32/16 Mbit, 2.6/3.3 V, Dual Boot, Simultaneous Read/Write, Burst Flash S29CD032J S29CD016J

32/16 Mbit, 2.6/3.3 V,  Dual Boot, Simultaneous Read/Write, Burst Flash S29CD032J S29CD016J
S29CD032J
S29CD016J
S29CL032J
S29CL016J
32/16 Mbit, 2.6/3.3 V, Dual Boot,
Simultaneous Read/Write, Burst Flash
General Description
The Spansion S29CD-J and S29CL-J devices are Floating Gate products fabricated in 110-nm process technology. These burstmode Flash devices are capable of performing simultaneous read and write operations with zero latency on two separate banks,
using separate data and address pins. These products can operate up to 75 MHz (32 Mb) or 66 MHz (16 Mb), and use a single VCC
of 2.5V to 2.75V (S29CD-J) or 3.0V to 3.6V (S29CL-J) that make them ideal for today’s demanding automotive applications.
Distinctive Characteristics
 Single 2.6V (S29CD-J) or 3.3V (S29CL-J) for read/program/erase
 Command set compatible with JEDEC (JC42.4) standard
 110 nm Floating Gate Technology
 Supports Common Flash Interface (CFI)
 Simultaneous Read/Write operation with zero latency
 Extended Temperature range
 x32 Data Bus
 Persistent and Password methods of Advanced Sector Protection
 Dual Boot Sector Configuration (top and bottom)
 Unlock Bypass program command to reduce programming time
 Flexible Sector Architecture
– CD016J and CL016J: Eight 2k Double word, Thirty 16k Double
word, and Eight 2k Double Word sectors
– CD032J and CL032J: Eight 2k Double word, Sixty-two 16k
Double Word, and Eight 2k Double Word sectors
 ACC input pin to reduce factory programming time
 VersatileI/O™ control (1.65V to 3.6V)
 Data Polling bits indicate program and erase operation completion
 Hardware (WP#) protection of two outermost sectors in the large
bank
 Ready/Busy (RY/BY#) output indicates data available to system
 Suspend and Resume commands for Program and Erase Operation
 Programmable Burst Interface
– Linear for 2, 4, and 8 double word burst with wrap around
 Secured Silicon Sector that can be either factory or customer locked
 20 year data retention (typical)
 Cycling Endurance: 1 million write cycles per sector (typical)
 Offered Packages
– 80-pin PQFP
– 80-ball Fortified BGA (13 x 11 mm and 11 x 9mm versions)
– Pb-free package option available
– Known Good Die
Performance Characteristics
Read Access Times
Current Consumption (Max values)
75
(32 Mb only)
66
Max Asynch. Access Time, ns (tACC)
54
54
54
Max Synch. Burst Access, ns (tBACC)
8
8
8
Min Initial Clock Delay (clock cycles)
5
5
5
4
Max CE# Access Time, ns (tCE)
54
54
54
54
Max OE# Access time, ns (tOE)
20
20
20
20
Speed Option (MHz)
56
Continuous Burst Read @ 75 MHz
90 mA
Program
50 mA
54
Erase
50 mA
8
Standby Mode
60 µA
40
Typical Program and Erase Times
Double Word Programming
18 µs
Sector Erase
1.0 s
Notice for the 32Mb S29CD-J and S29CL-J devices only:
Please refer to the application note “Recommended Mode of Operation for Spansion® 110 nm S29CD032J/S29CL032J Flash
Memory” publication number S29CD-CL032J_Recommend_AN for programming best practices.
Cypress Semiconductor Corporation
Document Number: 002-00948 Rev. *A
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised December 16, 2015
S29CD032J
S29CD016J
S29CL032J
S29CL016J
Contents
1.
1.1
Ordering Information ................................................... 3
Valid Combinations ........................................................ 4
13. Electrical Specifications............................................. 47
13.1 Absolute Maximum Ratings .......................................... 47
2.
Input/Output Descriptions and Logic Symbols......... 5
14.
3.
Block Diagram.............................................................. 6
4.
Block Diagram of Simultaneous Read/Write Circuit. 7
15. DC Characteristics...................................................... 48
15.1 Zero Power Flash.......................................................... 49
5.
5.1
5.2
Physical Dimensions/Connection Diagrams............. 8
80-Pin PQFP Connection Diagram ................................ 8
PQR080–80-Lead Plastic Quad Flat Package Physical Dimensions........................................................................ 9
80-Ball Fortified BGA Connection Diagrams................ 10
Special Package Handling Instructions........................ 10
LAA080–80-ball Fortified Ball Grid Array (13 x 11 mm)
Physical Dimensions.................................................... 11
LAD080–80-ball Fortified Ball Grid Array (11 x 9 mm)
Physical Dimensions.................................................... 12
5.3
5.4
5.5
5.6
6.
6.1
6.2
6.3
6.4
Additional Resources ................................................
Application Notes .........................................................
Specification Bulletins ..................................................
Hardware and Software Support..................................
Contacting Spansion....................................................
13
13
13
13
13
7.
7.1
Product Overview ...................................................... 14
Memory Map ................................................................ 14
8.
8.1
8.2
8.3
8.4
19
19
20
20
8.5
8.6
8.7
8.8
8.9
Device Operations .....................................................
Device Operation Table ...............................................
Asynchronous Read.....................................................
Hardware Reset (RESET#)..........................................
Synchronous (Burst) Read Mode and Configuration
Register........................................................................
Autoselect ....................................................................
VersatileI/O (VIO) Control.............................................
Program/Erase Operations ..........................................
Write Operation Status.................................................
Reset Command ..........................................................
9.
9.1
9.2
9.3
9.4
9.5
9.6
Advanced Sector Protection/Unprotection .............
Advanced Sector Protection Overview ........................
Persistent Protection Bits.............................................
Persistent Protection Bit Lock Bit.................................
Dynamic Protection Bits...............................................
Password Protection Method .......................................
Hardware Data Protection Methods.............................
37
39
39
41
41
42
43
16.
Operating Ranges ....................................................... 48
Test Conditions ........................................................... 50
17. Test Specifications ..................................................... 50
17.1 Switching Waveforms ................................................... 50
18.
18.1
18.2
18.3
18.4
18.5
18.6
18.7
18.8
18.9
AC Characteristics...................................................... 51
VCC and VIO Power-up.................................................. 51
Asynchronous Operations............................................. 52
Synchronous Operations .............................................. 54
Hardware Reset (RESET#)........................................... 56
Write Protect (WP#) ...................................................... 57
Erase/Program Operations ........................................... 57
Alternate CE# Controlled Erase/Program Operations .. 64
Erase and Programming Performance ......................... 66
PQFP and Fortified BGA Pin Capacitance ................... 66
19. Appendix 1 .................................................................. 67
19.1 Common Flash Memory Interface (CFI) ....................... 67
20. Appendix 2 .................................................................. 71
20.1 Command Definitions.................................................... 71
21.
Revision History.......................................................... 73
21
25
26
26
31
37
10. Secured Silicon Sector Flash Memory Region ....... 44
10.1 Secured Silicon Sector Protection Bit .......................... 45
10.2 Secured Silicon Sector Entry and Exit Commands...... 45
11.
Electronic Marking..................................................... 45
12.
12.1
12.2
12.3
12.4
Power Conservation Modes......................................
Standby Mode..............................................................
Automatic Sleep Mode.................................................
Hardware RESET# Input Operation.............................
Output Disable (OE#)...................................................
Document Number: 002-00948 Rev. *A
45
45
46
46
46
Page 2 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
1.
Ordering Information
The order number (Valid Combination) is formed by the following:
S29CD032J
S29CL032J
0
J
F
A
I
0
0
0
Packing Type
0 = Tray, FBGA: 180 per tray, min. 10 trays per box
Tray, PQFP: 66 per tray, min. 10 trays per box
2 = 7” Tape and Reel, FBGA: 400 per reel
3 = 13” Tape and Reel, FBGA: 1600 per reel
13” Tape and Reel, PQFP: 500 per reel
Boot Sector Option (16th Character)
0 = Top Boot with Simultaneous Operation
1 = Bottom Boot with Simultaneous Operation
2 = Top Boot without Simultaneous Operation
3 = Bottom Boot without Simultaneous Operation
Autoselect ID Option (15th Character)
0 = 7E, 08, 01/00 Autoselect ID
1 = 7E, 36, 01/00 Autoselect ID
0 = 7E, 46, 01/00 Autoselect ID
0 = 7E, 09, 01/00 Autoselect ID
0 = 7E, 49, 01/00 Autoselect ID
S29CD016J only
S29CL016J only
S29CD032J only
S29CL032J only
Temperature Range
I = Industrial (–40°C to +85°C)
M = Extended (–40°C to +125°C)
Material Set
A = Standard
F = Pb-free Option
Package Type
Q = Plastic Quad Flat Package (PQFP)
F = Fortified Ball Grid Array, 1.0 mm pitch package, 13 x 11 mm package
B = Fortified Ball Grid Array, 1.0 mm pitch package, 11 x 9 mm package
Clock Frequency (11th Character)
J = 40 MHz
M = 56 MHz
P = 66 MHz
R = 75 MHz
Initial Burst Access Delay (10th Character)
0 = 5-1-1-1, 6-1-1-1, and above
1 = 4-1-1-1 (40 MHz only)
Device Number/Description
S29CD032J/S29CD016J (2.5 volt-only), S29CL032J/S29CL016J (3.3 volt-only)
32 or 16 Megabit (1M or 512k x 32-Bit) CMOS Burst Mode, Dual Boot, Simultaneous Read/Write Flash Memory
Manufactured on 110 nm floating gate technology
Document Number: 002-00948 Rev. *A
Page 3 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
1.1
Valid Combinations
Valid Combinations lists configurations planned to be supported in volume for this device. Consult your local sales office to confirm
availability of specific valid combinations and to check on newly released combinations.
S29CD-J/CL-J Valid Combinations
Device
Number
Initial Burst
Access Delay
Clock
Frequency
0, 1
J
Package
Type
Material
Set
Temperature
Range
Autoselect ID
Option
Boot Sector
Option
Packing
Type
Q
0, 3
B, F
0, 2, 3
S29CD016J
0, 1
0
0, 1
Q
0, 3
B, F
0, 2, 3
M, P
Q
0, 3
B, F
0, 2, 3
J
S29CL016J
0, 1, 2, 3
0
0, 1
Q
0, 3
B, F
0, 2, 3
M, P
Q
0, 3
B, F
0, 2, 3
J
Q
0, 3
B, F
0, 2, 3
M, P
S29CD032J
A, F
I, M
0, 1 (2)
0
Q
0, 3
2, 3
0
R
0, 1 (2)
B, F
0, 2, 3
2, 3
0, 1
Q
0, 3
B, F
0, 2, 3
J
0, 1, 2, 3
Q
0, 3
B, F
0, 2, 3
M, P
S29CL032J
0, 1 (2)
0
Q
0, 3
2, 3
R
0, 1 (2)
B, F
0, 2, 3
2, 3
Notes:
1. The ordering part number that appears on BGA packages omits the leading “S29”.
2. Contact factory for availability.
Document Number: 002-00948 Rev. *A
Page 4 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
2. Input/Output Descriptions and Logic Symbols
Table identifies the input and output package connections provided on the device.
Symbol
Type
Description
A19-A0
Input
Address lines for S29CD-J and S29CL-J (A18-A0 for 16 Mb and A19-A0 for 32 Mb).
A9 supports 12V autoselect input.
DQ31-DQ0
I/O
CE#
Input
Data input/output
Chip Enable. This signal is asynchronous relative to CLK for the burst mode.
OE#
Input
Output Enable. This signal is asynchronous relative to CLK for the burst mode.
WE#
Input
Write Enable
VCC
Supply
Device Power Supply. This signal is asynchronous relative to CLK for the burst mode.
VIO
Supply
VersatileI/OTM Input.
VSS
Supply
NC
No Connect
Ground
RY/BY#
Output
CLK
Input
Clock Input that can be tied to the system or microprocessor clock and provides the
fundamental timing and internal operating frequency.
ADV#
Input
Load Burst Address input. Indicates that the valid address is present on the address
inputs.
IND#
Output
End of burst indicator for finite bursts only. IND is low when the last word in the burst
sequence is at the data outputs.
WAIT#
Output
Not connected internally
Ready/Busy output and open drain which require a external pull up resistor.
When RY/BY# = VOH, the device is ready to accept read operations and commands.
When RY/BY# = VOL, the device is either executing an embedded algorithm or the
device is executing a hardware reset operation.
Provides data valid feedback only when the burst length is set to continuous.
WP#
Input
Write Protect Input. At VIL, disables program and erase functions in two outermost
sectors of the large bank.
ACC
Input
Acceleration input. At VHH, accelerates erasing and programming. When not used for
acceleration, ACC = VSS or VCC.
RESET#
Input
Hardware Reset.
Document Number: 002-00948 Rev. *A
Page 5 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
3. Block Diagram
VCC
VSS
DQmax–DQ0
Erase Voltage
Generator
VIO
Input/Output
Buffers
WE#
ACC
WP#
State
Control
Command
Register
PGM Voltage
Generator
Chip Enable
Output Enable
Logic
CE#
OE#
VCC
Detector
ADV#
CLK
Burst
State
Control
IND/
WAIT#
Timer
Burst
Address
Counter
Address Latch
RESET#
Data
Latch
Y-Decoder
Y-Gating
X-Decoder
Cell Matrix
Amax-A0
Amax-A0
Note
Address bus is A19–A0 for 32 Mb device, A18–A0 for 16 Mb device. Data bus is D31–DQ0.
Document Number: 002-00948 Rev. *A
Page 6 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
4. Block Diagram of Simultaneous Read/Write Circuit
X-Decoder
Amax–A0
RESET#
WE#
CE#
ADV#
DQmax–DQ0
Upper Bank
Amax–A0
Y-Decoder
Upper Bank Address
Amax–A0
Latches and Control Logic
OE#
VCC
VSS
STATE
CONTROL
&
COMMAND
REGISTER
Status
DQmax–DQ0
Control
DQmax–DQ0
Document Number: 002-00948 Rev. *A
Lower Bank Address
Lower Bank
DQmax–DQ0
Latches and
Control Logic
Amax–A0
Y-Decoder
Amax–A0
X-Decoder
Page 7 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
VIO
RESET#
CLK
NC
RY/BY#
ADV#
NC
VSS
VCC
CE#
OE#
WE#
WP#
NC
80-Pin PQFP Connection Diagram
NC
5.1
Physical Dimensions/Connection Diagrams
IND/WAIT#
5.
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65
DQ16
DQ17
DQ18
DQ19
VIO
VSS
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
VIO
VSS
DQ28
DQ29
DQ30
DQ31
NC
A0
A1
A2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
80-Pin PQFP
DQ15
DQ14
DQ13
DQ12
VSS
VIO
DQ11
DQ10
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
VSS
VIO
DQ3
DQ2
DQ1
DQ0
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
VCC
ACC
VSS
A8
A7
A6
A5
A4
A3
25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Notes
1. On 16 Mb device, pin 44 (A19) is NC.
2. Pin 69 (RY/BY#) is Open Drain and requires an external pull-up resistor.
Document Number: 002-00948 Rev. *A
Page 8 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
5.2
PQR080–80-Lead Plastic Quad Flat Package Physical Dimensions
6
3
PIN S
D
D1
0.20 MIN. FLAT SHOULDER
D3
PIN R
7˚
TYP.
0˚MIN.
0.30 ± 0.05 R
PIN ONE I.D.
A
GAGE 0.25
PLANE
E3
-A-
E1
-B-
7˚
TYP.
L
3
0˚-7˚
6
b
ccc C
4
aa a M C A B S D S
E
DETAIL X
SEE NOTE 3
b
PIN P
-D-
PIN Q
c
SEE DETAIL X
e BASIC
SECTION S-S
S
A2
A1
S
PACKAGE
-A-C-
SEATING PLANE
NOTES:
PQR 080
JEDEC
SYMBOL
A
2
MO-108(B)CB-1
NOTES
MIN
NOM
MAX
A
--
--
3.35
A1
0.25
--
--
A2
2.70
2.80
2.90
b
0.30
--
0.45
1.
ALL DIMENSIONS AND TOLERANCES CONFORM TO
ANSI Y14.5M-1982.
2.
DATUM PLANE -A- IS LOCATED AT THE MOLD PARTING LINE
AND IS COINCIDENT WITH THE BOTTOM OF THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY.
3.
DIMENSIONS "D1" AND "E1" DO NOT INCLUD MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.25 mm PER SIDE.
DIMENSIONS "D1" AND "E1" INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE -A-
SEE NOTE 4
c
0.15
--
0.23
D
17.00
17.20
17.40
4.
DIMENSION "B" DOES NOT INCLUDE DAMBAR PROTRUSION.
D1
13.90
14.00
14.10
SEE NOTE 3
5.
CONTROLLING DIMENSIONS: MILLIMETER.
D3
--
12.0
--
REFERENCE
6.
e
--
0.80
--
BASIC, SEE NOTE 7
DIMENSIONS "D" AND "E" ARE MEASURED FROM BOTH
INNERMOST AND OUTERMOST POINTS.
E
23.00
23.20
23.40
7.
E1
19.90
20.00
20.10
SEE NOTE 3
DEVIATION FROM LEAD-TIP TRUE POSITION SHALL BE WITHIN
±0.0076 mm FOR PITCH > 0.5 mm AND WITHIN ±0.04 FOR
PITCH < 0.5 mm.
E3
--
18.40
--
REFERENCE
8.
aaa
---
0.20
---
LEAD COPLANARITY SHALL BE WITHIN: (REFER TO 06-500)
1 - 0.10 mm FOR DEVICES WITH LEAD PITCH OF 0.65 - 0.80 mm
2 - 0.076 mm FOR DEVICES WITH LEAD PITCH OF 0.50 mm.
COPLANARITY IS MEASURED PER SPECIFICATION 06-500.
9.
HALF SPAN (CENTER OF PACKAGE TO LEAD TIP) SHALL BE
WITHIN ±0.0085".
ccc
L
0.10
0.73
0.88
P
24
Q
40
R
64
S
80
1.03
3213\38.4C
Document Number: 002-00948 Rev. *A
Page 9 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
5.3
80-Ball Fortified BGA Connection Diagrams
A8
B8
C8
D8
E8
F8
G8
H8
J8
K8
A2
A1
A0
DQ29
VIO
VSS
VIO
DQ20
DQ16
NC
A7
B7
C7
D7
E7
F7
G7
H7
J7
K7
A3
A4
NC
DQ30
DQ26
DQ24
DQ23
DQ18
IND/WAIT#
NC
A6
B6
C6
D6
E6
F6
G6
H6
J6
K6
A6
A5
A7
DQ31
DQ28
DQ25
DQ21
DQ19
OE#
WE#
A5
B5
C5
D5
E5
F5
G5
H5
J5
K5
VSS
A8
NC
NC
DQ27
RY/BY#
DQ22
DQ17
CE#
VCC
A4
B4
C4
D4
E4
F4
G4
H4
J4
K4
ACC
A9
A10
NC
DQ1
DQ5
DQ9
WP#
NC
VSS
A3
B3
C3
D3
E3
F3
G3
H3
J3
K3
VCC
A12
A11
A19
DQ2
DQ6
DQ10
DQ11
ADV#
CLK
A2
B2
C2
D2
E2
F2
G2
H2
J2
K2
A14
A13
A18
DQ0
DQ4
DQ7
DQ8
DQ12
DQ14
RESET#
A1
B1
C1
D1
E1
F1
G1
H1
J1
K1
A15
A16
A17
DQ3
VIO
VSS
VIO
DQ13
DQ15
VIO
Notes
1. On 16 Mb device, ball D3 (A19) is NC.
2. Ball F5 (RY/BY#) is Open Drain and requires an external pull-up resistor.
5.4
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages (BGA). The package and/or data integrity may be
compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time.
Document Number: 002-00948 Rev. *A
Page 10 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
5.5
LAA080–80-ball Fortified Ball Grid Array (13 x 11 mm) Physical Dimensions
D
0.20 C
2X
D1
A
eD
K
J
H
G
F
E
D
C
B
A
8
7
7
SE
6
eE
5
E1
E
4
.50
3
φ0
2
1.00±0.5
1
A1 CORNER ID.
(INK OR LASER)
B
1.00±0.5
6
0.20 C
2X
TOP VIEW
A1
CORNER
NXφb
SD
A1
CORNER
7
φ0.25 M C A B
φ0.10 M C
BOTTOM VIEW
0.25 C
A
A2
SEATING PLANE
A1
C
0.15 C
SIDE VIEW
PACKAGE
NOTES:
LAA 080
JEDEC
N/A
SYMBOL
MIN
NOM
MAX
A
--
--
1.40
A1
0.40
--
--
A2
0.60
--
--
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
(EXCEPT AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX
SIZE IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF
SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW , SD OR SE = e/2
BODY THICKNESS
BODY SIZE
E
11.00 BSC.
BODY SIZE
D1
9.00 BSC.
MATRIX FOOTPRINT
E1
7.00 BSC.
MATRIX FOOTPRINT
MD
10
MATRIX SIZE D DIRECTION
ME
8
MATRIX SIZE E DIRECTION
N
80
0.60
2.
STANDOFF
13.00 BSC.
0.50
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
PROFILE HEIGHT
D
φb
1.
NOTE
13.00 x 11.00 mm
PACKAGE
BALL COUNT
0.70
BALL DIAMETER
eD
1.00 BSC.
BALL PITCH - D DIRECTION
8.
N/A
eE
1.00 BSC.
BALL PITCH - E DIRECTION
9.
SD/SE
0.50 BSC
SOLDER BALL PLACEMENT
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
3214\38.12C
Document Number: 002-00948 Rev. *A
Page 11 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
5.6
LAD080–80-ball Fortified Ball Grid Array (11 x 9 mm) Physical Dimensions
NOTES:
PACKAGE
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
LAD 080
JEDEC
N/A
DXE
2. ALL DIMENSIONS ARE IN MILLIMETERS.
11.00 mm x 9.00 mm
PACKAGE
3. BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.40
PROFILE
A1
0.35
0.45
0.55
BALL HEIGHT
D
11.00 BSC
BODY SIZE
E
9.00 BSC
BODY SIZE
D1
9.00 BSC
MATRIX FOOTPRINT
E1
7.00 BSC
MD
10
MATRIX FOOTPRINT
8
MATRIX SIZE E DIRECTION
N
80
BALL COUNT
b
0.55
0.65
1.00 BSC
0.75
N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW SD OR SE = 0.000.
BALL PITCH
eD
1.00 BSC
BALL PITCH
0.50 BSC
SOLDER BALL PLACEMENT
N/A
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
BALL DIAMETER
SD / SE
DEPOPULATED SOLDER BALLS
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE
"D" DIRECTION.
MATRIX SIZE D DIRECTION
ME
eE
4.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. “+” INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS.
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
g1064 \ f16-038.12 \ 01.31.12
Document Number: 002-00948 Rev. *A
Page 12 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
6.
Additional Resources
Visit www.spansion.com to obtain the following related documents:
6.1
Application Notes
The following is a list of application notes related to this product. All Spansion application notes are available at http://
www.spansion.com/Support/TechnicalDocuments/Pages/ApplicationNotes.aspx
 Using the Operation Status Bits in AMD Devices
 Understanding Page Mode Flash Memory Devices
 Common Flash Interface Version 1.4 Vendor Specific Extensions
6.2
Specification Bulletins
Contact your local sales office for details.
6.3
Hardware and Software Support
Downloads and related information on Flash device support is available at
http://www.spansion.com/SUPPORT/Pages/Support.aspx
 Spansion low-level drivers
 Enhanced Flash drivers
 Flash file system
Downloads and related information on simulation modeling and CAD modeling support is available at
http://www.spansion.com/Support/Pages/SimulationModels.aspx
VHDL and Verilog
 IBIS
 ORCAD
6.4
Contacting Spansion
Obtain the latest list of company locations and contact information on our web site at
http://www.spansion.com/About/Pages/Locations.aspx
Document Number: 002-00948 Rev. *A
Page 13 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
7.
Product Overview
The S29CD-J and S29CL-J families consist of 32 Mb and 16 Mb, 2.6 volt-only (CD-J) or 3.3 volt-only (CL-J), simultaneous read/
write, dual boot burst mode Flash devices optimized for today's automotive designs.
These devices are organized in 1,048,576 double words (32 Mb) or 524,288 double words (16 Mb) and are capable of linear burst
read (2, 4, or 8 double words) with wraparound. (Note that 1 double word = 32 bits.) These products also offer single word
programming with program/erase suspend and resume functionality. Additional features include:
 Advanced Sector Protection methods for protecting sectors as required.
 256 bytes of Secured Silicon area for storing customer or factory secured information. The Secured Silicon Sector is One-Time
Programmable.
 Electronic marking.
7.1
Memory Map
The S29CD-J and S29CL-J devices consist of two banks organized as shown in Table , Table , Table and Table .
Document Number: 002-00948 Rev. *A
Page 14 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
S29CD016J/CL016J (Top Boot) Sector and Memory Address Map
Sector
Group
x32 Address
Range (A18:A0)
Sector Size
(KDwords)
Sector
SG0
00000h–007FFh
2
SA15
SA1
SG1
00800h–00FFFh
2
SA16
SA2
SG2
01000h–017FFh
2
SA3
SG3
01800h–01FFFh
2
Sector
SA0
x32 Address Range
(A18:A0)
Sector Size
(KDwords)
20000h–23FFFh
16
24000h–27FFFh
16
SA17
28000h–2BFFFh
16
SA18
2C000h–2FFFFh
16
SG10
SA4
SG4
02000h–027FFh
2
SA19
30000h–33FFFh
16
SA5
SG5
02800h–02FFFh
2
SA20
34000h–37FFFh
16
SA6
SG6
03000h–037FFh
2
SA21
38000h–3BFFFh
16
SA7
SG7
03800h–03FFFh
2
SA22
3C000h–3FFFFh
16
04000h–07FFFh
16
SA23
40000h–43FFFh
16
SG8
08000h–0BFFFh
16
SA24
44000h–47FFFh
16
SA10
0C000h–0FFFFh
16
SA25
SA11
10000h–13FFFh
16
SA26
SA8
SA9
SA12
SA13
SA14
SG9
SG11
SG12
48000h–4BFFFh
16
4C000h–4FFFFh
16
14000h–17FFFh
16
SA27
50000h–53FFFh
16
18000h–1BFFFh
16
SA28
54000h–57FFFh
16
1C000h–1FFFFh
16
58000h–5BFFFh
16
5C000h–5FFFFh
16
Bank 1 (Note 2)
Bank 0 (Note 2)
(Note 1)
Sector
Group
SA29
SG13
SA30
SA31
60000h–63FFFh
16
SA32
64000h–67FFFh
16
68000h–6BFFFh
16
6C000h–6FFFFh
16
SA33
SG14
SA34
SA35
70000h–73FFFh
16
SG15
74000h–77FFFh
16
78000h–7BFFFh
16
SA38
SG16
7C000h–7C7FFh
2
SA39
SG17
7C800h–7CFFFh
2
SA40
SG18
7D000h–7D7FFh
2
SA41
SG19
7D800h–7DFFFh
2
SA42
SG20
7E000h–7E7FFh
2
SA43
SG21
7E800h–7EFFFh
2
SA44
(Note 3)
SG22
7F000h–7F7FFh
2
SA45
(Note 3)
SG23
7F800h–7FFFFh
2
SA36
SA37
Notes
1. Secured Silicon Sector overlays this sector when enabled.
2. The bank address is determined by A18 and A17. BA = 00 for Bank 0 and BA = 01, 10, or 11 for Bank 1.
3. This sector has the additional WP# pin sector protection feature.
Document Number: 002-00948 Rev. *A
Page 15 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
S29CD016J/CL016J (Bottom Boot) Sector and Memory Address Map
Sector
Sector
Group
Sector Size
(KDwords)
Sector
Sector
Group
x32
Address Range
(A18:A0)
Sector Size
(KDwords)
SA0 (Note 1)
SG0
00000h–007FFh
2
SA31
60000h–63FFFh
16
SA1 (Note 1)
SG1
00800h–00FFFh
2
SA32
64000h–67FFFh
16
SA2
SG2
01000h–017FFh
2
SA33
SA3
SG3
01800h–01FFFh
2
SA34
SG4
02000h–027FFh
2
SA35
SA5
SG5
02800h–02FFFh
2
SA36
SA6
SG6
03000h–037FFh
2
SA7
SG7
03800h–03FFFh
2
04000h–07FFFh
16
SG8
08000h–0BFFFh
16
SA10
0C000h–0FFFFh
SA11
10000h–13FFFh
SA9
SA12
SA13
SG9
SA14
2
16
SA41
SG19
7D800h–7DFFFh
2
16
SA42
SG20
7E000h–7E7FFh
2
14000h–17FFFh
16
SA43
SG21
7E800h–7EFFFh
2
18000h–1BFFFh
16
SA44
SG22
7F000h–7F7FFh
2
1C000h–1FFFFh
16
SA45
(Note 3)
SG23
7F800h–7FFFFh
2
28000h–2BFFFh
16
16
SA19
30000h–33FFFh
16
SA20
34000h–37FFFh
16
38000h–3BFFFh
16
3C000h–3FFFFh
16
SA23
40000h–43FFFh
16
SA24
44000h–47FFFh
16
48000h–4BFFFh
16
4C000h–4FFFFh
16
SG12
SA26
SA27
50000h–53FFFh
16
SA28
54000h–57FFFh
16
58000h–5BFFFh
16
5C000h–5FFFFh
16
SA29
SA30
SG13
2
2
2C000h–2FFFFh
SA25
16
7C000h–7C7FFh
7D000h–7D7FFh
16
SA22
78000h–7BFFFh
SG16
7C800h–7CFFFh
16
SG11
16
16
SG17
20000h–23FFFh
SA21
70000h–73FFFh
74000h–77FFFh
SG18
24000h–27FFFh
SA18
16
16
SG15
SA37
SA38
68000h–6BFFFh
6C000h–6FFFFh
SA39
SA16
SG10
SG14
SA40
SA15
SA17
Bank 1 (Note 2)
SA4
SA8
Bank 0 (Note 2)
x32 Address
Range (A18:A0)
Notes
1. This sector has the additional WP# pin sector protection feature.
2. The bank address is determined by A18 and A17. BA = 00, 01, or 10 for Bank 0 and BA = 11 for Bank 1.
3. Secured Silicon Sector overlays this sector when enabled.
Document Number: 002-00948 Rev. *A
Page 16 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
S29CD032J/CL032J (Top Boot) Sector and Memory Address Map
Sector
Sector
Group
x32 Address Range
(A19:A0)
Sector Size
(KDwords)
Sector
2
SA39
Sector
Group
SA0 (Note 1)
SG0
00000h–007FFh
SA1
SG1
00800h–00FFFh
2
SA40
84000h–87FFFh
16
SA2
SG2
01000h–017FFh
2
SA41
88000h–8BFFFh
16
SA3
SG3
01800h–01FFFh
2
SA42
8C000h–8FFFFh
16
SA4
SG4
02000h–027FFh
2
SA43
90000h–93FFFh
16
SA5
SG5
02800h–02FFFh
2
SA44
SA6
SG6
03000h–037FFh
2
SA45
SA7
SG7
03800h–03FFFh
2
04000h–07FFFh
16
Bank 0 (Note 2)
x32 Address Range
(A19:A0)
Sector Size
(KDwords)
Bank 1 continued (Note 2)
80000h–83FFFh
16
SG16
94000h–97FFFh
16
98000h–9BFFFh
16
SA46
9C000h–9FFFFh
16
SA47
A0000h–A3FFFh
16
A4000h–A7FFFh
16
SG17
SA8
08000h–0BFFFh
16
SA48
SA10
SA9
SG8
0C000h–0FFFFh
16
SA49
A8000h–ABFFFh
16
SA11
10000h–13FFFh
16
SA50
AC000h–AFFFFh
16
14000h–17FFFh
16
SA51
B0000h–B3FFFh
16
SA13
18000h–1BFFFh
16
SA52
B4000h–B7FFFh
16
SA14
1C000h–1FFFFh
16
SA53
B8000h–BBFFFh
16
SA15
20000h–23FFFh
16
SA54
BC000h–BFFFFh
16
24000h–27FFFh
16
SA55
C0000h–C3FFFh
16
SA17
28000h–2BFFFh
16
SA56
C4000h–C7FFFh
16
SA18
2C000h–2FFFFh
16
SA57
C8000h–CBFFFh
16
SA19
30000h–33FFFh
16
SA58
CC000h–CFFFFh
16
SA20
34000h–37FFFh
16
SA59
D0000h–D3FFFh
16
SA21
38000h–3BFFFh
16
SA60
D4000h–D7FFFh
16
SA22
3C000h–3FFFFh
16
SA61
D8000h–DBFFFh
16
SA62
DC000h–DFFFFh
16
40000h–43FFFh
16
SA63
E0000h–E3FFFh
16
E4000h–E7FFFh
16
SG18
SA12
SG9
SG19
SA16
SG10
SG20
SG11
SG21
Bank 1 (Note 2)
SA23
SA24
44000h–47FFFh
16
SA64
SA25
48000h–4BFFFh
16
SA65
E8000h–EBFFFh
16
SA26
4C000h–4FFFFh
16
SA66
EC000h–EFFFFh
16
SA27
50000h–53FFFh
16
SA67
F0000h–F3FFFh
16
SG12
SA28
SG22
54000h–57FFFh
16
SA68
SA29
58000h–5BFFFh
16
SA69
SG23
F4000h–F7FFFh
16
F8000h–FBFFFh
16
SA30
5C000h–5FFFFh
16
SA70
SG24
FC000h–FC7FFh
2
SA31
60000h–63FFFh
16
SA71
SG25
FC800h–FCFFFh
2
SG13
SA32
64000h–67FFFh
16
SA72
SG26
FD000h–FD7FFh
2
SA33
68000h–6BFFFh
16
SA73
SG27
FD800h–FDFFFh
2
SA34
6C000h–6FFFFh
16
SA74
SG28
FE000h–FE7FFh
2
SA35
70000h–73FFFh
16
SA75
SG29
FE800h–FEFFFh
2
SG14
SA36
74000h–77FFFh
16
SA76 (Note 3)
SG30
FF000h–FF7FFh
2
SA37
78000h–7BFFFh
16
SA77 (Note 3)
SG31
FF800h–FFFFFh
2
SA38
7C000h–7FFFFh
16
SG15
Notes
1. Secured Silicon Sector overlays this sector when enabled.
2. The bank address is determined by A19 and A18. BA = 00 for Bank 0 and BA = 01, 10, or 11 for Bank 1.
3. This sector has the additional WP# pin sector protection feature.
Document Number: 002-00948 Rev. *A
Page 17 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
S29CD032J/CL032J (Bottom Boot) Sector and Memory Address Map
Sector
Sector
Group
SA0 (Note 3)
SG0
SA1 (Note 3)
SA2
SA3
SA4
x32 Address Range
(A19:A0)
Sector Size
(KDwords)
Sector
00000h–007FFh
2
SA39
SG1
00800h–00FFFh
2
SA40
SG2
01000h–017FFh
2
SA41
SG3
01800h–01FFFh
2
SG4
02000h–027FFh
2
SA5
SG5
02800h–02FFFh
2
SA44
SA6
SG6
03000h–037FFh
2
SA45
SA7
SG7
03800h–03FFFh
2
04000h–07FFFh
16
08000h–0BFFFh
16
SA48
0C000h–0FFFFh
16
SA49
Bank 0 (Note 2)
SA8
SA9
SG8
SA10
Sector
Group
x32 Address Range
(A19:A0)
Sector Size
(KDwords)
Bank 0 continued (Note 2)
80000h–83FFFh
16
84000h–87FFFh
16
88000h–8BFFFh
16
SA42
8C000h–8FFFFh
16
SA43
90000h–93FFFh
16
SG16
94000h–97FFFh
16
98000h–9BFFFh
16
SA46
9C000h–9FFFFh
16
SA47
A0000h–A3FFFh
16
SG17
SG18
A4000h–A7FFFh
16
A8000h–ABFFFh
16
SA11
10000h–13FFFh
16
SA50
AC000h–AFFFFh
16
SA12
14000h–17FFFh
16
SA51
B0000h–B3FFFh
16
18000h–1BFFFh
16
SA52
1C000h–1FFFFh
16
SA53
SA54
SA13
SG9
SA14
SA15
20000h–23FFFh
16
SA16
24000h–27FFFh
16
SA17
SG10
SG19
B4000h–B7FFFh
16
B8000h–BBFFFh
16
BC000h–BFFFFh
16
Bank 1 (Note 2)
28000h–2BFFFh
16
SA55
C0000h–C3FFFh
16
SA18
2C000h–2FFFFh
16
SA56
C4000h–C7FFFh
16
SA19
30000h–33FFFh
16
SA57
SA20
34000h–37FFFh
16
SA58
SA21
SG11
SG20
C8000h–CBFFFh
16
CC000h–CFFFFh
16
38000h–3BFFFh
16
SA59
D0000h–D3FFFh
16
SA22
3C000h–3FFFFh
16
SA60
D4000h–D7FFFh
16
SA23
40000h–43FFFh
16
SA61
SA24
44000h–47FFFh
16
SA62
SA25
SG12
SG21
D8000h–DBFFFh
16
DC000h–DFFFFh
16
48000h–4BFFFh
16
SA63
E0000h–E3FFFh
16
SA26
4C000h–4FFFFh
16
SA64
E4000h–E7FFFh
16
SA27
50000h–53FFFh
16
SA65
SA28
54000h–57FFFh
16
SA66
SA29
SG13
58000h–5BFFFh
16
SA67
5C000h–5FFFFh
16
SA68
SA31
60000h–63FFFh
16
SA69
SA32
64000h–67FFFh
16
68000h–6BFFFh
6C000h–6FFFFh
SA30
SA33
SG14
SA34
SG22
E8000h–EBFFFh
16
EC000h–EFFFFh
16
F0000h–F3FFFh
16
SG23
F4000h–F7FFFh
16
F8000h–FBFFFh
16
SA70
SG24
FC000h–FC7FFh
2
16
SA71
SG25
FC800h–FCFFFh
2
16
SA72
SG26
FD000h–FD7FFh
2
SA35
70000h–73FFFh
16
SA73
SG27
FD800h–FDFFFh
2
SA36
74000h–77FFFh
16
SA74
SG28
FE000h–FE7FFh
2
SA37
SA38
SG15
78000h–7BFFFh
16
SA75
SG29
FE800h–FEFFFh
2
7C000h–7FFFFh
16
SA76
SG30
FF000h–FF7FFh
2
SA77 (Note 1)
SG31
FF800h–FFFFFh
2
Document Number: 002-00948 Rev. *A
Page 18 of 86
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S29CD016J
S29CL032J
S29CL016J
Notes
1. This sector has the additional WP# pin sector protection feature.
2. The bank address is determined by A19 and A18. BA = 00, 01, or 10 for Bank 0 and BA = 11 for Bank 1.
3. The Secured Silicon Sector overlays this sector when enabled.
8. Device Operations
This section describes the read, program, erase, simultaneous read/write operations, and reset features of the Flash devices.
Operations are initiated by writing specific commands or a sequence with specific address and data patterns into the command
register (see Table ). The command register itself does not occupy any addressable memory location; rather, it is composed of
latches that store the commands, along with the address and data information needed to execute the command. The contents of the
register serve as input to the internal state machine; the state machine outputs dictate the function of the device. Writing incorrect
address and data values or writing them in an improper sequence may place the device in an unknown state, in which case the
system must write the reset command in order to return the device to the reading array data mode.
8.1
Device Operation Table
The device must be set up appropriately for each operation. Table describes the required state of each control pin for any particular
operation.
Device Bus Operation
CE#
OE#
WE#
RESET#
CLK
ADV#
Addresses
Data
(DQ0–DQ31)
Read
L
L
H
H
X
X
AIN
DOUT
Asynchronous Write
L
H
L
H
X
X
AIN
DIN
Synchronous Write
L
H
L
H
AIN
DIN
Standby (CE#)
H
X
X
H
H
X
X
High-Z
Output Disable
L
H
H
H
X
X
High-Z
High-Z
Reset
X
X
X
L
X
X
X
Operation
PPB Protection Status (Note 2)
L
L
H
H
Load Starting Burst Address
L
X
H
H
Advance Burst to next address
with appropriate Data presented
on the Data bus
L
L
H
H
Terminate Current Burst Read Cycle
H
X
H
H
Terminate Current Burst
Read Cycle with RESET#
X
X
H
L
Terminate Current Burst Read Cycle;
Start New Burst Read Cycle
L
H
H
H
X
X
Sector Address,
A9 = VID,
A7 – A0 = 02h
High-Z
00000001h, (protected)
A6 = H
00000000h (unprotect)
A6 = L
Burst Read Operations
X
AIN
X
H
X
Burst Data Out
X
X
High-Z
X
X
High-Z
AIN
X
Legend
L = Logic Low = VIL, H = Logic High = VIH, X = Don’t care.
Notes
1. WP# controls the two outermost sectors of the top boot block or the two outermost sectors of the bottom boot block.
2. DQ0 reflects the sector PPB (or sector group PPB) and DQ1 reflects the DYB.
Document Number: 002-00948 Rev. *A
Page 19 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
8.2
Asynchronous Read
All memories require access time to output array data. In an asynchronous read operation, data is read from one memory location at
a time. Addresses are presented to the device in random order, and the propagation delay through the device causes the data on its
outputs to arrive asynchronously with the address on its inputs.
The internal state machine is set for asynchronously reading array data upon device power-up, or after a hardware reset. This
ensures that no spurious alteration of the memory content occurs during the power transition. No command is necessary in this
mode to obtain array data. Standard microprocessor read cycles that assert valid addresses on the device address inputs produce
valid data on the device data outputs. The device remains enabled for read access until the command register contents are altered.
The device has two control functions which must be satisfied in order to obtain data at the outputs. CE# is the power control and
should be used for device selection (CE# must be set to VIL to read data). OE# is the output control and should be used to gate data
to the output pins if the device is selected (OE# must be set to VIL in order to read data). WE# should remain at VIH (when reading
data).
Address access time (tACC) is equal to the delay from stable addresses to valid output data. The chip enable access time (tCE) is the
delay from the stable addresses and stable CE# to valid data at the output pins. The output enable access time (tOE) is the delay
from the falling edge of OE# to valid data at the output pins (assuming the addresses have been stable for at least a period of tACCtOE and CE# has been asserted for at least tCE-tOE time). Figure 8.1 shows the timing diagram of an asynchronous read operation.
