datasheet for UCD3138 by Texas Instruments

datasheet for UCD3138 by Texas Instruments
UCD3138
Highly Integrated Digital Controller for Isolated Power
Data Manual
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Literature Number: SLUSAP2F
March 2012 – Revised November 2013
UCD3138
www.ti.com
SLUSAP2F – MARCH 2012 – REVISED NOVEMBER 2013
Contents
1
Introduction
1.1
1.2
2
Overview
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3
4.3
4.4
4.5
4.6
4.7
4.8
..................................................................................................... 15
ABSOLUTE MAXIMUM RATINGS ......................................................................................
THERMAL INFORMATION ..............................................................................................
RECOMMENDED OPERATING CONDITIONS .......................................................................
ELECTRICAL CHARACTERISTICS ....................................................................................
PMBus/SMBus/I2C Timing ...............................................................................................
Power On Reset (POR) / Brown Out Reset (BOR) ...................................................................
Typical Clock Gating Power Savings ...................................................................................
Typical Temperature Characteristics ...................................................................................
Functional Overview
4.1
4.2
2
............................................................................................................................ 7
Description ................................................................................................................... 7
Ordering Information ........................................................................................................ 8
Product Selection Matrix ................................................................................................... 8
Functional Block Diagram .................................................................................................. 9
UCD3138RGC 64 QFN – Pin Assignments ........................................................................... 10
Pin Functions (UCD3138RGC 64 QFN) ................................................................................ 10
UCD3138RHA 40 QFN – Pin Assignments ............................................................................ 12
UCD3138RMH 40 QFN With Corner Anchors – Pin Assignments ................................................. 13
Pin Functions (UCD3138RHA and UCD3138RMH) .................................................................. 14
Electrical Specifications
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
4
........................................................................................................................ 6
Features ...................................................................................................................... 6
Applications .................................................................................................................. 7
.......................................................................................................... 23
ARM Processor ............................................................................................................
Memory .....................................................................................................................
4.2.1
CPU Memory Map and Interrupts ............................................................................
4.2.1.1
Memory Map (After Reset Operation) ...........................................................
4.2.1.2
Memory Map (Normal Operation) ................................................................
4.2.1.3
Memory Map (System and Peripherals Blocks) ................................................
4.2.2
Boot ROM .......................................................................................................
4.2.3
Customer Boot Program .......................................................................................
4.2.4
Flash Management .............................................................................................
System Module ............................................................................................................
4.3.1
Address Decoder (DEC) .......................................................................................
4.3.2
Memory Management Controller (MMC) ....................................................................
4.3.3
System Management (SYS) ...................................................................................
4.3.4
Central Interrupt Module (CIM) ...............................................................................
Peripherals .................................................................................................................
4.4.1
Digital Power Peripherals ......................................................................................
4.4.1.1
Front End ............................................................................................
4.4.1.2
DPWM Module .....................................................................................
4.4.1.3
DPWM Events ......................................................................................
4.4.1.4
High Resolution DPWM ...........................................................................
4.4.1.5
Over Sampling ......................................................................................
4.4.1.6
DPWM Interrupt Generation ......................................................................
4.4.1.7
DPWM Interrupt Scaling/Range ..................................................................
DPWM Modes of Operation ..............................................................................................
4.5.1
Normal Mode ....................................................................................................
Phase Shifting .............................................................................................................
DPWM Multiple Output Mode ............................................................................................
DPWM Resonant Mode ..................................................................................................
Contents
15
15
15
16
19
20
21
22
23
23
23
23
24
24
24
25
25
25
25
25
25
26
27
27
27
28
29
31
31
31
31
32
32
34
35
36
Copyright © 2012–2013, Texas Instruments Incorporated
UCD3138
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SLUSAP2F – MARCH 2012 – REVISED NOVEMBER 2013
Triangular Mode ...........................................................................................................
Leading Edge Mode .......................................................................................................
Sync FET Ramp and IDE Calculation ..................................................................................
Automatic Mode Switching ...............................................................................................
4.12.1 Phase Shifted Full Bridge Example ..........................................................................
4.12.2 LLC Example ....................................................................................................
4.12.3 Mechanism for Automatic Mode Switching ..................................................................
DPWMC, Edge Generation, IntraMux ..................................................................................
Filter .........................................................................................................................
4.14.1 Loop Multiplexer ................................................................................................
4.14.2 Fault Multiplexer ................................................................................................
Communication Ports .....................................................................................................
4.15.1 SCI (UART) Serial Communication Interface ...............................................................
4.15.2 PMBUS ..........................................................................................................
4.15.3 General Purpose ADC12 ......................................................................................
4.15.4 Timers ............................................................................................................
4.15.4.1 24-bit PWM Timer ..................................................................................
4.15.4.2 16-Bit PWM Timers ................................................................................
4.15.4.3 Watchdog Timer ....................................................................................
Miscellaneous Analog .....................................................................................................
Package ID Information ...................................................................................................
Brownout ...................................................................................................................
Global I/O ...................................................................................................................
Temperature Sensor Control .............................................................................................
I/O Mux Control ............................................................................................................
Current Sharing Control ..................................................................................................
Temperature Reference ..................................................................................................
38
39
41
41
41
42
44
45
46
48
49
51
51
51
52
53
53
54
54
54
54
54
55
56
56
56
57
5
IC Grounding and Layout Recommendations ........................................................................
6
Tools and Documentation ...................................................................................................
7
References .......................................................................................................................
Revision History .........................................................................................................................
58
59
61
62
4.9
4.10
4.11
4.12
4.13
4.14
4.15
4.16
4.17
4.18
4.19
4.20
4.21
4.22
4.23
Copyright © 2012–2013, Texas Instruments Incorporated
Contents
3
UCD3138
SLUSAP2F – MARCH 2012 – REVISED NOVEMBER 2013
www.ti.com
List of Figures
3-1
I2C/SMBus/PMBus Timing Diagram ...........................................................................................
20
3-2
Bus Timing in Extended Mode..................................................................................................
20
3-3
Power On Reset (POR) / Brown Out Reset (BOR) ..........................................................................
20
3-6
ADC12 Measurement Temperature Sensor Voltage vs. Temperature ....................................................
22
3-7
ADC12 2.5-V Reference vs. Temperature ....................................................................................
22
3-8
ADC12 Temperature Sensor Measurement Error vs. Temperature .......................................................
22
3-9
UCD3138 Oscillator Frequency (2MHz Reference, Divided Down from 250MHz) vs. Temperature ..................
22
4-1
Input Stage of EADC Module ...................................................................................................
28
4-2
Front End Module
(Front End 2 Recommended for Peak Current Mode Control) .............................................................
28
4-3
Secondary-Referenced Phase-Shifted Full Bridge Control
With Synchronous Rectification ................................................................................................
42
4-4
Secondary-Referenced Half-Bridge Resonant LLC Control
With Synchronous Rectification ................................................................................................
43
4-5
Fault Mux Block Diagram
4-6
4-7
4-8
4-9
4
.......................................................................................................
PMBus Address Detection Method ............................................................................................
ADC12 Control Block Diagram .................................................................................................
Internal Temp Sensor ............................................................................................................
Simplified Current Sharing Circuitry ...........................................................................................
List of Figures
51
52
53
56
57
Copyright © 2012–2013, Texas Instruments Incorporated
UCD3138
www.ti.com
SLUSAP2F – MARCH 2012 – REVISED NOVEMBER 2013
List of Tables
.....................................................................................................................
.....................................................................................................................
2
I C/SMBus/PMBus Timing Characteristics ....................................................................................
Interrupt Priority Table ...........................................................................................................
DPWM Interrupt Divide Ratio ...................................................................................................
2-1
Pin Functions
10
2-2
Pin Functions
14
3-1
4-1
4-2
Copyright © 2012–2013, Texas Instruments Incorporated
List of Tables
19
26
31
5
UCD3138
SLUSAP2F – MARCH 2012 – REVISED NOVEMBER 2013
www.ti.com
Highly Integrated Digital Controller for Isolated Power
Check for Samples: UCD3138
1
Introduction
1.1
Features
1
• Digital Control of up to 3 Independent
Feedback Loops
– Dedicated PID based hardware
– 2-pole/2-zero configurable
– Non-Linear Control
• Up to 16MHz Error Analog to Digital Converter
(EADC)
– Configurable Resolution as Small as
1mV/LSB
– Automatic Resolution Selection
– Up to 8x Oversampling
– Hardware Based Averaging (up to 8x)
– 14 bit Effective DAC
– Adaptive Sample Trigger Positioning
• Up to 8 High Resolution Digital Pulse Width
Modulated (DPWM) Outputs
– 250ps Pulse Width Resolution
– 4ns Frequency Resolution
– 4ns Phase Resolution
– Adjustable Phase Shift Between Outputs
– Adjustable Dead-band Between Pairs
– Cycle-by-Cycle Duty Cycle Matching
– Up to 2MHz Switching Frequency
• Configurable PWM Edge Movement
– Trailing Modulation
– Leading Modulation
– Triangular Modulation
• Configurable Feedback Control
– Voltage Mode
– Average Current Mode
– Peak Current Mode Control
– Constant Current
– Constant Power
• Configurable Modulation Methods
– Frequency Modulation
– Phase Shift Modulation
– Pulse Width Modulation
• Fast, Automatic and Smooth Mode Switching
– Frequency Modulation and PWM
– Phase Shift Modulation and PWM
• High Efficiency and Light Load Management
– Burst Mode
– Ideal Diode Emulation
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
– Synchronous Rectifier Soft On/Off
– Low IC Standby Power
Soft Start / Stop with and without Pre-bias
Fast Input Voltage Feed Forward Hardware
Primary Side Voltage Sensing
Copper Trace Current Sensing
Flux and Phase Current Balancing for NonPeak Current Mode Control Applications
Current Share Bus Support
– Analog Average
– Master/Slave
Feature Rich Fault Protection Options
– 7 High Speed Analog Comparators
– Cycle-by-Cycle Current Limiting
– Programmable Fault Counting
– External Fault Inputs
– 10 Digital Comparators
– Programmable blanking time
Synchronization of DPWM waveforms between
multiple UCD3138 devices
14 channel, 12 bit, 267 ksps General Purpose
ADC with integrated
– Programmable averaging filters
– Dual sample and hold
Internal Temperature Sensor
Fully Programmable High-Performance
31.25MHz, 32-bit ARM7TDMI-S Processor
– 32 kByte (kB) Program Flash
– 2 kB Data Flash with ECC
– 4 kB Data RAM
– 4 kB Boot ROM Enables Firmware Boot-Load
in the Field via I2C or UART
Communication Peripherals
– I2C/PMBus
– 2 UARTs on UCD3138RGC (64-pin QFN)
– 1 UART on UCD3138RHA/UCD3138RMH
(40-pin QFN)
Timer capture with selectable input pins
Up to 5 Additional General Purpose Timers
Built In Watchdog: BOD and POR
64-pin QFN and 40-pin QFN packages
Operating Temperature: –40°C to 125°C
Fusion_Digital_Power_Designer GUI Support
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2012–2013, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
UCD3138
www.ti.com
1.2
•
•
•
SLUSAP2F – MARCH 2012 – REVISED NOVEMBER 2013
Applications
Power Supplies and Telecom Rectifiers
Power Factor Correction
Isolated dc-dc Modules
2
Overview
2.1
Description
The UCD3138 is a digital power supply controller from Texas Instruments offering superior levels of
integration and performance in a single chip solution. The flexible nature of the UCD3138 makes it
suitable for a wide variety of power conversion applications. In addition, multiple peripherals inside the
device have been specifically optimized to enhance the performance of ac/dc and isolated dc/dc
applications and reduce the solution component count in the IT and network infrastructure space.
The UCD3138 is a fully programmable solution offering customers complete control of their application,
along with ample ability to differentiate their solution. At the same time, TI is committed to simplifying our
customer’s development effort through offering best in class development tools, including application
firmware, Code Composer Studio™ software development environment, and TI’s power development GUI
which enables customers to configure and monitor key system parameters.
At the core of the UCD3138 controller are the digital control loop peripherals, also known as Digital Power
Peripherals (DPP). Each DPP implements a high speed digital control loop consisting of a dedicated Error
Analog to Digital Converter (EADC), a PID based 2 pole–2 zero digital compensator and DPWM outputs
with 250 ps pulse width resolution. The device also contains a 12-bit, 267ksps general purpose ADC with
up to 14 channels, timers, interrupt control, PMBus and UART communications ports. The device is based
on a 32-bit ARM7TDMI-S RISC microcontroller that performs real-time monitoring, configures peripherals
and manages communications. The ARM microcontroller executes its program out of programmable flash
memory as well as on-chip RAM and ROM.
In addition to the FDPP, specific power management peripherals have been added to enable high
efficiency across the entire operating range, high integration for increased power density, reliability, and
lowest overall system cost and high flexibility with support for the widest number of control schemes and
topologies. Such peripherals include: light load burst mode, synchronous rectification, LLC and phase
shifted full bridge mode switching, input voltage feed forward, copper trace current sense, ideal diode
emulation, constant current constant power control, synchronous rectification soft on and off, peak current
mode control, flux balancing, secondary side input voltage sensing, high resolution current sharing,
hardware configurable soft start with pre bias, as well as several other features. Topology support has
been optimized for voltage mode and peak current mode controlled phase shifted full bridge, single and
dual phase PFC, bridgeless PFC, hard switched full bridge and half bridge, and LLC half bridge and full
bridge.
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2.2
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Ordering Information
PART NUMBER
PIN COUNT
PACKAGE
SUPPLY
TOP SIDE MARKING
OPERATING TEMPERATURE
RANGE, TA
UCD3138RGCT
64
QFN
250 (Small Reel)
UCD3138
–40°C to 125°C
UCD3138RGCR
64
QFN
2000 (Large Reel)
UCD3138
–40°C to 125°C
UCD3138RHAT
40
QFN
250 (Small Reel)
UCD3138
–40°C to 125°C
UCD3138RHAT
40
QFN
250 (Small Reel)
UCD3138
–40°C to 125°C
UCD3138RMHT
40
QFN
250 (Small Reel)
3138RMH
–40°C to 125°C
UCD3138RMHR
40
QFN
250 (Large Reel)
3138RMH
–40°C to 125°C
2.3
Product Selection Matrix
FEATURE
ARM7TDMI-S Core Processor
UCD3138 64 PIN
(RGC)
UCD3138 40 PIN
(RHA/RMH)
31.25 MHz
31.25 MHz
High Resolution DPWM Outputs (250ps Resolution)
8
8
Number of High Speed Independent Feedback Loops (# Regulated Output
Voltages)
3
3
12-bit, 267ksps, General Purpose ADC Channels
14
7
Digital Comparators at ADC Outputs
4
4
Flash Memory (Program)
32 KB
32 KB
Flash Memory (Data)
2 KB
2 KB
√
√
4 KB
4 KB
up to 2 MHz
up to 2 MHz
Programmable Fault Inputs
4
1 + 2 (1)
High Speed Analog Comparators with Cycle-by-Cycle Current Limiting
(2)
6 (2)
2
1 (1)
Flash Security
RAM
DPWM Switching Frequency
7
UART (SCI)
PMBus
√
√
Timers
4 (16 bit) and 1 (24 bit)
4 (16 bit) and 1 (24 bit)
Timer PWM Outputs
2
1
Timer Capture Inputs
1
1 (1)
Watchdog
√
√
On Chip Oscillator
√
√
Power-On Reset and Brown-Out Reset
√
√
Package Offering
64 Pin QFN (9mm x 9mm)
40 Pin QFN (6mm x 6mm)
Sync IN and Sync OUT Functions
√
√
Total GPIO (includes all pins with multiplexed functions such as, DPWM, Fault
Inputs, SCI, etc.)
30
18
External Interrupts
1
0
(1)
(2)
8
This number represents an alternate pin out that is programmable via firmware. See the UCD3138 Digital Power Peripherals
Programmer’s Manual for details.
To facilitate simple OVP and UVP connections both comparators B and C are connected to the AD03 pin.
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2.4
SLUSAP2F – MARCH 2012 – REVISED NOVEMBER 2013
Functional Block Diagram
Loop MUX
EAP0
EAN0
EAP1
Front End 1
EAN1
Front End 2
AFE
EAN2
2
DPWM0B
DPWM1A
PID Based
Filter 1
DPWM1
PID Based
Filter 2
DPWM2
DPWM1B
DPWM2A
DPWM2B
DPWM3A
DPWM3
DPWM3B
Front End Averaging
EADC
AFE
2
DPWM0
Constant Power Constant
Current
3-AFE
EAP2
DPWM0A
PID Based
Filter 0
Front End 0
X
SYNC
Avg()
Digital Comparators
SAR/Prebias
DAC0
Ramp
A0
Input Voltage Feed Forward
Filter x
CPCC
Value
Σ
Dither
Abs()
Peak Current Mode
Control Comparator
Advanced Power Control
Mode Switching, Burst Mode, IDE,
Synchronous Rectification soft on & off
ADC_EXT_TRIG
AD[13:0]
PMBUS_ALERT
ADC12 Control
Sequencing, Averaging,
Digital Compare, Dual
Sample and hold
ADC12
PMBUS_CTRL
PMBus
PMBUS_DATA
AD00
PMBUS_CLK
AD01
Internal Temperature
Sensor
AD02
AGND
AD13
Current Share
Analog, Average, Master/Slave
PWM0
Timers
4 – 16 bit (PWM)
1 – 24 bit
Oscillator
PWM1
TCAP
SCI_TX0
ARM7TDMI-S
32 bit, 31.25 MHz
Analog
Comparators
UART1
A
SCI_RX1
Memory
PFLASH 32 kB
DFLASH 2 kB
RAM 4 kB
ROM 4 kB
AD03
B
C
D
V33D
AD13
V33DIO
BP18
DGND
V33A
Power and
1.8 V Voltage
Regulator
Fault MUX &
Control
EXT_INT
FAULT0
GPIO
Control
FAULT1
FAULT2
Power On Reset
E
Cycle by Cycle
Current Limit
F
Digital
Comparators
AD06
SCI_RX0
SCI_TX1
AD02
AD04
UART0
FAULT3
/RESET
Brown Out Detection
TCK
JTAG
AD07
G
TDI
TMS
TDO
AGND
NOTE
Front-end 2 Recommended for Peak Current Mode Control
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2.6
AD11
AD09
AD08
AD05
AD02
AD01
AD00
V33A
AGND
EAN2
EAP2
EAN1
EAP1
EAN0
EAP0
AGND
UCD3138RGC 64 QFN – Pin Assignments
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
AGND
1
48
AGND
AD13
2
47
V33D
AD12
3
46
BP18
AD10
4
45
V33DIO
AD07
5
44
DGND
AD06
6
43
FAULT3
AD04
7
42
FAULT2
AD03
8
41
TCAP
V33DIO
9
40
TMS
DGND
10
39
TDI/SCI_RX0/PMBUS_CTRL/FAULT1
/RESET
11
38
TDO/SCI_TX0/PMBUS_ALERT/FAULT0
ADC_EXT_TRIG/TCAP/SYNC/PWM0
12
37
TCK/TCAP/SYNC/PWM0
SCI_RX0
13
36
FAULT1
SCI_TX0
14
35
FAULT0
PMBUS_CLK/SCI_TX0
15
34
INT_EXT
PMBUS_DATA/SCI_RX0
16
33
DGND
23
24
25
26
27
28
29
30
DPWM3B
DGND
SYNC/TCAP/ADC_EXT_TRIG/PWM0
PMBUS_ALERT
PMBUS_CTRL
SCI_TX1/PMBUS_ALERT
SCI_RX1/PMBUS_CTRL
31
32
PWM1
22
PWM0
21
DPWM3A
DPWM1A
20
DPWM2B
19
DPWM2A
18
DPWM1B
17
DPWM0B
UCD3138RGC
(64 QFN)
DPWM0A
2.5
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Pin Functions (UCD3138RGC 64 QFN)
Additional pin functionality is specified in the following table.
Table 2-1. Pin Functions
PIN
10
NAME
PRIMARY ASSIGNMENT
ALTERNATE ASSIGNMENT
NO. 1
1
AGND
Analog ground
2
AD13
12-bit ADC, Ch 13, comparator E, I-share
3
AD12
12-bit ADC, Ch 12
4
AD10
12-bit ADC, Ch 10
5
AD07
12-bit ADC, Ch 7, Connected to comparator F and
reference to comparator G
DAC output
6
AD06
12-bit ADC, Ch 6, Connected to comparator F
DAC output
7
AD04
12-bit ADC, Ch 4, Connected to comparator D
DAC output
8
AD03
12-bit ADC, Ch 3, Connected to comparator B and C
NO. 2
NO. 3
CONFIGURABLE
AS A GPIO?
SYNC
PWM0
Yes
DAC output
9
V33DIO
Digital I/O 3.3V core supply
10
DGND
Digital ground
11
RESET
Device Reset Input, active low
12
ADC_EXT_TRIG
ADC conversion external trigger input
13
SCI_RX0
SCI RX 0
14
SCI_TX0
SCI TX 0
15
PMBUS_CLK
PMBUS Clock (Open Drain)
SCI TX 0
Yes
16
PMBUS_DATA
PMBus data (Open Drain)
SCI RX 0
Yes
17
DPWM0A
DPWM 0A output
TCAP
Yes
Yes
Yes
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Table 2-1. Pin Functions (continued)
PIN
NAME
PRIMARY ASSIGNMENT
ALTERNATE ASSIGNMENT
NO. 1
NO. 2
NO. 3
CONFIGURABLE
AS A GPIO?
18
DPWM0B
DPWM 0B output
Yes
19
DPWM1A
DPWM 1A output
Yes
20
DPWM1B
DPWM 1B output
Yes
21
DPWM2A
DPWM 2A output
Yes
22
DPWM2B
DPWM 2B output
Yes
23
DPWM3A
DPWM 3A output
Yes
24
DPWM3B
DPWM 3B output
Yes
25
DGND
Digital ground
26
SYNC
DPWM Synchronize pin
27
PMBUS_ALERT
PMBus Alert (Open Drain)
28
PMBUS_CTRL
PMBus Control (Open Drain)
TCAP
ADC_EXT_TRI
G
PWM0
Yes
Yes
Yes
29
SCI_TX1
SCI TX 1
PMBUS_ALER
T
30
SCI_RX1
SCI RX 1
PMBUS_CTRL
31
PWM0
General purpose PWM 0
Yes
32
PWM1
General purpose PWM 1
Yes
33
DGND
Digital ground
34
INT_EXT
External Interrupt
Yes
35
FAULT0
External fault input 0
Yes
36
FAULT1
External fault input 1
37
TCK
JTAG TCK (For manufacturer test only)
Yes
Yes
Yes
TCAP
SYNC
PWM0
Yes
FAULT0
Yes
FAULT1
Yes
38
TDO
JTAG TDO (For manufacturer test only)
SCI_TX0
PMBUS_ALER
T
39
TDI
JTAG TDI (For manufacturer test only)
SCI_RX0
PMBUS_CTRL
40
TMS
JTAG TMS (For manufacturer test only)
Yes
41
TCAP
Timer capture input
Yes
42
FAULT2
External fault input 2
Yes
43
FAULT3
External fault input 3
Yes
44
DGND
Digital ground
45
V33DIO
Digital I/O 3.3V core supply
46
BP18
1.8V Bypass
47
V33D
Digital 3.3V core supply
48
AGND
Substrate analog ground
49
AGND
Analog ground
50
EAP0
Channel #0, differential analog voltage, positive input
51
EAN0
Channel #0, differential analog voltage, negative input
52
EAP1
Channel #1, differential analog voltage, positive input
53
EAN1
Channel #1, differential analog voltage, negative input
54
EAP2
Channel #2, differential analog voltage, positive input
(Recommended for peak currrent mode control)
55
EAN2
Channel #2, differential analog voltage, negative input
56
AGND
Analog ground
57
V33A
Analog 3.3V supply
58
AD00
12-bit ADC, Ch 0, Connected to current source
59
AD01
12-bit ADC, Ch 1, Connected to current source
60
AD02
12-bit ADC, Ch 2, Connected to comparator A, I-share
61
AD05
12-bit ADC, Ch 5
62
AD08
12-bit ADC, Ch 8
63
AD09
12-bit ADC, Ch 9
64
AD11
12-bit ADC, Ch 11
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AD01
AD00
V33A
AGND
EAP2
EAN1
EAP1
EAN0
EAP0
UCD3138RHA 40 QFN – Pin Assignments
AD02
2.7
40
39
38
37
36
35
34
33
32
31
30
AGND
29
AGND
28
BP18
27
V33D
5
26
DGND
DGND
6
25
FAULT2
/RESET
7
24
TMS
ADC_EXT_TRIG/TCAP/SYNC/PWM0
8
23
TDI/SCI_RX0/PMBUS_CTRL/FAULT1
PMBUS_CLK/SCI_TX0
9
22
TDO/SCI_TX0/PMBUS_ALERT/FAULT0
PMBUS_DATA/SCI_RX0
10
21
TCK/TCAP/SYNC/PWM0
DPWM0A
12
13
14
15
16
17
18
19
20
PMBUS_CTRL
AD03
(40 QFN)
PMBUS_ALERT
4
DPWM3B
AD04
DPWM3A
3
DPWM2B
AD06
UCD3138RHA
DPWM2A
2
DPWM1B
AD13
DPWM1A
1
DPWM0B
AGND
11
12
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40
39
38
37
36
35
34
33
32
EAP0
EAN0
EAP1
EAN1
EAP2
AGND
V33A
AD00
AD01
UCD3138RMH 40 QFN With Corner Anchors – Pin Assignments
AD02
2.8
SLUSAP2F – MARCH 2012 – REVISED NOVEMBER 2013
31
AGND
1
30
AGND
AD13
2
29
AGND
AD06
3
28
BP18
AD04
4
27
V33D
AD03
5
26
DGND
DGND
6
25
FAULT2
/RESET
7
24
TMS
ADC_EXT_TRIG/TCAP/SYNC/PWM0
8
23
TDI/SCI_RX0/PMBUS_CTRL/FAULT1
PMBUS_CLK/SCI_TX0
9
22
TDO/SCI_TX0/PMBUS_ALERT/FAULT0
PMBUS_DATA/SCI_RX0
10
21
TCK/TCAP/SYNC/PWM0
UCD3138RMH
12
13
14
15
16
17
18
19
DPWM0B
DPWM1A
DPWM1B
DPWM2A
DPWM2B
DPWM3A
DPWM3B
PMBUS_ALERT
20
PMBUS_CTRL
11
DPWM0A
(40 QFN)
NOTE: The RMH package has thinner package height compared to the RHA package. There are also four corner
pins on the RMH package. These features help to improve solder-joint reliability. The corner anchor pins and thermal
pad should be soldered for robust mechanical performance and should be tied to the appropriate ground signal.
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Pin Functions (UCD3138RHA and UCD3138RMH)
Additional pin functionality is specified in the following table.
Table 2-2. Pin Functions
PIN
PRIMARY ASSIGNMENT
ALTERNATE ASSIGNMENT
NO. 1
NO. 2
NO. 3
CONFIGURABLE
AS A GPIO?
TCAP
SYNC
PWM0
Yes
1
AGND
Analog ground
2
AD13
12-bit ADC, Ch 13, Connected to comparator E, I-share
3
AD06
12-bit ADC, Ch 6, Connected to comparator F
4
AD04
12-bit ADC, Ch 4, Connected to comparator D
5
AD03
12-bit ADC, Ch 3, Connected to comparator B & C
6
DGND
Digital ground
7
RESET
Device Reset Input, active low
8
ADC_EXT_TRIG
ADC conversion external trigger input
9
PMBUS_CLK
PMBUS Clock (Open Drain)
SCI_TX0
Yes
10
PMBUS_DATA
PMBus data (Open Drain)
SCI_RX0
Yes
11
DPWM0A
DPWM 0A output
Yes
12
DPWM0B
DPWM 0B output
Yes
13
DPWM1A
DPWM 1A output
Yes
14
DPWM1B
DPWM 1B output
Yes
15
DPWM2A
DPWM 2A output
Yes
16
DPWM2B
DPWM 2B output
Yes
17
DWPM3A
DPWM 3A output
Yes
18
DPWM3B
DPWM 3B output
Yes
19
PMBUS_ALERT
PMBus Alert (Open Drain)
Yes
20
PMBUS_CTRL
PMBus Control (Open Drain)
Yes
21
TCK
JTAG TCK (For manufacturer test only)
TCAP
SYNC
PWM0
Yes
22
TDO
JTAG TDO (For manufacturer test only)
SCI_TX0
PMBUS_ALERT
FAULT0
Yes
23
TDI
JTAG TDI (For manufacturer test only)
SCI_RX0
PMBUS_CTRL
FAULT1
Yes
24
TMS
JTAG TMS (For manufacturer test only)
Yes
25
FAULT2
External fault input 2
Yes
26
DGND
Digital ground
27
V33D
Digital 3.3V core supply
28
BP18
1.8V Bypass
29
AGND
Substrate analog ground
30
AGND
Analog ground
31
EAP0
Channel #0, differential analog voltage, positive input
32
EAN0
Channel #0, differential analog voltage, negative input
33
EAP1
Channel #1, differential analog voltage, positive input
34
EAN1
Channel #1, differential analog voltage, negative input
35
EAP2
Channel #2, differential analog voltage, positive input
(Recommended for peak currrent mode control)
36
AGND
Analog ground
37
V33A
Analog 3.3V supply
38
AD00
12-bit ADC, Ch 0, Connected to current source
39
AD01
12-bit ADC, Ch 1, Connected to current source
40
AD02
12-bit ADC, Ch 2, Connected to comparator A, I-share
Corner
anchor pin
(RMH only)
All four anchors should be soldered and tied to GND
Corner
NA
14
NAME
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3
Electrical Specifications
3.1
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
MIN
MAX
V33D
V33D to DGND
–0.3
3.8
V
V33DIO
V33DIO to DGND
–0.3
3.8
V
V33A
V33A to AGND
–0.3
3.8
V
BP18
BP18 to DGND
–0.3
2.5
V
|DGND – AGND|
Ground difference
0.3
V
All Pins, excluding
AGND (2)
Voltage applied to any pin
–0.3
3.8
V
TJ
Junction Temperature
–40
150
°C
Storage temperature
–55
150
°C
TSTG
(1)
(2)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Referenced to DGND
3.2
THERMAL INFORMATION
THERMAL METRIC (1)
(2)
θJA
Junction-to-ambient thermal resistance
θJCtop
Junction-to-case (top) thermal resistance
(3)
(4)
UCD3138
UCD3138
UCD3138
64 PIN QFN
(RGC)
40 PIN QFN
(RHA)
40 PIN QFN
(RMH)
25.1
31.8
31.0
10.5
18.5
16.5
4.6
6.8
6.3
0.2
0.2
0.2
θJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter (5)
ψJB
Junction-to-board characterization parameter
(6)
4.6
6.7
6.3
Junction-to-case (bottom) thermal resistance
(7)
1.2
1.8
1.1
θJCbot
(1)
(2)
(3)
(4)
(5)
(6)
(7)
UNITS
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
3.3
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
V33D
Digital power
3.0
3.3
3.6
V33DIO
Digital I/O power
3.0
3.3
3.6
V33A
Analog power
3.0
3.3
3.6
V
TJ
Junction temperature
–40
-
125
°C
BP18
1.8V Digital Power
1.6
1.8
2.0
V
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UNIT
V
15
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3.4
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ELECTRICAL CHARACTERISTICS
V33A = V33D = V33DIO = 3.3V; 1μF from BP18 to DGND, TJ = –40°C to 125°C (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
I33A
Measured on V33A. The device is
powered up but all ADC12 and EADC
sampling is disabled
6.3
mA
I33DIO
All GPIO and communication pins are
open
0.35
mA
I33D
ROM program execution
I33D
Flash programming in ROM mode
I33
The device is in ROM mode with all
DPWMs enabled and switching at 2
MHz. The DPWMs are all unloaded.
60
mA
70
mA
100
mA
ERROR ADC INPUTS EAP, EAN
EAP – AGND
–0.15
1.998
–0.256
1.848
AFE = 0
–256
248
mV
AFE = 3
0.8
1
1.20
mV
AFE = 2
1.7
2
2.30
mV
AFE = 1
3.55
4
4.45
mV
AFE = 0
6.90
8
9.10
EAP – EAN
Typical error range
EAP – EAN Error voltage digital resolution
REA
Input impedance (See Figure 4-1)
IOFFSET
Input offset current (See Figure 4-1)
EADC Offset
AGND reference
0.5
–5
mV
5
μA
Input voltage = 0 V at AFE = 0
–2
2
LSB
Input voltage = 0 V at AFE = 1
–2.5
2.5
LSB
Input voltage = 0 V at AFE = 2
–3
-3
LSB
Input voltage = 0 V at AFE = 3
–4
4
LSB
16
MHz
Analog Front End Amplifier Bandwidth
A0
V
MΩ
Sample Rate
Gain
V
See Figure 4-2
100
MHz
1
V/V
Minimum output voltage
100
mV
1.6
V
EADC DAC
DAC range
0
VREF DAC reference resolution
10 bit, No dithering enabled
1.56
VREF DAC reference resolution
With 4 bit dithering enabled
97.6
INL
DNL
Does not include MSB transition
3.0
LSB
–2.1
1.6
LSB
-1.4
DAC reference voltage
Settling Time
μV
–3.0
DNL at MSB transition
τ
mV
1.58
From 10% to 90%
LSB
1.61
250
V
ns
ADC12
IBIAS
Bias current for PMBus address pins
Measurement range for voltage monitoring
Internal ADC reference voltage
Change in Internal ADC reference from
25°C reference voltage (1)
(1)
16
–40°C to 125°C
9.5
10.5
μA
0
2.5
V
2.525
V
2.475
2.500
–40°C to 25°C
–0.4
25°C to 85°C
–1.8
25°C to 125°C
–4.2
mV
As designed and characterized. Not 100% tested in production.
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ELECTRICAL CHARACTERISTICS (continued)
V33A = V33D = V33DIO = 3.3V; 1μF from BP18 to DGND, TJ = –40°C to 125°C (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
ADC12 INL integral nonlinearity (1)
TYP
MAX
+/-2.5
ADC12 DNL differential nonlinearity (1)
ADC_SAMPLINGSEL = 6 for all ADC12
data, 25 °C to 125 °C
ADC Zero Scale Error
ADC Full Scale Error
LSB
–0.7/+2.5
–7
–35
UNIT
LSB
7
mV
35
mV
Input bias
2.5 V applied to pin
400
Input leakage resistance (1)
ADC_SAMPLINGSEL= 6 or 0
1
MΩ
10
pF
ADC_SAMPLINGSEL= 6 or 0
3.9
μs
Input Capacitance (1)
ADC single sample conversion time (1)
nA
DIGITAL INPUTS/OUTPUTS (2) (3)
VOL
Low-level output voltage (4)
VOH
High-level output voltage
VIH
High-level input voltage
V33DIO = 3 V
VIL
Low-level input voltage
V33DIO = 3 V
IOH
Output sinking current
IOL
Output sourcing current
DGND
+ 0.25
IOH = 4 mA, V33DIO = 3 V
(4)
IOH = –4 mA, V33DIO = 3 V
V
V33DIO
– 0.6
V
2.1
V
1.1
V
4
mA
–4
mA
SYSTEM PERFORMANCE
TWD
Watchdog time out range
Total time is: TWD x
(WDCTRL.PERIOD+1)
Time to disable DPWM output based on
active FAULT pin signal
High level on FAULT pin
14.6
Digital compensator delay
Pulse width needed at reset (6)
(1 clock = 32ns)
Retention period of flash content (data
retention and program)
f(PCLK)
TJ = 25°C
ms
ns
31.25
(5)
t(reset)
20.5
70
Processor master clock (MCLK)
tDelay
17
MHz
6
clocks
10
µs
100
years
Program time to erase one page or block in
data flash or program flash
20
ms
Program time to write one word in data
flash or program flash
20
µs
Internal oscillator frequency
Sync-in/sync-out pulse width
240
Sync pin
250
260
MHz
256
ns
Flash Read
1
MCLKs
Flash Write
20
μs
ISHARE
Current share current source (See
Figure 4-9)
238
259
μA
RSHARE
Current share resistor (See Figure 4-9)
9.75
10.3
kΩ
POWER ON RESET AND BROWN OUT (V33D pin, See Figure 3-3)
VGH
Voltage good High
2.7
V
VGL
Voltage good Low
2.5
V
Vres
Voltage at which IReset signal is valid
0.8
V
TPOR
Time delay after Power is good or
RESET* relinquished
(2)
(3)
(4)
(5)
(6)
1
ms
DPWM outputs are low after reset. Other GPIO pins are configured as inputs after reset.
On the 40 pin package V33DIO is connected to V33D internally.
The maximum total current, IOHmax and IOLmax for all outputs combined, should not exceed 12 mA to hold the maximum voltage drop
specified. Maximum sink current per pin = –6 mA at VOL; maximum source current per pin = 6 mA at VOH.
Time from close of error ADC sample window to time when digitally calculated control effort (duty cycle) is available. This delay, which
has no variation associated with it, must be accounted for when calculating the system dynamic response.
As designed and characterized. Not 100% tested in production.
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ELECTRICAL CHARACTERISTICS (continued)
V33A = V33D = V33DIO = 3.3V; 1μF from BP18 to DGND, TJ = –40°C to 125°C (unless otherwise noted)
PARAMETER
Brownout
TEST CONDITION
MIN
Internal signal warning of brownout
conditions
TYP
MAX
2.9
UNIT
V
TEMPERATURE SENSOR (7)
VTEMP
Voltage range of sensor
Voltage resolution
Volts/°C
Temperature resolution
Degree C per bit
Accuracy
(7) (8)
Temperature range
ITEMP
-40°C to 125°C
–10
-40°C to 125°C
–40
Ambient temperature
2.44
V
5.9
mV/ºC
0.1034
ºC/LSB
±5
10
125
ºC
ºC
30
μA
Turn on time / settling time of sensor
100
μs
Trimmed 25°C reading
1.85
V
Current draw of sensor when active
TON
VAMB
1.46
ANALOG COMPARATOR
DAC
Reference DAC Range
0
Reference Voltage
2.478
Bits
(7)
Offset
V
bits
0.21
LSB
0.06
0.12
LSB
–5.5
19.5
mV
150
ns
Reference DAC buffered output load (10)
0.5
1
mA
Buffer offset (-0.5 mA)
4.6
8.3
mV
–0.05
17
mV
Buffer offset (1.0 mA)
18
2.513
V
–0.42
Time to disable DPWM output based on 0
V to 2.5 V step input on the analog
comparator. (9)
(7)
(8)
(9)
(10)
2.5
7
INL (7)
DNL
2.5
Characterized by design and not production tested.
Ambient temperature offset value should be used from the TEMPSENCTRL register to meet accuracy.
As designed and characterized. Not 100% tested in production.
Available from reference DACs for comparators D, E, F and G.
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PMBus/SMBus/I2C Timing
3.5
The timing characteristics and timing diagram for the communications interface that supports I2C, SMBus,
and PMBus in Slave or Master mode are shown in Table 3-1, Figure 3-1, and Figure 3-2. The numbers in
Table 3-1 arµe for 400 kHz operating frequency. However, the device supports all three speeds, standard
(100 kHz), fast (400 kHz), and fast mode plus (1 MHz).
Table 3-1. I2C/SMBus/PMBus Timing Characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
Typical values at TA = 25°C and VCC = 3.3 V (unless otherwise noted)
fSMB
SMBus/PMBus operating frequency
Slave mode, SMBC 50% duty cycle
100 1000
kHz
fI2C
I2C operating frequency
Slave mode, SCL 50% duty cycle
100 1000
kHz
t(BUF)
Bus free time between start and
stop (1)
t(HD:STA)
Hold time after (repeated) start
t(SU:STA)
Repeated start setup time
t(SU:STO)
Stop setup time (1)
t(HD:DAT)
Data hold time
t(SU:DAT)
Data setup time
(1)
(1)
Receive mode
1.3
µs
0.6
µs
0.6
µs
0.6
µs
0
ns
100
ns
(2)
t(TIMEOUT)
Error signal/detect
t(LOW)
Clock low period
1.3
µs
t(HIGH)
Clock high period (3)
0.6
µs
t(LOW:SEXT)
Cumulative clock low slave extend
time (4)
tf
Clock/data fall time
Rise time tr = (VILmax – 0.15) to (VIHmin + 0.15)
tr
Clock/data rise time
Fall time tf = 0.9 VDD to (VILmax – 0.15)
Cb
Total capacitance of one bus line
(1)
(2)
(3)
(4)
(5)
35
ms
25
ms
20 + 0.1
Cb (5)
300
ns
20 + 0.1
Cb (5)
300
ns
400
pF
Fast Mode, 400 kHz
The device times out when any clock low exceeds t(TIMEOUT).
t(HIGH), Max, is the minimum bus idle time. SMBC = SMBD = 1 for t > 50 ms causes reset of any transaction that is in progress. This
specification is valid when the NC_SMB control bit remains in the default cleared state (CLK[0] = 0).
t(LOW:SEXT) is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.
Cb (pF)
Figure 3-1. I2C/SMBus/PMBus Timing Diagram
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Figure 3-2. Bus Timing in Extended Mode
3.6
Power On Reset (POR) / Brown Out Reset (BOR)
V33D
3.3 V
Brown Out
VGH
VGL
Vres
t
TPOR
IReset
TPOR
t
undefined
Figure 3-3. Power On Reset (POR) / Brown Out Reset (BOR)
20
VGH
– This is the V33D threshold where the internal power is declared good. The UCD3138 comes
out of reset when above this threshold.
VGL
– This is the V33D threshold where the internal power is declared bad. The device goes into
reset when below this threshold.
Vres
– This is the V33D threshold where the internal reset signal is no longer valid. Below this
threshold the device is in an indeterminate state.
IReset
– This is the internal reset signal. When low, the device is held in reset. This is equivalent to
holding the reset pin on the IC high.
TPOR
– The time delay from when VGH is exceeded to when the device comes out of reset.
Brown
Out
– This is the V33D voltage threshold at which the device sets the brown out status bit. In
addition an interrupt can be triggered if enabled.
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3.7
SLUSAP2F – MARCH 2012 – REVISED NOVEMBER 2013
Typical Clock Gating Power Savings
6
Power Savings (mA)
5
4.9
4
3
2.57
2
1.2
1
0.8
0.4
0.4
0.2
0.2
0.1
0.1
0
SCI
SCI
GIO
0
DPWM FE_CTRL
PCM
ADC12
PMBUS
TIMER
CPCC
FILTER
UCD3138 Function
G001
Power disable control register provides control bits that can enable or disable arrival of clock to several
peripherals such as, PCM, CPCC, digital filters, front ends, DPWMs, UARTs, ADC-12 and more.
All these controls are enabled as default. If a specific peripheral is not used in a specific application the
clock gate can be disabled in order to block the propagation of clock signal to that peripheral and therefore
reduce the overall current consumption of the device.
Electrical Specifications
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Typical Temperature Characteristics
1.81
2
1.79
Voltage (V)
EADC LSB Size (mV)
sp
2.1
1.9
1.8
1.7
1.6
−40
1.77
1.75
Minimum
Maximum
Typical
1.73
−20
0
20
40
60
Temperature (°C)
80
100
1.71
120
-50
8
2.4
6
ADC12 Error (LSB)
Sensor Voltage (V)
ADC12 Measurement Temperature Sensor Voltage
2.0
1.8
100
150
C001
Figure 3-5. BP18 Voltage vs Temperature
2.6
2.2
50
Temperature (ƒC)
Figure 3-4. EADC LSB Size with 4X Gain (mV) vs.
Temperature
1.6
1.4
0
G005a
ADC12 Temperature Sensor Measurement Error
4
2
0
−2
−60 −40 −20
0
20 40 60 80
Temperature (°C)
−4
−40
100 120 140 160
−20
0
G006b
Figure 3-6. ADC12 Measurement Temperature
Sensor Voltage vs. Temperature
20
40
60
Temperature (°C)
80
100
120
G002b
Figure 3-8. ADC12 Temperature Sensor
Measurement Error vs. Temperature
UCD3138 Oscillator Frequency
ADC12 2.5-V Reference
2.08
2.515
2.505
2-MHZ Reference
ADC12 Reference
2.510
2.500
2.495
2.490
2.04
2
1.96
2.485
2.480
2.475
−40
−20
0
20
40
60
Temperature (°C)
80
100
1.92
−40
G003b
Figure 3-7. ADC12 2.5-V Reference vs.
Temperature
22
120
−20
0
20
40
60
Temperature (°C)
80
100
120
G004b
Figure 3-9. UCD3138 Oscillator Frequency (2MHz
Reference, Divided Down from 250MHz) vs.
Temperature
Electrical Specifications
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4
Functional Overview
4.1
ARM Processor
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The ARM7TDMI-S processor is a synthesizable member of the ARM family of general purpose 32-bit
microprocessors. The ARM architecture is based on RISC (Reduced Instruction Set Computer) principles
where two instruction sets are available. The 32-bit ARM instruction set and the 16-bit Thumb instruction
set. The Thumb instruction allows for higher code density equivalent to a 16-bit microprocessor, with the
performance of the 32-bit microprocessor.
The three-staged pipelined ARM processor has fetch, decode and execute stage architecture. Major
blocks in the ARM processor include a 32-bit ALU, 32 x 8 multiplier, and a barrel shifter.
