Surface-Mount Fuses Fundamentals Overview

Surface-Mount Fuses Fundamentals Overview
Surface-Mount Fuses – Fundamentals
Surface-Mount Fuses
Fundamentals
Overview
TE Circuit Protection offers the widest selection of surface-mount
fuses available for addressing a broad range of overcurrent
protection applications. Helping to prevent costly damage
and promote a safe environment for electronic and electrical
equipment, our single-use chip fuses provide performance stability
to support applications with current ratings from .5A up to 20A.
TE Circuit Protection also offers the telecom FT600 fuse for
telecommunications applications. This telecom fuse helps comply
with North American overcurrent protection requirements,
including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68),
and UL60950 3rd edition.
Multi-layer Design for Chip Fuses
The multi-layer design has the benefit of exposing more fuse
element surface area to the glass-ceramic absorption material.
When the fuse elements open, there is more material for the
vaporizing fuse metals to absorb into, resulting in a very efficient
and effective quenching of the fuse arc.
Figure SF1 compares the multi-layer design of our SFF fuses with
standard glass coated designs. The glass coated designs rely on
the coating on only one side of the fuse element to absorb the
vaporizing fuse material when it opens. Therefore, there is much
less absorption material available to absorb the fuse metals. The
result can be prolonged arcing and possible coating breach.
Figure SF2 shows how the absorption characteristics of the two
designs differ. The multi-layer design indicates a clean separation
with the fuse element evenly diffusing into the surrounding
ceramic substrate. In the glass coated design, the element
diffusion takes place in a small portion of the device and is only
absorbed by the glass material directly above the area of failure.
Figure SF1
Glass/Ceramic
Substrate
Multiple Fuse
Elements
Multi-layer Design
Substrate
Material
Single Fuse Glass
Element Coating
Single-layer Glass Coated Design
Figure SF2
Fault Zones
10
Multi-layer Design
Single-layer Glass Coated Design
Wire-In-Air Design for 2410SFV Fuses
The 2410(6125) is a Wire-In-Air SMD fuse that is suitable for
secondary level overcurrent protection applications.
Figure SF3 compares our straight wire element design
2410SFV fuses with normal corrugated wire design fuse.
The straight wire element in air provides consistent fusing
and cutting characteristics together with inrush current
withstanding capability.
By introducing PCB assembly technology into the 2410SFV fuse
design and manufacturing process, lead-free compliance has
been achieved without the problems associated with end caps
on traditional ceramic devices.
Figure SF3
Glass Fiber Enforced
Epoxy Body
Straight Wire Element
Copper Terminal
Plated with Ni and Tin
Ceramic Body
Corrugated Wire Element
End Cap Plated with Tin
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-1-Fundamentals.indd 107
HF Halogen Free
107
8/3/13 10:58 AM
Temperature Derating
A fuse is a temperature sensitive device. Therefore, operating temperature will have an efect on fuse performance and
lifetime. Operating temperature should be taken into consideration when selecting the fuse current rating. The Thermal
Derating Curve for surface-mount fuses is presented in Figure SF4. Use it to determine the derating percentage based on
operating temperature and apply it to the derated system current.
Figure SF4
1206/0603/0402 Series
Temperature Effect on Current Rating
110
110
100
105
90
100
95
80
88%
90
% Derating
70
% Derating
2410 Series
Temperature Effect on Current Rating
60
50
40
85
80
75
70
30
65
20
60
10
55
0
-55 -45 -35 -25 -15
-5
5
15
25
35
45
55
65 70
85 95 105 115 125
50
-55
-35
-15
5
25
45
65
85
105
125
Maximum Operating Temperature (˚C)
Maximum Operating Temperature (˚C)
Pulse Cycle Derating
Figure SF5
Surface-mount Fuse Pulse Derating Curve
100%
% of Minimum I2t
Once the I2t value for the application waveform has been determined,
it must be derated based on the number of cycles expected over
the system lifetime. Since the stress induced by the current pulse is
mechanical in nature, the number of times the stress is applied has
significant bearing on how much derating must be applied to the fuse
rating. Figure SF5 presents the current pulse derating curve for our
surface-mount chip fuses up to 100,000 cycles.
10%
100
1000
10000
100000
Number of Pulses
Selecting Surface-mount Fuses
Fuse selection seems straightforward, in that you pick one which has a current rating just a bit higher than your worst case
system operating current. Unfortunately, it is not that simple. There are derating considerations for operating current and
application temperature. Turn-on and other system operations (like processor speed changes or motor start up) cause current
surges or spikes that also require consideration when selecting a fuse. So selecting the right fuse for your application is not as
simple as knowing the nominal current drawn by the system.
10
Fuse Selection Flowchart
However, the basic considerations for fuse selection are shown in the flow chart presented in Figure SF6. Following this flow
chart will help you select a fuse best suited for your application conditions. For a detailed example of this process you can
download our Fuse Selection Guide available on our website.
Figure SF6
Step 1 –
Determine Steady State
Fuse Current Rating
Step 2 –
Determine Pulse
Waveform by
Calculating I2t
Apply Standard Steady
State Derating (75%)
[Ifuse ≥ Isys/0.75]
Step 3 –
Apply Pulse
Cycle Derating
Step 7 – Select Fuse Current Rating
(Use Higher Value Between Step 1 and Step 6)
108
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-1-Fundamentals.indd 108
Step 4 –
Apply Pulse
Temperature
Derating
Apply
Temperature Derating
[Ifuse ≥ Isys/0.75/Ktemp]
Step 5 –
Apply Derating
for Variance in
the Circuit
Steady State
Fuse Current
Rating
Step 6 –
Select Fuse Current
Rating for Pulse
Environment
Step 8 – Check Voltage Rating
HF Halogen Free
8/14/13 9:21 AM
NEW
Pulse Tolerant Chip Fuses have high inrush current
withstand capability and provide overcurrent protection
for DC power systems. These devices combine a silver
fusing element and monolithic, multilayer design to
provide strong arc suppression characteristics.
These RoHS-compliant surface-mount devices can
help facilitate the development of more reliable,
high-performance consumer electronics such as
laptops, multimedia devices, cell phones and other
portable electronics.
Benefits
Surface-Mount Fuses – Pulse Tolerant Chip Fuses
Surface-Mount Fuses
Pulse Tolerant Chip Fuses
Features
• High inrush current withstand capability
• Lead free materials and RoHS compliant
• Ceramic monolithic structure
• Halogen free
(refers to: Br#900ppm, Cl#900ppm, Br+Cl#1500ppm)
• Silver fusing element and silver termination with
nickel and tin plating
• Monolithic, multilayer design
• Temperature stability
• High-temperature performance
• Strong arc suppression characteristics
• -55°C to +125°C operating temperature range
10
Applications
• Laptops
• Printers
• Game systems
• Digital cameras
• DVD players
• LCD monitors
• Cell phones
• Portable electronics
• Scanners
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-2-SFP-PulseTolerant.indd 109
HF Halogen Free
109
8/3/13 10:58 AM
Table FP1 Clear Time Characteristics for Pulse Tolerant Chip Fuses
% of rated current
100%
200%
1000%
Clear time at 25°C
4 hrs (min)
1 s (min)
0.0002 s (min)
60 s (max)
0.02 s (max)
Table FP2 Typical Electrical Characteristics and Dimensions for Pulse Tolerant Chip Fuses
0603 (1608 mm) Pulse Tolerant Chip Fuses
D
A
Part Number
Shape and Dimensions
mm (in)
B
C
A
mm
in
B
Min
Max
1.45
1.75
(0.057) (0.069)
C
Min
Max
0.65
0.95
(0.026) (0.037)
D
Min
Max
0.21
0.51
(0.008) (0.020)
Min
Max
0.65
0.95
(0.026) (0.037)
Typical
Electrical Characteristics
Rated
Nominal Nominal
I2t
Current Cold DCR
(A2s)†
(A)
(Ω)*
Max
Interrupt Ratings
Voltage
(VDC)
Current
(A)
0603SFP100F/32-2
1.0
0.210
0.08
32
50
0603SFP150F/32-2
1.5
0.101
0.11
32
50
0603SFP200F/32-2
2.0
0.057
0.24
32
50
0603SFP250F/32-2
2.5
0.042
0.56
32
50
0603SFP300F/32-2
3.0
0.030
0.72
32
50
0603SFP350F/32-2
3.5
0.022
1.10
32
50
0603SFP400F/32-2
4.0
0.018
2.08
32
50
0603SFP450F/32-2
4.5
0.014
2.63
32
50
0603SFP500F/32-2
5.0
0.013
3.25
32
50
0603SFP600F/32-2
6.0
0.010
4.00
32
70
1206 (3216 mm) Pulse Tolerant Chip Fuses
D
A
10
Part Number
Shape and Dimensions
mm (in)
B
Typical
Electrical Characteristics
Nominal Nominal
Rated
I2t
Current Cold DCR
(A2sec)†
(Ω)*
(A)
Max
Interrupt Ratings
Voltage
(VDC)
Current
(A)
1206SFP100F/63-2
1.0
0.340
0.11
63
50
1206SFP150F/63-2
1.5
0.150
0.33
63
50
1206SFP200F/63-2
2.0
0.090
0.80
63
50
1206SFP250F/32-2
2.5
0.070
1.19
32
50
1206SFP300F/32-2
3.0
0.035
1.35
32
50
1206SFP350F/32-2
3.5
0.029
1.84
32
50
C
A
mm
in
B
C
D
Min
Max
Min
Max
Min
Max
Min
Max
1206SFP400F/32-2
4.0
0.023
2.74
32
50
3.00
3.40
0.77
1.17
0.26
0.76
1.40
1.80
1206SFP450F/32-2
4.5
0.021
3.20
32
50
1206SFP500F/32-2
5.0
0.017
5.50
32
50
1206SFP600F/24-2
6.0
0.013
12.50
24
80
1206SFP700F/24-2
7.0
0.010
30.00
24
80
1206SFP800F/24-2
8.0
0.009
60.00
24
80
(0.118) (0.134)
(0.030) (0.046)
(0.010) (0.030)
(0.055) (0.071)
* Measured at #10% of rated current and 25°C ambient temperature.
† Melting I2t at 0.001 sec clear time.
110
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-2-SFP-PulseTolerant.indd 110
HF Halogen Free
8/3/13 10:58 AM
Surface-Mount Fuses – Pulse Tolerant Chip Fuses
Figures FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses
Figure FP1
4.5
5.0 A
A
6 .0
A
A
A
A
3.0
4.0
A
2. 5
3.5
A
2. 0
1.5
A
1.0
A
0603SFP Average Time Current Curves
100
Clear Time (s)
10
1
0.1
0.01
0.001
1
10
100
Current (A)
Note: Curves are nominal.
Figure FP2
0603SFP I2t vs. t Curves
6.0A
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
10,000
1000
10
1.0A
I2t (A2s)
100
10
1
0.1
0.01
0.001
0.01
0.1
1
10
100
Time (s)
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-2-SFP-PulseTolerant.indd 111
HF Halogen Free
111
8/3/13 10:58 AM
Figures FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses
Cont’d
Figure FP3
A
7.0
A
8 .0
A
3.0
A
4.0
A
4.5
A
5.0
A
6 .0
A
A
2. 5
3.5
A
2. 0
1.5
A
1.0
A
1206SFP Average Time Current Curves
1,000
100
Time (s)
10
1
0.1
0.01
0.001
1
10
100
Current (A)
Figure FP4
1206SFP I2t vs. t Curves
8.0A
7.0A
6.0A
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
100,000
10,000
10
1,000
1.0A
I2t (A2s)
100
10
1
0.1
0.01
0.001
0.001
0.01
0.1
1
10
100
1,000
Time (s)
Note: Curves are nominal.
 Please go to page 129 for more information about Pulse Tolerant Chip Fuses.
112
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-2-SFP-PulseTolerant.indd 112
HF Halogen Free
8/3/13 10:58 AM
NEW
Very fast-acting chip fuses help provide overcurrent
protection for systems using DC power sources up to
32VDC. The fuse’s monolithic, multilayer design helps
provide the highest hold current in the smallest footprint,
reduce diffusion-related aging, improve product
reliability and resilience, and enhance high-temperature
performance in a wide range of circuit designs.
These RoHS-compliant surface-mount devices offer
strong arc suppression characteristics and facilitate
the development of more reliable, high-performance
consumer electronics such as laptops, multimedia
devices, cell phones and other portable electronics.
