12-BIT, DUAL, ULTRALOW GLITCH, VOLTAGE OUTPUT DIGITAL-TO-ANALOG CONVERTER DAC7552 FEATURES

Actual Size
3 mm x 3 mm
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
12-BIT, DUAL, ULTRALOW GLITCH, VOLTAGE OUTPUT
DIGITAL-TO-ANALOG CONVERTER
Check for Samples: DAC7552
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
The
DAC7552
is
a
12-bit,
dual-channel,
voltage-output DAC with exceptional linearity and
monotonicity. Its proprietary architecture minimizes
undesired transients such as code-to-code glitch and
channel-to-channel
crosstalk.
The
low-power
DAC7552 operates from a single 2.7-V to 5.5-V
supply. The DAC7552 output amplifiers can drive a
2-kΩ, 200-pF load rail-to-rail with 5-µs settling time;
the output range is set using an external voltage
reference.
1
2
2.7-V to 5.5-V Single Supply
12-Bit Linearity and Monotonicity
Rail-to-Rail Voltage Output
Settling Time: 5 µs (Max)
Ultralow Glitch Energy: 0.1 nVs
Ultralow Crosstalk: –100 dB
Low Power: 440 µA (Max)
Per-Channel Power Down: 2 µA (Max)
Power-On Reset to Zero Scale
SPI-Compatible Serial Interface: Up to 50 MHz
Daisy-Chain Capability
Asynchronous Hardware Clear
Simultaneous or Sequential Update
Specified Temperature Range: –40°C to 105°C
Small 3-mm × 3-mm, 16-Lead QFN Package
The 3-wire serial interface operates at clock rates up
to 50 MHz and is compatible with SPI, QSPI,
Microwire™, and DSP interface standards. The
outputs of all DACs may be updated simultaneously
or
sequentially.
The
parts
incorporate
a
power-on-reset circuit to ensure that the DAC outputs
power up to zero volts and remain there until a valid
write cycle to the device takes place. The parts
contain a power-down feature that reduces the
current consumption of the device to under 2 µA.
APPLICATIONS
•
•
•
•
•
Portable Battery-Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
Programmable Attenuators
Industrial Process Control
The small size and low-power operation makes the
DAC7552 ideally suited for battery-operated portable
applications. The power consumption is typically
1.5 mW at 5 V, 0.75 mW at 3 V, and reduces to 1 µW
in power-down mode.
The DAC7552 is available in a 16-lead QFN package
and is specified over –40°C to 105°C.
FUNCTIONAL BLOCK DIAGRAM
VDD
IOVDD
VREFA
_
Input
Register
SCLK
DAC
Register
String
DAC A
Interface
Logic
SYNC
_
Input
Register
SDIN
SDO
CLR
DAC
Register
String
DAC B
Power-On
Reset
DAC7552
DCEN
+
GND
+
VFBA
VOUT A
VFBB
VOUT B
Power-Down
Logic
VREFB
PD
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Microwire is a trademark of National Semiconductor Corporation.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2011, Texas Instruments Incorporated
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
PRODUCT
PACKAGE
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
DAC7552
16 QFN
RGT
–40°C TO 105°C
D752
(1)
ORDERING
NUMBER
TRANSPORT
MEDIA
DAC7552IRGTT
250-piece Tape and Reel
DAC7552IRGTR
3000-piece Tape and Reel
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
UNIT
–0.3 V to 6 V
VDD , IOVDD to GND
Digital input voltage to GND
–0.3 V to VDD + 0.3 V
VOUT to GND
–0.3 V to VDD+ 0.3 V
Operating temperature range
–40°C to 105°C
Storage temperature range
–65°C to 150°C
Junction temperature (TJ Max)
(1)
150°C
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
VDD = 2.7 V to 5.5 V, VREF = VDD, RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications –40°C to 105°C, unless otherwise
specified
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE (1)
Resolution
12
Relative accuracy
Differential nonlinearity
Specified monotonic by design
±0.35
±1
LSB
±0.08
±0.5
LSB
±12
mV
±12
mV
Offset error
Zero-scale error
All zeroes loaded to DAC register
Gain error
Full-scale error
Zero-scale error drift
Gain temperature coefficient
PSRR
(1)
2
VDD = 5 V
Bits
±0.15
%FSR
±0.5
%FSR
7
µV/°C
3
ppm of FSR/°C
0.75
mV/V
Linearity tested using a reduced code range of 30 to 4065; output unloaded.
