TVS Diode Arrays Low Capacitance ESD Protection - SP3001 Series

TVS Diode Arrays  Low Capacitance ESD Protection - SP3001 Series
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3001 Series
SP3001 Series 0.65pF Diode Array
RoHS
Pb GREEN
Description
The SP3001 has ultra low capacitance rail-to rail diodes with
an additional zener diode fabricated in a proprietary silicon
avalanche technology to protect each I/O pin providing a
high level of protection for electronic equipment that may
experience destructive electrostatic discharges (ESD). These
robust diodes can safely absorb repetitive ESD strikes at the
maximum level specified in the IEC 61000-4-2 international
standard (Level 4, ±8kV contact discharge) without
performance degradation. Their very low loading capacitance
also makes them ideal for protecting high speed signal pins
such as HDMI, DVI, USB2.0, and IEEE 1394.
Features
Pinout
I/O 1
I/O 4
GND
VCC
I/O 2
• Low leakage current of
0.5μA (MAX) at 5V
• ESD protection of ±8kV
contact discharge, ±15kV
air discharge,
(IEC61000-4-2)
• Small SC70 ( JEDEC MO203) package saves board
space
• EFT protection,
IEC61000-4-4,
40A (5/50ns)
I/O 3
• Lightning Protection,
IEC61000-4-5, 2.5A
(8/20µs)
Applications
Functional Block Diagram
I/O2
• Low capacitance of
0.65pF (TYP) per I/O
I/O4
VCC
• Computer Peripherals
• Network Hardware/Ports
• Mobile Phones
• Test Equipment
• PDA’s
• Medical Equipment
• Digital Cameras
GND
I/O1
Application Example
I/O3
+5V
D2+
Additional Information
D2+
Gnd
D2-
D26
5
4
SP300x-04
1
2
3
D1+
Datasheet
Resources
Samples
D1+
Gnd
D1HDMI
or DVI
Connector
D1HDMI
or DVI
Interface
IC
D0+
D0+
Gnd
D0-
D06
5
4
SP300x-04
1
2
3
Clk+
Clk+
Gnd
Clk-
ClkGnd
A single 4 channel SP300x-04
device can be used to protect
four of the data lines in a
HDMI/DVI interface. Two (2)
SP300x-04 devices provide
protection for the main data
lines. Low voltage ASIC
HDMI/DVI drivers can also be
protected with the SP300x-04,
the +VCC pins on the SP300x-04
can be substituted with a
suitable bypass capacitor or in
some backdrive applications the
+VCC of the SP300x-04 can be
floated or NC.
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3001 Series
Absolute Maximum Ratings
Symbol
Thermal Information
Parameter
Value
Units
2.5
A
Operating Temperature
–40 to 125
°C
Storage Temperature
–55 to 150
°C
IPP
Peak Current (tp=8/20μs)
TOP
TSTOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Parameter
Rating
Units
Storage Temperature Range
–55 to
150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
Electrical Characteristics (TOP=25ºC)
Symbol
Test Conditions
Max
Units
Reverse Standoff Voltage
Parameter
VRWM
IR ≤ 1µA
6
V
Reverse Leakage Current
ILEAK
VR=5V
0.5
µA
Clamp Voltage1
VC
ESD Withstand Voltage1
VESD
Diode Capacitance1
CI/O-GND
Diode Capacitance
CI/O-I/O
1
Min
Typ
IPP=1A, tp=8/20µs, Fwd
9.5
11.0
V
IPP=2A, tp=8/20µs, Fwd
10.6
13.0
V
IEC61000-4-2 (Contact)
±8
kV
IEC61000-4-2 (Air)
±15
kV
Reverse Bias=0V
0.7
0.8
0.9
pF
Reverse Bias=1.65V
0.55
0.65
0.75
pF
Reverse Bias=0V
0.35
pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Insertion Loss (S21) I/O to GND
Capacitance vs. Bias Voltage
1
1.00
0
0.95
0.90
-2
I/O Capacitance (pF)
Insertion Loss [dB]
-1
-3
-4
-5
-6
-7
0.85
0.80
0.70
0.60
-9
0.55
1.E+06
VCC = 3.3V
0.65
-8
-10
VCC = Float
0.75
VCC = 5V
0.50
1.E+07
1.E+08
Frequency [Hz]
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
1.E+09
1.E+10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
I/O DC Bias (V)
3.5
4.0
4.5
5.0
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3001 Series
Capacitance vs. Frequency
Product Characteristics
Lead Plating
Matte Tin
1.2E-12
Capacitance [F]
1.4E-12
Lead Material
Copper Alloy
1E-12
Lead Coplanarity
0.0004 inches (0.102mm)
8E-13
Substitute Material
Silicon
6E-13
Body Material
Molded Epoxy
Flammability
UL 94 V-0
4E-13
2E-13
0
1.E+06
1.E+07
1.E+08
1.E+09
Frequency [Hz]
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tP)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
tP
TP
Temperature
Reflow Condition
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
Time
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3001 Series
Package Dimensions — SC70-6
6
Package
e
e
4
5
E
1
6
JEDEC
MO-203
Millimeters
HE
B
D
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
A2 A
A1
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
C
Solder Pad Layout
L
0.65 BSC
e
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Part Numbering System
Part Marking System
D* 4
D*4
Inches
Min
3
2
SC70-6
Pins
Product Series
SP3001-04 J T G
Number of Channels
D = SP3001 series
TVS Diode Arrays
(SPA® Diodes)
G= Green
T= Tape & Reel
Assembly Site
(varies)
Package
Series
J = SC70-6
Number of Channels
-04 = 4 channel
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP3001-04JTG
SC70-6
D*4
3000
Embossed Carrier Tape & Reel Specification — SC70-6
Symbol
Inches
Max
Min
Max
E
1.65
1.85
0.064
0.072
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.076
0.081
D
1.40
1.60
0.055
0.062
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.153
0.161
10P0
40.0± 0.20
W
7.70
8.10
1.574±0.007
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
2.14
2.34
0.084
0.092
B0
2.24
2.44
0.088
0.960
K0
1.12
1.32
0.044
0.052
t
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
Millimetres
Min
0.27 max
0.010 max
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