Benefits
Surface-Mount Fuses – 0603 Very Fast-Acting Chip Fuses
Surface-Mount Fuses
0603 Very Fast-Acting Chip Fuses
Features
• Very fast acting at 200% and 300% overloads
• Lead-free materials and RoHS compliant
• Inrush current withstand capability at high overloads
• Halogen free
• Thin body for space-limited applications
(refers to: Br#900ppm, Cl#900ppm, Br+Cl#1500ppm)
• Glass ceramic monolithic structure
• Monolithic, multilayer design
• Silver fusing element and silver termination with
nickel and tin plating
• High-temperature performance
10
• -55°C to +125°C operating temperature range
• RoHS compliant and lead-free materials
• Symmetrical design with marking on both sides
(optional)
Applications
• Laptops
• Printers
• Game systems
• Digital cameras
• DVD players
• LCD monitors
• Cell phones
• Portable electronics
• Scanners
RoHS Compliant, ELV Compliant
HF Halogen Free
2013_CP_S10-Fuses-3-SFV-0603-Very-Fast-Acting.indd 113
113
8/3/13 10:58 AM
Table FV1 Clear Time Characteristics for Very Fast-Acting Chip Fuses
% of Rated Current
100%
200%
300%
Clear Time at 25°C
4 hrs (min)
0.01 s (min)
0.001 s (min)
5 s (max)
0.2 s (max)
Table FV2 Typical Electrical Characteristics and Dimensions for Very Fast-Acting Chip Fuses
0603 (1608mm) Very Fast-Acting Chip Fuses
D
Part Number
A
Shape and Dimensions
mm (in)
Min
mm
in
Max
1.45
1.75
(0.057) (0.069)
Min
0.22
C
Max
Min
0.48
0.21
(0.009) (0.019)
0.51
(0.008) (0.020)
Min
0.65
Current
(A)
0.5
0.860
0.0093
32
50
0.8
0.450
0.0191
32
50
0603SFV100F/32-2
1.0
0.280
0.0360
32
50
0603SFV125F/32-2
1.3
0.205
0.0630
32
35
0603SFV150F/32-2
1.5
0.143
0.0950
32
35
Max
0603SFV175F/32-2
1.8
0.095
0.1400
32
35
0.95
0603SFV200F/32-2
2.0
0.073
0.2100
32
35
0603SFV250F/32-2
2.5
0.046
0.3000
32
35
0603SFV300F/32-2
3.0
0.039
0.4600
32
35
0603SFV350F/32-2
3.5
0.028
0.7300
32
35
0603SFV400F/32-2
4.0
0.023
1.1500
32
35
0603SFV450F/32-2
4.5
0.019
1.6800
32
35
0603SFV500F/32-2
5.0
0.015
2.6200
32
35
D
Max
Voltage
(VDC)
0603SFV075F/32-2
C
B
Max Interrupt Ratings
0603SFV050F/32-2
B
A
Typical Electrical Characteristics
Nominal
Rated
Nominal
I2t
Current
Cold DCR
(A2s)
(A)
(Ω)*
(0.025) (0.037)
* Measured at 10% of rated current and 25°C.
Figures FV1-FV2 Family Performance Curves for Very Fast-Acting Chip Fuses
Figure FV1
Figure FV2
0603SFV Average Time Current Curves
0.0
5A
0.7
5
1.0 A
0
1. 2 A
5
1.5 A
1.7 0A
2.05 A
2. 5 0 A
3.0 0A
3.5 0A
4.0 0A
4.5 0A
5.0 0A
0A
0603SFV I²t vs. t Curves
10
100
1000
5.00A
4.50A
4.00A
3.50A
3.00A
2.50A
2.00A
1.75A
1.50A
1.25A
1.00A
0.75A
0.05A
100
10
10
1
I²t (A²s)
Clear Time (s)
1
0.1
0.1
0.01
0.01
0.001
0.001
0.0001
1
10
Current (A)
100
0.0001
0.0001
0.001
Note: Curves are nominal.
0.01
0.1
1
10
Time (s)
 Please go to page 129 for more information about Very Fast-Acting Chip Fuses.
114
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-3-SFV-0603-Very-Fast-Acting.indd 114
HF Halogen Free
8/3/13 10:58 AM
Fast-acting chip fuses help provide overcurrent protection
for systems using DC power sources up to 63VDC.
The fuse’s monolithic, multilayer design helps provide
the highest hold current in the smallest footprint, reduce
diffusion-related aging, improve product reliability and
resilience, and enhance high-temperature performance in
a wide range of circuit designs.
These RoHS-compliant surface-mount devices offer
strong arc suppression characteristics and help facilitate
the development of more reliable, high-performance
consumer electronics such as laptops, multimedia
devices, cell phones and other portable electronics.
Benefits
Surface-Mount Fuses – Fast-Acting Chip Fuses
Surface-Mount Fuses
Fast-Acting Chip Fuses
Features
• Small size with high-current ratings
• Lead-free and RoHS compliant
• Temperature stability
• Halogen free
• High reliability and resilience
• Strong arc suppression characteristics
(refers to: Br#900ppm, Cl#900ppm, Br+Cl#1500ppm)
• Monolithic, multilayer design
• High-temperature performance
10
• -55°C to +125°C operating temperature range
Applications
• Laptops
• Printers
• Game systems
• Digital cameras
• DVD players
• LCD monitors
• Cell phones
• Portable electronics
• Scanners
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-4-FF-FastActing.indd 115
HF Halogen Free
115
8/3/13 10:59 AM
Table FF1 Clear Time Characteristics for Fast-Acting Chip Fuses
% of Rated Current
100%
250%
400%
Table FF2
Clear Time at 25°C
4 hrs min
5 s max
0.05 s max
Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for
Fast-Acting Chip Fuses
0402 (1005mm) Fast-Acting Chip Fuses
Shape and
Dimensions
in (mm)
0.020±0.004
(0.51±0.10)
Typical Electrical Characteristics
0.039±0.004
(1.00±0.10)
0.020±0.004
(0.51±0.10)
0.063
(1.60)
Recommended
Pad Layout
in (mm)
Nominal
Cold DCR
(Ω)*
Nominal
I2t
(A2s)†
Voltage
(VDC)
Current
(A)
0402SFF100F/24
1.00
0.120
0.0170
24
35
0402SFF150F/24
1.50
0.056
0.0490
24
35
0402SFF200F/24
2.00
0.035
0.0700
24
35
0402SFF300F/24
3.00
0.021
0.1250
24
35
0402SFF400F/24
4.00
0.014
0.2250
24
35
Part Number
0.010±0.004
(0.25±0.10)
0.016
(0.40)
Max Interrupt Ratings
Rated
Current
(A)
0.028
(0.70)
0.024
(0.60)
0603 (1608mm) Fast-Acting Chip Fuses
Typical Electrical Characteristics
Shape and
Dimensions
in (mm)
0.031±0.006
(0.80±0.15)
Nominal
Cold DCR
(Ω)*
Nominal
I2t
(A2s)†
Voltage
(VDC)
Current
(A)
0603SFF050F/32
0.50
0.485
0.0029
63
35
0603SFF075F/32
0.75
0.254
0.0064
63
35
0603SFF100F/32
1.00
0.147
0.0160
63
35
0603SFF150F/32
1.50
0.059
0.0300
63
35
0603SFF200F/32
2.00
0.044
0.0600
32
35
0603SFF250F/32
2.50
0.032
0.1150
32
35
0603SFF300F/32
3.00
0.025
0.1900
32
35
0603SFF350F/32
3.50
0.024
0.2950
32
35
0603SFF400F/32
4.00
0.018
0.4000
32
35
0603SFF500F/32
5.00
0.013
0.7000
32
35
0603SFF600F/24
6.00
0.010
1.1250
24
35
Part Number
0.031±0.006
(0.80±0.15)
0.014±0.006
(0.36±0.15)
0.110
(2.80)
Recommended
Pad Layout
in (mm)
0.024
(0.60)
0.039
(1.00)
0.043
(1.09)
10
Max Interrupt Ratings
Rated
Current
(A)
0.063±0.006
(1.60±0.15)
1206 (3216mm) Fast-Acting Chip Fuses
Typical Electrical Characteristics
Shape and
Dimensions
in (mm)
Rated
Current
(A)
Nominal
Cold DCR
(Ω)*
Nominal
I2t
(A2s)†
Voltage
(VDC)
Current
(A)
1206SFF050F/63
0.50
0.730
0.0021
63
50
1206SFF075F/63
0.75
0.513
0.0052
63
50
1206SFF100F/63
1.00
0.220
0.0120
63
50
1206SFF150F/63
1.50
0.120
0.0250
63
50
1206SFF175F/63
1.75
0.100
0.0450
63
50
1206SFF200F/63
2.00
0.050
0.0700
63
50
1206SFF250F/32
2.50
0.035
0.1400
32
50
1206SFF300F/32
3.00
0.031
0.2200
32
50
1206SFF400F/32
4.00
0.022
0.3800
32
45
0.173
(4.40)
1206SFF500F/32
5.00
0.015
0.6000
32
45
0.059
(1.50)
1206SFF600F/32
6.00
0.013
1.0000
32
50
1206SFF700F/32
7.00
0.011
1.7500
32
50
1206SFF800F/32
8.00
0.008
2.5000
32
50
1206SFF600F/24
6.00
0.013
1.0000
24
45
1206SFF700F/24
7.00
0.011
1.7500
24
45
1206SFF800F/24
8.00
0.008
2.5000
24
45
0.063±0.008
(1.60±0.20)
Part Number
0.126±0.008
(3.20±0.20)
0.043±0.008
(1.10±0.20)
0.020±0.010
(0.51±0.25)
Recommended
Pad Layout
in (mm)
Max Interrupt Ratings
0.071
(1.80)
0.057
(1.45)
* Measured at #10% of rated current and 25°C ambient temperature.
† Melting I2t at 0.001 sec clear time.
116
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-4-FF-FastActing.indd 116
HF Halogen Free
8/3/13 10:59 AM
Figure FF1
Figure FF2
0402SFF I²t vs. t Curves
2. 0
3 . 0A
4.0A
A
1.0
A
1.5
A
0402SFF Average Time Current Curves
1,000
4.0A
10
3.0A
2.0A
1.5A
100
1.0A
1
0.1
1
I²t (A²s)
Clear-Time (s)
10
0.1
0.01
0.01
0.001
Surface-Mount Fuses – Fast-Acting Chip Fuses
Figures FF1-FF6 Family Performance Curves for Fast-Acting Chip Fuses
0.001
0.0001
0.1
1
10
0.0001
0.0001
100
0.001
Current (A)
0.01
0.1
1
10
Time (s)
Note: Curves are nominal
Figure FF3
Figure FF4
0603SFF Average Time Current Curves
0.5
A
0.7
5
1.0 A
A
1.5
2 . 0A
2. 5 A
3.0A
3 . 5A
4. A
5.00A
6 .0A
A
0603SFF I²t vs. t Curves
10000
10
6.0A
5.0A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1.0A
0.75A
1000
100
10
0.5A
I²t (A²s)
Clear-Time (s)
1
10
0.1
1
0.1
0.01
0.01
0.001
0.1
1
10
Current (A)
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-4-FF-FastActing.indd 117
HF Halogen Free
100
0.001
0.001
Note: Curves are nominal
0.01
0.1
1
10
Time (s)
117
8/3/13 10:59 AM
Figures FF1-FF6 Family Performance Curves for Fast-Acting Chip Fuses
Figure FF5
Cont’d
Figure FF6
1206SFF Average Time Current Curves
0.5
A
0.7
5
1.0 A
A
1.5
1.7 A
2.05 A
2. 5 A
3.0A
4. A
5.00A
6 .0A
7.0 A
8 .0A
A
1206SFF I²t vs. t Curves
10000
10
8.0A
7.0A
6.0A
5.0A
4.0A
3.0A
2.5A
2.0A
1.75A
1.5A
1.0A
1000
1
100
0.5A
I²t (A²s)
Clear-Time (s)
0.75A
10
0.1
1
0.1
0.01
0.01
0.001
0.1
1
10
100
0.001
0.001
0.01
0.1
1
10
Time (s)
Current (A)
Note: Curves are nominal.
 Please go to page 129 for more information about Fast-Acting Chip Fuses.
10
118
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-4-FF-FastActing.indd 118
HF Halogen Free
8/3/13 10:59 AM
The monolithic multilayer design of the TE Circuit
Protection high-current-rated chip fuses helps to provide
some of the highest current ratings available in the 1206
size and enhances high-temperature performance in a
wide range of circuit protection designs. The devices’
small size, high reliability and strong arc suppression
characteristics make them suitable for overcurrent
protection of power supplies, servers, communications
equipment, voltage regulator modules, and other highcurrent, small size applications.
Benefits
Surface-Mount Fuses – High-Current-Rated Chip Fuses
Surface-Mount Fuses
High-Current-Rated Chip Fuses
Features
• Glass ceramic monolithic structure provides stability
in application cycling
• Lead-free materials and RoHS compliant
• Halogen free
• High-current rating in a small package allows more
efficient use in system space
• Monolithic multilayer design
• Strong arc suppression in overcurrent conditions
• High-temperature performance
(refers to: Br#900ppm, Cl#900ppm, Br+Cl#1500ppm)
• -55°C to +125°C operating temperature range
10
Applications
• Communications equipment
• Voltage regulator modules
• Power supplies
• Servers
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-5-FH-HighCurrent.indd 119
HF Halogen Free
119
8/3/13 10:59 AM
Table FH1 Clear Time Characteristics for High-Current-Rated Chip Fuses
1206SFH Series
% of Rated Current
100%
250%
Table FH2
Clear Time at 25°C
4 hrs (min)
5 s (max)
Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for
High-Current-Rated Chip Fuses
1206 (3216mm) High-Current-Rated Chip Fuses
Shape and
Dimensions
in (mm)
0.063±0.008
(1.60±0.20)
Typical Electrical
Characteristics
Rated
Nominal
Nominal
Current
Cold DCR
I2t
(A2s)†
(A)
(Ω)*
0.126±0.008
(3.20±0.20)
Part Number
0.038±0.008
(0.97±0.20)
Voltage
(VDC)
Current
(A)
1206SFH100F/24
10
0.010
9
24
100
1206SFH120F/24
12
0.008
14
24
100
1206SFH150F/24
15
0.005
26
24
100
1206SFH200F/24
20
0.003
56
24
100
* Measured at #10% of rated current and 25°C ambient temperature.
† Melting I2t at 0.001 sec clear time.
0.020±0.010
(0.51±0.25)
Recommended
Pad Layout
in (mm)
Max
Interrupt Ratings
0.173
(4.40)
0.059
(1.50)
0.071
(1.80)
0.057
(1.45)
Figures FH1-FH2 Family Performance Curves for High-Current-Rated Chip Fuses
Figure FH1
Figure FH2
10
A
1206SFH I²t vs. t Curves
20
10
A
12
A
15
A
1206SFH Average Time Current Curves
10
10000
20A
15A
12A
10A
1000
I²t (A²s)
Clear Time (s)
1
0.1
0.01
100
10
0.001
10
100
Current (A)
1000
1
0.001
Note: Curves are nominal.
0.01
0.1
1
10
Time (s)
 Please go to page 129 for more information about High-Current-Rated Chip Fuses.
120
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-5-FH-HighCurrent.indd 120
HF Halogen Free
8/3/13 10:59 AM
Surface-Mount Fuses – Slow-Blow Chip Fuses
Surface-Mount Fuses
Slow-Blow Chip Fuses
Available in industry standard 1206 and 0603 chip sizes,
TE Circuit Protection’s slow-blow chip fuses help provide
overcurrent protection on systems that experience
large and frequent current surges as part of their
normal operation.
The slow-blow chip fuse’s monolithic, multilayer design
helps provide some of the highest current ratings
available in the 1206 and 0603 footprints and enhances
high-temperature performance in a wide range of
circuit protection designs. The devices’ small size, high
reliability and strong arc suppression characteristics
make them suitable for overcurrent protection of
power supplies, capacitor filter banks, Liquid Crystal
Display (LCD) backlight inverters, electric motors and
portable electronics.
Benefits
Features
• Time-delayed design help prevent nuisance openings
in pulsed and high inrush
current applications
• Lead-free materials and RoHS compliant
• Small size with high-current ratings
• Monolithic multilayer design
• Strong arc suppression characteristics
• High-temperature performance
• Halogen free
(refers to: Br#900ppm, Cl#900ppm, Br+Cl#1500ppm)
• -55°C to +125°C operating temperature range
10
Applications
• Small motor systems
• Power over Ethernet (PoE)
• Computer drives
• Portable electronics
• Test equipment
• Displays
• Input power ports
• POL converter protection
• Printers
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-6-FS-SlowBlow.indd 121
HF Halogen Free
121
9/11/13 2:00 PM
Table FS1 Clear Time Characteristics for Slow-Blow Chip Fuses
0603SFS Series
% of Rated Current
100%
200%
300%
800%(1.0A-1.5A)
800%(2.0A-5.0A)
Table FS2
1206SFS Series
Clear Time at 25°C
4 hrs (min)
1 s (min)
0.1 s (min)
0.0005 s (min)
0.001 s (min)
120 s (max)
3 s (max)
0.05 s (max)
0.05 s (max)
% of Rated Current
100%
200%
300%
800%(1.0A-1.5A)
800%(2.0A-8.0A)
Clear Time at 25°C
4 hrs (min)
1 s (min)
0.1 s (min)
0.0016 s (min)
0.002 s (min)
120 s (max)
3 s (max)
0.05 s (max)
0.05 s (max)
Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for
Slow-Blow Chip Fuses
0603 (1608mm) Slow-Blow Chip Fuses
Shape and
Dimensions
in (mm)
0.031±0.006
(0.80±0.15)
0.063±0.006
(1.60±0.15)
Part Number
0.031±0.006
(0.80±0.15)
Max
Interrupt Ratings
Voltage
(VDC)
Current
(A)
0603SFS100F/32
1.0
0.200
0.093
32
50
0603SFS150F/32
1.5
0.100
0.18
32
50
0603SFS200F/32
2.0
0.052
0.32
32
50
0603SFS250F/32
2.5
0.041
0.63
32
50
0.110
(2.80)
0603SFS300F/32
3.0
0.031
0.87
32
50
0.024
(0.60)
0603SFS350F/32
3.5
0.021
1.20
32
50
0603SFS400F/32
4.0
0.017
2.30
32
50
0603SFS450F/32
4.5
0.015
2.70
32
50
0603SFS500F/32
5.0
0.013
3.20
32
50
0.014±0.006
(0.36±0.15)
Recommended
Pad Layout
in (mm)
Typical Electrical
Characteristics
Rated
Nominal
Nominal
Current
Cold DCR
I2t
(A)
(Ω)*
(A2s)†
0.039
(1.00)
0.043
(1.09)
1206 (3216mm) Slow-Blow Chip Fuses
Shape and
Dimensions
in (mm)
10
0.063±0.008
(1.60±0.20)
0.126±0.008
(3.20±0.20)
Part Number
Max
Interrupt Ratings
Voltage
(VDC)
Current
(A)
1206SFS100F/63
1.0
0.360
0.11
63
50
1206SFS125F/63
1.25
0.200
0.22
63
50
1206SFS150F/63
1.5
0.150
0.23
63
50
1206SFS200F/63
2.0
0.088
0.63
63
50
1206SFS250F/32
2.5
0.065
0.90
32
50
1206SFS300F/32
3.0
0.034
1.20
32
50
1206SFS350F/32
3.5
0.028
1.60
32
50
0.173
(4.40)
1206SFS400F/32
4.0
0.024
2.20
32
50
0.059
(1.50)
1206SFS450F/32
4.5
0.020
3.60
32
50
1206SFS500F/32
5.0
0.016
5.30
32
50
1206SFS550F/24
5.5
0.014
6.40
24
50
1206SFS600F/24
6.0
0.011
8.50
24
60
1206SFS700F/24
7.0
0.010
10.00
24
60
1206SFS800F/24
8.0
0.009
16.90
24
60
0.038±0.008
(0.97±0.20)
0.020±0.010
(0.51±0.25)
Recommended
Pad Layout
in (mm)
Typical Electrical
Characteristics
Rated
Nominal
Nominal
Current
Cold DCR
I2t
(A)
(Ω)*
(A2s)†
0.071
(1.80)
0.057
(1.45)
* Measured at #10% of rated current and 25°C ambient temperature.
† Melting I2t at 0.001 s clear time.
122
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-6-FS-SlowBlow.indd 122
HF Halogen Free
8/3/13 11:00 AM
Surface-Mount Fuses – Slow-Blow Chip Fuses
Figures FS1-FS4 Family Performance Curves for Slow-Blow Chip Fuses
Figure FS1
A
2. 5
3.0A
A
3.5
A
4.0
A
4.5
A
5.0
A
2. 0
1.5
A
1.0
A
0603SFS Average Time Current Curves
100
Clear Time (s)
10
1
0.1
0.01
0.001
1
10
100
Current (A)
Figure FS2
0603SFS I²t vs. t Curves
10,000
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1000
1.0A
10
I2t (A2s)
100
10
1
0.1
0.01
0.001
0.01
0.1
1
10
100
Time (s)
Note: Curves are nominal.
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-6-FS-SlowBlow.indd 123
HF Halogen Free
123
8/3/13 11:00 AM
Figures FS1-FS4 Family Performance Curves for Slow-Blow Chip Fuses
Cont’d
Figure FS3
A
A
3.0
3 . 5A
4.0A
4.5A
5.0 A
5 . 5A
6 .0 A
7.0 A
A
8 .0
A
2. 5
2. 0
1. 2
5A
1.5
A
1.0
A
1206SFS Average Time Current Curves
100
10
Clear Time (s)
1
0.1
0.01
0.001
1
10
1000
100
Current (A)
Figure FS4
1206SFS I²t vs. t Curves
100000
8.0A
7.0A
6.0A
5.5A
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1.25A
1.0A
10000
10
1000
I2t (A2s)
100
10
1
0.1
0.01
0.001
0.01
0.1
1
10
100
Time (s)
Note: Curves are nominal
 Please go to page 129 for more information about Slow-Blow Chip Fuses.
124
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-6-FS-SlowBlow.indd 124
HF Halogen Free
8/3/13 11:00 AM
The
2410
(6125mm)
Wire-in-Air
(WIA)
NEW
SMD
Fuse is suitable for secondary-level overcurrent
protection applications.
These lead-free surface-mount devices offer increased
reliability and avoid the risk of end caps falling off. Their
straight wire element in air performs consistent fusing
and cutting characteristics.
Benefits
Surface-Mount Fuses – 2410 Very Fast-Acting Fuses
Surface-Mount Fuses
2410 Very Fast-Acting Fuses
Features
• Very fast acting at 200% overload current level
• Halogen free, RoHS compliant and 100% lead free
• Excellent inrush current withstand capability
• Copper or copper alloy composite fuse link
• High reliability and resilience
• Fiberglass enforced epoxy fuse body
• Strong arc suppression characteristics
• Wide range of current rating
• Copper terminal with nickel and tin plating
• -55°C to +125°C operating temperature range
(with de-rating)
10
Applications
• Industrial equipment
• Power supplier
• Game systems
• LCD/PDP TV
• Telecom system
• White goods
• Backlight inverter
• Networking
• Automotive
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-7-FV-2410-Very-Fast-Acting.indd 125
HF Halogen Free
125
8/3/13 11:00 AM
Table SFV1 Clear Time Characteristics for 2410 Very Fast-Acting Fuses
% of Rated Current
100%
200% (0.5A-10.0A)
200% (12.0A-20.0A)
Table SFV2
Clear Time at 25°C
4 hrs (min)
0.01 s (min)
0.01 s (min)
5 s (max)
20 s (max)
Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for
2410 Very Fast-Acting Fuses
2410 (6125mm) Very Fast-Acting Fuse
Recommended Pad Layout
mm (Inch)
Shape and Dimensions
mm (in)
A
D
A
C
B
mm
in
B
Min
Max
5.95
6.25
(0.234) (0.246)
C
Min
Max
1.96
2.36
(0.077) (0.093)
D
Min
Max
0.97
1.73
(0.038) (0.068)
Min
Max
2.34
2.64
8.60
(0.338)
(0.092) (0.104)
2.80
(0.110)
3.00
(0.118)
Voltage Rating (V)
Part Number
10
Marking
Code
Rated
Current (A)
Interrupt Rating
AC
DC
Nominal Cold
DC
Resistance
(DCR) (Ω)*
Nominal I2t
(A2s)
2410SFV0.50FM/125
C
0.5
250
125
0.231
0.1
2410SFV0.63FM/125
S
0.63
250
125
0.174
0.16
2410SFV0.75FM/125
D
0.75
250
125
0.148
0.23
2410SFV1.00FM/125
E
1
250
125
0.093
0.59
2410SFV1.25FM/125
F
1.25
250
125
0.07
0.96
2410SFV1.50FM/125
G
1.5
250
125
0.062
1.19
250
125
0.042
2.75
125
125
0.031
1.21
TUV:
0.5~2A
100A @ 250VAC
50A @ 125VDC
125
125
0.0249
1.73
125
125
0.0232
2.2
125
125
0.022
2.5
CQC:
0.5A, 1A, 2A
100A @ 250VAC
50A @ 125VDC
125
125
0.0172
4.1
2410SFV2.00FM/125
I
2
2410SFV2.50FM/125
J
2.5
2410SFV3.00FM/125
K
3
2410SFV3.15FM/125
V
3.15
2410SFV3.50FM/125
L
3.5
2410SFV4.00FM/125
M
4
2410SFV5.00FM/125
N
5
2410SFV6.30FM/125
O
6.3
2410SFV7.00FM/125
P
7
2410SFV8.00FM/125
R
8
2410SFV10.0FM/125
Q
10
2410SFV12.0FM/065
X
12
2410SFV15.0FM/065
Y
15
2410SFV20.0FM/065
Z
20
UL:
0.5~2A
100A @ 250VAC
2.5~8A
50A @ 125VAC
0.5~8A
50A @ 125VDC
300A @ 32VDC
UL:
35A @ 125VAC
50A @ 125VDC
300A @ 32VDC
UL:
50A @ 65VAC
50A @ 65VDC
300A @ 32VDC
UL:
50A @ 65VAC
100A @ 65VDC
300A @ 32VDC
125
125
0.0143
5.9
125
125
0.01
12.5
125
125
0.0094
14.2
125
125
0.0086
20.3
125
125
0.0066
29.2
65
65
0.0053
49.2
65
65
0.0038
102.5
65
65
0.0034
126.2
* Measured at ≤10% of rated current and 25°C ambient
126
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-7-FV-2410-Very-Fast-Acting.indd 126
HF Halogen Free
9/5/13 9:07 AM
Surface-Mount Fuses – 2410 Very Fast-Acting Fuses
Figures SFV1-SFV2 Family Performance Curves for 2410 Very Fast-Acting Fuses
Figure SFV1
1.0
0A
1. 2
1.55 A
0A
2. 0
2. 5 0 A
0
3.0 A
3.1 0A
3.55 A
4.0 0A
5.0 0A
0A
6.3
7.0 0A
0
8 .0 A
10 0A
.
12 0A
.
15 0A
.0A
20
.0A
3A
5A
0.7
0.6
0.5
0A
2410SFV Average Time Current Curves
100
10
Clear Time (s)
1
0.1
0.01
0.001
0.1
1
10
100
1000
Current (A)
Figure SFV2
2410SFV I2t vs. t Curves
20.0A
15.0A
12.0A
10.0A
8.00A
7.00A
6.30A
5.00A
4.00A
3.50A
3.15A
3.00A
2.50A
2.00A
1.50A
1.25A
1.00A
0.75A
0.63A
0.50A
100,000
10,000
1000
I2t (A2s)
100
10
10
1
0.1
0.01
0.001
0.01
0.1
1
10
100
Time (s)
Note: Curves are nominal.
 Please go to page 129 for more information about 2410 Fast-Acting Fuses.
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-7-FV-2410-Very-Fast-Acting.indd 127
HF Halogen Free
127
8/3/13 11:00 AM
10
128
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-7-FV-2410-Very-Fast-Acting.indd 128
HF Halogen Free
8/3/13 11:00 AM
Surface-Mount Fuses - Specifications for All Fuses
Specifications, Packaging Information, Agency Approvals and
Part Numbering Systems for All Fuses
Table F1 Environmental Specifications for All Fuses
Operating Temperature
-55°C to +125°C
Mechanical Vibration
Withstands 5-3000 Hz at 30Gs when evaluated per Method 204 of MIL-STD-202
Mechanical Shock
Withstands 1500Gs, 0.5 millisecond half-sine pulses when evaluated per Method 213 of MIL-STD-202
Thermal Shock
Withstands 100 cycles from -65°C to +125°C when evaluated per Method 107 of MIL-STD-202
Resistance to Soldering Heat
Withstands 60 seconds at +260°C when evaluated per Method 210 of MIL-STD-202
Solderability
Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202
Moisture Resistance
Withstands 10 cycles when evaluated per Method 106 of MIL-STD-202
Salt Spray
Storage Temperature
Storage Humidity
Withstands 48-hour exposure when evaluated per Method 101 of MIL-STD-202
#30°C/ 85% RH
Per MIL-STD-202F, Method 106F
Table F2 Material Specifications for All Fuses
Construction Body Material
Termination Material
Fuse Element
Ceramic (1206/0603/0402); Fiberglass/Epoxy (2410)
Silver, Nickel, Tin
Silver(1206/0603/0402); Copper/Copper Alloy (2410)
Figure F1 Thermal Derating Current for All Fuses
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-55
2410 Series
Temperature Effect on Current Rating
110
105
100
10
95
90
% Derating
% Derating
1206/0603/0402 Series
Temperature Effect on Current Rating
85
80
75
70
65
60
55
-35
-15
5
25
45
65
85
105
125
145
Maximum Operating Temperature (˚C)
50
-55
-35
5
-15
25
45
65
85
105
125
Maximum Operating Temperature (˚C)
Table F3 Electrical Specifications for All Fuses
Insulation Resistance after Opening
20,000Ω minimum @ rated voltage. Fuse clearing under low-voltage conditions may result in lower
post-clearing insulation values. Under normal fault conditions TE Circuit Protection fuses help
provide sufficient insulation resistance for circuit protection.
Current Carrying Capacity
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-8-General.indd 129
Withstands 100% rated current at +25°C ambient for 4 hours when evaluated per MIL-PRF-23419.
HF Halogen Free
129
8/3/13 11:00 AM
Table F4 Packaging Information for All Fuses
Size
Reel Quantity
(pcs)
Reel Diameter
Carrier
Tape Size
Reel Width
Tape Type
Reels per Outside
Shipment Box
Outside Shipment
Boxes per Overpack
0402 (1005)
10,000
178mm White Plastic
9.0 ± 0.5mm
8.00 ± 0.10mm
Paper
5
1 to 10
0603 (1608)
4,000
178mm White Plastic
9.0 ± 0.5mm
8.00 ± 0.10mm
Paper
5
1 to 10
0603SFV (1608)
6,000
178mm White Plastic
9.0 ± 0.5mm
8.00 ± 0.10mm
Paper
5
1 to 10
1206 (3216)
3,000
178mm White Plastic
9.0 ± 0.5mm
8.00 ± 0.10mm
Plastic
5
1 to 10
2410 (6125)
2,000
178mm White Plastic
13.4 ± 0.5mm
12.00 ± 0.10mm
Plastic
4
1 to 10
Figure F2 Recommended Soldering Temperature Profile for All Fuses
tp
Tp
Critical Zone
TL to Tp
Ramp Up
Temperature
TL
tL
Ts MAX
Ts MIN
ts
Preheat
25
Reflow Profile
Ramp Down
t 25˚C to Peak
Time
Classification Reflow Profiles
Profile Feature
Average Ramp Up Rate (TsMAX to Tp)
Preheat
• Temperature min (TsMIN)
• Temperature max (TsMAX)
• Time (tsMIN to tsMAX)
Time Maintained Above:
• Temperature (TL)
• Time (tL)
Peak/Classification Temperature (Tp)
Time Within 5°C of Actual Peak Temperature
Time (tp)
From 25°C to Preheating (150°C)
Ramp Down Rate
10
1206/0603/0402
3°C/second max
2410
3°C/second max
150°C
200°C
60-180 seconds
150°C
200°C
40-100 seconds
217°C
60-150 seconds
260°C max
200°C
30-90 seconds
250°C max
20-40 seconds
8 minutes max
4°C/seconds max
30-40 seconds
40-100 seconds
Natural Cooling
Recommended Conditions for Hand Soldering:
1. Using a hot air rework station that can reflow the solder on both terminations at the same time is strongly
recommended; do not directly contact the chip termination with the tip of soldering iron.
2. Preheating: 150°C, 60s (min)
Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C /3s.