4.2
Memory
The UCD3138 (ARM7TDMI-S) is a Von-Neumann architecture, where a single bus provides access to all
of the memory modules. All of the memory module addresses are sequentially aligned along the same
address range. This applies to program flash, data flash, ROM and all other peripherals.
Within the UCD3138 architecture, there is a 1024x32-bit Boot ROM that contains the initial firmware
startup routines for PMBUS communication and non-volatile (FLASH) memory download. This boot ROM
is executed after power-up-reset checks if there is a valid FLASH program written. If a valid program is
present, the ROM code branches to the main FLASH-program execution.
UCD3138 also supports customization of the boot program by allowing an alternative boot routine to be
executed from program FLASH. This feature enables assignment of a unique address to each device;
therefore, enabling firmware reprogramming even when several devices are connected on the same
communication bus.
Two separate FLASH memory areas are present inside the device. The 32 kB Program FLASH is
organized as an 8 k x 32 bit memory block and is intended to be for the firmware program. The block is
configured with page erase capability for erasing blocks as small as 1kB per page, or with a mass erase
for erasing the entire program FLASH array. The FLASH endurance is specified at 1000 erase/write
cycles and the data retention is good for 100 years. The 2 kB data FLASH array is organized as a 512 x
32 bit memory (32 byte page size). The Data FLASH is intended for firmware data value storage and data
logging. Thus, the Data FLASH is specified as a high endurance memory of 20 k cycles with embedded
error correction code (ECC).
For run time data storage and scratchpad memory, a 4 kB RAM is available. The RAM is organized as a 1
k x 32 bit array.
4.2.1
CPU Memory Map and Interrupts
When the device comes out of power-on-reset, the data memories are mapped to the processor as
follows:
4.2.1.1
Memory Map (After Reset Operation)
Address
Size
Module
16 X 4K
Boot ROM
0x0001_0000 – 0x0001_7FFF
32K
Program Flash
0x0001_8800 – 0x0001_8FFF
2K
Data Flash
0x0001_9000 – 0x0001_9FFF
4K
Data RAM
0x0000_0000 – 0x0000_FFFF
In 16 repeated blocks of 4K each
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Memory Map (Normal Operation)
Just before the boot ROM program gives control to FLASH program, the ROM configures the memory as
follows:
Address
Size
Module
0x0000_0000 – 0x0000_7FFF
32K
Program Flash
0x0001_0000 – 0x0001_AFFF
4K
Boot ROM
0x0001_8800 – 0x0001_8FFF
2K
Data Flash
0x0001_9000 – 0x0001_9FFF
4K
Data RAM
4.2.1.3
Memory Map (System and Peripherals Blocks)
Address
Size
Module
0x0002_0000 - 0x0002_00FF
256
Loop Mux
0x0003_0000 - 0x0003_00FF
256
Fault Mux
0x0004_0000 - 0x0004_00FF
256
ADC
0x0005_0000 - 0x0005_00FF
256
DPWM 3
0x0006_0000 - 0x0006_00FF
256
Filter 2
0x0007_0000 - 0x0007_00FF
256
DPWM 2
0x0008_0000 - 0x0008_00FF
256
Front End/Ramp I/F 2
0x0009_0000 - 0x0009_00FF
256
Filter 1
0x000A_0000 - 0x000A_00FF
256
DPWM 1
0x000B_0000 – 0x000B_00FF
256
Front End/Ramp I/F 1
0x000C_0000 - 0x000C_00FF
256
Filter 0
0x000D_0000 - 0x000D_00FF
256
DPWM 0
0x000E_0000 - 0x000E_00FF
256
Front End/Ramp I/F 0
0xFFF7_EC00 - 0xFFF7_ECFF
256
UART 0
0xFFF7_ED00 - 0xFFF7_EDFF
256
UART 1
0xFFF7_F000 - 0xFFF7_F0FF
256
Miscellaneous Analog Control
0xFFF7_F600 - 0xFFF7_F6FF
256
PMBus Interface
0xFFF7_FA00 - 0xFFF7_FAFF
256
GIO
0xFFF7_FD00 - 0xFFF7_FDFF
256
Timer
0xFFFF_FD00 - 0xFFFF_FDFF
256
MMC
0xFFFF_FE00 - 0xFFFF_FEFF
256
DEC
0xFFFF_FF20 - 0xFFFF_FF37
23
CIM
0xFFFF_FF40 - 0xFFFF_FF50
16
PSA
0xFFFF_FFD0 - 0xFFFF_FFEC
28
SYS
The registers and bit definitions inside the System and Peripheral blocks are detailed in the programmer’s
guide for each peripheral.
4.2.2
Boot ROM
The UCD3138 incorporates a 4k boot ROM. This boot ROM includes support for:
• Program download through the PMBus
• Device initialization
• Examining and modifying registers and memory
• Verifying and executing program FLASH automatically
• Jumping to a customer defined boot program
24
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The Boot ROM is entered automatically on device reset. It initializes the device and then performs
checksums on the Program FLASH. If the first 2 kB of program FLASH has a valid checksum, the
program jumps to location 0 in the Program FLASH. This permits the use of a customer boot program. If
the first checksum fails, it performs a checksum on the complete 32 kB of program flash. If this is valid, it
also jumps to location 0 in the program flash. This permits full automated program memory checking,
when there is no need for a custom boot program.
If neither checksum is valid, the Boot ROM stays in control, and accepts commands via the PMBus
interface
These functions can be used to read and write to all memory locations in the UCD3138. Typically they are
used to download a program to Program Flash, and to command its execution
4.2.3
Customer Boot Program
As described above, it is possible to generate a user boot program using 2 kB or more of the Program
Flash. This can support things which the Boot ROM does not support, including:
• Program download via UART – useful especially for applications where the UCD3138 is isolated from
the host (e.g., PFC)
• Encrypted download – useful for code security in field updates.
4.2.4
Flash Management
The UCD3138 offers a variety of features providing for easy prototyping and easy flash programming. At
the same time, high levels of security are possible for production code, even with field updates. Standard
firmware will be provided for storing multiple copies of system parameters in data flash. This is minimizes
the risk of losing information if programming is interrupted.
4.3
System Module
The System Module contains the interface logic and configuration registers to control and configure all the
memory, peripherals and interrupt mechanisms. The blocks inside the system module are the address
decoder, memory management controller, system management unit, central interrupt unit, and clock
control unit.
4.3.1
Address Decoder (DEC)
The Address Decoder generates the memory selects for the FLASH, ROM and RAM arrays. The memory
map addresses are selectable through configurable register settings. These memory selects can be
configured from 1 kB to 16 MB. Power on reset uses the default addresses in the memory map for ROM
execution, which is then configured by the ROM code to the application setup. During access to the DEC
registers, a wait state is asserted to the CPU. DEC registers are only writable in the ARM privilege mode
for user mode protection.
4.3.2
Memory Management Controller (MMC)
The MMC manages the interface to the peripherals by controlling the interface bus for extending the read
and write accesses to each peripheral. The unit generates eight peripheral select lines with 1 kB of
address space decoding.
4.3.3
System Management (SYS)
The SYS unit contains the software access protection by configuring user privilege levels to memory or
peripherals modules. It contains the ability to generate fault or reset conditions on decoding of illegal
address or access conditions. A clock control setup for the processor clock (MCLK) speed, is also
available.
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Central Interrupt Module (CIM)
The CIM accepts 32 interrupt requests for meeting firmware timing requirements. The ARM processor
supports two interrupt levels: FIQ and IRQ. FIQ is the highest priority interrupt. The CIM provides
hardware expansion of interrupts by use of FIQ/IRQ vector registers for providing the offset index in a
vector table. This numerical index value indicates the highest precedence channel with a pending interrupt
and is used to locate the interrupt vector address from the interrupt vector table. Interrupt channel 0 has
the lowest precedence and interrupt channel 31 has the highest precedence. To remove the interrupt
request, the firmware should clear the request as the first action in the interrupt service routine. The
request channels are maskable, allowing individual channels to be selectively disabled or enabled.
Table 4-1. Interrupt Priority Table
NAME
MODULE COMPONENT OR
REGISTER
DESCRIPTION
PRIORITY
BRN_OUT_INT
Brownout
Brownout interrupt
0 (Lowest)
EXT_INT
External Interrupts
Interrupt on external input pin
1
WDRST_INT
Watchdog Control
Interrupt from watchdog exceeded (reset)
2
WDWAKE_INT
Watchdog Control
Wakeup interrupt when watchdog equals half of set
watch time
3
SCI_ERR_INT
UART or SCI Control
UART or SCI error Interrupt. Frame, parity or overrun
4
SCI_RX_0_INT
UART or SCI Control
UART0 RX buffer has a byte
5
SCI_TX_0_INT
UART or SCI Control
UART0 TX buffer empty
6
SCI_RX_1_INT
UART or SCI Control
UART1 RX buffer has a byte
7
SCI_TX_1_INT
UART or SCI Control
UART1 TX buffer empty
8
PMBUS_INT
PMBus related interrupt
9
DIG_COMP_INT
12-bit ADC Control
Digital comparator interrupt
10
FE0_INT
Front End 0
“Prebias complete”, “Ramp Delay Complete”, “Ramp
Complete”, “Load Step Detected”,
“Over-Voltage Detected”, “EADC saturated”
11
FE1_INT
Front End 1
“Prebias complete”, “Ramp Delay Complete”, “Ramp
Complete”, “Load Step Detected”,
“Over-Voltage Detected”, “EADC saturated”
12
FE2_INT
Front End 2
“Prebias complete”, “Ramp Delay Complete”, “Ramp
Complete”, “Load Step Detected”,
“Over-Voltage Detected”, “EADC saturated”
13
PWM3_INT
16-bit Timer PWM 3
16-bit Timer PWM3 counter overflow or compare interrupt
14
PWM2_INT
16-bit Timer PWM 2
16-bit Timer PWM2 counter Overflow or compare
interrupt
15
PWM1_INT
16-bit Timer PWM 1
16-bit Timer PWM1 counter overflow or compare interrupt
16
PWM0_INT
16-bit timer PWM 0
16-bit Timer PWM1 counter overflow or compare interrupt
17
OVF24_INT
24-bit Timer Control
24-bit Timer counter overflow interrupt
18
CAPTURE_1_INT
24-bit Timer Control
24-bit Timer capture 1 interrupt
19
COMP_1_INT
24-bit Timer Control
24-bit Timer compare 1 interrupt
20
CAPTURE_0_INT
24-bit Timer Control
24-bit Timer capture 0 interrupt
21
COMP_0_INT
24-bit Timer Control
24-bit Timer compare 0 interrupt
22
CPCC_INT
Constant Power Constant Current
Mode switched in CPCC module Flag needs to be read
for details
23
ADC_CONV_INT
12-bit ADC Control
ADC end of conversion interrupt
24
Fault Mux Interrupt
Analog comparator interrupts, Over-Voltage detection,
Under-Voltage detection,
LLM load step detection
25
FAULT_INT
26
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Table 4-1. Interrupt Priority Table (continued)
NAME
MODULE COMPONENT OR
REGISTER
DESCRIPTION
DPWM3
DPWM3
Same as DPWM1
26
DPWM2
DPWM2
Same as DPWM1
27
DPWM1
DPWM1
1) Every (1-256) switching cycles
2) Fault Detection
3) Mode switching
28
DPWM0
DPWM0
Same as DPWM1
29
EXT_FAULT_INT
External Faults
Fault pin interrupt
30
SYS_SSI_INT
System Software
System software interrupt
4.4
PRIORITY
31 (highest)
Peripherals
4.4.1
Digital Power Peripherals
At the core of the UCD3138 controller are 3 Digital Power Peripherals (DPP). Each DPP can be
configured to drive from one to eight DPWM outputs. Each DPP consists of:
• Differential input error ADC (EADC) with sophisticated controls
• Hardware accelerated digital 2-pole/2-zero PID based compensator
• Digital PWM module with support for a variety of topologies
These can be connected in many different combinations, with multiple filters and DPWMs. They are
capable of supporting functions like input voltage feed forward, current mode control, and constant
current/constant power, etc.. The simplest configuration is shown in the following figure:
EAP
EAN
4.4.1.1
DPWMA
Error ADC
(Front End)
Filter
Digital
PWM
DPWMB
Front End
Figure 4-1 shows the block diagram of the front end module. It consists of a differential amplifier, an
adjustable gain error amplifier, a high speed flash analog to digital converter (EADC), digital averaging
filters and a precision high resolution set point DAC reference. The programmable gain amplifier in concert
with the EADC and the adjustable digital gain on the EADC output work together to provide 9 bits of range
with 6 bits of resolution on the EADC output. The output of the Front End module is a 9 bit sign extended
result with a gain of 1 LSB / mV. Depending on the value of AFE selected, the resolution of this output
could be either 1, 2, 4 or 8 LSBs. In addition Front End 0 has the ability to automatically select the AFE
value such that the minimum resolution is maintained that still allows the voltage to fit within the range of
the measurement. The EADC control logic receives the sample request from the DPWM module for
initiating an EADC conversion. EADC control circuitry captures the EADC-9-bit-code and strobes the
digital compensator for processing of the representative error. The set point DAC has 10 bits with an
additional 4 bits of dithering resulting in an effective resolution of 14 bits. This DAC can be driven from a
variety of sources to facilitate things like soft start, nested loops, etc. Some additional features include the
ability to change the polarity of the error measurement and an absolute value mode which automatically
adds the DAC value to the error.
It is possible to operate the controller in a peak current mode control configuration; front-end 2 is
recommended for implementing peak current mode control. In this mode topologies like the phase shifted
full bridge converter can be controlled to maintain transformer flux balance. The internal DAC can be
ramped at a synchronously controlled slew rate to achieve a programmable slope compensation. This
eliminates the sub-harmonic oscillation as well as improves input voltage feed-forward performance. A0 is
a unity gain buffer used to isolate the peak current mode comparator. The offset of this buffer is specified
in the Electrical Characteristics table.
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EAP
Front End Differential
Amplifier
IOFFSET
R EA
IOFFSET
R EA
AGND
EAN
AGND
Figure 4-1. Input Stage of EADC Module
AFE_GAIN
2
EAP0
3-AFE_GAIN
6 bit ADC
8 mV/LSB
EAN0
2
AFE_GAIN
EADC
X
Signed 9 bit result
(error) 1 mV /LSB
Averaging
SAR/Prebias
Ramp
A0
Filter x
DAC0
10 bit DAC
1.5625 mV/LSB
CPCC
S
Value
Dither
4 bit dithering gives 14 bits of effective resolution
97.65625 µV/LSB effective resolution
Absolute Value
Calculation
10 bit result
1.5625 mV/LSB
Peak Current
Detected
Peak Current Mode
Comparator
Figure 4-2. Front End Module
(Front End 2 Recommended for Peak Current Mode Control)
4.4.1.2
DPWM Module
The DPWM module represents one complete DPWM channel with 2 independent outputs, A and B.
Multiple DPWM modules within the UCD3138 system can be configured to support all key power
topologies. DPWM modules can be used as independent DPWM outputs, each controlling one power
supply output voltage rail. It can also be used as a synchronized DPWM—with user selectable phase shift
between the DPWM channels to control power supply outputs with multiphase or interleaved DPWM
configurations.
