringdisconnection.
⑪ The products are not designed for the use under any of the following conditions. Please verify
their performance and reliability well enough if you use under any of the following conditions;
(1) In a place with a lot of moisture, dew condensation, briny air, and corrosive gas
(Cl, H2S, NH3, SO2, NOX, etc.)
(2) Under the direct sunlight, outdoor exposure, and in a dusty place
(3) In water, oil, medical fluid, and organic solvents
⑫ Guarantee covers the compliance to the quality standards mentioned in the Specifications;
however it does not cover the compatibility with application in the end-use, including assembly
and usage environment.
In case any quality problems occurred in the application of end-use, details will be separately
discussed and determined between the parties hereto.
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7-2 Soldering
This product is reflow ready model (within 2 times), but it is not ready for solder dipping.
Reflow
① Package temperature at reflow soldering is defined in the Fig. below. However, even
when it is under the profile condition, external stress can damage the internal packages.
Please test your reflow method and verify the solderability before use.
② Giving the soldering process promptly after opened aluminum package is recommended.
Soldering process must be completed including 2ndreflow as repairing within 7 days
(Temperature: 5 ℃ to 30 ℃ Relative humidity: 60% or less) after opened.
(Storage in a dry box after the first reflow is recommended.)
③ Recommended solder paste
Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD)
Temperature [℃]
④ Recommended Temperature Profile
260( MAX)
1 to 4℃/s
220
200
150
1 to 2.5℃/s
60s (MAX)
60 to 120s
5s (MAX)
1 to 4℃/s
25
Time [second]
In order to secure the product reliability, it is recommended to control the peak temperature
and temperature gradient. Moreover, since the thermal conduction to the products depends
on the specification of the reflow machine, and the size and layout of the PCBs please test
your solder conditions carefully.
Moreover, after the reflow process, if the activator remains in the flux between anode and
cathode, the remaining activator might react during high temperature operation, and the
electro-migration is generated and there will be a possibility of a short-circuit. Please use
it after confirming the electro-migration is not generated while mounted actual.
19
sharp LD-E7-9-14-A
Model No. GM2AA50GV6*
Contents in this technical document be changed without any notice due to the product modification.
http://www.sharp-world.com/products/device/
⑤ Recommended solder pad design
We recommend the metal mask of thickness 0.15mm for screen-printing. Solderability
depends on the reflow conditions, solder paste, and materials of the PCBs etc. Please test
and verify the solderability under the actual solder method.
Moreover, it might have a risk of short-circuit (leakage) with the electro-migration by the
remaining activator in the flux. Please make a suitable selection and test of the metal mask
in terms of pitch size and thickness before mass production.
0.3
②
①
0.65
0.9
3.4
0.9
0.65
3.2
(Unit:mm)
⑥ Precautions for PCB backside dip process
Please verify your conditions carefully in giving the dip process on the backside of the
PCBs, since the warped boards caused by heat and heat itself affect the inside of the
package. It is recommended to give the reflow process after dip process.
Though it is also available to give the reflow process before the dip process, the interval
of the two processes should be as short as possible.
7-3 Cleaning
・ Avoid cleaning the PCBs, since packages and resin are eroded by cleaning.
Please use the soldering paste without need of cleaning.
・ Avoid ultrasonic cleaning.
20
sharp LD-E7-9-14-A
http://www.sharp-world.com/products/device/
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