MAX15501

MAX15501
MAX15501
RELIABILITY REPORT
FOR
MAX15501GTJ+
PLASTIC ENCAPSULATED DEVICES
August 22, 2010
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Don Lipps
Quality Assurance
Manager, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX15501
Conclusion
The MAX15501GTJ+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX15500/MAX15501 analog output conditioners provide a programmable current up to ±24mA, or a voltage up to ±12V proportional to a control
voltage signal. The control voltage is typically supplied by an external DAC with an output voltage range of 0 to 4.096V for the MAX15500 and 0 to
2.5V for the MAX15501. The output current and voltage are selectable as either unipolar or bipolar. In the unipolar configuration, a control voltage of
5% full-scale (FS) produces a nominal output of 0A or 0V to achieve underrange capability. A control voltage of 100%FS produces one of two
programmable levels (105%FS or 120%FS) to achieve overrange capability. The outputs of the MAX15500/MAX15501 are protected against
overcurrent conditions and a short to ground or supply voltages up to ±35V. The devices also monitor for overtemperature and supply brownout
conditions. The supply brownout threshold is programmable. The MAX15500/MAX15501 are programmed through an SPI(tm) interface capable of
daisy-chained operation. The MAX15500/MAX15501 provide extensive error reporting through the SPI interface and an additional open-drain interrupt
output. The devices include an analog output to monitor load conditions. The MAX15500/MAX15501 operate over the -40°C to +105°C temperature
range. The devices are available in a 32-pin, 5mm x 5mm TQFN package.
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MAX15501
II. Manufacturing Information
A. Description/Function:
Industrial Analog Current/Voltage Output Conditioners
B. Process:
S45
C. Number of Device Transistors:
10671
D. Fabrication Location:
California, Texas or Japan
E. Assembly Location:
China
F. Date of Initial Production:
June 24, 2009
III. Packaging Information
A. Package Type:
32-pin TQFN 5x5
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-3244
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
47°C/W
K. Single Layer Theta Jc:
1.7°C/W
L. Multi Layer Theta Ja:
29°C/W
M. Multi Layer Theta Jc:
1.7°C/W
IV. Die Information
A. Dimensions:
140 X 126 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
F. Minimum Metal Spacing:
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX15501
V. Quality Assurance Information
A. Quality Assurance Contacts:
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 43 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 25.6 x 10-9
= 25.6 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the S45 Process results in a FIT Rate of 0.49 @ 25C and 8.49 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The IC00 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1000V per JEDEC JESD22-A114.
Latch-Up testing has shown that this device withstands a current of +/-100mA.
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Page 4/5
MAX15501
Table 1
Reliability Evaluation Test Results
MAX15501GTJ+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing (Note 2)
HAST
Ta = 130°C
RH = 85%
Biased
Time = 96hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
43
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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