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The output of the filter feeds the high resolution DPWM module. The DPWM module produces the pulse
width modulated outputs for the power stage switches. The compensator calculates the necessary duty
ratio as a 24-bit number in Q23 fixed point format (23 bit integer with 1 sign bit). This represents a value
within the range 0.0 to 1.0. This duty ratio value is used to generate the corresponding DPWM output ON
time. The resolution of the DPWM ON time is 250 psec.
Each DPWM module can be synchronized to another module or to an external sync signal. An input
SYNC signal causes a DPWM ramp timer to reset. The SYNC signal outputs—from each of the four
DPWM modules—occur when the ramp timer crosses a programmed threshold. In this way the phase of
the DPWM outputs for multiple power stages can be tightly controlled.
The DPWM logic is probably the most complex of the Digital Peripherals. It takes the output of the
compensator and converts it into the correct DPWM output for several power supply topologies. It
provides for programmable dead times and cycle adjustments for current balancing between phases. It
controls the triggering of the EADC. It can synchronize to other DPWMs or to external sources. It can
provide synchronization information to other DPWMs or to external recipients. In addition, it interfaces to
several fault handling circuits. Some of the control for these fault handling circuits is in the DPWM
registers. Fault handling is covered in the Fault Mux section.
Each DPWM module supports the following features:
• Dedicated 14 bit time-base with period and frequency control
• Shadow period register for end of period updates.
• Quad-event control registers (A and B, rising and falling) (Events 1-4)
– Used for on/off DPWM duty ratio updates.
• Phase control relative to other DPWM modules
• Sample trigger placement for output voltage sensing at any point during the DPWM cycle.
• Support for 2 independent edge placement DPWM outputs (same frequency or period setting)
• Dead-time between DPWM A and B outputs
• High Resolution capabilities – 250 ps
• Pulse cycle adjustment of up to ±8.192 µs ( 32768 × 250 ps)
• Active high/ active low output polarity selection
• Provides events to trigger both CPU interrupts and start of ADC12 conversions.
4.4.1.3
DPWM Events
Each DPWM can control the following timing events:
1. Sample Trigger Count–This register defines where the error voltage is sampled by the EADC in
relationship to the DPWM period. The programmed value set in the register should be one fourth of the
value calculated based on the DPWM clock. As the DCLK (DCLK = 62.5 MHz max) controlling the
circuitry runs at one fourth of the DPWM clock (PCLK = 250MHz max). When this sample trigger count
is equal to the DPWM Counter, it initiates a front end calculation by triggering the EADC, resulting in a
CLA calculation, and a DPWM update. Over-sampling can be set for 2, 4 or 8 times the sampling rate.
2. Phase Trigger Count–count offset for slaving another DPWM (Multi-Phase/Interleaved operation).
3. Period–low resolution switching period count. (count of PCLK cycles)
4. Event 1–count offset for rising DPWM A event. (PCLK cycles)
5. Event 2–DPWM count for falling DPWM A event that sets the duty ratio. Last 4 bits of the register are
for high resolution control. Upper 14 bits are the number of PCLK cycle counts.
6. Event 3–DPWM count for rising DPWM B event. Last 4 bits of the register are for high resolution
control. Upper 14 bits are the number of PCLK cycle counts.
7. Event 4–DPWM count for falling DPWM B event. Last 4 bits of the register are for high resolution
control. Upper 14 bits are the number of PCLK cycle counts.
8. Cycle Adjust–Constant offset for Event 2 and Event 4 adjustments.
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Basic comparisons between the programmed registers and the DPWM counter can create the desired
edge placements in the DPWM. High resolution edge capability is available on Events 2, 3 and 4.
Multi Mode Open Loop
Start of Period
Start of Period
Period
Period Counter
DPWM Output A
Event 1
Event 2 (High Resolution)
Cycle Adjust A (High Resolution)
Sample Trigger 1
To Other
Modules
Blanking A Begin
Blanking A End
DPWM Output B
Event 3 (High Resolution)
Event 4 (High Resolution)
Cycle Adjust B (High Resolution)
Sample Trigger 2
Blanking B Begin
To Other
Modules
Blanking B End
Phase Trigger
Events which change with DPWM mode:
DPWM A Rising Edge = Event 1
DPWM A Falling Edge = Event 2 + Cycle Adjust A
DPWM B Rising Edge = Event 3
DPWM B Falling Edge = Event 4 + Cycle Adjust B
Phase Trigger = Phase Trigger Register value
Events always set by their registers, regardless of mode:
Sample Trigger 1, Sample Trigger 2, Blanking A Begin , Blanking A End , Blanking B Begin,
Blanking B End
The drawing above is for multi-mode, open loop. Open loop means that the DPWM is controlled entirely
by its own registers, not by the filter output. In other words, the power supply control loop is not closed.
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The Sample Trigger signals are used to trigger the Front End to sample input signals. The Blanking
signals are used to blank fault measurements during noisy events, such as FET turn on and turn off.
Additional DPWM modes are described below.
4.4.1.4
High Resolution DPWM
Unlike conventional PWM controllers where the frequency of the clock dictates the maximum resolution of
PWM edges, the UCD3138 DPWM can generate waveforms with resolutions as small as 250 ps. This is
16 times the resolution of the clock driving the DPWM module.
This is achieved by providing the DPWM mechanism with 16 phase shifted clock signals of 250 MHz
each. The high resolution section of DPWM can be enabled or disabled, also the resolution can be defined
in several steps between 4ns to 250ps. This is done by setting the values of PWM_HR_MULTI_OUT_EN ,
HIRES_SCALE and ALL_PHASE_CLK_ENA inside the DPWM Control Register 1. See the Power
Peripherals programmer’s manual for details.
4.4.1.5
Over Sampling
The DPWM module has the capability to trigger an over sampling event by initiating the EADC to sample
the error voltage. The default “00” configuration has the DPWM trigger the EADC once based on the
sample trigger register value. The over sampling register has the ability to trigger the sampling 2, 4 or 8
times per PWM period. Thus the time the over sample happens is at the divide by 2, 4, or 8 time set in the
sampling register. The “01” setting triggers 2X over sampling, the “10” setting triggers 4X over sampling,
and the “11” triggers over sampling at 8X.
4.4.1.6
DPWM Interrupt Generation
The DPWM has the capability to generate a CPU interrupt based on the PWM frequency programmed in
the period register. The interrupt can be scaled by a divider ratio of up to 255 for developing a slower
interrupt service execution loop. This interrupt can be fed to the ADC circuitry for providing an ADC12
trigger for sequence synchronization. Table 4-2 outlines the divide ratios that can be programmed.
4.4.1.7
DPWM Interrupt Scaling/Range
Table 4-2. DPWM Interrupt Divide Ratio
Interrupt Divide Interrupt Divide
Setting
Count
Interrupt Divide
Count (hex)
Switching Period
Frames (assume 1MHz
loop)
Number of 32 MHz
Processor Cycles
1
0
00
1
32
2
1
01
2
64
3
3
03
4
128
4
7
07
8
256
5
15
0F
16
512
6
31
1F
32
1024
7
47
2F
48
1536
8
63
3F
64
2048
9
79
4F
80
2560
10
95
5F
96
3072
11
127
7F
128
4096
12
159
9F
160
5120
13
191
BF
192
6144
14
223
DF
224
7168
15
255
FF
256
8192
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DPWM Modes of Operation
The DPWM is a complex logic system which is highly configurable to support several different power
supply topologies. The discussion below will focus primarily on waveforms, timing and register settings,
rather than on logic design.
The DPWM is centered on a period counter, which counts up from 0 to PRD, and then is reset and starts
over again.
The DPWM logic causes transitions in many digital signals when the period counter hits the target value
for that signal.
4.5.1
Normal Mode
In Normal mode, the Filter output determines the pulse width on DPWM A. DPWM B fits into the rest of
the switching period, with a dead time separating it from the DPWM A on-time. It is useful for buck
topologies, among others. Here is a drawing of the Normal Mode waveforms:
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Normal Mode Closed Loop
Start of Period
Start of Period
Period
Period Counter
Filter controlled edge
DPWM Output A
Event 1
Filter Duty (High Resolution)
Cycle Adjust A (High Resolution)
Adaptive Sample Trigger A
Adaptive Sample Trigger B
Sample Trigger 1
To Other
Modules
Blanking A Begin
Blanking A End
DPWM Output B
Event 3 – Event 2 (High Res)
Event 4 (High Res)
Sample Trigger 2
Blanking B Begin
To Other
Modules
Blanking B End
Phase Trigger
Events which change with DPWM mode:
DPWM A Rising Edge = Event 1
DPWM A Falling Edge = Event 1 + Filter Duty + Cycle Adjust A
Adaptive Sample Trigger A = Event 1 + Filter Duty + Adaptive Sample Register or
Adaptive Sample Trigger B = Event 1 + Filter Duty/2 + Adaptive Sample Register
DPWM B Rising Edge = Event 1 + Filter Duty + Cycle Adjust A + (Event 3 – Event 2)
DPWM B Falling Edge = Event 4
Phase Trigger = Phase Trigger Register value or Filter Duty
Events always set by their registers, regardless of mode:
Sample Trigger 1, Sample Trigger 2, Blanking A Begin , Blanking A End , Blanking B
Begin, Blanking B End
Cycle adjust A can be used to adjust pulse widths on individual phases of a multi-phase system. This can
be used for functions like current balancing. The Adaptive Sample Triggers can be used to sample in the
middle of the on-time (for an average output), or at the end of the on-time (to minimize phase delay) The
Adaptive Sample Register provides an offset from the center of the on-time. This can compensate for
external delays, such as MOSFET and gate driver turn on times.
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Blanking A-Begin and Blanking A-End can be used to blank out noise from the MOSFET turn on at the
beginning of the period (DPWMA rising edge). Blanking B could be used at the turn off time of DPWMB.
The other edges are dynamic, so blanking is more difficult.
Cycle Adjust B has no effect in Normal Mode.
4.6
Phase Shifting
In most modes, it is possible to synchronize multiple DPWM modules using the phase shift signal. The
phase shift signal has two possible sources. It can come from the Phase Shift Register. This provides a
fixed value, which is useful for an interleaved PFC, for example.
The phase shift value can also come from the filter output. In this case, the changes in the filter output
causes changes in the phase relationship of two DPWM modules. This is useful for phase shifted full
bridge topologies.
The following figure shows the mechanism of phase shift:
Phase Shift
DPWM0 Start of Period
DPWM0 Start of Period
Period Counter
DPWM1 Start of Period
DPWM1 Start of Period
Period Counter
Phase Trigger = Phase Trigger Register value or Filter Duty
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DPWM Multiple Output Mode
Multi mode is used for systems where each phase has only one driver signal. It enables each DPWM
peripheral to drive two phases with the same pulse width, but with a time offset between the phases, and
with different cycle adjusts for each phase.
Here is a diagram for Multi-Mode:
Multi Mode Closed Loop
Start of Period
Start of Period
Period
Period Counter
Filter controlled edge
DPWM Output A
Event 1
Filter Duty (High Resolution)
Cycle Adjust A (High Resolution)
Adaptive Sample Trigger A
Adaptive Sample Trigger B
Sample Trigger 1
To Other
Modules
Blanking A Begin
Blanking A End
DPWM Output B
Event 3 (High Resolution)
Filter Duty (High Resolution)
Cycle Adjust B (High Resolution)
Sample Trigger 2
Blanking B Begin
To Other
Modules
Blanking B End
Phase Trigger
Events which change with DPWM mode:
DPWM A Rising Edge = Event 1
DPWM A Falling Edge = Event 1 + Filter Duty + Cycle Adjust A
Adaptive Sample Trigger A = Event 1 + Filter Duty + Adaptive Sample Register or
Adaptive Sample Trigger B = Event 1 + Filter Duty/2 + Adaptive Sample Register
DPWM B Rising Edge = Event 3
DPWM B Falling Edge = Event 3 + Filter Duty + Cycle Adjust B
Phase Trigger = Phase Trigger Register value or Filter Duty
Events always set by their registers, regardless of mode:
Sample Trigger 1, Sample Trigger 2, Blanking A Begin , Blanking A End , Blanking B
Begin, Blanking B End
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Event 2 and Event 4 are not relevant in Multi mode.
DPWMB can cross over the period boundary safely, and still have the proper pulse width, so full 100%
pulse width operation is possible. DPWMA cannot cross over the period boundary.
Since the rising edge on DPWM B is also fixed, Blanking B-Begin and Blanking B-End can be used for
blanking this rising edge.
And, of course, Cycle Adjust B is usable on DPWM B.
4.8
DPWM Resonant Mode
This mode provides a symmetrical waveform where DPWMA and DPWMB have the same pulse width. As
the switching frequency changes, the dead times between the pulses remain the same.
The equations for this mode are designed for a smooth transition from PWM mode to resonant mode, as
described in the LLC Example section. Here is a diagram of this mode:
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Resonant Symmetrical Closed Loop
Start of Period
Start of Period
Filter Period
Period Counter
Filter controlled edge
DPWM Output A
Event 1
Filter Duty – Average Dead Time
Adaptive Sample Trigger A
Adaptive Sample Trigger B
Sample Trigger 1
To Other
Modules
Blanking A Begin
Blanking A End
DPWM Output B
Event 3 - Event 2
Period Register – Event 4
Sample Trigger 2
Blanking B Begin
Blanking B End
Phase Trigger
Events which change with DPWM mode:
To Other
Modules
Dead Time 1 = Event 3 – Event 2
Dead Time 2 = Event 1 + Period Register – Event 4)
Average Dead Time = (Dead Time 1 + Dead Time 2)/2
DPWM A Rising Edge = Event 1
DPWM A Falling Edge = Event 1 + Filter Duty – Average Dead Time
Adaptive Sample Trigger A = Event 1 + Filter Duty + Adaptive Sample Register
Adaptive Sample Trigger B = Event 1 + Filter Duty/2 + Adaptive Sample Register
DPWM B Rising Edge = Event 1 + Filter Duty – Average Dead Time + (Event 3 – Event 2)
DPWM B Falling Edge = Filter Period – (Period Register – Event 4)
Phase Trigger = Phase Trigger Register value or Filter Duty
Events always set by their registers, regardless of mode:
Sample Trigger 1, Sample Trigger 2, Blanking A Begin, Blanking A End, Blanking B Begin,
Blanking B End
The Filter has two outputs, Filter Duty and Filter Period. In this case, the Filter is configured so that the
Filter Period is twice the Filter Duty. So if there were no dead times, each DPWM pin would be on for half
of the period. For dead time handling, the average of the two dead times is subtracted from the Filter Duty
for both DPWM pins. Therefore, both pins will have the same on-time, and the dead times will be fixed
regardless of the period. The only edge which is fixed relative to the start of the period is the rising edge of
DPWM A. This is the only edge for which the blanking signals can be used easily.