Copyright © 2005–2011, Texas Instruments Incorporated
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
VDD = 2.7 V to 5.5 V, VREF = VDD, RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications –40°C to 105°C, unless otherwise
specified
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
OUTPUT CHARACTERISTICS (2)
Output voltage range
Output voltage settling time
0
RL = 2 kΩ; 0 pF < CL < 200 pF
Slew rate
VREF
V
5
µs
1.8
Capacitive load stability
RL = ∞
RL = 2 kΩ
Digital-to-analog glitch impulse
1 LSB change around major carry
Channel-to-channel crosstalk
1-kHz full-scale sine wave,
outputs unloaded
V/µs
470
pF
1000
0.1
nV-s
–100
dB
Digital feedthrough
0.1
nV-s
Output noise density (10-kHz offset
frequency)
120
nV/rtHz
–85
dB
1
Ω
Total harmonic distortion
FOUT = 1 kHz, FS = 1 MSPS,
BW = 20 kHz
DC output impedance
Short-circuit current
Power-up time
VDD = 5 V
50
VDD = 3 V
20
Coming out of power-down mode,
VDD = 5 V
15
Coming out of power-down mode,
VDD = 3 V
15
mA
µs
REFERENCE INPUT
VREF Input range
Reference input impedance
Reference current
0
VDD
VREFA and VREFB shorted together
50
VREFA = VREFB = VDD = 5 V,
VREFA and VREFB shorted together
100
250
VREFA = VREFB = VDD = 3 V,
VREFA and VREFB shorted together
60
123
V
kΩ
µA
LOGIC INPUTS (2)
Input current
VIN_L, Input low voltage
IOVDD ≥ 2.7 V
VIN_H, Input high voltage
IOVDD ≥ 2.7 V
±1
µA
0.3 IOVDD
V
0.7 IOVDD
V
Pin capacitance
3
pF
5.5
V
POWER REQUIREMENTS
VDD,, IOVDD
(3)
IDD(normal operation)
VDD = 3.6 V to 5.5 V
VDD = 2.7 V to 3.6 V
2.7
DAC active and excluding load current
VIH = IOVDD and VIL = GND
300
440
250
400
0.2
2
0.05
2
µA
IDD (all power-down modes)
VDD = 3.6 V to 5.5 V
VDD = 2.7 V to 3.6 V
VIH = IOVDD and VIL = GND
µA
POWER EFFICIENCY
IOUT/IDD
(2)
(3)
ILOAD = 2 mA, VDD = 5 V
93%
Specified by design and characterization, not production tested. For 1.8 V < IOVDD < 2.7 V, It is recommended that
VIH = IOVDD, VIL = GND.
IOVDD operates down to 1.8 V with slightly degraded timing, as long as VIH = IOVDD and VIL = GND.
Copyright © 2005–2011, Texas Instruments Incorporated
3
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
TIMING CHARACTERISTICS (1)
www.ti.com
(2)
VDD = 2.7 V to 5.5 V, RL = 2 kΩ to GND; all specifications –40°C to 105°C, unless otherwise specified
PARAMETER
t1
(3)
TEST CONDITIONS
SCLK cycle time
t2
SCLK HIGH time
t3
SCLK LOW time
t4
SYNC falling edge to SCLK falling edge setup
time
t5
Data setup time
t6
Data hold time
t7
SCLK falling edge to SYNC rising edge
t8
Minimum SYNC HIGH time
t9
SCLK falling edge to SDO valid
t10
CLR pulse width low
(1)
(2)
(3)
MIN
VDD = 2.7 V to 3.6 V
20
VDD = 3.6 V to 5.5 V
20
VDD = 2.7 V to 3.6 V
10
VDD = 3.6 V to 5.5 V
10
VDD = 2.7 V to 3.6 V
10
VDD = 3.6 V to 5.5 V
10
VDD = 2.7 V to 3.6 V
4
VDD = 3.6 V to 5.5 V
4
VDD = 2.7 V to 3.6 V
5
VDD = 3.6 V to 5.5 V
5
VDD = 2.7 V to 3.6 V
4.5
VDD = 3.6 V to 5.5 V
4.5
VDD = 2.7 V to 3.6 V
0
VDD = 3.6 V to 5.5 V
0
VDD = 2.7 V to 3.6 V
20
VDD = 3.6 V to 5.5 V
20
VDD = 2.7 V to 3.6 V
10
VDD = 3.6 V to 5.5 V
10
VDD = 2.7 V to 3.6 V
10
VDD = 3.6 V to 5.5 V
10
TYP
MAX
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
All input signals are specified with tR = tF = 1 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
See Serial Write Operation timing diagram Figure 1.
