EFM32G290 DATASHEET F128/F64/F32 ...the world's most energy friendly microcontrollers

EFM32G290 DATASHEET F128/F64/F32 ...the world's most energy friendly microcontrollers
...the world's most energy friendly microcontrollers
EFM32G290 DATASHEET
F128/F64/F32
• ARM Cortex-M3 CPU platform
• High Performance 32-bit processor @ up to 32 MHz
• Memory Protection Unit
• Wake-up Interrupt Controller
• Flexible Energy Management System
• 20 nA @ 3 V Shutoff Mode
• 0.6 µA @ 3 V Stop Mode, including Power-on Reset, Brown-out
Detector, RAM and CPU retention
• 0.9 µA @ 3 V Deep Sleep Mode, including RTC with 32.768 kHz
oscillator, Power-on Reset, Brown-out Detector, RAM and CPU
retention
• 45 µA/MHz @ 3 V Sleep Mode
• 180 µA/MHz @ 3 V Run Mode, with code executed from flash
• 128/64/32 KB Flash
• 16/16/8 KB RAM
• 90 General Purpose I/O pins
• Configurable Push-pull, Open-drain, pull-up/down, input filter,
drive strength
• Configurable peripheral I/O locations
• 16 asynchronous external interrupts
• 8 Channel DMA Controller
• 8 Channel Peripheral Reflex System (PRS) for autonomous inter-peripheral signaling
• Hardware AES with 128/256-bit keys in 54/75 cycles
• Timers/Counters
• 3× 16-bit Timer/Counter
• 3×3 Compare/Capture/PWM channels
• Dead-Time Insertion on TIMER0
• 16-bit Low Energy Timer
• 24-bit Real-Time Counter
• 3× 8-bit Pulse Counter
• Watchdog Timer with dedicated RC oscillator @ 50 nA
• External Bus Interface for up to 4×64 MB of external memory
mapped space
• Communication interfaces
• 3× Universal Synchronous/Asynchronous Receiver/Transmitter
• UART/SPI/SmartCard (ISO 7816)/IrDA
• Triple buffered full/half-duplex operation
• Universal Asynchronous Receiver/Transmitter
• 2× Low Energy UART
• Autonomous operation with DMA in Deep Sleep
Mode
2
• I C Interface with SMBus support
• Address recognition in Stop Mode
• Ultra low power precision analog peripherals
• 12-bit 1 Msamples/s Analog to Digital Converter
• 8 single ended channels/4 differential channels
• On-chip temperature sensor
• Conversion tailgating for predictable latency
• 12-bit 500 ksamples/s Digital to Analog Converter
• 2 single ended channels/1 differential channel
• 2× Analog Comparator
• Capacitive sensing with up to 16 inputs
• Supply Voltage Comparator
• Ultra efficient Power-on Reset and Brown-Out Detector
• Pre-Programmed Serial Bootloader
• Temperature range -40 to 85 ºC
• Single power supply 1.85 to 3.8 V
• BGA112 package
32-bit ARM Cortex-M0, Cortex-M3 and Cortex-M4F microcontrollers for:
• Energy, gas, water and smart metering
• Health and fintess applications
• Smart accessories
• Alarm and security systems
• Industrial and home automation
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1 Ordering Information
Table 1.1 (p. 2) shows the available EFM32G290 devices.
Table 1.1. Ordering Information
Ordering Code
Flash (KB)
RAM
(KB)
Max
Speed
(MHz)
Supply
Voltage
(V)
Temperature
Package
EFM32G290F32-BGA112
32
8
32
1.85 - 3.8
-40 - 85 ºC
BGA112
EFM32G290F64-BGA112
64
16
32
1.85 - 3.8
-40 - 85 ºC
BGA112
EFM32G290F128-BGA112
128
16
32
1.85 - 3.8
-40 - 85 ºC
BGA112
Visit www.energymicro.com for information on global distributors and representatives or contact
sales@energymicro.com for additional information.
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2 System Summary
2.1 System Introduction
The EFM32 MCUs are the world’s most energy friendly microcontrollers. With a unique combination of
the powerful 32-bit ARM Cortex-M3, innovative low energy techniques, short wake-up time from energy
saving modes, and a wide selection of peripherals, the EFM32G microcontroller is well suited for any
battery operated application as well as other systems requiring high performance and low-energy consumption. This section gives a short introduction to each of the modules in general terms and also and
shows a summary of the configuration for the EFM32G290 devices. For a complete feature set and indepth information on the modules, the reader is referred to the EFM32G Reference Manual.
A block diagram of the EFM32G290 is shown in Figure 2.1 (p. 3) .
Figure 2.1. Block Diagram
G290F32/64/128
Core and Memory
Clock Managem ent
Memory
Protection
Unit
ARM Cortex™-M3 processor
Flash
Memory
[KB]
RAM
Memory
[KB]
32/64/128
8/16/16
Debug
Interface
DMA
Controller
High Frequency
Crystal
Oscilla tor
High Frequency
RC
Oscilla tor
Low Frequency
Crystal
Oscilla tor
Low Frequency
RC
Oscilla tor
Watchdog
Oscillator
Energy Managem ent
Voltage
Regulator
Voltage
Comparator
Power-on
Reset
Brown-out
Detector
32-bit bus
Peripheral Reflex System
Serial Interfaces
USART
UART
I/O Ports
External
Bus
Interface
General
Purpose
I/O
3x
Low
Energy
UART™
90 pins
I2C
External
Interrupts
2x
Pin
Reset
Timers and Triggers
Timer/
Counter
3x
Peripheral
Reflex
System
Low Energy
Timer™
Real Time
Counter
Analog Interfaces
ADC
DAC
Security
AES
2x
Pulse
Counter
3x
Watchdog
Timer
Analog
Comparator
2x
2.1.1 ARM Cortex-M3 Core
The ARM Cortex-M3 includes a 32-bit RISC processor which can achieve as much as 1.25 Dhrystone
MIPS/MHz. A Memory Protection Unit with support for up to 8 memory segments is included, as well
as a Wake-up Interrupt Controller handling interrupts triggered while the CPU is asleep. The EFM32
implementation of the Cortex-M3 is described in detail in EFM32G Cortex-M3 Reference Manual.
2.1.2 Debug Interface (DBG)
This device includes hardware debug support through a 2-pin serial-wire debug interface . In addition
there is also a 1-wire Serial Wire Viewer pin which can be used to output profiling information, data trace
and software-generated messages.
2.1.3 Memory System Controller (MSC)
The Memory System Controller (MSC) is the program memory unit of the EFM32G microcontroller. The
flash memory is readable and writable from both the Cortex-M3 and DMA. The flash memory is divided
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into two blocks; the main block and the information block. Program code is normally written to the main
block. Additionally, the information block is available for special user data and flash lock bits. There is
also a read-only page in the information block containing system and device calibration data. Read and
write operations are supported in the energy modes EM0 and EM1.
2.1.4 Direct Memory Access Controller (DMA)
The Direct Memory Access (DMA) controller performs memory operations independently of the CPU.
This has the benefit of reducing the energy consumption and the workload of the CPU, and enables
the system to stay in low energy modes when moving for instance data from the USART to RAM or
from the External Bus Interface to a PWM-generating timer. The DMA controller uses the PL230 µDMA
controller licensed from ARM.
2.1.5 Reset Management Unit (RMU)
The RMU is responsible for handling the reset functionality of the EFM32G.
2.1.6 Energy Management Unit (EMU)
The Energy Management Unit (EMU) manage all the low energy modes (EM) in EFM32G microcontrollers. Each energy mode manages if the CPU and the various peripherals are available. The EMU
can also be used to turn off the power to unused SRAM blocks.
2.1.7 Clock Management Unit (CMU)
The Clock Management Unit (CMU) is responsible for controlling the oscillators and clocks on-board
the EFM32G. The CMU provides the capability to turn on and off the clock on an individual basis to all
peripheral modules in addition to enable/disable and configure the available oscillators. The high degree
of flexibility enables software to minimize energy consumption in any specific application by not wasting
power on peripherals and oscillators that are inactive.
2.1.8 Watchdog (WDOG)
The purpose of the watchdog timer is to generate a reset in case of a system failure, to increase application reliability. The failure may e.g. be caused by an external event, such as an ESD pulse, or by a
software failure.
2.1.9 Peripheral Reflex System (PRS)
The Peripheral Reflex System (PRS) system is a network which lets the different peripheral module
communicate directly with each other without involving the CPU. Peripheral modules which send out
Reflex signals are called producers. The PRS routes these reflex signals to consumer peripherals which
apply actions depending on the data received. The format for the Reflex signals is not given, but edge
triggers and other functionality can be applied by the PRS.
2.1.10 External Bus Interface (EBI)
The External Bus Interface provides access to external parallel interface devices such as SRAM, FLASH,
ADCs and LCDs. The interface is memory mapped into the address bus of the Cortex-M3. This enables
seamless access from software without manually manipulating the IO settings each time a read or write
is performed. The data and address lines are multiplexed in order to reduce the number of pins required
to interface the external devices. The timing is adjustable to meet specifications of the external devices.
The interface is limited to asynchronous devices.
2.1.11 Inter-Integrated Circuit Interface (I2C)
2
2
The I C module provides an interface between the MCU and a serial I C-bus. It is capable of acting as
both a master and a slave, and supports multi-master buses. Both standard-mode, fast-mode and fastmode plus speeds are supported, allowing transmission rates all the way from 10 kbit/s up to 1 Mbit/s.
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Slave arbitration and timeouts are also provided to allow implementation of an SMBus compliant system.
2
The interface provided to software by the I C module, allows both fine-grained control of the transmission
process and close to automatic transfers. Automatic recognition of slave addresses is provided in all
energy modes.
2.1.12 Universal Synchronous/Asynchronous Receiver/Transmitter (USART)
The Universal Synchronous Asynchronous serial Receiver and Transmitter (USART) is a very flexible
serial I/O module. It supports full duplex asynchronous UART communication as well as RS-485, SPI,
MicroWire and 3-wire. It can also interface with ISO7816 SmartCards and IrDA devices.
2.1.13 Pre-Programmed Serial Bootloader
The bootloader presented in application note AN0003 is pre-programmed in the device at factory. Autobaud and destructive write are supported. The autobaud feature, interface and commands are described
further in the application note.
2.1.14 Universal Asynchronous Receiver/Transmitter (UART)
The Universal Asynchronous serial Receiver and Transmitter (UART) is a very flexible serial I/O module.
It supports full- and half-duplex asynchronous UART communication.
2.1.15 Low Energy Universal Asynchronous Receiver/Transmitter
(LEUART)
TM
The unique LEUART , the Low Energy UART, is a UART that allows two-way UART communication on
a strict power budget. Only a 32.768 kHz clock is needed to allow UART communication up to 9600 baud/
s. The LEUART includes all necessary hardware support to make asynchronous serial communication
possible with minimum of software intervention and energy consumption.
2.1.16 Timer/Counter (TIMER)
The 16-bit general purpose Timer has 3 compare/capture channels for input capture and compare/PulseWidth Modulation (PWM) output. TIMER0 also includes a Dead-Time Insertion module suitable for motor
control applications.
2.1.17 Real Time Counter (RTC)
The Real Time Counter (RTC) contains a 24-bit counter and is clocked either by a 32.768 kHz crystal
oscillator, or a 32 kHz RC oscillator. In addition to energy modes EM0 and EM1, the RTC is also available
in EM2. This makes it ideal for keeping track of time since the RTC is enabled in EM2 where most of
the device is powered down.
2.1.18 Low Energy Timer (LETIMER)
TM
The unique LETIMER , the Low Energy Timer, is a 16-bit timer that is available in energy mode EM2
in addition to EM1 and EM0. Because of this, it can be used for timing and output generation when most
of the device is powered down, allowing simple tasks to be performed while the power consumption of
the system is kept at an absolute minimum. The LETIMER can be used to output a variety of waveforms
with minimal software intervention. It is also connected to the Real Time Counter (RTC), and can be
configured to start counting on compare matches from the RTC.
2.1.19 Pulse Counter (PCNT)
The Pulse Counter (PCNT) can be used for counting pulses on a single input or to decode quadrature
encoded inputs. It runs off either the internal LFACLK or the PCNTn_S0IN pin as external clock source.
The module may operate in energy mode EM0 – EM3.
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2.1.20 Analog Comparator (ACMP)
The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is higher. Inputs can either be one of the selectable internal references or from
external pins. Response time and thereby also the current consumption can be configured by altering
the current supply to the comparator.
2.1.21 Voltage Comparator (VCMP)
The Voltage Supply Comparator is used to monitor the supply voltage from software. An interrupt can
be generated when the supply falls below or rises above a programmable threshold. Response time and
thereby also the current consumption can be configured by altering the current supply to the comparator.
2.1.22 Analog to Digital Converter (ADC)
The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits
at up to one million samples per second. The integrated input mux can select inputs from 8 external
pins and 6 internal signals.
2.1.23 Digital to Analog Converter (DAC)
The Digital to Analog Converter (DAC) can convert a digital value to an analog output voltage. The DAC
is fully differential rail-to-rail, with 12-bit resolution. It has two single ended output buffers which can be
combined into one differential output. The DAC may be used for a number of different applications such
as sensor interfaces or sound output.
