S7070_UG_v1.0e

S7070

Version 1.0e

Copyright

Copyright © 2014 MiTAC International Corporation. All rights reserved. No part of this manual may be reproduced or translated without prior written consent from

MiTAC International Corporation.

Trademark

All registered and unregistered trademarks and company names contained in this manual are property of their respective owners including, but not limited to the following.

TYAN

Intel

®

®

is a trademark of MiTAC International Corporation.

is a trademark of Intel

®

Corporation.

AMI, AMI BIOS are trademarks of AMI Technologies.

Microsoft

®

, Windows

®

are trademarks of Microsoft Corporation.

Winbond

®

is a trademark of Winbond Electronics Corporation.

Notice

Information contained in this document is furnished by MiTAC International

Corporation and has been reviewed for accuracy and reliability prior to printing.

MiTAC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TYAN

®

products including liability or warranties relating to fitness for a particular purpose or merchantability. MiTAC retains the right to make changes to product descriptions and/or specifications at any time, without notice. In no event will MiTAC be held liable for any direct or indirect, incidental or consequential damage, loss of use, loss of data or other malady resulting from errors or inaccuracies of information contained in this document.

1 http://www.tyan.com

Contents

S7070 ............................................................................................................ 1

Before you begin… .................................................................................... 3

Chapter 1: Instruction ................................................................................ 4

1.1 Congratulations ................................................................................. 4

1.2 Hardware Specifications .................................................................... 4

1.3 Software Specifications ................................................................... 12

Chapter 2: Board Installation ................................................................... 13

2.1 Board Image .................................................................................... 14

2.2 Block Diagram ................................................................................. 15

2.3 Motherboard Mechanical Drawing ................................................... 16

2.4 Board Parts, Jumpers and Connectors ........................................... 17

2.5 Installing the Processor and Heatsink ............................................. 29

2.6 Thermal Interface Material............................................................... 34

2.7 Tips on Installing Motherboard in Chassis ...................................... 35

2.8 Installing the Memory ...................................................................... 37

2.9 Attaching Drive Cables .................................................................... 42

2.10 Installing Add-In Cards .................................................................. 43

2.11 Connecting External Devices ........................................................ 44

2.12 Installing the Power Supply ........................................................... 46

2.13 Finishing Up ................................................................................... 47

Chapter 3: BIOS Setup ............................................................................. 48

3.1 About the BIOS ................................................................................ 48

3.2 Main Menu ....................................................................................... 50

3.3 Advanced Menu ............................................................................... 51

3.4 Intel RCSetup Menu ........................................................................ 79

3.5 Server Management ...................................................................... 105

3.6 Security .......................................................................................... 108

3.7 Boot ............................................................................................... 110

3.8 Save & Exit .................................................................................... 112

Chapter 4: Diagnostics ........................................................................... 114

4.1 Flash Utility .................................................................................... 114

4.2 AMIBIOS Post Code (Aptio) .......................................................... 115

Appendix I: Fan and Temp Sensors ..................................................... 122

Glossary ................................................................................................... 128

Technical Support .................................................................................. 134


Before you begin…

Check the box contents!

The retail motherboard package should contain the following:

1 x S7070 Motherboard

2 x SATA Single Cable

1 x Rear IO shielding

1 x S7070 Quick Installation Guide

1 x TYAN

®

Driver CD

IMPORTANT NOTE:

Sales samples may not come with any of the accessories listed above.

If you have ordered a sales sample and you are missing any of the above items, please contact your sales representative to help order accessories.


Chapter 1: Instruction

1.1 Congratulations

You have purchased the powerful TYAN

®

S7070 motherboard, based on the Intel

®

C612 Wellsburg chipset. The S7070 is designed to support dual Intel

®

Xeon E5-

2600 v3 (Haswell-EP) Series processors, and up to 32GB RDIMM, 64GB LRDIMM and 128GB LRDIMM 3DS* DDR4 memory for each DIMM slot. Leveraging advanced technology from Intel

®

, the S7070 is capable of offering scalable 32 and

64-bit computing, high-bandwidth memory design, and lightning-fast PCI-E bus implementation.

The S7070 not only empowers you in today‟s demanding IT environment but also offers a smooth path for future application upgradeability. All of these rich feature sets provide the S7070 with the power and flexibility to meet demanding requirements for today‟s IT environments.

Remember to visit the TYAN

® all the information on all TYAN website at

http://www.tyan.com

. There you can find

®

products as well as all the supporting documentation,

FAQs, Drivers and BIOS upgrades.

1.2 Hardware Specifications

TYAN S7070 (S7070WGM2NR)

Processor

Chipset

Memory

Supported CPU Series

Socket Type / Q’ty

Socket-R3 (LGA2011) / (2)

Thermal Design Power (TDP) wattage Max up to 160W

System Bus

PCH

Up to 9.6/ 8.0/ 6.4 GT/s with Intel

QuickPath Interconnect (QPI) support

Intel C612

Supported DIMM Qty

Intel Xeon Processor E5-2600 v3 series

DIMM Type / Speed

Capacity

Memory channel

Memory voltage

(8)+(8) DIMM slots

RDIMM DDR4 2133/1866/1600 /

LRDIMM DDR4 2133/1600 / LRDIMM

3DS DDR4 2133/1600

Up to 512GB RDIMM/ 1024GB

LRDIMM/ 2048GB LRDIMM 3DS

*Follow latest Intel DDR4 Memory

POR

4 Channels per CPU / 2 DIMM per channel

1.2V


Expansion

Slots

LAN

Storage

Graphic

COM

SAS

VGA

Input /Output

RJ-45

System

Monitoring

PCI-E

Port Q’ty

Controller

SAS

Connector

Controller

Speed

RAID

Connector

SATA

SSATA

Connector type

Connector

Controller

Speed

RAID

Resolution

Chipset

Controller

Speed

RAID

USB

Power

SATA

Chipset

Voltage

Fan

Temperature

PCI-E Slot1 Gen3 x8 from

CPU1(Open-end)

PCI-E Slot2 Gen3 x16 from CPU1



(2) GbE ports (1 port shared with

IPMI)

Intel I350-AM2

(2) Mini-SAS connectors (totally support 8 ports)

LSI SAS2308

6.0 Gb/s

RAID 0/1/1E/10 (LSI Integrated RAID)

(1) Mini-SAS,(2) SATA (totally support

6 ports)

Intel C612

6.0 Gb/s

RAID 0/1/10/5 (Intel RST)

(4) SSATA + SGPIO2

Intel C612

6.0 Gb/s


D-Sub 15-pin

Up to 1920x1200

Aspeed AST2400

(4) USB3.0 ports (2 at rear, 2 via cable) / (5) USB2.0 ports (2 at rear, 1 type A header, 2 via cable)

(1) header

(2) Mini-SAS (4-in-1) connectors

(1) D-Sub 15-pin VGA port

Total (2) GbE ports, (1) shared with

IPMI

SSI 24-pin + 8-pin + 8-pin + 4-pin power connector

(4-pin power connector is option)

(6) SATA + (4) SATA ports by (1) mini-SAS connector

Aspeed AST2400

Monitors voltage for CPU, memory, chipset & power supply

Total (7) 4-pin headers / Total (1) 2 x

10-pin headers

Monitors temperature for CPU & memory & system environment


BIOS

LED

Others

Onboard Chipset

Server

Management

AST2400 IPMI Feature

AST2400 iKVM Feature

Brand / ROM size

Feature

Physical

Dimension

Operating

System

Form Factor

Board Dimension

OS supported list

Regulation

Operating

Environment

RoHS

Package

Contains

FCC (DoC)

CE (DoC)

Operating Temp.

Non-operating Temp.

In/Non-operating Humidity

RoHS 6/6 Compliant

Motherboard

Manual

Installation CD

Over temperature warning indicator /

Fan & PSU fail LED indicator

Watchdog timer support

Onboard Aspeed AST2400

IPMI 2.0 compliant baseboard management controller (BMC) /

Supports storage over IP and remote platform-flash / USB 2.0 virtual hub

24-bit high quality video compression /

10/100 Mb/s MAC interface

AMI / 16MB

User-configurable H/W monitoring /

SMBIOS 2.7/PnP/Wake on LAN / PXE boot support / ACPI 3.0/ACPI sleeping states S4,S5

SSI EEB

12”x13” (305x330mm)

Please refer to our Intel OS supported list.

Class A

Yes

10° C ~ 35° C (50° F~ 95° F)

- 40° C ~ 70° C (-40° F ~ 158° F)

90%, non-condensing at 35° C

Yes

(1) S7070 Motherboard

(1) Quick Installation Guide

(1) TYAN installation CD

TYAN S7070 (S7070GM2NR)

Processor

Chipset

Memory

Supported CPU Series Intel Xeon Processor E5-2600 v3 series



Thermal Design Power

(TDP) wattage

Max up to 160W

System Bus

Up to 9.6/ 8.0/ 6.4 GT/s with Intel QuickPath

Interconnect (QPI) support

PCH

Intel C612

Supported DIMM Qty (8)+(8) DIMM slots


Capacity

Memory channel

RDIMM DDR4 2133/1866/1600 / LRDIMM DDR4

2133/1600 / LRDIMM 3DS DDR4 2133/1600

Up to 256GB RDIMM/ 512GB LRDIMM/

1,024GB LRDIMM 3DS * Follow latest Intel

DDR4 Memory POR

4 Channels per CPU/ 2 DIMM per channel

Memory voltage

1.2V


Expansion

Slots

LAN

Storage

Graphic

Input /Output

System

Monitoring

Server

Management

PCI-E

Port Q’ty

PCI-E Slot1 Gen3 x8 from CPU1(Open-end)




(2) GbE ports (1 port shared with IPMI)

Controller

Intel I350-AM2

Connector

(1) Mini-SAS,(2) SATA (totally support 6 ports)

SATA

Controller

Intel C612

Speed

6.0 Gb/s

RAID


SSATA

Chipset

Connector

(4) SSATA + SGPIO2

Controller

Intel C612

Speed

RAID

Connector type

Resolution

6.0 Gb/s


D-Sub 15-pin

Up to 1920x1200

Aspeed AST2400

USB

COM

VGA

RJ-45

(4) USB3.0 ports (2 at rear, 2 via cable) / (5)

USB2.0 ports (2 at rear, 1 type A header, 2 via cable)

(1) header

(1) D-Sub 15-pin VGA port

Power

SATA

Chipset

Voltage

Total (2) GbE ports, (1) shared with IPMI

SSI 24-pin + 8-pin + 8-pin + 4-pin power connector(4-pin power connector is option)


Aspeed AST2400


Fan

Temperature

LED

Others

Onboard Chipset

AST2400 IPMI Feature

Total (7) 4-pin headers / Total (1) 2 x 10-pin headers

Monitors temperature for CPU & memory& system environment

Over temperature warning indicator / Fan & PSU fail LED indicator


Onboard Aspeed AST2400

IPMI 2.0 compliant baseboard management controller (BMC) / Supports storage over IP and remote platform-flash / USB 2.0 virtual hub

BIOS Brand / ROM size

AMI / 16MB


Physical

Dimension

Operating

System

Feature

Form Factor

Board Dimension


User-configurable H/W monitoring / SMBIOS

2.7/PnP/Wake on LAN / PXE boot support /

ACPI 3.0/ACPI sleeping states S4,S5

SSI EEB

12”x13” (305x330mm)


Regulation

Operating

Environment

RoHS

Package

Contains

FCC (DoC)

CE (DoC)

Operating Temp.

Class A

Yes

10° C ~ 35° C (50° F~ 95° F)

Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)

In/Non-operating

Humidity



Yes

Motherboard


Manual

Installation CD



TYAN S7070 (S7070WA2NR)

Processor

Chipset

Memory

Expansion

Slots

LAN

Supported CPU Series



Thermal Design Power (TDP) wattage Max up to 160W

System Bus

PCH

Up to 9.6/ 8.0/ 6.4 GT/s with Intel

QuickPath Interconnect (QPI) support

Intel C612


Intel Xeon Processor E5-2600 v3 series


Capacity

(8)+(8) DIMM slots

RDIMM DDR4 2133/1866/1600 /

LRDIMM DDR4 2133/1600 /

LRDIMM 3DS DDR4 2133/1600

Up to 256GB RDIMM/ 512GB

LRDIMM/ 1,024GB LRDIMM 3DS

* Follow latest Intel DDR4 Memory

POR

Memory channel

Memory voltage

PCI-E

Port Q’ty

Controller


1.2V

PCI-E Slot1 Gen3 x8 from

CPU1(Open-end)




(2) GbE ports

Intel I350-AM2


Storage

SAS

SATA

SSATA

Audio Chipset

USB

COM

SAS

Input /Output

Audio

RJ-45

Power

System

Monitoring

BIOS

SATA

Chipset

Voltage

Fan

Temperature

LED

Others


Feature

Connector

Controller

Speed

RAID

Connector

Controller

Speed

RAID

Connector

Controller

Speed

RAID


(2) Mini-SAS connectors (totally support 8 ports)

LSI SAS2308

6.0 Gb/s

RAID 0/1/1E/10 (LSI Integrated

RAID)

(1) Mini-SAS,(2) SATA (totally support 6 ports)

Intel C612

6.0 Gb/s


(4) SSATA + SGPIO2

Intel C612

6.0 Gb/s


Realtek ALC892-GR

(4) USB3.0 ports (2 at rear, 2 via cable) / (5) USB2.0 ports (2 at rear, 1 type A header, 2 via cable)

(1) header

(2) Mini-SAS (4-in-1) connectors

LINE_IN, LINE_OUT, MIC_IN,

SURROUNT OUT,CEN/LFE OUT,

S/PDIF OUT

Total (2) GbE ports

SSI 24-pin + 8-pin + 8-pin + 4-pin power connector (4-pin power connector is option)


NCT7904D

Monitors voltage for CPU, system, chipset & power supply

Total (7) 4-pin headers / Total (1) 2 x

10-pin headers

Monitors temperature for CPU & system environment

Over temperature warning indicator /

Fan & PSU fail LED indicator


AMI / 16MB

User-configurable H/W monitoring /

SMBIOS 2.7/PnP/Wake on LAN /

PXE boot support / ACPI 3.0/ACPI

Physical

Dimension

Operating

System

Form Factor

Board Dimension


Regulation

Operating

Environment

RoHS

Package

Contains

FCC (DoC)

CE (DoC)

Operating Temp.


In/Non-operating Humidity


Motherboard

Manual

Installation CD

sleeping states S4,S5

SSI EEB

12”x13” (305x330mm)


Class A

Yes

10° C ~ 35° C (50° F~ 95° F)

- 40° C ~ 70° C (-40° F ~ 158° F)


Yes




TYAN S7070 (S7070A2NR-B)

Processor

Chipset

Memory

Expansion

Slots

LAN

Storage

Supported CPU Series Intel Xeon Processor E5-2600 v3 series



Thermal Design Power

(TDP) wattage

Max up to 160W

System Bus

Up to 9.6/ 8.0/ 6.4 GT/s with Intel QuickPath

Interconnect (QPI) support

PCH

Intel C612


(8)+(8) DIMM slots


Capacity

RDIMM DDR4 2133/1866/1600 / LRDIMM DDR4

2133/1600 / LRDIMM 3DS DDR4 2133/1600

Up to 256GB RDIMM/ 512GB LRDIMM/ 1,024GB

LRDIMM 3DS *Follow latest Intel DDR4 Memory

POR


Memory channel

Memory voltage

PCI-E

1.2V

PCI-E Slot1 Gen3 x8 from CPU1(Open-end)




Port Q’ty

Controller

(2) GbE ports

Intel I350-AM2

Connector

( (1) Mini-SAS,(2) SATA (totally support 6 ports)

Controller

Intel C612

SATA

Speed

RAID

6.0 Gb/s


SSATA

Connector

(4) SSATA + SGPIO2

Controller

Intel C612

Speed

6.0 Gb/s


Audio

Input /Output

System

Monitoring

BIOS

Physical

Dimension

Operating

System

Regulation

Operating

Environment

RoHS

Package

Contains

Chipset

USB

COM

Audio

RJ-45

Power

SATA

Chipset

Voltage

Fan

LED

Others


Feature

RAID

Temperature

Form Factor

Board Dimension


Realtek ALC892-GR

(4) USB3.0 ports (2 at rear, 2 via cable) / (5)

USB2.0 ports (2 at rear, 1 type A header, 2 via cable)

(1) header

LINE_IN, LINE_OUT, MIC_IN, SURROUNT

OUT,CEN/LFE OUT, S/PDIF OUT

Total (2) GbE ports

SSI 24-pin + 8-pin + 8-pin + 4-pin power connector

(4-pin power connector is option)

(6) SATA+ (4) SATA ports by (1) mini-SAS connector

NCT7904D


Total (7) 4-pin headers / Total (1) 2 x 10-pin headers

Monitors temperature for CPU & system environment

Over temperature warning indicator / Fan & PSU fail LED indicator


AMI / 16MB

User-configurable H/W monitoring / SMBIOS

2.7/PnP/Wake on LAN / PXE boot support / ACPI

3.0/ACPI sleeping states S4,S5

SSI EEB

12”x13” (305x330mm)



FCC (DoC)

CE (DoC)

Operating Temp.

Class A

Yes

10° C ~ 35° C (50° F~ 95° F)


- 40° C ~ 70° C (-40° F ~ 158° F)

In/Non-operating

Humidity



Yes

Motherboard


Manual

Installation CD


(1) TYAN installation CD in bulk packing carton


S7070 SKU Comparison Table

MB SKU

PCH

SATA

NGFF

ODM

OEM

PCIE

SLOT5

ODM

OEM

PCIE

SLOT6

LSI_SAS BMC/VGA AUDIO

S7070

Server

SKU

S7070

Workstation

SKU

S7070

WGM2NR/MB,

R02

S7070

GM2NR/MB,R02

S7070WA2NR/M

B, R02

S7070A2NR/MB,

R02

6+4

6+4

6+4

6+4

NO

NO

NO

NO

NO

NO

NO

NO

X16

X16

X16

X16

LSI2308

NO

LSI2308

NO

AST2400

AST2400

NO

NO

NO

NO

ALC892

ALC892

1.3 Software Specifications

For the latest OS (operation system) support, please visit the Tyan‟s Web site for information.

Remember to visit our Web site at http://www.tyan.com

for the latest AST2400

User‟s Guide.


Chapter 2: Board Installation

You are now ready to install your motherboard.

How to install our products right… the first time

The first thing you should do is read this user‟s manual. It contains important information that will make configuration and setup much easier. Here are some precautions you should take when installing your motherboard:

(1) Ground yourself properly before removing your motherboard from the antistatic bag. Unplug the power from your computer power supply and then touch a safely grounded object to release static charge (i.e. power supply case). For the safest conditions, MiTAC recommends wearing a static safety wrist strap.

(2) Hold the motherboard by its edges and do not touch the bottom of the board, or flex the board in any way.

(3) Avoid touching the motherboard components, IC chips, connectors, memory modules, and leads.

(4) Place the motherboard on a grounded antistatic surface or on the antistatic bag that the board was shipped in.

(5) Inspect the board for damage.

The following pages include details on how to install your motherboard into your chassis, as well as installing the processor, memory, disk drives and cables.

Caution!

1.

To avoid damaging the motherboard and associated components, do not use torque force greater than

7kgf/cm (6.09 lb/in) on each mounting screw for motherboard installation.

2.

Do not apply power to the board if it has been damaged.


2.1 Board Image

S7070

This picture is representative of the latest board revision available at the time of publishing. The board you receive may not look exactly like the above picture.

NOTE:

The Slot#5 and M2 NGFF connector are not in SKU channel


2.2 Block Diagram

S7070 Block Diagram


2.3 Motherboard Mechanical Drawing


2.4 Board Parts, Jumpers and Connectors

This diagram is representative of the latest board revision available at the time of publishing. The board you receive may not look exactly like the above diagram. The

DIMM slot numbers shown above can be used as a reference when reviewing the

DIMM population guidelines shown later in the manual. For the latest board revision, please visit our web site at


.


Motherboard Components

1. ID LED Button(SW1)

2. VGA Port

Connectors

20. SSATA 3.0 Connector(SSATA1)

21. Clear CMOS Button

3. 8-pin Power Connector(PW3)

4. USB2.0 ports and LAN Port #1(LAN1)

22. SSATA 3 0 Connector(SSATA0)

23. SATA3.0 Connector(SATA5)

5. USB3.0 ports and LAN Port #2(LAN2)

6. Audio Jack with S/PDIF

7. 4-pin Fan Connector(CPU1_FAN)

24. Power Button

25. Front Panel Header(FPIO1)

26. 4-pin Power Connector (PW4)

8. ID LED

9. 4-pin Fan Connector (SYS_FAN5)

10. 4-pin Fan Connector (SYS_FAN4)

11. COM Header (COM1)

12. Front Fan Connector (FAN_HDR1)

13. IPMB Connector (IPMB1)

14. Front 2.0 USB Header(USB2_2)

15. TYAN Module Header

16. TYPE_A USB Header(A_USB1)

17. Front 3.0 USB Header(USB3_2)

27. 4 in 1Mini SAS Connector(SATA0-3)

28. SGPIO Header(SGPIO2,SSATA0-3)

29. SATA3.0 Connector(SATA4)

30. 4 in 1 Mini SAS Connector(SAS4-7)

31. 4 in 1 Mini SAS Connector(SAS0-3)

32. 4-pin Fan Connector(SYS_FAN3)

33. 4-pin Fan Connector(SYS_FAN2)

34. 4-pin Fan Connector (CPU0_FAN)

18. SSATA3.0 Connector(SSATA3)

19. SSATA3.0 Connector(SSATA2)

35. 4-pin Fan Connector ( SYS_FAN1)



38. PSMI Connector

Memory Slots/PCIE Slots

A.CPU0 DIMM A0/CPU0 DIMM A1

B.CPU0 DIMM B0/CPU0 DIMM B1

C.CPU0 DIMM D0/CPU0 DIMM D1

H.CPU1 DIMM A0/CPU1 DIMM A1

I.PCI-E G3x16 slot(x8 or x16 link)

(f/CPU0)

J.PCI-E G3 x8 slot (x8 or x 0 link)

(f/CPU0)

D.CPU0 DIMM C0/CPU0 DIMM C1 K.PCI-E G3 x16 slot (x16 link) (f/CPU0)

E.CPU1 DIMM C0/CPU1 DIMM C1 L.PCI-E G3x16 slot (x16 link) (f/CPU1)

F.CPU1 DIMM D0/CPU1 DIMM D1

G.CPU1 DIMM B0/CPU1 DIMM B1

M.PCI-E G3x8 slot (x8 link) (f/CPU1)

Headers/Jumpers

a. PSU_Alert Enable Jumper (3PHD_10) b. Flash Security Override Jumper

(3PHD_8) e. Chassis Intrusion Header (2PHD_1) f. ID_LED Button Header (2PHD_2) c. ME Recovery Mode Jumper(3PHD_4) g. Buzzer Disable Jumper(4PHD_12) d. LAN2 Disable Jumper (3PHD_1) h. Intel MIC Jumper (3PHD_2)


PSMI1 SYS_FAN1

CPU0_FAN

CPU1_FAN

SYS_FAN4

SYS_FAN5

FAN_HDR1 USB2_2

COM1

IPMB1

USB3_2

A_USB1

SYS_FAN2

SYS_FAN3

SGPIO2

FPIO


SYS_FAN1/2/3/4/5/CPU0/1_FAN: 4-Pin FAN Connector

Pin

Signal

1

GND

2

+12V

3

FAN_TACH

4

FAN_PWM

NOTE:

Use this header to connect the cooling fan to your motherboard to keep the system stable and reliable.

