MAX6126

MAX6126
MAX6126xxxx
Rev. A
RELIABILITY REPORT
FOR
MAX6126xxxx
PLASTIC ENCAPSULATED DEVICES
March 30, 2004
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX6126 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX6126 is an ultra-low-noise, high-precision, lowdropout voltage reference. This family of voltage references
feature curvature-correction circuitry and high-stability, laser-trimmed, thin-film resistors that result in 3ppm/°C (max)
temperature coefficients and an excellent ±0.02% (max) initial accuracy. The proprietary low-noise reference
architecture produces a low flicker noise of 1.3µV P-P and wideband noise as low as 60nV per root-Hz (2.048V output)
without the increased supply current usually found in low-noise references. Improve wideband noise to 35nV per rootHz and AC power-supply rejection by adding a 0.1µF capacitor at the noise reduction pin. The MAX6126 series
mode reference operates from a wide 2.7V to 12.6V supply voltage range and load-regulation specifications are
guaranteed to be less than 0.025 for sink and source currents up to 10mA. These devices are available over the
automotive temperature range of -40°C to +125°C.
The MAX6126 typically draws 380µA of supply current and is available in 2.048V, 2.500V, 3.000V, 4.096V, and
5.000V output voltages. These devices also feature dropout voltages as low as 200mV. Unlike conventional shuntmode (two-terminal) references that waste supply current and require an external resistor, the MAX6126 offers
supply current that is virtually independent of supply voltage and does not require an external resistor. The MAX6126
is stable with 0.1µF to 10µF of load capacitance.
The MAX6126 is available in the tiny 8-pin µMAX, as well as 8-pin SO packages.
B. Absolute Maximum Ratings
Item
(All voltages referenced to GND)
GNDS
IN
OUTF, OUTS, NR
Output Short Circuit to GND or IN
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature (soldering, 10s)
Continuous Power Dissipation (TA = +70°C)
8-Pin µMAX
8-Pin NSO
Derates above +70°C
8-Pin µMAX
8-Pin NSO
Rating
-0.3V to +0.3V
-0.3V to +13V
-0.3V to the lesser of (VIN + 0.3V) or +6V
60s
-40°C to +125°C
+150°C
-65°C to +150°C
+300°C
362mW
471mW
4.5mW/°C
5.88mW/°C
II. Manufacturing Information
A. Description/Function: Ultra-High-Precision, Ultra-Low-Noise,Series Voltage Reference
B. Process:
S12 (Standard 1.2 micron silicon gate CMOS)
C. Number of Device Transistors:
1171
D. Fabrication Location:
Oregon, USA
E. Assembly Location:
Malaysia, Philippines or Thailand
F. Date of Initial Production:
October, 2001
III. Packaging Information
A. Package Type:
8-Pin µMAX
8-Pin NSO
B. Lead Frame:
Copper
Copper
C. Lead Finish:
Solder Plate
Solder Plate
D. Die Attach:
Silver-filled Epoxy
Silver-filled Epoxy
E. Bondwire:
Gold (1.0 mil dia.)
Gold (1.0 mil dia.)
F. Mold Material:
Epoxy with silica filler
Epoxy with silica filler
G. Assembly Diagram:
# 05-9000-0150
# 05-9000-0151
H. Flammability Rating:
Class UL94-V0
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard J-STD-022-A:
Level 1
Level 1
IV. Die Information
A. Dimensions:
59 x 82 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
1.2 microns (as drawn)
F. Minimum Metal Spacing:
1.2 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts:
B. Outgoing Inspection Level:
Jim Pedicord (Manager, Reliability Operations)
Bryan Preeshl (Executive Director)
Kenneth Huening (Vice President)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (λ) is calculated as follows:
λ=
1
=
MTTF
1.83
(Chi square value for MTTF upper limit)
192 x 4389 x 160 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ = 6.79 x 10-9
λ = 6.79 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-5387) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The RF26 die type has been found to have all pins able to withstand a transient pulse of ±1500V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.
Table 1
Reliability Evaluation Test Results
MAX6126xxxx
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
PACKAGE
DC Parameters
& functionality
SAMPLE
SIZE
NUMBER OF
FAILURES
160
0
77
77
0
0
0
Moisture Testing (Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
DC Parameters
& functionality
uMAX
NSO
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
77
DC Parameters
& functionality
77
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
0
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
Terminal A
(Each pin individually
connected to terminal A
with the other floating)
Terminal B
(The common combination
of all like-named pins
connected to terminal B)
1.
All pins except VPS1 3/
All VPS1 pins
2.
All input and output pins
All other input-output pins
1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).
3.4
Pin combinations to be tested.
a.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected
to terminal B. All pins except the one being tested and the ground pin(s) shall be open.
b.
Each pin individually connected to terminal A with respect to each different set of a combination
of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1 , or VCC2 ) connected to
terminal B. All pins except the one being tested and the power supply pin or set of pins shall be
open.
c.
Each input and each output individually connected to terminal A with respect to a combination of
all the other input and output pins connected to terminal B. All pins except the input or output pin
being tested and the combination of all the other input and output pins shall be open.
TERMINAL C
R1
R2
S1
TERMINAL A
REGULATED
HIGH VOLTAGE
SUPPLY
S2
C1
DUT
SOCKET
SHORT
TERMINAL B
TERMINAL D
Mil Std 883D
Method 3015.7
Notice 8
R = 1.5kΩ
C = 100pf
CURRENT
PROBE
(NOTE 6)
ONCE PER SOCKET
ONCE PER BOARD
10 OHMS
N/C
1
8
2
7
3
6
4
5
N/C
REVISION C
MAXIM
TITLE: BI
100uF
N/C
DEVICES: MAX 6133/6190/6191/6192/6194/6195/6198/6126
PACKAGE: 8 - NSO
MAX. EXPECTED CURRENT = 850uA
DOCUMENT I.D. 06-5387
0.1uF
+10V
DRAWN BY: TEK TAN
NOTES:
Circuit (MAX6190/6191/6192/6194/6195/6198/6133/6126)
PAGE
2
OF 3
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement