SIP-9P-M02

SINGLE IN-LINE PACKAGE
FUJITSU SEMICONDUCTOR
DATA SHEET
9 PIN PLASTIC
To Top / Package Lineup / Package Index
SIP-9P-M02
EIAJ code : HSIP009-P-0000-1
9-pin plastic SIP
Lead pitch
100 mil
Sealing method
Plastic mold
(SIP-9P-M02)
9-pin plastic SIP
(SIP-9P-M02)
23.60(.929)MAX
23.40(.921)MAX
8.00(.315)
3.30(.130)MAX
8.00(.315)
3.90(.154)
Ø3.40(.134)
0.60±0.10
(.024±.004)
3.40(.134)
11.10(.437)
14.20(.559)
MAX
6.40(.252)
1 PIN INDEX
0.80(.031)
5.80(.228)MIN
2.54(.100)
TYP
C
1994 FUJITSU LIMITED S09003S-3C-3
+0.30
1.20 –0
+.012
.047 –0
0.70±0.10
(.028±.004)
0.60±0.10
(.024±.004)
Dimensions in mm (inches).
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
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