Maximum SCLK frequency is 50 MHz at VDD = 2.7 V to 5.5 V.
t1
SCLK
t8
t2
t3
t4
t7
SYNC
t5
SDIN
D15
t6
D14
D13
D12
D11
D1
D0
D15
Input Word n
t9
SDO
D15
Input Word n+1
D14
D0
Input Word n
Undefined
CLR
D0
t10
Figure 1. Serial Write Operation
4
Copyright © 2005–2011, Texas Instruments Incorporated
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
PIN DESCRIPTION
VFBA
VREFA
CLR
SDIN
RGT PACKAGE
(TOP VIEW)
1
16 15 14 13
12
2
11
3
10
4
9
6
7
8
SCLK
SYNC
IOVDD
SDO
DCEN
5
VFBB
VREFB
PD
VOUTA
VDD
GND
VOUTB
Terminal Functions
TERMINAL
NO.
(1)
DESCRIPTION
NAME
1
VOUTA
Analog output voltage from DAC A
2
VDD
Analog voltage supply input
3
GND (1)
Ground
4
VOUTB
Analog output voltage from DAC B
5
VFBB
DAC B amplifier sense input. (For voltage output operation, connect to VOUTB externally.)
6
VREFB
Positive reference voltage input for DAC B
7
PD
Power-down
8
DCEN
Daisy-chain enable
9
SDO
Serial data output
10
IOVDD
I/O voltage supply input. (For single supply operation, connect to VDD externally.)
11
SYNC
Frame synchronization input. The falling edge of the SYNC pulse indicates the start of a serial data frame shifted out
to the DAC7552
12
SCLK
Serial clock input
13
SDIN
Serial data input
14
CLR
Asynchronous input to clear the DAC registers. When CLR is low, the DAC registers are set to 000H and the output
voltage to 0 V.
15
VREFA
Positive reference voltage input for DAC A
16
VFBA
DAC A amplifier sense input. (For voltage output operation, connect to VOUTA externally.)
Thermal pad should be connected to GND.
Copyright © 2005–2011, Texas Instruments Incorporated
5
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs
DIGITAL INPUT CODE
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs
DIGITAL INPUT CODE
1
Channel A
VREF = 4.096 V
Linearity Error − LSB
Linearity Error − LSB
1
VDD = 5 V
0.5
0
−0.5
0.25
0
−0.25
−0.5
0
512
1024
1536
2048
2560
3072
3584
4096
−0.5
0.5
0.25
0
−0.25
−0.5
0
512
1024
1536
2048
2560
3072
3584
Figure 2.
Figure 3.
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs
DIGITAL INPUT CODE
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs
DIGITAL INPUT CODE
4096
1
Channel A
VREF = 2.5 V
VDD = 2.7 V
Linearity Error − LSB
Linearity Error − LSB
0.5
0
−0.5
Channel B
VREF = 2.5 V
VDD = 2.7 V
0.5
0
−0.5
−1
0.5
0.25
0
−0.25
0
512
1024
1536
2048
2560
3072
3584
4096
Differential Linearity Error − LSB
Differential Linearity Error − LSB
0
Digital Input Code
−1
6
VDD = 5 V
Digital Input Code
1
−0.5
VREF = 4.096 V
−1
0.5
Differential Linearity Error − LSB
Differential Linearity Error − LSB
−1
Channel B
0.5
0.5
0.25
0
−0.25
−0.5
0
512
1024
1536
2048
2560
Digital Input Code
Digital Input Code
Figure 4.
Figure 5.
3072
3584
4096
Copyright © 2005–2011, Texas Instruments Incorporated
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
ZERO-SCALE ERROR
vs
FREE-AIR TEMPERATURE
ZERO-SCALE ERROR
vs
FREE-AIR TEMPERATURE
3
3
VDD = 2.7 V,
VREF = 2.5 V
2
2
Zero-Scale Error − mV
Zero-Scale Error − mV
VDD = 5 V,
VREF = 4.096 V
Channel A
1
Channel B
1
Channel A
0
0
Channel B
−1
−40
−10
20
50
−1
−40
80
TA − Free-Air Temperature − °C
20
50
80
TA − Free-Air Temperature − °C
Figure 6.
Figure 7.
FULL-SCALE ERROR
vs
FREE-AIR TEMPERATURE
FULL-SCALE ERROR
vs
FREE-AIR TEMPERATURE
1
1
VDD = 2.7 V,
VREF = 2.5 V
Full-Scale Error − mV
VDD = 5 V,
VREF = 4.096 V
Full-Scale Error − mV
−10
0
Channel B
−1
Channel A
−2
−40
−10
20
50
TA − Free-Air Temperature − °C
Figure 8.
Copyright © 2005–2011, Texas Instruments Incorporated
80
0
Channel B
Channel A
−1
−2
−40
−10
20
50
80
TA − Free-Air Temperature − °C
Figure 9.
7
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
SINK CURRENT AT NEGATIVE RAIL
SOURCE CURRENT AT POSITIVE RAIL
0.2
5.50
Typical for All Channels
VDD = 2.7 V,
VREF = 2.5 V
0.15
VO − Output Voltage − V
VO − Output Voltage − V
Typical for All Channels
0.1
VDD = 5.5 V,
VREF = 4.096 V
VDD = VREF = 5.5 V
5.40
5.30
0.05
DAC Loaded with 000h
0
0
5
10
ISINK − Sink Current − mA
DAC Loaded with FFFh
5.20
15
0
5
10
ISOURCE − Source Current − mA
Figure 10.
Figure 11.
SOURCE CURRENT AT POSITIVE RAIL
SUPPLY CURRENT
vs
DIGITAL INPUT CODE
2.7
15
400
Typical for All Channels
VDD = 5.5 V,
VREF = 4.096 V
I DD − Supply Current − µ A
VO − Output Voltage − V
350
2.6
VDD = VREF = 2.7 V
2.5
300
VDD = 2.7 V,
VREF = 2.5 V
250
200
150
100
50
DAC Loaded with FFFh
All Channels Powered, No Load
2.4
0
5
10
ISOURCE − Source Current − mA
Figure 12.
8
15
0
0
512
1024 1536 2048 2560 3072 3584 4096
Digital Input Code
Figure 13.
Copyright © 2005–2011, Texas Instruments Incorporated
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
400
400
I DD − Supply Current − µ A
I DD − Supply Current − µ A
All DACs Powered,
No Load,
VREF = 2.5 V
350
VDD = 5.5 V,
VREF = 4.096 V
300
VDD = 2.7 V,
VREF = 2.5 V
250
350
300
250
All Channels Powered, No Load
200
−40
−10
20
50
80
TA − Free-Air Temperature − °C
200
2.7
110
3.8
4.1
4.5
4.8
5.2
5.5
Figure 15.
SUPPLY CURRENT
vs
LOGIC INPUT VOLTAGE
HISTOGRAM OF CURRENT CONSUMPTION - 5.5 V
2000
TA = 255C, SCL Input
(All Other Inputs = GND)
VDD = 5.5 V,
VREF = 4.096 V
1500
1200
f − Frequency − Hz
I DD − Supply Current − µ A
3.4
VDD − Supply Volatge − V
Figure 14.
1600
3.1
VDD = 5.5 V,
VREF = 4.096 V
800
400
1000
500
VDD = 2.7 V,
VREF = 2.5 V
0
0
0
1
2
3
4
VLOGIC − Logic Input Voltage − V
Figure 16.
Copyright © 2005–2011, Texas Instruments Incorporated
5
253 264 275 286
297 308 319 330 341
IDD − Current Consumption − mA
Figure 17.
9
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
HISTOGRAM OF CURRENT CONSUMPTION - 2.7 V
TOTAL ERROR - 5 V
4
1500
VDD = 5 V,
VREF = 4.096 V,
TA = 255C
VDD = 2.7 V,
VREF = 2.5 V
Total Error − mV
f − Frequency − Hz
2
1000
Channel A Output
0
Channel B Output
500
−2
0
−4
0
239 249 259 269 279 289 299 309 319
IDD − Current Consumption − mA
Figure 18.
512
1024 1536 2048 2560 3072 3584 4095
Digital Input Code
Figure 19.
TOTAL ERROR - 2.7 V
EXITING POWER-DOWN MODE
4
5
VDD = 5 V,
VREF = 4.096 V,
Power-Up Code 4000
VDD = 2.7 V,
VREF = 2.5 V,
TA = 255C
Total Error − mV
Channel A Output
0
Channel B Output
−2
3
2
1
0
−4
0
512
1024 1536 2048 2560 3072 3584 4095
Digital Input Code
Figure 20.
10
VO − Output Voltage − V
4
2
t − Time − 4 s/div
Figure 21.
Copyright © 2005–2011, Texas Instruments Incorporated
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
LARGE-SIGNAL SETTLING TIME - 5 V
LARGE-SIGNAL SETTLING TIME - 2.7 V
5
3
VDD = 2.7 V, VREF = 2.5 V
Output Loaded With 200 pF to GND
Code 41 to 4055
VDD = 5 V, VREF = 4.096 V
Output Loaded With 200 pF to GND
Code 41 to 4055
VO − Output Voltage − V
VO − Output Voltage − V
4
3
2
2
1
1
0
0
t − Time − 5 s/div
t − Time − 5 s/div
Figure 23.
MIDSCALE GLITCH
WORST-CASE GLITCH
VO -
VO -
(5 mV/Div)
(5 mV/Div)
Figure 22.
Trigger Pulse
Trigger Pulse
Time - (400 nS/Div)
Figure 24.
