Features • Fast read access time – 45ns • Low-power CMOS operation • • • • • • • • – 100µA max standby – 20mA max active at 5MHz JEDEC standard packages – 28-lead PDIP – 32-lead PLCC 5V± 10% supply High-reliability CMOS technology – 2,000V ESD protection – 200mA latchup immunity Rapid programming algorithm – 100µs/byte (typical) CMOS- and TTL-compatible inputs and outputs Integrated product identification code Industrial and automotive temperature ranges Green (Pb/halide-free) packaging option 1. 512K (64K x 8) One-time Programmable, Read-only Memory Atmel AT27C512R Description The Atmel® AT27C512R is a low-power, high-performance, 524,288-bit, one-time programmable, read-only memory (OTP EPROM) organized as 64K by 8 bits. It requires only one 5V power supply in normal read mode operation. Any byte can be accessed in less than 45ns, eliminating the need for speed reducing WAIT states on high-performance microprocessor systems. The Atmel scaled CMOS technology provides high speed, lower active power consumption, and significantly faster programming. Power consumption is typically only 8mA in active mode and less than 10µA in standby mode. The AT27C512R is available in a choice of industry-standard, JEDEC-approved, one-time programmable (OTP) PDIP and PLCC packages. All devices feature two-line control (CE, OE) to give designers the flexibility to prevent bus contention. With 64K byte storage capability, the AT27C512R allows firmware to be stored reliably and to be accessed by the system without the delays of mass storage media. The AT27C512R has additional features to ensure high quality and efficient production use. The rapid programming algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 100µs/byte. The integrated product identification code electronically identifies the device and manufacturer. This feature is used by industry standard programming equipment to select the proper programming algorithms and voltages. 0015P–EPROM–10/11 Pin configurations Addresses O0 - O7 Outputs CE Chip enable OE/VPP Output enable/ Program supply NC No connect A7 A12 A15 NC VCC A14 A13 A0 - A15 28-lead PDIP Top view 32-lead PLCC Top view A6 A5 A4 A3 A2 A1 A0 NC O0 4 3 2 1 32 31 30 Function 5 6 7 8 9 10 11 12 13 29 28 27 26 25 24 23 22 21 14 15 16 17 18 19 20 Pin name A8 A9 A11 NC OE/VPP A10 CE O7 O6 O1 O2 GND NC O3 O4 O5 2. Note: 3. A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC A14 A13 A8 A9 A11 OE/VPP A10 CE O7 O6 O5 O4 O3 PLCC package pins 1 and 17 are don’t connect System considerations Switching between active and standby conditions via the chip enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may exceed datasheet limits, resulting in device nonconformance. At a minimum, a 0.1µF, high-frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor should be connected between the VCC and ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7µF bulk electrolytic capacitor should be utilized, again connected between the VCC and ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array. Figure 3-1. 2 Block diagram Atmel AT27C512R 0015P–EPROM–10/11 Atmel AT27C512R 4. Absolute maximum ratings* *NOTICE: Temperature under bias . . . . . . . . . . . . . -55°C to + 125°C Storage temperature . . . . . . . . . . . . . . . . -65°C to + 150°C Voltage on any pin with respect to ground . . . . . . . . . . . . . . . . . . .-2.0V to + 7.0V(1) Stresses beyond those listed under “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Voltage on A9 with respect to ground . . . . . . . . . . . . . . . . -2.0V to + 14.0V(1) VPP supply voltage with respect to ground . . . . . . . . . . . . . . . . . -2.0V to + 14.0V(1) Note: 5. 1. Minimum voltage is -0.6V DC, which may undershoot to -2.0V for pulses of less than 20ns. Maximum output pin voltage is VCC + 0.75V DC, which may overshoot to +7.0V for pulses of less than 20ns. DC and AC characteristics Table 5-1. Operating modes Mode/Pin CE OE/VPP Ai Outputs Read VIL VIL Ai DOUT Output disable VIL (1) VIH X High Z (1) X High Z DIN Standby VIH X Rapid program(2) VIL VPP Ai VPP (1) PGM inhibit VIH X High Z (3) Product identification(4) Notes: VIL A9 =VH A0 = VIH or VIL A1 - A15 = VIL VIL Identification code 1. X can be VIL or VIH. 2. Refer to programming characteristics. 3. VH = 12.0 ± 0.5V. 4. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9, which is set to VH, and A0, which is toggled low (VIL) to select the manufacturer’s identification byte and high (VIH) to select the device code byte. Table 5-2. DC and AC operating conditions for read operation Atmel AT27C512R Ind. -45 -70 -40°C - 85°C -40°C - 85°C Operating temp. (case) Auto. VCC supply -40C - 125C 5V ±10% 5V ±10% 3 0015P–EPROM–10/11 Table 5-3. DC and operating characteristics for read operation Symbol Parameter Condition ILI Input load current VIN = 0V to VCC ILO Output leakage current ISB VCC(1) standby current ICC VCC active current VIL Input low voltage VIH Input high voltage VOL Output low voltage IOL = 2.1mA VOH Output high voltage IOH = -400µA Note: Min Max Units Ind. ±1 µA Auto. ±5 µA Ind. ±5 µA Auto. ±10 µA 100 µA ISB2 (TTL), CE = 2.0 to VCC 0.5V 1 mA f = 5MHz, IOUT = 0mA, CE = VIL 20 mA -0.6 0.8 V 2.0 VCC + 0.5 V 0.4 V VOUT = 0V to VCC ISB1 (CMOS), CE = VCC 0.3V 2.4 V 1. VCC must be applied simultaneously with or before OE/VPP, and removed simultaneously with or after OE/VPP. Table 5-4. AC characteristics for read operation Atmel AT27C512R -45 Symbol Parameter Condition tACC(1) Address to output delay CE = OE/VPP = VIL tCE(1) CE to output delay tOE(1) OE/VPP to output delay tDF(1) OE/VPP or CE high to output float, whichever occurred first tOH Output hold from address, CE or OE/VPP, whichever occurred first Note: 4 Min -70 Max Units 45 70 ns OE/VPP = VIL 45 70 ns CE = VIL 20 30 ns 20 25 ns 7 Max Min 7 ns 1. See AC waveforms for read operation. Atmel AT27C512R 0015P–EPROM–10/11 Atmel AT27C512R Figure 5-1. Notes: AC waveforms for read operation(1) 1. Timing measurement reference level is 1.5V for -45 devices. Input AC drive levels are VIL = 0.0V and VIH = 3.0V. Timing measurement reference levels for all other speed grades are VOL = 0.8V and VOH = 2.0V. Input AC drive levels are VIL = 0.45V and VIH = 2.4V. 2. OE/VPP may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 3. OE/VPP may be delayed up to tACC - tOE after the address is valid without impact on tACC. 4. This parameter is only sampled, and is not 100% tested. 5. Output float is defined as the point when data is no longer driven. Figure 5-2. Input test waveforms and measurement levels For -45 devices only: tR, tF < 5ns (10% to 90%) For -70 devices: tR, tF < 20ns (10% to 90%) Figure 5-3. Output test load 5 0015P–EPROM–10/11 Note: 1. CL = 100pF including jig capacitance, except for the -45 devices, where CL = 30pF. Table 5-5. Pin capacitance f = 1MHz, T = 25°C (1) Symbol Typ Max Units Conditions CIN 4 6 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: 1. Typical values for nominal supply voltage. This parameter is only sampled, and is not 100% tested. Figure 5-4. Notes: Programming Waveforms(1) 1. The input timing reference is 0.8V for VIL and 2.0V for VIH. 2. tOE and tDFP are characteristics of the device, but must be accommodated by the programmer. 6 Atmel AT27C512R 0015P–EPROM–10/11 Atmel AT27C512R Table 5-6. DC programming characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, OE/VPP = 13.0 ± 0.25V Limits Symbol Parameter Test conditions ILI Input load current VIN = VIL,VIH VIL Input low level VIH Input high level VOL Output low voltage IOL = 2.1mA VOH Output high voltage IOH = -400µA ICC2 VCC supply current (program and verify) IPP2 OE/VPP current VID A9 product identification voltage Table 5-7. Min Max Units ±10 µA -0.6 0.8 V 2.0 VCC + 1 V 0.4 V 2.4 V CE = VIL 11.5 25 mA 25 mA 12.5 V Max Units AC programming characteristics TA = 25 5°C, VCC = 6.5 0.25V, OE/VPP = 13.0 0.25V Limits (1) Symbol Parameter Test conditions tAS Address setup time 2 µs tOES OE/VPP setup time 2 µs tOEH OE/VPP hold time 2 µs tDS Data setup time 2 µs tAH Address hold time 0 µs 2 µs Input rise and fall times (10% to 90%) 20ns Input pulse levels 0.45V to 2.4V Input timing reference level 0.8V to 2.0V Data hold time tDH Min (2) tDFP CE high to output float delay tVCS VCC setup time 0 130 2 (3) ns µs tPW CE program pulse width tDV Data valid from CE(2) tVR OE/VPP recovery time 2 µs tPRT OE/VPP pulse rise time during programming 50 ns Notes: 95 Output timing reference level 0.8V to 2.0V 105 µs 1 µs 1. VCC must be applied simultaneously with or before OE/VPP and removed simultaneously with or after OE/VPP. 2. This parameter is only sampled, and is not 100% tested. Output float is defined as the point where data is no longer driven. See timing diagram. 3. Program pulse width tolerance is 100µsec±5%. Table 5-8. The Atmel AT27C512R integrated product identification code Pins Codes A0 O7 O6 O5 O4 O3 O2 O1 O0 Hex data Manufacturer 0 0 0 0 1 1 1 1 0 1E Device type 1 0 0 0 0 1 1 0 1 0D 7 0015P–EPROM–10/11 6. Rapid programming algorithm A 100µs CE pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and OE/VPP is raised to 13.0V. Each address is first programmed with one 100µs CE pulse without verification. Then a verification/reprogramming loop is executed for each address. In the event a byte fails to pass verification, up to 10 successive 100µs pulses are applied with a verification after each pulse. If the byte fails to verify after 10 pulses have been applied, the part is considered failed. After the byte verifies properly, the next address is selected until all have been checked. OE/VPP is then lowered to VIL and VCC to 5.0V. All bytes are read again and compared with the original data to determine if the device passes or fails. Figure 6-1. 8 Rapid programming algorithm Atmel AT27C512R 0015P–EPROM–10/11 Atmel AT27C512R 7. Ordering information Green package (Pb/halide-free) ICC (mA) tACC (ns) Active Standby Atmel ordering code Package Lead finish Operation range 45 20 0.1 AT27C512R-45JU AT27C512R-45PU 32J 28P6 Matte tin Matte tin Industrial (-40C to 85C) 70 20 0.1 AT27C512R-70JU AT27C512R-70PU 32J 28P6 Matte tin Matte tin Industrial (-40C to 85C) Package type 32J 32-lead, plastic, J-leaded chip carrier (PLCC) 28P6 28-lead, 0.600" wide, plastic, dual inline package (PDIP) 9 0015P–EPROM–10/11 8. Packaging information 32J – PLCC 1.14(0.045) X 45° PIN NO. 1 IDENTIFIER 1.14(0.045) X 45° 0.318(0.0125) 0.191(0.0075) E1 E2 B1 E B e A2 D1 A1 D A 0.51(0.020)MAX 45° MAX (3X) COMMON DIMENSIONS (Unit of measure = mm) D2 Notes: 1. This package conforms to JEDEC reference MS-016, variation AE. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.10mm) maximum. SYMBOL MIN NOM MAX A 3.175 – 3.556 A1 1.524 – 2.413 A2 0.381 – – D 12.319 – 12.573 D1 11.354 – 11.506 D2 9.906 – 10.922 E 14.859 – 15.113 E1 13.894 – 14.046 E2 12.471 – 13.487 B 0.660 – 0.813 B1 0.330 – 0.533 e NOTE Note 2 Note 2 1.270 TYP 10/04/01 Package drawing contact: firstname.lastname@example.org 10 TITLE 32J, 32-lead, plastic J-leaded chip carrier (PLCC) DRAWING NO. 32J REV. B Atmel AT27C512R 0015P–EPROM–10/11 Atmel AT27C512R 28P6 – PDIP D PIN 1 E1 A SEATING PLANE A1 L B B1 e E 0º ~ 15º C eB Notes: 1. This package conforms to JEDEC reference MS-011, variation AB 2. Dimensions D and E1 do not include mold flash or protrusion mold flash or protrusion shall not exceed 0.25mm (0.010") COMMON DIMENSIONS (Unit of Measure = mm) REF SYMBOL MIN NOM MAX A – – 4.826 A1 0.381 – – D 36.703 – 37.338 E 15.240 – 15.875 E1 13.462 – 13.970 B 0.356 – 0.559 B1 1.041 – 1.651 L 3.048 – 3.556 C 0.203 – 0.381 eB 15.494 – 17.526 e NOTE Note 2 Note 2 2.540 TYP 09/28/01 Package drawing contact: email@example.com TITLE 28P6, 28-lead (0.600"/15.24mm wide) plastic dual inline package (PDIP) DRAWING NO. 28P6 REV. B 11 0015P–EPROM–10/11 9. 12 Revision history Doc. rev. Date Comments 0015Q 10/2011 Correct pinout note 0015P 04/2011 Remove TSOP and SOIC packages Add lead finish to ordering information 0015O 12/2007 Atmel AT27C512R 0015P–EPROM–10/11 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1) (408) 441-0311 Fax: (+1) (408) 487-2600 www.atmel.com Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 JAPAN Tel: (+81) (3) 3523-3551 Fax: (+81) (3) 3523-7581 © 2011 Atmel Corporation. All rights reserved. / Rev.: 0015P–EPROM–10/11 Atmel®, logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 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