MAX6037C

MAX6037C
MAX6037CAUKADJ+
RELIABILITY REPORT
FOR
MAX6037CAUKADJ+
PLASTIC ENCAPSULATED DEVICES
February 20, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX6037CAUKADJ+
Conclusion
The MAX6037CAUKADJ+ successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim"s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability
standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX6037 family of low-dropout, micropower voltage references offer fixed and adjustable output voltage options ranging from 1.184V to 5V.
Connect an external resistive-divider on the MAX6037_ADJ to adjust the output voltage from 1.184V to 5V. The other devices in the MAX6037 family
feature fixed output voltages of 1.25V, 2.048V, 2.5V, 3.0V, 3.3V, and 4.096V. The MAX6037 offers shutdown functionality with an active-low shutdown
(500nA, max). These series-mode voltage references operate from a 2.5V to 5.5V supply and consume 275µA (max) quiescent current. The output is
stable driving loads from 0.02µF to 1µF and can source and sink 5mA of load current. The MAX6037 offers a low temperature coefficient of 25ppm/°C
and initial accuracy of ±0.2% (max). The low dropout voltage (100mV, max at 1mA) and supply-independent, low supply current make the MAX6037
ideal for battery-powered applications. The MAX6037 is available in the miniature 5-pin SOT23 package and is specified over the -40°C to +125°C
automotive temperature range.
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MAX6037CAUKADJ+
II. Manufacturing Information
A. Description/Function:
Low-Power, Fixed and Adjustable Reference with Shutdown in SOT23
B. Process:
B8
C. Number of Device Transistors:
23390
D. Fabrication Location:
Texas
E. Assembly Location:
Casrsem Malaysia, ISPL Philippines, UTL Thailand, Unisem Malaysia
F. Date of Initial Production:
January 23, 2004
III. Packaging Information
A. Package Type:
5-pin SOT23
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
84-1lmisr4 Epoxy
E. Bondwire:
Gold (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-0780
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
324.3°C/W
K. Single Layer Theta Jc:
82°C/W
IV. Die Information
A. Dimensions:
42 X 55 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
0.8 microns (as drawn)
F. Minimum Metal Spacing:
0.8 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX6037CAUKADJ+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
MTTF
=
1.83
192 x 4340 x 144 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 7.5 x 10
= 7.5 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs
quarterly 1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at
http://www.maxim-ic.com/. Current monitor data for the B8 Process results in a FIT Rate of 2.71 @ 25C and 17.30 @ 55C
(0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The RF37 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1000 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
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MAX6037CAUKADJ+
Table 1
Reliability Evaluation Test Results
MAX6037CAUKADJ+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
144
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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