Copyright © 2005–2011, Texas Instruments Incorporated
Time - (400 nS/Div)
Figure 25.
11
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
CHANNEL-TO-CHANNEL CROSSTALK
FOR A FULL-SCALE SWING
VO -
VO -
(5 mV/Div)
(5 mV/Div)
DIGITAL FEEDTHROUGH ERROR
Trigger Pulse
Trigger Pulse
Time - (400 nS/Div)
Time - (400 nS/Div)
Figure 26.
Figure 27.
TOTAL HARMONIC DISTORTION
vs
OUTPUT FREQUENCY
THD − Total Harmonic Distortion − dB
−40
VDD = 5 V, VREF = 4.096 V
−1 dB FSR Digital Input, Fs = 1 Msps
Measurement Bandwidth = 20 kHz
−50
−60
−70
THD
−80
−90
−100
12
2nd Harmonic
3rd Harmonic
0
1
2
3
4
5
6
7
8
Output Frequency (Tone) − kHz
Figure 28.
9
10
Copyright © 2005–2011, Texas Instruments Incorporated
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
3-Wire Serial Interface
The DAC7552 digital interface is a standard 3-wire SPI/QSPI/Microwire/DSP-compatible interface.
Table 1. Serial Interface Programming
CONTROL
DATA BITS
DAC(s)
FUNCTION
DB15
DB14
DB13
DB12
DB11-DB10
0
0
0
0
data
A
Single Channel Store. The input register of channel A is updated.
0
0
1
0
data
B
Single Channel Store. The input register of channel B is updated.
0
1
0
0
data
A
Single Channel Update. The input and DAC registers of channel A are
updated.
0
1
1
0
data
A–B
1
0
0
0
data
B
1
0
1
0
data
A–B
Single Channel Update. The input and DAC registers of channel B are
updated and the DAC register of channel A is updated with input register data.
1
1
0
0
data
A–B
All Channel Update. The input and DAC registers of channels A and B are
updated.
1
1
1
0
data
A–B
All Channel DAC Update. The DAC register of channels A and B are updated
with input register data.
Single Channel Update. The input and DAC registers of channel A are
updated and the DAC register of channel B is updated with input register data.
Single Channel Update. The input and DAC registers of channel B are
updated.
POWER-DOWN MODE
In power-down mode, the DAC outputs are programmed to one of three output impedances, 1 kΩ, 100 kΩ, or
floating.
Table 2. Power-Down Mode Control
EXTENDED CONTROL
DATA BITS
FUNCTION
DB15
DB14
DB13
DB12
DB11
DB10
DB9-DB0
0
0
X
1
0
0
X
PWD Hi-Z (all channels)
0
0
X
1
0
1
X
PWD 1 kΩ (all channels)
0
0
X
1
1
0
X
PWD 100 kΩ (all channels)
0
0
X
1
1
1
X
PWD Hi-Z (all channels)
0
1
X
1
0
0
X
PWD Hi-Z (selected channel = A)
0
1
X
1
0
1
X
PWD 1 kΩ (selected channel = A)
0
1
X
1
1
0
X
PWD 100 kΩ (selected channel = A)
0
1
X
1
1
1
X
PWD Hi-Z (selected channel = A)
1
0
X
1
0
0
X
PWD Hi-Z (selected channel = B)
1
0
X
1
0
1
X
PWD 1 kΩ (selected channel = B)
1
0
X
1
1
0
X
PWD 100 kΩ (selected channel = B)
1
0
X
1
1
1
X
PWD Hi-Z (selected channel = B)
1
1
X
1
0
0
X
PWD Hi-Z (all channels)
1
1
X
1
0
1
X
PWD 1 kΩ (all channels)
1
1
X
1
1
0
X
PWD 100 kΩ (all channels)
1
1
X
1
1
1
X
PWD Hi-Z (all channels)
Copyright © 2005–2011, Texas Instruments Incorporated
13
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
THEORY OF OPERATION
D/A SECTION
DAC External Reference Input
The architecture of the DAC7552 consists of a string
DAC followed by an output buffer amplifier. Figure 29
shows a generalized block diagram of the DAC
architecture.
Two separate reference pins are provided for two
DACs, providing maximum flexibility. VREFA serves
DAC A and VREFB serves DAC B. VREFA and
VREFB can be externally shorted together for
simplicity.
VREF
100 kW
VFB
It is recommended to use a buffered reference in the
external circuit (e.g., REF3140). The input impedance
is typically 100 kΩ for each reference input pin.