Figure 8.1 Asynchronous Read Operation
CE#
CLK
ADV#
Addresses
Address 0
Data
Address 1
Address 2
D0
D1
Address 3
D2
D3
D3
OE#
WE#
IND/WAIT#
VIH
Float
Float
VOH
Note
Operation is shown for the 32-bit data bus. For the 16-bit data bus, A-1 is required.
Refer to Asynchronous Operations on page 52 for timing specifications and to Figure 18.2, Conventional Read Operations Timings
on page 52 for another timing diagram. ICC1 in the DC Characteristics table represents the active current specification for reading
array data.
8.3
Hardware Reset (RESET#)
The RESET# pin is an active low signal that is used to reset the device under any circumstances. A logic “0” on this input forces the
device out of any mode that is currently executing back to the reset state. RESET# may be tied to the system reset circuitry. A
system reset would thus also reset the device. To avoid a potential bus contention during a system reset, the device is isolated from
the DQ data bus by tristating the data outputs for the duration of the RESET pulse. All data outputs are “don’t care” during the reset
operation.
If RESET# is asserted during a program or erase operation, the RY/BY# output remains low until the reset operation is internally
complete. The RY/BY# pin can be used to determine when the reset operation is complete. Since the device offers simultaneous
read/write operation, the host system may read a bank after a period of tREADY2, if the bank was in the read/reset mode at the time
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RESET# was asserted. If one of the banks was in the middle of either a program or erase operation when RESET# was asserted,
the user must wait a period of tREADY before accessing that bank.
Asserting RESET# during a program or erase operation leaves erroneous data stored in the address locations being operated on at
the time of device reset. These locations need updating after the reset operation is complete. See Hardware Reset (RESET#)
on page 56 for timing specifications.
Asserting RESET# active during VCC and VIO power-up is required to guarantee proper device initialization until VCC and VIO have
reached their steady state voltages. See VCC and VIO Power-up on page 51.
8.4
Synchronous (Burst) Read Mode and Configuration Register
When a series of adjacent addresses need to be read from the device, the synchronous (or burst read) mode can be used to
significantly reduce the overall time needed for the device to output array data. After an initial access time required for the data from
the first address location, subsequent data is output synchronized to a clock input provided by the system.
The device offers a linear method of burst read operation which is discussed in 2-, 4-, 8- Double Word Linear Burst Operation
on page 22.
Since the device defaults to asynchronous read mode after power-up or a hardware reset, the configuration register must be set in
order to enable the burst read mode. Other Configuration Register settings include the number of wait states to insert before the
initial word (tIACC) of each burst access and when RDY indicates that data is ready to be read. Prior to entering the burst mode, the
system first determines the configuration register settings (and read the current register settings if desired via the Read
Configuration Register command sequence), then write the configuration register command sequence. See Configuration Register
on page 24, and Table on page 71 for further details. Once the configuration register is written to enable burst mode operation, all
subsequent reads from the array are returned using the burst mode protocols.
Figure 8.2 Synchronous/Asynchronous State Diagram
Power-up/
Hardware Reset
Asynchronous Read
Mode Only
Set Burst Mode
Configuration Register
Command for
Synchronous Mode
(D15 = 0)
Set Burst Mode
Configuration Register
Command for
Asynchronous Mode
(D15 = 1)
Synchronous Read
Mode Only
The device outputs the initial word subject to the following operational conditions:
 tIACC specification: The time from the rising edge of the first clock cycle after addresses are latched to valid data on the device
outputs.
 Configuration register setting CR13-CR10: The total number of clock cycles (wait states) that occur before valid data appears on
the device outputs. The effect is that tIACC is lengthened.
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Like the main memory access, the Secured Silicon Sector memory is accessed with the same burst or asynchronous timing as
defined in the Configuration Register. However, the user must recognize burst operations past the 256 byte Secured Silicon
boundary returns invalid data.
Burst read operations occur only to the main flash memory arrays. The Configuration Register and protection bits are treated as
single cycle reads, even when burst mode is enabled. Read operations to these locations results in the data remaining valid while
OE# is at VIL, regardless of the number of CLK cycles applied to the device.
8.4.1
2-, 4-, 8- Double Word Linear Burst Operation
In a linear burst read operation, a fixed number of words (2, 4, or 8 double words) are read from consecutive addresses that are
determined by the group within which the starting address falls. Note that 1 double word = 32 bits. See Table for all valid burst
output sequences.
The IND/WAIT# signal, or End of Burst Indicator signal, transitions active (VIL) during the last transfer of data in a linear burst read
before a wrap around. This transition indicates that the system should initiate another ADV# to start the next burst access. If the
system continues to clock the device, the next access wraps around to the starting address of the previous burst access. The IND/
WAIT# signal is floating when not active.
32-Bit Linear and Burst Data Order
Data Transfer Sequence
Two Linear Data Transfers
Output Data Sequence
(Initial Access Address)
0-1 (A0 = 0)
1-0 (A0 = 1)
0-1-2-3 (A1-A0 = 00)
Four Linear Data Transfers
1-2-3-0 (A1-A0 = 01)
2-3-0-1 (A1-A0 = 10)
3-0-1-2 (A1-A0 = 11)
0-1-2-3-4-5-6-7 (A2-A0 = 000)
1-2-3-4-5-6-7-0 (A2-A0 = 001)
2-3-4-5-6-7-0-1 (A2-A0 = 010)
Eight Linear Data Transfers
3-4-5-6-7-0-1-2 (A2-A0 = 011)
4-5-6-7-0-1-2-3 (A2-A0 = 100)
5-6-7-0-1-2-3-4 (A2-A0 = 101)
6-7-0-1-2-3-4-5 (A2-A0 = 110)
7-0-1-2-3-4-5-6 (A2-A0 = 111)
Notes
1. The default configuration in the Control Register for Bit 6 is “1,” indicating that the device delivers data on the rising edge of the CLK signal.
2. The device is capable of holding data for one CLK cycle.
3. If RESET# is asserted low during a burst access, the burst access is immediately terminated and the device defaults back to asynchronous read mode. When this
happens, the DQ data bus signal floats and the Configuration Register contents are reset to their default conditions.
4. CE# must meet the required burst read setup times for burst cycle initiation. If CE# is taken to VIH at any time during the burst linear or burst cycle, the device
immediately exits the burst sequence and floats the DQ bus signal.
5. Restarting a burst cycle is accomplished by taking CE# and ADV# to VIL.
6. A burst access is initiated and the address is latched on the first rising CLK edge when ADV# is active or upon a rising ADV# edge, whichever occurs first. If the ADV#
signal is taken to VIL prior to the end of a linear burst sequence, the previous address is discarded and subsequent burst transfers are invalid. A new burst is initiated
when ADV# transitions back to VIH before a clock edge.
7. The OE# (Output Enable) pin is used to enable the linear burst data on the DQ data bus pin. De-asserting the OE# pin to VIH during a burst operation floats the data
bus, but the device continues to operate internally as if the burst sequence continues until the linear burst is complete. The OE# pin does not halt the burst sequence,
The DQ bus remains in the float state until OE# is taken to VIL.
8. Halting the burst sequence is accomplished by either taking CE# to VIH or re-issuing a new ADV# pulse.
The IND/WAIT# signal is controlled by the OE# signal. If OE# is at VIH, the IND/WAIT# signal floats and is not driven. If OE# is at
VIL, the IND/ WAIT# signal is driven at VIH until it transitions to VIL, indicating the end of the burst sequence. Table lists the valid
combinations of the Configuration Register bits that impact the IND/WAIT# timing. See Figure 8.3 for the IND/WAIT# timing diagram.
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Valid Configuration Register Bit Definition for IND/WAIT#
CR9
(DOC)
CR8
(WC)
CR6
(CC)
0
0
1
IND/WAIT# = VIL for 1-CLK cycle, Active on last transfer, Driven on rising CLK edge
0
1
1
IND/WAIT# = VIL for 1-CLK cycle, Active on second to last transfer, Driven on rising
CLK edge
Definition
Figure 8.3 End of Burst Indicator (IND/WAIT#) Timing for Linear 4 Double Word Burst Operation
VIH
CE#
VIL
CLK
3 Clock Delay
ADV#
Address 1 Latched
Addresses
Address 1
Data
Address 2
Invalid
D1
D2
D3
D0
OE#
IND/WAIT#
Note
Operation is shown for the 32-bit data bus. Figure shown with 3-CLK initial access delay configuration, linear address, 4-doubleword burst, output on rising CLK edge,
data hold for 1-CLK, IND/WAIT# asserted on the last transfer before wrap-around.
8.4.2
Initial Burst Access Delay
Initial Burst Access Delay is defined as the number of clock cycles that must elapse from the first valid clock edge after ADV#
assertion (or the rising edge of ADV#) until the first valid CLK edge when the data is valid. Burst access is initiated and the address
is latched on the first rising CLK edge when ADV# is active or upon a rising ADV# edge, whichever comes first. The Initial Burst
Access Delay is determined in the Configuration Register (CR13-CR10). Refer to Table for the initial access delay configurations
under CR13-CR10. See Figure 8.4 for the Initial Burst Delay Control timing diagram. Note that the Initial Access Delay for a burst
access has no effect on asynchronous read operations.
Burst Initial Access Delay
CR13
CR12
CR11
CR10
Initial Burst Access (CLK cycles)
0
0
0
1
3
0
0
1
0
4
0
0
1
1
5
0
1
0
0
6
0
1
0
1
7
0
1
1
0
8
0
1
1
1
9
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Figure 8.4 Initial Burst Delay Control
1st CLK
2nd CLK
3rd CLK
4th CLK
5th CLK
CLK
ADV#
Address 1 Latched
Addresses
Valid Address
Three CLK Delay
DQ31-DQ03
D0
D1
D2
D3
D4
D0
D1
D2
D3
D0
D1
D2
Four CLK Delay
DQ31-DQ04
Five CLK Delay
DQ31-DQ05
Notes
1. Burst access starts with a rising CLK edge and when ADV# is active.
2. Configurations register 6 is always set to 1 (CR6 = 1). Burst starts and data outputs on the rising CLK edge.
3. CR [13-10] = 1 or three clock cycles.
4. CR [13-10] = 2 or four clock cycles.
5. CR [13-10] = 3 or five clock cycles.
8.4.3
Configuration Register
The configuration register sets various operational parameters associated with burst mode. Upon power-up or hardware reset, the
device defaults to the asynchronous read mode and the configuration register settings are in their default state. (See Table for the
default Configuration Register settings.) The host system determines the proper settings for the entire configuration register, and
then execute the Set Configuration Register command sequence before attempting burst operations. The configuration register is
not reset after deasserting CE#.
The Configuration Register does not occupy any addressable memory location, but rather, is accessed by the Configuration
Register commands. The Configuration Register is readable at any time, however, writing the Configuration Register is restricted to
times when the Embedded Algorithm™ is not active. If the user attempts to write the Configuration Register while the Embedded
Algorithm is active, the write operation is ignored and the contents of the Configuration Register remain unchanged.
The Configuration Register is a 16 bit data field which is accessed by DQ15–DQ0. During a read operation, DQ31–DQ16 returns all
zeroes. Also, the Configuration Register reads operate the same as the Autoselect command reads. When the command is issued,
the bank address is latched along with the command. Read operations to the bank that was specified during the Configuration
Register read command return Configuration Register contents. Read operations to the other bank return flash memory data. Either
bank address is permitted when writing the Configuration Register read command.
The configuration register can be read with a four-cycle command sequence. See Command Definitions on page 71 for sequence
details.
Table describes the Configuration Register settings.
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Configuration Register
Configuration Register
CR15 = Read Mode (RM)
0 = Synchronous Burst Reads Enabled
1 = Asynchronous Reads Enabled (Default)
CR14 = Reserved for Future Enhancements
These bits are reserved for future use. Set these bits to 0.
CR13–CR10 = Initial Burst Access Delay Configuration (IAD3-IAD0)
0000 = 2 CLK cycle initial burst access delay
0100 = 6 CLK cycle initial burst access delay
0001 = 3 CLK cycle initial burst access delay
0101 = 7 CLK cycle initial burst access delay
0010 = 4 CLK cycle initial burst access delay
0110 = 8 CLK cycle initial burst access delay
0011 = 5 CLK cycle initial burst access delay
0111 = 9 CLK cycle initial burst access delay—Default
CR9 = Data Output Configuration (DOC)
0 = Hold Data for 1-CLK cycle—Default
1 = Reserved
CR8 = IND/WAIT# Configuration (WC)
0 = IND/WAIT# Asserted During Delay—Default
1 = IND/WAIT# Asserted One Data Cycle Before Delay
CR7 = Burst Sequence (BS)
0 = Reserved
1 = Linear Burst Order—Default
CR6 = Clock Configuration (CC)
0 = Reserved
1 = Burst Starts and Data Output on Rising Clock Edge—Default
CR5–CR3 = Reserved For Future Enhancements (R)
These bits are reserved for future use. Set these bits to 0.
CR2–CR0 = Burst Length (BL2–BL0)
000 = Reserved, burst accesses disabled (asynchronous reads only)
001 = 64 bit (8-byte) Burst Data Transfer - x32 Linear
010 = 128 bit (16-byte) Burst Data Transfer - x32 Linear
011 = 256 bit (32-byte) Burst Data Transfer - x32 Linear (device default)
100 = Reserved, burst accesses disabled (asynchronous reads only)
101 = Reserved, burst accesses disabled (asynchronous reads only)
110 = Reserved, burst accesses disabled (asynchronous reads only)
Configuration Register After Device Reset
CR15
CR14
CR13
CR12
CR11
CR10
CR9
CR8
RM
Reserve
IAD3
IAD2
IAD1
IAD0
DOC
Reserve
1
0
0
1
1
1
0
0
CR7
CR6
CR5
CR4
CR3
CR2
CR1
CR0
BS
CC
Reserve
Reserve
Reserve
BL2
BL1
BL0
1
1
0
0
0
1
0
0
8.5
Autoselect
The autoselect mode provides manufacturer and device identification, and sector protection verification, through identifier codes
output on DQ7–DQ0. This mode is primarily intended for programming equipment to automatically match a device to be
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programmed with its corresponding programming algorithm. However, the autoselect codes can also be accessed in-system
through the command register.
When using programming equipment, the autoselect mode requires VID on address pin A9. Ad-dress pins A6, A1, and A0 must be
as shown in Table . In addition, when verifying sector protection, the sector address must appear on the appropriate highest order
address bits. Table shows the remaining address bits that are don’t care. When all necessary bits have been set as required, the
programming equipment may then read the corresponding identifier code on DQ7–DQ0.
To access the autoselect codes in-system, the host system can issue the autoselect command via the command. This method does
not require VID. See Command Definitions on page 71 for details on using the autoselect mode. Autoselect mode can be used in
either synchronous (Burst) mode or asynchronous (Non Burst) mode.
The system must write the reset command to exit the autoselect mode and return to reading the array data. See Table for command
sequence details.
S29CD-J and S29CL-J Flash Family Autoselect Codes (High Voltage Method)
A5
to
A8 A7 A6 A4 A3 A2 A1 A0
CE#
OE#
WE#
A19
to
A11
Manufacturer ID: Spansion
L
L
H
X
X
VID
X
X
L
X
X
X
L
L
0001h
Read Cycle 1
L
L
H
X
X
VID
X
L
L
X
L
L
L
H
007Eh
Autoselect Device Code
Description
A10
A9
DQ7
to DQ0
08h or 36h for CD016J
Read Cycle 2
L
L
H
X
X
VID
X
L
L
L
H
H
H
L
46h for CL016J
09h for CD032J
49h for CL032J
0000h
Read Cycle 3
L
L
H
X
X
VID
X
L
L
L
H
H
H
H
Top Boot Option
0001h
Bottom Boot Option
0000h (unprotected)
PPB Protection Status
L
L
H
SA
X
VID
X
L
L
L
L
L
H
L
0001h (protected)
Legend
L = Logic Low = VIL, H = Logic High = VIH, SA = Sector Address, X = Don’t care.
Note
The autoselect codes can also be accessed in-system via command sequences. See Table .
8.6
VersatileI/O (VIO) Control
The VersatileI/O (VIO) control allows the host system to set the voltage levels that the device generates at its data outputs and the
voltages tolerated at its data inputs to the same voltage level that is asserted on the VIO pin. The output voltage generated on the
device is determined based on the VIO level. For the 2.6 V (CD-J), a VIO of 1.65 V–3.6 V (CD032J has a VIO of 1.65 V to 2.75 V)
allows the device to interface with I/Os lower than 2.5 V. For a 3.3 V VCC (CL-J), a VIO of 1.65 V–3.60 V allows the device to
interface with I/Os lower than 3.0 V.
8.7
Program/Erase Operations
These devices are capable of several modes of programming and or erase operations which are described in detail in the following
sections. However, prior to any programming and or erase operation, devices must be set up appropriately as outlined in the
configuration register (Table on page 25). During a synchronous write operation, to write a command or command sequence
(including programming data to the device and erasing sectors of memory), the system must drive ADV# and CE# to VIL, and OE# to
VIH when providing an address to the device, and drive WE# and CE# to VIL, and OE# to VIH when writing commands or
programming data.
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8.7.1
Programming
Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock write cycles, followed
by the program setup command. The program address and data are written next, which in turn initiate the Embedded Program
algorithm. The system is not required to provide further controls or timings. The device automatically generates the program pulses
and verifies the programmed cell margin. Command Definitions on page 71 shows the address and data requirements for the
program command sequence.
Note the following:
 When the Embedded Program algorithm is complete, the device returns to the read mode and address are no longer latched. An
address change is required to begin reading valid array data.
 The system can determine the status of the program operation by using DQ7, DQ6 or RY/BY#. Refer to Write Operation Status
on page 31 for information on these status bits.
 A “0” cannot be programmed back to a “1.” Attempting to do so may halt the operation and set DQ5 to 1, or cause the Data#
Polling algorithm to indicate the operation was successful. A succeeding read shows that the data is still “0.” Only erase operations
can convert a “0” to a “1.”
 Any commands written to the device during the Embedded Program Algorithm are ignored except the Program Suspend
command.
 A hardware reset immediately terminates the program operation; the program command sequence should be re-initiated once the
device has returned to the read mode, to ensure data integrity.
 For the 32Mb S29CD-J and S29CL-J devices only:
Please refer to the application note “Recommended Mode of Operation for Spansion® 110 nm S29CD032J/S29CL032J Flash
Memory” publication number S29CD-CL032J_Recommend_AN for programming best practices.
Figure 8.5 Program Operation
START
Write Program
Command Sequence
Data Poll
from System
Embedded
Program
algorithm
in progress
Verify Data?
No
Yes
Increment Address
No
Last Address?
Yes
Programming
Completed
Note
See Table and Table for program command sequence.
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8.7.2
Sector Erase
The sector erase function erases one or more sectors in the memory array. (See Table , Memory Array Command Definitions (x32
Mode) on page 71 and Figure 8.6, Erase Operation on page 29.) The device does not require the system to preprogram prior to
erase. The Embedded Erase algorithm automatically programs and verifies the entire memory for an all-zero data pattern prior to
electrical erase. After a successful sector erase, all locations within the erased sector contain FFFFh. The system is not required to
provide any controls or timings during these operations.
After the command sequence is written, a sector erase time-out of no less than 80 µs occurs. During the time-out period, additional
sector addresses and sector erase commands may be written. Loading the sector erase buffer may be done in any sequence, and
the number of sectors may be from one sector to all sectors. The time between these additional cycles must be less than 80 µs. Any
sector erase address and command following the exceeded time-out (80 µs) may or may not be accepted. A time-out of 80 µs from
the rising edge of the last WE# (or CE#) initiates the execution of the Sector Erase command(s). If another falling edge of the WE#
(or CE#) occurs within the 80 µs time-out window, the timer is reset. Any command other than Erase Suspend during the time-out
period will be interpreted as an additional sector to erase. The device does not decode the data bus, but latches the address. (See
S29CD016J Sector Erase Time-Out Functionality Application Note for further information.). The system can monitor DQ3 to
determine if the sector erase timer has timed out (See DQ3: Sector Erase Timer on page 36.) The time-out begins from the rising
edge of the final WE# pulse in the command sequence.
When the Embedded Erase algorithm is complete, the bank returns to reading array data; addresses are no longer latched. The
system can determine the status of the erase operation by reading DQ7 or DQ6/DQ2 in the erasing bank. Refer to Write Operation
Status on page 31 for information on these status bits.
Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands are ignored. However,
note that a hardware reset immediately terminates the erase operation. If that occurs, the sector erase command sequence should
be re-initiated once that bank has returned to reading array data, in order to ensure data integrity.
Figure 8.6 on page 29 illustrates the algorithm for the erase operation. Refer to Program/Erase Operations on page 26 for
parameters and timing diagrams.
8.7.3
Chip Erase
Chip erase is a six-bus cycle operation as indicated by Command Definitions on page 71. The Chip Erase command is used to
erase the entire flash memory contents of the chip by issuing a single command. However, chip erase does not erase protected
sectors.
This command invokes the Embedded Erase algorithm, which does not require the system to preprogram prior to erase. The
Embedded Erase algorithm automatically preprograms and verifies the entire memory for an all-zero data pattern prior to electrical
erase. After a successful chip erase, all locations of the chip contain FFFFh. The system is not required to provide any controls or
timings during these operations. Command Definitions on page 71 in the appendix shows the address and data requirements for the
chip erase command sequence.
When the Embedded Erase algorithm is complete, that bank returns to the read mode and addresses are no longer latched. The
system can determine the status of the erase operation by using DQ7, DQ6 or the RY/BY#. Refer to Write Operation Status
on page 31 for information on these status bits.
Any commands written during the chip erase operation are ignored. However, note that a hardware reset immediately terminates the
erase operation. If that occurs, the chip erase command sequence should be reinitiated once that bank has returned to reading array
data, to ensure data integrity.
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Figure 8.6 Erase Operation
START
Write Erase
Command Sequence
Data Poll
from System
Embedded
Erase
algorithm
in progress
No
Data = FFh?
Yes
Erasure Completed
Notes
1. See Command Definitions on page 71 for erase command sequence.
2. See DQ3: Sector Erase Timer on page 36 for more information.
8.7.4
Erase Suspend / Erase Resume Commands
The Erase Suspend command allows the system to interrupt a sector erase operation and then read data from, or program data to,
any sector not selected for erasure. When the Erase Suspend command is written during the sector erase time-out, the device
immediately terminates the time-out period and suspends the erase operation. The bank address is required when writing this
command. This command is valid only during the sector erase operation, including the minimum 80-µs time-out period during the
sector erase command sequence. The Erase Suspend command is ignored if written during the chip erase operation.
When the Erase Suspend command is written after the 80-µs time-out period has expired and during the sector erase operation, the
device takes 20 µs maximum to suspend the erase operation.
After the erase operation has been suspended, the bank enters the erase-suspend-read mode. The system can read data from or
program data to any sector that is not selected for erasure. (The device “erase suspends” all sectors selected for erasure.) Note that
when the device is in the Erase Suspend mode, the Reset command is not required for read operations and is ignored.
Further nesting of erase operation is not permitted. Reading at any address within erase suspended sectors produces status
information on DQ7-DQ0. The system can use DQ6 and DQ2 together, to determine if a sector is actively erasing or is erasesuspended. Refer to Table on page 35 for information on these status bits.
A read operation from the erase-suspended bank returns polling data during the first 8 µs after the erase suspend command is
issued; read operations thereafter return array data. Read operations from the other bank return array data with no latency.
After an erase-suspended program operation is complete, the bank returns to the erase-suspend read mode. The system can
determine the status of the program operation using the DQ7, DQ6, and/or RY/BY# status bits, just as in the standard program
operation.
To resume the sector erase operation, the system must write the Erase Resume command. The bank address of the erasesuspended bank is required when writing this command. Further writes of the Resume command are ignored. Another Erase
Suspend command can be written after the chip has resumed erasing.
The following are the allowable operations when Erase Suspend is issued under certain conditions:
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For the Busy Sectors, the host system may
 Read status
 Write the Erase Resume command
For the Non Busy Sectors, the system may
 Read data
 Program data or write the Suspend/Resume Erase command
8.7.5
Program Suspend/Program Resume Commands
The Program Suspend command allows the system to interrupt an embedded programming operation so that data can read from
any non-suspended sector. When the Program Suspend command is written during a programming process, the device halts the
programming operation and updates the status bits.
After the programming operation has been suspended, the system can read array data from any non-suspended sector. If a read is
needed from the Secured Silicon Sector area, then user must use the proper command sequences to enter and exit this region. The
Sector Erase and Program Resume Command is ignored if the Secured Silicon sector is enabled.
After the Program Resume command is written, the device reverts to programming. The system can determine the status of the
program operation using the DQ7, DQ6, and/or RY/BY# status bits, just as in the standard program operation. See Write Operation
Status on page 31 for more information.
The system must write the Program Resume command in order to exit the Program Suspend mode, and continue the programming
operation. Further writes of the Program Resume command are ignored. Another Program Suspend command can be written after
the device has resumed programming.
The following are the allowable operations when Program Suspend is issued under certain conditions:
 For the Busy Sectors, the host system may write the Program Resume command
 For the Non Busy Sectors, the system may read data
8.7.6
Accelerated Program Operations
Accelerated programming is enabled through the ACC function. This method is faster than the standard program command
sequences.
The device offers accelerated program operations through the ACC pin. When the system asserts VHH (12V) on the ACC pin, the
device automatically enters the Unlock Bypass mode. The system may then write the two-cycle Unlock Bypass program command
sequence to do accelerated programming. The device uses the higher voltage on the ACC pin to accelerate the operation. Any
sector that is being protected with the WP# pin is still protected during accelerated program. Removing VHH from the ACC input,
upon completion of the embedded program operation, returns the device to normal operation.
Notes
 In this mode, the write protection function is bypassed unless the PPB Lock Bit = 1.
 The ACC pin must not be at VHH for operations other than accelerated programming or device damage may result.
 The ACC pin must not be left floating or unconnected; inconsistent behavior of the device may result.
 The Accelerated Program command is not permitted if the Secured Silicon sector is enabled.
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8.7.7
Unlock Bypass
The device features an Unlock Bypass mode to facilitate faster programming, erasing (Chip Erase), as well as CFI commands. Once
the device enters the Unlock Bypass mode, only two write cycles are required to program or erase data, instead of the normal four
cycles for program or 6 cycles for erase. This results in faster total programming/erasing time.
Command Definitions on page 71 shows the requirements for the unlock bypass command sequences.
During the unlock bypass mode only the Read, Unlock Bypass Program and Unlock Bypass Reset commands are valid. To exit the
unlock bypass mode, the system must issue the two-cycle unlock bypass reset command sequence, which returns the device to
read mode.
Notes
1. The Unlock Bypass Command is ignored if the Secured Silicon sector is enabled.
2. Unlike the standard program or erase commands, there is no Unlock Bypass Program/Erase Suspend or Program/Erase
Resume command.
8.7.8
Simultaneous Read/Write
The simultaneous read/write feature allows the host system to read data from one bank of memory while programming or erasing in
another bank of memory.
The Simultaneous Read/Write feature can be used to perform the following:
 Programming in one bank, while reading in the other bank
 Erasing in one bank, while reading in the other bank
 Programming a PPB, while reading data from the large bank or status from the small bank
 Erasing a PPB, while reading data from the large bank or status from the small bank
 Any of the above situations while in the Secured Silicon Sector Mode
The Simultaneous R/W feature can not be performed during the following modes:
 CFI Mode
 Password Program operation
 Password Verify operation
As an alternative to using the Simultaneous Read/Write feature, the user may also suspend an erase or program operation to read
in another location within the same bank (except for the sector being erased).
Restrictions
The Simultaneous Read/Write function is tested by executing an embedded operation in the small (busy) bank while performing
other operations in the big (non-busy) bank. However, the opposite case is neither tested nor valid. That is, it is not tested by
executing an embedded operation in the big (busy) bank while performing other operations in the small (non-busy) bank.
8.8
Write Operation Status
The device provides several bits to determine the status of a program or erase operation. The following subsections describe the
function of DQ7, DQ6, DQ2, DQ5, DQ3, and RY/BY#.
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8.8.1
DQ7: Data# Polling
The Data# Polling bit, DQ7, indicates to the host system whether an Embedded Program or Erase algorithm is in progress or
completed, or whether a bank is in Erase Suspend. Data# Polling is valid after the rising edge of the final WE# pulse in the command
sequence. Note that Data# Polling returns invalid data for the address being programmed or erased.
During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum programmed to DQ7. This DQ7
status also applies to programming during Erase Suspend. When the Embedded Program algorithm is complete, the device outputs
the datum programmed to DQ7. The system must provide the program address to read valid status information on DQ7.
If a program address falls within a protected sector, Data# polling on DQ7 is active for approximately 1 µs, then that bank returns to
the read mode without programming the sector. If an erase address falls within a protected sector, Toggle BIT (DQ6) is active for
150 s, then the device returns to the read mode without erasing the sector. Please note that Data# polling (DQ7) may give
misleading status when an attempt is made to program or erase a protected sector.
During the Embedded Erase Algorithm, Data# polling produces a “0” on DQ7. When the Embedded Erase algorithm is complete
Data# Polling produces a “1” on DQ7. The system must provide an address within any of the sectors selected for erasure to read
valid status information on DQ7.
In asynchronous mode, just prior to the completion of an Embedded Program or Erase operation, DQ7 may change asynchronously
with DQ6-DQ0 while Output Enable (OE#) is asserted low. That is, the device may change from providing status information to valid
data on DQ7. Depending on when the system samples the DQ7 output, it may read the status or valid data. Even if the device has
completed the program or erase operation and DQ7 has valid data, the data outputs on DQ6-DQ0 may be still invalid. Valid data on
DQ7-D00 appears on successive read cycles.
See the following for more information: Table , Write Operation Status on page 37 shows the outputs for Data# Polling on DQ7.
Figure 8.7, Data# Polling Algorithm on page 33 shows the Data# Polling timing diagram.
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Figure 8.7 Data# Polling Algorithm
START
Read DQ7–DQ0
Addr = VA
DQ7 = Data?
Yes
No
No
DQ5 = 1?
Yes
Read DQ7–DQ0
Addr = VA
DQ7 = Data?
Yes
No
FAIL
PASS
Notes
1. VA = Valid address for programming. During a sector erase operation, a valid address is an address within any sector selected for erasure. During chip erase, a valid
address is any non-protected sector address.
2. DQ7 should be rechecked even if DQ5 = 1 because DQ7 may change simultaneously with DQ5
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8.8.2
DQ6: Toggle Bit I
Toggle Bit I on DQ6 indicates whether an Embedded Program or Erase algorithm is in progress or complete, or whether the device
has entered the Erase Suspend mode.
Toggle Bit I may be read at any address in the same bank, and is valid after the rising edge of the final WE# pulse in the command
sequence (prior to the program or erase operation), and during the sector erase time-out.
During an Embedded Program or Erase algorithm operation, two immediate consecutive read cycles to any address cause DQ6 to
toggle. When the operation is complete, DQ6 stops toggling. For asynchronous mode, either OE# or CE# can be used to control the
read cycles. For synchronous mode, the rising edge of ADV# is used or the rising edge of clock while ADV# is Low.
After an erase command sequence is written, if all sectors selected for erasing are protected, DQ6 toggles for approximately 100 µs,
then returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected
sectors, and ignores the selected sectors that are protected.
The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is erase-suspended. When the
device is actively erasing (that is, the Embedded Erase algorithm is in progress), DQ6 toggles. When the device enters the Erase
Suspend mode, DQ6 stops toggling. However, the system must also use DQ2 to determine which sectors are erasing or erasesuspended. Alternatively, the system can use DQ7 (see the subsection on DQ7: Data# Polling).
If a program address falls within a protected sector, DQ6 toggles for approximately 1 µs after the program command sequence is
written, then returns to reading array data.
DQ6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program Algorithm is complete.
See Figure 18.12, Toggle Bit Timings (During Embedded Algorithms) on page 61 for additional information.
8.8.3
DQ2: Toggle Bit II
The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing (that is, the Embedded
Erase algorithm is in progress), or whether that sector is erase-suspended. Toggle Bit II is valid after the rising edge of the final WE#
pulse in the command sequence. DQ2 toggles when the system performs two consecutive reads at addresses within those sectors
that have been selected for erasure. But DQ2 cannot distinguish whether the sector is actively erasing or is erase-suspended. DQ6,
by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are
selected for erasure. Thus, both status bits are required for sector and mode information. Refer to Table to compare outputs for
DQ2 and DQ6. See DQ6: Toggle Bit I on page 34 for additional information.
8.8.4
Reading Toggle Bits DQ6/DQ2
Whenever the system initially begins reading toggle bit status, it must perform two consecutive reads of DQ7-DQ0 in a row in order
to determine whether a toggle bit is toggling. Typically, the system notes and stores the value of the toggle bit after the first read.
After the second read, the system compares the new value of the toggle bit with the first. If the toggle bit is not toggling, the device
completes the program or erases operation. The system can read array data on DQ7-DQ0 on the following read cycle.
However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also notes whether
the value of DQ5 is high (see the section on DQ5). If it is, the system then determines again whether the toggle bit is toggling, since
the toggle bit may have stopped toggling just as DQ5 went high. If the toggle bit is no longer toggling, the device has successfully
completed the program or erases operation. If it is still toggling, the device had not completed the operation successfully, and the
system writes the reset command to return to reading array data.
The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has not gone high. The system
may continue to monitor the toggle bit and DQ5 through successive read cycles, determining the status as described in the previous
paragraph. Alternatively, the system may choose to perform other system tasks. In this case, the system must start at the beginning
of the algorithm when it returns to determine the status of the operation. Refer to Figure 8.8 for more on the Toggle Bit Algorithm.
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DQ6 and DQ2 Indications
If device is
and the system reads
then DQ6
and DQ2
programming,
at any address,
toggles,
does not toggle.
at an address within a sector selected
for erasure,
toggles,
also toggles.
at an address within sectors not
selected for erasure,
toggles,
does not toggle
at an address within sectors selected
for erasure,
does not
toggle,
toggles.
at an address within sectors not
selected for erasure,
returns array
data,
returns array data. The system can
read from any sector not selected for
erasure.
at any address,
toggles,
is not applicable.
actively erasing,
erase suspended,
programming in erase
suspend,
Figure 8.8 Toggle Bit Algorithm
START
Read Byte
(DQ0-DQ7)
Address = VA
(Note 1)
Read Byte
(DQ0-DQ7)
Address = VA
DQ6 = Toggle?
No
Yes
No
DQ5 = 1?
Yes
Read Byte Twice
(DQ0-DQ7)
Adrdess = VA
(Notes 1, 2)
DQ6 = Toggle?
No
Yes
FAIL
PASS
Notes
1. Read toggle bit with two immediately consecutive reads to determine whether or not it is toggling.
2. Recheck toggle bit because it may stop toggling as DQ5 changes to 1.
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8.8.5
DQ5: Exceeded Timing Limits
DQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under these conditions DQ5
produces a 1. This is a failure condition that indicates the program or erase cycle was not successfully completed.
The DQ5 failure condition may appear if the system tries to program a 1 to a location that is previously programmed to 0. Only an
erase operation can change a 0 back to a 1. Under this condition, the device halts the operation, and when the operation has
exceeded the timing limits, DQ5 produces a 1.
Under both these conditions, the system issues the reset command to return the device to reading array data.
8.8.6
DQ3: Sector Erase Timer
After writing a sector erase command sequence, the system may read DQ3 to determine whether or not erasure has begun. (The
sector erase timer does not apply to the chip erase command.) If additional sectors are selected for erasure, the entire time-out also
applies after each additional sector erase command. When the time-out period is complete, DQ3 switches from a “0” to a “1.” If the
time between additional sector erase commands from the system can be assumed to be less than 50 µs, the system need not
monitor DQ3. See Sector Erase on page 28 for more details.
After the sector erase command is written, the system reads the status of DQ7 (Data# Polling) or DQ6 (Toggle Bit I) to ensure that
the device has accepted the command sequence, then reads DQ3. If DQ3 is “1,” the Embedded Erase algorithm has begun; all
further commands (except Erase Suspend) are ignored until the erase operation is complete. If DQ3 is “0,” the device accepts
additional sector erase commands.
To ensure the command has been accepted, the system software check the status of DQ3 prior to and following each sub-sequent
sector erase command. If DQ3 is high on the second status check, the last command might not have been accepted. Table shows
the status of DQ3 relative to the other status bits.
8.8.7
RY/BY#: Ready/Busy#
The device provides a RY/BY# open drain output pin as a way to indicate to the host system that the Embedded Algorithms are
either in progress or have been completed. If the output of RY/BY# is low, the device is busy with either a program, erase, or reset
operation. If the output is floating, the device is ready to accept any read/write or erase operation. When the RY/BY# pin is low, the
device will not accept any additional program or erase commands with the exception of the Erase suspend command. If the device
has entered Erase Suspend mode, the RY/BY# output is floating. For programming, the RY/BY# is valid (RY/BY# = 0) after the
rising edge of the fourth WE# pulse in the four write pulse sequence. For chip erase, the RY/BY# is valid after the rising edge of the
sixth WE# pulse in the six write pulse sequence. For sector erase, the RY/BY# is also valid after the rising edge of the sixth WE#
pulse.
If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a 0 (busy) until the internal reset operation is
complete, which requires a time of tREADY (during Embedded Algorithms). The system can thus monitor RY/BY# to determine
whether the reset operation is complete. If RESET# is asserted when a program or erase operation is not executing (RY/BY# pin is
floating), the reset operation is completed in a time of tREADY (not during Embedded Algorithms). The system can read data tRH after
the RESET# pin returns to VIH.
Since the RY/BY# pin is an open-drain output, several RY/BY# pins can be tied together in parallel with a pull-up resistor to VCC. An
external pull-up resistor is required to take RY/BY# to a VIH level since the output is an open drain.
Table shows the outputs for RY/BY#, DQ7, DQ6, DQ5, DQ3 and DQ2. Figure 18.2, Figure 18.6, Figure 18.8 and Figure 18.9 show
RY/BY# for read, reset, program, and erase operations, respectively.
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Write Operation Status
DQ7
(Note 2)
Operation
Standard
Mode
Erase
Suspend
Mode
Embedded Program Algorithm
DQ6
DQ5
(Note 1)
DQ3
DQ2
(Note 2)
RY/BY#
DQ7#
Toggle
0
N/A
No toggle
0
Embedded Erase Algorithm
0
Toggle
0
1
Toggle
0
Reading within Erase
Suspended Sector
1
No toggle
0
N/A
Toggle
1
Data
Data
Data
Data
Data
1
DQ7#
Toggle
0
N/A
N/A
0
Reading within Non-Erase
Suspended Sector
Erase-Suspend-Program
Notes
1. DQ5 switches to 1 when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. See DQ5: Exceeded Timing Limits
on page 36 for more information.
2. DQ7 and DQ2 require a valid address when reading status information. See DQ7: Data# Polling on page 32 and DQ2: Toggle Bit II on page 34 for further details.
8.9
Reset Command
Writing the reset command resets the device to the read or erase-suspend-read mode. Address bits are don’t cares for this
command.
The reset command may be written between the cycles in an erase command sequence before erasing begins. This resets the
device to the read mode. However, once erasure begins, the device ignores the reset commands until the operation is complete.
The reset command may be written between the cycles in a program command sequence before programming begins. This resets
the device to the read mode. If the program command sequence is written while the device is in the Erase Suspend mode, writing
the reset command returns the device to the erase-suspend-read mode. However, once programming begins, the device ignores the
reset commands until the operation is complete.
The reset command may be written between the cycles in an autoselect command sequence. Once in the autoselect mode, the
reset command must be written to exit the autoselect mode and return to the read mode.
If DQ5 goes high during a program or erase operation, writing the reset command returns the device to the read mode or erasesuspend-read-mode if the device was in Erase Suspend. When the reset command is written, before the embedded operation starts,
the device requires tRR before it returns to the read or erase-suspend-read mode.
Reset Command Timing
Parameter
tRR
Description
Reset Command to Read Mode
or Erase-Suspend-Read Mode
Max.
Unit
250
ns
9. Advanced Sector Protection/Unprotection
The Advanced Sector Protection/Unprotection feature disables or enables programming or erase operations in any or all sectors and
can be implemented through software and/or hardware methods, which are independent of each other. This section describes the
various methods of protecting data stored in the memory array. An overview of these methods in shown in Figure 9.1.
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Figure 9.1 Advanced Sector Protection/Unprotection
Hardware Methods
WP# = VIL
(Two outermost sectors
locked in large bank)
Software Methods
Password Method
Persistent Method
64-bit Password
(One Time Protect)
1,2,3
PPB Lock Bit
0 = PPBs Unlocked
1 = PPBs Locked
1. Bit is volatile, and defaults to “0” on reset.
2. Programming to “1” locks all PPBs to their
current state.
3. Once programmed to “1”, requires hardware
reset to unlock.
Memory Array
Persistent
Protection Bit
(PPB)5,6
Sector Group 0
PPB 0
DYB 0
Sector Group 1
PPB 1
DYB 1
Sector Group 2
PPB 2
DYB 2
Sector Group N-2
PPB N-2
DYB N-2
Sector Group N-1
PPB N-1
DYB N-1
PPB N
DYB N
4
Sector Group N
4. N = 23 for S29CD016J/CL016J,
31 for S29CD032J/CL032J.
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5. PPBs programmed individually,
but cleared collectively.
6. 0 = Sector Group Unprotected;
1 = Sector Group Protected
Dynamic
Protection Bit
(DYB)7,8,9
7. Protect effective only if PPB Lock Bit is
unlocked and corresponding PPB is “0”
(unprotected).
8. Volatile Bits.
9. 0 = Sector Group Unprotected;
1 = Sector Group Protected
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9.1
Advanced Sector Protection Overview
As shipped from the factory, all devices default to the persistent mode when power is applied, and all sector groups are unprotected.
The device programmer or host system must then choose which sector group protection method to use. Programming (setting to “0”)
any one of the following two one-time programmable, non-volatile bits locks the device permanently in that mode:
 Persistent Protection Mode Lock Bit
 Password Protection Mode Lock Bit
After selecting a sector group protection method, each sector group can operate in any of the following three states:
1. Persistently Locked. A sector group is protected and cannot be changed.
2. Dynamically locked. The selected sector groups are protected and can be altered via software commands.
3. Unlocked. The sector groups are unprotected and can be erased and/or programmed.
These states are controlled by the bit types described in sections Persistent Protection Bits on page 39 to Hardware Data Protection
Methods on page 43.
