DG412F

DG412F
DG412F
RELIABILITY REPORT
FOR
DG412FEUE+
PLASTIC ENCAPSULATED DEVICES
March 4, 2010
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Don Lipps
Quality Assurance
Manager, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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DG412F
Conclusion
The DG412FEUE+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The DG411F/DG412F/DG413F are quad, single-pole/single-throw (SPST), fault-protected analog switches. They are pin compatible with the
industry-standard nonprotected DG411/DG412/DG413. These new switches feature fault-protected inputs and rail-to-rail signal-handling capability. All
terminals are protected from overvoltage faults up to ±36V with power on and up to ±40V with power off. During a fault condition, the COM, NO, or NC
terminal becomes an open circuit and only microamperes of leakage current flow from the source. On-resistance is 35 (max) and is matched between
switches to 1.5 (max) at +25°C. The DG411F has four normally closed (NC) switches. The DG412F has four normally open (NO) switches. The
DG413F has two NC and two NO switches. These CMOS switches operate with dual power supplies ranging from ±4.5V to ±20V or a single supply
between +9V and +36V. All digital inputs have +0.8V and +2.4V logic thresholds, ensuring both TTL and CMOS logic compatibility when using ±15V or
a single +12V supply. For supply voltages of ±5V, +5V, and +3V, refer to the MAX4711/MAX4712/MAX4713 data sheet.
Maxim Integrated Products. All rights reserved.
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DG412F
II. Manufacturing Information
A. Description/Function:
Quad, Rail-to-Rail, Fault-Protected, SPST Analog Switches
B. Process:
S5
C. Number of Device Transistors:
D. Fabrication Location:
Oregon
E. Assembly Location:
Malaysia, Philippines, Thailand
F. Date of Initial Production:
4/27/2002
III. Packaging Information
A. Package Type:
16-pin TSSOP
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-1201-0288
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
106°C/W
K. Single Layer Theta Jc:
27°C/W
L. Multi Layer Theta Ja:
90°C/W
M. Multi Layer Theta Jc:
27°C/W
IV. Die Information
A. Dimensions:
86 X 138 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
5.0 microns (as drawn)
F. Minimum Metal Spacing:
5.0 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
Maxim Integrated Products. All rights reserved.
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DG412F
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 80 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 13.7 x 10-9
= 13.7 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the S5 Process results in a FIT Rate of 0.09 @ 25C and 1.55 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The AH88-1 die type has been found to have all pins able to withstand a HBM transient pulse of +/-200 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
Maxim Integrated Products. All rights reserved.
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DG412F
Table 1
Reliability Evaluation Test Results
DG412FEUE+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing (Note 2)
HAST
Ta = 130°C
RH = 85%
Biased
Time = 96hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
80
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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