A 4-pin fan is required for fan speed control.

COM1: COM Header

Signal

DCD

SIN

SOUT

DTR

GND

FPIO: Front Panel Connector

Pin

1

3

5

7

9

Pin

2

4

6

8

10

Signal

DSR

RTS

CTS

RI

KEY

Signal

PWRLED+

KEY

PWRLED-

HDDLED+

HDDLED-

PWR_SW#

Pin Pin Signal

1

3

2

4

V3P3_AUX

ID_LED+

5

7

6

8

ID_LED-

HWM_FAULT_LED-

9 10

SYS_FAULT_LED-

11 12

LAN1_ACTLE+

GND

RST_SW#

13 14

LAN1_ACTLED-

15 16

SMBDATA

GND

17 18

SMBCLK

FP_IDLED_BTN_N 19

20

INTRUSION#

FPIO_TEMP_IN

21 22

LAN2_ACTLED+

NMI_SW#

23 24

LAN2_ACTLED-

NOTE:

FPIO_TEMP_IN is reserved for Tyan front panel board, then BMC FW can read SYS_Air_Inlet temperature.

PSIMI1: PSMI Connector

Pin 1 2 3 4 5

Signal

SMB_CLK SMB_DAT SMB_ALERT# GND V3P3


USB2_2: Front USB2.0 Header

Signal

+5V

USB DATA1-

USBDATA1+

GND

KEY

USB3_2: Front USB3.0 Header

Signal

+5V

P0_RX_P

P0_TX_N

GND

P0_P

P1_P

GND

P1_TX_N

P1_RX_P

+5V

5

7

9

Pin

1

3

7

9

11

13

Pin

1

3

5

15

17

19

Pin

2

4

6

8

10

8

10

12

14

Pin

2

4

6

16

18

20

Signal

+5V

USB DATA2-

USB DATA2+

GND

GND

A_USB1: Vertical (Type_A) USB Connectors

Pin

Signal

IPMB1: IPMB Connector

1

VCC

2 3

USBDATA2- USBDATA2+

Signal Pin

BMC_SMB_DATA

1

BMC_SMB_CLK

3

Pin

2

4

FAN_HDR1: Front Fan Connector (Reserved for Barebone)

Signal

GND

NC

Signal

TACH1

TACH2

TACH3

TACH4

TACH5

GND

PWM2

TACH11

TACH12

VCC3_AUX

Pin

1

3

5

7

9

11

13

15

17

19

Pin

2

4

6

8

10

12

14

16

18

20

Signal

TACH6

TACH7

TACH8

TACH9

TACH10

KEY

PWM1

SMB_DATA

SMB_CLK

PWM3

Signal

P0_RX_N

GND

P0_TX_P

P0_N

OC_N

P1_N

P1_TX_P

GND

P1_RX_N

Key

4

GND


SGPIO2: SSATA SGPIO Header

Signal

SCL

Pin

1

3

Pin

2

4

Signal

NC

SDA SSDATA OUT-

GND

KEY

5

7

6

8

SSLOAD

SSCLOCK

P3V3_AUX

9 10

HD_ERROR_LED

NOTE:

SGPIO2 is responsible for SSATA 0~3


3PHD_2

DBG_HD1

3PHD_1

2PHD_1

2PHD_2

Caution:

1.

The jumpers are only using for engineering debug. We don‟t suggest customers change the jumpers‟ position, which may cause unable to boot device.


DBG_HD1: TYAN Module Header

Signal

P3V3

LAD0

LAD1

LAD2

LAD3

DBG_SERIRQ

DBG_PRES_N

ADDR_MB

2PHD_1: Chassis Intrusion Header

7

9

11

13

15

Pin

1

3

5

8

10

12

14

16

Pin

2

4

6

Signal

FRAME_N

KEY

PLT_RST_N

GND

CLK_33M

GND

VCC3_AUX

PCH_PP_EN

Pin 1 2

Open

Short (

Default

)

Signal

INTRUDER# GND

Open: Use this header to trigger the system chassis intrusion alarm.

Short: Use this header to disable the system chassis intrusion alarm.

2PHD_2: ID LED Button Header

Pin

Signal

3PHD_1: LAN2 Disable Jumper

1

FP_IDLED_BTN_N

2

GND

Pin

1

3

Signal

NC

GND

Pin

2

Pin 1-2 Closed: Normal Mode (

Default

)

Signal

PV_DIS_LAN_0

Pin 2-3 Closed: Disable Gigabit and only has IPMI function

3PHD_2: Intel MIC Jumper

Pin

1

3

Signal

NC

VCC3

Pin

2

Signal

MIC _EN


Default

)

Pin 2-3 Closed: Intel MIC Card


4PHD_12

3PHD_4

3PHD_8

3PHD_10


3PHD_4: ME Recovery Mode Jumper

Pin

1

3

Signal

NC

GND

Pin

2

Signal

FM_ME_RCVR_N


Default

)

Pin 2-3 Closed: ME Recovery Mode

3PHD_8: Flash Security Override Jumper

Pin

1

3

Signal

NC

GND

Pin

2

Signal

MFG_MODE_N


Default

)

Pin 2-3 Closed: Security Override

3PHD_10: PSU_Alert Enable Jumper

Pin

1

3

Signal

PSU_SMB_ALERT_

BMC_N

NC

Pin

2

Signal

PSU_SMB_ALERT_

BMC_N_R

Pin 1-2 Closed: Enable

Pin 2-3 Closed: Disable PSU Alert (

Default

)

4PHD_12: BUZZER Disable Jumper

Pin

1

3

Signal

VCC5

BUZ_1

Pin

2

4

Signal

NA

BUZ_2

Pin 3-4 Closed: Normal Mode (

Default

)

Pin 2-3 Closed: Disable PC Beep

Pin 1-4 Closed: Use the External Speaker


ID_LED Button

ID_LED


SATA4

SATA5

SSATA3/SSATA2/SSATA1/SSATA0

SATA4: SATA3.0 Connector(Blue)

1

7

5

6

7

1

2

3

4

GND

TXP

TXN

GND

RXN

RXP

GND

SATA5: SATA3.0 Connector(Blue)

1

7

5

6

7

1

2

3

4

GND

TXP

TXN

GND

RXN

RXP

GND

Connects to the Serial ATA ready drives via the Serial ATA cable.


SSATA0/1/2/3: Second SATA3.0 Connector(Black)

1

7

5

6

7

1

2

3

4

GND

TXP

TXN

GND

RXN

RXP

GND


ID_LED / IDLED_BTN: ID LED and Button

Pin

+

-

Signal

P3V3_AUX

ID_SW_L

State

On

Color

Blue

Description

System identified

Off Off System not identified

NOTE:

The ID LED can be activated remotely using IPMI.

Please visit the TYAN Web Site at


to download the latest IPMI Configuration Guide for more details.


2.5 Installing the Processor and Heatsink

The types of processors supported by the S7070 are listed in the 1.2 Hardware

Specifications section on page 4. Check our website at


for the latest list of validated Intel

®

processors for this specific motherboard.

NOTE:

MiTAC is not liable for damage as a result of operating an unsupported configuration.

Processor Installation (Socket R3 for Intel Haswell CPU)

Follow the steps described later to install the processors and heat sinks.

The following pictures illustrate how to install the Intel

®

Haswell-EP processor on the Socket R3. Please note that the motherboard may not look exactly like the one you purchased. Therefore, the illustrations should be held for your reference only.

NOTE:

Please save and replace the CPU protection cap when returning for service.

1. Locate the CPU socket.

2. Open the one side socket lever.

3. Open the other side of the lever.


4. Lift the socket cover to a fully open position.

5. Place the CPU in the CPU socket and make sure that the gold arrow is located in the right direction with two notches properly aligned.

6. Remove the socket protection cap.

7. Close the CPU socket cover.


8. Close the socket one side lever.

9. Close the socket other side lever.


Heat sink Installation

After installing the processor, you will need to proceed to install the heat sink. The

CPU heat sink will ensure that the processor do not overheat and continue to operate at maximum performance for as long as you own them. An overheated processor is dangerous to the motherboard. The processors will overheat within seconds, enter thermal protection, and shut down if heatsinks are not installed.

Caution： Take caution of the air flow must be in the direction which paralleled with memories.

For the safest method of installation and information on choosing the appropriate heat sink, using heat sinks validated by Intel

®

. Please refer to the Intel

®

website:

http://www.intel.com

The following diagram illustrates how to install the heatsink on the Intel

®

Haswell EP

Socket R3:

1. Tear down the heatsink protective cover.

2. Place the heat sink on top of the CPU.


3. Secure the heatsink screws.

4. Connect the fan cable.


2.6 Thermal Interface Material

There are two types of thermal interface materials designed for use with the processors.

The most common material comes as a small pad attached to the heat sink at the time of purchase. There should be a protective cover over the material. Take care not to touch this material.

Simply remove the protective cover and place the heat sink on the processor.

The second type of interface material is usually packaged separately. It is commonly referred to as „thermal compound‟. Simply apply a thin layer on to the CPU lid

(applying too much will actually reduce the cooling).

NOTE:

Always check with the manufacturer of the heat sink & processor to ensure that the thermal interface material is compatible with the processor and meets the manufacturer‟s warranty requirements.


2.7 Tips on Installing Motherboard in Chassis

Before installing your motherboard, make sure your chassis has the necessary motherboard support studs installed. These studs are usually metal and are gold in color. Usually, the chassis manufacturer will pre-install the support studs. If you are unsure of stud placement, simply lay the motherboard inside the chassis and align the screw holes of the motherboard to the studs inside the case. If there are any studs missing, you will know right away since the motherboard will not be able to be securely installed.

NOTE:

Be especially careful to look for extra stand-offs. If there are any stand-offs present that are not aligned with a mounting hole on the motherboard, it will likely short components on the back of the motherboard when installed. This will cause malfunction and/or damage to your motherboard.


Some chassis include plastic studs instead of metal. Although the plastic studs are usable, MiTAC recommends using metal studs with screws that will fasten the motherboard more securely in place.

Below is a chart detailing what the most common motherboard studs look like and how they should be installed.


2.8 Installing the Memory

Before installing memory, ensure that the memory you have is compatible with the motherboard and processor. Check the TYAN Web site at http://www.tyan.com for details of the type of memory recommended for your motherboard.

 The Intel

®

Xeon E5-2600 V3(22nm/Haswell processor is a dualchannel design with a total of 8 DDR4 channels

 This platform supports Registered DDR4 up to 256GB, LR DIMM

(Load Reduced) DIMM DDR4 up to 512GB, and LRDIMM 3DS* DDR4 up to 1024GB

 DDR4 data transfer rates of 1600, 1866, and 2133 MT/s are supported

 1.2V DDR4 DIMMs are supported

 All installed memory will automatically be detected. No jumpers or settings need to be changed for memory detection.

 All memory must be of the same type and density.

Registered and

LRDIMM memory types can NOT be mixed and matched on the same motherboard.


Recommended Memory Population Table (Single CPU)

Single CPU Installed

(CPU0 only)

Quantity of memory installed

1 2 3 4 5 6

CPU0_DIMM_A0

CPU0_DIMM_A1

√ √ √ √ √

√

√

√

7 8

√

√

CPU0_DIMM_B0

CPU0_DIMM_B1

√ √ √ √ √

√

√

√

CPU0_DIMM_C0

CPU0_DIMM_C1

CPU0_DIMM_D0

√ √

√

√

√

√

√

√

√

√ √

CPU0_DIMM_D1

NOTE:

1. √ indicates a populated DIMM slot.