Notes
1. If the password mode is chosen, the password must be programmed before setting the corresponding lock register bit.
The user must be sure that the password is correct when the Password Mode Locking Bit is set, as there is no means to
verify the password afterwards.
2. If both lock bits are selected to be programmed (to zeros) at the same time, the operation aborts.
3. Once the Password Mode Lock Bit is programmed, the Persistent Mode Lock Bit is permanently disabled, and no
changes to the protection scheme are allowed. Similarly, if the Persistent Mode Lock Bit is programmed, the Password
Mode is permanently disabled.
4. It is important that the mode is explicitly selected when the device is first programmed, rather than relying on the default
mode alone. This is so that it is impossible for a system program or virus to later set the Password Mode Locking Bit,
which would cause an unexpected shift from the default Persistent Sector Protection Mode into the Password Protection
Mode.
5. If the user attempts to program or erase a protected sector, the device ignores the command and returns to read mode. A
program command to a protected sector enables status polling for approximately 1 µs before the device returns to read
mode without modifying the contents of the protected sector. An erase command to a protected sector enables status
polling for approximately 50 µs, after which the device returns to read mode without having erased the protected sector.
6. For the command sequence required for programming the lock register bits, refer to Command Definitions on page 71.
9.2
Persistent Protection Bits
The Persistent Protection Bits are unique and nonvolatile. A single Persistent Protection Bit is assigned to a maximum for four
sectors (see the sector address tables for specific sector protection groupings). All eight-Kbyte boot-block sectors have individual
sector Persistent Protection Bits (PPBs) for greater flexibility.
Notes
1. Each PPB is individually programmed and all are erased in parallel. There are no means for individually erasing a specific
PPB and no specific sector address is required for this operation.
2. If a PPB requires erasure, all of the sector PPBs must first be programmed prior to PPB erasing. It is the responsibility of
the user to perform the preprogramming operation. Otherwise, an already erased sector PPB has the potential of being
over-erased. There is no hardware mechanism to prevent sector PPB over-erasure.
3. If the PPB Lock Bit is set, the PPB Program or erase command does not execute and times-out without programming or
erasing the PPB.
9.2.1
Programming PPB
The PPB Program Command is used to program, or set, a given PPB. The first three cycles in the PPB Program Command are
standard unlock cycles. The fourth cycle in the PPB Program Command executes the pulse which programs the specified PPB. The
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user must wait either 100 µs or until DQ6 stops toggling before executing the fifth cycle, which is the read verify portion of the PPB
Program Command. The sixth cycle outputs the status of the PPB Program operation.
In the event that the program PPB operation was not successful, the user can loop directly to the fourth cycle of the PPB Program
Command to perform the program pulse and read verification again. After four unsuccessful loops through the program pulse and
read verification cycles the PPB programming operation should be considered a failure.
Figure 9.2 PPB Program Operation
Write 0xAA to 0x555
Write 0x55 to 0x2AA
Write 0x60 to 0x555
Write 0x68 to SG+WP
Either poll DQ6 in the
small bank and wait for
it to stop toggling OR
wait 100 μs
Note: Reads from the
small bank at this point
return the status of the
operation, not read array
data.
Write 0x48 to SG+WP
Read from SG+WP
NO
NO
5th attempt?
YES
Error
9.2.2
DQ0 = 1?
YES
Done
Erasing PPB
The All PPB Erase command is used to erase all the PPBs in bulk. There are no means for individually erasing a specific PPB. The
first three cycles of the PPB Erase command are standard unlock cycles. The fourth cycle executes the erase pulse to all the PPBs.
The user must wait either 20 ms or until DQ6 stops toggling before executing the fifth cycle, which is the read verify portion of the
PPB Erase Command. The sixth cycle outputs the status of the PPB Erase operation.
In the event that the erase PPB operation was not successful, the user can loop directly to the fourth cycle of the All PPB Erase
Command to perform the erase pulse and read verification again. After four unsuccessful loops through the erase pulse and read
verification cycles, the PPB erasing operation should be considered a failure.
Note
 All PPB must be preprogrammed prior to issuing the All PPB Erase Command.
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Figure 9.3 PPB Erase Operation
Write 0xAA to 0x555
Write 0x55 to 0x2AA
Write 0x60 to 0x555
Write 0x60 to WP
Either poll DQ6 in the
small bank and wait for
it to stop toggling OR
wait 20 ms
Note: Reads from the
small bank at this point
return the status of the
operation, not read array
data.
Write 0x40 to WP
Read from WP
NO
NO
5th attempt?
YES
Error
9.3
DQ0 = 0?
YES
Done
Persistent Protection Bit Lock Bit
The Persistent Protection Bit Lock Bit is a global volatile bit for all sectors. When set to “1”, it locks all PPBs; when set to “0”, it allows
the PPBs to be changed. There is only one PPB Lock Bit per device.
Notes
1. No software command sequence unlocks this bit unless the device is in the password protection mode; only a hardware
reset or a power-up clears this bit.
2. The PPB Lock Bit must be set only after all PPBs are configured to the desired settings.
9.4
Dynamic Protection Bits
A Dynamic Protection Bit (DYB) is volatile and unique for each sector group and can be individually modified. DYBs only control the
protection scheme for unprotected sector groups that have their PPBs set to “0”. By issuing the DYB Set or Clear command
sequences, the DYBS are set or cleared, thus placing each sector group in the protected or unprotected state respectively. This
feature allows software to easily protect sector groups against inadvertent changes, yet does not prevent the easy removal of
protection when changes are needed.
Notes
1. The DYBs can be set or cleared as often as needed with the DYB Write Command.
2. When the parts are first shipped, the PPBs are cleared, the DYBs are cleared, and PPB Lock is defaulted to power up in
the cleared state – meaning the PPBs are changeable. The DYB are also always cleared after a power-up or reset.
3. It is possible to have sector groups that are persistently locked with sector groups that are left in the dynamic state.
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4. The DYB Set or Clear commands for the dynamic sector groups signify the protected or unprotected state of the sector
groups respectively. However, if there is a need to change the status of the persistently locked sector groups, a few more
steps are required. First, the PPB Lock Bit must be cleared by either putting the device through a power-cycle, or
hardware reset. The PPBs can then be changed to reflect the desired settings. Setting the PPB Lock Bit once again locks
the PPBs, and the device operates normally again.
Sector Protection Schemes
DYB
PPB
PPB Lock
0
0
0
Unprotected—PPB and DYB are changeable
Unprotected—PPB not changeable, DYB is changeable
0
0
1
0
1
0
1
0
0
1
1
0
0
1
1
1
0
1
1
1
1
9.5
Sector State
Protected—PPB and DYB are changeable
Protected—PPB not changeable, DYB is changeable
Password Protection Method
The Password Protection Method allows an even higher level of security than the Persistent Sector Protection Mode by requiring a
64-bit password for unlocking the device PPB Lock Bit. In addition to this password requirement, after power-up and reset, the PPB
Lock Bit is set “1” in order to maintain the password mode of operation. Successful execution of the Password Unlock command by
entering the entire password clears the PPB Lock Bit, allowing for sector PPBs modifications.
Notes
1. There is no special addressing order required for programming the password. Once the password is written and verified,
the Password Mode Locking Bit must be set in order to prevent access.
2. The Password Program Command is only capable of programming “0”s. Programming a “1” after a cell is programmed as
a “0” results in a time-out with the cell as a “0”. (This is an OTP area).
3. The password is all “1”s when shipped from the factory.
4. When the password is undergoing programming, Simultaneous Read/Write operation is disabled. Read operations to any
memory location returns the programming status. Once programming is complete, the user must issue a Read/Reset
command to return the device to normal operation.
5. All 64-bit password combinations are valid as a password.
6. There is no means to read, program or erase the password is after it is set.
7. The Password Mode Lock Bit, once set, prevents reading the 64-bit password on the data bus and further password
programming.
8. The Password Mode Lock Bit is not erasable.
9. The exact password must be entered in order for the unlocking function to occur.
10. There is a built-in 2-µs delay for each password check. This delay is intended to stop any efforts to run a program that
tries all possible combinations in order to crack the password.
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9.6
Hardware Data Protection Methods
The device offers several methods of data protection by which intended or accidental erasure of any sectors can be prevented via
hardware means. The following subsections describe these methods.
9.6.1
WP# Method
The Write Protect feature provides a hardware method of protecting the two outermost sectors of the large bank.
If the system asserts VIL on the WP# pin, the device disables program and erase functions in the two “outermost” boot sectors (8Kbyte sectors) in the large bank. If the system asserts VIH on the WP# pin, the device reverts to whether the boot sectors were last
set to be protected or unprotected. That is, sector protection or unprotection for these sectors depends on whether they were last
protected or unprotected.
Note that the WP# pin must not be left floating or unconnected as inconsistent behavior of the device may result.
The WP# pin must be held stable during a command sequence execution
9.6.2
Low VCC Write Inhibit
When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC power-up and power-down.
The command register and all internal program/erase circuits are disabled, and the device resets to reading array data. Subsequent
writes are ignored until VCC is greater than VLKO. The system must provide the proper signals to the control inputs to prevent
unintentional writes when VCC is greater than VLKO.
9.6.3
Write Pulse “Glitch Protection”
Noise pulses of less than 5 ns (typical) on OE#, CE# or WE# do not initiate a write cycle.
9.6.4
Power-Up Write Inhibit
If WE# = CE# = RESET# = VIL and OE# = VIH during power-up, the device does not accept commands on the rising edge of WE#.
The internal state machine is automatically reset to the read mode on power-up.
9.6.5
VCC and VIO Power-up And Power-down Sequencing
The device imposes no restrictions on VCC and VIO power-up or power-down sequencing. Asserting RESET# to VIL is required
during the entire VCC and VIO power sequence until the respective supplies reach the operating voltages. Once VCC and VIO attain
the operating voltages, deassertion of RESET# to VIH is permitted. Refer to timing in VCC and VIO Power-up on page 51.
9.6.6
Logical Inhibit
Write cycles are inhibited by holding any one of OE# = VIL, CE# = VIH, or WE# = VIH. To initiate a write cycle, CE# and WE# must be
a logical zero (VIL) while OE# is a logical one (VIH).
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10. Secured Silicon Sector Flash Memory Region
The Secured Silicon Sector provides an extra Flash memory region that enables permanent part identification through an Electronic
Serial Number (ESN). The Secured Silicon Sector is a 256-byte flash memory area that is either programmable at the customer, or
by Spansion at the request of the customer. See Table for the Secured Silicon Sector address ranges.
All Secured Silicon reads outside of the 256-byte address range return invalid data.
Secured Silicon Sector Addresses
Ordering Option
Sector Size (Bytes)
Address Range
Top Boot
256
00000h-0003Fh (16 Mb and 32 Mb)
Bottom Boot
256
FFFC0h–FFFFFh (32 Mb)
7FFC0h–7FFFFh (16 Mb)
The device allows Simultaneous Read/Write operation while the Secured Silicon Sector is enabled. However, several restrictions
are associated with Simultaneous Read/Write operation and device operation when the Secured Silicon Sector is enabled:
1. The Secured Silicon Sector is not available for reading while the Password Unlock, any PPB program/erase operation, or
Password programming are in progress. Reading to any location in the small bank will return the status of these
operations until these operations have completed execution.
2. Programming the DYB associated with the overlaid boot-block sector results in the DYB NOT being updated. This occurs
only when the Secured Silicon sector is not enabled.
3. Reading the DYB associated with the overlaid boot-block sector when the PPB Lock/DYB Verify command is issued,
causes the read command to return invalid data. This function occurs only when the Secured Silicon Sector is not
enabled.
4. All commands are available for execution when the Secured Silicon Sector is enabled, except the following:
a. Any Unlock Bypass command
b. CFI
c. Accelerated Program
d. Program and Sector Erase Suspend
e. Program and Sector Erase Resume
Issuing the above commands while the Secured Silicon Sector is enabled results in the command being ignored.
5. It is valid to execute the Sector Erase command on any sector other than the Secured Silicon Sector when the Secured
Silicon Sector is enabled. However, it is not possible to erase the Secured Silicon Sector using the Sector Erase
Command, as it is a one-time programmable (OTP) area that can not be erased.
6. Executing the Chip Erase command is permitted when the Secured Silicon Sector is enabled. The Chip Erase command
erases all sectors in the memory array, except for sector 0 in top-boot block configuration, or sector 45 in bottom-boot
block configuration. The Secured Silicon Sector is a one-time programmable memory area that cannot be erased.
7. Executing the Secured Silicon Sector Entry command during program or erase suspend mode is allowed. The Sector
Erase/Program Resume command is disabled when the Secured Silicon sector is enabled; the user cannot resume
programming of the memory array until the Exit Secured Silicon Sector command is written.
8. Address range 00040h–007FFh for the top bootblock, and FF00h–FFF7Fh return invalid data when addressed with the
Secured Silicon sector enabled.
9. The Secured Silicon Sector Entry command is allowed when the device is in either program or erase suspend modes. If
the Secured Silicon sector is enabled, the program or erase suspend command is ignored. This prevents resuming either
programming or erasure on the Secured Silicon sector if the overlayed sector was undergoing programming or erasure.
The host system must ensure that the device resume any suspended program or erase operation after exiting the
Secured Silicon sector.
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10.1
Secured Silicon Sector Protection Bit
The Secured Silicon Sector can be shipped unprotected, allowing customers to utilize that sector in any manner they choose.
Please note the following:
 The Secured Silicon Sector can be read any number of times, but can be programmed and locked only once. The Secured Silicon
Sector Protection Bit must be used with caution as once locked, there is no procedure available for unlocking the Secured Silicon
Sector area and none of the bits in the Secured Silicon Sector memory space can be modified in any way.
 Once the Secured Silicon Sector is locked and verified, the system must write the Exit Secured Silicon Sector Region command
sequence to return the device to the memory array.
10.2
Secured Silicon Sector Entry and Exit Commands
The system can access the Secured Silicon Sector region by issuing the three-cycle Enter Secured Silicon Sector command
sequence. The device continues to access the Secured Silicon Sector region until the system issues the four-cycle Exit Secured
Silicon Sector command sequence. See the Table , Memory Array Command Definitions (x32 Mode) on page 71 and Table , Sector
Protection Command Definitions (x32 Mode) on page 72 for address and data requirements for both command sequences.
The Secured Silicon Sector Entry Command allows the following commands to be executed
 Read Secured Silicon areas
 Program Secured Silicon Sector (only once)
After the system has written the Enter Secured Silicon Sector command sequence, it can read the Secured Silicon Sector by using
the addresses listed in Table , Secured Silicon Sector Addresses on page 44. This mode of operation continues until the system
issues the Exit Secured Silicon Sector command sequence, or until power is removed from the device.
11. Electronic Marking
Electronic marking has been programmed into the device, prior to shipment from Spansion, to ensure traceability of individual
products. The electronic marking is stored and locked within a one-time programmable region. Detailed information on Electronic
Marking will be provided in a data sheet supplement.
12. Power Conservation Modes
12.1
Standby Mode
When the system is not reading or writing to the device, it can place the device in standby mode. In this mode, current consumption
is greatly reduced, and outputs are placed in a high impedance state, independent of OE# input. The device enters CMOS standby
mode when the CE# and RESET# inputs are both held at
VCC ± 10%. The device requires standard access time (tCE) for read access before it is ready to read data. If the device is
deselected during erasure or programming, the device draws active current until the operation is completed.
ICC5 in DC Characteristic, CMOS Compatible on page 48 represents the standby current specification.
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Caution
Entering standby mode via the RESET# pin also resets the device to read mode and floats the data I/O pins. Furthermore, entering
ICC7 during a program or erase operation leaves erroneous data in the address locations being operated on at the time of the
RESET# pulse. These locations require updating after the device resumes standard operations. See Hardware RESET# Input
Operation on page 46for further discussion of the RESET# pin and its functions.
12.2
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy consumption. The automatic sleep mode is independent of the CE#, WE#
and OE# control signals. While in sleep mode, output data is latched and always available to the system.
While in asynchronous mode, the device automatically enables this mode when addresses remain stable for tACC + 60 ns. Standard
address access timings provide new data when addresses are changed. While in synchronous mode, the device automatically
enables this mode when either the first active CLK level is greater than tACC or the CLK runs slower than 5 MHz. A new burst
operation is required to provide new data.
ICC8 in DC Characteristic, CMOS Compatible on page 48 represents the automatic sleep mode current specification.
12.3
Hardware RESET# Input Operation
The RESET# input provides a hardware method of resetting the device to reading array data. When RESET# is driven low, the
device immediately terminates any operation in progress, tristates all outputs, resets the configuration register, and ignores all read/
write commands for the duration of the RESET# pulse. The device also resets the internal state machine to reading array data. Any
operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, in order to
ensure data integrity.
When RESET# is held at VSS ±0.2 V, the device draws CMOS standby current (ICC4). If RESET# is held at VIL but not within VSS
±0.2 V, the standby current is greater.
RESET# may be tied to the system reset circuitry, thus a system reset would also reset the Flash memory, enabling the system to
read the boot-up firmware from the Flash memory.
If RESET# is asserted during a program or erase operation, the RY/BY# pin remains low until the reset operation is internally
complete. This action requires between 1 µs and 7 µs for either Chip Erase or Sector Erase. The RY/BY# pin can be used to
determine whether the reset operation is complete. Otherwise, allow for the maximum reset time of 11 µs.
If RESET# is asserted when a program or erase operation is not executing (RY/BY# = 1), the reset operation completes within 500
ns. The Simultaneous Read/Write feature of this device allows the user to read a bank after 500 ns if the bank is in the read/reset
mode at the time RESET# is asserted. If one of the banks is in the middle of either a program or erase operation when RESET# is
asserted, the user must wait 11 µs before accessing that bank.
Asserting RESET# active during VCC and VIO power up is required to guarantee proper device initialization until VCC and VIO have
reached steady state voltages.
12.4
Output Disable (OE#)
When the OE# input is at VIH, output from the device is disabled. The outputs are placed in the high impedance state.
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13. Electrical Specifications
13.1
Absolute Maximum Ratings
Absolute Maximum Ratings
Parameter
Rating
Storage Temperature, Plastic Packages
–65 °C to +150 °C
Ambient Temperature with Power Applied
–65 °C to +145 °C
VCC, VIO (Note 1) for 2.6 V devices (S29CD-J)
–0.5V to +3.6V
VCC, VIO (Note 1) for 3.3 V devices (S29CL-J)
–0.5V to +3.6V
ACC, A9, and RESET# (Note 2)
–0.5V to +13.0V
(with the exception of CLK)
Address, Data, Control Signals (Note 1)
All other pins (Note 1)
–0.5V to +3.6V (CL016J)
–0.5V to +2.75V (CD016J)
–0.5V to +3.6V (CL032J)
–0.5V to +2.75V (CD032J)
Output Short Circuit Current (Note 3)
200 mA
Notes
1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, input at I/O pins may overshoot VSS to –2.0V for periods of up to 20 ns. See Figure 13.2.
Maximum DC voltage on output and I/O pins is 3.6V. During voltage transitions output pins may overshoot to VCC + 2.0V for periods up to 20 ns. See Figure 13.2.
2. Minimum DC input voltage on pins ACC, A9, and RESET# is -0.5V. During voltage transitions, A9 and RESET# may overshoot
VSS to –2.0V for periods of up to 20 ns. See Figure 13.1. Maximum DC input voltage on pin A9 is +13.0V which may overshoot to 14.0V for periods up to 20 ns.
3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second.
4. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum
rating conditions for extended periods may affect device reliability.
Figure 13.1 Maximum Negative Overshoot Waveform
20 ns
20 ns
+0.8 V
–0.5 V
–2 V
20 ns
Figure 13.2 Maximum Positive Overshoot Waveform
20 ns
V CC +2.0 V
V CC +0.5 V
2.0 V
20 ns
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14. Operating Ranges
Operating Ranges
Parameter
Ambient Temperature (TA)
VCC Supply Voltages
VIO Supply Voltages
Range
Industrial Devices
–40°C to +85°C
Extended Devices
–40°C to +125°C
VCC for 2.6V regulated voltage range (S29CD-J devices)
2.50V to 2.75V
VCC for 3.3V regulated voltage range (S29CL-J devices)
3.00V to 3.60V
VIO (S29CD-J devices)
1.65V to 2.75V
VIO (S29CL-J devices)
1.65V to 3.6V
Note
Operating ranges define those limits between which the functionality of the device is guaranteed.
15. DC Characteristics
DC Characteristic, CMOS Compatible
Parameter
ILI
Description
Input Load Current
Max
Unit
VIN = VSS to VIO, VIO = VIO max
Test Conditions
Min
Typ
1.0
µA
WP# Input Load Current
VIN = VSS to VIO, VIO = VIO max
–25
µA
ILIT
A9, ACC Input Load Current
VCC = VCCmax; A9 = 12.5V
35
µA
ILO
Output Leakage Current
VOUT = VSS to VCC, VCC = VCC max
ILIWP
1.0
µA
45
55
mA
S29CL-J
65
90
mA
10
mA
ICCB
VCC Active Burst Read Current (1)
CE# = VIL, OE# = VIL, 8 Double
Word
S29CD-J
ICC1
VCC Active Asynchronous
Read Current (1)
CE# = VIL, OE# = VIL
1 MHz
ICC3
VCC Active Program Current
(2, 3, 4)
CE# = VIL, OE# = VIH, ACC = VIH
40
50
mA
ICC4
VCC Active Erase Current (2, 3, 4)
CE# = VIL, OE# = VIH, ACC = VIH
20
50
mA
ICC5
VCC Standby Current (CMOS)
VCC= VCC max, CE# = VCC  0.3V
60
µA
ICC6
VCC Active Current
(Read While Write) (3)
CE# = VIL, OE# = VIL
90
mA
ICC7
VCC Reset Current
RESET# = VIL
60
µA
ICC8
Automatic Sleep Mode Current
VIH = VCC 0.3 V, VIL = VSS 0.3V
60
µA
IACC
VACC Acceleration Current
ACC = VHH
20
mA
30
VIL
Input Low Voltage
–0.5
0.3 x VIO
V
VIH
Input High Voltage
0.7 x VIO
VCC
V
–0.2
0.3 x VIO
V
0.7 x VCC
2.75
V
0.7 x VCC
3.6
V
11.5
12.5
V
VILCLK
CLK Input Low Voltage
VIHCLK
CLK Input High Voltage (CD-J)
VIHCLK
CLK Input High Voltage (CL-J)
VID
Voltage for Autoselect
VOL
Output Low Voltage
IOL = 4.0 mA, VCC = VCC min
RY/BY#, Output Low Current
VOL = 0.4V
IOLRB
VCC = 2.5V
0.45
8
V
mA
VHH
Accelerated (ACC pin) High Voltage
IOH = –2.0 mA, VCC = VCC min
0.85 x VCC
V
VOH
Output High Voltage
IOH = –100 µA, VCC = VCC min
VIO –0.1
V
VLKO
Low VCC Lock-Out Voltage (3)
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1.6
2.0
V
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Notes
1. The ICC current listed includes both the DC operating current and the frequency dependent component.
2. ICC active while Embedded Erase or Embedded Program is in progress.
3. Not 100% tested.
4. Maximum ICC specifications are tested with VCC = VCCmax.
15.1
Zero Power Flash
Figure 15.1 ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents)
Supply Current in mA
4
3
2
1
0
0
500
1000
1500
2000
2500
3000
3500
4000
Time in ns
Note
Addresses are switching at 1 MHz
Figure 15.2 Typical ICC1 vs. Frequency
5
2.7 V
Supply Current in mA
4
3
2
1
0
1
2
3
4
5
Frequency in MHz
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16. Test Conditions
Figure 16.1 Test Setup
Device
Under
Test
CL
17. Test Specifications
Test Specifications
Test Condition
All Options
Output Load
Unit
1 TTL gate
Output Load Capacitance, CL (including jig capacitance)
30
pF
Input Rise and Fall Times
5
ns
0.0V – VIO
V
Input timing measurement reference levels
VIO/2
V
Output timing measurement reference levels
VIO/2
V
Input Pulse Levels
Key to Switching Waveforms
Waveform
Inputs
Outputs
Steady
Changing from H to L
Changing from L to H
17.1
Don’t Care, Any Change Permitted
Changing, State Unknown
Does Not Apply
Center Line is High Impedance State (High-Z)
Switching Waveforms
Figure 17.1 Input Waveforms and Measurement Levels
VIO
Input
VIO/2 V
Measurement Level
VIO/2 V
Output
VSS
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18. AC Characteristics
18.1
VCC and VIO Power-up
VCC and VIO Power-up
Parameter
Description
Test Setup
Speed
Unit
tVCS
VCC Setup Time
Min
50
µs
tVIOS
VIO Setup Time
Min
50
µs
tRSTH
RESET# Low Hold Time
Min
50
µs
Figure 18.1 VCC and VIO Power-up Diagram
tVCS
VCC
tVIOS
VIOP
tRSTH
RESET#
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18.2
Asynchronous Operations
Asynchronous Read Operations
Parameter
Speed Options
JEDEC
Std.
Description
tAVAV
tRC
Read Cycle Time (Note 1)
tAVQV
tACC
Address to Output Delay
CE# = VIL
OE# = VIL
OE# = VIL
75 MHz
0R
Test Setup
66 MHz
0P
56 MHz
0M
40 MHz
0J/1J
Unit
Min
54
ns
Max
54
ns
tELQV
tCE
Chip Enable to Output Delay
Max
54
ns
tGLQV
tOE
Output Enable to Output Delay
Max
20
ns
tEHQZ
tDF
Chip Enable to Output High-Z
(Note 1)
Max
10
ns
tGHQZ
tDF
Output Enable to Output High-Z (Note 1)
tAXQX
Min
2
ns
Max
10
ns
Read
Min
0
ns
Toggle and
Data# Polling
Min
10
ns
Min
2
ns
tOEH
Output Enable Hold Time
(Note 1)
tOH
Output Hold Time From Addresses, CE# or OE#,
Whichever Occurs First (Note 1)
Notes
1. Not 100% tested.
2. See Figure 16.1 and Table for test specifications.
3. TOE during Read Array.
Figure 18.2 Conventional Read Operations Timings
tRC
Addresses Stable
Addresses
tACC
CE#
tDF
tOE
OE#
tOEH
WE#
tCE
tOH
High Z
High Z
Output Valid
Outputs
RESET#
RY/BY#
0V
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Figure 18.3 Asynchronous Command Write Timing
CLK
ADV#
CE#
tCS
tCH
tWC
Stable Address
Addresses
Data
Valid Data
tAS
tAH
tDS
WE#
tDH
tWEH
OE#
tOEP
IND/WAIT#
Notes
1. All commands have the same number of cycles in both asynchronous and synchronous modes, including the READ/RESET command. Only a single array access
occurs after the F0h command is entered. All subsequent accesses are burst mode when the burst mode option is enabled in the Configuration Register.
2. Refer to Table for write timing parameters.
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18.3
Synchronous Operations
Burst Mode for 32 Mb and 16 Mb
Parameter
Speed Options
Description
JEDEC
Std.
66 MHz,
0P
56 MHz,
0M
40 MHz,
0J/1J
Unit
8
8
8
8
ns
tBACC
Burst Access Time Valid Clock to Output Delay
tADVCS
ADV# Setup Time to Rising Edge of CLK
Min
6
ns
tADVCH
ADV# Hold Time from Rising Edge of CLK
Min
1.5
ns
tADVP
Max
75 MHz,
0R
ADV# Pulse Width
16 Mb
Min
7.5
8.5
9.5
10.5
ns
Min
2
2
3
3
ns
Min
0
0
0
0
ns
tBDH
Valid Data Hold from CLK (Note 2)
tINDS
CLK to Valid IND/WAIT# (Note 2)
tINDH
IND/WAIT# Hold from CLK (Note 2)
Min
2
2
3
3
ns
tIACC
CLK to Valid Data Out, Initial Burst Access
Max
48
54
54
54
ns
tCLK
CLK Period
Min
13.3
15.15
17.85
25
ns
tCR
tCF
tCLKH
CLK High Time (Note 3)
Min
6.65
6.8
8.0
11.25
ns
tCLKL
CLK Low Time (Note 3)
Min
6.65
6.8
8.0
11.25
ns
Output Enable to Output Valid
Max
Min
2
2
3
3
tOE
32 Mb
Max
8
ns
Max
60
CLK Rise Time (Note 2)
Max
3
ns
CLK Fall Time (Note 2)
Max
3
ns
20
ns
ns
tDF
tOEZ
Output Enable to Output High-Z (Note 2)
Max
7.5
10
15
17
tEHQZ
tCEZ
Chip Enable to Output High-Z (Note 2)
Max
7.5
10
15
17
ns
4
4
5
6
ns
tCES
CE# Setup Time to Clock
Min
tAAVS
ADV# Falling Edge to Address Valid (Note 1)
Max
6.5
ns
tAAVH
Address Hold Time from Rising Edge of ADV#
Min
1
CLK
cycle
tRSTZ
RESET# Low to Output High-Z (Note 2)
Max
tWADVH1 ADV# Falling Edge to WE# Falling Edge
Min
tWADVH2 ADV# Rising Edge to WE# Rising Edge
tWADVS
WE# Rising Edge Setup to ADV# Falling Edge
7.5
10
15
0
17
ns
ns
Min
10
ns
Min
11.75
ns
Notes
1. Using the max tAAVS and min tADVCS specs together will result in incorrect data output.
2. Not 100% tested
3. Recommended 50% Duty Cycle
Document Number: 002-00948 Rev. *A
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Figure 18.4 Burst Mode Read (x32 Mode)
tCES
tCEZ
CE#
CLK
tADVCS
ADV#
tAAVH
Addresses
Aa
tBDH
tBACC
Data
Da
tIACC
tAAVS
Da+1
Da+2
Da + 3
Da + 7
tOE
tOEZ
OE#
IND#
tINDS
tINDH
Figure 18.5 Synchronous Command Write/Read Timing
CE#
tCES
CLK
tADVCS
tADVP
ADV#
Valid Address
Addresses
tAS
Valid Address
Valid Address
tADVCH
Data
WE#
tEHQZ
Data In
Data Out
tWADVH2
tWADVH1
OE#
tWC
tDS
tWP
tDF
tOE
tDH
10 ns
IND/WAIT#
tWADVS
Note
All commands have the same number of cycles in both asynchronous and synchronous modes, including the READ/RESET command. Only a single array access occurs
after the F0h command is entered. All subsequent accesses are burst mode when the burst mode option is enabled in the Configuration Register.
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18.4
Hardware Reset (RESET#)
Hardware Reset (RESET#)
Parameter
JEDEC
Std.
Description
Test Setup
All Speed
Options
Unit
tREADY
RESET# Pin Low (During embedded Algorithms) to Read or Write
(See Note)
Max
11
µs
tREADY2
RESET# Pin Low (Not during embedded Algorithms) to Read or
Write (See Note)
Min
500
ns
tRP
RESET# Pulse Width
Min
500
ns
tRH
RESET# High time Before Read (See Note)
Min
50
ns
tRPD
RESET# Low to Standby Mode
Min
20
µs
tRB
RY/BY # Recovery Time
Min
0
ns
RESET # Active for Bank NOT Executing Algorithm
Min
500
ns
tREADY3
Note
Not 100% tested.
Figure 18.6 RESET# Timings
RY/BY#
CE#, OE#
tRH
RESET#
tRP
tREADY2
Reset Timing to Bank NOT Executing Embedded Algorithm
Reset Timing to Bank Executing Embedded Algorithm
tREADY
RY/BY#
tRB
CE#, OE#
RESET#
tRP
Document Number: 002-00948 Rev. *A
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18.5
Write Protect (WP#)
Figure 18.7 WP# Timing
Program/Erase Command
Data
tDS
tDH
tWP
WE#
tWPWS
Valid WP#
WP#
tBUSY
tWPRH
RY/BY#
18.6
Erase/Program Operations
Erase/Program Operations
Parameter
All Speed
Options
Unit
60
ns
Min
0
ns
Min
11.75
ns
Min
18
ns
Min
2
ns
Read Recovery Time Before Write
(OE# High to WE# Low, WE# Hold Time) (Note 1)
Min
0
ns
tOEP
OE# Pulse Width (Note 1)
Min
16
ns
tCS
CE# Setup Time
Min
0
ns
tWHEH
tCH
CE# Hold Time
Min
0
ns
tWLWH
tWP
WE# Width
Min
25
ns
JEDEC
Std.
tAVAX
tWC
Write Cycle Time (Note 1)
tAVWL
tAS
Address Setup Time
tWLAX
tAH
Address Hold Time from WE# Falling Edge
tDVWH
tDS
Data Setup to WE# Rising Edge
tWHDX
tDH
Data Hold from WE# Rising Edge
tGHWL
tWEH
tELWL
Description
Min
tWHWL
tWPH
Write Pulse Width High
Min
30
ns
tWHWH1
tWHWH1
Programming Operation (Note 2), Double-Word
Typ
9
µs
tWHWH2
tWHWH2
Sector Erase Operation (Note 2)
Typ
0.5
sec.
tVCS
VCC Setup Time (Note 1)
Min
50
µs
tRB
Recovery Time from RY/BY# (Note 1)
Min
0
ns
tBUSY
RY/BY# Delay After WE# Rising Edge (Note 1)
Max
90
ns
tWPWS
WP# Setup to WE# Rising Edge with Command (Note 1)
Min
20
ns
tWPRH
WP# Hold after RY/BY# Rising Edge (Note 1)
Max
2
ns
Notes
1. Not 100% tested.
2. See Command Definitions on page 71 for more information.
3. Program Erase Parameters are the same, regardless of Synchronous or Asynchronous mode.
Document Number: 002-00948 Rev. *A
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Figure 18.8 Program Operation Timings
Program Command Sequence (last two cycles)
tAS
tWC
Addresses
555h
Read Status Data (last two cycles)
PA
CE#
PA
PA
tCH
OE#
tAH
tWHWH1
tWP
WE#
tWPH
tCS
tDS
Data
tDH
tDH
A0h
PD
Status
tBUSY
DOUT
tRB
RY/BY#
VCC
tVCS
Note
PA = program address, PD = program data, DOUT is the true data at the program address.
Document Number: 002-00948 Rev. *A
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Figure 18.9 Chip/Sector Erase Operation Timings
Erase Command Sequence (last two cycles)
tAS
tWC
2AAh
Addresses
Read Status Data
VA
SA
VA
555h for chip erase
CE#
tCH
OE#
tAH
tWP
WE#
tWPH
tCS
tDS
tWHWH2
tDH
tDH
Data
In
Progress
30h
Complete
10 for Chip Erase
tBUSY
tRB
RY/BY#
tVCS
VCC
Note
SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see Write Operation Status on page 31).
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Figure 18.10 Back-to-back Cycle Timings
Addresses
tWC
tWC
tRC
Valid PA
Valid RA
tWC
Valid PA
Valid PA
tAH
tCPH
tACC
tCE
CE#
tCP
tOE
OE#
tOEH
tGHWL
tWP
tWPH
WE#
tDF
tWPH
tDS
tOH
tDH
Valid
Out
Valid
In
Data
Valid
In
Valid
In
tSR/W
WE# Controlled Write Cycle
Read Cycle
CE# Controlled Write Cycles
Figure 18.11 Data# Polling Timings (During Embedded Algorithms)
‘
tWC
tRC
Addresses
VA
VA
VA
tACC
tCE
CE#
tCH
tOE
OE#
tOEH
tDF
WE#
tOH
High Z
DQ7
Complement
Complement
Data
Status Data
Status Data
True
Valid Data
High Z
True
Valid Data
tBUSY
RY/BY#
Note
VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle.
Document Number: 002-00948 Rev. *A
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Figure 18.12 Toggle Bit Timings (During Embedded Algorithms)
tRC
Addresses
VA
VA
VA
VA
tACC
tCE
CE#
tCH
tOE
OE#
tOEH
tDF
WE#
tOH
High Z
DQ6/DQ2
tBUSY
Valid Status
Valid Status
(first read)
(second read)
Valid Status
Valid Data
(stops toggling)
RY/BY#
Note
VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status read cycle, and array data read cycle.
Document Number: 002-00948 Rev. *A
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Figure 18.13 DQ2 vs. DQ6 for Erase/Erase Suspend Operations
WE#
Enter Embedded
Erasing
Erase
Suspend
Enter Erase
Suspend Program
Erase Suspend
Read
Erase
Erase
Resume
Erase Suspend
Program
Erase Suspend
Read
Erase
Erase
Complete
DQ6
DQ2
Note
The system may use CE# or OE# to toggle DQ2 and DQ6. DQ2 toggles only when read at an address within an erase-suspended sector.
Figure 18.14 Synchronous Data Polling Timing/Toggle Bit Timings
CE#
CLK
ADV#
Addresses
VA
VA
OE#
tOE
tOE
Data
Status Data
Status Data
RDY
Notes
1. The timings are similar to synchronous read timings and asynchronous data polling Timings/Toggle bit Timing.
2. VA = Valid Address. Two read cycles are required to determine status. When the Embedded Algorithm operation is complete, the toggle bits will stop toggling.
3. RDY is active with data (A18 = 0 in the Configuration Register). When A18 = 1 in the Configuration Register, RDY is active one clock cycle before data.
4. Data polling requires burst access time delay.
Document Number: 002-00948 Rev. *A
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Figure 18.15 Sector Protect/Unprotect Timing Diagram
VIH
RESET#
SA, A6,
A1, A0
Valid*
Valid*
Sector Protect/Unprotect
Data
60h
1 µs
Valid*
Verify
60h/68h**
40h/48h***
Status
Sector Protect: 150 µs
Sector Unprotect: 15 ms
CE#
WE#
OE#
Notes
* Valid address for sector protect: A[7:0] = 3Ah. Valid address for sector unprotect: A[7:0] = 3Ah.
** Command for sector protect is 68h. Command for sector unprotect is 60h.
*** Command for sector protect verify is 48h. Command for sector unprotect verify is 40h.
Document Number: 002-00948 Rev. *A
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18.7
Alternate CE# Controlled Erase/Program Operations
Alternate CE# Controlled Erase/Program Operations
Parameter
JEDEC
Std.
Description
tAVAV
tWC
Write Cycle Time (Note 1)
Min
All Speed
Options
Unit
65
ns
tAVEL
tAS
Address Setup Time
Min
0
ns
tELAX
tAH
Address Hold Time
Min
45
ns
tDVEH
tDS
Data Setup Time
tEHDX
tDH
tGHEL
tGHEL
Data Hold Time
Min
35
ns
16 Mb
Min
2
ns
32 Mb
Min
5
ns
Min
0
ns
Read Recovery Time Before Write (OE# High to WE# Low)
tWLEL
tWS
WE# Setup Time
Min
0
ns
tEHWH
tWH
WE# Hold Time
Min
0
ns
tWP
WE# Width
Min
25
ns
tCP
CE# Pulse Width
Min
20
ns
CE# Pulse Width High
Min
30
ns
Typ
9
µs
tELEH
tEHEL
tCPH
tWHWH1
tWHWH1
Programming Operation (Note 2)
tWHWH2
tWHWH2
Sector Erase Operation (Note 2)
Typ
0.5
sec
WE# Rising Edge Setup to CLK Rising Edge
Min
5
ns
tWCKS
Double-Word
Notes
1. Not 100% tested.
2. See Command Definitions on page 71 for more information.
Document Number: 002-00948 Rev. *A
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Figure 18.16 Alternate CE# Controlled Write Operation Timings
PA for program
SA for sector erase
555 for chip erase
555 for program
2AA for erase
Data# Polling
PA
Addresses
tAS
tWC
tAH
tWH
tWP
WE#
tWPH
tGHEL
OE#
tWHWH1 or 2
tCP
CE#
tWS
tCPH
tBUSY
tDS
tDH
DQ7#
Data
tRH
A0 for program
55 for erase
DOUT
PD for program
30 for sector erase
10 for chip erase
RESET#
RY/BY#
Notes
1. PA = program address, PD = program data, DQ7# = complement of the data written to the device, DOUT = data written to the device.
2. Figure indicates the last two bus cycles of the command sequence.
Document Number: 002-00948 Rev. *A
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18.8
Erase and Programming Performance
Erase and Programming Performance
Typ
(Note 1)
Parameter
Sector Erase Time
Chip Erase Time
Max
(Note 2)
Unit
0.5
5
s
16 Mb = 23
32 Mb = 46
16 Mb = 230
32 Mb = 460
s
8
130
µs
Double Word Program Time
Accelerated Double Word Program Time
8
130
µs
Accelerated Chip Program Time
16 Mb = 5
32 Mb = 10
16 Mb = 50
32 Mb = 100
s
Chip Program Time, x32 (Note 3)
16 Mb = 12
32 Mb = 24
16 Mb = 120
32 Mb = 240
s
Comments
Excludes 00h programming prior to erasure
(Note 4)
Excludes system level overhead (Note 5)
Notes
1. Typical program and erase times assume the following conditions: 25°C, 2.5V VCC, 100K cycles. Additionally, programming typicals assume checkerboard pattern.
2. Under worst case conditions of 145°C, VCC = 2.5V, 1M cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table and Table for further information on
command definitions.
6. PPBs have a program/erase cycle endurance of 100 cycles.
7. Guaranteed cycles per sector is 100K minimum.
18.9
PQFP and Fortified BGA Pin Capacitance
PQFP and Fortified BGA Pin Capacitance
Parameter Symbol
Parameter Description
Test Setup
Typ
Max
Unit
CIN
Input Capacitance
VIN = 0
6
7.5
pF
COUT
Output Capacitance
VOUT = 0
8.5
12
pF
CIN2
Control Pin Capacitance
VIN = 0
7.5
9
pF
Notes
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
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19. Appendix 1
19.1
Common Flash Memory Interface (CFI)
The Common Flash Interface (CFI) specification outlines device and host system software interrogation handshake, which allows
specific vendor-specified software algorithms to be used for entire families of devices. Software support can then be deviceindependent, JEDEC ID-independent, and forward- and backward-compatible for the specified flash device families. Flash vendors
can standardize existing interfaces for long-term compatibility.
This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address 55h in word mode (or
address AAh in byte mode), any time the device is ready to read array data. The system can read CFI information at the addresses
given in Table -Table . In order to terminate reading CFI data, the system must write the reset command.
The system can also write the CFI query command when the device is in the autoselect mode. The device enters the CFI query
mode, and the system can read CFI data at the addresses given in Table -Table . The system must write the reset command to
return the device to the autoselect mode.
For further information, please refer to the CFI Specification and CFI Publication 100. Contact a Spansion representative for copies
of these documents.
CFI Query Identification String
Addresses
Data
10h
11h
12h
0051h
0052h
0059h
Query Unique ASCII string QRY
13h
14h
0002h
0000h
Primary OEM Command Set
15h
16h
0040h
0000h
Address for Primary Extended Table
17h
18h
0000h
0000h
Alternate OEM Command Set (00h = none exists)
19h
1Ah
0000h
0000h
Address for Alternate OEM Extended Table (00h = none exists)
Document Number: 002-00948 Rev. *A
Description
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CFI System Interface String
Addresses
1Bh
Data
(see description)
Description
VCC Min. (write/erase)
DQ7–DQ4: volts, DQ3–DQ0: 100 millivolt
0025h = S29CD-J devices
0030h = S29CL-J devices
VCC Max. (write/erase)
DQ7–DQ4: volts, DQ3–DQ0: 100 millivolt
1Ch
(see description)
1Dh
0000h
1Eh
0000h
VPP Max. voltage (00h = no VPP pin present)
1Fh
0004h
Typical timeout per single word/doubleword program 2N µs
20h
0000h
Typical timeout for Min. size buffer program 2N µs (00h = not supported)
21h
0009h
Typical timeout per individual block erase 2N ms
22h
0000h
Typical timeout for full chip erase 2N ms (00h = not supported)
23h
0005h
Max. timeout for word/doubleword program 2N times typical
24h
0000h
Max. timeout for buffer write 2N times typical
25h
0007h
Max. timeout per individual block erase 2N times typical
26h
0000h
Max. timeout for full chip erase 2N times typical (00h = not supported)
0027h = S29CD-J devices
0036h = S29CL-J devices
VPP Min. voltage (00h = no VPP pin present)
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Device Geometry Definition
Addresses
Data
Description
Device Size = 2N byte
27h
(see description)
0015h = 16 Mb device
0016h = 32 Mb device
Flash Device Interface description (for complete description, please refer to CFI
publication 100)
0000 = x8-only asynchronous interface
28h
29h
0003h
0000h
0001 = x16-only asynchronous interface
0002 = supports x8 and x16 via BYTE# with asynchronous interface
0003 = x 32-only asynchronous interface
0005 = supports x16 and x32 via WORD# with asynchronous interface
0000h
0000h
Max. number of byte in multi-byte program = 2N
(00h = not supported)
2Ch
0003h
Number of Erase Block Regions within device
2Dh
2Eh
2Fh
30h
0007h
0000h
0020h
0000h
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
31h
32h
33h
34h
(See description)
0000h
0000h
0001h
2Ah
2Bh
Erase Block Region 2 Information
(refer to the CFI specification or CFI publication 100)
Address 31h data:
001Dh = 16 Mb device
003Dh = 32 Mb device
35h
36h
37h
38h
0007h
0000h
0020h
0000h
Erase Block Region 3 Information
(refer to the CFI specification or CFI publication 100)
39h
3Ah
3Bh
3Ch
0000h
0000h
0000h
0000h
Erase Block Region 4 Information
(refer to the CFI specification or CFI publication 100)
CFI Primary Vendor-Specific Extended Query (Sheet 1 of 2)
Addresses
Data
40h
41h
42h
0050h
0052h
0049h
Description
Query-unique ASCII string PRI
43h
0031h
Major version number, ASCII (reflects modifications to the silicon)
44h
0033h
Minor version number, ASCII (reflects modifications to the CFI table)
Address Sensitive Unlock (DQ1, DQ0)
00 = Required, 01 = Not Required
45h
46h
000Ch
0002h
Silicon Revision Number (DQ5–DQ2)
0000 = CS49
0001 = CS59
0010 = CS99
0011 = CS69
0100 = CS119
Erase Suspend (1 byte)
00 = Not Supported
01 = To Read Only
02 = To Read and Write
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CFI Primary Vendor-Specific Extended Query (Sheet 2 of 2)
Addresses
Data
Description
47h
0001h
Sector Protect (1 byte)
00 = Not Supported, X = Number of sectors in per group
48h
0000h
Temporary Sector Unprotect
00h = Not Supported, 01h = Supported
49h
0006h
Sector Protect/Unprotect scheme (1 byte)
01 =29F040 mode, 02 = 29F016 mode
03 = 29F400 mode, 04 = 29LV800 mode
05 = 29BDS640 mode (Software Command Locking)
06 = BDD160 mode (New Sector Protect)
07 = 29LV800 + PDL128 (New Sector Protect) mode
4Ah
0037h
Simultaneous Read/Write (1 byte)
00h = Not Supported, X = Number of sectors in all banks except Bank 1
4Bh
0001h
Burst Mode Type
00h = Not Supported, 01h = Supported
4Ch
0000h
Page Mode Type
00h = Not Supported, 01h = 4 Word Page, 02h = 8 Word Page
4Dh
00B5h
ACC (Acceleration) Supply Minimum
00h = Not Supported (DQ7-DQ4: volt in hex, DQ3-DQ0: 100 mV in BCD)
4Eh
00C5h
ACC (Acceleration) Supply Maximum
00h = Not Supported, (DQ7-DQ4: volt in hex, DQ3-DQ0: 100 mV in BCD)
4Fh
0001h
Top/Bottom Boot Sector Flag (1 byte)
00h = Uniform device, no WP# control,
01h = 8 x 8 Kb sectors at top and bottom with WP# control
02h = Bottom boot device
03h = Top boot device
04h = Uniform, Bottom WP# Protect
05h = Uniform, Top WP# Protect
If the number of erase block regions = 1, then ignore this field
50h
0001h
Program Suspend
00 = Not Supported
01 = Supported
51h
0000h
Write Buffer Size
2(N+1) word(s)
57h
0002h
Bank Organization (1 byte)
00 = If data at 4Ah is zero
XX = Number of banks
58h
0017h
Bank 1 Region Information (1 byte)
XX = Number of Sectors in Bank 1
59h
0037h
5Ah
0000h
5Bh
0000h
Bank 2 Region Information (1 byte)
XX = Number of Sectors in Bank 2
Bank 3 Region Information (1 byte)
XX = Number of Sectors in Bank 3
Bank 4 Region Information (1 byte)
XX = Number of Sectors in Bank 4
Document Number: 002-00948 Rev. *A
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20. Appendix 2
20.1
Command Definitions
Command (Notes)
Cycles
Memory Array Command Definitions (x32 Mode)
Bus Cycles (Notes 1–4)
First
Second
Addr
Data
RD
Third
Fourth
Addr
Data
Addr
Data
Addr
Fifth
Data
Sixth
Addr
Data
Addr
Data
BA+X0E
09
BA+X0F
00/01
Read (5)
1
RA
Reset (6)
1
XXX
F0
Manufacturer ID
4
555
AA
2AA
55
555
90
BA+X00
01
Device ID (8)
6
555
AA
2AA
55
555
90
BA+X01
7E
Program
4
555
AA
2AA
55
555
A0
PA
PD
Chip Erase
6
555
AA
2AA
55
555
80
555
AA
2AA
55
555
10
Sector Erase
6
555
AA
2AA
55
555
80
555
AA
2AA
55
SA
30
Program/Erase Suspend (9)
1
BA
B0
Program/Erase Resume (10)
1
BA
30
CFI Query (11, 12)
1
55
98
Accelerated Program (13)
2
XX
A0
PA
PD
Configuration Register Verify (12)
3
555
AA
2AA
55
BA+555
C6
BA+XX
RD
Configuration Register Write (14)
4
555
AA
2AA
55
555
D0
XX
WD
Unlock Bypass Entry (15)
3
555
AA
2AA
55
555
20
Unlock Bypass Program (15)
2
XX
A0
PA
PD
Unlock Bypass Erase (15)
2
XX
80
XX
10
Unlock Bypass CFI (11, 15)
1
XX
98
Unlock Bypass Reset (15)
2
XX
90
XX
00
Autoselect
(7)
Legend
BA = Bank Address. The set of addresses that comprise a bank. The system
may write any address within a bank to identify that bank for a command.
PA = Program Address (Amax–A0). Addresses latch on the falling edge of the
WE# or CE# pulse, whichever happens later.
PD = Program Data (DQmax–DQ0) written to location PA. Data latches on the
rising edge of WE# or CE# pulse, whichever happens first.
RA = Read Address (Amax–A0).
RD = Read Data. Data DQmax–DQ0 at address location RA.
SA = Sector Address. The set of addresses that comprise a sector. The system
may write any address within a sector to identify that sector for a command.
WD = Write Data. See “Configuration Register” definition for specific write data.
Data latched on rising edge of WE#.
X = Don’t care
Notes
1. See Table for description of bus operations.
2. All values are in hexadecimal.
3. Shaded cells in table denote read cycles. All other cycles are write
operations.
8. The device ID must be read across the fourth, fifth, and sixth cycles. 00h in
the sixth cycle indicates ordering option 00, 01h indicates ordering option 01.
9. The system may read and program in non-erasing sectors when in the
Program/Erase Suspend mode. The Program/Erase Suspend command is
valid only during a sector erase operation, and requires the bank address.
4. During unlock cycles, (lower address bits are 555 or 2AAh as shown in table)
10. The Program/Erase Resume command is valid only during the Erase
address bits higher than A11 (except where BA is required) and data bits
Suspend mode, and requires the bank address.
higher than DQ7 are don’t cares.
11. Command is valid when device is ready to read array data.
5. No unlock or command cycles required when bank is reading array data.
12. Asynchronous read operations.
6. The Reset command is required to return to the read mode (or to the erasesuspend-read mode if previously in Erase Suspend) when a bank is in the
autoselect mode, or if DQ5 goes high (while the bank is providing status
information).
14. Command is ignored during any Embedded Program, Embedded Erase, or
Suspend operation.
7. The fourth cycle of the autoselect command sequence is a read cycle. The
system must provide the bank address to obtain the manufacturer ID or
device ID information. See Autoselect on page 25 for more information.
15. The Unlock Bypass Entry command is required prior to any Unlock Bypass
operation. The Unlock Bypass Reset command is required to return to the
read mode.
Document Number: 002-00948 Rev. *A
13. ACC must be at VID during the entire operation of this command.
Page 71 of 86
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Command (Notes)
Cycles
Sector Protection Command Definitions (x32 Mode)
Bus Cycles (Notes 1–4)
First
Addr
Second
Data
Addr
Data
Third
Addr
Fourth
Data
Fifth
Addr
Data
Reset
1
XXX
F0
Secured Silicon Sector Entry
3
555
AA
2AA
55
555
88
Secured Silicon Sector Exit
4
555
AA
2AA
55
555
90
XX
00
Secured Silicon Protection
Bit Program (5, 6)
6
555
AA
2AA
55
555
60
OW
68
Secured Silicon Protection Bit
Status
6
555
AA
2AA
55
555
60
OW
RD(0)
Password Program (5, 7, 8)
4
555
AA
2AA
55
555
38
PWA[0-1]
PWD[0-1]
Password Verify
4
555
AA
2AA
55
555
C8
PWA[0-1]
PWD[0-1]
Sixth
Addr
Data
Addr
Data
OW
48
OW
RD(0)
Password Unlock (7, 8)
5
555
AA
2AA
55
555
28
PWA[0-1]
PWD[0-1]
PPB Program (5, 6)
6
555
AA
2AA
55
555
60
SG+WP
68
SG+WP
48
SG+WP
RD(0)
All PPB Erase (5, 9, 10)
6
555
AA
2AA
55
555
60
WP
60
WP
40
WP
RD(0)
PPB Status (11, 12)
4
555
AA
2AA
55
BA+555
90
SA+X02
00/01
PPB Lock Bit Set
3
555
AA
2AA
55
555
78
PPB Lock Bit Status
4
555
AA
2AA
55
BA+555
58
SA
RD(1)
DYB Write (7)
4
555
AA
2AA
55
555
48
SA
X1
DYB Erase (7)
4
555
AA
2AA
55
555
48
SA
X0
RD(0)
PL
48
PL
RD(0)
SL
48
SL
RD(0)
DYB Status (12)
4
555
AA
2AA
55
BA+555
58
SA
PPMLB Program (5, 6)
6
555
AA
2AA
55
555
60
PL
68
PPMLB Status (5)
6
555
AA
2AA
55
555
60
PL
RD(0)
SPMLB Program (5, 6)
6
555
AA
2AA
55
555
60
SL
68
SPMLB Status (5)
6
555
AA
2AA
55
555
60
SL
RD(0)
Legend
DYB = Dynamic Protection Bit
OW = Address (A5–A0) is (011X10).
PPB = Persistent Protection Bit
PWA = Password Address. A0 selects between the low and high 32-bit portions
of the 64-bit Password
PWD = Password Data. Must be written over two cycles.
PL = Password Protection Mode Lock Address (A5–A0) is (001X10)
RD(0) = Read Data DQ0 protection indicator bit. If protected, DQ0= 1, if
unprotected, DQ0 = 0.
RD(1) = Read Data DQ1 protection indicator bit. If protected, DQ1 = 1, if
unprotected, DQ1 = 0.
SA = Sector Address. The set of addresses that comprise a sector. The system
may write any address within a sector to identify that sector for a command.
SG = Sector Group Address
BA = Bank Address. The set of addresses that comprise a bank. The system
may write any address within a bank to identify that bank for a command.
SL = Persistent Protection Mode Lock Address (A5–A0) is (010X10)
WP = PPB Address (A5–A0) is (111010)
X = Don’t care
PPMLB = Password Protection Mode Locking Bit
SPMLB = Persistent Protection Mode Locking Bit
Notes
1. See Table for description of bus operations.
2. All values are in hexadecimal.
3. Shaded cells in table denote read cycles. All other cycles are write
operations.
8. The entire four bus-cycle sequence must be entered for each portion of the
password.
9. The fourth cycle erases all PPBs. The fifth and sixth cycles are used to
validate whether the bits have been fully erased. If DQ0 (in the sixth cycle)
reads 1, the erase command must be issued and verified again.
4. During unlock cycles, (lower address bits are 555 or 2AAh as shown in table)
10. Before issuing the erase command, all PPBs should be programmed in order
address bits higher than A11 (except where BA is required) and data bits
to prevent over-erasure of PPBs.
higher than DQ7 are don’t cares.
11. In the fourth cycle, 00h indicates PPB set; 01h indicates PPB not set.
5. The reset command returns the device to reading the array.
12. The status of additional PPBs and DYBs may be read (following the fourth
6. The fourth cycle programs the addressed locking bit. The fifth and sixth
cycle) without reissuing the entire command sequence.
cycles are used to validate whether the bit has been fully programmed. If
DQ0 (in the sixth cycle) reads 0, the program command must be issued and
verified again.
7. Data is latched on the rising edge of WE#.
Document Number: 002-00948 Rev. *A
Page 72 of 86
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21. Revision History
Spansion Publication Number: S29CD-J_CL-J_00
Section
Description
Revision A0 (March 1, 2005)
Initial release.
Revision A1 (April 15, 2005)
Ordering Information and Valid
Combinations tables
Updated to include lead Pb-free options.
Revision A2 (January 20, 2006)
Ordering Information
Added “Contact factory” for 75 MHz. Modified Ordering Options for Characters 15 and 16 to reflect
autoselect ID and top/bottom boot. Changed “N” for Extended Temperature Range to “M”.
Input/Output Descriptions
Removed Logic Symbol Diagrams.
Additional Resources
Added section.
Memory Address Map
Changed “Bank 2” to “Bank 1”.
Simultaneous Read/Write Operation
Removed Ordering Options Table (Tables 3 and 4).
Advanced Sector Protection/
Unprotection
Added Advanced Sector Protection/Unprotection figure. Added figures for PPB Erase and Program
Algorithm.
Electronic Marking
Added in Electronic Marking section.
Absolute Maximum Ratings
Modified VCC Ratings to reflect 2.6 V and 3.6 V devices. Modified VCC Ratings to reflect 16 Mb and
32 Mb devices.
AC Characteristics
Added Note “tOE during Read Array”.
Asynchronous Read Operation
Changed values of tAVAV, tAVQV, tELQV, tGLQV in table.
Conventional Read Operation Timings
Moved tDF line to 90% on the high-Z output in figure.
Added tAAVS and tAAVH timing parameters to table. Changed tCH to tCLKH. Changed tCL to tCLKL.
Removed the following timing parameters:
• tDS (Data Setup to WE# Rising Edge)
• tDH (Data Hold from WE# Rising Edge)
• tAS (Address Setup to Falling Edge of WE#)
• tAH (Address Hold from Falling Edge of WE#)
• tCS (CE# Setup Time)
• tCH (CE# Hold Time)
• tACS (Address Setup Time to CLK)
• tACH (Address Hold Time from ADV# Rising Edge of CLK while ADV# is Low)
Burst Mode Read for 32 Mb and 16 Mb
Added the following timing parameters:
• tAAVS
• tDVCH
• tINDS
• tINDH
Burst Mode Read (x32 Mode)
Asynchronous Command Write Timing
In figure, changed tOEH to tWEH; changed tWPH to tOEP.
Synchronous Command Write/Read
Timing
Removed tWADVH and tWCKS from figure.
WP# Timing
In figure, changed tCH to tBUSY
Erase/Program Operations
In table, added Note 3: Program/Erase parameters are the same regardless of synchronous or
asynchronous mode. Added tOEP (OE# High Pulse)
Alternative CE# Controlled Erase/
Program Operations
Removed tOES from table. Added tWADVS and tWCKS
Appendix 2: Command Definitions
Removed “or when device is in autoselect mode” from Note 14.
Revision B0 (June 12, 2006)
Document Number: 002-00948 Rev. *A
Page 73 of 86
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S29CD016J
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S29CL016J
Section
Description
Global
Changed document status to Preliminary.
Distinctive Characteristics
Changed cycling endurance from typical to guaranteed.
Performance Characteristics
Updated Max Asynch. Access Time, Max CE# Access Time, and Max OE# Access time in table.
Ordering Information
Updated additional ordering options in designator breakout table. Updated valid combination tables.
Input/Output Descriptions and Logic
Symbols
Changed RY/BY# description.
Physical Dimensions/Connection
Diagrams
Changed note on connection diagrams.
Additional Resources
Updated contact information.
Hardware Reset (RESET#)
Added section.
Autoselect
Updated third and fourth paragraphs in section. Updated Autoselect Codes table.
Erase Suspend / Erase Resume
Commands
Modified second paragraph. Replaced allowable operations table with bulleted list.
Program Suspend / Program Resume
Commands
Replaced allowable operations table with bulleted list.
Reset Command
Added section.
Secured Silicon Sector Flash Memory
Region
Modified Secured Silicon Sector Addresses table.
Absolute Maximum Ratings
Modified VCC and VIO ratings. Modified Note 1.
Operating Ranges
Modified specification titles and descriptions (no specification value changes).
DC Characteristics, CMOS Compatible
table
Modified ICCB specification. Deleted Note 5. Added Note 3 references to table.
Burst Mode Read for 32 Mb and 16 Mb
table
Modified tADVCS, tCLKH, tCLKL, tAAVS specifications. Added tRSTZ, tWADVH1, and tWADVH2
specifications. Added Notes 2 and 3, and note references to table.
Synchronous Command Write/Read
Timing figure
Added tWADVH1 and tWADVH2 to figure. Deleted tACS and tACH from figure.
Hardware Reset (RESET#)
Added table to section.
Erase/Program Operations table
Added note references. Deleted tOEP specification.
Erase and Programming Performance
Common Flash Memory Interface (CFI)
Changed Double Word Program Time specification.
CFI System Interface String table: Changed description and data for addresses 1Bh and 1Ch.
Device Geometry Definition table: Changed description and data for address 27h.
Revision B1 (September 27, 2006)
Global
Data sheet format reorganized.
Distinctive Characteristics
Changed cycling endurance specification to typical.
Performance Characteristics
Changed tBACC specifications for 66 MHz, 56 MHz, 40 MHz speed options.
Ordering Information
Added quantities to packing type descriptions, restructured table for easier reference.
S29CD-J and S29CL-J Flash Family
Autoselect Codes (High Voltage
Method)
In table, modified description of read cycle 3 DQ7–DQ0.
DQ6 and DQ2 Indications
In table, corrected third column heading
Section 8.9, Reset Command
Added table.
Section 13.1, Absolute Maximum
Ratings
Deleted OE# from section.
Table 18.3, Burst Mode Read for 32 Mb
and 16 Mb
In table, changed tADVCS, tBDH specifications. Modified description for tIACC. Deleted minimum
specifications for tAAVH.
Burst Mode Read (x32 Mode)
In figure, modified period for tIACC in drawing.
Revision B2 (March 7, 2007)
Distinctive Characteristics
Corrected number of 16K sectors in 16 Mb devices. Modified read access times table.
Document Number: 002-00948 Rev. *A
Page 74 of 86
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S29CD016J
S29CL032J
S29CL016J
Section
Description
Ordering Information
Changed boot sector option part number designators. Changed valid combinations. Modified 10th
character option descriptions.
Block Diagram
Deleted WORD# input.
2-, 4-, 8- Double Word Linear Burst
Operation
In 32- Bit Linear and Burst Data Order table, deleted reference to WORD# input.
Sector Erase
Modified second paragraph; added reference to application note.
Advanced Sector Protection/
Unprotection
Modified Advanced Sector Protection/Unprotection figure and notes. In some subsections, changed
“sector” to “sector group”.
DC Characteristics
Changed ICCB test conditions and ICC1 maximum specification.
Test Specifications
Changed CL.
Asynchronous Operations
Synchronous Operations
Asynchronous Command Write Timing figure: Added note.
Asynchronous Read Operations table: Changed tRC, tACC, tCE for 75 MHz device.
Burst Mode Read for 32 Mb and 16 Mb table: Changed tINDS, tCLKL, tAAVH, and tWADVH1
specifications.
Burst Mode Read figure: Modified period lengths for several specifications.
Erase/Program Operations
Added tWEH and tOEP specifications to table.
Latchup Characteristics
Deleted section.
Common Flash Memory Interface (CFI)
CFI System Interface String table: Modified description of address 1Bh.
CFI Primary Vendor-Specific Extended Query table: Modified data at address 45h.
Revision B3 (March 30, 2009)
Global
Removed “Preliminary”
Changed all instances of VCCQ to VIO
Distinctive Characteristics
Removed “or without” (wrap around) from Programmable Burst Interface bullet
Performance Characteristics
Added notice to refer to programming best practices application note for 32 Mb devices.
Ordering Information
Input/Output Descriptions and Logic
Symbols
Added S29CL032J to valid OPN diagram.
Corrected valid combinations table.
Subscript CC for VCC, IO for VIO, SS for VSS in table.
Changed type for VIO to “Supply”
Changed type for VSS to “Supply”
Block Diagram
Table: S29CD016J/CL016J (Top Boot)
Sector and Memory Address Map
Removed DQmax-DQ0 label from inputs to Burst Address Counter and Address Latch.
Removed Amax-A0 label from I/O Buffers.
Changed Note 2 to refer to Bank 0 and 1 instead of Bank 1 and 2.
Removed “x16”
Table: 32-Bit Linear and Burst Data
Order
Removed “A0:A-1” from Output Data Sequence column for Four Linear Data Transfers.
Programming
Added notice to refer to programming best practices application note for 32 Mb devices.
Table: DC Characteristic, CMOS
Compatible
Changed Max ICCB for S29CL-J to 90 mA.
Removed “A1:A-1” from Output Data Sequence column for Eight Linear Data Transfers.
Table: Burst Mode for 32 Mb and 16 Mb
Figure: Synchronous Command Write/
Read Timing
Table: Erase/Program Operations
Figure: Program Operation Timings
Corrected values for tBDH with separate values for 16Mb and 32Mb.
Added tWADVS parameter to table.
Added timing definition for tWADVS.
Appended “from WE# Rising Edge” to tAH description.
Changed tAH Min to 11.75 ns.
Updated timing diagram to reflect new tAH value.
Document Number: 002-00948 Rev. *A
Page 75 of 86
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Section
Description
Figure: Chip/Sector Erase Operation
Timings
Updated timing diagram to reflect new tAH value.
Table: Alternate CE# Controlled Erase/
Program Operations
Removed tWADVS parameter.
Product Overview
Removed “or without”.
Table: Device Bus Operation
Changed “X” to “H” under CLK column for CE# row.
Accelerated Program and Erase
Operations
Removed all mention of accelerated erase.
Unlock Bypass
Removed mention of unlock bypass sector erase.
Simultaneous Read/Write
Added in warning to indicate restrictions on Simultaneous Read/Write conditions.
VCC and VIO Power-up And Powerdown Sequencing
Added reference to timing section.
Standby Mode
Changed Vcc ± 0.2V to Vcc ± 10%.
Figure: Test Setup
Removed Note “Diodes are IN3064 or equivalent”.
Table: Alternate CE# Controlled Erase/
Program Operations
Corrected values for tDH with separate values for 16 Mb and 32 Mb.
Table: Memory Array Command
Definitions (x32 Mode)
Cleaned up Notes.
Revision B4 (October 30, 2009)
Absolute Maximum Ratings
Corrected Address, Data, Control Signals identifiers to correctly distinguish different ratings
between CL016L, CL032J, CD016J, and CD032J.
DC Characteristics
Added line item to distinguish VIHCLK value differences between CL-J and CD-J.
Synchronous Operation
Corrected Figure “Burst Mode Read (x32 Mode)” to reflect max linear burst length of 8 double words
instead of 32.
Hardware Reset (RESET#)
Corrected Table “Burst Initial Access Delay”: changed tREADY2, tRP, and tREADY3 set up to Min
instead of Max.
Corrected Figure “RESET# Timings” to add tREADY2 to timing diagram for bank not executing
embedded algorithm.
Revision B5 (May 25, 2011)
Physical Dimensions/Connection
Diagrams
On the 80-ball Fortified BGA Connection Diagram, corrected the K1 pin name from VCCQ to VIO.
Revision B6 (March 15, 2012)
Global
Added LAD080 Fortified BGA package option and drawing.
Additional Resources
Updated relevant application note links.
Revision History
Corrected heading for May 25, 2011 edits from revision B4 to B5.
Revision B7 (October 11, 2012)
Valid Combinations
Updated Valid Combinations table to add clarity and make explicit which offerings require a
customer to “contact factory for availability”.
Asynchronous Operations
In Figure 18.3, “Asynchronous Command Write Timing”, corrected the tWC measurement to be of
the Stable Address period, not the Valid Data period.
Erase/Program Operations
In Table 18.5, merged redundant rows tGHWL and tWEH.
In Table 18.5, “Erase/Program Operations”, corrected JEDEC symbol tAVAV to tAVAX.
In Figures 18.8 “Program Operation Timings” and 18.9 “Chip/Sector Erase Operation Timings”,
corrected tAH measurement to be from the falling edge of WE#.
Document Number: 002-00948 Rev. *A
Page 76 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
Document History Page
Document Title:S29CD032J, S29CD016J, S29CL032J, S29CL016J
32/16 Mbit, 2.6/3.3 V, Dual Boot, Simultaneous Read/Write, Burst Flash
Document Number: 002-00948
Rev.
ECN No.
Orig. of
Change
Submission
Date
Description of Change
**
-
RYSU
03/01/2005 A0:Initial release
**
-
RYSU
04/15/2005 A1:Ordering Information and Valid Combinations tables
Updated to include lead Pb-free options.
Document Number: 002-00948 Rev. *A
Page 77 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
Document History Page (Continued)
Document Title:S29CD032J, S29CD016J, S29CL032J, S29CL016J
32/16 Mbit, 2.6/3.3 V, Dual Boot, Simultaneous Read/Write, Burst Flash
Document Number: 002-00948
Rev.
ECN No.
Orig. of
Change
**
-
RYSU
Submission
Date
Description of Change
01/20/2006 Ordering Information
Added “Contact factory” for 75 MHz. Modified Ordering Options for
Characters 15 and 16 to reflect
autoselect ID and top/bottom boot. Changed “N” for Extended Temperature
Range to “M”.
Input/Output Descriptions Removed Logic Symbol Diagrams.
Additional Resources Added section.
Memory Address Map Changed “Bank 2” to “Bank 1”.
Simultaneous Read/Write Operation Removed Ordering Options Table
(Tables 3 and 4).
Advanced Sector Protection/Unprotection
Added Advanced Sector Protection/Unprotection figure. Added figures for
PPB Erase and Program
Algorithm.
Electronic Marking Added in Electronic Marking section.
Absolute Maximum Ratings
Modified VCC Ratings to reflect 2.6 V and 3.6 V devices. Modified VCC
Ratings to reflect 16 Mb and
32 Mb devices.
AC Characteristics Added Note “tOE during Read Array”.
Asynchronous Read Operation Changed values of tAVAV, tAVQV,
tELQV, tGLQV in table.
Conventional Read Operation Timings Moved tDF line to 90% on the
high-Z output in figure.
Burst Mode Read for 32 Mb and 16 Mb
Added tAAVS and tAAVH timing parameters to table. Changed tCH to
tCLKH. Changed tCL to tCLKL.
Removed the following timing parameters:
• tDS (Data Setup to WE# Rising Edge)
• tDH (Data Hold from WE# Rising Edge)
• tAS (Address Setup to Falling Edge of WE#)
• tAH (Address Hold from Falling Edge of WE#)
• tCS (CE# Setup Time)
• tCH (CE# Hold Time)
• tACS (Address Setup Time to CLK)
• tACH (Address Hold Time from ADV# Rising Edge of CLK while ADV# is
Low)
Burst Mode Read (x32 Mode)
Added the following timing parameters:
• tAAVS
• tDVCH
• tINDS
• tINDH
Document Number: 002-00948 Rev. *A
Page 78 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
Document History Page (Continued)
Document Title:S29CD032J, S29CD016J, S29CL032J, S29CL016J
32/16 Mbit, 2.6/3.3 V, Dual Boot, Simultaneous Read/Write, Burst Flash
Document Number: 002-00948
Rev.
ECN No.
Orig. of
Change
**
-
RYSU
Submission
Date
Description of Change
01/20/2006 Asynchronous Command Write Timing In figure, changed tOEH to
tWEH; changed tWPH to tOEP.
Synchronous Command Write/Read Timing
Removed tWADVH and tWCKS from figure.
WP# Timing In figure, changed tCH to tBUSY
Erase/Program Operations
In table, added Note 3: Program/Erase parameters are the same
regardless of synchronous or
asynchronous mode. Added tOEP (OE# High Pulse)
Alternative CE# Controlled Erase/Program Operations
Removed tOES from table. Added tWADVS and tWCKS
Appendix 2: Command Definitions Removed “or when device is in autoselect mode” from Note 14.
Document Number: 002-00948 Rev. *A
Page 79 of 86
S29CD032J
S29CD016J
S29CL032J
S29CL016J
Document History Page (Continued)
Document Title:S29CD032J, S29CD016J, S29CL032J, S29CL016J
32/16 Mbit, 2.6/3.3 V, Dual Boot, Simultaneous Read/Write, Burst Flash
Document Number: 002-00948
Rev.
ECN No.
Orig. of
Change
**
-
RYSU
Submission
Date
Description of Change
06/12/2006 Global Changed document status to Preliminary.
Distinctive Characteristics Changed cycling endurance from typical to
guaranteed.
Performance Characteristics Updated Max Asynch. Access Time, Max
CE# Access Time, and Max OE# Access time in table.
Ordering Information Updated additional ordering options in designator
breakout table. Updated valid combination tables.
Input/Output Descriptions and Logic Symbols
Changed RY/BY# description.
Physical Dimensions/Connection Diagrams
Changed note on connection diagrams.
Additional Resources Updated contact information.
Hardware Reset (RESET#) Added section.
Autoselect Updated third and fourth paragraphs in section. Updated
Autoselect Codes table.
Erase Suspend / Erase Resume Commands
Modified second paragraph. Replaced allowable operations table with
bulleted list.
Program Suspend / Program Resume Commands
Replaced allowable operations table with bulleted list.
Reset Command Added section.
Secured Silicon Sector Flash Memory Region
Modified Secured Silicon Sector Addresses table.
Absolute Maximum Ratings Modified VCC and VIO ratings. Modified
Note 1.
Operating Ranges Modified specification titles and descriptions (no
specification value changes).
DC Characteristics, CMOS Compatible table
Modified ICCB specification. Deleted Note 5. Added Note 3 references to
table.
Burst Mode Read for 32 Mb and 16 Mb table
Modified tADVCS, tCLKH, tCLKL, tAAVS specifications. Added tRSTZ,
tWADVH1, and tWADVH2 specifications. Added Notes 2 and 3, and note
references to table.
Synchronous Command Write/Read Timing figure
Added tWADVH1 and tWADVH2 to figure. Deleted tACS and tACH from
figure.
Hardware Reset (RESET#) Added table to section.
Erase/Program Operations table Added note references. Deleted tOEP
specification.
Erase and Programming Performance Changed Double Word Program
Time specification.
Document Number: 002-00948 Rev. *A
Page 80 of 86
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S29CL032J
S29CL016J
Document History Page (Continued)
Document Title:S29CD032J, S29CD016J, S29CL032J, S29CL016J
32/16 Mbit, 2.6/3.3 V, Dual Boot, Simultaneous Read/Write, Burst Flash
Document Number: 002-00948
Rev.
ECN No.
Orig. of
Change
Submission
Date
**
-
RYSU
06/12/2006 Common Flash Memory Interface (CFI)
CFI System Interface String table: Changed description and data for
addresses 1Bh and 1Ch.
Device Geometry Definition table: Changed description and data for address
27h.
**
-
RYSU
09/27/2006 Global Data sheet format reorganized.
Distinctive Characteristics Changed cycling endurance specification to
typical.
Performance Characteristics Changed tBACC specifications for 66 MHz,
56 MHz, 40 MHz speed options.
Ordering Information Added quantities to packing type descriptions,
restructured table for easier reference.
S29CD-J and S29CL-J Flash Family Autoselect Codes (High Voltage
Method)
In table, modified description of read cycle 3 DQ7–DQ0.
DQ6 and DQ2 Indications In table, corrected third column heading
Section 8.9, Reset Command Added table.
Section 13.1, Absolute Maximum Ratings
Deleted OE# from section.
Table 18.3, Burst Mode Read for 32 Mb and 16 Mb
In table, changed tADVCS, tBDH specifications. Modified description for
tIACC. Deleted minimum
specifications for tAAVH.
Burst Mode Read (x32 Mode) In figure, modified period for tIACC in drawing.
Document Number: 002-00948 Rev. *A
Description of Change
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S29CD016J
S29CL032J
S29CL016J
Document History Page (Continued)
Document Title:S29CD032J, S29CD016J, S29CL032J, S29CL016J
32/16 Mbit, 2.6/3.3 V, Dual Boot, Simultaneous Read/Write, Burst Flash
Document Number: 002-00948
Rev.
ECN No.
Orig. of
Change
**
-
RYSU
Submission
Date
Description of Change
03/07/2007 Distinctive Characteristics Corrected number of 16K sectors in 16 Mb
devices. Modified read access times table.
Ordering Information
Changed boot sector option part number designators. Changed valid
combinations. Modified 10th
character option descriptions.
Block Diagram Deleted WORD# input.
2-, 4-, 8- Double Word Linear Burst Operation
In 32- Bit Linear and Burst Data Order table, deleted reference to WORD#
input.
Sector Erase Modified second paragraph; added reference to application
note.
Advanced Sector Protection/ Unprotection
Modified Advanced Sector Protection/Unprotection figure and notes. In
some subsections, changed
“sector” to “sector group”.
DC Characteristics Changed ICCB test conditions and ICC1 maximum
specification.
Test Specifications Changed CL.
Asynchronous Operations
Asynchronous Command Write Timing figure: Added note.
Asynchronous Read Operations table: Changed tRC, tACC, tCE for 75
MHz device.
Synchronous Operations
Burst Mode Read for 32 Mb and 16 Mb table: Changed tINDS, tCLKL,
tAAVH, and tWADVH1
specifications.
Burst Mode Read figure: Modified period lengths for several specifications.
Erase/Program Operations Added tWEH and tOEP specifications to
table.
Latchup Characteristics Deleted section.
Common Flash Memory Interface (CFI)
CFI System Interface String table: Modified description of address 1Bh.
CFI Primary Vendor-Specific Extended Query table: Modified data at address 45h.
Document Number: 002-00948 Rev. *A
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Document History Page (Continued)
Document Title:S29CD032J, S29CD016J, S29CL032J, S29CL016J
32/16 Mbit, 2.6/3.3 V, Dual Boot, Simultaneous Read/Write, Burst Flash
Document Number: 002-00948
Rev.
ECN No.
Orig. of
Change
**
-
RYSU
Submission
Date
Description of Change
03/30/2009 Global
Removed “Preliminary”
Changed all instances of VCCQ to VIO
Distinctive Characteristics Removed “or without” (wrap around) from
Programmable Burst Interface bullet
Performance Characteristics Added notice to refer to programming best
practices application note for 32 Mb devices.
Ordering Information
Added S29CL032J to valid OPN diagram.
Corrected valid combinations table.
Input/Output Descriptions and Logic Symbols
Subscript CC for VCC, IO for VIO, SS for VSS in table.
Changed type for VIO to “Supply”
Changed type for VSS to “Supply”
Block Diagram
Removed DQmax-DQ0 label from inputs to Burst Address Counter and
Address Latch.
Removed Amax-A0 label from I/O Buffers.
Table: S29CD016J/CL016J (Top Boot) Sector and Memory Address
Map
Changed Note 2 to refer to Bank 0 and 1 instead of Bank 1 and 2.
Table: 32-Bit Linear and Burst Data Order
Removed “x16”
Removed “A0:A-1” from Output Data Sequence column for Four Linear
Data Transfers.
Removed “A1:A-1” from Output Data Sequence column for Eight Linear Data
Transfers.
Programming Added notice to refer to programming best practices
application note for 32 Mb devices.
Table: DC Characteristic, CMOS Compatible
Changed Max ICCB for S29CL-J to 90 mA.
Table: Burst Mode for 32 Mb and 16 Mb
Corrected values for tBDH with separate values for 16Mb and 32Mb.
Added tWADVS parameter to table.
Figure: Synchronous Command Write/ Read Timing
Added timing definition for tWADVS.
Table: Erase/Program Operations
Appended “from WE# Rising Edge” to tAH description.
Changed tAH Min to 11.75 ns.
Figure: Program Operation Timings Updated timing diagram to reflect
new tAH value.
Figure: Chip/Sector Erase Operation Timings
Updated timing diagram to reflect new tAH value.
Document Number: 002-00948 Rev. *A
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Document History Page (Continued)
Document Title:S29CD032J, S29CD016J, S29CL032J, S29CL016J
32/16 Mbit, 2.6/3.3 V, Dual Boot, Simultaneous Read/Write, Burst Flash
Document Number: 002-00948
Rev.
ECN No.
Orig. of
Change
Submission
Date
**
-
RYSU
03/30/2009 Table: Alternate CE# Controlled Erase/Program Operations
Removed tWADVS parameter.
Product Overview Removed “or without”.
Table: Device Bus Operation Changed “X” to “H” under CLK column for
CE# row.
Accelerated Program and Erase Operations
Removed all mention of accelerated erase.
Unlock Bypass Removed mention of unlock bypass sector erase.
Simultaneous Read/Write Added in warning to indicate restrictions on Simultaneous Read/Write conditions.
VCC and VIO Power-up And Powerdown Sequencing
Added reference to timing section.
Standby Mode Changed Vcc ± 0.2V to Vcc ± 10%.
Figure: Test Setup Removed Note “Diodes are IN3064 or equivalent”.
Table: Alternate CE# Controlled Erase/Program Operations
Corrected values for tDH with separate values for 16 Mb and 32 Mb.
Table: Memory Array Command Definitions (x32 Mode)
Cleaned up Notes.
**
-
RYSU
10/30/2009 Absolute Maximum Ratings
Corrected Address, Data, Control Signals identifiers to correctly distinguish
different ratings
between CL016L, CL032J, CD016J, and CD032J.
DC Characteristics Added line item to distinguish VIHCLK value
differences between CL-J and CD-J.
Synchronous Operation
Corrected Figure “Burst Mode Read (x32 Mode)” to reflect max linear burst
length of 8 double words
instead of 32.
Hardware Reset (RESET#)
Corrected Table “Burst Initial Access Delay”: changed tREADY2, tRP, and
tREADY3 set up to Min
instead of Max.
Corrected Figure “RESET# Timings” to add tREADY2 to timing diagram for
bank not executing
embedded algorithm.
**
-
RYSU
05/25/2011 Physical Dimensions/Connection Diagrams
On the 80-ball Fortified BGA Connection Diagram, corrected the K1 pin
name from VCCQ to VIO.
**
-
RYSU
03/15/2012 Global Added LAD080 Fortified BGA package option and drawing.
Additional Resources Updated relevant application note links.
Revision History Corrected heading for May 25, 2011 edits from revision
B4 to B5.
Document Number: 002-00948 Rev. *A
Description of Change
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S29CL016J
Document History Page (Continued)
Document Title:S29CD032J, S29CD016J, S29CL032J, S29CL016J
32/16 Mbit, 2.6/3.3 V, Dual Boot, Simultaneous Read/Write, Burst Flash
Document Number: 002-00948
Rev.
ECN No.
Orig. of
Change
Submission
Date
**
-
RYSU
10/11/2012 Valid Combinations
Updated Valid Combinations table to add clarity and make explicit which
offerings require a
customer to “contact factory for availability”.
Asynchronous Operations
In Figure 18.3, “Asynchronous Command Write Timing”, corrected the tWC
measurement to be of
the Stable Address period, not the Valid Data period.
Erase/Program Operations
In Table 18.5, “Erase/Program Operations”, corrected JEDEC symbol
tAVAV to tAVAX.
In Table 18.5, merged redundant rows tGHWL and tWEH.
In Figures 18.8 “Program Operation Timings” and 18.9 “Chip/Sector Erase
Operation Timings”,
corrected tAH measurement to be from the falling edge of WE#.
*A
5048814
RYSU
12/16/2015 Updated to Cypress template
Document Number: 002-00948 Rev. *A
Description of Change
Page 85 of 86
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