130
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-8-General.indd 130
HF Halogen Free
8/3/13 11:00 AM
Dimension in in (mm)
0402 (1005)
0603 (1608)
1206 (3216)
0603SFV (1608)
2410 (6125)
E1
Mark
0.069 ± 0.004
0.069 ± 0.004
0.069 ± 0.004
0.069 ± 0.004
0.069 ± 0.004
(1.75 ± 0.10)
(1.75 ± 0.10)
(1.75 ± 0.10)
(1.75 ± 0.10)
(1.75 ± 0.10)
F
0.138 ± 0.002
0.138 ± 0.002
0.138 ± 0.002
0.138 ± 0.002
0.217 ± 0.004
(3.50 ± 0.05)
(3.50 ± 0.05)
(3.50 ± 0.05)
(3.50 ± 0.05)
(5.50 ± 0.10)
W
0.315 ± 0.004
0.315 ± 0.004
0.315 ± 0.004
0.315 ± 0.004
0.472 ± 0.004
(8.00 ± 0.10)
(8.00 ± 0.10)
(8.00 ± 0.10)
(8.00 ± 0.10)
(12.00 ± 0.10)
P1
0.079 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
(2.00 ± 0.10)
(4.00 ± 0.10)
(4.00 ± 0.10)
(4.00 ± 0.10)
(4.00 ± 0.10)
P0
0.157 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
(4.00 ± 0.10)
(4.00 ± 0.10)
(4.00 ± 0.10)
(4.00 ± 0.10)
(4.00 ± 0.10)
P2
0.079 ± 0.002
0.079 ± 0.002
0.079 ± 0.002
0.079 ± 0.002
0.079 ± 0.004
(2.00 ± 0.05)
(2.00 ± 0.05)
(2.00 ± 0.05)
(2.00 ± 0.05)
(2.00 ± 0.10)
D0
0.059 ± 0.004
0.059 ± 0.004
0.059 ± 0.004
0.059 ± 0.004
0.059 ± 0.004
(1.50+0.10/-0.00)
(1.50+0.10/-0.00)
(1.50+0.10/-0.00)
(1.50+0.10/-0.00)
(1.50+0.10/-0.00)
D1
—
—
0.039 max
—
0.61 ± 0.004
t
—
—
0.009 ± 0.001
—
0.010 ± 0.002
A0
0.026 ± 0.004
0.039 ± 0.004
0.071 ± 0.004
0.039 ± 0.004
0.112 ± 0.004
(0.67 ± 0.10)
(0.98 ± 0.10)
(1.80 ± 0.10)
(0.98 ± 0.10)
(2.85 ± 0.10)
B0
0.046 ± 0.004
0.071 ± 0.004
0.138 ± 0.004
0.071 ± 0.004
0.252 ± 0.004
(1.17 ± 0.10)
(1.80 ± 0.10)
(3.50 ± 0.10)
(1.80 ± 0.10)
(6.40 ± 0.10)
K0
0.025 ± 0.004
0.037 ± 0.003
0.050 ± 0.004
0.024 ± 0.003
0.093 ± 0.004
(0.63 ± 0.10)
(0.95 ± 0.08)
(1.27 ± 0.10)
(0.60 ± 0.08)
(2.35 ± 0.10)
(1.00 max)
(1.55 ± 0.10)
(0.23 ± 0.02)
(0.25 ± 0.05)
Surface-Mount Fuses - Specifications for All Fuses
(Cont’d)
Table F4 Packaging Information for All Fuses
Figure F3 Component Tape Dimensions for All Fuses
Paper Carrier Tape Specifications
P0
D0
P2
10
E1
F
W
B0
P1
D1
A0
K0
Plastic Carrier Tape Specifications
D0
P0
t
P2
E1
F
W
B0
D1
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-8-General.indd 131
HF Halogen Free
P1
A0
K0
131
8/3/13 11:00 AM
Figure F4 Reel Dimensions for All Fuses
Dimension
Description
Hub Outer Diameter
Dimension (mm)
Mark
1206/0603/0402
2410
B
60
60.2
Reel Inside Width
W1
9
13.4
Reel Outside Width
W2
11.4
16
Tape Width
W2
B
8
W1
Agency Approvals for All Fuses
UL: All fuses
CQC: File # 12012078873 (for 2410SFV 0.5A, 1A, 2A)
TUV: File # 50236400 (for 2410SFV 0.5A, 0.63A, 1A, 1.25A, 2A)
Part Numbering System for Fast-Acting, Slow-Blow and 0603 Very Fast-Acting Chip Fuses
1206 SF F 400 F / 24 -2
Packaging
-2 = Tape and Reel
Typical Voltage Rating
24 = 24VDC
Special Code
F = RoHS Compliant
FM = RoHS Compliant + Marked Part
Rated Current
050 = 0.50A
400 = 4A
Fuse Blow Type
F = Fast Acting
S = Slow Blow
10
SF = Surface-Mount Fuse
Size (1206, 0603, 0402)
Part Numbering System for High-Current-Rated Chip Fuses
1206 SF H 100 F / 24 -2
Packaging
-2 = Tape and Reel
Typical Voltage Rating
24 = 24VDC
Special Code
F = RoHS Compliant
FM = RoHS Compliant + Marked Part
Rated Current
100 = 10A
Fuse Blow Type
H = High Current
SF = Surface-Mount Fuse
Size (1206)
132
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-8-General.indd 132
HF Halogen Free
8/3/13 11:00 AM
2410 SF V 6.30 FM / 125 -2
Packaging
-2 = Tape and Reel
Typical Voltage Rating
125 = 125VDC
Special Code
F = RoHS Compliant
M = Marked Part
Rated Current
6.30 = 6.30A
Fuse Blow Type
V = Very Fast-Acting
SF = Surface-Mount Fuse
Size (0.24*0.10in)
Surface-Mount Fuses - Specifications for All Fuses
Part Numbering System for 2410 Very Fast-Acting Fuses
10
Notice :
Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability and test each product
selected for their own applications. Tyco Electronics Corporation and its affiliates in the TE Connectivity Ltd. group of companies (“TE”) reserves
the right to change or update, without notice, any information contained in this publication; to change, without notice, the design, construction,
processing, or specification of any product; and to discontinue or limit production or distribution of any product. This publication supersedes
and replaces all information previously supplied. Without express written consent by an officer of TE, TE does not authorize the use of any of
its products as components in nuclear facility applications, aerospace, or in critical life support devices or systems. TE expressly disclaims all
implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness
for a particular purpose. TE’s only obligations are those in the TE Standard Terms and Conditions of Sale and in no case will TE be liable for any
incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of its products.
RoHS Compliant, ELV Compliant
2013_CP_S10-Fuses-8-General.indd 133
HF Halogen Free
133
8/3/13 11:00 AM
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
TE Connectivity:
2410SFV6.30FM/125-2
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement