NXP LPC2109FBD64 Single-chip 16/32-bit microcontrollers; 64/128/256 kB ISP/IAP flash Data Sheet

LPC2109/2119/2129

Single-chip 16/32-bit microcontrollers; 64/128/256 kB ISP/IAP flash with 10-bit ADC and CAN

Rev. 7 — 14 June 2011 Product data sheet

The LPC2109/2119/2129 are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 64/128/256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty.

With their compact 64-pin package, low power consumption, various 32-bit timers,

4-channel 10-bit ADC, two advanced CAN channels, PWM channels and 46 fast GPIO lines with up to nine external interrupt pins these microcontrollers are particularly suitable for automotive and industrial control applications, as well as medical systems and fault-tolerant maintenance buses. With a wide range of additional serial communications interfaces, they are also suited for communication gateways and protocol converters as well as many other general-purpose applications.

Remark: Throughout the data sheet, the term LPC2109/2119/2129 will apply to devices with and without the /00 or /01 suffixes. The /00 or the /01 suffix will be used to differentiate from other devices only when necessary.

2. Features and benefits

2.1 Key features brought by LPC2109/2119/2129/01 devices

 Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original device.

They also allow for a port pin to be read at any time regardless of its function.

 Dedicated result registers for ADC(s) reduce interrupt overhead. The ADC pads are

5 V tolerant when configured for digital I/O function(s).

 UART0/1 include fractional baud rate generator, auto-bauding capabilities and handshake flow-control fully implemented in hardware.

 Buffered SSP serial controller supporting SPI, 4-wire SSI, and Microwire formats.

 SPI programmable data length and master mode enhancement.

 Diversified Code Read Protection (CRP) enables different security levels to be implemented. This feature is available in LPC2109/2119/2129/00 devices as well.

 General purpose timers can operate as external event counters.

2.2 Key features common for all devices

 16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package.

 8/16 kB on-chip SRAM.

NXP Semiconductors

LPC2109/2119/2129

Single-chip 16/32-bit microcontrollers

 64/128/256 kB on-chip flash program memory. 128-bit wide interface/accelerator enables high speed 60 MHz operation.

 In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software. Flash programming takes 1 ms per 512 B line. Single sector or full chip erase takes 400 ms.

 EmbeddedICE-RT interface enables breakpoints and watch points. Interrupt service routines can continue to execute while the foreground task is debugged with the on-chip RealMonitor software.

 Embedded Trace Macrocell (ETM) enables non-intrusive high speed real-time tracing of instruction execution.

 Two interconnected CAN interfaces (one for LPC2109) with advanced acceptance filters.

 Four-channel 10-bit A/D converter with conversion time as low as 2.44

s.

 Multiple serial interfaces including two UARTs (16C550), Fast I 2 C-bus (400 kbit/s) and two SPIs.

 60 MHz maximum CPU clock available from programmable on-chip Phase-Locked

Loop with settling time of 100

s.

 Vectored Interrupt Controller with configurable priorities and vector addresses.

 Two 32-bit timers (with four capture and four compare channels), PWM unit (six outputs), Real-Time Clock (RTC) and watchdog.

 Up to forty-six 5 V tolerant general purpose I/O pins. Up to nine edge or level sensitive external interrupt pins available.

 On-chip crystal oscillator with an operating range of 1 MHz to 30 MHz.

 Two low power modes, Idle and Power-down.

 Processor wake-up from Power-down mode via external interrupt.

 Individual enable/disable of peripheral functions for power optimization.

 Dual power supply:

 CPU operating voltage range of 1.65 V to 1.95 V (1.8 V

 0.15 V).

 I/O power supply range of 3.0 V to 3.6 V (3.3 V

 10 %) with 5 V tolerant I/O pads.

Table 1.

Ordering information

Type number Package

Name

LPC2109FBD64/01 LQFP64

LPC2119FBD64/01

LPC2129FBD64/01

LQFP64

LQFP64

Description plastic low profile quad flat package; 64 leads; body 10

 10  1.4 mm plastic low profile quad flat package; 64 leads; body 10

 10  1.4 mm plastic low profile quad flat package; 64 leads; body 10

 10  1.4 mm

Version

SOT314-2

SOT314-2

SOT314-2

LPC2109_2119_2129

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 7 — 14 June 2011

© NXP B.V. 2011. All rights reserved.

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LPC2109/2119/2129


3.1 Ordering options

Table 2.

Ordering options

Type number Flash memory

LPC2109FBD64/01 64 kB

LPC2119FBD64/01 128 kB

LPC2129FBD64/01 256 kB

RAM

8 kB

16 kB

16 kB

CAN

1 channel

2 channels

2 channels

Fast GPIO/

SSP/

Enhanced

UART, ADC,

Timer

Temperature range yes yes yes

40 C to +85 C

40 C to +85 C

40 C to +85 C

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LPC2109/2119/2129


TRST

TMS

(2)

(2)

TCK

TDI

(2)

(2)

RTCK

TDO

(2)

XTAL2

XTAL1 RESET

P0[30:27],

P0[25:0]

P1[31:16]

LPC2109

LPC2119

LPC2129

HIGH-SPEED

GPI/O

(4)

46 PINS TOTAL

ARM7 LOCAL BUS

TEST/DEBUG

INTERFACE

ARM7TDMI-S

AHB BRIDGE system clock

PLL

SYSTEM

FUNCTIONS

VECTORED

INTERRUPT

CONTROLLER

AMBA Advanced High-performance

Bus (AHB)

V

DD(3V3)

V

DD(1V8)

V

SS

EINT[3:0]

(1)

4 × CAP0

4

×

CAP1

(1)

(1)

4 × MAT0

(1)

4

×

MAT1

(1)

AIN[3:0]

(1)

P0[30:27],

P0[25:0]

P1[31:16]

PWM[6:1]

(1)

INTERNAL

SRAM

CONTROLLER

INTERNAL

FLASH

CONTROLLER

8/16 kB

SRAM

64/128/256 kB

FLASH

EXTERNAL

INTERRUPTS

CAPTURE/

COMPARE

TIMER 0/TIMER 1

A/D CONVERTER

AHB TO APB

BRIDGE

APB

DIVIDER

AHB

DECODER

I

2

C-BUS SERIAL

INTERFACE

SPI1/SSP

(4)

SERIAL

INTERFACE

SPI0 SERIAL

INTERFACE

UART0/UART1

SCL

(1)

SDA

(1)

SCK1

(1)

MOSI1

(1)

MISO1

(1)

SSEL1

(1)

SCK0

(1)

MOSI0

(1)

MISO0

(1)

SSEL0

(1)

TXD[1:0]

(1)

RXD[1:0]

(1)

DSR1

(1)

, CTS1

(1)

,

RTS1

(1)

, DTR1

(1)

,

DCD1

(1)

, RI1

(1)

GENERAL

PURPOSE I/O

PWM0

WATCHDOG

TIMER

SYSTEM

CONTROL

RD[2:1]

(1)

TD[2:1]

(1)

CAN INTERFACE 1 AND 2

ACCEPTANCE FILTERS

(3)

REAL-TIME CLOCK

002aad172

(1) Shared with GPIO.

(2) When test/debug interface is used, GPIO/other functions sharing these pins are not available.

(3) Only 1 for LPC2109.

(4) SSP interface and high-speed GPIO are available on LPC2109/01, LPC2119/01, and LPC2129/01 only.

Fig 1.

Block diagram

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5.1 Pinning

LPC2109/2119/2129


P0[21]/PWM5/CAP1[3]

P0[22]/CAP0[0]/MAT0[0]

P0[23]/RD2

(1)

P1[19]/TRACEPKT3

P0[24]/TD2

(1)

V

SS

V

DDA(3V3)

P1[18]/TRACEPKT2

P0[25]/RD1

TD1

P0[27]/AIN0/CAP0[1]/MAT0[1]

P1[17]/TRACEPKT1

P0[28]/AIN1/CAP0[2]/MAT0[2]

P0[29]/AIN2/CAP0[3]/MAT0[3]

P0[30]/AIN3/EINT3/CAP0[0]

P1[16]/TRACEPKT0

13

14

15

16

9

10

11

12

7

8

5

6

3

4

1

2

LPC2109

LPC2119

LPC2129 (2)

36

35

34

33

40

39

38

37

44

43

42

41

48

47

46

45

P1[20]/TRACESYNC

P0[17]/CAP1[2]/SCK1/MAT1[2]

P0[16]/EINT0/MAT0[2]/CAP0[2]

P0[15]/RI1/EINT2

P1[21]/PIPESTAT0

V

DD(3V3)

V

SS

P0[14]/DCD1/EINT1

P1[22]/PIPESTAT1

P0[13]/DTR1/MAT1[1]

P0[12]/DSR1/MAT1[0]

P0[11]/CTS1/CAP1[1]

P1[23]/PIPESTAT2

P0[10]/RTS1/CAP1[0]

P0[9]/RXD1/PWM6/EINT3

P0[8]/TXD1/PWM4

002aad173

(1) No TD2 and RD2 for LPC2109.

(2) Pin configuration is identical for devices with and without /00 and /01 suffixes.

Fig 2.

Pin configuration

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LPC2109/2119/2129


P0[0]/TXD0/

PWM1

P0[1]/RXD0/

PWM3/EINT0

P0[2]/SCL/

CAP0[0]

P0[3]/SDA/

MAT0[0]/EINT1

P0[4]/SCK0/

CAP0[1]

P0[5]/MISO0/

MAT0[1]

P0[6]/MOSI0/

CAP0[2]

P0[7]/SSEL0/

PWM2/EINT2

P0[8]/TXD1/

PWM4

P0[9]/RXD1/

PWM6/EINT3

P0[10]/RTS1/

CAP1[0]

P0[11]/CTS1/

CAP1[1]

P0[12]/DSR1/

MAT1[0]

P0[13]/DTR1/

MAT1[1]

P0[14]/DCD1/

EINT1

5.2 Pin description

Table 3.

Pin description

Symbol

P0[0] to P0[31]

Pin

19

21

22

26

27

29

30

31

33

34

35

37

38

39

41

I

I

I

O

O

O

I

I

I

O

I

O

I

O

I

O

I

O

O

O

I

O

Type Description

I/O Port 0 is a 32-bit bidirectional I/O port with individual direction controls for each bit.

The operation of port 0 pins depends upon the pin function selected via the Pin

Connect Block. Pins 26 and 31 of port 0 are not available.

TXD0 — Transmitter output for UART0.

PWM1 — Pulse Width Modulator output 1.

RXD0 — Receiver input for UART0.


I EINT0 — External interrupt 0 input

I/O SCL — I 2 C-bus clock input/output. Open-drain output (for I 2 C-bus compliance).

I CAP0[0] — Capture input for Timer 0, channel 0.

I/O SDA — I 2 C-bus data input/output. Open-drain output (for I 2 C-bus compliance).

I

O MAT0[0] — Match output for Timer 0, channel 0.

EINT1 — External interrupt 1 input.

I

I/O SCK0 — Serial clock for SPI0. SPI clock output from master or input to slave.

CAP0[1] — Capture input for Timer 0, channel 1.

I/O MISO0 — Master In Slave OUT for SPI0. Data input to SPI master or data output from SPI slave.

I


I/O MOSI0 — Master Out Slave In for SPI0. Data output from SPI master or data input to SPI slave.


SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave.



TXD1 — Transmitter output for UART1.


RXD1 — Receiver input for UART1.



RTS1 — Request to Send output for UART1.


CTS1 — Clear to Send input for UART1.


DSR1 — Data Set Ready input for UART1.

MAT1[0] — Match output for Timer 1, channel 0.

DTR1 — Data Terminal Ready output for UART1.


DCD1 — Data Carrier Detect input for UART1.


Note: LOW on this pin while RESET is LOW forces on-chip bootloader to take control of the part after reset.

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LPC2109/2119/2129


Table 3.

Pin description …continued

Symbol Pin

P0[15]/RI1/EINT2 45 I

Type Description

RI1 — Ring Indicator input for UART1.

P0[16]/EINT0/

MAT0[2]/CAP0[2]

46

I

I

O




P0[17]/CAP1[2]/

SCK1/MAT1[2]

P0[18]/CAP1[3]/

MISO1/MAT1[3]

P0[19]/MAT1[2]/

MOSI1/CAP1[2]

P0[20]/MAT1[3]/

SSEL1/EINT3

47

53

54

55



I/O SCK1 — Serial Clock for SPI1/SSP

[1]

. SPI clock output from master or input to slave.



I/O MISO1 — Master In Slave Out for SPI1/SSP

[1]

. Data input to SPI master or data output from SPI slave.

I

I

I

O



I/O

MOSI1 — Master Out Slave In for SPI1/SSP [1]

. Data output from SPI master or data input to SPI slave.



SSEL1 — Slave Select for SPI1/SSP

[1] . Selects the SPI interface as a slave.


P0[21]/PWM5/

CAP1[3]

P0[22]/CAP0[0]/

MAT0[0]

P0[23]/RD2

P0[24]/TD2

P0[25]/RD1

P0[27]/AIN0/

CAP0[1]/MAT0[1]

P0[28]/AIN1/

CAP0[2]/MAT0[2]

P0[29]/AIN2/

CAP0[3]/MAT0[3]

P0[30]/AIN3/

EINT3/CAP0[0]

P1[0] to P1[31]

1

2

3

5

9

11

13

14

15

I

O

I

O

I

I

I

O

I

I

I

O

I

O

I

O





CAN2 receiver input (not available on LPC2109).

CAN2 transmitter output (not available on LPC2109).

CAN1 receiver input.

AIN0 — A/D converter, input 0. This analog input is always connected to its pin.







CAP0[3] — Capture input for Timer 0, Channel 3.


I

I AIN3 — A/D converter, input 3. This analog input is always connected to its pin.



I/O Port 1 is a 32-bit bidirectional I/O port with individual direction controls for each bit.

The operation of port 1 pins depends upon the pin function selected via the Pin

Connect Block. Pins 0 through 15 of port 1 are not available.

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LPC2109/2119/2129


Table 3.


Symbol Pin Type Description

P1[16]/

TRACEPKT0

16 O Trace Packet, bit 0. Standard I/O port with internal pull-up.


P1[17]/

TRACEPKT1

P1[18]/

TRACEPKT2


P1[19]/

TRACEPKT3

P1[20]/

TRACESYNC

4

48

44

O

O

O

Trace Packet, bit 3. Standard I/O port with internal pull-up.

Trace Synchronization. Standard I/O port with internal pull-up.

Note: LOW on this pin while RESET is LOW, enables pins P1[25:16] to operate as

Trace port after reset.

Pipeline Status, bit 0. Standard I/O port with internal pull-up.

P1[21]/

PIPESTAT0

P1[22]/

PIPESTAT1

P1[23]/

PIPESTAT2

P1[24]/

TRACECLK

P1[25]/EXTIN0

P1[26]/RTCK

40

36

32

28

24

O

O

O



Trace Clock. Standard I/O port with internal pull-up.

P1[27]/TDO

P1[28]/TDI

P1[29]/TCK

P1[30]/TMS

P1[31]/TRST

TD1

RESET

XTAL1

XTAL2

V

SS

V

SSA

64

60

56

52

20

10

57

62

61

6, 18, 25,

42, 50

59 I

I

I

O

I

I

I

O

I

I

I External Trigger Input. Standard I/O with internal pull-up.

I/O Returned Test Clock output. Extra signal added to the JTAG port. Assists debugger synchronization when processor frequency varies. Bidirectional pin with internal pull-up.

Note: LOW on this pin while RESET is LOW, enables pins P1[31:26] to operate as

Debug port after reset.

O Test Data out for JTAG interface.

Test Data in for JTAG interface.

Test Clock for JTAG interface. This clock must be slower than 1 ⁄

6

of the CPU clock

(CCLK) for the JTAG interface to operate.

Test Mode Select for JTAG interface.

Test Reset for JTAG interface.

CAN1 transmitter output.

External reset input; a LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant.

Input to the oscillator circuit and internal clock generator circuits.

Output from the oscillator amplifier.

Ground: 0 V reference.

V

V

SSA(PLL)

DD(1V8)

58

17, 49 I

I

Analog ground; 0 V reference. This should nominally be the same voltage as V

SS

, but should be isolated to minimize noise and error.

PLL analog ground; 0 V reference. This should nominally be the same voltage as

V

SS

, but should be isolated to minimize noise and error.

1.8 V core power supply; this is the power supply voltage for internal circuitry.

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LPC2109/2119/2129


Table 3.


Symbol Pin Type Description

V

DDA(1V8)

63 I

V

DD(3V3)

V

DDA(3V3)

23, 43, 51

7 I

I

Analog 1.8 V core power supply; this is the power supply voltage for internal circuitry. This should be nominally the same voltage as V

DD(1V8)

but should be isolated to minimize noise and error.

3.3 V pad power supply; this is the power supply voltage for the I/O ports.

Analog 3.3 V pad power supply; this should be nominally the same voltage as

V

DD(3V3)

but should be isolated to minimize noise and error.

[1] SSP interface available on LPC2109/01, LPC2119/01, and LPC2129/01 only.

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LPC2109/2119/2129


LPC2109_2119_2129


Details of the LPC2109/2119/2129 systems and peripheral functions are described in the following sections.

6.1 Architectural overview

The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on

Reduced Instruction Set Computer (RISC) principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed Complex

Instruction Set Computers. This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core.

Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory.

The ARM7TDMI-S processor also employs a unique architectural strategy known as

Thumb, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue.

The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the

ARM7TDMI-S processor has two instruction sets:

• The standard 32-bit ARM set.

• A 16-bit Thumb set.

The Thumb set’s 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining most of the ARM’s performance advantage over a traditional 16-bit processor using 16-bit registers. This is possible because Thumb code operates on the same 32-bit register set as ARM code.

Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the performance of an equivalent ARM processor connected to a 16-bit memory system.

6.2 On-chip flash program memory

The LPC2109/2119/2129 incorporate a 64/128/256 kB flash memory system, respectively.

This memory may be used for both code and data storage. Programming of the flash memory may be accomplished in several ways. It may be programmed In System via the serial port. The application program may also erase and/or program the flash while the application is running, allowing a great degree of flexibility for data storage field firmware upgrades, etc. When on-chip bootloader is used, 60/120/248 kB of flash memory is available for user code.

The LPC2109/2119/2129 flash memory provides a minimum of 100000 erase/write cycles and 20 years of data retention.

On-chip bootloader (as of revision 1.60) provides Code Read Protection (CRP) for the

LPC2109/2119/2129 on-chip flash memory. When the CRP is enabled, the JTAG debug port and ISP commands accessing either the on-chip RAM or flash memory are disabled.


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LPC2109/2119/2129


However, the ISP flash erase command can be executed at any time (no matter whether the CRP is on or off). Removal of CRP is achieved by erasure of full on-chip user flash.

With the CRP off, full access to the chip via the JTAG and/or ISP is restored.

6.3 On-chip SRAM

On-chip SRAM may be used for code and/or data storage. The SRAM may be accessed as 8 bit, 16 bit, and 32 bit. The LPC2109/2119/2129 provide 8 kB of SRAM for the

LPC2109 and 16 kB for the LPC2119 and LPC2129.

6.4 Memory map

The LPC2109/2119/2129 memory maps incorporate several distinct regions, as shown in

Figure 3

.

In addition, the CPU interrupt vectors may be re-mapped to allow them to reside in either

flash memory (the default) or on-chip SRAM. This is described in Section 6.18 “System control”

.

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4.0 GB

3.75 GB

3.5 GB

3.0 GB

LPC2109/2119/2129


AHB PERIPHERALS

APB PERIPHERALS

0xFFFF FFFF

0xF000 0000

0xEFFF FFFF

0xE000 0000

0xDFFF FFFF

0xC000 0000

RESERVED ADDRESS SPACE

2.0 GB

BOOT BLOCK (RE-MAPPED FROM

ON-CHIP FLASH MEMORY)


16 kB ON-CHIP STATIC RAM (LPC2119/2129)

8 kB ON-CHIP STATIC RAM (LPC2109)

1.0 GB

0x8000 0000

0x7FFF FFFF

0x7FFF E000

0x7FFF DFFF

0x4000 4000

0x4000 3FFF

0x4000 1FFF

0x4000 0000

0x3FFF FFFF

0.0 GB


256 kB ON-CHIP FLASH MEMORY (LPC2129)



0x0004 0000

0x0003 FFFF

0x0002 0000

0x0001 FFFF

0x0001 0000

0x0000 FFFF

0x0000 0000

002aad174

Fig 3.

LPC2109/2119/2129 memory map

LPC2109_2119_2129


6.5 Interrupt controller

The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and categorizes them as Fast Interrupt reQuest (FIQ), vectored Interrupt reQuest (IRQ), and non-vectored IRQ as defined by programmable settings. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted.

FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC combines the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ latency is achieved when only one request is classified as FIQ because then the FIQ service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt.


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LPC2109/2119/2129


Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned to this category. Any of the interrupt requests can be assigned to any of the 16 vectored

IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest.

Non-vectored IRQs have the lowest priority.

The VIC combines the requests from all the vectored and non-vectored IRQs to produce the IRQ signal to the ARM processor. The IRQ service routine can start by reading a register from the VIC and jumping there. If any of the vectored IRQs are requesting, the

VIC provides the address of the highest-priority requesting IRQs service routine, otherwise it provides the address of a default routine that is shared by all the non-vectored

IRQs. The default routine can read another VIC register to see what IRQs are active.

6.5.1 Interrupt sources

Table 4 lists the interrupt sources for each peripheral function. Each peripheral device has

one interrupt line connected to the Vectored Interrupt Controller, but may have several internal interrupt flags. Individual interrupt flags may also represent more than one interrupt source.

Table 4.

Interrupt sources

Block Flag(s)

WDT

-

ARM Core

ARM Core

Timer 0

Watchdog Interrupt (WDINT)

Reserved for software interrupts only

EmbeddedICE, DbgCommRx

Timer 1

UART0

EmbeddedICE, DbgCommTx

Match 0 to 3 (MR0, MR1, MR2, MR3)

Capture 0 to 3 (CR0, CR1, CR2, CR3)

Match 0 to 3 (MR0, MR1, MR2, MR3)

Capture 0 to 3 (CR0, CR1, CR2, CR3)

Rx Line Status (RLS)

Transmit Holding Register empty (THRE)

Rx Data Available (RDA)

Character Time-out Indicator (CTI)

UART1

PWM0

I 2 C-bus

SPI0

SPI1 and SSP [1]

PLL

RTC

Rx Line Status (RLS)

Transmit Holding Register empty (THRE)

Rx Data Available (RDA)

Character Time-out Indicator (CTI)

Modem Status Interrupt (MSI)

Match 0 to 6 (MR0, MR1, MR2, MR3, MR4, MR5, MR6)

SI (state change)

SPIF, MODF

SPIF, MODF and TXRIS, RXRIS, RTRIS, RORRIS

PLL Lock (PLOCK)

RTCCIF (Counter Increment), RTCALF (Alarm)

11

12

13

8

9

10

3

4

1

2

VIC channel #

0

5

6

7

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Table 4.

Interrupt sources …continued

Block Flag(s)

System Control External Interrupt 0 (EINT0)

ADC

CAN

External Interrupt 1 (EINT1)



A/D Converter

CAN1, CAN2 and Acceptance Filter

[1] SSP interface available on LPC2109/01, LPC2119/01, and LPC2129/01 only.

VIC channel #

14

15

16

17

18

19 to 23

6.6 Pin connect block

The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on-chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined.

6.7 General purpose parallel I/O (GPIO) and Fast I/O

Device pins that are not connected to a specific peripheral function are controlled by the parallel I/O registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back, as well as the current state of the port pins.

6.7.1 Features

• Bit-level set and clear registers allow a single instruction set or clear of any number of bits in one port.

• Direction control of individual bits.

• Separate control of output set and clear.

• All I/O default to inputs after reset.

6.7.2 Features added with the Fast GPIO set of registers available on

LPC2109/2119/2129/01 only

• Fast GPIO registers are relocated to the ARM local bus for the fastest possible I/O timing, enabling port pin toggling up to 3.5 times faster than earlier LPC2000 devices.

• Mask registers allow treating sets of port bits as a group, leaving other bits unchanged.

• All Fast GPIO registers are byte addressable.

• Entire port value can be written in one instruction.

• Ports are accessible via either the legacy group of registers (GPIOs) or the group of registers providing accelerated port access (Fast GPIOs).

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6.8 10-bit ADC

The LPC2109/2119/2129 each contain a single 10-bit successive approximation ADC with four multiplexed channels.

6.8.1 Features

• Measurement range of 0 V to 3 V.

• Capable of performing more than 400000 10-bit samples per second.

• Burst conversion mode for single or multiple inputs.

• Optional conversion on transition on input pin or Timer Match signal.

6.8.2 ADC features available in LPC2109/2119/2129/01 only

• Every analog input has a dedicated result register to reduce interrupt overhead.

• Every analog input can generate an interrupt once the conversion is completed.

• The ADC pads are 5 V tolerant when configured for digital I/O function(s).

6.9 CAN controllers and acceptance filter

The LPC2119 and LPC2129 each contain two CAN controllers, while the LPC2109 has one CAN controller. The CAN is a serial communications protocol which efficiently supports distributed real-time control with a very high level of security. Its domain of application ranges from high-speed networks to low-cost multiplex wiring.

6.9.1 Features

• Data rates up to 1 Mbit/s on each bus.

• 32-bit register and RAM access.

• Compatible with CAN specification 2.0 B, ISO 11898-1.

• Global Acceptance Filter recognizes 11-bit and 29-bit Rx identifiers for all CAN buses.

• Acceptance Filter can provide FullCAN-style automatic reception for selected

Standard identifiers.

6.10 UARTs

The LPC2109/2119/2129 each contain two UARTs. In addition to standard transmit and receive data lines, the UART1 also provides a full modem control handshake interface.

6.10.1 Features

• 16 B Receive and Transmit FIFOs.

• Register locations conform to 16C550 industry standard.

• Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.

• Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values.

• Transmission FIFO control enables implementation of software (XON/XOFF) flow control on both UARTs.

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• UART1 is equipped with standard modem interface signals. This module also provides full support for hardware flow control (auto-CTS/RTS).

6.10.2 UART features available in LPC2109/2119/2129/01 only

Compared to previous LPC2000 microcontrollers, UARTs in LPC2109/2119/2129/01 introduce a fractional baud rate generator for both UARTs, enabling these microcontrollers to achieve standard baud rates such as 115200 Bd with any crystal frequency above

2 MHz. In addition, auto-CTS/RTS flow-control functions are fully implemented in hardware.

• Fractional baud rate generator enables standard baud rates such as 115200 Bd to be achieved with any crystal frequency above 2 MHz.

• Auto-bauding.

• Auto-CTS/RTS flow-control fully implemented in hardware.

6.11 I 2 C-bus serial I/O controller

The I 2 C-bus is a bidirectional bus for inter-IC control using only two wires: a serial clock line (SCL), and a serial data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g. an LCD driver or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I 2 C-bus is a multi-master bus; it can be controlled by more than one bus master connected to it.

The I 2 C-bus implemented in LPC2109/2119/2129 supports a bit rate up to 400 kbit/s (Fast

I 2 C-bus).

6.11.1 Features

• Standard I 2 C-bus compliant interface.

• Easy to configure as Master, Slave, or Master/Slave.

• Programmable clocks allow versatile rate control.

• Bidirectional data transfer between masters and slaves.

• Multi-master bus (no central master).

• Arbitration between simultaneously transmitting masters without corruption of serial data on the bus.

• Serial clock synchronization allows devices with different bit rates to communicate via one serial bus.

• Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer.

• The I 2 C-bus may be used for test and diagnostic purposes.

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6.12 SPI serial I/O controller

The LPC2109/2119/2129 each contain two SPIs. The SPI is a full duplex serial interface, designed to be able to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends a byte of data to the slave, and the slave always sends a byte of data to the master.

6.12.1 Features

• Compliant with Serial Peripheral Interface (SPI) specification.

• Synchronous, Serial, Full Duplex communication.

• Combined SPI master and slave.

• Maximum data bit rate of 1 ⁄

8

of the input clock rate.

6.12.2 Features available in LPC2109/2119/2129/01 only

• Eight to 16 bits per frame.

• When the SPI interface is used in Master mode, the SSELn pin is not needed (can be used for a different function).

6.13 SSP controller (LPC2109/2119/2129/01 only)

Remark: This peripheral is available in LPC2109/2119/2129/01 only.

The SSP is a controller capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. Data transfers are in principle full duplex, with frames of four to 16 bits of data flowing from the master to the slave and from the slave to the master.

While the SSP and SPI1 peripherals share the same physical pins, it is not possible to have both of these two peripherals active at the same time. Application can switch on the fly from SPI1 to SSP and back.

6.13.1 Features

• Compatible with Motorola’s SPI, Texas Instrument’s 4-wire SSI, and National

Semiconductor’s Microwire buses.

• Synchronous serial communication.

• Master or slave operation.

• 8-frame FIFOs for both transmit and receive.

• Four to 16 bits per frame.

6.14 General purpose timers

The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an externally supplied clock and optionally generate interrupts or perform other actions at specified timer values, based on four match registers. It also includes four capture inputs

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Single-chip 16/32-bit microcontrollers to trap the timer value when an input signal transitions, optionally generating an interrupt.

Multiple pins can be selected to perform a single capture or match function, providing an application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them.

6.14.1 Features

• A 32-bit Timer/Counter with a programmable 32-bit Prescaler.

• Timer or external event counter operation

• Four 32-bit capture channels per timer that can take a snapshot of the timer value when an input signal transitions. A capture event may also optionally generate an interrupt.

• Four 32-bit match registers that allow:

– Continuous operation with optional interrupt generation on match.

– Stop timer on match with optional interrupt generation.

– Reset timer on match with optional interrupt generation.

• Four external outputs per timer corresponding to match registers, with the following capabilities:

– Set LOW on match.

– Set HIGH on match.

– Toggle on match.

– Do nothing on match.

6.14.2 Features available in LPC2109/2119/2129/01 only

The LPC2109/2119/2129/01 can count external events on one of the capture inputs if the external pulse lasts at least one half of the period of the PCLK. In this configuration, unused capture lines can be selected as regular timer capture inputs, or used as external interrupts.

• Timer can count cycles of either the peripheral clock (PCLK) or an externally supplied clock.

• When counting cycles of an externally supplied clock, only one of the timer’s capture inputs can be selected as the timer’s clock. The rate of such a clock is limited to

PCLK / 4. Duration of HIGH/LOW levels on the selected CAPn input cannot be shorter than 1 / (2PCLK).

6.15 Watchdog timer

The purpose of the watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the watchdog will generate a system reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined amount of time.

6.15.1 Features

• Internally resets chip if not periodically reloaded.

• Debug mode.

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• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled.

• Incorrect/incomplete feed sequence causes reset/interrupt if enabled.

• Flag to indicate watchdog reset.

• Programmable 32-bit timer with internal pre-scaler.

• Selectable time period from (T cy(PCLK)

T cy(PCLK)

 4.

 256  4) to (T cy(PCLK)

 2 32  4) in multiples of

6.16 Real-time clock

The RTC is designed to provide a set of counters to measure time when normal or idle operating mode is selected. The RTC has been designed to use little power, making it suitable for battery powered systems where the CPU is not running continuously (Idle mode).

6.16.1 Features

• Measures the passage of time to maintain a calendar and clock.

• Ultra low power design to support battery powered systems.

• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and

Day of Year.

• Programmable reference clock divider allows adjustment of the RTC to match various crystal frequencies.

6.17 Pulse width modulator

The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2109/2119/2129. The Timer is designed to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The

PWM function is also based on match register events.

The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions.

Two match registers can be used to provide a single edge controlled PWM output. One match register (MR0) controls the PWM cycle rate, by resetting the count upon match.

The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an MR0 match occurs.

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Three match registers can be used to provide a PWM output with both edges controlled.

Again, the MR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs.

With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge).

6.17.1 Features

• Seven match registers allow up to six single edge controlled or three double edge controlled PWM outputs, or a mix of both types.

• The match registers also allow:

– Continuous operation with optional interrupt generation on match.

– Stop timer on match with optional interrupt generation.

– Reset timer on match with optional interrupt generation.

• Supports single edge controlled and/or double edge controlled PWM outputs. Single edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the output is a constant LOW. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses.

• Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate.

• Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses.

• Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses. Software must ‘release’ new match values before they can become effective.

• May be used as a standard timer if the PWM mode is not enabled.

• A 32-bit Timer/Counter with a programmable 32-bit Prescaler.

6.18 System control

6.18.1 Crystal oscillator

The oscillator supports crystals in the range of 1 MHz to 30 MHz. The oscillator output frequency is called f osc

and the ARM processor clock frequency is referred to as CCLK for purposes of rate equations, etc.. f osc

and CCLK are the same value unless the PLL is running and connected. Refer to

Section 6.18.2 “PLL”

for additional information.

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6.18.2 PLL

The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input frequency is multiplied up into the range of 10 MHz to 60 MHz with a Current Controlled

Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within its frequency range while the PLL is providing the desired output frequency. The output divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed following a chip Reset and may be enabled by software. The program must configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a clock source. The PLL settling time is 100

s.

6.18.3 Reset and wake-up timer

Reset has two sources on the LPC2109/2119/2129: the RESET pin and Watchdog Reset.

The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of chip Reset by any source starts the Wake-up Timer (see Wake-up Timer description below), causing the internal chip reset to remain asserted until the external Reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the on-chip flash controller has completed its initialization.

When the internal Reset is removed, the processor begins executing at address 0, which is the Reset vector. At that point, all of the processor and peripheral registers have been initialized to predetermined values.

The wake-up timer ensures that the oscillator and other analog functions required for chip operation are fully functional before the processor is allowed to execute instructions. This is important at power on, all types of Reset, and whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the Wake-up Timer.

The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is safe to begin code execution. When power is applied to the chip, or some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of V

DD

ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing ambient conditions.

6.18.4 Code security (Code Read Protection - CRP)

This feature of the LPC2109/2119/2129 allows the user to enable different levels of security in the system so that access to the on-chip flash and use of the JTAG and ISP can be restricted. When needed, CRP is invoked by programming a specific pattern into a dedicated flash location. IAP commands are not affected by the CRP.

There are three levels of the Code Read Protection.

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CAUTION

LPC2109/2119/2129


CRP1 disables access to chip via the JTAG and allows partial flash update (excluding flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is required and flash field updates are needed but all sectors can not be erased.

CRP2 disables access to chip via the JTAG and only allows full flash erase and update using a reduced set of the ISP commands.

Running an application with level CRP3 selected fully disables any access to chip via the

JTAG pins and the ISP. This mode effectively disables ISP override using P0[14] pin, too.

It is up to the user’s application to provide (if needed) flash update mechanism using IAP calls or call reinvoke ISP command to enable flash update via UART0.

If level three Code Read Protection (CRP3) is selected, no future factory testing can be performed on the device.

Remark: Devices without the suffix /00 or /01 have only a security level equivalent to

CRP2 available.

6.18.5 External interrupt inputs

The LPC2109/2119/2129 include up to nine edge or level sensitive External Interrupt

Inputs as selectable pin functions. When the pins are combined, external events can be processed as four independent interrupt signals. The External Interrupt Inputs can optionally be used to wake up the processor from Power-down mode.

6.18.6 Memory mapping control

The Memory Mapping Control alters the mapping of the interrupt vectors that appear beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip flash memory, or to the on-chip SRAM. This allows code running in different memory spaces to have control of the interrupts.

6.18.7 Power control

The LPC2109/2119/2129 support two reduced power modes: Idle mode and Power-down mode. In Idle mode, execution of instructions is suspended until either a Reset or interrupt occurs. Peripheral functions continue operation during Idle mode and may generate interrupts to cause the processor to resume execution. Idle mode eliminates power used by the processor itself, memory systems and related controllers, and internal buses.

In Power-down mode, the oscillator is shut down and the chip receives no internal clocks.

The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Power-down mode and the logic levels of chip output pins remain static. The Power-down mode can be terminated and normal operation resumed by either a Reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Power-down mode reduces chip power consumption to nearly zero.

A Power Control for Peripherals feature allows individual peripherals to be turned off if they are not needed in the application, resulting in additional power savings.

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6.18.8 APB

The APB divider determines the relationship between the processor clock (CCLK) and the clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first is to provide peripherals with the desired PCLK via APB so that they can operate at the speed chosen for the ARM processor. In order to achieve this, the APB may be slowed down to 1 ⁄

2

to 1 ⁄

4

of the processor clock rate. Because the APB must work properly at power-up (and its timing cannot be altered if it does not work since the APB divider control registers reside on the APB), the default condition at reset is for the APB to run at 1 ⁄

4

of the processor clock rate. The second purpose of the APB divider is to allow power savings when an application does not require any peripherals to run at the full processor rate.

Because the APB divider is connected to the PLL output, the PLL remains active (if it was running) during Idle mode.

6.19 Emulation and debugging

The LPC2109/2119/2129 support emulation and debugging via a JTAG serial port. A trace port allows tracing program execution. Debugging and trace functions are multiplexed only with GPIOs on Port 1. This means that all communication, timer and interface peripherals residing on Port 0 are available during the development and debugging phase as they are when the application is run in the embedded system itself.

6.19.1 EmbeddedICE

Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an

EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the Remote

Debug Protocol commands to the JTAG data needed to access the ARM core.

The ARM core has a Debug Communication Channel function built-in. The debug communication channel allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or even entering the debug state. The debug communication channel is accessed as a co-processor 14 by the program running on the ARM7TDMI-S core. The debug communication channel allows the JTAG port to be used for sending and receiving data without affecting the normal program flow. The debug communication channel data and control registers are mapped in to addresses in the EmbeddedICE logic.

The JTAG clock (TCK) must be slower than 1 ⁄

6

of the CPU clock (CCLK) for the JTAG interface to operate.

6.19.2 Embedded trace macrocell

Since the LPC2109/2119/2129 have significant amounts of on-chip memory, it is not possible to determine how the processor core is operating simply by observing the external pins. The ETM provides real-time trace capability for deeply embedded processor cores. It outputs information about processor execution to the trace port.

The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port. An external trace port analyzer must capture the trace information under software debugger control.

Instruction trace (or PC trace) shows the flow of execution of the processor and provides a list of all the instructions that were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the

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Single-chip 16/32-bit microcontrollers pipeline status on a cycle by cycle basis. Trace information generation can be controlled by selecting the trigger resource. Trigger resources include address comparators, counters and sequencers. Since trace information is compressed the software debugger requires a static image of the code being executed. Self-modifying code can not be traced because of this restriction.

6.19.3 RealMonitor

RealMonitor is a configurable software module, developed by ARM Inc., which enables real time debug. It is a lightweight debug monitor that runs in the background while users debug their foreground application. It communicates with the host using the DCC (Debug

Communications Channel), which is present in the EmbeddedICE logic. The

LPC2109/2119/2129 contain a specific configuration of RealMonitor software programmed into the on-chip flash memory.

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Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

[1]

Symbol Parameter supply voltage (1.8 V)

Conditions

V

DD(1V8)

V

DD(3V3)

V

DDA(3V3)

V

IA

V

I supply voltage (3.3 V) analog supply voltage (3.3 V) analog input voltage input voltage 5 V tolerant I/O pins other I/O pins supply current I

DD

I

SS

T j

T stg

P tot(pack)

V esd ground current junction temperature storage temperature total power dissipation (per package) based on package heat transfer, not device power consumption electrostatic discharge voltage human body model; all pins

[2]

[3]

[4][5]

[4][6]

Min

0.5

0.5

0.5

0.5

0.5

0.5

[7][8]

-

[8][9]

-

[10]

-

65

-

[11]

2000

Max

+2.5

+3.6

+4.6

+5.1

+6.0

V

DD(3V3)

100

100

150

+150

1.5

+2000

+ 0.5

V

V

V mA mA

C

C

W

V

V

Unit

V

V

[1] The following applies to

Table 5

: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.

b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V

SS

unless otherwise noted.

[2] Internal rail.

[3] External rail.

[4] Including voltage on outputs in 3-state mode.

[5] Only valid when the V

DD(3V3)

supply voltage is present.

[6] Not to exceed 4.6 V.

[7] Per supply pin.

[8] The peak current is limited to 25 times the corresponding maximum current.

[9] Per ground pin.

[10] Dependent on package type.

[11] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k

 series resistor.

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Table 6.

Static characteristics

T amb

=



40



C to +85



C for industrial applications, unless otherwise specified.

Symbol Parameter Conditions Min

[2]

1.65

V

DD(1V8) supply voltage (1.8 V)

V

DD(3V3) supply voltage (3.3 V)

V

DDA(3V3) analog supply voltage

(3.3 V)

[3]

3.0

2.5

I

I

V

I

V

O

V

IH

V

IL

V hys

V

OH

V

OL

I

OH

I

OL

I

OHS

I

Standard port pins, RESET, RTCK

I

IL

I

IH

I

OZ latch

LOW-level input current V

HIGH-level input current V

I

I

= 0 V; no pull-up

= V

DD(3V3)

; no pull-down

OFF-state output current V

O

= 0 V; V

O

= V no pull-up/down

DD(3V3)

;

I/O latch-up current

(0.5V

DD(3V3)

) < V

I

<

(1.5V

DD(3V3)

); T j

< 125

C input voltage output voltage

HIGH-level input voltage

LOW-level input voltage hysteresis voltage

HIGH-level output voltage I output active

LOW-level output voltage I

OL

HIGH-level output current

LOW-level output current V

HIGH-level short-circuit output current

OH

V

V

OH

OL

OH

=

4 mA

= 4 mA

= V

DD(3V3)

= 0.4 V

= 0 V

 0.4 V

I

OLS

V

OL

= V

DD(3V3) pd pu

LOW-level short-circuit output current pull-down current pull-up current

V

V

I

I

= 5 V

= 0 V

V

DD(3V3)

< V

I

< 5 V

-

-

[4][5][6]

0

0

-

2.0

[7]

[7]

[7]

[7]

[8]

-

-

0.4

-

V

DD(3V3)

 0.4 -

-

4

-

4 -

-

-

-

-

-

[8]

-

-

-

-

100

[9]

[10]

10

15

[9]

0

-

-

-

Typ

[1]

1.8

3.3

3.3

50

50

0

Max

1.95

3.6

3.6

-

3

3

3

5.5

-

V

DD(3V3)

0.8

-

-

0.4

-

-

45

50

150

85

0 mA

A

A

A

V

V mA mA mA

V

V

V

V

V

A

A

A mA

V

V

Unit

V

LPC2109_2119_2129



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V

IH

V

IL

V hys

V

OL

I

LI

Table 6.

Static characteristics …continued

T amb

=



40



C to +85





Power consumption LPC2109/00, LPC2119, LPC2119/00, LPC2129, LPC2129/00

I

DD(act) active mode supply current

V

DD(1V8)

= 1.8 V;

CCLK = 60 MHz;

T amb

= 25

C; code while(1){} executed from flash; all peripherals enabled via

PCONP [11]

register but not configured to run

I

I

DD(pd)

Power-down mode supply current

V

DD(1V8)

= 1.8 V;

T amb

= 25

C

V

DD(1V8)

T amb

= 1.8 V;

= 85

C

Power consumption LPC2109/01, LPC2119/01, LPC2129/01

DD(act) active mode supply current

V

DD(1V8)

= 1.8 V;

CCLK = 60 MHz;

T amb

= 25

C; code while(1){} executed from flash; all peripherals enabled via

PCONP [11]


I

DD(idle)

Idle mode supply current V

DD(1V8)

= 1.8 V;

CCLK = 60 MHz;

T amb

= 25

C; executed from flash; all peripherals enabled via

PCONP [11]


I

DD(pd)

Power-down mode supply current

V

DD(1V8)

= 1.8 V;

T amb

= 25

C

V

DD(1V8)

= 1.8 V;

T amb

= 85

C

I 2 C-bus pins

-

-

-

-

-

-

HIGH-level input voltage

LOW-level input voltage hysteresis voltage

LOW-level output voltage I

OLS

= 3 mA input leakage current V

I

= V

DD(3V3)

V

I

= 5 V

[7]

[12]

-

-

-

-

-

0.7V

DD(3V3)

Typ [1]

60

10

110

41.5

9

10

110

-

-

-

-

-

Max

500

500

Unit mA

A

A mA mA

A

A

-

0.3V

DD(3V3)

-

0.05V

DD(3V3)

-

0.4

2

10

4

22

V

V

V

V

A

A

LPC2109_2119_2129



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LPC2109/2119/2129


Table 6.

Static characteristics …continued

T amb

=



40



C to +85





Oscillator pins

0 V i(XTAL1) input voltage on pin

XTAL1

V o(XTAL2) output voltage on pin

XTAL2

0 -

-

Typ [1]

[1] Typical ratings are not guaranteed. The values listed are at room temperature (25

C), nominal supply voltages.

[2] Internal rail.

[3] External rail.

[4] Including voltage on outputs in 3-state mode.

[5] V

DD(3V3)

supply voltages must be present.

[6] 3-state outputs go into 3-state mode when V

DD(3V3)

is grounded.

[7] Accounts for 100 mV voltage drop in all supply lines.

[8] Only allowed for a short time period.

[9] Minimum condition for V

I

= 4.5 V, maximum condition for V

I

= 5.5 V.

[10] Applies to P1[25:16].

[11] See LPC2119/2129/2194/2292/2294 User Manual.

[12] To V

SS

.

Max

1.8

1.8

Unit

V

V

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LPC2109/2119/2129


Table 7.

ADC static characteristics

V

DDA

= 2.5 V to 3.6 V unless otherwise specified; T

4.5 MHz.

amb

=



40



C to +85



C unless otherwise specified. ADC frequency

Conditions Symbol

V

IA

C ia

E

D

E

L(adj)

E

O

E

G

E

T

Parameter analog input voltage analog input capacitance differential linearity error integral non-linearity offset error gain error absolute error

[1][2][3]

-

[1][4]

-

[1][5]

-

[1][6]

-

[1][7]

-

-

Min

0

-

-

-

-

-

-

-

Typ Max

V

DDA

1

1

2

3

0.5

4

Unit

V pF

LSB

LSB

LSB

%

LSB

[1] Conditions: V

SSA

= 0 V, V

DDA

= 3.3 V.

[2] The ADC is monotonic, there are no missing codes.

[3] The differential linearity error (E

D

) is the difference between the actual step width and the ideal step width. See

Figure 4 .

[4] The integral non-linearity (E

L(adj)

) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See

Figure 4 .

[5] The offset error (E

O

) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the

ideal curve. See Figure 4

.

[6] The gain error (E

G

) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset

error, and the straight line which fits the ideal transfer curve. See Figure 4

.

[7] The absolute voltage error (E

T

) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See

Figure 4 .

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LPC2109/2119/2129

Single-chip 16/32-bit microcontrollers offset error

E

O gain error

E

G

1023

1022

1021

1020

1019

1018

(2) code out

7

6

5

(5)

4

3

(4)

(3)

2

1

0

1 2 3 4

1 LSB

(ideal)

5 6 7

V

IA

(LSB ideal

) offset error

E

O

(1) Example of an actual transfer curve.

(2) The ideal transfer curve.

(3) Differential linearity error (E

D

).

(4) Integral non-linearity (E

L(adj)

).

(5) Center of a step of the actual transfer curve.

Fig 4.

ADC characteristics

(1)

1018 1019 1020 1021 1022 1023 1024

1 LSB =

V

DDA

−

V

SSA

1024

002aaa668

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LPC2109/2119/2129


8.1 Power consumption measurements for LPC2109/01, LPC2119/01,

LPC2129/01 devices

The power consumption measurements represent typical values for the given conditions.

The peripherals were enabled through the PCONP register, but for these measurements, the peripherals were not configured to run. Peripherals were disabled through the PCONP register. Refer to the LPC2119/2129/2194/2292/2294 User Manual for a description of the

PCONP register.

002aad127

45

I

DD(act)

(mA)

35 all peripherals enabled all peripherals disabled

25

15

5

12 20 28 36 44

Test conditions: Active mode entered executing code from on-chip flash; PCLK =

CCLK

⁄

4

;

T amb

= 25

C; core voltage 1.8 V.

Fig 5.

Typical LPC2109/01 I

DD(act)

measured at different frequencies

45

I

DD(act)

(mA)

35

60 MHz

48 MHz

52 frequency (MHz)

60

002aad128

25

15

12 MHz

5

1.65

1.70

1.75

1.80

1.85

Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK ⁄

4

;

T amb

= 25

C; core voltage 1.8 V; all peripherals enabled.

Fig 6.


DD(act)

measured at different voltages

1.90

voltage (V)

1.95

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LPC2109/2119/2129


10

I

DD(idle)

(mA)

8

6

4

2 all peripherals enabled all peripherals disabled

0

12 20 28 36 44

Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK ⁄

4

;

T amb

= 25


Fig 7.


DD(idle)


10

I

DD(idle)

(mA)

7.5

60 MHz

48 MHz

5.0

002aad129

52 frequency (MHz)

60

002aad130

2.5

12 MHz

0

1.65

1.70

1.75

1.80

1.85

Test conditions: Idle mode entered executing code from on-chip flash; PCLK =

CCLK

⁄

4

;

T amb

= 25


Fig 8.


DD(idle)


1.90

voltage (V)

1.95

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LPC2109/2119/2129

Single-chip 16/32-bit microcontrollers all peripherals enabled all peripherals disabled

002aad131

45

I

DD(act)

(mA)

35

25

15

5

12 20 28 36 44


4

;

T amb

= 25


Fig 9.

Typical LPC2119/01 and LPC2129/01 I

DD(act)


50

I

DD(act)

(mA)

40

60 MHz

48 MHz

30

52 frequency (MHz)

60

002aad132

20

10

12 MHz

0

1.65

1.70

1.75

1.80

1.85

Test conditions: Active mode entered executing code from on-chip flash; PCLK =

CCLK

⁄

4

;

T amb

= 25


Fig 10. Typical LPC2119/01 and LPC2129/01 I

DD(act)


1.90

voltage (V)

1.95

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LPC2109/2119/2129

Single-chip 16/32-bit microcontrollers all peripherals enabled all peripherals disabled

002aad133

10

I

DD(idle)

(mA)

8

6

4

2

0

12 20 28 36 44

Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK ⁄

4

;

T amb

= 25



DD(idle)


10

I

DD(idle)

(mA)

8

60 MHz

48 MHz

52 frequency (MHz)

60

002aad134

6

4

2

12 MHz

0

1.65

1.70

1.75

1.80

1.85


CCLK

⁄

4

;

T amb

= 25



DD(idle)


1.90

voltage (V)

1.95

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LPC2109/2119/2129


60 MHz

48 MHz

002aad135

45

I

DD(act)

(mA)

35

25

15

12 MHz

5

1.65

1.70

1.75

1.80

1.85

1.90

voltage (V)

1.95


4

;

Temp = 25

C; core voltage 1.8 V; all peripherals disabled.

Fig 13. Typical LPC2109/01, LPC2119/01, and LPC2129/01 I

DD(act)


002aad136

8

I

DD(idle)

(mA)

6 60 MHz

48 MHz

4

2

12 MHz

0

1.65

1.70

1.75

1.80

1.85

1.90

voltage (V)

1.95


CCLK

⁄

4

;

Temp = 25

C; core voltage 1.8 V; all peripherals disabled.


DD(idle)


LPC2109_2119_2129



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LPC2109/2119/2129


60 MHz

48 MHz

002aad137

45

I

DD(act)

(mA)

35

25

15

12 MHz

5

− 40 − 15 10 35 60 temperature (

°

C)

85


4

; core voltage 1.8 V; all peripherals disabled.


DD(act)

measured at different temperatures

002aad138

6

I

DD(idle)

(mA)

5

60 MHz

48 MHz

4

3

2

12 MHz

1

−

40

−

15 10 35 60 temperature ( ° C)

85


CCLK

⁄

4

; core voltage 1.8 V; all peripherals disabled.


DD(idle)


LPC2109_2119_2129



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LPC2109/2119/2129


1.95 V

1.8 V

1.65 V

002aad139

200

I

DD(pd)

(

μ

A)

160

120

80

40

0

− 40 − 15 10 35 60 temperature (

°

C)

85

Test conditions: Power-down mode entered executing code from on-chip flash.

Fig 17. Typical LPC2109/01, LPC2119/01, and LPC2129/01 core power-down current I

DD(pd)


Timer0

Timer1

UART0

UART1

PWM0

I 2 C-bus

SPI0/1

RTC

ADC

CAN1

Table 8.

Typical LPC2109/01 peripheral power consumption in active mode

Core voltage 1.8 V; T amb

= 25



C; all measurements in



A; PCLK = CCLK ⁄

4

.

Peripheral CCLK = 12 MHz CCLK = 48 MHz CCLK = 60 MHz

103

9

6

16

43

46

98

103

33

230

341

37

27

55

141

150

320

351

128

764

407

53

29

78

184

180

398

421

167

914

LPC2109_2119_2129



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LPC2109/2119/2129


Timer0

Timer1

UART0

UART1

PWM0

I 2 C-bus

SPI0/1

RTC

ADC

CAN1/2

Table 9.

Typical LPC2119/01 and LPC2129/01 peripheral power consumption in active mode

Core voltage 1.8 V; T amb

= 25



C; all measurements in



A; PCLK = CCLK ⁄

4

.

Peripheral CCLK = 12 MHz CCLK = 48 MHz CCLK = 60 MHz

103

9

6

16

43

46

98

103

33

229

341

37

27

55

141

150

320

351

128

771

407

53

29

78

184

180

398

421

167

914

LPC2109_2119_2129



Rev. 7 — 14 June 2011


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LPC2109/2119/2129


Table 10.

Dynamic characteristics

T amb

=



40



C to +85



C for industrial applications; V

DD(1V8)

, V

DD(3V3)

over specified ranges.

[1]

Symbol Parameter Conditions Min Typ

External clock f osc oscillator frequency 1 supplied by an external oscillator (signal generator) external clock frequency supplied by an external crystal oscillator external clock frequency if on-chip PLL is used external clock frequency if on-chip bootloader is used for initial code download

1

10

10 -

-

-

T cy(clk) t

CHCX t

CLCX t

CLCH clock cycle time clock HIGH time clock LOW time clock rise time t

CHCL clock fall time

Port pins (except P0[2] and P0[3]) t r rise time t f fall time

I 2 C-bus pins (P0[2] and P0[3]) t f fall time V

IH

to V

IL

-

-

-

-

20

T cy(clk)

 0.4

-

T cy(clk)

 0.4

-

-

-

-

[2]

20 + 0.1

 C b

-

10

10

[1] Parameters are valid over operating temperature range unless otherwise specified.

[2] Bus capacitance C b

in pF, from 10 pF to 400 pF.

Max

50

30

Unit

MHz

MHz

25

25

-

-

-

-

5

-

1000

5 ns ns ns ns ns ns ns ns

MHz

MHz

LPC2109_2119_2129



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LPC2109/2119/2129


9.1 Timing t

CHCL t

CLCX

T cy(clk) t

CHCX t

CLCH

002aaa907

Fig 18. External clock timing (with an amplitude of at least V i(RMS)

= 200 mV)

LPC2109_2119_2129



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LPC2109/2119/2129


10. Package outline

LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 c y

X

A

49

48 33

32 Z E

64

1 e pin 1 index b p

D

H

D w

M e

E

H

E w M b p

16

Z D

17 v M A

B v M B

A

A

2

A

1 detail X

L

L p

θ

0 2.5

scale

5 mm

DIMENSIONS (mm are the original dimensions)

UNIT

A max.

A

1

A

2

A

3 b p c mm 1.6

0.20

0.05

1.45

1.35

0.25

0.27

0.17

0.18

0.12

D

(1)

E

(1)

10.1

9.9

10.1

9.9

e H

D

H

E

0.5

12.15

11.85

12.15

11.85

L

1

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

L p

0.75

0.45

v

0.2

w y

0.12

0.1

Z

D

(1)

Z

E

(1)

1.45

1.05

1.45

1.05

θ

7 o

0 o

OUTLINE

VERSION

SOT314-2

IEC

136E10

REFERENCES

JEDEC JEITA

MS-026

EUROPEAN

PROJECTION

ISSUE DATE

00-01-19

03-02-25

Fig 19. Package outline SOT314-2 (LQFP64)

LPC2109_2119_2129



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LPC2109/2119/2129


11. Abbreviations

DCC

FIFO

GPIO

I/O

PLL

PWM

RAM

SPI

Table 11.

Abbreviations

Acronym

ADC

Description

Analog-to-Digital Converter

AMBA

APB

CAN

CPU

Advanced Microcontroller Bus Architecture

Advanced Peripheral Bus

Controller Area Network

Central Processing Unit

SRAM

SSI

SSP

TTL

UART

Debug Communications Channel

First In, First Out

General Purpose Input/Output

Input/Output

Phase-Locked Loop

Pulse Width Modulator

Random Access Memory

Serial Peripheral Interface

Static Random Access Memory

Synchronous Serial Interface

Synchronous Serial Port

Transistor-Transistor Logic

Universal Asynchronous Receiver/Transmitter

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LPC2109/2119/2129


12. Revision history

Table 12.

Revision history

Document ID Release date Data sheet status Change notice Supersedes

LPC2109_2119_2129 v.7

20110614

Modifications:

Product data sheet 201004021F LPC2109_2119_2129 v.6

•

Table 6 “Static characteristics”

; Changed /01 Power-down mode supply current (I from 180

A to 500 A for industrial temperature range.

DD(pd)

)

•


; Moved V hys

voltage from typical to minimum.

•


; Changed I 2 C pad hysteresis from 0.5V

DD(3V3)

to

0.05V

DD(3V3)

.

LPC2109_2119_2129 v.6

20071210

Modifications:

Product data sheet LPC2109_2119_2129 v.5

•

Type number LPC2109FBD64/01 has been added.

•


•


•

Details introduced with /01 devices on new peripherals/features (Fast I/O Ports, SSP, CRP) and enhancements to existing ones (UART0/1, Timers, ADC, and SPI) have been added.

•

Power measurements for LPC2109/2119/2129/01 devices have been added.

•

Description of JTAG pin TCK has been updated.

LPC2109_2119_2129 v.5

20070627 Product data sheet LPC2119_2129 v.4

LPC2119_2129 v.4

20060714 Product data sheet LPC2119_2129 v.3

LPC2119_2129 v.3

LPC2119_2129 v.2

LPC2119_2129 v.1

20041222

20040202

20031118

Product data

Preliminary data

Preliminary data

-

-

-

LPC2119_2129 v.2

LPC2119_2129 v.1

LPC2109_2119_2129



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LPC2109/2119/2129


13. Legal information

Document status

[1][2]

Objective [short] data sheet

Product status

[3]

Development

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

Definition

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com

.

13.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the

Product data sheet.

13.3 Disclaimers

Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or

LPC2109_2119_2129



Rev. 7 — 14 June 2011 malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.


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LPC2109/2119/2129


Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

14. Contact information

own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

I 2 C-bus — logo is a trademark of NXP B.V.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

LPC2109_2119_2129



Rev. 7 — 14 June 2011


45 of 46


LPC2109/2119/2129


15. Contents

1

2

2.1

2.2

3

3.1

4

5

5.1

5.2

6

6.1

6.2

6.3

6.4

6.5

6.5.1

6.6

6.7

6.7.1

6.7.2

6.8

6.8.1

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Key features brought by

LPC2109/2119/2129/01 devices. . . . . . . . . . . . 1

Key features common for all devices . . . . . . . . 1

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pinning information . . . . . . . . . . . . . . . . . . . . . . 5

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6

Functional description . . . . . . . . . . . . . . . . . . 10

Architectural overview . . . . . . . . . . . . . . . . . . 10

On-chip flash program memory . . . . . . . . . . . 10

On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 11

Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 11

Interrupt controller . . . . . . . . . . . . . . . . . . . . . 12

Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 13

Pin connect block . . . . . . . . . . . . . . . . . . . . . . 14

General purpose parallel I/O (GPIO) and

Fast I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Features added with the Fast GPIO set of registers available on

LPC2109/2119/2129/01 only . . . . . . . . . . . . . 14

10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.9

6.9.1

LPC2109/2119/2129/01 only . . . . . . . . . . . . . 15

CAN controllers and acceptance filter . . . . . . 15

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.10 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.10.2 UART features available in

LPC2109/2119/2129/01 only . . . . . . . . . . . . . 16

6.11 I 2

C-bus serial I/O controller . . . . . . . . . . . . . . 16

6.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.12 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 17

6.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

6.13 SSP controller (LPC2109/2119/2129/01 only) 17

6.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

6.14 General purpose timers . . . . . . . . . . . . . . . . . 17

6.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.15 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 18

6.15.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.16 Real-time clock . . . . . . . . . . . . . . . . . . . . . . . 19

6.16.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

6.17 Pulse width modulator . . . . . . . . . . . . . . . . . . 19

6.17.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6.18 System control . . . . . . . . . . . . . . . . . . . . . . . . 20

6.18.1 Crystal oscillator. . . . . . . . . . . . . . . . . . . . . . . 20

6.18.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

6.18.3 Reset and wake-up timer . . . . . . . . . . . . . . . . 21

6.18.4 Code security (Code Read Protection - CRP) 21

9

9.1

10

11

12

13

13.1

13.2

13.3

13.4

14

15

6.18.6 Memory mapping control . . . . . . . . . . . . . . . . 22

6.18.7 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 22

6.18.8 APB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6.19 Emulation and debugging . . . . . . . . . . . . . . . 23

6.19.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 23

6.19.2 Embedded trace macrocell . . . . . . . . . . . . . . 23

6.19.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 24

7

8

8.1

Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 25

Static characteristics . . . . . . . . . . . . . . . . . . . 26

Power consumption measurements for

LPC2109/01, LPC2119/01, LPC2129/01 devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Dynamic characteristics. . . . . . . . . . . . . . . . . 39

Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Package outline. . . . . . . . . . . . . . . . . . . . . . . . 41

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 42

Revision history . . . . . . . . . . . . . . . . . . . . . . . 43

Legal information . . . . . . . . . . . . . . . . . . . . . . 44

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 44

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Contact information . . . . . . . . . . . . . . . . . . . . 45

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

© NXP B.V. 2011.

All rights reserved.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

Date of release: 14 June 2011

Document identifier: LPC2109_2119_2129

NXP LPC2109FBD64 Single-chip 16/32-bit microcontrollers; 64/128/256 kB ISP/IAP flash Data Sheet

Single-chip 16/32-bit microcontrollers; 64/128/256 kB ISP/IAP flash with 10-bit ADC and CAN

2. Features and benefits

10. Package outline

11. Abbreviations

12. Revision history

13. Legal information

14. Contact information

15. Contents

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