Circuit Thermal Protection Circuit Protection NTC Thermistors Products Catalog (Thermal Management Solutions)

Circuit Thermal Protection Circuit Protection NTC Thermistors Products Catalog (Thermal Management Solutions)
2015
CATALOG
Thermal Management Solutions
2015.6
industrial.panasonic.com/
Thermal Management Solutions CONTENTS
Product Item
Multilayer NTC Thermistors
NTC Thermistors for automotive devices (chip type)
“PGS” Graphite Sheets
Part Number
Page
The NTC Thermistors
2
ERT JZ
ERT J0
ERT J1
3
Handling Precautions
11
ERT J0 M
ERT J1 M
16
Handling Precautions
21
EYG S
EYG A
26
Minimum order
30
Handling Precautions
32
All products in this catalog comply with the RoHS Directive.
The RoHS Directive is “the Directive (2011/65/EU) on the Restriction of the Use of Certain
Hazardous Substances in Electrical and Electronic Equipment “ and its revisions.
00 May. 2015
–1–
NTC Thermistors
The NTC Thermistors
NTC Thermistors is a negative temperature coefficient resistor that significantly reduces its resistance value as the heat/
ambient temperature rises. Thermistors is sintered in high-temperature (1200 °C to 1500 °C), and manufactured in
various shapes. It’s comprised of 2 to 4 kinds of metal oxides: iron, nickel, cobalt, manganese and copper.
Features
Recommended Applications
●
●
Temperature Coefficient of Resistance is negative,
and it’s extremely large (–2.8 to –5.1 [%/°C]).
● Various shapes, especially co mpact size
components are available.
● Selection of resistance vale is comparatively free, it’s
available from several tens Ω to several hundred kΩ.
For temperature measurement or temperature
detection : Thermometer, temperature controller
● For temperature compensation : Transistor, transistor
circuit, quarts oscillation circuit, and measuring
instruments
Physical Characteristics of NTC Thermistors
Thermistor is a resistor sensitive to temperature that is
utilizing the characteristic of metal oxide semiconductor
having large temperature coefficient.
And its temperature dependency of resistance value is
indicated by the following equation :
R=R0 exp
[ (
B
1
T
1
T0
)]
Fig. 1
1000
100
.....................................(1)
10
RT/R25
T0 : Standard Temperature 298.15 K(25 °C)
R0 : Resistance at T0 [K]
B : Thermistor Constant [K]
Temperature coefficient (a) in general meaning is indicated
as follows :
1
2000
3000
400
0
500
0
60
00
0.1
B ....................................................................
(2)
2
T
0.01
Since the change by temperature is considerably large, a is
not appropriate as a constant. Therefore, B value (constant)
is generally used as a coefficient of thermistors.
0.001
a=
B=1000
–40 –20
0
20
40 60
T (˚C)
80
100 120 140
Major Characteristics of NTC Thermistors
The relation between resistance and temperature of a
thermistor is linear as shown in Fig. 2. The resistance
value is shown in vertical direction in a logarithmic scale
and reciprocal of absolute temperature (adding 273.15 to
centigrade) is shown in horizontal direction.
The B value (constant) determines the gradient of these
straight lines. The B value (constant) is calculated by using
following equation.
knR1 – knR2
1
1
T1 T2
700
=4
0
B 25/5
100000
10000
....................................................... (3)
R1: Resistance at T1 K
R2: Resistance at T2 K
When you calculate this equation, you’ll find that B value
is not exactly constant. The resistance is expressed by
the following equation :
R = AT–C exp D/T ............................................................. (4)
In (4), C is a small positive or negative constant and quite
negligible except for use in precision temperature-measuring
device, therefore, the B value can be considered as constant
number.
In Fig. 1, the relation between the resistance ratio
RT/R25 (R25 : Resistance at 25 °C, RT : Resistance at T °C)
and B Value is shown with T °C, in the horizontal direction.
500
44005
=
00=
/55
□
BB2255/
0
□
□
104
4 25
EV EP473
0
0=
J
0
5
T RTJ
5/
2
R
B
E
E
□
5
03
343
R1
5=
E
0
25/8
J
B
T
0
A
5 0
ER
3□
=4
G10
/50
5
E
2
0
B
J
□
ERT
02
T1
E
TJ0
ER
00
=28
B 25/50
□
1
A10
J0E
ERT
1000000
R (Ω)
B=
Fig. 2
10000000
1000
100
10
1
2.4
125
2.9
85
3.4
1
(×10 –3K–1)
T
50
25
T (˚C)
3.9
0
–20
4.4
–40
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 May. 2015
–2–
Multilayer NTC Thermistors
Multilayer NTC Thermistors
ERTJ
Series:
Features
● Surface Mount Device (0201, 0402, 0603)
● Highly reliable multilayer / monolithic structure
● Wide temperature operating range (–40 to 125
● Environmentally-friendly lead-free
● RoHS compliant
°C)
Recommended Applications
● Mobile
Phone
· Temperature compensation for crystal oscillator
· Temperature compensation for semiconductor devices
● Personal Computer and Peripheral Device
· Temperature detection for CPU and memory device
· Temperature compensation for ink-viscosity (Inkjet Printer)
● Battery Pack (secondary battery)
· Temperature detection of battery cells
● Liquid Crystal Display
· Temperature compensation of display contrast
· Temperature compensation of display backlighting (CCFL)
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
R
T
J
0
E
G
1
0
3
J
A
Common Code
Product Code
Type Code
ERT NTC
J Chip Type (SMD)
Thermistors
Multilayer Type
Size Code
Z “0201”
0 “0402”
1 “0603”
Packaging
Style Code
E
V
“0201”, “0402”
Pressed Carrier
Taping
Punched Carrier
Taping
(Pitch : 2 mm)
“0603”
Punched Carrier
Taping
(Pitch : 4 mm)
B Value Class Code
2701 to 2800
A
3301 to 3400
G
3801 to 3900
M
4001 to 4100
P
4201 to 4300
R
4301 to 4400
S
4401 to 4500
T
4601 to 4700
V
Nominal Resistance
R25 (Ω)
The first two digits
are significant figures
of resistance and the
third one denotes
the number of zeros
following them.
(Example)
Resistance Tolerance
Code
G
±1% Narrow
Tolerance
±2% Type
H
J
±3% Standard
±5% Type
F
Special
Specification
Construction
3
4
5
1
No.
Name
A
Semiconductive Ceramics
B
Internal electrode
C
2
D
E
Terminal
electrode
Substrate electrode
Intermediate electrode
External electrode
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
–3–
Multilayer NTC Thermistors
Ratings
Size code (EIA)
Operating Temperature Range
Rated Maximum Power Dissipation✽1
✽2
Dissipation Factor
Z(0201)
0(0402)
–40 to 125 °C
66 mW
Approximately
2 mW/°C
33 mW
Approximately
1 mW/°C
1(0603)
100 mW
Approximately
3 mW/°C
✽1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature.
· The maximum value of power, and rated power is same under the condition of ambient temperature 25 °C or less. If the temperature exceeds
25 °C, rated power depends on the decreased power dissipation curve.
· Please see “Operating Power” for details.
✽2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 °C through self heat generation under stable temperatures.
· Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT).
Part Number List of Narrow Tolerance Type
(Resistance Tolerance : ±2 %, ±1 %)
● 0201(EIA)
Part Number
ERTJZEG103□A
ERTJZEP473□
ERTJZER683□
ERTJZER104□
ERTJZET104□
ERTJZEV104□
□ : Resistance Tolerance Code
Nominal Resistance
at 25 °C
10 kΩ
47 kΩ
68 kΩ
100 kΩ
100 kΩ
100 kΩ
Resistance
Tolerance
Nominal Resistance
at 25 °C
10 kΩ
33 kΩ
47 kΩ
68 kΩ
100 kΩ
100 kΩ
Resistance
Tolerance
Nominal Resistance
at 25 °C
10 kΩ
100 kΩ
Resistance
Tolerance
±1 %(F)
or
±2 %(G)
±1 %(F)
or
±2 %(G)
B Value
at 25/50(K)
(3380 K)
4050 K±1 %
4250 K±1 %
4250 K±1 %
4500 K±1 %
4700 K±1 %
B Value
at 25/85(K)
3435 K±1%
(4100 K)
(4300 K)
(4300 K)
(4550 K)
(4750 K)
B Value
at 25/50(K)
(3380 K)
4050 K±1 %
4050 K±1 %
4050 K±1 %
4330 K±1 %
4700 K±1 %
B Value
at 25/85(K)
3435 K±1 %
(4100 K)
(4100 K)
(4100 K)
(4390 K)
(4750 K)
B Value
at 25/50(K)
(3380 K)
(4330 K)
B Value
at 25/85(K)
3435 K±1 %
4390 K±1 %
● 0402(EIA)
Part Number
ERTJ0EG103□A
ERTJ0EP333□
ERTJ0EP473□
ERTJ0EP683□
ERTJ0ES104□
ERTJ0EV104□
±1 %(F)
or
±2 %(G)
□ : Resistance Tolerance Code
● 0603(EIA)
Part Number
ERTJ1VG103□A
ERTJ1VS104□A
□ : Resistance Tolerance Code
Part Number List of Standard Type
(Resistance Tolerance : ±5 %, ±3 %)
● 0201(EIA)
Part Number
ERTJZET202□
ERTJZET302□
ERTJZET472□
ERTJZEG103□A
ERTJZEP473□
ERTJZER683□
ERTJZER104□
ERTJZET104□
ERTJZEV104□
Nominal Resistance
at 25 °C
2.0 kΩ
3.0 kΩ
4.7 kΩ
10 kΩ
47 kΩ
68 kΩ
100 kΩ
100 kΩ
100 kΩ
Resistance
Tolerance
±3 %(H)
or
±5 %(J)
B Value
at 25/50(K)
4500 K±2 %
4500 K±2 %
4500 K±2 %
(3380 K)
4050 K±2 %
4250 K±2 %
4250 K±2 %
4500 K±2 %
4700 K±2 %
B Value
at 25/85(K)
(4450 K)
(4450 K)
(4450 K)
3435 K±1 %
(4100 K)
(4300 K)
(4300 K)
(4550 K)
(4750 K)
□ : Resistance Tolerance Code
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
–4–
Multilayer NTC Thermistors
● 0402(EIA)
Part Number
ERTJ0EA220□
Nominal Resistance
at 25 °C
22 Ω
Resistance
Tolerance
B Value
at 25/50(K)
2750 K±3 %
B Value
at 25/85(K)
(2700 K)
ERTJ0EA330□
33 Ω
2750 K±3 %
(2700 K)
ERTJ0EA400□
40 Ω
2750 K±3 %
(2700 K)
ERTJ0EA470□
47 Ω
2750 K±3 %
(2700 K)
ERTJ0EA680□
68 Ω
2800 K±3 %
(2750 K)
ERTJ0EA101□
100 Ω
2800 K±3 %
(2750 K)
ERTJ0EA151□
150 Ω
2800 K±3 %
(2750 K)
ERTJ0ET102□
1.0 kΩ
4500 K±2 %
(4450 K)
ERTJ0ET152□
1.5 kΩ
4500 K±2 %
(4450 K)
ERTJ0ET202□
2.0 kΩ
4500 K±2 %
(4450 K)
ERTJ0ET222□
2.2 kΩ
4500 K±2 %
(4450 K)
ERTJ0ET302□
3.0 kΩ
4500 K±2 %
(4450 K)
ERTJ0ER332□
3.3 kΩ
4250 K±2 %
(4300 K)
ERTJ0ET332□
3.3 kΩ
4500 K±2 %
(4450 K)
ERTJ0ET472□
4.7 kΩ
4500 K±2 %
(4450 K)
ERTJ0ER472□
4.7 kΩ
4250 K±2 %
(4300 K)
ERTJ0ER682□
6.8 kΩ
4250 K±2 %
(4300 K)
ERTJ0EG103□A
10 kΩ
(3380 K)
3435 K±1 %
ERTJ0EM103□
10 kΩ
3900 K±2 %
(3970 K)
ERTJ0ER103□
10 kΩ
4250 K±2 %
(4300 K)
ERTJ0ER153□
15 kΩ
4250 K±2 %
(4300 K)
±3 %(H)
or
±5 %(J)
ERTJ0ER223□
22 kΩ
4250 K±2 %
(4300 K)
ERTJ0EP333□
33 kΩ
4050 K±2 %
(4100 K)
ERTJ0ER333□
33 kΩ
4250 K±2 %
(4300 K)
ERTJ0ET333□
33 kΩ
4500 K±2 %
(4580 K)
ERTJ0EP473□
47 kΩ
4050 K±2 %
(4100 K)
ERTJ0EV473□
47 kΩ
4700 K±2 %
(4750 K)
ERTJ0EP683□
68 kΩ
4050 K±2 %
(4100 K)
ERTJ0ER683□
68 kΩ
4250 K±2 %
(4300 K)
ERTJ0EV683□
68 kΩ
4700 K±2 %
(4750 K)
ERTJ0ER104□
100 kΩ
4250 K±2 %
(4300 K)
ERTJ0ES104□
100 kΩ
4330 K±2 %
(4390 K)
ERTJ0ET104□
100 kΩ
4500 K±2 %
(4580 K)
ERTJ0EV104□
100 kΩ
4700 K±2 %
(4750 K)
ERTJ0ET154□
150 kΩ
4500 K±2 %
(4580 K)
ERTJ0EV154□
150 kΩ
4700 K±2 %
(4750 K)
ERTJ0EV224□
220 kΩ
4700 K±2 %
(4750 K)
ERTJ0EV334□
330 kΩ
4700 K±2 %
(4750 K)
ERTJ0EV474□
470 kΩ
4700 K±2 %
(4750 K)
□ : Resistance Tolerance Code
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
–5–
Multilayer NTC Thermistors
● 0603(EIA)
Part Number
ERTJ1VA220□
Nominal Resistance
at 25 °C
22 Ω
Resistance
Tolerance
B Value
at 25/50(K)
2750 K±3 %
B Value
at 25/85(K)
(2700 K)
ERTJ1VA330□
33 Ω
2750 K±3 %
(2700 K)
ERTJ1VA400□
40 Ω
2800 K±3 %
(2750 K)
ERTJ1VA470□
47 Ω
2800 K±3 %
(2750 K)
ERTJ1VA680□
68 Ω
2800 K±3 %
(2750 K)
ERTJ1VA101□
100 Ω
2800 K±3 %
(2750 K)
ERTJ1VT102□
1.0 kΩ
4500 K±2 %
(4450 K)
ERTJ1VT152□
1.5 kΩ
4500 K±2 %
(4450 K)
ERTJ1VT202□
2.0 kΩ
4500 K±2 %
(4450 K)
ERTJ1VT222□
2.2 kΩ
4500 K±2 %
(4450 K)
ERTJ1VT302□
3.0 kΩ
4500 K±2 %
(4450 K)
ERTJ1VT332□
3.3 kΩ
4500 K±2 %
(4450 K)
ERTJ1VR332□
3.3 kΩ
4250 K±2 %
(4300 K)
ERTJ1VR472□
4.7 kΩ
4250 K±2 %
(4300 K)
ERTJ1VT472□
4.7 kΩ
ERTJ1VR682□
6.8 kΩ
ERTJ1VG103□A
±3 %(H)
or
±5 %(J)
4500 K±2 %
(4450 K)
4250 K±2 %
(4300 K)
10 kΩ
(3380 K)
3435 K±1%
ERTJ1VR103□
10 kΩ
4250 K±2 %
(4300 K)
ERTJ1VR153□
15 kΩ
4250 K±2 %
(4300 K)
ERTJ1VR223□
22 kΩ
4250 K±2 %
(4300 K)
ERTJ1VR333□
33 kΩ
4250 K±2 %
(4300 K)
ERTJ1VP473□
47 kΩ
4100 K±2 %
(4150 K)
ERTJ1VR473□
47 kΩ
4250 K±2 %
(4300 K)
ERTJ1VV473□
47 kΩ
4700 K±2 %
(4750 K)
ERTJ1VR683□
68 kΩ
4250 K±2 %
(4300 K)
ERTJ1VV683□
68 kΩ
4700 K±2 %
(4750 K)
ERTJ1VS104□A
100 kΩ
(4330 K)
4390 K±1%
ERTJ1VV104□
100 kΩ
4700 K±2 %
(4750 K)
ERTJ1VV154□
150 kΩ
4700 K±2 %
(4750 K)
ERTJ1VT224□
220 kΩ
4500 K±2 %
(4580 K)
□ : Resistance Tolerance Code
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
–6–
Multilayer NTC Thermistors
● Temperature
and Resistance value (the resistance value at 25 °C is set to 1)/ Reference values
ERTJ□□A~
B25/50 2750 K
2800 K
B25/85 (2700 K) (2750 K)
ERTJ□□G~ ERTJ□□M~ ERTJ□□P~ ERTJ□□R~ ERTJ0ES~ ERTJ1VS~ ERTJ□□T~ ERTJ0ET104□ ERTJ□□V~
(3375 K)
3435 K
3900 K
4050 K
4250 K
4330 K
(3970 K) (4100 K) (4300 K) (4390 K)
(4330 K)
4390 K
4500 K
4500 K
4700 K
(4450 K) (4580 K) (4750 K)
✽1
T(°C)
✽2
-40 13.05
13.28
20.52
32.11
33.10
43.10
45.67
45.53
63.30
47.07
59.76
-35 10.21
10.40
15.48
23.29
24.03
30.45
32.08
31.99
42.92
33.31
41.10
11.79
17.08
17.63
21.76
22.80
22.74
29.50
23.80
28.61
12.65
13.06
15.73
16.39
16.35
20.53
17.16
20.14
11.48
11.91
11.89
14.46
12.49
14.33
-30
8.061
8.214
-25
6.427
6.547
9.069
-20
5.168
5.261
7.037
9.465
9.761
-15
4.191
4.261
5.507
7.147
7.362
8.466
8.743
8.727
-10
3.424
3.476
4.344
5.444
5.599
6.300
6.479
6.469
7.407
6.772
7.482
-5
2.819
2.856
3.453
4.181
4.291
4.730
4.845
4.839
5.388
5.046
5.481
0
2.336
2.362
2.764
3.237
3.312
3.582
3.654
3.650
3.966
3.789
4.050
5
1.948
1.966
2.227
2.524
2.574
2.734
2.778
2.776
2.953
2.864
3.015
10
1.635
1.646
1.806
1.981
2.013
2.102
2.128
2.126
2.221
2.179
2.262
15
1.380
1.386
1.474
1.567
1.584
1.629
1.642
1.641
1.687
1.669
1.710
20
1.171
1.174
1.211
1.247
1.255
1.272
1.277
1.276
1.293
1.287
1.303
25
1
1
1
1
1
1
1
1
1
1
1
30
0.8585
0.8565
0.8309
0.8072
0.8016
0.7921
0.7888
0.7890
0.7799
0.7823
0.7734
35
0.7407
0.7372
0.6941
0.6556
0.6461
0.6315
0.6263
0.6266
0.6131
0.6158
0.6023
40
0.6422
0.6376
0.5828
0.5356
0.5235
0.5067
0.5004
0.5007
0.4856
0.4876
0.4721
45
0.5595
0.5541
0.4916
0.4401
0.4266
0.4090
0.4022
0.4025
0.3874
0.3884
0.3723
50
0.4899
0.4836
0.4165
0.3635
0.3496
0.3319
0.3251
0.3254
0.3111
0.3111
0.2954
55
0.4309
0.4238
0.3543
0.3018
0.2881
0.2709
0.2642
0.2645
0.2513
0.2504
0.2356
60
0.3806
0.3730
0.3027
0.2518
0.2386
0.2222
0.2158
0.2161
0.2042
0.2026
0.1889
65
0.3376
0.3295
0.2595
0.2111
0.1985
0.1832
0.1772
0.1774
0.1670
0.1648
0.1523
70
0.3008
0.2922
0.2233
0.1777
0.1659
0.1518
0.1463
0.1465
0.1377
0.1348
0.1236
75
0.2691
0.2600
0.1929
0.1504
0.1393
0.1264
0.1213
0.1215
0.1144
0.1108
0.1009
80
0.2417
0.2322
0.1672
0.1278
0.1174
0.1057
0.1011
0.1013
0.09560
0.09162
0.08284
85
0.2180
0.2081
0.1451
0.1090
0.09937
0.08873
0.08469
0.08486
0.08033
0.07609
0.06834
90
0.1974
0.1871
0.1261
0.09310
0.08442
0.07468
0.07122
0.07138
0.06782
0.06345
0.05662
10.30
9.159
10.31
95
0.1793
0.1688
0.1097
0.07980
0.07200
0.06307
0.06014
0.06028
0.05753
0.05314
0.04712
100
0.1636
0.1528
0.09563
0.06871
0.06166
0.05353
0.05099
0.05112
0.04903
0.04472
0.03939
105
0.1498
0.1387
0.08357
0.05947
0.05306
0.04568
0.04340
0.04351
0.04198
0.03784
0.03308
110
0.1377
0.1263
0.07317
0.05170
0.04587
0.03918
0.03708
0.03718
0.03609
0.03218
0.02791
115
0.1270
0.1153
0.06421
0.04512
0.03979
0.03374
0.03179
0.03188
0.03117
0.02748
0.02364
120
0.1175
0.1056
0.05650
0.03951
0.03460
0.02916
0.02734
0.02742
0.02702
0.02352
0.02009
125
0.1091
0.09695
0.04986
0.03470
0.03013
0.02527
0.02359
0.02367
0.02351
0.02017
0.01712
✽1 Applied to the product except for ERTJ0ET104□ in B25/50=4500 K.
✽2 Applied only to ERTJ0ET104□.
B25/50=
kn (R25/R50)
1/298.15–1/323.15
B25/85=
kn (R25/R85)
1/298.15–1/358.15
R25=Resistance at 25.0±0.1 °C
R50=Resistance at 50.0±0.1 °C
R85=Resistance at 85.0±0.1 °C
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
–7–
Multilayer NTC Thermistors
Specification and Test Method
Item
Specification
Rated Zero-power Within the specified tolerance.
Resistance (R25)
Test Method
The value is measured at a power that the influence
of self-heat generation can be negligible (0.1mW or
less), at the rated ambient temperature of 25.0±0.1°C.
B Value
The Zero-power resistances; R1 and R2, shall be
measured respectively at T1 (deg.C) and T2 (deg.C).
The B value is calculated by the following equation.
Shown in each Individual Specification.
✽ Individual Specification shall specify B25/50 or
B25/85.
BT1/T2=
T1
25.0 ±0.1 °C
25.0 ±0.1 °C
B25/50
B25/85
Adhesion
kn (R1)–kn (R2)
1/(T1+273.15)–1/(T2+273.15)
T2
50.0 ±0.1 °C
85.0 ±0.1 °C
The terminal electrode shall be free from peeling Applied force :
or signs of peeling.
Size 0201
:2N
Size 0402, 0603 : 5 N
Duration : 10 s
Size : 0201, 0402
1.0
0.3/Size:0201
0.5/Size:0402
0.5R
Test Sample
Board
1.0
Size : 0603
Test
Sample
Bending distance : 1 mm
Bending speed : 1 mm/s
20
Bending
distance
Bending Strength There shall be no cracks and other mechanical
damage.
R25 change : within ±5 %
Unit : mm
R340
45±2
45±2
Unit : mm
Resistance to
Soldering Heat
Solderability
There shall be no cracks and other mechanical
damage.
Nallow Tol. type Standard type
R25 change
: within ±2 %
within ±3 %
B Value change : within ±1 %
within ±2 %
Soldering bath method
Solder temperature : 270 ±5 °C
Dipping period
: 4.0 ±1 s
Preheat condition :
More than 95 % of the soldered area of both
terminal electrodes shall be covered with fresh
solder.
Soldering bath method
Solder temperature : 230 ±5 °C
Dipping period
: 4 ±1 s
Solder
: Sn-3.0Ag-0.5Cu
Step
1
2
Temp (°C)
80 to 100
150 to 200
Period (s)
120 to 180
120 to 180
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
–8–
Multilayer NTC Thermistors
Specification and Test Method
Item
Temperature
Cycling
Specification
Test Method
Nallow Tol. type Standard type Conditions of one cycle
: within ±2 %
within ±3 %
Step 1 : –40 °C, 30±3 min
R25 change
B Value change : within ±1 %
within ±2 %
Step 2 : Room temp., 3 min max.