VOUT
Amplifier Sense Input
100 kW
50 kW
_
Ref +
Resistor String
Ref −
DAC Register
+
GND
Figure 29. Typical DAC Architecture
The input coding to the DAC7552 is unsigned binary,
which gives the ideal output voltage as:
VOUT = VREF × D/4096
Where D = decimal equivalent of the binary code that
is loaded to the DAC register which can range from 0
to 4095.
To Output
Amplifier
VREF
R
R
R
R
GND
Figure 30. Typical Resistor String
RESISTOR STRING
The resistor string section is shown in Figure 30. It is
simply a string of resistors, each of value R. The
digital code loaded to the DAC register determines at
which node on the string the voltage is tapped off to
be fed into the output amplifier. The voltage is tapped
off by closing one of the switches connecting the
string to the amplifier. Because it is a string of
resistors, it is specified monotonic. The DAC7552
architecture uses two separate resistor strings to
minimize channel-to-channel crosstalk.
OUTPUT BUFFER AMPLIFIERS
The output amplifier is capable of generating
rail-to-rail voltages on its output, which gives an
output range of 0 V to VDD. It is capable of driving a
load of 2 kΩ in parallel with up to 1000 pF to GND.
The source and sink capabilities of the output
amplifier can be seen in the typical curves. The slew
rate is 1.8 V/µs with a typical settling time of 3 µs with
the output unloaded.
14
The DAC7552 contains two amplifier feedback input
pins, VFBA and VFBB. For voltage output operation,
VFBA and VFBB must externally connect to VOUTA
and VOUTB, respectively. For better DC accuracy,
these connections should be made at load points.
The VFBA and VFBB pins are also useful for a
variety of applications, including digitally controlled
current sources. Each feedback input pin is internally
connected to the DAC amplifier's negative input
terminal through a 100-kΩ resistor; and, the
amplifier's negative input terminal internally connects
to ground through another 100-kΩ resistor (See
Figure 29). This forms a gain-of-two, noninverting
amplifier configuration. Overall gain remains one
because the resistor string has a divide-by-two
configuration. The resistance seen at each VFBx pin
is approximately 200 kΩ to ground.
Power-On Reset
On power up, all internal registers are cleared and all
channels are updated with zero-scale voltages. Until
valid data is written, all DAC outputs remain in this
state. This is particularly useful in applications where
it is important to know the state of the DAC outputs
while the device is powering up. In order not to turn
on ESD protection devices, VDD should be applied
before any other pin is brought high.
Power Down
The DAC7552 has a flexible power-down capability
as described in Table 2. Individual channels could be
powered down separately or all channels could be
powered down simultaneously. During a power-down
condition, the user has flexibility to select the output
impedance of each channel. During power-down
operation, each channel can have either 1-kΩ,
100-kΩ, or Hi-Z output impedance to ground.
Copyright © 2005–2011, Texas Instruments Incorporated
DAC7552
www.ti.com
Asynchronous Clear
The DAC7552 output is asynchronously set to
zero-scale voltage immediately after the CLR pin is
brought low. The CLR signal resets all internal
registers and therefore behaves like the Power-On
Reset. The DAC7552 updates at the first rising edge
of the SYNC signal that occurs after the CLR pin is
brought back to high.
IOVDD and Level Shifters
The DAC7552 can be used with different logic
families that require a wide range of supply voltages
(from 1.8 V to 5.5 V). To enable this useful feature,
the IOVDD pin must be connected to the logic supply
voltage of the system. All DAC7552 digital input and
output pins are equipped with level-shifter circuits.
Level shifters at the input pins ensure that external
logic high voltages are translated to the internal logic
high voltage, with no additional power dissipation.
Similarly, the level shifter for the SDO pin translates
the internal logic high voltage (AVDD) to the external
logic high level (IOVDD). For single-supply operation,
the IOVDD pin can be tied to the AVDD pin.
SERIAL INTERFACE
The DAC7552 is controlled over a versatile 3-wire
serial interface, which operates at clock rates up to
50 MHz and is compatible with SPI, QSPI, Microwire,
and DSP interface standards.
In daisy-chain mode (DCEN = 1), the DAC7552
requires a falling SCLK edge after the rising SYNC, in
order to initialize the serial interface for the next
update.
16-Bit Word and Input Shift Register
The input shift register is 16 bits wide. DAC data is
loaded into the device as a 16-bit word under the
control of a serial clock input, SCLK, as shown in the
Figure 1 timing diagram. The 16-bit word, illustrated
in Table 1, consists of four control bits followed by 12
bits of DAC data. The data format is straight binary
with all zeroes corresponding to 0-V output and all
ones corresponding to full-scale output (VREF – 1
LSB). Data is loaded MSB first (bit 15) where the first
two bits (DB15 and DB14) determine if the input
register, DAC register, or both are updated with shift
register input data. Bit 13 (DB13) determines whether
the data is for DAC A, DAC B, or both DACs. Bit 12
(DB12) determines either normal mode or
power-down mode (see Table 2). All channels are
updated when bits 15 and 14 (DB15 and DB14) are
high.
Copyright © 2005–2011, Texas Instruments Incorporated
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
The SYNC input is a level-triggered input that acts as
a frame synchronization signal and chip enable. Data
can only be transferred into the device while SYNC is
low. To start the serial data transfer, SYNC should be
taken low, observing the minimum SYNC to SCLK
falling edge setup time, t4. After SYNC goes low,
serial data is shifted into the device's input shift
register on the falling edges of SCLK for 16 clock
pulses.
The state of the daisy chain enable pin, DCEN,
determines when the input data word is latched into
the converter and when the output can be updated.
When DCEN is low, daisy chain mode is disabled and
the SDO pin is brought to a Hi-Z state. The first 16
data bits that follow the first falling edge of SYNC are
stored in the shift register. Immediately following the
16th falling edge of SCLK, the converter latches the
data word into the DAC and it updates immediately. If
SYNC is brought high before the 16th data bit, the
data word is ignored and no action occurs.
When DCEN is high, daisy chain mode is enabled
causing data that is input to the shift register to be
passed through and shifted out. The SDO pin
becomes active and outputs the SDIN data with a 16
clock cycle delay. In this case, a rising edge of SYNC
is required in order to load the shift register data into
the DAC. The loaded data consists of the last 16 data
bits received into the shift register before the rising
edge of SYNC.
If daisy-chain operation is not needed, DCEN should
permanently be tied to a logic low voltage.
Daisy-Chain Operation
When DCEN pin is brought high, daisy chaining is
enabled. Serial Data Output (SDO) pin is provided to
daisy-chain multiple DAC7552 devices in a system.
As long as SYNC is high or DCEN is low, the SDO
pin is in a high-impedance state. When SYNC is
brought low the output of the internal shift register is
tied to the SDO pin. As long as SYNC is low and
DCEN is high, SDO duplicates SDIN signal with a
16-cycle delay. To support multiple devices in a daisy
chain, SCLK and SYNC signals are shared across all
devices, and SDO of one DAC7552 should be tied to
the SDIN of the next DAC7552. For n devices in such
a daisy chain, 16n SCLK cycles are required to shift
the entire input data stream. After 16n SCLK falling
edges are received, following a falling SYNC, the
data stream becomes complete and SYNC can be
brought high to update n devices simultaneously.
SDO operation is specified at a maximum SCLK
speed of 10 MHz.
15
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
INTEGRAL AND DIFFERENTIAL LINEARITY
The DAC7552 uses precision thin-film resistors
providing exceptional linearity and monotonicity.
Integral linearity error is typically within (+/-) 0.35
LSBs, and differential linearity error is typically within
(+/-) 0.08 LSBs.
www.ti.com
Generating ±5-V, ±10-V, and ± 12-V Outputs For
Precision Industrial Control
Industrial control applications can require multiple
feedback loops consisting of sensors, ADCs, MCUs,
DACs, and actuators. Loop accuracy and loop speed
are the two important parameters of such control
loops.
GLITCH ENERGY
Loop Accuracy:
The DAC7552 uses a proprietary architecture that
minimizes glitch energy. The code-to-code glitches
are so low, they are usually buried within the
wide-band noise and cannot be easily detected. The
DAC7552 glitch is typically well under 0.1 nV-s. Such
low glitch energy provides more than 10X
improvement over industry alternatives.
In a control loop, the ADC has to be accurate. Offset,
gain, and the integral linearity errors of the DAC are
not factors in determining the accuracy of the loop.
As long as a voltage exists in the transfer curve of a
monotonic DAC, the loop can find it and settle to it.
On the other hand, DAC resolution and differential
linearity do determine the loop accuracy, because
each DAC step determines the minimum incremental
change the loop can generate. A DNL error less
than –1 LSB (non-monotonicity) can create loop
instability. A DNL error greater than +1 LSB implies
unnecessarily large voltage steps and missed voltage
targets. With high DNL errors, the loop loses its
stability, resolution, and accuracy. Offering 12-bit
ensured monotonicity and ± 0.08 LSB typical DNL
error, 755X DACs are great choices for precision
control loops.
CHANNEL-TO-CHANNEL CROSSTALK
The DAC7552 architecture is designed to minimize
channel-to-channel crosstalk. The voltage change in
one channel does not affect the voltage output in
another channel. The DC crosstalk is in the order of a
few microvolts. AC crosstalk is also less than –100
dBs. This provides orders of magnitude improvement
over certain competing architectures.