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Triangular Mode
Triangular mode provides a stable phase shift in interleaved PFC and similar topologies. In this case, the
PWM pulse is centered in the middle of the period, rather than starting at one end or the other. In
Triangular Mode, only DPWM-B is available. Here is a diagram for Triangular Mode:
Triangular Mode Closed Loop
Start of Period
Start of Period
Period
Period Counter
DPWM Output A
Sample Trigger 1
Blanking A Begin
To Other
Modules
Blanking A End
Filter controlled edge
DPWM Output B
Cycle Adjust A (High Resolution)
Cycle Adjust B (High Resolution)
Filter Duty/2 (High Resolution)
Period/2
Sample Trigger 2
Blanking B Begin
Blanking B End
To Other
Modules
Phase Trigger
Events which change with DPWM mode:
DPWM A Rising Edge = None
DPWM A Falling Edge = None
Adaptive Sample Trigger = None
DPWM B Rising Edge = Period/2 - Filter Duty/2 + Cycle Adjust A
DPWM B Falling Edge = Period/2 + Filter Duty/2 + Cycle Adjust B
Phase Trigger = Phase Trigger Register value or Filter Duty
Events always set by their registers, regardless of mode:
Sample Trigger 1, Sample Trigger 2, Blanking A Begin , Blanking A End , Blanking B
Begin, Blanking B End
All edges are dynamic in triangular mode, so fixed blanking is not that useful. The adaptive sample trigger
is not needed. It is very easy to put a fixed sample trigger exactly in the center of the FET on-time,
because the center of the on-time does not move in this mode.
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4.10 Leading Edge Mode
Leading edge mode is very similar to Normal mode, reversed in time. The DPWM A falling edge is fixed,
and the rising edge moves to the left, or backwards in time, as the filter output increases. The DPWM B
falling edge stays ahead of the DPWMA rising edge by a fixed dead time. Here is a diagram of the
Leading Edge Mode:
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Leading Edge Closed Loop
Start of Period
Start of Period
Period
Period Counter
DPWM Output A
Event 1
Filter Duty (High Resolution)
Cycle Adjust A (High Resolution)
Adaptive Sample Trigger A
Adaptive Sample Trigger B
Sample Trigger 1
To Other
Modules
Blanking A Begin
Blanking A End
DPWM Output B
Event 2 - Event 3 (High Resolution)
Event 4 (High Resolution)
Sample Trigger 2
Blanking B Begin
Blanking B End
To Other
Modules
Phase Trigger
Events which change with DPWM mode:
DPWM A Falling Edge = Event 1
DPWM A Rising Edge = Event 1 - Filter Duty + Cycle Adjust A
Adaptive Sample Trigger A = Event 1 - Filter Duty + Adaptive Sample Register or
Adaptive Sample Trigger B = Event 1 - Filter Duty/2 + Adaptive Sample Register
DPWM B Rising Edge = Event 4
DPWM B Falling Edge = Event 1 - Filter Duty + Cycle Adjust A -(Event 2 – Event 3)
Phase Trigger = Phase Trigger Register value or Filter Duty
Events always set by their registers, regardless of mode:
Sample Trigger 1, Sample Trigger 2, Blanking A Begin , Blanking A End , Blanking B
Begin, Blanking B End
As in the Normal mode, the two edges in the middle of the period are dynamic, so the fixed blanking
intervals are mainly useful for the edges at the beginning and end of the period.
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4.11 Sync FET Ramp and IDE Calculation
The UCD3138 has built in logic for controlling MOSFETs for synchronous rectification (Sync FETs). This
comes in two forms:
• Sync FET ramp
• Ideal Diode Emulation (IDE) calculation
When starting up a power supply, sometimes there is already a voltage on the output – this is called
prebias. It is very difficult to calculate the ideal Sync FET on-time for this case. If it is not calculated
correctly, it may pull down the pre-bias voltage, causing the power supply to sink current.
To avoid this, Sync FETs are not turned on until after the power supply has ramped up to the nominal
voltage. The Sync FETs are turned on gradually in order to avoid an output voltage glitch. The Sync FET
Ramp logic can be used to turn them on at a rate below the bandwidth of the filter.
In discontinuous mode, the ideal on-time for the Sync FETs is a function of Vin, Vout, and the primary side
duty cycle (D). The IDE logic in the UCD3138 takes Vin and Vout data from the firmware and combines it
with D data from the filter hardware. It uses this information to calculate the ideal on-time for the Sync
FETs.
4.12 Automatic Mode Switching
Automatic Mode switching enables the DPWM module to switch between modes automatically, with no
firmware intervention. This is useful to increase efficiency and power range. The following paragraphs
describe phase-shifted full bridge and LLC examples:
4.12.1 Phase Shifted Full Bridge Example
In phase shifted full bridge topologies, efficiency can be increased by using pulse width modulation, rather
than phase shift, at light load. This is shown below:
DPWM3A
(QB1)
DPWM3B
(QT1)
DPWM2A
(QT2)
DPWM2B
(QB2)
VTrans
DPWM1B
(QSYN1,3)
DPWM0B
(QSYN2,4)
IPRI
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L1
T1
Q7
+12V
Q6
VBUS
C1
I_pri
PRIM
CURRENT
RL
ORING
CTL
Q5
T2
VOUT
C2
D1
QT1
Lr
R2
QT2
VA
T1
QB1
Current
Sensing
QB2
D2
Vref
Vout
Duty for mode
switching
EADC0
CLA0
EADC1
CLA1
Load Current
I_pri
DPWM0B
AD02/CMP0
I_SHARE
Vout
AD 03/CMP1/CMP2
AD04/CMP3
Iout
AD05/CMP4
I_pri
AD06/CMP5
DPWM1B
DPWM2A
PCM
AD00
AD01
SYNCHRONOUS
GATE DRIVE
DPWM2B
DPWM3A
DPWM3B
ISOLATED
GATE Transformer
EADC2
temp
Primary
FAULT
CBC
AD07/CMP6
AD08
AD09
Vin
VA
DPWM0B
DPWM1
DPWM1B
DPWM2
DPWM2A
DPWM2B
DPWM3
DPWM3A
DPWM3B
FAULT 0
ACFAIL_IN
FAULT 1
ACFAIL_OUT
FAULT 2
FAILURE
CPCC
<
Iout
DPWM0
ORING_CRTL
GPIO2
ON/OFF
GPIO3
P_GOOD
WD
ARM7
PMBus
RST
OSC
UART 1
GPIO1
UART0
Memory
Figure 4-3. Secondary-Referenced Phase-Shifted Full Bridge Control
With Synchronous Rectification
4.12.2 LLC Example
In LLC, three modes are used. At the highest frequency, a pulse width modulated mode (Multi Mode) is
used. As the frequency decreases, resonant mode is used. As the frequency gets still lower, the
synchronous MOSFET drive changes so that the on-time is fixed and does not increase. In addition, the
LLC control supports cycle-by-cycle current limiting. This protection function operates by a comparator
monitoring the maximum current during the DPWMA conduction time. Any time this current exceeds the
programmable comparator reference the pulse is immediately terminated. Due to classic instability issues
associated with half-bridge topologies it is also possible to force DPWMB to match the truncated pulse
width of DPWMA. Here are the waveforms for the LLC:
Primary
Q1T
SynFET
PWM
Mode
QSR1
fs= fr_max
LLC Mode
fr
fs> fr
fs< fr
Q1B
Tr= 1/fr
Tr= 1/fr
QSR2
I SEC (t )
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VBUS
Q1T
ILR(t)
Transformer
LRES
QSR2
LK
NS
RLRES
Q1B
ILM(t)
LM
ISEC (t)
Driver
DPWM1B
Oring Circuitry
VOUT
NP
COUT1
NS
RF1
COUT2
AD03
EAP0
VBUS
ESR1
ESR2
RF2
QSR1
Rectifier and filter
CRES
VOUT(t)
CF
EAN0
AD04
RS
Driver
DPWM1A
CS
V CR(t)
CRES
RS1
RS2
Driver
DPWM0B
Driver
DPWM0A
ADC13
EAP1
Figure 4-4. Secondary-Referenced Half-Bridge Resonant LLC Control
With Synchronous Rectification
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4.12.3 Mechanism for Automatic Mode Switching
The UCD3138 allows the customer to enable up to two distinct levels of automatic mode switching. These
different modes are used to enhance light load operation, short circuit operation and soft start. Many of the
configuration parameters for the DPWM are in DPWM Control Register 1. For automatic mode switching,
some of these parameters are duplicated in the Auto Config Mid and Auto Config High registers.
If automatic mode switching is enabled, the filter duty signal is used to select which of these three
registers is used. There are 4 registers which are used to select the points at which the mode switching
takes place. They are used as shown below.
Automatic Mode Switching
With Hysteresis
Filter Duty
Full Range
Auto Config High
High – Upper Threshold
High – Lower Threshold
Auto Config Mid
Low – Upper Threshold
Low – Lower Threshold
Control
Register 1
0
As shown, the registers are used in pairs for hysteresis. The transition from Control Register 1 to Auto
Config Mid only takes place when the Filter Duty goes above the Low Upper threshold. It does not go
back to Auto Config Mid until the Low Lower Threshold is passed. This prevents oscillation between
modes if the filter duty is close to a mode switching point.
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4.13 DPWMC, Edge Generation, IntraMux
The UCD3138 has hardware for generating complex waveforms beyond the simple DPWMA and DPWMB
waveforms already discussed – DPWMC, the Edge Generation Module, and the IntraMux.
DPWMC is a signal inside the DPWM logic. It goes high at the Blanking A begin time, and low at the
Blanking A end time.
The Edge Gen module takes DPWMA and DPWMB from its own DPWM module, and the next one, and
uses them to generate edges for two outputs. For DPWM3, the DPWM0 is considered to be the next
DPWM. Each edge (rising and falling for DPWMA and DPWMB) has 8 options which can cause it.
The options are:
0 = DPWM(n) A Rising edge
1 = DPWM(n) A Falling edge
2 = DPWM(n) B Rising edge
3 = DPWM(n) B Falling edge
4 = DPWM(n+1) A Rising edge
5 = DPWM(n+1) A Falling edge
6 = DPWM(n+1) B Rising edge
7 = DPWM(n+1) B Falling edge
Where “n" is the numerical index of the DPWM module of interest. For example n=1 refers to DPWM1.
The Edge Gen is controlled by the DPWMEDGEGEN register. It also has an enable/disable bit.
The IntraMux is controlled by the Auto Config registers. Intra Mux is short for intra multiplexer. The
IntraMux takes signals from multiple DPWMs and from the Edge Gen and combines them logically to
generate DPWMA and DPWMB signals This is useful for topologies like phase-shifted full bridge,
especially when they are controlled with automatic mode switching. Of course, it can all be disabled, and
DPWMA and DPWMB will be driven as described in the sections above. If the Intra Mux is enabled, high
resolution must be disabled, and DPWM edge resolution goes down to 4 ns.
Here is a drawing of the Edge Gen/Intra Mux:
A/B/C (N)
A/B/C (N+1)
C (N+2)
C (N+3)
INTRAMUX
PWM A
PWM B
EDGE GEN
A(N)
B(N)
A(N+1)
B(N+1)
EGEN A
EGEN B
B SELECT
A SELECT
A ON SELECT
A OFF SELECT
B ON SELECT
B OFF SELECT
Here is a list of the IntraMux modes for DPWMA:
0
1
2
3
4
=
=
=
=
=
DPWMA(n) pass through (default)
Edge-gen output, DPWMA(n)
DPWNC(n)
DPWMB(n) (Crossover)
DPWMA(n+1)
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5 = DPWMB(n+1)
6 = DPWMC(n+1)
7 = DPWMC(n+2)
8 = DPWMC(n+3)
and for DPWMB:
0 = DPWMB(n) pass through (default)
1 = Edge-gen output, DPWMB(n)
2 = DPWNC(n)
3 = DPWMA(n) (Crossover)
4 = DPWMA(n+1)
5 = DPWMB(n+1)
6 = DPWMC(n+1)
7 = DPWMC(n+2)
8 = DPWMC(n+3)
The DPWM number wraps around just like the Edge Gen unit. For DPWM3 the following definitions apply:
DPWM(n)
DPWM3
DPWM(n+1)
DPWM0
DPWM(n+2)
DPWM1
DPWM(n+3)
DPWM2
4.14 Filter
The UCD3138 filter is a PID filter with many enhancements for power supply control. Some of its features
include:
• Traditional PID Architecture
• Programmable non-linear limits for automated modification of filter coefficients based on received
EADC error
• Multiple coefficient sets fully configurable by firmware
• Full 24-bit precision throughout filter calculations
• Programmable clamps on integrator branch and filter output
• Ability to load values into internal filter registers while system is running
• Ability to stall calculations on any of the individual filter branches
• Ability to turn off calculations on any of the individual filter branches
• Duty cycle, resonant period, or phase shift generation based on filter output.
• Flux balancing
• Voltage feed forward
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Here is the first section of the Filter :
Limit Comparator
Limit 6
Limit 5
…..
PID Filter Branch Stages
Limit 0
Kp Coef
Coefficient
select
EADC_DATA
<>
16
Xn
24
9
24
X
P
Xn-1 Reg
Ki Coef
9
9
Optional
Selected
by
KI_ADDER_
MODE
9
9
9
+
Ki High
24
16
24
24
+
X
24
Clamp
Ki_yn reg
24
24
I
24
Ki Low
Kd alpha
9
Kd coef
-
16
Xn–Xn+1
9
24
X
Kd yn_reg
32
Round
24
9
9
24
X
+
24
24
24
Clamp
D
The filter input, Xn, generally comes from a front end. Then there are three branches, P, I. and D. Note
that the D branch also has a pole, Kd Alpha. Clamps are provided both on the I branch and on the D
alpha pole.
The filter also supports a nonlinear mode, where up to 7 different sets of coefficients can be selected
depending on the magnitude of the error input Xn. This can be used to increase the filter gain for higher
errors to improve transient response.
Here is the output section of the filter (S0.23 means that there is 1 sign bit, 0 integer bits and 23 fractional
bits).:
24 P
24 I
24 D
Filter Yn
Clamp High
Yn Scale
+
26
S2.23
24
24
Saturate
Yn
S0.23
24
Shifter
S0.23
Clamp
Filter Yn
S0.23
Filter Yn
Clamp Low
All are S0.23
This section combines the P, I, and D sections, and provides for saturation, scaling, and clamping.
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There is a final section for the filter, which permits its output to be matched to the DPWM:
Filter YN
S0.23
24
KCompx
14.0
DPWMx Period 14.0
X
38
S14.23
Round to
18 bits,
Clamp to
Positive
18
14.4
Truncate
low 4 bits
14 Filter Period
Bits [17:4] 14.0
14
14.0
PERIOD_MULT_SEL
Filter Output
Clamp High
Filter YN (Duty %)
S0.23
24
KCompx
X
38
S14.23
Round to
18 bits,
Clamp to
Positive
18
Clamp
14.4
18 Filter Duty
14.4
14.0
DPWMx Period 14.0
Loop_VFF 14.0
14
Filter Output
Clamp Low
14.0
Resonant Duty 14.0
OUTPUT_MULT_SEL
This permits the filter output to be multiplied by a variety of correction factors to match the DPWM Period,
to provide for Voltage Feed Forward, or for other purposes. After this, there is another clamp. For resonant
mode, the filter can be used to generate both period and duty cycle.
4.14.1 Loop Multiplexer
The Loop Mux controls interconnections between the filters, front ends, and DPWMs. Any filter, front end,
and DPWM can be combined with each other in many configurations.
It
•
•
•
•
•
also controls the following connections:
DPWM to Front End
Front End DAC control from Filters or Constant Current/Constant Power Module
Filter Special Coefficients and Feed Forward
DPWM synchronization
Filter to DPWM
The following control modules are configured in the Loop Mux:
• Constant Power/Constant Current
• Cycle Adjustment (Current and flux balancing)
• Global Period
• Light Load (Burst Mode)
• Analog Peak Current Mode
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4.14.2 Fault Multiplexer
In order to allow a flexible way of mapping several fault triggering sources to all the DPWMs channels, the
UCD3138 provides an extensive array of multiplexers that are united under the name Fault Mux module.
The Fault Mux Module supports the following types of mapping between all the sources of fault and all
different fault response mechanism inside each DPWM module.
• Many fault sources mapped to a single fault response mechanism. For instance an analog comparator
in charge of over voltage protection, a digital comparator in charge of over current protection and an
external digital fault pin can be all mapped to a fault-A signal connected to a single FAULT MODULE
and shut down DPWM1-A.
• A single fault source can be mapped to many fault response mechanisms inside many DPWM
modules. For instance an analog comparator in charge of over current protection can be mapped to
DPWM-0 through DPWM-3 by way of several fault modules.
• Many fault sources can be mapped to many fault modules inside many DPWM modules.
FAULT MUX
CBC_PWM _AB_EN
DPWM
Bit 20 in DPWMCTRL0
CYCLE BY CYCLE
ANALOG PCM
FAULT - CBC
FAULT MODULE
AB FLAG
DISABLE PWM A AND B
CBC_FAULT_EN
Bit30 in DPWMFLTCTRL
FAULT - AB
FAULT MODULE
AB FLAG
DISABLE PWM A AND B
DCOMP – 4X
EXT GPIO– 4X
ACOMP – 7X
FAULT -A
FAULT -B
FAULT MODULE
FAULT MODULE
A FLAG
DISABLE PWM A ONLY
B FLAG
DISABLE PWM B ONLY
ALL_FAULT_EN
DPWM _EN
Bit 31 in DPWMFLTCTRL
Bit 0 in DPWMCTRL0
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The Fault Mux Module provides a multitude of fault protection functions within the UCD3138 high-speed
loop (Front End Control, Filter, DPWM and Loop Mux modules). The Fault Mux Module allows highly
configurable fault generation based on digital comparators, high-speed analog comparators and external
fault pins. Each of the fault inputs to the DPWM modules can be configured to one or any combination of
the fault events provided in the Fault Mux Module.
Each one of the DPWM engines has four fault modules. The modules are called CBC fault module, AB
fault module, A fault module and B fault module.
The internal circuitry in all the four fault modules is identical, and the difference between the modules is
limited to the way the modules are attached to the DPWMs.
FAULT FLAG
FAULT IN
DPWM EN
FAULT EN
MAX COUNT
FAULT MODULE
All fault modules provide immediate fault detection but only once per DPWM switching cycle. Each one of
the fault modules own a separate max_count and the fault flag will be set only if sequential cycle-by-cycle
faults count exceeds max_count.
Once the fault flag is set DPWMs need to be disabled by DPWM_EN going low in order to clear the fault
flags. Please note, all four Fault Modules share the same DPWM_EN control, all fault flags (output of Fault
Modules) will be cleared simultaneously.
All four Fault Modules share the same global FAULT_EN as well. Therefore a specific Fault Module
cannot be enabled/ disabled separately.
FAULT - CBC
CYCLE BY CYCLE
CLIM
Unlike Fault Modules, only one Cycle by Cycle block is available in each DPWM module.
The Cycle by Cycle block works in conjunction with CBC Fault Module and enables DPWM reaction to
signals arriving from Analog Peak current mode (PCM) module.
The Fault Mux Module supports the following basic functions:
• 4 digital comparators with programmable thresholds and fault generation
• Configuration for 7 high speed analog comparators with programmable thresholds and fault generation
• External GPIO detection control with programmable fault generation
• Configurable DPWM fault generation for DPWM Current Limit Fault, DPWM Over-Voltage Detection
Fault, DPWM A External Fault, DPWM B External Fault and DPWM IDE Flag
• Clock Failure Detection for High and Low Frequency Oscillator blocks
• Discontinuous Conduction Mode Detection
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HFO/LFO
Fail Detect
DCM Detection
Digital Comparator 0
Control
Front End
Control 0
Digital Comparator 1
Control
Front End
Control 1
Digital Comparator 2
Control
Front End
Control 2
Digital Comparator 3
Control
fault[2:0]
External GPIO
Detection
DPWM 0
Fault Control
DPWM 1
Fault Control
DPWM 2
Fault Control
DPWM 3
Fault Control
DPWM 0
DPWM 1
DPWM 2
DPWM 3
Analog Comparator 0
Control
Analog
Comparator 0
Analog Comparator 1
Control
Analog
Comparator 1
Analog Comparator 2
Control
Analog
Comparator 2
Analog Comparator 3
Control
Analog
Comparator 3
Analog Comparator 4
Control
Analog
Comparator 4
Analog Comparator 5
Control
Analog
Comparator 5
Analog Comparator 6
Control
Analog
Comparator 6
Analog Comparator
Automated Ramp
Figure 4-5. Fault Mux Block Diagram
4.15 Communication Ports
4.15.1 SCI (UART) Serial Communication Interface
A maximum of two independent Serial Communication Interface (SCI) or Universal Asynchronous
Receiver/Transmitter pre-scaler (UART) interfaces are included within the device for asynchronous startstop serial data communication (see the pin out sections for details) Each interface has a 24 bit for
supporting programmable baud rates and has programmable data word and stop bit options. Half or full
duplex operation is configurable through register bits. A loop back feature can also be setup for firmware
verification. Both SCI-TX and SCI-RX pin sets can be used as GPIO pins when the peripheral is not being
used.
4.15.2 PMBUS
The PMBus Interface supports independent master and slave modes controlled directly by firmware
through a processor bus interface. Individual control and status registers enable firmware to send or
receive I2C, SMBus or PMBus messages in any of the accepted protocols, in accordance with the I2C
Specification, SMBus Specification (Version 2.0) and the PMBUS Power System Management Protocol
Specification.
The PMBus interface is controlled through a processor bus interface, utilizing a 32-bit data bus and 6-bit
address bus. The PMBus interface is connected to the expansion bus, which features 4 byte write
enables, a peripheral select dedicated for the PMBus interface, separated 32-bit data buses for reading
and writing of data and active-low write and output enable control signals. In addition, the PMBus Interface
connects directly to the I2C/SMBus/PMBus Clock, Data, Alert, and Control signals.
Example: PMBus Address Decode via ADC12 Reading
The user can allocate 2 pins of the 12-bit ADC input channels, AD_00 and AD_01, for PMBus address
decoding. At power-up the device applies IBIAS to each address detect pin and the voltage on that pin is
captured by the internal 12-bit ADC.
Where bin(VAD0x) is the address bin for one of 12 address as shown in Figure 4-6.
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Vdd
AD00,
AD01
pin
I BIAS
On/Off Control
Resistor to
set PMBus
Address
To ADC Mux
Figure 4-6. PMBus Address Detection Method
4.15.3 General Purpose ADC12
The ADC12 is a 12 bit, high speed analog to digital converter, equipped with the following options:
• Typical conversion speed of 267 ksps
• Conversions can consist from 1 to 16 ADC channel conversions in any desired sequence
• Post conversion averaging capability, ranging from 4X, 8X, 16X or 32X samples
• Configurable triggering for ADC conversions from the following sources: firmware, DPWM rising edge,
ADC_EXT_TRIG pin or Analog Comparator results
• Interrupt capability to embedded processor at completion of ADC conversion
• Six digital comparators on the first 6 channels of the conversion sequence using either raw ADC data
or averaged ADC data
• Two 10 µA current sources for excitation of PMBus addressing resistors
• Dual sample and hold for accurate power measurement
• Internal temperature sensor for temperature protection and monitoring
The control module ( ADC12 Contol Block Diagram) contains the control and conversion logic for autosequencing a series of conversions. The sequencing is fully configurable for any combination of 16
possible ADC channels through an analog multiplexer embedded in the ADC12 block. Once converted,
the selected channel value is stored in the result register associated with the sequence number. Input
channels can be sampled in any desired order or programmed to repeat conversions on the same channel
multiple times during a conversion sequence. Selected channel conversions are also stored in the result
registers in order of conversion, where the result 0 register is the first conversion of a 16-channel
sequence and result 15 register is the last conversion of a 16-channel sequence. The number of channels
converted in a sequence can vary from 1 to 16.
Unlike EADC0 through EADC2, which are primarily designed for closing high speed compensation loops,
the ADC12 is not usually used for loop compensation purposes. The EADC converters have a
substantially faster conversion rate, thus making them more attractive for closed loop control. The ADC12
features make it best suited for monitoring and detection of currents, voltages, temperatures and faults.
Please see the Typical Characteristics plots for the temperature variation associated with this function.
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ADC12 Block
ADC12 Registers
ADC
Averaging
S/H
ADC
Channels
12-bit SAR
ADC
ADC12
Control
Digital
Comparators
ADC Channel
ADC External Trigger (from pin)
DPWM
Modules
Analog
Comparators
Figure 4-7. ADC12 Control Block Diagram
4.15.4 Timers
External to the Digital Power Peripherals there are 3 different types of timers in UCD3138. They are the
24-bit timer, 16-bit timer and the Watchdog timer
4.15.4.1 24-bit PWM Timer
There is one 24 bit counter PWM timer which runs off the Interface Clock and can further be divided down
by an 8-bit pre-scalar to generate a slower PWM time period. The timer has two compare registers (Data
Registers) for generating the PWM set/unset events. Additionally, the timer has a shadow register (Data
Buffer register) which can be used to store CPU updates of the compare events while still using the timer.
The selected shadow register update mode happens after the compare event matches.
The two capture pins TCMP0 and TCMP1 are inputs for recording a capture event. A capture event can
be set either to rising, falling, or both edges of the capture pin. Upon this event, the counter value is stored
in the corresponding capture data register.
The counter reset can be configured to happen on a counter roll over, a compare equal event, or by
software controlled register. Five Interrupts from the PWM timer can be set, which are the counter rollover
event (overflow), either capture event 0 or 1, or the two comparison match events. Each interrupt can be
disabled or enabled.
Upon an event comparison on only the second event, the TCMP pin can be configured to set, clear, toggle
or have no action at the output. The value of PWM pin output can be read for status or simply configured
as general purpose I/O for reading the value of the input at the pin. The first compare event can only be
used as an interrupt.
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4.15.4.2 16-Bit PWM Timers
There are four 16 bit counter PWM timers which run off the Interface Clock and can further be divided
down by a 8-bit pre-scaler to generate slower PWM time periods. Each timer has two compare registers
(Data Registers) for generating the PWM set/unset events. Additionally, each timer has a shadow register
(Data Buffer register) which can be used to store CPU updates of compare events while still using the
timer. The selected shadow register update mode happens after the compare event matches.
The counter reset can be configured to happen on a counter roll over, a compare equal event, or by a
software controlled register. Interrupts from the PWM timer can be set due to the counter rollover event
(overflow) or by the two comparison match events. Each comparison match and the overflow interrupts
can be disabled or enabled.
Upon an event comparison, the PWM pin can be configured to set, clear, toggle or have no action at the
output. The value of PWM pin output can be read for status or simply configured as General Purpose I/O
for reading the value of the input at the pin.
4.15.4.3 Watchdog Timer
A watchdog timer is provided on the device for ensuring proper firmware loop execution. The timer is
clocked off of a separate low speed oscillator source. If the timer is allowed to expire, a reset condition is
issued to the ARM processor. The watchdog is reset by a simple CPU write bit to the watchdog key
register by the firmware routine. On device power-up the watchdog is disabled. Yet after it is enabled, the
watchdog cannot be disabled by firmware. Only a device reset can put this bit back to the default disabled
state. A half timer flag is also provided for status monitoring of the watchdog.
4.16 Miscellaneous Analog
The Miscellaneous Analog Control (MAC) Registers are a catch-all of registers that control and monitor a
wide variety of functions. These functions include device supervisory features such as Brown-Out and
power saving configuration, general purpose input/output configuration and interfacing, internal
temperature sensor control and current sharing control.
The MAC module also provides trim signals to the oscillator and AFE blocks. These controls are usually
used at the time of trimming at manufacturing; therefore this document will not cover these trim controls.
The MAC registers and peripherals are all available in the UCD3138 (64 pin version). Other UCD3138
devices may have reduced resources. See the device pin out description for details.
4.17 Package ID Information
Package ID register includes information regarding the package type of the device and can be read by
firmware for reporting through PMBus or for other package sensitive decisions.
BIT NUMBER
Bit Name
1:0
PKG_ID
Access
R/W
Default
0 – UCD3138RGC,
1 – UCD3138RHA
4.18 Brownout
Brownout function is used to determine if the device supply voltage is lower than a threshold voltage, a
condition that may be considered unsafe for proper operation of the device.
The brownout threshold is higher than the reset threshold voltage; therefore, when the supply voltage is
lower than brownout threshold, it still does not necessarily trigger a device reset.
The brownout interrupt flag can be polled or alternatively can trigger an interrupt to service such case by
an interrupt service routine. Please see the Power On Reset (POR) / Brown Out Reset (BOR) section.
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4.19 Global I/O
Up to 30 pins in UCD3138 can be configured to serve as a general purpose input or output pin (GPIO).
This includes all digital input or output pins except for the RESET pin.
The pins that cannot be configured as GPIO pins are the supply pins, ground pins, ADC-12 analog input
pins, EADC analog input pins and the RESET pin.
There are two ways to configure and use the digital pins as GPIO pins:
1. Through the centralized Global I/O control registers.
2. Through the distributed control registers in the specific peripheral that shares it pins with the standard
GPIO functionality.
The Global I/O registers offer full control of:
1. Configuring each pin as a GPIO.
2. Setting each pin as input or output.
3. Reading the pin’s logic state, if it is configured as an input pin.
4. Setting the logic state of the pin, if it is configured as an output pin.
5. Configuring pin/pins as open drain or push-pull (Normal)
The Global I/O registers include Global I/O EN register, Global I/O OE Register, Global I/O Open Drain
Control Register, Global I/O Value Register and Global I/O Read Register.
The following is showing the format of Global I/O EN Register (GLBIOEN) as an example:
BIT NUMBER
29:0
Bit Name
GLOBAL_IO_EN
Access
R/W
Default
00_0000_0000_0000_0000_0000_0000_0000
Bits 29-0: GLOBAL_IO_EN – This register enables the global control of digital I/O pins
0 = Control of IO is done by the functional block assigned to the IO (Default)
1 = Control of IO is done by Global IO registers.
BIT
PIN_NAME
29
PIN NUMBER
UCD3138-64 PIN
UCD3138-40 PIN
FAULT[3]
43
NA
28
ADC_EXT_TRIG
12, 26
8
27
TCK
37
21
26
TDO
38
20
25
TMS
40
24
24
TDI
39
23
23
SCI_TX[1]
29
NA
22
SCI_TX[0]
14
22
21
SCI_RX[1]
30
NA
20
SCI_RX[0]
13
23
19
TMR_CAP
12, 26, 41
8, 21
18
TMR_PWM[1]
32
NA
17
TMR_PWM[0]
12, 26, 31, 37
21
16
PMBUS-CLK
15
9
15
PMBUS-DATA
16
10
14
CONTROL
30
20
13
ALERT
29
19
12
EXT_INT
26, 34
NA
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BIT
PIN_NAME
11
10
PIN NUMBER
UCD3138-64 PIN
UCD3138-40 PIN
FAULT[2]
42
25
FAULT[1]
36
23
9
FAULT[0]
35, 39
22
8
SYNC
12, 26,37
8, 21
7
DPWM3B
24
18
6
DPWM3A
23
17
5
DPWM2B
22
16
4
DPWM2A
21
15
3
DPWM1B
20
14
2
DPWM1A
19
13
1
DPWM0B
18
12
0
DPWM0A
17
11
4.20 Temperature Sensor Control
Temperature sensor control register provides internal temperature sensor enabling and trimming
capabilities. The internal temperature sensor is disabled as default.
Temp Cal
Temperature
Sensor
ADC 12
Ch14
Figure 4-8. Internal Temp Sensor
Temperature sensor is calibrated at room temperature (25 °C) via a calibration register value.
The temperature sensor is measured using ADC12 (via Ch14). The temperature is then calculated using a
mathematical formula involving the calibration register (this effectively adds a delta to the ADC
measurement).
The temperature sensor can be enabled or disabled.
4.21 I/O Mux Control
In different packages of UCD3138 several I/O functions are multiplexed and routed toward a single
physical pin. I/O Mux Control register may be used in order to choose a single specific functionality that is
desired to be assigned to a physical device pin for your application.
4.22 Current Sharing Control
UCD3138 provides three separate modes of current sharing operation.
• Analog bus current sharing
• PWM bus current sharing
• Master/Slave current sharing
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AD02 has a special ESD protection mechanism that prevents the pin from pulling down the currentshare bus if power is missing from the UCD3138
The simplified current sharing circuitry is shown in the drawing below:
3.3 V
ISHARE
SW3
Digital
3.3 V
3.3V
ESD
3. 2 kΩ
400 Ω
250 Ω
AD02
AD13
SW2
ESD
SW1
ESD
250 Ω
EXT CAP
R SHARE
ADC12 and
CMP
ADC12 and
CMP
Figure 4-9. Simplified Current Sharing Circuitry
FOR TEST ONLY,
ALWAYS KEEP 00
CS_MODE
EN_SW1
EN_SW2
Off or Slave Mode (3-state)
00
00 (default)
0
0
0
PWM Bus
00
01
1
0
ACTIVE
Off or Slave Mode (3-state)
00
10
0
0
0
Analog Bus or Master
00
11
0
1
0
CURRENT SHARING MODE
DPWM
The period and the duty of 8-bit PWM current source and the state of the SW1 and SW2 switches can be
controlled through the current sharing control register (CSCTRL).
4.23 Temperature Reference
The temperature reference register (TEMPREF) provides the ADC12 count when ADC12 measures the
internal temperature sensor (channel 14) during the factory trim and calibration.
This information can be used by different periodic temperature compensation routines implemented in the
firmware. But it should not be overwritten by firmware, otherwise this factory written value will be lost.
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IC Grounding and Layout Recommendations
•
•
•
Two grounds are recommended: AGND (analog) and DGND (digital).
– AGND plane should be on a different layer than DGND, and right under the UCD3138 device.
– UCD3138 power pad should be tied to AGND plane by at least 4 vias
– AGND plane should be just large enough to connect to all required components.
– Power ground (PGND) can be independent or combined with DGND
– The power pad of the driver IC should be tied to DGND
Both 3.3VD and 3.3VA should have a local 4.7µF capacitor placed as close as possible to the device
pins
BPCAP decoupling (2.2 µF typically) MUST be connected to DGND
V33D
2 .2 μF
BP18
1 .0 μF
DGND
•
•
•
•
•
•
•
58
All analog signal filter capacitors should be tied to AGND
– If the gate driver device, such as UCD27524 or UCD27511/7 driver is used, the filter capacitor for
the current sensing pin can be tied to DGND for easy layout
All digital signals, such as GPIO, PMBus and PWM are referenced to DGND.
The RESET pin capacitor (0.1µF) should be connected to either DGND or AGND locally. A 10kΩ pullup resistor to 3.3V is recommended.
All filter and decoupling capacitors should be placed close to UCD3138 as possible
– Resistor placement is less critical and can be moved a little further away
The DGND and AGND net-short resistor MUST be placed right between one UCD3138’s DGND pin
and one AGND pin. Ground connections to the net short element should be made by a large via (or
multiple paralleled vias) for each terminal of the net-short element.
If a gate driver device such as UCC27524 or UCC27511/7 is on the control card and there is a PGND
connection, a net-short resistor should be tied to the DGND plane and PGND plane by multiple vias. In
addition the net-short element should be close to the driver IC.
Configure all unused GPIO as inputs and connect them to ground.
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Tools and Documentation
The application firmware for UCD3138 is developed on Texas Instruments Code Composer Studio (CCS)
integrated development environment (v3.3 recommended).
Device programming, real time debug and monitoring/configuration of key device parameters for certain
power topologies are all available through Texas Instruments’ FUSION_DIGITAL_POWER_DESIGNER
Graphical User Interface (http://www.ti.com/tool/fusion_digital_power_designer).
The FUSION_DIGITAL_POWER_DESIGNER software application uses the PMBus protocol to
communicate with the device over a serial bus using an interface adaptor known as the USB-TO-GPIO,
available as an EVM from Texas Instruments (http://www.ti.com/tool/usb-to-gpio). PMBUS-based real-time
debug capability is available through the ‘Memory Debugger’ tool within the Device GUI module of the
FUSION_DIGITAL_POWER_DESIGNER GUI, which represents a powerful alternative over traditional
JTAG-based approaches.
The software application can also be used to program the devices, with a version of the tool known as
FUSION_MFR_GUI optimized for manufacturing environments (http://www.ti.com/tool/fusion_mfr_gui).
The FUSION_MFR_GUI tool supports multiple devices on a board, and includes built-in logging and
reporting capabilities.
In terms of reference documentation, the following 3 programmer’s manuals are available offering detailed
information regarding the application and usage of UCD3138 digital controller:
1. UCD3138 Digital Power Peripheral Programmer's Manual Key topics covered in this manual include:
– Digital Pulse Width Modulator (DPWM)
– Modes of Operation (Normal/Multi/Phase-shift/Resonant etc)
– Automatic Mode Switching
– DPWMC, Edge Generation & Intra-Mux
– Front End
– Analog Front End
– Error ADC or EADC
– Front End DAC
– Ramp Module
– Successive Approximation Register Module
– Filter
– Filter Math
– Loop Mux
– Analog Peak Current Mode
– Constant Current/Constant Power (CCCP)
– Automatic Cycle Adjustment
– Fault Mux
– Analog Comparators
– Digital Comparators
– Fault Pin functions
– DPWM Fault Action
– Ideal Diode Emulation (IDE), DCM Detection
– Oscillator Failure Detection
– Register Map for all of the above peripherals in UCD3138
2. UCD3138 Monitoring and Communications Programmer’s Manual
Key topics covered in this manual include:
– ADC12
– Control, Conversion, Sequencing & Averaging
– Digital Comparators
– Temperature Sensor
– PMBUS Addressing
– Dual Sample & Hold
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– Miscellaneous Analog Controls (Current Sharing, Brown-Out, Clock-Gating)
– PMBUS Interface
– General Purpose Input Output (GPIO)
– Timer Modules
– PMBus
– Register Map for all of the above peripherals in UCD3138
3. UCD3138 ARM and Digital System Programmer’s Manual
Key topics covered in this manual include:
– Boot ROM & Boot Flash
– BootROM Function
– Memory Read/Write Functions
– Checksum Functions
– Flash Functions
– Avoiding Program Flash Lock-Up
– ARM7 Architecture
– Modes of Operation
– Hardware/Software Interrupts
– Instruction Set
– Dual State Inter-working (Thumb 16-bit Mode/ARM 32-bit Mode)
– Memory & System Module
– Address Decoder, DEC (Memory Mapping)
– Memory Controller (MMC)
– Central Interrupt Module
– Register Map for all of the above peripherals in UCD3138
4. FUSION_DIGITAL_POWER_DESIGNER for Isolated Power Applications
– User guide for Designer GUI
– User guide for Device GUI
– Firmware Memory Debugger
– Manufacturing Tool (MFR GUI)
In addition to the tools and documentation described above, for the most up to date information regarding
evaluation modules, reference application firmware and application notes/design tips, please visit
http://www.ti.com/product/ucd3138.
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References
1.
2.
3.
4.
5.
6.
7.
8.
(1)
SLUSAP2F – MARCH 2012 – REVISED NOVEMBER 2013
UCD3138 Digital Power Peripherals Programmer’s Manual (Literature Number:SLUU995)
UCD3138 Monitoring & Communications Programmer’s Manual (Literature Number:SLUU996)
UCD3138 ARM and Digital System Programmer’s Manual (Literature Number:SLUU994)
FUSION_DIGITAL_POWER_DESIGNER for Isolated Power Applications (Literature Number:
SLUA676
Code Composer Studio Development Tools v3.3 – Getting Started Guide, (Literature Number:
SPRU509H)
ARM7TDMI-S Technical Reference Manual
System Management Bus (SMBus) Specification
PMBusTM Power System Management Prototcol Specification (1)
PMBus is a trademark of SMIF, Inc.
References
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (March 2012) to Revision A
•
Added Production Data statement to footnote and removed "Product Preview" banner
Changes from Revision A (March 2012) to Revision B
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
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62
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6
Page
Added Feature bullets ............................................................................................................... 6
Changed "Dual Edge Modulation" to "Triangular Modulation" in Features section ......................................... 6
Changed "265 ksps" to "267 ksps" in Features section ......................................................................... 6
Clarified number of UARTs in Feature section ................................................................................... 6
Changed "FDPP" to "DDP" throughout. ........................................................................................... 7
Changed Total GPIO pin count for the UCD3138 40-pin device from "17" to "18" in the Product Selection Matrix
table. ................................................................................................................................... 8
Changed "VREG" to "BP18" in conditions statement for Electrical Characteristics table. ................................ 16
Changed EAP – EAN Error voltage digital resolution MIN values for AFE=3, AFE=2, AFE=1, AFE=0 from 0.95,
1.90, 3.72, and 7.3 respectively; to, 0.8, 1.7, 3.55, and 6.90 respectively. ................................................. 16
Changed "VREG" to "BP18" in conditions statement for Electrical Characteristics table. ................................ 17
Changed conditions for VOL and VOH specs in the Electrical Characteristics table ........................................ 17
Added TWD spec to Electrical Characteristics table ........................................................................... 17
Changed "VREG" to "BP18" in conditions statement for Electrical Characteristics table. ................................ 18
Changed "PWM" to "DPWM" in DPWM Module. ............................................................................... 29
Changed "PWMA" and "PWMB" to "DPWMA" and "DPWMB" in . .......................................................... 34
Changed waveforms graphic for "Phase Shifted Full Bridge Example" for clarification ................................... 41
Added text to section LLC Example .............................................................................................. 42
Changed typical conversion speed from "268 ksps" to "267 ksps" in the General Purpose ADC12 section. .......... 52
Added package ID information for the UCD3138RGC and UCD3138RHA devices. ...................................... 54
Added bullet "AD02 has a special ESD protection mechanism that prevents the pin from pulling down the
current-share bus if power is missing from the UCD3138" to Current Sharing Control. .................................. 56
Added sub-bullet "The power pad of the driver IC should be tied to DGND" and changed capacitor value from
"0.1 µF" to "4.7 µF" in IC Grounding and Layout Recommendations ....................................................... 58
Added "Tools and Documentation" section ..................................................................................... 59
Changed " Mechanical Data" section to "References" section ............................................................... 61
Changes from Revision B (July 2012) to Revision C
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Page
Page
Deleted "JTAG Debug Port" feature bullet ........................................................................................ 6
Deleted text string "JTAG debug" from Description section. ................................................................... 7
Deleted "JTAG" option from Product Selection Matrix. ......................................................................... 8
Added NOTE under Functional Block Diagram .................................................................................. 9
Added text to Pin 54 description .................................................................................................. 11
Added text to Pin 35 description .................................................................................................. 14
Added BP18 spec to Abs Max Ratings and Recommended Operating Conditions Tables .............................. 15
Deleted VDD spec from System Performance section of Electrical Characteristics table ................................. 17
Added footnote to Table 3-1 ...................................................................................................... 19
Deleted text string reference to "JTAG port" in ARM Processor section .................................................... 23
Added text string regarding front-end 2 in the Front End section ............................................................ 28
Changed illustration in IC Grounding and Layout Recommendations section ............................................. 58
Changed text strings in Tools and Documentation section ................................................................... 59
Added document to References list .............................................................................................. 61
References
Copyright © 2012–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: UCD3138
UCD3138
www.ti.com
SLUSAP2F – MARCH 2012 – REVISED NOVEMBER 2013
Changes from Revision C (March 2013) to Revision D
•
•
Page
Changed TOPT spec to TJ in Abs Max table with MAX temp of 150°C ....................................................... 15
Added BP18 Voltage vs Temperature graphic ................................................................................. 22
Changes from Revision D (August 2013) to Revision E
•
•
•
•
•
Page
Added UCD3138RMH to Feature bullet .......................................................................................... 6
Added RMH package option to Ordering Info table ............................................................................. 8
Added RMH package pinout drawiing ........................................................................................... 13
Added RMH package thermal specs. ............................................................................................ 15
Changed Global I/O registers ordered list, item 5 text from "Connecting pin/pins to high rail through internal pull
up resistors." to "Configuring pin/pins as open drain or push-pull (Normal)" ............................................... 55
Changes from Revision E (August 2013) to Revision F
•
Changed Top Side Marking info from "3138" to "3138RMH" in the Ordering Information table.
Page
..........................
References
Copyright © 2012–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: UCD3138
8
63
PACKAGE OPTION ADDENDUM
www.ti.com
22-Dec-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
UCD3138RGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
UCD3138
UCD3138RGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
UCD3138
UCD3138RHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
UCD3138
UCD3138RHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
UCD3138
UCD3138RMHR
ACTIVE
WQFN
RMH
40
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
3138RMH
UCD3138RMHT
ACTIVE
WQFN
RMH
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
3138RMH
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
22-Dec-2014
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Feb-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
UCD3138RGCR
VQFN
RGC
64
UCD3138RGCT
VQFN
RGC
UCD3138RHAR
VQFN
RHA
UCD3138RHAT
VQFN
UCD3138RMHR
UCD3138RMHT
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2000
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
64
250
180.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
40
2500
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
RHA
40
250
180.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
WQFN
RMH
40
2000
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
WQFN
RMH
40
250
180.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Feb-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UCD3138RGCR
VQFN
RGC
64
2000
367.0
367.0
38.0
UCD3138RGCT
VQFN
RGC
64
250
210.0
185.0
35.0
UCD3138RHAR
VQFN
RHA
40
2500
367.0
367.0
38.0
UCD3138RHAT
VQFN
RHA
40
250
210.0
185.0
35.0
UCD3138RMHR
WQFN
RMH
40
2000
367.0
367.0
38.0
UCD3138RMHT
WQFN
RMH
40
250
210.0
185.0
35.0
Pack Materials-Page 2
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