Step 3 : 125 °C, 30±3 min.
Step 4 : Room temp., 3 min max.
Number of cycles: 100 cycles
Humidity
R25 change
:
B Value change :
Biased Humidity
Low Temperature
Exposure
Nallow Tol. type Standard type Temperature
: 85 ±2 °C
within ±2 %
within ±3 % Relative humidity : 85 ±5 %
within ±1 %
within ±2 % Test period
: 1000 +48/0 h
R25 change
:
B Value change :
Nallow Tol. type Standard type Temperature
: 85 ±2 °C
within ±2 %
within ±3 % Relative humidity : 85 ±5 %
within ±1 %
within ±2 % Applied power : 10 mW(D.C.)
Test period
: 500 +48/0 h
R25 change
:
B Value change :
Nallow Tol. type Standard type Specimens are soldered on the testing board
within ±2 %
within ±3 % shown in Fig.2.
within ±1 %
within ±2 % Temperature
: –40 ±3 °C
Test period
: 1000 +48/0 h
High Temperature
Nallow Tol. type Standard type Specimens are soldered on the testing board
Exposure
R25 change
: within ±2 %
within ±3 % shown in Fig.2.
B Value change : within ±1 %
within ±2 % Temperature
: 125 ±3 °C
Test period
: 1000 +48/0 h
Typical Application
● Temperature
Detection
Writing current control of HDD
Vcc
GMR Head
R
R
L
Rth
NTC
AD
converter
CPU
● Temperature
Interface
● Temperature
Compensation (Pseudo-linearization)
Contrast level control of LCD
Compensation (RF circuit)
Temperature compensation of TCXO
Vcc
PMIC
ADC
R
Rth
NTC
R
LCD
NTC
R
Rth
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
–9–
Multilayer NTC Thermistors
Dimensions in mm (not to scale)
L
(Unit : mm)
W
Size Code (EIA)
L
W
T
L1, L2
Z(0201)
0.60±0.03
0.30±0.03
0.30±0.03
0.15±0.05
0(0402)
1.0±0.1
0.50±0.05
0.50±0.05
0.25±0.15
1(0603)
1.60±0.15
0.8±0.1
0.8±0.1
0.3±0.2
T
L2
L1
Packaging Methods
Size
Code
Thickness
(mm)
Z(0201)
0(0402)
1(0603)
● Pitch
● Reel
Packing Quantities
0.3
0.5
0.8
Kind of Taping
Pressed Carrier Taping
2
2
4
Punched Carrier Taping
W1
E
15,000
10,000
4,000
C
D
2 mm (Pressed Carrier Taping) : Size 0201
Feeding hole
fD0
W2
Chip pocket
A
E
t
Dim.
B
(mm)
K0
Chip component
A
B
W
P 1 P2
F
E
P2
P0
fD 0
t
±0.03 ±0.03 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1
● Pitch
Feeding hole
fD0
C
D
E
13.0±0.5
21.0±0.8
2.0±0.5
W1
9.0
W2
+1.0
0
11.4±1.0
Part and Taped End
Leader part
0
max. ±0.03
Top cover tape
2 mm (Punched Carrier Taping) : Size 0402
100 min.
Vacant position
400 min.
Chip pocket
E
t1
60.0
+1.0
0
● Leader
K0
Dim. 0.36 0.66 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.55 0.36
(mm)
180
0
–3
Tape running direction
P0
P1
fB
fA
Symbol
F
W
A
Symbol
for Taping
Pitch Quantity
(mm) (pcs./reel)
B
● Standard
Taped end
B
F
W
A
t2
Chip component
A
Symbol
B
W
P1 P2
F
E
P0
P1
P2
P0
fD 0
t1
Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.7
±0.05 ±0.05 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1
● Pitch
0
t2
1.0
max. max.
Minimum Quantity / Packing Unit
Part Number Minimum Quantity Packing Quantity
Carton
/ Packing Unit
in Carton
L×W×H (mm)
(Size)
4 mm (Punched Carrier Taping) : Size 0603
Feeding hole
fD0
ERTJZ
(0201)
15,000
300,000
250×200×200
ERTJ0
(0402)
10,000
200,000
250×200×200
4,000
80,000
250×200×200
Tape running direction
ERTJ1
(0603)
Chip pocket
E
t1
(Unit : mm)
F
W
(mm)
160 min.
Vacant position
Tape running direction
B
A
t2
Symbol
A
Dim. 1.0
(mm)
P1
Chip component
±0.1
B
W
F
E
P2
P1
P0
P2
P0
fD 0
t1
1.8 8.0 3.50 1.75 4.0 2.00 4.0 1.5+0.1 1.1
±0.1
±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1
0
Part No., quantity and country of origin are designated
on outer packages in English.
t2
1.4
max. max.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
– 10 –
Multilayer NTC Thermistors
Multilayer NTC Thermistors
Series:
ERTJ
Handling Precautions
Safety Precautions
Multilayer NTC Thermistors (hereafter referred to as “Thermistors”) should be used for general purpose applications
found in consumer electronics (audio/visual, home, office, information & communication) equipment.
When subjected to severe electrical, environmental, and/or mechanical stress beyond the specifications, as
noted in the Ratings and Specified Conditions section, the Thermistors’ performance may be degraded, or become
failure mode, such as short circuit mode and open-circuit mode. If you use under the condition of short-circuit, heat
generation of thermistors will occur by running large current due to application of voltage. There are possibilities of
smoke emission, substrate burn-out, and, in the worst case, fire.
For products which require higher safety levels, please carefully consider how a single malfunction can affect your
product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe,
such as setting up protecting circuits, etc.
● For the following applications and conditions, please contact us for product of special specification not found in
this document.
· When your application may have difficulty complying with the safety or handling precautions specified below.
· High-quality and high-reliability required devices that have possibility of causing hazardous conditions, such as
death or injury (regardless of directly or indirectly), due to failure or malfunction of the product.
1 Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.)
2 Submarine Equipment (submarine repeating equipment, etc.)
3 Transportation Equipment (motor vehicles, airplanes, trains, ship, traffic signal controllers, etc.)
4 Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.)
5 Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
6 Information Processing Equipment (large scale computer systems, etc.)
7 Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
8 Rotary Motion Equipment
9 Security Systems
J And any similar types of equipment
Operating Conditions and Circuit Design
[Maximum power dissipation]
1. Circuit Design
· The Maximum power that can be continuously
applied under static air at a certain ambient
temperature. The Maximum power dissipation under
an ambient temperature of 25 °C or less is the same
with the rated maximum power dissipation, and
Maximum power dissipation beyond 25 °C depends
on the Decreased power dissipation curve below.
1.1 Operating Temperature and Storage Temperature
When operating a components-mounted circuit,
please be sure to observe the “Operating Temperature
Range”, written in delivery specifications. Please
remember not to use the product under the condition
that exceeds the specified maximum temperature.
Storage temperature of PCB after mounting
Thermistors, which is not operated, should be within
the specified “Storage Temperature Range” in the
delivery specifications.
Maximum power dissipation
/ Rated maximum power dissipation (%)
Decreased power dissipation curve
1.2 Operating Power
The electricity applied to between terminals of
Thermistors should be under the specified maximum
power dissipation.
There are possibilities of breakage and burn-out due
to excessive self-heating of Thermistors, if the power
exceeds maximum power dissipation when operating.
Please consider installing protection circuit for your
circuit to improve the safety, in case of abnormal
voltage application and so on.
Thermistors’ performance of temperature detection
would be deteriorated if self-heating occurs,
even when you use it under the maximum power
dissipation.
Please consider the maximum power dissipation and
dissipation factor.
100
50
25
75
125
Ambient temperature (°C)
[Dissipation factor]
· The constant amount power required to raise the
temperature of the Thermistor 1 °C through self
heat generation under stable temperatures.
Dissipation factor (mW/°C) = Power consumption
of Thermistor / Temperature rise of element
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
– 11 –
Multilayer NTC Thermistors
1.3 Environmental Restrictions
(2) The land size shall be designed to have equal
space, on both right and left sides. If the
amount of solder on both sides is not equal,
the component may be cracked by stress,
since the side with a larger amount of solder
solidifies later during cooling.
The Thermistors shall not be operated and/or
stored under the following conditions.
(1) Environmental conditions
(a) Under direct exposure to water or salt water
(b) Under conditions where water can condense
and/or dew can form
(c) Under conditions containing corrosive gases
such as hydrogen sulfide, sulfurous acid,
chlorine and ammonia
(2) Mechanical conditions
The place where vibration or impact that
exceeds specified conditions written in delivery
specification is loaded.
Recommended Amount of Solder
(a) Excessive amount
(1) Solder resist shall be utilized to equalize the
amounts of solder on both sides.
(2) Solder resist shall be used to divide the
pattern for the following cases;
· Components are arranged closely.
· The Thermistor is mounted near a component
with lead wires.
· The Thermistor is placed near a chassis.
Refer to the table below.
The resistance of the Thermistors varies depending
on ambient temperatures and self-heating. To
measure the resistance value when examining circuit
configuration and conducting receiving inspection
and so on, the following points should be taken into
consideration:
1 Measurement temp : 25±0.1 °C
Measurement in liquid (silicon oil, etc.) is
recommended for a stable measurement temperature.
2 Power : 0.10 mW max.
4 terminal measurement with a constant-current
power supply is recommended.
Prohibited Applications and Recommended Applications
Item
2. Design of Printed Circuit Board
2.1 Selection of Printed Circuit Boards
Mixed mounting
with a component
with lead wires
There is a possibility of performance deterioration
by heat shock (temperature cycles), which causes
cracks, from alumina substrate.
Please confirm that the substrate you use does
not deteriorate the Thermistors’ quality.
Arrangement
near chassis
2.2 Design of Land Pattern
Retro-fitting of
component with
lead wires
Recommended Land Dimensions
Lateral
arrangement
SMD
c
Solder resist
Z(0201)
0(0402)
1(0603)
a
b
Chassis
Solder
(Ground solder)
Solder resist
Solder resist
A lead wire of
Soldering Retro-fitted
component
iron
Portion to be
excessively soldered
Land
Solder resist
Solder resist
To prevent the crack of Thermistors, try to
place it on the position that could not easily
be affected by the bending stress of substrate
while mounting procedures or procedures
afterwards.
Placement of the Thermistors near heating
elements also requires the great care to be
taken in order to avoid stresses from rapid
heating and cooling.
Unit (mm)
Size Code
(EIA)
The lead wire of a
component with lead wires
Improved applications
by pattern division
2.4 Component Layout
a
Component
dimensions
L
W
T
0.6 0.3 0.3
1.0 0.5 0.5
1.6 0.8 0.8
Prohibited
applications
Electrode pattern
(1) Recommended land dimensions are shown below.
Use the proper amount of solder in order
to prevent cracking. Using too much solder
places excessive stress on the Thermistors.
b
(c) Insufficient amount
2.3 Utilization of Solder Resist
1.4 Measurement of Resistance
Land
(b) Proper amount
c
0.2 to 0.3 0.25 to 0.30 0.2 to 0.3
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5
0.8 to 1.0 0.6 to 0.8 0.6 to 0.8
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
– 12 –
Multilayer NTC Thermistors
2. Chip Mounting Consideration
(1) To minimize mechanical stress caused by the
warp or bending of a PC board, please follow
the recommended Thermistors’ layout below.
Prohibited layout
(1) When mounting the Thermistors/components
on a PC board, the Thermistor bodies shall
be free from excessive impact loads such
as mechanical impact or stress due to the
positioning, pushing force and displacement of
vacuum nozzles during mounting.
(2) Maintenance and inspection of the Chip
Mounter must be performed regularly.
(3) If the bottom dead center of the vacuum
nozzle is too low, the Thermistor will crack from
excessive force during mounting.
The following precautions and recommendations
are for your reference in use.
(a) Set and adjust the bottom dead center of the
vacuum nozzles to the upper surface of the PC
board after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle
during mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a
supporting pin on the rear surface of the PC
board to suppress the bending of the PC
board in order to minimize the impact of the
vacuum nozzles. Typical examples are shown
in the table below.
Recommended layout
Layout the Thermistors sideways
against the stressing direction
(2) The following layout is for your reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on
the mounting position of the Thermistors.
E
D
Perforation
C
A
B
Slit
Magnitude of stress A>B=C>D>E
(3) The magnitude of mechanical stress applied to
the Thermistors when dividing the circuit board
in descending order is as follows:
push back < slit < V-groove < perforation.
Also take into account the layout of the
Thermistors and the dividing/breaking method.
(4) When the Thermistors are placed near heating
elements such as heater, etc., cracks from thermal
stresses may occur under following situation:
· Soldering the Thermistors directly to heating
elements.
· Sharing the land with heating elements.
If planning to conduct above-mentioned mounting
and/or placement, please contact us in advance.
Item
Single surface
mouting
Prohibited mounting
Crack
Recommended mounting
The supporting pin does not necessarily
have to be positioned beneath the
Thermistor.
Supporting
pin
Double surface
mounting
Separation of Solder
Crack
Supporting
pin
(d) Adjust the vacuum nozzles so that their bottom
dead center during mounting is not too low.
(4) The closing dimensions of the positioning
chucks shall be controlled. Maintenance
and replacement of positioning chucks shall
be performed regularly to prevent chipping
or cracking of the Thermistors caused by
mechanical impact during positioning due to
worn positioning chucks.
(5) Maximum stroke of the nozzle shall be
adjusted so that the maximum bending of PC
board does not exceed 0.5 mm at 90 mm
span. The PC board shall be supported by an
adequate number of supporting pins.
2.5 Mounting Density and Spaces
Intervals between components should not be too
narrow to prevent the influence from solder bridges
and solder balls. The space between components
should be carefully determined.
Precautions for Assembly
1. Storage
(1) The Thermistors shall be stored between 5 to
40 °C and 20 to 70 % RH, not under severe
conditions of high temperature and humidity.
(2) If stored in a place where humidity, dust, or
corrosive gasses (hydrogen sulfide, sulfurous
acid, hydrogen chloride and ammonia, etc.) are
contained, the solderability of terminal electrodes
will be deteriorated.
In addition, storage in a places where the heat
or direct sunlight exposure occur will cause
mounting problems due to deformation of tapes
and reels and components and taping/reels
sticking together.
(3) Do not store components longer than 6
months. Check the solderability of products
that have been stored for more than 6 months
before use
3. Selection of Soldering Flux
Soldering flux may seriously affect the performance
of the Thermistors. The following shall be confirmed
before use.
(1) The soldering flux should have a halogen based
content of 0.1 wt% (converted to chlorine) or below.
Do not use soldering flux with strong acid.
(2) When applying water-soluble soldering flux,
wash the Thermistors sufficiently because
the soldering flux residue on the surface of
PC boards may deteriorate the insulation
resistance on the Thermistors’ surface.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
– 13 –
Multilayer NTC Thermistors
4. Soldering
(b) Preheating:
Conduct sufficient pre-heating, and make
sure that the temperature difference
between solder and Thermistors’ surface
is 150 °C or less.
(c) Temperature of Iron tip: 300 °C max.
(The required amount of solder shall be
melted in advance on the soldering tip.)
(d) Gradual cooling:
After soldering, the Thermistors shall be
cooled gradually at room temperature.
4.1 Reflow Soldering
The reflow soldering temperature conditions are
composed of temperature curves of Preheating,
Temp. rise, Heating, Peak and Gradual cooling.
Large temperature difference inside the Thermistors
caused by rapid heat application to the Thermistors
may lead to excessive thermal stresses, contributing
to the thermal cracks. The Preheating temperature
requires controlling with great care so that tombstone
phenomenon may be prevented.
Temperature
140 to 180 °C
Preheating temp
2Temp. rise
to Peak temp.
220 °C min.
3Heating
260 °C max.
4Peak
Peak temp.
5Gradual cooling
to 140 °C
Recommended profile of Hand soldering (EX)
Period or Speed
60 to 120 sec
Item
1Preheating
2 to 5 °C /sec
△T
Gradual cooling
60 sec max.
10 sec max.
Preheating
1 to 4 °C /sec
60 to 120 sec
Recommended profile of Reflow soldering (EX)
△T
Temperature (°C)
△T : Allowable temperature difference △T < 150 °C
4 Peak
260
220
2 Temp. rise
(2) Condition 2 (without preheating)
Hand soldering can be performed without
preheating, by following the conditions below:
(a) Soldering iron tip shall never directly
touch the ceramic and terminal electrodes
of the Thermistors.
(b) The lands are sufficiently preheated with a
soldering iron tip before sliding the soldering
iron tip to the terminal electrodes of the
Thermistors for soldering.
5 Gradual
cooling
180
140
1 Preheating
3 Heating
Time
60 to 120 sec
3 sec max.
60 sec max.
△T : Allowable temperature difference △T < 150 °C
Conditions of Hand soldering without preheating
The rapid cooling (forced cooling) during Gradual
cooling part should be avoided, because this may
cause defects such as the thermal cracks, etc.
When the Thermistors are immersed into a cleaning
solvent, make sure that the surface temperatures of
the devices do not exceed 100 °C.
Per for ming reflow soldering twice under
the conditions shown in the figure above
[Recommended profile of Reflow soldering (EX)] will
not cause any problems. However, pay attention to
the possible warp and bending of the PC board.
Item
Temperature of Iron tip
Wattage
Shape of Iron tip
Soldering time with
a soldering iron
Condition
270 °C max.
20 W max.
f3 mm max.
3 sec max.
5. Post Soldering Cleaning
5.1 Cleaning solvent
Soldering flux residue may remain on the PC
board if cleaned with an inappropriate solvent.
This may deteriorate the electrical characteristics
and reliability of the Thermistors.
4.2 Hand Soldering
Hand soldering typically causes significant temperature
change, which may induce excessive thermal stresses
inside the Thermitors, resulting in the thermal cracks, etc.
In order to prevent any defects, the following should
be observed.
· The temperature of the soldering tips should be
controlled with special care.
· The direct contact of soldering tips with the
Thermistors and/or terminal electrodes should be
avoided.
· Dismounted Thermistors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering:
Use thread solder (f1 mm or below) which
contains flux with low chlorine, developed
for precision electronic equipment.
5.2 Cleaning conditions
Inappropriate cleaning conditions such as insufficient
cleaning or excessive cleaning may impair the electrical
characteristics and reliability of the Thermistors.
(1) Insufficient cleaning can lead to:
(a) The halogen substance found in the residue
of the soldering flux may cause the metal of
terminal electrodes to corrode.
(b) The halogen substance found in the residue
of the soldering flux on the surface of the
Thermistors may change resistance values.
(c) Water-soluble soldering flux may have more
remarkable tendencies of (a) and (b) above
compared to those of rosin soldering flux.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
– 14 –
Multilayer NTC Thermistors
(2) Dividing/Breaking of the PC boards shall be
done carefully at moderate speed by using a jig
or apparatus to protect the Thermistors on the
boards from mechanical damage.
(3) Examples of PCB dividing/breaking jigs:
The outline of PC board breaking jig is shown
below. When PC boards are broken or divided,
loading points should be close to the jig to minimize
the extent of the bending
Also, planes with no parts mounted on should be
used as plane of loading, in order to prevent tensile
stress induced by the bending, which may cause
cracks of the Thermistors or other parts mounted on
the PC boards.
(2) Excessive cleaning can lead to:
(a) When using ultrasonic cleaner, make sure that the
output is not too large, so that the substrate will
not resonate. The resonation causes the cracks
in Varistors and/or solders, and deteriorates the
strength of the terminal electrodes. Please follow
these conditions for Ultrasonic cleaning:
Ultrasonic wave output
: 20 W/L max.
Ultrasonic wave frequency
: 40 kHz max.
Ultrasonic wave cleaning time : 5 min. max.
5.3 Contamination of Cleaning solvent
Cleaning with contaminated cleaning solvent may
cause the same results as insufficient cleaning
due to the high density of liberated halogen.
Outline of Jig
6. Inspection Process
The pressure from measuring terminal pins might
bend the PCB when implementing circuit inspection
after mounting Thermistors on PCB, and as a result,
cracking may occur.
(1) Mounted PC boards shall be supported by an
adequate number of supporting pins on the back
with bend settings of 90 mm span 0.5 mm max.
(2) Confirm that the measuring pins have the right
tip shape, are equal in height, have the right
pressure, and are set in the correct positions.
The following figures are for your reference to
avoid bending the PC board.
Item
Prohibited setting
PC board
V-groove
PC board
splitting jig
Prohibited dividing
Loading direction
Loading
point
PC
board
Recommended
setting
Recommended dividing
PC
board
Chip
component
Loading direction
V-groove
Chip component
Loading
point
V-groove
Check pin
Check pin
9. Mechanical Impact
Bending of
PC board
Separated, Crack
(1) The Thermistors shall be free from any excessive
mechanical impact.
The Thermistor body is made of ceramics and
may be damaged or cracked if dropped.
N eve r use a T h ermisto r w hich has be en
dropped; their quality may be impaired and
failure rate increased.
(2) When handling PC boards with Thermistors mounted
on them, do not allow the Thermistors to collide
with another PC board.
When mounted PC boards are handled or stored
in a stacked state, the corner of a PC board might
strike Thermistors, and the impact of the strike may
cause damage or cracking and can deteriorate the
withstand voltage and insulation resistance of the
Thermistor.
Supporting pin
7. Protective Coating
When the surface of a PC board on which the
Thermistors have been mounted is coated with resin
to protect against moisture and dust, it shall be
confirmed that the protective coating does not affect the
performance of Varistors.
(1) Choose the material that does not emit the
decomposition and/or reaction gas. The Gas may
affect the composing members of the Varistors.
(2) Shrinkage and expansion of resin coating when
curing may apply stress to the Varistors and may
lead to occurrence of cracks.
8. Dividing/Breaking of PC Boards
Mounted PCB
(1) Please be careful not to stress the substrate with
bending/twisting when dividing, after mounting
components including Varistors. Abnormal and
excessive mechanical stress such as bending or
torsion shown below can cause cracking in the
Thermistors.
Bending
Crack
Crack
Floor
Other
Torsion
The various precautions described above are typical.
For special mounting conditions, please contact us.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 May. 2015
– 15 –
NTC Thermistors for automotive devices (chip type)
Multilayer NTC Thermistors
ERTJ
Series:
Features
● Surface Mount Device (0402, 0603)
● Highly reliable multilayer / monolithic structure
● Wide temperature operating range (–40 to 150
● Environmentally-friendly lead-free
● RoHS compliant
°C)
Recommended Applications
● For
● For
● For
● For
● For
● For
car audio system
ECUs
electric pumps and compressors
LED lights
batteries
temperature detection of various circuits
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
R
T
J
0
E
G
1
0
3
F
M
Common Code
Product Code
Type Code
ERT NTC
J Chip Type (SMD)
Thermistors
Multilayer Type
Size Code
0 “0402”
1 “0603”
Packaging
Style Code
E
V
“0402”
Pressed Carrier
Taping
Punched Carrier
Taping
(Pitch : 2 mm)
“0603”
Punched Carrier
Taping
(Pitch : 4 mm)
B Value Class Code
2701 to 2800
A
3301 to 3400
G
3801 to 3900
M
4001 to 4100
P
4201 to 4300
R
4301 to 4400
S
4401 to 4500
T
4601 to 4700
V
Nominal Resistance
R25 (Ω)
The first two digits
are significant figures
of resistance and the
third one denotes
the number of zeros
following them.
(Example)
Resistance Tolerance
Code
G
±1% Narrow
Tolerance
±2% Type
H
J
±3% Standard
±5% Type
F
M
Automotive
component
Construction
3
4
5
1
No.
Name
A
Semiconductive Ceramics
B
Internal electrode
C
2
D
E
Terminal
electrode
Substrate electrode
Intermediate electrode
External electrode
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
– 16 –
Jun. 2015
NTC Thermistors for automotive devices (chip type)
Ratings
Size code (EIA)
Operating Temperature Range
Rated Maximum Power Dissipation✽1
Dissipation Factor✽2
0(0402)
1(0603)
–40 to 150 °C
66 mW
Approximately 2 mW/°C
100 mW
Approximately 3 mW/°C
✽1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature.
· The maximum value of power, and rated power is same under the condition of ambient temperature 25 °C or less. If the temperature exceeds
25 °C, rated power depends on the decreased power dissipation curve.
· Please see “Operating Power” for details.
✽2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 °C through self heat generation under stable temperatures.
· Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT).
Part Number List
● 0402(EIA)
Part Number
ERTJ0EG103□M
ERTJ0EP473□M
ERTJ0ER104□M
ERTJ0EV104□M
● 0603(EIA)
Nominal Resistance
at 25 °C
10 kΩ
47 kΩ
100 kΩ
100 kΩ
B Value
B Value
at 25/50(K) at 25/85(K)
3380 K±1 % 3435 K±1 %
4050 K±1 %
(4100 K)
4250 K±1 %
(4300 K)
4700 K±1 %
(4750 K)
Nominal Resistance
at 25 °C
ERTJ1VG103□M
10 kΩ
ERTJ1VP473□M
47 kΩ
ERTJ1VV104□M
100 kΩ
Part Number
B Value
B Value
at 25/50(K) at 25/85(K)
3380 K±1 % 3435 K±1 %
4100 K±1 %
(4150 K)
4700 K±1 %
(4750 K)
□ : Resistance Tolerance Code (F : ±1%, G : ±2%, H : ±3%, J : ±5%)
□ : Resistance Tolerance Code (F : ±1%, G : ±2%, H : ±3%, J : ±5%)
● Temperature
B25/50
B25/85
T(°C)
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
125
B25/50=
and Resistance value (the resistance value at 25 °C is set to 1)/ Reference values
ERTJ□□G~
(3380 K)
3435 K
ERTJ□□P~
4050 K
(4100 K)
ERTJ□□P~
4100 K
(4150 K)
ERTJ□□R~
4250 K
(4300 K)
ERTJ□□V~
4700 K
(4750 K)
20.52
15.48
11.79
9.069
7.037
5.507
4.344
3.453
2.764
2.227
1.806
1.474
1.211
1
0.8309
0.6941
0.5828
0.4916
0.4165
0.3543
0.3027
0.2595
0.2233
0.1929
0.1672
0.1451
0.1261
0.1097
0.09563
0.08357
0.07317
0.06421
0.05650
0.04986
33.10
24.03
17.63
13.06
9.761
7.362
5.599
4.291
3.312
2.574
2.013
1.584
1.255
1
0.8016
0.6461
0.5235
0.4266
0.3496
0.2881
0.2386
0.1985
0.1659
0.1393
0.1174
0.09937
0.08442
0.07200
0.06166
0.05306
0.04587
0.03979
0.03460
0.03013
34.56
24.99
18.26
13.48
10.04
7.546
5.720
4.369
3.362
2.604
2.030
1.593
1.258
1
0.7994
0.6426
0.5194
0.4222
0.3451
0.2837
0.2344
0.1946
0.1623
0.1359
0.1143
0.09658
0.08189
0.06969
0.05957
0.05117
0.04415
0.03823
0.03319
0.02886
42.40
29.96
21.42
15.50
11.33
8.370
6.244
4.699
3.565
2.725
2.098
1.627
1.271
1
0.7923
0.6318
0.5069
0.4090
0.3320
0.2709
0.2222
0.1831
0.1516
0.1261
0.1054
0.08843
0.07457
0.06316
0.05371
0.04585
0.03929
0.03378
0.02913
0.02519
59.76
41.10
28.61
20.14
14.33
10.31
7.482
5.481
4.050
3.015
2.262
1.710
1.303
1
0.7734
0.6023
0.4721
0.3723
0.2954
0.2356
0.1889
0.1523
0.1236
0.1009
0.08284
0.06834
0.05662
0.04712
0.03939
0.03308
0.02791
0.02364
0.02009
0.01712
kn (R25/R50)
1/298.15–1/323.15
B25/85=
kn (R25/R85)
1/298.15–1/358.15
R25=Resistance at 25.0±0.1 °C
R50=Resistance at 50.0±0.1 °C
R85=Resistance at 85.0±0.1 °C
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
– 17 –
Jun. 2015
NTC Thermistors for automotive devices (chip type)
Specification and Test Method
Item
Specification
Rated Zero-power Within the specified tolerance.
Resistance (R25)
Test Method
The value is measured at a power that the influence
of self-heat generation can be negligible (0.1mW or
less), at the rated ambient temperature of 25.0±0.1°C.
B Value
The Zero-power resistances; R1 and R2, shall be
measured respectively at T1 (deg.C) and T2 (deg.C).
The B value is calculated by the following equation.
Shown in each Individual Specification.
✽ Individual Specification shall specify B25/50 or
B25/85.
BT1/T2=
T1
25.0 ±0.1 °C
25.0 ±0.1 °C
B25/50
B25/85
Adhesion
kn (R1)–kn (R2)
1/(T1+273.15)–1/(T2+273.15)
T2
50.0 ±0.1 °C
85.0 ±0.1 °C
The terminal electrode shall be free from peeling Applied force :
or signs of peeling.
Size 0402, 0603 : 5 N
Duration : 10 s
Size : 0402
1.0
0.5
0.5R
Test Sample
Board
1.0
Size : 0603
Test
Sample
Bending distance : 2 mm
Bending speed : 1 mm/s
20
R340
45±2
Bending
distance
Bending Strength There shall be no cracks and other mechanical
damage.
R25 change : within ±5 %
Unit : mm
45±2
Unit : mm
Resistance to
Vibration
There shall be no cracks and other mechanical
damage.
R25 change
:
B Value change :
Resistance to
Impact
within ±2 %
within ±1 %
There shall be no cracks and other mechanical
damage.
R25 change
:
B Value change :
within ±2 %
within ±1 %
Solder samples on a testing substrate, then
apply vibration to them.
Acceleration
:5G
Vibrational frequency : 10 to 2000 Hz
Sweep time
: 20 minutes
12 cycles in three directions,
which are perpendicular to each other
Solder samples on a testing substrate, then apply
impacts to them.
Pulse waveform
: Semisinusoidal wave, 11 ms
Impact acceleration : 50 G
Impact direction
: X-X', Y-Y', Z-Z' In 6 directions,
three times each
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
– 18 –
Jun. 2015
NTC Thermistors for automotive devices (chip type)
Specification and Test Method
Item
Resistance to
Soldering Heat
Specification
There shall be no cracks and other mechanical
damage.
R25 change
:
B Value change :
within ±2 %
within ±1 %
Test Method
Soldering bath method
Solder temperature : 260 ±5 °C, 270 ±5 °C
Dipping period
: 3.0 ±0.5 s, 10.0 ±0.5 s
Preheat condition :
Step
1
2
Temp (°C)
80 to 100
150 to 200
Period (s)
120 to 180
120 to 180
Solderability
More than 95 % of the soldered area of both
terminal electrodes shall be covered with fresh
solder.
Soldering bath method
Solder temperature : 230 ±5 °C
Dipping period
: 4 ±1 s
Solder
: Sn-3.0Ag-0.5Cu
Temperature
Cycling
R25 change
:
B Value change :
within ±2 %
within ±1 %
Conditions of one cycle
Step 1 : –55±3 °C, 30±3 min.
Step 2 : Room temp., 3 min. max.
Step 3 : 125±5 °C, 30±3 min.
Step 4 : Room temp., 3 min. max.
Number of cycles: 2000 cycles
Humidity
R25 change
:
B Value change :
within ±2 %
within ±1 %
Temperature
: 85 ±2 °C
Relative humidity : 85 ±5 %
Test period
: 2000 +48/0 h
Biased Humidity
R25 change
:
B Value change :
within ±2 %
within ±1 %
Temperature
: 85 ±2 °C
Relative humidity : 85 ±5 %
Applied power : 10 mW(D.C.)
Test period
: 2000 +48/0 h
Low Temperature
Exposure
R25 change
:
B Value change :
within ±2 %
within ±1 %
Temperature
Test period
: –40 ±3 °C
: 2000 +48/0 h
High Temperature R25 change
:
Exposure 1
B Value change :
within ±2 %
within ±1 %
Temperature
Test period
: 125 ±3 °C
: 2000 +48/0 h
High Temperature R25 change
:
Exposure 2
B Value change :
within ±3 %
within ±2 %
Temperature
Test period
: 150 ±3 °C
: 1000 +48/0 h
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
– 19 –
Jun. 2015
NTC Thermistors for automotive devices (chip type)
Dimensions in mm (not to scale)
L
W
(Unit : mm)
Size Code (EIA)
L
W
T
L1, L2
0 (0402)
1.0±0.1
0.50±0.05
0.50±0.05
0.25±0.15
1 (0603)
1.60±0.15
0.8±0.1
0.8±0.1
0.3±0.2
T
L2
L1
Packaging Methods
Size
Code
● Reel
Packing Quantities
Thickness
(mm)
0 (0402)
0.5
1 (0603)
0.8
for Taping
Pitch Quantity
(mm) (pcs./reel)
Kind of Taping
Punched Carrier Taping
2
10,000
4
4,000
W1
E
C
B
● Standard
D
● Pitch
W2
2 mm (Punched Carrier Taping) : Size 0402
A
Feeding hole
fD0
t1
Chip pocket
E
Symbol
(mm)
fB
fA
180
0
–3
60.0
+1.0
0
C
D
E
13.0±0.5 21.0±0.8 2.0±0.5
W1
9.0
+1.0
0
W2
11.4±1.0
B
F
W
A
Dim.
t2
Chip component
A
Symbol
B
W
P1 P2
F
E
P0
P1
P2
P0
fD 0
t1
Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.7
(mm)
±0.05 ±0.05 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1
● Pitch
● Leader
Tape running direction
0
Part and Taped End
Leader part
t2
Top cover tape
1.0
max. max.
100 min.
Vacant position
400 min.
4 mm (Punched Carrier Taping) : Size 0603
Feeding hole
fD0
Chip pocket
Taped end
E
t1
B
F
W
A
t2
Symbol
160 min.
Vacant position
(Unit : mm)
ERTJ0 (0402)
Minimum Quantity/ Packing
Unit
10,000
Packing Quantity
in Carton
200,000
Carton
L×W×H (mm)
250×200×200
ERTJ1 (0603)
4,000
80,000
250×200×200
A
Dim. 1.0
(mm)
P1
Chip component
±0.1
B
1.8
±0.1
W
F
E
P2
Tape running direction
P0
P1
P2
P0
fD 0
t1
t2
8.0 3.50 1.75 4.0 2.00 4.0 1.5+0.1 1.1 1.4
±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1
0 max. max.
Minimum Quantity / Packing Unit
Part Number (Size)
Part No., quantity and country of origin are designated on outer packages in English.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
– 20 –
Jun. 2015
NTC Thermistors for automotive devices (chip type)
Multilayer NTC Thermistors
Series:
ERTJ
Handling Precautions
Safety Precautions
The NTC Thermistors for automotive devices (chip type), hereafter referred to as Thermisotrs, is designed for
use in automotive devices. When subjected to severe electrical, environmental, and/or mechanical stress beyond
the specifications, as noted in the Ratings and Specified Conditions section, the Thermistors’ performance may
be degraded, or become failure mode, such as short circuit mode and open-circuit mode. If you use under the
condition of short-circuit, heat generation of thermistors will occur by running large current due to application of
voltage. There are possibilities of smoke emission, substrate burn-out, and, in the worst case, fire.
For products which require higher safety levels, please carefully consider how a single malfunction can affect your
product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe,
such as setting up protecting circuits, etc.
● For the following applications and conditions, please contact us for product of special specification not found in
this document.
· When your application may have difficulty complying with the safety or handling precautions specified below.
· High-quality and high-reliability required devices that have possibility of causing hazardous conditions, such as
death or injury (regardless of directly or indirectly), due to failure or malfunction of the product.
1 Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.)
2 Submarine Equipment (submarine repeating equipment, etc.)
3 Transportation Equipment (airplanes, trains, ship, traffic signal controllers, etc.)
4 Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.)
5 Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
6 Information Processing Equipment (large scale computer systems, etc.)
7 Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
8 Rotary Motion Equipment
9 Security Systems
J And any similar types of equipment
Operating Conditions and Circuit Design
[Maximum power dissipation]
1. Circuit Design
· The Maximum power that can be continuously
applied under static air at a certain ambient
temperature. The Maximum power dissipation under
an ambient temperature of 25 °C or less is the same
with the rated maximum power dissipation, and
Maximum power dissipation beyond 25 °C depends
on the Decreased power dissipation curve below.
1.1 Operating Temperature and Storage Temperature
When operating a components-mounted circuit,
please be sure to observe the “Operating Temperature
Range”, written in delivery specifications. Please
remember not to use the product under the condition
that exceeds the specified maximum temperature.
Storage temperature of PCB after mounting
Thermistors, which is not operated, should be within
the specified “Storage Temperature Range” in the
delivery specifications.
Maximum power dissipation/
Rated maximum power dissipation (%)
Decreased power dissipation curve
120
100
1.2 Operating Power
The electricity applied to between terminals of
Thermistors should be under the specified maximum
power dissipation.
There are possibilities of breakage and burn-out due
to excessive self-heating of Thermistors, if the power
exceeds maximum power dissipation when operating.
Please consider installing protection circuit for your
circuit to improve the safety, in case of abnormal
voltage application and so on.
Thermistors’ performance of temperature detection
would be deteriorated if self-heating occurs,
even when you use it under the maximum power
dissipation.
Please consider the maximum power dissipation and
dissipation factor.
80
60
40
20
0
−25
0
25 50 75 100 125 150 175
Ambient temperature (°C)
[Dissipation factor]
· The constant amount power required to raise the
temperature of the Thermistor 1 °C through self
heat generation under stable temperatures.
Dissipation factor (mW/°C) = Power consumption
of Thermistor / Temperature rise of element
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
– 21 –
Jun. 2015
NTC Thermistors for automotive devices (chip type)
1.3 Environmental Restrictions
(2) The land size shall be designed to have equal
space, on both right and left sides. If the
amount of solder on both sides is not equal,
the component may be cracked by stress,
since the side with a larger amount of solder
solidifies later during cooling.
The Thermistors shall not be operated and/or
stored under the following conditions.
(1) Environmental conditions
(a) Under direct exposure to water or salt water
(b) Under conditions where water can condense
and/or dew can form
(c) Under conditions containing corrosive gases
such as hydrogen sulfide, sulfurous acid,
chlorine and ammonia
(2) Mechanical conditions
The place where vibration or impact that
exceeds specified conditions written in delivery
specification is loaded.
Recommended Amount of Solder
(a) Excessive amount
(1) Solder resist shall be utilized to equalize the
amounts of solder on both sides.
(2) Solder resist shall be used to divide the
pattern for the following cases;
· Components are arranged closely.
· The Thermistor is mounted near a component
with lead wires.
· The Thermistor is placed near a chassis.
Refer to the table below.
The resistance of the Thermistors varies depending
on ambient temperatures and self-heating. To
measure the resistance value when examining circuit
configuration and conducting receiving inspection
and so on, the following points should be taken into
consideration:
1 Measurement temp : 25±0.1 °C
Measurement in liquid (silicon oil, etc.) is
recommended for a stable measurement temperature.
2 Power : 0.10 mW max.
4 terminal measurement with a constant-current
power supply is recommended.
Prohibited Applications and Recommended Applications
Item
2. Design of Printed Circuit Board
2.1 Selection of Printed Circuit Boards
Mixed mounting
with a component
with lead wires
There is a possibility of performance deterioration
by heat shock (temperature cycles), which causes
cracks, from alumina substrate.
Please confirm that the substrate you use does
not deteriorate the Thermistors’ quality.
Arrangement
near chassis
2.2 Design of Land Pattern
Retro-fitting of
component with
lead wires
Recommended Land Dimensions
Lateral
arrangement
SMD
c
Solder resist
Chassis
Solder
(Ground solder)
Solder resist
Solder resist
A lead wire of
Soldering Retro-fitted
component
iron
Portion to be
excessively soldered
Land
Solder resist
Solder resist
To prevent the crack of Thermistors, try to
place it on the position that could not easily
be affected by the bending stress of substrate
while mounting procedures or procedures
afterwards.
Placement of the Thermistors near heating
elements also requires the great care to be
taken in order to avoid stresses from rapid
heating and cooling.
Unit (mm)
Size Code
(EIA)
The lead wire of a
component with lead wires
Improved applications
by pattern division
2.4 Component Layout
a
Component
dimensions
L
W
T
Prohibited
applications
Electrode pattern
(1) Recommended land dimensions are shown below.
Use the proper amount of solder in order
to prevent cracking. Using too much solder
places excessive stress on the Thermistors.
b
(c) Insufficient amount
2.3 Utilization of Solder Resist
1.4 Measurement of Resistance
Land
(b) Proper amount
a
b
c
0(0402)
1.0
0.5
0.5
0.4 to 0.5
0.4 to 0.5
0.4 to 0.5
1(0603)
1.6
0.8
0.8
0.8 to 1.0
0.6 to 0.8
0.6 to 0.8
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
– 22 –
Jun. 2015
NTC Thermistors for automotive devices (chip type)
2. Chip Mounting Consideration
(1) To minimize mechanical stress caused by the
warp or bending of a PC board, please follow
the recommended Thermistors’ layout below.
Prohibited layout
(1) When mounting the Thermistors/components
on a PC board, the Thermistor bodies shall
be free from excessive impact loads such
as mechanical impact or stress due to the
positioning, pushing force and displacement of
vacuum nozzles during mounting.
(2) Maintenance and inspection of the Chip
Mounter must be performed regularly.
(3) If the bottom dead center of the vacuum
nozzle is too low, the Thermistor will crack from
excessive force during mounting.
The following precautions and recommendations
are for your reference in use.
(a) Set and adjust the bottom dead center of the
vacuum nozzles to the upper surface of the PC
board after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle
during mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a
supporting pin on the rear surface of the PC
board to suppress the bending of the PC
board in order to minimize the impact of the
vacuum nozzles. Typical examples are shown
in the table below.
Recommended layout
Layout the Thermistors sideways
against the stressing direction
(2) The following layout is for your reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on
the mounting position of the Thermistors.
E
D
Perforation
C
A
B
Slit
Magnitude of stress A>B=C>D>E
(3) The magnitude of mechanical stress applied to
the Thermistors when dividing the circuit board
in descending order is as follows:
push back < slit < V-groove < perforation.
Also take into account the layout of the
Thermistors and the dividing/breaking method.
(4) When the Thermistors are placed near heating
elements such as heater, etc., cracks from thermal
stresses may occur under following situation:
· Soldering the Thermistors directly to heating
elements.
· Sharing the land with heating elements.
If planning to conduct above-mentioned mounting
and/or placement, please contact us in advance.
Item
Single surface
mouting
Prohibited mounting
Crack
Recommended mounting
The supporting pin does not necessarily
have to be positioned beneath the
Thermistor.
Supporting
pin
Double surface
mounting
Separation of Solder
Crack
Supporting
pin
(d) Adjust the vacuum nozzles so that their bottom
dead center during mounting is not too low.
(4) The closing dimensions of the positioning
chucks shall be controlled. Maintenance
and replacement of positioning chucks shall
be performed regularly to prevent chipping
or cracking of the Thermistors caused by
mechanical impact during positioning due to
worn positioning chucks.
(5) Maximum stroke of the nozzle shall be
adjusted so that the maximum bending of PC
board does not exceed 0.5 mm at 90 mm
span. The PC board shall be supported by an
adequate number of supporting pins.
2.5 Mounting Density and Spaces
Intervals between components should not be too
narrow to prevent the influence from solder bridges
and solder balls. The space between components
should be carefully determined.
Precautions for Assembly
1. Storage
(1) The Thermistors shall be stored between 5 to
40 °C and 20 to 70 % RH, not under severe
conditions of high temperature and humidity.
(2) If stored in a place where humidity, dust, or
corrosive gasses (hydrogen sulfide, sulfurous
acid, hydrogen chloride and ammonia, etc.) are
contained, the solderability of terminal electrodes
will be deteriorated.
In addition, storage in a places where the heat
or direct sunlight exposure occur will cause
mounting problems due to deformation of tapes
and reels and components and taping/reels
sticking together.
(3) Do not store components longer than 6
months. Check the solderability of products
that have been stored for more than 6 months
before use
3. Selection of Soldering Flux
Soldering flux may seriously affect the performance
of the Thermistors. The following shall be confirmed
before use.
(1) The soldering flux should have a halogen based
content of 0.1 wt% (converted to chlorine) or below.
Do not use soldering flux with strong acid.
(2) When applying water-soluble soldering flux,
wash the Thermistors sufficiently because
the soldering flux residue on the surface of
PC boards may deteriorate the insulation
resistance on the Thermistors’ surface.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
– 23 –
Jun. 2015
NTC Thermistors for automotive devices (chip type)
4. Soldering
(b) Preheating:
Conduct sufficient pre-heating, and make
sure that the temperature difference
between solder and Thermistors’ surface
is 150 °C or less.
(c) Temperature of Iron tip: 300 °C max.
(The required amount of solder shall be
melted in advance on the soldering tip.)
(d) Gradual cooling:
After soldering, the Thermistors shall be
cooled gradually at room temperature.
4.1 Reflow Soldering
The reflow soldering temperature conditions are
composed of temperature curves of Preheating,
Temp. rise, Heating, Peak and Gradual cooling.
Large temperature difference inside the Thermistors
caused by rapid heat application to the Thermistors
may lead to excessive thermal stresses, contributing
to the thermal cracks. The Preheating temperature
requires controlling with great care so that tombstone
phenomenon may be prevented.
Temperature
140 to 180 °C
Preheating temp
2Temp. rise
to Peak temp.
220 °C min.
3Heating
260 °C max.
4Peak
Peak temp.
5Gradual cooling
to 140 °C
Recommended profile of Hand soldering (EX)
Period or Speed
60 to 120 sec
Item
1Preheating
2 to 5 °C /sec
△T
Gradual cooling
60 sec max.
10 sec max.
Preheating
1 to 4 °C /sec
60 to 120 sec
Recommended profile of Reflow soldering (EX)
△T
Temperature (°C)
△T : Allowable temperature difference △T < 150 °C
4 Peak
260
220
2 Temp. rise
(2) Condition 2 (without preheating)
Hand soldering can be performed without
preheating, by following the conditions below:
(a) Soldering iron tip shall never directly
touch the ceramic and terminal electrodes
of the Thermistors.
(b) The lands are sufficiently preheated with a
soldering iron tip before sliding the soldering
iron tip to the terminal electrodes of the
Thermistors for soldering.
5 Gradual
cooling
180
140
1 Preheating
3 Heating
Time
60 to 120 sec
3 sec max.
60 sec max.
△T : Allowable temperature difference △T < 150 °C
Conditions of Hand soldering without preheating
The rapid cooling (forced cooling) during Gradual
cooling part should be avoided, because this may
cause defects such as the thermal cracks, etc.
When the Thermistors are immersed into a cleaning
solvent, make sure that the surface temperatures of
the devices do not exceed 100 °C.
Per for ming reflow soldering twice under
the conditions shown in the figure above
[Recommended profile of Reflow soldering (EX)] will
not cause any problems. However, pay attention to
the possible warp and bending of the PC board.
Item
Temperature of Iron tip
Wattage
Shape of Iron tip
Soldering time with
a soldering iron
Condition
270 °C max.
20 W max.
f3 mm max.
3 sec max.
5. Post Soldering Cleaning
5.1 Cleaning solvent
Soldering flux residue may remain on the PC
board if cleaned with an inappropriate solvent.
This may deteriorate the electrical characteristics
and reliability of the Thermistors.
4.2 Hand Soldering
Hand soldering typically causes significant temperature
change, which may induce excessive thermal stresses
inside the Thermitors, resulting in the thermal cracks, etc.
In order to prevent any defects, the following should
be observed.
· The temperature of the soldering tips should be
controlled with special care.
· The direct contact of soldering tips with the
Thermistors and/or terminal electrodes should be
avoided.
· Dismounted Thermistors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering:
Use thread solder (f1 mm or below) which
contains flux with low chlorine, developed
for precision electronic equipment.
5.2 Cleaning conditions
Inappropriate cleaning conditions such as insufficient
cleaning or excessive cleaning may impair the electrical
characteristics and reliability of the Thermistors.
(1) Insufficient cleaning can lead to:
(a) The halogen substance found in the residue
of the soldering flux may cause the metal of
terminal electrodes to corrode.
(b) The halogen substance found in the residue
of the soldering flux on the surface of the
Thermistors may change resistance values.
(c) Water-soluble soldering flux may have more
remarkable tendencies of (a) and (b) above
compared to those of rosin soldering flux.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
– 24 –
Jun. 2015
NTC Thermistors for automotive devices (chip type)
(2) Dividing/Breaking of the PC boards shall be
done carefully at moderate speed by using a jig
or apparatus to protect the Thermistors on the
boards from mechanical damage.
(3) Examples of PCB dividing/breaking jigs:
The outline of PC board breaking jig is shown
below. When PC boards are broken or divided,
loading points should be close to the jig to minimize
the extent of the bending
Also, planes with no parts mounted on should be
used as plane of loading, in order to prevent tensile
stress induced by the bending, which may cause
cracks of the Thermistors or other parts mounted on
the PC boards.
(2) Excessive cleaning can lead to:
(a) When using ultrasonic cleaner, make sure that the
output is not too large, so that the substrate will
not resonate. The resonation causes the cracks
in Varistors and/or solders, and deteriorates the
strength of the terminal electrodes. Please follow
these conditions for Ultrasonic cleaning:
Ultrasonic wave output
: 20 W/L max.
Ultrasonic wave frequency
: 40 kHz max.
Ultrasonic wave cleaning time : 5 min. max.
5.3 Contamination of Cleaning solvent
Cleaning with contaminated cleaning solvent may
cause the same results as insufficient cleaning
due to the high density of liberated halogen.
Outline of Jig
6. Inspection Process
The pressure from measuring terminal pins might
bend the PCB when implementing circuit inspection
after mounting Thermistors on PCB, and as a result,
cracking may occur.
(1) Mounted PC boards shall be supported by an
adequate number of supporting pins on the back
with bend settings of 90 mm span 0.5 mm max.
(2) Confirm that the measuring pins have the right
tip shape, are equal in height, have the right
pressure, and are set in the correct positions.
The following figures are for your reference to
avoid bending the PC board.
Item
Prohibited setting
PC board
V-groove
PC board
splitting jig
Prohibited dividing
Loading direction
Loading
point
PC
board
Recommended
setting
Recommended dividing
PC
board
Chip
component
Loading direction
V-groove
Chip component
Loading
point
V-groove
Check pin
Check pin
9. Mechanical Impact
Bending of
PC board
Separated, Crack
(1) The Thermistors shall be free from any excessive
mechanical impact.
The Thermistor body is made of ceramics and
may be damaged or cracked if dropped.
N eve r use a T h ermisto r w hich has be en
dropped; their quality may be impaired and
failure rate increased.
(2) When handling PC boards with Thermistors mounted
on them, do not allow the Thermistors to collide
with another PC board.
When mounted PC boards are handled or stored
in a stacked state, the corner of a PC board might
strike Thermistors, and the impact of the strike may
cause damage or cracking and can deteriorate the
withstand voltage and insulation resistance of the
Thermistor.
Supporting pin
7. Protective Coating
When the surface of a PC board on which the
Thermistors have been mounted is coated with resin
to protect against moisture and dust, it shall be
confirmed that the protective coating does not affect the
performance of Varistors.
(1) Choose the material that does not emit the
decomposition and/or reaction gas. The Gas may
affect the composing members of the Varistors.
(2) Shrinkage and expansion of resin coating when
curing may apply stress to the Varistors and may
lead to occurrence of cracks.
8. Dividing/Breaking of PC Boards
Mounted PCB
(1) Please be careful not to stress the substrate with
bending/twisting when dividing, after mounting
components including Varistors. Abnormal and
excessive mechanical stress such as bending or
torsion shown below can cause cracking in the
Thermistors.
Bending
Crack
Crack
Floor
Other
Torsion
The various precautions described above are typical.
For special mounting conditions, please contact us.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
– 25 –
Jun. 2015
“PGS” Graphite Sheets
“PGS” Graphite Sheets
EYG
Type:
PGS (Pyrolytic Graphite Sheet) is a ther mal
interface material which is very thin, synthetically
made, has high thermal conductivity, and is made
from a higly oriented graphite polymer film. It
is ideal for providing thermal management/heatsinking in limited spaces or to provide supplemental
heat-sinking in addition to conventional means.
This material is flexible and can be cut into
customizable shapes.
Features
● Excellent
thermal conductivity : 700 to 1950 W/(m·K)
(2 to 5 times as high as copper, 3 to 8 time as high as aluminum)
● Lightweight: Specific gravity : 0.85 to 2.13 g/cm3
(1/4 to 1/10 of copper, 1/1.3 to 1/3 of aluminum in density)
● Flexible and easy to be cut or trimmed. (withstands repeated bending)
● Low thermal resistance
● RoHS compliant
Recommended applications
● Smart phones, Mobile phones, DSC, DVC, Tablet PCs, PCs and peripherals, LED
● Semiconductor manufacturing equipment (Sputtering, Dry etching, Steppers)
● Optical communications equipment
Devices
Explanation of Part Numbers
● PGS
only (EYGS✽✽✽✽✽✽)
1
2
3
4
5
6
7
8
9
10
E
Y
G
S
0
9
1
2
1
0
Product Code
Style
S
0912
1218
1823
PGS only
Dimension
90 mm × 115 mm
115 mm × 180 mm
180 mm × 230 mm
PGS Thickness✽
100 μm
10
70 μm
07
50 μm
05
40 μm
04
25 μm
03
✽ PGS thickness of 17 μm, 10 μm does not
support as single item.
● Taping
(EYGA✽✽✽✽✽✽✽✽)
1
2
3
4
5
6
7
8
9
10
11
12
E
Y
G
A
0
9
1
2
1
0
D
M
Product Code
Style
A
Taping
0912
1218
Dimension✽✽
90 mm × 115 mm
115 mm × 180 mm
✽✽ Please contact us for other dimensions other
than those above.
PGS Thickness
10 100 μm
07
70 μm
05
50 μm
04
40 μm
03
25 μm
02
17 μm
01
10 μm
Suffix
A
M
F
PA
PM
DM
DF
V
RV
KV
Lamination type
✽ Please refer to
Composition
example.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
06
– 26 –
Mar. 2015
“PGS” Graphite Sheets
Characteristics
Thickness
Density
Thermal conductivity a-b plane
Electrical conductivity
Extensional strength
a-b plane
Expansion coefficient
c axis
Heat resistance✽
Bending(angle 180,R5)
Thickness
Density
Thermal conductivity a-b plane
Electrical conductivity
Extensional strength
a-b plane
Expansion coefficient
c axis
Heat resistance✽
Bending(angle 180,R5)
100 μm
0.10±0.03 mm
0.85 g/cm3
700 W/(m·K)
10000 S/cm
20.0 MPa
9.3×10-7 1/K
3.2×10-5 1/K
25 μm
0.025±0 .010 mm
1.90 g/cm3
1600 W/(m·K)
20000 S/cm
30.0 MPa
9.3×10-7 1/K
3.2×10-5 1/K
70 μm
50 μm
0.07±0.015 mm
0.050±0 .015 mm
1.21 g/cm3
1.70 g/cm3
1000 W/(m·K)
1300 W/(m·K)
10000 S/cm
10000 S/cm
20.0 MPa
20.0 MPa
-7
9.3×10 1/K
9.3×10-7 1/K
-5
3.2×10 1/K
3.2×10-5 1/K
400 °C
10000 cycles
17 μm
0.017±0 .005 mm
2.10 g/cm3
1850 W/(m·K)
20000 S/cm
40.0 MPa
9.3×10-7 1/K
3.2×10-5 1/K
400 °C
10000 cycles
40 μm
0.040±0 .012 mm
1.80 g/cm3
1350 W/(m·K)
10000 S/cm
25.0 MPa
9.3×10-7 1/K
3.2×10-5 1/K
10 μm
0.010±0 .002 mm
2.13 g/cm3
1950 W/(m·K)
20000 S/cm
40.0 MPa
9.3×10-7 1/K
3.2×10-5 1/K
✽ Withstand temperature refers to PGS only.
(Lamination material such as PET tape etc. is not included)
✽✽ Values are for reference, not guaranteed.
Comparison of thermal conductivity (a-b plane)
Layered structure of PGS
Diamond
1950 W/(m·K)
PGS 10 μm
1850 W/(m·K)
PGS 17 μm
PGS 25 μm
1350 W/(m·K)
PGS 40 μm
1300 W/(m·K)
PGS 50 μm
1000 W/(m·K)
PGS 70 μm
PGS 100 μm
3.354∼3.356
×10-8cm
C axis
1600 W/(m·K)
a-b plane
700 W/(m·K)
C : 99.9 % above
Thermal conductivity:
2 to 5 times as high as copper,
Specific gravity:
1/10 to 1/4 that of copper
Pure copper
Aluminum
Magnesium alloy
Stainless steel
Heat-conductive sheet
0
200 400
600 800 1000 1200 1400 1600 1800 2000
Coefficient of thermal conductivity (W/(m·k))
Electric field shield performance
Effect of shield (dB)
a-b plane(KEC method)
140
130
Effect of shield (dB)=–20 log (Vs/V0)
120
110
100
90
Effect of electric field shield
80
70
60
50
40
30
Effect of magnetic field shield
20
10
0
10
100
1000
Frequency (MHz)
10000
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
06
– 27 –
Mar. 2015
“PGS” Graphite Sheets
Lamination type/Composition example
● Standard
series ( PGS 100, 70, 50, 40, 25, 17, 10 μm)
Type
Front face
Rear face
PGS Only
S type
–
–
A-A type
–
Insulative adhesion type 30 μm
Adhesive Type
A -M type
A -F type
–
–
Insulative thin adhesion type 10 μm Insulative thin adhesion type 6 μm
PGS
Graphite sheet
PGS
Graphite sheet
PGS
Graphite sheet
PGS
Graphite sheet
Acrylic Adhesive
tape 30 μm
Separating paper
Acrylic Adhesive
tape 10 μm
Separating paper
Acrylic Adhesive
tape 6 μm
Separating paper
Structure
Features
Withstand temperature
Standard Size
Maximam size
Part No.
100
μm
Thickness
Part No.
70
μm
Thickness
Part No.
50
μm
Thickness
Part No.
40
μm
Thickness
Part No.
25
μm
Thickness
Part No.
17
μm
Thickness
Part No.
10
μm
Thickness
Type
Front face
Rear face
· High Thermal Conductivity
High Flexibility
· Low Thermal Resistance
· Available up to 400 °C
· Conductive Material
400 °C
115 × 180 mm
180 × 230 mm (25 μm to)
EYGS121810
100 μm
EYGS121807
70 μm
EYGS121805
50 μm
EYGS121804
40 μm
EYGS121803
25 μm
–
–
–
–
· With insulation material
on one side
· With strong adhesive
tape for putting chassis
· Withstanding Voltage : 2 kV
100 °C
90 × 115 mm
115 × 180 mm
EYGA091210A
130 μm
EYGA091207A
100 μm
EYGA091205A
80 μm
EYGA091204A
70 μm
EYGA091203A
55 μm
EYGA091202A
47 μm
EYGA091201A
40 μm
· With insulation material on
one side
· Low thermal resistance
comparison with A-A type
· Withstanding Voltage : 1 kV
100 °C
90 × 115 mm
115 × 180 mm
EYGA091210M
110 μm
EYGA091207M
80 μm
EYGA091205M
60 μm
EYGA091204M
50 μm
EYGA091203M
35 μm
EYGA091202M
27 μm
EYGA091201M
20 μm
· With insulation material on
one side
· Low thermal resistance
comparison with A-A type
100 °C
90 × 115 mm
115 × 180 mm
EYGA091210F
106 μm
EYGA091207F
76 μm
EYGA091205F
56 μm
EYGA091204F
46 μm
EYGA091203F
31 μm
EYGA091202F
23 μm
EYGA091201F
16 μm
Laminated type (Insulation & Adhesive)
A-PA type
A-PM type
A-DM type
A-DF type
Polyester tape standard type 30 μm Polyester tape standard type 30 μm Polyester tape thin type 10 μm Polyester tape thin type 10 μm
Insulative adhesion type 30 μm Insulative thin adhesion type 10 μm Insulative thin adhesion type 10 μm Insulative thin adhesion type 6 μm
PGS
Graphite sheet
Polyester(PET) PGS
Polyester(PET) PGS
Polyester(PET)
Graphite sheet tape 30 μm
Graphite sheet tape 10 μm
tape 30 μm
PGS
Polyester(PET)
Graphite sheet tape 10 μm
Structure
Acrylic Adhesive
Acrylic Adhesive
tape 30 μm
tape 10 μm
Separating paper
Separating paper
Features
Withstand temperature
Standard Size
Maximam size
Part No.
100
μm
Thickness
Part No.
70
μm
Thickness
Part No.
50
μm
Thickness
Part No.
40
μm
Thickness
Part No.
25
μm
Thickness
Part No.
17
μm
Thickness
Part No.
10
μm
Thickness
· With insulation material on
both side
· Withstanding Voltage
PET tape : 4 kV
Adhesive Tape : 2 kV
100 °C
90 × 115 mm
115 × 180 mm
EYGA091210PA
160 μm
EYGA091207PA
130 μm
EYGA091205PA
110 μm
EYGA091204PA
100 μm
EYGA091203PA
85 μm
EYGA091202PA
77 μm
EYGA091201PA
70 μm
· With insulation material on
both side
· Withstanding Voltage
PET tape : 4 kV
Adhesive Tape : 1 kV
100 °C
90 × 115 mm
115 × 180 mm
EYGA091210PM
140 μm
EYGA091207PM
110 μm
EYGA091205PM
90 μm
EYGA091204PM
80 μm
EYGA091203PM
65 μm
EYGA091202PM
57 μm
EYGA091201PM
50 μm
Acrylic Adhesive
tape 10 μm
Separating paper
· With insulation material on
both side
· Withstanding Voltage
PET tape : 1 kV
Adhesive Tape : 1 kV
100 °C
90 × 115 mm
115 × 180 mm
EYGA091210DM
120 μm
EYGA091207DM
90 μm
EYGA091205DM
70 μm
EYGA091204DM
60 μm
EYGA091203DM
45 μm
EYGA091202DM
37 μm
EYGA091201DM
30 μm
Acrylic Adhesive
tape 6 μm
Separating paper
· With insulation material on
both side
· Withstanding Voltage
PET tape : 1 kV
100 °C
90 × 115 mm
115 × 180 mm
EYGA091210DF
116 μm
EYGA091207DF
86 μm
EYGA091205DF
66 μm
EYGA091204DF
56 μm
EYGA091203DF
41 μm
EYGA091202DF
33 μm
EYGA091201DF
26 μm
✽ Please contact us for other lamination type product.
✽✽ Withstanding Voltages are for reference, not guaranteed.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
06
– 28 –
Mar. 2015
“PGS” Graphite Sheets
● High
heat resistance series ( PGS 100, 70, 50, 40, 25, 17, 10 μm)
Type
A-V type
Front face
–
Rear face
High heat resistance and insulation
adhesion type 18 μm
PGS
Graphite sheet
High heat resistance type
A-RV type
High heat resistance and insulation
type 13 μm
High heat resistance and insulation
adhesion type 18 μm
A-KV type
High heat resistance and insulation
type 30 μm
High heat resistance and insulation
adhesion type 18 μm
PGS
Graphite sheet
PGS
Heat-resistance
PEEK tape 13 μm Graphite sheet
Heat-resistance
Acrylic adhesive
tape 18 μm
Separating paper
Polyimide
tape 30 μm
Structure
Heat-resistance
Acrylic adhesive
tape 18 μm
Features
Withstand temperature
Standard Size
Maximam size
Part No.
100
μm
Thickness
Part No.
70
μm
Thickness
Part No.
50
μm
Thickness
Part No.
40
μm
Thickness
Part No.
25
μm
Thickness
Part No.
17
μm
Thickness
Part No.
10
μm
Thickness
Separating paper
· With high heat resistance and
insulation
tape on one side
· Withstanding Voltage Adhesive tape
: 2 kV
· With high heat resistance and
insulation
tape on both side
· Withstanding Voltage
PEEK tape : 2 kV
Adhesive tape : 2 kV
150 °C
90 × 115 mm
115 × 180 mm
EYGA091210V
118 μm
EYGA091207V
88 μm
EYGA091205V
68 μm
EYGA091204V
58 μm
EYGA091203V
43 μm
EYGA091202V
35 μm
EYGA091201V
28 μm
150 °C
90 × 115 mm
115 × 180 mm
EYGA091210RV
131 μm
EYGA091207RV
101 μm
EYGA091205RV
81 μm
EYGA091204RV
71 μm
EYGA091203RV
56 μm
EYGA091202RV
48 μm
EYGA091201RV
41 μm
Heat-resistance
Acrylic adhesive
tape 18 μm
Separating paper
· With high heat resistance and
more insulated tape on both side
· Withstanding Voltage
PI tape : 5 kV
Adhesive tape : 2 kV
150 °C (Polyimide : 180 °C)
90 × 115 mm
115 × 180 mm
EYGA091210KV
148 μm
EYGA091207KV
118 μm
EYGA091205KV
98 μm
EYGA091204KV
88 μm
EYGA091203KV
73 μm
EYGA091202KV
65 μm
EYGA091201KV
58 μm
✽ Please contact us for other lamination type product.
✽✽ Withstanding Voltages are for reference, not guaranteed.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
06
– 29 –
Mar. 2015
“PGS” Graphite Sheets
Minimum order
Item
Type
S type
100 μm
S type
70 μm
PGS Graphite Sheet
Only
S type
50 μm
S type
40 μm
S type
25 μm
A-A type
70 μm
A-A type
25 μm
PGS 70, 25, 17 μm
Adhesive Type
[Standard series]
A-A type
17 μm
A-M type
70 μm
A-M type
25 μm
A-M type
17 μm
A-PA type
70 μm
A-PA type
25 μm
A-PA type
17 μm
PGS 70, 25, 17 μm
Laminated Type
(Insulation & Adhesive)
[Standard series]
A-PM type
70 μm
A-PM type
25 μm
A-PM type
17 μm
A-DM type
70 μm
A-DM type
25 μm
A-DM type
17 μm
Part No.
EYGS091210
EYGS121810
EYGS182310
EYGS091207
EYGS121807
EYGS182307
EYGS091205
EYGS121805
EYGS182305
EYGS091204
EYGS121804
EYGS182304
EYGS091203
EYGS121803
EYGS182303
EYGA091207A
EYGA121807A
EYGA091203A
EYGA121803A
EYGA091202A
EYGA121802A
EYGA091207M
EYGA121807M
EYGA091203M
EYGA121803M
EYGA091202M
EYGA121802M
EYGA091207PA
EYGA121807PA
EYGA091203PA
EYGA121803PA
EYGA091202PA
EYGA121802PA
EYGA091207PM
EYGA121807PM
EYGA091203PM
EYGA121803PM
EYGA091202PM
EYGA121802PM
EYGA091207DM
EYGA121807DM
EYGA091203DM
EYGA121803DM
EYGA091202DM
EYGA121802DM
Size
90×115 mm
115×180 mm
180×230 mm
90×115 mm
115×180 mm
180×230 mm
90×115 mm
115×180 mm
180×230 mm
90×115 mm
115×180 mm
180×230 mm
90×115 mm
115×180 mm
180×230 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
Minimum order
20
10
10
20
10
10
20
10
10
20
10
10
20
10
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
✽ Only S type supports 180×230 mm size.
(PGS thickness of 17 μm, 10μm does not support as single item)
✽✽ PGS of 10 μm, 40 μm, 50 μm type is also possible to be made as lamination type.
✽✽✽ The above-listed part number is sample part number for testing.
✽✽✽✽ Please contact us about your request of custom part number which will be arranged separately.
✽✽✽✽✽ Please contact us if quantity is below Minimum Order Quantity.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
06
– 30 –
Mar. 2015
“PGS” Graphite Sheets
Item
Type
A-V type
70 μm
A-V type
25 μm
A-V type
17 μm
A-RV type
70 μm
PGS 70, 25, 17 μm
[High heat resistance type]
A-RV type
25 μm
A-RV type
17 μm
A-KV type
70 μm
A-KV type
25 μm
A-KV type
17 μm
Part No.
EYGA091207V
EYGA121807V
EYGA091203V
EYGA121803V
EYGA091202V
EYGA121802V
EYGA091207RV
EYGA121807RV
EYGA091203RV
EYGA121803RV
EYGA091202RV
EYGA121802RV
EYGA091207KV
EYGA121807KV
EYGA091203KV
EYGA121803KV
EYGA091202KV
EYGA121802KV
Size
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
90×115 mm
115×180 mm
Minimum order
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
✽ Only S type supports 180×230 mm size.
(PGS thickness of 17 μm, 10μm does not support as single item)
✽✽ PGS of 10 μm, 40 μm, 50 μm type is also possible to be made as lamination type.
✽✽✽ The above-listed part number is sample part number for testing.
✽✽✽✽ Please contact us about your request of custom part number which will be arranged separately.
✽✽✽✽✽ Please contact us if quantity is below Minimum Order Quantity.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
06
– 31 –
Mar. 2015
“PGS” Graphite Sheets
“PGS” (Pyrolytic Graphite Sheet) Heat sink sheet
Handling Precautions
Safety Precautions
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage
to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
PGS (Pyrolytic Graphite Sheet) Heat sink sheet (hereafter referred to as PGS) may result in accidents or trouble
when subjected to severe conditions of electrical, environmental and /or mechanical stress beyond the specified
“Rating” and specified “Conditions” found in the Specifications. Please follow the recommendations in “Safety
Precautions” and “Application Notes”. Contact our engineering staff or the factory with any questions.
1.
1.1
1.2
1.3
1.4
Safety Precautions
The PGS shall be used within the specified operating temperature range.
The PGS is soft, do not rub or touch it with rough materials to avoid scratching it.
Lines or folds in the PGS may affect thermal conductivity.
The PGS shall not be used with acid.
The PGS shall not be used in contact with a soldering iron at 400 °C or more
1.5 The PGS shall not be exposed to salt water or direct sunlight during use. The PGS shall not be used in corrosive
gases (hydrogen sulfide, sulfurous acid, chlorine, ammonia etc.).
1.6 Our PGS has been developed for general industry applications. Prior to using the PGS for special applications
such as medical, work please contact our engineering staff or the factory.
1.7 Never touch a PGS during use because it may be extremely hot.
2. Application notes
2.1 Use protective materials when handling and/or applying the PGS, do not use items with sharp edges as they
might tear or puncture the PGS.
2.2 The PGS does not work properly if overheated.
2.3 Thermal conductivity is dependant on the way it is used.
Test the adaptability of PGS to your application before use.
2.4 The PGS has conductivity.
If required, the PGS should be provided insulation.
2.5 Long term storage
• The PGS shall not be stored under severe conditions of salt water, direct sunlight or corrosive gases (hydrogen
sulfide, sulfurous acid, chlorine, ammonia etc.).
• The PGS shall not be stored near acid.
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01
– 32 –
Jan. 2015
CAUTION AND WARNING
1. The electronic components contained in this catalog are designed and produced for use in home electric appliances, office equipment, information equipment,
communications equipment, and other general purpose electronic devices.
Before use of any of these components for equipment that requires a high degree of safety, such as medical instruments, aerospace equipment, disaster-prevention
equipment, security equipment, vehicles (automobile, train, vessel),
please be sure to contact our sales representative.
2. When applying one of these components for equipment requiring a high degree of safety, no matter what sort of application it might be, be sure to install a protective
circuit or redundancy arrangement to enhance the safety of your equipment. In addition, please carry out the safety test on your own responsibility.
3. When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance.
4. Technical information contained in this catalog is intended to convey examples of typical performances and/or applications and is not intended to make any
warranty with respect to the intellectual property rights or any other related rights of our company or any third parties nor grant any license under such rights.
5. In order to export products in this catalog, the exporter may be subject to the export license requirement under the Foreign Exchange and Foreign Trade Law of
Japan.
6. No ozone-depleting substances (ODSs) under the Montreal Protocol are used in the manufacturing processes of Automotive & Industrial Systems Company, Panasonic
Corporation.
● Please contact
● Factory
Device Solutions Business Division
Automotive & Industrial Systems Company
Panasonic Corporation
1006 Kadoma, Kadoma City, Osaka 571-8506,
JAPAN
The information in this catalog is valid as of June 2015.
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Related manuals

Download PDF

advertisement