MP34DT01-M MEMS audio sensor omnidirectional digital microphone -

MP34DT01-M MEMS audio sensor omnidirectional digital microphone -
MP34DT01-M
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
• VoIP
• Speech recognition
• A/V eLearning devices
• Gaming and virtual reality input devices
• Digital still and video cameras
• Antitheft systems
Description
The MP34DT01-M is an ultra-compact, lowpower, omnidirectional, digital MEMS microphone
built with a capacitive sensing element and an IC
interface.
HCLGA (3 x 4 x 1.06 4LD)
Features
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process
dedicated to produce audio sensors.
• Single supply voltage
• Low power consumption
• 120 dBSPL acoustic overload point
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.
• 61 dB signal-to-noise ratio
• Omnidirectional sensitivity
• – 26 dBFS sensitivity
• PDM output
• HCLGA package
– Top-port design
– SMD-compliant
– EMI-shielded
– ECOPACK®, RoHS, and “Green” compliant
The MP34DT01-M has an acoustic overload point
of 120 dBSPL with a 61 dB signal-to-noise ratio
and –26 dBFS sensitivity.
The MP34DT01-M is available in a top-port, SMDcompliant, EMI-shielded package and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Applications
• Mobile terminals
• Laptop and notebook computers
• Portable media players
Order codes
Table 1. Device summary
Temperature range [°C]
Package
-40 to +85
HCLGA (3 x 4 x 1.06) mm 4LD
MP34DT01-M
Packing
Tray
MP34DT01TR-M
September 2014
This is information on a product in full production.
Tape and reel
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www.st.com
Contents
MP34DT01-M
Contents
1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2
Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3
Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4
Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6
Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.1
L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
7
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
8
Carrier tape mechanical specifications . . . . . . . . . . . . . . . . . . . . . . . . . 14
9
Process recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
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1
Pin description
Pin description
Figure 1. Pin connections
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Table 2. Pin description
Pin #
Pin name
Function
1
Vdd
Power supply
2
LR
Left/Right channel selection
3
CLK
Synchronization input clock
4
DOUT
Left/Right PDM data output
5 (ground ring)
GND
0 V supply
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Acoustic and electrical specifications
MP34DT01-M
2
Acoustic and electrical specifications
2.1
Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,
T = 25 °C, unless otherwise noted.
Table 3. Acoustic and electrical characteristics
Symbol
Parameter
Test condition
Vdd
Supply voltage
Idd
Current consumption in
normal mode
IddPdn
Current consumption in
power-down mode (2)
Scc
Short-circuit current
AOP
Acoustic overload point
So
Min.
Typ. (1)
Max.
Unit
1.64
1.8
3.6
V
Mean value
0.6
mA
20
µA
1
10
120
Sensitivity
-29
-26
dBSPL
-23
dBFS
SNR
Signal-to-noise ratio
A-weighted at 1 kHz,
1 Pa
61
dB
PSR
Power supply rejection
Guaranteed by
design
-70
dBFS
Clock
Input clock frequency (3)
1
3.25
MHz
10
ms
-40
+85
°C
Guaranteed by
design
2.4
Ton
Turn-on time (4)
Top
Operating temperature
range
VIOL
Low level logic
input/output voltage
Iout = 1 mA
-0.3
0.35xVdd
V
VIOH
High level logic
input/output voltage
Iout = 1 mA
0.65xVdd
Vdd+0.3
V
1. Typical specifications are not guaranteed.
2. Input clock in static mode.
3. Duty cycle: min = 40% max = 60%.
4. Time from the first clock edge to valid output data.
Table 4. Distortion specifications
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mA
Parameter
Test condition
Value
Distortion
100 dBSPL (1 kHz)
< 1% THD+N
Distortion
115 dBSPL (1 kHz)
< 2% THD+N
Distortion
120 dBSPL (1 kHz)
< 10% THD+N
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2.2
Acoustic and electrical specifications
Frequency response
Figure 2. Typical frequency response normalized at 1 kHz
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Acoustic and electrical specifications
2.3
MP34DT01-M
Timing characteristics
Table 5. Timing characteristics
Parameter
Description
fCLK
Clock frequency for normal mode
fPD
Clock frequency for power-down mode
TCLK
Clock period for normal mode
Data enabled on DATA line, L/R pin = 1
TR,DIS
Data disabled on DATA line, L/R pin = 1
TL,DIS
Max.
Unit
1
3.25
MHz
0.23
MHz
1000
ns
308
TR,EN
TL,EN
Min.
(1)
18
ns
16(1)
(1)
Data enabled on DATA line, L/R pin = 0
18
ns
ns
16(1)
Data disabled on DATA line, L/R pin = 0
ns
1. From design simulations
Figure 3. Timing waveforms
TCLK
CLK
TL,DIS
TR,EN
TR,DIS
High Z
PDM R
High Z
TL,EN
PDM L
High Z
High Z
AM045165v1
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Application recommendations
Figure 4. MP34DT01-M electrical connections (Top view)
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Figure 5. MP34DT01-M electrical connections for stereo configuration (Top view)
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Application recommendations
MP34DT01-M
Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as
near as possible to pin 1 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 5).
