Resistors Inductors Resistors Chip Resistors Product Notices ERJ-1WY, ERJ-1WNFxxxxU, ERJ

DISCONTINUED PRODUCT
NOTIFICATION
SUBJECT: Thick Film Chip Resistor Discontinuation ERJ-1WY, -1WNF, -1WR
BULLETIN #: PG42111000
Date:
November 10, 2000
Last Order Date: January 31, 2001
Last Ship Date:
April 30, 2001
SUGGESTED REPLACEMENT: See table below
Affected series:
Discontinued
ERJ-1WY
Size 2512, 5%
Qty. per reel
3,000
ERJ-1WNFxxxxU
Size 2512, 1%
3,000
ERJ-1WR
3,000
Size 2512, low resistance
Dimensions
(in mm)
Replace with thinner
ERJ-1TY
ERJ1TNFxxxxU
4,000
ERJ-1TR
4,000
Current Type
(Thick)
6.4
3.2
1.1
1.3
Glass
Metal with Glass
ERJ-1W
ERJ1WR
L
W
T
b
Protective Coating
Side Electrode
Panasonic Part Number
New Type
(Thin)
6.4
3.2
0.6
0.6
Resin
Metal with Resin
ERJ-1T
ERJ-1TR
T
b
L
Qty. per reel
4,000
Recommended Land Pattern
c
Chip Resistor
a
b
Type
ERJ1W
ERJ1T
a
3.6 to 4.0
5.0 to 5.4
Dimensions (mm)
b
c
7.6 to 8.6
2.3 to 3.5
7.6 to 8.6
2.3 to 3.5
Technical Data
Thick Film Chip Resistors
ERJ1T (25
(2512 Th
Thin) Type
Type
(Comparison for Thick Type (t=1.1mm) to Thin Type (t=0.6mm))
1.Temperature Coefficient of Resistance
2.Short Time Overload
3.Resistance to Soldering Heat
4.High Temperature Exposure
5.Temperature Cycling
6.Humidity
7.Load Life
8.Load Life in Humidity
9.Pulse
10.Terminal Strength
11.Bending Strength
12.Surface Temperature
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
RESISTOR DIVISION
Technical Data (1)TCR
ERJ1T(2512)
300
TCR(×10-6/℃)
<Thick
Type>
200
Hot : 25℃∼125℃
Hot :○
100
Cold:-55℃∼ 25℃ Cold:●
0
-100
n=20
-200
-300
10
1k
100k
Nominal Resistance(Ω)
300
TCR(×10-6/℃)
<Thin
Type>
200
Hot :○
Cold:●
100
0
-100
n=20
-200
-300
10
1k
100k
Nominal Resistance(Ω)
(2)Short Time Overload
Resistance Change (%)
2
<Thick Type>
1
RCWV x 2.5 times
(Max.500V)
5 seconds
0
-1
n=20
-2
10
1k
100k
Nominal Resistance(Ω)
Resistance Change (%)
2
<Thin Type>
1
0
-1
n=20
-2
10
1k
100k
Nominal Resistance(Ω)
Technical Data (3)Soldering Heat
ERJ1T(2512)
2
Resistance Change (%)
<Thick Type>
1
Solder Bath : 270℃
Dipping : 10 sec.
0
-1
n=20
-2
Nominal Resistance(Ω)
10
1k
100k
2
Resistance Change (%)
<Thin Type>
1
0
-1
n=20
-2
Nominal Resistance(Ω)
10
1k
100k
(4)High Temp. Exposure
Resistance Change (%)
2
<Thick Type>
125℃, 1000 hrs,
1
without load
○:10Ω
0
△:1kΩ
□:100kΩ n=20
-1
-2
0
250
500
750
1000
(hrs)
Resistance Change (%)
2
<Thin Type>
1
0
n=20
-1
-2
0
250
500
750
1000
(hrs)
Technical Data (5)Temp. Cycling
ERJ1T(2512)
2
Resistance Change (%)
<Thick Type>
1
-55℃ 30 min.
↓↑
Room Temp. 30 min.,100 cyc.
0
↓↑
125℃ 30 min.
-1
n=20
-2
Nominal Resistance(Ω)
10
1k
100k
Resistance Change (%)
2
<Thin Type>
1
0
-1
n=20
-2
10
1k
100k
Nominal Resistance(Ω)
(6)Humidity
Resistance Change (%)
2
<Thick Type>
60℃,95%RH,
1
1000 hrs, without load
○:10Ω
0
△:1kΩ
□:100kΩ n=20
-1
-2
0
250
500
750
1000
(hrs)
Resistance Change (%)
2
<Thin Type>
1
0
n=20
-1
-2
0
250
500
750
1000
(hrs)
Technical Data ERJ1T(2512)
(7)Load Life
3
Resistance Change (%)
<Thick Type>
2
RCWV 1.5 hrs ON 0.5 hrs OFF, at 70 ℃
1
1000 hrs
0
-1
n=20
-2
-3
0
250
500
750
1000
(hrs)
3
Resistance Change (%)
2
<Thin Type>
1
0
-1
n=20
-2
-3
0
(8)Load Life in Humidity
250
500
750
1000
(hrs)
3
Resistance Change (%)
2
<Thick
Type>
RCWV 1.5 hrs ON 1
0.5 hrs OFF, at 60 ℃
95%RH, 1000 hrs
0
-1
○:10Ω n=20
-2
△:1kΩ
□:100kΩ
-3
0
250
500
750
1000
(hrs)
3
Resistance Change (%)
2
<Thin
Type>
1
0
-1
n=20
-2
-3
0
250
500
750
1000
(hrs)
Technical Data (9)Puls
ERJ1T(2512)
5
Resistance Change (%)
4
<Thick Type>
3
RCWV x 2.5 times
2
(Max.500V)
1
1 sec ON – 25 sec OFF
0
10,000 cycle
-1
-2
n=20
-3
-4
-5
10
1k
100k
Nominal Resistance(Ω)
5
Resistance Change(%)
4
<Thin Type>
3
2
1
0
-1
-2
n=20
-3
-4
-5
10
1k
100k
Nominal Resistance(Ω)
(10)Terminal Strength
80
P
Strength(N)
F i x ed S o l d e r
<Thick
Type>
( Pb / S n = 4 0 / 6 0 )
70
60
Copper Plate : t=0.4 mm
Pull Speed : 10 mm / sec
50
n=20
40
LotA
LotB
LotC
80
<Thin Type>
Strength(N)
70
60
n=20
50
40
LotA
LotB
LotC
Technical Data ERJ1T(2512)
(11)Bending Strength
Bending Distance(mm)
Bending Distance(mm)
10
9
<Thick
Type>
micro scope
8
fixed
7
fixed
bending
6
distance
5
4
press
3
90mm
n=30
2
10 sec. Hold
1
Glass Epoxy Substrate
0
(t=1.6 mm)
0
4
8
12
16
20
24
28
(Pcs)
10
9
8
<Thin
Type>
7
6
5
4
3
2
n=30
1
0
0
4
8
12
16
20
24
28
(Pcs)
(12)Surface Temperature
100
Temperature(℃)
Substrate : Glass Epoxy
80
Thin
60
Thick
40
20
0
0
25
50
75
Rated Power(%)
100
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