MX7820
SCOPE:
CMOS HIGHSPEED 8-BIT A/D CONVERTER WITH TRACK AND HOLD
Device Type
01
02
Generic Number
MX7820U(x)/883B
MX7820T(x)/883B
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:
Case Outline
Package Code
Outline Letter
Mil-Std-1835
MAXIM SMD
Q
R
GDIP1-T20 or CDIP2-T20
20 LEAD CERDIP
J20
E
2
CQCCI-N20
20 LEADLESS CHIP CARRIER L20
Absolute Maximum Ratings
Supply Voltage to GND ................................................................................... 0V, +7V
Digital Input Voltage ................................................................................... -0.3V, VDD
Digital Output Voltage ................................................................................. -0.3V, VDD
Positive Reference Voltage ..................................................................... VREF- to VDD
Negative Reference Voltage ..................................................................... 0V to VREF+
Input Voltage (VIN) .................................................................................... -0.3V to VDD
Lead Temperature (soldering, 10 seconds) ............................................................... +300°C
Storage Temperature .................................................................................. -65°C to +150°C
Continuous Power Dissipation ............................................................................ TA=+70°C
20 pin CERDIP(derate 11.1mW/°C above +70°C) .................................................. 889mW
20 pin LCC(derate 9.1mW/°C above +70°C) ........................................................... 727mW
Junction Temperature TJ ........................................................................................ +150°C
Thermal Resistance, Junction to Case, ΘJC
20 pin CERDIP.................................................................................................... 40°C/W
20 pin LCC ......................................................................................................... 20°C/W
Thermal Resistance, Junction to Ambient, ΘJA:
20 pin CERDIP................................................................................................... 90°C/W
20 pin LCC ...................................................................................................... 110°C/W
Recommended Operating Conditions
Ambient Operating Range (TA) ......................................................…... -55°C to +125°C
Supply Voltage Range (VDD) ............................................................….. +4.75V to 5.25V
Positive Reference Voltage (VREF+) ................................................................….. +5.0V
Negative Reference Voltage (VREF-) ....................................................................….. 0V
Ground Potential (GND) .......................................................................................….... 0V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of MX7820/883B
for /883B and SMD 5962-88650
19-0072
Page 2 of
Rev. C
7
TABLE 1. ELECTRICAL TESTS:
TEST
Symbol
Resolution
RES
Total Unadjusted Error
TUE
Analog Input Leakage
Current
Analog Input Capacitance
Reference Input Resistance
Digital Input High Level
Voltage
Digital Input Low Level
Voltage
Digital Input High Level
Current
CONDITIONS
-55 °C ≤TA≤ +125°C 1/ 2/
Unless otherwise specified
This is the minimum resolution
for which no missing codes are
guaranteed.
Includes gain error, offset error
and linearity error.
IIN
CIA
RIN
NOTE 3
Group A
Subgroup
Device
type
1
2,3,12
01
±1.0
±0.5
1,2,3
1,2,3
02
All
±1.0
± 3.0
µA
4
1,2,3
All
All
60
4.0
pF
kΩ
1,2,3
All
8
1.0
LSB
V
3.5
0.8
All
V
Mode Input (Pin 7)
__
___
CS and RD inputs
1.5
±1.0
IIH
Digital Input Low Current
IIL
Digital Input Capacitance
CID
Digital Output High Level
Voltage
VOH
Digital Output Low Level
Voltage
VOL
Floating State Leakage
Current
Digital Output Capacitance
Supply Current from VDD
IOUT
Power Supply Sensitivity
__
__ ___
CS to RD/WR Setup Time
__
__ ___
CS to RD/WR Hold Time
__
CS to RDY delay
Mode Input (Pin 7)
__ ___ ___
CS, WR, RD and mode inputs
__ ___ ___
NOTE 3
CS, WR, RD and mode inputs
___
___
DB0-DB7, OFL and INT outputs
ISOURCE=360µA
___
___
DB0-DB7, OFL and INT outputs
ISINK=1.6mA
DB0-DB7
LSB
2.4
1,2,3
___
WR Inputs
Units
All
Mode Input (Pin 7)
__ ___
___
CS, WR, and RD inputs
VIL
Limits
Max
1,2,3
__ ___
___
CS, WR, and RD inputs
VIH
Limits
Min
1,2,3
All
±3.0
µA
1,2,3
All
±200
-1.0
µA
4
All
8.0
pF
1,2,3
All