2. Install memory in sets of fours for maximum performance. This ensures that all four memory channels are properly utilized, providing maximum memory bandwidth.

3. Populate the same DIMM type in each channel, specifically

- Use the same DIMM size

- Use the same # of ranks per DIMM

4. Dual-rank DIMMs are recommended over single-rank DIMMs.

√

√

√

√

√

√

√


Recommended Memory Population Table (Dual CPU)

Dual CPU installed (CPU0 and CPU1)

Quantity of memory installed

2 3 4 5 6 7 8 10 12 14 16

CPU0_DIMM_A0

CPU0_DIMM_A1

CPU0_DIMM_B0

CPU0_DIMM_B1

CPU0_DIMM_C0

CPU0_DIMM_C1

CPU0_DIMM_D0

√ √ √ √ √ √ √

√ √ √ √ √ √

√ √ √

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

CPU0_DIMM_D1

CPU1_DIMM_A0

CPU1_DIMM_A1

CPU1_DIMM_B0

√ √ √ √ √ √ √

√ √ √ √ √

√

√

√

√

√

√

√

√

√

CPU1_DIMM_B1

CPU1_DIMM_C0

CPU1_DIMM_C1

CPU1_DIMM_D0

√ √ √

√

√

√

√

√

√

√

√

√

√

√

√

√

CPU1_DIMM_D1 √

NOTE:

1. √ indicates a populated DIMM slot.

2. Install memory in sets of fours for maximum performance. This ensures that all four memory channels are properly utilized, providing maximum memory bandwidth.

3. Populate the same DIMM type in each channel, specifically

- Use the same DIMM size

- Use the same # of ranks per DIMM

4. Dual-rank DIMMs are recommended over single-rank DIMMs.

√

√

√

√

√

√

√

√

√

√

√


Intel

®

Xeon

®

processor E5-2600v3 product families Support

NOTE 1:

1DPC => One dimm per channel

NOTE 2:

2DPC => Two dimm per channel

 Physical Ranks are used to calculate DIMM Capacity.

 Supported DRAM Densities are 4Gb, 8Gb.


Memory Installation Procedure

Follow these instructions to install memory modules into the S7070.

1. Unlock a DIMM socket by Press the retaining clip outwardly in the following illustration.

2. Align the memory module with the socket，such that the DIMM NOTCH match the KEY SLOT on the socket.

3. Seat the module firmly into the socket by gently pressing down until it sits flush with the socket. The locking levers pop up into place.


2.9 Attaching Drive Cables

Attaching SATA Cables

The following illustrates how to make a SATA Cable connection. If you are in need of SATA/SAS cables or power adapters please contact your local sales representative.

Attaching SAS Cables

The following illustrates how to make a SAS Cable connection. If you are in need of

SATA/SAS cables or power adapters please contact your local sales representative.


2.10 Installing Add-In Cards

Before installing add-in cards, it‟s helpful to know if they are fully compatible with your motherboard. For this reason, we‟ve provided the diagrams below, showing the slots that may appear on your motherboard.

 1.Slot #6: PCI-E G3x16 slot (x8 or x16 link) (f/ CPU0)

 2.Slot #5: PCI-E G3x8 slot (x8 or x0 link) (f/ CPU0) ODM/OEM

 3.Slot #4: PCI-E G3 x16 slot (x16 link)

(f/ CPU0)



 4.Slot #2: PCI-E G3x16 slot (x16 link)

(f/ CPU1)



 5.Slot #1: PCI-E G3 x8 slot (x8 link) (f/

CPU1)open-end type

Simply find the appropriate slot for your add-in card and insert the card firmly. Do not force any add-in cards into any slots if they do not seat in place. It is better to try another slot or return the faulty card rather than damaging both the motherboard and the add-in card.

TIP: It‟s a good practice to install add-in cards in a staggered manner rather than making them directly adjacent to each other. Doing so allows air to circulate within the chassis more easily, thus improving cooling for all installed devices.

NOTE:

You must always unplug the power connector from the motherboard before performing system hardware changes to avoid damaging the board or expansion device.


2.11 Connecting External Devices

Connecting external devices to the motherboard is an easy task. The motherboard supports a number of different interfaces through connecting peripherals. See the following diagrams for the details.

LAN1 (shared with IPMI, i350)

AST2400, i350 only server)

LAN2 (i350)

ID_Button

VGA Port

(only server)

Audio Jack Definition

USB2.0x2 USB3.0x2

Audio Jack with

S/PDIF (only WS)


Onboard LAN LED Color Definition

The

two

onboard Ethernet ports have green and Amber LEDs to indicate LAN status. The chart below illustrates the different LED states.

1Gbps LAN Link/Activity LED Scheme

Description

Left LED

(Link/Activity)

Right LED

(Speed)

1Gbps

No Link

10 Mbps

100 Mbps

Link

Active

Link

Active

Link

Active

OFF

Green

Blinking Green

Green

Blinking Green

Green

Blinking Green

OFF

OFF

OFF

Solid Green

Solid Green

Solid Amber

Solid Amber


2.12 Installing the Power Supply

There are Four (4) power connectors on your S7070 motherboard. The S7070 supports EPS 12V power supply.

PWR1: ATX 24-Pin Power Connector

Signal

V3P3

V3P3

GND

+5V

GND

+5V

GND

PWROK

5VSB

+12V

+12V

V3P3

8

9

10

11

12

Pin

1

2

3

4

5

6

7

20

21

22

23

24

Pin

13

14

15

16

17

18

19

Signal

V3P3

-12V

GND

PS_ON#

GND

GND

GND

NC

+5V

+5V

+5V

GND

PWR2: SSI 8-Pin CPU/DIMM Power Connector

Signal

GND

GND

GND

GND

Pin

1

2

3

4

PWR3: SSI 8-Pin CPU/DIMM Power Connector

Signal

GND

GND

GND

GND

Pin

1

2

3

4

Pin

5

6

7

8

Pin

5

6

7

8

Signal

P0_P12V

P0_P12V

P0_MEM_P12V

P0_MEM_P12V

Signal

P1_P12V

P1_P12V

P1_MEM_P12V

P1_MEM_P12V

Signal

GND

1

Pin

2

Pin Signal

GND

+12V

3 4

+12V

NOTE:

The PW4 is reserved for PCIE slot

12V supplement if the PCIE card and the

MB FAN's 12V power consumption exceed the maximum 12V out of PSU's PW1.

NOTE:

You must unplug the power supply before plugging the power cables to motherboard connectors.


2.13 Finishing Up

Congratulations on making it this far! You have finished setting up the hardware aspect of your computer. Before closing up your chassis, make sure that all cables and wires are connected properly, especially SATA cables and most importantly, jumpers. You may have difficulty powering on your system if the motherboard jumpers are not set correctly.

In the rare circumstance that you have experienced difficulty, you can find help by asking your vendor for assistance. If they are not available for assistance, please find setup information and documentation online at our website or by calling your vendor‟s support line.


Chapter 3: BIOS Setup

3.1 About the BIOS

The BIOS is the basic input/output system, the firmware on the motherboard that enables your hardware to interface with your software. The BIOS determines what a computer can do without accessing programs from a disk. The BIOS contains all the code required to control the keyboard, display screen, disk drives, serial communications, and a number of miscellaneous functions. This chapter describes the various BIOS settings that can be used to configure your system.

The BIOS section of this manual is subject to change without notice and is provided for reference purposes only. The settings and configurations of the BIOS are current at the time of print and are subject to change, and therefore may not match exactly what is displayed on screen.

This section describes the BIOS setup program. The setup program lets you modify basic configuration settings. The settings are then stored in a dedicated, batterybacked memory (called NVRAM) that retains the information even when the power is turned off.

To start the BIOS setup utility:

1. Turn on or reboot your system.

2. Press <F2> or <Del> during POST (<Tab> on remote console) to start the

BIOS setup utility.

3.1.1 Setup Basics

The table below shows how to navigate in the setup program using the keyboard.

Key

<F1>

<ESC>

 arrow  keys

↑ or↓ arrow keys

<Tab> / <Shift-Tab>

<Home> / <End>

<PgUp> / <PgDn>

<->

<+>

<F8>

<F3>

<F4>

<Enter>

Function

General help window

Exit current menu

Select a different menu

Move cursor up/down

Cycle cursor up/down

Move cursor to top/bottom of the window

Move cursor to next/previous page

Select the previous value/setting of the field

Select the next value/setting of the field

Load Fail Safe default configuration values of the menu

Load the Optimal default configuration values of the menu

Save and exit

Execute command or select submenu


3.1.2 Getting Help

Pressing [F1] will display a small help window that describes the appropriate keys to use and the possible selections for the highlighted item. To exit the Help

Window, press [ESC] or the [Enter] key again.

3.1.3 In Case of Problems

If you have trouble booting your computer after making and saving the changes with the BIOS setup program, you can restart the computer by holding the power button down until the computer shuts off (usually within 4 seconds); resetting by pressing

CTRL-ALT-DEL; or clearing the CMOS.

The best advice is to only alter settings that you thoroughly understand. In particular, do not change settings in the Chipset section unless you are absolutely sure of what you are doing. The Chipset defaults have been carefully chosen either by

MiTAC or your system manufacturer for best performance and reliability. Even a seemingly small change to the Chipset setup options may cause the system to become unstable or unusable.

3.1.4 Setup Variations

Not all systems have the same BIOS setup layout or options. While the basic look and function of the BIOS setup remains more or less the same for most systems, the appearance of your Setup screen may differ from the charts shown in this section. Each system design and chipset combination requires a custom configuration. In addition, the final appearance of the Setup program depends on the system designer. Your system designer may decide that certain items should not be available for user configuration, and remove them from the BIOS setup program.

NOTE: The following pages provide the details of BIOS menu. Please be aware that the BIOS menus are continually changing due to continual BIOS updates over the product lifespan of the motherboard. The BIOS menus provided are current as of the date when this manual was written. Please visit TYAN‟s website at http://www.tyan.com

for information on BIOS updates available for this specific motherboard.


3.2 Main Menu

In this section, you can alter general features such as the date and time.

Note that the options listed below are for options that can directly be changed within the Main Setup screen.

BIOS Information

It displays BIOS related information.

Memory Information

This displays the total memory size.

System Date

Adjust the system date.

MM (Months): DD (Days): YYYY (Years)

System Time

Adjust the system clock.

HH (24 hours format): MM (Minutes): SS (Seconds)

Access Level

Read only.


3.3 Advanced Menu

This section facilitates configuring advanced BIOS options for your system.

ACPI Settings

System ACPI Parameters.

Hardware Health Configuration

Hardware health Configuration Parameters.

Onboard Device Configuration

Onboard Device Configuration.

PCIe Slot Configuration

Onboard PCIe Slot Configuration

WatchDog Timer Configuration

WatchDog Configuration

ASPEED Super IO Configuration

System Super IO Chip parameters


S5 RTC Wake Settings

S5 RTC Wake Settings

Serial Port Console Redirection

Serial Port Console Redirection

PCI Subsystem Settings

PCI, PCI-X and PCI Express Settings

CSM Configuration

CSM Configuration, Enable/Disable Option ROM execution setting,etc

Trusted Computing ( optional function )

Trusted Computing (TPM) settings.

NOTE: If no TPM chipset is on, the Trusted Computing submenu will not appear.

USB Configuration

USB Configuration Parameters.


3.3.1 ACPI Settings

Enable ACPI Auto Configuration

Enable or disable BIOS ACPI Auto Configuration.

Disabled / Enabled

Enable Hibernation

Enables or disables System ability to Hibernate (OS/S4 Sleep State). This option may not be effective with some OS.

Disabled / Enabled


3.3.2 Hardware Health Configuration

Auto Fan Control

Auto Fan Control help.

Disabled / Enabled

NOTE: Auto Fan Control must be set to [Enable] PWM Minimal Duty Cycle menu will appear.

PWM Minimal Duty Cycle

Duty Cycle control range

30% Duty Cycle / 45% Duty Cycle / 60% Duty Cycle

BMC Alert Beep

BMC Alert Beep On/Off.

On / Off

PSU Status Monitor

PMBus support

Disabled / Enabled


3.3.2.1 Sensor Data Register Monitoring

When you enter the Sensor Data Register Monitoring submenu, you will see the following dialog window pop out. Please wait 8~10 seconds.

NOTE 1:

SDR can not be modified. Read only.




3.3.3 Onboard Device Configuration

Onboard LAN #1

Enable or disable the Onboard Network Controller.

Enabled / Disabled

Load Onboard LAN1/2 Option ROM

Enabled/Disabled the LAN Option ROM in the Chipset.

Enabled with iSCSI / Enabled with PXE / Disabled

NOTE:

The ISCSI function is only supported in LAN1.

Onboard LSI SAS

Enable or disable Onboard LSI SAS Controller


Chassis Intrusion detect

Enabled: When a chassis open event is detected ,the BIOS will record the event.

Disabled / PXE


NMI Button

Enable or disable NMI button.

Enabled / Disabled

Wait For ‘ESC’ if Error

Enable or disable wait ESC key function. When chassis intrusion. CMOS Clear or

BMC not Response.



3.3.4 PCIe Slot Configuration

PCIe SLOT1/2/3/5 OPTROM

Enabled/Disabled Load OPTROM for PCIe slot devices.


PCIe SLOT1/2/3/5 LINK SPEED

Onboard PCIe Link Slot Link, Speed Configuration

Auto / GEN1(2.5GT/s) / GEN2(5GT/s) / GEN3(8GT/s)


3.3.5 Watchdog Timer Configuration

Watch Dog Mode

Watch Dog Mode Help.

Disabled / POST / OS / PowerON

NOTE:

Watch Dog Timer will appear when Watch Dog Mode is not set to

[Disabled].

Watch Dog Timer

Watch Dog Timer Help.


3.3.6 ASPEED Super IO Configuration

Super IO Chip

Read only.


3.3.6.1 Serial Port 1 Configuration

Serial PortGSIO200

Enable or disable Serial Port (COM).

Enabled / Disabled

Device Settings

Read only.

Change SettingsGSIO600

Select an optimal setting for Super IO Device.

Auto / IO=3F8h; IRQ=4;

/ IO=3F8h, IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;

/ IO=2F8h; IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;

/ IO=3E8h, IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;

/ IO=2E8h, IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;


3.3.7 S5 RTC Wake Settings

Wake system from S5

Enable or disable system wake on alarm event. Select Fixed time, system will wake on the hr::min::sec specified. Select dynamic time, system will wake on the current time+ increase minute(s)

Disabled / Fixed time /Dynamic time


3.3.8 Serial Port Console Redirection

Console Redirection

Console redirection enable or disable.

Disabled / Enabled

Serial Port for Out-Of-Band Management/Windows Emergency Services (EMS)

Console Redirection

Console redirection enable or disable.

Disabled / Enabled

Console Redirection Settings

The settings specify how the host computer (which the user is using) will exchange data. Both computers should have the same or compatible settings.

NOTE:

Console Redirection Settings menu only appear when Console

Redirection was set to [Enabled].


3.3.8.1 Console Redirection Settings

Terminal Type

Emulation: ANSI: Extended ASCII charset.

VT100: ASCII charset.

VT100+: Extends VT100 to support color function keys, etc.

VT-UTF8: Uses UTF8 encoding to map Unicode chars onto 1 or more bytes.

VT-UTF8 / VT100 / VT100+ / ANSI

Bits per Second

Select serial port transmission speed. The speed must be matched on the other side. Long or noisy lines may require lower speeds.

38400 / 9600 / 19200 / 115200 / 57600

Data Bits

8 / 7

Parity

A parity bit can be sent with the data bits to detect some transmission errors. Even: parity bit is 0 if the num of 1‟s in the data bits is even. Odd: parity bit is 0 if the num of 1‟s in the data bits is odd. Mark: parity bit is always 1. Space: parity bit is always

0. Mark and Space parity do not allow for error detection.

None / Even / Odd / Mark / Space


Stop Bits

Stop bits indicate the end of a serial data packet. (A start bit indicates the beginning). The standard setting is 1 stop bit. Communication with slow devices may require more than 1 stop bit.

1 / 2

Flow Control

Flow Control can prevent data loss from buffer overflow. When sending data, if the receiving buffers are full, a „stop‟ signal can be sent to stop the data flow. Once the buffers are empty, a „start‟ signal can be sent to restart the flow. Hardware flow control uses two wires to send start/stop signal.

None / Hardware RTS/CTS

VT-UTF8 Combo Key Support

Enable VT-UTF8 Combination Key Support for ANSI/VT100 terminals.


Recorder Mode

With this mode enabled only text will be sent. This is to capture Terminal data.


Resolution 100x31

Enable or disable extended terminal resolution.


Legacy OS Redirection Resolution

On Legacy OS, the number of rows and columns supported redirection.

80x24 / 80x25

Putty KeyPad

Select FunctionKey and KeyPad on Putty.

VT100 / LINUX / XTERMR6 / SCO / ESCN / VT400

Redirection After BIOS POST

The settings specify if bootloader is selected than Legacy console redirection is disabled before booting to Legacy OS. Default value is always enable means

Legacy.

Always enable / Bootloader


3.3.8.2 Console Redirection Settings

Legacy Serial Redirection Port

Select a COM port to display redirection of Legacy OS and Legacy OPROM

Messages

COM1


3.3.8.3 Serial Port for Out-Of-Band Management/Windows Emergency

Services (EMS) Console Redirection Settings

Out-of Band Mgmt Port

Microsoft Windows Emergency Management Services (EMS) allows for remote management of a Windows Server OS through a serial port.

COM1 / COM2

Terminal Type

VT-UTF8 is the preferred terminal type for out-of-band management. The next best choice is VT100+ and then VT100. See above, in Console Redirection Settings page, for more Help with Terminal Type/Emulation.

VT-UTF8 / VT100 / VT100+ / ANSI

Bits per Second

Select serial port transmission speed. The speed must be matched on the other side. Long or noisy lines may require lower speeds.

115200 / 9600 / 19200 / 38400 / 57600

Flow Control

Flow Control can prevent data loss from buffer overflow. When sending data, if the receiving buffers are full, a „stop‟ signal can be sent to stop the data flow. Once the


buffers are empty, a „start‟ signal can be sent to restart the flow. Hardware flow control uses two wires to send start/stop signal.

None / Hardware RTS/CTS

Data Bits / Parity / Stop Bits

Read only.


3.3.9 PCI Subsystem

Above 4G Decoding

Enables or Disables 64bit capable Devices to be decoded in Above 4G Address

Space(Only if System supports 64 bit PCI decoding).

Enable / Disabled

SR-IOV Supporting

Enable / Disabled


3.3.9.1 PCI Express settings

Maximum Payload

Set maximum payload of PCI express device or allow system BIOS to select the value.

Auto / 128 Bytes / 256 Bytes / 512 Bytes / 1024 Bytes /2048

Bytes / 4056 Bytes


3.3.9.2 PCI Express Gen2 settings

ARI Forwarding

If supported by hardware and set to ‟Enabled‟, the downstream Port disables its traditional. Device Number field being 0 enforcement when turning a type1 configuration request into a type0 configuration request permitting access to extended functions in an ARI Device immediately below the port.

Enabled / Disabled


3.3.10 CSM Configuration

CSM support

Enable/Disable CSM Support


Option ROM Messages

Set display mode for Option ROM

Force BIOS / Keep Current

Network

Controls the execution of UEFI and legacy PXE OpROM

Do not launch / UEFI / legacy

Storage


Do not launch / UEFI / legacy /

Video


Do not launch / UEFI / legacy


Other PCI devices

Determines OpRom execution policy for devices other than network, storage, or video

legacy / UEFI


3.3.11 Trusted Computing ( optional function )

NOTE:

If no TPM chipset is on, the Trusted Computing submenu will not appear.

Security Device Support

Enable or disable BIOS support for security device. O.S. will not show Security device. O.S. will not show Security Device. TCG EFI protocol and INT1A interface will not be available.

Enable / Disable

NOTE:

The following BIOS items are available only when Security Device Support is set to [Enable].

TPM State

Enable/Disable security Device. NOTE: Your computer will reboot during restart in order to change State of the device.

Enabled / Disabled

Current Status Information

Read only.


3.3.12 USB Configuration

Legacy USB Support

Enable USB legacy support. AUTO option disables legacy support if no USB devices are connected. DISABLE option will keep USB devices available only for

EFI applications.

Enabled / Disabled / Auto

XHCI Hand-off

Enabled

/ Disabled

EHCI Hand-off

This is a workaround for OSes without EHCI hand-off support. The EHCI ownership change should be claimed by EHCI driver.


USB Mass Storage Driver Support

Enabled

/ Disabled

Port 60/64 Emulation

Enables I/O port 60h/64h emulation support. This should be enabled for the complete USB keyboard legacy support for non-USB aware OSes.

Enabled

/ Disabled


USB transfer time-out

The time-out value for Control, Bulk and Interrupt transfers.

20 sec / 10 sec / 5 sec / 1 sec

Device reset time-out

USB mass storage device Start Unit command time-out.

20 sec / 10 sec / 30 sec / 40 sec

Device power-up delay

Maximum time the device will take before it properly reports itself to the Host

Controller. AUTO uses default value: for a Root port it is 100 ms, for a Hub port the delay is taken from Hub descriptor.

Auto / Manual


3.4 Intel RCSetup Menu

Processor Configuration

Processor Parameters.

Advanced Power Management Configuration

Advanced power management Parameters.

Common RefCode Configuration

Common RefCode Configuration.

QPI Configuration

QPI Configuration

Memory Configuration

Memory Configuration

I/O Configuration (I/O Configuration)

PCH Configuration (PCH Configuration)

Miscellaneous Configuration (Miscellaneous Configuration)


3.4.1 Processor Configuration

Hyper Threading (ALL)

Enabled for Windows XP and Linux (OS optimized for Hyper Threading Technology) and disabled for other OS (OS not optimized for Hyper Threading Technology).

When disabled only one thread


Execute Disable Bit

XD can prevent certain classes of malicious buffer overflow attacks when combined with a supporting OS (Windows Server 2003 SP1, Windows XP SP2, SuSE Linux

9.2, RedHat Enterprise 3 Update 3).

Enabled

/

Disabled

VMX

Enables the Vanderpool Technology, takes effect after reboot

Enabled

/

Disabled

Enable SMX

Enables Safer Mode Extensions.

Enabled

/

Disabled


3.4.1.1 CPU Socket0/1 Configuration

Read only



3.4.2 Advanced Power Management Configuration

Power Technology

Enable the power management features.

Custom / Disabled / Energy Efficient

NOTE:

The following BIOS items are available only when Power Technology is set to

[Custom].


3.4.2.1 CPU P State Control

EIST (P-states)

When enabled,OS sets CPU frequency according load. When disabled, CPU frequency is set at max non-turbo.

Enabled

/

Disabled

Turbo Mode

Turbo mode allows a CPU logical processor to execute a higher frequency when

Enough power is available not exceed CPU defined limits.

Enabled

/

Disabled


3.4.2.2 CPU C State Control

Package C State Limit

C0/C1 state / C2 state / C6 (non Retention) state / C6 (Retention State)

CPU C3 Report

Enable/Disable CPU C3 (ACPI C2) report to OS. Recommended to be disabled

Enabled / Disabled

CPU C6 Report

Enable/Disable CPU C6 (ACPI C3) report to OS.


Enhanced Halt State

Enables the Enhanced C1E state of the CPU, takes effect after reboot



3.4.3 Common RefCode Configuraion

MMIOHBase

MMIOH Base [63:32]; must be between 4032 - 4078

56T / 48T / 24T

MMIO High Size

Select MMIO High Size

256G /128G / 512G /1024G

Numa

Enable or Disable none uniform Memory Access. (NUMA)



3.4.3 QPI Configuration Submenu

QPI Link Speed Mode

Select the QPI link speed as either the Fast Mode or the Slow Mode.

Fast / Slow

QPI Link Frequency Select

Select the QPI Link Frequency.

Auto / 6.4GT/s / 9.6GT/s / 8.0GT/s / Auto Limited

Link L0p Enable

Link L0p Enable: Disable, Enable, Auto (default)


Link L1 Enable

Link L1 Enable: Disable, Enable, Auto (default)



3.4.3.1 QPI Status Submenu

Read only


3.4.4 Memory Configuration

Enforce POR

Enable to enforce POR restrictions for DDR frequency and voltage programming

Auto / Enforce POR / Disabled / Enforce Stretch Goals

Memory Frequency

Maximum Memory Frequency Selections in Mhz. Do not select Reserved

Auto / 1333 / 1400 / 1600 / 1800 /1867 / 2000 / 2133 / 2200 / 2400 / 2600

/2667 / Reserved / Reserved / Reserved / Reserved

ECC Support

Select the memory type supported by this platform.

Auto / Disabled / Enabled

Memory Type

RDIMMs only / UDIMMs only / UDIMMs and RDIMMs

Data Scrambling

Enables Data Scrambling



3.4.4.1 Memory Topology Configuration

Read only


3.4.4.2 Memory Thermal Configuration

Set Throttling Mode

Configure Thermal throttling mode. Select OLTT or CLTT mode.

Disabled / CLTT / OLTT


3.4.4.3 Memory Map Configuration

Channel Interleaving

Select Channel Interleaving setting

Auto / 1-way Interleave / 2-way Interleave / 3-way Interleave / 4-way

Interleave

Rank Interleaving

Select rank Interleaving setting

Auto / 1-way Interleave / 2-way Interleave / 4-way Interleave / 8-way

Interleave


3.4.4.4 Memory RAS Configuration

RAS Mode

Enable / Disable RAS modes. Enabling Sparing and Mirroring is not supported.

Incase if enabled, sparing will be selected.

Disabled / Mirror / Lockstep Mode

Lockstep x4 DIMMs

Enable / Disable Lockstep for x4 DIMMs


Memory Rank Sparing

Enable / Disable Memory Rank Sparing


Device Tagging

Enable / Disable Device Tagging



3.4.5 I/O Configuration Submenu

Read only


3.4.5.1 IOAT Configuration Submenu

Enable IOAT

Control to enable / disable IOAT devices



3.4.5.2 Intel

®

VT for Directed I/O Configuration Submenu

Intel

®

VT for directed I/O (VT-d)

Enable/Disable Intel

®

I/O Acceleration Technology (I/OAT).

Disabled / Enabled


3.4.6 PCH Configuration


3.4.6.1 PCH Devices Configuration

PCH State after G3

Select S0/S5 for ACPI state after a G3.

S0 / S5 / Last State


3.4.6.2 PCH sSATA Configuration


sSATA Controller

Enable or Disable SATA Controller

Disabled / Enabled

Configure sSATA as

Indentify the SATA port is connected to Solid State Drive or Hard Disk Drive

IDE / AHCI / RAID

Support Aggressive Link Power Mana

Enable or Disable Aggressive Link Power Mana

Disabled / Enabled

sSATA Port 0/1/2/3

Port 0/1/2/3

Disabled / Enabled

Hot Plug

Enable/Disable SATA Ports Hot Plug Support.


Spin Up Device

AHCI Supports Staggered Spin-up


sSATA Device Type


Hard Disk Drive / Solid State Drive


3.4.6.3 PCH SATA Configuration


SATA Controller

Enable or Disable SATA Controller

Disabled / Enabled

Configure SATA as


IDE / AHCI / RAID

Support Aggressive Li

Enable or Disable Aggressive Li

Disabled / Enabled

SATA Port 0/1/2/3/4/5

Port 0/1/2/3

Disabled / Enabled

Hot Plug

Enable/Disable SATA Ports Hot Plug Support.


Spin Up Device

AHCI Supports Staggered Spin-up


SATA Device Type


Hard Disk Drive / Solid State Drive


3.4.6.4 USB Configuration xHCI Mode

Mode of operation of xHCI controller.

Auto / Smart Auto / Enabled / Disabled / Manual


3.4.7 Miscellaneous Configuration

Active Video

Select active video type

Onboard Device / Offboard Device


3.5 Server Management

Press <Enter> to change the SEL configuration.

Enable/Disable interfaces to communicate with BMC.


3.5.1 System Event Log

SEL Components

Change this to enable or disable all features of System Event Logging during boot.

Disabled / Enabled

Erase SEL

Choose options for erasing SEL.

No / Yes, on next reset / No, on every reset

When SEL is Full

Choose options for reactions to a full SEL.

Do Nothing / Erase Immediately

Log EFI Status Codes

Disable the logging of EFI Status Codes or log only error code or only progress code or both.

Both / Disabled / Error Code / Progress Code


3.5.2 BMC Network Configuration

Configuration Address Source

Select the configure LAN channel parameters statically or dynamically (by BIOS or

BMC). Unspecified option will not modify any BMC network parameters during BIOS phase.

Current Setting / Static / Dynamic-Obtained by BMC


3.6 Security

Password Description

Read only.

Administrator Password

Install or change the password.

User Password

Install or change the password.


3.6.1 Security Flash update Configuration


3.7 Boot

Bootup NumLock State

Select the keyboard NumLock state.

Off / On

Quiet Boot

Enable or disable Quiet Boot option.


Endless Boot

Enable or disable Endless Boot.

Disabled / Enabled

Boot Option #1/Boot Option #2

Select the first boot device.

Device Name / Disabled


3.7.1 Delete Boot Option Configuration

Delete Boot Option #1

Sets the system boot order.

Device Name / Select one to Delete


3.8 Save & Exit

Save Changes and Exit

Exit system setup after saving the changes.

Discard Changes and Exit

Exit system setup without saving any changes.

Save Changes and Reset

Reset the system after saving the changes.

Discard Changes and Reset

Reset system setup without saving any changes.

Save Options

Read only.

Save Changes

Save changes done so far to any of the setup options.

Discard Changes

Discard changes done so far to any of the setup options.


Restore Defaults

Restore/Load Default values for all the setup options.

Save as User Defaults

Save the changes done so far as User Defaults.

Restore User Defaults

Restore the User Defaults to all the setup options.


Chapter 4: Diagnostics

NOTE: if you experience problems with setting up your system, always check the following things in the following order:

Memory, Video, CPU

By checking these items, you will most likely find out what the problem might have been when setting up your system. For more information on troubleshooting, check the TYAN website at http://www.tyan.com.

4.1 Flash Utility

Every BIOS file is unique for the motherboard it was designed for. For Flash

Utilities, BIOS downloads, and information on how to properly use the Flash Utility with your motherboard, please check the TYAN web site at http://www.tyan.com

NOTE:

Please be aware that by flashing your BIOS, you agree that in the event of a BIOS flash failure, you must contact your dealer for a replacement

BIOS. There are no exceptions. TYAN does not have a policy for replacing

BIOS chips directly with end users. In no event will TYAN be held responsible for damages done by the end user.


4.2 AMIBIOS Post Code (Aptio)

The POST code checkpoints are the largest set of checkpoints during the BIOS preboot process. The following table describes the type of checkpoints that may occur during the POST portion of the BIOS:

Checkpoint Ranges

Status Code Range

0x01 – 0x0B

0x0C – 0x0F

0x10 – 0x2F

0x30 – 0x4F

0x50 – 0x5F

0x60 – 0x8F

0x90 – 0xCF

0xD0 – 0xDF

0xE0 – 0xE8

0xE9 – 0xEF

0xF0 – 0xF8

0xF9 – 0xFF

Description

SEC execution

Sec errors

PEI execution up to and including memory detection

PEI execution after memory detection

PEI errors

DXE execution up to BDS

BDS execution

DXE errors

S3 Resume (PEI)

S3 Resume errors (PEI)

Recovery (PEI)

Recovery errors (PEI)

Standard Checkpoints

SEC Phase

0x06

0x07

0x08

0x09

0x0A

0x0B

Status Code

0x00

Progress Codes

0x01

0x02

0x03

0x04

0x05

Description

Note used

Power on. Reset type detection (soft/hard).

AP initialization before microcode loading

North Bridge initialization before microcode loading

South Bridge initialization before microcode loading

OEM initialization before microcode loading

Microcode loading

AP initialization after microcode loading

North Bridge initialization after microcode loading

South Bridge initialization after microcode loading

OEM initialization after microcode loading

Cache initialization


0x18

0x19

0x1A

0x1B

0x1C

0x1D – 0x2A

0x2B

0x2C

0x2D

0x2E

0x2F

0x30

0x31

0x32

0x33

0x34

SEC Error Codes

0x0C – 0x0D

0x0E

0x0F

SEC Phase

None

PEI Phase

Status Code

Progress Codes

0x10

0x11

0x12

0x13

0x14

0x15

0x16

0x17

Reserved for future AMI SEC error codes

Microcode not found

Microcode not found

Description

PCI Core is started

Pre-memory CPU initialization is started

Pre-memory CPU initialization (CPU module specific)



Pre-memory North Bridge initialization is started

Pre-Memory North Bridge initialization (North Bridge module specific)

Pre-memory North Bridge initialization (North Bridge module specific)

Pre-Memory North Bridge initialization (North Bridge module specific)

Pre-memory South Bridge initialization is started

Pre-Memory South Bridge initialization (South Bridge module specific)

Pre-memory South Bridge initialization (South Bridge module specific)

Pre-Memory South Bridge initialization (South Bridge module specific)

OEM pre-memory initialization codes

Memory initialization. Serial Presence Detect (SPD) data reading

Memory initialization. Memory presence detection

Memory initialization. Programming memory timing information

Memory initialization. Configuring memory

Memory initialization (other)

Reserved for ASL (see ASL Status Codes section below)

Memory Installed

CPU post-memory initialization is started.

CPU post-memory initialization. Cache initialization

CPU post-memory initialization. Application Processor(s) (AP) initialization


Status Code

0x35

0x36

0x37

0x38

0x39

0x3A

0x3B

0x3C

0x3D

0x3E

Description

CPU post-memory initialization. Boot Strap Processor (BSP) selection

CPU post-memory initialization. System Management Mode (SMM) initialization

Post-Memory North Bridge initialization is started.

Post-Memory North Bridge initialization (North Bridge module specific)



Post-Memory South Bridge initialization is started

Post-Memory South Bridge initialization (South Bridge module specific)



OEM post memory initialization codes

DXE PIL is started

0x3F – 0x4E

0x4F

PCI Error Codes

0x50

0x51

0x52

0x53

0x54

0x55

0x56

0x57

0x58

0x59

Memory initialization error. Invalid memory type or incompatible memory speed

Memory initialization error. SPD reading has failed.

Memory initialization error. Invalid memory size or memory modules do not match.

Memory initialization error. No usable memory detected

Unspecified memory initialization error

Memory not installed

Invalid CPU type or speed

CPU mismatch

CPU self test failed or possible CPU cache error

CPU microcode is not found or microcode update is failed.

0x5A

0x5B

Internal CPU error

Reset PPI is not available.

0x5C – 0x5F Reserved for future AMI error codes

S3 Resume Progress Codes

0xE0

0xE1

0xE2

0xE3

0xE4 – 0xE7

S3 Resume is started (S3 Resume PPI is called by the DXE IPL).

S3 Boot Script execution

Video repost

OS S3 wake vector call

Reserved for future AMI progress codes


4

4

7

2

3

3

Status Code Description

S3 Resume Error Codes

0xE8 S3 Resume failed

0xE9

0xEA

0xEB

0xEC – 0xEF

S3 Resume PPI not found

S3 Resume Boot Script error

S3 OS wake error

Reserved for future AMI error codes

Recovery Progress Codes

0xF0 Recovery condition triggered by firmware (Auto recovery)

0xF1

0xF2

Recovery condition triggered by user (forced recovery)

Recovery process started

0xF3

0xF4

0xF5 – 0xF7

Recovery Error Codes

Recovery firmware image is found.

Recovery firmware image is loaded.

Reserved for future AMI progress codes

0xF8

0xF9

0xFA

0xFB – 0xFF

Recovery PPI is not available.

Recovery capsule is not found.

Invalid recovery capsule

Reserved for future AMI error codes

PEI Beep Codes

# of Beeps

Progress Codes

1

Description

1

Memory not installed

Memory was installed twice (installPEIMemory routine in PEI Core called twice).

Recovery started

DXEIPL was not found.

DXE Core Firmware Volume was not found.

Recovery failed

S3 Resume failed

Reset PPI is not available.

DXE Phase

Status Code

0x60

0x61

0x62

Description

DXE Core is started.

NVRAM initialization

Installation of the South Bridge Runtime Services


0x93

0x94

0x95

0x96

0x97

0x98

0x99

0x9A

0x71

0x72

0x73

0x74

0x75

0x76

0x77

0x78

0x79

0x7A – 0x7F

0x80 – 0x8F

0x90

0x91

0x92

0x69

0x6A

0x6B

0x6C

0x6D

0x6E

0x6F

0x70

Status Code

0x63

0x64

0x65

0x66

0x67

0x68

Description

CPU DXE initialization is started.

CPU DXE initialization (CPU module specific)




PCI host bridge initialization

North Bridge DXE initialization is started.

North Bridge DXE SMM initialization is started.

North Bridge DXE initialization (North Bridge module specific)





South Bridge DXE initialization is started.

South Bridge DXE SMM initialization is started.

South Bridge devices initialization

South Bridge DXE initialization (South Bridge module specific)





ACPI module initialization

CSM initialization

Reserved for future AMI DXE codes

OEM DXE initialization codes

Boot Device Selection (BDS) phase is started

Driver connecting is started

PCI Bus initialization is started

PCI Bus Hot Plug Controller initialization

PCI Bus Enumeration

PCI BUS Request Resources

PCI Bus Assign Resources

Console output devices connect

Console Input devices connect

Super IO initialization

USB initialization is started.


0xB2

0xB3

0xB4

0xB5

0xB6

0xB7

0xAA

0xAB

0xAC

0xAD

0xAE

0xAF

0xB0

0xB1

0xA2

0xA3

0xA4

0xA5

0xA6

0xA7

0xA8

0xA9

Status Code

0x9B

0x9C

0x9D

0x9E -0x9F

0xA0

0xA1

0xB8 – 0xBF

0xC0 – 0xCF

DXE Error Codes

0xD0

0xD1

0xD2

0xD3

0xD4

Description

USB Reset

USB Detect

USB Enable

Reserved for future AMI codes

IDE initialization is started

IDE Reset

IDE Detect

IDE Enable

SCSI initialization is started.

SCSI Reset

SCSI Detect

SCSI Enable

Setup Verifying Password

Start of Setup


Setup Input Wait


Ready To Boot event

Legacy Boot event

Exit Boot Services event

Runtime Set Virtual Address MAP Begin

Runtime Set Virtual Address MAP End

Legacy Option ROM initialization

System Reset

USB hot plug

PCI bus hot plug

Clean-up of NVRAM

Configuration Reset (reset of NVRAM settings)

Reserved for future AMI codes

OEM BDS initialization codes

CPU initialization error

North Bridge initialization error

South Bridge initialization error

Some of the Architectural Protocols are not available

PCI resource allocation error. Out of Resources


Status Code

0xD5

0xD6

0xD7

0xD8

0xD9

0xDA

0xDB

0xDC

Description

No Space for Legacy Option ROM

No Console Output Devices are found.

No Console Input Devices are found.

Invalid password

Error loading Boot Option (LoadImage returned error)

Boot Option is failed (StartImage returned error).

Flash update is failed.

Reset protocol is not available.

DXE Beep Codes

5

5

6

7

8

# of Beeps

1

4

ACPI/ASL Checkpoints

Description

Invalid password

Some of the Architectural Protocols are not available.

No Console Output Devices are found.

No Console Input Devices are found.

Flash update is failed.

Reset protocol is not available.

Platform PCI resource requirements cannot be met.

Status Code

0x01

0x02

0x03

0x04

0x05

0x10

0x20

0x30

0x40

0xAC

0xAA

Description

System is entering S1 sleep state.





System is waking up from the S1 sleep state.




System has transitioned into ACPI mode. Interrupt controller is in

APIC mode.

System has transitioned into ACPI mode. Interrupt controller is in

APIC mode.


Appendix I: Fan and Temp Sensors

This section aims to help readers identify the locations of some specific FAN and

Temp Sensors on the motherboard. A table of BIOS Temp sensor name explanation is also included for readers‟ reference.

NOTE:

The red dot indicates the sensor.

Fan and Temp Sensor Location:

1. Fan Sensor: It is located in the third pin of the fan connector, which detects the fan speed (rpm)

2. Temp Sensor: PCH_Temp , CPU1_MOS_Area (RT31) and SYS_Air_Outlet

(RT33) . They detect the system temperature around.


NOTE:

The system temperature is measured in a scale defined by

Intel

, not in Fahrenheit or Celsius.

BIOS Temp Sensor Name Explanation:



BIOS Temp Sensor Name Explanation

CPU0_DTS_Temp Temperature of the CPU0 Digital Temperature Sensor

CPU1_DTS_Temp Temperature of the CPU1 Digital Temperature Sensor

CPU0_PECI_Temp Temperature of the CPU0 Platform Environment Control Interface

CPU1_PECI_Temp Temperature of the CPU1 Platform Environment Control Interface

Sys _Air_Inlet Temperature of the System_Air_Inlet Area

Sys _Air_Outlet

CPU1_MOS_Area

PCH_Temp

CPU0_DIMM_A0

Temperature of the System_Air_Outlet Area

Temperature of the CPU1_MOS_Area

Temperature of the PCH

Temperature of CPU0 DIMM A0 Slot

CPU0_DIMM_A1

CPU0_DIMM_B0

CPU0_DIMM_B1

CPU0_DIMM_C0

CPU0_DIMM_C1

CPU0_DIMM_D0

CPU0_DIMM_D1

CPU1_DIMM_A0

CPU1_DIMM_A1

CPU1_DIMM_B0

CPU1_DIMM_B1

CPU1_DIMM_C0

CPU1_DIMM_C1

CPU1_DIMM_D0

CPU1_DIMM_D1


Temperature of CPU0 DIMM B0 Slot


Temperature of CPU0 DIMM C0 Slot


Temperature of CPU0 DIMM D0 Slot










BIOS FAN Sensor Name Explanation

CPU0_FAN Fan speed of CPU0_FAN

CPU1_FAN

SYS_FAN_1

Fan speed of CPU1_FAN

Fan speed of SYS_FAN_1

SYS_FAN_2

SYS_FAN_3

SYS_FAN_4




SYS_FAN_5

SYS_FAN_6

SYS_FAN_7

SYS_FAN_8

SYS_FAN_9

SYS_FAN_10








SYS_FAN_11

SYS_FAN_12




NOTE


Glossary

ACPI (Advanced Configuration and Power Interface): a power management specification that allows the operating system to control the amount of power distributed to the computer‟s devices. Devices not in use can be turned off, reducing unnecessary power expenditure.

AGP (Accelerated Graphics Port): a PCI-based interface which was designed specifically for demands of 3D graphics applications. The 32-bit AGP channel directly links the graphics controller to the main memory. While the channel runs only at 66 MHz, it supports data transmission during both the rising and falling ends of the clock cycle, yielding an effective speed of 133 MHz.

ATAPI (AT Attachment Packet Interface): also known as IDE or ATA; a drive implementation that includes the disk controller on the device itself. It allows CD-

ROMs and tape drives to be configured as master or slave devices, just like HDDs.

ATX: the form factor designed to replace the AT form factor. It improves on the AT design by rotating the board 90 degrees, so that the IDE connectors are closer to the drive bays, and the CPU is closer to the power supply and cooling fan. The keyboard, mouse, USB, serial, and parallel ports are built-in.

Bandwidth: refers to carrying capacity. The greater the bandwidth, the more data the bus, phone line, or other electrical path can carry. Greater bandwidth results in greater speed.

BBS (BIOS Boot Specification): a feature within the BIOS that creates, prioritizes, and maintains a list of all Initial Program Load (IPL) devices, and then stores that list in NVRAM. IPL devices have the ability to load and execute an OS, as well as provide the ability to return to the BIOS if the OS load process fails. At that point, the next IPL device is called upon to attempt loading of the OS.

BIOS (Basic Input/Output System): the program that resides in the ROM chip, which provides the basic instructions for controlling your computer‟s hardware. Both the operating system and application software use BIOS routines to ensure compatibility.

Buffer: a portion of RAM which is used to temporarily store data; usually from an application though it is also used when printing and in most keyboard drivers. The

CPU can manipulate data in a buffer before copying it to a disk drive. While this improves system performance (reading to or writing from a disk drive a single time is much faster than doing so repeatedly) there is the possibility of losing your data should the system crash. Information in a buffer is temporarily stored, not permanently saved.


Bus: a data pathway. The term is used especially to refer to the connection between the processor and system memory, and between the processor and PCI or

ISA local buses.

Bus mastering: allows peripheral devices and IDEs to access the system memory without going through the CPU (similar to DMA channels).

Cache: a temporary storage area for data that will be needed often by an application. Using a cache lowers data access times since the information is stored in SRAM instead of slower DRAM. Note that the cache is also much smaller than your regular memory: a typical cache size is 512KB, while you may have as much as 4GB of regular memory.

Closed and open jumpers: jumpers and jumper pins are active when they are “on” or “closed”, and inactive when they are “off” or “open”.

CMOS (Complementary Metal-Oxide Semiconductors): chips that hold the basic startup information for the BIOS.

COM port: another name for the serial port, which is called as such because it transmits the eight bits of a byte of data along one wire, and receives data on another single wire (that is, the data is transmitted in serial form, one bit after another). Parallel ports transmit the bits of a byte on eight different wires at the same time (that is, in parallel form, eight bits at the same time).

DDR (Double Data Rate): a technology designed to double the clock speed of the memory. It activates output on both the rising and falling edge of the system clock rather than on just the rising edge, potentially doubling output.

DIMM (Dual In-line Memory Module): faster and more capacious form of RAM than SIMMs, and do not need to be installed in pairs.

DIMM bank: sometimes called DIMM socket because the physical slot and the logical unit are the same. That is, one DIMM module fits into one DIMM socket, which is capable of acting as a memory bank.

DMA (Direct Memory Access): channels that are similar to IRQs. DMA channels allow hardware devices (like soundcards or keyboards) to access the main memory without involving the CPU. This frees up CPU resources for other tasks. As with

IRQs, it is vital that you do not double up devices on a single line. Plug-n-Play devices will take care of this for you.


DRAM (Dynamic RAM): widely available, very affordable form of RAM which looses data if it is not recharged regularly (every few milliseconds). This refresh requirement makes DRAM three to ten times slower than non-recharged RAM such as SRAM.

ECC (Error Correction Code or Error Checking and Correcting): allows data to be checked for errors during run-time. Errors can subsequently be corrected at the same time that they‟re found.

EEPROM (Electrically Erasable Programmable ROM): also called Flash BIOS, it is a ROM chip which can, unlike normal ROM, be updated. This allows you to keep up with changes in the BIOS programs without having to buy a new chip. TYAN

®

‟s

BIOS updates can be found at http://

www.tyan.com

ESCD (Extended System Configuration Data): a format for storing information about Plug-n-Play devices in the system BIOS. This information helps properly configure the system each time it boots.

Firmware: low-level software that controls the system hardware.

Form factor: an industry term for the size, shape, power supply type, and external connector type of the Personal Computer Board (PCB) or motherboard. The standard form factors are the AT and ATX.

Global timer: onboard hardware timer, such as the Real-Time Clock (RTC).

HDD: stands for Hard Disk Drive, a type of fixed drive.

H-SYNC: controls the horizontal synchronization/properties of the monitor.

HyperTransport

TM

: a high speed, low latency, scalable point-to-point link for interconnecting ICs on boards. It can be significantly faster than a PCI bus for an equivalent number of pins. It provides the bandwidth and flexibility critical for today's networking and computing platforms while retaining the fundamental programming model of PCI.

IC (Integrated Circuit): the formal name for the computer chip.

IDE (Integrated Device/Drive Electronics): a simple, self-contained HDD interface.

It can handle drives up to 8.4 GB in size. Almost all IDEs sold now are in fact

Enhanced IDEs (EIDEs), with maximum capacity determined by the hardware controller.

IDE INT (IDE Interrupt): Hardware interrupt signal that goes to the IDE.


I/O (Input/Output): the connection between your computer and another piece of hardware (mouse, keyboard, etc.)

IRQ (Interrupt Request): an electronic request that runs from a hardware device to the CPU. The interrupt controller assigns priorities to incoming requests and delivers them to the CPU. It is important that there is only one device hooked up to each IRQ line; doubling up devices on IRQ lines can lock up your system. Plug-n-

Play operating systems can take care of these details for you.

Latency: the amount of time that one part of a system spends waiting for another part to catch up. This occurs most commonly when the system sends data out to a peripheral device and has to wait for the peripheral to spread (peripherals tend to be slower than onboard system components).

NVRAM: ROM and EEPROM are both examples of Non-Volatile RAM, memory that holds its data without power. DRAM, in contrast, is volatile.

Parallel port: transmits the bits of a byte on eight different wires at the same time.

PCI (Peripheral Component Interconnect): a 32 or 64-bit local bus (data pathway) which is faster than the ISA bus. Local buses are those which operate within a single system (as opposed to a network bus, which connects multiple systems).

PCI PIO (PCI Programmable Input/Output) modes: the data transfer modes used by IDE drives. These modes use the CPU for data transfer (in contrast, DMA channels do not). PCI refers to the type of bus used by these modes to communicate with the CPU.

PCI-to-PCI Bridge: allows you to connect multiple PCI devices onto one PCI slot.

Pipeline burst SRAM: a fast secondary cache. It is used as a secondary cache because SRAM is slower than SDRAM, but usually larger. Data is cached first to the faster primary cache, and then, when the primary cache is full, to the slower secondary cache.

PnP (Plug-n-Play): a design standard that has become ascendant in the industry.

Plug-n-Play devices require little set-up to use. Devices and operating systems that are not Plug-n-Play require you to reconfigure your system each time you add or change any part of your hardware.

PXE (Preboot Execution Environment): one of four components that together make up the Wired for Management 2.0 baseline specification. PXE was designed to define a standard set of preboot protocol services within a client with the goal of allowing networked-based booting to boot using industry standard protocols.


RAID (Redundant Array of Independent Disks): a way for the same data to be stored in different places on many hard drives. By using this method, the data is stored redundantly and multiple hard drives will appear as a single drive to the operating system. RAID level 0 is known as striping, where data is striped (or overlapped) across multiple hard drives, but offers no fault-tolerance. RAID level 1 is known as mirroring, which stores the data within at least two hard drives, but does not stripe. RAID level 1 also allows for faster access time and fault-tolerance, since either hard drive can be read at the same time. RAID level 0+1 is striping and mirroring, providing fault-tolerance, striping, and faster access all at the same time.

RAIDIOS: RAID I/O Steering (Intel)

RAM (Random Access Memory): technically refers to a type of memory where any byte can be accessed without touching the adjacent data and is often referred to the system‟s main memory. This memory is available to any program running on the computer.

ROM (Read-Only Memory): a storage chip which contains the BIOS; the basic instructions required to boot the computer and start up the operating system.

SDRAM (Synchronous Dynamic RAM): called as such because it can keep two sets of memory addresses open simultaneously. By transferring data alternately from one set of addresses and then the other, SDRAM cuts down on the delays associated with non-synchronous RAM, which must close one address bank before opening the next.

Serial port: called as such because it transmits the eight bits of a byte of data along one wire, and receives data on another single wire (that is, the data is transmitted in serial form, one bit after another).

SCSI Interrupt Steering Logic (SISL): Architecture that allows a RAID controller, such as AcceleRAID 150, 200 or 250, to implement RAID on a system boardembedded SCSI bus or a set of SCSI busses. SISL: SCSI Interrupt Steering Logic

(LSI) (only on LSI SCSI boards)

Sleep/Suspend mode: in this mode, all devices except the CPU shut down.

SDRAM (Static RAM): unlike DRAM, this type of RAM does not need to be refreshed in order to prevent data loss. Thus, it is faster and more expensive.

SLI (Scalable Link Interface): NVIDIA SLI

technology

links two

graphics cards

together to provide scalability and increased performance. NVIDIA SLI takes advantage of the increased features

bandwidth

of the

PCI Express

bus architecture, and hardware

and software

innovations within NVIDIA

GPU s (graphics processing units) and NVIDIA MCPs (media and

Depending on the

communications

processors). application

, NVIDIA SLI can deliver as much as two times the performance of a single GPU configuration.


Standby mode: in this mode, the video and hard drives shut down; all other devices continue to operate normally.

UltraDMA-33/66/100: a fast version of the old DMA channel. UltraDMA is also called UltraATA. Without a proper UltraDMA controller, your system cannot take advantage of higher data transfer rates of the new UltraDMA/UltraATA hard drives.

USB (Universal Serial Bus): a versatile port. This one port type can function as a serial, parallel, mouse, keyboard or joystick port. It is fast enough to support video transfer, and is capable of supporting up to 127 daisy-chained peripheral devices.

VGA (Video Graphics Array): the PC video display standard

V-SYNC: controls the vertical scanning properties of the monitor.

ZCR (Zero Channel RAID): PCI card that allows a RAID card to use the onboard

SCSI chip, thus lowering cost of RAID solution

ZIF Socket (Zero Insertion Force socket): these sockets make it possible to insert

CPUs without damaging the sensitive CPU pins. The CPU is lightly placed in an open ZIF socket, and a lever is pulled down. This shifts the processor over and down, guiding it into the board and locking it into place.


Technical Support

If a problem arises with your system, you should first turn to your dealer for direct support. Your system has most likely been configured or designed by them and they should have the best idea of what hardware and software your system contains. Hence, they should be of the most assistance for you. Furthermore, if you purchased your system from a dealer near you, take the system to them directly to have it serviced instead of attempting to do so yourself (which can have expensive consequences).

If these options are not available for you then TYAN

®

Computer Corporation can help. Besides designing innovative and quality products for over a decade, TYAN has continuously offered customers service beyond their expectations. TYAN

®

's website (

www.tyan.com

) provides easy-to-access FAQ searches and online

Trouble Ticket creation as well as Instant Chat capabilities with our Support Agents.

TYAN

®

also provides easy-to-access resources such as in-depth Linux Online

Support sections with downloadable Linux drivers and comprehensive compatibility reports for chassis, memory and much more. With all these convenient resources just a few keystrokes away, users can easily find the latest software and operating system components to keep their systems running as powerful and productive as possible. TYAN

®

also ranks high for its commitment to fast and friendly customer support through email. By offering plenty of options for users, TYAN

®

serves multiple market segments with the industry's most competitive services to support them.

"TYAN's tech support is some of the most impressive we've seen, with great response time and exceptional organization in general" - Anandtech.com

Help Resources:

1. See the beep codes section of this manual.

2. See the TYAN

®

website for FAQ‟s, bulletins, driver updates, and other information:


3. Contact your dealer for help BEFORE calling TYAN

®

.

4. Check the TYAN

®

user group in Google Forum:

alt.comp.periphs.mainboard.TYAN

Returning Merchandise for Service

During the warranty period, contact your distributor or system vendor FIRST for any product problems. This warranty only covers normal customer use and does not cover damages incurred during shipping or failure due to the alteration, misuse, abuse, or improper maintenance of products.


NOTE:

A receipt or copy of your invoice marked with the date of purchase is required before any warranty service can be rendered. You may obtain service by calling the manufacturer for a Return Merchandise Authorization

(RMA) number. The RMA number Should be prominently displayed on the outside of the shipping carton and the package should be mailed prepaid.

TYAN

®

will pay to have the board shipped back to you.

Notice for the USA

Compliance Information Statement (Declaration of

Conformity Procedure) DoC

FCC Part 15: This device complies with part 15 of the FCC

Rules

Operation is subject to the following conditions:

This device may not cause harmful interference, and this device must accept any interference received including interference that may cause undesired operation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and the receiver.

Plug the equipment into an outlet on a circuit different from that of the receiver.

Consult the dealer on an experienced radio/television technician for help.

Notice for Canada

This apparatus complies with the Class B limits for radio interference as specified in the Canadian Department of Communications Radio Interference Regulations. (Cet appareil est conforme aux norms de Classe B d‟interference radio tel que specifie par le Ministere Canadien des Communications dans les reglements d‟ineteference radio.)

CAUTION: Lithium battery included with this board. Do not puncture, mutilate, or dispose of battery in fire. There is danger of an explosion if the battery is incorrectly replaced. Replace only with the same or equivalent type recommended by manufacturer. Dispose of used battery according to manufacturer instructions and in accordance with your local regulations.

Document #:

D2292 - 100


S7070_UG_v1.0e

Contents

Before you begin…

Chapter 1: Instruction

1.1 Congratulations

1.2 Hardware Specifications

1.3 Software Specifications

Chapter 2: Board Installation

Caution!

2.1 Board Image

2.2 Block Diagram

2.3 Motherboard Mechanical Drawing

2.4 Board Parts, Jumpers and Connectors

2.5 Installing the Processor and Heatsink

2.6 Thermal Interface Material

2.7 Tips on Installing Motherboard in Chassis

2.8 Installing the Memory

2.9 Attaching Drive Cables

2.10 Installing Add-In Cards

2.11 Connecting External Devices

2.12 Installing the Power Supply

2.13 Finishing Up

Chapter 3: BIOS Setup

3.1 About the BIOS

3.2 Main Menu

3.3 Advanced Menu

3.4 Intel RCSetup Menu

3.5 Server Management

3.6 Security

3.7 Boot

3.8 Save & Exit

Chapter 4: Diagnostics

4.1 Flash Utility

4.2 AMIBIOS Post Code (Aptio)

Appendix I: Fan and Temp Sensors

NOTE

Glossary

technology

graphics cards

bandwidth

communications

Technical Support

Related manuals

Tyan

S7070

Tyan

FT48A-B7070

Colorful

BATTLE AXE C.B150AK V20

Tyan

S7063

Tyan

GT62B-B7076

Tyan

S7086

Tyan

S5535

Tyan

GT24B-B7076

Table of contents