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4
Sensing element
Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable
plate and a fixed plate placed in a tiny silicon chip. This sensor transducers the sound
pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
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Absolute maximum ratings
5
MP34DT01-M
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 6. Absolute maximum ratings
Symbol
Ratings
Vdd
Supply voltage
Vin
Input voltage on any control pin
TSTG
Storage temperature range
Electrostatic discharge protection
ESD
3 discharges at ± 8 kV direct contact to lid when unit
is grounded (IEC 61000-4-2) and 3 discharges at
± 2 kV direct contact to I/O pins. (MIL 883E, Method
3015.7)
Maximum value
Unit
-0.3 to 6
V
-0.3 to Vdd +0.3
V
-40 to +125
°C
2 (HBM)
kV
±8
kV
This device is sensitive to mechanical shock, improper handling can cause
permanent damage to the part.
This device is ESD-sensitive, improper handling can cause permanent damage to the
part.
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Functionality
6
Functionality
6.1
L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 7. The
L/R pin must be connected to Vdd or GND.
Table 7. L/R channel selection
L/R
CLK low
CLK high
GND
Data valid
High impedance
Vdd
High impedance
Data valid
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Package mechanical data
7
MP34DT01-M
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Soldering information
The HCLGA 3x4 4LD package is also compliant with the RoHS and “Green” standards and
is qualified for soldering heat resistance according to JEDEC J-STD-020.
Landing pattern and soldering recommendations are available at www.st.com.
Figure 6. Recommended soldering profile limits
tp
TP
CRITICAL ZONE
RAMP-UP
TL to T P
TL
TEMPERATURE
TSMAX
tL
TSMIN
ts
PREHEAT
RAMP-DOWN
T25°C to PEAK
30
60
90
120
150
180
TIME
210
240
270
300
330
360
390
AM045166v1
Table 8. Recommended soldering profile limits
Description
Average ramp rate
Parameter
Pb free
TL to TP
3 °C/sec max
TSMIN
TSMAX
tS
150 °C
200 °C
60 sec to 120 sec
Preheat
Minimum temperature
Maximum temperature
Time (TSMIN to TSMAX)
TSMAX to TL
Ramp-up rate
Time maintained above liquidus temperature
Liquidus temperature
tL
TL
60 sec to 150 sec
217 °C
Peak temperature
TP
260 °C max
Time within 5 °C of actual peak temperature
12/17
20 sec to 40 sec
Ramp-down rate
6 °C/sec max
Time 25 °C (t25 °C) to peak temperature
8 minutes max
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Package mechanical data
Figure 7. HCLGA (3 x 4 x 1.06 mm) 4-lead package outline
32$BB$
Note:
The MEMS microphone metal cap can exhibit some level of variation in color when the
device is subjected to thermal process.
Dimensions are in millimeter unless otherwise specified. General tolerance is ± 0.15 mm
unless otherwise specified.
Table 9. HCLGA (3 x 4 x 1.06 mm) mechanical data
Item
Dimension (mm)
Tolerance (mm)
Length [L]
4
± 0.1
Width [W]
3
± 0.1
Height [H]
1.06
± 0.1
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Carrier tape mechanical specifications
8
MP34DT01-M
Carrier tape mechanical specifications
Figure 8. Carrier tape without microphone-top view
Figure 9. Carrier tape with microphone-top view
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9
Process recommendations
Process recommendations
To ensure a consistent manufacturing process it is strongly advised to comply with following
recommendations:
–
The recommended pick-up area for the MP34DT01-M package must be defined
using the worst case (ie. no device alignment during picking process). This area
has been defined considering all the tolerances of the components involved (reel,
package, sound inlet). Picker tolerance shall be considered as well.
–
To prevent damage to the MEMS membrane or incorrect pick-up and placement,
do not pick up the component on the inlet area
–
For the package outline please refer to Figure 10. Nozzle shape, size, and
placement accuracy are the other key factors to consider when deciding on the
coordinates for the picking.
–
Device alignment before picking is highly recommended.
–
A vacuum force greater than 7 psi must be avoided
–
1 kPa = 0.145 psi (lb/in2) = 0.0102 kgf/cm² = 0.0098 atm
–
All the recommended dimensions (device safe pick area) do not include the pick
and place equipment tolerances
–
According to Figure 10, standard picker tool can be used to handle this device
Figure 10. Recommended picking area
0.58
0.23
0.285
Radius of package
corner (0.25 mm)
Pocket Positional Tolerance
Package Size Tolerance
1.49 1.99 2.27
Pocket Size Clearance
Sound Port Positional Tolerance
Safe Pick Area
0.96
1.245
GAMS3107141420SG
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Revision history
10
MP34DT01-M
Revision history
Table 10. Document revision history
Date
Revision
Changes
19-Jun-2014
1
Initial release
09-Jul-2014
2
Modified Min. and Max. values So parameter Table 3 on page 4
Added:
03-Sep-2014
16/17
3
– Table 4: Distortion specifications on page 4
– Section 3: Application recommendations on page 7
– Section 9: Process recommendations on page 15
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MP34DT01-M
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© 2014 STMicroelectronics – All rights reserved
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