PREPARED BY: DATE Reference SPEC NO. FILE No. ISSUE CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE PAGE Dec. 4, 2012 1/22 REPRESENTATIVE DIVISION SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 2.4GHz Wireless LAN Front-End IC MODEL No. QM2A1UB028 □ CUSTOMER’S APPROVAL DATE BY PRESENTED BY Development Department Ⅰ System Device Division Electronic Components and Devices Group SHARP CORPORATION PAGE 2/22 MODEL No. SPEC No. QM2A1UB028 DOC. FIRST ISSUE Dec. 4, 2012 RECORD OF REVISION IDENT. DATA No. REF. PAGE DATE PARAGRAPH CHECK REVISED No. SUMMARY & APPROVAL DRAWING No. Dec. 4, 2012 FIRST ISSUE Apr. 15, 2013 Revised evaluation circuit for external noise reduction PAGE 3/22 Product name : 2.4GHz Wireless LAN Front-End IC Model No. QM2A1UB028 1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) Please do verify the validity of this part after assembling it in customer’s products, when customer wants to make catalogue and instruction manual based on the specification sheet of this part. (2) This product is designed for use in the following application areas ; • OA equipment • Audio visual equipment • Home appliances • Telecommunication equipment (Terminal) • Measuring equipment • Tooling machines • Computers If the use of the product in the above application areas is for equipment listed in paragraphs (3) or (4), please be sure to observe the precautions given in those respective paragraphs. (3) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; • Transportation control and safety equipment (aircraft, train, automobile etc.) • Traffic signals • Gas leakage sensor breakers • Rescue and security equipment • Other safety equipment (4) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; • Space equipment • Telecommunication equipment (for trunk lines) • Nuclear power control equipment • Medical equipment (5) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. PAGE 4/22 CONTENTS Page 1. Description 5 2. Pin Out and Assignment 6 3. Absolute Maximum Ratings 7 4. Electrical Characteristics 8 5. Application Information 9 6. Package and packing specification 11 MODEL No. QM2A1UB028 SPEC No. PAGE 5/22 522 1. Description 1-1 Functions The QM2A1UB028 is an integrated Front-end IC in a small and low profile 2.5mmx2.5mmx0.4mm package for 2.4GHz Band WLAN systems. The QM2A1UB028 integrates two-stage Power Amplifier with a power detector, LNA and SP3T switch with all 50Ω RF ports, which requires minimal external components and provides minimizing PCB foot-print. TX PA ANT RX LNA SW (SP3T) Bypass BT 1-2 Features ▪ Integrates matching network, All RF ports are 50Ω ▪ Integrates the high efficiency and high linearity PA Pout=19dBm, 802.11ac (MCS7, BW=20MHz , 64QAM,) at EVM 2%, 2.4-2.5GHz, VDD=3.6V ▪ Wide dynamic range and load insensitive built-in power detector ▪ SP3T Switch capable of alternative reception for WLAN and Bluetooth ▪ The LNA with bypass mode function which allows wide dynamic range Rx operation ▪ Lead Free / RoHS Compliant / Halogen Free 1-3 Applications ▪ W-LAN(IEEE 802.11b/g./n/ac) ====== Not designed or rated as radiation hardened ====== 1-4 Handle with care ▪ ESD ( Electro-Static Discharge ) sensitive. ▪ Gallium (Ga) and Arsenic (As) specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process chemically to make them as gas or powder. When the product is disposed, please follow the related regulation and do not mix this with general industrial waste or household waste. MODEL No. QM2A1UB028 SPEC No. PAGE 6/22 622 GND BT VDD_LNA LNA_ON 2. Pin Out and Assignment 2-1 Pin Out 12 11 10 9 TOP VIEW 14 NC 15 ANT 16 1 2 3 8 RX 7 GND 6 PA_ON 5 TX 4 VDD_PA1 VC_RX 028 YMX SB VDD_PA2 13 N.C. VC_BT VDET (contact pins facing down) 2-2 Pin Description Pin 1 2 3 4 5 6 7 8 Symbol VDET N.C. VDD_PA2 VDD_PA1 TX PA_ON GND RX Description Detector Voltage Output Non Connection PA 2nd Stage Supply Voltage PA 1stStage Supply Voltage Tx Port Input PA ON/OFF Control Voltage Ground Rx Port Output Pin 9 10 11 12 13 14 15 16 Symbol LNA_ON VDD_LNA BT GND VC_BT VC_RX N/C ANT Description LNA ON/OFF Control Voltage LNA Supply Voltage Bluetooth Port Ground BT Switch Control Voltage Rx Switch Control Voltage No Connect Antenna Port MODEL No. QM2A1UB028 SPEC No. PAGE 7/22 722 3. Absolute Maximum Ratings and Recommended Operating Conditions 3-1 Absolute Maximum Ratings Applied conditions greater than those listed may cause permanent damage to the IC. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. Parameter Symbol DC Supply Voltage (VDD) VDD Unit Min. Max. V - 5 No RF Applied, Ta=25℃ Note DC Supply Current (IDD) IDD_PA Total DC Power Dissipation PD mA - 300 While Tx mode, Ta=25℃ W - 1 Ta=25℃ TX RF Input Level TX_IN dBm - 0 Ta=25℃ RX RF Input Level RX_IN dBm - 5 At ANT Port,Ta=25℃ Storage Temperature Tstg ℃ -55 +125 Operating Temperature Ta_opr ℃ -30 +85 Maximum Junction Temperature Tj_max ℃ +150 3-2 Recommended Operating Conditions Parameter Frequency DC Supply Voltage Control Voltage (High State) Control Voltage (Low State) Unit Min. MHz V V V V 2400 3.2 2.95 2.8 - Typ. Max. 3.6 3.3 3.3 0 2500 4.6 3.65 VDD 0.4 Note VDD_PA,VDD_LNA PA_ON (*1) VC_RX, LNA_ON, VC_BT PA_ON, VC_RX, LNA_ON (*1) with virtual resistor R2 in our evaluation board. (refer to page.9) 3-3 FEIC Control Logic Table Mode Bluetooth WLAN RX (Normal-mode) WLAN RX (Bypass-mode) WLAN TX VC_BT VC_RX LNA_ON PA_ON High Low Low Low Low High High Low Low High Low Low Low Low Low High MODEL No. QM2A1UB028 SPEC No. PAGE 8/22 822 4. Electrical Characteristics These specifications are obtained with the evaluation board shown in Page 10 Test conditions are Ta = 25 °C, Source impedance: ZS = 50Ω, load impedance: ZL = 50 Ω, unless otherwise noted. Common Parameters Ta=25℃,VDD_PA=VDD_LNA=3.6V, PA_ON=LNA_ON=VC_BT=VC_RX=0V, no RF input Parameter Stand-by Leakage Current Symbol ILEAK Condition Measured on VDD leakage current Min. Typ. Max Unit － － 20 µA Tx Parameters Ta=25℃,Freq=2.4-2.5GHz, VDD_PA=VDD_LNA=3.6V, PA_ON=3.3V, LNA_ON=VC_BT=VC_RX=0V, unless otherwise noted. Parameter Symbol Power Gain GAIN_TX Power Consumption IDD_PA_ PA Control Current Error Vector Magnitude(*1) Power Detector Voltage Output Condition Min. Typ. Max Unit 27 dB 200 mA IPA_ON 6 mA EVM 2 % No RF 0.21 V Pout=19dBm, CW 0.8 V Pout=21dBm (802.11b, CCK-1Mbps) -14 dBm/MHz VDET_DC VDET Pout=19dBm , 802.11ac, MCS7, BW=20MHz, 64QAM, Dynamic-EVM nd 2fo rd 3fo -33 dBm/MHz TX Input RL_TX 12 dB ANT port RL_ANT_t 12 dB 2 Harmonic 3 Harmonic Return Loss RX Parameters Ta=25℃,Freq=2.4-2.5GHz, VDD_PA=VDD_LNA=3.6V, PA_ON=VC_BT=0V, LNA_ON=3.3V,VC_RX=3.3V, unless otherwise noted. Parameter Symbol Normal-mode Gain GAIN_Rx Bypass-mode Gain GAIN_BP Noise Figure NF Input IP3 Condition Min. Typ. Max 13 Unit dB LNA_ON=0V -5.5 dB (Includes the SW loss before LNA) 2.0 dB 7 dBm 15 dBm The tone separation=100kHz, Pin=-20dBm Normal-mode IIP3_NORM Bypass-mode IIP3_BP LNA Supply Current IDD_LNA Rx Control Current LNA Control Current LNA_ON=0V 10 mA IC_RX Measured on VC_RX - 6 µA ILNA_ON Measured on LNA_EN - 6 µA Measured on VDD_LNA Return Loss RX output RL_RX 7 dB ANT port RL_ANT_r 12 dB Bluetooth Parameters Ta=25℃,Freq=2.4-2.5GHz, VDD_PA=VDD_LNA=3.6V, PA_ON=LNA_ON=VC_RX=0V,VC_BT=3.3V, unless otherwise noted. Parameter Symbol Insertion Loss IL_BT BT Control Current IC_BT BT Port Return Loss RL_BT Condition Measured on VC_BT Min. Typ. Max Unit 0.6 dB 6 µA 20 dB MODEL No. QM2A1UB028 SPEC No. PAGE 9/22 922 5. Application Information 5-1 Typical Evaluation Circuit VDD_PA C2 C1 （ VDET NC 5 ANT 15 ） 6 （ R1 1 PA R2 PA_ON 2 ） TX 3 16 4 C6 SP3T (*3) VC_RX 14 7 LNA C4 13 8 RX (*3) VC_BT C5 9 10 11 (*3) 12 LNA_ON C3 VDD_LNA BT Figure 1. Schematic of Evaluation Circuit Table 1. Parts List of Evaluation Circuit Symbol Value Vendor Part Number C1 10 pF KYOCERA CM05CH100B50AB C2 1 µF Murata GRM155F11C105Z C3 1 µF Murata GRM155F11C105Z C4 (*3) 10 pF Kyocera CM05CH100J50AB C5 (*3) 10 pF Kyocera CM05CH100J50AB C6 (*3) 10 pF Kyocera CM05CH100J50AB R1(*2) 27k ohm ROHM MCR MZSJ 273 R2 (*2) 24 ohm ROHM MCR01 MRTJ240 (*2) These resistors do not need in the real circuit because they are put to simulate the output series resistor and input impedance of the chip set. (*3) These components are for external noise reduction. Please confirm the system performance on your board, if you want to remove or change them. MODEL No. QM2A1UB028 SPEC No. PAGE 10/22 1022 Evaluation Board 028 R1 C2 1pin index C1 ● 5-2 R2 Layer Structure. Material: FR4 (ε=4.7） SR Cu PP Unit: um 20 18 200 C3 Cu 35 Core 400 Cu PP 35 200 Cu SR 18 20 MODEL No. QM2A1UB028 SPEC No. PAGE 11/22 1122 6. Package and packing specification 6-1 Storage Conditions 6-1-1 Storage conditions required before opening the dry packing • Normal temperature : 5 ~ 40 °C • Normal humidity : 80 % ( Relative humidity ) or less • Storage period : One year or less * " Humidity " means " Relative humidity " 6-1-2 Storage conditions required after opening the dry packing In order to prevent moisture absorption after opening, ensure the following storage conditions apply: (1) Storage conditions for one-time soldering ( Convection reflow**, IR / Convection reflow** ) • Temperature : 5 ~ 25 °C • Humidity : 60 % or less • Period : 96 hours or less after opening (2) Storage conditions for two-time soldering ( Convection reflow**, IR / Convection reflow** ) a. Storage conditions following opening and prior to performing the 1st reflow • Temperature : 5 ~ 25 °C • Humidity : 60 % or less • Period : 96 hours or less after opening b. Storage conditions following completion of the 1st reflow and prior to performing the 2nd reflow • Temperature : 5 ~ 25 °C • Humidity : 60 % or less • Period : 96 hours or less after completion of the 1st reflow ** : Air or nitrogen environment 6-1-3 Temporary storage after opening To re-store the devices before soldering, do so only once and use a dry box or place desiccant ( with a blue humidity indicator ) with the devices and perform dry packing again using heat-sealing. The storage period, temperature and humidity must be as follows : (1) Storage temperature and humidity First opening X1 Re-sealing Ｙ Re-opening X2 Mounting Temperature : 5 ~ 40 °C Temperature : 5 ~ 25 °C Temperature : 5 ~ 40 °C Temperature : 5 ~ 25 °C Humidity : 80 % or less *** Humidity : 60 % or less Humidity : 80 % or less *** Humidity : 60 % or less ***：External atmosphere temperature and humidity of the dry packing (2) Storage period • X1＋X2 ׃ •Y ׃ Refer to Section 6-1-2 (1) and (2) a , depending on the mounting method. Two weeks or less MODEL No. QM2A1UB028 SPEC No. PAGE 12/22 1222 6-2 Baking Condition (1) Situations requiring baking before mounting • Storage conditions exceed the limits specified in Section 6-1-2 or 6-1-3. • Humidity indicator in the desiccant was already red ( pink ) when opened. ( Also for re-opening.) (2) Recommended baking conditions • Baking temperature and period : 120 + 10 / -0 °C for 2 ~ 3 hours • The above baking conditions do not apply since the embossed carrier tape is not heat-resistant. Replace the devices on heat-resistant carrier. (3) Storage after baking • After baking, store the devices in the environment specified in Section 6-1-2 and mount immediately. 6-3 Surface Mount Conditions The following soldering conditions are recommended to ensure device quality. 6-3-1 Soldering (1) Convection reflow or IR/Convection reflow ( one-time soldering or two-time soldering in air or nitrogen environment ) • Temperature and period : A) Peak temperature 260℃ max B) Heating temperature 40 to 60 seconds as 230℃ C) Preheat temperature It is 150 to 200℃, and is 120±30 seconds D) Temperature increase rate It is 1 to 3℃/seconds • Measuring point : IC package surface • Temperature profile : A IC package surface temperature B C D Time MODEL No. QM2A1UB028 SPEC No. PAGE 13/22 1322 6-4 Condition for removal of residual flux (1) Ultrasonic washing power : 25 watts / liter or less (2) Washing time : Total 1 minute or less (3) Solvent temperature : 15 ~ 40 °C 6-5 Package outline specification 6-5-1 Package outline Refer to the attached drawing. 6-5-2 LEAD FINISH or BALL TYPE LEAD FREE TYPE ( Ni / Pd / Au ) 6-6. Markings 6-6-1 Marking details ( The information on the package should be given as follows. ) (1) Product name : 028 (2) Date code : YMX Y → Denotes the production year. (Last one digit of the year.) M → Denotes the production month.（1・2・～・8・9・0・N・D） X → Denotes the production ref. code (1 digit). (3) Company name : S (4) Factory Code : (1 digit, Example “B”) 6-6-2 Marking layout The layout is shown in the attached drawing. (The layout does not specify the size of the marking character and marking position.) 028 YMX SB S … Brand name “S” B … Factory code MODEL No. QM2A1UB028 SPEC No. PAGE 14/22 1422 Package specifications TOP VIEW 2.5 2.5 028 YMX SB S … Brand name “S” B … Factory code Pin 1 indicator 0.4 1.7 1.7 Pin 1 indicator 0.2 0.25 0.5 UNIT : mm BOTTOM VIEW NOTE : LEAD FREE product. LEAD FINISH : Ni/Pd/Au PLATING LEAD MATERIAL : Cu Alloy MODEL No. QM2A1UB028 SPEC No. PAGE 15/22 1522 6-7 Packing specifications ( Embossed carrier tape specifications ) This standard applies to the embossed carrier tape specifications for ICs supplied by SHARP CORPORATION. SHARP’s embossed carrier tape specifications are generally based on those described in JIS C 0806 ( Japanese Industrial Standard ) and EIA481A. 6-7-1 Tape structure The embossed carrier tape is made of conductive plastic. The embossed portions of the carrier tape are filled with IC packages and a top covering tape is used to enclose them. 6-7-2 Taping reel and embossed carrier tape size For the taping reel and embossed carrier tape sizes, refer to the attached drawing. 6-7-3 IC package enclosure direction in embossed carrier tape The IC package enclosure direction in the embossed portion relative to the direction in which the tape is pulled is indicated by an index mark on the package ( indicating the No. 1 pin ) shown in the attached drawing. 6-7-4 Missing IC packages in embossed carrier tape The number of missing IC packages in the embossed carrier tape per reel should not exceed either 1 or 0.1 % of the total contained on the tape per reel, whichever is larger. There should never be more than two consecutive missing IC packages. 6-7-5 Tape joints There is no joint in an embossed carrier tape. 6-7-6 Peeling strength of the top covering tape Peeling strength must meet the following conditions. (1) Peeling angle : 165 ~ 180 ° (2) Peeling speed : 300 mm / min (3) Peeling strength : 0.2 ~ 0.7 Ｎ ( 20 ~ 70 gf ) Top covering tape 165 ~ 180° Peeling direction Pull-out direction Embossed carrier tape MODEL No. QM2A1UB028 SPEC No. PAGE 16/22 1622 6-7-7 Packing (1) The top covering tape ( leader side ) at the leading edge of the embossed carrier tape, and the trailing edge of the embossed carrier tape, should both be held in place with paper adhesive tape at least 30 mm in length. (2) The leading and trailing edges of the embossed carrier tape should be left empty ( with embossed portions not filled with IC packages ) in the attached drawing. (3) The number of IC packages enclosed in the embossed carrier tape per reel should generally comply with the list given below. Number of IC Packages / Reel Number of IC Packages / Inner carton Number of IC Packages / Outer carton 5,000 devices / Reel 5,000devices / Inner carton 25,000 devices / Outer carton 6-7-8 Indications The following should be indicated on the taping reel and the packing carton. • Part Number ( Product Name ) • Storage Quantity • Packed Date • Manufacture’s Name ( SHARP ) Note : The IC taping direction is indicated by " EL " suffixed to the part number. EL : Equivalent to " L " of the JIS C 0806 standard. 6-7-9 Protection during transportation The IC packages should have no deformation and deterioration of their electrical characteristics resulting from transportation. 6-8 Precautions for use (1) Opening must be done on an anti-ESD treated workbench. All workers must also have undergone anti-ESD treatment. (2) The devices should be mounted within one year of the date of delivery. 6-9 Chemical substance information in the product Product Information Notification based on Chinese law, Management Methods for Controlling Pollution by Electronic Information Products. Names and Contents of the Toxic and Hazardous Substances or Elements in the Product Lead ( Pb ) Mercury ( Hg ) Cadmium ( Cd ) Hexavalent Chromium ( Cr (VI) ) Polybrominated Biphenyl ( PBB ) Polybrominated Diphenyl Ethers ( PBDE ) ○ ○ ○ ○ ○ ○ ○ : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ / T 11363 - 2006. x : indicates that the content of the toxic and hazardous substance in at least one homogeneous material of the part exceeds the concentration limit requirement as described in SJ / T 11363 - 2006 standard. MODEL No. QM2A1UB028 SPEC No. PAGE 17/22 1722 Product Orientation Emboss taping type (EL) The drawing direction of tape Index mark Trailer side of tape Adhesive tape (paper) 30 MIN. Carrier tape (empty enboss） 500 MIN. Leader side of tape Filled emboss with products Filled emboss with products Index mark Carrier tape (empty enboss） 500 MIN. Adhesive tape (paper) 30 MIN. Top cover tape 200 MIN. The drawing direction of tape MODEL No. QM2A1UB028 SPEC No. PAGE 18/22 1822 Tape structure and dimensions Pocket hole for IC Hole for Taping Machine （ ） （ ） （ （ ） ） Unit: mm Symbol Size Symbol Size Symbol （ ） （ ） （ ） Size ◎ R1,R2,R3, and θ are reference value （ ） MODEL No. QM2A1UB028 SPEC No. PAGE 19/22 1922 9.5 Reel structure and dimensions UNIT : mm · UNIT: mm · ( ): Reference value MODEL No. QM2A1UB028 SPEC No. PAGE 20/22 2022 Inner packing appearance Reel & tape Inner label Pull-out direction Desiccant with humidity indicator Inner label Laminated aluminum bag Cushion pad Inner label Laminated aluminum bag Cushion pad Inner label Inner box MODEL No. QM2A1UB028 SPEC No. PAGE 21/22 2122 Outer packing appearance (345) 45 ) (55) (3 Inner label Inner box 5 rows adhesivetape tape(“Ｈ”taping) Adshive ( “H” taping ) ) 65 3 ( (385) Outer label Outer box (315) UNIT: mm ( ) : Reference value 0.23 ± 0.1 MODEL No. QM2A1UB028 SPEC No. PAGE 22/22 2222 Inner label and Outer label Inner carton label (a) LEAD FREE QM2A1UB028 (3N)1 QM2A1UB028 <QUANTITY> (b) $TD44a (c) < LOT > xxxxxxxxxx xxxx QM2A1UB028/EL/ (d) YYYY.MM.DD MADE IN xxxx (f) (e) 5000 (3N)2 5000 XXXXXXXXXXXX 103120 (j) TYPE : A EIAJ C-3 <RMK> XXXXXXXXXXXXXXXXX (g) (h) (i) Outer carton label (c) (4S)PKG ID : QM2A1UB028/EL/ (e) (Q)QUANTITY : 25000 (g) MADE IN xxxx LEAD FREE XXXXXXXXXXXXXXXXXXXX (a) (k) XXXXXXXXXXXXXXXXXXXX YYYY.MM.DD XXXXXXXXXXXXXXXXXXXX (d) (P)CUST PROD ID : QM2A1UB028 XXXXXXXXXXX X (f) NOTE : The « LEAD FREE » indicates this product is lead free articles. "R.C." is SHARP’s corporate logo which indicates RoHS compliant ( a ) Model No. ( b ) Quantity / PD lot / Company code ( c ) SHARP internal Model No. ( d ) Packed date ( e ) Quantity ( f ) “ SHARP ” Logo ( g ) The country of origin ( h ) Type name / Former ( i ) Assemble management No. ( j ) Assemble lot No. / Date code / Quantity ( k ) Shipment lot No.