APPLICATION INFORMATION
Loop Speed:
DAC SPI Interfacing
Many factors determine control loop speed. Typically,
the ADC's conversion time and the MCU's
computation time are the two major factors that
dominate the time constant of the loop. DAC settling
time is rarely a dominant factor because ADC
conversion times usually exceed DAC conversion
times. DAC offset, gain, and linearity errors can slow
the loop down only during the start-up. Once the loop
reaches its steady-state operation, these errors do
not affect loop speed any further. Depending on the
ringing characteristics of the loop's transfer function,
DAC glitches can also slow the loop down. With its 1
MSPS (small-signal) maximum data update rate,
DAC7552 can support high-speed control loops.
Ultralow glitch energy of the DAC7552 significantly
improves loop stability and loop settling time.
Care must be taken with the digital control signals
that are applied directly to the DAC, especially with
the SYNC pin. The SYNC pin must not be toggled
without having a full SCLK pulse in between. If this
condition is violated, the SPI interface locks up in an
erroneous state, causing the DAC to behave
incorrectly and possibly have errors. The DAC can be
recovered from this faulty state by writing a valid SPI
command or using the SYNC pin correctly;
communication is then restored. Avoid glitches and
transients on the SYNC line to ensure proper
operation.
Waveform Generation
Due to its exceptional linearity, low glitch, and low
crosstalk, the DAC7552 is well suited for waveform
generation (from DC to 10 kHz). The DAC7552
large-signal settling time is 5 µs, supporting an
update rate of 200 KSPS. However, the update rates
can exceed 1 MSPS if the waveform to be generated
consists of small voltage steps between consecutive
DAC updates. To obtain a high dynamic range,
REF3140 (4.096 V) or REF02 (5 V) are
recommended for reference voltage generation.
16
Generating Industrial Voltage Ranges:
For control loop applications, DAC gain and offset
errors are not important parameters. This could be
exploited to lower trim and calibration costs in a
high-voltage control circuit design. Using an
operational amplifier (OPA130), and a voltage
reference (REF3140), the DAC7552 can generate the
wide voltage swings required by the control loop.
Copyright © 2005–2011, Texas Instruments Incorporated
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
Fixed R1 and R2 resistors can be used to coarsely
set the gain required in the first term of the equation.
Once R2 and R1 set the gain to include some
minimal over-range, a DAC7552 channel could be
used to set the required offset voltage. Residual
errors are not an issue for loop accuracy because
offset and gain errors could be tolerated. One
DAC7552 channel can provide the Vtail voltage, while
the other DAC7552 channel can provide Vdac voltage
to help generate the high-voltage outputs.
Vtail
DAC7552
R1
REF3140
R2
VREF
VREFH
DAC7552
_
Vdac
+
VOUT
OPA130
For ±5-V operation: R1=10 kΩ, R2 = 15 kΩ, Vtail =
3.33 V, VREF= 4.096 V
Figure 31. Low-cost, Wide-swing Voltage
Generator for Control Loop Applications
For ±10-V operation: R1=10 kΩ, R2 = 39 kΩ, Vtail =
2.56 V, VREF = 4.096 V
The output voltage of the configuration is given by:
ǒ
Ǔ
V out + V REF R2 ) 1 Din * V tail R2
4096
R1
R1
Copyright © 2005–2011, Texas Instruments Incorporated
(1)
For ±12-V operation: R1=10 kΩ, R2 = 49 kΩ, Vtail =
2.45 V, VREF = 4.096 V
17
DAC7552
SLAS442D – JANUARY 2005 – REVISED JUNE 2011
www.ti.com
REVISION HISTORY
Changes from Revision C (December 2005) to Revision D
Page
•
Changed to Revision D, June 2011 ...................................................................................................................................... 1
•
Changed row 4, DAC(s) column from A to A-B, row 5, from A to B and row 6, from B to A-B .......................................... 13
•
Changed wording in 3rd and 4th paragraphs in "16-Bit Word and Input Shift Register" section ....................................... 15
•
Added new sub section "DAC SPI Interfacing" and 1 paragraph directly under APPLICATION INFORMATION ............. 16
18
Copyright © 2005–2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
DAC7552IRGTR
ACTIVE
QFN
RGT
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
D752
DAC7552IRGTRG4
ACTIVE
QFN
RGT
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
D752
DAC7552IRGTT
ACTIVE
QFN
RGT
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
D752
DAC7552IRGTTG4
ACTIVE
QFN
RGT
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
D752
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DAC7552IRGTR
QFN
RGT
16
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
DAC7552IRGTT
QFN
RGT
16
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC7552IRGTR
QFN
RGT
16
3000
338.1
338.1
20.6
DAC7552IRGTT
QFN
RGT
16
250
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated