MAX532

MAX532
MAX532
RELIABILITY REPORT
FOR
MAX532XxxE+
PLASTIC ENCAPSULATED DEVICES
February 17, 2010
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX532
Conclusion
The MAX532XxxE+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX532 is a complete, dual, serial-input, 12-bit multiplying digital-to-analog converter (MDAC) with output amplifiers. No external user trims are
required to achieve full specified performance. The MAX532's 3-wire serial interface minimizes the number of package pins, so it uses less board
space than parallel-interface parts. The interface is SPI(tm), QSPI(tm) and Microwire(tm) compatible. A serial output, DOUT, allows cascading of two
or more MAX532s and read-back of the data written to the device. The device's serial interface minimizes digital-noise feed-through from its logic pins
to its analog outputs. Serial interfacing also simplifies opto-coupler-isolated or transformer-isolated applications. The MAX532 is specified with ±12V
to ±15V power supplies. All logic inputs are TTL and CMOS compatible. It comes in space-saving 16-pin DIP and wide SO packages.
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MAX532
II. Manufacturing Information
A. Description/Function:
Dual, Serial Input, Voltage-Output, Multiplying, 12-Bit DAC
B. Process:
SG5
C. Number of Device Transistors:
D. Fabrication Location:
Oregon
E. Assembly Location:
Philippines
F. Date of Initial Production:
Pre 1997
III. Packaging Information
A. Package Type:
16-pin PDIP
16-SOIC
B. Lead Frame:
Copper
Copper
C. Lead Finish:
100% matte Tin
100% matte Tin
D. Die Attach:
Conductive
Conductive
E. Bondwire
Au (1.3 mil dia.)
Au (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
Epoxy with silica filler
G. Assembly Diagram:
#05-0401-0319
#05-0401-0359
H. Flammability Rating:
Class UL94-V0
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
Level 1
J. Single Layer Theta Ja:
95°C/W
105°C/W
K. Single Layer Theta Jc:
35°C/W
32°C/W
IV. Die Information
A. Dimensions:
140 X 250 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
5.0 microns (as drawn)
F. Minimum Metal Spacing:
5.0 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX532
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
(Chi square value for MTTF upper limit)
1000 x 4340 x 154 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 1.37 x 10
= 1.37 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the SG5 Process results in a FIT Rate of 0.12 @ 25C and 2.04 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The DA48 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2000 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
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MAX532
Table 1
Reliability Evaluation Test Results
MAX532XxxE+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 1000 hrs.
Moisture Testing (Note 2)
HAST
Ta = 130°C
RH = 85%
Biased
Time = 96hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
154
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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