2.1.24 Advanced Encryption Standard Accelerator (AES)
The AES accelerator performs AES encryption and decryption with 128-bit or 256-bit keys. Encrypting or
decrypting one 128-bit data block takes 52 HFCORECLK cycles with 128-bit keys and 75 HFCORECLK
cycles with 256-bit keys. The AES module is an AHB slave which enables efficient access to the data
and key registers. All write accesses to the AES module must be 32-bit operations, i.e. 8- or 16-bit
operations are not supported.
2.1.25 General Purpose Input/Output (GPIO)
In the EFM32G290, there are 90 General Purpose Input/Output (GPIO) pins, which are divided into ports
with up to 16 pins each. These pins can individually be configured as either an output or input. More
advances configurations like open-drain, filtering and drive strength can also be configured individually
for the pins. The GPIO pins can also be overridden by peripheral pin connections, like Timer PWM
outputs or USART communication, which can be routed to several locations on the device. The GPIO
supports up to 16 asynchronous external pin interrupts, which enables interrupts from any pin on the
device. Also, the input value of a pin can be routed through the Peripheral Reflex System to other
peripherals.
2.2 Configuration Summary
The features of the EFM32G290 is a subset of the feature set described in the EFM32G Reference
Manual. Table 2.1 (p. 6) describes device specific implementation of the features.
Table 2.1. Configuration Summary
Module
Configuration
Pin Connections
Cortex-M3
Full configuration
NA
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Module
Configuration
Pin Connections
DBG
Full configuration
DBG_SWCLK, DBG_SWDIO,
DBG_SWO
MSC
Full configuration
NA
DMA
Full configuration
NA
RMU
Full configuration
NA
EMU
Full configuration
NA
CMU
Full configuration
CMU_OUT0, CMU_OUT1
WDOG
Full configuration
NA
PRS
Full configuration
NA
EBI
Full configuration
I2C0
Full configuration
I2C0_SDA, I2C0_SCL
USART0
IrDA
US0_TX, US0_RX. US0_CLK, US0_CS
USART1
US1_TX, US1_RX, US1_CLK, US1_CS
USART2
US2_TX, US2_RX, US2_CLK, US2_CS
UART0
Full configuration
U0_TX, U0_RX
LEUART0
Full configuration
LEU0_TX, LEU0_RX
LEUART1
Full configuration
LEU1_TX, LEU1_RX
TIMER0
Full configuration with DTI.
TIM0_CC[2:0], TIM0_CDTI[2:0]
TIMER1
Full configuration
TIM1_CC[2:0]
TIMER2
Full configuration
TIM2_CC[2:0]
RTC
Full configuration
NA
LETIMER0
Full configuration
LET0_O[1:0]
PCNT0
8-bit count register
PCNT0_S[1:0]
PCNT1
8-bit count register
PCNT1_S[1:0]
PCNT2
8-bit count register
PCNT2_S[1:0]
ACMP0
Full configuration
ACMP0_CH[7:0], ACMP0_O
ACMP1
Full configuration
ACMP1_CH[7:0], ACMP1_O
VCMP
Full configuration
NA
ADC0
Full configuration
ADC0_CH[7:0]
DAC0
Full configuration
DAC0_OUT[1:0]
AES
Full configuration
NA
GPIO
90 pins
Available pins are shown in
Table 4.3 (p. 54)
2.3 Memory Map
The EFM32G290 memory map is shown in Figure 2.2 (p. 8) , with RAM and Flash sizes for the
largest memory configuration.
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Figure 2.2. EFM32G290 Memory Map with largest RAM and Flash sizes
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3 Electrical Characteristics
3.1 Test Conditions
3.1.1 Typical Values
The typical data are based on TAMB=25°C and VDD=3.0 V, as defined in Table 3.2 (p. 9) , by simulation and/or technology characterisation unless otherwise specified.
3.1.2 Minimum and Maximum Values
The minimum and maximum values represent the worst conditions of ambient temperature, supply voltage and frequencies, as defined in Table 3.2 (p. 9), by simulation and/or technology characterisation unless otherwise specified.
3.2 Absolute Maximum Ratings
The absolute maximum ratings are stress ratings, and functional operation under such conditions are
not guaranteed. Stress beyond the limits specified in Table 3.1 (p. 9) may affect the device reliability
or cause permanent damage to the device. Functional operating conditions are given in Table 3.2 (p.
9) .
Table 3.1. Absolute Maximum Ratings
Symbol
Parameter
TSTG
Storage temperature range
TS
Maximum soldering temperature
VDDMAX
External main supply voltage
VIOPIN
Voltage on any I/O pin
Condition
Min
Typ
Max
Unit
1
-40
150
Latest IPC/JEDEC J-STD-020
Standard
°C
260 °C
0
3.8 V
-0.3
VDD+0.3 V
1
Based on programmed devices tested for 10000 hours at 150°C. Storage temperature affects retention of preprogrammed calibration values stored in flash. Please refer to the Flash section in the Electrical Characteristics for information on flash data retention for different temperatures.
3.3 General Operating Conditions
3.3.1 General Operating Conditions
Table 3.2. General Operating Conditions
Symbol
Parameter
TAMB
Ambient temperature range
VDDOP
Operating supply voltage
fAPB
Internal APB clock frequency
32 MHz
fAHB
Internal AHB clock frequency
32 MHz
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Min
Typ
-40
1.85
9
Max
Unit
85 °C
3.8 V
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3.3.2 Environmental
Table 3.3. Environmental
Symbol
Parameter
Condition
Min
Typ
Max
Unit
VESDHBM
ESD (Human Body Model
HBM)
TAMB=25°C
2 kV
VESDCDM
ESD (Charged Device
Model, CDM)
TAMB=25°C
1 kV
Latch-up sensitivity test passed level A according to JEDEC JESD 78B method Class II, 85°C.
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3.4 Current Consumption
Table 3.4. Current Consumption
Symbol
IEM0
IEM1
IEM2
IEM3
IEM4
Parameter
EM0 current. No prescaling. Running prime number calculation code from
Flash.
EM1 current
Condition
Min
Typ
Max
Unit
32 MHz HFXO, all peripheral
clocks disabled, VDD= 3.0 V
180
µA/
MHz
28 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V
181
235 µA/
MHz
21 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V
183
237 µA/
MHz
14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V
185
243 µA/
MHz
11 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V
186
246 µA/
MHz
7 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
191
257 µA/
MHz
1 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
220
µA/
MHz
32 MHz HFXO, all peripheral
clocks disabled, VDD= 3.0 V
45
µA/
MHz
28 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V
47
62 µA/
MHz
21 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V
48
64 µA/
MHz
14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V
50
69 µA/
MHz
11 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V
51
72 µA/
MHz
7 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
56
83 µA/
MHz
1 MHz HFRCO. all peripheral
clocks disabled, VDD= 3.0 V
103
µA/
MHz
EM2 current with RTC at 1
Hz, RTC prescaled to 1kHz,
32 kHz LFRCO, VDD= 3.0 V,
TAMB=25°C
0.9
µA
EM2 current with RTC at 1
Hz, RTC prescaled to 1kHz,
32 kHz LFRCO, VDD= 3.0 V,
TAMB=85°C
3.0
6.0 µA
VDD= 3.0 V, TAMB=25°C
0.59
µA
VDD= 3.0 V, TAMB=85°C
2.75
5.8 µA
VDD= 3.0 V, TAMB=25°C
0.02
µA
VDD= 3.0 V, TAMB=85°C
0.25
0.7 µA
EM2 current
EM3 current
EM4 current
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Figure 3.1. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 28MHz
5.3
5.3
85.0° C
65.0° C
5.2
5.2
45.0° C
5.1
5.1
5.0
5.0° C
-15.0° C
Idd [ m A]
Idd [ m A]
25.0° C
4.9
5.0
4.9
-40.0° C
4.8
4.8
4.7
4.6
2.0
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
4.7
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
3.4
3.6
4.6
–40
3.8
–15
5
45
25
Tem perat ure [ ° C]
65
85
Figure 3.2. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 21MHz
4.0
4.0
85.0° C
65.0° C
3.9
3.9
45.0° C
25.0° C
Idd [ m A]
3.8
Idd [ m A]
3.8
5.0° C
-15.0° C
3.7
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
3.7
-40.0° C
3.6
3.5
2.0
3.6
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
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3.4
3.6
3.5
–40
3.8
12
–15
5
45
25
Tem perat ure [ ° C]
65
85
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Figure 3.3. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 14MHz
2.75
2.75
85.0° C
2.70
2.70
65.0° C
2.65
2.65
45.0° C
2.60
2.60
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
Idd [ m A]
Idd [ m A]
25.0° C
2.55
5.0° C
2.50
-15.0° C
2.50
2.45
-40.0° C
2.45
2.40
2.35
2.0
2.55
2.40
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
3.4
3.6
2.35
–40
3.8
–15
5
45
25
Tem perat ure [ ° C]
65
85
Figure 3.4. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 11MHz
2.20
2.20
85.0° C
2.15
2.15
65.0° C
2.10
2.10
25.0° C
2.05
Idd [ m A]
Idd [ m A]
45.0° C
5.0° C
2.00
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
2.05
2.00
-15.0° C
1.95
-40.0° C
1.90
1.85
2.0
1.95
1.90
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
3.4
3.6
1.85
–40
3.8
13
–15
5
45
25
Tem perat ure [ ° C]
65
85
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Figure 3.5. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 7MHz
1.45
1.45
85.0° C
1.40
1.40
65.0° C
45.0° C
1.35
Idd [ m A]
25.0° C
5.0° C
Idd [ m A]
1.35
-15.0° C
1.30
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
1.30
-40.0° C
1.25
1.20
2.0
1.25
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
3.4
3.6
1.20
–40
3.8
–15
5
45
25
Tem perat ure [ ° C]
65
85
Figure 3.6. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 28MHz
1.40
1.40
85.0° C
65.0° C
1.35
1.35
Vdd= 2.0V
Vdd= 2.4V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
45.0° C
25.0° C
1.30
1.30
-15.0° C
-40.0° C
1.25
1.20
1.15
2.0
Idd [ m A]
Idd [ m A]
5.0° C
1.25
1.20
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
3.4
3.6
1.15
–40
3.8
14
–15
5
45
25
Tem perat ure [ ° C]
65
85
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Figure 3.7. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 21MHz
1.08
1.08
85.0° C
1.06
1.04
65.0° C
1.04
1.02
45.0° C
1.02
25.0° C
1.00
5.0° C
Idd [ m A]
Idd [ m A]
1.06
1.00
0.98
-15.0° C
0.98
0.96
-40.0° C
0.96
0.94
0.92
2.0
Vdd= 2.0V
Vdd= 2.4V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
0.94
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
3.4
3.6
0.92
–40
3.8
–15
5
45
25
Tem perat ure [ ° C]
65
85
Figure 3.8. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 14MHz
0.76
0.76
85.0° C
0.74
0.74
65.0° C
0.72
Vdd= 2.0V
Vdd= 2.4V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
0.72
25.0° C
0.70
5.0° C
Idd [ m A]
Idd [ m A]
45.0° C
0.70
-15.0° C
0.68
0.68
-40.0° C
0.66
0.64
2.0
0.66
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
3.4
3.6
0.64
–40
3.8
15
–15
5
45
25
Tem perat ure [ ° C]
65
85
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Figure 3.9. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 11MHz
0.62
0.60
65.0° C
0.60
0.58
45.0° C
0.58
25.0° C
5.0° C
0.56
Vdd= 2.0V
Vdd= 2.4V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
Idd [ m A]
85.0° C
Idd [ m A]
0.62
0.56
-15.0° C
-40.0° C
0.54
0.52
2.0
0.54
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
3.4
3.6
0.52
–40
3.8
–15
5
45
25
Tem perat ure [ ° C]
65
85
Figure 3.10. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 7MHz
0.44
0.44
85.0° C
0.43
0.43
65.0° C
0.42
Vdd= 2.0V
Vdd= 2.4V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
0.42
0.41
0.41
25.0° C
0.40
5.0° C
-15.0° C
0.39
Idd [ m A]
Idd [ m A]
45.0° C
0.40
0.39
-40.0° C
0.38
0.38
0.37
0.37
0.36
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
3.4
3.6
0.36
–40
3.8
16
–15
5
45
25
Tem perat ure [ ° C]
65
85
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Figure 3.11. EM2 current consumption. RTC prescaled to 1kHz, 32 kHz LFRCO.
3.5
3.5
-40.0° C
-15.0° C
5.0° C
25.0° C
45.0° C
65.0° C
85.0° C
3.0
3.0
2.5
Idd [ uA]
Idd [ uA]
2.5
2.0
2.0
1.5
1.5
1.0
1.0
0.5
1.8
Vdd= 1.8V
Vdd= 2.2V
Vdd= 2.6V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
3.4
3.6
0.5
–40
3.8
–15
5
45
25
Tem perat ure [ ° C]
65
85
5
45
25
Tem perat ure [ ° C]
65
85
Figure 3.12. EM3 current consumption.
3.0
3.0
-40.0° C
-15.0° C
5.0° C
25.0° C
45.0° C
65.0° C
85.0° C
2.5
2.5
2.0
Idd [ uA]
Idd [ uA]
2.0
1.5
1.5
1.0
1.0
0.5
0.5
0.0
1.8
Vdd= 1.8V
Vdd= 2.2V
Vdd= 2.6V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
3.4
3.6
0.0
–40
3.8
17
–15
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Figure 3.13. EM4 current consumption.
0.45
0.40
0.40
0.35
0.30
0.30
0.25
0.25
Idd [ uA]
Idd [ uA]
0.35
0.45
-40.0° C
-15.0° C
5.0°C
25.0° C
45.0° C
65.0° C
85.0° C
0.20
0.20
0.15
0.15
0.10
0.10
0.05
0.05
0.00
1.8
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [ V]
3.2
3.4
3.6
0.00
–40
3.8
Vdd= 1.8V
Vdd= 2.2V
Vdd= 2.6V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
–15
5
45
25
Tem perat ure [ ° C]
65
85
3.5 Transition between Energy Modes
Table 3.5. Energy Modes Transitions
Symbol
Parameter
Min
Typ
Max
Unit
1
HF
core
CLK
cycles
tEM10
Transition time from EM1 to EM0
0
tEM20
Transition time from EM2 to EM0
2
µs
tEM30
Transition time from EM3 to EM0
2
µs
tEM40
Transition time from EM4 to EM0
163
µs
1
Core wakeup time only.
3.6 Power Management
This EFM32G device requires the power to be applied to the AVDD_x pins before or at the same time as
power is applied to the VDD_DREG and IOVDD_x pins. In addition, it is also a requirement that all the
power pins are powered with the same voltage level. For practical schematic recommendations to fulfil
this requirement, please see the application note, "AN0002 EFM32 Hardware Design Considerations".
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
18
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Table 3.6. Power Management
Symbol
Parameter
Condition
Min
Typ
Max
Unit
VBODextthr-
BOD threshold on falling
external supply voltage
1.82
1.85 V
VBODintthr-
BOD threshold on falling
internally regulated supply
voltage
1.62
1.68 V
VBODextthr+
BOD threshold on rising external supply voltage
VPORthr+
Power-on Reset (POR)
threshold on rising external
supply voltage
tRESETdly
Delay from reset is reApplies to Power-on Reset,
leased until program execu- Brown-out Reset and pin retion starts
set.
tRESET
negative pulse length to ensure complete reset of device
CDECOUPLE
Voltage regulator decoupling capacitor.
1.85
V
1.98 V
163
µs
50
ns
X5R capacitor recommended.
Apply between DECOUPLE
pin and GROUND
1
µF
3.7 Flash
Table 3.7. Flash
Symbol
Parameter
ECFLASH
Flash erase cycles before
failure
Condition
Min
TAMB<150°C
RETFLASH
Flash data retention
Typ
Max
Unit
20000
cycles
10000
h
TAMB<85°C
10
years
TAMB<70°C
20
years
µs
tW_PROG
Word (32-bit) programming
time
20
tP_ERASE
Page erase time
20
20.4
20.8 ms
tD_ERASE
Device erase time
40
40.8
41.6 ms
IERASE
Erase current
IWRITE
Write current
VFLASH
Supply voltage during flash
erase and write
1
mA
2
mA
7
7
1.8
3.8 V
1
Measured at 25°C
Measured at 25°C
2
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
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3.8 General Purpose Input Output
Table 3.8. GPIO
Symbol
Parameter
VIOIL
Input low voltage
VIOIH
Input high voltage
VIOOH
VIOOL
Condition
Min
Typ
Max
Unit
0.3VDD V
0.7VDD
V
Sourcing 6 mA, VDD=1.8V,
GPIO_Px_CTRL DRIVEMODE = STANDARD
0.75VDD
V
Sourcing 6 mA, VDD=3.0V,
GPIO_Px_CTRL DRIVEMODE = STANDARD
0.95VDD
V
Sourcing 20 mA, VDD=1.8V,
GPIO_Px_CTRL DRIVEMODE = HIGH
0.7VDD
V
Sourcing 20 mA, VDD=3.0V,
GPIO_Px_CTRL DRIVEMODE = HIGH
0.9VDD
V
Output high voltage
Sinking 6 mA, VDD=1.8V,
GPIO_Px_CTRL DRIVEMODE = STANDARD
0.25VDD V
Sinking 6 mA, VDD=3.0V,
GPIO_Px_CTRL DRIVEMODE = STANDARD
0.05VDD V
Sinking 20 mA, VDD=1.8V,
GPIO_Px_CTRL DRIVEMODE = HIGH
0.3VDD V
Sinking 20 mA, VDD=3.0V,
GPIO_Px_CTRL DRIVEMODE = HIGH
0.1VDD V
Output low voltage
IIOLEAK
Input leakage current
RPU
I/O pin pull-up resistor
40
kOhm
RPD
I/O pin pull-down resistor
40
kOhm
RIOESD
Internal ESD series resistor
200
Ohm
tIOGLITCH
Pulse width of pulses to be
removed by the glitch suppression filter
tIOOF
VIOHYST
Output fall time
I/O pin hysteresis (VIOTHR+
- VIOTHR-)
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
High Impedance IO connected to GROUND or VDD
+/-25 nA
10
50 ns
0.5 mA drive strength
and load capacitance
CL=12.5-25pF.
20+0.1CL
250 ns
2mA drive strength and load
capacitance CL=350-600pF
20+0.1CL
250 ns
VDD = 1.8 - 3.8 V
20
0.1VDD
V
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Figure 3.14. Typical Low-Level Output Current, 2V Supply Voltage
5
0.20
4
Low-Level Out put Current [ m A]
Low-Level Out put Current [ m A]
0.15
0.10
3
2
0.05
1
-40° C
25° C
85° C
0.00
0.0
0.5
1.5
1.0
Low-Level Out put Volt age [ V]
-40° C
25° C
85° C
0
0.0
2.0
GPIO_Px_CTRL DRIVEMODE = LOWEST
0.5
1.5
1.0
Low-Level Out put Volt age [ V]
2.0
GPIO_Px_CTRL DRIVEMODE = LOW
45
20
40
35
Low-Level Out put Current [ m A]
Low-Level Out put Current [ m A]
15
10
30
25
20
15
5
10
5
-40° C
25° C
85° C
0
0.0
0.5
1.5
1.0
Low-Level Out put Volt age [ V]
0
0.0
2.0
GPIO_Px_CTRL DRIVEMODE = STANDARD
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
-40° C
25° C
85° C
0.5
1.5
1.0
Low-Level Out put Volt age [ V]
2.0
GPIO_Px_CTRL DRIVEMODE = HIGH
21
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Figure 3.15. Typical High-Level Output Current, 2V Supply Voltage
0.00
0.0
-40°C
25°C
85°C
-40°C
25°C
85°C
–0.5
High-Level Out put Current [ m A]
High-Level Out put Current [ m A]
–0.05
–0.10
–1.0
–1.5
–0.15
–2.0
–0.20
0.0
1.5
0.5
1.0
High-Level Out put Volt age [ V]
–2.5
0.0
2.0
GPIO_Px_CTRL DRIVEMODE = LOWEST
1.5
0.5
1.0
High-Level Out put Volt age [ V]
2.0
GPIO_Px_CTRL DRIVEMODE = LOW
0
0
-40°C
25°C
85°C
-40°C
25°C
85°C
–10
High-Level Out put Current [ m A]
High-Level Out put Current [ m A]
–5
–10
–20
–30
–15
–40
–20
0.0
1.5
0.5
1.0
High-Level Out put Volt age [ V]
–50
0.0
2.0
GPIO_Px_CTRL DRIVEMODE = STANDARD
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
1.5
0.5
1.0
High-Level Out put Volt age [ V]
2.0
GPIO_Px_CTRL DRIVEMODE = HIGH
22
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0.5
10
0.4
8
Low-Level Out put Current [ m A]
Low-Level Out put Current [ m A]
Figure 3.16. Typical Low-Level Output Current, 3V Supply Voltage
0.3
0.2
0.1
6
4
2
-40° C
25° C
85° C
0.0
0.0
0.5
1.5
1.0
2.0
Low-Level Out put Volt age [ V]
2.5
-40° C
25° C
85° C
0
0.0
3.0
GPIO_Px_CTRL DRIVEMODE = LOWEST
0.5
1.5
1.0
2.0
Low-Level Out put Volt age [ V]
2.5
3.0
GPIO_Px_CTRL DRIVEMODE = LOW
40
50
35
40
Low-Level Out put Current [ m A]
Low-Level Out put Current [ m A]
30
25
20
15
30
20
10
10
5
0
0.0
-40° C
25° C
85° C
0.5
1.5
1.0
2.0
Low-Level Out put Volt age [ V]
2.5
-40° C
25° C
85° C
0
0.0
3.0
GPIO_Px_CTRL DRIVEMODE = STANDARD
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
0.5
1.5
1.0
2.0
Low-Level Out put Volt age [ V]
2.5
3.0
GPIO_Px_CTRL DRIVEMODE = HIGH
23
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Figure 3.17. Typical High-Level Output Current, 3V Supply Voltage
0.0
0
-40°C
25°C
85°C
-40°C
25°C
85°C
–1
High-Level Out put Current [ m A]
High-Level Out put Current [ m A]
–0.1
–0.2
–0.3
–2
–3
–4
–0.4
–5
–0.5
0.0
0.5
1.5
1.0
2.0
High-Level Out put Volt age [ V]
2.5
–6
0.0
3.0
GPIO_Px_CTRL DRIVEMODE = LOWEST
2.5
3.0
0
-40°C
25°C
85°C
-40°C
25°C
85°C
–10
High-Level Out put Current [ m A]
–10
High-Level Out put Current [ m A]
1.5
1.0
2.0
High-Level Out put Volt age [ V]
GPIO_Px_CTRL DRIVEMODE = LOW
0
–20
–30
–40
–50
0.0
0.5
–20
–30
–40
0.5
1.5
1.0
2.0
High-Level Out put Volt age [ V]
2.5
–50
0.0
3.0
GPIO_Px_CTRL DRIVEMODE = STANDARD
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
0.5
1.5
1.0
2.0
High-Level Out put Volt age [ V]
2.5
3.0
GPIO_Px_CTRL DRIVEMODE = HIGH
24
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Figure 3.18. Typical Low-Level Output Current, 3.8V Supply Voltage
0.8
14
0.7
12
Low-Level Out put Current [ m A]
Low-Level Out put Current [ m A]
0.6
0.5
0.4
0.3
10
8
6
4
0.2
2
0.1
0.0
0.0
-40° C
25° C
85° C
0.5
1.5
1.0
2.0
2.5
Low-Level Out put Volt age [ V]
3.0
-40° C
25° C
85° C
0
0.0
3.5
1.5
1.0
2.0
2.5
Low-Level Out put Volt age [ V]
3.0
50
50
40
40
30
20
10
30
20
10
-40° C
25° C
85° C
0
0.0
3.5
GPIO_Px_CTRL DRIVEMODE = LOW
Low-Level Out put Current [ m A]
Low-Level Out put Current [ m A]
GPIO_Px_CTRL DRIVEMODE = LOWEST
0.5
0.5
1.5
1.0
2.0
2.5
Low-Level Out put Volt age [ V]
3.0
-40° C
25° C
85° C
0
0.0
3.5
GPIO_Px_CTRL DRIVEMODE = STANDARD
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
0.5
1.5
1.0
2.0
2.5
Low-Level Out put Volt age [ V]
3.0
3.5
GPIO_Px_CTRL DRIVEMODE = HIGH
25
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Figure 3.19. Typical High-Level Output Current, 3.8V Supply Voltage
0.0
–0.1
0
-40°C
25°C
85°C
–1
-40°C
25°C
85°C
–2
High-Level Out put Current [ m A]
High-Level Out put Current [ m A]
–0.2
–0.3
–0.4
–0.5
–3
–4
–5
–6
–0.6
–7
–0.7
–0.8
0.0
–8
0.5
1.5
1.0
2.0
2.5
High-Level Out put Volt age [ V]
3.0
–9
0.0
3.5
GPIO_Px_CTRL DRIVEMODE = LOWEST
3.0
3.5
0
-40°C
25°C
85°C
-40°C
25°C
85°C
–10
High-Level Out put Current [ m A]
–10
High-Level Out put Current [ m A]
1.5
1.0
2.0
2.5
High-Level Out put Volt age [ V]
GPIO_Px_CTRL DRIVEMODE = LOW
0
–20
–30
–40
–50
0.0
0.5
–20
–30
–40
0.5
1.5
1.0
2.0
2.5
High-Level Out put Volt age [ V]
3.0
–50
0.0
3.5
GPIO_Px_CTRL DRIVEMODE = STANDARD
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
0.5
1.5
1.0
2.0
2.5
High-Level Out put Volt age [ V]
3.0
3.5
GPIO_Px_CTRL DRIVEMODE = HIGH
26
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3.9 Oscillators
3.9.1 LFXO
Table 3.9. LFXO
Symbol
Parameter
Condition
Min
Typ
Max
Unit
fLFXO
Supported nominal crystal
frequency
ESRLFXO
Supported crystal equivalent series resistance
(ESR)
CLFXOL
Supported crystal external
load range
X
DCLFXO
Duty cycle
48
ILFXO
Current consumption for
core and buffer after startup.
ESR=30 kOhm, CL=10 pF,
LFXOBOOST in CMU_CTRL
is 1
190
nA
tLFXO
Start- up time.
ESR=30 kOhm, CL=10 pF,
40% - 60% duty cycle has
been reached, LFXOBOOST
in CMU_CTRL is 1
400
ms
32.768
30
kHz
120 kOhm
1
25 pF
50
53.5 %
1
See Minimum Load Capacitance (CLFXOL) Requirement For Safe Crystal Startup figure and table
For safe startup of a given crystal, the load capacitance should be larger than the value indicated in
Figure 3.20 (p. 27) and in Table 3.10 (p. 27) for a given LFXOBOOST setting. The minimum
supported load capacitance depends on the crystal shunt capacitance, C0, which is specified in crystal
vendors’ datasheet.
Figure 3.20. Minimum Load Capacitance (CLFXOL) Requirement For Safe Crystal Startup
11
10
CL [ pF]
9
8
7
6
5
0.6
0.8
1.4
1.2
C0 [ pF]
1.0
1.6
1.8
2.0
Table 3.10. Minimum Load Capacitance (CLFXOL) Requirement For Safe Crystal Startup
Symbol
Capacitance [pF]
Shunt Capacitance C0
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
CLmin lfxoboost = 0
5.4
5.8
6.3
6.7
7.1
7.4
7.8
8.1
8.4
8.7
9.0
9.2
9.5
9.8
10.0 10.2
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
27
2.0
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3.9.2 HFXO
Table 3.11. HFXO
Symbol
Parameter
fHFXO
Supported nominal crystal
Frequency
Condition
Min
Typ
Max
4
Unit
32 MHz
Supported crystal equivalent series resistance
(ESR)
Crystal frequency 32 MHz
30
60 Ohm
Crystal frequency 4 MHz
400
1500 Ohm
gmHFXO
The transconductance of
the HFXO input transistor
at crystal startup
HFXOBOOST in CMU_CTRL
equals 0b11
CHFXOL
Supported crystal external
load range
DCHFXO
Duty cycle
ESRHFXO
IHFXO
Current consumption for
HFXO after startup
Startup time
tHFXO
20
mS
5
25 pF
46
50
54 %
4 MHz: ESR=400 Ohm,
CL=20 pF, HFXOBOOST in
CMU_CTRL equals 0b11
85
µA
32 MHz: ESR=30 Ohm,
CL=10 pF, HFXOBOOST in
CMU_CTRL equals 0b11
165
µA
32 MHz: ESR=30 Ohm,
CL=10 pF, HFXOBOOST in
CMU_CTRL equals 0b11
400
µs
Pulse width removed by
glitch detector
1
4 ns
3.9.3 LFRCO
Table 3.12. LFRCO
Symbol
Parameter
fLFRCO
Oscillation frequency ,
VDD= 3.0 V, TAMB=25°C
tLFRCO
Startup time not including
software calibration
150
µs
ILFRCO
Current consumption
190
nA
TCLFRCO
Temperature coefficient
VCLFRCO
Supply voltage coefficient
±15
TUNESTEPL-
Frequency step for LSB
change in TUNING value
1.5
FRCO
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
Condition
Min
Typ
Max
32
±0.02
28
Unit
kHz
%/°C
%/V
%
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Figure 3.21. Calibrated LFRCO Frequency vs Temperature and Supply Voltage
42
42
-40° C
25° C
85° C
40
38
Frequency [ kHz]
Frequency [ kHz]
40
36
38
34
34
32
32
30
1.8
2.2
2.6
3.0
3.4
30
–40
3.8
Vdd [ V]
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
29
1.8 V
3V
3.8 V
36
–15
5
45
25
Tem perat ure [ ° C]
65
85
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3.9.4 HFRCO
Table 3.13. HFRCO
Symbol
fHFRCO
tHFRCO_settling
IHFRCO
DCHFRCO
TCHFRCO
VCHFRCO
TUNESTEPHFRCO
Parameter
Oscillation frequency, VDD=
3.0 V, TAMB=25°C
Settling time after start-up
Condition
Min
Typ
Max
Unit
28 MHz frequency band
28
MHz
21 MHz frequency band
21
MHz
14 MHz frequency band
14
MHz
11 MHz frequency band
11
MHz
7 MHz frequency band
7
MHz
1 MHz frequency band
1
MHz
fHFRCO = 14 MHz
0.6
Cycles
fHFRCO = 28 MHz
106
µA
fHFRCO = 21 MHz
93
µA
fHFRCO = 14 MHz
77
µA
fHFRCO = 11 MHz
72
µA
fHFRCO = 7 MHz
63
µA
fHFRCO = 1 MHz
22
µA
Current consumption
Duty cycle
Temperature coefficient,
VDD= 3.0 V
Supply voltage coefficient,
TAMB=25°C
fHFRCO = 14 MHz
48.5
50
51 %
fHFRCO = 14 MHz
±0.01
1
%/°C
fHFRCO = 28 MHz
±0.005
1
%/°C
fHFRCO = 21 MHz
±0.01
1
%/°C
±0.02
1
%/°C
fHFRCO = 7 MHz
±0.02
1
%/°C
fHFRCO = 1 MHz
±0.06
1
%/°C
fHFRCO = 14 MHz
±0.32
2
%/V
fHFRCO = 28 MHz
±0.52
2
%/V
±0.25
2
%/V
fHFRCO = 11 MHz
±0.28
2
%/V
fHFRCO = 7 MHz
±0.3
2
%/V
fHFRCO = 1 MHz
±15
2
%/V
fHFRCO = 11 MHz
fHFRCO = 21 MHz
Frequency step for LSB
change in TUNING value
0.3
%
1
Calculated using (max(-40°C - 85°C) - min(-40°C - 85°C)) / f_HFRCO / (85°C - (-40°C))
Calculated using (max(1.8V - 3.8V) - min(1.8V - 3.8V)) / f_HFRCO / (3.8V - 1.8V))
2
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30
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Figure 3.22. Calibrated HFRCO 1 MHz Band Frequency vs Temperature and Supply Voltage
1.30
1.30
-40° C
25° C
85° C
1.25
1.20
1.20
1.15
1.15
Frequency [ MHz]
Frequency [ MHz]
1.25
1.10
1.05
1.10
1.05
1.00
1.00
0.95
0.95
0.90
0.90
0.85
1.8
2.2
2.6
3.0
3.4
0.85
–40
3.8
1.8 V
3V
3.8 V
–15
Vdd [ V]
5
45
25
Tem perat ure [ ° C]
65
85
Figure 3.23. Calibrated HFRCO 7 MHz Band Frequency vs Temperature and Supply Voltage
7.15
7.15
-40° C
25° C
85° C
1.8 V
3V
3.8 V
7.10
Frequency [ MHz]
Frequency [ MHz]
7.10
7.05
7.00
6.95
6.90
1.8
7.05
7.00
6.95
2.2
2.6
3.0
3.4
6.90
–40
3.8
–15
Vdd [ V]
5
45
25
Tem perat ure [ ° C]
65
85
Figure 3.24. Calibrated HFRCO 11 MHz Band Frequency vs Temperature and Supply Voltage
11.15
11.20
11.15
11.10
1.8 V
3V
3.8 V
11.10
11.00
10.95
Frequency [ MHz]
Frequency [ MHz]
11.05
-40°C
25°C
85°C
11.05
11.00
10.95
10.90
10.90
10.85
10.80
1.8
10.85
2.2
2.6
3.0
3.4
10.80
–40
3.8
Vdd [ V]
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
31
–15
5
45
25
Tem perat ure [ ° C]
65
85
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Figure 3.25. Calibrated HFRCO 14 MHz Band Frequency vs Temperature and Supply Voltage
14.15
14.15
-40° C
25° C
85° C
14.10
14.05
Frequency [ MHz]
Frequency [ MHz]
14.10
14.00
14.05
14.00
13.95
13.95
13.90
13.90
13.85
1.8
2.2
2.6
3.0
3.4
13.85
–40
3.8
1.8 V
3V
3.8 V
–15
Vdd [ V]
5
45
25
Tem perat ure [ ° C]
65
85
Figure 3.26. Calibrated HFRCO 21 MHz Band Frequency vs Temperature and Supply Voltage
21.2
21.2
-40° C
25° C
85° C
21.1
21.0
Frequency [ MHz]
Frequency [ MHz]
21.1
20.9
21.0
20.9
20.8
20.8
20.7
20.7
20.6
1.8
2.2
2.6
3.0
3.4
20.6
–40
3.8
1.8 V
3V
3.8 V
–15
Vdd [ V]
5
45
25
Tem perat ure [ ° C]
65
85
Figure 3.27. Calibrated HFRCO 28 MHz Band Frequency vs Temperature and Supply Voltage
28.1
28.0
28.0
27.9
27.9
Frequency [ MHz]
Frequency [ MHz]
28.1
27.8
27.7
27.6
27.8
27.7
27.6
-40° C
25° C
85° C
27.5
27.4
1.8
1.8 V
3V
3.8 V
2.2
2.6
3.0
3.4
27.5
27.4
–40
3.8
Vdd [ V]
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
32
–15
5
45
25
Tem perat ure [ ° C]
65
85
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3.9.5 ULFRCO
Table 3.14. ULFRCO
Symbol
Parameter
Condition
fULFRCO
Oscillation frequency
25°C, 3V
TCULFRCO
Temperature coefficient
VCULFRCO
Supply voltage coefficient
Min
Typ
Max
0.8
Unit
1.5 kHz
0.05
%/°C
-18.2
%/V
3.10 Analog Digital Converter (ADC)
Table 3.15. ADC
Symbol
Parameter
VADCIN
Input voltage range
Condition
Min
Single ended
Differential
VADCREFIN
Input range of external reference voltage, single ended and differential
Typ
Max
Unit
0
VREF V
-VREF/2
VREF/2 V
1.25
VDD V
VADCREFIN_CH7 Input range of external negative reference voltage on
channel 7
See VADCREFIN
0
VDD - 1.1 V
VADCREFIN_CH6 Input range of external positive reference voltage on
channel 6
See VADCREFIN
0.625
VDD V
0
VDD V
VADCCMIN
Common mode input range
IADCIN
Input current
CMRRADC
Analog input common
mode rejection ratio
IADC
2pF sampling capacitors
<100
nA
65
dB
1 MSamples/s, 12 bit, external reference
351
µA
1 MSamples/s, 12 bit, internal
reference
411
µA
10 kSamples/s 12 bit, internal
1.25 V reference, WARMUPMODE in ADCn_CTRL set to
0b00, ADC_CLK running at
13MHz
67
µA
10 kSamples/s 12 bit, internal
1.25 V reference, WARMUPMODE in ADCn_CTRL set to
0b01, ADC_CLK running at
13MHz
63
µA
10 kSamples/s 12 bit, internal
1.25 V reference, WARMUPMODE in ADCn_CTRL set to
0b10, ADC_CLK running at
13MHz
64
µA
2
pF
Average active current
CADCIN
Input capacitance
RADCIN
Input ON resistance
RADCFILT
Input RC filter resistance
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
1
MOhm
10
33
kOhm
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Symbol
Parameter
CADCFILT
Input RC filter/decoupling
capacitance
fADCCLK
ADC Clock Frequency
tADCCONV
Condition
Min
Typ
Max
250
Acquisition time
tADCACQVDD3
Required acquisition time
for VDD/3 reference
fF
13 MHz
6 bit
7
ADCCLK
Cycles
10 bit
11
ADCCLK
Cycles
12 bit
13
ADCCLK
Cycles
1
256 ADCCLK
Cycles
Conversion time
tADCACQ
Unit
Programmable
2
µs
Startup time of reference
generator and ADC core in
NORMAL mode
5
µs
Startup time of reference
generator and ADC core in
KEEPADCWARM mode
1
µs
1 MSamples/s, 12 bit, single
ended, internal 1.25V reference
59
dB
1 MSamples/s, 12 bit, single
ended, internal 2.5V reference
63
dB
1 MSamples/s, 12 bit, single
ended, VDD reference
65
dB
1 MSamples/s, 12 bit, differential, internal 1.25V reference
60
dB
1 MSamples/s, 12 bit, differential, internal 2.5V reference
65
dB
1 MSamples/s, 12 bit, differential, 5V reference
54
dB
1 MSamples/s, 12 bit, differential, VDD reference
67
dB
1 MSamples/s, 12 bit, differential, 2xVDD reference
69
dB
200 kSamples/s, 12 bit, single ended, internal 1.25V reference
62
dB
200 kSamples/s, 12 bit, single ended, internal 2.5V reference
63
dB
200 kSamples/s, 12 bit, single
ended, VDD reference
67
dB
tADCSTART
SNRADC
Signal to Noise Ratio
(SNR)
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Symbol
SNDRADC
Parameter
Signal to Noise-puls-Distortion Ratio (SNDR)
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
Condition
Min
Typ
Max
Unit
200 kSamples/s, 12 bit, differential, internal 1.25V reference
63
dB
200 kSamples/s, 12 bit, differential, internal 2.5V reference
66
dB
200 kSamples/s, 12 bit, differential, 5V reference
66
dB
200 kSamples/s, 12 bit, differential, VDD reference
69
dB
200 kSamples/s, 12 bit, differential, 2xVDD reference
70
dB
1 MSamples/s, 12 bit, single
ended, internal 1.25V reference
58
dB
1 MSamples/s, 12 bit, single
ended, internal 2.5V reference
62
dB
1 MSamples/s, 12 bit, single
ended, VDD reference
64
dB
1 MSamples/s, 12 bit, differential, internal 1.25V reference
60
dB
1 MSamples/s, 12 bit, differential, internal 2.5V reference
64
dB
1 MSamples/s, 12 bit, differential, 5V reference
54
dB
1 MSamples/s, 12 bit, differential, VDD reference
66
dB
1 MSamples/s, 12 bit, differential, 2xVDD reference
68
dB
200 kSamples/s, 12 bit, single ended, internal 1.25V reference
61
dB
200 kSamples/s, 12 bit, single ended, internal 2.5V reference
65
dB
200 kSamples/s, 12 bit, single
ended, VDD reference
66
dB
200 kSamples/s, 12 bit, differential, internal 1.25V reference
63
dB
200 kSamples/s, 12 bit, differential, internal 2.5V reference
66
dB
200 kSamples/s, 12 bit, differential, 5V reference
66
dB
200 kSamples/s, 12 bit, differential, VDD reference
68
dB
200 kSamples/s, 12 bit, differential, 2xVDD reference
69
dB
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Symbol
SFDRADC
VADCOFFSET
Parameter
Spurious-Free Dynamic
Range (SFDR)
Condition
Min
Typ
Max
Unit
1 MSamples/s, 12 bit, single
ended, internal 1.25V reference
64
dBc
1 MSamples/s, 12 bit, single
ended, internal 2.5V reference
76
dBc
1 MSamples/s, 12 bit, single
ended, VDD reference
73
dBc
1 MSamples/s, 12 bit, differential, internal 1.25V reference
66
dBc
1 MSamples/s, 12 bit, differential, internal 2.5V reference
77
dBc
1 MSamples/s, 12 bit, differential, VDD reference
76
dBc
1 MSamples/s, 12 bit, differential, 2xVDD reference
75
dBc
1 MSamples/s, 12 bit, differential, 5V reference
69
dBc
200 kSamples/s, 12 bit, single ended, internal 1.25V reference
75
dBc
200 kSamples/s, 12 bit, single ended, internal 2.5V reference
75
dBc
200 kSamples/s, 12 bit, single
ended, VDD reference
76
dBc
200 kSamples/s, 12 bit, differential, internal 1.25V reference
79
dBc
200 kSamples/s, 12 bit, differential, internal 2.5V reference
79
dBc
200 kSamples/s, 12 bit, differential, 5V reference
78
dBc
200 kSamples/s, 12 bit, differential, VDD reference
79
dBc
200 kSamples/s, 12 bit, differential, 2xVDD reference
79
dBc
After calibration, single ended
0.3
mV
After calibration, differential
0.3
mV
Offset voltage
-1.92
mV/°C
Thermometer output gradient
-6.3
ADC
Codes/
°C
DNLADC
Differential non-linearity
(DNL)
±0.7
LSB
INLADC
Integral non-linearity (INL),
End point method
±1.2
LSB
TGRADADCTH
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Symbol
Parameter
Condition
MCADC
No missing codes
Min
Typ
1
11.999
Max
12
Unit
bits
1
On the average every ADC will have one missing code, most likely to appear around 2048 +/- n*512 where n can be a value in
the set {-3, -2, -1, 1, 2, 3}. There will be no missing code around 2048, and in spite of the missing code the ADC will be monotonic
at all times so that a response to a slowly increasing input will always be a slowly increasing output. Around the one code that is
missing, the neighbour codes will look wider in the DNL plot. The spectra will show spurs on the level of -78dBc for a full scale
input for chips that have the missing code issue.
The integral non-linearity (INL) and differential non-linearity parameters are explained in Figure 3.28 (p.
37) and Figure 3.29 (p. 37) , respectively.
Figure 3.28. Integral Non-Linearity (INL)
Digit al ouput code
INL= |[ (VD -VSS)/VLSBIDEAL] - D| where 0 < D < 2 N - 1
4095
4094
Act ual ADC
t ranfer funct ion
before offset and
gain correct ion
4093
4092
Act ual ADC
t ranfer funct ion
aft er offset and
gain correct ion
INL Error
(End Point INL)
Ideal t ransfer
curve
3
2
1
VOFFSET
0
Analog Input
Figure 3.29. Differential Non-Linearity (DNL)
Digit al
ouput
code
DNL= |[ (VD+ 1 - VD )/VLSBIDEAL] - 1| where 0 < D < 2 N - 2
Full Scale Range
4095
4094
Exa m p le : Adjacent
input value VD+ 1
corrresponds t o digit al
out put code D+ 1
4093
4092
Act ual t ransfer
funct ion wit h one
m issing code.
Exa m p le : Input value
VD corrresponds t o
digit al out put code D
Code widt h = 2 LSB
DNL= 1 LSB
Ideal t ransfer
curve
5
0.5
LSB
Ideal spacing
bet ween t wo
adjacent codes
VLSBIDEAL= 1 LSB
4
3
2
1
Ideal 50%
Transit ion Point
Ideal Code Cent er
0
Analog Input
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
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3.10.1 Typical performance
Figure 3.30. ADC Frequency Spectrum, Vdd = 3V, Temp = 25°
0
0
–20
–20
–40
–40
Am plit ude [ dB]
Am plit ude [ dB]
–60
–80
–100
–60
–80
–100
–120
–120
–140
–140
–160
–180
0
20
40
60
Frequency [ kHz]
–160
80
0
20
1.25V Reference
40
60
Frequency [ kHz]
80
2.5V Reference
0
0
–20
–20
–40
–40
Am plit ude [ dB]
Am plit ude [ dB]
–60
–80
–100
–60
–80
–100
–120
–120
–140
–140
–160
–180
0
20
40
60
Frequency [ kHz]
–160
80
2XVDDVSS Reference
0
20
40
60
Frequency [ kHz]
80
5VDIFF Reference
0
–20
–40
Am plit ude [ dB]
–60
–80
–100
–120
–140
–160
–180
0
20
40
60
Frequency [ kHz]
80
VDD Reference
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1.5
1.5
1.0
1.0
0.5
0.5
INL (LSB)
INL (LSB)
Figure 3.31. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25°
0.0
0.0
–0.5
–0.5
–1.0
0
512
1024
1536
2048
2560
Out put code
3072
3584
–1.0
4096
0
512
1.25V Reference
1024
1536
2048
2560
Out put code
3072
3584
4096
3072
3584
4096
2.5V Reference
0.8
1.0
0.6
0.4
INL (LSB)
INL (LSB)
0.5
0.2
0.0
0.0
–0.2
–0.4
–0.5
–0.6
0
512
1024
1536
2048
2560
Out put code
3072
3584
4096
0
2XVDDVSS Reference
512
1024
1536
2048
2560
Out put code
5VDIFF Reference
0.8
0.6
0.4
INL (LSB)
0.2
0.0
–0.2
–0.4
–0.6
–0.8
0
512
1024
1536
2048
2560
Out put code
3072
3584
4096
VDD Reference
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1.0
1.0
0.5
0.5
DNL (LSB)
DNL (LSB)
Figure 3.32. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25°
0.0
–0.5
–1.0
0.0
–0.5
0
512
1024
1536
2048
2560
Out put code
3072
3584
–1.0
4096
0
512
1.0
1.0
0.5
0.5
0.0
–0.5
–1.0
1536
2048
2560
Out put code
3072
3584
4096
3072
3584
4096
2.5V Reference
DNL (LSB)
DNL (LSB)
1.25V Reference
1024
0.0
–0.5
0
512
1024
1536
2048
2560
Out put code
3072
3584
–1.0
4096
2XVDDVSS Reference
0
512
1024
1536
2048
2560
Out put code
5VDIFF Reference
1.0
DNL (LSB)
0.5
0.0
–0.5
–1.0
0
512
1024
1536
2048
2560
Out put code
3072
3584
4096
VDD Reference
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Figure 3.33. ADC Absolute Offset, Common Mode = Vdd /2
5
2.0
Vref= 1V25
Vref= 2V5
Vref= 2XVDDVSS
Vref= 5VDIFF
Vref= VDD
4
1.5
2
1.0
Act ual Offset [ LSB]
Act ual Offset [ LSB]
3
VRef= 1V25
VRef= 2V5
VRef= 2XVDDVSS
VRef= 5VDIFF
VRef= VDD
1
0
–1
0.5
0.0
–2
–0.5
–3
–4
2.0
2.2
2.4
2.6
2.8
3.0
Vdd (V)
3.2
3.4
3.6
–1.0
–40
3.8
Offset vs Supply Voltage, Temp = 25°
–15
5
45
25
Tem p (C)
65
85
Offset vs Temperature, Vdd = 3V
Figure 3.34. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V
79.4
71
2XVDDVSS
70
1V25
79.2
Vdd
69
79.0
67
5VDIFF
2V5
66
SFDR [ dB]
SNR [ dB]
68
Vdd
2V5
78.8
78.6
2XVDDVSS
78.4
65
78.2
64
63
–40
–15
5
45
25
Tem perat ure [ ° C]
65
5VDIFF
1V25
85
78.0
–40
Signal to Noise Ratio (SNR)
–15
5
45
25
Tem perat ure [ ° C]
65
85
Spurious-Free Dynamic Range (SFDR)
3.11 Digital Analog Converter (DAC)
Table 3.16. DAC
Symbol
VDACOUT
VDACCM
IDAC
Parameter
Condition
Min
Typ
Max
Unit
VDD voltage reference, single
ended
0
VDD V
VDD voltage reference, differential
-VDD
VDD V
0
VDD V
Output voltage range
Output common mode voltage range
Active current including references for 2 channels
500 kSamples/s, 12bit
400
µA
100 kSamples/s, 12 bit
200
µA
38
µA
1 kSamples/s 12 bit
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Symbol
Parameter
SRDAC
Sample rate
Condition
Min
Typ
Max
500 ksamples/s
Continuous Mode
fDAC
DAC clock frequency
CYCDACCONV
Clock cyckles per conversion
tDACCONV
Conversion time
tDACSETTLE
Settling time
SNRDAC
SNDRDAC
SFDRDAC
VDACOFFSET
Signal to Noise Ratio
(SNR)
Signal to Noise-pulse Distortion Ratio (SNDR)
Spurious-Free Dynamic
Range(SFDR)
Offset voltage
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
Unit
1000 kHz
Sample/Hold Mode
250 kHz
Sample/Off Mode
250 kHz
2
2
µs
5
µs
500 kSamples/s, 12 bit, single ended, internal 1.25V reference
58
dB
500 kSamples/s, 12 bit, single ended, internal 2.5V reference
59
dB
500 kSamples/s, 12 bit, differential, internal 1.25V reference
58
dB
500 kSamples/s, 12 bit, differential, internal 2.5V reference
58
dB
500 kSamples/s, 12 bit, differential, VDD reference
59
dB
500 kSamples/s, 12 bit, single ended, internal 1.25V reference
57
dB
500 kSamples/s, 12 bit, single ended, internal 2.5V reference
54
dB
500 kSamples/s, 12 bit, differential, internal 1.25V reference
56
dB
500 kSamples/s, 12 bit, differential, internal 2.5V reference
53
dB
500 kSamples/s, 12 bit, differential, VDD reference
55
dB
500 kSamples/s, 12 bit, single ended, internal 1.25V reference
62
dBc
500 kSamples/s, 12 bit, single ended, internal 2.5V reference
56
dBc
500 kSamples/s, 12 bit, differential, internal 1.25V reference
61
dBc
500 kSamples/s, 12 bit, differential, internal 2.5V reference
55
dBc
500 kSamples/s, 12 bit, differential, VDD reference
60
dBc
After calibration, single ended
2
mV
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Symbol
Parameter
Condition
Min
Typ
After calibration, differential
Max
2
Unit
mV
VDACSHMDRIFT
Sample-hold mode voltage
drift
540
µV/ms
DNLDAC
Differential non-linearity
±1
LSB
INLDAC
Integral non-linearity
±5
LSB
MCDAC
No missing codes
12
bits
3.12 Analog Comparator (ACMP)
Table 3.17. ACMP
Symbol
Parameter
VACMPIN
Input voltage range
0
VDD V
VACMPCM
ACMP Common Mode voltage range
0
VDD V
IACMP
Active current
Condition
Min
VACMPOFFSET
VACMPHYST
RCSRES
Current consumption of internal voltage reference
Max
Unit
BIASPROG=0b0000, FULLBIAS=0 and HALFBIAS=1 in
ACMPn_CTRL register
55
nA
BIASPROG=0b1111, FULLBIAS=0 and HALFBIAS=0 in
ACMPn_CTRL register
2.82
µA
BIASPROG=0b1111, FULLBIAS=1 and HALFBIAS=0 in
ACMPn_CTRL register
195
µA
0
µA
Internal voltage reference,
LPREF=1
50
nA
Internal voltage reference,
LPREF=0
6
µA
Single ended
10
mV
Differential
10
mV
Programmable
17
mV
CSRESSEL=0b00 in
ACMPn_INPUTSEL
39
kOhm
CSRESSEL=0b01 in
ACMPn_INPUTSEL
71
kOhm
CSRESSEL=0b10 in
ACMPn_INPUTSEL
104
kOhm
CSRESSEL=0b11 in
ACMPn_INPUTSEL
136
kOhm
Internal voltage reference off.
Using external voltage reference
IACMPREF
Typ
Offset voltage
ACMP hysteresis
Capacitive Sense Internal
Resistance
The total ACMP current is the sum of the contributions from the ACMP and its internal voltage reference
as given in Equation 3.1 (p. 43) . IACMPREF is zero if an external voltage reference is used.
Total ACMP Active Current
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IACMPTOTAL = IACMP + IACMPREF
(3.1)
Figure 3.35. Typical ACMP Characteristics
4.5
2.5
HYSTSEL= 0.0
HYSTSEL= 2.0
HYSTSEL= 4.0
HYSTSEL= 6.0
4.0
3.5
Response Tim e [ us]
Current [ uA]
2.0
1.5
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0.5
0.0
4
8
ACMP_CTRL_BIASPROG
0
0.0
12
Current consumption
0
2
4
6
8
10
ACMP_CTRL_BIASPROG
12
14
Response time
100
BIASPROG= 0.0
BIASPROG= 4.0
BIASPROG= 8.0
BIASPROG= 12.0
Hyst eresis [ m V]
80
60
40
20
0
0
1
2
4
3
ACMP_CTRL_HYSTSEL
5
6
7
Hysteresis
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3.13 Voltage Comparator (VCMP)
Table 3.18. VCMP
Symbol
Parameter
Condition
Min
Typ
Max
Unit
VVCMPIN
Input voltage range
VDD
V
VVCMPCM
VCMP Common Mode voltage range
VDD
V
BIASPROG=0b0000
and HALFBIAS=1 in
VCMPn_CTRL register
0.1
µA
14.7
µA
IVCMP
Active current
BIASPROG=0b1111
and HALFBIAS=0 in
VCMPn_CTRL register.
LPREF=0.
tVCMPREF
Startup time reference generator
NORMAL
10
µs
Single ended
10
mV
VVCMPOFFSET
Offset voltage
Differential
10
mV
17
mV
VVCMPHYST
VCMP hysteresis
The VDD trigger level can be configured by setting the TRIGLEVEL field of the VCMP_CTRL register in
accordance with the following equation:
VCMP Trigger Level as a Function of Level Setting
VDD Trigger Level=1.667V+0.034 ×TRIGLEVEL
(3.2)
3.14 Digital Peripherals
Table 3.19. Digital Peripherals
Symbol
Parameter
Condition
Min
IUSART
USART current
USART idle current, clock enabled
IUART
UART current
ILEUART
Typ
Max
Unit
7.5
µA/
MHz
UART idle current, clock enabled
5.63
µA/
MHz
LEUART current
LEUART idle current, clock
enabled
150
nA
II2C
I2C current
I2C idle current, clock enabled
6.25
µA/
MHz
ITIMER
TIMER current
TIMER_0 idle current, clock
enabled
8.75
µA/
MHz
ILETIMER
LETIMER current
LETIMER idle current, clock
enabled
150
nA
IPCNT
PCNT current
PCNT idle current, clock enabled
100
nA
IRTC
RTC current
RTC idle current, clock enabled
100
nA
IAES
AES current
AES idle current, clock enabled
2.5
µA/
MHz
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Symbol
Parameter
Condition
IGPIO
GPIO current
GPIO idle current, clock enabled
5.31
µA/
MHz
IEBI
EBI current
EBI idle current, clock enabled
1.56
µA/
MHz
IPRS
PRS current
PRS idle current
2,81
µA/
MHz
IDMA
DMA current
Clock enable
8.12
µA/
MHz
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
Min
46
Typ
Max
Unit
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4 Pinout and Package
Note
Please refer to the application note "AN0002 EFM32 Hardware Design Considerations" for
guidelines on designing Printed Circuit Boards (PCB's) for the EFM32G290.
4.1 Pinout
The EFM32G290 pinout is shown in Figure 4.1 (p. 47) and Table 4.1 (p. 47). Alternate locations
are denoted by "#" followed by the location number (Multiple locations on the same pin are split with "/").
Alternate locations can be configured in the LOCATION bitfield in the *_ROUTE register in the module
in question.
Figure 4.1. EFM32G290 Pinout (top view, not to scale)
Table 4.1. Device Pinout
Pin Alternate Functionality / Description
Pin #
BGA112 Pin#
and Name
Pin Name
Analog
A1
PE15
EBI_AD07 #0
LEU0_RX #2
A2
PE14
EBI_AD06 #0
LEU0_TX #2
A3
PE12
EBI_AD04 #0
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
EBI
Timers
TIM1_CC2 #1
47
Communication
Other
US0_CLK #0
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Pin Alternate Functionality / Description
Pin #
BGA112 Pin#
and Name
Pin Name
Analog
EBI
Timers
PCNT2_S1IN #1
A4
PE9
EBI_AD01 #0
A5
PD10
EBI_CS1 #0
A6
PF7
A7
PF5
EBI_REn #0
TIM0_CDTI2 #2
A8
PF4
EBI_WEn #0
TIM0_CDTI1 #2
A9
PE4
A10
PC14
ACMP1_CH6
TIM0_CDTI1 #1/3
TIM1_CC1 #0
PCNT0_S1IN #0
U0_TX #3
A11
PC15
ACMP1_CH7
TIM0_CDTI2 #1/3
TIM1_CC2 #0
U0_RX #3
DBG_SWO #1
B1
PA15
EBI_AD08 #0
B2
PE13
EBI_AD05 #0
US0_CS #0
ACMP0_O #0
B3
PE11
EBI_AD03 #0
TIM1_CC1 #1
B4
PE8
EBI_AD00 #0
PCNT2_S0IN #1
B5
PD11
EBI_CS2 #0
B6
PF8
TIM0_CC2 #2
B7
PF6
TIM0_CC0 #2
B8
PF3
B9
PE5
B10
PC12
ACMP1_CH4
B11
PC13
ACMP1_CH5
C1
PA1
EBI_AD10 #0
TIM0_CC1 #0/1
I2C0_SCL #0
C2
PA0
EBI_AD09 #0
TIM0_CC0 #0/1
I2C0_SDA #0
C3
PE10
EBI_AD02 #0
TIM1_CC0 #1
US0_TX #0
C4
PD13
C5
PD12
C6
PF9
C7
VSS
C8
PF2
C9
PE6
C10
PC10
ACMP1_CH2
C11
PC11
ACMP1_CH3
D1
PA3
EBI_AD12 #0
TIM0_CDTI0 #0
D2
PA2
EBI_AD11 #0
TIM0_CC2 #0/1
D3
PB15
D4
VSS
D5
IOVDD_6
D6
PD9
TIM0_CC1 #2
Communication
Other
U0_RX #0
US0_CS #1
EBI_ALE #0
US0_RX #0
U0_TX #0
TIM0_CDTI0 #2
US0_CLK #1
CMU_CLK0 #1
TIM0_CDTI0 #1/3
TIM1_CC0 #0
PCNT0_S0IN #0
CMU_CLK1 #0
EBI_CS3 #0
Ground
ACMP1_O #0
DBG_SWO #0
EBI_ARDY #0
US0_RX #1
TIM2_CC2 #2
US0_RX #2
US0_TX #2
U0_TX #2
CMU_CLK0 #0
Ground
Digital IO power supply 6.
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
EBI_CS0 #0
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Pin Alternate Functionality / Description
Pin #
BGA112 Pin#
and Name
Pin Name
Analog
EBI
Timers
Communication
D7
IOVDD_5
D8
PF1
D9
PE7
D10
PC8
ACMP1_CH0
TIM2_CC0 #2
US0_CS #2
D11
PC9
ACMP1_CH1
TIM2_CC1 #2
US0_CLK #2
E1
PA6
EBI_AD15 #0
E2
PA5
EBI_AD14 #0
TIM0_CDTI2 #0
LEU1_TX #1
E3
PA4
EBI_AD13 #0
TIM0_CDTI1 #0
U0_RX #2
E4
PB0
TIM1_CC0 #2
E8
PF0
LETIM0_OUT0 #2
E9
PE0
PCNT0_S0IN #1
U0_TX #1
E10
PE1
PCNT0_S1IN #1
U0_RX #1
E11
PE3
F1
PB1
TIM1_CC1 #2
F2
PB2
TIM1_CC2 #2
F3
PB3
PCNT1_S0IN #1
US2_TX #1
F4
PB4
PCNT1_S1IN #1
US2_RX #1
F8
VDD_DREG
Power supply for on-chip voltage regulator.
F9
VSS_DREG
Ground for on-chip voltage regulator.
F10
PE2
F11
DECOUPLE
G1
PB5
US2_CLK #1
G2
PB6
US2_CS #1
G3
VSS
G4
IOVDD_0
Digital IO power supply 0.
G8
IOVDD_4
Digital IO power supply 4.
G9
VSS
G10
PC6
ACMP0_CH6
LEU1_TX #0
I2C0_SDA #2
G11
PC7
ACMP0_CH7
LEU1_RX #0
I2C0_SCL #2
H1
PC0
ACMP0_CH0
H2
PC2
ACMP0_CH2
H3
PD14
H4
PA7
H5
PA8
H6
VSS
H7
IOVDD_3
H8
PD8
H9
PD5
Other
Digital IO power supply 5.
LETIM0_OUT1 #2
DBG_SWDIO #0/1
US0_TX #1
LEU1_RX #1
DBG_SWCLK #0/1
ACMP1_O #1
ACMP0_O #1
Decouple output for on-chip voltage regulator. An external capacitance of size CDECOUPLE is required at this pin.
Ground
Ground
PCNT0_S0IN #2
US1_TX #0
US2_TX #0
I2C0_SDA #3
TIM2_CC0 #0
Ground
Digital IO power supply 3.
CMU_CLK1 #1
ADC0_CH5
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
LEU0_RX #0
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Pin Alternate Functionality / Description
Pin #
BGA112 Pin#
and Name
Pin Name
Analog
H10
PD6
H11
EBI
Timers
Communication
ADC0_CH6
LETIM0_OUT0 #0
I2C0_SDA #1
PD7
ADC0_CH7
LETIM0_OUT1 #0
I2C0_SCL #1
J1
PC1
ACMP0_CH1
PCNT0_S1IN #2
US1_RX #0
J2
PC3
ACMP0_CH3
J3
PD15
J4
PA12
TIM2_CC0 #1
J5
PA9
TIM2_CC1 #0
J6
PA10
TIM2_CC2 #0
J7
PB9
J8
PB10
J9
PD2
ADC0_CH2
TIM0_CC1 #3
US1_CLK #1
J10
PD3
ADC0_CH3
TIM0_CC2 #3
US1_CS #1
J11
PD4
ADC0_CH4
LEU0_TX #0
K1
PB7
LFXTAL_P
US1_CLK #0
K2
PC4
ACMP0_CH4
K3
PA13
K4
VSS
K5
PA11
K6
RESETn
Reset input.
Active low, with internal pull-up.
K7
AVSS_1
Analog ground 1.
K8
AVDD_2
Analog power supply 2.
K9
AVDD_1
Analog power supply 1.
K10
AVSS_0
Analog ground 0.
K11
PD1
ADC0_CH1
L1
PB8
LFXTAL_N
L2
PC5
ACMP0_CH5
L3
PA14
L4
IOVDD_1
L5
PB11
DAC0_OUT0
LETIM0_OUT0 #1
L6
PB12
DAC0_OUT1
LETIM0_OUT1 #1
L7
AVSS_2
L8
PB13
HFXTAL_P
LEU0_TX #1
L9
PB14
HFXTAL_N
LEU0_RX #1
L10
AVDD_0
Analog power supply 0.
L11
PD0
ADC0_CH0
Other
US2_RX #0
I2C0_SCL #3
LETIM0_OUT0 #3
PCNT1_S0IN #0
US2_CLK #0
TIM2_CC1 #1
Ground
TIM0_CC0 #3
PCNT2_S1IN #0
US1_RX #1
US1_CS #0
LETIM0_OUT1 #3
PCNT1_S1IN #0
US2_CS #0
TIM2_CC2 #1
Digital IO power supply 1.
Analog ground 2.
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
PCNT2_S0IN #0
50
US1_TX #1
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4.2 Alternate functionality pinout
A wide selection of alternate functionality is available for multiplexing to various pins. This is shown in
Table 4.2 (p. 51) . The table shows the name of the alternate functionality in the first column, followed
by columns showing the possible LOCATION bitfield settings.
