TVS Diode Arrays Low Capacitance ESD Protection - SP0504S Series (SPA Diodes)

TVS Diode Arrays Low Capacitance ESD Protection - SP0504S Series (SPA Diodes)
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP0504S Series
SP0504S Series 0.85pF Diode Array
RoHS
Pb GREEN
Description
The SP0504S has ultra low capacitance rail-to-rail diodes
with an additional zener diode fabricated in a proprietary
silicon avalanche technology to protect each I/O pin
providing a high level of protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level (Level 4) specified in the
IEC 61000-4-2 international standard without performance
degradation. Their very low loading capacitance also makes
them ideal for protecting high speed signal pins such as
HDMI, DVI, USB2.0, and IEEE 1394.
Pinout
Features
I/O 1
I/O 4
VCC
GND
I/O 2
I/O 3
• L
ow leakage current of
0.5μA (MAX) at 5V
• E
SD protection of
±12kV contact discharge,
±15kV air discharge,
(IEC61000-4-2)
• Small packaging options
saves board space
• E
FT protection,
IEC61000-4-4, 40A
(5/50ns)
SOT23-6
Functional Block Diagram
I/O2
• L
ow capacitance of
0.85 pF (TYP) per I/O
• L
ightning Protection,
IEC61000-4-5, 4.5A
(8/20µs)
• AEC-Q101 Qualified
Applications
I/O4
VCC
• Computer Peripherals
• Network Hardware/Ports
• Mobile Phones
• Test Equipment
• PDA’s
• Medical Equipment
• Digital Cameras
Application Example
GND
I/O1
RJ-45
Connector
I/O3
Ethernet PHY
Tx+
J1
Additional Information
Tx-
Rx+
Datasheet
Resources
Samples
Rx-
J8
NC
GND
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/17/15
SP0504S
A single 4 channel SP0504S device can be used to protect
four of the data lines in a HDMI/DVI interface. Two (2)
SP0504S devices provide protection for the main data lines.
Low voltage ASIC HDMI/DVI drivers can also be protected
with the SP0504S, the +VCC pins on the SP0504S can be
substituted with a suitable bypass capacitor or in some
backdrive applications the +VCC of the SP0504S can be
floated or NC.
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP0504S Series
Thermal Information
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
IPP
Peak Current (tp=8/20μs)
4.5
A
TOP
Operating Temperature
–40 to 125
°C
TSTOR
Storage Temperature
–55 to 150
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Parameter
Rating
Units
Storage Temperature Range
–55 to
150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
Electrical Characteristics (TOP=25ºC)
Symbol
Test Conditions
Max
Units
Reverse Standoff Voltage
Parameter
VRWM
IR ≤ 1µA
6.0
V
Reverse Leakage Current
ILEAK
VR=5V
0.5
µA
Clamp Voltage1
VC
ESD Withstand Voltage1
VESD
Diode Capacitance1
CI/O-GND
Diode Capacitance
CI/O-I/O
1
Min
Typ
IPP=1A, tp=8/20µs, Fwd
9.5
11.0
V
IPP=2A, tp=8/20µs, Fwd
10.6
13.0
V
IEC61000-4-2 (Contact)
±12
kV
IEC61000-4-2 (Air)
±15
kV
Reverse Bias=0V
0.95
1.1
1.25
pF
Reverse Bias=1.65V
0.7
0.85
1.0
pF
Reverse Bias=0V
0.5
pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Insertion Loss (S21) I/O to GND
Capacitance vs. Bias Voltage
1.50
0
1.40
I/O Capacitance (pF)
Insertion Loss [dB]
1.30
-5
-10
-15
1.20
VCC = Float
1.10
1.00
VCC = 3.3V
0.90
0.80
VCC = 5V
0.70
0.60
-20
1.E+06
0.50
1.E+07
1.E+08
Frequency [Hz]
1.E+09
1.E+10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
I/O DC Bias (V)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/17/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP0504S Series
Capacitance vs. Frequency
Product Characteristics
2E-12
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
1.8E-12
1.6E-12
Capacitance [F]
1.4E-12
1.2E-12
1E-12
8E-13
6E-13
4E-13
2E-13
0
1.E+06
1.E+07
1.E+08
1.E+09
Frequency [Hz]
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Part Numbering System
tP
TP
Temperature
Reflow Condition
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
25
time to peak temperature
Series
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/17/15
Time
Ordering Information
Part Number
Package
Marking
Min. Order
Qty.
SP0504SHTG
SOT23-6
E*4
3000
Part Marking System
E*4
SP0504S HTG
TVS Diode Arrays
(SPA® Diodes)
Critical Zone
TL to TP
Ramp-up
G= Green
T= Tape & Reel
Package
H = SOT23-6
E*4
Product Series
Number of Channels
E = SP0504S series
Assembly Site
(varies)
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP0504S Series
Package Dimensions — SOT23-6
Package
SOT23
Pins
6
JEDEC
MO-178AB
Millimeters
Min
Inches
Min
Max
Notes
A
0.900
1.450
0.035
0.057
-
A1
0.000
0.150
0.000
0.006
-
A2
0.900
1.300
0.035
0.051
-
b
0.350
0.500
0.0138
0.0196
-
C
0.080
0.220
0.0031
0.009
-
D
2.800
3.000
0.11
0.118
3
E
2.600
3.000
0.102
0.118
-
E1
1.500
1.750
0.06
0.069
3
e
0.95 Ref
0.0374 ref
e1
1.9 Ref
0.0748 Ref
0.30
L
0.600
0.012
8º
0º
6
N
a
Recommended Solder Pad Layout
Max
0º
-
0.023
6
4,5
6
8º
-
M
2.590
0.102
-
O
0.690
.027 TYP
-
P
0.990
.039 TYP
-
R
0.950
0.038
-
Notes:
1. Dimensioning and tolerancing Per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Foot length L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
M
P
R
O
Embossed Carrier Tape & Reel Specification — SOT23-6
8mm TAPE AND REEL
1.5mm
DIA. HOLE
ACCESS HOLE
14.4mm
4.0mm
1.75mm
2.0mm
CL
8mm
4.0mm
13mm
180mm
GENERAL INFORMATION
SOT-23 (8mm POCKET PITCH)
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
60mm
8.4mm
USER DIRECTION OF FEED
PIN 1
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/17/15
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Littelfuse:
SP0504SHTG
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