TVS Diode Array SPA SP1010 Datasheet

TVS Diode Array SPA SP1010 Datasheet
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP1010 Series
SP1010 Series 3.5pF 8kV Unidirectional TVS Array
RoHS
Pb GREEN
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These
robust diodes can safely absorb repetitive ESD strikes
at the maximum level specified in the IEC 61000-4-2
international standard (Level 4, ±8kV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protection highspeed signal pins.
Pinout
Features
t&4%*&$œL7
contact, ±15kV air
I/O (1)
I/O (4)
GND
GND
t-JHIUOJOH*&$
1A (tp=8/20μs)
I/O (3)
t-PXDBQBDJUBODFPGQ'
(TYP) per I/O
I/O (2)
μDFN-6
(1.25x1.0x0.5mm)
5
t&'5QSPUFDUJPO
IEC61000-4-4, 40A
(5/50ns)
t-PXMFBLBHFDVSSFOUPG
1μA (MAX) at 5V
Applications
Functional Block Diagram
6
t5JOZç%'/+&%&$.0
229) package (1.25mm x
1.0mm x 0.5mm)
4
t/PUFCPPL
t1PSUBCMFNFEJDBMEFWJDF
t/FUCPPL
t.11.1
t6MUSBNPCJMF1$
t%JHJUBMDBNFSB
t.PCJMFQIPOF
t1PSUBCMFOBWJHBUJPO
device
1
2
3
Application Example
Keyboard
Controller
Input
Outside World
D1
D2
D3
D4
SP1010-04UTG
Shield
Ground
Signal
Ground
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
55
Revision: March 20, 2012
SP1010 Series
SP1010
Description
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP1010 Series
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
1.0
A
Operating Temperature
-40 to 85
°C
Storage Temperature
-60 to 150
°C
IPP
Peak Pulse Current (tp=8/20μs)
TOP
TSTOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
Units
-65 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 20-40s)
260
°C
Storage Temperature Range
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
VR
IR = 1mA
7.0
7.8
8.5
V
Reverse Standoff Voltage
VRWM
IR≤1μA
6
V
Reverse Leakage Current
ILEAK
VR = 5V
1
μA
ESD Withstand Voltage1
VESD
Reverse Voltage Drop
Diode Capacitance1
0.1
IEC61000-4-2 (Contact Discharge)
±8
kV
IEC61000-4-2 (Air Discharge)
±15
kV
CD
Reverse Bias = 0V
6
Reverse Bias = 2.5V
3.5
7
pF
pF
Note:
1. Parameter is guaranteed by design and/or device characterization.
Capacitance vs. Reverse Bias
Insertion Loss (S21) I/O to GND
5
7.0
0
-5
5.0
Attenuation (dB)
Capacitance (pF)
6.0
4.0
3.0
-10
-15
2.0
-20
1.0
-25
-30
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
10
5.0
SP1010 Series
100
1000
10000
Frequency (MHz)
DC Bias (V)
56
Revision: March 20, 2012
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP1010 Series
Soldering Parameters
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
- Temperature (tL)
tP
TP
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
SP1010
Pre Heat
Pb – Free assembly
Temperature
Reflow Condition
Ramp-do
Ramp-down
Preheat
TS(min)
tS
217°C
60 – 150 seconds
25
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
time to peak temperature
Time
Package Dimensions — μDFN-6 (1.25x1.0x0.5mm)
Bottom View
Top View
℮
A
D
0.05 C
6 5 4
4 5 6
0.05 C
L
μDFN-6 (1.25x1.0x0.5mm)
JEDEC
MO-229
Symbol
Pin 1 chamfer
0.10 x 45’
E
Pin 1 Index Area
Package
1 2 3
3 2 1
B
Millimeters
Max
A
0.45
0.55
0.018
0.022
A1
0.00
0.05
0.000
0.002
A3
Side View
0.05 C
A3
A1
A
Seating plane
C
b
Inches
Min
Min
0.127 REF
Max
0.005 REF
b
0.15
0.25
0.006
0.010
D
1.20
1.30
0.047
0.051
D2
-
-
-
-
E
0.95
1.05
0.037
0.041
E2
-
-
-
-
0.10 M C A B
e
0.05 M C
L
0.4 REF
0.25
0.016 REF
0.35
0.010
0.014
Recommanded Soldering Pad for μDFN-6L 1.25 x1.0x0.5 mm
1.1
0.4
0.3
1.1
0.4
0.1
0.3
Total:+/- 0.01mm
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
57
Revision: March 20, 2012
SP1010 Series
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP1010 Series
Product Characteristics
Part Numbering System
SP 1010 – 04 U T G
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
T= Tape & Reel
Lead Coplanarity
0.0004 inches (0.102mm)
Package
U: μDFN-6
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
G= Green
Series
Number of
Channels
Notes :
Part Marking System
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
H 4
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Product Series
H = SP1010
H4
Number of Channels
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP1010-04UTG
μDFN-6 (1.25x1.0x0.5mm)
H4
3000
Symbol
t
W
E
P2
D
Embossed Carrier Tape & Reel Specification — μDFN-6 (1.25x1.0x0.5mm)
Min
Max
Min
Max
1.65
1.85
0.06
0.07
F
3.45
3.55
0.14
0.14
D1
0.50
0.65
0.02
0.03
D
F
B0
10P0
P0
A0
Inches
E
P0
D1
Millimeters
1.50 MIN
3.90
4.10
40.0 +/- 0.20
0.06 MIN
0.15
0.16
1.57 +/- 0.01
W
7.90
8.30
0.31
0.33
P2
1.95
2.05
0.08
0.08
A0
1.09
1.19
0.04
0.05
B0
1.42
1.52
0.06
0.06
K0
0.71
0.81
0.03
0.03
0.25 TYP
0.01 TYP
K0
t
SP1010 Series
58
Revision: March 20, 2012
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
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