ISI Company Overview Apr 2012 LRT

ISI Company Overview Apr 2012 LRT
Company
CompanyOverview
Overview
February, 2012
September, 2010
Copyright ©2009 ISI Nallatech
Company History – Continuously Adding Capabilities
Ranked 58 on Inc.
Magazines list of
fastest growing
privately held
companies
Interconnect Systems, Inc. founded
to supply high pin count PPGAs
Designed and
manufactured
557 I/O PPGA
For 48 Watt
GaAs die.
1988
1992
Strengthened FPGA
products & engineering
resources by acquiring
Innovative Integrations, a leading supplier of data
acquisition and signal processing solutions.
C design
Added connector
resources, tool room,
molding & equipment
automation capabilities.
1993
1997
Awarded patent for surface
mounting pins to a substrate
Selected to build
PowerPC modules
for Apple G3 computers.
• Ramped production to 10K units/day
in a four month period.
• Manufactured over four million modules
during the program life.
2000
2001
ISI
2005
HiLo™ Flexible Interconnect
System introduced
Designed and
manufactured
FSB – FPGA
Acceleration
Modules
2007
2008
2009
2010
Developed first
Near Sensor
Computing
product
Begin in-house bare die
assembly and add flex circuit
assembly capabilities
Entered FPGA accelerated computing &
European markets by acquiring Nallatech Ltd.
Received ISO 9001
Certification
Copyright © 2012 Interconnect Systems Inc.
Significantly increased 3D and stacked die
packaging capabilities
2
ISI
Company Overview
200 Full-Time Employees, Including 70 Degreed Engineers and 9 Technicians
Business Unit
Location
Functions
ISI
Camarillo, CA
Multi-Component Modules,
Bare Die Packaging,
Electronic Connectors
Headquarters, Engineering, Manufacturing,
Sales and Marketing
Duarte, CA
Molded connector manufacturing, production
automation, machine shop
ISI - Nallatech
Camarillo, CA
Engineering & Manufacturing
Near Sensor Processing &
Miniature FPGA systems
Eldersburg, MD
Sales, Customer Support
Nallatech Ltd.
Cumbernauld, UK
European Headquarters, Engineering, Marketing
FPGA solutions, primary
markets Mil/Aero & FPGA
Accelerated Computing
Bristol, UK
Engineering center
Innovative Integration
Simi Valley, CA
Engineering, Sales & Marketing, Customer
Support
FPGA solutions, primary
markets Instrumentation &
Communications
ISO9001:2008 certified by
Perry Johnson Registrars
• IPC Class III compliant soldering.
• Certified IPC Specialist inspectors
and key operators.
• In-house Certified IPC Trainer.
Copyright © 2012 Interconnect Systems Inc.
ITAR registered North
American facilities
3
ISI
Range of Solutions
FPGA Computing Systems
•
•
•
•
Near sensor processing
Miniaturized solutions
COTS processor boards
Complete Development
• System design
• Hardware / Firmware
• Software / IP
3D & Miniaturized Modules
•
•
•
•
Stacked-die & multichip
High-density memory
Rugged, overmolded
Bare and/or packaged ICs
Connectors & IC Adapters
•
•
•
•
Large array connectors
Custom mini connectors
Adapters & interposers
BGA reballing & anti-RoHS
Copyright © 2012 Interconnect Systems Inc.
4
ISI
ISI Customers
ISI’s Broad Range of Customers Include:
Copyright © 2012 Interconnect Systems Inc.
5
ISI
Next Level Integration
Next Level Integration blends high density packaging with advanced
interconnect technologies to quickly deliver optimized modular solutions.
This multi-discipline approach improves performance, reduces size
and cost, and accelerates time to market.
Co-Development
Multi-Discipline Manufacturing
Our design teams possess the in-depth technical knowledge needed to
deliver innovative solutions based on a systems level understanding of
our customers’ requirements.
Copyright © 2012 Interconnect Systems Inc.
ISI’s extensive array of high volume
manufacturing equipment enables cost
effective, expedited production ramps.
6
ISI
Integrated Design
PCB Design
Substrate (bare die) and PCB
design
- High speed, high density
analog & digital
- Leading edge design rules
- Broad PCB and substrate
supply base
Advanced Interconnect
Design
- Low-cost, custom
interconnect solutions
- Very high pin count
(2400 pin +)
- Very high speed
(10Gbps +)
- High reliability
Miniaturized Module
Design
FPGA Systems Design
 - High Density Memory
Packaging
FPGA sensor processing &
embedded computing
solutions
 - 3D / Stacked Packages
 - Ruggedized module
overmolding
 - Optical Die Packaging
- Hardware
- Firmware
- Software
www.isipkg.com
Copyright © 2012 Interconnect Systems Inc.
8
ISI
Integrated Manufacturing
Advanced SMT
State-of-the-art high speed
SMT assembly lines
- Screen print w / AOI
- Very high accuracy
placement equipment
- Precision dispense equipment
Partial Equipment List
Description
Ekra X4 (2)
Precision stencil printers w/ 2.5D paste inspection
Samsung SM421 (2)
SMT placement machine, capable of placing 01005
passives and 55mm body size, 0.4mm pitch BGAs.
30 µm placement accuracy at Cpk 1.0
Fuji NXT-II 4M
Modular SMT chipshooter, 45,000 component
placements/hour, 30 µm placement accuracy
Fuji QP-351E-MM
High speed pick & place
Fuji CP732
Chip shooter, up to 52K components per hour
Heller 1800EXL & 1809W
10-zone & 8-zone convection reflow ovens
Aqueous Trident Duo
Two-chambered automatic de-fluxing and residue
cleaning system with integrated cleanliness testing
Asymtek
Underfill and epoxy dispensing systems
Novastar
Wave soldering system
Aqueous SW-ECO
Ultrasonic stencil cleaning system
Pace TF2000
BGA/CSP rework station
Totech
Dry storage cabinet
Accutape QMT 1100D
Tape and reel placement machine
Copyright © 2012 Interconnect Systems Inc.
9
ISI
Integrated Manufacturing
Bare Die Packaging
Multi-die and stacked-die assembly
capabilities:
- Die attach and wirebond
- Flip chip and underfill
- Transfer overmold/underfill
of multi-component modules
Partial Equipment List
Description
Clean Room
Class 10,000 with on-demand Class 1,000
capabilities
Datacon 2200EVO
Twin-head, multi-chip, die bonder / flip-chip
placement system. Two machines in one:
A separate dispensing area with integrated
dispenser and a bonding area for die attach and flip
chip. 7,000 UPH with 10µm accuracy at 3σ
Die size 0.17mm to 50mm. 300mm wafer handler.
H&K Wedgebonder BJ815
Gold and aluminum wedge, area array, and deep
reach bonder. 40µm pitch, 3µm positioning at 3σ
12.3” x 7” work area. Extremely short 75µm loops
Kulicke & Soffa 8028PPS
Gold-ball wire bonder, 45 µm in-line pitch; 25 µm
interstitial
Kulicke & Soffa 1484XQ Turbo
Three automated gold-ball wire bonders
Sikama Falcon 1200
Conduction /convection reflow oven
Kulicke & Soffa Model 980
Precision 8-inch wafer dicing system
Fico B100
Automated transfer overmold / underfill machine
Fico MMS-12-M
Large-area transfer overmold / underfill machine
Advanced Plasma Systems B-6
Plasma cleaning system
YES Technologies
Plasma cleaning system
Copyright © 2012 Interconnect Systems Inc.
10
ISI
Integrated Manufacturing
Connector Manufacturing
- In-house tool room and
mold making
- Laminate and molded
plastic insulators
- Injection and insert molding
- Automated contact insertion
- Automated BGA ball attach
Partial Equipment List
Description
ESI QSM
(2) high-speed, four-spindle, precision drilling machines
Dynamotion PMC-550
Six-spindle, high speed drilling machine
Excellon Uniline 2000
Single-spindle, high-speed driller/router
Precision PCB 101CM
(2) precision routers
Excellon 105DP
(2) precision routers
ISI
(7) automated contact insertion machines
Schmidt Technology
(2) 40-ton presses
Grieve
(4) high-temperature ovens
Fico B100
Automated transfer molding machine
Fico MMS-12-M
Large-area transfer molding machine
Aurburg
(10) 40-ton molding machines
Autojector
(4) 40-ton, horizontal injection, rotary-table molding machines
Bruderer
(2) 30-ton, 3-post, stamping presses
Adapt
(4) semi-automatic pin loaders
Fully-equipped
machine shop
(3) Mitsubishi precision wire EDMs (FA10 advanced & FX10)
Mitsubishi ED2000-M drill (hole popper),
HAAS VF-0 CNC vertical mill, Chevalier FSG 818S
automatic surface grinder, (3) Bridgeport vertical milling
machines, (5) 6” X 18” surface grinders, and a 12” X 40” lathe
Copyright © 2012 Interconnect Systems Inc.
11
ISI
Integrated Manufacturing
Inspection, Test, & Marking
- X-Ray solder joint inspection
- Boundary Scan / JTAG
- Functional testing
- Signal Integrity testing
- Automated optical inspection
- Temp cycling/reliability
Partial Equipment List
Description
Nikon VMR 3020
Four automated laser and optical inspection systems
Scienscope X-Scope 1800
X-ray inspection system, 70º tilt, five micron focal spot
Nikon Profile Projector V12
2D contour measurement system
RVSI LS-6000
IC package automated optical inspection system
Fisherscope XDAL
X-ray spectrometer
Niton XRF
X-ray fluorescence analyzer
XYZTEC Condor 70-3
Multifunction bond pull / bond shear / ball shear tester
SCS Instruments
Ionic contamination testing instrument
SMT Tools BGA-100
BGA optical inspection scope
Espec TSE-11-A
Two-zone environmental chamber, -65 to 200ºC
Agilent Infinium DCA-J
Three wideband oscilloscope mainframes with TDR
modules
Agilent E5071B
8.5 GHz network analyzer
Corelis
JTAG boundary scan system & software
JTAG Technologies
JTAG boundary scan system & software
Trotec Laser
Laser marking system
A comprehensive range of
electronics test equipment
Precision oscilloscopes, function generators, source
meters, and power supplies.
Copyright © 2012 Interconnect Systems Inc.
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ISI
Integrated Manufacturing
Configurable Manufacturing Capabilities
Optimized for Multi-Up Module Assembly
10,000
μP modules
per day
mold carrier
pin load
screen print
place components
reflow
5,000
IC packages
per day
dice wafer
die attach
wirebond
overmold
ball attach
400,000
HiLo contacts
per shift
drill organic layers
Laminate layers
Insert contacts
precision route
Copyright © 2012 Interconnect Systems Inc.
optical inpsection
13
ISI
ISI Customers
Sales by Market:
14%
38%
13%
Homeland Security
Mil / Aero
5%
Telcom / Network / Wireless
Medical
12%
Industrial / Broadcast
18%
Copyright © 2012 Interconnect Systems Inc.
Computing / Embedded HPC
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High Performance FPGA Computing
ISI
ISI’s subsidiary companies, Nallatech and Innovative Integration, are leaders in high
performance FPGA-based embedded computing solutions.
Products include:





Rugged Embedded VME & XMC solutions
PCIe, PCI-X and PCI-based solutions
Intel® in-socket FPGA accelerators
Full suite of firmware and software to help implement FPGA computing solutions
Custom server-based systems solutions
Copyright © 2012 Interconnect Systems Inc.
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ISI
High Performance FPGA Computing
Signal Intelligence
»
»
»
»
Data acquisition and
transmission
Sophisticated ADC and
DAC front end
Usually real time data
processing
Host bandwidth and
latency important
Network Processing
»
»
»
»
»
Monitoring, Interception
and Searching of
internet/network traffic
Ethernet (1GbE &
10GbE)
Mostly real time data
processing
Host bandwidth and
latency critical
Rapid deployment of
new technologies
Copyright © 2012 Interconnect Systems Inc.
Accelerated Computing
»
»
»
»
FPGA co-processing
FPGA/Memory
architecture important
Mostly streaming
applications that do not
require real time data
processing
Platform CPU/FPGA
density extremely
important
FPGA Computing Appliances
FPGA Computing Appliances




Hybrid HPC computing solutions
FPGA cards + software + firmware + server + support + warranty services
 Large HPC customers want complete solution, not do-it-yourself
Nallatech cards approved by leading server providers
 IBM Spore Qualified
 HP Accelerator Group
Significant program wins in 2010 and 2011
Copyright © 2012 Interconnect Systems Inc.
ISI
ISI
Emerging Market: Near Sensor Processing
By utilizing ISI’s packaging capabilities and FPGA system design capabilities,
customers can quickly develop and deploy miniaturized FPGA solutions.
Step 1: Rapid Prototype
Start with a COTS FPGA solution codevelopment now with Nallatech’s
broad range of hardware, firmware,
and software.
Step 2: Optimize Design
Collaborate with ISI to increase
performance and reliability while
reducing component count, power
consumption, and cost.
Step 3: Optimize Packaging
Leverage ISI’s expertise in 3D, bare
die, stacked-die modules, and custom
interconnect to miniaturize as needed.
Step 4: Ruggedize
ISI’s unique transfer molding process
overmolds/underfills all components in
one molding cycle, significantly improving
reliability in harsh environments
Step 5: Deploy
Copyright © 2012 Interconnect Systems Inc.
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ISI
Emerging Market: Near Sensor Processing
Current Example
Near-Sensor Processing
 Customer: Tier 1 Defense Prime
 1” Cube Image Sensor/Pre-processor
 Functionality includes sensor conditioning and basic NSP
 I/O capabilities support higher-level, external processing
 Prototypes shipped April 2011
 Next generation design already in progress
Customer Content
Nallatech Content
Camerlink
connectors
Sensor
Array
25 mm ~ 1” cube
Copyright © 2012 Interconnect Systems Inc.
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ISI
High-Density Module Examples
Multi-Die Packaging
Near Sensor Processing (NSP) Modules
- 11 die
- 2 microBGAs
- Multiple passives
- Laminate substrate
- Embeds FPGA and/or CPU within sensor
- Improves SWAP
- Leverages all of ISI‟s key strengths
-System design
- FPGA design
- Interconnect technology
- Miniaturization
- Manufacturing
Reduce circuit size by 80%+
3D Stacked Die Module
„Future-proof‟ Flash Memory Module
- 4 stacks of 2 die each allowed
all ADC devices to be placed
within footprint of 18x18 pixel
crystal sensor
- Multiple flash ICs + identity PROM
- Custom 3D interconnect
-Rugged overmold/underfill available
-Custom connector provide
precision alignment and
„tiling‟ of multiple modules
- Customer-defined “standard” footprint
Utilize new memory in form/fit/function module
to eliminate future IC obsolescense issues
Reduces sensor footprint with 3D die stacking
Simplifies mfg with self-aligning assembly
Copyright © 2012 Interconnect Systems Inc.
20
ISI
High-Density Memory Solutions
Flash Stack – Two High
Flash Stack – Four High
- 2 TSOP 48 devices
- 4 TSOP 48 devices
- Doubles density in same footprint
- Quadruples density in same footprint
Lowers cost with 2 stacked lower density devices
BGA Package in Package (PiP)
and Package on Package (PoP)
PoP
PiP with
embedded BGA
Doubles SDRAM density in
same PCB footprint
Upgrades memory density 4X in the same footprint
Five-Chip Memory Module
Bumped substrate is wire-bonded to
memory die to make CSP building block
The bottom side of module
has BGA spheres for assembly
to the board.
Three CSP building blocks
are embedded in the base.
The top substrate has BGA pads allowing for
placement of two additional packaged memories.
Customized memory solutions using die and/or packaged devices
Copyright © 2012 Interconnect Systems Inc.
21
ISI
High-Density Memory Solutions
Physical Packaging
Design Detail
4 Memories on topside of module
cross-section
4 memories on
bottom of top board
1 memories + register + misc
on top of bottom board
Thermal solution can be
added to center of
module if required
Void-free overmold /
underfill between
module substrates
Pinout is modified for each module to
directly couple to Host memory pins
Entire bottom surface available for BGA
or HiLo interconnect to system PCB
HiLo option allows for modules to be
placed over and above any decoupling
capacitors placed on main PCB
(provides 3mm+ spacing)
Bottom Side - BGA version
Copyright © 2012 Interconnect Systems Inc.
Bottom Side - HiLo socketed version
22
ISI
High-Density Memory Solutions
(4) banks of 4GB DDR3 directly coupled to the host FPGA
•
Each bank is directly pin-mapped to the DDR3 pins in a quadrant of the FPGA
•
4 modules provide a total of 16GB directly-coupled DDR3
•
All DDR3 routing was eliminated from the system board; through hole vias connect the
FPGA to the memory module
•
Our customer eliminated 14 layers from their system PCB by using this approach
vs. routing to standard DIMMs
Top View
System PCB - Side View
Bottom View
45mm
FPGA
or
ASIC
Bank 1
4GB
Bank 2
4GB
Bank 3
4GB
Bank 4
4GB
45mm
Copyright © 2012 Interconnect Systems Inc.
23
ISI
High-Performance Interconnect
HiLoTM Socketing System
Custom Connectors
In-house state-of-the-art mold/tooling fabrication shop
Quick-turn capability
Low NREs
2400+ Count I/O
Mixed Pitch
Socket your BGA device, or an entire module
Optimized for your application
Custom Board-to-board Interconnect
High-Speed Board-to-Board
Molded Housing
7 flex circuits
Pinfield
Socket
141 Position HiLo Pinfield
Mated Set
72 Male Contacts
Any pattern, any shape. Pin pitch to 0.8mm
72 Female Contacts
10 Shields
Extreme high density multi-board interconnect
Copyright © 2012 Interconnect Systems Inc.
24
ISI
Obsolescence / RoHS
Footprint Conversion Adapters (Interposers / Adapters)
Multi micro leadframe to BGA
QFP to PGA
Multi BGA to BGA
TSOP to SOJ
BGA to QFP
TSOP to DIP
BGA to BGA
Interposers can include voltage regulators and/or level shifters to accommodate different
supply voltages and I/O standards
Replaces EOL devices without expensive board re-spins
RoHS / Lead-Free Solutions
Reballing – Pb-Free to Leaded
BGA Interposers
Low-cost, high-volume process for re-balling
Simple PCB to adapt ROHS device to non-ROHS process
Copyright © 2012 Interconnect Systems Inc.
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