EU3 Datasheet
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Avnet Embedded
Specification.
Datasheet
Cinterion
EU3
www.avnet-embedded.eu
3G
M2M Advanced
Wireless Module EU3
Invest today in tomorrow’s wireless connectivity
Dual-Band/
Tri-Band
3G
High-Speed
Serial
Dual-Band 2G
High-Speed
USB
EDGE
Class 10
80 pin B2B
Connector
GPRS
Class 10
10 GPIOs
Full Voice
Support
Extended
Temperature
Range
TCP/IP
Video Call
Support
The Cinterion EU3 UMTS & HSDPA wireless module provides a
smart investment today for the wireless connectivity of the future.
By enabling a full range of M2M functions and features, EU3
protects your current technology investment while allowing
room for growth to the 3G cellular networks of the future.
many years to come. By enabling UMTS functionality on the
900 MHz band, EU3 offers increased coverage area for high
speed communications even in very remote locations. EU3
offers GPRS/EDGE functionality to support portable, mobile
and fixed applications where 3G coverage is not available.
EU3 offers the perfect solution for the challenging long term
requirements of industrial applications such as automatic
meter reading (AMR) solutions. Dual band frequencies
including newly added UMTS900 means EU3 can support
applications designed for use on evolving GSM networks for
Specifically designed for M2M applications, Cinterion’s EU3
offers extremely fast data speeds on serial and USB interfaces for quick and easy data transfer. The 10 GPIO (general
purpose input/output) pins guarantee the highest possible flexibility to connect customer application sensors.
www.cinterion.com
Wireless Module EU3
Invest today in tomorrow’s
wireless connectivity
General features
▪ Dual-Band UMTS: 900 / 2100 MHz (EU3-E)
▪ Tri-Band UMTS: 850 / 900 / 2100 MHz (EU3-P)
▪ Dual-Band GSM: 900 / 1800 MHz
▪ UMTS 3GPP release 5
▪ GSM release 99 / release 4
▪ EDGE (E-GPRS) multi-slot class 10
▪ GPRS multi-slot class 10
▪ Output power:
▫ Class 4 (2 W) for GSM900
▫ Class 1 (1 W) for GSM1800
▫ Class E2 (0.5 W) for EDGE900
▫ Class E2 (0.4 W) for EDGE1800
▫ Class 3 (0.25 W) for UMTS
▪ SIM Application Toolkit, release 99
▪ Control via AT commands (Hayes, 3GPP TS
27.007 and 27.005)
▪ TCP/IP stack access via AT commands
▪ Supply voltage range 3.3 - 4.2 V
▪ Power consumption:
▫ Sleep @ GSM Mode: typical < 2.2 mA
▫ Sleep @ UMTS Mode: typical < 2.0 mA
▪ Dimensions 33.9 x 44.6 x 5.0 mm
▪ Operational temperature range: -40°C to +85°C
▪ RoHS compliant
▪ Weight approx. 11g
Specifications
▪ HSDPA data rates:
DL: max. 3.6 Mbps, UL: max: 384 kbps
▪ UMTS data rates:
DL: max. 384 kbps, UL: max. 384 kbps
▪ EDGE class 10:
DL: max. 237 kbps, UL: max. 118 kbps
▪ GPRS class 10:
DL: max. 85.6 kbps, UL: max. 42.8 kbps
▪ Full PBCCH support
▪ CSD data transmission 14.4 kbps, V.110
▪ USSD support
▪ SMS text and PDU mode
▪ Fax Group 3, class 1
▪ Support of video calls
▪ Voice support:
speech codec HR, FR, EFR and AMR
▪ Handset, Headset and Handsfree modes
Special features
▪ Multiplex driver according 3GPP 27.010 for
Microsoft® Windows XP™, Windows Vista™
and Windows 7™
▪ Customer IMEI on request
▪ Prepared for Component SIM
33.9 mm
44.6 mm
Interfaces
▪ U.FL-R-SMT 50 Ω antenna connector
▪ 80-pin board-to-board connector
▫ Power supply
▫ Audio: analog
▫ High speed serial interface (up to 460 kbps)
▫ USB 2.0 high speed interface (up to 480 Mbps)
▫ UICC/SIM card interface 3V, 1.8V
▫ 10 GPIO pins
▫ ADC port
Approvals
▪ R&TTE, GCF, CE
▪ Local approvals and network operator
certifications
For detailed specification please see Hardware
Interface Description.
UMTS900
The 3G connectivity with high-speed data rates at 900 MHz band for future proof
applications in refarmed networks.
USB & Serial High Speed
The highest data speed — up to 480 Mbps (USB) and up to 460 kbps (serial) — for
M2M applications requiring quick data transmissions. For easy handling and efficient
usage, USB and Serial interface can be operated simultaneously.
GPIO
The most flexible interface for customer applications and their input and output lines
providing easy set up and usage via AT commands.
Cinterion Global Support
Local engineers, a competent helpdesk, a dedicated team of R&D specialists and
an advanced development center are the hallmarks of our leading support offer.
The Cinterion support includes:
▪ Personal design-in consulting for hardware and software
▪ Extensive RF test capabilities
▪ GCF/PTCRB conform pretests to validate approval readiness
▪ Guidelines for local approvals and acceptances
▪ Regular training workshops
Cinterion Wireless Modules
St-Martin-Str. 53
81669 Munich, Germany
Further information about our products and services is also accessible via www.cinterion.com
The information provided in this brochure contains merely general descriptions or characteristics of performance, which in
case of actual use do not always apply as described or which may change as a result of further development of the products.
An obligation to provide the respective characteristics shall only exist if expressly agreed in the terms of contract. All product
designations may be trademarks or product names of Cinterion or supplier companies whose use by third parties for their own
purposes could violate the rights of the owners. Java and the Java logo are registered trademarks of Sun Microsystems, Inc.
in the United States and other countries. ARM9 is a registered trademark of ARM Limited.
© Copyright 2010, Cinterion • Subject to changes in technology, design and availability • Order No: L30960Y1000A222 • Printed in Germany
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06/2010
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