DG411

DG411
DG411
RELIABILITY REPORT
FOR
DG411DY+
PLASTIC ENCAPSULATED DEVICES
September 11, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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DG411
Conclusion
The DG411DY+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
Maxim's redesigned DG411/DG412/DG413 analog switches now feature low on-resistance matching between switches (3 max) and guaranteed
on-resistance flatness over the signal range ( 4 max). These low on-resistance switches conduct equally well in either direction. They guarantee low
charge injection, low power consumption, and an ESD tolerance of 2000V minimum per Method 3015.7. The new design offers lower off-leakage
current over temperature (less than 5nA at +85°C). The DG411/DG412/DG413 are quad, single-pole/single-throw (SPST) analog switches. The
DG411 is normally closed (NC), and the DG412 is normally open (NO). The DG413 has two NC switches and two NO switches. Switching times are
less than 150ns max for tON and less than 100ns max for tOFF. These devices operate from a single +10V to +30V supply, or bipolar ±4.5V to ±20V
supplies. Maxim's improved DG411/DG412/DG413 are fabricated with a 44V silicon-gate process.
Maxim Integrated Products. All rights reserved.
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DG411
II. Manufacturing Information
A. Description/Function:
Improved, Quad, SPST Analog Switches
B. Process:
S5
C. Number of Device Transistors:
D. Fabrication Location:
Oregon
E. Assembly Location:
Philippines, Thailand, Malalysia
F. Date of Initial Production:
Pre 1997
III. Packaging Information
A. Package Type:
16-pin SOIC (N)
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Gold (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-0301-0596
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
115°C/W
K. Single Layer Theta Jc:
32°C/W
L. Multi Layer Theta Ja:
82.2°C/W
M. Multi Layer Theta Jc:
32°C/W
IV. Die Information
A. Dimensions:
80 X 97 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
5.0 microns (as drawn)
F. Minimum Metal Spacing:
5.0 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
Maxim Integrated Products. All rights reserved.
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DG411
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 80 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 13.4 x 10-9
= 13.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the S5 Process results in a FIT Rate of 0.09 @ 25C and 1.55 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The AG38 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1000 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
Maxim Integrated Products. All rights reserved.
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DG411
Table 1
Reliability Evaluation Test Results
DG411DY+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing (Note 2)
HAST
Ta = 130°C
RH = 85%
Biased
Time = 96hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
80
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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