Note
Some functionality, such as analog interfaces, do not have alternate settings or a LOCATION bitfield. In these cases, the pinout is shown in the column corresponding to LOCATION 0.
Table 4.2. Alternate functionality overview
Alternate
LOCATION
Functionality
0
1
2
3
Description
ACMP0_CH0
PC0
Analog comparator ACMP0, channel 0.
ACMP0_CH1
PC1
Analog comparator ACMP0, channel 1.
ACMP0_CH2
PC2
Analog comparator ACMP0, channel 2.
ACMP0_CH3
PC3
Analog comparator ACMP0, channel 3.
ACMP0_CH4
PC4
Analog comparator ACMP0, channel 4.
ACMP0_CH5
PC5
Analog comparator ACMP0, channel 5.
ACMP0_CH6
PC6
Analog comparator ACMP0, channel 6.
ACMP0_CH7
PC7
Analog comparator ACMP0, channel 7.
ACMP0_O
PE13
ACMP1_CH0
PC8
Analog comparator ACMP1, channel 0.
ACMP1_CH1
PC9
Analog comparator ACMP1, channel 1.
ACMP1_CH2
PC10
Analog comparator ACMP1, channel 2.
ACMP1_CH3
PC11
Analog comparator ACMP1, channel 3.
ACMP1_CH4
PC12
Analog comparator ACMP1, channel 4.
ACMP1_CH5
PC13
Analog comparator ACMP1, channel 5.
ACMP1_CH6
PC14
Analog comparator ACMP1, channel 6.
ACMP1_CH7
PC15
Analog comparator ACMP1, channel 7.
ACMP1_O
PF2
ADC0_CH0
PD0
Analog to digital converter ADC0, input channel number 0.
ADC0_CH1
PD1
Analog to digital converter ADC0, input channel number 1.
ADC0_CH2
PD2
Analog to digital converter ADC0, input channel number 2.
ADC0_CH3
PD3
Analog to digital converter ADC0, input channel number 3.
ADC0_CH4
PD4
Analog to digital converter ADC0, input channel number 4.
ADC0_CH5
PD5
Analog to digital converter ADC0, input channel number 5.
ADC0_CH6
PD6
Analog to digital converter ADC0, input channel number 6.
ADC0_CH7
PD7
Analog to digital converter ADC0, input channel number 7.
CMU_CLK0
PA2
PC12
Clock Management Unit, clock output number 0.
CMU_CLK1
PA1
PD8
Clock Management Unit, clock output number 1.
DAC0_OUT0
PB11
Digital to Analog Converter DAC0 output channel number 0.
DAC0_OUT1
PB12
Digital to Analog Converter DAC0 output channel number 1.
DBG_SWCLK
PF0
PE2
Analog comparator ACMP0, digital output.
PE3
Analog comparator ACMP1, digital output.
PF0
2012-02-27 - EFM32G290FXX - d0007_Rev1.40
Debug-interface Serial Wire clock input.
51
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Alternate
LOCATION
Functionality
0
1
2
3
Description
Note that this function is enabled to pin out of reset, and has a built-in pull
down.
Debug-interface Serial Wire data input / output.
DBG_SWDIO
PF1
PF1
Note that this function is enabled to pin out of reset, and has a built-in pull up.
Debug-interface Serial Wire viewer Output.
DBG_SWO
PF2
PC15
EBI_AD00
PE8
External Bus Interface (EBI) address and data input / output pin 00.
EBI_AD01
PE9
External Bus Interface (EBI) address and data input / output pin 01.
EBI_AD02
PE10
External Bus Interface (EBI) address and data input / output pin 02.
EBI_AD03
PE11
External Bus Interface (EBI) address and data input / output pin 03.
EBI_AD04
PE12
External Bus Interface (EBI) address and data input / output pin 04.
EBI_AD05
PE13
External Bus Interface (EBI) address and data input / output pin 05.
EBI_AD06
PE14
External Bus Interface (EBI) address and data input / output pin 06.
EBI_AD07
PE15
External Bus Interface (EBI) address and data input / output pin 07.
EBI_AD08
PA15
External Bus Interface (EBI) address and data input / output pin 08.
EBI_AD09
PA0
External Bus Interface (EBI) address and data input / output pin 09.
EBI_AD10
PA1
External Bus Interface (EBI) address and data input / output pin 10.
EBI_AD11
PA2
External Bus Interface (EBI) address and data input / output pin 11.
EBI_AD12
PA3
External Bus Interface (EBI) address and data input / output pin 12.
EBI_AD13
PA4
External Bus Interface (EBI) address and data input / output pin 13.
EBI_AD14
PA5
External Bus Interface (EBI) address and data input / output pin 14.
EBI_AD15
PA6
External Bus Interface (EBI) address and data input / output pin 15.
EBI_ALE
PF3
External Bus Interface (EBI) Address Latch Enable output.
EBI_ARDY
PF2
External Bus Interface (EBI) Hardware Ready Control input.
EBI_CS0
PD9
External Bus Interface (EBI) Chip Select output 0.
EBI_CS1
PD10
External Bus Interface (EBI) Chip Select output 1.
EBI_CS2
PD11
External Bus Interface (EBI) Chip Select output 2.
EBI_CS3
PD12
External Bus Interface (EBI) Chip Select output 3.
EBI_REn
PF5
External Bus Interface (EBI) Read Enable output.
EBI_WEn
PF4
External Bus Interface (EBI) Write Enable output.
HFXTAL_N
PB14
High Frequency Crystal (4 - 32 MHz) negative pin. Also used as external optional clock input pin.
HFXTAL_P
PB13
High Frequency Crystal (4 - 32 MHz) positive pin.
I2C0_SCL
PA1
PD7
PC7
PD15
I2C0 Serial Clock Line input / output.
I2C0_SDA
PA0
PD6
PC6
PD14
I2C0 Serial Data input / output.
LETIM0_OUT0
PD6
PB11
PF0
PC4
Low Energy Timer LETIM0, output channel 0.
LETIM0_OUT1
PD7
PB12
PF1
PC5
Low Energy Timer LETIM0, output channel 1.
LEU0_RX
PD5
PB14
PE15
LEUART0 Receive input.
LEU0_TX
PD4
PB13
PE14
LEUART0 Transmit output. Also used as receive input in half duplex communication.
LEU1_RX
PC7
PA6
LEUART1 Receive input.
LEU1_TX
PC6
PA5
LEUART1 Transmit output. Also used as receive input in half duplex communication.
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Alternate
LOCATION
Functionality
0
1
2
3
Description
LFXTAL_N
PB8
Low Frequency Crystal (typically 32.768 kHz) negative pin. Also used as an
optional external clock input pin.
LFXTAL_P
PB7
Low Frequency Crystal (typically 32.768 kHz) positive pin.
PCNT0_S0IN
PC13
PE0
PC0
Pulse Counter PCNT0 input number 0.
PCNT0_S1IN
PC14
PE1
PC1
Pulse Counter PCNT0 input number 1.
PCNT1_S0IN
PC4
PB3
Pulse Counter PCNT1 input number 0.
PCNT1_S1IN
PC5
PB4
Pulse Counter PCNT1 input number 1.
PCNT2_S0IN
PD0
PE8
Pulse Counter PCNT2 input number 0.
PCNT2_S1IN
PD1
PE9
Pulse Counter PCNT2 input number 1.
TIM0_CC0
PA0
PA0
PF6
PD1
Timer 0 Capture Compare input / output channel 0.
TIM0_CC1
PA1
PA1
PF7
PD2
Timer 0 Capture Compare input / output channel 1.
TIM0_CC2
PA2
PA2
PF8
PD3
Timer 0 Capture Compare input / output channel 2.
TIM0_CDTI0
PA3
PC13
PF3
PC13
Timer 0 Complimentary Deat Time Insertion channel 0.
TIM0_CDTI1
PA4
PC14
PF4
PC14
Timer 0 Complimentary Deat Time Insertion channel 1.
TIM0_CDTI2
PA5
PC15
PF5
PC15
Timer 0 Complimentary Deat Time Insertion channel 2.
TIM1_CC0
PC13
PE10
PB0
Timer 1 Capture Compare input / output channel 0.
TIM1_CC1
PC14
PE11
PB1
Timer 1 Capture Compare input / output channel 1.
TIM1_CC2
PC15
PE12
PB2
Timer 1 Capture Compare input / output channel 2.
TIM2_CC0
PA8
PA12
PC8
Timer 2 Capture Compare input / output channel 0.
TIM2_CC1
PA9
PA13
PC9
Timer 2 Capture Compare input / output channel 1.
TIM2_CC2
PA10
PA14
PC10
Timer 2 Capture Compare input / output channel 2.
U0_RX
PF7
PE1
PA4
PC15
UART0 Receive input.
U0_TX
PF6
PE0
PA3
PC14
UART0 Transmit output. Also used as receive input in half duplex communication.
US0_CLK
PE12
PE5
PC9
USART0 clock input / output.
US0_CS
PE13
PE4
PC8
USART0 chip select input / output.
US0_RX
PE11
PE6
PC10
USART0 Asynchronous Receive.
USART0 Synchronous mode Master Input / Slave Output (MISO).
US0_TX
PE10
PE7
USART0 Asynchronous Transmit.Also used as receive input in half duplex
communication.
PC11
USART0 Synchronous mode Master Output / Slave Input (MOSI).
US1_CLK
PB7
PD2
USART1 clock input / output.
US1_CS
PB8
PD3
USART1 chip select input / output.
US1_RX
PC1
PD1
USART1 Asynchronous Receive.
USART1 Synchronous mode Master Input / Slave Output (MISO).
US1_TX
PC0
USART1 Asynchronous Transmit.Also used as receive input in half duplex
communication.
PD0
USART1 Synchronous mode Master Output / Slave Input (MOSI).
US2_CLK
PC4
PB5
USART2 clock input / output.
US2_CS
PC5
PB6
USART2 chip select input / output.
US2_RX
PC3
PB4
USART2 Asynchronous Receive.
USART2 Synchronous mode Master Input / Slave Output (MISO).
US2_TX
PC2
USART2 Asynchronous Transmit.Also used as receive input in half duplex
communication.
PB3
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Alternate
LOCATION
Functionality
0
1
2
3
Description
USART2 Synchronous mode Master Output / Slave Input (MOSI).
4.3 GPIO pinout overview
The specific GPIO pins available in EFM32G290 is shown in Table 4.3 (p. 54) . Each GPIO port is
organized as 16-bit ports indicated by letters A through F, and the individual pin on this port in indicated
by a number from 15 down to 0.
Table 4.3. GPIO Pinout
Port
Pin
15
Pin
14
Pin
13
Pin
12
Pin
11
Pin
10
Pin
9
Pin
8
Pin
7
Pin
6
Pin
5
Pin
4
Pin
3
Pin
2
Pin
1
Pin
0
Port A
PA15
PA14
PA13
PA12
PA11
PA10
PA9
PA8
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
Port B
PB15
PB14
PB13
PB12
PB11
PB10
PB9
PB8
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
Port C
PC15
PC14
PC13
PC12
PC11
PC10
PC9
PC8
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
Port D
PD15
PD14
PD13
PD12
PD11
PD10
PD9
PD8
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
Port E
PE15
PE14
PE13
PE12
PE11
PE10
PE9
PE8
PE7
PE6
PE5
PE4
PE3
PE2
PE1
PE0
Port F
-
-
-
-
-
-
PF9
PF8
PF7
PF6
PF5
PF4
PF3
PF2
PF1
PF0
4.4 BGA112 Package
Figure 4.2. BGA112
Note:
1. The dimensions in parenthesis are reference.
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2. Datum 'C' and seating plane are defined by the crown of the solder balls.
3. All dimensions are in millimeters.
The BGA112 Package uses Sn96.5/Ag3/Cu0.5 solderballs.
All EFM32 packages are RoHS compliant and free of Bromine (Br) and Antimony (Sb).
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5 PCB Layout and Soldering
5.1 Recommended PCB Layout
Figure 5.1. BGA112 PCB Land Pattern
c1
a
cn
r1
b
e
rn
d
Table 5.1. BGA112 PCB Land Pattern Dimensions (Dimensions in mm)
Symbol
Dim. (mm)
Symbol
Row name and
column number
a
0.35
r1
A
b
0.80
rn
L
d
8.00
c1
1
e
8.00
cn
11
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Figure 5.2. BGA112 PCB Solder Mask
a
b
e
d
Table 5.2. BGA112 PCB Solder Mask Dimensions (Dimensions in mm)
Symbol
Dim. (mm)
a
0.48
b
0.80
d
8.00
e
8.00
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Figure 5.3. BGA112 PCB Stencil Design
a
b
e
d
Table 5.3. BGA112 PCB Stencil Design Dimensions (Dimensions in mm)
1.
2.
3.
4.
5.
Symbol
Dim. (mm)
a
0.33
b
0.80
d
8.00
e
8.00
The drawings are not to scale.
All dimensions are in millimeters.
All drawings are subject to change without notice.
The PCB Land Pattern drawing is in compliance with IPC-7351B.
Stencil thickness 0.125 mm.
5.2 Soldering Information
The latest IPC/JEDEC J-STD-020 recommendations for Pb-Free reflow soldering should be followed.
The packages have a Moisture Sensitivity Level rating of 3, please see the latest IPC/JEDEC J-STD-033
standard for MSL description and level 3 bake conditions.
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6 Chip Marking, Revision and Errata
6.1 Chip Marking
In the illustration below package fields and position are shown.
Figure 6.1. Example Chip Marking
6.2 Revision
The revision of a chip can be determined from the "Revision" field in Figure 6.1 (p. 59) . If the revision
says "ES" (Engineering Sample), the revision must be read out electronically as specified in the reference
manual.
6.3 Errata
Please see the dxxxx_efm32g290_errata.pdf for description and resolution of device erratas. This document is available in Simplicity Studio or online at http://www.energymicro.com/downloads/datasheets.
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7 Revision History
7.1 Revision 1.40
February 27nd, 2012
Updated Power Managment section.
Corrected operating voltage from 1.8 V to 1.85 V.
Corrected TGRADADCTH parameter.
Corrected BGA112 package drawing.
Updated PCB land pattern, solder mask and stencil design.
7.2 Revision 1.30
May 20th, 2011
Updated LFXO load capacitance section
7.3 Revision 1.20
December 17th, 2010
Increased max storage temperature.
Added data for <150°C and <70°C on Flash data retention.
Changed latch-up sensitivity test description.
Added IO leakage current
Added Flash current consumption
Updated HFRCO data
Updated LFRCO data
Added graph for ADC Absolute Offset over temperature
Added graph for ADC Temperature sensor readout
7.4 Revision 1.11
November 17th, 2010
Corrected maximum DAC clock speed for continuous mode.
Added DAC sample-hold mode voltage drift rate.
Added pulse widths detected by the HFXO glitch detector.
Added power sequencing information to Power Management section.
7.5 Revision 1.10
September 13th, 2010
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Added typical values for RADCFILT and CADCFILT.
Added two conditions for DAC clock frequency; one for sample/hold and one for sample/off.
Added RoHS information and specified leadframe/solderballs material.
Added Serial Bootloader to feature list and system summary.
Updated ADC characterization data.
Updated DAC characterization data.
Updated RCO characterization data.
Updated ACMP characterization data.
Updated VCMP characterization data.
7.6 Revision 1.00
April 23rd, 2010
ADC_VCM line removed.
Added pinout illustration and additional pinout table.
Changed "Errata" chapter. Errata description moved to separate document.
Document changed status from "Preliminary".
Updated "Electrical Characteristics" chapter.
7.7 Revision 0.85
February 19th, 2010
Renamed DBG_SWV pin to DBG_SWO.
7.8 Revision 0.83
January 25th, 2010
Updated errata section.
Specified flash word width in Section 3.7 (p. 19)
Added Capacitive Sense Internal Resistor values in Section 3.12 (p. 43) .
7.9 Revision 0.82
December 9th, 2009
Updated conctact information.
ADC current consumption numbers updated in Section 3.10 (p. 33)
7.10 Revision 0.81
November 20th, 2009
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Section 3.1 (p. 9) updated.
Storage temperature in Section 3.2 (p. 9) updated.
Temperature coefficient of band-gap reference in Section 3.6 (p. 18) added.
Erase times in Section 3.7 (p. 19) updated.
Definitions of DNL and INL added in Figure 3.28 (p. 37) and Figure 3.29 (p. 37) .
Current consumption of digital peripherals added in Section 3.14 (p. 45) .
Pinout information in Table 4.1 (p. 47) corrected.
Updated errata section.
7.11 Revision 0.80
Initial preliminary revision, October 19th, 2009
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A Disclaimer and Trademarks
A.1 Disclaimer
Energy Micro AS intends to provide customers with the latest, accurate, and in-depth documentation of
all peripherals and modules available for system and software implementers using or intending to use
the Energy Micro products. Characterization data, available modules and peripherals, memory sizes and
memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in
different applications. Application examples described herein are for illustrative purposes only. Energy
Micro reserves the right to make changes without further notice and limitation to product information,
specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness
of the included information. Energy Micro shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder
to design or fabricate any integrated circuits. The products must not be used within any Life Support
System without the specific written consent of Energy Micro. A "Life Support System" is any product or
system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected
to result in significant personal injury or death. Energy Micro products are generally not intended for
military applications. Energy Micro products shall under no circumstances be used in weapons of mass
destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable
of delivering such weapons.
A.2 Trademark Information
Energy Micro, EFM32, EFR, logo and combinations thereof, and others are the registered trademarks or
trademarks of Energy Micro AS. ARM, CORTEX, THUMB are the registered trademarks of ARM Limited.
Other terms and product names may be trademarks of others.
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B Contact Information
B.1 Energy Micro Corporate Headquarters
Postal Address
Visitor Address
Technical Support
Energy Micro AS
P.O. Box 4633 Nydalen
N-0405 Oslo
NORWAY
Energy Micro AS
Sandakerveien 118
N-0484 Oslo
NORWAY
support.energymicro.com
Phone: +47 40 10 03 01
www.energymicro.com
Phone: +47 23 00 98 00
Fax: + 47 23 00 98 01
B.2 Global Contacts
Visit www.energymicro.com for information on global distributors and representatives or contact
sales@energymicro.com for additional information.
Americas
Europe, Middle East and Africa Asia and Pacific
www.energymicro.com/americas www.energymicro.com/emea
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Table of Contents
1. Ordering Information .................................................................................................................................. 2
2. System Summary ...................................................................................................................................... 3
2.1. System Introduction ......................................................................................................................... 3
2.2. Configuration Summary .................................................................................................................... 6
2.3. Memory Map ................................................................................................................................. 7
3. Electrical Characteristics ............................................................................................................................. 9
3.1. Test Conditions .............................................................................................................................. 9
3.2. Absolute Maximum Ratings .............................................................................................................. 9
3.3. General Operating Conditions ........................................................................................................... 9
3.4. Current Consumption ..................................................................................................................... 11
3.5. Transition between Energy Modes .................................................................................................... 18
3.6. Power Management ....................................................................................................................... 18
3.7. Flash .......................................................................................................................................... 19
3.8. General Purpose Input Output ......................................................................................................... 20
3.9. Oscillators .................................................................................................................................... 27
3.10. Analog Digital Converter (ADC) ...................................................................................................... 33
3.11. Digital Analog Converter (DAC) ...................................................................................................... 41
3.12. Analog Comparator (ACMP) .......................................................................................................... 43
3.13. Voltage Comparator (VCMP) ......................................................................................................... 45
3.14. Digital Peripherals ....................................................................................................................... 45
4. Pinout and Package ................................................................................................................................. 47
4.1. Pinout ......................................................................................................................................... 47
4.2. Alternate functionality pinout ............................................................................................................ 51
4.3. GPIO pinout overview .................................................................................................................... 54
4.4. BGA112 Package .......................................................................................................................... 54
5. PCB Layout and Soldering ........................................................................................................................ 56
5.1. Recommended PCB Layout ............................................................................................................ 56
5.2. Soldering Information ..................................................................................................................... 58
6. Chip Marking, Revision and Errata .............................................................................................................. 59
6.1. Chip Marking ................................................................................................................................ 59
6.2. Revision ...................................................................................................................................... 59
6.3. Errata ......................................................................................................................................... 59
7. Revision History ...................................................................................................................................... 60
7.1. Revision 1.40 ............................................................................................................................... 60
7.2. Revision 1.30 ............................................................................................................................... 60
7.3. Revision 1.20 ............................................................................................................................... 60
7.4. Revision 1.11 ............................................................................................................................... 60
7.5. Revision 1.10 ............................................................................................................................... 60
7.6. Revision 1.00 ............................................................................................................................... 61
7.7. Revision 0.85 ............................................................................................................................... 61
7.8. Revision 0.83 ............................................................................................................................... 61
7.9. Revision 0.82 ............................................................................................................................... 61
7.10. Revision 0.81 .............................................................................................................................. 61
7.11. Revision 0.80 .............................................................................................................................. 62
A. Disclaimer and Trademarks ....................................................................................................................... 63
A.1. Disclaimer ................................................................................................................................... 63
A.2. Trademark Information ................................................................................................................... 63
B. Contact Information ................................................................................................................................. 64
B.1. Energy Micro Corporate Headquarters .............................................................................................. 64
B.2. Global Contacts ............................................................................................................................ 64
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List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32G290 Memory Map with largest RAM and Flash sizes .......................................................................... 8
3.1. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at
28MHz ..................................................................................................................................................... 12
3.2. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at
21MHz ..................................................................................................................................................... 12
3.3. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at
14MHz ..................................................................................................................................................... 13
3.4. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at
11MHz ..................................................................................................................................................... 13
3.5. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at
7MHz ....................................................................................................................................................... 14
3.6. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 28MHz ............................... 14
3.7. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 21MHz ............................... 15
3.8. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 14MHz ............................... 15
3.9. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 11MHz ............................... 16
3.10. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 7MHz ............................... 16
3.11. EM2 current consumption. RTC prescaled to 1kHz, 32 kHz LFRCO. ............................................................. 17
3.12. EM3 current consumption. ................................................................................................................... 17
3.13. EM4 current consumption. ................................................................................................................... 18
3.14. Typical Low-Level Output Current, 2V Supply Voltage ................................................................................ 21
3.15. Typical High-Level Output Current, 2V Supply Voltage ................................................................................ 22
3.16. Typical Low-Level Output Current, 3V Supply Voltage ................................................................................ 23
3.17. Typical High-Level Output Current, 3V Supply Voltage ................................................................................ 24
3.18. Typical Low-Level Output Current, 3.8V Supply Voltage .............................................................................. 25
3.19. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................. 26
3.20. Minimum Load Capacitance (CLFXOL) Requirement For Safe Crystal Startup ................................................... 27
3.21. Calibrated LFRCO Frequency vs Temperature and Supply Voltage .............................................................. 29
3.22. Calibrated HFRCO 1 MHz Band Frequency vs Temperature and Supply Voltage ............................................ 31
3.23. Calibrated HFRCO 7 MHz Band Frequency vs Temperature and Supply Voltage ............................................ 31
3.24. Calibrated HFRCO 11 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.25. Calibrated HFRCO 14 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 32
3.26. Calibrated HFRCO 21 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 32
3.27. Calibrated HFRCO 28 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 32
3.28. Integral Non-Linearity (INL) ................................................................................................................... 37
3.29. Differential Non-Linearity (DNL) .............................................................................................................. 37
3.30. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 38
3.31. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 39
3.32. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 40
3.33. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 41
3.34. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V .............................................. 41
3.35. Typical ACMP Characteristics ............................................................................................................... 44
4.1. EFM32G290 Pinout (top view, not to scale) ............................................................................................... 47
4.2. BGA112 .............................................................................................................................................. 54
5.1. BGA112 PCB Land Pattern ..................................................................................................................... 56
5.2. BGA112 PCB Solder Mask ..................................................................................................................... 57
5.3. BGA112 PCB Stencil Design ................................................................................................................... 58
6.1. Example Chip Marking ........................................................................................................................... 59
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List of Tables
1.1. Ordering Information ................................................................................................................................ 2
2.1. Configuration Summary ............................................................................................................................ 6
3.1. Absolute Maximum Ratings ...................................................................................................................... 9
3.2. General Operating Conditions ................................................................................................................... 9
3.3. Environmental ....................................................................................................................................... 10
3.4. Current Consumption ............................................................................................................................. 11
3.5. Energy Modes Transitions ...................................................................................................................... 18
3.6. Power Management ............................................................................................................................... 19
3.7. Flash .................................................................................................................................................. 19
3.8. GPIO .................................................................................................................................................. 20
3.9. LFXO .................................................................................................................................................. 27
3.10. Minimum Load Capacitance (CLFXOL) Requirement For Safe Crystal Startup ................................................... 27
3.11. HFXO ................................................................................................................................................ 28
3.12. LFRCO .............................................................................................................................................. 28
3.13. HFRCO ............................................................................................................................................. 30
3.14. ULFRCO ............................................................................................................................................ 33
3.15. ADC .................................................................................................................................................. 33
3.16. DAC .................................................................................................................................................. 41
3.17. ACMP ............................................................................................................................................... 43
3.18. VCMP ............................................................................................................................................... 45
3.19. Digital Peripherals ............................................................................................................................... 45
4.1. Device Pinout ....................................................................................................................................... 47
4.2. Alternate functionality overview ................................................................................................................ 51
4.3. GPIO Pinout ........................................................................................................................................ 54
5.1. BGA112 PCB Land Pattern Dimensions (Dimensions in mm) ......................................................................... 56
5.2. BGA112 PCB Solder Mask Dimensions (Dimensions in mm) ......................................................................... 57
5.3. BGA112 PCB Stencil Design Dimensions (Dimensions in mm) ....................................................................... 58
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List of Equations
3.1. Total ACMP Active Current ..................................................................................................................... 43
3.2. VCMP Trigger Level as a Function of Level Setting ..................................................................................... 45
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