MAX1692

MAX1692
MAX1692EUB
Rev. A
RELIABILITY REPORT
FOR
MAX1692EUB
PLASTIC ENCAPSULATED DEVICES
February 14, 2003
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX1692 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Ma nufacturing Information
III. .......Packaging Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX1692 is a low-noise, pulse-width-modulated (PWM), DC-DC step-down converter. It powers logic and
transmitters in small wireless systems such as cellular phones, communicating PDAs, and handy-terminals. The
device features an internal synchronous rectifier for high efficiency; it requires no external Schottky diode. Excellent
noise characteristics and fixed-frequency operation provide easy post-filtering. The MAX1692 is ideally suited for LiIon battery applications. It is also useful for +3V or +5V fixed input applications.
The device operates in one of four modes. Forced PWM mode operates at a fixed frequency regardless of the load.
Synchronizable PWM mode allows an external switching frequency to control and minimize harmonics. Idle Mode™
(PWM/PFM) extends battery life by switching to a PFM pulse-skipping mode during light loads. Shutdown mode
places the device in standby, reducing quiescent supply current to under 0.1µA.
The MAX1692 can deliver over 600mA. The output voltage can be adjusted from 1.25V to VIN with the input range of
+2.7V to +5.5V. Other features of the MAX1692 include high efficiency, low dropout voltage, and a 1.2%-accurate
1.25V reference. It is available in a space-saving 10-pin µMAX package with a height of only 1.11mm.
The MAX6021 precision, low-dropout, micropower voltage reference is available in miniature SOT23-3 surface-mount
package. It features a proprietary curvature-correction circuit and laser-trimmed thin-film resistors that result in a low
temperature coefficient of <15ppm/°C and initial accuracy of better than 0.2%. This device is specified over the
extended temperature range.
B. Absolute Maximum Ratings
Item
IN, BP, SHDN, SYNC/PWM, LIM to GND
BP to IN
PGND to GND
LX to PGND
FB, REF to GND
Reference Current
LX Peak Current (internally limited)
Continuous Power Dissipation (TA = +70°C)
10-Pin µMAX (derate 5.6mW/°C above +70°C)
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Lead Temperature (soldering, 10sec)
Continuous Power Dissipation (TA = +70°C)
10-Pin uMAX
Derates above +70°C
10-Pin uMAX
Rating
-0.3V to +6V
-0.3V to +0.3V
-0.3V to +0.3V
-0.3V to (VIN + 0.3V)
-0.3V to (VBP + 0.3V)
±1mA
1.6A
444mW
-40°C to +85°C
+150°C
-65°C to +160°C
+300°C
444mW
5.6mW/°C
II. Manufacturing Information
A. Description/Function:
Low-Noise, 5.5V-Input, PWM Step-Down Regulator
B. Process:
S12 (Standard 1.2 micron silicon gate CMOS)
C. Number of Device Transistors:
1462
D. Fabrication Location:
Oregon, USA
E. Assembly Location:
Malaysia, Thailand or Philippines
F. Date of Initial Production:
July, 1998
III. Packaging Information
A. Package Type:
10-Pin uMAX
B. Lead Frame:
Copper
C. Lead Finish:
Solder Plate
D. Die Attach:
Silver-filled Epoxy
E. Bondwire:
Gold (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
# 05- 1101-0094
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112:
Level 1
IV. Die Information
A. Dimensions:
87 x 61mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
1.2 microns (as drawn)
F. Minimum Metal Spacing:
1.2 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts:
B. Outgoing Inspection Level:
Jim Pedicord (Reliability Lab Manager)
Bryan Preeshl (Executive Director)
Kenneth Huening (Vice President)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°Cbiased (static) life test are shown in Table 1. Using these results, the Failure
Rate (λ) is calculated as follows:
λ=
1
=
MTTF
1.83
192 x 4389 x 80 x 2
(Chi square value for MTTF upper limit)
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ = 13.57 x 10-9
λ = 13.57 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-5349) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The PX41 die type has been found to have all pins able to withstand a transient pulse of ±2000V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.
Table 1
Reliability Evaluation Test Results
MAX1692EUB
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
PACKAGE
DC Parameters
& functionality
SAMPLE
SIZE
NUMBER OF
FAILURES
80
0
77
0
0
Moisture Testing (Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
DC Parameters
& functionality
uMAX
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
77
DC Parameters
& functionality
77
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
0
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
Terminal A
(Each pin individually
connected to terminal A
with the other floating)
Terminal B
(The common combination
of all like-named pins
connected to terminal B)
1.
All pins except VPS1 3/
All VPS1 pins
2.
All input and output pins
All other input-output pins
1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).
3.4
Pin combinations to be tested.
a.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected
to terminal B. All pins except the one being tested and the ground pin(s) shall be open.
b.
Each pin individually connected to terminal A with respect to each different set of a combination
of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1 , or VCC2 ) connected to
terminal B. All pins except the one being tested and the power supply pin or set of pins shall be
open.
c.
Each input and each output individually connected to terminal A with respect to a combination of
all the other input and output pins connected to terminal B. All pins except the input or output pin
being tested and the combination of all the other input and output pins shall be open.
TERMINAL C
R1
R2
S1
TERMINAL A
REGULATED
HIGH VOLTAGE
SUPPLY
S2
C1
DUT
SOCKET
SHORT
TERMINAL B
TERMINAL D
Mil Std 883D
Method 3015.7
Notice 8
R = 1.5kΩ
C = 100pf
CURRENT
PROBE
(NOTE 6)
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement