TJF1051T/3

TJF1051T/3
TJF1051
High-speed CAN transceiver
Rev. 01 — 10 August 2010
Product data sheet
1. General description
The TJF1051 is a high-speed CAN transceiver that provides an interface between a
Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.
The transceiver is designed for high-speed (up to 1 Mbit/s) CAN industrial applications,
providing differential transmit and receive capability to (a microcontroller with) a CAN
protocol controller.
The TJF1051 is a step up from the TJA1050 high-speed CAN transceiver. It offers
improved ElectroMagnetic Compatibility (EMC) and ElectroStatic Discharge (ESD)
performance, and also features ideal passive behavior to the CAN bus when the supply
voltage is off.
The TJF1051 can be interfaced directly to microcontrollers with supply voltages from
3 V to 5 V
These features make the TJF1051 an excellent choice for all types of HS-CAN networks,
in nodes that do not require a standby mode with wake-up capability via the bus.
2. Features and benefits
2.1 General
„ Fully ISO 11898-2 compliant
„ Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
„ VIO input allows for direct interfacing with 3 V to 5 V microcontrollers
2.2 Low-power management
„ Functional behavior predictable under all supply conditions
„ Transceiver disengages from the bus when not powered up (zero load)
2.3 Protection
„
„
„
„
High ESD handling capability on the bus pins
Transmit Data (TXD) dominant time-out function
Undervoltage detection on pins VCC and VIO
Thermally protected
TJF1051
NXP Semiconductors
High-speed CAN transceiver
3. Ordering information
Table 1.
Ordering information
Type number
TJF1051T/3
Package
Name
Description
Version
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
4. Block diagram
VIO
VCC
5
3
VCC
TJF1051
TEMPERATURE
PROTECTION
7
VIO
TXD
S
RXD
1
TIME-OUT
8
MODE
CONTROL
4
SLOPE
CONTROL
AND
DRIVER
6
CANH
CANL
DRIVER
2
GND
Fig 1.
TJF1051
Product data sheet
015aaa099
Block diagram
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Rev. 01 — 10 August 2010
© NXP B.V. 2010. All rights reserved.
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TJF1051
NXP Semiconductors
High-speed CAN transceiver
5. Pinning information
5.1 Pinning
TJF1051T/3
TXD
1
8
S
GND
2
7
CANH
VCC
3
6
CANL
RXD
4
5
VIO
015aaa100
Fig 2.
Pin configuration diagram
5.2 Pin description
TJF1051
Product data sheet
Table 2.
Pin description
Symbol
Pin
Description
TXD
1
transmit data input
GND
2
ground supply
VCC
3
supply voltage
RXD
4
receive data output; reads out data from the bus lines
VIO
5
supply voltage for I/O level adapter
CANL
6
LOW-level CAN bus line
CANH
7
HIGH-level CAN bus line
S
8
Silent mode control input
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Rev. 01 — 10 August 2010
© NXP B.V. 2010. All rights reserved.
3 of 16
TJF1051
NXP Semiconductors
High-speed CAN transceiver
6. Functional description
The TJF1051 is a stand-alone high-speed CAN transceiver with Silent mode. It combines
the functionality of the TJA1050 transceiver with improved EMC and ESD handling
capability. Improved slope control and high DC handling capability on the bus pins
provides additional application flexibility.
6.1 Operating modes
The TJF1051 supports two operating modes, Normal and Silent, which are selectable via
pin S. See Table 3 for a description of the operating modes under normal supply
conditions.
Table 3.
Operating modes
Mode
Inputs
Normal
Silent
Outputs
Pin S
Pin TXD
CAN driver
Pin RXD
LOW
LOW
dominant
active[1]
LOW
HIGH
recessive
active[1]
HIGH
X[2]
recessive
active[1]
[1]
LOW if the CAN bus is dominant, HIGH if the CAN bus is recessive.
[2]
X = don't care.
6.1.1 Normal mode
A LOW level on pin S selects Normal mode. In this mode, the transceiver is able to
transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block
diagram). The differential receiver converts the analog data on the bus lines into digital
data which is output to pin RXD. The slope of the output signals on the bus lines is
controlled and optimized in a way that guarantees the lowest possible EME levels.
6.1.2 Silent mode
A HIGH level on pin S selects Silent mode. In Silent mode the transmitter is disabled,
releasing the bus pins to recessive state. All other IC functions, including the receiver,
continue to operate as in Normal mode. Silent mode can be used to prevent a faulty CAN
controller from disrupting all network communications.
6.2 Fail-safe features
6.2.1 TXD dominant time-out function
A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on
pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus
lines to recessive state. This function prevents a hardware and/or software application
failure from driving the bus lines to a permanent dominant state (blocking all network
communications). The TXD dominant time-out timer is reset when pin TXD is set HIGH.
The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s.
6.2.2 Internal biasing of TXD and S input pins
Pin TXD has an internal pull-up to VIO and pin S has an internal pull-down to GND. This
ensures a safe, defined state in case one or both of these pins are left floating.
TJF1051
Product data sheet
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Rev. 01 — 10 August 2010
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TJF1051
NXP Semiconductors
High-speed CAN transceiver
6.2.3 Undervoltage detection on pins VCC and VIO
Should VCC or VIO drop below their respective undervoltage detection levels (Vuvd(VCC)
and Vuvd (VIO); see Table 6), the transceiver will switch off and disengage from the bus
(zero load) until VCC and VIO have recovered.
6.2.4 Overtemperature protection
The output drivers are protected against overtemperature conditions. If the virtual junction
temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be
disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes
recessive again. Including the TXD condition ensures that output driver oscillations due to
temperature drift are avoided.
6.3 VIO supply pin
Pin VIO should be connected to the microcontroller supply voltage (see Figure 3). This
adjusts the signal levels on pins TXD, RXD and S to the I/O levels of the microcontroller.
7. Application design-in information
BAT
3V
5V
VCC
CANH
VIO
VDD
CANH
S
TJF1051
TXD
RXD
CANL
CANL
Pyy
TX0
MICROCONTROLLER
RX0
GND
GND
Fig 3.
015aaa101
Typical application of the TJF1051
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol Parameter
Conditions
Vx
no time limit; DC value
voltage on pin x
TJF1051
Product data sheet
Min
Max
Unit
on pins CANH and CANL
−58
+58
V
on any other pin
−0.3
+7
V
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TJF1051
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High-speed CAN transceiver
Table 4.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol Parameter
VESD
Conditions
electrostatic discharge voltage
HBM
pins CANH and CANL
any other pin
any pin
ambient temperature
[1]
Human Body Model (HBM): 100 pF, 1.5 kΩ.
[2]
Machine Model (MM): 200 pF, 0.75 μH, 10 Ω.
Max
Unit
−8
+8
kV
−4
+4
kV
−300
+300
V
−40
+85
°C
[2]
MM
Tamb
Min
[1]
9. Thermal characteristics
Table 5.
Thermal characteristics
According to IEC 60747-1.
Symbol
Parameter
Conditions
Value
Unit
Rth(vj-a)
thermal resistance from virtual junction to ambient
in free air
155
K/W
10. Static characteristics
Table 6.
Static characteristics
Tamb = −40 °C to +85 °C; VCC = 4.5 V to 5.5 V; RL = 60 Ω; unless otherwise specified; all voltages are defined with respect to
ground; positive currents flow into the IC.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
4.5
-
5.5
V
0.1
1
2.5
mA
recessive
2.5
5
10
mA
dominant; VTXD = 0 V
20
50
70
mA
3.5
-
4.5
V
2.8
-
5.5
V
recessive; VTXD = VIO
10
80
250
μA
dominant; VTXD = 0 V
50
350
500
μA
1.3
-
2.7
V
Supply; pin VCC
VCC
supply voltage
ICC
supply current
Silent mode
Normal mode
Vuvd(VCC)
undervoltage detection voltage
on pin VCC
I/O level adapter supply; pin VIO
VIO
supply voltage on pin VIO
IIO
supply current on pin VIO
Vuvd(VIO)
Normal and Silent modes
undervoltage detection voltage
on pin VIO
Mode control input; pin S
VIH
HIGH-level input voltage
0.7VCC
-
VCC + 0.3 V
VIL
LOW-level input voltage
−0.3
-
0.3VCC
IIH
HIGH-level input current
1
4
10
μA
IIL
LOW-level input current
−1
0
+1
μA
TJF1051
Product data sheet
VS = 0 V
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Rev. 01 — 10 August 2010
V
© NXP B.V. 2010. All rights reserved.
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NXP Semiconductors
High-speed CAN transceiver
Table 6.
Static characteristics …continued
Tamb = −40 °C to +85 °C; VCC = 4.5 V to 5.5 V; RL = 60 Ω; unless otherwise specified; all voltages are defined with respect to
ground; positive currents flow into the IC.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
CAN transmit data input; pin TXD
VIH
HIGH-level input voltage
0.7VCC
-
VCC + 0.3 V
VIL
LOW-level input voltage
−0.3
-
0.3VCC
V
IIH
HIGH-level input current
VTXD = VCC
−5
0
+5
μA
IIL
LOW-level input current
Normal mode; VTXD = 0 V
−260
−150
−30
μA
Ci
input capacitance
-
5
10
pF
CAN receive data output; pin RXD
IOH
HIGH-level output current
VRXD = VCC − 0.4 V
−8
−3
−1
mA
IOL
LOW-level output current
VRXD = 0.4 V; bus dominant
2
5
12
mA
pin CANH
2.75
3.5
4.5
V
pin CANL
0.5
1.5
2.25
V
Vdom(TX)sym = VCC − VCANH − VCANL
−400
0
+400
mV
VTXD = 0 V; t < tto(dom)TXD
1.5
-
3
V
VTXD = VIO; recessive; no load
−50
-
+50
mV
Bus lines; pins CANH and CANL
VO(dom)
dominant output voltage
VTXD = 0 V; t < tto(dom)TXD
Vdom(TX)sym transmitter dominant voltage
symmetry
VO(dif)bus
bus differential output voltage
VO(rec)
recessive output voltage
Normal and Silent modes;
VTXD = VIO; no load
2
0.5VCC 3
V
Vth(RX)dif
differential receiver threshold
voltage
Normal and Silent modes
Vcm(CAN)[1] = −12 V to +12 V
0.5
0.7
0.9
V
Vhys(RX)dif
differential receiver hysteresis
voltage
Normal and Silent modes
Vcm(CAN) = −12 V to +12 V
50
120
400
mV
IO(dom)
dominant output current
VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V
pin CANH; VCANH = 0 V
−120
−70
−40
mA
pin CANL; VCANL = 5 V/40 V
40
70
120
mA
IO(rec)
recessive output current
Normal and Silent modes;
VTXD = VCC;
VCANH = VCANL = −27 V to +32 V
−5
-
+5
mA
VCC = 0 V; VCANH = VCANL = 5 V
−5
0
+5
μA
9
15
28
kΩ
−3
0
+3
%
IL
leakage current
Ri
input resistance
ΔRi
input resistance deviation
Ri(dif)
differential input resistance
19
30
52
kΩ
Ci(cm)
common-mode input
capacitance
-
-
20
pF
Ci(dif)
differential input capacitance
-
-
10
pF
-
190
-
°C
between VCANH and VCANL
Temperature protection
Tj(sd)
[1]
shutdown junction temperature
Vcm(CAN) is the common mode voltage of CANH and CANL.
TJF1051
Product data sheet
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Rev. 01 — 10 August 2010
© NXP B.V. 2010. All rights reserved.
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TJF1051
NXP Semiconductors
High-speed CAN transceiver
11. Dynamic characteristics
Table 7.
Dynamic characteristics
Tamb = −40 °C to +85 °C; VCC = 4.5 V to 5.5 V; RL = 60 Ω unless specified otherwise. All voltages are defined with respect to
ground. Positive currents flow into the IC.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 4 and Figure 5
td(TXD-busdom)
delay time from TXD to bus dominant
Normal mode
-
65
-
ns
td(TXD-busrec)
delay time from TXD to bus recessive
Normal mode
-
90
-
ns
td(busdom-RXD) delay time from bus dominant to RXD
Normal and Silent modes
-
60
-
ns
td(busrec-RXD)
delay time from bus recessive to RXD
Normal and Silent modes
-
65
-
ns
tPD(TXD-RXD)
propagation delay from TXD to RXD
2.8 V < VIO < 4.5 V
Normal mode
40
-
250
ns
4.5 V > VCC = VIO < 5.5 V
Normal mode
40
-
220
ns
VTXD = 0 V; Normal mode
0.3
1
12
ms
tto(dom)TXD
TXD dominant time-out time
+5 V
47 μF
100 nF
VIO
VCC
CANH
TXD
TJF1051
RXD
GND
RL
100 pF
CANL
S
15 pF
015aaa103
Fig 4.
TJF1051
Product data sheet
Timing test circuit for CAN transceiver
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TJF1051
NXP Semiconductors
High-speed CAN transceiver
HIGH
TXD
LOW
CANH
CANL
dominant
0.9 V
VO(dif)(bus)
0.5 V
recessive
HIGH
0.7VIO
RXD
0.3VIO
LOW
td(TXD-busrec)
td(TXD-busdom)
td(busrec-RXD)
td(busdom-RXD)
tPD(TXD-RXD)
Fig 5.
TJF1051
Product data sheet
tPD(TXD-RXD)
015aaa025
CAN transceiver timing diagram
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TJF1051
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High-speed CAN transceiver
12. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
4
1
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
inches
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
o
8
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Fig 6.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Package outline SOT96-1 (SO8)
TJF1051
Product data sheet
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Rev. 01 — 10 August 2010
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TJF1051
NXP Semiconductors
High-speed CAN transceiver
13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
TJF1051
Product data sheet
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Rev. 01 — 10 August 2010
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TJF1051
NXP Semiconductors
High-speed CAN transceiver
13.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 7) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Table 8.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 9.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 7.
TJF1051
Product data sheet
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Rev. 01 — 10 August 2010
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TJF1051
NXP Semiconductors
High-speed CAN transceiver
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 7.
Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
14. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TJF1051 v.1
20100810
Product data sheet
-
-
TJF1051
Product data sheet
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High-speed CAN transceiver
15. Legal information
16. Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TJF1051
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. The product is not designed, authorized or warranted to be
suitable for use in medical, military, aircraft, space or life support equipment,
nor in applications where failure or malfunction of an NXP Semiconductors
product can reasonably be expected to result in personal injury, death or
severe property or environmental damage. NXP Semiconductors accepts no
liability for inclusion and/or use of NXP Semiconductors products in such
equipment or applications and therefore such inclusion and/or use is at the
customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 10 August 2010
© NXP B.V. 2010. All rights reserved.
14 of 16
TJF1051
NXP Semiconductors
High-speed CAN transceiver
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
16.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TJF1051
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 10 August 2010
© NXP B.V. 2010. All rights reserved.
15 of 16
TJF1051
NXP Semiconductors
High-speed CAN transceiver
18. Contents
1
2
2.1
2.2
2.3
3
4
5
5.1
5.2
6
6.1
6.1.1
6.1.2
6.2
6.2.1
6.2.2
6.2.3
6.2.4
6.3
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Low-power management . . . . . . . . . . . . . . . . . 1
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Operating modes . . . . . . . . . . . . . . . . . . . . . . . 4
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 4
TXD dominant time-out function . . . . . . . . . . . . 4
Internal biasing of TXD and S input pins . . . . . 4
Undervoltage detection on pins VCC and VIO . . 5
Overtemperature protection . . . . . . . . . . . . . . . 5
VIO supply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application design-in information . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal characteristics . . . . . . . . . . . . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Soldering of SMD packages . . . . . . . . . . . . . . 11
Introduction to soldering . . . . . . . . . . . . . . . . . 11
Wave and reflow soldering . . . . . . . . . . . . . . . 11
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 August 2010
Document identifier: TJF1051
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