1,2,3
All
0.4
V
1,2,3
All
±3.0
µA
8.0
20.0
pF
mA
±.25
4.0
V
4
1,2,3
All
All
PSS
tCSS
NOTE 3
__ ___
CS=RD=0V
VDD=5.0V±5%
NOTE 6 and 7
1,2,3
9,10,11
All
All
0
LSB
ns
tCSH
NOTE 6 and 7
9,10,11
All
0
ns
tRDY
NOTE 6 and 7, CL=50pF, pullup resistor=2.0kΩ
9
10,11
All
COUT
IDD
----------------------------
Electrical Characteristics of MX7820/883B
for /883B and SMD 5962-88650
70
100
19-0072
Page 3 of
Rev. C
7
ns
TEST
Symbol
___ Conversion Time
(RD mode)
___ Data Access Time
(RD mode)
___ ___
__ RD to INT Delay
(RD mode)
Data Hold Time
tCRD
Delay Time Between
Conversion
Write Pulse Width
Delay Time between
___
___
WR and RD Pulses
Delay Access Time
___ __
WR/RD mode
___ ___
RD to INT delay
___ ___
WR to INT delay
Data Access Time
___ ___
WR/RD mode
___ ___
WR to INT delay, Stand
alone operation
Data access time ___
after INT
Stand alone operation
CONDITIONS
-55 °C ≤TA≤ +125°C 1/ 2/
Unless otherwise specified
Group A
Subgroup
Device
type
9
10,11
9
10,11
9
10,11
All
9
10,11
9
10,11
9,10,11
9
10,11
All
tACCO
See Figure 3 in Commercial
Datasheet. NOTE 7
NOTE 4 and 7
tINTH
NOTE 7, CL=50pF
tDH
NOTE 5, 6, 7
tP
NOTE 6, 7
tWR
tRD
NOTE 6
NOTE 6
tACC1
NOTE 4, 6
9
10,11
tR1
NOTE 6
tINTL
NOTE 6, CL=50pF
tACC2
NOTE 4, 6
tIHWR
tID
Limits
Min
1.6
2.5
1.62
2.55
175
225
All
All
All
Limits
Max
60
100
500
600
0.6
600
700
µs
µs
ns
ns
ns
50
µs
ns
All
160
250
ns
9
10,11
9
10,11
9
10,11
All
140
225
1.0
1.7
70
110
ns
NOTE 6, CL=50pF
9
10,11
All
100
150
ns
NOTE 6
9
10,11
All
50
75
ns
All
All
All
All
NOTE 1: VDD=+5V, VREF(+)=+5V; VREF(-)=GND=0V, unless otherwise specified.__
Specifications apply for RD mode (pin 7=0V).
NOTE 2: All input control signals are specified with tr=tf=20ns (10 percent to 90 percent of +5.0V) and
timed from a voltage level of 1.6V.
NOTE 3: Tested at initial release and upon redesign. Sample size will be 116 units.
NOTE 4: Measured with load circuits of Figure 2 in the Commercial Datasheet and defined as the time
required for an output to cross 0.8V to 2.4V.
NOTE 5: Defined as the time required for the data lines to change 0.5V when loaded with the circuits of
Figures 2 in the Commercial Datasheet and is measured only for the initial test and after process
or design changes which may affect tDH.
NOTE 6: Refer to timing diagrams of Figure 3 of Commercial Datasheet. These parameters, if not tested,
shall be guaranteed to the limits specified in Table 1.
__
NOTE 7: Refer to timing diagram of Figure 3 (RD mode). These parameters are tested to Subgroup 9 under
Group A test requirements.
----------------------------
Units
Electrical Characteristics of MX7820/883B
for /883B and SMD 5962-88650
19-0072
Page 4 of
Rev. C
7
µs
ns
TERMINAL CONNECTIONS
J20, L20
J20, L20
1
VIN
11
VREF2
DB0(LSB)
12
VREF+
3
DB1
13
CS
4
DB2
14
DB4
5
DB3
15
DB5
6
___
16
DB6
WR/RDY
7
Mode
17
DB7(MSB)
8
__
18
___
RD
OFL
9
___
19
NC
INT
10
GND
20
VDD
01
01
02
02
Package
20 pin CERDIP
20 pin LCC
20 pin CERDIP
20 pin LCC
----------------------------
ORDERING INFORMATION:
MX7820UQ/883B
MX7820UE/883B
MX7820TQ/883B
MX7820TE/883B
Electrical Characteristics of MX7820/883B
for /883B and SMD 5962-88650
SMD NUMBER
5962-8865001RA
5962-88650012C
5962-8865002RA
5962-88650022C
19-0072
Page 5 of
Rev. C
7
QUALITY ASSURANCE
Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in MilStd-883.
Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125°C minimum.
3. Interim and final electrical test requirements shall be specified in Table 2.
Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,
C, and D inspection.
Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.
Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125°C, minimum.
3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.
TABLE 2.
ELECTRICAL TEST REQUIREMENTS
Mil-Std-883 Test Requirements
Interim Electric Parameters
Method 5004
Final Electrical Parameters
Method 5005
Group A Test Requirements
Method 5005
Group C and D End-Point Electrical Parameters
Method 5005
Subgroups
per Method 5005, Table 1
1
1*, 2, 3, 4**, 9, 10, 11***
1, 2, 3, 4**, 9, 10, 11***
1
*
**
PDA applies to Subgroup 1 only.
Subgroup 4, Capacitance tests are performed at initial qual and upon redesign.
Sample size will be 116 units.
*** Subgroups 10 and 11 if not tested, are guaranteed to the limits specified in Table 1.
----------------------------
Electrical Characteristics of MX7820/883B
for /883B and SMD 5962-88650
19-0072
Page 6 of
Rev. C
7
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