XX225_Chassis_TPS

XX225_Chassis_TPS
®
Intel SC5200 5U Server
Chassis Kit
Technical Product Specification
Order Number: A99108-001
Revision 1.2
December, 2002
Enterprise Platforms and Services Marketing
Revision History
SC5200 5U Server Chassis TPS
Revision History
Date
5/16/02
Revision
Number
0.9
Modifications
Initial draft for review.
5/29/02
1.0
Initial Release
9/13/02
1.1
Added SE7501BR2 Server information
Corrected MM# for Product Code, AXX2PSMODL350 (Appendix)
12/20/02
1.2
Added KHD3RP450 Redundant Power Supply
Disclaimers
®
Information in this document is provided in connection with Intel products. No license, express
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel
assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining
applications. Intel may make changes to specifications and product descriptions at any time,
without notice.
Designers must not rely on the absence or characteristics of any features or instructions
marked "reserved" or "undefined." Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
This document contains information on products in the design phase of development. Do not
finalize a design with this information. Revised information will be published when the product
is available. Verify with your local sales office that you have the latest datasheet before
finalizing a design.
®
The Intel SHG2, SE7501BR2, SE7505VB2 or SE7500CW2 Server Boards may contain
design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
2
I C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the
2
2
I C bus/protocol and was developed by Intel. Implementations of the I C bus/protocol or the
SMBus bus/protocol may require licenses from various entities, including Philips Electronics
N.V. and North American Philips Corporation.
Intel and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries
in the United States and other countries.
Copyright © Intel Corporation 2002. *Other names and brands may be claimed as the property
of others.
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Revision 1.2
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SC5200 5U Server Chassis TPS
Table of Contents
Table of Contents
1. Introduction ............................................................................................................1
1.1
KHD3BASE450 ................................................................................................... 1
1.2
KHD3RP450........................................................................................................ 1
1.3
KHD3HSRP650................................................................................................... 1
1.4
KHD3HSRP650R ................................................................................................ 1
1.5
AXX2HSDRVUG ................................................................................................. 2
1.6
5.25 Inch Drive Bays ........................................................................................... 2
1.7
Chassis Cover..................................................................................................... 2
2. SC5200 Chassis .....................................................................................................4
2.1
System Colors..................................................................................................... 4
2.2
Security ............................................................................................................... 4
2.2.1 Padlock Loop ................................................................................................. 4
2.2.2 Key Lock ........................................................................................................ 4
2.2.3 Instrusion Switch............................................................................................ 5
2.3
I/O Panel ............................................................................................................. 5
2.4
Chassis Views ..................................................................................................... 5
3. Chassis Power Subsystem..................................................................................11
3.1
EPS - 450W Entry (Non Redundant) Power Supply ......................................... 11
3.1.1 EPS - 450-W Power Supply Mechanical Outline ......................................... 11
3.1.2 EPS 450-W Power Supply Fan Requirements ............................................ 12
3.1.3 450-W, 1+1 Base Redudant Power Supply (BRP) (KHD3RP450) ............. 12
3.2
650W 2+1 Redundant Power Supply................................................................ 12
3.3
450W 1+1 Base Redundant Power (BRP) Supply Mechanical Specifications. 13
Revision 1.2
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SC5200 5U Server Chassis TPS
3.3.1 450W 1+1 Module Mechanical Drawing ..................................................... 13
3.3.2 Cage Mechanical Drawing ........................................................................... 14
3.3.3 450W 1+1 Airflow and Acoustic noise ........................................................ 15
3.3.4 AC Input Requirements ............................................................................... 16
3.3.5 AC Inlet Connector ...................................................................................... 16
3.3.6 AC Input Voltage Specification .................................................................... 16
3.3.7 Efficiency ..................................................................................................... 16
3.3.8 AC Line Dropout .......................................................................................... 16
3.3.9 AC Line Fuse ............................................................................................... 16
3.3.10 AC Inrush................................................................................................... 16
3.4
450W 1+1 DC Output Specification .................................................................. 16
3.4.1 Output Connector ........................................................................................ 16
3.4.2 Grounding .................................................................................................... 17
3.4.3 Residual Voltage Immunity in Standby mode .............................................. 17
3.4.4 Output Power / Currents .............................................................................. 17
3.4.5 Ripple / Noise .............................................................................................. 18
3.4.6 Current Sharing ........................................................................................... 18
3.4.7 Hot Swap ..................................................................................................... 19
3.4.8 Timing Requirements................................................................................... 19
3.5
450W 1+1 Protection Circuits ........................................................................... 21
3.5.1 Current Limit (OCP) ................................................................................... 21
3.5.2 Over Voltage Protection (OVP)................................................................... 21
3.5.3 Over Temperature Protection (OTP) .......................................................... 21
3.6
450W 1+1 Control and Indicator Functions....................................................... 21
3.6.1 PWOK (Power OK) Output Signal ............................................................... 22
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3.6.2 PSKILL Signal Requirements ...................................................................... 23
3.6.3 PRESENT# Signal Requirements ................................................................ 23
3.6.4 LED DISPLAY Indicators ............................................................................. 24
3.7
450W 1+1 Environmental Requirements .......................................................... 24
3.7.1 Temperature ................................................................................................ 24
3.7.2 Humidity....................................................................................................... 24
3.7.3 Altitude......................................................................................................... 24
3.8
450W 1+1 MTBF.............................................................................................. 25
3.8.1 Mean Time Between Failures (MTBF) ......................................................... 25
3.8.2 Warranty Period........................................................................................... 25
3.9
450W 1+1 Power Distribution (Back Plane) Overview ..................................... 25
3.9.1 450W 1+1 Card Cage Mechanial Specification ........................................... 25
3.10
450W 1+1 Electrical Specification.................................................................. 29
3.10.1 Power Distribution Board (Backplane) block schematic ........................... 29
3.10.2 Input Connectors ....................................................................................... 30
3.10.3 240VA Current Limit .................................................................................. 32
3.11
450W 1+1 Control and Indicator Functions.................................................... 32
3.11.1 PWOK........................................................................................................ 32
3.11.2 SMBus (I2C) .............................................................................................. 32
3.11.3 I2C Bus Addressing Scheme and Supply voltage: .................................... 33
3.11.4 I2C Bus Command format ......................................................................... 33
3.11.5 Input Port Register..................................................................................... 33
3.11.6 PSKill ......................................................................................................... 34
3.11.7 PSAlert# .................................................................................................... 34
3.12
450W 1+1 Output Cable Harness .................................................................. 35
Revision 1.2
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SC5200 5U Server Chassis TPS
3.12.1 P1 Baseboard power connector ................................................................ 36
3.12.2 P2 Processor Power Connector ................................................................ 37
3.12.3 P3 Signal Connector.................................................................................. 37
3.12.4 P4-6, P8-11 Peripheral Power Connectors................................................ 37
3.12.5 P7 Floppy Power Connector...................................................................... 38
3.13
450W 1+1 Environmental Requirements ....................................................... 38
3.13.1 Temperature .............................................................................................. 38
3.13.2 Humidity..................................................................................................... 38
3.13.3 Altitude....................................................................................................... 38
3.13.4 Mechanical Shock...................................................................................... 38
3.13.5 Random Vibration ...................................................................................... 38
3.13.6 Thermal Shock (Shipping) ......................................................................... 39
3.13.7 Ecological Requirements ........................................................................... 39
3.14
650-W 2+1 Redundant Power Supply............................................................ 39
3.14.1 650-W Power Supply Mechanical Outline ................................................. 39
3.14.2 Marking and Identification.......................................................................... 40
3.14.3 Dual AC Inputs........................................................................................... 40
3.14.4 650-W Power Supply LED Functions ........................................................ 41
3.14.5 350-W TPS Module ................................................................................... 42
3.14.6 650-W Power Supply Fan Requirements .................................................. 43
3.14.7 AC Power Line........................................................................................... 43
4. System Cooling ....................................................................................................44
4.1
Fan Configuration.............................................................................................. 44
4.2
Base Cooling Solution....................................................................................... 44
4.3
Redundant Cooling Solution ............................................................................. 46
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4.4
Table of Contents
Fan Control ....................................................................................................... 48
5. System Peripheral Bays ......................................................................................50
5.1
3.5" Floppy Drive Bay........................................................................................ 50
5.2
Drive Bay Locations .......................................................................................... 50
5.3
3.5-inch Hot-swap Hard Drive Bays .................................................................. 51
5.4
SCSI Multi-Mode Termination ........................................................................... 52
5.5
SCSI Interface................................................................................................... 52
5.6
FET Short Protection......................................................................................... 52
5.7
Device SCSI ID ................................................................................................. 53
5.8
Hard Drive Activity LED..................................................................................... 53
5.9
Hard Drive Fault LED ........................................................................................ 53
5.10
Hot-Swap Drive Bay Electronics .................................................................... 55
5.10.1 SCSI HSBP Board Layout ......................................................................... 56
5.10.2 SCSI Hot-Swap Backplane Specifications................................................. 56
5.10.3 SAF-TE Board Layout................................................................................ 57
5.11
SAF-TE Specifications ................................................................................... 57
6. Front Panel ...........................................................................................................58
7. System Interconnection.......................................................................................60
7.1
Signal Definitions .............................................................................................. 60
7.2
Interconnect Diagram........................................................................................ 60
7.3
Chassis Internal Cables .................................................................................... 61
7.3.1 Intrusion Alarm Switch cable ....................................................................... 61
7.3.2 Front Panel cable......................................................................................... 61
7.3.3 USB cable.................................................................................................... 61
7.3.4 Fan Connectors ........................................................................................... 61
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7.3.5 SCSI cable................................................................................................... 61
7.3.6 I2C cable ...................................................................................................... 61
7.4
Server Board Internal Cables ............................................................................ 61
7.4.1 IDE cable ..................................................................................................... 61
7.4.2 SCSI cable................................................................................................... 62
7.4.3 Floppy cable ................................................................................................ 62
7.4.4 Serial cable .................................................................................................. 62
7.5
Accessory Cables ............................................................................................. 62
7.5.1 ICMB Interface Card cable .......................................................................... 62
7.5.2 External SCSI Cable.................................................................................... 62
7.5.3 SCSI Y-Cable .............................................................................................. 62
7.6
I/O Panel Connectors........................................................................................ 62
8. System-Compatible Server Boards ....................................................................63
8.1
Intel® SE7505VB2 Dual Processor Server Board ............................................. 63
8.2
Intel® SHG2 Dual Processor Server Board ....................................................... 63
8.3
Intel® SE7500CW2 Dual Processor Server Board ............................................ 65
8.4
®
Intel SE7501BR2 Dual Processor Server Board ............................................. 66
9. Product Regulatory Compliance.........................................................................67
9.1
Product Safety Compliance............................................................................... 67
9.2
Product EMC Compliance ................................................................................. 67
9.3
Product Regulatory Compliance Markings ........................................................ 67
9.4
Electromagnetic Compatibility Notices .............................................................. 68
9.4.1 USA ............................................................................................................. 68
9.4.2 FCC Verification Statement ......................................................................... 69
9.4.3 ICES-003 (Canada) ..................................................................................... 69
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9.4.4 Europe (CE Declaration of Conformity) ....................................................... 69
9.4.5 Japan EMC Compatibility ............................................................................ 69
9.4.6 BSMI (Taiwan) ............................................................................................. 70
10. Environmental Limits...........................................................................................71
10.1
System Office Environment............................................................................ 71
10.2
System Environmental Testing....................................................................... 71
11. Reliability, Serviceability, and Availability .........................................................72
11.1
MTBF ............................................................................................................. 72
11.2
Serviceability .................................................................................................. 72
12. Upgradeability ......................................................................................................73
12.1
DLT Tape Drive and Slimline CDROM Mounting Brackets ............................ 73
12.2
ICMB Interface card with brackets and cable................................................. 73
12.3
Hot-swap Drive Bay Upgrade ......................................................................... 74
12.4
SCSI Y-Adapter Cable ................................................................................... 74
12.5
External SCSI Adapter Cable......................................................................... 75
12.6
350-W TPS Power Module............................................................................. 75
12.7
Rack Conversion Kit Product Code AHD3RACK. .......................................... 76
13. Appendix A: Chassis Spares & Accessories .......................................................I
13.1
Upgrade and Accessory Parts........................................................................... I
13.2
Replacement and Spare Parts .......................................................................... I
14. Glossary..................................................................................................................II
Reference Documents ............................................................................................... IV
15. INDEX ..................................................................................................................... V
Revision 1.2
xi
List of Figures
SC5200 5U Server Chassis TPS
List of Figures
Figure 1. ATX* 2.03 I/O Aperture .................................................................................... 5
Figure 2. Rack Configuration View.................................................................................. 6
Figure 3. Front Pedestal View ......................................................................................... 6
Figure 4. Rear Pedestal View (Base version).................................................................. 7
Figure 5. Rear Pedestal View (Redundant version ) ....................................................... 8
Figure 6. Front Pedestal Internal View (Base version) .................................................... 8
Figure 7. Front Pedestal Internal View (Redundant version)........................................... 9
Figure 8. Rear Pedestal Internal View (Base version)..................................................... 9
Figure 9. Rear Pedestal Internal View (Redundant version) ......................................... 10
Figure 10 EPS 450W Power Supply ............................................................................. 11
Figure 11 Power Supply Enclosure240VA Drawing ...................................................... 13
Figure 12 450W 1+1 Redudant Power Supply Cage Drawing ...................................... 14
Figure 13 450-Watt 1+1 Output Voltage Timing............................................................ 19
Figure 14 450-Watt 1+1 Turn On/Off Timing ................................................................ 19
Figure 15 450Watt 1+1 Output Voltage Rise Time ....................................................... 20
Figure 16 PSON# Required Signal Characteristics....................................................... 22
Figure 17 450W 1+1 Power Distribution e Boad & Enclosure...................................... 25
Figure 18 Power Distribution board hole layout and dimensions ................................ 26
Figure 19 Input connector hole layout detail ................................................................. 28
Figure 20 Power Distribution Block Schematic .......................................................... 29
Figure 21 PWOK Circuit Function ................................................................................ 32
Figure 22 SMBus Circuit Function................................................................................. 32
Figure 23 PSAlert# Signal Circuit Function ................................................................... 34
Figure 24 Output Harnes Mechanical Details................................................................ 36
Figure 25. 650-W 2+1 Redundant Power Supply.......................................................... 40
Figure 26. Power Supply Module, AC Inlet & LED Designations .................................. 40
Figure 27. 650-W Power Supply Cage LED Block Diagram ......................................... 41
Figure 28. Replaceable 350-W Thin Power Supply Module.......................................... 42
Figure 29. Close Up View of Front Fan Mounting Features .......................................... 44
Figure 30. Processor Wind Tunnel Illustration .............................................................. 45
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List of Figures
Figure 31. Base Chassis Airflow Characteristics........................................................... 45
Figure 32. Close Up View of Redundant Hot-Swap Fan Assemblies............................ 46
Figure 33. Processor and PCI Area Ducting ................................................................. 47
Figure 34. Redundant Chassis Airflow Characteristics ................................................. 47
Figure 35. Drive Bay Locations ..................................................................................... 50
Figure 36. Hot-swap Drive Bay, Front Isometric View................................................... 54
Figure 37. Hot-swap Drive Bay, Rear Isometric View ................................................... 55
Figure 38. Drive Carrier with Air Baffle Installed............................................................ 55
Figure 39. SC5100/SC5200 SCSI Backplane ............................................................... 56
Figure 40. SC5100/SC5200 SAF-TE Board.................................................................. 57
Figure 41. Front Panel Controls and Indicators............................................................. 58
Figure 42. Front Panel, Showing Basic Layout ............................................................. 59
Figure 43. Chassis Interconnect Diagram ..................................................................... 60
Figure 44. DLT Tape Drive and Slimline CDROM Mounting Brackets .......................... 73
Figure 45. ICMB Interface Card .................................................................................... 73
Figure 46. Hot-swap Drive Bay Upgrade....................................................................... 74
Figure 47. SCSI Y-Adapter Cable ................................................................................. 74
Figure 48. External SCSI Adapter Cable Detail ............................................................ 75
Figure 49. 350-W TPS Power Module .......................................................................... 75
Figure 50. Rack Conversion Kit..................................................................................... 76
Revision 1.2
xiii
List of Tables
SC5200 5U Server Chassis TPS
List of Tables
Table 1 SC5200 Product Matrix ...................................................................................... 2
Table 2. Chassis Dimensions.......................................................................................... 4
Table 3. System Power Summary for All Power Supplies............................................. 12
Table 5 AC Input Rating................................................................................................ 16
Table 6 Edge Finger Pinout ......................................................................................... 16
Table 7 Load Ratings 450 Watt 1+1 ............................................................................. 18
Table 8 Voltage Regulation 450-Watt 1+1 Limits.......................................................... 18
Table 9 450Watt 1+1 Turn On/Off Timing..................................................................... 20
Table 10 450Watt 1+1 Over Current Protection (OCP)................................................. 21
Table 11 450Watt 1+1 Over Voltage Protection (OVP) Limits ...................................... 21
Table 12 PSON* Signal Functions ................................................................................ 22
Table 13 450Watt 1+1 LED Indicators ......................................................................... 24
Table 14 Input Connector Pinout .................................................................................. 31
Table 15 240VA Over-Current Protection Limits ........................................................... 32
Table 16 I2C Bus Address ............................................................................................ 33
Table 17 I2C Bus Command Format ............................................................................ 33
Table 18 PSAlert# Circuit Logic Table .......................................................................... 35
Table 19 Cable Lengths ................................................................................................ 35
Table 20 P1 Main Power Connector ............................................................................ 36
Table 21 P2 Processor Power Connector ..................................................................... 37
Table 22 P3 Server Signal Connector........................................................................... 37
Table 23 P4-6, P8-11 Peripheral Power Connector ...................................................... 38
Table 24: P7 Floppy Power Connector ....................................................................... 38
Table 25. 350-W TPS Module LED Indicator ................................................................ 42
Table 26. Non-Redundant Power Supply Configurations............................................. 43
Table 27. SCSI ID Assignments.................................................................................... 53
Table 28. Hard Drive Activity LED................................................................................. 53
Table 29. Hard Drive Fault LED .................................................................................... 54
Table 30. Typical Front Panel LED Functions............................................................... 59
Table 31. System Office Environment Summary .......................................................... 71
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List of Tables
Table 32. MTBF Calculations........................................................................................ 72
Table 33. Maximum Maintenance Procedure Times..................................................... 72
Revision 1.2
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SC5200 5U Server Chassis TPS
1.
Introduction
Introduction
This specification details the feature set of the Intel® SC5200 Server Chassis, an entry-level server
®
chassis designed for Intel server board products. The SC5200 chassis series of products are low
cost, time to market, and allow utilization of multiple platforms and configurations.
1.1
KHD3BASE450
KHD3BASE450 is the base SC5200 chassis, designed to address the entry market. It includes a
single 450-W Power Factor Correction (PFC) non redundant power supply, and supports five non
hot-swap hard drives. Two tachometer output fans, mounted in front of the server board, and two
fans mounted at the rear of the chassis provide main chassis cooling. An optional hot-swap drive
bay kit, product code AXX2HSDRVUG, provides an upgrade path to allow the SC5200 base
®
chassis to support five hot-swap drives. This chassis is compatible with the Intel SE7500CW2,
SHG2, and SE7501BR2 Server Boards.
1.2
KHD3RP450
KHD3RP450 is the base SC5200 chassis, designed to address the entry market. It includes a
single 450-W Power Factor Correction (PFC) power supply. A second 450-W module may be
added to provide redundancy. Two tachometer output fans, mounted in front of the server board,
and two fans mounted at the rear of the chassis provide main chassis cooling. An optional hotswap drive bay kit, product code AXX2HSDRVUG, provides an upgrade path to allow the SC5200
®
base chassis to support five hot-swap drives. This chassis is compatible with the Intel
SE7500CW2, SHG2, SE7505VB2 and SE7501BR2 Server Boards. An Rack Mount Conversio kit,
ADH3RACK, is available.
1.3
KHD3HSRP650
KHD3HSRP650 contains a 650-W, 2+1 redundant power supply that features replaceable hotswap 350-W thin power supply (TPS) modules and dual AC power cords for increased reliability
and availability. The 350-W modules can be replaced without disrupting the operation of the
server system. This chassis is pre-configured with two 350-W power modules and can be
upgraded to a redundant power supply with an optional third 350-W module. This version of the
chassis also features redundant cooling and hot-swappable fans. Two hot-swap 80-mm fans
mounted at the rear, and one hot-swap 80-mm fan at the front, provide cooling for the core area
(processors and memory). Two hot-swap, 92-mm fans mounted at the front provide cooling for
the PCI area. A single hot-swap Small Computer Systems Interface (SCSI) hard drive bay is preinstalled in this version of the chassis, and an optional hot-swap bay drive bay kit can be installed
to provide support for up to ten hot-swap SCA hard drives. This chassis is compatible with the
®
Intel SHG2 and SE7501BR2 Server Boards.
1.4
KHD3HSRP650R
KHD3HSRP650R is the rack-mountable version of the KHD3HSRP650 chassis. In addition to the
features mentioned above, this version provides unpainted covers, black rack bezels, peripheral
bay reorientation bracket, and slide mounting rails. The unit is re-positioned in a horizontal
orientation. The reorientation bracket is provided to maintain a horizontal position for CD-ROM
®
and tape drives. This chassis is compatible with the Intel SHG2 and SE7501BR2 Server Boards.
Revision 1.2
1
Introduction
1.5
SC5200 5U Server Chassis TPS
AXX2HSDRVUG
The optional hot-swap SCSI hard disk drive bay, AXX2HSDRVUG, is available for all of the
SC5200 chassis configurations. It supports up to five 1-inch single connector attachment (SCA)
low-voltage differential SCSI (LVD) hard drives to enhance serviceability, availability, and
upgradability of the system. Adapter brackets allow mounting of hard drives at the lower six 5.25inch, half-height peripheral bays at the front of the chassis. When the hot-swap drive bay is
installed, it utilizes three of the six available bay positions. For the chassis configured with a hotswap redundant power supply, this optional hot-swap hard disk drive bay is added to the preinstalled drive bay for a total support of ten hot-swap SCSI drives.
1.6
5.25 Inch Drive Bays
An additional two 5.25-inch, half-height drive bays are available for other peripherals, such as CDROM and tape drives. Only two of the three spaces can be occupied by devices. The third
location must remain open, retaining the vented panel installed, to provide an inlet for cooling air.
1.7
Chassis Cover
A removable access cover provides entry to the interior of the chassis. On the redundant
configurations, the side cover features an access panel for hot-swap fan replacement. The rear
I/O panel conforms to Advanced Technology Extended (ATX) Specification, Revision 2.03, and
supports seven full-length expansion cards. The chassis is provided with a front panel board
designed for Server Standards Infrastructure (SSI) Entry E-Bay (EEB) 3.0-compliant server
boards.
This specification details the key features of the product. Reference documents listed in
Appendix B provide additional product specification detail for the server boards,
backplane, and power supplies validated for use with this chassis. Check the compatibility
section and the Configuration Guides for the server boards on the support website for
more details: http://support.intel.com/support/motherboards/server/chassis/sc5200/. Also see
http://support.intel.com/support/motherboards/se
Table 1 SC5200 Product Matrix
®
Product Code
Intel Server
Board
Hot-swap SCSI
Drives Supported
Power Supply
Configuration
Hot-swap
Fans
Pedestal/
Rack
KHD3BASE450
Base 450-W
SHG2
SE7500CW2
SE7501BR2
SE7505VB2
None:
Fixed 450-W PFC uses one
power cord.
No
Pedestal
KHD3RP450
Base 450W
Redundant (1+1)
SHG2
SE7500CW2
SE7501BR2
SE7505VB2
None:
No
Pedestal
Upgradeable to 5
SCSI Drives using
AXX2HSDRVUG
Modular 450-W PFC 1+1
with one 450-W power
module and one blank filler,
uses one power cord per
module.
KHD3HSRP650
HSRP 650-W
SHG2
SE7501BR2
Yes – 5
(upgradeable to 10
SCSI Drives using
AXX2HSDRVUG)
650-W PFC 2+1 dual line
cord with two 350-W
modules and one blank
filler.
Yes – 5
Pedestal
2
Upgradeable to 5
Drives using
AXX2HSDRVUG
Revision 1.2
SC5200 5U Server Chassis TPS
KHD3HSRP650R
HSRP 650-W
Rack
Revision 1.2
SHG2
SE7501BR2
Introduction
Yes – 5
(upgradeable to 10
SCSI Drives using
AXX2HSDRVUG
650-W PFC 2+1 dual line
cord with two 350-W
modules and one blank
filler.
Yes – 5
Rack
3
SC5200 Chassis
2.
SC5200 5U Server Chassis TPS
SC5200 Chassis
Table 2. Chassis Dimensions
Configuration
2.1
Pedestal
Rack
Height
17.5 inches
8.6 inches
Width
8.6 inches (chassis),
12.7 inches (with feet)
16.9 inches
Depth
26 inches
25 inches
Clearance
Front
10 inches
N/A
Clearance
Rear
5 inches
N/A
Clearance
Side
3 inches (additional side clearance
needed for service)
N/A
System Colors
The Intel® SC5200 Server Chassis is offered in two color configurations. The primary exterior
system color (bezels and covers) will match Intel Dusty Beige (GE BR7026) for the pedestal
version of the chassis. The rack version of the chassis has covers without paint and the bezel will
match GE Cycoloy*-701 (Black). Front Bezel Features
The standard pedestal front bezel is a molded plastic door covering all drive bays. A key lock is
provided to prevent unauthorized access to the peripheral bays. Each peripheral bay is covered
with a removable electromagnetic interference (EMI) shield. A molded plastic sub-bezel is located
on the face of the chassis under the front bezel. The sub-bezel houses the front panel buttons
and light pipes for the front panel indicators.
Opening the exterior plastic door on the Pedestal chassis accesses the hot-swap hard drives,. An
EMI shield is incorporated into the drive carrier design, eliminating the need for a separate shield
or door. This adds flexibility to the bezel design by making EMI performance independent of the
cosmetic plastic parts.
Customized bezels for OEM customers can be designed from the standard bezel design.
2.2
Security
A variety of chassis security options are provided at the system level.
2.2.1
Padlock Loop
A removable padlock loop on the rear of the system access cover can be used to prevent access
to the microprocessors, memory, and add-in cards. A variety of lock sizes can be accommodated
by the 0.270-inch diameter loop.
2.2.2
Key Lock
A two-position key lock/switch will unlock the front bezel.
4
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SC5200 5U Server Chassis TPS
2.2.3
SC5200 Chassis
Instrusion Switch
®
Intrusion switches are provided allowing server management software, such as Intel Server
Management (ISM), to detect unauthorized access to the system cover and pedestal bezel door.
Note: See the appropriate Server Board Technical Product Specification on the support.intel.com
website for a description of BIOS and Intel® Server Management security features.
2.3
I/O Panel
All input/output (I/O) connectors are accessible on the rear of the chassis. The SSI E-bay 3.0
compliant chassis provides an ATX* 2.03-compatible cutout for I/O shield installation. Boxed
server boards provide the required I/O shield for installation in the cutout. The I/O cutout
dimensions are shown in Figure 1 below for reference.
R 0.039 MAX, TYP
0.100 Min keepout around opening
1.750 ± 0.008
(0.150)
I/O Aperture
6.250 ± 0.008
Baseboard
5.196 ± 0.010
Datum 0,0
(0.650)
Figure 1. ATX* 2.03 I/O Aperture
2.4
Chassis Views
Revision 1.2
5
SC5200 Chassis
SC5200 5U Server Chassis TPS
Figure 2. Rack Configuration View
(Fan access door only on redundant versions)
Figure 3. Front Pedestal View
(Fan access door only on redundant versions)
6
Revision 1.2
SC5200 5U Server Chassis TPS
SC5200 Chassis
Figure 4. Rear Pedestal View (Base version)
Revision 1.2
7
SC5200 Chassis
SC5200 5U Server Chassis TPS
Figure 5. Rear Pedestal View (Redundant version )
(Actual power supply differs from picture)
Figure 6. Front Pedestal Internal View (Base version)
8
Revision 1.2
SC5200 5U Server Chassis TPS
SC5200 Chassis
Figure 7. Front Pedestal Internal View (Redundant version)
(Shown with optional second hot-swap drive bay upgrade installed)
Figure 8. Rear Pedestal Internal View (Base version)
Revision 1.2
9
SC5200 Chassis
SC5200 5U Server Chassis TPS
Figure 9. Rear Pedestal Internal View (Redundant version)
10
Revision 1.2
SC5200 5U Server Chassis TPS
3.
Chassis Power Subsystem
Chassis Power Subsystem
The Intel® SC5200 Server Chassis supports three different power supply solutions.
3.1
EPS - 450W Entry (Non Redundant) Power Supply
The 450-W non redundant Entry Power Supply (EPS) ,KHD3BASE450, features Entry SSI (Rev.
3.0)-compliant server board connectors and is positioned as the entry power supply solution for the
Intel® SHG2, SE7501BR2, SE7505VB2 and SE7500CW2 Server Boards. Refer to the 450-W
EPS 1.0 Power Supply Specification for details (see Appendix B for order number).
3.1.1
EPS - 450-W Power Supply Mechanical Outline
The mechanical outline and dimensions for the 450-W supply are an extended PS/2 form factor.
The approximate dimensions are 86-mm high by 150-mm wide by 180-mm deep.
Figure 10 EPS 450W Power Supply
Revision 1.2
11
Chassis Power Subsystem
3.1.2
SC5200 5U Server Chassis TPS
EPS 450-W Power Supply Fan Requirements
The 450-W EPS power supply incorporates an 80-mm low acoustic noise fan to exhaust air. The
sound pressure level is measured at a distance of 1.0 meter from each side of the power supply in
a free field. The worst-case peak value of the measurements shall not exceed 43 dBA at 25°C
inlet temperature. Redundant 450W 1+1 Power Supply
3.1.3
450-W, 1+1 Base Redudant Power Supply (BRP) (KHD3RP450)
The 450-W, 1+1 Redudant Power Supply (KHD3RP450) features SSI (Rev. 3.0)-compliant server
board connectors and is positioned as the redundant entry power supply solution for the Intel
SE7505VB2 Server Board. The 450-W redudant power supply supports two removable modules
inserted into a main housing (power supply cage). Each 450W module has an AC power cord
receptacle. The standard configuration ships with one 450-W 1+1 module and one baffle installed
for non-redundant operation. Two 450-W 1+1 modules must be installed for redundant operation.
The removable hot-swap DC power modules can be replaced in the event of a failure. The system
will remain in operation during a failed voltage condition and remain online during a single module
replacement for maximum up time. The AC power cord must be removed before removing a
module.
3.2
650W 2+1 Redundant Power Supply
The Intel® SHG2 and SE7501BR2 Server Board systems can also be configured with a 650-W,
2+1 redundant (KHD3HS650 or KHD3HS650R) power supply. The 650-W power supply features
three removable modules inserted into a main housing (or cage). The main housing contains dual
AC input circuits and power distribution boards. The standard configuration ships with two 350-W
TPS modules and one baffle installed for non-redundant operation. Three 350-W TPS modules
and both power cords must be installed for redundant operation. The removable hot-swap DC
power modules can be replaced in the event of a failure. The system will remain in operation
during a failed voltage condition and remain online during a single module replacement for
maximum up time. Refer to the 650-W 2+1 Redundant Power Supply Cage Specification for
details.
Table 3. System Power Summary for All Power Supplies
SC5200
SC5200
SC5200
450-Watt Entry Power
Supply Non Redundant
650-Watt 2+1 Redundant
Power Supply
450-Watt 1+1 Redundant
Power Supply
Intel Part Number
A85459-XXX
A52678-XXX
C20013-XXX
+3.3 VDC Output
24 Amp Max
38 Amp Max
20 Amp Max
+5 VDC Output
20 Amp Max
38 Amp Max
20 Amp Max
47.5 Amp Sustained
32 Amp Peak
+12 VDC Output
30 Amp Sustained
36 Amp / 12 second peak
current
57 Amp / 12 second peak
current
26 Amp Sustained.
-12 VDC Output
0.5 Amp Max
0.5 Amp Max
0.3 Amp Max
+5 VDC Standby
2.0 Amp Max
2.0 Amp Max
2.0 Amp Max
12
Revision 1.2
SC5200 5U Server Chassis TPS
Multiple +12V 240
VA Protection
Circuits
Chassis Power Subsystem
Yes (2)
Yes (3)
Yes (2)
Output balancing
Total combined output power
of +3.3v and +5v shall not
exceed 179 W.
Total combined output power
of +3.3v and +5v shall not
exceed 300 W.
Total combined output power
of +3.3v and +5v shall not
exceed 120W
DC Power
Connections
24-pin, 8-pin
24-pin, 8-pin, 5-pin SSI
24-pin, 8-pin, 5-pin SSI
AC Line Voltage
Auto-ranging for either 100127 VAC
or 200-240 VAC
Auto-ranging for either 100127 VAC
or 200-240 VAC
Auto-ranging for either 100127 VAC
or 200-240 VAC
AC Line Frequency
50/60 Hz
50/60 Hz
50/60 Hz
AC Input Current
(System AC Rating)
6.0 Amp at 115 VAC
8.0 Amp at 115 VAC
6.56 Amp at 100 VAC
2.5 Amp at 220 VAC
4.0 Amp at 220 VAC
3.28 Amp at 200 VAC
Redundant Power
No
Yes
Yes
Hot-swap Power
Modules
No
Three replaceable 350-W TPS
Modules
Two replaceable 450 W
(445W) moduels
Dual Line Cords
No
Yes
One AC Line Cord per 450 W
(445W) Power Module
Redundant Fans
No
Yes
No
Replaceable Fans
No
No
No
Intended Server
Boards
SHG2
SE7500CW2
SE7501BR2
SHG2
SE7501BR2
SE7505VB2
SE7500CW2
SE7501BR2
3.3 450W 1+1 Base Redundant Power (BRP) Supply Mechanical
Specifications
3.3.1
450W 1+1 Module Mechanical Drawing
Figure 11 Power Supply Enclosure240VA Drawing
Revision 1.2
13
Chassis Power Subsystem
SC5200 5U Server Chassis TPS
Note:
The latch shall protect the operator from any burn hazard through the use of the Intel Corporation
Industrial designed plastic handle. The plastic handle shall be molded in either of the following
materials:
Material
Color
Designation
GE 2800
Green
GN3058
BAYER FR2000 Green
SM G663A
3.3.2
Cage Mechanical Drawing
Figure 12 450W 1+1 Redudant Power Supply Cage Drawing
14
Revision 1.2
SC5200 5U Server Chassis TPS
Chassis Power Subsystem
Note: All dimensions are in mm.
3.3.3
450W 1+1 Airflow and Acoustic noise
One 80mm high speed DC fan with fan speed control circuit is used for cooling.
1) When the power supply is running at 70% load (315W), the power supply must not
exceed 47dB
2) When the power supply is running at max power (450W), the power supply should not
exceed 50dB
Revision 1.2
15
Chassis Power Subsystem
3.3.4
SC5200 5U Server Chassis TPS
AC Input Requirements
The power supply incorporates universal power input with active power factor correction, which
shall reduce line harmonics in accordance with the EN61000-3-2 and JEIDA MITI standards. See
Table 5 AC Input Rating.
3.3.5
AC Inlet Connector
The AC input connector is an IEC 320 C-14 power inlet. This inlet is rated for 15A / 250VAC.
3.3.6
AC Input Voltage Specification
The power supply operates within all specified limits over the following input voltage range, shown
in below table. The power supply shall power off if the AC input is less than 75-80Vac ranges.
The power supply operates properly starting at 80-85VAC input voltages.
Table 4 AC Input Rating
PARAMETER
MIN
RATED
MAX
Voltage
(110)
Voltage
(220)
Frequency
90 Vrms
100-127
Vrms
200-240
Vrms
50/60 Hz
140
Vrms
264
Vrms
63 Hz
180 Vrms
47 Hz
Max Input AC Current
7.3
Arms1,3
3.65 Arms2,3
1
2
Maximum input current at low input voltage range shall be measured at 90Vac, at max load.
Maximum input current at high input voltage range shall be measured at 180VAC, at max load.
3
4
This is not to be used for determining agency input current markings.
3.3.7
Max Rated Input AC Current
6.56Arms
4
3.28Arms 4
Maximum rated input current is measured at 100VAC and 200VAC.
Efficiency
The power supply shall have a minimum efficiency of 70% at maximum load and over the
specified AC voltage.
3.3.8
AC Line Dropout
An AC line dropout of one cycle or less (20ms min) shall not cause any tripping of control signals
or protection circuits (= 20ms holdup time requirement.
3.3.9
AC Line Fuse
The power supply has a single line fuse, on the Line (Hot) wire of the AC input. The line fusing
shall be acceptable for all safety agency requirements.
3.3.10
AC Inrush
AC line inrush current shall not exceed 25A peak for up to one-quarter of the AC cycle, after
which, the input current should be no more than the specified maximum input current.
3.4
3.4.1
450W 1+1 DC Output Specification
Output Connector
The power supply provides card edge fingers, which mate to female connector located on the back
plane. Card edge finger pin assignments are listed in Table 5 Edge Finger Pinout.
Table 5 Edge Finger Pinout
16
Revision 1.2
SC5200 5U Server Chassis TPS
Chassis Power Subsystem
Top
Bottom
1
2
3
+12V
+12V
+12V
1
2
3
+12V
+12V
+12V
4
5
6
7
8
9
10
11
12
+12V
+12V
GND
GND
GND
GND
GND
+5VSB
Present#
4
5
6
7
8
9
10
11
12
+12V
+12V
GND
GND
GND
GND
GND
+5VSB
PSKill
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
PSON#
+12VRS
+5VRS
+3.3VRS
ReturnS
+5V
+5V
+5V
+5V
GND
GND
GND
GND
GND
GND
+3.3V
+3.3V
+3.3V
+3.3V
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
PWOK
+12LS
+5LS
+3.3LS
-12V
+5V
+5V
+5V
+5V
GND
GND
GND
GND
GND
GND
+3.3V
+3.3V
+3.3V
+3.3V
Keying Slot
#
Signals that can be defined as low true or high true use the following convention: signal = low true
Reserved pins are reserved for future use.
3.4.2
Grounding
The ground pins of the power supply output connector provide the power return path. The output
connector ground pins are connected to safety ground (power supply enclosure).
3.4.3
Residual Voltage Immunity in Standby mode
The PS supply is immune to any residual voltage placed on its outputs (leakage voltage) up to
500mV.
3.4.4
Output Power / Currents
The following tables define two power and current ratings for this redundant 450W power supply.
These were selected to cover different types of systems and configurations. The combined output
power of all outputs shall not exceed the rated output power. Below are load ranges for a power
supply power level.
Revision 1.2
17
Chassis Power Subsystem
SC5200 5U Server Chassis TPS
Table 6 Load Ratings 450 Watt 1+1
+3.3V
+5V
+12V
Minimum
Continuous Load
1.0 A
1.0 A
1.0 A
-12V
+5VSB
0A
0A
Voltage
1.
2.
3.
Maximum
Continuous Load
20 A
20 A
26 A
Peak Load
Max Continuous
Power
120W
(note 2)
Max Peak
Power
120W
(note 2)
312W
384W
32 A peak
(see note 3)
3.6W
0.3 A
10W
2.0 A
Total continuous power =
445.6W
Total Peak power (note 3) =
3.6W
10W
517.6W
Maximum continuous total DC output power should not exceed 445.6 Watts.
Maximum combined 3.3V and 5V total output power is 120W.
Peak power and peak current loading shall be supported for a minimum of 15 seconds.
The power supply output voltages must stay within the following voltage limits when operating at
steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise
specified in table 11. All outputs are measured with reference to the return remote sense signal
(ReturnS). The 5V, 12V, –12V and 5VSB outputs are measured at the power supply connectors
referenced to ReturnS.
Table 7 Voltage Regulation 450-Watt 1+1 Limits
PARAMETER Tolerance
MIN
+3.20
+ 3.3V
3%/+4.5%
-4%/+4%
+4.80
+ 5V
+11.60
+ 12V
3.3%/+5%
±10%
-13.20
- 12V
-4%/+5%
+4.80
+ 5VSB
3.4.5
NOM
+3.30
MAX
+3.45
UNITS
Vrms
+5.00
+12.00
+5.20
+12.60
Vrms
Vrms
-12.00
+5.00
-10.80
+5.25
Vrms
Vrms
Ripple / Noise
The maximum allowed ripple/noise output of the power supply is defined in Table 11 Ripple and
Noise below. This is measured over a bandwidth of 0Hz to 20MHz at the power supply output
connectors. .
Table 11 Ripple and Noise 450-Watt 1+1
+3.3V
50mVp-p
3.4.6
+5V
60mVp-p
+12V
100mVp-p
-12V
250mVp-p
+5VSB
60mVp-p
Current Sharing
In the 1+1 parallel configuration, the +5V, +3.3V & +12V outputs shall actively current share within
10% of nominal at full load; linearly decrease to 20% of the nominal at half load. If the load sharing
18
Revision 1.2
SC5200 5U Server Chassis TPS
Chassis Power Subsystem
is disabled by shorting the load share bus to ground, the power system will continue to operate
within regulation limits for loads less than or equal to one power supply. The failure of a power
supply should not effect the load sharing or output voltages of the other supplies still operating.
3.4.7
Hot Swap
A power supply may be hot swapped only if the AC power cord is unplugged. During this process
the output voltages shall remain within the limits specified in Table 8. In general, a failed (off by
internal latch or external control) supply may be removed, then replaced with a good power supply,
3.4.8
Timing Requirements
Timing specifications for the power supply operation are listed in Figure 13 450-Watt 1+1 Output
Voltage Timing and in Figure 14 450-Watt 1+1 Turn On/Off Timing . The output voltages will rise
from 10% to within regulation limits (Tvout_rise) within 2 to 20ms and –12V – it is allowed to rise from
0.1 to 20 ms. The +3.3V, +5V and +12V output voltages should start to rise approximately at the
same time. All outputs rise monotonically. The +5V output will be greater than the +3.3V output
during any point of the voltage rise. Refer to Figure Figure 13 450-Watt 1+1 Output Voltage
Timing and Figure 1. ATX* 2.03 I/O Aperture for the timing specifications for the power supply
being turned on and off via the AC input, with PSON held low and the PSON signal, with the AC
input applied.
Figure 13 450-Watt 1+1 Output Voltage Timing
T7
Off
PS_ON
On
AC Vin
+5 V Standby
Off
95%
T1
T5
95%
OUTPUTS
10%
POK
T3
POK Sense Level = 95% of nom
T2
T4
T6
Figure 14 450-Watt 1+1 Turn On/Off Timing
Revision 1.2
19
Chassis Power Subsystem
SC5200 5U Server Chassis TPS
T7
Off
PS_ON
On
AC Vin
+5 V Standby
Off
95%
T1
95%
OUTPUTS
10%
POK
T3
POK Sense Level = 95% of nom
T4
T2
T8
Figure 15 450Watt 1+1 Output Voltage Rise Time
ITEM
Tvout_rise
DESCRIPTION
Output voltage rise time from each main
output. (T2)
MIN
2.0 *
MAX
20 *
UNITS
ms
MAX
UNITS
* The –12V output voltage rise time shall be from 0.1ms to 20.0ms
Table 8 450Watt 1+1 Turn On/Off Timing
DESCRIPTION
MIN
Time all output voltages stay within regulation after loss
of AC. (T6 + T4)
Delay from loss of AC to de-assertion of PWOK (T6)
21
ms
20
ms
ITEM
Tvout_holdup
Tpwok_holdup
Tpson_on_delay
T pson_pwok
Tpwok_on
T pwok_off
20
#
Delay from PSON active to output voltages within
regulation limits. (T2+T7)
Delay from PSON# reactive to PWOK being deasserted. (T8)
Delay from output voltages within regulation limits to
PWOK asserted at turn on. (T3)
Delay from PWOK de-asserted to output voltages (3.3V,
5V, 12V, -12V) dropping out of regulation limits. (T4)
5
100
1
120
ms
2
ms
500
ms
ms
Revision 1.2
SC5200 5U Server Chassis TPS
Delay from 5VSB being in regulation and out regulation
to O/Ps being in regulation at AC turn on (T1) and off
(T5).
Tsb_vout
3.5
Chassis Power Subsystem
5
ms
450W 1+1 Protection Circuits
Protection circuits inside the power supply cause only the power supply’s main outputs to
shutdown. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF for
#
15sec and a PSON cycle HIGH for 1sec will reset the power supply.
3.5.1
Current Limit (OCP)
Current limits to prevent the +3.3V, +5V, and +12V outputs from exceeding the values are
provided in Table 9 if the current limits are exceeded the power supply shuts down and latches
#
off. The latch is cleared by toggling the PSON signal or by an AC power interruption. The -12V
and 5VSB are also protected during over current or shorted conditions
Table 9 450Watt 1+1 Over Current Protection (OCP)
VOLTAGE
+3.3V
+5V
+12V
5VSB
3.5.2
OVER CURRENT LIMIT (IOUT
LIMIT)
110% minimum (22A); 150% maximum (30A)
110% minimum (22A); 150% maximum (30A)
130% minimum (34A); 150% maximum (39A)
200% minimum (4A); 350% maximum (7A)
Over Voltage Protection (OVP)
The power supply shuts down and latches off after an over voltage condition occurs. This latch is
#
cleared by toggling the PSON signal or by an AC power interruption. Table 10 contains the over
voltage limits. The values are measured at the output of the power supply’s connectors.
Table 10 450Watt 1+1 Over Voltage Protection (OVP) Limits
Output Voltage
+3.3V
+5V
+12V
+5VSB (no latch off)
3.5.3
MIN (V)
3.7
5.7
13.3
5.7
MAX (V)
4.5
6.5
15
6.5
Over Temperature Protection (OTP)
In an OTP condition the PSU will shutdown. When the power supply temperature drops to within
specified limits (which are??) the power supply shall restore power automatically, while the 5VSB
remains always on.
3.6
450W 1+1 Control and Indicator Functions
Revision 1.2
21
Chassis Power Subsystem
SC5200 5U Server Chassis TPS
The PSON# signal is required to remotely turn on/off the power supply. PSON# is an active low
signal that turns on the +3.3V, +5V, +12V, and -12V power rails. When this signal is not pulled low
by the system, or left open, the outputs (except the +5VSB) turn off. This signal is pulled to a
standby voltage by a pull-up resistor internal to the power supply. See below table:
Table 11 PSON* Signal Functions
Signal Type
#
PSON = Low
#
PSON = High or Open
Logic level low (power supply ON)
Logic level high (power supply OFF)
Source current, Vpson = low
Power up delay: Tpson_on_delay
PWOK delay: T pson_pwok
Accepts an open collector/drain input from the
system. Pull-up to VSB located in power supply.
ON
OFF
MAX
MIN
0V
1.2V
2.0V
5.25V
1mA
5msec
120msec
2msec
Figure 16 PSON# Required Signal Characteristics
Disabled
0.3V ≤ Hysteresis
in 1.0-2.0V input voltage range is required
≤ 1.0 V
PS is
enabled
≥ 2.0 V
PS is
disabled
Enabled
0V
3.6.1
1.0V
2.0V
5.25V
PWOK (Power OK) Output Signal
PWOK is a power OK signal and will be pulled HIGH by the power supply to indicate that all the
outputs are within the regulation limits of the power supply. When any output voltage falls below
regulation limits or when AC power has been removed for a time sufficiently long so that power
supply operation is no longer guaranteed, PWOK will be de-asserted to a LOW state. See the
table below.
Table 17 PWOK Signal Characteristics
22
Revision 1.2
SC5200 5U Server Chassis TPS
Chassis Power Subsystem
Signal Type
PWOK = High
PWOK = Low
Logic level low voltage, Isink=4mA
Logic level high voltage, Isource=200µ
µA
Sink current, PWOK = low
PWOK delay: Tpwok_on
PWOK rise and fall time
Power down delay: T pwok_off
3.6.2
Open collector/drain output from power supply.
Pull-up to VSB located in system.
Power OK
Power Not OK
MAX
MIN
0V
0.4V
2.4V
5.25V
4mA
100ms
500ms
100µsec
1ms
PSKILL Signal Requirements
PKill pin allows for hot swapping of the power supply. The PS-Kill pin on the power supply is
shorter than the other signal pins. When a power supply is removed from the system, the PSKill
pin turns off the power supply to prevent arching of the DC output contacts.
Table 18: PSKILL Signal Characteristics
Signal Type (Input Signal to Supply)
#
PSKILL = Low, PSON = Low
#
PSKILL = Open, PSON = Low or Open
#
PSKILL = Low, PSON = Open
Logic level low (power supply ON)
Logic level high (power supply OFF)
Source current, Vpskill = low
Delay from PSKILL=High to power
1
supply turned off (TPSKill)
Accepts a ground input from the system. Pull-up
to VSB located in the power supply.
ON
OFF
OFF
MIN
MAX
0V
1.0V
2.0V
5.25V
4mA
100µsec
Tpskill is the time from the PSKill signal deasserting HIGH to the power supply’s output
inductor discharging.
3.6.3
PRESENT# Signal Requirements
The PRESENT# signal is used to sense the number of power supplies installed (operational or
not). This signal connects to the power supply's internal output ground through a 4.7 Ohm or less
resistor.
Table19:
Revision 1.2
#
PRESENT Signal Characteristics
23
Chassis Power Subsystem
SC5200 5U Server Chassis TPS
Signal Type
#
PRESENT = Low
#
PRESENT = High
Logic level low voltage, Isink=4mA
Maximum pull-up voltage
#
Sink current, PRESENT = low
#
Sink current, PRESENT = high
3.6.4
Output from power supply that is connected to
ground. Pull-up to VSB located in system.
Present
Not Present
MIN
MAX
0V
0.4V
5.25V
4mA
50µA
LED DISPLAY Indicators
Two LEDs indicate the power supply status. LED #1 is green and LED #2 is amber.
Table 12 450Watt 1+1 LED Indicators
POWER SUPPLY CONDITION
No AC power to all PSU
No AC power to this PSU only or
Power supply failure or
Current limit
AC present / only standby Output(s)
On
Power supply DC outputs ON and
OK
3.7
LED#1 (Power)
GREEN
OFF
LED#2 (Fail)
AMBER
OFF
OFF
ON
BLINK GREEN
OFF
GREEN
OFF
450W 1+1 Environmental Requirements
3.7.1
Temperature
Operating Ambient, normal mode (inlet air): +10°C min / +45°C max at 10,000 feet above sea
level.
(At full load, with a maximum rate of change of 5°C/10 minutes, but no more than 10°C/hr)
Operating Ambient, stand-by mode (inlet air): +10°C min / +45°C max at 10,000 feet above sea
level.
Non-operating Ambient: -40°C to +70°C
(Maximum rate of change of 20°C/hour)
3.7.2
Humidity
Operating:
0 to 80% relative humidity (non-condensing)
Non-Operating:
0 to 95% relative humidity (non-condensing)
NOTE: 95% relative humidity is achieved with a dry bulb temp. of 55°C and a wet bulb temp. of
54°C.
3.7.3
Operating:
24
Altitude
to 10,000 ft
Revision 1.2
SC5200 5U Server Chassis TPS
Non-operating:
3.8
to 35,000 ft
450W 1+1 MTBF
3.8.1
Mean Time Between Failures (MTBF)
The 450W 1+1 power supply shall have a minimum MTBF at continuous operation of 100,000
hours at 100% load and 45°C, as calculated by Bellcore RPP, or
3.8.2
Warranty Period
Three (3) years.
3.9
450W 1+1 Power Distribution (Back Plane) Overview
The power distribution board is designed to work with two 450W power supplies in 1+1
configuration. Each 450W power supply, supplies five output voltages and several I/O signals
which are described below. The mate connectors on the power distribution board are the right
angle 2x31 pin connectors. The power outputs from these connectors will be combined to allow
redundancy (12V, 5V, 3.3V, -12V, 5VSB).
The 240VA protection240VA circuit will be provided for 5V and +12V outputs on the power
distribution board. As an additional protection, a mechanical shield covering the entire power
distribtion board PCB’s topside will be provided in order to keep the user from accidental contact.
Each power rail and I/O signals will be routed to the system thru a wire harness, as described
below.
The I/O signals coming thru each power supply connector to the power distribution board are:
PSON#, PWOK, Present#, PSKill. The I/O signals coming thru the backplane output wire harness
to the system are:
PSON# (global), PWOK (global), PSAlert# and SMBus (I2C), as described below.
3.9.1
450W 1+1 Card Cage Mechanial Specification
The physical size of the Power Distribution Board (Back Plane) with its enclosure 240VAis shown
below:
Figure 17 450W 1+1 Power Distribution e Boad & Enclosure
Revision 1.2
25
SC5200 5U Server Chassis TPS
Notes: All dimensions are in mm.
Figure 18 Power Distribution board hole layout and dimensions
26
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SC5200 5U Server Chassis TPS
Whoops!
Revision 1.2
27
SC5200 5U Server Chassis TPS
Figure 19 Input connector hole layout detail
28
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SC5200 5U Server Chassis TPS
3.10 450W 1+1 Electrical Specification
3.10.1
Power Distribution Board (Backplane) block schematic
Figure 20 Power Distribution Block Schematic
Revision 1.2
29
Pwr Sply 1+1
SC5200 5U Server Chassis TPS
Backplane
5VSB_1
5VSB
System
5VSB_2
3.3Vdc_1
3.3Vdc
3.3Vdc_2
3.3VRS_1
3.3V
load
3.3RS
3.3VRS_2
3.3VLS_1
3.3VLS_2
-12Vdc_1
-12Vdc
-12Vdc_2
5VRS_1
5VRS_2
5Vdc_1
Rs
5Vdc_ 2
5VLS_1
5Vdc
5V
load
5V/240VA protection ckt.
5VLS_2
+12RS_1
+12RS_2
+12Vdc_1
Rs
+12V_1
+12Vdc_2
Rs
+12V_2
+12VLS_1
12V/240VA protection ckt.
+12VLS_2
+12V_1
load
+12V_2
load
PSON#_1
L
L
PSON#_2
L
OR
PSON# (input)
L
PSON# Ckt.
5VSB
PSAlert# Ckt.
PRESENT#_1
OR
PRESENT#_2
PW OK_1
AND
PSAlert#
OR
PW OK_2
SCL
PIC16C72A
Ckt.
PSKill_1
I2C
SMBus
SDL
(Addr: 38h)
PSKill_2
PW OK_1
PW OK_2
PW OK (out)
OR
ReturnS_1
ReturnS_2
GND_1
GND
GND_2
3.10.2
Input Connectors
Each power supply output connector provides card edge fingers, which mate with the Power
Distribtuion Board female input connector. This is a blind mating type connector that connects the
30
Revision 1.2
SC5200 5U Server Chassis TPS
power supply’s output voltages and signals. This female type connector on the backplane is the
right angle 2x31 pin type Singatron p/n: 2806-62-R-30T-P or equivalent. The connector pinout is
shown below.
Table 13 Input Connector Pinout
Top Row Pin
Description
+12V
+12V
+12V
+12V
+12V
GND
GND
GND
GND
GND
+5VSB
Present#
PIN
#
1
2
3
4
5
6
7
8
9
10
11
12
Bottom Row Pin
Description
+12V
+12V
+12V
+12V
+12V
GND
GND
GND
GND
GND
+5VSB
PSKill
Keying Notch
PSON#
+12VRS
+5VRS
+3.3VRS
ReturnS
+5V
+5V
+5V
+5V
GND
GND
GND
GND
GND
GND
+3.3V
+3.3V
+3.3V
+3.3V
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
PWOK
+12LS
+5LS
+3.3LS
-12V
+5V
+5V
+5V
+5V
GND
GND
GND
GND
GND
GND
+3.3V
+3.3V
+3.3V
+3.3V
#
Signals that can be defined as low true or high true use the following convention: signal = low true
Reserved pins are reserved for future use.
Revision 1.2
31
SC5200 5U Server Chassis TPS
3.10.3
240VA Current Limit
The power supply has 240VA current limit channels for +12V1 and 12V2 outputs and one 240VA
current limit channel for +5V output to prevent the +5V, +12V1 and 12V2 outputs from exceeding
the values shown in Table 2. If the current limits are exceeded the power supplies shall shutdown
#
and latch off. The latch will be cleared by toggling the PSON signal or by an AC power
interruption.
Table 14 240VA Over-Current Protection Limits
Continuous Load
Peak load
Current Limit
Current Limit
Peak Limit Delay (see note)*
MIN
MAX
12V1
18A
20A
22A Min
500ms-1000ms
12V2
0
18A
20A
5V
0
22A
30A
Note: The delay means that the 12V1 OCP circuit will allow the peak load of 20-22A for 500ms
min (and 1000ms max) before it will shutdown the PS.
240VA
Channel
3.11 450W 1+1 Control and Indicator Functions
The following sections define the input and output signals from the power supply.
Signals that can be defined as low true use the following convention:
3.11.1
#
signal = low true
PWOK
The Backplane board shall provide the logical OR-ing of the two PWOK signals coming from each
power supply to provide a single PWOK signal to the system. PWOK output is 5V TTL compatible.
Figure 21 PWOK Circuit Function
PSU#1
PWOK_1
PWOK
PSU#2
3.11.2
PWOK_2
SMBus (I2C)
There shall be a device on the Backplane board to monitor the PWOK and PRESENT# signals
from each of the two power supplies. This device shall be a Microchip PIC16C72A micro controller
or equivalent and have an address of 38h.
Figure 22 SMBus Circuit Function
32
Revision 1.2
SC5200 5U Server Chassis TPS
5VSB
5VSB
20
Vdd Vss
Present#1
PSU#1
I/O
PWOK_1
I/O
Present#2
PSU#2
8
I/O
PWOK_2
SCL
SMBus
SDA
I/O
PIC16C72A
3.11.3
I2C Bus Addressing Scheme and Supply voltage:
The I2C Bus is powered from to 5VSB.
Table 15 I2C Bus Address
3.11.4
Hex Address R / W
Target device
38h / 39h
PIC16C72A
I2C Bus Command format
Read From Input Port:
Table 16 I2C Bus Command Format
1
S
2
Slave
Address
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
3.11.5
3
4
5
6
R
A
Data Byte 1
A
…
7
8
9
10
A
Data Byte N
/A
P
Start Bit
Slave Address (38h)
Read Bit
ACK
Data Byte 1
ACK
ACK
Data Byte N
NONACK
Stop Bit
Input Port Register
This register is a read only. It reflects the incoming logic levels of the pins. Write to this register
has no effect.
BIT
7
6
Revision 1.2
Name
Reserved
Reserved
R/W
Read
Read
Description
No use. Return 0
No use. Return 0
33
SC5200 5U Server Chassis TPS
5
4
3
2
1
0
3.11.6
Reserved
Reserved
PWOK_2
PRESENT#
2
PWOK_1
PRESENT#
1
Read
Read
Read
Read
No use. Return 0
No use. Return 0
PWOK for module 2 (1=power is good, 0= otherwise)
PRESENT for module 2 (0=Present, 1= Not Present)
Read
Read
PWOK for module 1 (1=power is good, 0= otherwise)
PRESENT for module 1 (0=Present, 1= Not Present)
PSKill
The power backplane provides ground to the PSKill signal to each power supply.
3.11.7
PSAlert#
The power distribution board provides a PSAlert# signal based on PWOK and Present# signal
from each power supply. This is used for boards that do not have SMBus monitoring capability to
provide power supply failure status.
Table 3: Alert# Signal Characteristics
Signal Type (Active Low)
Open collector/drain output from power supply. Pullup to VSB located in system.
OK
Power Alert to system
MIN
MAX
0V
0.4 V
5.25 V
4 mA
50 µA
100 µs
Alert# = High
Alert# = Low
Logic level low voltage, Isink=4 mA
Logic level high voltage, Isink=50 µA
Sink current, Alert# = low
Sink current, Alert# = high
Alert# rise and fall time
The power distribution board shall provide a PSAlert# signal based on PWOK and Present#
signals from each power supply. This is used for boards that do not have SMBus monitoring
capability to provide power supply failure status. Below is a logic table and the needed logic to
implement the PSAlert# signal.
Figure 23 PSAlert# Signal Circuit Function
5VSB
Present#1
PSU#1
PWOK_1
PSAlert#
Present#2
PSU#2
PWOK_2
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Revision 1.2
SC5200 5U Server Chassis TPS
Table 17 PSAlert# Circuit Logic Table
PWOK1
Present#1
PWOK2
Present#2
PSALE
RT#
H
L
H
L
H
L
L
H
L
L
L
H
H
H
H
H
L
L
H
H
L
L
L
L
L
L
H
H
L
L
H
H
L
L
H
L
H
H
L
L
H
H
L
L
H
H
L
L
L
L
L
L
L
H
H
H
H
L
L
L
H
H
H
H
H
H
H
H
L
L
X
H
X
L
X
X
X
X
X
X
Comments
Both supplies good and ON
Both supplies present, PS1 failed or
off
Only PS2 present, PS2 good and on
Not a possible state
Both supplies present, PS2 failed or
off
Both present but failed or off
Only PS2 present but failed or off
Not a possible state
Only PS1 present, PS1 good and on
Only PS1 present, PS1 failed or off
Not a possible state
Not a possible state
Not a possible state
Not a possible state
Not a possible state
Not a possible state
Note: Some states are not possible since the PWOK from a power supply cannot be asserted if the power supply is not present.
3.12 450W 1+1 Output Cable Harness
The power distribution board connects to the system via a wire harness. The harness size, connectors, and
pinouts are shown below. Listed or recognized component appliance wiring material (AVLV2), CN, rated min
105°C, 300Vdc shall be used for all output wiring.
Table 18 Cable Lengths
From
Length
mm (in)
To
connector #
No of
pins
Description
Backplane cover exit hole
Backplane cover exit hole
450 (17.7)
450 (17.7)
P1
P2
24
8
Baseboard Power Connector
Processor Power Connector
Backplane cover exit hole
450 (17.7)
P3
4
Signal Connector
Backplane cover exit hole
Extension
Backplane cover exit hole
Extension
Backplane cover exit hole
Extension
230 (9.0)
100 (4.0)
330 (13.0)
180 (7.1)
330 (13.0)
75 (3.0)
P4
P5
P6
P7
P8
P9
4
4
4
4
4
4
Peripheral Power Connector
Peripheral Power Connector
Peripheral Power Connector
Floppy Power Connector
Peripheral Power Connector
Peripheral Power Connector
Backplane cover exit hole
430 (16.9)
P10
4
Peripheral Power Connector
Revision 1.2
35
SC5200 5U Server Chassis TPS
75 (3.0)
Extension
P11
4
Peripheral Power Connector
Figure 24 Output Harnes Mechanical Details
1
1
4
P11
4
P7
P10
75.0
(3.0")
P9
12
24
P1
1
4
1
8
5
13
1
1X 180.0
(7.1")
4
5
P3
P6
P5
P2
P8
2X 25.4
(1.0")
1x 100.0
(4.0")
P4
75.0
(3.0")
430.0
(16.9")
330.0
(13.0")
10x 4
3x 450.0
(17.7")
230.0
(9.0")
NOTES:
1. ALL DIMENSIONS ARE IN mm
2. ALL TOLERANCES ARE +15 /-0 mm
3. MARK REFERENCE DESIGNATOR ON EACH CONNECTOR
Harness
exit hole.
4. TIE WRAP EACH HARNESS AT APPROX. MID POINT OR
POINT SHOWN.
Backplane Case.
3.12.1
P1 Baseboard power connector
Connector housing: 24- Pin Molex Mini-Fit Jr. 39-01-2240 or equivalent
Contact: Molex 44476-1111 or equivalent
Table 19 P1 Main Power Connector
PIN
1
36
SIGNAL
+3.3 VDC
18 AWG COLOR
Orange
PIN
13
SIGNAL
+3.3 VDC
18 AWG COLOR
Orange
Revision 1.2
SC5200 5U Server Chassis TPS
2
3
+3.3 VDC
COM (GND)
Orange
Black
14
15
-12 VDC
COM
Blue
Black
4
5 VDC*
5 VRS
Red
Red
16
PS_ON#
Green
5
6
COM
+5 VDC
Black
Red
17
18
COM
COM
Black
Black
7
COM
Black
19
COM
Black
8
PWR OK
Gray
20
Reserved (-5V in ATX)
N.C.
9
5VSB
Purple
21
+5 VDC
Red
22
23
24
+5 VDC
+5 VDC
COM
Red
Red
Black
10
+12 V2
Yellow/Blue Stripe
11
+12 V2
Yellow/Blue Stripe
12
+3.3 VDC
Orange
* 5V Remote Sense Double Crimped into pin 4
3.12.2
P2 Processor Power Connector
Connector housing: 8- Pin Molex 39-01-2080 or equivalent
Contact: Molex 44476-1111 or equivalent
Table 20 P2 Processor Power Connector
3.12.3
PIN
SIGNAL
18 AWG COLOR
PIN
SIGNAL
18 AWG COLOR
1
COM
Black
5
+12 V1
Yellow/Black Stripe
2
COM
Black
6
+12 V1
Yellow/Black Stripe
3
COM
Black
7
+12 V1
Yellow/Black Stripe
4
COM
Black
8
+12 V1
Yellow/Black Stripe
P3 Signal Connector
Connector housing: 5-pin Molex 50-57-9405 or equivalent
Contacts: Molex 16-02-0088 or equivalent
Table 21 P3 Server Signal Connector
3.12.4
Pin
Signal
24 AWG Color
1
2
3
4
5
SMBus Clock
SMBus Data
PSAlert#
Reserved (for ReturnS)
3.3RS
White/Green Stripe
White/Yellow Stripe
Red/White Stripe
Black/White Stripe
Orange/White Stripe
P4-6, P8-11 Peripheral Power Connectors
Connector housing: Amp 1-480424-0 or equivalent
Contact: Amp 61314-1 or equivalent
Revision 1.2
37
SC5200 5U Server Chassis TPS
Table 22 P4-6, P8-11 Peripheral Power Connector
Pin
1
2
3
4
3.12.5
Signal
+12 V2
COM
COM
+5 VDC
18 AWG Color
Yellow/Blue Stripe
Black
Black
Red
P7 Floppy Power Connector
Connector housing: Amp 171822-4 or equivalent
Contact: Amp 170204-1 or equivalent
Table 23: P7 Floppy Power Connector
Pin
1
2
3
4
Signal
+5 VDC
COM
COM
+12 V2
22 AWG Color
Red
Black
Black
Yellow/Blue Stripe
3.13 450W 1+1 Environmental Requirements
3.13.1
Temperature
Operating Ambient: +10°C min / +45°C max at 10,000 feet above sea level.
(At full load, with a maximum rate of change of 5°C/10 minutes, but no more than 10°C/hr)
Non-operating Ambient: -40°C to +70°C
(Maximum rate of change of 20°C/hour)
3.13.2
Humidity
Operating:
0 to 80% relative humidity (non-condensing)
Non-Operating:
0 to 95% relative humidity (non-condensing)
NOTE: 95% relative humidity is achieved with a dry bulb temp. of 55°C and a wet bulb temp. of
54°C.
3.13.3
Altitude
Operating:
to 10,000 ft
Non Operating: to 50,000 ft
3.13.4
Mechanical Shock
The device will withstand the following imposed conditions without electrical or mechanical failure:
Non-operating Square Wave Shock: 40G, Square wave at 200in/sec (508cm/sec); on all six sides
Non-operating Half Sine Shock: Half Sine pulse for 70in/sec (178cm/sec) for 2ms; on all sides
except top
Operating Half Sine Shock: Half Sine pulse for 40in/sec (102cm/sec) for 2ms; on all sides except
top.
3.13.5
Random Vibration
Operating: Sinusoidal vibration, 0.5G (0-peak) acceleration. 3-200Hz, sweep at 1/2 octave/min
from low to high frequency, and then from high to low. Thirty minute dwell at all resonant points,
where resonance is defined as those exciting frequencies at which the device under test
experiences excursions two times larger than non-resonant excursions. Plane of vibration to be
along three mutually perpendicular axis.
38
Revision 1.2
SC5200 5U Server Chassis TPS
Non-operating: Sinusoidal vibration, 1.0G (0-peak) acceleration. 3-200Hz, sweep at 1/2
octave/min from low to high frequency, and then from high to low. Thirty minute dwell at all
resonant points, where resonance is defined as those exciting frequencies at which the device
under test experiences excursions two times larger than non-resonant excursions.
3.13.6
Thermal Shock (Shipping)
Non-operating:
-40°C to +70°C, 50 cycles, 30°C/min. ≥
transition time ≥ 15°C/min., duration of exposure to temperature extremes for each half cycle shall
be 30 minutes.
3.13.7
Ecological Requirements
Cadmium shall not be used in painting or plating. No brominated plastics shall be used.
No Quaternary salt electrolytic capacitors shall be used. Example of prohibited caps are: United
Chemi-Con type: LXF, LXY, LXZ.
Reliability /
3.14 650-W 2+1 Redundant Power Supply
3.14.1
650-W Power Supply Mechanical Outline
The approximate 650-W 2+1 supply dimensions are 96-mm high by 184-mm wide by 343-mm
deep.
Revision 1.2
39
SC5200 5U Server Chassis TPS
Unit of measure
is millimeters
Figure 25. 650-W 2+1 Redundant Power Supply
3.14.2
Marking and Identification
Figure 26 shows AC inlet, power supply module, and LED designations on 650-W power
subsystem.
AC1
LED AC1
LED AC2
LED ACR
AC2
Module #3
#2
#1
Figure 26. Power Supply Module, AC Inlet & LED Designations
3.14.3
40
Dual AC Inputs
Revision 1.2
SC5200 5U Server Chassis TPS
The 650-W power subsystem has two AC inlets, AC1 and AC2. AC1 is connected to the inputs of
TPS module #1 (PS1). AC2 shall be connected to the inputs of Module #2 (PS2). Module #3
(PS3) is connected to AC2 through normally closed transfer switch contacts. There could be a
configuration where both AC inlets will be connected to the same AC source (single AC source
operation).
Figure 27 illustrates how the redundant power is implemented using a transfer switch controller.
The transfer switch monitors the relay operation functionality during initial AC turn on and the
presence of all 3 modules.
If AC1 input fails (goes out of specified voltage range), PS2 and PS3 power modules will continue
to operate taking power from the line that remains operational, AC2.
If AC2 input fails, the transfer switch will connect PS3 to AC1 so that PS1 and PS3 power modules
will take power from AC1. Once AC2 recovers, PS3 will be switched into its original state.
AC Input #1
Module #1
AC1 LED
AC2 LED
Transfer Switch
Controller
Module #3
ACR LED
AC Input #2
Module #2
Enable/Disable
Relay Self Test
AC1
AC2
TSOK ACR
PWOK #1 ~ #3
Power Good Signal
Cage Controller
PSON, PRESENT, AC-WARNING, FAIL
I2C BUS to system
Figure 27. 650-W Power Supply Cage LED Block Diagram
3.14.4
650-W Power Supply LED Functions
Three green LEDs are positioned to the left of module #3 as shown in Figure 27.
•
LED AC1 indicates the availability of AC1 input voltage.
Revision 1.2
41
SC5200 5U Server Chassis TPS
•
LED AC2 indicates the availability of AC2 input voltage.
•
LED ACR indicates the AC redundancy status of the power subsystem depending on the
following four conditions. The LED ACR is ON GREEN if all four conditions are true.
Otherwise, the ACR LED is OFF.
1.
2.
3.
4.
3.14.5
LED AC1 is green
LED AC2 is green
The power good signal from each of the three power modules is asserted
TS-OK (transfer switch – OK) signal asserted
350-W TPS Module
The 350-W TPS module is redundant and hot-swappable. The module accepts AC input from an
external EMI filter. The power supply docks into a power supply 240VAor cage, which contains the
AC EMI filter and power distribution to the system. The supply is intended to operate with up to
three modules in parallel. Refer to the 350-W TPS Power Supply Module Specification for details.
Figure 28. Replaceable 350-W Thin Power Supply Module
There is a single bi-color LED to indicate power supply status of each module. When AC is
applied to the power supply module and standby voltages are available, the will blink GREEN. The
LED turns on GREEN to indicate that all the power outputs are available. The LED turns on
AMBER to indicate that the power supply has failed, shutdown due to over current, shutdown due
to over temperature, or is indicating a predictive failure. Listed below are the LED indicators for
conditions of the 350-W TPS module LEDs.
Table 24. 350-W TPS Module LED Indicator
Power Supply Condition
42
Power Supply LED
No AC1 or AC2 power input
OFF
No AC power to this PS module only
AMBER
AC present / Only Standby Outputs On
BLINK GREEN
Power supply DC outputs ON and OK
GREEN
Power supply failure (includes over voltage, over temperature)
AMBER
Current limit
AMBER
Revision 1.2
SC5200 5U Server Chassis TPS
Note: The SC5200 HSRP Chassis ships in a non-redundant, 2+0 configuration with modules #2
and #3 installed. The single power cord should be inserted in AC2 inlet to ensure that the power
supply is providing 650 watts of power. If the power cord is connected to AC1, module #2 should
be moved to the #1 position (see Figure 26). Other combinations are invalid and will degrade the
power supply to 350 watts as shown in Table 25. Adding a second power cord will allow for any
combination of two modules, but does not provide redundant operation unless the third power
supply module is also added.
Table 25. Non-Redundant Power Supply Configurations
AC1
AC2
Module 1
ON
GREEN
ON
GREEN
ON
ON
3.14.6
ON
AMBER
ON
AMBER
Module 2
Module 3
Output wattage
GREEN
650 W
AMBER
350 W
AMBER
GREEN
350 W
GREEN
GREEN
650 W
GREEN
350 W
GREEN
350 W
650-W Power Supply Fan Requirements
The 650-W 2+1 RPS power supply incorporates two high performance 60-mm fans to exhaust air.
If a module failure is detected, the fans will enter a faster boost mode to provide additional cooling
until the failing module is replaced. Under a condition where one module has failed, it is
acceptable for the sound pressure level to approach 72 dBA (maximum).
The fans are redundant when 3 modules and 2 power cords are present. In this case, if a fan fails,
the remaining fan will enter boost mode and maintain proper cooling. If the second fan fails,
module fails, or a power cord is removed, the power supply will shut off.
3.14.7
AC Power Line
The system is specified to operate from 100-127VAC, 200-240VAC, at 50 or 60 Hz. The specified
PFC power supplies are auto-ranging. The system is tested to meet these line voltages, and has
been tested (but not specified) at ±10% of the voltage ranges, and similarly ±3 Hz on the line input
frequency.
The system is specified to operate without error at full power supply output load, nominal input
voltage, with line source interruptions not to exceed one period of the AC input power frequency
(i.e., 20 milliseconds at 50 Hz).
The system is not damaged by AC surge ring wave up to 2.0kV/500A. This ring wave is a 100
kHz-damped oscillatory wave with a specified rise time for the linear portion of the initial half-cycle
of 0.5µsec. Additionally, the system will not be damaged by a unidirectional surge waveform of up
to 2.0kV /3000A, with a 1.2µsec rise time and 50µsec duration. Further details on these waveforms
can be obtained in ANSI/IEEE STD C62.45-1992.
Revision 1.2
43
System Cooling
SC5200 5U Server Chassis TPS
4.
System Cooling
4.1
Fan Configuration
®
Two cooling solutions are employed in the Intel SC5200 Server Chassis. The base solution
®
consists of four fixed fans working in conjunction with the active heatsinks provided in the Intel
boxed processor kits to provide sufficient system cooling. The second redundant solution is
designed for maximum up-time by providing five replaceable hot-swap fans that maintain proper
system cooling, even with a single failed fan.
4.2
Base Cooling Solution
Two 80 x 32-mm, two 80 x 25-mm system fans, and the power supply fan(s) will provide cooling
for the processors, hard drives, and add-in cards. When the hot-swap drive bays are installed, one
of the 80 x 32 mm system fans draws air through the rear of each bay to provide drive cooling.
The 80 x 25 mm fans at the rear of the chassis assist in evacuating hot air from the system and
draws air in at the upper, vented 5.25” peripheral bays. All system fans provide a signal for RPM
detection that the server board can make available for server management functions. Removal of
the side cover gives entry to the fans, which then can be easily changed with the system shut
down.
Figure 29. Close Up View of Front Fan Mounting Features
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SC5200 5U Server Chassis TPS
System Cooling
To ensure proper cooling, only processors with active heatsinks should be used unless otherwise
indicated in the server board manuals. Active heatsinks incorporate a fan to provide cooling. Such
®
a thermal solution is included with Intel boxed processors.
Figure 30. Processor Wind Tunnel Illustration
Air should flow through the system from front to back. The active processor cooling solution
validated with this chassis is called a Processor Wind Tunnel (PWT), and is provided with the
®
Intel Boxed Xeon Processors. Proper installation places the fan portion of the PWT over the
front edge of the chassis. The fans blow toward the rear of the chassis (toward I/O connectors).
See illustration below. Note the direction of the fan airflow.
Air Flow
CDROM drive
450W power supply
Processors
with PWT
Fan
80x25mm Fan
Other 5.25" Drive
80x25mm Fan
Fan
Floppy Drive
Memory
5 Hotswap Hard Drives
IDE drives
PCI cards
80x32mm fans x2
Epak fan shroud
Figure 31. Base Chassis Airflow Characteristics
Revision 1.2
45
System Cooling
4.3
SC5200 5U Server Chassis TPS
Redundant Cooling Solution
Three hot-swap 80 x 38 mm, two hot-swap 92 x 25 mm system fans, and the two 60 mm power
supply fans provide cooling for the processors, hard drives, and add-in cards. The three 80 mm
fans ensure proper cooling of the core area (processors and memory) and hot-swap drive bay.
The two 92 mm fans, with help from the two rear mounted 80 mm fans, provide cooling for the PCI
card area. When the optional second hot-swap drive bay is installed, the 92 mm fans provide
drive cooling. Should any single fan fail, the remaining fans will increase in speed and maintain
cooling until the failed unit is replaced. All system fans provide a signal for RPM detection that the
server board can make available for server management functions. The two rear mounted fans
are directly accessible from the back of the chassis, while the three interior system fans are
accessed by opening a door on the side of the chassis. The fans can be replaced without shutting
off the server, and no tools are required.
Figure 32. Close Up View of Redundant Hot-Swap Fan Assemblies
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System Cooling
Figure 33. Processor and PCI Area Ducting
To ensure proper cooling, only processors with passive heatsinks should be used unless otherwise
indicated in the server board manuals. The ducting shown in Figure 33 is designed to work with
®
TM
the passive heatsink included with the Intel Boxed Xeon processors.
Air flows through the system from front to back. The heatsink solution used for the HSRP version
of the SC5200 chassis is provided with the Intel® Boxed XeonTM processors. Only the retention
mechanism, heatsink, clips, and thermal interface (grease) are used. The plastic PWT and fans
should not be installed. Note the direction of the fan airflow.
Air Flow
CDROM drive
650W power supply
Processors with
Passive Heatsinks
Other 5.25" Drive
80x38mm
Hot-Swap Fan
80x38mm
Hot-Swap FanS
Floppy Drive
Memory
5 Hotswap Hard Drives
IDE drives
PCI cards
92x25mm Hot-Swap fans x2
Plastic Fan Holder
Figure 34. Redundant Chassis Airflow Characteristics
Revision 1.2
47
System Cooling
4.4
SC5200 5U Server Chassis TPS
Fan Control
The fans in the Intel® SC5200 Server Chassis are designed for server boards that support fan
®
control, such as the Intel SHG2 and Server Boards. The front panel of the chassis has an active
temperature sensor (i.e., Dallas* 1621) connected to the front panel’s bus. Based on the inlet
temperature measured, the server board’s firmware will adjust the fan voltage. This will maintain
proper system cooling of all components and peripherals, while minimizing the acoustic noise
level. A fan sensor will be re-armed by the firmware if it was read as stopped (0 RPM) for one
polling cycle (~30 seconds) and then started back up again. To hot swap a fan, the user should
remove the failed fan, wait at least 30 seconds, and insert the replacement fan. The firmware will
then re-arm the fan sensor. The correct Field Replaceable Unit (FRU)/Sensor Data Record (SDR)
must be installed to ensure proper functionality of the fan control.
Some server boards may only utilize on onboard sensor to regulate fan speed between a nominal
speed and high speed.
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49
System Peripheral Bays
SC5200 5U Server Chassis TPS
5.
System Peripheral Bays
5.1
3.5" Floppy Drive Bay
®
The Intel SC5200 Server Chassis provides for the installation of a 3.5-inch floppy drive (Figure
35, item C) beside the 5.25-inch peripheral bays. However, another type of 3.5 inch device could
be installed in this space. Removal of the access cover provides entry for replacement of the
floppy drive. When a floppy drive is not installed, a snap-in EMI shield must be in place to ensure
regulatory compliance. A cosmetic plastic filler is also provided to snap into the bezel.
Figure 35. Drive Bay Locations
5.2
Drive Bay Locations
The SC5200 chassis supports two half height or one full-height 5.25 inch removable media
peripheral device (i.e., magnetic/optical disk, CD-ROM, or tape drive). These peripherals can be
up to 9 inches deep. Only the upper two of the three drive bay locations (Figure 35, item A) should
be populated in the SC5200 chassis. The vented EMI shields in the third drive bay location and
the 1-inch space below it (Figure 35, item B) should be retained as an air inlet for processor and
memory cooling. Without this air inlet, the processors may overheat. As a guideline, the
maximum recommended power per device is 18 W. Thermal performance of specific devices
must be verified to ensure compliance to the manufacturer’s specifications. The upper three bay
locations are rotated 90 degrees (via an adapter bracket) when configured in rack mode. This
allows devices (such as CDROMs) to remain in their normal operating position when the chassis is
rotated to the horizontal rack position.
For the pedestal systems, an optional DLT/CDROM bracket is available as an accessory
(FHD2DLTBRK). This includes a bracket to properly mount a full-height DLT type tape drive and a
bracket for a slimline CDROM drive to be mounted beneath the tape drive. This allows a CDROM
50
Revision 1.2
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System Peripheral Bays
drive to be installed in the pedestal system when a full-height tape drive is present and still permit
proper cooling.
For the rack chassis, the upper three bay locations are rotated 90 degrees via a pre-installed
adapter bracket. This allows devices (such as CD-ROMs) to remain in their normal operating
position when the chassis is rotated to the horizontal rack position. This configuration supports
two half-height devices or one full-height device. A DLT device will mount in this reorientation
bracket without the need for the optional accessory kit.
Six additional half-height 5.25-inch drive bays are provided to support installation of up to five hard
drive disk devices. Five 3.5-inch to 5.25-inch hard drive adapter trays are provided in the base
configurations and must be used to ensure proper cooling and Electromagnetic Compatibility
(EMC) compliance. The lowest 5.25-inch bay is covered with a ventilated EMI shield panel and
should not be utilized for drives to ensure proper system cooling operation.
The 5.25-inch peripherals are removable directly from the front of the chassis after removal of the
access cover (to disconnect cables) and opening front bezel (pedestal configuration only). EMI
shield panels or drive trays are installed and should be retained in unused 5.25-inch bays to
ensure proper cooling.
Note: Caution must be observed when approaching the maximum level of integration for these
5.25-inch drive bays. Power consumption of the devices integrated needs to be carefully
considered to ensure that the power supply maximum power levels are not exceeded. Typical
configurations can supply enough power for a floppy drive, a tape drive, a CD-ROM, and five SCSI
hard drives. The redundant power supplies (650-W 2+1) provide enough power for up to ten hotswap SCSI drives.
5.3
3.5-inch Hot-swap Hard Drive Bays
The backplane is an LVD/SE SCSI design, which provides support for SCSI devices, using Low
Voltage Differential Signaling, as well as support for older SE SCSI devices (Ultra 160* and older).
The backplane has a connector to accommodate a SAF-TE controller on an add-in card. The
backplane supports five 1-inch hot-swap SCA-2 drives when mounted in the docking drive carrier.
Using a “Y”-cable (AHD3HSBPYCBL), two of these backplane assemblies may be connected for
ten SCSI drives from one SCSI channel (650-W redundant chassis only).
®
The Intel SC5200 server chassis supports up to two hot-swap drive bays, each supporting five
drives, for a total capacity of ten 3.5 inch-wide SCA LVDS hard drives. The 650-W power supply
solution is required to be installed for full 10-drive support. The 450-W-powered systems are
designed to only power five hard drives. Drives are accessible by opening the front access door on
the pedestal configuration or directly from the front of the rack mount chassis. Five metal carriers
are provided with each hot-swap bay to mount the hard drives. Each carrier features a plastic
handle and bezel with an activity/fault indicator. When no drive is installed in a carrier, the air baffle
should remain in place to ensure proper cooling of the hard drives.
®
Originally designed for the Intel SC5100 Server Chassis, the hot-swap drive bay is designed to
accept one-inch peripherals that consume up to 18 W of power. This wattage number is intended
as a guideline. Thermal performance of specific hard drives must be verified to ensure compliance
®
to the drive manufacturer’s specifications. The compatibility list of the supported Intel server
board for the SC5200 server chassis is available on support.intel.com. The Intel server board
compatibility section for a list of compatible devices. (URL: http://support.intel.com/)
Revision 1.2
51
System Peripheral Bays
SC5200 5U Server Chassis TPS
Further technical details of the SCSI backplane can be obtained from the SC5100/SC5200 Low
Voltage Differential (LVD)/Single Ended (SE) SCSI Backplane External Product Specification
(EPS).
An optional hot-swap drive bay assembly (AXX2HSDRVUG) is available for the SC5200 chassis.
It should be mounted in place of the middle three 5.25-inch drive trays of the base, non-redundant
chassis models. For the redundant power models, the upgrade accessory should be installed in
the lower three 5.25-inch drive trays to bring the total number of available hot-swap SCSI drives to
ten.
®
Refer to the Intel SC5100/SC5200 Server Chassis Hot-swap Bay Upgrade Kit for installation
instructions.
5.4
SCSI Multi-Mode Termination
The multi-mode terminators provide SCSI-4 compliant termination for the backplane. These
terminators provide termination in both SE modes and LVD mode. Installing a single SE drive
forces all installed drives to run in the SE termination mode on the SCSI bus.
5.5
SCSI Interface
The SCSI interface on the SC51001 LVD/SE SCSI backplane provides the link between the SCSI
1
bus and the microcontroller (containing the intelligence for the SC5100 LVD/SE SCSI backplane).
This interface allows the microcontroller to respond as a SCSI target to implement the SAF-TE
protocol.
1
Power control on the SC5100 LVD/SE SCSI backplane supports the following features.
•
•
5.6
Spin-down of a drive when failure is detected and reported (using enclosure services
messages) via the SCSI bus. An application or RAID controller detects a drive-related
problem that indicates a data risk. In response, it removes the drive from service and
sends a spin-down SCSI command to the drive. This decreases the likelihood that the
drive will be damaged during removal from the hot-swap drive bay. When a new drive is
inserted, the power control waits a small amount of time for the drive to be fully seated, and
then applies power with a controlled power ramp.
If the system power is on, the LVD/SE SCSI backplane immediately powers off a drive slot
when it detects that a drive has been removed. This prevents possible damage to the drive
when it is partially removed and re-inserted while full power is available, and disruption of
the entire SCSI array from possible sags in supply voltage and resultant current spikes.
FET Short Protection
The Field Effect Transistor (FET) short protection circuit is useful to protect both 12-volt and 5-volt
power control FETs located on LVD/SE SCSI backplane.
1 The SCSI backplane board set used for the SC5200 chassis is the same as previously used in the SC5100
chassis. This board set is referred to as the SC5100 backplane board set below.
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SC5200 5U Server Chassis TPS
5.7
System Peripheral Bays
Device SCSI ID
Each device on a SCSI bus must have a unique SCSI ID. The 5 x 1.0” LVD/SE SCSI backplane
device SCSI ID is dependent on whether it is configured as a primary or a secondary backplane.
2
This configuration is defined by the logic of pin 1 on the I C* connector (J2A1).
Table 26. SCSI ID Assignments
Drive 1
SCSI ID as Primary Backplane
2
I C* connector (J2A1) pin1=1
0x0H
SCSI ID as Secondary Backplane
2
I C connector (J2A1) pin1=0
0x8H
Drive 2
0x1H
0x9H
Drive 3
0x2H
0xAH
Drive 4
0x3H
0xBH
Drive 5
0x4H
0xCH
SAF-TE Controller
0x6H
0x5H
Device
5.8
Hard Drive Activity LED
Each SCSI drive turns on a green when it is accessed. The LEDs are 4-terminal dual-color (yellow
and green) physically located on the backplane.
Table 27. Hard Drive Activity LED
5.9
Drive
1
HSBP LED Activated
1
LED Designator
DS5A1
LED Color
Green
2
2
DS5B1
Green
3
3
DS5C1
Green
4
4
DS5D1
Green
5
5
DS5E1
Green
Hard Drive Fault LED
The hot-swap controller(HSC) is responsible for turning the drive fault LEDs on or off according to
the states specified via commands received from SAF-TE and the IMB. The drive fault LEDs are
yellow and indicate failure status for each drive. The LEDs are physically located on the LVD/SE
SCSI backplane. For further information on slot status to fault light state mapping refer to the
SC5100/SC5200 Hot-swap Controller Interface EPS.
The LEDs are 4-terminal dual-color (yellow and green) physically located on the backplane.
Revision 1.2
53
System Peripheral Bays
SC5200 5U Server Chassis TPS
Table 28. Hard Drive Fault LED
Drive
1
HSBP LED Activated
1
LED Designator
DS5A1
LED Color
Yellow
2
2
DS5B1
Yellow
3
3
DS5C1
Yellow
4
4
DS5D1
Yellow
5
5
DS5E1
Yellow
Further technical details of the SCSI backplane can be obtained from the SC5100 LVD/SE SCSI
Backplane External Product Specification.
Figure 36. Hot-swap Drive Bay, Front Isometric View
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System Peripheral Bays
Figure 37. Hot-swap Drive Bay, Rear Isometric View
Figure 38. Drive Carrier with Air Baffle Installed
5.10 Hot-Swap Drive Bay Electronics
The hot-swap SCSI backplane board set supports the following features:
•
•
Hot-swapping of SCSI drives, that allows connection of SCSI devices while the system
power is on.
management and monitoring functions conforming to the SCSI-Accessed Fault-Tolerant
Enclosures Specification (SAF-TE), Revision 1.00.
Revision 1.2
55
System Peripheral Bays
5.10.1
SC5200 5U Server Chassis TPS
SCSI HSBP Board Layout
The following diagram shows the layout of components and connectors on the hot-swap SCSI
backplane printed circuit board set. This solution consists of two separate boards. The first board
provides power distribution and SCSI interfacing of the drives. The second board provides the
SAF-TE features and drive failure indicators.
Figure 39. SC5100/SC5200 SCSI Backplane
5.10.2
SCSI Hot-Swap Backplane Specifications
The SC5100/SC5200 hot-swap SCSI backplane is an embedded application subsystem, which
during normal operation does the following:
•
•
•
Responds to SAF-TE messages (transmitted to the backplane via the SCSI bus).
Monitors the temperature on the backplane, and reports a warning or critical error if outside
programmed limits.
Monitors the speed of the fans (if present), and reports a warning or critical error if outside
programmed limits.
The SC5100/SC5200 hot-swap SCSI backplane board set is made up of the following functional
blocks:
•
•
•
•
•
56
SCSI Bus with SCA drive connectors, and active LVDS terminators
Microcontroller with program Flash and RAM
SCSI interface that allows the microcontroller to respond as a SCSI target
I2C interface to server board
SCSI drive power control
Revision 1.2
SC5200 5U Server Chassis TPS
•
•
•
System Peripheral Bays
Fault indicator support
Support for two cooling fans (fan-tach inputs and power control)
Temperature sensor
The hot-swap SCSI backplane board set resides in the hot-swap drive bay which is included with
the SC5200 650-W redundant chassis and/or is available as an upgrade.
5.10.3
SAF-TE Board Layout
Figure 40. SC5100/SC5200 SAF-TE Board
5.11 SAF-TE Specifications
The SC5100/SC5200 hot-swap SCSI backplane board set performs the tasks associated with hotswappable drives, enclosure (chassis) monitoring and management, as specified in the SCSIAccessed Fault-Tolerant Enclosures Specification (SAF-TE), Revision 1.0. The SAF-TE specified
features supported by the hot-swap SCSI backplane include, but are not limited to, the following:
•
Monitoring the SCSI bus for enclosure services messages, and acting on them
appropriately. Examples of such messages include: activate a drive fault indicator, power
down a drive that has failed, and report backplane temperature.
•
SAF-TE intelligent agent, which acts as proxy for “dumb” I2C devices (that have no bus
mastering capability) during intra-chassis communications.
Revision 1.2
57
Front Panel
6.
SC5200 5U Server Chassis TPS
Front Panel
The front panel is located in the front corner of the chassis and remains unchanged from the
SC5100 server chassis. For the pedestal configuration, an exterior door allows full access to the
front panel features. The front panel features the control buttons and LED indicators listed in
Figure 41. Not shown (in the figure below) is a tool-activated Non-maskable Interrupt (NMI) switch
located below the Status LED. The LEDs are visible with the pedestal exterior access door closed.
The blue ID LED and ID toggle switch featured in the rack mount SC5200 chassis is used to
indicate which particular chassis among several in a rack configuration is being serviced. There is
a second blue ID LED mounted on the baseboard and visible from the rear of the chassis, which
mimics the front ID LED.
A 34-pin Entry Ebay SSI (rev 3.0) front panel header is located on the back of the front panel.
This allows for a 34-pin ribbon cable connection for use with SSI rev 3.0-compliant server boards,
or a 24-pin ribbon connection for use with first generation SSI server boards.
When the hot-swap drive bay is installed, a bi-color hard drive LED is located on each drive carrier
(five total) to indicate specific drive failure or activity. For pedestal systems, these LEDs are visible
upon opening the front bezel door.
A
C
B
E
D
F
E
D
F
J
C
B
A
G
I
H G
OM12035
H
OM11954
A.
B.
C.
D.
E.
F.
G.
H.
Hard drive activity LED (bi-color)
Power button
Sleep button
NIC1 activity LED (green)
Reset button
NIC2 activity LED (green)
Status LED (bi-color)
Power/Sleep LED (green)
Figure 41-1. Pedestal Controls and Indicators
A.
B.
C.
D.
E.
F.
G.
H.
I.
J.
Hard drive activity LED (bi-color)
Power button
Sleep button
NIC1 activity LED (green)
Reset button
ID toggle switch
ID LED (blue)
NIC2 activity LED (green)
Status LED (bi-color)
Power/ Sleep LED (green)
Figure 41-2. Rack Controls and Indicators
Figure 41. Front Panel Controls and Indicators
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SC5200 5U Server Chassis TPS
Front Panel
Table 29. Typical Front Panel LED Functions
LED Name
Color
Condition
Description
Power/Sleep LED
Green
ON
Power on
Green
BLINK
Standby/Sleep (S1)
OFF
Power off or Sleep (S4)
Green
ON
System ready
Green
BLINK
Processor or memory disabled
Amber
ON
Critical temperature or voltage fault; CPU/Terminator missing
Amber
BLINK
Power fault; Fan fault; Non-critical temperature or voltage
fault
Status LED
Hard drive activity
NIC1 activity
NIC2 activity
ID LED
OFF
Fatal error during POST
Green
BLINK
Hard drive activity
Amber
ON
Fault
OFF
No activity
Green
ON
Linked
Green
BLINK
LAN activity
OFF
Disconnected
Green
ON
Linked
Green
BLINK
LAN activity
OFF
Disconnected
ON
Server identification; Toggled by ID button or software
OFF
Server identification; Toggled by ID button or software
Blue
Further details of the front panel functions supported refer to the individual server board
specifications.
Figure 42. Front Panel, Showing Basic Layout
Revision 1.2
59
System Interconnection
SC5200 5U Server Chassis TPS
7.
System Interconnection
7.1
Signal Definitions
The standard cable construction is briefly described following. The pin-out on the connectors
referred to in this section is defined in the respective server board Technical Product Specificarion
(TPS).
7.2
Interconnect Diagram
The figure below depicts cables that may be found in a fully integrated SC5200 system. Not all the
cables shown below are provided with the system chassis or server board products.
Front Panel
IDE CDROM
Power Supply
Fan
SCSI Tape
24 pin SSI Power
8 pin SSI Power
5 pin SSI Power
3 pin fan
34 pin SSI FP
10 pin USB
3 pin fan
Serverboard
Hotswap Drive Bay
3 pin fan
5 pin ICMB
3 pin OEM IPMB
4 pin RAID HD Activity
2 pin Chassis Intrusion
40 pin ATA
68 pin LVD SCSI
34 pin Floppy
68 pin LVD SCSI
4 pin Primary HSBP I2C
40 pin ATA
4 pin 2nd HSBP I2C
10 pin Serial
OEM Board
3 pin fan
IDE drive
3 pin fan
Fan
Fan
ICMB Board
3 pin fan
OEM Board
Floppy Drive
Fan
Fan
3 pin fan
2nd Fan on
redudant only
IDE drive
2nd HS Drive Bay
(Not shown)
Chassis
Intrusion
COM2
Chassis
Intrusion
Figure 43. Chassis Interconnect Diagram
Note: Actual server board connections will vary by product. Consult the server board TPS for details. Cabled
COM2 is normally routed to the rear of the chassis with front mounting as an option for rack version. Two hotswap drive bays can be installed on the chassis with the 650-W 2+1 redundant power supply chassis. No
hot-swap drive bays are shipped with the 450-W power supply chassis (see Error! Reference source not
found.). Install hot-swap drive upgrade kit (AXX2HSDRVUG). ICMB board kit is a separate option
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SC5200 5U Server Chassis TPS
System Interconnection
(AXX2ICMBKIT). Both power supplies have the 24-pin SSI and 8-pin power connectors, and the 650-W also
has the 5-pin connector.
7.3
Chassis Internal Cables
The following cables are provided as part of the chassis kit:
7.3.1
Intrusion Alarm Switch cable
The intrusion alarm cable consists of two switches in a series which are normally open and are
depressed by the access cover and front bezel. It is cabled to the server board by 22AWG twistedpair wire terminated at a 2-pin connector.
7.3.2
Front Panel cable
A 34-conductor ribbon cable with 34-pin IDC* connectors links the front panel and SSI Revision
2.0-compliant server board (e.g., SHG2). Some boards may employ a 24-pin ribbon cable that
does not fully support all the features of the front panel.
7.3.3
USB cable
A 10-conductor USB cable with 10-pin connectors is used for connecting the front panel- mounted
USB connector to the server board
7.3.4
Fan Connectors
The installed system fans provide 3-pin connectors designed to mate with SSI (ATX*)-compatible
fan headers. Hot-swap fans employ chassis-mounted adapter cables to provide a standard 3-pin
connector for the server board.
The following cables are also provided as part of the HSRP chassis kit:
7.3.5
SCSI cable
A 68-conductor twisted-pair SCSI cable is provided to interface from the server board to the hotswap backplane (HSBP).
I2C cable
7.3.6
A 4-pin cable connects the server board to the HBSP to communicate server management
information, such as drive and fan status to the server board. Note that the server management
features will vary by server board.
7.4
Server Board Internal Cables
Depending on the specific server board support of these features, some or all of the following
cables may not be included as part of the boxed board kit:
7.4.1
IDE cable
One or two 40-pin, 80-conductor DMA33/66/100 IDE cable.
Revision 1.2
61
System Interconnection
7.4.2
SC5200 5U Server Chassis TPS
SCSI cable
One 68-pin, 68-conductor twisted-pair wide SCSI cable with terminator. Cable supports connection
of up to four SCSI drives to the server board.
7.4.3
Floppy cable
One 34-conductor cable featuring two 34-pin IDC connectors (2x17) floppy cable.
7.4.4
Serial cable
One 8-conductor cable terminated in a 2x5 header at one end and a 9-pin panel mount Dsub
connector on the other.
7.5
7.5.1
Accessory Cables
ICMB Interface Card cable
One 5-pin ICMB cable connects the server board to the ICMB interface card mounted on the
chassis rear panel or add-in card slot (included in the ICMB Interface Card Kit (AXX2ICMBKIT)
7.5.2
External SCSI Cable
One 68-pin SCSI cable connects the server board or add-in SCSI card to the panel which mounts
to the back of the chassis (see Figure 48). (AXXEXTSCSICBL)
7.5.3
SCSI Y-Cable
A 68-conductor twisted-pair SCSI cable is provided to interface from the server board to two
HSBPs. The server board uses the middle connector with an HSBP connected on each end. The
server board or SCSI card utilized must support disabling termination on the board, as both
backplanes will provide proper termination (see Figure 47). (AHD3HSBPYCBL)
7.6
I/O Panel Connectors
The SC5200 chassis provides an ATX 2.03 and SSI E-bay 3.0 -compliant I/O aperture for the
backside I/O. The specific panel used will be provided in the boxed server board kit. The following
are typical panel connections:
•
•
•
•
•
•
•
62
PS/2 keyboard connector
PS/2 mouse connector
9-pin serial port(s)
25-pin parallel port
USB port(s)
15-pin video port
Ethernet RJ-45 connector(s)
Revision 1.2
SC5200 5U Server Chassis TPS
System-Compatible Server Boards
8.
System-Compatible Server Boards
8.1
Intel® SE7505VB2 Dual Processor Server Board
Dual Intel® Xeon™ processors
Intel® (Placer) E7505 Chipset
8GB DDR 266 (4DIMMs) w/Intel® x4 Single Device Data Correction
Triple peer PCI
2*PCI-X 64bit/100MHz, 1*64bit/66MHz, 2*32bit/33MHz
AGP 3.0 (8X) Slot with Pro50 support
Dual Intel Ethernet (Gigabit & 10/100)
Integrated PCI graphics (8MB)
Integrated Serial ATA (2 port)
SCSI - single channel U320 (optional accessory)
Server monitoring and control (LDCM)
USB 2.0 support (up to 4 ports)
SSI Entry Electronics Bay 3.0 (12x13”)
8.2
Intel® SHG2 Dual Processor Server Board
Major features of the SHG2 server board include the following:
•
•
•
•
•
Dual Intel® XeonTM processor support.
Embedded VRMs
ServerWorks* Grand Champion LE chipset.
Support for six DDR200 or DDR266-registered ECC SDRAM DIMMs.
32-bit, 33-MHz, 5V keyed PCI segment with three expansion connectors and two
embedded devices.
- One PCI NIC—Intel® 82550PM Fast Ethernet Controller.
- 3D/2D graphics accelerator —ATI Rage XL* 8 MB SDRAM Video Controller.
Revision 1.2
63
System-Compatible Server Boards
•
•
•
•
•
•
•
•
•
•
SC5200 5U Server Chassis TPS
64-bit, 100-MHz, 3.3V PCI-X segment with two expansion connectors and one embedded
device.
®
- One PCI-X network interface controller—Intel 82544GC Gbit Ethernet Controller
64-bit, 133-MHz, 3.3V PCI-X segment with one expansion connector and one embedded
device.
- Dual Channel Ultra160 SCSI controller—Adaptec* 7899W SCSI controller.
X-bus segment with one embedded device.
- 8-Mbit Flash device for system BIOS.
LPC bus segment with two embedded devices.
- Super I/O* controller chip providing all PC-compatible I/O (floppy, parallel, serial,
keyboard, mouse).
- Sahalee Baseboard Management Controller (BMC) providing monitoring, alerting,
and logging of critical system information obtained from embedded sensors on the
baseboard.
Four Universal Serial Bus (USB) ports.
Two IDE connectors, supporting two ATA* 33/66/100-compatible devices.
IPMI 1.5-compliant Intel® Server Management v5.1 intelligent hardware and firmware
Intelligent Chassis Management Bus (ICMB) support via paddle card accessory
Supports SMBus
SHG2 has following connectors and switches: Serial x 2, Parallel, USB x 4, keyboard,
mouse, video, IPMB x 2, ICMB x 1, Ultra 160* -wide SCSI x 2, IDE x 2, LAN x 2 (one
100/10Base-T, one 1Gbit) x 1, Dump (NMI) switch, DC on/off switch, Sleep switch, Reset
switch, and ID switch (rack).
®
See the Intel SHG2 DP Server Board TPS on the support.intel.com website for more detail.
64
Revision 1.2
SC5200 5U Server Chassis TPS
8.3
System-Compatible Server Boards
Intel® SE7500CW2 Dual Processor Server Board
Major features of the SE7500CW2 server board include the following:
•
•
•
•
•
Dual Intel® XeonTM processors using the Socket* 603/604 FCPGA2 package.
400 MHz front side bus
Intel® E7500 server chipset
- Memory Controller Hub (MCH) memory controller
- P64H2 64-bit I/O Hub
- ICH3-S I/O controller
- Firmware Hub (FWH)
Support for up to four DDR200 or DDR266-compliant ECC DDR DIMMs, providing up to 4
GB of memory.
Three separate and independent PCI buses:
- Segment A: 32-bit, 33 MHz, 5 V (P32-A) with four embedded devices:
!
!
!
!
Segment B: PCI-X 64-bit, 100 MHz, 3.3 V, (P64-B) supporting the following
configuration:
-
!
!
!
!
•
•
•
•
•
Two PCI slots capable of supporting full length PCI add-in cards
Segment C: PCI-X 64-bit, 133 MHz, 3.3 V (P64-C) supporting the following device:
One PCI slot capable of supporting full length PCI add-in cards
Segment C: PCI-X 64-bit, 133 MHz, 3.3 V (P64-C) supporting the following device:
•
2D/3D graphics controller: ATI Rage XL Video Controller with 8 MB of SDRAM
®
Two Intel 10/100 82550PM Fast Ethernet Controllers
ATA-100 controller: Promise Technology* PDC20267
2 PCI I/O riser slot capable of supporting full length PCI add-in cards
One PCI slot capable of supporting full length PCI add-in cards
Low Pin Count (LPC) bus segment with two embedded devices:
- Super I/O controller chip providing all PC-compatible I/O (floppy, serial, keyboard,
mouse) as well as integrated hardware monitoring via a Winbond* 83627HF
hardware monitor
®
- Flash ROM device for system BIOS: Intel 8Mbit N82802AC flash ROM.
Three external USB ports with an additional internal header providing one optional USB
ports for front panel support.
Two IDE connectors, supporting up to four ATA-100 compatible devices
Support for up to four system fans and two processor fans.
SSI-compliant connectors for SSI interface support: front panel and power connectors.
SE7500CW2 has the following connectors and switches: Serial x 2, Parallel, USB x 4,
keyboard, mouse, video, IDE x 2, ATA RAID x 2, LAN x 2 (100/10Base-T) x 1, DC On/Off
switch, Sleep switch, and Reset switch.
®
See the Intel SE7500CW2 DP Server Board TPS on the support.intel.com website for more
detail.
Revision 1.2
65
System-Compatible Server Boards
8.4
SC5200 5U Server Chassis TPS
Intel® SE7501BR2 Dual Processor Server Board
Major features of the SE7501BR2 server board include support for the following:
•
•
•
•
•
•
•
•
•
Dual Intel® XeonTM processors with 512KB L2 cache
533MHz Front Side Bus, backwards compatible with 400MHz FSB processors
Embedded VRMs
Intel® E7501 Chipset Memory Controller Hub (MCH)
Intel® 82870P2 PCI/PCI-X 64-bit Hub2 (P64H2) I/O Hub
Intel® 82801CA I/O Controller Hub3 (ICH3-S)
Support for four DDR266 compliant registered ECC SDRAM DIMMs, providing up to 8 GB
of memory
Intel® x4 Single Device Data Correction
Three separate and independent PCI buses:
- Segment A (P32-A): PCI 32-bit, 33 MHz, 5 V, with two full-length/full-height
expansion slots and three embedded devices:
!
!
!
ATI 3D/2D Rage* XL Graphics Accelerator Video Controller
Intel® 10/100 82550PM Ethernet Controller
Intel® Gigabit 82540EM Ethernet Controller
Segment B (P64-B): PCI-X 64-bit, 100/66 MHz, 3.3 V, with two full-length/full-height
expansion slots and one embedded device:
-
!
Adaptec AIC-7901* single-channel Ultra320 SCSI controller
Segment C (P64-C): PCI-X 64-bit, 133/100/66 MHz, 3.3 V, with two full-length/fullheight expansion slots. This segment may operate as PCI-X 64-bit, 133 MHz when
only one slot is used.
LPC bus segment with two embedded devices:
-
•
Super I/O controller chip providing all PC-compatible I/O (floppy, parallel, serial,
keyboard, mouse) – National Semiconductor PC87417*
-
Sahalee BMC providing monitoring, alerting, and logging of critical system
information obtained from embedded sensors on baseboard
Two IDE connectors, supporting up to four ATA 33/66/100-compatible devices
Five USB ports
Support for up to six system fans and two processor fans
IPMI 1.5-compliant Intel Server Management v5.5 intelligent hardware and firmware
ICMB support via paddle card accessory
SE7501BR2 server board has the following connectors and switches: Serial x 2, Parallel,
USB x 5, keyboard, mouse, video, IPMB, ICMB, Ultra 320-wide SCSI x 1, IDE x 2, LAN x 2
(one 10/100, one 1Gbit), Dump (NMI) switch, DC on/off switch, Sleep switch, Reset switch,
and ID switch (rack)
-
•
•
•
•
•
•
®
See the Intel SE7501BR2 Server Board EPS for more details
66
Revision 1.2
SC5200 5U Server Chassis TPS
9.
Product Regulatory Compliance
Product Regulatory Compliance
The SC5200 chassis is designed and tested to meet the standards and regulation listed below
®
when configured with the Intel server boards specified.
9.1
Product Safety Compliance
The SC5200 complies with the following safety requirements:
•
•
•
•
•
9.2
UL 1950 – CSA 950 (US/Canada).
EN 60 950 (European Union).
IEC 60 950 (International).
CE – Low Voltage Directive (73/23/EEC) (European Limits).
EMKO-TSE (74-SEC) 207/94 (Nordics).
Product EMC Compliance
The system has been tested and verified to comply with the following EMC regulations when
configured with the Intel server boards specified. For information on compatible server boards,
refer to Intel’s Server Builder website (http://www.intel.com/go/serverbuilder) or contact your local
Intel representative.
•
•
•
•
•
•
•
•
•
•
9.3
FCC (Class A Verification) – Radiated and Conducted Emissions (USA).
ICES-003 (Class A) – Radiated and Conducted Emissions (Canada).
CISPR 22, 3rd Edition (Class A) – Radiated and Conducted Emissions (International).
EN45022 (Class A) – Radiated and Conducted Emissions (European Union).
EN45024 (Immunity) (European Union).
EN6100-3-2 & -3 (Power Harmonics & Fluctuation and Flicker).
CE – EMC Directive (89/33/EEC) (European Union).
VCCI (Class A) – Radiated and Conducted Emissions (Japan).
RRL (Class A) – Radiated and Conducted Emissions (Korea).
BSMI (Class A) – Radiated and Conducted Emissions (Taiwan).
Product Regulatory Compliance Markings
This product is provided with the following Product Certification Markings.
•
•
•
•
UL / cUL Listing Mark.
CE Mark.
German GS Mark.
Russian GOST Mark.
Revision 1.2
67
Product Regulatory Compliance
•
•
•
•
•
9.4
9.4.1
SC5200 5U Server Chassis TPS
FCC, Class A Verification Marking.
ICES-003 (Canada EMC Compliance Marking).
VCCI, Class A Mark.
Australian C-Tick Mark.
Taiwan BSMI Certification Number and Class A Warning.
Electromagnetic Compatibility Notices
USA
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference and (2), this device must accept
any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Connect the equipment to an outlet on a circuit other than the one to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the grantee of this device could void the
user’s authority to operate the equipment. The customer is responsible for ensuring compliance of
the modified product.
Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC
Class B limits may be attached to this computer product. Operation with noncompliant peripherals
is likely to result in interference to radio and TV reception.
All cables used to connect to peripherals must be shielded and grounded. Operation with cables,
connected to peripherals that are not shielded and grounded, may result in interference to radio
and TV reception.
68
Revision 1.2
SC5200 5U Server Chassis TPS
9.4.2
Product Regulatory Compliance
FCC Verification Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference and (2), this device must accept
any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124-6497
Phone: 1 (800)-INTEL4U or 1 (800) 628-8686
9.4.3
ICES-003 (Canada)
Cet appareil numérique respecte les limites bruits radioélectriques applicables aux appareils
numériques de Classe A prescrites dans la norme sur le matériel brouilleur: “Appareils
Numériques”, NMB-003 édictée par le Ministre Canadian des Communications.
English translation of the notice above:
“This digital apparatus does not exceed the Class A limits for radio noise emissions from digital
apparatus set out in the interference-causing equipment standard entitled “Digital Apparatus,”
ICES-003 of the Canadian Department of Communications.”
9.4.4
Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage Directive
(73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark to
illustrate its compliance.
9.4.5
Japan EMC Compatibility
Electromagnetic Compatibility Notices (International).
English translation of the notice above:
“This is a Class A product based on the standard of the Voluntary Control Council for Interference
(VCCI) from Information Technology Equipment. If this is used near a radio or television receiver
in a domestic environment, it may cause radio interference. Install and use the equipment
according to the instruction manual.”
Revision 1.2
69
Product Regulatory Compliance
9.4.6
SC5200 5U Server Chassis TPS
BSMI (Taiwan)
The BSMI Certification number and the following warning is located on the product safety label
which is located on the bottom side (pedestal orientation) or side (rack mount configuration).
70
Revision 1.2
SC5200 5U Server Chassis TPS
Environmental Limits
10. Environmental Limits
10.1 System Office Environment
Table 30. System Office Environment Summary
Parameter
Limits
Operating Temperature
+5oC to +35oC with the maximum rate of change not to exceed 10oC per
hour.
Non-Operating Temperature
-40oC to +70oC
Non-Operating Humidity
95%, non-condensing @ 30oC
Acoustic noise
55 dBA in a typical office ambient temperature (18-25C)
Operating Shock
No errors with a half sine wave shock of 2G (with 11-millisecond duration).
Package Shock
Operational after a free fall, 18 – 24 inch depending on the weight.
ESD
15kV per Intel Environmental Test Specification
10.2 System Environmental Testing
The system will be tested per the Environmental Standards Handbook, Intel Doc.#662394-05.
These tests shall include:
•
•
•
•
•
•
•
•
•
Temperature Operating and Non-Operating
Humidity Non-Operating
Packaged Shock
Packaged and Unpackaged Vibration
AC Voltage, Frequency, and Source Interrupt
AC Surge
Acoustics
Electrostatic Discharge (ESD)
EMC Radiated Investigation
Revision 1.2
71
Reliability, Serviceability, and Availability
SC5200 5U Server Chassis TPS
11. Reliability, Serviceability, and Availability
11.1 MTBF
Calculated Mean Time Between Failures (MTBF) at maximum configuration has been calculated at
TBD hours at 35°C.
Table 31. MTBF Calculations
Item
Percentage usage
MTBF HRs
Baseboard
100
Front panel board (typ)
100
3,566,515
Processor
100
TBD
SCSI dist BD
100
314,618
Hard Drive
100
NA
PRO 100 B
100
1,680,930
IDE CD-ROM (typ)
25
500,000
Power supply (typ)
100
150,000
1.44MB 3.5" FDU (typ)
5
405,000
32 Meg DIMM (typ)
100
283,051
FAN (typ)
100
96,062
TBD
11.2 Serviceability
The system is designed for service by qualified technical personnel only.
The desired Mean Time To Repair (MTTR) of the system is 30 minutes including diagnosis of the
system problem. To meet this goal, the system and hardware have been designed to minimize the
MTTR.
The following are the maximum times that a trained field service technician should take to perform
the listed system maintenance procedures, after diagnosis of the system.
Table 32. Maximum Maintenance Procedure Times
Remove cover
72
1
minute
Remove and replace hard disk drive
1
minute
Remove and replace 5 ¼ peripheral device
5
minutes
Remove and replace power supply
5
minutes
Remove and replace drive cage fan
2
minutes
Remove and replace expansion board
5
minutes
Remove and replace front panel board
5
minutes
Remove and replace server board (with no expansion boards)
15
minutes
Overall MTTR
20
minutes
Revision 1.2
SC5200 5U Server Chassis TPS
Upgradeability
12. Upgradeability
Listed below are accessory kits available for the SC5200 chassis. Illustrations are provided to
indicate some of the kit contents. Not all parts for each kit are shown and the actual part may differ
in appearance.
12.1 DLT Tape Drive and Slimline CDROM Mounting Brackets
Product Code FHD2DLTBRK. Contains DLT tape drive mounting rails (can be used for proper
mounting of other full-height peripherals), slim-line CDROM adapter bracket with integrated
cooling grill (for proper processor cooling), and 4-pin power adapter cable.
Figure 44. DLT Tape Drive and Slimline CDROM Mounting Brackets
12.2 ICMB Interface card with brackets and cable
Product Code AXX2ICMBKIT. This kit includes an interface board, adapter brackets for rear
panel mounting or PCI card slot mounting, and cable for connecting a server board to external
ICMB devices.
Figure 45. ICMB Interface Card
Revision 1.2
73
Upgradeability
SC5200 5U Server Chassis TPS
12.3 Hot-swap Drive Bay Upgrade
Product Code AXX2HSDRVUG. The kit includes a hot-swap drive bay with mounting hardware,
68-pin LVD cable for data transfer, and 4-pin I2C cable for server management communication.
Figure 46. Hot-swap Drive Bay Upgrade
12.4 SCSI Y-Adapter Cable
Product Code AHD3HSBPYCBL. This 10-pack kit includes a Y-Cable that splits a single SCSI
channel from a server board or add-in card, for connection to two 5-drive SCSI Backplanes (see
AHD3HSDRVUG).
Figure 47. SCSI Y-Adapter Cable
74
Revision 1.2
SC5200 5U Server Chassis TPS
Upgradeability
12.5 External SCSI Adapter Cable
Product Code AXXEXTSCSICBL. This 68-pin LVD SCSI cable allows an internal SCSI
connection from the motherboard to be routed to the ICMB/SCSI knockout at the rear of the
chassis.
Figure 48. External SCSI Adapter Cable Detail
12.6 350-W TPS Power Module
Product Code AXX2PSMODL350. This accessory provides a single 350-W TPS module and
power cord to upgrade RPS power supplies to redundant mode. It is also used as a replacement
module.
Figure 49. 350-W TPS Power Module
Revision 1.2
75
Upgradeability
SC5200 5U Server Chassis TPS
12.7 Rack Conversion Kit Product Code AHD3RACK.
Kit includes all parts needed to convert a pedestal chassis into the rack version. Contents include
rack bezel parts, 5.25-inch reorientation bracket, unpainted side covers, handles, mounting rails,
and hardware kit.
Figure 50. Rack Conversion Kit
76
Revision 1.2
SC5200 5U Server Chassis TPS
Appendix A: Chassis Spares & Accessories
13. Appendix A: Chassis Spares & Accessories
13.1 Upgrade and Accessory Parts
Product Code
MM #
UPC
Qty.
Description
AXX2PSMODL350
841602
7 35858 14629 6 1
350W Power Supply Module Upgrade or Spare
AXX2HSDRVUG
835948
7 35858 14630 2 1
Hot-Swap Drive Upgrade Kit – Upgrade Base
Chassis to 5 drives or HSRP to 10 drives
AHD3HSBPYCBL
848239
7 35858 15645 5 10
New SCSI Y-cable to work with SC5200 HSRP.
Permits cabling two backplanes to one SCSI/RAID
channel.
AXXEXTSCSICBL
830656
7 35858 13953 3 1
External SCSI Cable Accessory. For use with
SCSI Knock-out on rear of chassis.
AXX2ICMBKIT
836017
7 35858 14653 1 1
ICMB Board Assembly
FHD2DLTBRK
836423
7 35858 14669 2 5 Sets
DLT mounting bracket, includes slim-line CD ROM
mounting bracket and connector board
AHD2RACK
835849
7 35858 14670 8 1
Rack Kit- Use to convert Pedestal Chassis to a 5U
rack chassis. Includes rails, rack mounting
hardware, and rack bezel in black.
Will work with SC5100 or SC5200 Base Chassis.
Use AHD3RACK for HSRP Chassis.
AHD3RACK
845727
7 35858 15426 0 1
Rack upgrade kit with new SC5200 Hot-swap fan
access side cover. Backwards compatible with
Hudson II (includes both side covers)
13.2 Replacement and Spare Parts
®
AHG2IO
844599
7 35858 15299 0 50
I/O Shield and Gasket for Intel SHG2,
SE7500CW2, and SE7501BR2 Server Boards
FHDLVDSCBL
823391
7 35858 12705 9 10
SCSI Wide, LVDS Cable. Note: Use
FHD3SCSICBL for HSRP SKU.
FHD3SCSICBL
847537
7 35858 15475 8 10
New SCSI cable to work with SC5200 HSRP.
Connects baseboard to SCSI backplane (nonterminated).
FHDEYE2C
823392
7 35858 12720 2 10
I C Cable
FXX2HSBRD
836033
7 35858 14654 8 1
Hot-Swap Backplane Board
FXX2SAFTE
836027
7 35858 14655 5 1
SAF-TE Board
FHDSHRD
823387
7 35858 12712 7 10
HSBP Fan Shroud
FXX2DRVCARBLK 835853
7 35858 14621 0 10
Hot-Swap Drive Carrier, 1 inch, black
Revision 1.2
2
I
Appendix A: Chassis Spares & Accessories
SC5200 5U Server Chassis TPS
FHD2FPBRD
835851
7 35858 14622 7 1
Front Panel Board & Cable
FHD3BASEFANS
844703
7 35858 15303 4 1
Base SKU fan spare kit: one each 80x25 mm and
80x32 mm
FHD3HSFANS
844702
7 35858 15302 7 1
Hot swap fan spare kit: (1) 92 mm and (2) 80 mm,
includes carriers/connectors
FHD2EPAC
835950
7 35858 14632 6 1 Set
EPAC Set for SC5200 Base chassis (without hot
swap fans)
FHD3HSDUCT
844704
7 35858 15305 8 1
Plastic duct and fan holder/harness for HSRP SKU
FHD3PS450
844924
7 35858 15351 5 1
Non-Redundant 450W Power Supply for SC5200
Base Chassis
FHD2PSCAGE2P1 836424
7 35858 14668 5 1
650W 2+1 Power Supply Cage – Dual Line Cord
for SC5200 HSRP Chassis
AXX2PSMODL350
841602
7 35858 14629 6 1
350W Power Supply Module Upgrade or Spare
FHD3HSSIDE
844701
7 35858 15306 5 5
Side cover with fan access door for HSRP Chassis
FHDSDE
823386
7 35858 12706 6 5 Sets
Right and Left Side Panels - Painted
FHDTP
823385
7 35858 12707 3 10
Top Panel - Painted
FHDBTTM
823372
7 35858 12708 0 10
Bottom Panel- Painted
FHDFEET
823396
7 35858 12709 7 10
Pedestal Foot (Beige)
FHDPKG
823390
7 35858 12713 4 1
Packaging
FHD2HWKT
836557
7 35858 14707 1 1
Hardware Kit – Screws
FHD3SPRS
844685
7 35858 15304 1 1
SC5200 Channel Spares Kit
14. Glossary
Term
AC
II
Definition
Alternating Current
ACPI
Advanced Configuration and Power Interface.
ATX
Advanced technology extended (motherboard type).
BKM
Best Known Method – a document, created by an Intel organization, that details the proper or
customary steps used to perform a specific task (e.g., operating system installation).
BMC
Baseboard Management Controller – Provides monitoring, alerting, and logging of critical system
information obtained from embedded sensors on the baseboard.
DC
Direct Current
DDR
Double Data Rate
DIMM
Dual Inline Memory Module
Revision 1.2
Reference Documents
Term
SC5200 5U Server Chassis TPS
Definition
DLT
Digital Linear Tape
ECC
Error Correcting Code
EEB
Entry E-Bay
EEPROM
Electrically Erasable Programmable Read-Only Memory
EMC
Electromagnetic compatibility
EMI
Electromagnetic Interference
EPS
Entry Power Supply; External Product Specification
EPG
Enterprise Products Group – a division of Intel Corporation.
ESD
Electrostatic Discharge
FET
Field Effect Transistor
FRU
Field Replaceable Unit
FWH
Firmware Hub
HCT
Hardware Compatibility Test
HSBP
Hot-Swap Backplane
HSC
Hot-Swap Controller
Hz
Hertz (1 cycle/second)
I2C
Inter-integrated circuit bus
ICMB
Intelligent Chassis Management Bus
IDE
Integrated Drive Electronics
IMB
I/O
Input / Output
IP
Internet protocol
IPMI
Intelligent Platform Management Interface
ISM
Intel Server Management
LAN
Local Area Network
LED
Light Emitting Diode
®
LPC
Low Pin Count
LVDS
Low-voltage differential SCSI
MTBF
Mean Time Between Failures
MTTR
Mean Time to Repair
NMI
Nonmaskable Interrupt
OEM
Original Equipment Manufacturer
OS
Operating System
PCI
Peripheral Component Interconnect
PFC
Power Factor Correction
RPM
Revolutions Per Minute
RPS
Redundant Power Supply
PWT
Processor Wind Tunnel – Active cooling device included with the Intel® Boxed Xeon
SAF-TE
SCSI Accessed Fault –Tolerant Enclosure
SCA
Single connector attachment.
SCSI
Small Computer Systems Interface.
TM
Processors
Revision 1.2
II
SC5200 5U Server Chassis TPS
Term
Reference Documents
Definition
SDR
Sensor Data Record
SKU
Stock Keeping Unit
SMBus
A subset of the I C bus/protocol, developed by Intel.
SSI
Server System Infrastructure – Organization which defines and promotes specifications for the
server market
TBD
To Be Documented – Used when item being described has not yet been designed or formalized.
TPS
Thin Power Supply; Technical Product Specification
USB
Universal Serial Bus
VCCI
Voluntary Control Council for Interference
2
VRAM
Video Random Access Memory
VRM
Voltage Regulation Module
WfM
Wired for Management
WOL
Wake-on-LAN
Revision 1.2
III
Reference Documents
SC5200 5U Server Chassis TPS
Reference Documents
Refer to the following documents for additional information:
•
Intel® SHG2 DP Server Board EPS Rev 1.0, #11806
•
Intel® SE7500CW2 DP Server Board EPS Rev 1.1, #12362
•
Intel SE7501BR2 DP Server Board EPS Rev 0.72, #12025
•
SC5100 Low-Voltage Differential / Single Ended SCSI Backplane EPS, #10655
•
SC5100/SC5200/SRSH4/SPSH4 Hot Swap Controller EPS, #11615
•
450-W EPS 1.0 Power Supply Module Specification #A85459
•
650-W 2+1 Redundant Power Supply Specification, #A52678
•
350-W TPS Power Supply Module Specification #A45295
•
Intel® SC5200 Base Server Chassis Subassembly Product Guide, #A86510
•
Intel SC5200 Hot-Swap, Redundant Power Pedestal and Rack Server Chassis
Subassembly Product Guide, #A83713
•
Intel SC5100 and SC5200 Server Chassis Hot Swap Bay Upgrade Kit, #A58844
•
Intel® SC5100 and SC5200 DLT Tape and Slim-line CD ROM Installation Guide,
#A58846
•
Intel SC5100 and SC5200 Rack Kit Installation Guide, #A58842
•
Intel® SC5100 and SC5200 ICMB Card Installation Guide, #A58841
•
Intel® SC5100 and SC5200 External SCSI Cable Install Guide, #A27198
•
SCSI Accessed Fault-Tolerant Enclosures Specification, Revision 1.00
The SAF-TE Specification is available via email @ [email protected]
•
SSI Entry-Level Electronics–Bay Specification, Version 3.0
•
Advance Technology Extended (ATX) Specification, Revision 2.03
®
®
®
®
http://www.ssiforum.org/docs/entry_elecbay_spec_v3_0.pdf
•
ANSI/IEEE STD C62.45-1992
http://standards.ieee.org/reading/ieee/std_public/description/surge/C62.45-1992_desc.html
•
Environmental Standards Handbook, #662394-05
Revision 1.2
IV
SC5200 5U Server Chassis TPS
Reference Documents
15. INDEX
240VA, 25, 31
350-W Thin Power Supply Module, 1, 2, 12,
13, 42, 43, 76, IV
450-W 1+1 Base Redudant Power Supply,
14
450-W 1+1 Indicator and Control Functions,
21
450-W 1+1 On/Off Timing Power Supply,
20
450-W 1+1 Over Temperature Protection,
21
450-W 1+1 Over Voltage Protection, 21
450-W 1+1 Power Supply, 12, 16, 17
450-W 1+1 Protection Circuits Power
Supply, 21
450-W 1+1 Voltage Rise Time, 20
450-W Power Supply, 1, 2, 11, 12, 52, 61,
IV
650-W Redundant Power Supply, 1, 2, 12,
39, 40, 41, 42, 44, 52, 58, 61, 62, IV
82544GC Gbit Ethernet Controller, 65
82550PM Ethernet Controller, 64, 66
Ambient, 38
Ambient Air Temp, 24
ANSI, 44, IV
ATI* Rage XL, 64, 66
ATX 2.03 (Advanced Technology
Extended), 2, 5, 62, 63, II, IV
back plane, 53, 56, 57
Certifications, 68, 69, 70, 71
Chassis Intrusion, 5, 62
Color, 4, 54, 55, 60
DIMM, 64, 66, 73, II
DLT/CDROM Bracket, 51, 52, 74, I, II, IV
ECC, 64, 66, II
EEB (Entry E-Bay), 2
EEPROM, II
EMC, 52, 68, 69, 70, 72
EMI (Electromagnetic Interference, 4, 42,
51, 52, II
enclosure, 25, 42, 53, 56, 58, 73
Enclosure, 13
Fan Connectors, 62
FET short protection, 53
Front Panel reset, 65, 66, 67
Hard drive failure, 53, 54
Hot Swap, 12, 19, 49, II, IV
Revision 1.2
Hot-swap drive bay, 1, 45, 47, 52, 53, 55,
56, 58, 59, 61, 75
I/O Panel, 5, 63
2
I C, ii, 49, 54, 57, 58, 62, 75, I, II, III
ICMB (Intelligent-Chassis Management Bus),
61, 63, 65, 74, 76, I, IV
ICMB, See also Inter-chassis Management
Bus, 67
®
ISM (Intel Server Management), 5, 65, II
LED, 24, 59, II
Front Panel, 59, 60
Hard drive fault, 54
Power Supply, 40, 42, 43
LED, 42, 43, 54, 55, 59
LPC, II
Memory, 60, II, III
MTBF, 25
Multi-mode terminators, 53
NMI, 59, 65, 67, II
POST, 60
Power control, 53
Power Distribtuion Board, 36
Power Distribution Board, 25, 35
Power-on Self-Test
See POST, 60
Processor, 60
PSKill, 23
PWOK, 22, 32
PWOK y, 32
PWT (Processor Wind Tunnel), 46, 48, II
Rack Conversion Kit, 77
Reset, 65, 66, 67
SAF-TE, 56, 57, 58
SCA-2, 52
SCSI, 1, 52, 53, 55, 56, 57, 58, 62, 63, 64,
65, 67, 75, 76, II, III
SCSI ID, 54
SCSI Y-Cable, 63, 75, I
SCSI-4, 53
SE7500CW2 Server Board, ii, 1, 2, 11, 13,
66, I, IV
SE7501BR2 Server Board, ii, 1, 2, 49, 67
SE7505BV2 Server Board, ii
SE7505VB2 Server Board, 64
Serial, 67
SHG2 Server Board, ii, 1, 2, 11, 13, 49, 62,
64, 65, I, IV
V
Reference Documents
SMBus, 33
SMBus, 32, 33, 34
Specification, SAF-TE, 58
Spin-down, 53
SSI (Server Standards Infrastructure), 2, 5,
11, 12, 13, 59, 62, 63, 66, III, IV
Temperature, 58, 60
Termination, 53
SC5200 5U Server Chassis TPS
Transfer switch, 41, 42
USB (Universal Serial Bus), 62, 63, 65, 66, III
USB, See also Universal Serial Bus, 67
VCCI notice, 70
Voltage, 53, 60
Wired for Management, III
TM
Xeon processors, ii, 46, 48, 64, 66, II
Revision 1.2
II
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